JP6079925B1 - Resin sealing device and abnormality detection method of resin sealing device - Google Patents

Abstract

The present invention provides a resin sealing device and an abnormality detection method capable of appropriately detecting a sliding failure of an exposed pin in a resin sealed package in which an exposed portion is formed on an electronic component surface. A spring pin 13 provided in a first mold 2 abuts on the surface of a sensor element of a substrate with a sensor element, which is a substrate with an electronic component, to form an exposed portion. A light-shielding sensor is installed on the upper end surface of the holder base, and detects the tip of the detection pin constituting the spring pin 13. The load detection pin holder 42 of the load measuring loader 40 is a portion that is pushed up by the second mold 3 driven by the mold driving device, and is lifted through the guide portion 44 to enter the cavity of the first mold 2. Go closer. The load detection pin 45 of the load detection pin holder 42 comes into contact with the tip of the exposed pin 30 and measures the load when the exposed pin 30 is pushed up. [Selection] Figure 3

Description

  The present invention relates to a resin sealing device and an abnormality detection method for the resin sealing device.

  Conventionally, insert molding has been performed in which an electronic component such as a semiconductor is sealed with a resin to manufacture a resin-sealed package. In this insert molding, an electronic component, a substrate with an electronic component, or the like is fixed inside a mold, and a resin melted in a cavity is filled and cured to integrate the substrate with the electronic component, etc. and a resin molding portion.

  In addition, depending on the type of electronic component such as a semiconductor sealed in a resin-sealed package, a portion not sealed with resin may be set on the surface of the electronic component. For example, when the electronic component is a temperature sensor, a humidity sensor, or various sensor elements for a camera, the element surface is exposed to the outside without being covered with resin.

  Here, when manufacturing a resin-sealed package with the element surface exposed to the outside by insert molding, it is necessary to mask the element surface at the time of resin sealing, for example, an exposed pin held by a spring on the element surface There is a method for abutting.

  A through hole communicating with the cavity is formed in the mold, an exposed pin inserted through the through hole is provided, and the tip of the exposed pin protrudes outside the cavity.

  The exposure pin is held by a spring and is biased toward the element surface side installed in the cavity. The exposure pin is configured to be movable back and forth while sliding along the through hole.

  The tip of the exposed pin comes into contact with the element surface with an appropriate pressure to mask the element surface. In this state, resin sealing is performed to manufacture a resin-sealed package in which an exposed portion of the element surface is formed.

  In the resin sealing device, not only the above-described exposed pin but also a structure in which a through hole is provided in the mold and the pin is inserted, for example, there is an ejector pin for releasing a molded product from the cavity.

  The ejector pin is provided by being inserted through a through hole formed in the mold, and takes two positions, that is, a retracted position at the normal time and a protruding position at the time of releasing the mold. When the molded product is released, the ejector pin is pushed out to the cavity side by a pressing device, and the tip protrudes greatly to release the molded product. In normal times, the spring is returned to the retracted position by the biasing force of the spring.

  In the forward / backward movement of the ejector pin, there may be a phenomenon that foreign matter such as resin waste is mixed into a gap formed by the movement of the pin, and the pin does not return to the normal retracted position. And there existed a problem that a metal mold | die will operate | move without the ejector pin returning to an appropriate retreat position, and a large amount of poorly molded resin-sealed packages are generated.

  Under such circumstances, there is a mold for detecting the position of the ejector pin and trying to detect an abnormality. For example, a mold described in Patent Document 1 has been proposed.

  In the metal mold described in Patent Document 1, a metal plate is further attached to a plate portion provided at the base end (base) of the ejector pin, and the position of the metal plate is detected by a magnetic sensor. .

Japanese Patent Laid-Open No. 7-60806

  Here, in the conventional mold and the resin sealing apparatus for manufacturing the resin-sealed package with the element surface exposed to the outside, including the mold described in Patent Document 1, there is an ejector pin abnormality detection mechanism. There was no structure capable of appropriately detecting the above-described abnormality of the exposed pin.

  More specifically, there is a problem that the resin flows from the cavity side between the exposed pin and the through hole, the sliding resistance changes, and the sliding failure of the exposed pin occurs. The clearance between the exposed pin and the through-hole is as small as 10 μm or less, but it is difficult to avoid the resin from flowing in due to the high fluidity of the resin.

  Further, not only the resin flows, but also the occurrence of sliding of the exposed pin due to the generation of metal scrap due to wear associated with the long-term advance / retreat operation of the exposed pin and the increase of the frictional force due to seizure.

  A change in the sliding resistance force between the exposed pin and the inner peripheral surface of the through hole affects the load when the tip of the exposed pin comes into contact with the element surface. For example, the pressing force when the exposed pin comes into contact with the element surface becomes excessive, and the semiconductor element may be damaged.

  In addition, the pressing force to the element surface by the exposed pin may be weakened, or the exposed pin may not return to the normal position after the molded product is released, and the tip of the pin may not reach the element surface. As a result, the resin may wrap around the exposed portion of the element surface, resulting in a poorly molded resin-sealed package.

  In order to reduce such poorly molded resin-sealed packages, there is a need for a mechanism that can detect the presence or absence of poor sliding of exposed pins. In particular, there is a demand for a mechanism that can appropriately evaluate the load when the tip of the exposed pin comes into contact with the element surface and the exposed pin is pushed up to the spring side.

  The present invention was devised in view of the above points, and a resin sealing device capable of appropriately detecting the presence or absence of sliding failure of an exposed pin in a resin sealed package in which an exposed portion is formed on the surface of an electronic component. And it aims at providing the abnormality detection method of a resin sealing device.

  In order to achieve the above object, the resin sealing mold of the present invention includes a main body in which a hollow portion is formed, a mold matching surface provided in the main body, and a thermosetting which is provided on the mold matching surface side. A cavity recess filled with a conductive resin, a first through hole formed continuously to the cavity recess and the hollow portion of the main body, and the first through hole of the main body connected to the hollow portion of the main body. A second through-hole formed on the opposite side; a pin flange disposed in a hollow portion of the main body and biased by an elastic body toward the first through-hole; and the first of the pin flange And an exposed pin configured to slide along the inner peripheral surface of the first through hole and move forward and backward, and The second through-hole is provided on the side opposite to the side where the exposed pin is provided so that the second through-hole can be inserted. A detected pin whose tip is configured to protrude outward from the second through hole, and a tip of the detected pin from the second through hole provided on the opposite side of the mold matching surface side of the main body. A second mold having a first mold having a detection sensor part for detecting the protrusion of the first mold, and a mold-matching surface for clamping the substrate with electronic parts in cooperation with the mold-matching surface of the first mold The first mold and the second mold can be brought close to each other, and a mold driving unit capable of performing mold clamping by bringing them close to each other, the first mold and the second mold A detection loader body that can be placed between the molds and can be brought close to the mold mating surface of the first mold via the second mold pushed by the mold drive unit; and the detection loader Load that is provided on the main body and measures the load when the exposed pin is pressed against the tip of the exposed pin Comprising a loader for load measurement with Nsa section.

  Here, a first mold having a mold matching surface provided in the main body, and a second mold having a mold matching surface for clamping the substrate with electronic parts in cooperation with the mold matching surface of the first mold. The substrate with electronic parts can be clamped and clamped by the mold.

  In addition, a resin molding portion can be provided by a cavity concave portion provided on the mold matching surface side and filled with a thermosetting resin.

  Further, a pin collar portion is disposed inside the first mold by a main body having a hollow portion and a pin collar portion disposed in the hollow portion of the main body and biased by an elastic body toward the first through hole. An urging force can be applied to the attachment and pin collar.

  A first through hole formed continuously with the cavity recess and the hollow portion of the main body; an exposed pin provided by inserting the first through hole on the first through hole side of the pin flange; The exposed pin is inserted into the first through hole by the pin collar portion that is disposed in the hollow portion and is urged by the elastic body toward the first through hole. Further, the biasing force of the elastic body can be applied to the exposed pin through the pin flange, and the tip of the exposed pin can be biased in the direction protruding from the cavity recess. As a result, the tip of the exposure pin can be brought into contact with the surface of the electronic component of the substrate with the electronic component disposed in the cavity recess to be exposed to the outside.

  Also, an exposed pin configured to slide along the inner peripheral surface of the first through hole and move forward and backward, and a pin disposed in the hollow portion of the main body and biased by an elastic body on the first through hole side An appropriate load is applied to the member in contact with the tip of the exposed pin by the collar portion. That is, this load becomes a force that the tip of the exposed pin presses the surface of the electronic component of the substrate with the electronic component. The load referred to here is mainly the urging force of the elastic body and the sliding resistance force generated between the exposed pin and the inner peripheral surface of the first through hole, which changes as the first mold is used. Means something consisting of

  In addition, the exposed pin receives the biasing force of the elastic body through the pin collar, and masking is possible even when the type of base material with electronic parts that contacts the tip of the exposed pin and the thickness of the resin molded part are different. It is possible. In other words, the elastic body responds to the difference in the size of the electronic component surface of the substrate with the electronic component and the thickness of the sealing molded portion, so that it can be masked while applying an appropriate pressure to the electronic component surface. Yes.

  A pin collar disposed in the hollow portion of the main body, an exposed pin provided on the first through hole side of the pin collar, and a detected object provided on the side opposite to the side where the exposed pin of the pin collar is provided The pin has a structure in which the pin flange, the exposed pin, and the detected pin are integrated. That is, the position of the pin to be detected is changed by the change of the position accompanying the advance / retreat operation of the exposure pin. The position of the exposed pin refers to the standby position where the tip of the exposed pin protrudes beyond the cavity recess, the surface of the electronic component of the substrate with the electronic component contacts the tip of the exposed pin, and the tip of the exposed pin is the cavity. There are two positions at the time of resin sealing pushed into the concave side. The position of the pin to be detected also changes depending on the standby position of the exposed pin and the position at the time of resin sealing.

  Further, a second through hole formed on the opposite side of the main body from the first through hole and connected to the hollow portion of the main body, and on the side opposite to the side where the exposed pin of the pin collar is provided, The detected pin is inserted through the second through-hole by the detected pin that is provided so that the through-hole can be inserted and whose tip can protrude outside the second through-hole. The tip can protrude to the outside of the main body. That is, for example, as described above, when the position of the detected pin changes with the change of the position due to the forward / backward movement of the exposed pin, and the exposed pin becomes the resin-sealed position, the tip of the detected pin is the main body. It can be set as the structure which protrudes outside.

  Further, a second through hole formed on the opposite side of the main body from the first through hole and connected to the hollow portion of the main body, and on the side opposite to the side where the exposed pin of the pin collar is provided, A through-hole is provided so that the through-hole can be inserted, and a tip thereof is provided on the side opposite to the mold-matching surface side of the main body so as to protrude outside the second through-hole. By detecting the protrusion of the tip of the detected pin, the protrusion of the tip of the detected pin can be detected. In other words, the position of the tip of the exposed pin can be detected by detecting the position of the tip of the detected pin. By detecting the position of the tip of the pin to be detected, for example, detecting the state where the sliding resistance applied to the exposed pin increases and the exposed pin remains in the resin-sealed position and does not return to the standby position. Is possible. In addition, the position at the time of resin sealing to be detected here is not only when actually injecting resin, but also when the exposed pin is pushed in with the load sensor section described later in contact with the tip of the exposed pin. The position is included.

  In addition, the first mold and the second mold can be brought close to each other, and the mold drive unit capable of performing the mold clamping by bringing them close to each other allows the base material with electronic components on the die mating surfaces of both molds. Can be clamped.

  The base material with electronic parts is set inside the mold of the resin sealing device of the present invention as described above, and both molds are brought close to each other by the mold driving unit, and then the heat melted in the cavity recess A resin-sealed package in which an electronic component is sealed with a resin can be manufactured by filling and curing the curable resin, separating the two molds with a mold driving unit, and performing die cutting.

  Moreover, it can be arranged between the first mold and the second mold, and can be brought close to the mold-matching surface of the first mold via the second mold pushed by the mold driving unit. The detection loader body can bring the detection loader body closer to the first mold. That is, for example, the detection loader main body is arranged between the first mold and the second mold that are opened, and the detection loader main body can be brought closer to the mold-matching surface of the first mold. Yes.

  Moreover, it can be arranged between the first mold and the second mold, and can be brought close to the mold-matching surface of the first mold via the second mold pushed by the mold driving unit. The load when the exposure pin is pushed in is detected by the loader that has a load sensor unit that is provided on the detection loader body and has a load sensor unit that contacts the tip of the exposure pin and measures the load when pushing the exposure pin. It becomes possible to measure. That is, the force with which the tip of the exposed pin presses the surface of the electronic component of the substrate with the electronic component can be measured. The measurement by the load sensor unit is to measure the load when the load sensor unit pushes the exposed pin up to the push-in position of the exposed pin set assuming that the surface of a predetermined electronic component is sealed with resin. ing. As a result, it is possible to measure a load that takes into account the sliding resistance generated between the exposed pin and the inner peripheral surface of the first through hole, which changes with the use of the first mold.

  In addition, when a signal that informs you that the load is abnormal when the load measured by the load sensor part is out of the set range, it is easy to check the abnormality of the load when pushing the exposure pin, It becomes possible to quickly stop the operation of the resin sealing device. The range of the load set here is, for example, the minimum load value for preventing the resin from wrapping around the exposed part of the electronic component surface, and the electronic component surface is not damaged. The range of the load value that can withstand the upper limit value.

  In addition, when the detection sensor unit detects a protrusion of the tip of the detected pin from the second through hole and issues a signal notifying the detection, the exposed pin is sealed with resin due to a sliding failure. It becomes easy to confirm an abnormality in the state where the position does not return to the standby position, and the operation of the resin sealing device can be stopped quickly.

  In order to achieve the above object, the abnormality detection method of the resin sealing device of the present invention is urged by an elastic body on the surface of the electronic component with the electronic component disposed in the cavity portion of the mold, A method for detecting an abnormality of a resin sealing device that performs masking by bringing the tip of an exposed pin sliding along the inner peripheral surface of the mold into contact, and presses one end of the exposed pin provided on the mold And a load measuring step for measuring a load when the exposed pin is pushed in, and a detecting step for detecting a position of one end of the exposed pin after the one end of the exposed pin provided in the mold is pressed. .

  Here, the load at the time of pushing in the exposure pin can be measured by the load measuring step of measuring the load at the time of pushing in the exposure pin by pressing one end of the exposure pin provided in the mold. That is, the force with which the tip of the exposed pin presses the surface of the electronic component of the substrate with the electronic component can be measured. As a result, it is possible to measure a load that takes into account the sliding resistance generated between the exposed pin and the inner peripheral surface of the mold, which varies with the use of the mold.

  In addition, the position of the exposed pin can be confirmed by a detection step of detecting the position of one end of the exposed pin after the one end of the exposed pin provided in the mold is pressed. For example, it is possible to detect a state where the sliding resistance applied to the exposed pin is increased, and the exposed pin remains in the position at the time of resin sealing and cannot return to the standby position.

  In addition, when the detection process is performed after taking out the molded product after resin sealing from the mold or after the load measurement process, the exposed pin pushed in at the time of resin sealing or load measurement by the load sensor It becomes possible to confirm whether or not to return to the standby position. Further, by performing detection at each timing, it becomes easier to detect a sliding failure of the exposed pin.

  In order to achieve the above object, the resin sealing device of the present invention includes a main body in which a hollow portion is formed, a mold matching surface provided on the main body, and a thermosetting provided on the mold matching surface side. A cavity recess filled with a conductive resin, a first through hole formed continuously to the cavity recess and the hollow portion of the main body, and the first through hole of the main body connected to the hollow portion of the main body. A second through-hole formed on the opposite side; a pin flange disposed in a hollow portion of the main body and biased by an elastic body toward the first through-hole; and the first of the pin flange A first gold having an exposed pin that is provided on the through hole side of the first through hole and is configured to slide along the inner peripheral surface of the first through hole and move forward and backward. A mold and a mold-matching surface for holding the substrate with the electronic component in cooperation with the mold-matching surface of the first mold; A second mold, a mold drive unit capable of bringing the first mold and the second mold close to each other, and capable of performing mold clamping by bringing them close to each other; and the first mold Loader body that can be disposed between the first mold and the second mold, and can be brought close to the mold mating surface of the first mold via the second mold pushed by the mold drive unit And a load measuring loader provided on the detection loader main body, having a load sensor unit that contacts a tip of the exposed pin and measures a load when the exposed pin is pushed.

  Here, a first through-hole formed continuously to the cavity recess and the hollow portion of the main body, an exposed pin provided by inserting the first through-hole into the first through-hole side of the pin flange, and the main body The exposed pin integrated with the pin flange is inserted into the first through hole by the pin flange that is disposed in the hollow portion and is urged by the elastic body toward the first through hole. Further, the biasing force of the elastic body can be applied to the exposed pin through the pin flange, and the tip of the exposed pin can be biased in the direction protruding from the cavity recess. As a result, the tip of the exposure pin can be brought into contact with the surface of the electronic component of the substrate with the electronic component disposed in the cavity recess to be exposed to the outside.

  Also, an exposed pin configured to slide along the inner peripheral surface of the first through hole and move forward and backward, and a pin disposed in the hollow portion of the main body and biased by an elastic body on the first through hole side An appropriate load is applied to the member in contact with the tip of the exposed pin by the collar portion. That is, this load becomes a force that the tip of the exposed pin presses the surface of the electronic component of the substrate with the electronic component. The load referred to here is mainly the urging force of the elastic body and the sliding resistance force generated between the exposed pin and the inner peripheral surface of the first through hole, which changes as the first mold is used. Means something consisting of

  Moreover, it can be arranged between the first mold and the second mold, and can be brought close to the mold-matching surface of the first mold via the second mold pushed by the mold driving unit. The load when the exposure pin is pushed in is detected by the loader that has a load sensor unit that is provided on the detection loader body and has a load sensor unit that contacts the tip of the exposure pin and measures the load when pushing the exposure pin. It becomes possible to measure. That is, the force with which the tip of the exposed pin presses the surface of the electronic component of the substrate with the electronic component can be measured. As a result, it is possible to measure a load that takes into consideration the sliding resistance force generated between the exposed pin and the inner peripheral surface of the first through hole, which changes with the use of the first mold.

  The resin sealing device and the abnormality detection method for the resin sealing device according to the present invention can appropriately detect the presence or absence of a sliding failure of an exposed pin in a resin sealed package in which an exposed portion is formed on the surface of an electronic component. It has become.

It is a schematic sectional drawing which shows the structure of the metal mold | die of the resin sealing apparatus to which this invention is applied. It is principal part sectional explanatory drawing which shows the periphery structure of the spring pin of a metal mold | die. It is the schematic which shows the structure of the loader for load measurement. It is the schematic which shows the state which the loader for load measurement pushes up a spring pin. It is the schematic which shows a motion when the loader for load measurement is inserted between metal mold | dies. It is the schematic which shows the apparatus structure and arrangement | positioning of the resin sealing apparatus to which this invention is applied. It is the schematic which shows the movement of each apparatus around a press apparatus. It is the schematic which shows the state at the time of resin sealing. It is the schematic which shows the detection by the light-shielding sensor after the resin sealing process. It is the schematic which shows a non-detection state by the detection by the light-shielding sensor after the measurement of a load. It is the schematic which shows a detection state by the detection by the light-shielding sensor after the measurement of a load.

  Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings.

  As shown in FIG. 1, a resin sealing mold 1, which is an example of a mold that constitutes a resin sealing device according to the present invention, includes a first mold 2 and a second mold 3. ing. The first mold 2 and the second mold 3 are clamped in a state where the second mold 3 is driven by a mold driving device (not shown) and the mold matching surface 4 and the mold matching surface 5 are aligned. And manufacturing a resin-sealed package.

  The first mold 2 includes an upper die set 6 and an upper die chess 7. The upper die set 6 is a member that supports the upper die chess 7 via the support pillar 8. The upper die chess 7 has a holder base 9 supported by a support pillar 8 and a cavity bar 10 including a die matching surface 4.

  The cavity bar 10 has a cavity 11 into which resin is injected into the mold matching surface 4. The cavity 11 is a part that manufactures a molded product in cooperation with the die matching surface 5 of the lower chess.

  The cavity bar 10 has a resin passage 12 for supplying resin to the cavity 11. The resin passage 12 is a portion serving as a path through which resin is supplied from the pot 28 of the second mold 3 and resin is supplied to the cavity 11.

  The upper chess 7 is provided with a spring pin 13. More specifically, the spring pin 13 is disposed in a space and a through hole provided in the holder base 9 and a through hole provided in the cavity bar 10.

  The spring pin 13 is a member whose tip is in contact with the surface of the sensor element of the substrate with the sensor element, which is a base material with an electronic component, and forms an exposed portion that is not sealed with resin. The detailed structure of the spring pin 13 will be described with reference to a separate drawing.

  A light shielding sensor 14 is installed on the upper end surface of the holder base 9. The light shielding sensor 14 detects the tip of the detected pin 15 constituting the spring pin 13. The position of the tip of the detected pin 15 is changed by the forward / backward movement of the spring pin 13. The position where the light-shielding sensor 14 detects can be appropriately set according to the type and size of the sensor-equipped substrate.

  Here, the first mold 2 is not necessarily required to have the cavity 11 and the spring pin 13. For example, the first mold 2 has a structure in which the resin mold part of the molded product is provided in the second mold 3 and the spring pin. There may be.

  In addition, it is not always necessary that the second mold 3 is driven to clamp the mold, and a configuration in which the first mold 2 is driven can also be adopted.

  Further, the sensor for detecting the tip of the detected pin 15 is not limited to the light shielding sensor 14, and any sensor that can detect the position of the tip of the detected pin 15 is sufficient. However, since the position of the tip of the detected pin 15 can be detected with high accuracy and has a simple structure, it is desirable that the light shielding sensor 14 is employed as a sensor for detecting the tip of the detected pin 15.

  As shown in FIG. 1, the first mold 2 has an ejector pin 16. The ejector pin 16 is a member for releasing the molded resin-sealed package from the cavity 11.

  The ejector pin 16 is moved to the cavity 11 side by using the opening / closing operation of the second mold 3 by a mold opening / closing device (not shown), and its tip abuts on the resin-sealed package to release the molded product. Let A part of the ejector pin 16 is configured to be able to pass through a through hole provided in the holder base 9 and the cavity bar 10.

  The base end (upper side in FIG. 1) of the ejector pin 16 is fixed to the pin plate 17, and the ejector pin 16 and the pin plate 17 are integrated and moved forward and backward. The pin plate 17 is urged away from the holder base 9 by a pressing device 19 provided on the ejector plate 18.

  As shown in FIG. 1, the second mold 3 includes a lower die set 20 and a lower die chess 21. The lower die set 20 is a member that supports the lower die chess 21 via the support pillar 22. The lower mold chess 21 has a holder base 23 supported by the support pillar 22 and a cavity bar 24 including the mold matching surface 5.

  The mold matching surface 5 of the cavity bar 24 is in contact with the mold matching surface 4 of the upper mold chess 7, and resin is injected into the cavity 11 to manufacture a molded product.

  Here, in the resin sealing mold 1, the cavity 11 is formed only in the upper mold chess 7 and the cavity is not formed in the lower mold chess 21, but the location of the cavity is not limited to this. Absent. For example, the structure which provides a cavity further in the area | region facing the cavity 11 of the lower mold | type chess 21 by the structure of a molded article may be sufficient.

  Similar to the first mold 2, the second mold 3 has ejector pins 25. The ejector pin 25 is a member for releasing the molded resin-sealed package from the cavity 24.

  The ejector pin 25 is moved to the cavity bar 24 side using the opening / closing operation of the second mold 3 by a mold opening / closing device (not shown) to release the molded product. A part of the ejector pin 25 is configured to be able to be inserted through a through hole provided in the holder base 23 and the cavity bar 24.

  The base end (lower side in FIG. 1) of the ejector pin 25 is fixed to the pin plate 26, and the ejector pin 25 and the pin plate 26 are integrated and moved forward and backward. The pin plate 26 is biased in a direction away from the holder base 23 by a pressing device 67 provided on the ejector plate 27.

  The lower chess 21 is formed with a pot 28 for accommodating a resin tablet made of, for example, an epoxy-based thermosetting resin.

  The pot 28 is a part for melting the thermosetting resin, and the thermosetting resin melted inside the pot 28 is pushed out by the plunger 29 to the resin passage 12 side of the upper chess 7 in the clamped state. It has become.

  The peripheral structure of the spring pin 13 of the resin sealing mold 1 will be described with reference to FIG. FIG. 2 shows a state after the inloader transports the molding material to the resin sealing mold 1 before mold clamping. The second mold 3 is provided with a substrate 38 with a sensor element to be molded on the mold mating surface 5. A solid resin tablet 39 before melting is placed inside the pot 28.

  The spring pin 13 includes an exposed pin 30, a flange 31, and a detected pin 15, and has a structure in which each member is integrated.

  The collar portion 30 is disposed in a hollow portion 32 that is a hollow portion provided in the holder base 9. Further, the collar portion 30 is attached to a spring 33 whose one end is fixed to the holder base 9 and is biased toward the cavity 11 side (the lower side in FIG. 2).

  The exposed pin 30 is formed integrally with the flange portion 31 and has a structure inserted through the pin hole 34 of the cavity bar 10. The tip 35 of the exposure pin 30 is a part that abuts on the surface of the sensor element of the substrate 38 with the sensor element. Further, the tip 35 of the exposure pin 30 also comes into contact with a load sensor described later.

  When the mold driving device pushes up the second mold 3, the tip 35 of the exposed pin 30 comes into contact with the surface of the sensor element, and the spring pin 13 is pushed up against the urging force of the spring 33. Then, the spring pin 13 (exposed pin 30) is pushed to a position set according to the type of the molded product, and the tip 35 applies a predetermined pressure to the sensor element surface at the same position, thereby realizing masking. The position where the spring pin 13 is pushed up and stopped is hereinafter referred to as “position during resin sealing” for convenience.

  Further, the exposed pin 30 is urged by the spring 33 through the flange 31 and protrudes toward the outside of the cavity 11. That is, when the tip 35 of the exposure pin 30 is not pushed up, the exposure pin 30 is stationary at the protruding position on the outside of the cavity 11. This protruding position is hereinafter referred to as a “standby position” for convenience. FIGS. 1 to 3, 9, and 10 schematically show the structure of the exposure pin 30. In the actual apparatus, the tip 35 protrudes outward from the cavity 11 in the standby position. It has become.

  As described above, the exposure pin 30 moves forward and backward when the tip 35 is pushed up or the pushed-up state is released. Further, the exposed pin 30 moves forward and backward while sliding along the inner peripheral surface of the pin hole 34.

  When the exposed pin 30 is pushed up to the position at the time of resin sealing, a load is generated to push it back. This load is mainly composed of a biasing force of the spring 33 and a sliding resistance force generated between the exposed pin 30 and the inner peripheral surface of the pin hole 34.

  The load when the exposed pin 30 is pushed up to the position at the time of resin sealing corresponds to a force pushing the surface of the sensor element. Therefore, the value of this load is required to be a force in an appropriate range in order to produce a good molded product.

  More specifically, there is a range in which the minimum load that does not cause the resin to wrap around the exposed portion of the sensor element surface is the lower limit value, and the load that can be endured without damaging the sensor element surface is the upper limit value. Conceivable. The range between the lower limit value and the upper limit value can be appropriately set depending on the type of the molded product. Further, a value set including a permissible range in the theoretical value of the load resistance of the sensor element may be adopted.

  As shown in FIG. 2, the detected pin 15 is fixed to the flange portion 30 and has a structure in which the pin hole 36 of the holder base 9 can be inserted. The detected pin 15 is a portion that is detected at the detection position of the light-shielding sensor 14 as the position of the tip 37 thereof changes as the spring pin 13 advances and retracts.

  By detecting the position of the tip 37 of the detected pin 15, the resin sealing device can detect the position of the tip 35 of the exposure pin 30 configured integrally.

  At the position where the spring pin 13 is sealed with resin, the tip 37 of the pin 15 to be detected is a position detected by the light shielding sensor 14, but when the state where the tip 35 of the exposed pin 30 is pushed up is released, the spring 37 is released. The spring pin 13 returns to the standby position by the urging force of 33, and the tip 37 of the detected pin 15 returns to a position where it is not detected by the light shielding sensor 14.

  On the other hand, when the sliding resistance increases due to the resin entering between the pin hole 34 and the exposed pin 30, the spring pin 13 is pushed up without returning from the position at the time of resin sealing to the standby position. May stop at. In this case, the tip 37 of the detected pin 15 remains detected by the light shielding sensor 14. That is, the resin sealing device can detect the state of the sliding failure of the exposed pin 30.

  In addition, the resin sealing device transmits the detection state of the light shielding sensor 14 via a signal and outputs the information as character information to the lighting of the lamp or the display plate, for example, so that the operator can easily check the detection state. Will be able to.

  A load measuring loader 40 for measuring the load on the spring pin 13 will be described with reference to FIG. The load measuring loader 40 enters between the first mold 2 and the second mold 3 in a state where the mold is opened after molding the resin-sealed package, pushes up the exposed pin 30, and measures the load. It is a member.

  The load measurement loader 40 includes a base portion 41 and a load detection pin holder 42. The base portion 41 is a portion that comes into contact with the mold matching surface 5 of the second mold 3, and includes a base plate 43 and a guide portion 44.

  The load detection pin holder 42 is a portion that is pushed up by the second mold 3 that is driven by a mold driving device (not shown). The load detection pin holder 42 is lifted through the guide portion 44 and close to the cavity 11 of the first mold 2. I will do it. The load detection pin holder 42 includes a load detection pin 45 and a detection signal cable 46 as load sensors.

  As shown in FIG. 4, the load detection pin 45 measures the load when the tip 47 abuts on the tip 35 of the exposed pin 30 and pushes up the exposed pin 30. As the load detection pin 45, a known pressure sensor can be used.

  The load detection pin 45 pushes up the exposed pin 30 to the position at the time of resin sealing, and measures the load generated at that time. The measured load corresponds to the force with which the tip 35 of the exposed pin 30 pushes the surface of the sensor element when the exposed pin 30 is pushed up to the position at the time of resin sealing by the substrate 38 with the sensor element.

  By measuring the load with the load detection pin 45, the resin sealing device is changed by continuously using the biasing force of the spring 33 and the first mold 2, and the exposed pin 30 and the pin hole. It is possible to capture a load reflecting the sliding resistance force between them.

  As described above, the value of the force (load) by which the exposure pin 30 presses the surface of the sensor element is required to be a force in an appropriate range. Therefore, the resin sealing device can measure the load of the exposed pin 30 with the load detection pin 45, and can be regarded as abnormal when the measured value is out of the appropriate range. The abnormality of the measured value is mainly caused by a change in the sliding resistance force between the exposed pin 30 and the pin hole 34.

  More specifically, when the measured load is less than the lower limit of the appropriate range, the tip 35 of the exposed pin 30 is in contact with the surface of the sensor element, but the load for masking is insufficient. Or, it reflects the state where the exposed pin does not reach the sensor element surface.

  Further, when the measured load exceeds the upper limit value of the appropriate range, the state where the tip 35 of the exposed pin 30 exerts an excessive pressure on the sensor element surface is reflected.

  Thus, if the measured load is out of the proper range, both the upper and lower limits are indices indicating a state that leads to the manufacture of a molded resin-sealed package. Therefore, by measuring the load of the exposed pin 30 with the load detection pin 45, for example, the operator can confirm whether or not there is a sliding failure in the resin sealing device before molding.

  In addition, the resin sealing device, when the load measured with the load detection pin 45 is out of the proper range, outputs the character information to the lamp lighting or display plate, or stops the automatic operation, For example, the operator can easily confirm that the load of the exposure pin 30 is in an abnormal state.

  FIG. 5 shows the movement when the load measuring loader 40 is inserted between the first mold 2 and the second mold 3. FIG. 5 shows a fixed platen 48 to which the first mold 2 is fixed, a movable platen 49 to which the second mold 3 is fixed, and a tie bar 50.

  The tie bar 50 is fitted with a movable platen 49 that can be moved up and down. The movable platen 49 can be moved up and down with a required stroke by a lift drive unit (not shown) that drives the toggle link with a servo motor via a ball screw.

  When measuring the load with the load measuring loader 40, the load loader body 51 holding the load measuring loader 40 moves to the side of the resin sealing mold 1. The load loader body 51 is driven by a servo motor, and its movement position is controlled.

  As shown in the lower diagram of FIG. 5, when the load loader main body 51 reaches a predetermined position, the load loader main body 51 slides the load measuring loader 40 and remains in the cantilever state with the first mold 2. The load measuring loader 40 is inserted between the second molds 3. Thereafter, as described above, the second mold 3 raised by the movable platen 49 comes into contact with the load measuring loader 40, and the resin sealing device measures the load.

  Next, the outline of the apparatus configuration and arrangement of the resin sealing apparatus to which the present invention is applied will be described with reference to FIG.

  A resin sealing device 52 shown in FIG. 6 includes a material supply unit 53, a press device 54 having a resin sealing mold 1, an inloader 55, a preheater 56, an unloader 57, and a load measurement loader. A load loader main body 51 holding 40 and a storage portion 58 are included. A plurality of press devices 54 are arranged in the resin sealing device 52.

  The material supply unit 53 has a base plate 59 on which a slit magazine (not shown) is placed, and sends the slit magazine onto the turntable 60. The slit magazine is a plate-like member in which a plurality of slits are formed, and a plurality of substrates with sensor elements or lead frames 68 are arranged in the slit portion.

  Moreover, the material supply part 53 has the tablet loader 61 which has arrange | positioned the resin tablet 39 and was comprised so that raising / lowering was possible.

  The inloader 55 is a device that grips and conveys the molding material to the press device 54 and the preheater 56. The inloader 55 moves to the position of the turntable 60 and the tablet loader 61 to grip and convey the lead frame 68 and the resin tablet 39. The inloader 55 is driven by a servo motor, and its movement position is controlled.

  The pre-heater 56 is a device for preheating the lead frame 68 before resin sealing to suppress problems such as bending of the lead frame 68 during molding.

  The unloader 57 is a device that takes out the resin-sealed package after being released from the mold and conveys it to the storage unit 58. The unloader 57 is driven by a servo motor, and its movement position is controlled.

  The storage unit 58 includes a delegate unit 62 that removes unnecessary resin such as calves and runners attached to a molded product immediately after mold release, and a storage box 63 that stores the molded product from which unnecessary resin is removed. Thus, the resin sealing device 52 is configured to manufacture a resin sealing package from a molding material by a plurality of devices.

  FIG. 7 shows the moving direction of the press device 54 and the inloader 55, the load loader main body 51, and the unloader 57 around the press device 54. The inloader 55, the load loader main body 51, and the unloader 57 move in the left and right direction (reference numerals X1, X2, and X3) in FIG. 7 and the vertical direction (reference numerals Y1, Y2, and Y3) that enters the press device 54. It is configured to be possible.

  Further, each device that has entered the press device 54 stops at a position corresponding to the resin sealing mold 1. For the load loader main body 51, as described with reference to FIG. 5, the load detection loader 40 is slid and the load is detected between the first mold 2 and the second mold 3 while being cantilevered. The loader 40 is inserted.

  Hereinafter, the manufacture of a resin-sealed package using the above-described resin-sealing mold 1 and the flow of an abnormality detection method in the resin sealing device 52 will be described.

[Resin sealing process]
As shown in FIG. 8, at the time of resin sealing, the mold fitting surfaces of the first mold 2 and the second mold 3 are brought into contact with each other to clamp the mold, and the cavity 11 of the first mold 2 and the resin passage 12. The pot 28 of the second mold 3 is closed.

  The tip 35 of the exposure pin 30 abuts on the sensor element 64 of the substrate 38 with the sensor element, and the spring pin 13 is pushed upward. And it becomes the position at the time of resin sealing in the position where mold clamping was completed.

  In a state where the mold is clamped as described above, the plunger 29 is operated while the resin tablet heated in the pot 28 is melted, and the molten thermosetting resin 65 in the pot 28 is pushed out.

  The molten thermosetting resin 65 is sent to the cavity 11 through the resin passage 12 and filled. Then, by holding and curing the melted thermosetting resin 65, the sensor element 64 is partially sealed to form the resin molding portion 66 shown in FIG.

[Detection by shading sensor after resin sealing process]
After the mold is opened and the molded product 67 is taken out, the position of the tip 37 of the detected pin 15 is detected by the light shielding sensor 14. As shown in FIG. 9, when the spring pin 13 returns to the standby position, the tip 37 of the detected pin 15 is not detected by the light shielding sensor 14. That is, it can be confirmed that there is no sliding failure due to the sliding resistance between the exposed pin 30 and the pin hole 34.

  On the other hand, although not shown, when the mold is opened, the spring pin 13 remains pushed up to the position at the time of resin sealing and does not return to the standby position. Is detected. That is, for example, the operator can confirm that a sliding failure has occurred due to the sliding resistance between the exposed pin 30 and the pin hole 34. After confirming the detection of the light shielding sensor 14, for example, the operator stops the resin sealing device 52 and performs the maintenance and inspection work of the first mold 2.

[Measurement of load by load measurement loader]
Following the detection by the light shielding sensor 14, the load on the exposed pin 30 is measured by the load measuring loader 40. As described above, the load is measured by bringing the tip 47 of the load detection pin 45 into contact with the tip 35 of the exposed pin 30 and pushing up the exposed pin 30 (see FIGS. 3 and 4).

  If the measured load is a numerical value included in an appropriate range set in advance, it can be determined that the exposed pin 30 can be masked while applying an appropriate pressure to the surface of the sensor element 64.

  On the other hand, if the measured load is less than the lower limit value of the appropriate range set in advance or exceeds the upper limit value, there is a risk of producing a poorly molded resin-sealed package. The stopping device 52 is stopped, and the maintenance inspection work of the first mold 2 is performed.

  In the measurement of the load by the load measuring loader 40, the load can be determined numerically, so that it is possible to more strictly evaluate the presence or absence of a sliding failure. For example, after the spring pin 13 is pushed up, the resin sealing device 52 can detect a state in which the force for pressing the surface of the sensor element is not sufficiently returned from the position at the time of resin sealing to the standby position. It becomes. In such a state, it is assumed that the tip 37 of the detected pin 15 cannot be detected by the light-shielding sensor 14, so that it can be said that the detection is more precise.

[Detection by shading sensor after load measurement]
After the load is measured by the load measuring loader 40, the position of the tip 37 of the detected pin 15 is detected again by the light shielding sensor 14. As shown in FIG. 10, when the spring pin 13 returns to the standby position, the tip 37 of the detected pin 15 is not detected by the light shielding sensor 14. That is, for example, the operator can confirm that no sliding failure has occurred due to the sliding resistance between the exposed pin 30 and the pin hole 34.

  On the other hand, as shown in FIG. 11, after the load is measured by the load measuring loader 40, the spring pin 13 remains pushed up to the position at the time of resin sealing and does not return to the standby position. The tip 37 of the detection pin 15 is detected by the light shielding sensor 14. That is, for example, the operator can confirm that a sliding failure has occurred due to the sliding resistance between the exposed pin 30 and the pin hole 34. As described above, the resin sealing device 52 performs detection by the light shielding sensor 14 after resin sealing and after the load measurement by the load measuring loader, so that, for example, the operator can further sufficiently prevent the sliding failure. The presence or absence can be confirmed.

As described above, the resin sealing device according to the present invention can appropriately detect the presence or absence of a sliding failure of an exposed pin in a resin sealed package in which an exposed portion is formed on the surface of an electronic component.
Moreover, the abnormality detection method of the resin sealing device according to the present invention can appropriately detect the presence or absence of sliding failure of the exposed pin in the resin sealed package in which the exposed portion is formed on the surface of the electronic component. .

DESCRIPTION OF SYMBOLS 1 Resin sealing metal mold | die 2 1st metal mold | die 2nd metal mold | die 4 Mold matching surface 5 Mold mating surface 6 Upper die set 7 Upper die chess 8 Support pillar 9 Holder base 10 Cavity bar 11 Cavity 12 Resin passage 13 Spring pin 14 Light-shielding sensor 15 Detected pin 16 Ejector pin 17 Pin plate 18 Ejector plate 19 Press device 20 Lower die set 21 Lower die chess 22 Support pillar 23 Holder base 24 Cavity bar 25 Ejector pin 26 Pin plate 27 Ejector plate 28 Pot 29 Plunger 30 Exposed pin 31 Gutter 32 Hollow part 33 Spring 34 Pin hole 35 Tip of exposed pin 36 Pin hole 37 Tip of detected pin 38 Substrate with sensor element 39 Resin tablet 40 Load measurement Fixed loader 41 Base portion 42 Load detection pin holder 43 Base plate 44 Guide portion 45 Load detection pin 46 Detection signal cable 47 Tip of load detection pin 48 Fixed platen 49 Movable platen 50 Tie bar 51 Load loader body 52 Resin sealing device 53 Material Supply unit 54 Press device 55 Inloader 56 Pre-heater 57 Unloader 58 Storage unit 59 Base plate 60 Turntable 61 Tablet loader 62 Digate unit 63 Storage box 64 Sensor element 65 Thermosetting resin 66 Resin molding unit 67 Press device 68 Lead frame

Claims (6)

A main body in which a hollow portion is formed, a mold matching surface provided on the main body, a cavity concave portion provided on the mold matching surface side and filled with a thermosetting resin, the cavity concave portion, and a hollow portion of the main body. A first through hole formed continuously, a second through hole formed on the opposite side of the first through hole of the main body and connected to the hollow portion of the main body, and a hollow portion of the main body A pin flange portion disposed and urged by an elastic body on the first through hole side; and the first through hole side of the pin flange portion being provided through the first through hole side; and An exposed pin configured to slide forward and backward along the inner peripheral surface of the first through hole, and the second through hole on the opposite side of the pin flange portion from the side where the exposed pin is provided. Is provided so that it can be inserted, and the tip thereof is configured to be able to protrude outside the second through hole. A detection pin, provided on the opposite side of the die mating surface side of the main body, a first mold having a detecting sensor unit for detecting the protrusion of the of the detected pin tip from the second through hole,
A second mold having a mold matching surface for holding the electronic component-attached substrate in cooperation with the mold matching surface of the first mold;
A mold driving unit capable of bringing the first mold and the second mold close to each other, and capable of performing mold clamping by bringing them close to each other;
It can be arranged between the first mold and the second mold, and is brought close to the mold mating surface of the first mold through the second mold pressed by the mold driving unit. And a load measuring loader having a load sensor portion that is provided on the detection loader body and that abuts against the tip of the exposure pin and measures a load when the exposure pin is pressed. Resin sealing device. The resin sealing device according to claim 1, wherein when the load measured by the load sensor part is out of a set range, a signal notifying that the load is abnormal is issued. 3. The resin sealing device according to claim 1, wherein when the detection sensor unit detects the protrusion of the tip of the detected pin from the second through-hole, a signal informing the detection is issued. . The tip of an exposed pin that is urged by an elastic body and slides along the inner peripheral surface of the mold is brought into contact with the surface of the electronic component of the substrate with the electronic component disposed in the cavity portion of the mold. An abnormality detection method for a resin sealing device that performs masking,
A load measuring step for measuring the load when pressing the one end of the exposed pin provided in the mold and pushing the exposed pin;
And a detection step of detecting a position of one end of the exposed pin after the one end of the exposed pin provided on the mold is pressed. The abnormality detection method for a resin sealing device according to claim 4, wherein the detection step is performed after a molded product after resin sealing is taken out from the mold or after the load measurement step. A main body in which a hollow portion is formed, a mold matching surface provided on the main body, a cavity concave portion provided on the mold matching surface side and filled with a thermosetting resin, the cavity concave portion, and a hollow portion of the main body. A first through hole formed continuously, a second through hole formed on the opposite side of the first through hole of the main body and connected to the hollow portion of the main body, and a hollow portion of the main body A pin flange portion disposed and urged by an elastic body on the first through hole side; and the first through hole side of the pin flange portion being provided through the first through hole side; and A first mold having an exposed pin configured to be slidable along the inner peripheral surface of the first through hole so as to advance and retract;
A second mold having a mold matching surface for holding the electronic component-attached substrate in cooperation with the mold matching surface of the first mold;
A mold driving unit capable of bringing the first mold and the second mold close to each other, and capable of performing mold clamping by bringing them close to each other;
It can be arranged between the first mold and the second mold, and is brought close to the mold mating surface of the first mold through the second mold pressed by the mold driving unit. And a load measuring loader having a load sensor portion that is provided on the detection loader body and that abuts against the tip of the exposure pin and measures a load when the exposure pin is pressed. Resin sealing device.

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