TW201532491A - Hot melting machine for multilayer printed circuit board - Google Patents
Hot melting machine for multilayer printed circuit board Download PDFInfo
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- TW201532491A TW201532491A TW104113695A TW104113695A TW201532491A TW 201532491 A TW201532491 A TW 201532491A TW 104113695 A TW104113695 A TW 104113695A TW 104113695 A TW104113695 A TW 104113695A TW 201532491 A TW201532491 A TW 201532491A
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- printed circuit
- circuit board
- power source
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- 238000002844 melting Methods 0.000 title abstract description 5
- 230000008018 melting Effects 0.000 title abstract description 5
- 239000012943 hotmelt Substances 0.000 claims abstract description 28
- 238000003466 welding Methods 0.000 claims description 91
- 230000007246 mechanism Effects 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims description 16
- 230000004927 fusion Effects 0.000 claims description 14
- 238000006073 displacement reaction Methods 0.000 claims description 5
- 238000013016 damping Methods 0.000 claims description 2
- 238000007526 fusion splicing Methods 0.000 claims 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000005674 electromagnetic induction Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- Lining Or Joining Of Plastics Or The Like (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
本發明係關於一種適用於多層印刷電路板壓合的熱熔機,尤指熱熔機的結構改變，使機體體積縮小，還能增進多層印刷電路板之熱熔壓合的作業效率。The invention relates to a hot melt machine suitable for press bonding of a multilayer printed circuit board, in particular to a structural change of the hot melt machine, which reduces the volume of the body, and can also improve the working efficiency of the hot melt press bonding of the multilayer printed circuit board.
按由,印刷電路板(Printed Circuit Board；PCB)作成三層以上之多層電路板，已是現今的趨勢，而PCB產品多會朝向高密度的薄板(HDI)或高層數(Multilayer)的型態而發展，因此各印刷電路板在壓合過程中，必須要求每一層的對位精度，因此印刷電路板的壓合技術，由以往鉚合的手段已發展至電磁感應式的熱熔機。其主要係將內層及膠片對位後放置於熱熔機的操作台上，以電磁感應方式改變磁通量來加熱，當膠片升溫達到設定温度即與內層緊密結合。According to the printed circuit board (PCB), more than three layers of multi-layer circuit boards have become the trend of today, and PCB products tend to be oriented toward high-density thin-film (HDI) or high-layer (Multilayer) types. However, in the process of pressing, each printed circuit board must require the alignment accuracy of each layer. Therefore, the pressing technology of the printed circuit board has been developed from the conventional riveting method to the electromagnetic induction type hot melt machine. The main purpose is to place the inner layer and the film on the operation table of the hot melt machine, and change the magnetic flux to heat by electromagnetic induction. When the temperature rises to the set temperature, the film is tightly combined with the inner layer.
適用於多層印刷電路板壓合的熱熔機，除了熱熔頭之外，機台的設計與以往的多層印刷電路板鉚合加工機一樣包含一用以固定印刷電路的固定機構、一用以運送印刷電路進出的定位機構、兩操作台、一作業區，其可如證書號Ｉ４３０７３０「多層印刷電路板之固定機構及其固定方法」發明專利案所示＜下稱：引證前案＞。A hot melt machine suitable for press-bonding a multi-layer printed circuit board. In addition to the hot melt head, the design of the machine includes a fixing mechanism for fixing the printed circuit, and a fixing mechanism for the conventional multilayer printed circuit board riveting machine. The positioning mechanism for transporting the printed circuit in and out, the two operating stations, and the working area can be as shown in the invention patent case of the certificate number I430730 "fixing mechanism of the multilayer printed circuit board and the fixing method thereof" (hereinafter referred to as: the pre-citation case).
引證前案顯示，機台為長形，兩端分別設為一操作台，兩操作台之中央為一作業區，每操作台各設置一定位機構，而其中該作業區設有第一、二壓著件；實施時，操作員將多層印刷電路板放置在一端的操作台上，藉由定位機構限制多層印刷電路板的側緣，以將多層印刷電路板定位於設定位置，定位完成後，即可將多層印刷電路板運輸至作業區，在此利用作業區的第一、二壓著件來彈性壓合多層印刷電路板，並於此進行熱熔與加壓壓合，多層印刷電路板壓合完成後，即運輸至另一端的操作台，即可取出成品。The pre-citation case shows that the machine is long and the two ends are respectively set as a console. The center of the two consoles is a work area. Each console is provided with a positioning mechanism, and the working area is provided with the first and second. Pressing member; in implementation, the operator places the multilayer printed circuit board on the operation table at one end, and the side edge of the multilayer printed circuit board is restricted by the positioning mechanism to position the multilayer printed circuit board at the set position, after the positioning is completed, The multi-layer printed circuit board can be transported to the working area, where the first and second pressing members of the working area are used to elastically press the multilayer printed circuit board, and the hot-melt and press-pressed are performed thereon, and the multilayer printed circuit board is pressed. After the pressing is completed, it is transported to the other end of the station, and the finished product can be taken out.
引證前案在作業區的兩側分別設有一操作台，讓印刷電路板單向推動，由一端操作台經由作業區而由另端的操作台輸出。因而造成整個機台的長度長，在現今地狹人稠的環境下，龐大體積的機台將會增加製造成本、空間安置成本，實乃不利提高產品競爭力。
In the pre-citation case, an operation console is respectively arranged on both sides of the work area, so that the printed circuit board is pushed in one direction, and is outputted by the other end console through the operation area from the one end operation table. As a result, the length of the entire machine is long. In today's narrow and dense environment, the huge volume of the machine will increase the manufacturing cost and space placement cost, which is unfavorable to improve product competitiveness.
本發明者鑑於前述的問題，進而用心研究開發，因此本發明主要目的係在提供一種多層印刷電路板之熱熔機，其主要係機體在較以往體積長度縮短的狀況下，透過上熔接部配置兩個下熔接部，讓上熔接部輪流左右移動以在對準定位於各下熔接部時，來對印刷電路板熱熔壓合作業，縮小熱熔機所佔空間體積，並且提昇量產效率。The inventors of the present invention have intensively researched and developed in view of the above problems, and therefore, the main object of the present invention is to provide a hot melt machine for a multilayer printed circuit board, which is mainly configured such that the body is disposed through the upper welded portion in a state where the volume is shortened compared to the prior art. The two lower welding portions allow the upper welding portion to move left and right in turn to collate the printed circuit board in a hot-pressing manner when positioning and positioning the lower welding portions, reduce the space occupied by the hot melt machine, and improve mass production efficiency. .
為了可達到前述的目的，本發明所運用的技術手段係在於提供一種多層印刷電路板之熱熔機，其係一機體包含一上熔接部、一第一下熔接部、一第二下熔接部，其中：
In order to achieve the foregoing objects, the technical means for the present invention is to provide a multi-layer printed circuit board hot melt machine, which is characterized in that a body comprises an upper welding portion, a first lower welding portion and a second lower welding portion. ,among them:
該機體於設定高度固定一呈水平的架體，該架體之的兩端分別設置該第一、二下熔接部，該架體之兩側各設置一滑軌，該第一、二下熔接部分別包含數個下熔接頭;The body is fixed to a horizontal frame body at a set height, and the first and second lower welding portions are respectively disposed at two ends of the frame body, and a sliding rail is disposed on each side of the frame body, and the first and second welding are performed The parts respectively comprise a plurality of lower fusion joints;
該上熔接部包含一框架、一熔接座、一固定機構、一動力源，該熔接座位於該框架上方，於該熔接座設置數上熔接頭以及該用以壓合印刷電路板之固定機構，該框架之下方兩相對側各設置一滑動件，供該滑動件滑設於該第一、二下熔接部兩側之滑軌，用以該上熔接部移動於該第一、二下熔接部，而該機體下方設置一動力源，該動力源輸出動力的輸出端連結固定於該上熔接部，供該動力源帶動該上熔接部來位移；藉以該上熔接部經由該動力源帶動位移，而能輪流暫停在該第一、二下熔接部以進行多層印刷電路板之壓合。The upper welding portion includes a frame, a welding seat, a fixing mechanism, and a power source. The welding seat is located above the frame, and the welding socket is provided with a plurality of welding joints and a fixing mechanism for pressing the printed circuit board. a sliding member is disposed on each of the opposite sides of the frame, and the sliding member is slidably disposed on the sliding rails on both sides of the first and second lower welding portions, and the upper welding portion is moved to the first and second lower welding portions. a power source is disposed under the body, and an output end of the power source output power is coupled and fixed to the upper welding portion, and the power source drives the upper welding portion to be displaced; thereby the upper welding portion drives the displacement via the power source. The first and second lower welds can be suspended in turn for the pressing of the multilayer printed circuit board.
所述該熔接座設置一輔助該主壓缸支持該熔接座之支撐組，該支撐組係包含一輔助壓缸、一抵塊、一定塊；該輔助壓缸固定於該承架角落以位於該主壓缸之上，該輔助壓缸設置之一缸軸固定一抵塊，該上熔接部之該框架位於該主壓缸之該缸軸之上，並且固定該呈Ｌ形的定塊；藉以該主壓缸調整洩壓時，驅動該輔助壓缸以推伸出該抵塊以移位至該定塊上，供該熔接座以該抵塊支撐於該上熔接之該框架。The welding seat is provided with a supporting group for supporting the welding cylinder to support the welding seat, the supporting group comprises an auxiliary pressure cylinder, a pressing block and a certain block; the auxiliary pressure cylinder is fixed at the corner of the bracket to be located at the support Above the master cylinder, one of the auxiliary cylinders is fixed to a cylinder block, the frame of the upper weld portion is located above the cylinder shaft of the master cylinder, and the L-shaped block is fixed; When the master cylinder adjusts the pressure relief, the auxiliary cylinder is driven to push the abutting block to be displaced to the block, and the welding seat is supported by the abutting block on the frame to be welded.
因此依據本發明的技術手段，本發明可以獲得的功效簡要說明如下所列：Therefore, in accordance with the technical means of the present invention, a brief description of the functions that can be obtained by the present invention is as follows:
１、本發明主要係機體兩端分別設置一第一、二下熔接部，機體上則設置一可左右線性移動的上熔接部，因此在機體長度較以往有效縮小的狀況下，透過上熔接部構成可移動式設計，因此左右位移，交替輪流定位於第一或第二下熔接部，來對印刷電路板進行熱熔壓合作業，因此機體長度縮短，體積縮小，大大提昇空間運用成本、輸送成本以及空間利用率。1. The present invention mainly provides a first and second lower welding portion at both ends of the body, and an upper welding portion that can be linearly moved left and right is arranged on the body, so that the upper welding portion is penetrated under the condition that the length of the body is effectively reduced. The utility model constitutes a movable design, so that the left and right displacements are alternately positioned in the first or second lower welding portion to perform hot melt pressing cooperation on the printed circuit board, so that the length of the body is shortened and the volume is reduced, thereby greatly improving the space operation cost and conveying. Cost and space utilization.
２、承前第１項所述優點，本發明之上熔接部設為可移動式，因此以一可動式的上熔接部，搭配兩個呈固定的第一、二下熔接部，是故上熔接部移動到第一下熔接部來進行印刷電路板熱熔壓合同時，第二下熔接部同時上料欲作業的印刷電路板，因此這段時間便同步進行「熱熔壓合作業」以及「上料定位作業」，故上熔接部完成第一下熔接部位置的印刷電路板，再移動到第二下熔接部時，便已經有上料好的印刷電路板立即作業，因此作業具有連續性，產能有效提高。2. According to the advantages mentioned in the first item, the welding portion of the present invention is made movable, so that a movable upper welding portion is matched with two first and second lower welding portions which are fixed, so that the welding is performed. When the part moves to the first lower welding part for the hot-melt contract of the printed circuit board, the second lower welding part simultaneously feeds the printed circuit board to be operated, so the "hot-melt pressure cooperation" and " The feeding positioning operation is completed. Therefore, when the upper welding portion completes the printed circuit board at the position of the first lower welding portion and then moves to the second lower welding portion, the printed circuit board that has been loaded is immediately operated, so the operation is continuous. The production capacity is effectively improved.
３、本發明在上熔接部設置一支撐組，由於上熔接部包含了一框架以及一熔接座，熔接座設有數上熔接頭，框架立設有主壓缸來支撐熔接座，使其位在框架之上方，為能在作業休息時間，讓主壓缸減緩支撐的氣壓動力，且為了避免上、下熱熔頭不小心之碰撞，以及增大熱熔頭維修、更換的空間，因此設計一支撐組，利用其輔助壓缸固定於承架角落以位於該主壓缸之上，輔助壓缸之缸軸固定一抵塊，框架則固定一定塊；藉以主壓缸調整洩壓時，驅動輔助壓缸，使其將抵塊推伸出去，以抵靠於定塊上面，讓熔接座藉抵塊來支撐，使主壓缸可洩壓緩解氣動壓力，增長機件的使用壽命。
3. The present invention provides a support group in the upper weld portion. Since the upper weld portion includes a frame and a weld seat, the weld seat is provided with a plurality of weld joints, and the frame is provided with a main pressure cylinder to support the weld seat, so that the weld seat is positioned Above the frame, in order to be able to slow down the supporting pneumatic power during the rest time of the work, and to avoid accidental collision of the upper and lower hot melt heads, and to increase the space for repair and replacement of the hot melt head, design one The support group is fixed on the corner of the bracket by the auxiliary pressure cylinder to be located above the main pressure cylinder, the cylinder shaft of the auxiliary pressure cylinder is fixed to a block, and the frame is fixed by a certain block; when the pressure relief is adjusted by the main pressure cylinder, the drive assist The cylinder is pressed to push the abutting block to abut against the block, so that the welding seat is supported by the block, so that the main pressure cylinder can relieve pressure and relieve the pneumatic pressure and increase the service life of the machine.
（１０）‧‧‧機體
（２０）‧‧‧第一下熔接部
（２０１）‧‧‧第二下熔接部
（２１）‧‧‧架體
（２２）‧‧‧下基板
（２３）‧‧‧下熔接頭
（２５）‧‧‧滑軌
（２６）‧‧‧托盤
（３０）‧‧‧上熔接部
（３１）‧‧‧框架
（３１１）‧‧‧底架
（３２）‧‧‧滑動件
（３３）‧‧‧熔接座
（３３１）‧‧‧承架
（３４）‧‧‧上熔接頭
（３５）‧‧‧動力源
（３５１）‧‧‧輸出端
（３６）‧‧‧固定機構
（３７）‧‧‧主壓缸
（３７１）‧‧‧缸軸
（４０）‧‧‧支撐組
（４１）‧‧‧輔助壓缸
（４１１）‧‧‧缸軸
（４２）‧‧‧抵塊
（４４）‧‧‧定塊
（５０）‧‧‧印刷電路板(10) ‧ ‧ body (20) ‧ ‧ first welded joint (201) ‧ ‧ second welded joint (21) ‧ ‧ frame (22) ‧ ‧ lower substrate (23) ‧ ‧ lower fusion joints (25) ‧ ‧ slats (26) ‧ ‧ pallets (30) ‧ ‧ upper welded joints (31) ‧ ‧ frame (311) ‧ ‧ chassis (32) ‧ ‧ sliding (33) ‧ ‧ weld joints (331) ‧ ‧ truss (34) ‧ ‧ upper weld joints (35) ‧ ‧ power source (351) ‧ ‧ output (36) ‧ ‧ fixed mechanism (37) ‧ ‧ main pressure cylinder (371) ‧ ‧ cylinder shaft (40) ‧ ‧ support group (41) ‧ ‧ auxiliary cylinder (411) ‧ ‧ cylinder shaft (42) ‧ ‧ (44) ‧ ‧ fixed block (50) ‧ ‧ printed circuit boards
第一圖係本發明較佳實施例之立體外觀圖。
第二圖係本發明較佳實施例之拆掉外殼的立體外觀示意圖，顯示上熔接部移動到第一下熔接部之處。
第三圖係本發明較佳實施例之熔接座與機體立體分解圖。
第四圖係本發明較佳實施例之拆掉外殼的立體外觀示意圖，顯示上熔接部移動到第二下熔接部之處。
第五圖係本發明較佳實施例之前視平面圖，顯示印刷電路板的熱熔壓合動作圖（一）。
第六圖係本發明較佳實施例之前視平面圖，顯示印刷電路板的熱熔壓合動作圖（二）。
第七圖係本發明較佳實施例之前視平面圖，顯示印刷電路板的熱熔壓合動作圖（三）。
第八圖係本發明較佳實施例之支撐組局部立體放大圖。
第九圖係本發明較佳實施例之支撐組動作後的局部立體放大圖。
The first drawing is a perspective view of a preferred embodiment of the present invention.
The second drawing is a schematic perspective view of the outer casing of the preferred embodiment of the present invention, showing the upper welded portion moving to the first lower welded portion.
The third figure is a perspective exploded view of the welded joint and the body of the preferred embodiment of the present invention.
The fourth figure is a schematic perspective view of the outer casing of the preferred embodiment of the present invention, showing the upper welded portion moving to the second lower welded portion.
The fifth drawing is a front plan view of a preferred embodiment of the present invention, showing a hot-melt pressing action diagram (1) of a printed circuit board.
Figure 6 is a front plan view of a preferred embodiment of the present invention showing a hot melt press action diagram (2) of a printed circuit board.
Figure 7 is a front plan view of a preferred embodiment of the present invention showing a hot melt pressing action diagram (3) of a printed circuit board.
Figure 8 is a partially enlarged perspective view of a support set of a preferred embodiment of the present invention.
The ninth drawing is a partial enlarged view of the support group after the action of the preferred embodiment of the present invention.
本發明係一種多層印刷電路板之熱熔機，請參看第一、二圖所示，其係一機體（１０）於兩端分別設置一第一下熔接部（２０）、一與該第一下熔接部（２０）相鄰之第二下熔部（２０１），以及於機體（１０）上設置一可左右位移於該第一、二下熔接部（２０）（２０１）之上熔接部（３０）。The present invention is a hot melt machine for a multilayer printed circuit board. Referring to the first and second figures, a body (10) is provided with a first lower welding portion (20), a first and a first portion respectively. a second lower melting portion (201) adjacent to the lower welding portion (20), and a welding portion (10) disposed on the body (10) for laterally displaceable on the first and second lower welding portions (20) (201) ( 30).
請再參看第二、三圖所示，第一、二下熔接部（２０）（２０１）的型態相同，其中於機體（１０）適當高度固定一呈水平的架體（２１），架體（２１）上鋪設一下基板（２２），下基板（２２）的兩端分別設置該第一、二下熔接部（２０）（２０１），第一、二下熔接部（２０）（２０１）係分別包含數個呈下熔接頭（２３），下熔接頭（２３）比如有八個，兩側各設有四個，位在下熔接頭（２３）之間的中央區域，係於各第一、二下熔接部（２０）（２０１）之下基板（２２）上，設置一供印刷電路板承置的定位機構（２６）；Referring to the second and third figures, the first and second lower welding portions (20) (201) are of the same type, wherein a horizontal frame body (21) is fixed at an appropriate height of the body (10). (21) laying the substrate (22), the first and second lower welding portions (20) (201) are respectively disposed at two ends of the lower substrate (22), and the first and second lower welding portions (20) (201) are respectively Each of the first fusion joints (23), the lower fusion joints (23), for example, eight, four on each side, located in the central region between the lower fusion joints (23), is the first, a lower positioning portion (20) (201) under the substrate (22), is provided with a positioning mechanism (26) for the printed circuit board;
該上熔接部（３０）如第三、五圖所示，其包含一框架（３１）、一熔接座（３３）、一固定機構（３６）、一動力源（３５）、一輔助壓缸（４０）；其中該框架（３１）的水平範圍係容許覆蓋該第一下熔接部（２０）＜第二下熔接部（２０１）亦同＞的面積，框架（３１）之下方兩相對側各設置一滑動件（３２），以藉滑動件（３２）滑設於第一、二下熔接部（２０）（２０１）兩側之滑軌（２５），讓上熔接部（３０）移動於第一、二下熔接部（２０）（２０１），而為驅動上熔接部（３０）移動，機體（１０）下方設置一動力源（３５），動力源（３５）可為壓缸，動力源（３５）用以輸出動力的輸出端（３５１），其係連結固定於一底架（３１１），該底架（３１１）係由框架（３１）底部往下延伸至第一、二下熔接部（２０）（２０１）下方，以便動力源（３５）帶動上熔接部（３０）左右位移；以及The upper welding portion (30), as shown in the third and fifth figures, comprises a frame (31), a welding seat (33), a fixing mechanism (36), a power source (35), and an auxiliary pressure cylinder ( 40); wherein the horizontal extent of the frame (31) is allowed to cover the area of the first lower weld portion (20) <the second lower weld portion (201), and the opposite sides of the frame (31) are respectively disposed a sliding member (32) is slidably disposed on the sliding rails (25) on both sides of the first and second lower welding portions (20) (201) by the sliding member (32), and the upper welding portion (30) is moved to the first The second welding part (20) (201) moves to drive the upper welding part (30), and a power source (35) is disposed under the body (10). The power source (35) can be a pressure cylinder and a power source (35). An output end (351) for outputting power is fixedly coupled to a chassis (311) extending downward from the bottom of the frame (31) to the first and second lower welding portions (20) ) 01) below so that the power source (35) driven by the left and right welded portions (30) displacement; and
該熔接座（３３）如第三、五圖所示，其係位於上熔接部（３０）的框架（３１）上方，熔接座（３３）包含一矩形框的承架（３３１），以及上熔接頭（３４）、一支撐組（４０）；其中，承架（３３１）底側面對應下熔接頭（２３），各設置一可上下伸縮位移的上熔接頭（３４），並且熔接座（３３）底側中央設置一可上下位移的固定機構（３６），用以對印刷電路板（５０）進行下降壓合以及上移退出的作用，而熔接座（３３）為結合於框架（３１），於框架（３１）四個角落各固定一主壓缸（３７），主壓缸（３７）之缸軸（３７１）連結於承架（３３１）底側；The welding seat (33) is located above the frame (31) of the upper welding portion (30) as shown in the third and fifth figures, the welding seat (33) comprises a frame (331) of a rectangular frame, and the upper welding a head (34) and a support group (40); wherein the bottom side of the frame (331) corresponds to the lower fusion joint (23), each of which is provided with an upper fusion joint (34) capable of up-and-down displacement, and the fusion joint (33) A fixing mechanism (36) for vertically disposing is disposed at the center of the bottom side for performing the function of lowering and pressing the printed circuit board (50), and the welding seat (33) is coupled to the frame (31). A master cylinder (37) is fixed to each of the four corners of the frame (31), and a cylinder shaft (371) of the master cylinder (37) is coupled to the bottom side of the bracket (331);
另外，該支撐組（４０）如第五、八圖所示，其係包含一呈水平的輔助壓缸（４１）、一抵塊（４２）、一定塊（４４）；該輔助壓缸（４１）固定於承架（３３１）角落以位於主壓缸（３７）之上，輔助壓缸（４１）之缸軸（４１１）係固定一抵塊（４２），上熔接部（３０）之框架（３１）位於主壓缸（３７）之缸軸（３７１）之上，係固定該呈Ｌ形的定塊（４４）；藉以主壓缸（３７）調整熔接座（３３）在一設定高度即停止伸縮以便支撐，而若是加工作業的休息時間，為使主壓缸（３７）可減少氣壓動力來支撐熔接座（３３）的工作時間，如第八、九圖所示，驅動輔助壓缸（４１），使其伸出缸軸（４１１）帶動抵塊（４２）來移位至定塊（４４）的水平面上，藉以熔接座（３３）利用抵塊（４２）支撐於框架（３１），即可避免熔接座（３３）降落，故此時便能減少空氣動力輸出給主壓缸（３７），加長主壓缸（３７）的使用壽命以及減少空氣動力之損耗；反之，回復作業狀態，即輸出空氣動力給主壓缸（３７），退出輔助壓缸（４１）的缸軸（４１１）於定塊（４４）之外，重新讓主壓缸（３７）來支撐熔接座（３３）。In addition, as shown in the fifth and eighth figures, the support group (40) includes a horizontal auxiliary pressure cylinder (41), a damping block (42), and a fixed block (44); the auxiliary pressure cylinder (41) Fixed to the corner of the frame (331) to be located above the master cylinder (37), the cylinder shaft (411) of the auxiliary cylinder (41) is fixed to a block (42), and the frame of the upper weld (30) ( 31) Located above the cylinder shaft (371) of the master cylinder (37), the L-shaped block (44) is fixed; by means of the master cylinder (37), the weld seat (33) is stopped at a set height. Telescopic for support, and if the rest time of the machining operation, the main cylinder (37) can reduce the pneumatic power to support the working time of the welding seat (33), as shown in the eighth and ninth drawings, drive the auxiliary cylinder (41) ), extending the cylinder shaft (411) to drive the resisting block (42) to shift to the horizontal surface of the fixed block (44), whereby the welded seat (33) is supported by the frame (31) by the resisting block (42), ie Can avoid melting The seat (33) is lowered, so that the aerodynamic output can be reduced to the main pressure cylinder (37), the service life of the main pressure cylinder (37) is extended, and the loss of aerodynamic force is reduced; otherwise, the operation state is returned, that is, the output of the aerodynamic force is given. The master cylinder (37) exits the cylinder shaft (411) of the auxiliary cylinder (41) outside the block (44), and re-engages the master cylinder (37) to support the weld seat (33).
本發明使用實施時，請參看第二、五、六圖所示，印刷電路板（５０）位於第一下熔接部（２０），而可活動的上熔接部（３０）位於第一下熔接部（２０）上面時，停止暫留於第一下熔接部（２０）上定位機構（２６）之印刷電路板（５０），先透過固定機構（３６）往下移動以壓貼於印刷電路板（５０）上，其次，如第六、七圖所示，各個上熔接部（３０）朝印刷電路板（５０）向下移動，並且與下熔接頭（２３）一起加壓、加熱，使印刷電路板（５０）因此壓合成多層印刷電路板。When the invention is used, please refer to the second, fifth and sixth figures, the printed circuit board (50) is located at the first lower welding portion (20), and the movable upper welding portion (30) is located at the first lower welding portion. (20) When the upper surface is stopped, the printed circuit board (50) temporarily suspended on the positioning mechanism (26) of the first lower welding portion (20) is stopped by first moving downward through the fixing mechanism (36) to be pressed against the printed circuit board ( 50) above, secondly, as shown in the sixth and seventh figures, each upper welded portion (30) moves downward toward the printed circuit board (50), and is pressurized and heated together with the lower fusion joint (23) to make the printed circuit The board (50) is thus pressed into a multilayer printed circuit board.
本發明之特色如第二、四圖所示，當上熔接部（３０）位於第一下熔接部（２０）進行熱熔壓合的加工的作業時，第二下熔接部（２０１）同步在其定位機構（２６）來承置另一塊印刷電路板（５０），讓第二下熔接部（２０１）的印刷電路板（５０）等待上熔接部（３０）來作業；其次，上熔接部（３０）完成第一下熔接部（２０）位置的印刷電路板（５０）之熱熔壓合作業，即啟動動力源（３５）以帶動上熔接部（３０），配合滑動件（３２）引導上熔接部（３０）沿滑軌（２５）線性移動，讓上熔接部（３０）準備地移動到第二下熔接部（２０１），來對位於第二下熔接部（２０１）的印刷電路板（５０），進行下一波的熱熔壓合作業，而在第二下熔接部（２０１）作業時，第一下熔接部（２０）上已壓合完成的多層印刷電路板則移動並且脫離以進入下一個加工流程。如此一來，可活動的上熔接部（３０）便在第一、二下熔接部（２０）（２０１）兩端輪流來回作業，因此整個機體（１０）的體積長度可以較之前顯著縮小，有效地提昇作業效率。The features of the present invention are as shown in the second and fourth figures. When the upper weld portion (30) is located in the first lower weld portion (20) for the hot melt press working, the second lower weld portion (201) is synchronized. The positioning mechanism (26) carries another printed circuit board (50), so that the printed circuit board (50) of the second lower soldering portion (201) waits for the upper soldering portion (30) to operate; secondly, the upper soldering portion ( 30) completing the hot-melt pressing cooperation of the printed circuit board (50) at the position of the first lower welding portion (20), that is, starting the power source (35) to drive the upper welding portion (30), and guiding the sliding member (32) The welded portion (30) linearly moves along the slide rail (25), and the upper welded portion (30) is prepared to move to the second lower welded portion (201) to face the printed circuit board located at the second lower welded portion (201) ( 50), performing the next wave of hot melt pressing cooperation, and when the second lower welding portion (201) is operated, the laminated printed circuit board on which the first lower welded portion (20) is pressed is moved. And from entering a machining process to the next. In this way, the movable upper welding portion (30) rotates back and forth between the first and second lower welding portions (20) (201), so that the volume length of the entire body (10) can be significantly reduced compared with the previous one, and the effective Improve the efficiency of the work.
上述實施例僅為例示性說明本發明之技術及其功效，而非用於限制本發明。任何熟於此項技術人士均可在不違背本發明之技術原理及精神的情況下，對上述實施例進行修改及變化，因此本發明之權利保護範圍應如後所述之申請專利範圍所列。
The above embodiments are merely illustrative of the technology of the present invention and its effects, and are not intended to limit the present invention. Any person skilled in the art can modify and change the above embodiments without departing from the technical spirit and spirit of the present invention. Therefore, the scope of protection of the present invention should be as listed in the patent application scope mentioned later. .
(10)‧‧‧機體 (10) ‧ ‧ body
(20)‧‧‧第一下熔接部 (20)‧‧‧First welding joint
(201)‧‧‧第二下熔接部 (201)‧‧‧Second welding joint
(21)‧‧‧架體 (21) ‧ ‧ ‧ frame
(22)‧‧‧下基板 (22)‧‧‧ Lower substrate
(23)‧‧‧下熔接頭 (23) ‧‧‧ under the fusion joint
(25)‧‧‧滑軌 (25)‧‧‧Slide rails
(26)‧‧‧定位機構 (26)‧‧‧ Positioning agencies
(30)‧‧‧上熔接部 (30) ‧ ‧ upper weld
(31)‧‧‧框架 (31) ‧‧‧Framework
(32)‧‧‧滑動件 (32)‧‧‧Sliding parts
(33)‧‧‧熔接座 (33)‧‧‧welding seat
(34)‧‧‧上熔接頭 (34) ‧‧‧Upper joint
(40)‧‧‧支撐組 (40) ‧‧‧Support group
(50)‧‧‧印刷電路板 (50)‧‧‧Printed circuit boards
Claims (4)
該機體於設定高度固定一呈水平的架體，該架體之的兩端分別設置該第一、二下熔接部，該架體之兩側各設置一滑軌，該第一、二下熔接部分別包含數個下熔接頭;
該上熔接部包含一框架、一熔接座、一固定機構、一動力源，該熔接座位於該框架上方，於該熔接座設置數上熔接頭以及該用以壓合印刷電路板之固定機構，該框架之下方兩相對側各設置一滑動件，供該滑動件滑設於該第一、二下熔接部兩側之滑軌，用以該上熔接部移動於該第一、二下熔接部，而該機體下方設置一動力源，該動力源輸出動力的輸出端連結固定於該上熔接部，供該動力源帶動該上熔接部來位移；藉以該上熔接部經由該動力源帶動位移，而能輪流暫停在該第一、二下熔接部以進行多層印刷電路板之壓合。A hot melt machine for a multilayer printed circuit board, comprising: an upper welding portion, a first lower welding portion and a second lower welding portion, wherein:
The body is fixed to a horizontal frame body at a set height, and the first and second lower welding portions are respectively disposed at two ends of the frame body, and a sliding rail is disposed on each side of the frame body, and the first and second welding are performed The parts respectively comprise a plurality of lower fusion joints;
The upper welding portion includes a frame, a welding seat, a fixing mechanism, and a power source. The welding seat is located above the frame, and the welding socket is provided with a plurality of welding joints and a fixing mechanism for pressing the printed circuit board. a sliding member is disposed on each of the opposite sides of the frame, and the sliding member is slidably disposed on the sliding rails on both sides of the first and second lower welding portions, and the upper welding portion is moved to the first and second lower welding portions. a power source is disposed under the body, and an output end of the power source output power is coupled and fixed to the upper welding portion, and the power source drives the upper welding portion to be displaced; thereby the upper welding portion drives the displacement via the power source. The first and second lower welds can be suspended in turn for the pressing of the multilayer printed circuit board.
The hot-melt machine of the multi-layer printed circuit board of claim 3, wherein the fusion splicing seat is provided with a supporting group for assisting the main pressure cylinder to support the welding pedestal, the supporting group comprises an auxiliary pressure cylinder and a damping block The auxiliary cylinder is fixed on the corner of the bracket to be located above the master cylinder, and one of the cylinders of the auxiliary cylinder is fixed to abutment block, and the frame of the upper weld is located in the master cylinder Above the cylinder shaft, and fixing the L-shaped fixed block; when the main pressure cylinder adjusts the pressure relief, the auxiliary pressure cylinder is driven to push the abutting block to shift to the fixed block for the welding The seat is supported by the abutting block on the frame to which the upper portion is welded.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104113695A TW201532491A (en) | 2015-04-29 | 2015-04-29 | Hot melting machine for multilayer printed circuit board |
| CN201510259018.8A CN106211635A (en) | 2015-04-29 | 2015-05-20 | Hot melting machine for multilayer printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104113695A TW201532491A (en) | 2015-04-29 | 2015-04-29 | Hot melting machine for multilayer printed circuit board |
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| TW201532491A true TW201532491A (en) | 2015-08-16 |
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| CN105081631A (en) * | 2015-09-28 | 2015-11-25 | 苏州汉腾自动化设备有限公司 | Hot-melting machining method |
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| CN1290690C (en) * | 2004-02-23 | 2006-12-20 | 吉林大学 | Regulatable hydraulic machine with up and down both double moving |
| JP5962065B2 (en) * | 2012-02-29 | 2016-08-03 | 株式会社Ihi | Conveying device and transfer press device |
| TWM444281U (en) * | 2012-08-13 | 2013-01-01 | Tso Ta Tailor Machine Co Ltd | Improved-type hot stamping machine |
| CN203393015U (en) * | 2013-08-15 | 2014-01-15 | 福建省万达汽车玻璃工业有限公司 | Mold lifting device |
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| CN105081631A (en) * | 2015-09-28 | 2015-11-25 | 苏州汉腾自动化设备有限公司 | Hot-melting machining method |
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