TW201305320A - Flame-retardant epoxy resin composition and use thereof - Google Patents

Abstract

The present invention is related to a flame-retardant epoxy resin composition. The composition comprises (a) epoxy resin; (b) curing agent; (c) flame retardant; (d) curing accelerator; and (e) inorganic filler, wherein said flame retardant comprises melamine cyanurate and cyclic phosphazene having the structure of formula (I): wherein R and m are as defined in the specification. The flame-retardant epoxy resin composition of the present invention not only has excellent flame retardancy, but also enhances the adhesion, IR reflow resistance, and electrical stability of epoxy resin materials, so it is suitable for package of all kinds of elements.

Description

Flame retardant epoxy resin composition and use thereof

The present invention relates to a flame retardant epoxy resin composition and uses thereof.

Epoxy molding compound has excellent mechanical, heat, acid and alkali resistance and electrical properties. It makes epoxy resin very important in composite materials such as sports equipment, automobile and aerospace industry. Status, because epoxy resin has easy curing, low cure shrinkage, good adhesion, mechanical and chemical resistance, it has been widely used in 3C industry (computer, communication, consumer electronics) IC in recent years. Packaging material. The main purpose of the IC package is to protect the wafers, wires, and wires from moisture, dust, and other external forces in the air, thereby increasing the life and reliability of the wafer. In recent years, with the increasing reliability and safety requirements of epoxy resin in the IC packaging industry, the requirements for flame retardant performance of epoxy resins have gradually increased.

The flame retardant properties of epoxy resin materials are generally poor, so it is necessary to add flame retardant to achieve the effect of flame retardant. At present, there are many kinds of flame retardants used in epoxy resin materials, which can be classified into inorganic salt flame retardants and organic resistors. Combustion agent and organic and inorganic mixed flame retardant. Inorganic flame retardant is the most widely used flame retardant, mainly metal compounds, including zinc borate, zinc molybdate, metal hydroxide, composite metal hydroxide. Etc., wherein the metal hydroxide application products are mainly aluminum hydroxide and magnesium hydroxide. However, the use of a metal compound in an epoxy resin material has a limited flame retardancy for improving the resin composition, and a large amount of addition is required to meet the required flame retardant standard, and the moisture absorption during use causes the curing time of the resin composition to be prolonged. Causes operational problems on the client side. The main component of the organic flame retardant is organic matter, and the main products are halogen, phosphate, halogenated phosphate, etc. However, the halogen-containing flame retardant generates corrosive and toxic hydrogen halide gas, and has a large amount of smoke. And when burning, there may be doubts about harmful carcinogenic gas such as halogenated dioxin or halogenated furan. Therefore, in the Directive on "Waste Electrical, Electronic Equipment (WEEE)", the electronic and electrical equipment are specified. Restriction of Hazardous Substances (RoHS) in EEE, which clearly prohibits the use of polybrominated biphenyl (PBB), polybrominated diphenyl ethers (PBDE), etc. Bromine compound. Phosphate flame retardants are easily hydrolyzed to produce phosphoric acid, which tends to corrode the wafer and affect the reliability of the finished product. The organic-inorganic mixed flame retardant is an improved product of an inorganic salt-based flame retardant, mainly using an aqueous emulsion of a water-insoluble organic phosphate, partially replacing an inorganic salt-based flame retardant, and its component is mainly an inorganic flame retardant, which is resistant The burning requirements are still not enough to meet the needs of current product development.

In addition, with the rising awareness of environmental protection, the world's advanced countries have banned the use of highly polluting materials. As far as the related art of semiconductor packaging is concerned, development has been progressing toward the use of lead-free solder materials. In order to respond to changes in the material of such solder, the solder reflow step must be performed at a higher temperature in the semiconductor package process. In this case, in addition to the necessity of having flame retardant properties, the epoxy resin composition used for the semiconductor package must maintain excellent reflow resistance and electrical stability. Japanese Patent Laid-Open No. Hei 9 (1997) No. 3161, Japanese Patent Laid-Open No. Hei 9 (1997)- 235 353, and No. Hei No. Hei 11 (1999)-140277, which are used to improve reflow resistance by using an epoxy resin having low water absorption and a curing agent. , thereby solving the problem caused by the temperature rise during assembly. However, cross-linking of an epoxy resin composition having a low water absorbability and a small modulus (a naphthalene epoxy resin, a biphenyl type epoxy resin, and a phenol aralkyl phenol resin having a biphenylene unit in a main chain structure) The density is low, and the molded article is easily softened after curing, and the resin composition will adhere to the mold or the cavity during continuous operation to greatly reduce the productivity. In addition, Chinese Patent Application No. 200480002310.1 proposes to increase the amount of spherical molten bismuth powder used in the product, and at the same time use low-viscosity epoxy resin to reduce the hygroscopicity of the product under high temperature and high humidity environment to prevent it from being caused during the welding process. The thermal stress and the use of a special oxidized polyethylene wax release system to improve the operability of the user end. However, an increase in the content of niobium powder may cause defects such as insufficient filling, wire sweep, and the like at the time of the user's packaging requiring high fluidity, and there are disadvantages such as being expensive.

In view of the above, an object of the present invention is to develop an epoxy resin composition having excellent flame retardancy, fluidity, and continuous formability, and a package member using the epoxy resin composition has excellent flame retardancy and reflow resistance. Weldability and electrical stability.

To achieve the above object, the present invention provides a flame-retardant epoxy resin composition comprising: (a) an epoxy resin; (b) a hardener; (c) a flame retardant; (d) a hardening accelerator; (e) an inorganic filler, wherein the flame retardant comprises melamine cyanurate and cyclic phosphazene, wherein the cyclophosphazene has a structure represented by the following chemical formula (I):

Wherein m is an integer selected from 1 to 4; and each R is the same or different and each independently is a linear or branched C1-C6 alkyl group, a phenyl group or a naphthyl group, wherein the phenyl group and the naphthyl group are Unsubstituted or optionally substituted with 1 to 3 straight or branched C1-C4 alkyl groups.

Further, the present invention also provides a method of packaging an element comprising packaging the element using the flame-retardant epoxy resin composition of the present invention.

The epoxy resin composition of the present invention has an excellent flame retardant effect by adding a flame retardant containing melamine cyanurate and cyclophosphazene, and is obtained by encapsulating the flame retardant epoxy resin composition of the present invention. The composition exhibits excellent adhesion, reflow resistance and electrical stability, and does not contain a metal compound, so the composition of the present invention also has the advantage of low hygroscopicity.

The flame retardant used in the flame-retardant epoxy resin composition of the present invention comprises a mixture of melamine cyanurate and cyclophosphazene, and provides a flame retardancy and adhesion by the multiplication effect of the two. A flame retardant epoxy resin composition excellent in properties such as force and flow reflow resistance.

Specifically, the flame-retardant epoxy resin composition of the present invention comprises: (a) an epoxy resin; (b) a hardener; (c) a flame retardant; (d) a hardening accelerator; and (e) an inorganic a filler material; wherein the flame retardant comprises melamine cyanurate and cyclophosphazene, wherein the cyclophosphazene has a structure represented by the following chemical formula (I):

Wherein m is an integer selected from 1 to 4; and each R is the same or different and each independently is a linear or branched C1-C6 alkyl group, a phenyl group or a naphthyl group, wherein the phenyl group and the naphthyl group are Unsubstituted or optionally substituted with 1 to 3 straight or branched C1-C4 alkyl groups.

Melamine cyanurate as a flame retardant can effectively impart good flame retardant properties to the composition, but when the content of melamine cyanurate is too high, it will affect the fluidity of the composition. When the content is too low, the flame retarding effect is limited, and it is difficult to simultaneously take into consideration Flame retardancy and fluidity. The invention finds that the combination of melamine cyanurate and cyclophosphazene flame retardant can not only maintain good fluidity, but also improve its flame retardancy and enhance the adhesion of the composition due to the synergistic effect of the two. Reflow resistance. Furthermore, the cyclophosphazene P-OR bond order and bond strength are stronger than phosphate, so the water resistance is good, and there is no problem that the phosphate ester is easily hydrolyzed to produce phosphoric acid, and the melamine cyanurate itself does not absorb. It is wet, so the composition of the present invention is also characterized by low hygroscopicity. The melamine cyanurate and cyclophosphazene flame retardant have strong molecular bonds, high temperature is not easy to decompose, and the molecular structure contains a secondary amine group and a tertiary amine group, which can form a covalent bond with the metal, and its synergy (synergy) It has excellent adhesion to the metal material of the frame and the wafer, and can overcome the stress caused by heat expansion and contraction during the welding process, so it has excellent reflow resistance and high temperature preservability.

In the present invention, the weight of melamine cyanurate and cyclophosphazene is preferably from 1:10 to 10:1, more preferably from 1:5 to 5:1, particularly preferably from 1:2 to 2:1. If the weight ratio of melamine cyanurate to cyclophosphazene is too large or too small, synergistic effect will not be achieved, and flame retardancy and reflow resistance cannot be effectively improved. Further, if the weight ratio of melamine cyanurate to cyclophosphazene is too large, the fluidity of the composition may be poor; if the weight ratio is too small, there may be a problem of flashing during packaging.

The flame retardant used in the present invention is contained in an amount of from 0.1 to 6.0% by weight, based on the total weight of the composition, preferably from 1.0 to 4.0% by weight. If the content of the flame retardant is too low, the effect of improving the flame retardancy cannot be achieved; if the content of the flame retardant is too high, the impurity content is too large, which tends to cause reliability problems after product packaging. In addition, if the melamine cyanurate content exceeds 5.0% by weight, the flow characteristics of the resin composition will be lowered, and the appearance of the molded article may be insufficient when the package is sealed at the user end; if the cyclophosphazene content exceeds 5.0% by weight, Will greatly improve the flow characteristics of the composition, there will be problems with the flash when packaging the product, the customer will not be able to process in the back-end process, affecting the customer's back-end use.

Epoxy resins suitable for use in the compositions of the present invention are well known to those skilled in the art and are not particularly limited, such as, but not limited to, epoxy resins containing two or more functional groups including, but not limited to, bisphenol epoxy Resin, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, biphenyl epoxy resin, trisphenol methane epoxy resin, naphthol epoxy resin, bismuth type Epoxy resin, epoxy resin containing triazine core structure, novolac type epoxy resin, novolac type alkyl novolac epoxy resin, modified novolac epoxy resin, dicyclopentadiene epoxy resin or a mixture thereof, preferably It is a biphenyl type epoxy resin, a novolac type alkyl novolac epoxy resin or a mixture thereof.

Examples of commercially available epoxy resins include: CNE-200ELA (manufactured by Changchun Chemical Co., Ltd.), ESCN-195XL (manufactured by Sumitomo Chemical Co., Ltd.), YX-4000H (manufactured by Shell Co., Ltd.), N-670 (manufactured by Japan DIC), and JECN-801 (Jianghuan) Chemical system), NC-3000H (made by Nippon Kasei Co., Ltd.), NPEB-400 (made by Nanya Epoxy Resin).

According to the invention, the aforementioned epoxy resins may be used singly or in combination of two or more kinds. The epoxy resin is used in an amount of usually 2 to 15% by weight, preferably 6 to 12% by weight based on the total mass of the composition.

The hardener used in the flame-retardant epoxy resin composition of the present invention is used in combination with an epoxy resin, which is well known to those skilled in the art, such as, but not limited to, a phenolic resin. The phenolic resin suitable for use in the present invention contains two or more hydroxy functional groups such as, but not limited to, novolac resin, cresol novolak resin, trisphenol alkylphenol, aralkyl resin, naphthalene phenolic resin. The cyclopentadiene type phenol resin or a mixture thereof is preferably a cresol novolac resin, a naphthalene type phenol resin or a mixture thereof.

Examples of commercially available phenolic resins include TD-2131 (manufactured by Japan DIC), HRJ-1583 (manufactured by Schenectady Co., Ltd.), XLC-3L (manufactured by Mitsui Chemicals Co., Ltd.), HP-5000 (manufactured by Japan DIC), and PK-7500 (Jinlong) Chemical system), HP-7200 (made by Japan DIC), KPH-F3065 (made by KOLON).

In the flame-retardant epoxy resin composition of the present invention, the content of the hardener is 2 to 10% by weight, preferably 3 to 8% by weight based on the total weight of the composition.

The hardening accelerator used in the flame-retardant epoxy resin composition of the present invention accelerates the hardening reaction between the epoxy group of the epoxy resin and the phenolic hydroxyl group in the hardener. Hardening accelerators suitable for use in the present invention are, for example but not limited to, tertiary amines, imidazole compounds, nitrogen-containing heterocyclic compounds or mixtures thereof. Among them, examples of the tertiary amine are, for example but not limited to, triethylamine, dimethylaniline, benzyldimethylamine, N,N-dimethyl-aminomethylphenol or a mixture thereof. Examples of the imidazole compound include, but are not limited to, 2-methylimidazole, 2-methyl-4-methylimidazole, heptadecyl imidazole, 1-cyanoethyl-4-methyl A base imidazole or a mixture thereof. Examples of the nitrogen-containing heterocyclic compound include, but are not limited to, 1,8-diazabicyclo[5,4,0]undec-7-ene (1,8-Diazabicyclo[5.4.0]undec- 7-ene; DBU). Preferably, 2-methylimidazole, 1,8-diazabicyclo[5,4,0]undec-7-ene or a mixture thereof is used as the hardening accelerator of the present invention.

In the flame-retardant epoxy resin composition of the present invention, the hardening accelerator is used in an amount of from 0.01 to 1% by weight, preferably from 0.1 to about 0.3% by weight based on the total mass of the composition.

The inorganic filler suitable for use in the flame-retardant epoxy resin composition of the present invention is, for example but not limited to, molten cerium oxide, crystalline cerium oxide, talc, alumina, cerium nitride or a mixture thereof, preferably It is a molten type of cerium oxide. The amount of the inorganic filler added is 70 to 95% by weight based on the total weight of the composition based on the balance of moldability and solder resistance. If the content of the inorganic filler is too low, the soldering property of the resin composition will be lowered due to an increase in moisture absorption; if the content is too high, the fluidity of the resin composition in the molding is lowered, and the filling failure is liable to occur.

Further, the flame-retardant epoxy resin composition of the present invention may optionally contain various additives well known to those skilled in the art, such as a decane coupling agent (for example, 2,3-epoxypropylpropyltrimethoxydecane or β-( 3,4-epoxycyclohexane)ethyltrimethoxydecane), release agent (for example, paraffin wax, palm wax, long-chain fatty acid or metal salt thereof, polyethylene/olefin synthetic wax, etc.) or colorant (for example, carbon) black).

The flame retardant used in the flame-retardant epoxy resin composition of the present invention does not contain a halogen or a ruthenium compound, and the content of a halogen atom and a ruthenium atom in the final composition (from a catalyst which cannot be avoided in the preparation of the resin or The additive) is less than 0.1% by weight based on the total weight of the composition, so that environmental protection requirements can be achieved.

In addition to excellent flame retardancy, the flame-retardant epoxy resin composition of the present invention has excellent flow moldability and curability, and is excellent in handleability, and the component obtained by encapsulation using the epoxy resin composition is excellent. The characteristics of adhesion, reflow resistance, electrical stability and moisture resistance greatly improve the reliability of the finished product. Therefore, the flame retardant epoxy resin composition of the present invention is suitable for packaging of various components.

The present invention also relates to a method of packaging an element comprising packaging a component using the flame-retardant epoxy resin composition of the present invention. The type of the component is not particularly limited and may be a semiconductor component, an electronic component, a display component, or a solar component. Preferably, it is used to package a semiconductor component. The above packaging techniques can be accomplished by conventional means. For example, hardening and molding can be performed by a forming process well known to those skilled in the art, such as press forming, injection forming, or vacuum forming, to produce a predetermined pattern. When the flame-retardant epoxy resin composition of the present invention is used for a package member, it can exhibit an excellent effect.

The technical features of the present invention have been specifically described in the description of the invention, and other materials and formulations are well known in the art, and those skilled in the art can easily implement the present invention. The features and advantages of the present invention are exemplified by the embodiments.

Examples and Comparative Examples 1-6:

The flame-retardant epoxy resin compositions of Example 1 and Comparative Examples 1 to 6 were prepared in the manner described below, and their compositions are as listed in Table 1.

The components are selected according to the weight parts listed in Table 1, and the components are mixed at room temperature using a mixer, the temperature is controlled at 60-120 ° C, and the mixture is kneaded at a high temperature by a biaxial stirrer to obtain a flame retardant epoxy resin composition. Things.

The information of each component in Table 1 is as follows:

Epoxy resin 1: CNE-200ELA, softening point: 65 ° C, epoxy equivalent: 200 g / eq, purchased from Changchun Chemical.

Phenolic resin 1: TD-2131, softening point: 80 ° C, OH equivalent: 102 g / eq, purchased from Japan DIC.

Spherical molten cerium oxide: SS-0183R, purchased from Korea KOSEM.

Melamine cyanurate: MC-25, purchased from CIBA Co., Ltd.

Hexaphenoxycyclotriphosphazene: SPB-100, purchased from Otsuka Chemical.

Aluminium hydroxide: purchased from SHOWA DENKO.

Magnesium hydroxide: Xieming Chemical Company.

ODOPB (phosphate ester flame retardant): purchased from Shenyang Bomeida Co., Ltd.

Brominated bisphenol A type epoxy resin: EPICLON 153, purchased from Japan DIC Corporation.

Antimony trioxide: PATOX-MZ, purchased from Japan Concentrate.

DBU: DBU, purchased from Japan's Shanghai Swimming Company.

Decane coupling agent: KBM403, available from Shin-Etsu Corporation.

Release agent: consisting of 0.4 parts by weight of palm wax (Carnauba No. 1, available from East Asia Chemical Co., Ltd.) and 0.3 parts by weight of polyethylene/olefin synthetic wax (PED-522, available from Clariant).

Carbon black: MA-600, purchased from Mitsubishi Corporation of Japan.

testing method:

Spiral flow: This measurement is based on EMMI-1-66, using a mold to measure the spiral flow at a molding temperature of 175 ° C, with an injection clamping pressure of 6.9 MPa and a hardening time of 120 seconds. carry out testing. The unit of the length of the spiral flow measured is expressed in cm.

Gelation time: This method determines the molding curing characteristics and mixing uniformity of epoxy resin molding materials. The above composition was poured onto the center of a 175 ± 2 ° C hot plate, and immediately flattened with a tongue-pressing bar, the area was about 5 cm ² , and the timepiece was pressed from the start of melting of the composition, and the tongue was pressed once a time. The frequency of seconds pushes the powder, and the time is taken when the powder gradually changes from fluid to gel, and the time taken is read. The operation was performed twice in the same manner (two measurements were not more than 2 seconds), and the gelation time was averaged twice.

Flame retardancy: The test piece was molded using a low-pressure rotary injection molding machine (127 mm × 12.7 mm and three thicknesses of 1.0 mm, 2.0 mm and 3.0 mm), while the molding temperature was 175 ° C and the injection pressure was 6.9 MPa. The time was 120 seconds, followed by post-hardening at 175 ° C for 8 hours. Thereafter, the time of ΣF, Flaming was measured according to the UL-94 vertical method, and the flame retardancy was judged.

Shore hardness: According to the test standard of GB2411-80, 16P SOP (20mm*6.5mm*3.3mm) is formed by transfer moulding. The molding conditions are: metal mold temperature is 175±3°C, injection pressure It was 70 ± 5 kg/cm ² and the curing time was 2 minutes. The surface hardness of the molded product was measured using a Shore hardness tester 10 seconds after the mold was opened.

Melt viscosity: The melt viscosity of EMC is tested using a high-grade rheometer (CFT-500D), and the pore size of the die is selected according to the viscosity. After installing the mold, start the software and start heating the mold to a constant temperature of 175±1°C. Weigh an appropriate amount of EMC sample (usually about 2g) with an electronic balance, and use a cake machine to make the diameter (Φ) 0.5mm. A cylindrical sample with a height of 1.0 mm. Place the sample quickly in the rheometer and press the start key test. The melt flows out of the small hole and the instrument automatically calculates and displays the melt viscosity value.

Adhesion: Diode is encapsulated with epoxy resin composition (lead made of copper). The molding conditions are: metal mold temperature is 175±3°C, injection pressure is 70±5kg/cm ² , curing time It is 45 seconds. After 8 hours of post-cure treatment at 175 ° C, the copper lead was pulled with a universal tensile machine so that the force separating the copper lead from the epoxy resin was an adhesion force.

Hygroscopicity: A sample having a size of 50 mm * 3 mm (diameter (φ) * height) was prepared from the epoxy resin composition, and the molded sample was post-cured at 175 ° C for 8 hours, and then placed. In the basket of the high pressure cooker (PCT), after autoclaving at 121 ° C for 24 hours, the water absorption weight increase rate was tested.

Reflow resistance: 100P TQFP is encapsulated with epoxy resin composition (semiconductor component size is 8.0*8.0mm, lead frame is made of 42 alloy), molding conditions are: metal mold temperature is 175±3°C, injection The pressure was 70 ± 5 kg / cm ² and the curing time was 1.5 minutes. Further, post-curing treatment was performed at 175 ° C for 8 hours, however, the obtained package member was kept in an environment of a temperature of 60 ° C and a relative humidity of 60% for 40 hours. Thereafter, the package member was immersed in a solder bath at 240 ° C for 10 seconds. The peeling area of the cured product of the epoxy resin composition, that is, the area of the cured epoxy resin composition peeled off from the surface of the lead frame base material, was measured by scanning acoustic tomography, and the peeling rate was calculated by the following formula:

[Peeling rate] = {(peeling area) / (surface area of semiconductor element) * 100%}

The number of samples (n) = 10. The unit of the peeling rate is %.

Test results: The test results obtained above are recorded in Table 2.

Example 1 is a flame-retardant epoxy resin composition of the present invention, and the test results show that it has good flame retardancy, fluidity, adhesion, reflow resistance and low hygroscopicity. Comparative Examples 1 and 2 did not contain melamine cyanurate and cyclophosphazene flame retardants at the same time. Therefore, the test results showed that the overall performance of flame retardancy, adhesion and reflow resistance was inferior to that of Example 1; 3 and 4 used metal oxide as a flame retardant, and Comparative Example 5 used a phosphate flame retardant, and as a result, it was revealed that a metal oxide was used as a flame retardant or a resin composition containing a phosphate flame retardant, The flame retardant adhesion, moisture absorption and reflow resistance were not good. Although Comparative Example 6 also had good flame retardancy, the flame retardant used contained bromine and barium, which did not meet environmental requirements.

Therefore, it is known from Table 2 that the flame-retardant epoxy resin composition of the present invention exhibits excellent moldability; the components packaged using the composition of the present invention have excellent flame retardancy, adhesion, reflow resistance and Low hygroscopicity.

In summary, the epoxy resin composition of the present invention has an excellent flame retardant effect by adding a flame retardant containing melamine cyanurate and cyclophosphazene, and the composition can be obtained by using the composition for packaging components. An element that is excellent in adhesion, reflow resistance, and electrical stability.

Other implementations

All features disclosed in this disclosure can be combined in any manner. Features disclosed in this specification can be replaced with features of the same, equivalent or similar purpose. Therefore, the features disclosed in this specification are one of a series of equivalent or similar features.

In addition, according to the disclosure of the present specification, those skilled in the art can easily make appropriate changes and modifications to different methods and situations without departing from the spirit and scope of the present invention. The implementation aspect is also included in the scope of the patent application.

Claims (18)

A flame-retardant epoxy resin composition comprising: (a) an epoxy resin; (b) a hardener; (c) a flame retardant; (d) a hardening accelerator; and (e) an inorganic filler; The flame retardant comprises melamine cyanurate and cyclophosphazene, wherein the cyclophosphazene has the structure represented by the following chemical formula (I): Wherein m is an integer selected from 1 to 4; and each R is the same or different and each independently is a linear or branched C1-C6 alkyl group, a phenyl group or a naphthyl group, wherein the phenyl group and the naphthyl group are Unsubstituted or optionally substituted with 1 to 3 straight or branched C1-C4 alkyl groups. The composition of claim 1, wherein R in the formula (I) is a methyl group, an ethyl group, a phenyl group, a methylphenyl group, and m is 1. The composition of claim 1, wherein the chemical formula (I) is hexaphenoxycyclotriphosphazene. The composition of claim 1, wherein the weight ratio of melamine cyanurate to cyclophosphazene in the flame retardant is 1:5-5:1. The composition of claim 1, wherein the flame retardant is present in an amount of from 0.1% by weight to 6.0% by weight based on the total weight of the composition. The composition of claim 1, wherein the epoxy resin is bisphenol epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, and Benzene type epoxy resin, trisphenol methane type epoxy resin, naphthol type epoxy resin, fluorene type epoxy resin, epoxy resin containing triazine core structure, novolac type phenolic epoxy resin, novolac type alkyl phenolic ring Oxygen resin, modified novolac epoxy resin, dicyclopentadiene epoxy resin or a mixture thereof. The composition of claim 1, wherein the epoxy resin is present in an amount of from 2.0% by weight to 15.0% by weight based on the total weight of the composition. The composition of claim 1, wherein the hardener is a phenolic resin. The composition according to claim 8, wherein the phenolic resin is a novolak resin, a cresol novolak resin, a trisphenol alkylphenol, an aralkyl resin, a naphthophenol resin, and a cyclopentadiene type. Phenolic resin or a mixture thereof. The composition of claim 1, wherein the hardener is present in an amount of from 2.0% by weight to 10.0% by weight based on the total weight of the composition. The composition of claim 1, wherein the hardening accelerator is a tertiary amine, an imidazole compound, a nitrogen-containing heterocyclic compound or a mixture thereof. The composition of claim 11, wherein the tertiary amine is triethylamine, dimethylaniline, benzyldimethylamine, N,N-dimethyl-aminomethylphenol or a mixture thereof, and the imidazole compound is 2-methylimidazole, 2-methyl-4-methylimidazole, 2-heptadecylimidazole, 1-cyanoethyl-4-methylimidazole or a mixture thereof, and The nitrogen-containing heterocyclic compound is 1,8-diazabicyclo[5,4,0]undec-7-ene. The composition of claim 1, wherein the hardener promoter is present in an amount of from 0.01% by weight to 1.0% by weight based on the total weight of the composition. The composition of claim 1, wherein the inorganic filler is molten cerium oxide, crystalline cerium oxide, talc, aluminum oxide, cerium nitride or a mixture thereof. The composition of claim 14, wherein the inorganic filler is molten cerium oxide. The composition of claim 1, wherein the inorganic filler is present in an amount of from 70% by weight to 95% by weight based on the total weight of the composition. The composition of claim 1 is for packaging of components. A method of encapsulating an element, comprising packaging the element using the composition of any one of claims 1 to 16.