JP2015184882A - Laminate, manufacturing method of laminate, electrostatic capacitance type touch panel, and image display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminate, a manufacturing method of a laminate, an electrostatic capacitance type touch panel, and an image display device, in which a decorative printing layer formed by black ink on an outer edge part of a back surface of a transparent panel substrate is not damaged when a transparent electrode layer and a wiring layer of a touch panel are patterned by laser processing.SOLUTION: A top plate 11 includes: a transparent panel substrate 1; a decorative printing layer 3 formed on an outer edge part of a back surface of the transparent panel substrate 1; planarization resin layer 4 which is formed over a surface of the transparent panel substrate 1, on which the decorative printing layer 3 is formed, so as to cover the area over the decorative printing layer 3 and the transparent panel substrate 1, and which has an infrared absorption function; and a transparent electrode layer 6 formed on a back surface of the planarization resin layer and having a wiring layer 6A. The wiring layer 6A and the transparent electrode layer 6 of the top plate 11 are patterned by laser processing of an infrared laser from a back surface side of the decorative printing layer 3.

Description

  The present invention relates to a laminate, a method for producing the laminate, a capacitive touch panel, and an image display device, and in particular, a laminate having a decorative print layer formed on the outer edge portion of the back surface of a transparent panel substrate, and the laminate. The present invention relates to a manufacturing method, a capacitive touch panel, and an image display device.

  Smartphones and tablet PCs that can be easily operated with a touch panel have become widespread, and touch panel thickness reduction, weight reduction, and cost reduction are urgent issues.

  There are various touch panel detection methods, for example, a resistive film method that specifies the pointing position by overlapping two resistive films, or an ultrasonic wave or surface acoustic wave is generated on the panel surface to detect the pointing position. The surface acoustic wave method to perform etc. is mentioned. The touch panel used for the above-described smartphone or tablet PC taps or drags on the panel with a finger, or performs a pinch-out operation that spreads two fingers on the screen to enlarge the image, It is necessary to deal with a complicated and flexible operation such as a pinch-in operation that moves two fingers together. Therefore, at present, a capacitive touch panel that forms a xy matrix using transparent electrodes and can simultaneously detect a plurality of designated positions has become the mainstream.

  Conventionally, in the manufacturing process of a capacitive touch panel, detection part formation for detecting contact is performed by applying a transparent conductive film to a substrate, leaving only a part necessary for detection by etching, and removing unnecessary parts.

  In addition, the lead-out wiring for connecting the detection unit and the external circuit was formed on the outer periphery of the touch panel by screen printing with silver paste. However, as the number of detection units on the touch panel increased, the wiring width became finer and printed. However, there is a limit to the method according to, and at present, it is formed by etching in the same manner as the transparent conductive film.

  Etching methods are roughly classified into wet etching using a chemical solution and dry etching using a laser or the like. In wet etching, the number of manufacturing processes is increased because cleaning and the like are repeated. However, dry etching has the advantage of simplifying the manufacturing process and leading to cost reduction.

  In addition, in order to cover the above-described lead wiring on the touch panel, printing with mainly black ink called decorative printing is performed on the outer peripheral portion.

  In other words, conventional image display panels such as electronic devices and capacitive touch panels provided on the surface of the image display panel are designed to increase the commercial value by attaching various designs to the peripheral area of the image display area as a decoration area. Has been made. However, since the wiring pattern that is electrically connected to the transparent electrode is formed in the peripheral region, when the laminated body is configured, unevenness corresponding to the shape of the wiring pattern occurs on the surface of the touch panel. There is. In this case, there is a problem that the desired flatness of the touch panel cannot be maintained and the commercial value is impaired.

  In addition, if decoration is applied to the panel substrate and an optical double-sided tape is applied to it, bubbles or air layers may be generated inside the steps created by the decoration. A panel substrate is formed in a smooth state without distortion by filling an ultraviolet curable resin so as to fill a level difference between layers and smoothing the back surface of the panel substrate.

JP 2014-000725 A JP 2013-246885 A JP 2001-202826 A

  By the way, in the wet etching process using a chemical solution, since there are steps such as water shower and etching, it is essential to select a resin or a substrate having solvent resistance or alkali resistance. If the resistance is not sufficient, problems such as film adhesion and conductivity of the sheet resistance value occur. In addition, a large number of steps in wet etching also causes a decrease in yield.

  On the other hand, since laser processing is a dry process, the resin and substrate can be selected more freely than the wet process, and the number of processing steps is small. While the current wet process requires 8 steps, the laser can pattern in one step.

However, in the conventional capacitive touch panel, when the transparent electrode layer or wiring layer of the touch panel is patterned by laser processing, the decorative printed layer formed of black ink on the outer edge of the back surface of the transparent panel substrate is damaged. There has been a problem that defects such as the appearance of the receiver are impaired.

  Therefore, in view of the conventional problems as described above, the object of the present invention is formed by black ink on the outer edge of the back surface of the transparent panel substrate when patterning the transparent electrode layer and the wiring layer of the touch panel by laser processing. It is providing the laminated body which does not produce a defect in a decorative printed layer, the manufacturing method of a laminated body, an electrostatic capacitance type touch panel, and an image display apparatus.

  Other objects of the present invention and specific advantages obtained by the present invention will become more apparent from the embodiments described below with reference to the drawings.

  In the present invention, the decorative print layer is covered with a planarizing resin layer having an infrared absorption function, thereby reducing the amount of infrared rays reaching the decorative print layer, thereby reducing the damage of the decorative print layer.

  That is, this invention is a laminated body, Comprising: The transparent panel board | substrate, the decorative printed layer formed in the outer edge part of the back surface of the said transparent panel board | substrate, and the said decorative printed layer of the said transparent panel board | substrate were formed. On the surface, a planarizing resin layer having an infrared absorption function formed so as to cover the region extending over the decorative printed layer and the transparent panel substrate, and a wiring layer formed on the back surface of the planarizing resin layer. And a transparent electrode layer.

  In the laminate according to the present invention, the decorative print layer can be formed directly on the outer edge of the back surface of the transparent panel substrate, for example.

  Moreover, the laminated body which concerns on this invention WHEREIN: The said decorative print layer shall be formed in the outer edge part of the back surface of the said transparent panel board | substrate through the anchor layer which covers the back surface of the said transparent panel board | substrate, for example. Can do.

  Moreover, the laminated body which concerns on this invention WHEREIN: As for the said planarization resin layer, the infrared rays absorption amount in wavelength 1060nm shall be 4%-30%, for example.

  Furthermore, in the laminate according to the present invention, the transparent conductive layer may be made of a material containing, for example, silver nanowires or Cu nanowires.

  The present invention is a method for producing a laminate, wherein a decorative print layer is formed on an outer edge portion of the back surface of a transparent panel substrate, and the decorative print layer is formed on the surface of the transparent panel substrate. A flattened resin layer having an infrared absorption function is formed so as to cover a region extending from the decorative printed layer and the transparent panel substrate, and a transparent electrode layer having a wiring layer is formed on the back surface of the flattened resin layer. The wiring layer and the transparent electrode layer on the back surface of the decorative print layer of the laminate are patterned by laser processing using an infrared laser as a laser light source.

  This invention is a capacitive touch panel, Comprising: A transparent panel board | substrate, the decorative printed layer formed in the outer edge part of the back surface of the said transparent panel board | substrate, and the said decorative printed layer of the said transparent panel board | substrate are formed. A planarizing resin layer having an infrared absorption function formed so as to cover a region extending over the decorative printed layer and the transparent panel substrate, and a wiring layer formed on the back surface of the planarizing resin layer. The wiring layer and the transparent electrode layer on the back surface of the decorative print layer are patterned by laser processing using an infrared laser.

  Moreover, the electrostatic capacitance type touch panel which concerns on this invention WHEREIN: The said decorative printing layer shall be directly laminated | stacked on the back surface of the said transparent panel board | substrate, for example.

  Moreover, the electrostatic capacitance type touch panel which concerns on this invention WHEREIN: The said decorative printing layer shall be laminated | stacked through the anchor layer which covers the back surface of the said transparent panel board | substrate, for example.

  In the capacitive touch panel according to the present invention, the planarizing resin layer may have an infrared absorption amount of 4% to 30% at a wavelength of 1060 nm, for example.

  Furthermore, in the capacitive touch panel according to the present invention, the transparent conductive layer may be made of a material containing, for example, silver nanowires or Cu nanowires.

  The present invention is an image display device including a capacitive touch panel on the entire surface of a display screen, wherein the capacitive touch panel is formed on a transparent panel substrate and an outer edge portion of the back surface of the transparent panel substrate. A flattening having an infrared absorption function formed so as to cover a region extending over the decorative print layer and the transparent panel substrate on the surface on which the decorative print layer and the decorative print layer of the transparent panel substrate are formed. It is characterized by comprising a resin layer and a transparent electrode layer formed on the back surface of the planarizing resin layer and having a wiring layer.

  Moreover, the image display apparatus which concerns on this invention WHEREIN: The said decorating printing layer shall be directly formed in the outer edge part of the back surface of the said transparent panel board | substrate, for example.

  Moreover, the image display apparatus which concerns on this invention WHEREIN: The said decorating printing layer shall be formed in the outer edge part of the back surface of the said transparent panel board | substrate through the anchor layer which covers the back surface of the said transparent panel board | substrate, for example. be able to.

  In the image display device according to the present invention, the planarizing resin layer may have an infrared absorption amount of 4% to 30% at a wavelength of 1060 nm, for example.

  Furthermore, in the image display device according to the present invention, the transparent conductive layer may be made of a material containing, for example, silver nanowires or Cu nanowires.

  In the present invention, by covering the decorative print layer with a planarizing resin layer having an infrared absorption function, the amount of infrared rays reaching the decorative print layer can be reduced, thereby reducing the damage of the decorative print layer. When patterning the transparent electrode layer or wiring layer of the touch panel by laser processing, a laminate that does not cause defects in the decorative printed layer formed of black ink on the outer edge of the back surface of the transparent panel substrate, A manufacturing method, a capacitive touch panel, and an image display device can be provided.

It is a figure which shows the structure of the capacitive touch panel which concerns on one embodiment of this invention. (A) is a top view of an electrostatic capacitance type touch panel, (B) is sectional drawing in the AA 'line | wire of (A) figure. It is process drawing which shows an example of the manufacturing procedure of the said capacitive touch panel. It is sectional drawing which shows typically the formation process of the top plate in the 1st process of the said manufacture procedure thru | or a 4th process. It is sectional drawing which shows typically the formation process of the top plate in the 5th process thru | or 8th process of the said manufacture procedure. It is sectional drawing which shows typically the formation process of the top plate in the 9th process of the said manufacture procedure. It is a figure which shows evaluation of the visibility of the decorative printed layer of a top plate. It is sectional drawing which shows typically the bonding process of the top plate and bottom plate in the 10th process of the said manufacture procedure. It is a figure which shows an image display apparatus with a touch panel provided with an electrostatic capacitance type touch panel.

  Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the present invention. In addition, the dimension of each part in drawing shows the outline, and especially sectional drawing is taken as the dimension emphasized in the thickness direction in order to show a structure clearly.

  The present invention is applied to, for example, a capacitive touch panel 100 having a structure as shown in FIG.

  FIG. 1 is a diagram showing a configuration example of a capacitive touch panel 100 configured by the structure according to the present invention, where (A) shows a front view of the capacitive touch panel 100 and (B) shows its AA ′. A line sectional view is shown.

  The capacitive touch panel 100 includes a laminate of a top plate 11 and a bottom plate 12.

  In this capacitive touch panel 100, the top plate 11 is formed on the outer edge portion of the back surface of the transparent panel substrate 1 through the transparent panel substrate 1 and the undercoat layer 2 covering the back surface of the transparent panel substrate 1. The decorative printed layer 3, the planarizing resin layer 4 having an infrared absorption function formed so as to cover the back side of the transparent panel substrate 1 and the back side of the decorative printed layer 3, and the planarizing resin layer 4 It consists of a transparent electrode layer 6 having a wiring layer 6A formed on the back surface via an overcoat layer 5.

  The top plate 11 may have the decorative print layer 3 directly formed on the outer edge of the back surface of the transparent panel substrate 1 or may have a structure in which the undercoat layer 2 is omitted. .

  The bottom plate 12 includes a transparent panel substrate 7 and a transparent electrode layer 8 having a wiring layer 8A formed on the entire surface of the transparent panel substrate 7.

  The transparent electrode layer 6 having the wiring layer 6 </ b> A formed on the top plate 11 and the transparent electrode layer 8 having the wiring layer 8 </ b> A formed on the bottom plate 12 are formed on the back surface of the top plate 11. When 12 are bonded together, they are provided so as to face each other, thereby functioning as a sensor unit. Wiring drawn from the transparent electrode layers 6 and 8 through the wiring layers 6A and 8A is connected to an external circuit through a flexible printed circuit board (FPC) 9.

  The capacitive touch panel 100 is manufactured, for example, by performing the processes of the first to tenth steps (S1 to S10) according to the procedure shown in the process diagram of FIG.

  That is, first, in the first step S1, the anchor layer 2 that covers the entire back surface of the transparent panel substrate 1 is formed on the back surface of the flexible transparent panel substrate 1 (FIGS. 3A and 3B). )reference).

  Next, in the second step S2, the decorative printed layer 3 is formed on the back surface of the transparent panel substrate 1 with black ink on the outer edge portion of the back surface of the transparent panel substrate 1 via the undercoat layer 2 (FIG. 3 (C)).

  In addition, the said 1st process S1 may be abbreviate | omitted and you may make it form the said decorating printing layer 3 in the outer edge part of the back surface of the said transparent panel board | substrate 1 directly in the said 2nd process S2.

  Next, in the third step S3, the inside of the step of the decorative print layer 3 on the back surface of the flexible transparent panel substrate 2 on which the decorative print layer 3 is formed, and the decorative print layer 3 A flattened resin layer 4 is formed by applying an ultraviolet curable resin to which an infrared absorber is added on the back surface (see FIG. 3D).

  Next, in the fourth step S4, the undercoat layer 2 is formed on the entire back surface of the planarizing resin layer 4 (see FIG. 3E).

  In this way, the top plate material 10A composed of the transparent panel substrate 1, the decorative printing layer 3, the flattening resin layer 4, and the like is formed.

  Here, the decorative print layer 3 is formed on the outer edge portion of the liquid crystal screen that constitutes a smartphone, a tablet terminal, etc., and an area where electrodes, wirings, etc. necessary for functioning the touch panel are formed is used as a frame area from the outside. It is a layer formed for the purpose of covering so that it cannot be visually recognized. The decorative print layer 3 is formed by, for example, overlaying colored inks using, for example, a two-component urethane ink in multiple layers by silk screen printing. In order to apply a predetermined thickness so that the electrodes and wirings formed in the frame region do not pass through, it is easy to make a thick coating with a single application. It is necessary to form a multi-layered printing layer by thinning and dividing into multiple times. For example, in the case of dark ink that does not easily transmit light, a printing layer is formed by applying twice, and in the case of light color ink (such as white) that easily transmits light, it is applied approximately four times. Need to do. When the coating thickness per one time is about 8 μm, the light-color ink layer has a thickness of about 32 μm.

  In the next fifth step S5, as shown in FIG. 4A, the flattening resin layer 4 is pressed with the back surface of the flattening resin layer 4 and the flat surface of the flat substrate 30 bonded together. Apply processing.

  Specifically, in the fifth step S5, for example, a glass plate is adsorbed as the flat substrate 30 to the top plate 20 having a suction function, and the top plate material 10A is sandwiched between the flat substrate 30 and the roller 21. By rolling the roller 21 in the direction of the arrow, the roller 21 is applied to the planarizing resin layer 4 from the transparent panel substrate 1 side by using a bonding apparatus that bonds the flat substrate 30 and the top plate 10A. Apply pressure treatment.

  As described above, the flattening resin layer 4 is pressed by the roller 21 from the transparent panel substrate 1 side, and the flattening substrate 30 is bonded to the flattening resin layer 4. 4, the flat surface of the flat substrate 30 is transferred, and the back surface of the flattening resin layer 4 is, for example, the surface accuracy of, for example, a glass plate used as the flat substrate 30, that is, the flatness and the surface roughness. And so on.

  Further, when the flattening resin layer 4 is pressed by the roller 21 from the transparent panel substrate 2 side and the flat substrate 30 is bonded to the back surface of the flattening resin layer 4, By setting the moving speed to a predetermined constant speed, it is possible to reduce bubbles remaining in the stepped portion by the decorative layer 3 of the top plate 1.

  In the next sixth step S6, the flattening resin layer 4 of the top plate material 10A that has been subjected to the pressure treatment is further subjected to a clave treatment.

  Specifically, in the sixth step S6, the suction of the flat substrate 30 by the top plate 20 is stopped, the top plate material 10A is separated from the top plate 20 together with the flat substrate 30, and the autoclave pressure cooker is removed. And cleave.

  Bubbles remaining in the stepped portion of the decorative printing layer 3 of the top plate material 10A subjected to the pressurizing treatment can be further reduced by performing a clave treatment, and the image inside the decorative layer 3 can be reduced. Bubbles remaining in the display area can be eliminated.

  Then, in the next seventh step S7, the planarizing resin layer 4 of the top plate material 10A that has been subjected to the clave treatment is cured.

  Specifically, in the seventh step S7, as shown in FIG. 4B, the flat substrate is applied to the flattening resin layer 4 of the top plate material 10A that has been subjected to the pressurizing process and the clave process. The planarizing resin layer 4 is cured by irradiating ultraviolet rays from the ultraviolet light source 22 from the 30 side.

  Here, by using a transparent glass plate having a high ultraviolet transmittance for the flat substrate 20, the flattened resin layer 4 can be efficiently cured by irradiating ultraviolet rays from the flat substrate 30 side.

  The flat substrate 30 may be, for example, a polycarbonate substrate or an acrylic resin substrate through which ultraviolet rays subjected to mold release treatment pass, instead of the glass plate.

  In the next eighth step S8, the flat substrate 30 is peeled off from the cured flattening resin layer 4.

  The flat substrate 30 is made of a substrate material, for example, a glass plate having a thickness of 0.5 mm to 2 mm or less, so that the cured flattening resin layer 4 can be easily peeled off. It is preferable that the mold release process applied to the surface is performed.

  Then, in the next ninth step S9, as shown in FIG. 5, the top plate 11 is formed by forming the transparent electrode layer 6 having the wiring layer 6A on the back surface of the planarizing resin layer 4 of the top plate 10B. Complete.

  Specifically, in the ninth step S9, the transparent electrode layer 6 having the wiring layer 6A is formed on the back surface of the planarizing resin layer 4 of the top plate 10B (FIGS. 5A and 5B). Further, as shown in FIG. 5C, the top plate 11 is completed by patterning the transparent electrode layer 6 having the wiring layer 6A by laser processing using an infrared laser as a laser light source.

  In this manner, the top plate 10B having a structure as shown in FIGS. 3A and 3B is produced by the processes of the first to ninth steps (S1 to S9).

  Here, with respect to the top plate 10B having such a structure, a sample was prepared using an ultraviolet curable resin in which the type and addition amount of the infrared absorbent were changed, and the visibility of the decorative printing layer 3 was evaluated. Results as shown in FIG. 6 were obtained.

  For the UV curable resin forming the planarizing resin layer 4, RL-9262 resin manufactured by Sanyu Rec Co., Ltd. is used, and as an infrared absorber to be added, Lumogen IR765 manufactured by BASF, IRG-022C, IRG-069 manufactured by Nippon Kayaku Co., Ltd. Each sample is prepared using CIR-265 manufactured by Nippon Carlit Co., Ltd., and the transparent electrode layer 6 having the wiring layer 6A is patterned using a fiber laser (1060 ± 10 nm) manufactured by Kataoka Manufacturing Co., Ltd. as a laser processing machine. The visibility of the layer 3 was evaluated.

  Visibility was evaluated based on whether or not defects could be detected in the decorative print layer 3 by observing the front and back surfaces of the laminate using transmission and incident light of an optical microscope.

  A sample in which the flattening resin layer 4 having a thickness of 10 μm was formed from RL-9262 resin manufactured by San Yulec Co., Ltd., in which the addition amount of the infrared absorber was 0%, was referred to as Comparative Example 1.

  A sample in which the planarizing resin layer 4 having a thickness of 30 μm was formed from RL-9262 resin manufactured by San Yulec Co., Ltd., in which the addition amount of the infrared absorbing agent was 0% was used as Comparative Example 2.

  A sample in which the flattening resin layer 4 having a thickness of 10 μm was formed by RL-9262 resin manufactured by Sanyu Rec Co., Ltd., to which 0.1% of BASF Lumogen IR765 was added as an infrared absorber was set as Comparative Example 3.

  A sample in which the flattened resin layer 4 having a thickness of 10 μm was formed by RL-9262 resin manufactured by Sanyu Rec Co., Ltd., to which 0.5% of Lumogen IR765 manufactured by BASF was added as an infrared absorber was set as Comparative Example 4.

  A sample in which the flattening resin layer 4 having a thickness of 10 μm was formed by RL-9262 resin manufactured by Sanyu Rec Co., Ltd., in which 0.1% of IRG-022C manufactured by Nippon Kayaku Co., Ltd. was added as an infrared absorber was set as Comparative Example 5.

  A sample in which the flattened resin layer 4 having a thickness of 10 μm was formed of RL-9262 resin manufactured by Sanyu Rec Co., Ltd., to which 0.1% of IRG-069 manufactured by Nippon Kayaku Co., Ltd. was added as an infrared absorber was set as Comparative Example 6.

  A sample in which the flattened resin layer 4 having a thickness of 10 μm was formed by RL-9262 resin manufactured by Sanyu Rec Co., Ltd., to which 0.1% of CIR-265 manufactured by Nippon Carlit Co., Ltd. was added as an infrared absorber was set as Comparative Example 7.

  A sample in which the flattened resin layer 4 having a thickness of 10 μm was formed by using RL-9262 resin manufactured by Sanyu Rec Co., Ltd. to which 1.0% of Lumogen IR765 manufactured by BASF was added as an infrared absorber was defined as Example 1.

  A sample in which the flattened resin layer 4 having a thickness of 10 μm was formed of RL-9262 resin manufactured by Sanyu Rec Co., Ltd. to which 5.0% of Lumogen IR765 manufactured by BASF was added as an infrared absorber was set as Example 2.

  A sample in which the flattening resin layer 4 having a thickness of 10 μm was formed from Sanurec Co., Ltd. RL-9262 resin to which 1.0% of IRG-022C manufactured by Nippon Kayaku Co., Ltd. was added as an infrared absorber was defined as Example 3.

  A sample in which the planarizing resin layer 4 having a thickness of 10 μm was formed from RL-9262 resin manufactured by Sanyu Rec Co., Ltd., to which 1.0% of IRG-069 manufactured by Nippon Kayaku Co., Ltd. was added as an infrared absorber was defined as Example 4.

  A sample in which the flattened resin layer 4 having a thickness of 10 μm was formed from Sanurec Co., Ltd. RL-9262 resin to which 1.0% of CIR-265 manufactured by Nippon Carlit Co., Ltd. was added as an infrared absorber was taken as Example 5.

  In Comparative Examples 1 to 7, all of the decorative print layers 3 were defective due to laser processing, and there was a problem in visibility.

  On the other hand, in Examples 1 to 5, good visibility was obtained without any defects in the decorative print layer 3 caused by laser processing.

  The planarization resin layer 4 in the above Examples 1 to 5 has an infrared absorption amount of 4% to 30% at a wavelength of 1060 nm by adding an infrared absorber.

  Then, in the next tenth step S10, as shown in FIG. 7A, the back surface of the top plate 11 and the front surface of the bottom plate 11 face each other, and as shown in FIG. A transparent electrode layer 7 having a wiring layer 6A formed on the top plate 11 and a transparent electrode layer 8A having a wiring layer 8A formed on the bottom plate 12 by bonding the top plate 11 and the bottom plate 11 together. 8 completes the capacitive touch panel 100 that functions as a sensor unit.

  The transparent electrode layer 8 having the wiring layer 8A formed on the bottom plate 12 is processed by laser using an infrared laser in the same manner as the transparent electrode layer 7 having the wiring layer 7A formed on the top plate 11. A fine wiring pattern is formed by patterning the transparent electrode layer 6 having the wiring layer 6A.

  Here, a material containing Ag or Cu nanowire, ITO, ZnO or the like is preferably used for the transparent electrode layers 6 and 7. The transparent electrode layers 6 and 7 are composed of a plurality of wirings, and are formed so as to cross each other with an insulator therebetween, so that the capacitance is equivalently formed.

  In addition, as a material of the flattening resin layer 4 formed so as to cover the entire back surface of the transparent panel substrate 2 and the back surface of the decorative print layer 3, a transparent acrylic resin paint or urethane used for ultraviolet curable ink is used. A resin paint or the like can be used. More specifically, urethane (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, polyester urethane (meth) acrylate, polyether (meth) acrylate, polycarbonate (meth) acrylate, polycarbonate urethane (meth) acrylate It is possible to use a paint made of such as a material. The material used for the flattening resin layer 4 is more preferably one whose haze, which is the ratio of diffusely transmitted light to total light transmitted, does not exceed 1% so as not to affect the optical properties of the touch panel. As described above, when decorative printing is performed with light ink, the decoration layer 3 has a thickness of about 32 μm, and thus, for example, the back surface and the decoration of the transparent panel substrate 1 have a thickness of about 35 μm. The planarizing resin layer 4 may be formed by applying an acrylic paint over the back surface of the printing layer 3. In order to apply the acrylic paint for forming the flattening resin layer 4, it may be applied directly using a die coater in addition to silk screen printing. Thus, since the well-known application | coating technique can be used for formation of the planarization resin layer 4, it is not necessary to introduce special equipment, and the same thing as the equipment used for the printing process of the decorative printing layer 3 should be used. Manufacturing costs can be reduced. When the transparent electrode layer 6 </ b> A is formed on the back surface of the planarizing resin layer 4, it is possible to prevent disconnection of wiring due to this step.

  The flattening resin layer 4 of the top plate 11 in the capacitive touch panel 100 is a resin layer having an infrared absorption function obtained by curing an ultraviolet curable resin or the like to which an infrared absorber is added. Before the resin layer is cured, the back surface of the flattened resin layer 4 is subjected to a compression treatment in a state where the back surface of the flattened resin layer 4 is covered with a flat substrate having a flat surface such as a glass plate. The flat surface of the flat substrate is transferred to form a flat surface. Thereby, in the image display area in the decorative print layer 3, the surface roughness of the back surface of the flattening resin layer 4 is not visually recognized, and the surface roughness of the back surface of the flattening resin layer 4 is reduced. The quality of the capacitive touch panel 100 is not deteriorated. In this capacitive touch panel 100, the surface roughness of the back surface of the flattening resin layer 4 for eliminating a step due to the decorative printing layer 3 formed on the outer edge portion of the back surface of the top plate 1 is visually recognized. No high quality capacitive touch panel.

  Moreover, the top plate 11 in the capacitive touch panel 100 includes the planarizing resin layer 4 having an infrared absorption function, so that the wiring layer 6A and the transparent electrode layer are formed from the back side of the decorative printing layer 3 in the manufacturing process. Even if 6 is patterned by laser processing using an infrared laser, the decorative printed layer 3 does not cause defects due to the infrared laser, and the quality of the capacitive touch panel 100 does not deteriorate.

  For example, as shown in FIG. 8, the capacitive touch panel 100 is installed in front of an image display unit 200 such as a liquid crystal panel to constitute an image display device 300 with a touch panel.

11 Top plate, 1, 7 Transparent panel substrate, 2 Anchor coat layer, 3 Decorative printing layer, 4 Flattening resin layer, 5 Overcoat layer, 6, 8 Transparent electrode layer, 6A, 8A Wiring layer, 12 Bottom plate, 100 Capacitive touch panel

Claims (16)

A transparent panel substrate;
A decorative print layer formed on the outer edge of the back surface of the transparent panel substrate;
On the surface of the transparent panel substrate on which the decorative printing layer is formed, a planarizing resin layer having an infrared absorption function formed so as to cover the region extending over the decorative printing layer and the transparent panel substrate,
A laminate comprising: a transparent electrode layer formed on a back surface of the planarizing resin layer and having a wiring layer.   The laminate according to claim 1, wherein the decorative print layer is directly formed on an outer edge portion of the back surface of the transparent panel substrate.   The laminate according to claim 1, wherein the decorative print layer is formed on an outer edge portion of the back surface of the transparent panel substrate via an anchor layer covering the back surface of the transparent panel substrate.   4. The laminate according to claim 2, wherein the planarizing resin layer has an infrared absorption amount of 4% to 30% at a wavelength of 1060 nm. 5.   The laminate according to claim 4, wherein the transparent conductive layer is made of a material containing silver nanowires or Cu nanowires. Form a decorative print layer on the outer edge of the back of the transparent panel substrate,
On the surface of the transparent panel substrate on which the decorative printing layer is formed, a planarizing resin layer having an infrared absorption function is formed so as to cover the region extending over the decorative printing layer and the transparent panel substrate,
A laminated body is formed by forming a transparent electrode layer having a wiring layer on the back surface of the planarizing resin layer,
A method for producing a laminate, wherein the wiring layer and the transparent electrode layer on the back surface of the decorative printed layer of the structure are patterned by laser processing using an infrared laser as a laser light source. A transparent panel substrate;
A decorative print layer formed on the outer edge of the back surface of the transparent panel substrate;
On the surface of the transparent panel substrate on which the decorative printing layer is formed, a planarizing resin layer having an infrared absorption function formed so as to cover the region extending over the decorative printing layer and the transparent panel substrate,
A transparent electrode layer formed on the back surface of the planarizing resin layer and having a wiring layer;
The capacitance touch panel in which the wiring layer and the transparent electrode layer on the back surface of the decorative printing layer are patterned by laser processing using an infrared laser.   The capacitive touch panel according to claim 7, wherein the decorative print layer is directly laminated on a back surface of the transparent panel substrate.   The capacitive touch panel according to claim 7, wherein the decorative printing layer is laminated via an anchor layer that covers a back surface of the transparent panel substrate.   10. The capacitive touch panel according to claim 8, wherein the planarizing resin layer has an infrared absorption amount of 4% to 30% at a wavelength of 1060 nm.   11. The capacitive touch panel according to claim 10, wherein the transparent conductive layer is made of a material containing silver nanowires or Cu nanowires. An image display device comprising a capacitive touch panel on the front of the display screen,
The capacitive touch panel has a transparent panel substrate, a decorative print layer formed on the outer edge of the back surface of the transparent panel substrate, and a surface on which the decorative print layer of the transparent panel substrate is formed. A planarizing resin layer having an infrared absorption function formed so as to cover the region extending over the decorative printing layer and the transparent panel substrate; a transparent electrode layer having a wiring layer formed on the back surface of the planarizing resin layer; An image display device comprising:   The image display device according to claim 12, wherein the decorative printing layer is directly formed on an outer edge portion of the back surface of the transparent panel substrate.   The image display device according to claim 12, wherein the decorative print layer is formed on an outer edge portion of the back surface of the transparent panel substrate via an anchor layer covering the back surface of the transparent panel substrate.   The image display device according to claim 13, wherein the planarizing resin layer has an infrared absorption amount of 4% to 30% at a wavelength of 1060 nm.   The image display device according to claim 15, wherein the transparent conductive layer is made of a material containing silver nanowires or Cu nanowires.

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