201246404 六、發明說明： 【發明所屬之技術領域】 發明領域 本發明係有關於一種用以將搭載於基板之至少一面之 半導體裝置、例如積體電路、光半導體元件封裝樹脂之樹 脂封裝裝置及樹脂封裝方法。 發明背景 用以將搭載於表面之半導體元件等電子零件封裝樹脂 之基板有由散熱特性優異之陶究材料構成，且搭載有 LED、半⑽雷射等_子零件、功率半導體元件等之陶 瓷基板。又’有將樹脂封裝材料供至設在下模具之模六， 以浸潰基板之電子零件，封裝樹脂，於封裝樹脂後，將成 形品從模具脫模之情形。舉例言之，如專利文獻】之第讕 所示，有下述結構，前述結構係將樹脂封裝㈣8供至設在 下模具2之模穴3 ’並將基板裝設固定於可動銷6,以上模具 1與下模具2夾持基板’合模後，封裝樹脂，再以可動銷6頂 出成形品之基板10者。 先行技術文獻 專利文獻 專利文獻1日本專利公開公報2006-245丨5 i號 I：發明内容3 發明概要 發明欲解決之課題 4 201246404 呈然而’在前述樹脂封裝裝置中’在開啟上模具i與下模 了之狀態下，使樹脂封裝材料供給裝置進入上模具1與下 f、=、2間將樹脂封裝材料8供至設在下模具2之模穴3後， 使樹知封裝材料供給裝置退出。然後，使基板搬送裝置（圖 二）進入上模具1與下模具2間，將基板1〇裝設固定於下 模具2之可動銷6後，使基板搬送裝置退出。接著，藉以上 模具1與下模具2夾持基板1〇後，合模，以封裝樹脂。因此， 由於將樹脂封裝材料供至模穴後至封裝樹脂為止費時，故 無法使用硬化時間短之樹脂封裝材料。 又，由於上模具1與下模具2加熱至適合樹脂成形之溫 度而基板10為常溫，故直接在此狀態下封裝樹脂時，已 熔融之樹脂材料被基板10奪熱，流動性降低，而易產生未 填充或空隙等問題。因此，於封裝樹脂之際，需預先將基 板10加熱，而在前述樹脂封裝裝置，需要將上模具1壓抵基 板1後加熱’達到預定溫度為止之等待時間。 再者，在前述樹脂封裝裝置，使成形品以可動銷6頂出 而脫模時，基板10可以前述頂出銷6之狹窄前端面頂出。因 此，有基板10自身因被頂出之際之衝擊力而破損之虞。特 別是於為成形品之封裝樹脂8產生裂縫時，有為被封裝物之 半導體7L件9或Au線11破損之虞，而有成品率差之問題點。 本發明鑑於前述問題點，其課題係提供一種防止將安 裝在基板之半導體元件業經封裝樹脂之成形品從模具脫模 之際可能產生之基板的破損，成品率高之樹脂封裴裝置及 樹脂封裝方法。 201246404 用以欲解決課題之手段 為解決前述課題，本發明之樹脂封裝裝置之結構係由 上模具組及下模具組構成，該上模具組於下面具有可保持 基板之保持機構，該下模具組於上面搭載具有模穴部之陰 模，且可透過水平移動機構，沿著底板在成形位置及待機 位置間來回移動，且藉由以合模機構使位於前述成形位置 之前述陰模上下移動，可以前述上模具組之下面與前述下 模具組之陰模，夾持安裝有電子零件之前述基板而合模， 且將前述基板之電子零件浸潰於供給至前述模穴部之樹脂 封裝材料，以進行樹脂封裝，並於前述陰模之外周中至少 對向之2搞置«導件，而可以前述㈣導件頂推前述基 板之外周緣部而脫模。 發明效果 根據本發明，配置於陰模之外周之至少2邊的框架導件 不是以點，而是以線抬起基板之外周緣部而脫模。因此， 由於可分散、緩和負载於基板之外周緣部之外力的集中， 故不僅可防止前述基板之破損，亦可防止安裝於前述基板 之半導體元件、金屬線之破損。 又’由於可使下模具組在成形位置及待機位置間來回 移動，故+需使樹脂料材料供給裝i及基_送裝置進 入至上下模具間’可縮小上下模具之開啟量，而可縮小樹 脂封裝裝置全體。特別是因可縮小開啟量，故亦可縮小合 模機構，而可使樹脂封裝裝置更進一步小型化。 再者，由於合模機構僅使陰模運作，故相較於使下模 6 201246404 具組全體運作之情形，可抑制合模所需之驅動力，而可沪 得小塑且低價之樹脂封裝裝置。 又，由於上模具組之下面具有可保持基板之保持機 構，故將樹脂封裝材料供至下模具組之模穴部移動至成 升>位置後，可直接將前述基板進行合模，來封聿樹π。因 此，由於亦可使用硬化時間短之樹脂封裝材料，故不僅可 獲得通雜高之樹賴裝裝置，射料細彡週期短生 產性南之樹脂封装裝置。 特別是框架導件被賦與朝脫模方向之勢能時，當前述 框架導件位於待機位置時，將基板搭載於前述框架^件之 内側緣部之際或使搭載有前述基板之前述框架導件從待機 位置移動至成形位置時，基板呈懸空狀態。因此，可防止 安裝於前述基板之τ®之電子零件及將前述f子零件與基 板連接之金屬線等抵接陰模。 本發明之實施形態其結構亦可為將框架導件以彈菁力 賦與朝向從陰模將成形品脫模之方向之勢能。 根據本實施形態，可利用依據彈力之框架導件之赋與 勢能力’將·品從陰模脫模。因此，由於使用其他脫模 用構件時，亦可減低前述脫則構件之驅動力，故可獲得 易設計’且生產能量低之樹脂封裝裝置。 本發明另-實施形態其結構亦可為將框架導件形成包 圍陰模之外周之框狀。 根據本實施形態，由於可以框狀框架導件抬起基板之 外周緣部，故可更進-步分散、緩和域於前述基板之外 7 201246404 力。因此，可更進一步有效地防止前述基板之破損。 本發明又另一實施形態其結構亦可為將框架導件形成 可將前述基板之外周緣部定位之定位用段部。 根據本實施形態，由於基板之定位作業簡單，且正確， 故生產性可提高，而且，成形不良減少，成品率可提高。 本發明之不同之實施形態其結構亦可為於隔著陰模對 向之框架導件之至少1邊設有用以拉起基板之缺口部。 根據本實施形態，在成形前及成形後之基板對框架導 件之定位作業及取出作業簡單，生產性可更進一步提高。 本發明一新貫施形態其結構為前述實施形態之樹脂封 裝裝置，其包含有對供給至模穴部之樹脂封裝材料施予預 疋歷力之傳送銷，並包含有具有配置於下面且抵接於基 之抵接構件、及緩衝在脫模時負載於前述抵接構件之衝 2之緩衝構件的保持裝置，並且以前述傳送銷將以陰模 =保持裝置之抵接構件所夾持之樹脂封裝後的前述基 從則述陰模頂出，而將前述傳送銷也用於脫模。 所*姓據本實卿態，*於以傳闕將以陰模與抵接構 可^之封I樹脂後之基板從前述陰模頂出，故緩衝構 亦可防止緩和傳闕之衝擊力，㈣絲板之破損。因此 :止於前述基板絲在表面之半導體科之破損。 後之脫模2傳送銷調整成形㈣，並且，亦可進行心 出驅動裝置由於不再“頂出銷及具有此之了: 構造簡單且_之樹脂封„置。件數心而可獲々 8 201246404 /為解決前述課題，本發明之樹脂封裝方法係使用以進 行樹脂封裝之結構由下面具有可保持基板之保持機構的上 模具組及於上面搭載具有模穴部之陰模，且可透過水平移 動機構，沿著底板在成形位置及待機位置間來回移動的下 抵具組構成’而將安裝於前述基板之電子零件浸潰於供給 月j述模八。卩之樹脂封裝材料，而進行樹脂封裝，其包含 下列步驟：使前述下模具組移動至待機❹後，將下面安 裳有電子零狀前述基板定⑽配置結述陰模之外周中 至少對向之2邊之《導件；使前述下模餘移動至成形位 置丄並且使前述陰模及_導件上升，錢前述基板保持 於則述上模具組之保持機構；使前述陰模及框架導件下 降並且使則述下模具組移動至前述待機位置；將樹脂封 裝材料供給至前述陰模之模穴部；使由前述下模具組移動 至成形位置後’藉使前述陰模及框架導件上升，而以前述 上模具組、刚述下模具組之陰模及前述框架導件將前述基 板進仃。模’藉此’進行樹脂封裝；及使前述陰模及框架 導件下降’並且，將業經樹脂封裝之前述基板之外周緣部 以前述框架導件頂推而脫模。 /艮據本發明，配置於陰模之外周之至少2邊的框架導件 不疋以點’而是以線抬起基板之外周緣部而脫模。因此， 由於可/3政、緩和貞載於基板之外周緣部之外力的集中， 故不僅可防止前述基板之破損，亦可防止安裝於前述基板 之半導體元件、金屬線之破損。 又，由於上模具組之下面具有可保持基板之保持機 201246404 構，故將樹脂封裝材料供至下模具組之模穴部移動至成 形位置後，可直接將前述基板進行合模，來封裝樹脂。因 此，由於亦可使用硬化時間短之樹脂封裝材料，故具有不 僅可獲得通用性高之樹脂封裝方法，還可獲得成形週期 短，生產性高之樹脂封裝方法之效果。 又，根據本發明，將下面安裝有電子零件之前述基板 定位於前述框架導件，使前述下模频㈣至成形位置， ^且’使前述陰模及框架導件上升，錢前述基板保持於 =述上模具組之保持機構，使前述陰模及框架導件下降， :且’使前述下模組移動至前述待機位置，將樹脂封裝材 =至前述陰模之模穴部，使前述下模具組移動至成形位 與^使前述陰模及框架導件上升，而可以前述上模具組 模^下模具組之陰模及前述框架導件將前述基板進行合 持機^裝樹脂。因此’可於使基板保持於上模具組之保 用以將L ’至封裝樹脂為止之期間預備加熱，而具有不需 圖式簡單說明 果 封裝带？ 81第1B圖第1C§l係顯示經以本案發明之樹脂 光半導體J裝樹&之成形品之立體®、正面圖及經裁切之 干導體裝置單體之立體圖。 圖係本案發明之樹軸裝裝置之正面圖。 第^係第2圖所示之樹脂封妓置之主要部份截面圖。 係本轉明之劃旨科裝置之側視圖。 5圖係本案發明之樹脂封裝裝置之平面戴面圖。 10 201246404 置之主要部份放大截 置之主要部份放大平 第6圖係第4圖所示之樹脂封裝敦 面圖。 第7圖係第5圖所示之樹脂封裝裝 面圖。 第8圖：第4圖、第5圖所示之保持裝置之放大側視圖。 第9圖係第8_所示之保持裝置之主要部份放大平面圖。 第1卿仙以朗本案發明之樹脂封裝裝 置之成形步驟的截面圖。 第则、第11B圖係接續第_圖之載面圖 第则、第卿係接續第陶之截面圖 第謂、第卿係接_2B圖之戴面圖 第14圖係接續第13B圖之幾面圖。 C實方包冷式;3 用以實施發明之形態 根據第1圖至第Μ圖之附加圖式 裝裝置之實施形態。 說明本發明之樹脂封 如、第1Β圖所示，本實施形態之樹脂封裝裝 係用以將以預定間距安裝於印刷有導電圖形之喊製基; 1之一面的㈣LED之辭導體轉2找樹脂者。 …本實郷紅料料_錢以财熱性 透光性優異之石夕材為主原料之材粗 何抖。此種前述樹脂封裝；| 枓不僅指迄今使用之稱為片劑 川爻固態者，亦可藉將液狀ί 月日封裝材料注入模具内，使复 得所如 史、加熱，而熱硬化，藉此，赛 仵所期之形狀。舉例言之，在太 仗不案中，如後述，亦可為j 11 201246404 有與設在基板i上之成形部6相鄰之無用樹脂4之㈣品3。 又’前述品3在後步驟之㈣步驟㈣斷成諸個光半導 體裝置5(第_)’it行凸塊連料處理後，被搭載至母基板。 /如第2圖所tf，將前述基板i封裝樹脂之樹脂封裝裝置 係由固定在直立設置於底板1〇上之4根繫桿u之上端部的 平台12、固定在前述平台12之下面之上模具組20、位於前 述上模具組2G之下方側，絲置成可沿著前述底板1〇之上 面滑動之滑動板3G、設置在前述滑動板30上之下模具組40 構成者X ’如第5圖所不，保持裝置9〇及分配裝置1〇〇係 配置成朝前述底板10之待機位置？交互來回移動。 如第6圖所示，前述上模具組20以固定於前述平台12之 下面之上模具模組2卜固定於此上模具模組21之下面之上 模具槽22構成。於前述上模具槽22形成有供後述引導銷— 插入之引導孔23 1者’在前述上模具槽以下面中，於 前述基板！之㈣面㈣料設村㈣料絲丨之吸引 孔24。㈣吸引孔24藉由形成於前述上模具模組21與上模 具槽22之透氣路徑25，連接於圖中未示之真空產生裝置。 同樣地肖以使成形時之密閉空間呈真空之透氣路徑％連 接於圖中未示之真空產生裝置。 下模具組40係依序於設置成可沿著底板1〇上面滑動之 滑動板30上面组裝有下模具模組41及下模具槽的者。又， 下模具組40於位於其成形位置之前述滑動板30之正下方具 有組裝於前述底板10之升降裝置8〇。 前述滑動板30組裝成可沿著平行設置於前述底板1〇上 12 201246404 面之一對引導執道13’在待機位置p(第4圖）與成形位置（第6 圖）間滑動移動。又，如第4圖所示，藉以電動馬達14使滾 珠螺桿15旋動，前述滑動板3〇可在待機位置p與成形位置間 來回移動。又，如第6圖所示，前述滑動板3〇内藏有驅動位 於其側邊之電動馬達31，藉由帶32，旋動第3圖所示之螺帽 33，藉此而上下移動之滾珠螺桿34。再者，藉由配置於前 述螺帽33兩側之套筒35，吊掛上接頭％。X，前述滑動板 30之構造係以位於其中央下部，且固定在底板1〇上之支撐 塊16於合模時支撐者。 下模具模組41依序於前述滑動板3〇堆疊氣缸基座42、 中間基座43而構成。又，前述下模具模組似前述中間基 座43之上面緣部堆疊有環狀固定框44。前述固定框44將上 面具有環狀密封材45之可動框47配置成可藉由驅動裝置 46(參照第2圖）上下移動。 在前述氣缸基座42内，如第3圖所示，配置成可以前述 滾珠螺桿34獅之巾心、板48滑動卡合㈣支持㈣。又， 直立設置於前述内支持器49之角部之連結軸50的上端部連 結，下模具_之傳送板㈣—體化。又，配置成可藉由 套筒35頂推之外板51滑動卡合於外續H 52。X，直立設 置於前述外支持㈣之連結軸53的上端部連結於配置在= 述中間基座43内之下層板54而-體化。 於前述氣叙基座42及中間基座43内形成有收納以2根 ，、办排歹]成4列之共8根之活塞55，並且，以活塞蓋56密 閉之空間°前述空間可填充為壓力媒體之液體，並且，從 13 201246404 為 於 圖中未示之注入口、排出口使液體流出流入，藉此，使舌 塞55上下移動，透過下層板54，對後述陰模63施予預定壓力 如第3圖及第6圖所示，下模具槽60係設置於以前述中 間基座43及前述固定框44形成之空間内者，於框狀支持器 基座61之外側面安裝有側面蓋—，並且’於前述支持器： 座61内配置有背板62。此外，本實施形態為可同時成形^ 基板1之結構，下模具6内具備2組構成零件亦可成形1片 基板，片數不限。前述背板62藉由直立設置於前述下模具 模組41之下層板54之支制54枝#，並且，藉由插通=層 板54之凸肩螺栓62a防止脫落。又，如第7圖所示，前述背 板62於其上面中央部载置有陰模63，並且，於其上面外周 、’彖部藉由彈簧62b’支#有框狀框料件65。前述框架導二 65以前述彈簧62b賦與從前述陰模63之上面朝上方頂出之 勢轧。又，前述框架導件65於其内周緣部形成有用以定位 基板1之環狀段部65a，另一方面’直立設置於前述背^62 之弓丨導銷62c以可突出沒入之方式從其上面突出。再者， 使以手動作業放置基板1時之定位作業及取出作業容易， 前迷框架導件65形成有缺口部65b。 ▲又，如前述，配置於前述背板62之下方側之傳送板料 藉由前述下模具模組41之連結⑽支# ^前述傳送板料插 通有以彈簧66a之彈力賦與勢能之傳送銷的之下方部。另一 =面’前述傳送祕之上方料f板62及陰模63以可突出 沒入之方式插通，其前端部份插通後述樹脂積存部的。因 此，前述傳送銷66藉驅動電動馬達31，使其上下移動可 14 201246404 對供至陰模63之樹脂封裝材料9施予一定壓力，並且可頂出 成形後之成形品3。 如第7圖所示，陰模63平面呈約方形，於形成於其上面 之凹處67内將半球狀模穴部68配置成格子狀，並且沿著前 述凹處67之對向之2邊形成有樹脂積存部69。前述樹脂積存 部69藉由連通路徑70，連通於前述凹處67，並且，於其預 定位置形成可供傳送銷66插通之銷孔71。又，於連通於前 述凹處6 7之位置設有可探測陰模6 3内之樹脂填充壓力之壓 力感測器72。 如第3圖所示，升降裝置80係於安裝在底板1〇下面之支 撐軸81之下端部配置有螺帽82。又，如第6圖所示，以電動 馬達83旋動前述螺帽82，而使安裝於滾珠螺桿料上端部之 弓丨導板85上下移動，藉此，可使安裝在前述引導板％之角 邛之引導軸86上下移動。又，相鄰之一對引導軸％之上端 部以下接頭87連結。 如第4圖、第5圖所示，保持裝置9〇係用以吸引保持封 裝樹脂前後之基板1之裝置，可朝底板1〇之待機位置來回移 動，並且，支撐成可上下移動。又，保持裝置9〇也與下模 、軋60同樣地’為保持2片基板之結構。又，如第8圖、第9 圖所不，刖述保持裝置90於長方形上板91藉由以4根為1組 之杈92，分別吊掛有2片正方形下板93。 又，在前述上板91與前述下板93間，於4個角落共4處 爽持有由橡膠材等構成之緩衝構件94,其位置配置於前述 傳送銷66之*心ρ再者，前述上板91藉由設在其兩側下 15 201246404 面緣部之引導部95，將引導軸96支撐成可於軸心方向滑 動。又’前述弓丨導軸96、96組裝有彈簧96a，而賦與其一直 朝向外側之勢能，並且，藉由設在其前端部之連結桿97連 結。再者’於前述連結桿97之兩端部分別設有卡止爪97a。 另—方面，下板93於其下面接著有由海綿等構成之板 狀抵接構件98。前述板狀抵接構件98於其下面設有最深之 底面正方形凹部98a，並且，設有格子狀凸部98b，以於與 最下面間形成—些間隙。又，吸引凸塊99分別連通於前述 凹部98a ’而可吸引前述基板1。 此外’前述保持裝置9〇亦可利用提高搬送距離及搬送 功能之卸載裝置是無須贅言的。 如第5圖所示’分配裝置1〇〇可藉由圖中未示之驅動裝 置，朝底板10上之待機位置P來回移動。又，前述分配裝置 100將已。十量之液狀樹脂封裝材料注入至被拉出至待機位 置P之下模具模組41之陰模63。 接著，主要根據第1〇圖至第14圖之附加圖式，說明本 實施形態之樹脂封裝裝置所行之封裝方法。 首先，藉驅動電動馬達14，使滾珠螺桿丨5旋動，而使 滑動板30滑動移動至在第4圖中以二點鏈線所示之待機位 置P。然後，以手動或圖中未示之負載裝置將基板丨定位於 露出之框架導件65之環狀段部65a。 在本實施形態中，由於於框架導件65形成有環狀段部 65a，故以手動定位基板1之作業便簡單，且正確。又由 於於框架導件65形成有缺口部65b，故作業者定位基板丨之 16 201246404 際形成為抓持基板1之手指之出口，以手動定位基板1之 作業簡單且正確。 土 此外，前述基板1之定位亦可以設在框架導件65之定位 銷（圖中未示）進行。 然後’當藉驅動電動馬達14，使前述滾珠螺桿15逆旋 轉，而使陰模63移動至成形位置時（第i〇A圖），上接頭％卡 合於下接頭87(第ό圖）。 此外，根據本實施形態，基板1定位於框架導件65之内 周緣部，前述框架導件65被賦與勢能，而可從陰模幻之上 面朝上方頂出之。因此，前述基板丨在懸空狀態。結果於 陰模63移動至成形位置之際’即使施加振動、衝擊等仍 可防止搭載於基板1之光半導體元件2或連接前述光半導體 元件2與基板1之Au線抵接前述陰模63。 接著，當驅動電動馬達83時，螺合於螺帽82之滾珠螺 桿84旋動，頂推引導他，藉此，藉由下接頭87及上接頭 36，頂推板51及支㈣52。@此，藉由直立設置於前述支 持器52之連結軸53，頂推下層板54、支_54a，㈣料 板62°結果’藉㈣簧62b彈性切於前述背板62之框架導 件65上升，基板1亦上升。‘然後，5丨導銷心嵌入引導孔η， 而正確地线於財位置，㈣，前«板1祕上模具槽 22之下面（第10B圖）。 此外，於前述下層板54上升時，連結於下層板54之活 塞55上升存在於大侵部55a之上面之液體從圖中未示之排 出口排出，追隨下層板54之動作。 17 201246404 藉驅動圖中未示之真空裝置’設在上模具槽22之下面 之吸引孔24吸附保持基板1後，藉驅動電動馬達83，使陰模 63下降（第11A圖）。此外，由於於陰模幻下降前，框架導件 65藉由彈簧62b之彈力，將基板〗按壓至上模具槽。之下 面故不致於基板1產生勉曲或不平坦。 然後，藉驅動電動馬達14，使下模具組4〇從成形位置 再度移動至待機位置p。接著’使分配裝置刚滑動移動至 刖述陰模63之上方後’將已計量之液狀樹脂封裝材料9注入 至模穴部68(第11B圖）。 之後，藉驅動電動馬達14，使滾珠螺桿15逆旋轉，而 使π動板30回復至成形位置，藉此，上接頭城下接頭^ 卡。。然後’可動框47上升，使密封材45密合於上模具槽 以下面後，藉驅動圖中未示之^產生裝置，藉由透氣 路控26，排出形成於上模錢a與巾間基座Μ間之密閉空 間之空氣’以減壓至預定壓力（第12八圖）。 ， 肖驅動電動馬達83，螺合於螺闕之滚珠蜾 桿84旋動’頂推料⑽，藉此，藉由下接頭㈣上接頭 36，頂推板51及支持器52。因此，藉由直立設置於前述支 持器52之連絲53，下層板54、支㈣54a，而頂推背 ㈣。結果’藉㈣*62b彈性切料述背砂之框 件65上升。 此外，於前述下層板54上升時，連結於下層板M之活 :55上升，存在於大徑部…之上面之液體從圖中未示之排 出口排出，而追隨下層板54之動作。 201246404 然後’引導銷62嵌_入至引導孔23，而正確地定位於預 义位置’保持在預定位置之基板1便欲合於環狀段部65a。 然後，前述基板1以上模具槽22之下面與框架導件65及陰模 63夾持（第12B圖）。因此，可將安裝於基板丨之光半導體元 件2浸於模穴部68内之樹脂封裝材料9。在此步驟中，預先 保持在上模具槽22之基板1之光半導體元件2及連接於光半 導體元件2之金屬線專在接觸注入至陰模Μ之模穴部6 8之 祕月曰封裝材料前，較高速地移動，之後，以低速及低壓力 進行合模》 接著，藉驅動圖中未示之加壓裝置，將液體注入至活 塞55之大徑部55a之下部後加壓，進行合模。 上模具槽22與陰模63藉由基板1密合時，在模穴部68剩 餘之樹脂封裝材料9藉由連通路徑7〇 ,流入至樹脂積存部 69。然後，藉驅動電動馬達31，使傳送銷66上下移動，藉 此，解决樹脂封裝材料9之注入量之偏差，並且，對模穴部 8¼予預疋壓力。傳送銷66之上下移動依據設在下模具陰 模63之壓力感測器72所探測之壓力，以電動馬達31控制成 達到設定壓力，並且，藉由活塞55，控制成產生必要最小 限度之合模壓力。然後，藉傳送銷66之動作，以圖中未示 之則述加壓裝置使合模壓力增加為與壓力感測器72所探測 之壓力成比例，以進行最後合模。 經過預定硬化時間後，藉驅動電動馬達31，使傳送銷 66下降，而使别述傳送銷66從已硬化之樹脂封裝材料$分 離。接著，使可動框47下降，並且停止加壓裝置，呈無負 201246404 載狀態後，驅動電動馬達μ，使陰模63下卜上模師22 ，真空產生裝置於瞬間吐出空氣後，停止、然後，成形曰品3 藉陰模63與已硬化之樹脂封裝材料9之貼附，隨著前述陰模 63下降（第13A圖）。 、 艇動電動馬達14,將下模具組4()移動至待機位訂後， 保持裝置90滑動移動至前述下模具組4〇之正上方。然後， 藉保持裝置90之圖中未示之驅動裝置，將連結蓋％拉進至 内側後，使其下降至預定位置。然後，解放圖中未示之前 述驅動裴置，使卡止爪97a卡止於側面蓋61a，藉此，使基 板1抵接抵接構件98之下面，同時，以前述抵接構件98與框 架導件65夾持前述基板1之外周緣部（第ι3Β圖）。接著藉 由吸引管99吸引，藉此，使抵接構件98吸附至成形品3之基 板1。藉將卡止爪97a卡止於此側面蓋6ia，可於頂出後述傳 送銷66之際，有效地吸收負載於保持裝置9〇之衝擊力。 藉使電動馬達31驅動’使傳送銷66上升，可頂出在銷 孔71内硬化之無用樹脂4，框架導件65以彈簧62b之彈力頂 推基板1之外周緣部，並且，以抵接構件98之吸引力吸引基 板1，藉此，可將成形品3在不撓曲下從陰模63脫模（第14 圖）。此時，以複數傳送銷66頂出以穩固地貼附於陰模63而 硬化之樹脂封裝材料9形成之成形部6的外周，同時，以框 架導件65之環狀段部65a頂推基板1之外周緣部。進一步， 藉以抵接構件98吸引基板1之投影面全體，可將成形部6從 陰模63之凹處67強力且平衡性佳地脫模。進而，於脫模之 際產生之傳送銷66之衝擊力可為抵接構件98、緩衝構件94 201246404 吸收、緩和。因此，不僅成形品3之基板丨不致破損，亦可 防止光半導體元件2之破損。 又’由於藉將抵接構件98之下面形成格子狀，可確保 均—之吸附力，並且可使基板丨之撓曲為最小，故可防止基 板1之損傷。 又’由於設在保持裝置90之緩衝構件94設置於前述傳 廷銷66之軸心上，故以傳送銷66頂出基板1之際，不致於基 板1負載多餘之力矩載重，而可更進一步有效地防止損傷。 最後，驅動電動馬達31，使傳送銷66返回原本之位置， 另方面’驅動保持裝置90之圖中未示之驅動裝置，拉進 連結蓋96後’直接在吸附基板1之狀態下使保持裝置90移動 至上方。然後，使前述保持裝置9〇滑動移動至原本之位置 後，確保成形品3。之後，藉反覆進行相同之作業，可連續 進行樹脂封裝作業。 例不了陶瓷基板作為前述基板，但未必限於此，亦可 為金屬基板、由環氧樹脂等構成之樹脂基板。 又’半導體元件不限安裝於前述基板之一面，亦可安 裝於兩面是無須贅言的。 再者’在本實施形態中，例示了緩衝構件94為橡膠之 情形’只要為如彈簧等具有彈性者即可。 又’在本實施形態中，板狀抵接構件98係以海綿來舉 例說明，材質未特別限定，亦可為鋁、鋼鐵等金屬製。特 別是在本實施形態中’就於板狀抵接構件98之下面配置底 面正方形凹部98a及格子狀凸部98b之情形作了說明，但未 21 201246404 必限於此。舉例言之，亦可於撓曲最大之抵接構件之中央 部形成凸部，以該凸部為中心，將凹部形成放射狀。 產業上之可利用性 本發明不限於前述實施形態之樹脂封裝裝置，當然亦 可適用於用以將兩面安裝有半導體元件之基板封裝樹脂之 樹脂封裝裝置。 I：圖式簡單說明3 第1A圖、第1B圖、第1C圖係顯示經以本案發明之樹脂 封裝裝置封裝樹脂之成形品之立體圖、正面圖及經裁切之 光半導體裝置單體之立體圖。 第2圖係本案發明之樹脂封裝裝置之正面圖。 第3圖係第2圖所示之樹脂封裝裝置之主要部份截面圖。 第4圖係本案發明之樹脂封裝裝置之側視圖。 第5圖係本案發明之樹脂封裝裝置之平面截面圖。 第6圖係第4圖所示之樹脂封裝裝置之主要部份放大截 面圖。 第7圖係第5圖所示之樹脂封裝裝置之主要部份放大平 面圖。 第8圖係第4圖、第5圖所示之保持裝置之放大側視圖。 第9圖係第8圖所示之保持裝置之主要部份放大平面圖。 第10A圖、第10B圖係用以說明本案發明之樹脂封裝裝 置之成形步驟的截面圖。 第11A圖、第11B圖係接續第10B圖之截面圖。 第12A圖、第12B圖係接續第11B圖之截面圖。 22 201246404 第13A圖、第13B圖係接續第12B圖之截面圖。 第14圖係接續第13B圖之截面圖。 【主要元件符號說明】 1...基板 33，82...螺帽 2...光半導體元件 35...套筒 3…成形品 36...上接頭 4...無用樹脂 40...下模具組 5...光半導體裝置 41...下模具模組 6...成形部 42...氣缸基座 9...樹脂封裝材料 43...中間基座 10...底板 44...固定框 11…繫桿 45...密封材 12...平台 46...驅動裝置 13...引導軌道 47...可動框 14，31，83...電動馬達 48...中心板 15，34，84...滚珠螺桿 49...内支持器 16...支撐塊 50，53…連結軸 20...上模具組 51...外板 21...上模具模組 52...外支持器 22...上模具槽 54...下層板 23··.引導孔 54a，81...支撐銷 24...吸引孔 55...活塞 25，26...透氣路徑 56...活塞蓋 30...滑動板 60...下模具槽 32…帶 61...支持器基座 23 201246404 61a...側面蓋 62…背板 62a...凸肩螺栓 62b，66a，96a·.·彈簧 62c…引導銷 63.. .陰模 64.. .傳送板 65.. .框架導件 65a...環狀段部 65b...缺口部 66.. .傳送銷 67.. .凹處 68.. .模穴部 69.. .樹脂積存部 70.. .連通路徑 71.. .銷孔 72.. .壓力感測器 80.. .升降裝置 85.. .引導板 86，96...引導軸 87.. .下接頭 90.. .保持裝置 91.. .上板 92. _ •柱 93.. .下板 94.. .緩衝構件 95.. .引導部 97.. .連結桿 97a...卡止爪 98.. .板狀抵接構件 98a...凹部 98b...凸部 99.. .吸引管 100.. .分配裝置 P...待機位置 24[Technical Field] The present invention relates to a resin package for mounting a semiconductor device mounted on at least one side of a substrate, for example, an integrated circuit, an optical semiconductor element encapsulating resin, and a resin. Packaging method. BACKGROUND OF THE INVENTION A substrate for an electronic component encapsulating resin such as a semiconductor device mounted on a surface is made of a ceramic material having excellent heat dissipation characteristics, and is mounted with a ceramic substrate such as an LED, a semiconductor (10) laser, or a power semiconductor device. . Further, there is a case where the resin encapsulating material is supplied to the mold 6 provided in the lower mold to impregnate the electronic parts of the substrate, and the resin is encapsulated, and after the resin is encapsulated, the molded product is released from the mold. For example, as shown in the third section of the patent document, there is a structure in which a resin package (4) 8 is supplied to a cavity 3' provided in the lower mold 2, and the substrate is mounted and fixed to the movable pin 6, the above mold 1After clamping the substrate with the lower mold 2, the resin is encapsulated, and the substrate 10 of the molded article is ejected by the movable pin 6. PRIOR ART DOCUMENT PATENT DOCUMENT Patent Document 1 Japanese Patent Laid-Open Publication No. 2006-245 No. 5 No. I: SUMMARY OF THE INVENTION SUMMARY OF THE INVENTION Problem to be Solved by the Invention 4 201246404 However, 'in the aforementioned resin packaging device', the upper mold i and the lower one are opened. In the molded state, the resin encapsulating material supply device is introduced into the upper mold 1 and the lower f, =, and 2, and the resin encapsulating material 8 is supplied to the cavity 3 provided in the lower mold 2, and the packaging material supply device is withdrawn. Then, the substrate transfer device (Fig. 2) is placed between the upper mold 1 and the lower mold 2, and the substrate 1 is mounted and fixed to the movable pin 6 of the lower mold 2, and then the substrate transfer device is ejected. Next, the substrate 1 is held by the above mold 1 and the lower mold 2, and then the mold is closed to encapsulate the resin. Therefore, since it takes time from the supply of the resin encapsulating material to the cavity to the encapsulating resin, it is impossible to use a resin encapsulating material having a short curing time. Further, since the upper mold 1 and the lower mold 2 are heated to a temperature suitable for resin molding and the substrate 10 is at normal temperature, when the resin is directly encapsulated in this state, the molten resin material is heated by the substrate 10, and the fluidity is lowered, which is easy. Produce problems such as unfilled or voids. Therefore, in the case of encapsulating the resin, the substrate 10 needs to be heated in advance, and in the above-described resin encapsulating apparatus, the waiting time until the upper mold 1 is pressed against the substrate 1 and heated to a predetermined temperature is required. Further, in the resin sealing device, when the molded article is ejected by the movable pin 6 and released, the substrate 10 can be ejected from the narrow front end surface of the ejector pin 6. Therefore, there is a flaw in the substrate 10 itself due to the impact force at the time of ejection. In particular, when a crack occurs in the encapsulating resin 8 of the molded article, there is a problem that the semiconductor 7L member 9 or the Au wire 11 of the package is broken, and the yield is poor. The present invention has been made in view of the above problems, and an object of the present invention is to provide a resin sealing device and a resin package which are capable of preventing damage of a substrate which may occur when a molded article of a semiconductor element mounted on a substrate is released from a mold by a mold. method. 201246404 Means for Solving the Problem In order to solve the above problems, the structure of the resin packaging device of the present invention is composed of an upper mold set and a lower mold set, and the upper mold set has a holding mechanism for holding the substrate on the lower surface, and the lower mold set A female mold having a cavity portion is mounted thereon, and is movable back and forth between the forming position and the standby position along the bottom plate through the horizontal moving mechanism, and the female mold located at the forming position is moved up and down by a clamping mechanism. The lower surface of the upper mold set and the negative mold of the lower mold set may be clamped by sandwiching the substrate on which the electronic component is mounted, and the electronic component of the substrate may be immersed in the resin package material supplied to the cavity portion. In order to perform resin encapsulation, the guide member is placed at least opposite to the outer circumference of the female mold, and the outer peripheral portion of the substrate may be pushed up by the (four) guide to be released. EFFECTS OF THE INVENTION According to the present invention, the frame guides disposed on at least two sides of the outer periphery of the female mold are not demolded by dots but by lifting the outer peripheral edge portion of the substrate. Therefore, since the concentration of the force other than the peripheral portion of the substrate can be dispersed and moderated, the damage of the substrate can be prevented, and the semiconductor element or the metal wire attached to the substrate can be prevented from being damaged. In addition, since the lower mold set can be moved back and forth between the forming position and the standby position, it is necessary to reduce the opening amount of the upper and lower molds by reducing the amount of opening of the upper and lower molds by the supply of the resin material supply and the feeding of the base material to the upper and lower molds. The entire resin packaging device. In particular, since the opening amount can be reduced, the mold clamping mechanism can be reduced, and the resin package device can be further miniaturized. Furthermore, since the mold clamping mechanism only operates the female mold, the driving force required for the mold clamping can be suppressed compared to the case where the lower mold 6 201246404 has the entire operation of the group, and the resin of the small plastic and low price can be obtained. Packaging device. Moreover, since the lower surface of the upper mold set has a holding mechanism for holding the substrate, after the resin sealing material is supplied to the cavity portion of the lower mold set to the position of liters, the substrate can be directly closed and sealed. Eucalyptus π. Therefore, since a resin encapsulating material having a short curing time can be used, it is possible to obtain not only a high-rise tree-laying device but also a resin-packaging device with a short shot-period and a short-lived south. In particular, when the frame guide is biased in the direction of the mold release, when the frame guide is at the standby position, when the substrate is mounted on the inner edge of the frame member or the frame guide on which the substrate is mounted When the piece moves from the standby position to the forming position, the substrate is suspended. Therefore, it is possible to prevent the electronic component of the τ® mounted on the substrate and the metal wire or the like connecting the f sub-component to the substrate from coming into contact with the female mold. The embodiment of the present invention may be configured such that the frame guide is biased toward the direction in which the molded article is released from the female mold by the elastic force. According to this embodiment, the product can be released from the female mold by the imparting ability of the frame guide according to the elastic force. Therefore, when other members for mold release are used, the driving force of the above-described release member can be reduced, so that a resin package device which is easy to design and has low production energy can be obtained. In another embodiment of the present invention, the frame guide may be formed in a frame shape surrounding the outer periphery of the female mold. According to the present embodiment, since the frame-shaped frame guide can lift the outer peripheral edge portion of the substrate, it is possible to further disperse and relax the field outside the substrate. Therefore, the damage of the aforementioned substrate can be further effectively prevented. According to still another embodiment of the present invention, the frame guide may be formed as a positioning segment for positioning the outer peripheral edge portion of the substrate. According to the present embodiment, since the positioning operation of the substrate is simple and accurate, the productivity can be improved, and the molding failure is reduced, and the yield can be improved. According to a different embodiment of the present invention, the structure may be provided with a notch portion for pulling up the substrate on at least one side of the frame guide opposed to the female mold. According to this embodiment, the positioning work and the take-out operation of the frame guide before and after the molding are simple, and the productivity can be further improved. According to a still further aspect of the present invention, the resin encapsulating device of the above embodiment includes a transfer pin for imparting a pre-existing force to the resin encapsulating material supplied to the cavity portion, and includes a disposition disposed below Abutting member connected to the base and a retaining device for buffering the cushioning member loaded on the punch 2 of the abutting member during demolding, and being held by the abutting member of the female die=holding device by the transfer pin The aforementioned base after resin encapsulation is ejected from the female mold, and the aforementioned transfer pin is also used for demolding. According to the fact that the surname of the * is based on the actual state, the substrate that has been sealed by the negative mold and the abutting structure can be ejected from the above-mentioned female mold, so that the buffer structure can also prevent the impact of the transmission. (4) Damage to the silk plate. Therefore, the damage of the semiconductor substrate of the substrate filament on the surface is terminated. The subsequent demolding 2 transfer pin is adjusted to form (4), and the core drive device can also be used because it no longer "ejokes the pin and has this: a simple construction and a resin seal." In order to solve the above problems, the resin encapsulation method of the present invention is a resin encapsulation method using an upper mold set having a holding mechanism for holding a substrate and a cavity portion mounted thereon. The female mold is configured to immerse the electronic component mounted on the substrate in the supply month by the horizontal movement mechanism and the lower abutment group structure that moves back and forth along the bottom plate between the forming position and the standby position. The resin encapsulating material is subjected to resin encapsulation, and the method comprises the following steps: after moving the lower mold group to the standby state, the substrate is arranged in an electronic zero shape, and the substrate is arranged in a (10) configuration to describe at least the opposite side of the negative mold. On the two sides of the "guide; moving the lower mold to the forming position 丄 and raising the female mold and the guide, the substrate is held in the holding mechanism of the mold set; the female mold and the frame guide Lowering and moving the mold set to the aforementioned standby position; supplying the resin encapsulating material to the cavity portion of the female mold; moving the lower mold group to the forming position, and then lending the female mold and the frame guide Ascending, the substrate is advanced by the aforementioned upper mold set, the negative mold of the lower mold set, and the aforementioned frame guide. The mold is used to perform resin encapsulation; and the female mold and the frame guide are lowered' and the peripheral portion of the substrate which is encapsulated by the resin is pushed up by the frame guide to be released. According to the present invention, the frame guides disposed on at least two sides of the outer periphery of the female mold are released from the outer peripheral portion of the substrate by the point ′ instead of the point ’. Therefore, since the force can be concentrated outside the peripheral portion of the substrate, the damage of the substrate can be prevented, and the semiconductor element or the metal wire attached to the substrate can be prevented from being damaged. Moreover, since the underside of the upper mold set has a structure for holding the substrate 201246404, after the resin encapsulating material is supplied to the mold portion of the lower mold set and moved to the forming position, the substrate can be directly clamped to encapsulate the resin. . Therefore, since a resin encapsulating material having a short curing time can be used, it is possible to obtain a resin encapsulating method which is not only versatile, and also has an effect of a resin encapsulating method which has a short molding cycle and high productivity. Further, according to the present invention, the substrate on which the electronic component is mounted is positioned on the frame guide, the lower mold frequency (4) is brought to the molding position, and the female mold and the frame guide are raised, and the substrate is held by the substrate. Describe the holding mechanism of the mold set, lowering the female mold and the frame guide, and: 'moving the lower module to the standby position, and returning the resin package to the cavity portion of the female mold, so that the The mold set is moved to the forming position and the female mold and the frame guide are raised, and the substrate can be assembled by the negative mold of the upper mold set and the frame guide. Therefore, it is possible to preheat the substrate while holding the substrate in the upper mold set to hold the L' to the encapsulating resin, and it is not necessary to simply describe the package. 81B of Fig. 1B shows a perspective view of a solid-state device, a front view, and a cut dry conductor device, which are obtained by the resin of the present invention. The figure is a front view of the tree shaft mounting device of the invention. A cross-sectional view of the main part of the resin sealing device shown in Fig. 2 of the second embodiment. A side view of the device of the syllabus. 5 is a plan view of a resin encapsulating device of the present invention. 10 201246404 Main part of the enlarged section of the enlarged section of the enlarged section Fig. 6 is a diagram of the resin package shown in Fig. 4. Fig. 7 is a view showing a resin package surface shown in Fig. 5. Fig. 8 is an enlarged side view of the holding device shown in Figs. 4 and 5. Fig. 9 is an enlarged plan view showing the main part of the holding device shown in Fig. 8_. A section of the forming step of the resin encapsulating apparatus invented by the first invention. The first and the 11th picture are the continuation of the chart of the _Fig., the section of the dynasty of the dynasty, the section of the dynasty, the first section of the dynasty Several faces. C solid package cooling type; 3 embodiment for carrying out the invention According to the embodiment of the additional drawing device according to the first to third drawings. The resin package of the present invention is as shown in Fig. 1, and the resin package of the present embodiment is used for mounting a conductive substrate with a conductive pattern at a predetermined pitch; Resin. ...this real blush material _ money to the heat of the heat of the light of the stone material is the main raw material of the material. The above-mentioned resin encapsulation;| 枓 refers not only to the tablet that has been used so far, but also to inject the liquid ί 日 封装 packaging material into the mold, so that the recovery is as history, heating, and heat hardening. In this way, the shape of the celluloid. For example, in the case of the case, as described later, it is also possible to have the (4) product 3 of the unnecessary resin 4 adjacent to the forming portion 6 provided on the substrate i as j 11 201246404. Further, the product 3 is cut into the optical semiconductor device 5 (the _)'it row bump processing in the step (4) of the subsequent step (4), and then mounted on the mother substrate. / As shown in FIG. 2, the resin encapsulating device of the substrate i encapsulating resin is fixed to the lower portion of the platform 12 by the platform 12 fixed to the upper end of the four tie bars u which are erected on the bottom plate 1 The upper mold set 20 is located on the lower side of the upper mold set 2G, the wire is placed as a slide plate 3G slidable along the upper surface of the bottom plate 1 , and the mold set 40 is disposed on the lower surface of the slide plate 30. In the fifth drawing, the holding device 9A and the dispensing device 1 are arranged to be in a standby position toward the bottom plate 10? Interaction moves back and forth. As shown in Fig. 6, the upper mold set 20 is fixed to the lower surface of the stage 12, and the mold module 2 is fixed to the lower mold groove 22 of the upper mold module 21. In the upper mold groove 22, a guide hole 23 for inserting a guide pin, which will be described later, is formed in the upper mold groove in the lower surface of the substrate! (4) Face (4) The material is set in the village (4). (4) The suction hole 24 is connected to a vacuum generating device (not shown) by a gas permeable path 25 formed in the upper mold block 21 and the upper mold groove 22. Similarly, the ventilating path % which is a vacuum in the sealed space at the time of molding is connected to a vacuum generating device (not shown). The lower mold set 40 is sequentially assembled with the lower mold module 41 and the lower mold groove on the upper surface of the slide plate 30 which is disposed to slide along the upper surface of the bottom plate 1 . Further, the lower mold set 40 has a lifting device 8A assembled to the bottom plate 10 directly under the sliding plate 30 at its forming position. The slide plate 30 is assembled so as to be slidably movable between a standby position p (Fig. 4) and a forming position (Fig. 6) along one of the faces of the bottom plate 1 12 12 201246404. Further, as shown in Fig. 4, the electric motor 14 rotates the ball screw 15, and the slide plate 3 is movable back and forth between the standby position p and the forming position. Further, as shown in Fig. 6, the slide plate 3 has an electric motor 31 that drives the side of the slide plate 3, and the nut 33 is rotated by the belt 32, thereby moving up and down. Ball screw 34. Further, the joint % is suspended by the sleeve 35 disposed on both sides of the nut 33 described above. X, the aforementioned sliding plate 30 is constructed by a support block 16 located at a lower portion of the center thereof and fixed to the bottom plate 1 at the time of clamping. The lower mold module 41 is configured by sequentially stacking the cylinder base 42 and the intermediate base 43 on the slide plate 3〇. Further, the lower mold module has an annular fixing frame 44 stacked on the upper edge portion of the intermediate base 43. The fixed frame 44 is disposed such that the movable frame 47 having the annular seal member 45 thereon is vertically movable by the drive unit 46 (see Fig. 2). As shown in Fig. 3, the cylinder base 42 is disposed so as to be slidably engaged with the ball screw 34 and the plate 48 (4). Further, the upper end portion of the connecting shaft 50 which is erected at the corner portion of the inner holder 49 is connected, and the transfer plate (four) of the lower mold is formed. Further, it is arranged such that the outer plate 51 is slidably engaged with the outer H 52 by the sleeve 35. X, the upper end portion of the connecting shaft 53 placed on the outer support (4) is connected to the lower layer 54 disposed in the intermediate base 43 and is formed into a body. In the gas base pedestal 42 and the intermediate base 43, a total of eight pistons 55 that are housed in two rows and that are arranged in four rows are formed, and the space in which the piston cover 56 is sealed is formed. In the case of the liquid of the pressure medium, the liquid is flowed out from the injection port and the discharge port (not shown) at 13 201246404, whereby the tongue plug 55 is moved up and down, and the lower plate 54 is passed through to the lower mold 54 to be given to the negative mold 63 to be described later. As shown in FIGS. 3 and 6, the lower mold groove 60 is provided in a space formed by the intermediate base 43 and the fixed frame 44, and is attached to the outer surface of the frame holder base 61. Side cover - and 'in the aforementioned holder: a backing plate 62 is disposed in the seat 61. Further, in the present embodiment, the substrate 1 can be simultaneously molded, and the lower mold 6 can be formed into two sets of components, and the number of sheets can be changed. The back plate 62 is prevented from falling off by the shoulder bolts 62a of the lower plate module 54 which are erected by the lower plate module 54. Further, as shown in Fig. 7, the back plate 62 has a female mold 63 placed on the upper center portion thereof, and a frame-shaped frame member 65 is supported by the spring 62b' on the outer circumference of the upper surface. The aforementioned frame guide 65 is biased by the aforementioned spring 62b to be pushed upward from the upper surface of the above-mentioned female mold 63. Further, the frame guide 65 is formed on the inner peripheral portion thereof to position the annular segment portion 65a of the substrate 1, and on the other hand, the bow guide pin 62c that is erected on the back surface 62 is protruded from the bottom portion. It stands out above. Further, the positioning work and the take-out operation when the substrate 1 is placed by manual work are facilitated, and the front frame guide 65 is formed with the notch portion 65b. ▲ Further, as described above, the transfer sheet material disposed on the lower side of the backing plate 62 is coupled to the lower mold module 41 by a connection (10). The transfer sheet material is inserted through the spring force of the spring 66a to transfer the potential energy. The lower part of the pin. On the other side, the upper surface of the transfer material f plate 62 and the female mold 63 are inserted so as to be protruded, and the front end portion thereof is inserted into the resin reservoir described later. Therefore, the transfer pin 66 can be moved up and down by driving the electric motor 31. 201224404 A certain pressure is applied to the resin encapsulating material 9 supplied to the female mold 63, and the formed molded article 3 can be ejected. As shown in Fig. 7, the plane of the female mold 63 is approximately square, and the hemispherical cavity portions 68 are arranged in a lattice shape in the recess 67 formed thereon, and along the opposite sides of the aforementioned recess 67 A resin reservoir 69 is formed. The resin reservoir 69 communicates with the recess 67 via the communication path 70, and a pin hole 71 through which the transfer pin 66 can be inserted is formed at a predetermined position. Further, a pressure sensor 72 capable of detecting the resin filling pressure in the female mold 63 is provided at a position communicating with the recess 67. As shown in Fig. 3, the lifting device 80 is provided with a nut 82 at a lower end portion of the support shaft 81 attached to the lower surface of the bottom plate. Further, as shown in Fig. 6, the nut 82 is rotated by the electric motor 83, and the bow guide 85 attached to the upper end portion of the ball screw material is moved up and down, whereby the guide plate can be attached to the guide plate. The guide shaft 86 of the corner is moved up and down. Further, one of the adjacent pairs is connected to the joint 87 below the end portion of the guide shaft %. As shown in Figs. 4 and 5, the holding device 9 is a device for sucking and holding the substrate 1 before and after the sealing resin, and is movable back and forth toward the standby position of the bottom plate 1 and supported to be movable up and down. Further, the holding device 9 is also configured to hold two substrates in the same manner as the lower mold and the rolled 60. Further, as shown in Figs. 8 and 9, the above-described holding device 90 has two square lower plates 93 suspended from the rectangular upper plate 91 by four sets of two ridges 92. Further, between the upper plate 91 and the lower plate 93, a cushion member 94 made of a rubber material or the like is held in four corners in four corners, and the position is placed on the center of the transport pin 66. The upper plate 91 supports the guide shaft 96 so as to be slidable in the axial direction by the guide portion 95 provided on the both sides of the lower surface 15 201246404. Further, the aforementioned bow guide shafts 96, 96 are assembled with the spring 96a, and are given the potential energy directed toward the outside, and are connected by the connecting rod 97 provided at the front end portion thereof. Further, locking claws 97a are provided at both end portions of the connecting rod 97. On the other hand, the lower plate 93 is followed by a plate-like abutting member 98 composed of a sponge or the like. The plate-like abutting member 98 is provided with a deepest bottom surface square recess 98a on its lower surface, and a lattice-like convex portion 98b is provided to form a gap therebetween. Further, the attraction bumps 99 are respectively connected to the concave portions 98a' to attract the substrate 1. Further, it is needless to say that the holding device 9 can also use an unloading device that increases the transport distance and the transport function. As shown in Fig. 5, the dispensing device 1 can be moved back and forth toward the standby position P on the bottom plate 10 by a driving device not shown. Further, the aforementioned dispensing device 100 will be available. Ten of the liquid resin encapsulating material is injected into the female mold 63 of the mold module 41 which is pulled out to the standby position P. Next, the encapsulation method of the resin encapsulating apparatus of the present embodiment will be mainly described based on the additional drawings of Figs. 1 to 14 . First, by driving the electric motor 14, the ball screw 丨 5 is rotated, and the slide plate 30 is slidably moved to the standby position P indicated by the two-dot chain line in Fig. 4 . Then, the substrate 丨 is positioned by the load device not shown manually or in the figure to the annular segment portion 65a of the exposed frame guide 65. In the present embodiment, since the annular segment portion 65a is formed in the frame guide 65, the operation of manually positioning the substrate 1 is simple and correct. Further, since the frame guide 65 is formed with the notch portion 65b, the operator positions the substrate 1616 201246404 to form the exit of the finger holding the substrate 1, and the operation of manually positioning the substrate 1 is simple and correct. In addition, the positioning of the substrate 1 described above may also be performed on a positioning pin (not shown) of the frame guide 65. Then, when the electric motor 14 is driven to rotate the aforementioned ball screw 15 to move the female mold 63 to the forming position (Fig. iA), the upper joint % is engaged with the lower joint 87 (Fig. 1). Further, according to the present embodiment, the substrate 1 is positioned at the inner peripheral portion of the frame guide 65, and the frame guide 65 is given a potential energy, and can be ejected upward from the upper side of the phantom. Therefore, the aforementioned substrate is in a floating state. As a result, when the female mold 63 is moved to the molding position, the optical semiconductor element 2 mounted on the substrate 1 or the Au line connecting the optical semiconductor element 2 and the substrate 1 can be prevented from coming into contact with the female mold 63 even by applying vibration or impact. Next, when the electric motor 83 is driven, the ball screw 84 screwed to the nut 82 is rotated, and the pusher is guided to thereby push the plate 51 and the branch (4) 52 by the lower joint 87 and the upper joint 36. @本, by the erecting shaft 53 which is erected on the support 52, pushes the lower plate 54, the branch _54a, and the (four) material plate 62. As a result, the borrowing (four) spring 62b elastically cuts the frame guide 65 of the back plate 62. Ascending, the substrate 1 also rises. ‘Then, the 5丨 guide pin is embedded in the guide hole η, and correctly lined up in the position of the financial position, (4), the front «plate 1 is below the mold groove 22 (Fig. 10B). Further, when the lower plate 54 is raised, the piston 55 connected to the lower plate 54 rises and the liquid which is present on the upper surface of the large intrusion portion 55a is discharged from the discharge port (not shown), and follows the operation of the lower plate 54. 17 201246404 Vacuum device not shown in the driving diagram 'The suction hole 24 provided under the upper mold groove 22 sucks and holds the substrate 1, and then drives the electric motor 83 to lower the female mold 63 (Fig. 11A). Further, the frame guide 65 presses the substrate to the upper mold groove by the elastic force of the spring 62b before the negative mode is lowered. The lower surface does not cause distortion or unevenness on the substrate 1. Then, by driving the electric motor 14, the lower mold set 4 is moved again from the forming position to the standby position p. Then, the measured liquid resin encapsulating material 9 is injected into the cavity portion 68 (Fig. 11B) after the sliding device has just been slid and moved to the upper side of the female mold 63. Thereafter, by driving the electric motor 14, the ball screw 15 is reversely rotated, and the π-moving plate 30 is returned to the forming position, whereby the upper joint joint is clamped. . Then, the movable frame 47 is raised, so that the sealing material 45 is adhered to the upper mold groove to the lower side, and the device is driven by the air passage 26 by the air passage 26, which is formed in the upper mold money and the towel base. The air in the confined space between the crucibles is decompressed to a predetermined pressure (Fig. 12). The shawl drives the electric motor 83, and the ball 蜾 rod 84 screwed to the snail rotates the ejector (10), thereby pushing the plate 51 and the holder 52 by the lower joint (4) upper joint 36. Therefore, the back plate (four) is pushed up by the upright plate 54, the branch (four) 54a which is erected to the aforementioned holder 52. As a result, the frame 65 of the back sand was raised by the (four) * 62b elastic cut. Further, when the lower deck 54 is raised, the activity 55 connected to the lower deck M rises, and the liquid existing on the upper surface of the large-diameter portion is discharged from the discharge port (not shown) to follow the operation of the lower deck 54. 201246404 Then, the guide pin 62 is inserted into the guide hole 23, and the substrate 1 which is correctly positioned at the predetermined position and held at the predetermined position is intended to be fitted to the annular segment portion 65a. Then, the lower surface of the substrate 1 and the upper mold groove 22 is sandwiched by the frame guide 65 and the female mold 63 (Fig. 12B). Therefore, the photo-semiconductor element 2 mounted on the substrate can be immersed in the resin encapsulating material 9 in the cavity portion 68. In this step, the optical semiconductor element 2 of the substrate 1 previously held in the upper mold groove 22 and the metal wire connected to the optical semiconductor element 2 are exclusively contacted with the secret sealing material of the cavity portion 6 of the negative mold. Before moving at a relatively high speed, and then clamping at a low speed and a low pressure, the liquid is injected into the lower portion of the large diameter portion 55a of the piston 55 by a pressing device (not shown), and then pressurized. mold. When the upper mold groove 22 and the female mold 63 are brought into close contact with each other by the substrate 1, the resin encapsulating material 9 remaining in the cavity portion 68 flows into the resin reservoir portion 69 via the communication path 7?. Then, by driving the electric motor 31, the transfer pin 66 is moved up and down, whereby the deviation of the injection amount of the resin encapsulating material 9 is solved, and the pressure is applied to the cavity portion 81⁄4. The upper and lower movement of the conveying pin 66 is controlled by the electric motor 31 to reach the set pressure according to the pressure detected by the pressure sensor 72 provided in the female mold 63 of the lower mold, and is controlled by the piston 55 to produce the necessary minimum clamping. pressure. Then, by the action of the transfer pin 66, the pressing means is increased in proportion to the pressure detected by the pressure sensor 72 by a pressing means not shown in the drawing to perform the final mold clamping. After the predetermined hardening time, the electric motor 31 is driven to lower the transfer pin 66, and the transfer pin 66 is separated from the hardened resin encapsulating material $. Next, the movable frame 47 is lowered, and the pressurizing device is stopped, and after the negative load of 201246404 is loaded, the electric motor μ is driven to cause the female mold 63 to be placed on the mold 22, and the vacuum generating device stops the air instantaneously, then stops. The molded product 3 is attached to the hardened resin encapsulating material 9 by the female mold 63, and is lowered as the above-mentioned female mold 63 is lowered (Fig. 13A). After the boat motor motor 14 moves the lower die set 4 () to the standby position, the holding device 90 is slidably moved directly above the lower die set 4'. Then, by means of a driving device not shown in the figure of the holding device 90, the connecting cover is pulled in to the inside and lowered to a predetermined position. Then, the driving device (not shown) is released, and the locking claws 97a are locked to the side cover 61a, whereby the substrate 1 is brought into contact with the lower surface of the abutting member 98, and the abutting member 98 and the frame are simultaneously The guide member 65 sandwiches the outer peripheral portion of the substrate 1 (Fig. 3A). Then, the suction member 99 is attracted, whereby the abutting member 98 is adsorbed to the substrate 1 of the molded article 3. By engaging the locking claws 97a with the side cover 6ia, the impact force applied to the holding device 9 can be effectively absorbed when the transfer pin 66 is described later. When the electric motor 31 is driven to raise the transfer pin 66, the unnecessary resin 4 hardened in the pin hole 71 can be ejected, and the frame guide 65 pushes the outer peripheral portion of the substrate 1 with the elastic force of the spring 62b, and abuts The attraction force of the member 98 attracts the substrate 1, whereby the molded article 3 can be released from the female mold 63 without being bent (Fig. 14). At this time, the outer periphery of the formed portion 6 formed by the resin encapsulating material 9 which is firmly adhered to the female mold 63 and firmly adhered by the plurality of transfer pins 66, while pushing the substrate by the annular segment portion 65a of the frame guide 65 1 outside the peripheral part. Further, by the abutting member 98 attracting the entire projection surface of the substrate 1, the molded portion 6 can be released from the recess 67 of the female mold 63 with strong strength and balance. Further, the impact force of the conveying pin 66 generated at the time of demolding can be absorbed and moderated by the abutting member 98 and the cushioning member 94 201246404. Therefore, not only the substrate of the molded article 3 is not damaged, but also the optical semiconductor element 2 can be prevented from being damaged. Further, since the lower surface of the abutting member 98 is formed in a lattice shape, the uniform adsorption force can be ensured, and the deflection of the substrate 丨 can be minimized, so that the damage of the substrate 1 can be prevented. Further, since the cushioning member 94 provided in the holding device 90 is disposed on the axis of the transfer pin 66, when the transfer pin 66 is ejected from the substrate 1, the substrate 1 is not loaded with an excess torque load, and can be further advanced. Effectively prevent damage. Finally, the electric motor 31 is driven to return the transfer pin 66 to the original position. On the other hand, the drive device (not shown) of the drive holding device 90 is pulled into the joint cover 96, and the holding device is directly held in the state of adsorbing the substrate 1. 90 moves to the top. Then, the holding device 9 is slid and moved to the original position, and the molded article 3 is secured. After that, the resin can be continuously processed by repeating the same operation. The ceramic substrate is not particularly limited as the substrate, but is not limited thereto, and may be a metal substrate or a resin substrate made of an epoxy resin or the like. Further, the semiconductor element is not limited to being mounted on one side of the substrate, and it is not necessary to say that it can be mounted on both sides. In the present embodiment, the case where the cushion member 94 is made of rubber is exemplified as long as it has elasticity such as a spring. Further, in the present embodiment, the plate-shaped abutting member 98 is exemplified by a sponge, and the material is not particularly limited, and may be made of metal such as aluminum or steel. In the present embodiment, the case where the bottom square concave portion 98a and the lattice convex portion 98b are disposed on the lower surface of the plate-shaped abutting member 98 has been described, but the present invention is not limited thereto. For example, a convex portion may be formed at a central portion of the abutting member having the largest deflection, and the concave portion may be formed radially around the convex portion. Industrial Applicability The present invention is not limited to the resin package device of the above embodiment, and can of course be applied to a resin package device for mounting a substrate encapsulating resin having semiconductor elements on both sides. I. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A, FIG. 1B, and FIG. 1C are perspective views showing a molded article of a resin encapsulating resin encapsulated by the present invention, a front view, and a perspective view of a single cut optical semiconductor device. . Fig. 2 is a front elevational view showing the resin encapsulating apparatus of the present invention. Fig. 3 is a cross-sectional view showing the main part of the resin package device shown in Fig. 2. Fig. 4 is a side view of the resin encapsulating device of the invention of the present invention. Fig. 5 is a plan sectional view showing a resin encapsulating apparatus of the present invention. Fig. 6 is an enlarged cross-sectional view showing the main part of the resin package device shown in Fig. 4. Fig. 7 is an enlarged plan view showing the main part of the resin package device shown in Fig. 5. Fig. 8 is an enlarged side view of the holding device shown in Figs. 4 and 5. Fig. 9 is an enlarged plan view showing the main part of the holding device shown in Fig. 8. Fig. 10A and Fig. 10B are cross-sectional views for explaining the forming steps of the resin encapsulating device of the present invention. Fig. 11A and Fig. 11B are cross-sectional views taken along line 10B. Fig. 12A and Fig. 12B are cross-sectional views taken along line 11B. 22 201246404 Fig. 13A and Fig. 13B are cross-sectional views of Fig. 12B. Figure 14 is a cross-sectional view taken along line 13B. [Main component symbol description] 1. . . Substrate 33, 82. . . Nut 2. . . Optical semiconductor component 35. . . Sleeve 3...formed product 36. . . Upper joint 4. . . Useless resin 40. . . Lower mold set 5. . . Optical semiconductor device 41. . . Lower mold module 6. . . Forming part 42. . . Cylinder base 9. . . Resin packaging material 43. . . Intermediate base 10. . . Bottom plate 44. . . Fixed frame 11... tied rod 45. . . Sealing material 12. . . Platform 46. . . Drive unit 13. . . Guide track 47. . . Movable frame 14,31,83. . . Electric motor 48. . . Center board 15,34,84. . . Ball screw 49. . . Internal support 16. . . Support block 50, 53... connecting shaft 20. . . Upper mold set 51. . . Outer plate 21. . . Upper mold module 52. . . External support 22. . . Upper mold groove 54. . . Lower board 23··. Guide hole 54a, 81. . . Support pin 24. . . Attracting holes 55. . . Piston 25,26. . . Breathable path 56. . . Piston cover 30. . . Sliding plate 60. . . Lower mold groove 32... belt 61. . . Support base 23 201246404 61a. . . Side cover 62...back plate 62a. . . Shoulder bolts 62b, 66a, 96a·. · Spring 62c... guide pin 63. . . Female model 64. . . Transfer board 65. . . Frame guide 65a. . . Annular section 65b. . . Notch 66. . . Delivery pin 67. . . Concave 68. . . Cavity part 69. . . Resin reservoir 70. . . Connected path 71. . . Pin hole 72. . . Pressure sensor 80. . . Lifting device 85. . . Guide board 86,96. . . Guide shaft 87. . . Lower joint 90. . . Holding device 91. . . Upper plate 92. _ • Column 93. . . Lower board 94. . . Cushioning member 95. . . Guide portion 97. . . Connecting rod 97a. . . Card claws 98. . . Plate-shaped abutment member 98a. . . Concave 98b. . . Convex 99. . . Suction tube 100. . . Distribution device P. . . Standby position 24