TW201512067A - Method and device of feeding buffering - Google Patents
Method and device of feeding buffering Download PDFInfo
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- TW201512067A TW201512067A TW102133412A TW102133412A TW201512067A TW 201512067 A TW201512067 A TW 201512067A TW 102133412 A TW102133412 A TW 102133412A TW 102133412 A TW102133412 A TW 102133412A TW 201512067 A TW201512067 A TW 201512067A
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- 230000003139 buffering effect Effects 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000013022 venting Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 4
- 230000006837 decompression Effects 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 claims description 2
- 230000007547 defect Effects 0.000 claims 1
- 230000005484 gravity Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- 229920001296 polysiloxane Polymers 0.000 description 1
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Abstract
Description
本發明係有關於一種緩衝方法及裝置,尤指一種將量測且分類完成之電子元件,在以氣體輸送至收集盒過程中減緩輸送速度,並防止電子元件直接墜落收集盒底部導致損壞之落料緩衝方法及裝置。 The invention relates to a buffering method and device, in particular to an electronic component which is measured and classified, which slows down the conveying speed during the process of conveying the gas to the collecting box, and prevents the electronic component from falling directly to the bottom of the collecting box and causing damage. Material buffering method and device.
按,一般例如LED之電子元件,由於製成品之電性及光譜特性複雜且量大,因此通常需要透過量測及分選的製程,以將不同電性或光譜特性的電子元件經由分選加以分類及依等級分別收集,其相關製程如專利號第M359374號「電子元件測試分選機」、公開號第201014771號「晶片測試機之分類裝置」,其通常係在轉盤上形成數個等間距之鏤空缺槽,並在轉盤上方設有多站之工作站,其中包括如極性反轉、電性量測、光學檢測…等之工作站,以對應由震動送料機經輸送槽道送入轉盤缺槽,並被間歇性循環流路傳送的電子元件,可逐一被調整方向或進行量測;而完成量測的電子元件則經由轉盤之缺槽,以氣壓排出經導管引導至一分配器進行分配至連結不同收集盒之預定管路,以使電子元件可在氣壓輸送推移下落入預定之收集盒被收集。 Generally, electronic components such as LEDs, because of the complex and large amount of electrical and spectral characteristics of the finished product, generally require a process of measurement and sorting to separate electronic components of different electrical or spectral characteristics by sorting. Classification and collection according to the level, the related processes such as Patent No. M359374 "Electronic Component Test Sorting Machine", Publication No. 201014771 "Classification Device for Wafer Testing Machine", which usually form several equal intervals on the turntable After that, there is a vacant slot, and there are multiple stations on the top of the turntable, including workstations such as polarity reversal, electrical measurement, optical detection, etc., corresponding to the vibrating feeder feeding into the turntable through the transport channel. And the electronic components transmitted by the intermittent circulation flow path can be adjusted direction or measured one by one; and the electronic components that complete the measurement are guided to the dispenser through the air outlet through the slot of the turntable to be distributed to the dispenser. The predetermined piping of the different collection boxes is connected so that the electronic components can be collected by dropping into the predetermined collection box at the air pressure.
然而,在電子元件經由氣體壓力輸送至收集盒過程中,為了提升效率,通常使用高壓氣體以提升氣體推動電子元件 在導管內之移動速度,導致電子元件在進入收集盒時,仍帶有一定之速度,加上為了使分選的類別增加,各收集盒通常採多數密集排列且截面積小但高度大的方式設計,在電子元件墜落時之地心引力加乘效果,使直接在高處墜落收集盒底部之電子元件容易產生損壞。 However, in order to improve efficiency during the delivery of electronic components to the collection box via gas pressure, high-pressure gas is usually used to lift the gas to push the electronic components. The speed of movement within the catheter causes the electronic components to still have a certain speed when entering the collection box, and in order to increase the sorting category, each collection box is usually in a manner that is densely arranged and has a small cross-sectional area but a high height. The design, the gravity attraction effect when the electronic components fall, makes the electronic components falling directly at the bottom of the collection box directly at high places susceptible to damage.
爰是,本發明之目的,在於提供一種可防止電子元件直接墜落收集盒底部而產生損壞之落料緩衝方法。 Accordingly, it is an object of the present invention to provide a blanking buffering method which can prevent the electronic component from falling directly to the bottom of the collecting box and causing damage.
本發明之另一目的,在於提供一種在以氣體輸送電子元件的導管至收集盒間,可減緩電子元件進入收集盒之速度並防止電子元件直接墜落收集盒底部產生損壞之落料緩衝裝置。 Another object of the present invention is to provide a blanking buffer device which can reduce the speed at which electronic components enter the collecting box and prevent the electronic components from falling directly to the bottom of the collecting box, between the conduit for transporting the electronic components by gas to the collecting box.
本發明又一目的,在於提供一種在收集盒上防止電子元件直接墜落底部產生損壞之落料緩衝裝置。 Another object of the present invention is to provide a blanking buffer device for preventing damage to an electronic component directly falling from the bottom of the collecting box.
依據本發明目的之落料緩衝方法,包括:提供一輸送流路,形成在電子元件被進行輸送的導管至收集盒間,在該輸送流路中通有氣體進行對電子元件推送;提供一緩衝件,樞設於該輸送流路中,其可作樞轉改變緩衝件之緩衝面與輸送流路傾斜角度;藉以上方法,使電子元件落入收集盒收集時,可落抵緩衝件之緩衝面獲得緩衝,而在收集盒將電子元件倒出時可順利排出者。 The blanking buffering method according to the object of the present invention comprises: providing a conveying flow path formed between a conduit through which an electronic component is conveyed to a collecting box, in which a gas is introduced to push the electronic component; and a buffer is provided; The device is pivotally disposed in the conveying flow path, and can pivotally change the buffering surface of the buffering member and the inclination angle of the conveying flow path; by the above method, when the electronic component falls into the collecting box for collecting, it can fall into the cushioning of the buffering member The surface is cushioned and can be smoothly discharged when the collection box is poured out of the electronic components.
依據本發明另一目的之落料緩衝裝置,用以引導電子元件落入收集,並在落入時獲得緩衝,包括:一導管,內部可供電子元件移動通過,並通有氣體;一導料件,與所述導管連結並設有可將氣體逸散洩放之排氣孔;一收集盒,設有一開口與所述導料件相通,收集盒內部近開口處設有一緩衝件,其朝開口方 向上表面之一側形成一緩衝面,緩衝件可作樞轉改變其上緩衝面傾斜角度。 The blanking buffer device according to another object of the present invention is for guiding the electronic component to fall into the collection and obtaining the buffer when falling, comprising: a conduit for allowing the electronic component to move through and having a gas; a guiding material And a venting hole connected to the conduit and venting the gas; a collecting box having an opening communicating with the guiding member, and a buffer member disposed at a near opening of the collecting box, Open side A buffer surface is formed on one side of the upper surface, and the cushioning member is pivotable to change the inclination angle of the upper buffer surface.
依據本發明又一目的之落料緩衝裝置,用以引導電子元件落入收集,並在落入時獲得緩衝,包括:一收集盒,設有一開口;一緩衝件,設於所述收集盒內部近開口處,緩衝件朝開口方向上表面之一側形成一緩衝面,緩衝件可作樞轉改變其上緩衝面傾斜角度。 According to still another object of the present invention, a blanking buffer device for guiding an electronic component to fall into a collection and obtaining a cushion when falling therein comprises: a collecting box having an opening; and a buffering member disposed inside the collecting box Near the opening, the cushioning member forms a buffering surface on one side of the upper surface in the opening direction, and the cushioning member can pivot to change the inclination angle of the upper buffer surface.
本發明實施例所提供之方法及裝置,使電子元件在進入第二輸送流路時,因推動電子元件移動之氣體由排氣孔逸散而獲得一第一緩衝速度,並在第二輸送流路中設置緩衝件,使電子元件在墜落收集盒底部前,會先受到緩衝件之緩衝面阻擋,再一次獲得更緩的第二緩衝速度以減緩電子元件墜落速度墜落收集盒底部,防止電子元件直接墜落收集盒底部發生損壞之情形;且在將電子元件由收集盒傾倒取出時,緩衝件可因第一緩衝面面積較大而因重力作用作自由的樞轉改變位置,使電子元件可以順利被倒出。 The method and device provided by the embodiments of the present invention enable the electronic component to obtain a first buffering speed when the electronic component moves by the exhaust hole when entering the second conveying flow path, and the second conveying flow is obtained in the second conveying flow. The buffer is arranged in the road so that the electronic components are blocked by the buffer surface of the buffer before falling to the bottom of the collecting box, and a second buffering speed is obtained again to slow down the falling speed of the electronic component and fall to the bottom of the collecting box to prevent electronic components. The damage occurs directly at the bottom of the collection box; and when the electronic component is dumped from the collection box, the buffer member can be freely pivoted to change position due to the large area of the first buffer surface, so that the electronic component can be smoothly Was poured out.
1‧‧‧收集盒 1‧‧‧ collection box
11‧‧‧開口 11‧‧‧ openings
12‧‧‧壁面 12‧‧‧ wall
121‧‧‧第一壁面 121‧‧‧First wall
122‧‧‧第二壁面 122‧‧‧ second wall
123‧‧‧第三壁面 123‧‧‧ third wall
124‧‧‧第四壁面 124‧‧‧Fourth wall
125‧‧‧樞孔 125‧‧‧ pivot hole
13‧‧‧落入口 13‧‧‧Land entrance
2‧‧‧導料件 2‧‧‧Guide parts
21‧‧‧排氣孔 21‧‧‧ venting holes
3‧‧‧載架 3‧‧‧ Carrier
4‧‧‧載台 4‧‧‧ stage
41‧‧‧通孔 41‧‧‧through hole
42‧‧‧嵌扣部 42‧‧‧Inlay
43‧‧‧凹室 43‧‧ ‧ alcove
44‧‧‧扣環 44‧‧‧ buckle
45‧‧‧扣槽 45‧‧‧ buckle groove
5‧‧‧緩衝件 5‧‧‧ cushioning parts
51‧‧‧樞軸 51‧‧‧ pivot
52‧‧‧緩衝面 52‧‧‧ buffer surface
521‧‧‧第一緩衝面 521‧‧‧First buffer surface
522‧‧‧第二緩衝面 522‧‧‧second buffer surface
53‧‧‧擋抵件 53‧‧‧Parts
6‧‧‧導管 6‧‧‧ catheter
A‧‧‧輸送流路 A‧‧‧Transport flow path
A1‧‧‧第一輸送流路 A1‧‧‧First conveying flow path
A2‧‧‧第二輸送流路 A2‧‧‧Second transport flow path
L‧‧‧軸線 L‧‧‧ axis
W‧‧‧電子元件 W‧‧‧Electronic components
第一圖係本發明實施例中多數導料件與多數收集盒之組設關係示意圖。 The first figure is a schematic diagram showing the relationship between a plurality of guide members and a plurality of collection boxes in the embodiment of the present invention.
第二圖係本發明實施例中收集盒之立體分解圖。 The second figure is an exploded perspective view of the collection box in the embodiment of the present invention.
第三圖係本發明實施例中收集盒之剖面示意圖。 The third figure is a schematic cross-sectional view of the collection box in the embodiment of the present invention.
第四圖係本發明實施例中導料件組設於載台上之立體示意圖。 The fourth figure is a three-dimensional schematic view of the guide members assembled on the stage in the embodiment of the present invention.
第五圖係本發明實施例中導料件組設於載台上之剖面示意圖。 The fifth figure is a schematic cross-sectional view of a guide member assembled on a stage in the embodiment of the present invention.
第六圖係本發明實施例中電子元件在輸送流路內之作動示意圖。 The sixth figure is a schematic diagram of the operation of the electronic component in the transport flow path in the embodiment of the present invention.
第七圖係本發明實施例中從收集盒倒出電子元件之示意圖。 The seventh figure is a schematic view of the electronic component being ejected from the collection box in the embodiment of the present invention.
請參閱第一圖所示,本發明之元件落料緩衝方法茲以如下裝置為實施例作說明,該裝置為一使用在電子元件分選機中的落料收集裝置,其中包括:多數個收集盒1與多數個導料件2;該多數個收集盒1以矩陣方式排列於一載架3中;該多個導料件2各為管狀體而共同以矩陣方式排列於一載台4上,各導料件2分別各對應一收集盒1,並各位於所對應收集盒1之相對上方。 Referring to the first figure, the component blanking buffering method of the present invention is described by way of an apparatus which is a blanking collection device used in an electronic component sorting machine, including: a plurality of collections. a box 1 and a plurality of guiding members 2; the plurality of collecting boxes 1 are arranged in a matrix in a carrier 3; the plurality of guiding members 2 are each a tubular body and are arranged in a matrix on a loading table 4 Each of the guiding members 2 respectively corresponds to a collecting box 1 and is located above the corresponding collecting box 1 respectively.
請參閱第二圖與第三圖所示,該收集盒1內設有一緩衝件5,該緩衝件5設於近收集盒1開口11處,其並由矽膠或橡膠…等軟撓性材料所製成,其兩端各設有一樞軸51,該收集盒1開口11周緣下方形成四個相互對稱之壁面12,在其中一對相互平行的第一、二壁面121、122上各開設有樞孔125供二樞軸51樞設,使緩衝件5可相對於收集盒1轉動;緩衝件5朝開口11方向上表面之一側形成一緩衝面52,該緩衝面52以樞軸51之軸線L作為分隔線,區分為面積不同朝與設樞孔125之壁面121、122垂直之第三壁面123方向伸設之第一緩衝面521,與朝與設樞孔125之壁面121、122垂直之第四壁面124方向伸設之第二緩衝面522,其中,第一緩衝面521之面積較第二緩衝面522大,並在相對緩衝件5上表面側緩衝面52之另一下表面側,自軸線L處反向延伸凸出一與緩衝面52約略垂直之擋抵件53;所述樞孔125設置偏靠第二緩衝面522朝向之第四壁面124,並使所述擋抵件53之長度大於樞孔125至第四壁面124之間距, 及使第二緩衝面522之長度較樞軸51至第四壁面124之間距為小,故所述緩衝件5在第一緩衝面521較第二緩衝面522面積大之重力影響下將產生一角度之傾斜,而使第一緩衝面521低於第二緩衝面522,並藉使擋抵件53卡抵於該第四壁面124,而保持此定位之常態;而第一緩衝面522末端則與其所朝向之第三壁面123間保留一間距而形成一落入口13。 Referring to the second and third figures, the collecting box 1 is provided with a cushioning member 5, which is disposed at the opening 11 of the near collecting box 1, and is made of soft flexible material such as silicone or rubber. The two sides of the opening 11 of the collecting box 1 are formed with four mutually symmetric wall faces 12, and a pair of mutually parallel first and second wall faces 121 and 122 are respectively provided with pivots. The hole 125 is pivoted by the two pivots 51 so that the cushioning member 5 can be rotated relative to the collecting box 1; the cushioning member 5 forms a buffering surface 52 on one side of the upper surface in the direction of the opening 11, the buffering surface 52 being the axis of the pivot 51 As a dividing line, L is divided into a first buffering surface 521 which is different in area from the third wall surface 123 perpendicular to the wall surfaces 121 and 122 of the pivot hole 125, and is perpendicular to the wall surfaces 121 and 122 of the pivot hole 125. a second buffer surface 522 extending in the direction of the fourth wall surface 124, wherein the first buffer surface 521 is larger than the second buffer surface 522, and on the other lower surface side of the upper surface side buffer surface 52 of the buffer member 5, The axis L is oppositely extended to protrude from a blocking member 53 which is approximately perpendicular to the buffer surface 52; the pivot hole 125 is disposed Against the second buffer surface toward the fourth wall 124 522, and the stopper 53 is greater than the length of the contact member 125 to the fourth wall surface of the pivot hole 124 of the pitch, And the length of the second buffer surface 522 is smaller than the distance between the pivot 51 and the fourth wall 124. Therefore, the buffer member 5 will generate a gravity under the influence of the gravity of the first buffer surface 521 and the second buffer surface 522. The angle of the angle is such that the first buffer surface 521 is lower than the second buffer surface 522, and the retaining member 53 is locked against the fourth wall surface 124 to maintain the normal state of the positioning; and the end of the first buffer surface 522 is A drop inlet 13 is formed with a space remaining between the third wall 123 facing it.
請參閱第四、五、六圖,該導料件2一端被固定於載台4,另一端與導管6連結,導料件2之管狀體周緣設有數個排氣孔21;該導料件2設於載台4之通孔41中,其端部設有一環設之凸緣狀嵌扣部42,其嵌扣於載台4通孔41底端之環狀凹室43中,另設有一扣環44緊扣載台4上方之導料件2周緣一環狀凹設扣槽45處,使導料件2固定於載台4上。 Referring to the fourth, fifth and sixth figures, one end of the guiding member 2 is fixed on the loading platform 4, and the other end is connected with the conduit 6. The circumference of the tubular body of the guiding member 2 is provided with a plurality of venting holes 21; the guiding member 2 is disposed in the through hole 41 of the stage 4, and has an annular flange-shaped fastening portion 42 at the end thereof, which is embedded in the annular recess 43 at the bottom end of the through hole 41 of the stage 4, and is additionally provided. A buckle ring 44 is fastened to the periphery of the guide member 2 above the loading platform 4 at an annular recessed buckle groove 45 to fix the guide member 2 to the carrier 4.
請參閱第六圖所示,電子元件W被進行輸送於內部可供電子元件W移動通過並通有氣體的導管6至收集盒1間的輸送流路A,包括導料件2的排氣孔21前供氣段之第一輸送流路A1、及導料件2的排氣孔21後至收集盒1內間減壓段之第二輸送流路A2;在第一輸送流路A1中通有氣體進行對電子元件W推送,而該氣體在導料件2的排氣孔21處被逸散至導料件2外部,而使氣體減壓以減少對電子元件W之推送,使電子元件W可以依其重力下落。 Referring to FIG. 6 , the electronic component W is transported to the transport flow path A between the conduit 6 through which the electronic component W is movable and through which the gas is passed, and the collection box 1 , including the vent hole of the guide member 2 . The first conveying flow path A1 of the front air supply section 21 and the second conveying flow path A2 of the decompression section of the inner side of the collecting box 1 after the exhaust hole 21 of the guiding member 2 are passed through the first conveying flow path A1; There is gas to push the electronic component W, and the gas is dissipated to the outside of the guide member 2 at the vent hole 21 of the guide member 2, and the gas is decompressed to reduce the pushing of the electronic component W, so that the electronic component W can fall by its gravity.
本發明實施例在實施上,該可樞轉之緩衝件5設在以氣體輸送電子元件W至收集盒1之輸送流路A上,並位於排氣孔21後至收集盒1內間減壓段之第二輸送流路A2中;當電子元件W在供氣段之第一輸送流路A1被氣體推送而落經該排氣孔21 處時,因氣體經排氣孔21被逸散至導料件2外部,故電子元件W在第二輸送流路A2中的墜落速度將被減緩,並在落至該緩衝件5與輸送流路A保持一角度傾斜之緩衝面52時,以較輕緩的第一緩衝速度碰觸軟撓性材料構成的緩衝件5之第一緩衝面521,而再次減緩電子元件W之墜落速度,最後以再被減緩的第二緩衝速度由落入口13自然墜落至收集盒1底部被收集。 In an embodiment of the present invention, the pivotable cushioning member 5 is disposed on the conveying flow path A of the gas conveying electronic component W to the collecting box 1, and is located in the collecting box 1 and is decompressed after being located in the collecting box 1. In the second transport flow path A2 of the segment; when the electronic component W is pushed by the gas in the first transport flow path A1 of the air supply section, it flows through the exhaust hole 21 At the time, since the gas is dissipated to the outside of the guide member 2 through the vent hole 21, the falling speed of the electronic component W in the second conveying flow path A2 is slowed down, and falls to the cushioning member 5 and the conveying flow. When the road A maintains the angled inclined buffer surface 52, the first buffer surface 521 of the cushioning member 5 made of soft flexible material is touched at a relatively gentle first buffering speed, and the falling speed of the electronic component W is again slowed down. The second buffering speed, which is further slowed down, is naturally dropped by the landing 13 to the bottom of the collecting box 1 to be collected.
請參閱第七圖所示,如要將收集盒1內之電子元件W取出,僅需將收集盒1往下傾倒使其開口11朝下,因緩衝件5可以樞軸51作樞轉,且第二緩衝面522之長度較樞軸51至第四壁面124之間距為小,故使緩衝件5可以旋轉成第一緩衝面521朝下伸設,形成使開口11開啟且凸伸出開口11的狀態,使電子元件W容易自收集盒1中傾倒出。 Referring to the seventh figure, if the electronic component W in the collection box 1 is to be taken out, it is only necessary to pour the collection box 1 downward so that the opening 11 faces downward, since the cushioning member 5 can pivot the pivot 51, and The length of the second buffer surface 522 is smaller than the distance between the pivot 51 and the fourth wall 124. Therefore, the buffer member 5 can be rotated to extend downwardly from the first buffer surface 521, so that the opening 11 is opened and the opening 11 is protruded. The state makes the electronic component W easy to pour out from the collecting box 1.
本發明實施例所提供之方法及裝置,使電子元件W在進入第二輸送流路A2時,因推動電子元件W移動之氣體由排氣孔21逸散而獲得一第一緩衝速度,並在第二輸送流路A2中設置緩衝件5,使電子元件W在墜落收集盒1底部前,會先受到緩衝件5之緩衝面52阻擋,再一次獲得更緩的第二緩衝速度以減緩電子元件W之墜落速度墜落收集盒1底部,防止電子元件W直接墜落收集盒1底部發生損壞之情形;且在將電子元件W由收集盒1傾倒取出時,緩衝件5可因第一緩衝面面積較大而因重力作用作自由的樞轉改變位置,使電子元件W可以順利被倒出。 The method and apparatus provided by the embodiments of the present invention enable the electronic component W to obtain a first buffering speed when the gas that drives the electronic component W moves out of the exhaust hole 21 when entering the second conveying flow path A2, and The buffering member 5 is disposed in the second conveying flow path A2, so that the electronic component W is first blocked by the buffer surface 52 of the buffering member 5 before falling to the bottom of the collecting box 1, and once again obtains a gentle second buffering speed to slow down the electronic components. The falling speed of W falls to the bottom of the collecting box 1 to prevent the electronic component W from falling directly to the bottom of the collecting box 1; and when the electronic component W is dumped from the collecting box 1, the cushioning member 5 can be compared with the first buffer surface area. The large pivoting position due to gravity changes the position so that the electronic component W can be poured out smoothly.
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專 利涵蓋之範圍內。 The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are Still belong to the invention Within the scope of the benefit.
2‧‧‧導料件 2‧‧‧Guide parts
21‧‧‧排氣孔 21‧‧‧ venting holes
6‧‧‧導管 6‧‧‧ catheter
A‧‧‧輸送流路 A‧‧‧Transport flow path
A1‧‧‧第一輸送流路 A1‧‧‧First conveying flow path
A2‧‧‧第二輸送流路 A2‧‧‧Second transport flow path
W‧‧‧電子元件 W‧‧‧Electronic components
Claims (11)
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TW102133412A TW201512067A (en) | 2013-09-16 | 2013-09-16 | Method and device of feeding buffering |
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TW102133412A TW201512067A (en) | 2013-09-16 | 2013-09-16 | Method and device of feeding buffering |
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TW201512067A true TW201512067A (en) | 2015-04-01 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI574798B (en) * | 2016-04-22 | 2017-03-21 | All Ring Tech Co Ltd | The material box and the material for the storage of the material collection device |
TWI576220B (en) * | 2016-04-22 | 2017-04-01 | All Ring Tech Co Ltd | Material to undertake the collection device |
-
2013
- 2013-09-16 TW TW102133412A patent/TW201512067A/en unknown
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI574798B (en) * | 2016-04-22 | 2017-03-21 | All Ring Tech Co Ltd | The material box and the material for the storage of the material collection device |
TWI576220B (en) * | 2016-04-22 | 2017-04-01 | All Ring Tech Co Ltd | Material to undertake the collection device |
CN107303567A (en) * | 2016-04-22 | 2017-10-31 | 万润科技股份有限公司 | Material receiving and collecting device |
CN107303568A (en) * | 2016-04-22 | 2017-10-31 | 万润科技股份有限公司 | Material box and material receiving and collecting device provided with same |
CN107303568B (en) * | 2016-04-22 | 2020-01-03 | 万润科技股份有限公司 | Material box and material receiving and collecting device provided with same |
CN107303567B (en) * | 2016-04-22 | 2020-01-03 | 万润科技股份有限公司 | Material receiving and collecting device |
CN110813802A (en) * | 2016-04-22 | 2020-02-21 | 万润科技股份有限公司 | Material box and material receiving and collecting device for setting the material box |
CN110813801A (en) * | 2016-04-22 | 2020-02-21 | 万润科技股份有限公司 | Material receiving and collecting device |
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