TW201621589A - Film touch sensor and method for fabricating the same - Google Patents

Abstract

Disclosed are a film touch sensor, including: a separating layer; a first protective layer disposed on the separating layer; and electrode pattern layers including a sensing electrode formed in a sensing area and a pad electrode formed in a pad area which are formed on the first protective layer, wherein an area other than the pad electrode in the pad area on the first protective layer is filled with a material of a first protective layer, thereby it is possible to prevent the thermal damage of the base film, easily form the pattern layer, and prevent the separating layer from being damaged due to the exposure to the etchant, and a method for fabricating the same.

Description

Film touch sensor and manufacturing method thereof

The present invention relates to a thin film touch sensor and a method of fabricating the same.

Since the touch input mode has become the focus of the next generation input mode, there have been many attempts to introduce this touch input mode into various electronic devices. Therefore, the research and development of touch sensors for improving the application of touch signals in different environments are also actively underway.

For example, in the case of an electronic device having a touch-mode display, an ultra-thin film flexible display not only has improved portability, but also achieves ultra-light weight and low power consumption, and thus becomes attractive to the public. A generation of displays. Therefore, it is necessary to develop a touch sensor that can be applied to such a display.

A flexible display refers to a display fabricated on a flexible substrate that can be bent, bent or rolled up without compromising its characteristics. The technology development of flexible displays has been greatly improved, with various forms such as flexible LCDs, flexible OLEDs, spreadsheets or the like.

To apply the touch input mode to a flexible display, a touch sensor having excellent flexibility and recovery and excellent flexibility and elasticity is required.

In order to manufacture a thin film touch sensor for a flexible display, a wiring substrate including a wiring buried in a transparent resin has been proposed.

A method of manufacturing a wiring substrate may include a wiring forming manufacturing process for forming a metal wiring on a substrate, and may include a stack manufacturing process by applying a transparent resin solution to a metal wiring to form a transparent resin substrate, so that the transparent resin can be covered And the dry metal wiring may also include a manufacturing procedure for peeling off the transparent resin from the substrate.

In order to smoothly perform the peeling manufacturing process in the above manufacturing method, an organic peeling material (for example, a silicone resin and a fluororesin) or an inorganic peeling material (for example, a diamond-like carbon (DLC) film or a zirconia film) is formed in advance. Methods for the surface of the substrate have also been employed.

However, in the case of using an inorganic release material, if the substrate and the metal wiring are peeled off from the substrate, the metal wiring and the substrate cannot be peeled off smoothly, and thus there is a problem that the metal wiring and a part of the substrate remain on the surface of the substrate, and if organic The material may be left as a release material.

That is, there is a problem that even if a release material is used, the metal wiring of the wiring substrate may not be completely peeled off from the substrate.

In order to solve the above problems, Korean Patent Publication No. 10-1191865 discloses a method comprising forming a sacrificial layer which can be removed by light or solvent, a metal when a flexible substrate is formed in a form in which a metal wiring is buried therein. The wiring and a polymer material (flexible substrate) are on the substrate, and then the sacrificial layer is removed by light or solvent to peel the metal wiring from the polymer material from the substrate.

However, the above method has a problem in that in a display having a large size, it is difficult to perform a manufacturing process for removing the sacrificial layer, and at the same time, a high-temperature manufacturing process cannot be performed, and thus various film substrates cannot be used.

Accordingly, it is an object of the present invention to provide a thin film touch sensor capable of forming a pattern layer or the like by performing a manufacturing process on a carrier substrate, and providing a thin film touch sensor. Methods.

Another object of the present invention is to provide a thin film touch sensor that can be easily peeled off from a carrier substrate and to provide a method of fabricating such a thin film touch sensor.

The above object of the present invention is achieved by the following features:

(1) A thin film touch sensor comprising: a separation layer; a first protective layer disposed on the separation layer; and a plurality of electrode pattern layers including a sensing electrode and a pad electrode, the sensing electrode Forming in a sensing region and forming a pad electrode in a pad region, wherein the plurality of electrode pattern layers are formed on the first protective layer, wherein in the pad region of the first protective layer, except for the pad electrode One of the other regions is filled with the material of the first protective layer.

(2) The thin film touch sensor according to (1) above, wherein the separation layer is made of a polymer selected from the group consisting of polyimide polymer and polyvinyl alcohol. (poly vinyl alcohol polymer), polyamic acid polymer, polyamide polymer, polyethylene polymer, polystyrene polymer, poly Polynorbornene polymer, phenylmaleimide copolymer polymer, polyazobenzene polymer, polyphthalate polymer Polyphenylenephthalamide polymer), polyester polymer, polymethyl methacrylate polymer, polyarylate polymer, cinnamate polymer, coumarin polymerization Coumarin polymer, phthalimidine polymer, chalcone polymerization (Chalcone polymer) and aromatic acetylene polymer (aromatic acetylene polymer) consisting of one group.

(3) The thin film touch sensor according to (1) above, wherein the separation layer is formed on a carrier substrate and separated from the carrier substrate.

(4) The thin film touch sensor according to (3) above, wherein the separation layer has a peeling strength of not more than 1 N/25 mm with respect to the carrier substrate.

(5) The thin film touch sensor according to (3) above, wherein the separation layer has a peeling strength of not more than 0.1 N/25 mm with respect to the carrier substrate.

(6) The thin film touch sensor according to (3) above, wherein the carrier substrate is a glass substrate.

(7) The thin film touch sensor of (1) above, wherein the first protective layer covers at least a portion of one of the faces of the separation layer.

(8) The thin film touch sensor according to (1) above, wherein the pad electrode has a surface energy difference of not more than 20 mN/m between the separation layer and the first protective layer.

(9) The thin film touch sensor according to (1) above, wherein the electrode pattern layer is made of one or more materials selected from the group consisting of metal oxides, metals, metal nanowires, A group of carbon-based materials and conductive polymer materials.

(10) The thin film touch sensor of (1), further comprising: a second protective layer disposed on the first protective layer on which the electrode pattern layer is formed.

(11) The thin film touch sensor of (10), wherein the second protective layer is an adhesive layer, and the first protective layer and the second protective layer have a ratio of not more than 300 at 25 ° C. The difference in elastic modulus of MPa.

(12) The thin film touch sensor of (10), further comprising: a base film attached to the second protective layer.

(13) The thin film touch sensor of (12), wherein the base film is attached to the second protective layer by an adhesive layer, and the second protective layer and the adhesive layer have A difference in elastic modulus, which is not more than 300 MPa at 25 °C.

(14) The thin film touch sensor of (12), wherein the base film is a polarizing plate or a transparent film.

(15) The thin film touch sensor of (1), further comprising: a circuit board electrically connected to the pad electrode.

(16) A touch panel comprising the thin film touch sensor according to any one of (1) to (15) above.

(17) An image display device comprising the touch screen panel according to (16) above.

(18) A method of manufacturing a thin film touch sensor, comprising: forming a separation layer on a carrier substrate; forming a first protective layer on the separation layer; selectively etching only one of the first protective layers A portion of the pad region, wherein a pad electrode is to be formed in the portion; and a sensing electrode is formed on one of the sensing regions of the first protective layer, and a pad electrode is formed on the portion to be etched.

(19) The method of (18), further comprising: forming a second protective layer on the first protective layer, wherein the sensing electrode and the pad electrode are formed on the first protective layer.

(20) The method according to (19) above, wherein the second protective layer is an adhesive layer, and the first protective layer and the second protective layer have an elastic modulus of not more than 300 MPa at 25 ° C difference.

(21) The method according to (19) above, further comprising: attaching a base film to the second protective layer.

(22) The method according to (21) above, wherein the base film is attached to the second protective layer by an adhesive layer, and the elastic modulus difference between the second protective layer and the adhesive layer is The difference in elastic modulus is not more than 300 MPa at 25 °C.

(23) The method according to (18) above, further comprising: separating the separation layer from the carrier substrate.

(24) The method according to (18) above, wherein the separation layer is made of a polymer selected from the group consisting of a polyimide polymer and a poly vinyl alcohol polymer. , polyamic acid polymer, polyamide polymer, polyethylene polymer, polystyrene polymer, polynorbornene polymer (polynorbornene polymer) Polymer), phenylmaleimide copolymer polymer, polyazobenzene polymer, polyphenylenephthalamide polymer, polyester polymerization Polyester polymer, polymethyl methacrylate polymer, polyarylate polymer, cinnamate polymer, coumarin polymer, benzyl Phthalimidine polymer, chalcone polymer Acetylene and aromatic polymer (aromatic acetylene polymer) consisting of one group.

(25) The method according to (18) above, wherein the separation layer has a peel strength of not more than 1 N/25 mm with respect to the carrier substrate.

(26) The method according to (18) above, wherein the carrier substrate is a glass substrate.

(27) The method of (18) above, wherein the first protective layer is formed to cover at least a portion of one of the faces of the separation layer.

(28) The method according to (23) above, further comprising: after peeling off the separation layer from the carrier substrate, attaching a circuit board to a position corresponding to the pad region of the separation layer, and electrically connecting the circuit board to the pad electrode.

(29) The method according to (28) above, wherein the anisotropic conductive film has a conductive ball, and the anisotropic conductive film is disposed at a position corresponding to the pad region of the separation layer, after heating and adding Pressing, the conductive ball is passed through the separation layer to be connected to the pad electrode and the circuit board is connected to the anisotropic conductive film.

Embodiments of the present invention disclose that thermal damage or the like of the base film can be prevented by performing a manufacturing process for forming a patterned layer, or fabricating a thin film touch sensor similar to a carrier substrate, and then attaching a base film thereon.

It is disclosed in the embodiments of the present invention that the pattern layer can be formed relatively easily, and sufficient support effect is provided by using the carrier substrate.

In the embodiment of the present invention, when the self-supporting substrate is peeled off, the peeling electrode pattern layer is protected by peeling off the electrode pattern layer from the carrier substrate, and the electrical connection of the circuit board is easily achieved.

In addition, it is also possible to prevent the separation layer from being damaged by exposure to the etchant or the like, since the region other than the pad electrode in the pad region of the first protective layer is filled with the material of the first protective layer.

The present invention discloses a thin film touch sensor comprising: a separation layer; a first protective layer disposed on the separation layer; and a plurality of electrode pattern layers including a sensing electrode and a pad electrode, sensing The electrode is formed on a sensing region and the pad electrode is formed on a pad region, and the plurality of electrode pattern layers are formed on the first protection layer, wherein in the pad region of the first protection layer, except for the solder The region other than the pad electrode is filled with the material of the first protective layer, thereby preventing thermal damage of the base film, facilitating formation of the pattern layer, and preventing the separation layer from being damaged by exposure to the etchant; the present invention also discloses the film A method of manufacturing a touch sensor.

The thin film touch sensor disclosed in one embodiment of the present invention comprises a separation layer, a first protection layer and a plurality of electrode pattern layers.

1 to 5 are a cross-sectional view of a thin film touch sensor and a plan view of a pad electrode according to a specific embodiment of the present invention; and FIGS. 6 to 15 are diagrams showing a manufacturing process of manufacturing a thin film touch sensor. The details will be described below with reference to the drawings.

The separation layer 20 is formed on one of the carrier substrates 10 and can be separated from the carrier substrate 10, and serves as a protective electrode pattern by covering the electrode pattern layer (pad electrode) 40 and the electrode pattern layer (sensing electrode) 50. One layer of the layer (pad electrode) 40 and the electrode pattern layer (sensing electrode) 50.

The separation layer 20 may be a polymer organic layer. For example, the separation layer 20 may be made of a polymer such as a polyimide polymer, a poly vinyl alcohol polymer, a polyamic acid polymer, or a polyfluorene polymer. Polyamide polymer, polyethylene polymer, polystyrene polymer, polynorbornene polymer, phenyl maleimide copolymer polymer Phenylmaleimide copolymer polymer), polyazobenzene polymer, polyphenylenephthalamide polymer, polyester polymer, polymethyl methacrylate polymer Polymethyl methacrylate polymer), polyarylate polymer, cinnamate polymer, coumarin polymer, phthalimidine polymer, chalcone polymerization (chalcone polymer) and aromatic acetylene polymer (aromatic acetylene Polymer), etc., but is not limited to this. These materials may be used singly or in combination of two or more.

The separation layer 20 can be easily peeled off from the carrier substrate 10, and can be made of a material having a peel strength with respect to the carrier substrate 10 and not more than 1 N/25 mm, preferably with respect to the carrier substrate 10 and A material having a peel strength of not more than 0.1 N/25 mm is formed so that the separation layer 20 is not peeled off from the first protective layer 30 as described below when it is peeled off.

Any material having appropriate strength and being less susceptible to heat treatment or chemical treatment can be used as the carrier substrate 10, and is not particularly limited as long as the material can hold the carrier substrate 10 without being easily deformed or distorted during handling. For example, glass, quartz, tantalum wafer, SUS, or the like can be used, and glass is preferably used.

The first protective layer 30 is disposed on the separation layer 20.

Similar to the separation layer 20, the first protective layer 30 covers the electrode pattern layer (pad electrode) 40 and the electrode pattern layer (sensing electrode) 50 as described below to protect the electrode pattern layer (pad electrode) 40 and the electrode pattern layer. (sensing electrode) 50, and in the manufacturing process of manufacturing the thin film touch sensor of the present invention, as a separation preventing layer 20 from being exposed to form an electrode pattern layer (pad electrode) 40 and an electrode pattern layer (sensing Electrode) 50 etchant.

A polymer known in the art can be used as the first protective layer 30, and is not particularly limited, and the first protective layer 30 can be manufactured, for example, as an organic insulating layer.

The first protective layer 30 may cover at least a portion of one of the faces of the separation layer 20 to reduce the patterning process of the pattern, such as the pattern described below, in which the one side of the separation layer is exposed to the etchant or the like. . Insofar as one side of the separation layer 20 is completely blocked, it is preferable that the first protective layer 30 is formed to completely cover one side of the separation layer 20.

The electrode pattern layer (pad electrode) 40 and the electrode pattern layer (sensing electrode) 50 are disposed on the first protective layer 30.

The electrode pattern layer (pad electrode) 40 and the electrode pattern layer (sensing electrode) 50 include a sensing electrode 50 and a pad electrode 40.

The sensing electrode 50 can be disposed on one of the sensing regions on the first protective layer, and the pad electrode 40 can be disposed on one of the pad regions on the first protective layer. However, since the sensing electrode 50 and the pad electrode 40 are electrically connected to each other, at least a portion of the sensing electrode 50 can be disposed in the pad region and at least a portion of the pad electrode 40 can also be Set in the sensing area.

The sensing area refers to the area corresponding to the display unit, that is, the area where the touch can be performed in the film sensor, and the pad area refers to the area corresponding to the pad element. That is, the sensing area of the first protective layer refers to the area corresponding to the display unit on the first protective layer, and the pad area refers to the area corresponding to the pad element on the first protective layer.

The electrode pattern layer (pad electrode) 40 and the electrode pattern layer (sensing electrode) 50 may be made of any conductive material, and are not particularly limited. For example, the electrode pattern layer (pad electrode) 40 and the electrode pattern layer (sensing electrode) 50 may be made of a material selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), and oxidation. Indium zinc tin (IZTO), aluminum zinc oxide (AZO), gallium zinc oxide (GZO), fluorine tin oxide (FTO), indium tin oxide - silver - indium tin oxide (ITO - Ag - ITO), indium zinc oxide-silver-indium zinc oxide (IZO-Ag-IZO), indium zinc tin oxide-silver-indium zinc tin oxide (IZTO-Ag-IZTO) and aluminum zinc oxide - a metal oxide selected from the group consisting of silver-oxidized aluminum zinc (AZO-Ag-AZO); from gold (Au), silver (Ag), copper (Cu), molybdenum (Mo), and a metal selected from the group consisting of Ag-Pd-Cu alloy (APC); a metal nanowire selected from the group consisting of gold, silver, copper, and lead; a carbon-based material selected from the group consisting of carbon nanotubes (CNTs) and graphene; selected from the group consisting of polydioxyethylthiophene (PEDOT) and polyaniline (PANI) A conductive polymer material of choice. These materials may be used singly or in combination of two or more.

The unit patterns of the electrode pattern layer (pad electrode) 40 and the electrode pattern layer (sensing electrode) 50 may be independent of each other, and may also have a polygonal pattern including a triangle, a quadrangle, a pentagon, a hexagon, Hexagon or more sides.

Furthermore, the electrode pattern layer (pad electrode) 40 and the electrode pattern layer (sensing electrode) 50 may also include a regular pattern. A regular pattern means that a pattern form is regular. For example, the unit patterns may be independent of each other, and may also include a grid form such as a rectangle and a square or a pattern such as a hexagon.

Furthermore, the electrode pattern layer (pad electrode) 40 and the electrode pattern layer (sensing electrode) 50 may include an irregular pattern. An irregular pattern means that a pattern form is not regular.

If the electrode pattern layer (pad electrode) 40 and the electrode pattern layer (sensing electrode) 50 are made of, for example, a metal nanowire, a carbon-based material, and a polymer material, the electrode pattern layer (pad electrode) 40 and the electrode The pattern layer (sensing electrode) 50 may have a network structure.

If the electrode pattern layer (pad electrode) 40 and the electrode pattern layer (sensing electrode) 50 have a network structure, signals can be sequentially transferred to adjacent patterns by being in contact with each other, and thus, a high can be generated. The pattern of sensitivity.

The pad electrode 40 can be electrically connected to a circuit board 80 as described below.

Figure 2 is a plan view of the pad electrode 40 after it has been formed (in Figure 2, the red rectangle represents the pad area). As shown in Fig. 2A, in the pad region of the first protective layer 30, the region other than the pad electrode 40 is filled with the material of the first protective layer 30.

The pad electrode 40 can be formed by selectively patterning a portion of the pad region of the first protective layer 30, that is, the pad electrode 40 is formed in the patterned portion of the pad region of the first protective layer 30. , but not limited to this.

As shown in FIG. 2A, if the region other than the pad electrode 40 is filled with the material of the first protective layer 30 in the pad region of the first protective layer 30, the separation layer 20 corresponds to the pad region. The region is not exposed, and thus when the electrode pattern layer (pad electrode) 40 and the electrode pattern layer (sensing electrode) 50 are formed, the pad region of the separation layer 20 is not exposed to an etchant or the like. Therefore, the chemical influence caused by the etchant or the like does not cause problems such as cracking, peeling, deterioration or the like of the excellent separation layer 20.

However, as shown in FIG. 2B, if the entire pad region is etched to form the pad electrode 40, when the electrode pattern layer (pad electrode) 40 and the electrode pattern layer (sensing electrode) 50 are formed later, The region of the separation layer 20 corresponding to the pad region is exposed to the etchant.

In order to reduce the area of the separation layer 20 corresponding to the pad region from being exposed to the etchant, it is preferable that the pad electrode 40 has a surface energy difference from the separation layer 20 and the first protection layer 30, respectively. This surface energy difference is no more than 20 mN/m.

As shown in Figures 2A and 10, the pad electrode 40 is adjacent to the separation layer 20 and the first protective layer 30. Here, if the pad electrode 40 has a surface energy difference of not more than 20 mN/m (measured by ASTM D7490) between the separation layer 20 and the first protective layer 30, the pad electrode 40 may have a separation relative to the separation. The excellent adhesion of the layer 20 and the first protective layer 30 also prevents the etchant from flowing into the gap therebetween.

As shown in FIG. 3, the thin film touch sensor disclosed in one embodiment of the present invention may further include a second protective layer 60 disposed on the first protective layer on which the electrode pattern layer is formed.

The second protective layer 60 can serve as a substrate or as a passivation layer. In addition, the second protective layer 60 can also prevent the electrode pattern layer (pad electrode) 40 and the electrode pattern layer (sensing electrode) 50 from being corroded, and can suppress microbubbles when bonded to the base film 70 by planarizing the surface. It happened. Further, the second protective layer 60 can function as an adhesive layer.

If the second protective layer 60 is used as a substrate or a passivation layer, it can be a polymer (for example, polydimethylsiloxane (PDMS), polyorganosiloxanes (POS), etc.), polyimine. A polymer (polyimide polymer), a polyurethane polymer or the like is produced, but is not limited thereto. These materials may be used singly or in combination of two or more.

If the second protective layer 60 is used as an adhesive layer, there is no particular limitation on the heat-curable or photo-curable adhesive or binder known in the art. For example, polyester, polyether or urethane can be used. , epoxy resin, hydrazine and acrylate resin as a heat curing or photocuring adhesive or bonding agent.

If the second protective layer 60 is used as an adhesive layer, in the thin film touch sensor disclosed in one embodiment of the present invention, the first protective layer 30 and the second protective layer 60 preferably have a The difference in elastic modulus, which is not more than 300 MPa at 25 °C, can suppress the occurrence of cracks. This modulus of elasticity can be measured with a rheometer, UTM device, or similar device.

As shown in FIG. 4, the thin film touch sensor disclosed in one embodiment of the present invention may further include a base film 70 attached to the second protective layer 60.

If the second protective layer 60 is used as an adhesive layer, the base film 70 may be attached to the second protective layer 60, or as shown in FIG. 5, the base film 70 may be attached to the second protection by an adhesive layer 90. On layer 60.

In this case, the difference between the second protective layer 60 and the adhesive layer preferably has an elastic modulus difference of not more than 300 MPa at 25 ° C, and the crack caused by the difference in the elastic modulus can be suppressed. occur.

If the base film 70 is a transparent film, it can be made of a material widely used in the art, and is not particularly limited. For example, the base film 70 may be any one selected from the group consisting of the materials listed below. Made of these materials such as: cellulose ester (for example: cellulose triacetate, cellulose propionate, cellulose butyrate, cellulose acetate (cellulose acetate propionate) and nitrocellulose, polyimide, polycarbonate, polyester (eg polyethylene terephthalate) , polyethylene naphthalate, poly-1,4-cyclohexane dimethylene phthalate, polyethylene 1,2 -diphenyloxyethane-4,4'-dicarboxylate and polybutylene terephthala Te)), polystyrene (for example: syndiotactic polystyrene), polyolefin (for example: polypropylene, polyethylene, polymethyl pentane) Polymethylpentene, polysulfone, polyether sulfone, poly arylate, polyether-imide, polymethyl methacrylate, Polyether ketone, polyvinylalcohol, and polyvinyl chloride or a mixture thereof; may be used singly or in combination of two or more.

Further, the base film may be an isotropic film or a retardation film.

In the case of an isotropic film, one side hysteresis (Ro, Ro = [nx – ny] ́ d], where nx and ny represent the major refractive index of a film plane, and nz represents the film along its thickness direction. The refractive index) is 40 nm or less, preferably 15 nm or less, and hysteresis along one of its thickness directions (Rth, Rth = [(nx + ny)/2 - nz] ́ d) is - It is in the range of 90 nm to +75 nm, preferably in the range of -80 nm to +60 nm and more preferably in the range of -70 nm to +45 nm.

The retardation film is a film manufactured by a manufacturing process, and the manufacturing process may include uniaxial stretching of a polymer film, biaxial stretching of a polymer film, polymer coating, and liquid crystal coating; and the hysteresis film is usually Used to improve and control optical properties such as viewing angle compensation, color sensitivity enhancement, light leakage improvement, and color taste control in displays.

Further, a polarizing plate can be used as the base film 70.

The polarizing plate may be formed by attaching a polarizing protective film to one surface or both surfaces of a polyvinyl alcohol polarizing film.

Further, a protective film can be used as the base film 70.

The protective film is a film in which an adhesive layer is formed on at least one surface of the film, and the film may be made of a polymer resin or a self-adhesive film such as polypropylene, and may be used to protect the touch sensor. Surface and improved processability.

Preferably, the base film 70 has a light transmittance of more than 85%, and more preferably more than 90%. Further, the base film 70 preferably has a total haze value of less than 10%, and more preferably less than 7%, and the result is measured by JIS K7136.

The thickness of the base film 70 is not limited, but is preferably in the range of 30 to 150 mm, and more preferably in the range of 70 to 120 mm.

Further, the thin film touch sensor disclosed in one embodiment of the present invention may further include a circuit board 80.

Circuit board 80 can be a flexible printed circuit board (FPCB).

The board 80 can be electrically connected to the pad electrodes.

The case where the circuit board 80 is attached to the separation layer 20 will be described in detail, and the circuit board 80 may be connected to the pad electrode 40 by an anisotropic conductive film (ACF).

The anisotropic conductive film may have a form of a plurality of conductive balls, wherein the conductive balls are conductive particles dispersed in the curable resin.

The conductive ball may be made of nickel or a nickel-gold alloy, and the curable resin in which the conductive ball is located may be an acrylate resin or an epoxy resin, but is not limited thereto.

A commercially available conductive ball may comprise a TGP series manufactured by H&C High Tech Co.

The thin film touch sensor disclosed in one embodiment of the present invention can be used as a thin film touch sensor after being peeled off from the carrier substrate 10.

Furthermore, the present invention provides a touch screen panel including the film touch sensor and an image display device including the touch screen panel.

The touch screen panel disclosed in one embodiment of the present invention can be used for a general liquid crystal display device and various image display devices, such as an electroluminescence display device, a plasma display device, and a field emission display device. In addition, the touch screen panel can be effectively applied to an image display device having flexible characteristics.

Further, the present invention provides a method of fabricating a thin film touch sensor.

Hereinafter, a method of manufacturing a thin film touch sensor disclosed in an embodiment of the present invention will be described in detail.

In the method of manufacturing a thin film touch sensor disclosed in an embodiment of the present invention, as shown in FIG. 6, the separation layer 20 is formed on the carrier substrate 10.

Any material having appropriate strength and being less susceptible to heat treatment or chemical treatment can be used as the carrier substrate 10, and is not particularly limited as long as the material can hold the carrier substrate 10 without being easily deformed or distorted during handling. For example, glass, quartz, tantalum wafer, SUS, or the like can be used, and glass is preferably used.

The separation layer 20 can be made of the above polymer material.

Since the pad electrode 40 made of a metal material is not easily peeled off from the carrier substrate 10 as described below, and the separation layer 20 is easily peeled off from the carrier substrate 10, in the case where the separation layer 20 is formed, the carrier substrate 10 is formed. The influence of the thin film touch sensor at the time of being peeled off can be reduced, and thus the damage problem of the electrode pattern layer (pad electrode) 40 and the electrode pattern layer (sensing electrode) 50 can be reduced.

When the physical damage is reduced when peeled off, it is preferred that the separation layer 20 has a peel strength with respect to the carrier substrate 10 of not more than 1 N/25 mm, and more preferably not more than 0.1 N/25 mm.

The method of forming the separation layer 20 is not particularly limited, but may be formed by a polymer component and by any method known in the art, for example, slit coating, blade coating, spin coating, casting, micro gravure Coating, gravure coating, bar coating, roll coating, wire bar coating, dip coating, spray coating, screen printing, gravure printing, flexographic printing, lithography, inkjet printing, dispenser printing, nozzle coating and capillary Coating and similar methods.

After the separation layer 20 is formed by the above method, the separation layer 20 can be subjected to an additional curing process.

The method of curing the separation layer 20 is not particularly limited, but may be used by photocuring, heat curing, or both. If the photocuring method is used together with the heat curing method, the order is not particularly limited.

As a special example of curing conditions, the thermal curing process is carried out at 50 to 300 ° C for 1 to 60 minutes, preferably at 100 to 200 ° C for 5 to 30 minutes. In the photocuring treatment procedure, ultraviolet irradiation may be performed at an intensity of 0.01 to 10 J/cm ² for 1 to 500 seconds, and preferably ultraviolet irradiation is performed at an intensity of 0.05 to 1 J/cm ² for 1 to 120 Seconds, but not limited to this.

Next, as shown in Fig. 7, a first protective layer 30 is formed on the separation layer 20.

The first protective layer 30 can be made of the above materials, and the method of forming the separation layer 20 is not particularly limited, and therefore the same method as the formation of the separation layer 20 can be used.

The first protective layer 30 may be formed to cover at least a portion of one side of the separation layer 20 to reduce exposure of one of the separation layers to an etchant or the like in a manufacturing process (eg, a patterning process of a pattern as described below) situation. Insofar as one side of the separation layer 20 is completely blocked, it is preferable that the first protective layer 30 is formed to completely cover one side of the separation layer 20.

Next, as shown in Figs. 8 and 2A, only a portion of the pad region of the first protective layer 30 is selectively etched, and the pad electrode 40 is formed in the portion.

As shown in FIG. 2B, in the case of etching all of the pad regions of the first protective layer 30, a portion of the pad region of the separation layer 20 is formed when the pad electrode 40 is formed or after the pad electrode 40 is formed. Was exposed. Therefore, when the pad electrode 40 is formed or the sensing electrode 50 described below is formed, the exposed portion of the separation layer 20 is exposed to chemicals such as an etchant and a release agent, thereby causing cracks, peeling, and deterioration. Or similar issues.

However, the present invention is only selectively etched into a portion of the pad region of the first protective layer 30, and the pad electrode 40 will be formed in the previously etched portion. Therefore, after the pad electrode 40 is formed on the portion to be etched, the separation layer 20 under the first protective layer 30 is completely unexposed, and therefore, the problem of exposure to an etchant or the like can be solved.

Next, as shown in Figs. 9 and 10, the pad electrode 40 is formed on the portion to be etched.

The pad electrode 40 can be made of the above metal or metal oxide.

The method of forming the pad electrode 40 is not particularly limited, but may include any method known in the art, such as physical deposition, chemical deposition, plasma deposition, plasma polymerization, thermal deposition, thermal oxidation, amphoteric oxidation, clustering. Ion beam deposition, screen printing, gravure printing, flexographic printing, lithography, ink jet printing, dispenser printing or the like.

It is possible to more reliably prevent the separation layer 20 from being exposed to an etchant or the like, preferably the pad electrode 40 exceeds the portion to be etched, and thus is formed to have a width larger than the portion to be etched, so that The pad electrode 40 may be formed to further cover a portion of the pad region of the first protective layer 30.

Figure 11 is a cross-sectional view showing the formation of a thin film touch sensor until the pad electrode 40 is viewed from the pad area as viewed from the pad area. Thus, when the width of the pad electrode 40 is formed to have a width larger than the portion to be etched, the etchant can be surely prevented from flowing into the etched slit.

As shown in FIGS. 12 and 13, the sensing electrode 50 is formed on the sensing region of the first protective layer 30.

The sensing electrode 50 may be made of the above metal oxide, metal, nanowire, carbon-based material, polymer material or the like.

The method of forming the sensing electrode 50 is not particularly limited, and thus the same method as the formation of the pad electrode 40 can be used.

The unit patterns of the sensing electrode 50 and the pad electrode 40 can be formed by photolithography.

Photolithography is a method of forming a pattern by a series of fabrication processes known in the art, such as applying a photoresist to a layer to be patterned, using a mask to selectively cure The photoresist, the uncured photoresist is removed by development, patterned by etching, and the cured photoresist is removed.

The photoresist can be divided into a positive photoresist and a negative photoresist. The positive photoresist is a photoresist, which becomes soluble in the developer after being irradiated by ultraviolet light, and the photoresist is a photoresist. The agent becomes insoluble in the developer after being irradiated with ultraviolet light.

Therefore, in the case of using a positive photoresist, a portion irradiated with ultraviolet light is developed and then subjected to a manufacturing process to form a pattern; however, in the case of using a negative photoresist, a portion not irradiated with ultraviolet light is developed, and then A manufacturing process is performed to form a pattern.

The conditions for curing the photoresist are not particularly limited, and for example, ultraviolet irradiation is performed at an intensity of 0.01 to 10 J/cm ² for 1 to 500 seconds, and preferably ultraviolet light is performed at an intensity of 0.05 to 1 J/cm ² . Irradiate for 1 to 120 seconds.

The present invention may further include forming a second protective layer 60 on the first protective layer 30 on which the sensing electrode 50 and the pad electrode 40 are formed.

The second protective layer 60 itself can serve as a substrate or as a passivation layer. In addition, the second protective layer 60 can also prevent the electrode pattern layer (pad electrode) 40 and the electrode pattern layer (sensing electrode) 50 from being corroded, and can suppress microbubbles when bonded to the base film 70 by planarizing the surface. It happened. Further, the second protective layer 60 can function as an adhesive layer.

The second protective layer 60 may be made of the above polymer or the above-mentioned adhesive or binder.

If the second protective layer 60 serves as an adhesive layer, the first protective layer 30 and the second protective layer 60 may have a difference in elastic modulus as described above.

As shown in Fig. 14, the present invention may further comprise an adhesion base film 70 on the second protective layer 60.

The base film 70 may be a film made of the above materials or may be a polarizing plate, a retardation film or a protective film.

The polarizing plate may be formed by attaching a polarizing protective film to one surface or both surfaces of a polyvinyl alcohol polarizing film.

If the second protective layer 60 is used as a substrate, the base film 70 can be attached to the second protective layer 60 by the above-described heat-curing or photo-curing adhesive. In this case, the second protective layer 60 and the adhesive layer may have the above-described difference in elastic modulus.

The base film 70 may be attached by pressurization, and the pressure range applied thereto is not particularly limited, and thus the range may be, for example, in the range of 1 to 200 Kg/cm ² , preferably 10 to 100. Between the range of Kg/cm ² .

When the base film 70 is attached to the second protective layer 60, in order to improve the adhesion between the base film 70 and the second protective layer 60, the surface to which the base film 70 is attached may be subjected to a surface treatment such as corona treatment, flame. Treatment, plasma treatment, ultraviolet light irradiation, primer coating treatment and saponification treatment.

Next, the separation layer 20 is peeled off from the carrier substrate 10.

Even after being peeled off, the separation layer 20 remains on the side of the thin film sensor without being removed, and thus can serve as a cladding layer to protect the electrode pattern layer (pad electrode) 40 and the electrode pattern layer (sensing electrode) ) 50.

After the separation layer 20 is peeled off from the carrier substrate 10, as shown in Fig. 15, the circuit board 80 can be attached to the pad region of the separation layer 20.

The circuit board 80 is electrically connected to the pad electrode 40.

The electrical connection between the board 80 and the pad electrode 40 can be achieved by an anisotropic conductive film.

The anisotropic conductive film may have a form in which a plurality of conductive balls are dispersed in a curable resin, wherein the conductive balls are conductive particles.

The conductive ball may be made of nickel or a nickel-gold alloy, and the curable resin in which the conductive ball is located may be an acrylate resin or an epoxy resin, but is not limited thereto.

The details of the electrical connection are as follows. An anisotropic conductive film having a conductive ball is disposed in the pad region of the separation layer 20, and then heated and pressurized. Next, a conductive ball is passed through the separation layer 20 to connect the pad electrode 40. Then, the circuit board 80 is connected to the anisotropic conductive film to electrically connect the circuit board 80 to the pad electrode 40.

As disclosed in another embodiment of the present invention, the separation layer 20 is peeled off from the carrier substrate 10, and then the separation layer 20 corresponding to the pad region can also be chemically removed.

As a medical fluid for removing the separation layer 20, a medical fluid for removing a polymer known in the art can be used without particular limitation. For example, a basic medical fluid such as potassium hydroxide (KOH), tetramethylammonium hydroxide (TMAH), and an amine can be used, and an acidic medical fluid such as phosphoric acid, acetic acid, and nitric acid can also be used. These materials may be used singly or in combination of two or more.

After the separation layer 20 is removed, the circuit board 80 may be attached to the side of the first protective layer to be electrically connected to the pad electrode 40.

A method for manufacturing a thin film touch sensor including the above steps disclosed in an embodiment of the present invention is a manufacturing process for forming a pattern layer on a carrier substrate 10 by forming a thin film touch sensor, and then attaching the base film 70. Thereby, thermal damage of the base film 70 can be prevented.

Further, if a pattern layer is formed on the base film 70 in accordance with a general method, in the case of using the thin base film 70, the base film 70 cannot be sufficiently supported. However, the present invention forms a pattern layer on the carrier substrate 10, whereby the pattern layer is easily formed without causing the above problems.

Further, when the separation layer 20 is peeled off from the carrier substrate 10, the separation layer 20 is also peeled off from the carrier substrate 10, and thus the electrode pattern layer (pad electrode) 40 and the electrode pattern layer (sensing electrode) 50 can be protected. The electrical connection to and from the board 80 can be easily achieved.

Further, the pad electrode 40 is formed by selectively etching a portion of the pad region of the first protective layer 30, whereby the separation layer 20 can be prevented from being damaged by exposure to an etchant or the like.

The present invention has been described above with reference to the above embodiments, but it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of patent protection shall be subject to the definition of the scope of the patent application attached to this specification.

10‧‧‧ Carrier substrate
20‧‧‧Separation layer
30‧‧‧First protective layer
40‧‧‧electrode pattern layer (pad electrode)
50‧‧‧electrode pattern layer (sensing electrode)
60‧‧‧Second protective layer
70‧‧‧ base film
80‧‧‧ boards
90‧‧‧Adhesive layer

The accompanying drawings are included to provide a further understanding of the invention, The drawings illustrate one or more embodiments of the invention, and, together with the Therefore, the present invention will be more fully understood from the following description of the embodiments, wherein: FIG. 1 is a cross-sectional view of an embodiment of a thin film touch sensor of the present invention. Fig. 2A is a plan view showing a pad electrode formed in an embodiment of the invention, and Fig. 2B is a plan view showing a pad electrode formed in a conventional manner. Figure 3 is a cross-sectional view showing another embodiment of the thin film touch sensor of the present invention. Figure 4 is a cross-sectional view showing another embodiment of the thin film touch sensor of the present invention. Figure 5 is a cross-sectional view showing another embodiment of the thin film touch sensor of the present invention. 6 to 15 are schematic views showing a manufacturing process of a thin film touch sensor manufactured by an embodiment of the manufacturing method of the present invention.

20‧‧‧Separation layer

30‧‧‧First protective layer

40‧‧‧electrode pattern layer (pad electrode)

Claims (29)

A thin film touch sensor comprising: a separation layer; a first protective layer disposed on the separation layer; and a plurality of electrode pattern layers including a sensing electrode and a pad electrode, the sensing electrode forming And a plurality of electrode pattern layers are formed on the first protective layer, wherein the solder pad area of the first protective layer is in addition to the soldering One of the regions other than the pad electrode is filled with the material of the first protective layer. The thin film touch sensor of claim 1, wherein the separation layer is made of a polymer selected from the group consisting of a polyimide polymer and a polyvinyl alcohol polymer ( Poly vinyl alcohol polymer), polyamic acid polymer, polyamide polymer, polyethylene polymer, polystyrene polymer, polynorbornazole Polynorbornene polymer, phenylmaleimide copolymer polymer, polyazobenzene polymer, polyphenylenephthalamide polymer ), polyester polymer, polymethyl methacrylate polymer, polyarylate polymer, cinnamate polymer, coumarin polymer Coumarin polymer), phthalimidine polymer, chalcone polymer (chalcone polymer) and a group of aromatic acetylene polymers. The thin film touch sensor of claim 1, wherein the separation layer is formed on a carrier substrate and separated from the carrier substrate. The thin film touch sensor of claim 3, wherein the separation layer has a peel strength relative to the carrier substrate and not greater than 1 N/25 mm. The thin film touch sensor of claim 3, wherein the separation layer has a peel strength relative to the carrier substrate and not greater than 0.1 N/25 mm. The thin film touch sensor of claim 3, wherein the carrier substrate is a glass substrate. The thin film touch sensor of claim 1, wherein the first protective layer covers at least a portion of one of the separation layers. The thin film touch sensor of claim 1, wherein the pad electrode has a surface energy difference from the separation layer and the first protective layer, and the surface energy difference is no more than 20 mN/m. The thin film touch sensor of claim 1, wherein the electrode pattern layer is made of one or more materials selected from the group consisting of metal oxides, metals, metal nanowires, carbon-based materials, and conductive materials. A group of constituents of a polymeric material. The thin film touch sensor of claim 1, further comprising: a second protective layer disposed on the first protective layer on which the electrode pattern layer is formed. The film touch sensor of claim 10, wherein the second protective layer is an adhesive layer, and the first protective layer and the second protective layer have an elastic modulus difference, the elastic modulus The difference is not more than 300 MPa at 25 °C. The thin film touch sensor of claim 10, further comprising: a base film attached to the second protective layer. The film touch sensor of claim 12, wherein the base film is attached to the second protective layer by an adhesive layer, and the second protective layer and the adhesive layer have an elastic mode The difference in the modulus of elasticity is not more than 300 MPa at 25 °C. The thin film touch sensor of claim 12, wherein the base film is a polarizing plate or a transparent film. The thin film touch sensor of claim 1, further comprising: a circuit board electrically connected to the electrode of the pad. A touch screen panel comprising the film touch sensor of any one of claims 1 to 15. An image display device comprising the touch screen panel of claim 16. A method of manufacturing a thin film touch sensor, comprising: forming a separation layer on a carrier substrate; forming a first protective layer on the separation layer; selectively etching only one of the first protection layers a portion of the region, wherein a pad electrode is to be formed in the portion; and a sensing electrode is formed on the sensing region of the first protective layer, and the pad electrode is formed on the portion to be etched. The method of claim 18, further comprising: forming a second protective layer on the first protective layer on which the electrode pattern layer is formed. The method of claim 19, wherein the second protective layer is an adhesive layer, and the first protective layer and the second protective layer have an elastic modulus difference, and the elastic modulus is different at 25 ° C. It is not more than 300 MPa. The method of claim 19, further comprising: attaching a base film to the second protective layer. The method of claim 21, wherein the base film is attached to the second protective layer by an adhesive layer, and the elastic modulus is different between the second protective layer and the adhesive layer. The difference is not more than 300 MPa at 25 °C. The method of claim 18, further comprising: stripping the separation layer from the carrier substrate. The method of claim 18, wherein the separation layer is made of a polymer selected from the group consisting of a polyimide polymer, a poly vinyl alcohol polymer, and a polyvinyl alcohol polymer. , polyamic acid polymer, polyamide polymer, polyethylene polymer, polystyrene polymer, polynorbornene polymer (polynorbornene polymer) Polymer), phenylmaleimide copolymer polymer, polyazobenzene polymer, polyphenylenephthalamide polymer, polyester polymerization Polyester polymer, polymethyl methacrylate polymer, polyarylate polymer, cinnamate polymer, coumarin polymer, benzyl Phthalimidine polymer, chalcone polymer Lymer) and a group of aromatic acetylene polymers. The method of claim 18, wherein the separation layer has a peel strength relative to the carrier substrate and no greater than 1 N/25 mm. The method of claim 18, wherein the carrier substrate is a glass substrate. The method of claim 18, wherein the first protective layer is formed to cover at least a portion of one of the separation layers. The method of claim 23, further comprising: after peeling the separation layer from the carrier substrate, attaching a circuit board to a position corresponding to the pad region of the separation layer, and electrically connecting the circuit board to the Pad electrode. The method of claim 28, wherein the anisotropic conductive film has a conductive ball, and the anisotropic conductive film is disposed at a position corresponding to the pad region of the separation layer, and is heated and pressurized to make the method A conductive ball is connected to the pad electrode through the separation layer and connects the circuit board to the anisotropic conductive film.