TW201539279A - Laminate, method for producing laminate, capacitive touch panel and image display device - Google Patents

Abstract

A laminate wherein a defect does not occur in a decorative print layer that is formed using a black ink in the peripheral portion of the back surface of a transparent panel substrate when a transparent electrode layer or a wiring layer of a touch panel is patterned by laser processing; a method for producing a laminate; a capacitive touch panel; and an image display device. A top plate (11) is provided with: a transparent panel substrate (1); a decorative print layer (3) which is formed in the peripheral portion of the back surface of the transparent panel substrate (1); a planarization resin layer (4) having infrared absorbing function, which is formed on a surface of the transparent panel substrate (1), on said surface the decorative print layer (3) being formed, so as to cover a region ranging from the decorative print layer (3) to the transparent panel substrate (1); and a transparent electrode layer (6) which is formed on the back surface of the planarization resin layer and has a wiring layer (6A). The wiring layer (6A) and the transparent electrode layer (6) of the top plate (11) are patterned by laser processing, which uses an infrared laser, from the back surface side of the decorative print layer (3).

Description

Laminated body, manufacturing method of laminated body, static capacitance type touch panel and image display device

The present invention relates to a laminated body, a method of manufacturing a laminated body, a capacitive touch panel, and an image display device, and more particularly to a laminated body or a laminated body having a decorative printed layer formed on an outer edge portion of a back surface of a transparent panel substrate. Manufacturing method, static capacitance type touch panel and image display device. The present application claims priority on the basis of Japanese Patent Application No. 2014-060099, filed on March 24, 2014, the entire disclosure of which is hereby incorporated by reference.

Smart phones and tablet computers that can be easily operated by the use of touch panels have become widespread, and thinner, lighter, and lower-cost touch panels have become an urgent issue.

There are various methods for detecting the touch panel, for example, a resistive film method in which two resistive films are stacked to specify a predetermined position, or a surface acoustic wave method in which an ultrasonic wave or a surface acoustic wave is generated on the surface of the panel to perform position detection. The touch panel used in the above-mentioned smart phone or tablet computer must be touched, dragged, or pinched out on the screen in order to enlarge the image, so that the pinch out is made on the screen. The two fingers are compact and have a degree of freedom in operations such as pinch in operations. Therefore, in the current situation, a transparent electrode is used to form an xy matrix, and a capacitive touch panel capable of simultaneously detecting a plurality of indicated positions has become mainstream.

In the past, in the process of a capacitive touch panel, the detection shape of the contact is detected. In the step of applying the transparent conductive film to the substrate, only the portion necessary for the detection is left by etching, and the excess portion is removed.

Moreover, the lead wiring for connecting the detecting portion and the external circuit is made of silver paste It is formed on the outer peripheral portion of the touch panel by screen printing. However, as the number of detecting portions on the touch panel increases, the wiring width becomes finer, so the limit is produced by the printing method, and the transparent conductive film is currently used. The same is formed by etching.

The etching method is largely divided into dry etching through the liquid and dry etching through the laser. engraved. The wet etching has many manufacturing steps because it is repeatedly washed, and the dry etching has the advantage that the manufacturing steps can be simplified and the cost can be reduced.

Moreover, in order to cover the above-mentioned lead-out wiring, the touch panel is applied to the outer peripheral portion. It is mainly called decorative printing, which is mainly printing using black ink.

That is, an image display panel of a conventional electronic device or the like is provided on the surface thereof. The static capacitance type touch panel adds various designs to the peripheral area of the image display area as a decoration area, thereby increasing the value of the product. However, in the peripheral region, since the wiring pattern electrically connected to the transparent electrode is formed, irregularities corresponding to the shape of the wiring pattern may be generated on the surface of the touch panel when the laminated body is formed. In this case, it becomes impossible to maintain the desired flatness of the touch panel, and there is a problem that the value of the product is impaired.

Moreover, the panel substrate is decorated with an optical double-sided tape attached thereto. In this case, since a bubble or an air layer is generated inside the step caused by the decoration, the ultraviolet curable resin is filled to fill the step difference caused by the decorative printed layer on the back surface of the panel substrate, and the panel substrate is formed by The back surface is made smooth to form the panel substrate in a smooth shape without distortion.

[Advanced technical literature]

[Patent Document 1]: JP-A-2014-000725

[Patent Document 2]: JP-A-2013-246885

[Patent Document 3]: Japanese Laid-Open Patent Publication No. 2001-202826

However, in the wet etching process by the chemical liquid, since there are steps such as water rinsing or etching, it is necessary to select a resin or a substrate having solvent resistance or alkali resistance. In the case where sufficient resistance is not obtained, the film adhesion or the electrical conductivity of the sheet resistance value may be deteriorated. And the number of steps of wet etching is also a cause of a decrease in yield.

On the other hand, laser processing has a degree of freedom compared to the selection of a resin or a substrate in a wet process due to a dry process, and the number of processing steps is small. Compared to the current wet process, there must be 8 steps, and the laser can be patterned in one step.

However, in the conventional capacitive touch panel, when the transparent electrode layer or the wiring layer of the touch panel is patterned by laser processing, it is generated by black ink in the outer edge portion of the back surface of the transparent panel substrate. The formed decorative printed layer is damaged to impair the defects such as appearance.

Therefore, in view of the above-mentioned conventional problems, it is an object of the present invention to provide a transparent electrode layer or a wiring layer of a touch panel by laser processing without being outside the outer edge of the back surface of the transparent panel substrate. A laminated body in which a decorative printed layer formed of black ink is used to produce defects, a method of manufacturing a laminated body, a capacitive touch panel, and an image display device.

Other objects and advantages of the present invention will become more apparent from the embodiments described herein.

According to the present invention, the amount of infrared rays reaching the decorative printed layer is reduced by covering the decorative printed layer with a flattening resin layer having an infrared reflecting function, thereby reducing damage of the decorative printed layer.

That is, the present invention is a laminated body comprising: a transparent panel substrate; a decorative printed layer formed on an outer edge portion of the back surface of the transparent panel substrate; and a flattening resin layer having an infrared absorbing function on the transparent panel substrate The surface on which the decorative printed layer is formed is formed to cover a region extending over the decorative printed layer and the transparent panel substrate, and the transparent electrode layer is formed on the back surface of the planarizing resin layer to have a wiring layer.

The laminated body of the present invention may be configured such that the decorative printed layer is formed directly on the outer edge portion of the back surface of the transparent panel substrate, for example.

Moreover, the laminated body of the present invention may be configured such that the decorative printed layer is formed on the outer edge of the back surface of the transparent panel substrate, for example, via an anchor layer covering the back surface of the transparent panel substrate.

Further, the laminated body of the present invention may have a configuration in which the flattening resin layer has an infrared ray absorption amount of, for example, 4% to 30% at a wavelength of 1060 nm.

Further, the laminate of the present invention may have a configuration in which the transparent conductive layer is made of, for example, a material containing a silver nanowire or a Cu nanowire.

The present invention provides a method for manufacturing a laminated body by forming a decorative printed layer on the outer edge portion of the back surface of the transparent panel substrate, and covering the surface of the transparent printed circuit board on the decorative printed layer to cover the decorative material. a flattening resin layer having an infrared absorbing function is formed on the printed layer and the transparent panel substrate, and a transparent electrode layer having a wiring layer is formed on the back surface of the planarizing resin layer to form a laminated body; Laser The laser processing of the light source is performed by patterning the wiring layer and the transparent electrode layer on the back surface of the decorative printed layer of the laminate.

The invention is a static capacitance type touch panel, which comprises: a transparent panel substrate; a decorative printed layer formed on an outer edge portion of the back surface of the transparent panel substrate; and a flattening resin layer having an infrared absorbing function formed on the surface of the transparent panel substrate on which the decorative printed layer is formed a region where the printed layer and the transparent panel substrate are decorated; and a transparent electrode layer formed on the back surface of the flattening resin layer and having a wiring layer; and the wiring layer and the transparent electrode layer on the back surface of the decorative printed layer Patterned by laser processing using infrared lasers.

Moreover, the electrostatic capacitance type touch panel of the present invention can also be configured as follows: The printed layer is laminated, for example, directly on the back surface of the transparent panel substrate.

Moreover, the electrostatic capacitance type touch panel of the present invention can also be configured as follows: The printed layer is interposed, for example, by an anchor layer covering the back surface of the transparent panel substrate.

Moreover, the capacitive touch panel of the present invention can also be configured as follows: The resin layer, for example, has an infrared absorption amount of 4% to 30% at a wavelength of 1060 nm.

Furthermore, the capacitive touch panel of the present invention can also be configured, for example, as follows: The transparent conductive layer is made of, for example, a material containing a silver nanowire or a Cu nanowire.

The invention is an image display device, which has static electricity in the display screen The capacitive touch panel includes: a transparent panel substrate; a decorative printed layer formed on an outer edge of the back surface of the transparent panel substrate; and a planarized resin layer having an infrared absorbing function And forming a surface of the transparent panel substrate on which the decorative printed layer is formed to cover an area extending over the decorative printed layer and the transparent panel substrate; The bright electrode layer is formed on the back surface of the flattening resin layer and has a wiring layer.

Moreover, the image display device of the present invention can also be configured as follows: the above-described decorative printing The layer is formed, for example, directly on the outer edge portion of the back surface of the transparent panel substrate.

The image display device of the present invention can also be configured as follows: The outer edge portion of the back surface of the transparent panel substrate is formed by an anchor layer covering the back surface of the transparent panel substrate.

Moreover, the image display device of the present invention can also be configured as follows: the flattening tree The lipid layer, for example, has an infrared absorption of 4% to 30% at a wavelength of 1060 nm.

Furthermore, the image display device of the present invention can also be configured as follows: the transparent guide The electrical layer is composed, for example, of a material comprising a silver nanowire or a Cu nanowire.

The present invention can provide a laminated body, a method of manufacturing a laminated body, a capacitive touch panel, and an image display device, which are provided by covering a decorative printed layer with a flattening resin layer having an infrared reflecting function to reduce the arrival of the decorative printed layer The amount of infrared rays is used to reduce the damage of the decorative printed layer, and when the transparent electrode layer or the wiring layer of the touch panel is patterned by laser processing, it is not used in the outer edge portion of the back surface of the transparent panel substrate. The decorative printed layer formed by the black ink produces defects.

1, 7‧‧‧ transparent panel substrate

2‧‧‧ anchor layer

3‧‧‧Plus printing layer

4‧‧‧Flating resin layer

5‧‧‧Protective layer

6, 8‧‧‧ transparent electrode layer

6A, 8A‧‧‧ wiring layer

11‧‧‧ top board

12‧‧‧floor

100‧‧‧Static Capacitive Touch Panel

1A and 1B are views showing a structure of a capacitive touch panel according to an embodiment of the present invention, and Fig. 1A is a plan view of a capacitive touch panel, and Fig. 1B is a cross-sectional view taken along line AA' of Fig. 1A.

2 is a process diagram showing an example of a manufacturing procedure of the above-described capacitive touch panel.

3A, 3B, 3C, 3D, and 3E are schematic cross-sectional views showing a process of forming a top plate in the first step to the fourth step of the manufacturing step, and Fig. 3A shows the first step, Fig. 3B. After the first step, FIG. 3C shows the second step, FIG. 3D shows the third step, and FIG. 3E shows the fourth step.

4A, 4B, and 4C are cross-sectional views schematically showing the formation process of the top plate in the fifth step to the eighth step of the manufacturing step, wherein FIG. 4A shows the fifth step, and FIG. 4B shows the seventh step. 4C indicates the eighth step.

5A, 5B, and 5C are cross-sectional views schematically showing a process of forming a top plate in the ninth step of the manufacturing step, wherein FIG. 5A shows a state before the fifth step, and FIG. 5B shows a state in which a transparent electrode layer is formed. Fig. 5C shows a state in which the transparent electrode layer is patterned.

Figure 6 is a diagram showing the identification evaluation of the decorative printed layer of the top plate.

7A and 7B are cross-sectional views schematically showing the bonding process of the top plate and the bottom plate in the tenth step of the above manufacturing step, and Fig. 7A shows the bonding before, and Fig. 7B shows the bonding.

8 is a view showing an image display device with a touch panel including a capacitive touch panel.

Hereinafter, the form for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the embodiments described below, and various modifications may be made without departing from the spirit and scope of the invention. Further, the dimensions of the respective portions in the drawing are schematic, and in particular, the cross-sectional views are dimensions which are emphasized in the thickness direction in order to clearly show the structure.

The present invention is applicable to, for example, the capacitive touch panel 100 of the configuration shown in FIGS. 1A and 1B.

1A and 1B show a capacitive contact type constructed by the structure of the present invention. FIG. 1A is a front view of the capacitive touch panel 100, and FIG. 1B is a cross-sectional view taken along line AA' of FIG. 1A.

The capacitive touch panel 100 is composed of a laminate of a top plate 11 and a bottom plate 12 to make.

In the static capacitance type touch panel 100, the top plate 11 is made of a transparent panel substrate 1. The decorative printed layer 3 formed on the outer edge portion of the back surface of the transparent panel substrate 1 via an anchor layer 2 covering the back surface of the transparent panel substrate 1 is formed to cover the back side of the transparent panel substrate 1 and The flattening resin layer 4 having an infrared absorbing function on the back side of the decorative printed layer 3 and the transparent electrode layer 6 having the wiring layer 6A formed on the back surface of the flattening resin layer 4 via the protective layer 5 are formed.

In addition, the top plate 11 may also be on the outer edge of the back surface of the transparent panel substrate 1 The decorative printed layer 3 may be formed directly, or the anchor layer 2 may be omitted.

Moreover, the bottom plate 12 is formed of a transparent panel substrate 7 and formed on the transparent panel substrate 7 The entire transparent electrode layer 8 having the wiring layer 8A is formed.

a transparent electrode layer 6 having a wiring layer 6A formed on the top plate 11 and a shape The transparent electrode layer 8 having the wiring layer 8A formed on the bottom plate 12 is attached to the back surface of the top plate 11 by the bottom plate 12, and is disposed to face each other to function as a sensor portion. The wiring drawn from the transparent electrode layers 6 and 8 via the wiring layers 6A and 8A is connected to an external circuit through the flexible printed circuit board (FPC) 9.

The static capacitance type touch panel 100 is illustrated by a step diagram according to, for example, FIG. The step is performed by the processes of the first to tenth steps (S1 to S10).

That is, first in the first step S1, in the flexible transparent panel base The back surface of the board 1 is formed with an anchor layer 2 covering the entire back surface of the transparent panel substrate 1 (see FIGS. 3A and 3B).

Next, in the second step S2, the back surface of the transparent panel substrate 1 is interposed therebetween. The anchor layer 2 is formed of a decorative printed layer 3 by black ink on the outer edge of the back surface of the transparent panel substrate 1 (see FIG. 3C).

Further, the above-described first step S1 may be omitted, and in the second step S2 described above The decorative printed layer 3 is directly formed on the outer edge portion of the back surface of the transparent panel substrate 1.

Next, in the third step S3, the above-described decorative printed layer 3 is formed. The inside of the step of the decorative printed layer 3 on the back surface of the flexible transparent panel substrate 1 and the ultraviolet curable resin to which the infrared absorbing agent is added are applied to the back surface of the decorative printed layer 3 to form a planarizing resin layer 4 (refer to FIG. 3D). ).

Next, in the fourth step S4, the back surface of the planarizing resin layer 4 is entirely The protective layer 5 is formed on the surface (see FIG. 3E).

Formed by the transparent panel substrate 1, the decorative printed layer 3, and planarized by this method The top sheet 10A composed of the resin layer 4 or the like.

Here, the decorative printed layer 3 is formed in a smart phone, a tablet terminal, etc. The outer edge portion of the liquid crystal screen is formed by a layer formed by an electrode or a wiring or the like necessary for the touch panel to function as an edge region, and is covered so as not to be recognized from the outside. The decorative printed layer 3 is formed by superposing and coating a plurality of colored inks using urethane by screen printing. In order to apply a predetermined thickness so that the electrode or the wiring formed in the edge region does not permeate, the thick coating applied once is likely to be uneven. Therefore, it is necessary to form the coating layer each time to be thin and divided into a plurality of times. Multi-layer printed layer. For example, hard In the case of a dark-colored ink that is light-transmissive, when a printing layer is formed by secondary coating and a light-colored (white or the like) ink is easily transmitted, it is necessary to apply the coating four times or so. When the coating thickness per application is about 8 μm, the layer of the pale ink has a thickness of about 32 μm.

In the next fifth step S5, as shown in FIG. 4A, the transparent surface is The flattening resin layer 4 is subjected to a pressure treatment in a state in which the back surface of the board substrate 1 is bonded to the flat surface of the flat substrate 30.

Specifically, in the fifth step S5, a bonding device is used, The bonding apparatus adsorbs, for example, a glass plate as the flat substrate 30 before the top plate 20 having the suction function, and the top plate 10A is sandwiched between the flat substrate 30 and the roller 21, and the roller 21 is rolled in the direction of the arrow. The flat substrate 30 is bonded to the top plate member 10A, and the flattening resin layer 4 is pressurized by the roller 21 from the side of the transparent panel substrate 1 by using the bonding device.

The planarization resin layer 4 is faced from the side of the transparent panel substrate 1 as described above. By applying the pressure treatment to the flat resin layer 4, the flat substrate 30 is bonded to the flat resin layer 4, and the flat surface of the flat substrate 30 is transferred to the back surface of the flattening resin layer 4, and the flattening resin is applied. The back surface of the layer 4 is a flat surface having, for example, the surface accuracy of the glass plate used as the flat substrate 30, that is, the flatness or the surface roughness.

Moreover, the flattening resin layer 4 is applied to the flat resin substrate 4 from the side of the transparent panel substrate 1 When the flat sheet 30 is bonded to the back surface of the flattening resin layer 4 by the press treatment, the rolling speed of the roll 21 can be reduced to a predetermined constant speed, and the top plate 1 can be reduced. The bubble of the step portion generated by the printed layer 3 is decorated.

In the next sixth step S6, the above-mentioned top having been subjected to the above-described pressurization treatment The planarization resin layer 4 of the sheet material 10A is further subjected to autoclaving treatment.

Specifically, in the sixth step S6, the top plate 20 is stopped on the flat base. The attraction of the plate 30 causes the top plate 10A to be detached from the top plate 20 together with the flat substrate 30, and placed in an autoclave pressure cooker for autoclaving.

The decorative printed layer 3 of the above-mentioned top sheet 10A to which the above-described pressurization treatment has been applied The bubbles remaining in the generated step portion can be further reduced by the autoclaving treatment, and the bubbles remaining in the image display region inside the decorative printed layer 3 can be eliminated.

Then, in the next seventh step S7, the above-mentioned autoclave has been applied. The flattening resin layer 4 of the above top sheet 10A is cured.

Specifically, in this seventh step S7, as shown in FIG. 4B, by using On the flat substrate 30 side, the flattening resin layer 4 of the top plate material 10A subjected to the above-described pressurization treatment and autoclaving treatment is irradiated with ultraviolet rays by the ultraviolet light source 22 to cure the flattening resin layer 4.

Here, by using a transparent glass plate having a high ultraviolet transmittance as the above flat The substrate 30 can be irradiated with ultraviolet rays from the flat substrate 30 side, and the planarizing resin layer 4 can be cured with good efficiency.

In addition, it is also possible to replace the above-mentioned glass plate, and use, for example, by applying a release treatment. The ultraviolet polycarbonate substrate or the acrylic resin substrate or the like is used as the flat substrate 30 described above.

In the next eighth step S8, as shown in FIG. 4C, from the hardened above The flattening resin layer 4 peels off the flat substrate 30 described above.

Further, the flat substrate 30 is preferably made of a hardened planarization resin layer 4 For peeling, the base sheet is made of a glass plate having a thickness of, for example, 0.5 mm to 2 mm or less, and is further preferably For the release treatment of applying a water repellent or a release agent to the surface.

Then, in the next 9th step S9, as shown in FIG. 5A, FIG. 5B, and FIG. 5C The top plate 11 is completed by forming the transparent electrode layer 6 having the wiring layer 6A on the back surface of the flat resin layer 4 of the top plate 10B.

Specifically, in the ninth step S9, the flat top plate 10B is flat. The transparent electrode layer 6 having the wiring layer 6A is formed on the back surface of the canonized resin layer 4 (refer to FIG. 5A, FIG. 5B), and as shown in FIG. 5C, the laser processing using the infrared laser as the laser light source will have wiring. The transparent electrode layer 6 of the layer 6A is patterned to complete the top plate 11.

In this way, the processing of the first to ninth steps (S1 to S9) is performed. The top plate 10B of the configuration shown in Figs. 3A and 3B is made.

Here, for the top plate 10B of such a configuration, a kind of infrared absorbing agent is used. A sample of the ultraviolet curable resin with a change in the amount and the amount added was evaluated, and after the identification of the decorative printed layer 3 was evaluated, the results shown in Fig. 6 were obtained.

The ultraviolet curing resin forming the planarizing resin layer 4 is used (Sanyu-rec) Resin Co., Ltd. RL-9262 resin, as an infrared absorber to be added, each sample was prepared using Lumogen IR765 manufactured by BASF Corporation, IRG-022C manufactured by Nippon Chemical Co., Ltd., IRG-069 manufactured by Japan Carlit Corporation, and CIR-265 manufactured by Japan Carlit Corporation. In addition, the transparent electrode layer 6 having the wiring layer 6A was patterned by a fiber laser (1060±10 nm) manufactured by Kataoka Seisakusho Co., Ltd. as a laser processing machine, and the visibility of the decorative printed layer 3 was evaluated.

The identification of the identification is based on the transmission and the projection of the optical microscope. The surface and the back surface of the laminate are based on whether or not defects can be detected in the decorative printed layer 3.

The amount of the infrared absorbing agent added by the amount of the infrared absorbing agent is 0%. A sample of the flattened resin layer 4 having a thickness of 10 μm was formed as a comparative example 1 by the company RL-9262 resin.

The amount of the infrared absorbing agent added by the amount of the infrared absorbing agent is 0%. As a comparative example 2, a sample of the flattening resin layer 4 having a thickness of 30 μm was formed from RL-9262 resin.

By adding 0.1% of BASF as an infrared absorber A sample of the flattened resin layer 4 having a thickness of 10 μm was formed from RL-9262 resin manufactured by Lumogen IR 765 Sanyo Resin Co., Ltd. as Comparative Example 3.

By adding 0.5% of BASF as an infrared absorber A sample of the flattened resin layer 4 having a thickness of 10 μm was formed from RL-9262 resin manufactured by Lumogen IR 765 Sanyo Resin Co., Ltd. as Comparative Example 4.

It will be manufactured by Nippon Kayaku Co., Ltd. by adding 0.1% as an infrared absorbing agent. A sample of the flattened resin layer 4 having a thickness of 10 μm was formed as a RL-9262 resin manufactured by Iru-Resin Co., Ltd., IRG-022C, as Comparative Example 5.

It will be manufactured by Nippon Kayaku Co., Ltd. by adding 0.1% as an infrared absorbing agent. A sample of the flattened resin layer 4 having a thickness of 10 μm was formed as a RL-9262 resin manufactured by IRG-069 Sanyo Resin Co., Ltd. as Comparative Example 6.

It will be added by 0.1% of Japan Carlit Co., Ltd. as an infrared absorbing agent. A sample of the flattened resin layer 4 having a thickness of 10 μm was formed as a RL-9262 resin manufactured by CIR-265, Sanyo Resin Co., Ltd. as Comparative Example 7.

By adding 1.0% of BASF as an infrared absorber RL-9262 resin manufactured by Lumogen IR765 Sanyou Resin Co., Ltd. has a thickness of 10 μm A sample of the planarizing resin layer 4 was taken as Example 1.

By adding 5.0% of BASF as an infrared absorber A sample of the flattened resin layer 4 having a thickness of 10 μm was formed as a RL-9262 resin manufactured by Lumogen IR 765 Sanyo Resin Co., Ltd. as Example 2.

It will be manufactured by Nippon Kayaku Co., Ltd., which is 1.0% as an infrared absorbing agent. A sample of the flattened resin layer 4 having a thickness of 10 μm was formed as a RL-9262 resin manufactured by Iru-Resin Co., Ltd., IRG-022C, as Example 3.

It will be manufactured by Nippon Kayaku Co., Ltd., which is 1.0% as an infrared absorbing agent. A sample of the flattened resin layer 4 having a thickness of 10 μm was formed as a RL-9262 resin manufactured by IRG-069 Sanyo Resin Co., Ltd. as Example 4.

1.0% by the Japanese carlit company will be added as an infrared absorbing agent. A sample of the flattened resin layer 4 having a thickness of 10 μm was formed as a RL-9262 resin manufactured by CIR-265 Sanyou Resin Co., Ltd. as Example 5.

In any of Comparative Examples 1 to 7, any one of the printed layers 3 was produced by laser processing. There are defects and there are identification problems.

On the other hand, in any of Examples 1 to 5, none of them was added by laser processing. The printed layer 3 is defective and can be well recognized.

The planarizing resin layer 4 in the above embodiments 1 to 5 is added with infrared rays The absorption amount of the infrared ray at a wavelength of 1060 nm is 4% to 30%.

Next, in the next 10th step S10, as shown in FIG. 7A, the top plate is made. The back surface of the face 11 is facing the front side of the bottom plate 12, and as shown in FIG. 7B, the transparent electrode layer having the wiring layer 6A formed on the top plate 11 is completed by bonding the top plate 11 and the bottom plate 12 together. The capacitive touch panel 100 that functions as a sensor portion is formed on the transparent electrode layer 8 having the wiring layer 8A formed on the substrate 12.

Further, a transparent electrode layer having the wiring layer 8A formed on the above substrate 12 8. The transparent electrode layer 8 having the wiring layer 8A is patterned by laser processing using infrared laser light in the same manner as the transparent electrode layer 6 having the wiring layer 6A formed on the top plate 11, and a fine wiring pattern is formed. .

Here, the transparent electrode layers 6, 8 can very suitably use Ag or Cu nanometers. Wire, ITO or ZnO materials. The transparent electrode layers 6, 8 are composed of a plurality of wirings, and are formed so as to intersect with each other across the insulator, and the static capacitance is formed in equal amounts.

Further, as the back surface and the decorative printed layer 3 formed over the transparent panel substrate 1 As the material for covering the entire flattening resin layer 4 on the back surface, a transparent acrylic resin paint or an amine ester resin paint used for the ultraviolet curable ink can be used. More specifically, amine ester (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, polyester urethane (meth) acrylate, polyether (methyl) can be used. A coating material such as acrylate, polycarbonate (meth) acrylate or polycarbonate amide (meth) acrylate. The material for planarizing the resin layer 4 preferably has a ratio of diffused transmitted light to total light transmitted light, that is, haze of not more than 1%, without affecting the optical characteristics of the touch panel. As described above, when the decorative printing is performed with a pale ink, the decorative printed layer 3 has a thickness of about 32 μm, so that it can have a thickness of, for example, about 35 μm, over the back surface of the transparent panel substrate 1 and the decorative printed layer. 3 The acrylic coating is applied on the back side to form the planarizing resin layer 4. When the acrylic coating material for forming the planarizing resin layer 4 is applied, in addition to screen printing, it can be directly coated using a die coater. As described above, since the well-known coating technique can be used to form the planarization resin layer 4, no guide is required. The special equipment can be used in the same manner as the equipment used in the printing step of the decorative printed layer 3, which can reduce the manufacturing cost. When the transparent electrode layer 6 is formed on the back surface of the planarizing resin layer 4, it is possible to prevent the wiring from being broken due to the step.

The planarization resin layer 4 of the top plate 11 in the static capacitance type touch panel 100, A resin layer having an infrared absorbing function obtained by curing an ultraviolet curable resin to which an infrared absorbing agent is added, and a flat substrate having a flat surface such as a glass plate is covered with a flat resin before the resin layer is cured in the process. The back surface of the layer 4 is subjected to a compression treatment, and the back surface of the flattening resin layer 4 is a flat surface on which the flat surface of the flat substrate is transferred. Thereby, in the image display region in the decorative printed layer 3, the surface roughness of the back surface of the flattening resin layer 4 is unrecognizable, and the surface roughness of the back surface of the flattening resin layer 4 does not cause the electrostatic capacitance. The quality of the touch panel 100 is reduced. The static capacitance type touch panel 100 is a high-quality electrostatic capacitance type touch panel for eliminating a flat resin layer formed by the decorative printed layer 3 formed on the outer edge of the back surface of the transparent panel substrate 11. 4 The surface roughness of the back side will not be recognized.

The top plate 11 of the static capacitance type touch panel 100 is provided with infrared In the planarization resin layer 4 of the line absorption function, even if the wiring layer 6A and the transparent electrode layer 6 are patterned by laser processing using infrared laser from the back side of the decorative printed layer 3, the decorative printed layer 3 does not Defects due to infrared processing do not degrade the quality of the electrostatic capacitance type touch panel 100.

The above-described capacitive touch panel 100 is provided, for example, as shown in FIG. The image display device 300 having a touch panel is configured in front of the image display unit 200 such as a crystal panel.

1, 7‧‧‧ transparent panel substrate

2‧‧‧ anchor layer

3‧‧‧Plus printing layer

4‧‧‧Flating resin layer

5‧‧‧Protective layer

6, 8‧‧‧ transparent electrode layer

6A, 8A‧‧‧ wiring layer

9‧‧‧Flexible printed circuit board

11‧‧‧ top board

12‧‧‧floor

100‧‧‧Static Capacitive Touch Panel

Claims (16)

A laminated body comprising: a transparent panel substrate; a decorative printed layer formed on an outer edge portion of the back surface of the transparent panel substrate; a flattening resin layer having an infrared absorbing function; and the decorative layer formed on the transparent panel substrate The surface of the printed layer is formed to cover a region extending over the decorative printed layer and the transparent panel substrate, and the transparent electrode layer is formed on the back surface of the planarizing resin layer to have a wiring layer. The laminate according to claim 1, wherein the decorative printed layer is directly formed on an outer edge portion of the back surface of the transparent panel substrate. The laminated body according to claim 1, wherein the decorative printed layer is formed on an outer edge portion of the back surface of the transparent panel substrate via an anchor layer covering the back surface of the transparent panel substrate. The laminate according to the second or third aspect of the invention, wherein the flattening resin layer has an infrared absorption amount of 4% to 30% at a wavelength of 1060 nm. The laminate of claim 4, wherein the transparent conductive layer is made of a material comprising a silver nanowire or a Cu nanowire. A method for manufacturing a laminated body by forming a decorative printed layer on an outer edge portion of a back surface of a transparent panel substrate, and forming a surface of the transparent printed circuit board on which the decorative printed layer is formed to cover the decorative printed layer and a planarization resin layer having an infrared absorbing function is formed in a region of the transparent panel substrate, and a transparent electrode layer having a wiring layer is formed on a back surface of the planarization resin layer to form a laminate; The wiring layer and the transparent electrode layer on the back surface of the decorative printed layer of the laminated body are patterned by laser processing using an infrared laser as a laser light source. A static capacitance type touch panel comprising: a transparent panel substrate; a decorative printed layer formed on an outer edge portion of the back surface of the transparent panel substrate; and a flattening resin layer having an infrared absorbing function formed on the transparent panel substrate a surface of the decorative printed layer is formed to cover a region extending over the decorative printed layer and the transparent panel substrate; and a transparent electrode layer is formed on a back surface of the planarizing resin layer to have a wiring layer; the decorative printing The wiring layer and the transparent electrode layer on the back surface of the layer are patterned by laser processing using infrared laser. The capacitive touch panel of claim 7, wherein the decorative printed layer is directly laminated on the back surface of the transparent panel substrate. The capacitive touch panel of claim 7, wherein the decorative printed layer is provided with an anchor layer covering the back surface of the transparent panel substrate. The electrostatic capacitance type touch panel according to claim 8 or 9, wherein the flattening resin layer has an infrared absorption amount of 4% to 30% at a wavelength of 1060 nm. For example, in the capacitive touch panel of claim 10, the transparent conductive layer is made of a material including a silver nanowire or a Cu nanowire. An image display device comprising a capacitive touch panel in front of a display screen, wherein the capacitive touch panel comprises: a transparent panel substrate; and a decorative printed layer formed on the surface a rear edge portion of the back surface of the transparent panel substrate; and a flattening resin layer having an infrared absorbing function formed on the surface of the transparent panel substrate on which the decorative printed layer is formed to cover the decorative printed layer and the transparent layer A region of the panel substrate; and a transparent electrode layer formed on the back surface of the planarization resin layer and having a wiring layer. The image display device of claim 12, wherein the decorative printed layer is directly formed on an outer edge portion of the back surface of the transparent panel substrate. The image display device of claim 12, wherein the decorative printed layer is formed on an outer edge portion of the back surface of the transparent panel substrate via an anchor layer covering a back surface of the transparent panel substrate. The image display device according to claim 13 or 14, wherein the flattening resin layer has an infrared absorption amount of 4% to 30% at a wavelength of 1060 nm. The image display device of claim 15, wherein the transparent conductive layer is made of a material including a silver nanowire or a Cu nanowire.