TW201504717A - Vacuum bonding apparatus and bonding method - Google Patents

Abstract

The present invention discloses a vacuum bonding apparatus and a bonding method. A part of a carrier for carrying a plate-shaped module contains a magnet, and the plate-shaped module is magnetically attracted on the carrier by the magnet. In addition to solving a prior art problem of a positional deviation produced by a sucker sucking the plate-shaped module, and enhancing the positioning precision for providing a reliable bond quality, the present invention also has a low device cost, thereby reducing production costs.

Description

Vacuum bonding equipment and bonding method

The present invention relates to a fitting apparatus and method, and more particularly to a vacuum bonding apparatus and a bonding method.

According to the manufacturing process of the touch display panel, such as the combination of the display and the touch input technology, it is often necessary to bond the two boards together with the adhesive, however, in order to prevent the adhesive glue from being generated in the bonding process, bubbles are generated. Generally, the bonding process is completed by a vacuum bonding apparatus.

The conventional vacuum bonding apparatus generally operates by sucking the two plates of the bonding process by suction force generated by the suction cup, and then performing the pressing process after aligning the relative positions.

However, for the vacuum bonding of the liquid crystal display module and the touch panel, since the liquid crystal display module is composed of a liquid crystal panel, a backlight module, a frame, etc., the liquid crystal display The module itself is a little warped, and the back surface of the liquid crystal display module is mostly uneven. Therefore, when the conventional vacuum bonding device sucks the liquid crystal display module, the offset phenomenon is likely to occur. , affecting its alignment accuracy, resulting in poor fit quality.

Therefore, it is necessary to provide an improved vacuum bonding apparatus and bonding method to solve the above problems.

In view of the above, an object of the present invention is to provide a vacuum bonding apparatus and a bonding method which have an improved carrier which can improve the above-mentioned offset phenomenon and thereby improve the accuracy of alignment.

In order to achieve the above object, the present invention provides a vacuum bonding apparatus for bonding a plate-shaped module and a substrate, the vacuum bonding apparatus comprising a pair of position pressing systems, a casing and a vacuum The device, the alignment press system includes a lower carrier and an upper carrier. The alignment pressing system is configured to align the relative positions of the plate module and the substrate and then press-fit. The lower carrier is used to carry the plate module, and the upper carrier is used to carry the substrate. The housing has a chamber inside for receiving the lower carrier and the upper carrier. The vacuuming device is in communication with the chamber for evacuating the chamber. At least one region of the lower carrier is formed of a magnet for magnetically absorbing the plate-shaped module.

Furthermore, the present invention provides a bonding method comprising the steps of: providing a plate module and a substrate, and applying an adhesive on at least one side of the plate-like module and the opposite bonding surface of the substrate; a cavity, the cavity is provided with a lower carrier and an upper carrier, at least one region of the lower carrier is composed of a magnet; the plate module is placed on the lower carrier, and The magnet magnetically attracts the plate-shaped module; the substrate is held on the upper carrier; the cavity is evacuated; and the relative position of the plate-shaped module to the substrate is aligned and then pressed.

In an embodiment of the invention, one of the components of the plate module is made of a magnetically permeable material, and the plate module is fixed by the component made of a magnetic conductive material in the plate module. On the magnet.

In an embodiment of the present invention, the frame of the plate-shaped module is further provided with at least one jig, and the jig is made of a magnetic conductive material, and the plate-shaped module is adsorbed and fixed to the magnet by the jig. on.

In an embodiment of the present invention, at least one jig is further disposed on the frame of the plate module, and the jig is provided with at least one magnetic member, and the plate module passes at least one of the jigs The magnetic member is adsorbed and fixed on the magnet.

In an embodiment of the invention, the magnetic member is a permanent magnet.

In an embodiment of the invention, the magnetic member is a sheet made of a magnetically permeable material.

In an embodiment of the invention, the magnetically permeable material comprises iron, cobalt, nickel, or a combination thereof.

In an embodiment of the invention, the plate module is a liquid crystal display module.

In an embodiment of the invention, the substrate is a touch panel.

In an embodiment of the invention, the magnet is a permanent magnet.

In an embodiment of the invention, the lower carrier further includes at least one jacking device for lifting the plate module to be disengaged from the permanent magnet by the jacking of the jacking device.

In an embodiment of the invention, the lower carrier further includes at least one lowering device, and the permanent magnet is disposed on the lowering device for disengaging the permanent magnet from the plate module by the lowering of the lowering device .

In an embodiment of the invention, the magnet is an electromagnet.

Compared with the prior art, the present invention is constructed by a magnet for carrying a plate-like module. a part of the carrier, and the magnet module is magnetically attracted to the carrier by the magnet, the improved carrier not only improves the deviation caused by the suction of the plate module by the suction cup, In addition to increasing the accuracy of the alignment and providing a reliable fit quality, the production cost can be reduced because of the low cost of the device.

1‧‧‧Vacuum laminating equipment

2‧‧‧Touch LCD Module

2a‧‧‧LCD module

2b‧‧‧Touch panel

10‧‧‧ alignment press system

20‧‧‧shell

30‧‧‧ Vacuuming device

101‧‧‧Lower carrier

102‧‧‧Upper carrier

103‧‧‧ alignment adjustment device

104‧‧‧ Pressing device

201‧‧‧ chamber

1011‧‧‧Electromagnet

1012‧‧‧Loading column

1013‧‧‧ permanent magnet

1014‧‧‧Elevation device

1015‧‧‧Descent device

1016‧‧‧Base

S11~S16‧‧‧Steps

Fig. 1 is a schematic view showing a vacuum laminating apparatus in a first embodiment of the present invention.

Fig. 2 is a schematic view showing a vacuum laminating apparatus in a second embodiment of the present invention.

Fig. 3 is a schematic view showing a vacuum laminating apparatus in a third embodiment of the present invention.

Figure 4 is a flow chart showing the steps of the bonding method in the embodiment of the present invention.

The embodiments described in detail below with reference to the drawings will make the advantages and features of the invention, and the methods of the inventions. However, the present invention is not limited to the embodiments disclosed below, and the present invention can be implemented in various ways that are different from each other. The embodiments disclosed below are only for making the disclosure of the present invention more complete and contributing to the present invention. A person of ordinary skill in the art can fully understand the scope of the present invention, which is defined in accordance with the scope of the patent application. Throughout the specification, the same reference numerals denote the same structural elements.

Please refer to FIG. 1 , which is a schematic view of a vacuum bonding apparatus 1 of the present invention. The vacuum bonding apparatus 1 mainly includes a pair of position pressing system 10, a casing 20 and a vacuuming device 30. The alignment pressing system 10 generally includes a lower bearing base 101 and an upper bearing base 102. A pair of position adjusting device 103 and a pressing device 104. The vacuum bonding device 1 is used for bonding a plate-shaped module and a substrate. In the following embodiments, the plate-shaped module is a liquid crystal display module 2a. The substrate is the touch panel 2b.

The function of the alignment pressing system 10 is to align the relative positions of the liquid crystal display module 2a and the touch panel 2b and then press-fit. The lower carrier 101 is for carrying the liquid crystal display module 2a, and the upper carrier 102 is for carrying the touch panel 2b. The upper bearing base 102 is connected and fixed to the alignment adjusting device 103, and the alignment adjusting device 103 adjusts three axial directions of X, Y and Z of the upper bearing base 102, so that the upper bearing block is processed. The touch panel 2b and the liquid crystal display module 2a are aligned with each other, and a downward force is applied by the pressing device 104 to press the touch panel 2b and the liquid crystal display module 2a.

The housing 20 has a chamber 201 therein for receiving the lower carrier 101, the upper carrier 102, the alignment adjusting device 103 and the pressing device 104. The vacuuming device 30 is connected to the chamber 201. The vacuuming device 30 can extract air in the chamber 201 to form a vacuum state in the chamber 201.

The main improvement of the present invention is that at least one region of the lower carrier 101 carrying the liquid crystal display module 2a is composed of a magnet, and the liquid crystal display module 2a is adsorbed and fixed by magnetic attraction. In the present invention, one of the components (not shown) of the liquid crystal display module 2a can be made of a magnetically permeable material, and the liquid crystal display module 2a is made of a magnetic conductive material in the liquid crystal display module 2a. The component is adsorbed and fixed to the magnet. Alternatively, at least one jig (not shown) may be embedded in the frame of the liquid crystal display module 2a. The jig is made of a magnetic conductive material, and the liquid crystal display module 2a is adsorbed and fixed by the jig. On the magnet. Alternatively, at least one jig (not shown) may be integrated on the frame of the liquid crystal display module 2a, and the jig is provided with at least one magnetic member (not shown), and the liquid crystal display module 2a The magnet is adsorbed and fixed by at least one magnetic member on the jig. The magnetic member may be a permanent magnet or a sheet made of a magnetically permeable material. The magnetically permeable material comprises iron, cobalt, nickel or a combination thereof. Three embodiments will be described below to explain in detail the lower carrier 101 in the vacuum bonding apparatus 1 of the present invention.

[Example 1]

Referring to Fig. 1 for a first aspect of the lower carrier 101 of the vacuum bonding apparatus 1 of the present invention, a schematic view of the vacuum bonding apparatus 1 of the first embodiment of the present invention is shown. In the figure, the lower carrier 101 is composed of a plurality of electromagnets 1011 and a plurality of carrier posts 1012. When the electromagnets 1011 are energized, a magnetic force is generated to adsorb and fix the liquid crystal display module 2a. After the electricity, it can be easily removed without magnetic attraction.

[Embodiment 2]

A second aspect of the lower carrier 101 in the vacuum bonding apparatus 1 of the present invention, see Fig. 2, which shows a schematic view of the vacuum bonding apparatus 1 in the second embodiment of the present invention. In the illustration, the lower carrier 101 is mainly composed of a permanent magnet 1013, and a plurality of jacking devices 1014 are embedded in the platform, and the liquid crystal display module is driven by the jacking of the jacking device 1014. 2a rises and is released from the attraction of the permanent magnet 1013.

[Example 3]

A third aspect of the lower carrier 101 in the vacuum bonding apparatus 1 of the present invention, see Fig. 3, which shows a schematic view of the vacuum bonding apparatus 1 in the third embodiment of the present invention. In the figure, the main body of the lower bearing base 101 is a base 1016. A plurality of lowering devices 1015 are embedded around the base 1016. Each of the lowering devices 1015 is provided with a permanent magnet 1013. In the working state, the top surface of the permanent magnets 1013 and the top surface of the base 1016 are a flat surface. When the operation is completed, the lowering of the lowering device 1015 can cause the permanent magnets 1013 to be separated from the liquid crystal display. Module 2a.

Please refer to FIG. 4, which is a flow chart of the steps of the bonding method in the embodiment of the present invention, and the method includes the following steps:

In step S11, a plate-shaped module and a substrate are provided, and an adhesive is applied to at least one surface of the plate-like module and the opposing bonding surface of the substrate. In the present invention, one of the components of the plate-like module may be made of a magnetically permeable material, and the plate-shaped module is affixed to the magnet by the component made of a magnetically permeable material in the slab-shaped module. on. Alternatively, the frame of the plate-shaped module is further provided with at least one jig, and the jig may be made of a magnetic conductive material, and the plate-shaped module is fixedly fixed to the magnet through the jig; or The jig can be provided with at least one magnetic member, and the plate-shaped module is fixedly attached to the magnet through at least one magnetic member on the jig. The magnetic member may be a permanent magnet or a sheet made of a magnetically permeable material. The magnetically permeable material may be iron, cobalt, nickel or an alloy thereof. The adhesive may be an ultraviolet reactive adhesive or a thermally reactive adhesive. In an example, the plate module may be a liquid crystal display module, and the substrate may be a touch panel, but the invention is not limited thereto.

In step S12, a cavity is provided, the cavity is provided with a lower carrier and an upper carrier, and at least one region of the lower carrier is composed of a magnet. The magnet can be an electromagnet or a permanent magnet.

In step S13, the plate-shaped module is placed on the lower carrier, and the plate-shaped module is magnetically attracted by the magnet.

In step S14, the substrate is held on the upper carrier.

In step S15, the chamber is evacuated.

In step S16, the relative positions of the plate-shaped module and the substrate are aligned and then pressed. After the pressing is completed, if the magnet is an electromagnet, it is only necessary to power off the electromagnet. The magnetic force that attracts the plate module can be released. If the magnet is a permanent magnet, the lower carrier further includes at least one lifting device or at least one lowering device, and the lifting of the lifting device can cause the plate-shaped module to which the substrate is attached to rise and disengage The permanent magnet is attracted to the lowering device, or the permanent magnet is disposed on the lowering device, and the lowering device can lower the permanent magnet from the plate-shaped module to which the substrate is attached.

As described above, at least one region of the lower carrier 101 in the vacuum bonding apparatus 1 of the present invention is composed of a magnet, and the liquid crystal display module 2a is adsorbed and fixed by magnetic attraction, and then passed through a conventional alignment adjusting device. 103 and the pressing device 104 aligns the touch panel 2b and the liquid crystal display module 2a into a touch-type liquid crystal display module 2, and the improved lower carrier 101 can improve the conventional suction cup. In addition to the offset generated by the liquid crystal display module 2a, the accuracy of the alignment is increased, and the reliable bonding quality is provided, and the production cost can be reduced because the device is inexpensive.

While the invention has been described above in terms of the preferred embodiments, the invention is not intended to limit the invention, and the invention may be practiced without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.

1‧‧‧Vacuum laminating equipment

2‧‧‧Touch LCD Module

2a‧‧‧LCD module

2b‧‧‧Touch panel

10‧‧‧ alignment press system

20‧‧‧shell

30‧‧‧ Vacuuming device

101‧‧‧Lower carrier

102‧‧‧Upper carrier

103‧‧‧ alignment adjustment device

104‧‧‧ Pressing device

201‧‧‧ chamber

1011‧‧‧Electromagnet

1012‧‧‧Loading column

Claims (26)

A vacuum bonding device for bonding a plate-shaped module and a substrate, the vacuum bonding device comprising: a pair of position pressing systems for aligning the relative positions of the plate-shaped module and the substrate And then pressing, the alignment pressing system comprises: a lower carrier for carrying the plate module; and an upper carrier for carrying the substrate; a casing having a cavity inside the casing a chamber, the lower carrier and the upper carrier are housed in the chamber of the housing; and a vacuuming device is connected to the chamber, the vacuuming device is configured to evacuate the chamber, wherein the At least one region of the lower carrier is formed of a magnet for magnetically absorbing the plate-like module. The vacuum bonding apparatus of claim 1, wherein one of the components of the plate-shaped module is made of a magnetically permeable material, and the plate-shaped module passes through the magnetically conductive material in the plate-shaped module. The fabricated component is adsorbed and fixed to the magnet. The vacuum laminating apparatus according to claim 1, wherein the frame of the plate-shaped module is further provided with at least one jig, and the jig is made of a magnetic conductive material, and the plate-shaped module passes the The jig is adsorbed and fixed on the magnet. The vacuum laminating apparatus of claim 1, wherein the frame of the plate-shaped module has at least one jig in the card, and the jig is provided with at least one magnetic member, and the plate-shaped module passes At least one magnetic member on the jig is adsorbed and fixed on the magnet. The vacuum bonding apparatus of claim 4, wherein the magnetic member is a permanent magnet. The vacuum laminating apparatus of claim 4, wherein the magnetic member is a sheet made of a magnetically permeable material. The vacuum bonding apparatus of claim 2, 3 or 6, wherein the magnetic conductive material package Containing iron, cobalt, nickel or a combination thereof. The vacuum bonding apparatus according to claim 1, wherein the plate module is a liquid crystal display module. The vacuum bonding apparatus of claim 1, wherein the substrate is a touch panel. The vacuum bonding apparatus of claim 1, wherein the magnet is a permanent magnet. The vacuum bonding apparatus of claim 10, wherein the lower carrier further comprises at least one lifting device for lifting the plate module away from the permanent by the jacking of the jacking device The attraction of the magnet. The vacuum bonding apparatus of claim 10, wherein the lower carrier further comprises at least one lowering device, the permanent magnet being disposed on the lowering device for making the permanent by the lowering of the lowering device The magnet is separated from the plate module. The vacuum bonding apparatus of claim 1, wherein the magnet is an electromagnet. A bonding method includes the steps of: providing a plate module and a substrate, and applying an adhesive on at least one side of the opposite surface of the plate module and the substrate; providing a cavity, the cavity The content is provided with a lower carrier and an upper carrier, at least one region of the lower carrier is composed of a magnet; the plate module is placed on the lower carrier, and the plate is magnetically attracted by the magnet a module; holding the substrate on the upper carrier; vacuuming the cavity; and aligning the relative position of the plate module with the substrate and then pressing. The bonding method of claim 14, wherein one of the components of the plate-shaped module is made of a magnetically permeable material, and the plate-shaped module is made of a magnetically permeable material in the plate-shaped module. The formed component is adsorbed and fixed to the magnet. The bonding method of claim 14, wherein the frame of the plate module is further provided with at least one jig, and the jig is made of a magnetic conductive material, and the plate module passes the treatment. The adsorption is fixed on the magnet. The bonding method of claim 14, wherein the frame of the plate module has at least one jig in the card, and the jig is provided with at least one magnetic member, and the plate module passes the At least one magnetic member on the jig is adsorbed and fixed on the magnet. The bonding method of claim 17, wherein the magnetic member is a permanent magnet. The bonding method of claim 17, wherein the magnetic member is a sheet made of a magnetically permeable material. The bonding method of claim 15, wherein the magnetically permeable material comprises iron, cobalt, nickel or a combination thereof. The bonding method according to claim 14, wherein the plate module is a liquid crystal display module. The bonding method of claim 14, wherein the substrate is a touch panel. The bonding method of claim 14, wherein the magnet is a permanent magnet. The method of claim 23, wherein the lower carrier further comprises at least one lifting device for lifting the plate module from the permanent magnet by the jacking of the jacking device Attraction. The method of claim 23, wherein the lower carrier further comprises at least one lowering device, the permanent magnet being disposed on the lowering device for lowering the permanent magnet by the lowering of the lowering device Get out of the plate module. The bonding method according to claim 14, wherein the magnet is an electromagnet.