TW201446526A - Attachment separation method and separation device - Google Patents

Abstract

The present invention provides an attachment separation method and a separation device which can easily and conveniently separate a thin substrate from a support substrate via vacuum destruction. Under atmospheric pressure, a penetration member is inserted into at least a portion of a sealed piece (3) of an attachment substrate (4) so as to create a passage. As a result, the airtight sealing of the vacuum space (S) inside the sealed piece (3) is broken, and air or liquid rushes into the vacuum space (S) which is accordingly opened to the atmosphere. Due to being opened to the atmosphere, the inner and exterior sides of the sealed piece (3) receive pressures from both the atmospheric pressure and the in-rush fluid pressure inside the vacuum space (S). Therefore, the thin substrate (1) can be easily separated from the support substrate (2) without deformation.

Description

Lamination separation method and separation device

The present invention relates to a method for attaching and separating a thin-plate substrate such as a thin-walled cover glass or a film, for example, in a flat panel display (FPD) or a touch panel or a 3D (3-dimensional) display or an electronic book. And a separation device for carrying out the method of the separation and separation.

Conventionally, as such a bonding and separating method and a separating apparatus, there is a bonding and separating method and a separating apparatus, that is, a supporting substrate (second substrate) formed by forming a groove structure on the surface of a light-transmitting insulating substrate. In the above, a bonding resin having a reduced adhesiveness by irradiation with a specific ultraviolet light is applied to a space portion of the groove to form a bonding layer, and a thin plate glass (first substrate) containing a light-transmitting insulating substrate is bonded thereon. After the bonding substrate is formed, an electronic component (device) is formed by the bonding substrate, and then the bonding substrate is irradiated with specific ultraviolet light, whereby the bonding strength of the bonding layer of the bonding substrate is lowered, thereby being peeled off from the electronic component. A support substrate (for example, refer to Patent Document 1).

[Advanced technical literature] [Patent Literature]

Patent Document 1: Japanese Patent Publication No. 2003-80658

However, in the conventional bonding and separating method and the separating apparatus, the bonding substrate is irradiated with specific ultraviolet light, whereby the adhesion of the bonding layer disposed between the thin glass and the supporting substrate can be reduced and peeled off. Therefore, when the support substrate contains a light-shielding material, the thin plate glass cannot be easily peeled off without lowering the adhesion of the bonding layer.

As a result, the material of the supporting substrate is limited, and thus there is a problem that the electronic component that can be manufactured is also limited.

Further, the method of peeling the support substrates from the joined thin plate glass after the two bonded substrates are joined to each other by the thin plate glass is difficult to perform because the support substrate is not deformed.

Therefore, there is a problem in that it is difficult to manufacture a laminate in which thin plate glasses are joined to each other.

The present invention has been made to solve such a problem, and an object thereof is to easily and easily separate a thin plate substrate or the like from a support substrate by vacuum destruction.

In order to achieve such an object, in the bonding and separating method of the present invention, a specific process is performed in a state where the thin plate substrate and the reinforcing supporting substrate are bonded together, and after the end of the process, the thin plate substrate and the supporting substrate are separated. The bonding and separating method is characterized in that the method includes a superposition step of joining the thin plate substrate and the support substrate with a frame-shaped sealing member interposed therebetween in a vacuum atmosphere to form a bonded substrate; and a separating step Removing at least a portion of the sealing member of the bonded substrate in an atmospheric pressure atmosphere, and introducing a fluid into a vacuum space formed inside the sealing member to open the atmosphere, in the separating step, At least a portion of the sealing member is inserted into the penetrating member to open a through hole, and an atmospheric pressure fluid is introduced into the vacuum space from the through hole to open the atmosphere.

Further, in the separation apparatus of the present invention, the bonded substrate in which the frame-shaped seal is joined by sandwiching the thin substrate and the reinforcing support substrate in a vacuum atmosphere separates the thin substrate from the support substrate in an atmospheric pressure atmosphere The separating apparatus is characterized in that the penetrating member is provided with a penetrating member, and the penetrating member is provided to be opposed to the sealing member of the bonded substrate, and the penetrating member is configured to be inserted into the upper member. a blade tip of at least a portion of the sealing member, and a through hole is formed in at least a portion of the sealing member along the relative movement of the blade edge relative to the bonding substrate, and is formed from the through hole toward the The vacuum space inside the seal is introduced into the atmospheric fluid to open the atmosphere.

In the bonding and separating method of the present invention having the above characteristics, at least a portion of the sealing member to which the substrate is bonded is removed in an atmospheric pressure atmosphere, whereby the inside of the sealing member is vacuum-tightly maintained in a vacuum state before that. The airtightness of the space is destroyed, and a fluid such as air or liquid enters the vacuum space at one time and is opened to the atmosphere. By the opening of the atmosphere, the seal is pressed by the pressure from the outside and the pressure of the fluid entering the vacuum space from the outside and the inside, so that the seal is thin and can be removed from the support substrate without deforming the thin plate substrate. Stripping effortlessly.

Therefore, the thin plate substrate can be easily and easily separated from the support substrate by vacuum destruction.

As a result, the support substrate can be easily separated even if the support substrate is a light-shielding material, compared with a conventional method in which the bonding substrate is irradiated with specific ultraviolet light to reduce the adhesion of the bonding layer between the thin plate glass and the support substrate. Thin plate substrate. Thereby, the electronic component is not limited by the limitation of the support substrate material, and the convenience is excellent.

Further, the two bonded substrates are bonded to each other so as to face each other to form a bonded substrate group, whereby even if the thin substrate is not deformed, the bonded thin substrate can be peeled off from the support substrate without any difficulty. It is possible to easily manufacture a laminate in which thin plate substrates are joined to each other.

In particular, in an atmospheric pressure atmosphere, a through hole is formed in at least a portion of the seal member to open a through hole, whereby a fluid such as air or liquid enters the vacuum space from the through hole at a time. Accordingly, the seal member becomes thin by the pressure from the outside generated by the atmospheric pressure and the pressure of the fluid entering the vacuum space, so that the thin plate substrate and the support substrate can be made without Struggling to peel off.

Therefore, the thin plate substrate can be reliably separated from the support substrate by a simple method.

Further, in the separating apparatus of the present invention having the above-described features, in an atmospheric pressure atmosphere, at least a portion of the sealing member of the bonded substrate is inserted into the tip of the penetrating member to open the through hole, whereby the sealing member is formed before The inside of the vacuum space in which the inner side is kept in a vacuum state is destroyed, and a fluid such as air or liquid enters the vacuum space at one time and is opened to the atmosphere. By the opening of the atmosphere, the seal is pressed by the pressure from the outside and the pressure of the fluid entering the vacuum space from the outside and the inside, so that the seal is thin and can be removed from the support substrate without deforming the thin plate substrate. Stripping effortlessly.

Therefore, the thin plate substrate can be easily separated from the support substrate by vacuum destruction with a simple structure. Thereby, the manufacturing cost of the whole apparatus can be reduced.

As a result, the support substrate can be easily separated even if the support substrate is a light-shielding material, compared with a conventional method in which the bonding substrate is irradiated with specific ultraviolet light to reduce the adhesion of the bonding layer between the thin plate glass and the support substrate. Thin plate substrate. Thereby, the electronic component is not limited by the limitation of the support substrate material, and the convenience is excellent.

Further, the two bonded substrates are bonded to each other so as to face each other to form a bonded substrate group, whereby even if the thin substrate is not deformed, the bonded thin substrate can be peeled off from the support substrate without any difficulty. It is possible to easily manufacture a laminate in which thin plate substrates are joined to each other.

1, 1', 1" ‧‧‧ thin plate substrate

1a, 1a', 1a"‧‧‧ outer surface

1b, 1b', 1b"‧‧‧ inner surface

2, 2', 2" ‧ ‧ support substrate

2a, 2a', 2a" ‧ ‧ step

2b, 2b', 2b"‧‧‧ abutment

2c‧‧‧dose (convex)

2d‧‧‧ concave and convex (concave)

3, 3', 3" ‧ ‧ seals

3a‧‧‧through hole

3b‧‧‧ crack

4, 4', 4" ‧ ‧ affixed substrate

5, 5'‧‧‧ affixed substrate group

6‧‧‧Laminated body

11, 12‧‧‧ Keep board

11a, 12a‧‧‧ Keep face

12b‧‧‧Adhesive chuck

13‧‧‧ Lifting and Driving Department

14‧‧‧vacuum chamber

15‧‧‧ cushioning parts

20, 20', 20" ‧ ‧ through members

21, 21', 21", 23, 23' ‧ ‧ cutting edge

22, 24‧‧‧ Supporting components

30‧‧‧Liquid tank

31, 34‧‧‧Small liquid trough

32, 33, 35, 36‧‧‧ large liquid tank

A, A1, A2‧‧‧ fitting device

B, B1, B2‧‧‧ separation device

S, S', S" ‧ ‧ vacuum space

L‧‧‧Soluble

X, Y, Z‧‧ Direction

1 is an explanatory view showing an overall configuration of a bonding and separating method according to an embodiment of the present invention in a step sequence, wherein (a) is a front view of a support substrate in an initial state, (b) is a plan view thereof and partially shows a part thereof. And (c) is a partial slit front view of the support substrate in the preparation step, (d) is a top view thereof and partially shows a part thereof, and (e) is a partial slit front view of the bonded substrate in the overlapping step, ( f) a partial slit front view of the bonded substrate in the separation step Fig. (g) is a longitudinal sectional view of the thin plate substrate after the separation step and a partial slit front view of the support substrate.

Fig. 2 is an explanatory view showing the entire configuration of a bonding apparatus according to an embodiment of the present invention, wherein (a) is a partial slit front view showing a state before joining in the superposing step, and (b) is a partial view showing a state at the time of joining. The front view of the slit, (c) is a partial cut front view of the bonded substrate after joining.

Fig. 3 is an explanatory view showing the entire configuration of a separating apparatus according to an embodiment of the present invention, wherein (a) shows a partial slit front view in a state in which a through hole is formed in the sealing member, and (b) shows a state in which vacuum is broken. A partial incision front view, (c) is a partial incision front view showing the state after vacuum failure.

Fig. 4 is an explanatory view showing a modification of the separating apparatus, wherein (a) shows a partial slit front view in a state in which a through hole is opened in the sealing member, and (b) shows a partial state in a state of vacuum breaking and vacuum breaking. Front view of the incision.

Figure 5 is an explanatory view showing the overall structure of the bonding and separating method of another embodiment of the present invention in the order of steps, (a) a partial slit front view of the bonded substrate group in the separating step, and (b) a separation step after the separation step A longitudinal section of the laminate and a partial cut front view of the support substrate.

Fig. 6 is an explanatory view showing the entire configuration of a bonding apparatus according to another embodiment of the present invention, wherein (a) is a partial slit front view showing a state before joining in the superposing step, and (b) is a state at the time of joining. A partial incision front view, (c) a partial incision front view of the bonded substrate set after bonding.

Fig. 7 is an explanatory view showing the entire configuration of a separating apparatus according to another embodiment of the present invention, wherein (a) shows a partial slit front view in a state in which a through hole is opened in the sealing member, and (b) shows a state in which vacuum destruction occurs. A partial incision front view, (c) is a partial incision front view showing the state after vacuum destruction.

Fig. 8 is an explanatory view showing a modification of the separating device, and (a) shows the opening on the sealing member. A partial slit front view in a state in which a through hole is provided, and (b) is a partial cut front view showing a state in which the vacuum is broken and after the vacuum is broken.

Fig. 9 is an explanatory view showing a modification of the support substrate, wherein (a) is a partial slit front view of the support substrate in the preparation step, and (b) is a partial slit front view of the bonded substrate in the separation step.

Fig. 10 is an explanatory view showing a modification of the support substrate, wherein (a) is a partial slit front view of the support substrate in the preparation step, and (b) is a partial slit front view of the bonded substrate in the separation step.

Fig. 11 is an explanatory view showing a modification of the support substrate, wherein (a) is a partial slit front view of the bonded substrate group in the separating step, (b) is a longitudinal sectional view of the laminated body after the separating step, and a part of the supporting substrate Front view of the incision.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

As shown in Fig. 1 (a) to (g), the bonding and separating method according to the embodiment of the present invention is used to bond the thin plate substrate 1 to the thin substrate 1 in a state where the thin substrate 1 and the reinforcing supporting substrate 2 are bonded together. A method of separating the thin plate substrate 1 and the support substrate 2 after the end of the treatment by a specific treatment such as film surface treatment or bonding with other members including the thin plate substrates 1.

As described in detail, the bonding and separating method according to the embodiment of the present invention includes the following steps as a main step: a superposition step in which a thin plate substrate 1 and a support substrate 2 are sandwiched by a frame-shaped sealing member 3 in a vacuum atmosphere. Bonding to form the bonded substrate 4; and a separating step of removing at least a portion of the sealing member 3 of the bonded substrate 4 in an atmospheric pressure atmosphere, and placing a fluid into the vacuum space S formed on the inner side of the sealing member 3 Realize the opening of the atmosphere.

The thin plate substrate 1 is made of, for example, a flat panel display (FPD) or a touch panel or a 3D (3D) display or an electronic book for a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), a flexible display, or the like. Or a thin-walled cover glass or barrier glass or film.

However, since the thickness of the thin plate substrate 1 is relatively thin with respect to the surface areas of the outer surface 1a and the inner surface 1b, it is easy to deform, and it is difficult to carry out attachment and detachment while maintaining a smooth state. As a result, there is a disadvantage that the film surface treatment of the thin-plate substrate 1 or the bonding of the thin-plate substrates 1 or the bonding with other members can not be reliably performed.

The support substrate 2 is formed of a non-deformable glass or metal or other rigid material resistant to the above-described film surface treatment or bonding, etc., to be equal to or larger than the thin plate substrate 1 and opposed to the thin plate substrate 1. The surface is a smooth flat or curved plate.

A sealing member 3 to be described later is detachably provided on the surface of the support substrate 2, and the thin plate substrate 1 is detachably adhered and held via the sealing member 3.

As a specific example of the support substrate 2, as shown in Figs. 1(a) and 1(b), the entire surface is formed in a planar shape, and has a concave step portion 2a formed in a frame shape on the outer peripheral portion of the surface, and It is preferable to arrange the sealing member 3 to be described later on the step portion 2a except that the central portion other than the step portion 2a is opposed to the inner surface 1b of the thin plate substrate 1 and is formed to be smoothly formed. The step portion 2a is formed to have a depth corresponding to a thickness at which the seal 3 to be described later can be mechanically cut from the outer peripheral end surface of the support substrate 2. The depth of the step portion 2a is formed to have the same size over the entire circumference of the frame shape, or it is possible to cut only the thickness of a portion of the frame shape.

Further, although not shown in the drawings, the step portion 2a or the contact surface 2b may not be formed on the support substrate 2, and the sealing member 3 to be described later may be disposed on the outer peripheral portion of the surface of the support substrate 2.

Further, between the contact surface 2b of the central portion other than the step portion 2a of the support substrate 2 and the central portion of the inner surface 1b of the thin plate substrate 1 opposed thereto, a fine uneven portion 2c is formed at a specific density, 2d is preferred. The fine concavo-convex portions 2c and 2d are formed by surface-treating or surface-treating the abutting surface 2b or the central portion of the inner surface 1b of the thin-plate substrate 1, or by attaching a gap member such as a spacer to the abutting surface 2b. It is preferable that the formation positions of the fine uneven portions 2c and 2d are disposed on the inner side of the step portion 2a only by a predetermined distance.

As a specific example, as shown in FIGS. 1(a) to (e), the surface of the support substrate 2 is etched. The step portion 2a and the abutting surface 2b, and the fine convex portion 2c and the concave portion 2d are simultaneously formed by engraving or sandblasting.

Further, although not shown in the drawings, a plurality of spacers which are formed into a columnar shape or the like at a specific density on the contact surface 2b of the support substrate 2 can be adhered by heat treatment or the like thereafter. The fine convex portion 2c and the concave portion 2d are formed separately from the step portion 2a, or embossed fine concavities and convexities are provided at a central portion of the inner surface 1b of the thin plate substrate 1 by printing or the like at a specific density.

The sealing member 3 is an adhesive which is subjected to the above-described predetermined operation and is disposed in a frame shape along the outer peripheral portion (step portion 2a) of the surface of the support substrate 2.

As a method of arranging the sealing member 3, coating is performed using a liquid quantitative discharge machine such as a dispenser, or other means such as printing is provided to form a closed space at a portion inside the sealing member 3. As the arrangement state of the sealing member 3, it is preferable to arrange the surface position of the sealing member 3 on the same plane as the surface of the contact surface 2b of the support substrate 2 or the fine convex portion 2c.

As a specific example of the sealing material 3, a binder which is soluble in an adhesive material which can be dissolved in the dissolution liquid L is preferably used.

Further, as another example, an insoluble seal 3 can also be used.

Further, in the bonding and separating method of the embodiment of the present invention, in the preparation step before the superposition step, as shown in Figs. 1(c) and (d), the outer peripheral portion of the surface of the support substrate 2 (step difference) The portion 2a) adheres to the sealing member 3 by coating or the like.

In the subsequent superposition step, the bonding device 3 or the like to be described later holds the frame-like sealing member 3 on the support substrate 2 as shown in FIG. 1(e) in an atmosphere maintained at a predetermined degree of vacuum. The thin plate substrate 1 is bonded to the bonded substrate 3 by the adhesive force of the sealing member 3.

Thereby, the gap between the contact surface 2b of the thin-plate substrate 1 and the support substrate 2, and the step portion 2a and the seal member of the support substrate 2 on the inside of the frame-shaped seal 3 in the bonded substrate 4 The gaps between 3 are respectively divided to form a vacuum space S.

In the subsequent separation step, the separator 3 in the bonded substrate 4 is used in an atmospheric pressure atmosphere by using an apparatus such as a penetrating member 20 to be described later in an atmospheric pressure atmosphere, as shown in FIG. At least a portion is cut or the like to be removed, and a fluid such as air or liquid enters therefrom.

Thereby, the airtightness of the vacuum space S in which the inside of the sealing member 3 is hermetically held in a vacuum state is broken and opened at one time. That is, the atmospheric pressure fluid enters into the vacuum space S at one time and is opened to the atmosphere (vacuum destruction).

By the opening of the atmosphere (vacuum breaking), only a part of the sealing member 3 is sheared, and the sealing member 3 is also subjected to pressure from the outside and atmospheric pressure into the vacuum space S from both the outer side and the inner side. The pressure of the fluid is pressed, so that the thickness of the thick wall becomes thin and becomes weak throughout the entire circumference.

As a result, the crack 3b is easily formed on the sealing member 3, and as shown in Fig. 1(g), the support substrate 2 can be peeled off without any difficulty even if the thin plate substrate 1 is not deformed from the crack 3b.

Next, a bonding apparatus A used to carry out the bonding and separating method of the embodiment of the present invention will be described.

As shown in FIGS. 2(a) to 2(c), the bonding apparatus A1 of the thin plate substrate 1 and the supporting substrate 2 has the following main components: the holding plates 11, 12, and the thin plate substrate 1 and the supporting substrate which face each other. 2, respectively, being detachably mounted; the lifting drive portion 13 is configured such that either or both of the holding plates 11, 12 are relatively moved toward each other to overlap the thin plate substrate 1 and the support substrate 2; the vacuum chamber 14 is covered at least The thin plate substrate 1 and the support substrate 2 held on the holding plates 11 and 12 are maintained at a predetermined degree of vacuum, and a control unit (not shown) is used to control the operation of the elevation driving unit 13 and the like.

The holding plates 11 and 12 include, for example, a flat plate-like platform formed of a rigid body such as metal or ceramic so as not to be warped (deflected), and have holding surfaces 11a and 12a which are smooth toward each other.

Further, the holding plates 11, 12 are reciprocally movably supported in at least one or two of the upward and downward directions (Z direction) so that the holding faces 11a, 12a approach or separate from each other in a parallel state.

The holding faces 11a and 12a of the holding plates 11 and 12 are provided with, for example, an adhesive chuck, a suction chuck, an electrostatic chuck, or a combination thereof, as a holding mechanism for detachably holding the thin plate substrate 1 and the support substrate 2, respectively.

As a specific example of the holding plates 11 and 12, as shown in Figs. 2(a) and 2(b), a plurality of the retaining surfaces 12a of the upper holding plate 12 are movably inserted in the Z direction. The adhesive chuck 12b is brought into contact with the support substrate 2 by the movement of the adhesive chuck 12b toward the holding surface 12a and adhered to the holding surface 12a, and is moved by the opposite movement of the adhesive chuck 12b away from the holding surface 12a. It is peeled off from the support substrate 2 to release the support substrate 2 from the holding surface 12a.

Further, the elevation drive unit 13 that reciprocates only the holding plate 12 disposed above in the Z direction is provided.

Further, although not shown in the drawings, an adhesive chuck having a different structure may be provided on the holding surface 12a of the upper holding plate 12, or the suction chuck and the electrostatic chuck may be arranged in combination, or the lifting drive unit 13 may be used. Only the holding plate 11 disposed below is reciprocated in the Z direction, or both of the holding plates 11 and 12 are reciprocated in the Z direction.

The control unit is a controller that is electrically connected not only to the holding mechanism of the holding plates 11 and 12, the lifting/lowering driving unit 13 or the vacuum degree adjusting mechanism (not shown) of the vacuum chamber 14 but also to the sealing member 3 as needed. An application mechanism (not shown), a loading mechanism (not shown) for loading the thin plate substrate 1 and the support substrate 2 toward the holding plates 11 and 12, and a stacked substrate 4 for carrying out the overlapping bonding substrates 4 from the holding plates 11 and 12 The unloading mechanism (not shown) is electrically connected, and the actuation control is sequentially performed according to a preset program.

The loading mechanism and the unloading mechanism include a transport robot, and the like, in particular, the loading mechanism of the thin-plate substrate 1 transports the thin-plate substrate 1 as a single body, or the thin-plate substrate 1 is not deformed by using a tray or the like. It is better to carry in the ground.

As an example of the program set in the control unit, in the bonding apparatus A1 of the thin-plate substrate 1 and the support substrate 2, first, the thin-plate substrate 1 is transported from the outside of the vacuum chamber 14 to the inside of the vacuum chamber 14 by the transport mechanism. And the support substrate 2 to which the seal 3 is applied by a coating mechanism in a frame shape, as shown in FIG. 2(a), is carried into the upper and lower holding plates 11 and 12, and the thin plate substrate 1 and the support substrate 2 are respectively held by The predetermined positions of the faces 11a and 12a are held. At the same time, the vacuum chamber 14 is closed, and the inside thereof is depressurized to complete the preparation step.

Thereafter, when the inside of the vacuum chamber 14 reaches a predetermined degree of vacuum, the superimposing step is started, and as shown in FIG. 2(b), either or both of the holding plates 11, 12 are moved by the elevation driving portion 13. Moving in the direction in which they are close to each other, the thin plate substrate 1 and the support substrate 2 are joined to each other by the frame-shaped seal 3 to form the bonded substrate 4, and a vacuum space S is formed inside the seal 3.

Thereafter, as shown in FIG. 2(c), the bonded substrate 4 is unloaded to the outside of the vacuum chamber 14 by the unloading mechanism.

The internal pressure of the vacuum chamber 14 is set such that the bonded substrate 4 bonded to the inside of the vacuum chamber 14 under a predetermined degree of vacuum is moved to the outside of the vacuum chamber 14 and moved to an atmospheric pressure atmosphere. The central portion of the substrate 1 is not bulged and deformed due to the pressure difference therebetween.

Further, in the bonding apparatus A1 of the thin plate substrate 1 and the supporting substrate 2, the cushioning members 15 including the elastically deformable material are provided on at least one or both of the holding plates 11, 12, whereby even if it is non-rigid and easy It is preferable that the deformed thin plate substrate 1 can be bonded to the entire surface of the support substrate 2 to reliably perform the entire surface bonding. The cushioning member 15 is preferably an elastic material which does not deteriorate under a vacuum atmosphere. It is preferable to form fine grooves or fine concavities and convexities at a predetermined interval or density on the surface of the cushioning member 15 so as to prevent breakage due to contact of one end of the thin plate substrate 1, and to prevent the generation of static electricity by bonding the entire surface without warping.

In the bonding apparatus A1 of the thin-plate substrate 1 and the support substrate 2 shown in FIGS. 2(a) and 2(b), the buffer member 15 is provided only on the holding plate 11 disposed below.

Further, although not shown in the drawings, the cushioning member 15 may be provided on the holding plate 12 disposed below, or may be provided on both of the holding plates 11 and 12.

Next, a separating apparatus B used to carry out the bonding and separating method of the embodiment of the present invention will be described.

As shown in FIGS. 3(a) to (c) or FIGS. 4(a) and 4(b), the separation device B1 of the thin plate substrate 1 and the support substrate 2 is used for supporting the thin plate substrate 1 and the reinforcement in a vacuum atmosphere. The substrate 2 is a device in which the bonded substrate 3 is bonded to the thin substrate 1 and the support substrate 2 by sandwiching the frame-shaped sealing member 3.

As described in detail, the separating device includes the penetrating member 20 that is disposed to face the sealing member 3 of the bonded substrate 4 and is relatively movable, and is a main constituent element.

The penetrating member 20 includes a tip or the like protruding from the tip end, which is configured to be relatively movable relative to the bonded substrate 4 in atmospheric air or in a liquid. And configured to: contact the at least one portion of the sealing member 20 with at least a portion of the sealing member 3 as the opposing movement of the bonding substrate 4 and the penetrating member 20, thereby removing at least a portion of the sealing member 3, and from here The air or liquid or the like which is an atmospheric pressure fluid is introduced into the vacuum space S formed inside the sealing member 3, and the inside air of the sealing member 3 is opened.

As a specific example of the penetrating member 20, as shown in Fig. 3 (a), (b) or Figs. 4 (a) and (b), in the atmospheric pressure liquid, the tip end 21 protruding from the tip end is fitted as the penetrating member 20 The sealing member 3 of the substrate 4 is reciprocated to be inserted into at least a portion of the sealing member 3, thereby opening the through hole 3a, and introducing a liquid as an atmospheric fluid from the through hole 3a toward the vacuum space S inside the sealing member 3. .

Further, although not shown in the drawings, a needle-shaped or other-shaped cutter or the like may be used as the penetrating member 20, or a through hole 3a may be formed in at least a portion of the sealing member 3 in the atmospheric air and from the through hole 3a. Introducing atmospheric air into the vacuum space S, or moving the penetrating member 20 inserted into a portion of the sealing member 3 over the entire circumference of the sealing member 3, from The seal 3 is separated.

According to the bonding and separating method and the separating apparatus B of the embodiment of the present invention, at least a part of the sealing member 3 of the bonded substrate 4 is removed in an atmospheric pressure atmosphere (in air or in a liquid). The airtightness of the vacuum space S in which the inside of the sealing member 3 is previously kept in a vacuum state is destroyed, and the fluid such as air or liquid enters the vacuum space S at one time and is opened to the atmosphere. By the opening of the atmosphere, the seal member 3 is pressed by the pressure from the outside and the pressure of the fluid entering the vacuum space S from the outside and the inside, so that the seal member 3 can be thinned without deforming the thin plate substrate 1. Peeling is performed without difficulty from the support substrate 2.

Therefore, the thin-plate substrate 1 can be separated from the support substrate 2 without difficulty and easily by vacuum destruction.

In particular, in the separating step, when the through hole 3a is opened by inserting the penetrating member 20 into at least a portion of the sealing member 3, and the atmospheric pressure fluid is introduced from the through hole 3a toward the vacuum space S to open the atmosphere, the atmosphere is at atmospheric pressure. The through hole 3a is formed in at least a portion of the sealing member 3, whereby fluid such as air or liquid enters the vacuum space S from the through hole 3a at a time. As a result, the seal member 3 is thinned by the pressure from the outside generated by the atmospheric pressure and the pressure of the fluid entering the vacuum space S, so that the thin plate substrate 1 and the support substrate 2 can be peeled off without difficulty.

Therefore, the thin plate substrate 1 can be reliably separated from the support substrate 2 by a simple method.

Further, in the separating device B, the thin plate substrate 1 can be easily separated from the support substrate 2 by vacuum destruction with a simple structure. Thereby, the manufacturing cost of the whole apparatus can be reduced.

Further, in the preparation step before the superposition step, when the sealing member 3 is disposed on the frame-like and concave step portion 2a formed on the outer peripheral portion of the support substrate 2, even if the step portion 2a is coated with the sealing member 3 Further, the sealing member 3 does not overflow from a predetermined position of the support substrate 2, and is disposed in a predetermined shape.

Therefore, the arrangement of the seal 3 can be easily performed and the preparation time before the overlap can be shortened. between.

As a result, the time of the entire stroke can be shortened to achieve higher speed.

In particular, when the through hole 3a is opened by inserting the through member 20 in a part of the sealing member 3, since the tip end of the penetrating member 20 can be inserted into a position colliding with the step portion 2a, even if the sealing member 3 is deformable In the material configuration, the shape of the seal 3 is not deformed, and the through hole 3a can be smoothly and reliably drilled.

As a result, reliability is improved.

Further, even when the fine uneven portions 2c and 2d are formed at a specific density between the abutting surface 2b other than the step portion 2a and the central portion of the inner surface 1b of the thin plate substrate 1 opposed thereto in the support substrate 2, even if fine uneven portions 2c and 2d are formed at a specific density The foreign matter enters between the contact surface 2b of the support substrate 2 and the thin plate substrate 1, and foreign matter is also induced to enter the concave portion 2d, whereby the thin plate substrate 1 is smoothly joined along the contact surface 2b of the support substrate 2.

Therefore, it is possible to prevent the bulging deformation of the thin plate substrate 1 caused by the engagement of the foreign matter.

In particular, when the formation positions of the fine uneven portions 2c and 2d are arranged inside the predetermined distance from the step portion 2a, when the seal 3 is placed on the step portion 2a by coating or the like, there is no seal 3 error. The entry of the fine recess 2d without entering the step portion 2a makes the removal of the seal 3 easy and convenient.

[Example 1]

Next, various embodiments of the present invention will be described with reference to the drawings.

As shown in FIG. 1 to FIG. 3 or FIG. 4, in the first embodiment, the sealing member 3 is composed of an adhesive material which can be dissolved by the dissolution liquid L, and at least one of the sealing members 3 to which the substrate 4 is bonded in the separating step. Part of the solution is immersed in the solution L to open the vacuum space S in the solution L.

As shown in FIG. 3 or FIG. 4, the separation device B1 as the thin plate substrate 1 and the support substrate 2 is provided with a liquid tank 30 in which the dissolved liquid L is stored, and a liquid container 30 in the liquid tank 30 so as to be immersed in the dissolved liquid L. At least a portion of the seal 3 of the substrate 4 is opposite and relatively free to move The member 20 is worn.

In the example shown in FIGS. 3(a) to 3(c), the liquid tank 30 as the dissolving liquid L is provided with a small liquid tank 31 into which at least a part of the sealing member 3 of the bonded substrate 4 is placed, and The large liquid tank 32 of the entire substrate 4 is bonded. In the small liquid tank 31, a part of the seal member 3 which is immersed in the solution L with respect to a portion is to be a blade tip 21 of the penetrating member 20 and a supporting member 22 to which the blade tip 21 is attached. It is provided to be reciprocally movable with respect to the small liquid tank 31.

In the first separating step shown in Fig. 3 (a), the blade tip 21 is moved toward a portion of the portion of the sealing member 3 which is immersed in the solution L in the small liquid tank 31, and is inserted into the seal. A through hole 3a is formed in one side of the piece 3. In the second separation step shown in Fig. 3(b), the blade tip 21 is separated from a side portion of the sealing member 3 which is immersed in the solution L in the opposite direction, thereby dissolving a large amount of the solution. The liquid L flows into the vacuum space S inside the sealing member 3 from the through hole 3a at one time. Further, in the third separation step shown in the last FIG. 3(c), the bonded substrate 4 is moved to the large liquid tank 32, and the entire sealing member 3 is immersed, thereby being dissolved by the dissolved liquid L.

Further, although not shown in the drawings, the blade edge 21 of the penetrating member 20 may be fixedly disposed to the small liquid tank 31, and a portion of the bonding substrate 4 immersed in the solution L may be directed toward the blade edge 21. A through hole 3a is formed in a side portion of the sealing member 3 in proximity to movement.

Further, in the example shown in FIGS. 4(a) and 4(b), the liquid tank 30 as the dissolved liquid L is provided with a large liquid tank 33 into which the entire bonded substrate 4 is placed. In the large liquid tank 33, both of the cutting edge 21 as the penetrating member 20 and the supporting member 22 to which the cutting edge 21 is attached are disposed opposite to each other with respect to one side of the sealing member 3 immersed in the dissolving liquid L. The large liquid tank 33 reciprocates freely.

In the first separating step shown in Fig. 4 (a), the blade tip 21 is moved toward the one side of the sealing member 3 which is immersed in the molten liquid L in the large liquid tank 33 as a whole, and is inserted into the sealing member. One side of the 3 is provided with a through hole 3a. Second point shown in Figure 4(b) In the step, the blade tip 21 is separated from the one side of the sealing member 3 which is entirely immersed in the solution L in the opposite direction, so that a large amount of the solution L flows from the through hole 3a to the inside of the sealing member 3 at a time. In the vacuum space S, the entire sealing member 3 is dissolved by the dissolved liquid L.

Further, although not shown in the drawings, the blade edge 21 of the penetrating member 20 may be fixedly disposed with respect to the large-sized liquid tank 33, and the bonded substrate 4 immersed in the dissolved liquid L as a whole may move toward the blade edge 21. A through hole 3a is formed in one side of the sealing member 3.

According to the bonding and separating method and the separating device B1 of the first embodiment of the present invention, the sealing member 3 of the bonded substrate 4 is removed in a state where at least a portion of the bonded substrate 4 is immersed in the solution L. At least a portion of the through hole 3a is opened by the penetrating member 20, whereby the airtightness of the vacuum space S is broken, so that the dissolved liquid L enters the vacuum space S at a time. With this, the sealing member 3 is thinned by the water pressure from the outside generated by the dissolved liquid L and the pressure of the dissolved liquid L entering the vacuum space S, and is eroded by the dissolved liquid L from both the outer side and the inner side. Thereby, the thin plate substrate 1 and the support substrate 2 can be peeled off without difficulty.

Therefore, the sealing member 3 can be dissolved and removed while separating the thin plate substrate 1 and the support substrate 2.

As a result, it is not necessary to separately increase the removal step of the sealing member 3, so that the subsequent steps of the separation step can be simplified, and the advantage that the entire stroke can be shortened can be achieved.

[Embodiment 2]

As shown in FIG. 5 to FIG. 7 or FIG. 8, the configuration of the second embodiment is different from that of the first embodiment shown in FIG. 1 to FIG. 3 or FIG. 4, and the other configuration is the same as that of the first embodiment, that is, In the superposition step, after the bonded substrates 4 are joined to each other to form the bonded substrate group 5, in the separation step, the respective stickers in the bonded substrate group 5 are removed in an atmospheric pressure atmosphere (in air or in a liquid). At least a part of the sealing material 3 of the substrate 4 is opened, and the vacuum space S is opened to the atmosphere, whereby the laminated body 6 and the pair of supporting substrates 2 which are bonded to each other by the thin plate substrate 1 are peeled off.

The bonding apparatus A2 which bonded the board|substrate 4 mutually is demonstrated.

As an example of the program set in the control unit of the bonding apparatus A2, first, The loading mechanism transports the two sets of bonded substrates 4 from the outside of the vacuum chamber 14 to the inside of the vacuum chamber 14, and as shown in Fig. 6(a), the holding plates 11 and 12 are carried in the upper and lower holding plates 11a, The predetermined position of 12a is held such that the respective thin plate substrates 1 face each other. At this stage, a binder (not shown) is applied to either or both of the opposing thin plate substrates 1 in the two sets of bonded substrates 4. And, at the same time, the vacuum chamber 14 is closed, and the inside thereof is depressurized to complete the preparation step.

Thereafter, when the inside of the vacuum chamber 14 reaches a predetermined degree of vacuum, the superimposing step is started, and as shown in FIG. 6(b), either or both of the holding plates 11, 12 are moved by the elevation driving portion 13. Moving in the direction in which they approach each other, the thin-plate substrates 1 in the two sets of bonded substrates 4 are bonded to each other with the bonding agent interposed therebetween, and are bonded to the substrate group 5 by the bonding agent.

Thereafter, as shown in FIGS. 5(a) and 6(c), the bonded substrate group 5 in which the bonding step is completed is carried out to the outside of the vacuum chamber 14 by the carry-out mechanism.

Further, although not shown in the drawings, depending on the bonding state of the laminated body 6, the vacuum chamber 14 can be used in the bonding apparatus A2 for bonding the substrates 4, but the atmosphere can be bonded in an atmospheric pressure atmosphere. The substrates 4 are bonded to each other to form a bonded substrate group 5.

Further, in the bonding and separating method of the second embodiment of the present invention, a case where the bonding substrate group 5 produced by the bonding apparatus A2 is subjected to a separation step in atmospheric air will be described.

In the separation step, in the atmospheric air, as shown in FIG. 5(a), at least a part of the sealing member 3 of each of the bonded substrates 4 in the bonded substrate group 5 is respectively separated by an instrument such as the penetrating member 20 to be described later. Cut and so on to remove. Thereby, the airtightness of the vacuum space S is broken, and the fluid such as air enters the vacuum space S at one time and is opened by the atmosphere (vacuum destruction).

By the opening of the atmosphere (vacuum breaking), only a part of the sealing member 3 of each of the bonded substrates 4 is sheared, and each of the sealing members 3 is also generated from the outside by the atmospheric pressure from both the outer side and the inner side. The pressure and the pressure of the fluid entering the vacuum space S are pressed, so that the thickness of the thick wall becomes thin and becomes weak throughout the entire circumference.

As a result, the crack 3b is easily formed on the sealing member 3, and as shown in Fig. 5(b), the thin plate substrate 1 can be peeled off from the supporting substrate 2 without any difficulty even if the thin plate substrate 1 is not deformed from the crack 3b. The laminated body 6 is formed.

Further, in the example shown in FIG. 5(a), the two blade tips 23 which protrude as the tips of the penetrating members 20 are disposed to reciprocate toward the sealing member 3 of each of the bonded substrates 4 in the bonded substrate group 5. Freely, a through hole 3a is formed in one side portion of the sealing member 3, respectively.

Further, although not shown in the drawings, the two blade tips 23 serving as the penetrating members 20 can be fixedly arranged, and the bonded substrate group 5 can be moved toward the blade edge 23 to be opened on one side of the sealing member 3, respectively. Through hole 3a.

Next, the laminate 6 in which the thin substrate 1 is bonded from the bonded substrate group 5 in the liquid and the separation device B2 of the pair of support substrates 2 will be described.

As shown in FIG. 7 or FIG. 8 , the separation device B2 includes a liquid tank 30 in which the dissolved liquid L is stored, and a bonded substrate 4 in the liquid crystal tank 30 and the bonded substrate group 5 immersed in the dissolved liquid L. At least a portion of the seal 3 is opposed to and relatively movable through the member 20.

In the example shown in FIGS. 7(a) to 7(c), the liquid tank 30 as the dissolved liquid L is provided with at least a part of the sealing member 3 placed in each of the bonded substrates 4 in the bonded substrate group 5. The small liquid tank 34 and the large liquid tank 35 which is placed in the entire bonded substrate group 5 are provided. In the small liquid tank 34, with respect to a portion of one side of each of the seals 3 immersed in the solution L, the two tips 23 as the penetrating members 20 and the supporting members 24 to which the tips 23 are attached are provided. Both of these are arranged to reciprocate with respect to the small liquid tank 34.

In the first separating step shown in Fig. 7 (a), the blade tip 23 is moved toward a portion of one side of each of the sealing members 3 immersed in the small liquid tank 34 in the small liquid tank 34, and is inserted into A through hole 3a is formed in one side of the sealing member 3, respectively. In the second separation step shown in FIG. 7(b), the blade tip 23 is separated from the one side of each of the seal members 3 immersed in the solution L in the opposite direction, thereby a large amount of The solution L flows into the vacuum space S inside the sealing member 3 from the through hole 3a at a time. Moreover, in the final Figure 7(c) In the third separation step shown, the bonded substrate group 5 is moved to the large liquid tank 35, and the entire sealing member 3 is immersed, respectively, to be dissolved by the dissolved liquid L.

Further, although not shown in the drawings, the blade edge 23 of the penetrating member 20 may be fixedly disposed with respect to the small-sized liquid tank 34, and a portion of the bonded substrate group 5 immersed in the solution L may be directed toward the blade edge. 23 is moved closer to each other to open a through hole 3a in one side portion of the sealing member 3.

Further, in the example shown in FIGS. 8(a) and 8(b), the liquid tank 30 as the dissolved liquid L is provided with a large liquid tank 36 into which the entire bonded substrate group 5 is placed. In the large liquid tank 36, the two cutting edges 23 as the penetrating member 20 and the supporting member 24 to which the cutting edge 23 is attached are used with respect to one side portion of each of the seal members 3 immersed in the dissolving liquid L. It is arranged to reciprocate with respect to the large liquid tank 36.

In the first separating step shown in Fig. 8(a), the blade tip 23 is moved toward the side of each of the seal members 3 of the solution L immersed in the large liquid tank 36 as a whole, and is inserted into the seal. A through hole 3a is formed in one side of the member 3. In the second separation step shown in FIG. 8(b), the blade edge 23 is separated from the one side of each of the sealing members 3 immersed in the solution L in the opposite direction, thereby dispersing a large amount of the solution. L flows into the vacuum space S inside the sealing member 3 from the through hole 3a at a time, and the entire sealing member 3 is dissolved by the dissolved liquid L.

Further, although not shown in the drawings, the blade edge 23 of the penetrating member 20 can be fixedly disposed with respect to the large-sized liquid tank 36, and the bonded substrate group 5 immersed in the solution L as a whole can be approached toward the blade edge 23. The through hole 3a is opened in one side portion of the sealing member 3 by moving.

According to the bonding and separating method and the separating apparatus B2 of the second embodiment of the present invention, the two bonded substrates 4 are joined to each other such that the thin-plate substrates 1 face each other, thereby forming the bonded substrate group 5, whereby even the thin-plate substrate Since the bonded thin plate substrate 1 can be peeled off from the support substrate 2 without any difficulty, the thin plate substrate 1 can be easily fabricated. The advantages of the laminated body 6 formed.

Further, when the fine uneven portions 2c and 2d are formed at a specific density between the abutting surface 2b other than the step portion 2a and the central portion of the inner surface 1b of the thin plate substrate 1 opposed thereto in the support substrate 2, When the laminate 6 in which the thin plate substrates 1 are bonded to each other is produced, there is an advantage that the gap formed between the thin plate substrates 1 can be made uniform.

As a result, it is possible to perform processes such as bonding of the thin plate substrates 1 with a good yield.

In addition, when the laminate 6 in which the thin films of the thin-plate substrates 1 are bonded to each other is produced, a laminate having fine irregularities on the surface of the film is often used. There is an advantage that even if fine irregularities are formed on the surface of the film, the film can be bonded to each other with good yield.

Further, in the above-described embodiment, the support substrate 2 is a support substrate which is formed in a planar shape on the surface opposite to the thin plate substrate 1. However, the present invention is not limited thereto, and deformation as shown in Figs. 9 to 11 may be used. The surface of the example is formed into a curved support substrate 2', 2".

The examples shown in Figs. 9(a) and 9(b) are formed such that the surface of the support substrate 2' is curved in an arc shape and protrudes convexly toward the inner surface 1b' of the thin plate substrate 1'. The support substrate 2' has a step portion 2a' and a curved surface abutting surface 2b'. In the superimposing step, the outer surface 1a' of the thin plate substrate 1' is convexly convexly joined to the support substrate 2' in a vacuum atmosphere so as to sandwich the frame-shaped seal member 3' disposed on the step portion 2a'. Thereby, the bonded substrate 4' in which the thin plate substrate 1' protrudes in a curved shape can be produced. In the separation step, in the atmospheric pressure atmosphere, at least a portion of the sealing member 3' in the bonded substrate 4' is cut or the like by the penetration member 20' (the blade tip 21') or the like, and is removed therefrom. The atmosphere is opened by placing a fluid into the vacuum space S' on the inner side of the seal 3'. Thereby, it is possible to perform a specific treatment on the thin plate substrate 1' that protrudes in a curved shape.

The examples shown in Figs. 10(a) and (b) are formed such that the surface of the support substrate 2" opposed to the inner surface 1b of the thin plate substrate 1" is curved in an arc shape and recessed in a concave shape. "having a step portion 2a" and a concave contact surface 2b". In the overlap step, in a vacuum atmosphere The support substrate 2" is configured to sandwich the outer surface 1a" of the thin plate substrate 1" in a concavely curved manner so as to sandwich the seal member 3" disposed on the step portion 2a". Thereby, the thin plate substrate 1' can be made curved. The recessed bonded substrate 4". In the separation step, in the atmospheric pressure atmosphere, at least a portion of the sealing member 3" in the bonded substrate 4" is cut by the penetrating member 20" (the blade tip 21") or the like, and is removed therefrom. Atmospheric opening is achieved by placing a fluid into the vacuum space S" on the inner side of the seal 3". Thereby, it is possible to perform a specific treatment on the thin plate substrate 1' which is recessed in a curved shape.

In the example shown in FIGS. 11(a) and 11(b), in the superposing step, the bonded substrate 4' in which the thin substrate 1' is joined to the curved surface of the support substrate 2' having a curved surface is used. And the bonding substrate 4 which is formed by bonding the thin-plate substrate 1 to the curved surface of the support substrate 2 which has a curved surface is joined, and the bonded substrate 4' can be formed by bending the curved substrate 1'. Group 5'.

In the separation step, in the atmospheric pressure atmosphere, at least the sealing members 3', 3" of the bonding substrates 4', 4" in the bonded substrate group 5' are bonded by the penetrating member 20' (the blade tip 23') or the like. A part is separately cut and the like to be removed, and from here, the fluid is opened by putting a fluid into the vacuum spaces S', S" on the inner side of the seals 3', 3". Thereby, the laminated body 6 curved in the curved shape can be easily manufactured.

Further, although not shown in the drawings, the sealing members 3' and 3" may be disposed without forming the step portions 2a' and 2a" or the abutting surfaces 2b' and 2b" on the support substrates 2' and 2". Framed.

1‧‧‧thin plate substrate

1a, 1a', 1a"‧‧‧ outer surface

1b, 1b', 1b"‧‧‧ inner surface

2‧‧‧Support substrate

2a‧‧‧Steps Department

2b‧‧‧Abutment

2c‧‧‧dose (convex)

2d‧‧‧ concave and convex (concave)

3‧‧‧Seal

3(3b)‧‧‧Seal (crack)

3a‧‧‧through hole

4‧‧‧Finished substrate

12‧‧‧ Keeping board

20(21)‧‧‧through members (knife tips)

S‧‧‧vacuum space

Claims (5)

A method for laminating and separating, characterized in that a specific process is performed in a state where a thin plate substrate is bonded to a support substrate for reinforcement, and after the end of the process, the thin plate substrate is separated from the support substrate; and the step of superposing comprises And bonding the thin plate substrate and the support substrate with a frame-shaped seal therebetween to form a bonded substrate in a vacuum atmosphere; and separating step of removing the bonded substrate in an atmospheric pressure atmosphere At least a part of the sealing member, and inserting a fluid into the vacuum space formed inside the sealing member to open the atmosphere; in the separating step, inserting the through member at at least a portion of the sealing member to open the through hole And introducing an atmospheric pressure fluid into the vacuum space from the through hole to open the atmosphere. In the bonding and separating method of claim 1, the sealing member is disposed on a frame-shaped and concave step portion formed on the outer peripheral portion of the support substrate. The bonding method according to claim 2, wherein a fine uneven portion is formed at a specific density between the abutting surface other than the step portion and the central portion of the inner surface of the thin plate substrate opposite to the supporting substrate. . The method of claim 1, 2 or 3, wherein the sealing member is made of an adhesive material that is soluble in a solution, and in the separating step, at least a portion of the sealing member of the bonded substrate is impregnated In the above-mentioned solution, the vacuum space is opened in the above-mentioned solution. A separating apparatus for separating a thin plate substrate from the support substrate in an atmospheric pressure atmosphere in a bonded substrate in which a seal member is sandwiched between a thin plate substrate and a reinforcing support substrate in a vacuum atmosphere; And has: a penetrating member disposed to face and move relative to the sealing member of the bonding substrate; the through member is configured to have a blade tip inserted into at least a portion of the sealing member, and A through hole is formed in at least a portion of the sealing member with respect to the relative movement of the blade edge, and an atmospheric pressure fluid is introduced into the vacuum space formed inside the sealing member from the through hole to open the atmosphere.