TW201641294A - Method for producing rugged pattern compact article and imprinting apparatus - Google Patents
Method for producing rugged pattern compact article and imprinting apparatus Download PDFInfo
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- TW201641294A TW201641294A TW105107895A TW105107895A TW201641294A TW 201641294 A TW201641294 A TW 201641294A TW 105107895 A TW105107895 A TW 105107895A TW 105107895 A TW105107895 A TW 105107895A TW 201641294 A TW201641294 A TW 201641294A
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- resin layer
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- transfer
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/002—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
本發明係關於凹凸圖案形成體的製造方法及該製造方法所使用之裝置。 The present invention relates to a method for producing a textured pattern forming body and an apparatus used therefor.
奈米壓印技術,係將形成有凹凸的圖案之模具緊壓於基板上的液狀樹脂等,以將模具的圖案轉印至樹脂者。凹凸的圖案,從10nm水準的奈米等級者至100μm左右者均有,並廣泛使用在半導體材料、光學材料、記憶媒體、微機器、生物、環境等之各領域。 The nanoimprint technique is a method in which a mold having a pattern of irregularities is pressed against a liquid resin on a substrate to transfer a pattern of a mold to a resin. The pattern of the unevenness is from the nanometer level of 10 nm to about 100 μm, and is widely used in various fields such as semiconductor materials, optical materials, memory media, micro-machines, biology, and the environment.
奈米壓印的種類,可列舉出:將表面形成有既定形狀之模具壓接於在玻璃轉移溫度以上經熔融之熱塑性樹脂,以將該模具的表面形狀熱奈米壓印於熱塑性樹脂,且於冷卻後卸下模具之熱奈米壓印;以及將同樣的模具壓接於光硬化性樹脂,並藉由紫外線照射等之能量線使光硬化性樹脂硬化後,卸下模具之光奈米壓印等。 The type of the nanoimprint is exemplified by pressing a mold having a predetermined shape on the surface thereof to a thermoplastic resin which is melted at a glass transition temperature or higher, and embossing the surface shape of the mold to a thermoplastic resin. After cooling, the hot nano embossing of the mold is removed; and the same mold is pressure-bonded to the photocurable resin, and the photocurable resin is cured by an energy ray such as ultraviolet ray irradiation, and the photosensitive nanometer of the mold is removed. Embossing, etc.
第3圖係顯示作為以往之奈米壓印裝置的一例之將平板狀模具的形狀轉印至平坦的基板上的被轉印體樹脂層,即所謂板對板方式(plate to plate)的裝置之示意 圖。此裝置中,係將固定在臂101之板狀模具,藉由使臂101往下方向移動而壓接於被塗布於平板基板之被轉印體樹脂層以進行奈米壓印,於被轉印體樹脂層硬化後,藉由使臂101往上方向移動而將模具從硬化後的被轉印體樹脂層中剝離。 Fig. 3 is a view showing a device for transferring a shape of a flat mold to a transferable resin layer on a flat substrate as an example of a conventional nanoimprinting apparatus, that is, a so-called plate to plate device. Schematic Figure. In this apparatus, the plate-shaped mold of the arm 101 is fixed, and the arm 101 is pressed in the transfer-substrate resin layer applied to the flat substrate by the arm 101 in the downward direction to perform nanoimprinting. After the printed resin layer is cured, the mold is peeled off from the cured transfer body resin layer by moving the arm 101 in the upward direction.
根據此方法,可獨立進行轉印操作及被轉印體樹脂層的硬化操作。然而,為將板狀模具壓接於板狀被轉印體樹脂層之方法時,於壓接時氣泡會進入於模具與被轉印體樹脂層之間,並在該狀態下硬化,所以難以將模具的形狀正確地轉印至被轉印體樹脂層。此外,於被轉印體樹脂層硬化後,將模具從硬化後的被轉印體樹脂層中剝離時,需耗費較大力道,所以可能於模具及硬化後的被轉印體樹脂層產生損傷。 According to this method, the transfer operation and the hardening operation of the resin layer to be transferred can be independently performed. However, in the method of crimping the plate-shaped mold to the plate-shaped transfer-substrate resin layer, bubbles are allowed to enter between the mold and the transfer-substrate resin layer at the time of pressure bonding, and harden in this state, so that it is difficult The shape of the mold is correctly transferred to the resin layer to be transferred. Further, when the mold body layer is cured and the mold is peeled off from the cured transfer resin layer, it takes a lot of force, so that the mold and the hardened transfer resin layer may be damaged. .
第4圖係顯示又一個作為以往之另外的奈米壓印裝置的一例,為將輥上之模具的形狀轉印至輥上的樹脂之所謂輥對輥(roll to roll)方式的裝置之示意圖。此裝置中,係將使形狀位於外側而被捲繞固定在輥上之模具,壓接於基板上的被轉印體樹脂層以進行奈米壓印。 Fig. 4 is a view showing another example of a so-called roll-to-roll type apparatus for transferring a shape of a mold on a roll to a resin on a roll as an example of another conventional nanoimprinting apparatus. . In this apparatus, a mold having a shape on the outer side and being wound and fixed on a roll is pressed against a transfer resin layer on a substrate to perform nanoimprinting.
第5圖係顯示作為以往之另外的奈米壓印裝置的一例,為將輥上之模具的形狀轉印至平坦的基板上的樹脂之所謂輥對板(roll to plate)方式的裝置之示意圖。此裝置中,係將使形狀位於外側而被捲繞固定在輥上之模具,壓接於基板上的被轉印體樹脂層以進行奈米壓印。 Fig. 5 is a view showing a so-called roll to plate type apparatus for transferring a shape of a mold on a roll to a resin on a flat substrate as an example of another conventional nanoimprinting apparatus. . In this apparatus, a mold having a shape on the outer side and being wound and fixed on a roll is pressed against a transfer resin layer on a substrate to perform nanoimprinting.
為此等輥對輥及輥對板方式時,由於模具 與被轉印體的接觸面積小,所以不會有上述板對板方式之氣泡進入的問題,此外,將模具從硬化後的被轉印體樹脂層中剝離之際,模具或製品亦不會產生損傷。 For this type of roll-to-roll and roll-to-plate method, due to the mold Since the contact area with the object to be transferred is small, there is no problem that the above-described plate-to-plate type air bubbles enter, and when the mold is peeled off from the hardened transfer body resin layer, the mold or the product does not Causes damage.
此等使用輥之方式中,係將模具貼附固定在輥,但於貼附時若雜質混入於貼附面或氣泡滲入時,會有成為轉印缺陷之問題,此時需再次進行貼附。然而,由於模具以強力的黏著劑固定在輥上,所以一旦從輥中剝離,該模具即無法再使用。 In the method of using the roller, the mold is attached and fixed to the roller. However, if impurities are mixed into the attachment surface or bubbles infiltrate during attachment, there is a problem of becoming a transfer defect, and the attachment is required again. . However, since the mold is fixed to the roll with a strong adhesive, the mold can no longer be used once it is peeled off from the roll.
因此,專利文獻1中,係揭示一種容易將模具從輥中剝離之壓印模具固定用黏著薄片。專利文獻1係以於壓印時無法將模具從輥中剝離者為課題。此外,係將模具與黏著薄片一同剝離。 Therefore, Patent Document 1 discloses an adhesive sheet for fixing an imprint mold which is easy to peel a mold from a roll. Patent Document 1 is a problem in that it is impossible to peel a mold from a roll at the time of imprinting. In addition, the mold is peeled off together with the adhesive sheet.
再者,此等使用輥之方式中,模具接觸於被轉印體之時機僅有轉印時,所以需同時進行朝向被轉印體樹脂層之轉印操作與被轉印體樹脂層的硬化操作。因此,壓印裝置的樣態受限,並且被轉印體樹脂的種類亦僅限於光硬化性樹脂。 Further, in the method of using the roller, when the timing of the contact of the mold with the transfer target is only transfer, it is necessary to simultaneously perform the transfer operation toward the resin layer of the transfer target and the hardening of the resin layer of the transfer target. operating. Therefore, the state of the imprint apparatus is limited, and the type of the resin to be transferred is limited to the photocurable resin.
為了解決此等先前之輥方式的壓印裝置之問題,專利文獻2中,係記載一種將輥與模具分離之裝置。然而,此裝置中,須具備用以使模具升降之龐大的構成。 In order to solve the problem of the prior art roll type imprint apparatus, Patent Document 2 describes an apparatus for separating a roll from a mold. However, in this device, it is necessary to have a bulky structure for lifting and lowering the mold.
專利文獻1:國際公開第2013/031710號公報 Patent Document 1: International Publication No. 2013/031710
專利文獻2:日本特許第5232077號公報 Patent Document 2: Japanese Patent No. 5232077
本發明之目的在於提供一種在將模具抵接於被轉印體樹脂層時,氣泡不會進入,並且在將模具從硬化後的被轉印體樹脂層中剝離時,模具及硬化後的被轉印體樹脂層不會產生破損之凹凸圖案形成體的製造方法及壓印裝置。 An object of the present invention is to provide a method in which a bubble does not enter when a mold is brought into contact with a resin layer to be transferred, and when the mold is peeled off from the hardened transfer resin layer, the mold and the cured portion are A method of producing a concave-convex pattern forming body in which the transfer body resin layer does not cause damage, and an imprint apparatus.
此外,本發明之目的在於提供一種在使用輥作為壓力施加手段之壓印裝置中,模具相對於輥容易裝卸,且即使一旦從輥中剝離,模具亦可再利用之凹凸圖案形成體的製造方法及壓印裝置。 Further, an object of the present invention is to provide a method for producing a concave-convex pattern forming body in which a mold can be easily attached and detached with respect to a roll in an imprint apparatus using a roll as a pressure applying means, and the mold can be reused even if it is peeled off from the roll. And imprinting device.
再者,本發明之目的在於提供一種不須同時進行轉印操作與硬化操作之凹凸圖案形成體的製造方法及壓印裝置。 Further, an object of the present invention is to provide a method and a stamping apparatus for producing a concave-convex pattern forming body which do not require simultaneous transfer operation and hardening operation.
本發明,例如關於以下[1]至[4]。 The present invention is, for example, regarding the following [1] to [4].
[1]一種凹凸圖案形成體的製造方法,其特徵為包含:將表面具有凹凸圖案之薄膜模具,可裝卸地捲繞保持於表面具有卡止能力之輥上之步驟(1);將包含基板及形成於基板上之被轉印體樹脂層之被轉印體,載置於基板載置部上之步驟(2);一邊將前述步驟(1)中所得之捲繞保持於輥之薄膜模具抵接於前述被轉印體樹脂層的表面一邊使輥轉動,將薄膜 模具從輥上剝離而捲出至被轉印體樹脂層上,並且將薄膜模具之表面的凹凸圖案轉印至被轉印體樹脂層之步驟(3); 使藉由前述步驟(3)而在表面積層有薄膜模具之狀態的被轉印體樹脂層硬化之步驟(4);以及一邊將表面具有卡止能力之輥抵接於前述步驟(4)中所得之被積層於硬化後的被轉印體樹脂層上之薄膜模具一邊轉動,將薄膜模具從硬化後的被轉印體樹脂層上剝離,並捲取於輥上之步驟(5)。 [1] A method for producing a concave-convex pattern forming body, comprising: a film mold having a concave-convex pattern on a surface thereof, detachably winding and holding on a roll having a locking property on a surface; (1); And a step (2) of depositing the transfer target resin layer formed on the substrate on the substrate mounting portion; and winding the film obtained in the step (1) on the roll film mold Abutting on the surface of the resin layer to be transferred, the roller is rotated to form a film The mold is peeled off from the roll and rolled up onto the transfer body resin layer, and the concave and convex pattern of the surface of the film mold is transferred to the transfer body resin layer step (3); a step (4) of curing the transferred body resin layer in a state in which the surface layer has a film mold by the above step (3); and a step of abutting the roller having the locking ability on the surface in the step (4) The obtained film mold which is laminated on the hardened transfer-resist resin layer is rotated, and the film mold is peeled off from the hardened transfer-substrate resin layer, and is taken up on the roll (5).
[2]如[1]所述之凹凸圖案形成體的製造方法,其中於前述輥表面存在有黏著層。 [2] The method for producing a concave-convex pattern forming body according to [1], wherein an adhesive layer is present on the surface of the roller.
[3]如[11或[2]所述之凹凸圖案形成體的製造方法,其係連續地進行前述步驟(1)至(5)。 [3] The method for producing a concave-convex pattern forming body according to [11], wherein the steps (1) to (5) are continuously performed.
[4]一種壓印裝置,其係具備:表面具有卡止能力之輥、捲出至前述輥表面且可裝卸地被保持在前述輥表面之在表面上具有凹凸圖案之薄膜模具、以及用以使被轉印體樹脂層硬化之樹脂硬化手段而成;並且將形成於前述薄膜模具的表面之凹凸圖案轉印至被轉印體樹脂層,其中:將捲繞有前述薄膜模具之輥配置在前述被轉印體樹脂層上,並藉由使前述輥朝前述薄膜模具的捲出方向轉動,使前述薄膜模具可從輥表面供給至被轉印體樹脂層表面;並且在藉由前述樹脂硬化手段使被轉印體樹脂層硬 化後, 將前述輥配置在硬化後的前述被轉印體樹脂層上,並藉由朝前述薄膜模具的捲取方向轉動輥,將轉印有前述薄膜模具的凹凸圖案之被轉印體樹脂層與前述薄膜模具剝離,使前述薄膜模具可捲取並回收於輥表面。 [4] An embossing apparatus comprising: a roll having a locking property on a surface thereof; a film mold having a concave-convex pattern on a surface which is detachably held on the surface of the roller and detachably held on the surface of the roller, and a resin hardening means for hardening the resin layer of the transfer body; and transferring the concave-convex pattern formed on the surface of the film mold to the resin layer to be transferred, wherein the roller on which the film mold is wound is disposed The film body of the transfer body is rotated by the roll in the winding direction of the film mold, so that the film mold can be supplied from the surface of the roll to the surface of the resin layer of the transfer body; and hardened by the resin Means to harden the resin layer of the transferred body After the transformation, The roller is disposed on the hardened layer of the transfer target resin layer, and the transfer body resin layer on which the concavo-convex pattern of the film mold is transferred is transferred by rotating the roller toward the winding direction of the film mold. The film mold is peeled off so that the film mold can be taken up and recovered on the surface of the roll.
根據本發明之製造方法,一邊使用輥作為壓力施加手段,一邊於轉印時將模具從輥剝離並積層於被轉印體樹脂層上,所以不須同時進行轉印操作與硬化操作。此外,由於亦可將剝離後的模具再利用,所以可連續地製造凹凸圖案形成體。然後,積層於硬化後的被轉印體樹脂層上之模具,由於可藉由僅為輥曲率較低的剝離角從硬化後的被轉印體樹脂層中剝離,所以於剝離時模具及硬化後的被轉印體樹脂層不會產生損傷。再者,由於使用輥將模具轉印至被轉印體樹脂層,所以氣泡不會進入模具與被轉印體樹脂層之間。 According to the production method of the present invention, the mold is used as the pressure applying means, and the mold is peeled off from the roll at the time of transfer and laminated on the transfer body resin layer, so that it is not necessary to perform the transfer operation and the hardening operation at the same time. Further, since the peeled mold can be reused, the uneven pattern forming body can be continuously produced. Then, the mold laminated on the hardened transfer-resist resin layer can be peeled off from the cured transfer-receiving resin layer by the peeling angle which is only low in curvature of the roll, so that the mold and the hardening at the time of peeling The subsequent transfer body resin layer does not cause damage. Further, since the mold is transferred to the transfer body resin layer using a roller, the bubbles do not enter between the mold and the transfer body resin layer.
此外,本發明之壓印裝置,不須如以往之輥對板方式的裝置般之將壓模版安裝於支柱或轉動臂,所以與以往之輥對板方式的裝置相比,可達到小型化。 Further, the imprint apparatus of the present invention can reduce the size of the stamping apparatus as compared with the conventional roll-to-plate type apparatus, as in the case of the conventional roll-to-plate type apparatus.
1‧‧‧輥 1‧‧‧ Roll
2‧‧‧具有卡止能力之輥表面 2‧‧‧Rolling surface with locking ability
3‧‧‧薄膜模具 3‧‧‧film mould
4a‧‧‧硬化前的被轉印體樹脂層 4a‧‧‧Transferd resin layer before hardening
4b‧‧‧硬化後的被轉印體樹脂層 4b‧‧‧ Hardened transfer resin layer
5‧‧‧基板 5‧‧‧Substrate
6‧‧‧基板載置部 6‧‧‧Substrate placement
7‧‧‧留置手段 7‧‧‧Retention means
8‧‧‧薄膜模具的固定層 8‧‧‧Fixed layer of film mold
101‧‧‧臂 101‧‧‧ Arm
第1圖係顯示本發明之製造凹凸圖案形成體之方法的步驟之示意圖。 Fig. 1 is a schematic view showing the steps of a method of producing a textured pattern forming body of the present invention.
第2圖係顯示本發明之製造凹凸圖案形成體之方法所 使用之壓印裝置的留置手段之示意圖。 Fig. 2 is a view showing a method of manufacturing a concave-convex pattern forming body of the present invention. A schematic representation of the retention means of the imprinting device used.
第3圖係顯示以往之板對板方式的壓印裝置之示意圖。 Fig. 3 is a schematic view showing a conventional plate-to-plate type imprint apparatus.
第4圖係顯示以往之輥對輥方式的壓印裝置之示意圖。 Fig. 4 is a schematic view showing a conventional roll-to-roll type imprint apparatus.
第5圖係顯示以往之輥對板方式的壓印裝置之示意圖。 Fig. 5 is a schematic view showing a conventional roll-to-plate type imprint apparatus.
本發明之凹凸圖案形成體的製造方法,其包含:將表面具有凹凸圖案之薄膜模具,可裝卸地捲繞保持於表面具有卡止能力之輥上之步驟(1);將包含基板及形成於基板上之被轉印體樹脂層之被轉印體,載置於基板載置部上之步驟(2);一邊將前述步驟(1)中所得之捲繞保持於輥之薄膜模具抵接於前述被轉印體樹脂層的表面一邊使輥轉動,將薄膜模具從輥上剝離而捲出至被轉印體樹脂層上,並且將薄膜模具之表面的凹凸圖案轉印至被轉印體樹脂層之步驟(3);使藉由前述步驟(3)而在表面積層有薄膜模具之狀態的被轉印體樹脂層硬化之步驟(4);以及一邊將表面具有卡止能力之輥抵接於前述步驟(4)中所得之被積層於硬化後的被轉印體樹脂層上之薄膜模具一邊轉動,將薄膜模具從硬化後的被轉印體樹脂層上剝離,並捲取於輥上之步驟(5)。 A method for producing a concave-convex pattern forming body according to the present invention, comprising: a film mold having a concave-convex pattern on a surface thereof, and detachably winding and holding the film (1) on a roll having a locking property; and comprising a substrate and a step (2) of placing the transfer target of the transfer-substrate resin layer on the substrate on the substrate mounting portion; and the film mold obtained by winding the film obtained in the step (1) on the roll is in contact with The surface of the transfer-receiving resin layer is rotated by a roll, the film mold is peeled off from the roll and wound up onto the transfer body resin layer, and the uneven pattern on the surface of the film mold is transferred to the transfer body resin. Step (3) of the layer; step (4) of hardening the transferred body resin layer in a state where the surface layer has a film mold by the above step (3); and abutting the roller having the locking ability on the surface The film mold which is laminated on the hardened transfer-resist resin layer obtained in the above step (4) is rotated, and the film mold is peeled off from the hardened transfer-substrate resin layer and taken up on a roll. Step (5).
〈步驟(1)〉 <step 1)>
如第1圖(1)所示,將薄膜模具3捲繞於表面具有卡止能力之輥1的卡止層2上。此時,薄膜模具3以不具有凹凸圖案之面作為輥1的表面側,亦即,以具有凹凸圖案之 面作為外側而捲繞於輥1上。如此,薄膜模具3被保持於輥1上。當薄膜模具3之輥外周方向的長度較輥1的外周更短時,係將薄膜模具3的全體長度捲繞於輥1上,當薄膜模具3之輥外周方向的長度較輥1的外周更長時,將輥外周長度的量之薄膜模具3捲繞於輥1上,並將較輥外周更長的量之薄膜模具3重疊於該輥1上而捲繞。 As shown in Fig. 1 (1), the film mold 3 is wound around the locking layer 2 of the roller 1 having the locking ability on its surface. At this time, the film mold 3 has the surface having no uneven pattern as the surface side of the roll 1, that is, has a concave-convex pattern. The surface is wound around the roll 1 as the outer side. Thus, the film mold 3 is held on the roller 1. When the length of the outer peripheral direction of the roll of the film mold 3 is shorter than the outer circumference of the roll 1, the entire length of the film mold 3 is wound around the roll 1, and the length of the outer peripheral direction of the roll of the film mold 3 is more than the outer circumference of the roll 1. For a long period of time, the film mold 3 of the outer peripheral length of the roll is wound around the roll 1, and the film mold 3 of a larger amount than the outer circumference of the roll is superposed on the roll 1 to be wound.
首先說明輥1。 First, the roller 1 will be described.
輥1的大小,較佳為直徑23至1000mm、寬10至3000mm。輥1的材質,可列舉出金屬、碳、塑膠、聚矽氧橡膠、陶瓷等。輥1通常連接於驅動手段而轉動。 The size of the roller 1 is preferably 23 to 1000 mm in diameter and 10 to 3000 mm in width. Examples of the material of the roller 1 include metal, carbon, plastic, polyoxyethylene rubber, and ceramics. The roller 1 is usually rotated by being connected to a driving means.
在此所謂卡止能力,意指將薄膜模具3保持為可裝卸的程度之功能。 The term "locking ability" as used herein means a function of keeping the film mold 3 at a detachable level.
此外,從確實地卡止薄膜模具3之觀點來看,較佳係輥1表面全體具有卡止能力。 Further, from the viewpoint of reliably locking the film mold 3, it is preferable that the entire surface of the roll 1 has a locking ability.
輥1表面的卡止能力,可列舉出靜電、減壓及黏著等,從處理之觀點來看,較佳係使用黏著。 The locking ability of the surface of the roll 1 is, for example, static electricity, pressure reduction, adhesion, and the like, and it is preferable to use adhesion from the viewpoint of handling.
上述靜電的例子,可列舉出利用帶電列的關係者。例如可列舉出:當使用聚酯作為形成薄膜模具之樹脂時,由於聚酯容易帶負電,所以選擇容易帶正電之玻璃或鉛作為輥的材質以加強靜電力者。 Examples of the above static electricity include those using a charged row. For example, when polyester is used as the resin for forming a film mold, since the polyester is easily negatively charged, it is preferable to select a glass or lead which is easily positively charged as a material of the roller to enhance the electrostatic force.
此外,亦可將電壓施加於輥以積極地賦予靜電力來使用。具體而言,可於聚醯亞胺、氧化矽陶瓷、石英玻璃等之介質表面上產生庫侖力,並將該電壓施加於輥而調整輥的卡止能力。 Further, a voltage may be applied to the roller to actively apply an electrostatic force. Specifically, a Coulomb force can be generated on the surface of a medium such as polyimide, cerium oxide ceramic, quartz glass, or the like, and this voltage is applied to the roller to adjust the locking ability of the roller.
上述減壓的例子,可於輥設置細孔,並通過該細孔進行減壓吸引,將真空度調整至0.1kPa至0.1MPa而藉此調整輥的卡止能力。 In the above-described example of the pressure reduction, the fine pores may be provided in the roll, and the vacuum suction may be performed through the fine holes, and the degree of vacuum may be adjusted to 0.1 kPa to 0.1 MPa to thereby adjust the locking ability of the roll.
上述黏著的例子,可列舉出將黏著劑塗布於輥表面之方法,以及將黏著薄片貼附於輥表面之方法。 Examples of the above-mentioned adhesion include a method of applying an adhesive to a surface of a roll, and a method of attaching an adhesive sheet to a surface of a roll.
黏著劑可使用以丙烯酸樹脂、胺甲酸酯樹脂、聚矽氧樹脂、及橡膠為主成分之黏著劑,從成本或後述黏著力的調整容易度來看,較佳為以丙烯酸樹脂為主成分之黏著劑。此等黏著劑中,可視需要,較佳係含有異氰酸酯系化合物、金屬螯合系化合物等之交聯劑。將黏著劑塗布於輥表面之方法,可使用以刷毛來塗布、或是噴霧等之一般所知的方法。 As the adhesive, an adhesive mainly composed of an acrylic resin, a urethane resin, a polyoxymethylene resin, and a rubber may be used. From the viewpoint of the cost or the ease of adjustment of the adhesive force described later, it is preferred to use an acrylic resin as a main component. Adhesive. Among these adhesives, a crosslinking agent such as an isocyanate compound or a metal chelate compound is preferably used as needed. The method of applying the adhesive to the surface of the roll can be carried out by a generally known method of coating with a bristles or spraying.
此外,將黏著薄片貼附於輥表面之方法,可列舉出將具有黏著性之彈性體薄片,直接或使用黏著劑貼附於輥,或是使用具有黏著劑層之雙面膠帶,將雙面膠帶的一面貼合於輥,將另一面構成為具有卡止能力之黏著劑層之方法。 Further, the method of attaching the adhesive sheet to the surface of the roller may be exemplified by attaching an adhesive elastic sheet directly to the roller by using an adhesive or using a double-sided tape having an adhesive layer to cover the double-sided tape. One side of the tape is attached to the roller, and the other side is formed as a method of the adhesive layer having the locking ability.
彈性體薄片的材質,可列舉出天然橡膠、聚矽氧橡膠、乙烯-丙烯共聚合橡膠、苯乙烯-丁二烯共聚合橡膠、丙烯腈-丁二烯共聚合橡膠、丙烯酸橡膠、苯乙烯橡膠、表氯醇橡膠、氯碸化聚乙烯、氯化聚乙烯、胺甲酸酯橡膠、氟橡膠、異丁烯異戊二烯橡膠及聚酯等。 Examples of the material of the elastomer sheet include natural rubber, polyoxyethylene rubber, ethylene-propylene copolymer rubber, styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber, acrylic rubber, and styrene rubber. , epichlorohydrin rubber, chlorinated polyethylene, chlorinated polyethylene, urethane rubber, fluororubber, isobutylene isoprene rubber and polyester.
使用雙面膠帶時,除了於基材的雙面形成有黏著劑層者之外,亦可使用未採用基材者(僅由黏著劑及 積層於黏著劑層的雙面之經脫模處理後的剝離性基材所形成者)中的任一種,考量到往薄膜模具之貼附容易度或薄膜模具更換時之作業容易度,較佳為於基材的雙面形成有黏著劑層之雙面膠帶,特佳係使用:設為貼附於薄膜模具之一側的黏著劑層之面的黏著力較貼附於輥之面的黏著力弱之雙面膠帶。 When double-sided tape is used, in addition to the adhesive layer formed on both sides of the substrate, those who do not use the substrate may be used (adhesive only Any one of the peelable substrates which are laminated on both sides of the pressure-sensitive adhesive layer after the release treatment is considered to be easy to attach to the film mold or easy to handle when the film mold is replaced, preferably. In order to form a double-sided tape having an adhesive layer on both sides of the substrate, it is particularly preferable to use an adhesive force which is attached to the surface of the adhesive layer on one side of the film mold to adhere to the surface of the roller. Weak double-sided tape.
雙面膠帶所使用之基材,只要具有可捲繞於輥之可撓性即可,具體而言,可使用熱塑性樹脂性的薄膜、不織布、發泡體等。構成雙面膠帶之黏著劑層所使用之黏著劑,可使用以丙烯酸樹脂、胺甲酸酯樹脂、聚矽氧樹脂、及橡膠為主成分之黏著劑,從成本或後述黏著力的調整容易度來看,較佳為以丙烯酸樹脂為主成分之黏著劑。此等黏著劑中,可視需要,較佳係含有異氰酸酯系化合物、金屬螯合系化合物等之交聯劑。 The base material used for the double-sided tape may have flexibility that can be wound around a roll, and specifically, a thermoplastic resin film, a nonwoven fabric, a foam, or the like can be used. The adhesive used for the adhesive layer constituting the double-sided tape can be an adhesive containing an acrylic resin, a urethane resin, a polyoxymethylene resin, and a rubber as a main component, and the ease of adjustment from the cost or the adhesive force described later can be used. In view of the above, an adhesive mainly composed of an acrylic resin is preferred. Among these adhesives, a crosslinking agent such as an isocyanate compound or a metal chelate compound is preferably used as needed.
上述黏著劑層,該依循JIS Z 0237以拉伸角度90。且剝離速度300mm/分的條件下所進行之23℃時的黏著力,較佳未達20N/25mm,同一條件下之23℃時的黏著力,尤佳為0.01至10N/25mm。 The above adhesive layer is subjected to a stretching angle of 90 in accordance with JIS Z 0237. The adhesive force at 23 ° C under the conditions of a peeling speed of 300 mm/min is preferably less than 20 N/25 mm, and the adhesive force at 23 ° C under the same conditions is particularly preferably 0.01 to 10 N/25 mm.
接著說明薄膜模具3。 Next, the film mold 3 will be described.
薄膜模具,係具有具備於表面具有凹凸圖案之樹脂層,較佳為具備薄膜基材、形成於前述薄膜基材上且於表面具有凹凸圖案之樹脂層、以及以均一的厚度形成於前述樹脂層之至少具有凹凸圖案的面上之剝離劑層。 The film mold has a resin layer having a concave-convex pattern on its surface, and preferably has a film substrate, a resin layer formed on the film substrate and having a concave-convex pattern on the surface, and a resin layer formed on the resin layer with a uniform thickness. A release agent layer on the surface having at least a concave-convex pattern.
薄膜基材,較佳係選自由聚對苯二甲酸乙 二酯、聚碳酸酯、聚酯、聚甲基丙烯酸甲酯、聚苯乙烯、聚烯烴、聚醯亞胺、聚碸、聚醚碸及聚萘二甲酸乙二酯所組成之群組的1種樹脂。 a film substrate, preferably selected from the group consisting of polyethylene terephthalate a group consisting of diester, polycarbonate, polyester, polymethyl methacrylate, polystyrene, polyolefin, polyimine, polyfluorene, polyether oxime and polyethylene naphthalate Kind of resin.
薄膜基材的厚度,為了同時達到可撓性與剛性,較佳為25至1000μm的範圍內。形成樹脂層之樹脂,可列舉出熱塑性樹脂、熱固性樹脂或光硬化性樹脂。具體可列舉出丙烯酸系樹脂、甲基丙烯酸系樹脂、苯乙烯系樹脂、烯烴系樹脂、環烯烴樹脂、聚碳酸酯樹脂、聚酯系樹脂、環氧樹脂、氧雜環丁烷(Oxetane)等。較佳的樹脂為光硬化性樹脂,尤其是藉由紫外線所硬化之樹脂,具體可列舉出丙烯酸系樹脂、甲基丙烯酸系樹脂、環烯烴樹脂、苯乙烯系樹脂、環氧樹脂、聚碳酸酯樹脂、聚酯系樹脂。 The thickness of the film substrate is preferably in the range of 25 to 1000 μm in order to achieve flexibility and rigidity at the same time. The resin forming the resin layer may, for example, be a thermoplastic resin, a thermosetting resin or a photocurable resin. Specific examples thereof include acrylic resin, methacrylic resin, styrene resin, olefin resin, cycloolefin resin, polycarbonate resin, polyester resin, epoxy resin, oxetane, etc. . The preferred resin is a photocurable resin, particularly a resin which is cured by ultraviolet rays, and specific examples thereof include an acrylic resin, a methacrylic resin, a cycloolefin resin, a styrene resin, an epoxy resin, and a polycarbonate. Resin, polyester resin.
上述樹脂,在不對上述樹脂的性質造成影響之範圍內,可含有抗氧化劑、光增感劑、填充劑、勻化劑等成分。 The resin may contain components such as an antioxidant, a photosensitizer, a filler, and a leveling agent within a range that does not affect the properties of the above resin.
樹脂層的厚度,通常為0.5至500μm,較佳為5至250μm。樹脂層的厚度位於上述範圍時,具有可承受壓印之強度,並且平滑性良好,具有可撓性而容易處理。在此,所謂樹脂層的厚度,意指樹脂層的底面與表面上之凹凸的最高面之間的距離。 The thickness of the resin layer is usually from 0.5 to 500 μm, preferably from 5 to 250 μm. When the thickness of the resin layer is in the above range, it has strength to withstand embossing, and has good smoothness, flexibility, and easy handling. Here, the thickness of the resin layer means the distance between the bottom surface of the resin layer and the highest surface of the unevenness on the surface.
樹脂層之表面的凹凸圖案為以一定的週期重複之圖案,較佳為週期為10nm至500μm,深度為10nm至500μm。凹凸的具體形狀,可列舉出包含線、圓柱、單塊(monolith)、圓錐、多角錐、微透鏡、配線圖案、孔狀的 洞等之凹凸形狀。 The concavo-convex pattern on the surface of the resin layer is a pattern repeated at a certain period, preferably having a period of 10 nm to 500 μm and a depth of 10 nm to 500 μm. Specific shapes of the concavities and convexities include a line, a cylinder, a monolith, a cone, a polygonal pyramid, a microlens, a wiring pattern, and a hole shape. The concave and convex shape of the hole.
形成前述剝離劑層之剝離劑,可列舉出氟系矽烷偶合劑、具有胺基或羧基之全氟化合物及具有胺基或羧基之全氟醚化合物。剝離劑層的厚度,較佳為0.5至20nm的範圍內。所謂均一的厚度,意指實質上為均一之厚度,較佳為標準差0.1至10之均一的厚度。 Examples of the release agent for forming the release agent layer include a fluorine-based decane coupling agent, a perfluoro compound having an amine group or a carboxyl group, and a perfluoroether compound having an amine group or a carboxyl group. The thickness of the release agent layer is preferably in the range of 0.5 to 20 nm. By uniform thickness is meant a substantially uniform thickness, preferably a uniform thickness of 0.1 to 10 standard deviation.
此外,於樹脂層與剝離劑層之間,較佳係設置無機物層。藉由設置無機物層,可提升各層間的密合性,所以於轉印後,被轉印體樹脂層與薄膜模具之剝離性變得良好,不會產生薄膜模具之剝離劑層的脫落。 Further, an inorganic layer is preferably provided between the resin layer and the release agent layer. By providing the inorganic layer, the adhesion between the layers can be improved. Therefore, after the transfer, the peelability of the transfer body resin layer and the film mold is improved, and the release agent layer of the film mold does not fall off.
無機物層,較佳係由選自由SiO2、ZrO2、ZnO、Ta2O5、HfO2、ITO、FTO、TiO2、Si及SiC所組成之群組的至少1種無機物所構成,無機物層的厚度,較佳為0.5至100nm的範圍內。 The inorganic layer is preferably composed of at least one inorganic material selected from the group consisting of SiO 2 , ZrO 2 , ZnO, Ta 2 O 5 , HfO 2 , ITO, FTO, TiO 2 , Si, and SiC, and an inorganic layer. The thickness is preferably in the range of 0.5 to 100 nm.
薄膜模具之輥的外周方向的長度並無特別限制,可較輥的外周更短或更長,從穩定地卡止於輥之觀點來看,較佳係較輥的外周更短。 The length of the roll of the film mold in the outer circumferential direction is not particularly limited, and may be shorter or longer than the outer circumference of the roll, and is preferably shorter than the outer circumference of the roll from the viewpoint of stably locking the roll.
薄膜模具之輥寬度方向的長度,從壓印之觀點來看,較佳係較輥寬度更短。 The length of the film mold in the width direction of the roll is preferably shorter than the roll width from the viewpoint of embossing.
〈步驟(2)〉 <Step (2)>
如第1圖(2)所示,將基板5及於基板5上積層有未硬化的被轉印體樹脂層4a之被轉印體載置於壓印裝置的基板載置部6並固定。 As shown in Fig. 1 (2), the substrate 5 and the transfer target on which the unfixed transfer-substrate resin layer 4a is laminated on the substrate 5 are placed on the substrate mounting portion 6 of the imprint apparatus and fixed.
基板5並無特別限制,可列舉出樹脂基板、玻璃基板、矽基板、藍寶石基板、氮化鎵基板、碳基板、氮化矽基板等,為了提升與被轉印體樹脂層之密合性,可施以一般所知的易接著處理(電暈處理、引體處理等) The substrate 5 is not particularly limited, and examples thereof include a resin substrate, a glass substrate, a tantalum substrate, a sapphire substrate, a gallium nitride substrate, a carbon substrate, and a tantalum nitride substrate, and the adhesion to the transfer resin layer is improved. It can be easily processed (corona treatment, pull-up treatment, etc.) as generally known.
基板5可因應所得之凹凸圖案形成體的用途來適當地選擇,從可撓性或成本面之觀點來看,較佳為樹脂基板。樹脂基板所使用之樹脂,例如可列舉出聚對苯二甲酸乙二酯、聚碳酸酯、聚甲基丙烯酸甲酯、聚苯乙烯、環狀聚烯烴、聚醯亞胺、聚碸、聚醚碸、聚萘二甲酸乙二酯。基板的厚度,較佳為25至2000μm的範圍內,尤佳為50至500μm的範圍內。 The substrate 5 can be appropriately selected depending on the use of the obtained concave-convex pattern forming body, and is preferably a resin substrate from the viewpoint of flexibility or cost. Examples of the resin used for the resin substrate include polyethylene terephthalate, polycarbonate, polymethyl methacrylate, polystyrene, cyclic polyolefin, polyimine, polyfluorene, and polyether. Bismuth, polyethylene naphthalate. The thickness of the substrate is preferably in the range of 25 to 2000 μm, particularly preferably in the range of 50 to 500 μm.
形成被轉印體樹脂層4a之被轉印體樹脂,可列舉出熱塑性樹脂、熱固性樹脂、光硬化性樹脂,較佳的樹脂為光硬化性樹脂,尤其是藉由紫外線所硬化之樹脂,具體可列舉出丙烯酸系樹脂、甲基丙烯酸系樹脂、環烯烴樹脂、苯乙烯系樹脂、環氧樹脂、聚碳酸酯樹脂、聚酯系樹脂。為了得到未硬化的被轉印體樹脂層,熱塑性樹脂通常於塗布前必須進行加熱而軟化或是以有機溶劑來溶解之前處理,相對於此,光硬化性樹脂不須進行前處理,就此點而言為佳。 The transfer target resin forming the transfer body resin layer 4a may, for example, be a thermoplastic resin, a thermosetting resin or a photocurable resin, and a preferred resin is a photocurable resin, particularly a resin which is cured by ultraviolet rays, specifically Examples thereof include an acrylic resin, a methacrylic resin, a cycloolefin resin, a styrene resin, an epoxy resin, a polycarbonate resin, and a polyester resin. In order to obtain an uncured transfer-substrate resin layer, the thermoplastic resin is usually heated before being applied to soften or dissolve in an organic solvent, whereas the photocurable resin does not need to be pretreated. The words are better.
被轉印體樹脂塗布於基板5之方法,較佳為旋轉塗布、噴霧塗布、棒塗布、唇板塗布(lip coating)、狹縫塗布、灌注塗布等。被轉印體樹脂層4a的厚度,可因應所得之凹凸圖案形成體的用途來適當地選擇,較佳為0.1 至100μm的範圍。 The method of applying the transfer body resin to the substrate 5 is preferably spin coating, spray coating, bar coating, lip coating, slit coating, or infusion coating. The thickness of the transfer target resin layer 4a can be appropriately selected depending on the use of the obtained concavo-convex pattern formation body, and is preferably 0.1. To the range of 100 μm.
基板載置部6的材質,通常使用石英、玻璃、石模板、金屬及塑膠等。 As the material of the substrate mounting portion 6, quartz, glass, stone template, metal, plastic, or the like is generally used.
如第2圖所示,於基板載置部6上,較佳係具備用以暫時阻擋薄膜模具3的端部之留置手段7。較佳係於基板載置部6上之基板5的端部具備留置手段7,尤佳係於基板5的兩端部具備留置手段7。留置手段7可列舉出再剝離性的黏著膠帶、聚矽氧橡膠、以及以跨越薄膜模具與基板載置部之間之方式裝著之卡止片等。 As shown in FIG. 2, the substrate mounting portion 6 is preferably provided with an indwelling means 7 for temporarily blocking the end portion of the film mold 3. It is preferable that the end portion of the substrate 5 on the substrate mounting portion 6 is provided with the indwelling means 7, and it is particularly preferable to provide the indwelling means 7 at both end portions of the substrate 5. Examples of the indwelling means 7 include a releasable adhesive tape, a polyoxyxene rubber, and a locking sheet attached between the film mold and the substrate placing portion.
藉由具備留置手段7,尤其在連續作業時可確保壓印的位置精度,並且輔助薄膜模具3往被轉印體樹脂層4a上之卡止。 By providing the indwelling means 7, the positional accuracy of the imprint can be ensured particularly in the case of continuous operation, and the auxiliary film mold 3 can be locked to the transfer body resin layer 4a.
將被轉印體固定在基板載置部6上之方法,例如可列舉出真空吸附法、依據固定輔助具之固定、使用黏著劑之黏著法等。 The method of fixing the to-be-transferred body to the substrate mounting portion 6 may, for example, be a vacuum adsorption method, a fixing by a fixing aid, an adhesion method using an adhesive, or the like.
〈步驟(3)〉 <Step (3)>
較佳係在以留置手段7固定薄膜模具3的端部後,如第1圖(3)所示,一邊將步驟(1)中所得之捲繞保持於輥1之薄膜模具3,抵接於步驟(2)中所製備之基板5上的被轉印體樹脂層4a的表面,一邊使前述輥1往捲出方向轉動,而將薄膜模具3之表面的凹凸圖案轉印至被轉印體樹脂層4a的表面。如此,被轉印體樹脂層4a對薄膜模具3之卡止能力,較輥1之卡止薄膜模具3的能力更大,所以在凹凸圖 案之轉印的同時,薄膜模具3從輥1的表面剝離,而被捲出至被轉印體樹脂層4a上。該結果使薄膜模具3從輥1移動至被轉印體樹脂層4a上。根據此方法,可在不會產生氣泡的情況下,將薄膜模具3積層於被轉印體樹脂層4a上。薄膜模具3不須全部從輥1中剝離,可維持一部分捲繞於輥1之狀態。 Preferably, after fixing the end portion of the film mold 3 by the retention means 7, the film obtained in the step (1) is wound around the film mold 3 of the roll 1 as shown in Fig. 1 (3), and is abutted. The surface of the transfer-receiving resin layer 4a on the substrate 5 prepared in the step (2) is rotated in the winding-out direction while the roller 1 is rotated in the winding-out direction, and the uneven pattern on the surface of the film mold 3 is transferred to the object to be transferred. The surface of the resin layer 4a. As described above, the ability of the transfer body resin layer 4a to lock the film mold 3 is greater than the ability of the roll 1 to lock the film mold 3, so that the unevenness pattern is obtained. At the same time as the transfer of the film, the film mold 3 is peeled off from the surface of the roll 1 and is taken up onto the transfer body resin layer 4a. As a result, the film mold 3 is moved from the roll 1 to the transfer body resin layer 4a. According to this method, the film mold 3 can be laminated on the transfer body resin layer 4a without generating bubbles. The film mold 3 does not have to be completely peeled off from the roll 1, and a part of the film mold 3 can be maintained in a state of being wound around the roll 1.
此時,從使轉印達到良好之觀點來看,輥1的壓力較佳為1Pa至10kPa,轉速較佳為0.001至2m/分。 At this time, from the viewpoint of achieving good transfer, the pressure of the roller 1 is preferably from 1 Pa to 10 kPa, and the rotation speed is preferably from 0.001 to 2 m/min.
〈步驟(4)〉 <Step (4)>
如第1圖(4)所示,薄膜模具3藉由步驟(3)而捲出至被轉印體樹脂層4a,藉此成為積層於被轉印體樹脂層4a上之狀態。於此狀態下,使用樹脂硬化手段(圖中未顯示)使被轉印體樹脂層4a硬化而成為硬化後的被轉印體樹脂層4b。 As shown in Fig. 1 (4), the film mold 3 is wound up in the transfer body resin layer 4a by the step (3), thereby being laminated on the transfer body resin layer 4a. In this state, the transfer body resin layer 4a is cured by a resin curing means (not shown) to be the transferred body resin layer 4b after curing.
樹脂硬化手段,可列舉出光照射手段及加熱手段。光照射手段所使用之光,可列舉出紫外線、可見光線、紅外線及電子束等之活化能射線。活化能射線的照射量,通常為1至20,000mJ/cm2。加熱手段,可列舉出電熱加熱器、紅外線加熱器(燈)、感應加熱等。光照射手段,係使用在被轉印體樹脂為光硬化性樹脂時,加熱手段,係使用在被轉印體樹脂為熱固性樹脂時。 Examples of the resin hardening means include a light irradiation means and a heating means. Examples of the light used in the light irradiation means include active energy rays such as ultraviolet rays, visible rays, infrared rays, and electron beams. The amount of activation energy rays to be irradiated is usually from 1 to 20,000 mJ/cm 2 . Examples of the heating means include an electric heater, an infrared heater (lamp), induction heating, and the like. The light irradiation means is used when the transfer target resin is a photocurable resin, and the heating means is used when the transfer target resin is a thermosetting resin.
被轉印體樹脂為熱塑性樹脂時,藉由固化,可達成與本發明的硬化相同之目的,所以可將固化後 的熱塑性樹脂構成為被轉印體樹脂層4b。 When the transfer target resin is a thermoplastic resin, the same purpose as the hardening of the present invention can be achieved by curing, so that after curing The thermoplastic resin is configured as the transfer body resin layer 4b.
〈步驟(5)〉 <Step (5)>
如第1圖(5)所示,一邊將表面具有卡止能力之輥1抵接於步驟(4)中被積層於硬化後的被轉印體樹脂層4b的表面上的薄膜模具3,一邊往捲取方向轉動。如此,使因被轉印體樹脂層4a硬化所得之被轉印體樹脂層4b之對薄膜模具3的卡止能力減少,而使硬化後的被轉印體樹脂層4b對薄膜模具3的卡止能力,較輥1之卡止薄膜模具3的能力更小,所以薄膜模具3從硬化後的被轉印體樹脂層4b中剝離,並被捲取於輥1。此方法中,由於將薄膜模具3從硬化後的被轉印體樹脂層4b中剝離時之剝離角僅為輥曲率,所以薄膜模具3及硬化後的被轉印體樹脂層4b不會產生損傷。 As shown in Fig. 1 (5), the roll 1 having the locking ability on the surface is brought into contact with the film mold 3 laminated on the surface of the cured transfer resin layer 4b in the step (4). Rotate in the winding direction. In this manner, the locking ability of the transfer-form resin layer 4b obtained by curing the transfer-receptor resin layer 4a against the film mold 3 is reduced, and the card body 3b after the hardening is applied to the film mold 3 Since the ability to lock the film mold 3 of the roll 1 is smaller than that of the roll 1, the film mold 3 is peeled off from the hardened transfer body resin layer 4b, and is taken up by the roll 1. In this method, since the peeling angle when the film mold 3 is peeled off from the hardened transfer body resin layer 4b is only the roll curvature, the film mold 3 and the hardened transfer body resin layer 4b are not damaged. .
此時,從將薄膜模具3確實地從硬化後的被轉印體樹脂層4b剝離之觀點來看,輥1的壓力較佳為1Pa至10kPa,轉速較佳為0.001至2m/分。 At this time, from the viewpoint of reliably peeling the film mold 3 from the cured transfer body resin layer 4b, the pressure of the roll 1 is preferably from 1 Pa to 10 kPa, and the rotation speed is preferably from 0.001 to 2 m/min.
步驟(4)所使用之輥,可使用步驟(3)中將薄膜模具3剝離後的狀態之輥,此外,亦可使用與步驟(1)至(3)所使用之輥不同的輥。 The roll used in the step (4) may be a roll in a state in which the film mold 3 is peeled off in the step (3), and a roll different from the roll used in the steps (1) to (3) may be used.
〈步驟(3)及步驟(5)的架構〉 <Structure of Step (3) and Step (5)>
本發明,係利用:藉由輥1的壓力及旋轉以及被轉印體樹脂層的硬化,使薄膜模具與被轉印體樹脂層的界面相 對強度相對地降低之發明。 According to the present invention, the interface between the film mold and the resin layer of the transfer body is utilized by the pressure and rotation of the roll 1 and the hardening of the resin layer of the transfer body. The invention is relatively low in strength.
被轉印體樹脂層,於硬化前具有流動性,所以具有潤濕性。另一方面,硬化後的被轉印體樹脂層為樹脂硬化體,所以不具有潤濕性,基板由於對被轉印體樹脂層的密合性較強,所以可將輥與薄膜模具之密合性(黏著性),設定為較密合性相對較弱之薄膜模具與硬化後的被轉印體樹脂層之界面的剝離力更高,而能夠將薄膜模具捲取於輥。因此,本發明係將輥1表面的卡止能力,設定為較硬化前的被轉印體樹脂層4a與基板之卡止能力更低,且較硬化後的薄膜模具與被轉印體樹脂層4b之卡止能力更高。亦即,輥1表面的卡止能力與被轉印體樹脂層的卡止能力之大小關係,係因被轉印體樹脂層的硬化而使往薄膜模具3之密合性降低並藉此反轉。該結果為,較佳以留置手段7來固定薄膜模具的端部,並施以輥1的旋轉及壓力而對被轉印體樹脂層4a進行壓印,接著使被轉印體樹脂層硬化,藉此,隨著薄膜模具3與輥1表面的卡止能力以及對被轉印體樹脂層之密合性大小關係的變化,而在輥表面上與被轉印體樹脂層來回移動。 The resin layer to be transferred has fluidity before curing, and therefore has wettability. On the other hand, since the resin body layer to be transferred after curing is a resin-hardened body, it does not have wettability, and the substrate has a strong adhesion to the resin layer to be transferred, so that the roll and the film mold can be densely bonded. The properties (adhesiveness) are set such that the peeling force at the interface between the film mold having a relatively weaker adhesion and the cured transfer resin layer is higher, and the film mold can be taken up on the roll. Therefore, the present invention sets the locking ability of the surface of the roll 1 to be lower than that of the transfer target resin layer 4a and the substrate before hardening, and the hardened film mold and the transfer body resin layer. 4b has a higher card stopping capacity. In other words, the relationship between the locking ability of the surface of the roll 1 and the locking ability of the resin layer to be transferred is caused by the hardening of the resin layer of the transfer body, and the adhesion to the film mold 3 is lowered. turn. As a result, it is preferable that the end portion of the film mold is fixed by the retention means 7, and the transfer body resin layer 4a is embossed by the rotation and pressure of the roller 1, and then the resin layer of the transfer body is hardened. Thereby, the film mold 3 moves back and forth with the transfer body resin layer on the surface of the roll as the locking property of the film mold 3 on the surface of the roll 1 and the adhesion to the resin layer to be transferred are changed.
具體而言,步驟(3)中,較佳者,當以留置手段7將薄膜模具3的端部固定在基板載置部6後,將薄膜模具抵接於硬化前的被轉印體樹脂層時,由於輥1表面的卡止能力較硬化前的被轉印體樹脂層4a的卡止能力低,所以藉由輥1的加壓及開展(旋轉),薄膜模具從輥1表面移往硬化前的被轉印體樹脂層4a上。相對於此,步驟 (5)中,當將輥1表面的卡止層抵接於硬化後的被轉印體樹脂層4b時,由於輥1表面的卡止能力較硬化前的被轉印體樹脂層的卡止能力高,所以藉由輥1的加壓及開展(旋轉),薄膜模具從硬化後的被轉印體樹脂層上移往輥表面上。 Specifically, in the step (3), preferably, the end portion of the film mold 3 is fixed to the substrate mounting portion 6 by the retention means 7, and the film mold is brought into contact with the transfer body resin layer before curing. When the locking ability of the surface of the roll 1 is lower than that of the transfer-receiving resin layer 4a before hardening, the film mold is moved from the surface of the roll 1 to hardening by the pressurization and development (rotation) of the roll 1. The front transfer resin layer 4a is transferred. In contrast, the steps (5) When the locking layer on the surface of the roll 1 is brought into contact with the hardened transfer-body resin layer 4b, the locking ability of the surface of the roll 1 is more than that of the transfer-receptive resin layer before curing. Since the capacity is high, the film mold is moved from the hardened transfer-substrate resin layer to the surface of the roll by pressurization and development (rotation) of the roll 1.
藉由上述架構,本發明可容易地將薄膜模具3從輥表面中剝離,並且在製造凹凸圖案形成體後,可將薄膜模具回收至輥表面。因此,根據本發明之製造方法,可個別進行轉印操作與被轉印體樹脂層的硬化操作,並且將回收後的薄膜模具再利用。 With the above structure, the present invention can easily peel the film mold 3 from the surface of the roll, and after the concave-convex pattern forming body is manufactured, the film mold can be recovered to the roll surface. Therefore, according to the manufacturing method of the present invention, the transfer operation and the hardening operation of the transfer body resin layer can be performed individually, and the recovered film mold can be reused.
〈步驟(1)至(5)的連續操作〉 <Continuous operation of steps (1) to (5)>
於上述步驟(2)中,當基板載置部被固定時,藉由使在前述表面具有薄膜模具3之輥1移動並使被轉印體樹脂層4硬化,可連續地製造凹凸圖案形成體。此時,亦可藉由使用將薄膜模具3捲出至被轉印體樹脂層4a之輥、以及從硬化後的被轉印體樹脂層4b上捲取薄膜模具3之輥之不同的輥來作為輥1,而更改為移動方式。 In the above step (2), when the substrate mounting portion is fixed, the uneven pattern forming body can be continuously manufactured by moving the roller 1 having the film mold 3 on the surface and curing the transferred body resin layer 4. . At this time, it is also possible to use a roller which rolls up the film mold 3 to the transfer body resin layer 4a and a roller which rolls the film of the film mold 3 from the hardened transfer body resin layer 4b. As the roller 1, it is changed to the moving mode.
於上述步驟(2)中,當基板載置部為可移動時,藉由將前述表面具有卡止能力之輥1以及樹脂硬化手段固定,並使基板載置部移動,可連續地製造凹凸圖案形成體。 In the above step (2), when the substrate mounting portion is movable, the roller 1 and the resin curing means having the locking ability on the surface are fixed, and the substrate mounting portion is moved to continuously manufacture the concave-convex pattern. Form the body.
〈凹凸圖案形成體〉 <concave pattern forming body>
本發明中所得之凹凸圖案形成體,藉由適當地調整凹 凸圖案的尺寸或被轉印體樹脂的組成,可合適地使用作為光學構件用途(抗反射薄膜、線柵型偏光板、LED或OLED的取光基板、光擴散板等)、細胞培養薄片、撥水性構件、親水性構件。 The concave-convex pattern forming body obtained in the present invention, by appropriately adjusting the concave The size of the convex pattern or the composition of the resin to be transferred can be suitably used as an optical member (antireflection film, wire grid type polarizing plate, light-receiving substrate of LED or OLED, light diffusion plate, etc.), cell culture sheet, A water-repellent member and a hydrophilic member are dialed.
〈壓印裝置〉 <imprinting device>
本發明的第二樣態之壓印裝置,係具備:表面具有卡止能力之輥、捲出至前述輥表面且可裝卸地被保持在前述輥表面之在表面上具有凹凸圖案之薄膜模具、以及用以使被轉印體樹脂層硬化之樹脂硬化手段而成;並且該壓印裝置係將形成於前述薄膜模具的表面之凹凸圖案轉印至被轉印體樹脂層,其特徵為:將捲繞有前述薄膜模具之輥配置在前述被轉印體樹脂層上,並藉由使前述輥朝前述薄膜模具的捲出方向轉動,使前述薄膜模具可從輥表面供給至被轉印體樹脂層表面;並且在藉由前述樹脂硬化手段使被轉印體樹脂層硬化後,將前述輥配置在硬化後的前述被轉印體樹脂層上,並藉由朝前述薄膜模具的捲取方向轉動輥,將轉印有前述薄膜模具的凹凸圖案之被轉印體樹脂層與前述薄膜模具剝離,而使前述薄膜模具可捲取並回收於輥表面。 An imprint apparatus according to a second aspect of the present invention includes: a roll having a locking property on the surface; a film mold having a concave-convex pattern on the surface which is detachably held on the surface of the roll and detachably held on the surface of the roll, And a resin hardening means for hardening the resin layer of the transfer body; and the printing apparatus transfers the uneven pattern formed on the surface of the film mold to the resin layer to be transferred, characterized in that A roll on which the film mold is wound is disposed on the transfer body resin layer, and the film mold is supplied from the roll surface to the transfer body resin by rotating the roll toward the winding direction of the film mold. After the surface of the layer is cured by the resin curing means, the roller is placed on the hardened layer of the transfer body resin and rotated in the winding direction of the film mold. The roller peels the transfer-substrate resin layer on which the concave-convex pattern of the film mold is transferred, and the film mold, and the film mold can be taken up and collected on the surface of the roll.
以下係根據實施例來更具體說明本發明, 但本發明並不限定於此等實施例。 The present invention will be more specifically described below based on examples. However, the invention is not limited to the embodiments.
黏著劑A:混合丙烯酸系聚合物(綜研化學公司製、品名:SK Dyne 1435、非揮發份30%)120g(固體成分量)、異氰酸酯系交聯劑(Tosoh公司製、Coronate HX、非揮發份100%)3.6g(固體成分量)、以及乙酸乙酯200g。 Adhesive A: Mixed acrylic polymer (product name: SK Dyne 1435, 30% nonvolatile content) 120 g (solid content), isocyanate crosslinking agent (Tosoh, Coronate HX, non-volatile 100%) 3.6 g (solid content) and 200 g of ethyl acetate.
黏著劑B:混合丙烯酸系聚合物(綜研化學公司製、品名:SK Dyne 1495、非揮發份30%)120g(固體成分量)、異氰酸酯系交聯劑(Tosoh公司製、Coronate HX、非揮發份100%)312g(固體成分量)、以及乙酸乙酯200g。 Adhesive B: Mixed acrylic polymer (manufactured by Soken Chemical Co., Ltd., product name: SK Dyne 1495, nonvolatile content: 30%), 120 g (solid content), isocyanate crosslinking agent (Tosoh, Coronate HX, non-volatiles) 100%) 312 g (solid content) and 200 g of ethyl acetate.
將黏著劑A塗布於厚度50μm之聚對苯二甲酸乙二酯製薄膜(Toray公司製、Lumirror T60)的單面並乾燥,而形成黏著劑層A。此外,於未形成黏著劑層A之聚對苯二甲酸乙二酯製薄膜之另一方的面,塗布黏著劑層B並乾燥,而形成黏著劑層B。乾燥後之黏著劑層A、B的厚度均為25μm,黏著力,黏著劑層A較黏著劑層B高。 The adhesive A was applied to one side of a polyethylene terephthalate film (manufactured by Toray Co., Ltd., Lumirror T60) having a thickness of 50 μm and dried to form an adhesive layer A. Further, the adhesive layer B was applied to the other surface of the polyethylene terephthalate film on which the adhesive layer A was not formed, and dried to form the adhesive layer B. The thickness of the adhesive layers A and B after drying was 25 μm, and the adhesive layer A was higher than the adhesive layer B.
黏著劑層A對不鏽鋼板的黏著力為(7.1N/25mm)。 The adhesion of the adhesive layer A to the stainless steel plate was (7.1 N / 25 mm).
黏著劑層B對不鏽鋼板的黏著力為(0.4N/25mm)。 The adhesion of the adhesive layer B to the stainless steel plate was (0.4 N/25 mm).
(1)樹脂層的形成 (1) Formation of resin layer
將混合有丙烯酸異莰酯75重量份、二新戊四醇六丙烯酸酯15重量份、以及甲基丙烯酸縮水甘油酯10重量份之光硬化性樹脂液,以使膜厚成為1μm之方式旋轉塗布於 厚度75μm之聚對苯二甲酸乙二酯製薄膜(Toyobo公司製、Cosmo Shine A-4100)的易接著處理面上後,以0.4MPa緊壓於在表面賦予有孔狀的凹凸之鎳模具(轉印面100mm×100mm‧週期250nm‧深度200nm),並藉由UV照射(10mW/cm2、1分鐘)使樹脂膜硬化後,將模具脫模而得到賦予有孔狀的洞之樹脂薄片。 The photocurable resin liquid containing 75 parts by weight of isodecyl acrylate, 15 parts by weight of dipentaerythritol hexaacrylate, and 10 parts by weight of glycidyl methacrylate was spin-coated so as to have a film thickness of 1 μm. After a film having a thickness of 75 μm of polyethylene terephthalate (manufactured by Toyobo Co., Ltd., Cosmo Shine A-4100), it was pressed at 0.4 MPa to a nickel mold having a hole-like unevenness on the surface. (Transfer surface: 100 mm × 100 mm ‧ cycle 250 nm ‧ depth: 200 nm), and the resin film was cured by UV irradiation (10 mW/cm 2 , 1 minute), and then the mold was released to obtain a resin sheet to which a hole having a hole was formed.
(2)無機物層的形成 (2) Formation of inorganic layer
於(1)所得之表面賦予有形狀之樹脂薄片上,於室溫下以SiO2進行1分鐘的真空蒸鍍,形成10nm厚的氧化被覆膜,而構成無機物層。蒸鍍後,以目視確認到於無機物層的表面形狀上,未產生龜裂或形狀的缺損。 The surface obtained by the above (1) was applied to a resin sheet having a shape, and vacuum-deposited with SiO 2 for 1 minute at room temperature to form an oxide coating film having a thickness of 10 nm to form an inorganic layer. After the vapor deposition, it was visually confirmed that the surface shape of the inorganic layer did not cause cracks or shape defects.
(3)剝離劑層的形成 (3) Formation of release agent layer
將(2)所得之無機物層與光硬化性樹脂層與基板之積層物,浸漬在全氟系的氟系剝離劑(Daikin Industries公司製、商品名稱:Optool DSX)1分鐘後,拉起並在70℃、90%RH的濕熱環境下靜置1小時。然後以氟系溶劑(Harves公司製、商品名稱:HD-TH)淋洗,於23℃、65%RH的環境下靜置24小時,結束剝離劑層的處理。剝離劑層的厚度為3nm。確認剝離劑層之形成後的凹凸形狀,並無缺陷或形狀變化。 The inorganic layer obtained in (2) and the laminate of the photocurable resin layer and the substrate were immersed in a perfluoro-based fluorine-based release agent (manufactured by Daikin Industries, Inc., trade name: Optool DSX) for 1 minute, and then pulled up and The mixture was allowed to stand in a hot and humid environment at 70 ° C and 90% RH for 1 hour. Then, it was rinsed with a fluorine-based solvent (manufactured by Harves Co., Ltd., trade name: HD-TH), and allowed to stand in an environment of 23° C. and 65% RH for 24 hours to complete the treatment of the release agent layer. The thickness of the release agent layer was 3 nm. The uneven shape after the formation of the release agent layer was confirmed, and there was no defect or shape change.
如此,係得到依序積層有基板、樹脂層、無機物層及剝離劑層之薄膜模具。 In this manner, a film mold in which a substrate, a resin layer, an inorganic layer, and a release agent layer are laminated in this order is obtained.
於直徑100mm、寬200mm之SUS304製輥的表面上,透過調製例1中所得之雙面黏著膠帶的黏著劑A,貼附雙面黏著膠帶。 The double-sided adhesive tape was attached to the surface of the SUS304 roll having a diameter of 100 mm and a width of 200 mm through the adhesive A of the double-sided adhesive tape obtained in Preparation Example 1.
將調製例2中所製作之薄膜模具,透過前述雙面黏著膠帶的黏著劑B捲繞保持於輥表面,而得到薄膜模具被捲繞保持於表面之輥。 The film mold prepared in Preparation Example 2 was wound around the surface of the roll by the adhesive B of the double-sided adhesive tape to obtain a roll in which the film mold was wound and held on the surface.
藉由膠帶固定法,將厚度100μm之聚對苯二甲酸乙二酯製基板(Toray公司製、Lumirror U10)載置於基板載置部。 A polyethylene terephthalate substrate (manufactured by Toray Co., Ltd., Lumirror U10) having a thickness of 100 μm was placed on the substrate mounting portion by a tape fixing method.
藉由棒塗布法,將光硬化性樹脂(東洋合成工業公司製、PAK-02)塗布於前述基板上,而形成厚度1.5μm之被轉印體樹脂層。 A photocurable resin (PAK-02, manufactured by Toyo Kasei Co., Ltd.) was applied onto the substrate by a bar coating method to form a transfer body resin layer having a thickness of 1.5 μm.
將模具表面被捲繞保持有前述薄膜模具之輥,以250Pa的壓力抵接於前述被轉印樹脂層,並以0.06m/分的轉速在捲出方向上旋轉,在薄膜模具與前述黏著膠帶的黏著劑層B之界面上,以全體寬度將前述薄膜模具剝離並捲出至被轉印樹脂層表面,而將薄膜模具的圖案轉印至被轉印樹脂層,並且得到被轉印樹脂層與薄膜模具之積層物。 Roller having the surface of the mold held by the film mold, abutting against the transferred resin layer at a pressure of 250 Pa, and rotating in a winding direction at a rotational speed of 0.06 m/min, in the film mold and the aforementioned adhesive tape At the interface of the adhesive layer B, the film mold is peeled off and rolled up to the surface of the transferred resin layer at the entire width, and the pattern of the film mold is transferred to the transferred resin layer, and the transferred resin layer is obtained. A laminate with a film mold.
對前述被轉印樹脂層與薄膜模具之積層物,照射1,000mJ/cm2的紫外線以使被轉印樹脂硬化。 The laminate of the transfer resin layer and the film mold was irradiated with ultraviolet rays of 1,000 mJ/cm 2 to cure the transferred resin.
然後,當以250Pa的壓力將薄膜模具被剝離後之輥抵接於前述積層物的薄膜模具,並以0.06m/分的轉速在捲取方向上旋轉時,薄膜模具從硬化後的樹脂層中剝離,且被 捲取於輥表面的黏著劑層B上。薄膜模具與轉印後之樹脂層的圖案,均未被破壞。 Then, when the roll in which the film mold was peeled off was brought into contact with the film mold of the above laminate at a pressure of 250 Pa and rotated in the winding direction at a rotation speed of 0.06 m/min, the film mold was from the cured resin layer. Stripped and It is taken up on the adhesive layer B on the surface of the roll. The pattern of the film mold and the resin layer after the transfer was not broken.
將紫外線對被轉印樹脂層與薄膜模具之積層物的照射量變更為40mJ/cm2,除此之外,其他進行與實施例1相同之操作,結果被轉印樹脂未硬化。當使薄膜模具在輥的捲取方向上旋轉時,散見到樹脂層的圖案產生變形或破壞。 The same operation as in Example 1 was carried out except that the irradiation amount of the ultraviolet ray on the laminate of the transfer resin layer and the film mold was changed to 40 mJ/cm 2 , and the transferred resin was not cured. When the film mold is rotated in the winding direction of the roll, the pattern in which the resin layer is scattered is deformed or broken.
1‧‧‧輥 1‧‧‧ Roll
2‧‧‧具有卡止能力之輥表面 2‧‧‧Rolling surface with locking ability
3‧‧‧薄膜模具 3‧‧‧film mould
4a‧‧‧硬化前的被轉印體樹脂層 4a‧‧‧Transferd resin layer before hardening
4b‧‧‧硬化後的被轉印體樹脂層 4b‧‧‧ Hardened transfer resin layer
5‧‧‧基板 5‧‧‧Substrate
6‧‧‧基板載置部 6‧‧‧Substrate placement
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