CN108511576A - Light-emitting diode encapsulation structure - Google Patents

Abstract

A kind of light-emitting diode encapsulation structure, it includes a pedestal and an at least light-emitting diode chip for backlight unit, pedestal is more than the length of the second direction along vertical first direction along the length of first direction, a host cavity is formed on pedestal, host cavity penetrates through the both ends of the top and pedestal of pedestal on first direction, host cavity has a positive opening at the top of pedestal, lateral openings are respectively provided at the both ends on first direction of pedestal, the light that light-emitting diode chip for backlight unit is sent out is projected by the positive opening and lateral openings of pedestal.

Description

Light-emitting diode packaging structure

technical field

The invention relates to a light emitting diode packaging structure.

Background technique

Compared with traditional light sources, light emitting diodes (Light Emitting Diode, LED) have the advantages of light weight, small size, low pollution, long life, etc. As a new type of light source, they have been more and more widely used.

The shape of the light field produced by the traditional LED packaging structure is mostly circular, but in some lighting occasions, a long light field is often required, such as road lighting. If the light field of the street lamp is circular, part of the light will be Illuminating outside the range of the road will not only cause waste of resources but also may cause wrong traffic guidance. In this case, it is better to require the lighting area formed by the street lamp to be roughly elongated, with a larger lighting length in the direction along the road, and Has a smaller lighting length in the direction perpendicular to the road. However, in a common strip lighting device, the light will scatter along the direction parallel to the electrodes of the light emitting diodes, resulting in insufficient concentration. Therefore, how to provide a light-emitting diode packaging structure with a good concentration light field has become a technical problem to be solved by people in the industry.

Contents of the invention

In view of this, it is necessary to provide a light-emitting diode packaging structure with a strip-shaped light field shape with good concentration.

A light-emitting diode packaging structure, which includes a base and at least one light-emitting diode chip, the length of the base along the first direction is greater than the length along the second direction perpendicular to the first direction, and a housing is formed on the base cavity, the accommodating cavity runs through the top of the base and the two ends of the base along the first direction, the accommodating cavity has a positive opening on the top of the base, and the two ends of the base along the first direction respectively have The base has a side opening, the base includes an insulating part, and the insulating part includes a rectangular base, two first side walls extending vertically upward from the side of the base in the first direction, and extending vertically upward from the side of the base in the second direction. Two second side walls extending vertically upwards from the sides of the two first side walls, the two first side walls are parallel to each other, the two second side walls are parallel to each other, the two first side walls, the two second side walls The wall and the base together form the storage cavity, the height of the first side wall is greater than the height of the second side wall, the light emitting diode chip is arranged in the storage cavity, and the light emitted by the light emitting diode chip passes through the base The front opening and the side opening of the seat are ejected.

Further, the base includes a first electrode structure and a second electrode structure disposed on the insulating base.

Furthermore, the insulating base is a cuboid structure, the long side of the cuboid structure extends along the first direction, and the short side extends along the second direction.

Further, the height of the LED chip is smaller than the height of the second side wall.

Furthermore, the first electrode structure includes a first internal electrode, a first extension electrode and a first external electrode, the second electrode structure includes a second internal electrode, a second extension electrode and a second external electrode, the The first internal electrode and the second internal electrode are arranged at intervals on the side wall of the insulating seat in the accommodating cavity, and the first extension electrode and the second extension electrode are respectively arranged on the side surfaces of the base of the insulating seat, and respectively The base is electrically connected to the first internal electrode and the second internal electrode, and the first external electrode and the second external electrode respectively extend from the first extension electrode and the second extension electrode to the side wall of the insulating seat.

Furthermore, the light emitting diode chip is disposed in the receiving cavity of the base and electrically connected to the first internal electrode and the second internal electrode respectively.

Further, the LED packaging structure further includes a packaging layer, the packaging layer fills the entire cavity of the base and covers the LED chip.

Further, phosphor powder is contained in the encapsulation layer.

Furthermore, the top surface of the encapsulation layer is exposed from the front opening of the accommodating cavity, and is flush with the top surfaces of the two first side walls; The side surfaces of the two side walls are flush with each other; the side surfaces of part of the encapsulation layer are respectively exposed from the side openings of the receiving cavity, and are respectively flush with the outer end surfaces of the two second side walls.

In the above light emitting diode packaging structure, a receiving cavity is formed on the base, the receiving cavity has a positive opening at the top of the base, and side openings are respectively provided at both ends of the base along the first direction, and the light emitting diode The chip is arranged in the accommodation cavity of the base, and the light emitted by it is emitted from the front opening of the base and the side openings on both sides of the base along the first direction, the two first side walls, the two second The two side walls and the base jointly define the receiving cavity, and the height of the first side wall is greater than the height of the second side wall. Since the height of the first side wall is greater than the height of the second side wall, the LED package The structure of light emitting diode chip light beam can be easily emitted from the direction of the second side wall to increase the characteristics of wide-angle light emission, and at the same time, the second side wall can also reflect and concentrate part of the light beam emitted to the inner side of the second side wall from the front direction. The light emits from the direction of the opening so as to maintain the light intensity of the LED packaging structure.

Description of drawings

FIG. 1 is a perspective view of a light emitting diode package structure in an embodiment of the present invention.

FIG. 2 is a top view of the LED package structure in FIG. 1 .

FIG. 3 is a bottom view of the LED package structure in FIG. 1 .

FIG. 4 is a left side view of the LED package structure in FIG. 1 .

FIG. 5 is a right view of the LED package structure in FIG. 1 .

FIG. 6 is a side view of the LED package structure in FIG. 1 .

Explanation of main component symbols

Light-emitting diode packaging structure 100

Base 10

LED chip 20

encapsulation layer 30

Insulator 11

First electrode configuration 12

Second Electrode Configuration 13

Containment chamber 14

base 111

first side wall 112

Second side wall 114

first inner electrode 121

First extension electrode 122

first external electrode 123

Second inner electrode 131

Second extension electrode 132

Second external electrode 133

Front opening 141

Side opening 142

The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.

Detailed ways

The present invention will be further described in detail below in conjunction with the accompanying drawings.

Referring to FIGS. 1 to 6 , a light emitting diode packaging structure 100 provided in an embodiment of the present invention includes a base 10 , at least one light emitting diode chip 20 disposed in the base 10 , and a light emitting diode chip 20 disposed in the base 10 and An encapsulation layer 30 covering the LED chip 20 .

Referring to FIG. 2 , the base 10 includes an insulating seat 11 and a first electrode structure 12 and a second electrode structure 13 disposed on the insulating seat 11 . The insulating base 11 is a cuboid structure, its long side extends along the first direction X, and its short side extends along the second direction Y. The insulating base 11 includes a rectangular base 111 , a first side wall 112 extending vertically upward from two long sides of the base 111 , and a second side wall 114 vertically extending upward from two short sides of the base 111 . The two first side walls 112 are parallel to each other, and the two second side walls 114 are parallel to each other. The height of the first sidewall 112 is greater than the height of the second sidewall 114 . The two first side walls 112 , the two second side walls 114 and the base 111 jointly define a receiving cavity 14 . Please refer to FIG. 1 , the accommodating cavity 14 passes through the top of the insulating seat 11 and both ends of the insulating seat 11 along the first direction X, and has a forward opening 141 at the top of the insulating seat 11 and The lateral openings 142 are located at both ends of the insulating base 11 along the first direction X.

Please refer to FIG. 2 to FIG. 5 , the first electrode structure 12 and the second electrode structure 13 are arranged on the insulating base 11 at intervals. Wherein, the first electrode structure 12 includes a first inner electrode 121 , a first extension electrode 122 and a first outer electrode 123 . Likewise, the second electrode structure 13 includes a second inner electrode 131 , a second extension electrode 132 and a second outer electrode 133 . The first internal electrode 121 and the second internal electrode 131 are arranged on the base 111 of the insulating seat 11 in the receiving cavity 14 at intervals from each other, and are used for electrical connection with the LED chip 20 . The first extension electrode 122 and the second extension electrode 132 are respectively disposed on the lower surface of the base 111 of the insulating base 11 , and are respectively connected to the first internal electrode 121 and the second internal electrode 131 through the base 111 . The first external electrode 123 and the second external electrode 133 are respectively extended from the first extension electrode 122 and the second extension electrode 132 to the first side wall 112 of the insulating base 11 for electrical connection with an external power source.

The light emitting diode chip 20 is disposed in the receiving cavity 14 of the base 10 and is electrically connected to the first internal electrode 121 and the second internal electrode 131 respectively through wires. The height of the LED chip 20 is smaller than the height of the second sidewall 114 .

The encapsulation layer 30 fills the entire cavity 14 of the base 10 and covers the LED chip 20 and the two second sidewalls 114 . The top surface of the encapsulation layer 30 is exposed by the forward opening 141 of the housing cavity 14, and is flush with the top surfaces of the two first side walls 112; The sides of the sidewalls 114 are flush with each other; the side surfaces of part of the encapsulation layer 30 are respectively exposed by the side openings 142 of the receiving cavity 14 and flush with the outer end surfaces of the two second sidewalls 114 respectively. The encapsulation layer 30 is a transparent structure, and its material can be silicon, epoxy resin and the like. Phosphor powder can also be doped into the encapsulation layer 30 . The phosphor material can be selected from one of garnet, silicate, nitride, nitrogen oxide, phosphide, and sulfide, or a combination of several compounds.

Referring to FIG. 2 and FIG. 6, in the light emitting diode packaging structure 100 of the present invention, a housing cavity 14 is formed on the base 10, and the housing cavity 14 has a forward opening 141 on the top of the base 10. The two ends of the seat 10 along the first direction X have side openings 142 respectively, and the light emitting diode chip 20 is arranged in the receiving cavity 14 of the base 10 , and the light emitted by it is transmitted by the forward opening 141 of the base 10 and the base 10 The side openings 142 on both sides of the first direction X are emitted, so that the light field generated by the light emitting diode chip 20 can be elongated and extended in the first direction X, so that a strip-shaped light field can be formed shape. Since the height of the first side wall 112 is greater than the height of the second side wall 114, the light beam of the light emitting diode chip 20 of the light emitting diode packaging structure 100 can be easily emitted from the direction of the second side wall 114 to increase the wide-angle light emission characteristics, and at the same time, the second side wall The two sidewalls 114 can also reflect part of the light beams incident on the inside of the second sidewalls 114 and concentrate them out from the direction of the opening 141 , so as to maintain the light intensity of the LED package structure 100 .

It can be understood that, for those skilled in the art, various other corresponding changes and deformations can be made according to the technical concept of the present invention, and all these changes and deformations should belong to the protection scope of the claims of the present invention .

Claims (9)

1. A light-emitting diode packaging structure, which includes a base and at least one light-emitting diode chip, characterized in that: the length of the base along the first direction is greater than the length along the second direction perpendicular to the first direction, the A storage cavity is formed on the base, and the storage cavity passes through the top of the base and the two ends of the base along the first direction. The two upward ends respectively have side openings, the base includes an insulating seat, the insulating seat includes a rectangular base, two first side walls extending vertically upward from the side of the base in the first direction, and a Two second side walls extending vertically upwards from the sides of the base in the second direction, the two first side walls are parallel to each other, the two second side walls are parallel to each other, and the two first side walls , the two second side walls and the base jointly enclose the storage cavity, the height of the first side wall is greater than the height of the second side wall, the light-emitting diode chip is arranged in the storage cavity, and the light-emitting diode The light emitted by the chip is emitted through the front opening and the side opening of the base. 2. The light emitting diode packaging structure according to claim 1, wherein the base comprises a first electrode structure and a second electrode structure disposed on the insulating seat. 3 . The light emitting diode package structure according to claim 2 , wherein the insulating seat is a cuboid structure, the long side of the cuboid structure extends along the first direction, and the short side extends along the second direction. 4 . 4. The light emitting diode package structure according to claim 1, wherein the height of the light emitting diode chip is smaller than the height of the second sidewall. 5. The light emitting diode packaging structure according to claim 2, wherein the first electrode structure comprises a first internal electrode, a first extension electrode and a first external electrode, and the second electrode structure comprises a second internal electrode electrode, a second extension electrode, and a second external electrode, the first internal electrode and the second internal electrode are arranged at intervals on the side wall of the insulating seat in the accommodating cavity, the first extension electrode and the second extension electrode The electrodes are respectively arranged on the side surfaces of the base of the insulating seat, and are respectively electrically connected to the first internal electrode and the second internal electrode through the base, and the first external electrode and the second external electrode are respectively composed of the first extension electrode and the second The two extension electrodes extend to the side wall of the insulating seat. 6 . The light emitting diode packaging structure according to claim 5 , wherein the light emitting diode chip is disposed in the receiving cavity of the base and electrically connected to the first internal electrode and the second internal electrode respectively. 7 . 7. The light emitting diode packaging structure according to claim 1, characterized in that: the light emitting diode packaging structure further comprises a packaging layer, the packaging layer is filled in the entire cavity of the base, and covers the LED chips. 8 . The LED packaging structure according to claim 1 , wherein phosphor powder is contained in the packaging layer. 9. The light emitting diode packaging structure according to claim 7, wherein the top surface of the packaging layer is exposed from the front opening of the receiving cavity, and is flush with the top surfaces of the two first side walls flat; the sides of the encapsulation layer are flush with the sides of the two second side walls; part of the sides of the encapsulation layer are respectively exposed by the side openings of the storage cavity, and are respectively connected to the two second side walls The outer end faces of the two side walls are flush.