TW201340172A - Transparent substrate having nano pattern and method of manufacturing the same - Google Patents

Abstract

Provided are a transparent substrate having a nano pattern, and a method of manufacturing the same, which enables the nano pattern to be easily formed on the transparent substrate and has the nano pattern applicable to a large sized substrate by forming a resin layer made of transparent material on a transparent substrate; forming at least one or more unit pattern parts composed of a first pattern area and a second pattern area in which a plurality of grid patterns are formed, and a protrusion pattern formed between the first pattern area and the second pattern area, on the resin layer; and forming a nanoscale metal layer on the protrusion pattern.

Description

Transparent substrate with nano pattern and method of manufacturing same

The present invention claims priority to Korean Patent No. 10-2011-0137217, filed on Dec. 19, 2011. This is incorporated herein by reference.

The present invention relates to the field of forming a nano pattern, and more particularly to a transparent substrate having a nano pattern.

In manufacturing a semiconductor device, it is necessary to apply various fine patterns such as a word line, a digit line, a contact, and the like. In general, these fine patterns are formed using a lithograph technology.

One of the widely used contact lithography processes is to form a pattern over a large area. However, due to the limit of diffraction of light, the pitch of one of the fine patterns that can be formed is limited (1-2 μm).

Accordingly, in order to solve this problem, a stepper method, a scanner method, a holographic lithography method, and the like have been developed. However, these methods require complicated and sophisticated instruments and are expensive. Moreover, in these methods, the area in which the pattern can be formed is limited. That is to say, the conventional lithography technology is basically limited in the realization of the nano-scale fine pattern due to the limitation of the device and the process characteristics. More precisely, when conventional lithography techniques are used, it is difficult to uniformly form a nanoscale pattern in a large area of more than 8 Å.

Based on the above problem, Korean Patent Publication No. 2011-0024892 discloses a method of forming a porous metal thin film using a porous template made of a metal material, and proposes to use a porous film. Metal film as a catalyst (catalyst) to form a nano pattern. This method has a problem in that it is inconvenient because a porous template needs to be prepared in advance; and since a catalyst growth method is used, the nano pattern can be formed only in a desired region. Moreover, this method has a problem in that the nano pattern cannot be formed on a transparent substrate.

[Reference Known Technology]

Reference Patent 1: Korean Patent Publication No. 2011-0024892.

Accordingly, the present invention is intended to solve the problems and disadvantages of the above-described prior art. One aspect of the present invention provides a transparent substrate having a nano pattern and a method of manufacturing the same, which enables a nano pattern to be easily formed on a transparent substrate and has a nano pattern which can be applied to a large-sized substrate. The method comprises: forming a resin layer made of a transparent material on a transparent substrate; and forming at least one or more of the first pattern region and the second pattern region formed by forming one of the plurality of grating patterns The unit pattern portion and a protrusion pattern between the first pattern region and the second pattern region are formed on a resin layer; and a nano-scale metal layer is formed on the protrusion pattern.

According to an aspect of the invention, a method for manufacturing a transparent substrate having a nano pattern includes: forming a resin layer made of a transparent material on a transparent substrate; and forming a plurality of grids respectively Forming at least one of the first pattern region and the second pattern region and at least one or more unit pattern portions composed of a protrusion pattern between the first pattern region and the second pattern region is formed on the resin layer And forming a nano-scale metal layer over the protrusion pattern.

According to another aspect of the present invention, a transparent substrate having a nano pattern is provided, comprising: a transparent substrate; a resin layer formed on the transparent substrate and made of a transparent material; at least one or a plurality of unit pattern layers are formed on the resin layer; a nano-scale metal layer is formed on the unit pattern layer, wherein the unit pattern layer comprises: a first pattern area and a second pattern area, A plurality of grid patterns are formed therein; and a protrusion pattern is formed between the first pattern region and the second pattern region, wherein the metal layer is formed on the protrusion pattern.

The invention has the advantages that the nanometer scale grating pattern can be uniformly and thoroughly formed. Formed in a wide area of the transparent substrate.

Moreover, the present invention has the advantages that, in addition to the aforementioned nano-scale grid pattern, a nano-scale metal layer can be uniformly formed on the transparent substrate, thereby providing transparency with conductivity equivalent to ITO at low cost. Substrate.

Further, the master mold used in the present invention is recyclable before it is damaged, so that there are economic advantages such as raw material cost and manufacturing cost savings.

10‧‧‧Master mode

10a‧‧‧ structure

10b‧‧‧Unit mold pattern section

11‧‧‧Grid mold pattern

13‧‧‧First mold pattern area

15‧‧‧ concave pattern

17‧‧‧Second mold pattern area

20‧‧‧Transparent substrate

30‧‧‧ resin layer

30b‧‧‧Unit pattern section

31‧‧‧ grille pattern

33‧‧‧First pattern area

35‧‧‧protrusion pattern

37‧‧‧Second pattern area

40‧‧‧ meter scale metal layer

A‧‧‧Width

B‧‧‧Width

C‧‧‧Width

D‧‧‧Width

E‧‧‧Width

F‧‧‧Width

S1, S3, S5‧‧‧ steps

S31, S33, S35, S37‧ ‧ steps

The aspects, functions, and advantages of the above and other embodiments of the present invention will be described in conjunction with the following drawings, wherein: FIGS. 1 and 2 illustrate a method of manufacturing a transparent substrate having a nano pattern according to the present invention. FIG. 3 to FIG. 9 are diagrams showing an example of a process for fabricating a transparent substrate having a nano pattern according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the embodiments of the invention may be embodied in a variety of different forms and are not intended to limit the invention. The embodiments of the present invention are provided to complete the description of the present application, and the subject matter of the present invention is fully presented to those skilled in the art. Further, a detailed description of known structures or functions in the technical field related to the present invention will be omitted, without departing from the spirit of the invention. It should also be noted that the meaning of a particular term or sentence should be defined on the basis of the content of the entire patent specification. In the description of the drawings, the same reference numerals will be used to refer to the same elements in the drawings.

1 and 2 are flow charts showing a method of fabricating a transparent substrate having a nano pattern according to the present invention.

Referring to FIG. 1 and FIG. 2, in accordance with the present invention, a method for fabricating a transparent substrate having a nano pattern can include the steps of forming a resin layer made of a transparent material on a transparent substrate (step S1). Forming at least one or more unit pattern parts (wherein the unit pattern portion is formed by one of a plurality of grid patterns) And a second pattern area and a protrusion pattern formed between the first pattern area and the second pattern area on a resin layer (step S3); and forming a A nanoscale metal layer is over the protrusion pattern (step S5).

The material of the transparent substrate used in the step S1 may be glass, quartz, or a polymer made of a transparent material, such as a well-known polymer material such as polyterephthalic acid. Polyethylene terephthalate (PET), polycarbonate (PC), polyimide (PI). In addition to this, various flexible substrates can also be used. This material is not limited to this.

After the transparent substrate is prepared, a resin layer made of a transparent material is coated on the transparent substrate. At this time, the resin may use a thermosetting polymer or a photo curable polymer. Meanwhile, in order to improve the bonding ability between the resin layer and the transparent substrate, an adhesive may be applied onto the transparent substrate before applying the resin, and then A resin is applied over the transparent substrate.

After performing step S1, at least one or more unit pattern portions composed of a first pattern region and a second pattern region respectively formed with a plurality of grid patterns, and the first pattern region and the second pattern region A protrusion pattern is formed on the resin layer (step S3). In particular, step S3 can be carried out as follows.

First, a master mold is produced (step S31), the master mold having at least one or more unit mold pattern portions composed of a first mold pattern region and a second mold pattern region in which a plurality of grid mold patterns are respectively formed. And a concave mold pattern formed between the first and second mold pattern regions.

The nano-scale grid mold patterns are first formed on a raw material of one of the main molds by using a space lithography process, for example, a manufacturing one disclosed in Korean Patent Application No. 10-2010-0129255. A method of having a large area of nanoscale patterns. In the present invention, the master mold can be manufactured by forming a concave mold pattern to distinguish a first mold pattern region and a second mold pattern region, and forming one or more unit mold pattern portions. At this time, the die pattern forming method can be performed by an electron beam lithography process (electron-beam) Lithography process). However, the invention is not limited thereto.

Meanwhile, the first mold pattern region or the second mold pattern region may have a width falling within a range of 50 to 100 nm. The die pattern may have a width falling within the range of 200 to 1000 nm. The master mold produced by this method is not disposable, but can be used until it is damaged. Moreover, the master mold can be used in an imprinting process to achieve economic advantages such as raw material costs and manufacturing cost savings.

Then, the main mold system manufactured in step S31 is disposed on an upper portion of the resin layer, and one or more unit pattern portions corresponding to one or more unit mold pattern portions are passed through an imprint process. The resin layer is pressed to be formed on the resin layer (step S33). Here, the unit pattern portion refers to a structure including a first pattern region corresponding to the first mold pattern region, a second pattern region corresponding to the second mold pattern region, and a corresponding concave pattern. Projection pattern unit. The grid patterns corresponding to the grid mold patterns are provided in the first pattern area and the second pattern area.

A hardening process of one of the resin layers is performed (step S35). At this time, when the resin layer is made of a thermosetting polymer, the resin layer is hardened by heating. When the resin layer is made of a photohardenable polymer, the resin layer is hardened by irradiation with ultraviolet light. Next, the step S3 of the present invention is carried out to remove the main mold from the resin layer (step S37).

Then, in step S5, the nano-scale metal layer is formed on the protrusion pattern of the resin layer.

More precisely, a metal is first deposited on the grid patterns and the protrusion pattern. At this time, the metal may use any of the following: Al, Cr, Ag, Cu, Ni, Co, and Mo, or an alloy thereof. However, the invention is not limited thereto. In addition, other suitable metals may be used as needed. Further, the metal deposition method may be at least one of the following: a sputtering method, a chemical vapor deposition method, and an evaporation method. But this is only an example. In addition to the above methods, all deposition methods can be used, including existing techniques that have been commercialized, and technologies that can be implemented in the future.

Meanwhile, a height of one of the deposited metals may be formed to be larger than a pitch value of the grating patterns, and the metal may be uniformly deposited on each of the grating patterns and the protrusion patterns. on. This is to easily remove the metal formed on the grid patterns in one etching process to be performed later.

After the metal is deposited, a wet etching process is performed thereon, whereby isotropic etching is performed on the exposed sides of the metal. Accordingly, the metal deposited on the grid patterns is etched or a portion bonded to the grid patterns is stripped. Therefore, the metal deposited on the grid patterns is removed, and the metal remaining on the protrusion pattern is formed to form a metal layer. The reason for removing the metal deposited on the grating patterns while retaining the metal on the protrusion pattern to form the metal layer is between the metal deposited on the grating patterns and the etching solution used during the wet etching process. A contact area is greater than the metal deposited on the pattern of protrusions. According to this, a transparent substrate having the nano pattern of the present invention, which comprises a nano pattern and a nano-scale metal layer, can be produced.

According to the present invention, when the wet etching method is used, it can be performed even at room temperature, and since the manufacture of the master mold can be performed separately, the flexibility of the process can be ensured. In addition, the main mold is available before damage, so it can save raw material costs and manufacturing costs.

Moreover, according to the present invention, the nano patterns can be uniformly and thoroughly completed in a wide area of the transparent substrate, and the nano-scale metal layer can be uniformly formed on the transparent substrate. Accordingly, the present invention has an advantage of being able to provide a transparent substrate having conductivity equivalent to ITO at a low cost, and as one of ITO substitutes, the Ag grid can be manufactured as a nano-scale pattern. Accordingly, the present invention can be applied to various fields such as a touch panel, a liquid crystal device, a solar cell, and the like.

3 to 9 are diagrams showing an example of a process for fabricating a transparent substrate having a nano pattern according to the present invention.

Referring to Figures 3 through 9, as shown in Figure 3, a structure 10a is formed having a plurality of nano-scale grid mold patterns 11 formed on an upper portion thereof. At this time, the spacer lithography method can be used as a method of forming the grid mold pattern 11. This is the same as the description of Figure 2 above.

Next, as shown in FIGS. 4 and 5, the structure 10a of FIG. 3 is patterned by an electron beam lithography method to produce a master mold 10 having at least one or more unit mold pattern portions 10b. At this time, the unit mold pattern portion 10b is composed of a first mold pattern region 13, a second mold pattern region 17, and the first mold pattern region 13 and the second mold pattern region. A die pattern 15 is formed between 17. The first mold pattern region 13 and the second mold pattern region 17 have a plurality of grid mold patterns 11.

Here, one width B of the female mold pattern 15 is formed to be larger than one width A of the first mold pattern region 13 or one width C of the second mold pattern region 17. More precisely, the width B of the die pattern 15 can be formed to fall within the range of 200 to 1000 nm. The width A of the first mold pattern region 13 or the width C of the second mold pattern region 17 may be formed to fall within the range of 50 to 100 nm. However, the invention is not limited thereto. In addition, one of the recess patterns 15 may have a recess depth greater than a height of the grid mold pattern 11.

Next, as shown in Fig. 6, an imprint process is performed to pressurize the resin layer 30 formed on the transparent substrate 20 in a main mode (10 in Fig. 5) in which one or more unit mold pattern portions 10b are formed. . The detailed description of the transparent substrate 20 and the resin layer 30 is the same as that described above with reference to FIGS. 1 and 2, and therefore will not be described here. After performing a photohardening or a heat curing process, as shown in FIG. 7, the main mold (10 in FIG. 5) is separated from the resin layer 30 so as to correspond to the unit mold pattern portion (10b in FIGS. 5, 6). One or more unit pattern portions 30b are formed over the resin layer 30. Here, the unit pattern portion 30b is composed of a first pattern region 33, a second pattern region 37, and a protrusion pattern 35 formed between the first pattern region 33 and the second pattern region 37. The first pattern region 33 and the second pattern region 37 have a plurality of grid patterns 31.

Here, one of the widths E of the protrusion pattern 35 may be formed to be larger than one of the width D of the first pattern region 33 or one of the widths F of the second pattern region 37. More precisely, the width E of the protrusion pattern 35 may be formed to fall within the range of 200 to 1000 nm. The width D of the first pattern region 33 or the width F of the second pattern region 37 may be formed to fall within a range of 50 to 100 nm. However, the invention is not limited thereto. In addition, one of the heights of the protrusion pattern 35 may be formed to be larger than a height of the grid mold pattern 31.

Next, a metal system is deposited on the grid mold patterns 31 and the protrusion patterns 35, and the metal deposited on the grid mold pattern 31 is removed in the wet etching process to form the nano-scale metal layer 40. Above the protrusion pattern 35, as shown in FIG. According to this, a large-area transparent substrate having a nano pattern can be obtained as shown in FIG.

Although the embodiments are described with reference to a number of illustrative embodiments of the embodiments, Numerous other modifications and embodiments that fall within the spirit and scope of the principles of the inventions will be apparent to those skilled in the art. It is understood that the embodiments are described with reference to a number of illustrative embodiments, and are not intended to limit the scope of the invention. Therefore, all modifications and embodiments that fall within the scope of the invention are intended to be included within the scope of the invention.

S1, S3, S5‧‧‧ steps

Claims (20)

A manufacturing method of a transparent substrate having a nano pattern, comprising: forming a resin layer made of a transparent material on the transparent substrate; and forming at least one or more of the plurality of grating patterns a unit pattern portion composed of the first pattern region and a second pattern region and a protrusion pattern between the first pattern region and the second pattern region are formed on a resin layer; and forming a nanometer-scale metal layer Above the protrusion pattern. The method of claim 1, wherein the height of the protrusion pattern is greater than the height of the grid patterns. The method of claim 1, wherein the width of the protrusion pattern is greater than a width of the first pattern area or a width of the second pattern area. The method of claim 1, wherein the step of forming the at least one or more unit pattern portions comprises: producing a master mold having: forming one of a plurality of grid mold patterns respectively a mold pattern area and a second mold pattern area, and at least one or more unit mold pattern portions, consisting of a concave pattern formed between the first mold pattern area and the second mold pattern area; An imprint process, forming a portion of the unit mold pattern corresponding to the main mold formed on the resin layer; Hardening the resin layer; and separating the main mold from the transparent substrate. The method of claim 4, wherein the first mold pattern region or the second mold pattern region has a width falling within a range of 50 to 100 nm. The method of claim 4, wherein the grid lithography process is used to form the grid mold patterns. The method of claim 4, wherein the electron beam lithography process is used to form the die pattern. The method of claim 4, wherein the die pattern has a width falling within the range of 200 to 1000 nm. The method of claim 1, wherein the step of forming the metal layer comprises: depositing a metal on the grating patterns and the protrusion pattern; and removing the deposition by using a wet etching method. The metal on the grid pattern. The method of claim 9, wherein the height of the deposited metal is greater than a distance between the grid patterns. The method of claim 9, wherein the step of depositing the metal is performed by at least one of the following: a sputtering method, a chemical vapor deposition method, and an evaporation method. The method of claim 9, wherein the metal layer comprises the following Any of them: Al, Cr, Ag, Cu, Ni, Co, and Mo, or an alloy thereof. The method of claim 1, wherein the resin layer is composed of a thermosetting polymer or a photohardenable polymer. A transparent substrate having a nano pattern comprising: a transparent substrate; a resin layer formed on the transparent substrate and made of a transparent material; at least one or more unit pattern layers formed on the resin And a nano-scale metal layer formed on the unit pattern layer; wherein the unit pattern layer comprises: a first pattern area and a second pattern area, wherein a plurality of grids are respectively formed a pattern; and a protrusion pattern formed between the first pattern region and the second pattern region, wherein the metal layer is formed on the protrusion pattern. The transparent substrate of claim 14, wherein the height of the protrusion pattern is formed to be greater than a height of the grid pattern. The transparent substrate of claim 14, wherein the width of the protrusion pattern is formed to be larger than a width of the first pattern region and a width of the second pattern region. The transparent substrate of claim 14, wherein the first pattern region and the second pattern region have a width falling within a range of 50 to 100 nm. degree. The transparent substrate of claim 14, wherein the protrusion pattern has a width falling within a range of 200 to 1000 nm. The transparent substrate according to claim 14, wherein the metal layer comprises any one of the following: Al, Cr, Ag, Cu, Ni, Co, and Mo, or an alloy thereof. The transparent substrate of claim 14, wherein the resin layer is composed of a thermosetting polymer or a photohardenable polymer.