TW201437726A - Package structure of light emitting element - Google Patents

Abstract

The purpose of this invention is to propose a structure for improving hot spot issue of backlight module. A package structure of light emitting structure comprises a plurality of package elements, each of which includes a chamber which comprises a first side wall, a second side wall, and a bottom side wherein the height of the first side wall is greater than the height of the second side wall. The second side wall of each package element is next to the second side wall of a next package element. A plurality of light emitting elements is located inside the chamber.

Description

Light-emitting element package structure

The invention relates to a light emitting diode package structure, in particular to a light emitting diode package structure used in a liquid crystal display.

With the advancement of liquid crystal display technology, light weight and thinning have become the trend of the market. The backlight module of the liquid crystal display has gradually replaced the traditional cold cathode tube by the LED (Light Emitting Diode). It is about a light-emitting diode package structure.

Please refer to FIG. 1 , which is a top view of a light-emitting diode and a light guiding device in a conventional side-lighting backlight module, wherein a plurality of light-emitting diodes 110 are soldered to a light bar. Above 101, the light source emitted by the light-emitting diode is transmitted to the corners of the light guiding device through the light guiding device 120 to homogenize the light; but because the light-emitting diode itself is a point light source, the light-emitting side A is caused. The light source has not been homogenized by the light guiding device to generate hot spots or dark areas, and one of the conventional methods for solving this problem is to design the light guiding device in a local area to design a graphic such as 120A. Light compensation, however, still cannot completely solve the problem and increase the manufacturing cost of the light guiding device.

Recently, due to the improvement of the luminous efficiency of the light-emitting diode, the number of light-emitting diodes required to achieve the brightness specification of the liquid crystal display module is reduced, so that the distance P1 between the light-emitting diodes becomes larger, and the hot spot problem is more serious. However, if more light-emitting diodes 110 and microstructures 120A are used to solve the hot spot problem, the pitch P2 is made smaller, as shown in FIG. The schematic diagram of the light-emitting diode and the light guide plate in the conventional light-input backlight module of the prior art shows an increase in cost and a side effect of energy consumption.

Since the light-emitting diode backlight module is composed of at least one light-emitting diode as a light source, the light-emitting diode is a point light source compared to the conventional strip-shaped cold cathode tube light source. As shown in FIG. 3 , it is an optical pattern of light emitted by a conventional light-emitting diode, wherein the light curve 410 represents an angle and intensity distribution emitted by the light source, and the light is 0 degrees as the light intensity of 100%. According to the proportional standard, it can be seen that the half-luminance angle θ of the curve 410 reaches 50% of the light intensity is about 60 degrees. Under this condition, a hot spot phenomenon similar to that produced by the backlight module shown in FIG. 2 is simulated, as shown in FIG. It can be clearly seen that the hot spots H01~H0N generated by the point light source corresponding to each of the light emitting diode package bodies are the problems to be solved by the present invention.

In order to solve the above problems, an object of the present invention is to provide a package body of a light-emitting element, the package body comprising a plurality of package structures and a plurality of light-emitting elements, each package structure having a cavity, the cavity being at least a first a sidewall, a second sidewall, and a bottom portion, wherein the first sidewall has a height greater than the second sidewall, and the package main systems are adjacent to the second sidewall; and a plurality of light emitting components are disposed on the sidewall Inside the cavity.

120, 220, 1120‧‧‧ light guiding device

120A‧‧‧Microstructure

410, 710‧‧‧ light curve

500, 800, 1100‧‧‧Light-emitting component package structure

101, 201, 501, 801, 1101‧‧‧ boards

110, 510, 810, 1110‧‧‧Lighting element package body

512, 812‧‧‧ illuminating element package body cavity bottom

513, 813‧‧‧Light-emitting element package body cavity long side wall

514, 814, 1014‧‧‧Light-emitting element package body cavity short side wall

515, 815‧‧‧Light Emitter Wafer

516, 816‧‧‧Lighting elements filled with colloid

517, 817‧‧‧Light-emitting component package body central open area

519, 819‧‧‧Light-emitting device package body cavity

1028‧‧‧Light-emitting element package body side fence

1010A, 1010B‧‧‧Light-emitting component package body

1130‧‧‧LCD panel

1112‧‧‧Backlight module

θ, θ'‧‧‧half-angle angle

H01, H02, H, H0 (N-1), H0N, H71, H72, H7 (N-1), H7N‧‧

A‧‧‧ point light source light side

C‧‧‧Into the glossy surface

D‧‧‧Lighting surface of light guiding device

E‧‧‧Light-emitting element package body adjacent side wall

F‧‧‧Light-emitting element package body non-adjacent side wall

P1, P2‧‧‧ spacing

FIG. 1 is a schematic top view of a light-emitting diode and a light guide plate in a conventional side-lighting backlight module.

FIG. 2 is a schematic top view of a light-emitting diode and a light guide plate in a conventional side-lighting backlight module.

Fig. 3 is a view showing the light pattern of the light-emitting structure of the conventional light-emitting element package structure.

Figure 4 shows the hot spot simulation of the point source corresponding to the body of the LED package. Figure.

Fig. 5 is a side view showing the package structure of a light-emitting element of the first embodiment.

Fig. 6 is an enlarged view showing the light emitting element package main body of the first embodiment.

7A and 7B are diagrams showing the light pattern of the light-emitting structure of the optical analog conventional light-emitting element package structure of the first embodiment and the hot spot simulation of the point light source corresponding to the light-emitting diode package body.

Fig. 8 is a side view showing the package structure of a light-emitting element of the second embodiment.

Fig. 9 is an enlarged view showing the light emitting element package main body of the second embodiment.

10A and B are enlarged views of two types of light emitting element package bodies.

Figure 11 is a block diagram showing the structure of a display of the third embodiment.

Referring to FIG. 5, a package structure 500 for a light emitting device according to a first embodiment of the present invention includes a circuit board 501 and a plurality of light emitting device package bodies 510. The light emitting device package body 510 is illustrated in FIG. The illuminating device package body 510 is structurally provided with a cavity 519. The cavity 519 is configured to have an optical reflection characteristic on the inner wall, and the light source is reflected to the opening 517 of the cavity 519 to emit light, and the cavity 519 is bottom 512. The two long side walls 513 and the two short side walls 514 are surrounded, and the LED chip 515 is disposed on the bottom portion 512 to provide a light source for exciting the phosphor powder mixed in the inside of the groove and mixed in the colloid 516 to issue a specific The wavelength of the light source, the light-emitting diode chip may be selected as a single or two or more to achieve the light-emitting component light-emitting amount; the purpose of the present invention is to increase the light-emitting angle of the adjacent side of the plurality of light-emitting device package structures, in this embodiment In the example, the height of the short side wall 514 is lowered, so that the short side wall 514 is lower in height than the long side wall 513, so that the light source can emit light toward the side at a larger angle, but at the same time maintain the structural strength of the package structure. The importance of the presence of the inevitable side walls, in accordance with experimental results of the present invention, the degree of reduction of the short sidewall recommended between 50-95% of the longitudinal side walls, this range may be adjusted according to the needs of the design It is particularly effective in the range of 60% to 80%.

According to the embodiment, when the short side wall 514 is lowered to 60% of the long side wall 513, the result of simulating the light exit angle can be seen in FIG. 7A, and the half curve angle when the light curve 710 reaches 50% of the 0 degree angular light intensity. θ' is about 70 degrees, the design of the package structure can increase the light exit angle, and the hot spot H71~H7N generated by the point light source corresponding to each package body of the light emitting diode package is shown, as shown in Fig. 7B, the light exit angle After the increase, the difference in brightness between the point source and the dark area between the point sources can be alleviated, thereby improving the hot spot problem.

Referring to FIG. 8 , a package structure 800 for a light emitting device according to a second embodiment of the present invention includes a circuit board 801 and a plurality of light emitting device package bodies 810. The light emitting device package body 810 is illustrated in FIG. 9 . In an enlarged view, the light emitting device package body 810 is structurally included with a cavity 819. The cavity 819 is configured to have an optical reflection characteristic on the inner wall, and the light source is reflected to the upper opening 817 of the cavity 819 to emit light, and the cavity 819 is bottomed. 812, two long side walls 813, two short side walls 814 are surrounded, and a light emitting diode chip 815 is disposed at the bottom 812 to provide a light source for exciting the phosphor powder filled in the cavity 816 and mixed in the colloid 816 A light source of a specific wavelength is emitted. In this embodiment, the light emitting device package body 810 is disposed on the package structure 800 according to the functional requirements of the backlight module. The long sides of the package body are adjacent to each other, so that the side of the light emitting device package structure is increased. For the purpose of the light exiting angle, the long side wall 813 adjacent to each other side is lowered in height, so that the long side wall 813 is lower in height than the short side wall 814, so that the light source can be larger toward the side. Luminescence, but in order to maintain the structural strength of the package structure at the same time, the sidewall has an inevitable importance. According to the experimental results of the present invention, the degree of reduction of the long side wall 813 is recommended to be between 50% and 95% of the short side wall 814, according to The design needs are adjusted in this range, and the effect is particularly good in the range of 60% to 80%.

Further, the design method of reducing the sidewall of the light-emitting component package body is further adjusted according to the material strength of the package body, the light-emitting angle requirement, the manufacturing method, and the like, and the light-emitting component package body of FIG. Important original The structure for reducing the sidewall is not limited to a linear shape, and the design of the arc-shaped sidewall 1014 of the light-emitting component package body 1010A in FIG. 10A may be adopted; or the barrier design may be performed at the sidewall of the reduction, as shown in FIG. 10B. The component package body 1010B can control the side light output intensity, the light exit angle, or the side edge colloid structure by the shape and spacing of the fence 1028.

Please refer to FIG. 11 , which is a schematic diagram of a display structure 1111 according to a third embodiment of the present invention, which includes a liquid crystal display panel 1130 and a backlight module 1112. The backlight module 1112 includes a package structure 1100 and a light guide of a light-emitting component. The light guiding device 1120 is a flat or wedge-shaped structure having a light-incident surface C and a light-emitting surface D. The light source emitted by the light-emitting element enters the light guiding device 1120 from the light-incident surface C, and is evenly distributed. After the diffusion, the light-emitting surface D enters the liquid crystal display panel to provide a light source required for the liquid crystal display panel to play back the image; and the light-emitting component package structure 1100 includes a circuit board 1101 and a plurality of light-emitting element package bodies 1110, wherein the light-emitting element package body The structure is the same as that of the light-emitting device package body 510 in the first embodiment, and will not be described herein; the main system of the light-emitting device package is arranged adjacent to each other, and the normal vector of the sidewall E of the adjacent side is perpendicular to the light guide. The normal vector of the light-emitting surface D of the guiding device, the normal vector of the sidewall F of the non-adjacent side is parallel to the light-emitting surface D of the light guiding device, and the light-emitting component packaging structure is increased. Beam angle side, the side adjacent to the side wall height to be lowered, the side wall adjacent the side sidewall height lower than the height of the non-adjacent sides, so that the light source toward the larger side adjacent light emitting angle, to achieve the purpose of improving hot issue.

In summary, the light-emitting device package structure of the present invention can achieve the intended purpose and effect by the structures and devices disclosed in the above embodiments.

While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

510‧‧‧Lighting element package body

512‧‧‧Light-emitting element package body cavity bottom

513‧‧‧Light-emitting element package body cavity long side wall

514‧‧‧Light-emitting element package body cavity short side wall

515‧‧‧Light Emitter Wafer

516‧‧‧Lighting element filled with colloid

517‧‧‧Lighting element package body central opening area

519‧‧‧Light-emitting element package body cavity

Claims (8)

A package body of a light-emitting component, the package body comprising: a plurality of package structures, each package structure having a cavity formed by at least a first sidewall, a second sidewall and a bottom, wherein the package A sidewall has a height greater than the second sidewall, and the package main systems are arranged adjacent to the second sidewall; and a plurality of light emitting elements are disposed within the cavities. The package body of the light-emitting element of claim 1, wherein the second sidewall is at least partially lower in height than the first sidewall. The package body of the light-emitting element according to claim 1, wherein the second height of the second side of the structure is 50% to 95% of the first height of the first side. The package body of the light-emitting element according to the first aspect of the invention, wherein the light-emitting element comprises at least one light-emitting diode. A backlight module is assembled in a display, the backlight module comprises: a light guiding device having a light emitting surface and a light incident surface; a package structure of a plurality of light emitting elements, each of the package structures having a cavity The cavity is formed by at least a first sidewall, a second sidewall and a bottom, wherein a height of the first sidewall is greater than a height of the second sidewall, and a normal vector of the second sidewall of the package body is perpendicular to The normal vector of the light guiding surface of the light guiding device, the normal vector of the first side wall of the package body is parallel to the normal vector of the light guiding surface of the light guiding device; and a plurality of light emitting elements are disposed in the cavity. The backlight module of claim 5, wherein the second sidewall of the light emitting device package structure is at least partially lower in height than the first sidewall. The backlight module of claim 5, wherein the height of the second sidewall of the light emitting device package structure is 50% to 95% of the height of the first sidewall. The backlight module of claim 5, wherein the light emitting element comprises at least one light emitting diode.