KR20160071091A - Film Touch Sensor and Method for Fabricating the Same - Google Patents

Abstract

The present invention relates to a film touch sensor and a method of manufacturing the same, and more particularly, A first protective layer located on the isolation layer; And a pad electrode formed on a sensing region formed on a sensing region on the first passivation layer and a pad region, wherein a region other than the pad electrode in the pad region on the first passivation layer is a first passivation layer, The present invention relates to a film touch sensor capable of preventing thermal damage or the like of a base film by being filled with a material and capable of easily forming a pattern layer and preventing damage to an isolation layer caused by exposure to an etchant or the like and a manufacturing method thereof.

Description

Technical Field [0001] The present invention relates to a film touch sensor and a fabrication method thereof,

The present invention relates to a film touch sensor and a method of manufacturing the same.

There have been attempts to introduce a touch input method into a wider variety of electronic devices while the touch input method is being watched as a next generation input method. Accordingly, research and development on a touch sensor capable of being applied to various environments and capable of accurate touch recognition are actively performed have.

For example, in the case of an electronic device having a touch-type display, an ultra-thin flexible display which achieves light weight, low power and improved portability has been attracting attention as a next generation display, and development of a touch sensor applicable to such a display has been required.

Flexible display means a display made on a flexible substrate that can bend, bend or twist without loss of properties, and technology development is underway in the form of flexible LCDs, flexible OLEDs, and electronic paper.

In order to apply the touch input method to such a flexible display, a touch sensor having excellent flexing and restoring force and excellent flexibility and stretchability is required.

As for the film touch sensor for manufacturing such a flexible display, a wiring board including wiring buried in a transparent resin base is proposed.

A wiring forming step of forming a metal wiring on the substrate; a lamination step of forming a transparent resin base material by applying and drying a transparent resin solution so as to cover the metal wiring; and a peeling step of peeling the transparent resin base material from the substrate .

In order to smoothly carry out the peeling process, an organic peeling material such as silicone resin or fluororesin, a diamond like carbon (DLC) thin film, a zirconium oxide thin film, or other inorganic peeling material is applied to the surface of the substrate A method of forming in advance is used.

However, when an inorganic stripping material is used, there is a problem that the metal wiring and the substrate remain on the surface of the substrate because the separation of the wiring and the substrate does not proceed smoothly when the substrate and the metal wiring are separated from the substrate. There is a problem in that the organic material is buried on the surface of the wiring and the substrate.

That is, there is a problem that the metal wiring of the wiring substrate can not be completely peeled off from the substrate even when the peeling material is used.

In order to solve such a problem, Korean Patent No. 10-1191865 discloses a method for manufacturing a flexible substrate in the form of a buried metal wiring, a sacrificial layer which can be removed by light or a solvent, After the polymer material (flexible substrate) is formed on the substrate, the sacrificial layer is removed by using light or a solvent to separate the metal wiring and the polymer material (flexible substrate) from the substrate.

However, such a method has a problem that it is difficult to remove the sacrificial layer in a large size, and a high temperature process can not be performed, so that various film substrates can not be used.

Korean Patent No. 1191865

An object of the present invention is to provide a film touch sensor in which a pattern layer and the like are easily formed on a carrier substrate, and a manufacturing method thereof.

An object of the present invention is to provide a film touch sensor which is easy to peel off from a carrier substrate and a method of manufacturing the same.

1. separation layer;

A first protective layer located on the isolation layer; And

And an electrode pattern layer including a sensing electrode formed on a sensing region on the first passivation layer and a pad electrode formed on the pad region,

Wherein a region other than the pad electrode in the pad region on the first passivation layer is filled with the first passivation layer material.

2. The separator of claim 1, wherein the separating layer is selected from the group consisting of a polyimide-based polymer, a poly vinyl alcohol-based polymer, a polyamic acid-based polymer, a polyamide-based polymer, Based polymer, a polystyrene-based polymer, a polynorbornene-based polymer, a phenylmaleimide copolymer-based polymer, a polyazobenzene-based polymer, a polyphenylenephthalamide-based polymer A polymer such as a polyester, a polymethyl methacrylate polymer, a polyarylate polymer, a cinnamate polymer, a coumarin polymer, a phthalimidine polymer, phthalimidine-based polymer, chalcone-based polymer, and aromatic acetylene-based polymer.

3. The film touch sensor of claim 1, wherein the separation layer is formed on and separated from the carrier substrate first.

4. The film touch sensor according to 3 above, wherein the separation layer has a peeling force of not more than 1 N / 25 mm on the carrier substrate.

5. The film touch sensor according to 3 above, wherein the separating layer has a peeling force of 0.1 N / 25 mm or less with respect to the carrier substrate.

6. The film touch sensor according to 3 above, wherein the carrier substrate is a glass substrate.

7. The film touch sensor of 1 above, wherein said first protective layer covers at least a part of the side of the separation layer.

8. The film touch sensor of claim 1, wherein the pad electrode has a surface energy difference of 20 mN / m or less with respect to the separation layer and the first passivation layer.

9. The film touch sensor of 1 above, wherein the electrode pattern layer is formed of at least one material selected from the group consisting of metal oxide materials, metals, metal nanowires, carbon-based materials, and conductive high-molecular materials.

10. The film touch sensor of claim 1, further comprising a second protective layer located on the first protective layer on which the electrode pattern layer is formed.

11. The film touch sensor of 10, wherein the second protective layer is an adhesive layer, and the first protective layer and the second protective layer have a difference in elastic modulus at 25 DEG C of 300 MPa or less.

12. The film touch sensor of claim 10, further comprising a substrate film deposited on the second protective layer.

13. The film touch sensor according to 12 above, wherein the base film is attached to the second protective layer through an adhesive layer, and the difference between the elastic modulus at 25 DEG C of the second protective layer and the adhesive layer is 300 MPa or less.

14. The film touch sensor according to 12 above, wherein the base film is a polarizing plate or a transparent film.

15. The film touch sensor of claim 1, further comprising a circuit board electrically connected to the pad electrode.

16. A touch screen panel comprising a film touch sensor according to any one of claims 1 to 15.

17. An image display device comprising the above sixteen touch screen panels.

18. A method comprising: forming a separation layer on a carrier substrate;

Forming a first passivation layer on the isolation layer;

Selectively etching only a portion of the pad region on the first passivation layer where a pad electrode is to be formed; And

Forming a sensing electrode on the sensing region on the first passivation layer and forming a pad electrode on the etched region.

19. The method of claim 18, further comprising forming a second passivation layer on the first passivation layer on which the sensing electrode and the pad electrode are formed.

20. The method of manufacturing a film touch sensor according to 19 above, wherein the second protective layer is an adhesive layer, and the first protective layer and the second protective layer have a difference in elastic modulus at 25 DEG C of 300 MPa or less.

21. The method of manufacturing a film touch sensor according to 19 above, further comprising the step of attaching a base film on the second protective layer.

22. The film touch sensor according to 21 above, wherein the base film is attached to the second protective layer through an adhesive layer, and the difference in elastic modulus at 25 캜 between the second protective layer and the adhesive layer is 300 MPa or less.

23. The method of claim 18, further comprising peeling the separation layer away from the carrier substrate.

24. The separator of claim 18, wherein the separating layer is selected from the group consisting of a polyimide-based polymer, a poly vinyl alcohol-based polymer, a polyamic acid-based polymer, a polyamide-based polymer, Based polymer, a polystyrene-based polymer, a polynorbornene-based polymer, a phenylmaleimide copolymer-based polymer, a polyazobenzene-based polymer, a polyphenylenephthalamide-based polymer, A polymer such as a polyester, a polymethyl methacrylate polymer, a polyarylate polymer, a cinnamate polymer, a coumarin polymer, a phthalimidine polymer, phthalimidine-based polymer, chalcone-based polymer, and aromatic acetylene-based polymer. Gt;

25. The method of manufacturing a film touch sensor according to 18 above, wherein the separation layer has a peeling force of not more than 1 N / 25 mm on the carrier substrate.

26. The method of manufacturing a film touch sensor according to 18 above, wherein the carrier substrate is a glass substrate.

27. The method of claim 18, wherein the first passivation layer is formed to cover at least a portion of a side surface of the isolation layer.

28. The method of claim 23, further comprising attaching a circuit board on the pad region of the separation layer after said peeling, and electrically connecting said circuit board to said pad electrode.

29. A method of manufacturing a circuit board as described in 28 above, wherein an anisotropic conductive film having a conductive ball is placed in a pad region on a separation layer, followed by heating and pressing to connect the conductive ball to the pad electrode through the separation layer, And the conductive film is connected to the conductive film.

In the present invention, a process such as formation of a pattern layer for realizing a film touch sensor is performed on a carrier substrate, and then a base film is attached, so that heat damage or the like of the base film can be prevented.

The present invention can sufficiently form a pattern layer by performing a sufficient supporting function of the carrier substrate.

The present invention can protect the electrode pattern layer by separating the separation layer from the carrier substrate at the time of peeling from the carrier substrate, and the electrical connection of the circuit board thereafter is easy.

In addition, since the region other than the pad electrode in the pad region on the first passivation layer is filled with the material of the first passivation layer, damage to the separating layer due to exposure to the etchant or the like can be prevented.

1 is a cross-sectional view of a film touch sensor according to an embodiment of the present invention.
2 is a plan view of the pad electrode (a) formed according to the present invention and the pad electrode (b) not otherwise formed.
3 is a cross-sectional view of a film touch sensor according to an embodiment of the present invention.
4 is a cross-sectional view of a film touch sensor according to an embodiment of the present invention.
5 is a cross-sectional view of a film touch sensor according to an embodiment of the present invention.
6 to 14 are schematic process drawings of a method of manufacturing a film touch sensor according to an embodiment of the present invention.

The present invention relates to a semiconductor device, A first protective layer located on the isolation layer; And a pad electrode formed on a sensing region formed on a sensing region on the first passivation layer and a pad region, wherein a region other than the pad electrode in the pad region on the first passivation layer is a first passivation layer, The present invention relates to a film touch sensor capable of preventing thermal damage or the like of a base film and facilitating formation of a pattern layer and preventing damage of the separation layer due to exposure to an etchant and the like.

A film touch sensor according to an embodiment of the present invention includes a separation layer, a first protective layer, and an electrode pattern layer.

FIGS. 1 to 5 are cross-sectional views of a film touch sensor and a pad electrode according to an embodiment of the present invention, and FIGS. 6 to 14 illustrate a film touch sensor manufacturing process. do.

The separation layer 20 is a layer formed for separation from the carrier substrate 10 and covers the electrode pattern layers 40 and 50 to protect the electrode pattern layers 40 and 50.

The separation layer 20 may be a polymer organic film, and may be a polyimide-based polymer, a poly vinyl alcohol-based polymer, a polyamic acid-based polymer, a polyamide-based polymer , A polymer based on polyethylene, a polymer based on polystyrene, a polymer based on polynorbornene, a polymer based on phenylmaleimide copolymer, a polymer based on polyazobenzene, a polymer based on polyphenylene phthalamide based polymer, a polyphenylenephthalamide-based polymer, a polyester-based polymer, a polymethyl methacrylate-based polymer, a polyarylate-based polymer, a cinnamate-based polymer, a coumarin- A phthalimidine-based polymer, a chalcone-based polymer, and an aromatic acetylene-based polymer may be used. It is not limited. These may be used alone or in combination of two or more.

The separating layer 20 is easily peeled off from the carrier substrate 10 and is peeled off from the first protective layer 30 to be described later when peeling off, / 25 mm or less, more preferably a material having a peeling force of 0.1 N / 25 mm or less with respect to the carrier substrate 10.

The carrier substrate 10 may be used without any particular limitation if it is a material that provides adequate strength to be fixed without being bent or twisted during the process, and has little influence on heat or chemical treatment. For example, glass, quartz, silicon wafer, cloth or the like can be used, and preferably, glass can be used.

The first protective layer 30 is located on the separation layer 20.

The first protective layer 30 protects the electrode pattern layers 40 and 50 by covering the electrode pattern layers 40 and 50 to be described later in the same manner as the separation layer 20, The separating layer 20 is not exposed to the etchant for forming the electrode pattern layers 40 and 50. [

As the first protective layer 30, a polymer known in the art may be used without limitation, for example, it may be made of an organic insulating film.

The first passivation layer 30 may cover at least a part of the side surface of the isolation layer 20 so that the side surface of the isolation layer 20 may be minimized from being exposed to the etchant during the patterning process of patterns to be described later. The first protective layer 30 preferably covers all the side surfaces of the separation layer 20 in terms of completely blocking the exposure of the side surface of the separation layer 20. [

The electrode pattern layers (40, 50) are located on the first protective layer (30).

The electrode pattern layers 40 and 50 include a sensing electrode 50 and a pad electrode 40.

The sensing electrode 50 may be located in a sensing region on the first passivation layer and the pad electrode 40 may be located in a pad region on the first passivation layer. At least a part of the sensing electrode 50 may be located in the pad region and at least a portion of the sensing electrode 50 may be located in the sensing region. You may.

The sensing region means an area corresponding to a display portion to be touched by the film touch sensor, and the pad region means an area corresponding to the pad portion. That is, the sensing region on the first protection layer means a region corresponding to the display portion on the first protection layer, and the pad region means the region corresponding to the pad portion on the first protection layer.

As the electrode pattern layers 40 and 50, any conductive material may be used without limitation, for example, indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), aluminum zinc oxide (ITO-Ag-ITO), indium zinc oxide-silver-indium zinc oxide (IZO-Ag-IZO), indium tin oxide Metal oxide oxides selected from the group consisting of indium zinc tin oxide-silver-indium zinc tin oxide (IZTO-Ag-IZTO) and aluminum zinc oxide-silver-aluminum zinc oxide (AZO-Ag-AZO); Metals selected from the group consisting of gold (Au), silver (Ag), copper (Cu), molybdenum (Mo) and APC; Nanowires of metals selected from the group consisting of gold, silver, copper and lead; Carbon-based materials selected from the group consisting of carbon nanotubes (CNT) and graphene; And a conductive polymer material selected from the group consisting of poly (3,4-ethylenedioxythiophene) (PEDOT) and polyaniline (PANI). These may be used alone or in combination of two or more.

The unit patterns of the electrode pattern layers 40 and 50 may be polygonal patterns independent of each other, for example, triangular, tetragonal, pentagonal, hexagonal, or hexagonal.

In addition, the electrode pattern layers 40 and 50 may include a regular pattern. A rule pattern means that the pattern form has regularity. For example, the unit patterns may include, independently of each other, a mesh shape such as a rectangle or a square, or a pattern such as a hexagon.

In addition, the electrode pattern layers 40 and 50 may include an irregular pattern. The irregular pattern means that the shape of the pattern does not have regularity.

When the electrode pattern layers 40 and 50 are formed of a material such as a metal nanowire, a carbon-based material, or a polymer material, the electrode pattern layers 40 and 50 may have a network structure.

In the case of having a network structure, since signals are sequentially transmitted to adjacent patterns in contact with each other, a pattern having high sensitivity can be realized.

The pad electrode 40 may be electrically connected to the circuit board 80 to be described later.

2 (a), in the pad region on the first passivation layer 30, the pad electrode 40 is formed in a plan view immediately after the pad electrode 40 is formed (the red rectangle means the pad region) (40) is filled with the material of the first protective layer (30).

The pad electrode 40 may be formed by selectively patterning only a portion where the pad electrode 40 is to be formed in the pad region on the first passivation layer 30, but the present invention is not limited thereto.

2 (a), when the pad region on the first passivation layer 30 is filled with the material of the first passivation layer 30, the pad region of the separation layer 20 is not exposed The pad region of the separation layer 20 is not exposed to the etchant or the like when the electrode pattern layers 40 and 50 are formed. As a result, it is possible to obtain an excellent separation layer 20 free from problems such as cracking, peeling and deterioration due to a chemical impact caused by an etchant or the like.

However, when the pad electrode 40 is formed by etching the entire pad region as shown in FIG. 2B, the pad region of the separation layer 20 is exposed to the etchant when the electrode pattern layers 40 and 50 are formed. do.

The pad electrode 40 preferably has a surface energy difference between the isolation layer 20 and the first passivation layer 30 of 20 mN / m or less.

The pad electrode 40 is adjacent to the isolation layer 20 and the first passivation layer 30 as illustrated in Figures 2A and 10 except that the isolation layer 20 of the pad electrode 40, The adhesion of the pad electrode 40 to the separation layer 20 and the first passivation layer 30 is less than 20 mN / m (measured according to ASTM D7490) when the difference in surface energy with the first passivation layer 30 is less than 20 mN / So that it is possible to suppress the flow of the etchant into the gap.

As illustrated in FIG. 3, the film touch sensor of the present invention may further include a second passivation layer 60 disposed on the first passivation layer on which the electrode pattern layers 40 and 50 are formed.

The second passivation layer 60 itself can serve as a substrate and serve as a passivation layer. In addition, corrosion of the electrode pattern layers 40 and 50 is prevented, and the surface is planarized, whereby generation of minute bubbles can be suppressed when the electrode pattern layers 40 and 50 are bonded to the base film 70. It can also serve as an adhesive layer.

When the second protective layer 60 serves as a substrate or a passivation layer, a silicone-based polymer such as polydimethylsiloxane (PDMS) or polyorganosiloxane (POS); Polyimide-based polymers; Polyurethane-based polymers, and the like, but the present invention is not limited thereto. These may be used alone or in combination of two or more.

When the second protective layer 60 serves as an adhesive layer, a thermosetting or photo-curable pressure-sensitive adhesive or adhesive known in the art can be used without limitation. For example, thermosetting or photo-curable pressure-sensitive adhesives or adhesives such as polyester-based, polyether-based, urethane-based, epoxy-based, silicone-based or acrylic-

When the second protective layer 60 serves as an adhesive layer, the first protective layer 30 and the second protective layer 60 of the film touch sensor of the present invention have a difference in elastic modulus at 25 ° C of 300 MPa or less This is preferable in terms of suppressing the occurrence of cracks due to the difference in elastic modulus. The modulus of elasticity can be measured with a rheometer or UTM equipment.

As illustrated in FIG. 4, the film touch sensor of the present invention may further include a base film 70 adhered on the second protective layer 60.

When the second protective layer 60 is an adhesive layer, the base film 70 is adhered on the second protective layer 60, otherwise, as shown in Fig. 5, through the adhesive layer on the second protective layer 60 .

In such a case, it is preferable that the difference in elastic modulus at 25 캜 between the second protective layer 60 and the adhesive layer is 300 MPa or less in terms of suppressing the generation of cracks due to the difference in modulus of elasticity

As the base film 70, a transparent film made of a material widely used in the art can be used without limitation, and examples thereof include cellulose esters (e.g., cellulose triacetate, cellulose propionate, cellulose butyrate, cellulose acetate Propionate, and nitrocellulose), polyimides, polycarbonates, polyesters such as polyethylene terephthalate, polyethylene naphthalate, poly-1,4-cyclohexanedimethylene terephthalate, polyethylene 1,2-diphenoxyethane 4,4'-dicarboxylate and polybutylene terephthalate, polystyrenes such as syndiotactic polystyrenes, polyolefins such as polypropylene, polyethylene and polymethylpentene, polysulfone, polyethersulfone , Polyarylate, polyether-imide, polymethylmethacrylate, polyetherketone, Polyvinyl alcohol and polyvinyl chloride, or a film made of a mixture thereof.

Further, the transparent film may be an isotropic film or a retardation film.

Nx and ny are the main indices of refraction in the film plane, nz is the refractive index in the film thickness direction, d is the film thickness) is 40 nm or less, and 15 nm And the retardation in the thickness direction (Rth, Rth = [(nx + ny) / 2-nz] xd) is from -90 nm to +75 nm, preferably -80 nm to +60 nm, desirable.

The retardation film is a film produced by the uniaxial stretching, biaxial stretching, polymer coating and liquid crystal coating method of a polymer film, and is generally used for improving the viewing angle of the display, improving the color feeling, improving the light leakage, do.

A polarizing plate may also be used as the base film 70.

The polarizing plate may be one having a polarizer protective film attached on one side or both sides of a polyvinyl alcohol polarizer.

Further, a protective film may be used as the base film 70.

The protective film may be a film including an adhesive layer on at least one side of a film made of a polymer resin, or a self-adhesive film such as polypropylene, and may be used for protecting the surface of the touch sensor and improving the process precision.

The light transmittance of the base film 70 is preferably 85% or more, and more preferably 90% or more. The haze value of the base film 70 measured according to JIS K7136 is preferably 10% or less, and more preferably 7% or less.

The thickness of the base film 70 is not limited, but is preferably 30 to 150 占 퐉, and more preferably 70 to 120 占 퐉.

In addition, the film touch sensor of the present invention may further include a circuit board (80).

The circuit board 80 may be a flexible printed circuit board (FPCB).

The circuit board 80 may be electrically connected to the pad electrode.

The circuit board 80 may be connected to the pad electrode 40 through an anisotropic conductive film (ACF).

The anisotropic conductive film may have a form in which conductive balls, which are conductive particles, are dispersed in a curable resin.

The conductive ball may be nickel, nickel, or a gold alloy, and the curable resin may be an acrylic or epoxy resin, but is not limited thereto.

Examples of commercially available conductive balls include the TGP series manufactured by H & C High Tech.

The film touch sensor of the present invention as described above can be used as a film touch sensor after being peeled off from the carrier substrate 10.

The present invention also provides a touch screen panel including the film touch sensor, and an image display device including the touch screen panel.

The touch screen panel of the present invention is applicable not only to a conventional liquid crystal display but also to various image display devices such as an electroluminescence display device, a plasma display device, and a field emission display device. It can be particularly usefully applied to an image display device having a flexible characteristic.

The present invention also provides a method of manufacturing the film touch sensor.

Hereinafter, a method of manufacturing a film touch sensor according to an embodiment of the present invention will be described in detail.

According to an embodiment of the method of manufacturing a film touch sensor of the present invention, a separation layer 20 is first formed on a carrier substrate 10 as shown in FIG.

The carrier substrate 10 may be used without any particular limitation if it is a material that provides adequate strength to be fixed without being bent or twisted during the process, and has little influence on heat or chemical treatment. For example, glass, quartz, silicon wafer, cloth or the like can be used, and preferably, glass can be used.

The separation layer 20 can be formed of the above-described polymer material.

It is difficult to separate the pad electrode 40 formed from the carrier substrate 10 from the carrier substrate 10 in the case of the separation layer 20 and therefore the separation layer 20 can be easily separated from the carrier substrate 10, It is possible to reduce problems such as damage to the electrode pattern layers 40 and 50 due to less impact applied to the film touch sensor at the time of peeling from the carrier substrate 10. [

Preferably, the separating layer 20 may have a peeling force of 1 N / 25 mm or less, preferably 0.1 N / 25 mm or less, from the viewpoint of minimizing physical damage to the carrier substrate 10.

The method of forming the separation layer 20 is not particularly limited and may be a slit coating method, a knife coating method, a spin coating method, a casting method, a micro gravure coating method, a gravure coating method, a bar coating method, A dip coating method, a spray coating method, a screen printing method, a gravure printing method, a flexo printing method, an offset printing method, an ink jet coating method, a dispenser printing method, a nozzle coating method, Can be done.

After the separation layer 20 is formed by the above-described method, an additional curing process may be further carried out.

The curing method of the separating layer 20 is not particularly limited, and it is possible to use both of the above methods by photocuring or thermosetting. The order of the photo-curing and the thermal curing is not particularly limited.

As the curing condition, for example, in the case of thermosetting, it can be carried out at 50 to 300 ° C for 1 minute to 60 minutes, preferably 100 to 200 ° C for 5 to 30 minutes. In the case of photo-curing, UV irradiation at 0.01 to 10 J / cm ² can be performed for 1 second to 500 seconds, preferably UV irradiation at 0.05 to 1 J / cm ² for 1 second to 120 seconds, but the present invention is not limited thereto .

Thereafter, as shown in FIG. 7, a first passivation layer 30 is formed on the isolation layer 20.

The first protective layer 30 may be formed of the above-described material, and the method of forming the first protective layer 30 is not particularly limited, and the same method as the method of forming the separation layer 20 may be used.

The first protective layer 30 may be formed to cover at least a part of the side surface of the isolation layer 20 so as to minimize the exposure of the side surface of the isolation layer 20 to the etchant during the patterning process, have. The first protective layer 30 may be formed so as to cover all the side surfaces of the isolation layer 20 in terms of completely blocking the exposure of the side surface of the isolation layer 20. [

Next, as shown in FIG. 8 and FIG. 2 (a), only the portion of the pad region on the first passivation layer 30 where the pad electrode 40 is to be formed is selectively etched.

As shown in FIG. 2 (b), when the entire pad region on the first passivation layer 30 is etched, a part of the pad region of the isolation layer 20 is exposed during or after the pad electrode 40 is formed. The exposed portion of the separation layer 20 is exposed to chemical agents such as a cantilever or a stripper at the time of forming the pad electrode 40 or at the time of forming the sensing electrode 50 to be described later to crack, May occur.

However, since the pad electrode 40 is selectively etched in the pad region on the first passivation layer 30, the first passivation layer 30 is formed after the pad electrode 40 is formed at the etched portion. The lower isolation layer 20 is not exposed at all. Thus, the problem of exposure to the etchant can be solved.

Thereafter, as shown in Figs. 9 and 10, a pad electrode 40 is formed on the etched portion.

The pad electrode 40 may be formed of the above-described metal or metal oxide.

The method of forming the pad electrode 40 is not particularly limited and may be selected from a physical vapor deposition method, a chemical vapor deposition method, a plasma deposition method, a plasma polymerization method, a thermal polymerization method, a thermal deposition method, a thermal oxidation method, an anodic oxidation method, a cluster ion beam deposition method, A printing method, an offset printing method, an ink jet coating method, a dispenser printing method, and the like.

The pad electrode 40 is preferably formed so as to have a width larger than that of the etched portion and to have a larger width than the etched portion of the first passivation layer 30 in view of more reliably preventing the separation layer 20 from being exposed to the etchant, May further be formed to cover a part of the pad regions on the pad.

FIG. 11 is a view showing the film touch sensor viewed from the pad region side after forming the pad electrode 40. When the width of the pad electrode 40 is formed to have a width wider than the etching region, It is possible to more reliably block the flow of the air into the gap.

As shown in FIGS. 12 and 13, a sensing electrode 50 is formed in a sensing region on the first passivation layer 30.

The sensing electrode 50 may be formed of the above-described metal oxide materials, metals, nanowires, carbon-based materials, high-molecular materials, and the like.

The method of forming the sensing electrode 50 is not particularly limited, and the same method as the method of forming the pad electrode 40 can be used.

In the case of forming a unit pattern of the sensing electrode 50 and the pad electrode 40, a photoetching method can be used.

In the photoetching method, a photoresist is coated on a layer to be patterned, the applied photoresist is selectively cured using a mask, the uncured photoresist is developed and removed, and then etched to form a pattern, And a pattern is formed through a series of processes known in the art for removing the cured photoresist.

In the case of a photoresist, it can be classified into a positive type photoresist and a negative type photoresist. In the case of a positive type, it is a photoresist which becomes soluble in a developing solution upon UV exposure. In the case of a negative type, it is insoluble Lt; / RTI >

Therefore, when a positive type is used, a portion exposed to UV can be developed, and a pattern can be formed through a subsequent process. In the case of a negative type, a portion not exposed to UV is developed, .

The conditions for curing the photoresist are not particularly limited. For example, UV of 0.01 to 10 J / cm ² can be irradiated for 1 second to 500 seconds, preferably UV of 0.05 to 1 J / cm ² for 1 second to It can be irradiated for 120 seconds.

The method may further include forming a second passivation layer 60 on the first passivation layer 30 having the sensing electrode 50 and the pad electrode 40 formed thereon.

The second passivation layer 60 itself can serve as a substrate and serve as a passivation layer. In addition, corrosion of the electrode pattern layers 40 and 50 is prevented, and the surface is planarized, whereby generation of minute bubbles can be suppressed when the electrode pattern layers 40 and 50 are bonded to the base film 70. It can also serve as an adhesive layer.

The second protective layer 60 may be formed of the above-described polymer or the above-mentioned pressure-sensitive adhesive or adhesive.

When the second protective layer 60 serves as an adhesive layer, the first protective layer 30 and the second protective layer 60 may have the above-described elastic modulus difference.

The present invention may further include a step of attaching the base film 70 on the second protective layer 60 as shown in FIG.

The base film 70 may be a film made of the above-mentioned material, or a polarizing plate, a retardation film, or a protective film.

The polarizing plate may be one having a polarizer protective film attached on one side or both sides of a polyvinyl alcohol polarizer.

When the second protective layer 60 serves as a substrate, the base film 70 may be adhered onto the second protective layer 60 through the above-described thermosetting or photo-curable adhesive. In such a case, the second protective layer 60 and the adhesive layer may have the above-described elastic modulus difference.

The base film 70 can be adhered under pressure, and the pressure range to be applied is not particularly limited, and may be, for example, 1 to ²⁰⁰ kg / cm ² , and preferably 10 to 100 kg / cm ² .

The surface to which the base film 70 is adhered is subjected to corona treatment, a flame treatment, a plasma treatment, an ultraviolet ray (ultraviolet ray) treatment, or the like to improve adhesion between the base film 70 and the second protective layer 60, Surface treatment such as irradiation, primer coating treatment and saponification treatment can be carried out.

Thereafter, the separation layer 20 is separated from the carrier substrate 10.

The separating layer 20 remains on the film touch sensor side without being removed even after the peeling, so that it can serve as a covering for protecting the electrode pattern layers 40 and 50.

After the separation layer 20 is peeled from the carrier substrate 10, the circuit board 80 may be mounted on the pad region of the separation layer 20 as shown in FIG.

The circuit board 80 is electrically connected to the pad electrode 40.

Electrical connection between the circuit board 80 and the pad electrode 40 can be performed through the anisotropic conductive film.

The anisotropic conductive film may have a form in which conductive balls, which are conductive particles, are dispersed in a curable resin.

The conductive ball may be nickel, nickel, or a gold alloy, and the curable resin may be an acrylic or epoxy resin, but is not limited thereto.

Specifically, first, an anisotropic conductive film having a conductive ball is placed in a pad region on the separation layer 20, followed by heating and pressing. The conductive ball penetrates the separation layer 20 and is connected to the pad electrode 40. Then, by connecting the circuit board 80 to the anisotropic conductive film, the circuit board 80 can be electrically connected to the pad electrode 40.

According to another embodiment of the present invention, after the separation layer 20 is separated from the carrier substrate 10, the separation layer 20 of the pad region may be chemically removed.

As the chemical solution used for removing the separation layer 20, a chemical solution used for removing the polymer in the art can be used without limitation, for example, a basic chemical solution such as KOH, TMAH, and amines; Acidic chemicals such as phosphoric acid, acetic acid, and nitric acid may be used. These may be used alone or in combination of two or more.

After the separation layer 20 is removed, the circuit board 80 may be attached to the first protective layer side and electrically connected to the pad electrode 40.

In the method of manufacturing a film touch sensor of the present invention including the above steps, a process such as forming a pattern layer for implementing a film touch sensor is performed on the carrier substrate 10, and then the base film 70 is attached, Heat damage or the like of the base film 70 can be prevented.

If the patterned layer is formed on the base film 70 in accordance with a conventional method, the base film 70 may not sufficiently serve as a support when the thin base film 70 is used. However, The pattern layer is formed on the substrate 10, so that the pattern layer can be easily formed without causing such a problem.

The separation layer 20 is also peeled from the carrier substrate 10 at the time of peeling from the carrier substrate 10 so that the electrode pattern layers 40 and 50 can be protected. Connection is easy.

In addition, since the pad electrode 40 is formed by selectively etching the pad region on the first passivation layer 30, the damage of the isolation layer 20 due to exposure to the etchant or the like can be prevented.

While the present invention has been particularly shown and described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. It will be apparent to those skilled in the art that various changes and modifications can be made in the examples, and it is obvious that such variations and modifications fall within the scope of the appended claims.

10: carrier substrate 20: separation layer
30: first protection layer 40: pad electrode
50: sensing electrode 60: second protection layer
70: base film 80: circuit board
90: Adhesive layer

Claims (29)

A separation layer;
A first protective layer located on the isolation layer; And
And an electrode pattern layer including a sensing electrode formed on a sensing region on the first passivation layer and a pad electrode formed on the pad region,
Wherein a region other than the pad electrode in the pad region on the first passivation layer is filled with the first passivation layer material.
[5] The method of claim 1, wherein the separation layer is formed of a material selected from the group consisting of a polyimide-based polymer, a polyvinyl alcohol-based polymer, a polyamic acid-based polymer, a polyamide-based polymer, A polymer such as a polystyrene type polymer, a polynorbornene type polymer, a phenylmaleimide copolymer type polymer, a polyazobenzene type polymer, a polyphenylenephthalamide type polymer, A polymer such as a polyester type polymer, a polymethyl methacrylate type polymer, a polyarylate type polymer, a cinnamate type polymer, a coumarin type polymer, a phthalimidine type polymer, Based polymer, a chalcone-based polymer, and an aromatic acetylene-based polymer, .
The film touch sensor of claim 1, wherein the separation layer is first formed on and separated from the carrier substrate.
4. The film touch sensor according to claim 3, wherein the separating layer has a peeling force of not more than 1 N / 25 mm on the carrier substrate.
4. The film touch sensor of claim 3, wherein the separating layer has a peel force of 0.1 N / 25 mm or less on the carrier substrate.
The film touch sensor according to claim 3, wherein the carrier substrate is a glass substrate.
The film touch sensor of claim 1, wherein the first passivation layer covers at least a portion of a side of the isolation layer.
The film touch sensor of claim 1, wherein the pad electrode has a surface energy difference between the isolation layer and the first passivation layer of 20 mN / m or less.
The film touch sensor of claim 1, wherein the electrode pattern layer is formed of at least one material selected from the group consisting of metal oxide materials, metals, metal nanowires, carbon-based materials, and conductive high-molecular materials.
The film touch sensor of claim 1, further comprising a second protective layer located on a first protective layer on which the electrode pattern layer is formed.
The film touch sensor of claim 10, wherein the second protective layer is an adhesive layer, and the first protective layer and the second protective layer have a difference in elastic modulus at 25 캜 of 300 MPa or less.
11. The film touch sensor of claim 10, further comprising a substrate film deposited on the second protective layer.
The film touch sensor according to claim 12, wherein the base film is attached to the second protective layer through an adhesive layer, and the difference in elastic modulus at 25 캜 is not more than 300 MPa.
The film touch sensor according to claim 12, wherein the base film is a polarizing plate or a transparent film.
The film touch sensor of claim 1, further comprising a circuit board electrically connected to the pad electrode.
A touch screen panel comprising the film touch sensor of any one of claims 1 to 15.
The image display apparatus according to claim 16, comprising the touch screen panel.
Forming a separation layer on the carrier substrate;
Forming a first passivation layer on the isolation layer;
Selectively etching only a portion of the pad region on the first passivation layer where a pad electrode is to be formed; And
Forming a sensing electrode on the sensing region on the first passivation layer and forming a pad electrode on the etched region.
[Claim 19] The method of claim 18, further comprising forming a second passivation layer on the first passivation layer having the sensing electrode and the pad electrode.
The method of manufacturing a film touch sensor according to claim 19, wherein the second protective layer is an adhesive layer, and the first protective layer and the second protective layer have a difference in elastic modulus at 25 ° C of 300 MPa or less.
21. The method of claim 19, further comprising attaching a substrate film on the second passivation layer.
The film touch sensor according to claim 21, wherein the base film is attached to the second protective layer through an adhesive layer, and the difference in elastic modulus at 25 ° C between the second protective layer and the adhesive layer is 300 MPa or less.
19. The method of claim 18, further comprising peeling the separation layer away from the carrier substrate.
[Claim 18] The method of claim 18, wherein the separation layer comprises at least one of polyimide polymer, poly vinyl alcohol polymer, polyamic acid polymer, polyamide polymer, A polymer such as a polystyrene type polymer, a polynorbornene type polymer, a phenylmaleimide copolymer type polymer, a polyazobenzene type polymer, a polyphenylenephthalamide type polymer, A polymer such as a polyester type polymer, a polymethyl methacrylate type polymer, a polyarylate type polymer, a cinnamate type polymer, a coumarin type polymer, a phthalimidine type polymer, Based polymer, a chalcone-based polymer, and an aromatic acetylene-based polymer. Method.
19. The method of manufacturing a film touch sensor according to claim 18, wherein the separating layer has a peeling force of not more than 1 N / 25 mm on the carrier substrate.
The method of manufacturing a film touch sensor according to claim 18, wherein the carrier substrate is a glass substrate.
19. The method of claim 18, wherein the first passivation layer is formed to cover at least a portion of a side surface of the isolation layer.
24. The method of claim 23, further comprising attaching a circuit board on the pad area of the separation layer after the peeling and electrically connecting the circuit board to the pad electrode.
The method of manufacturing a circuit board according to claim 28, wherein an anisotropic conductive film having a conductive ball is placed in a pad region on the separation layer, and then heated and pressed to connect the conductive ball to the pad electrode through the separation layer, Of the film touch sensor.

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