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TW201222034A - An optical waveguide structure and an electronic device - Google Patents

An optical waveguide structure and an electronic device Download PDF

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Publication number
TW201222034A
TW201222034A TW100110677A TW100110677A TW201222034A TW 201222034 A TW201222034 A TW 201222034A TW 100110677 A TW100110677 A TW 100110677A TW 100110677 A TW100110677 A TW 100110677A TW 201222034 A TW201222034 A TW 201222034A
Authority
TW
Taiwan
Prior art keywords
optical waveguide
light
core
waveguide structure
core portion
Prior art date
Application number
TW100110677A
Other languages
Chinese (zh)
Inventor
Tetsuya Mori
Makoto Fujiwara
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2010088097A external-priority patent/JP2011221143A/en
Priority claimed from JP2010089047A external-priority patent/JP2011221195A/en
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of TW201222034A publication Critical patent/TW201222034A/en

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122Basic optical elements, e.g. light-guiding paths
    • G02B6/1221Basic optical elements, e.g. light-guiding paths made from organic materials
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122Basic optical elements, e.g. light-guiding paths
    • G02B6/1228Tapered waveguides, e.g. integrated spot-size transformers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13Integrated optical circuits characterised by the manufacturing method
    • G02B6/138Integrated optical circuits characterised by the manufacturing method by using polymerisation

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

The present invention provides an optical waveguide structure equipped with an optical waveguide and an electronic device equipped with the optical waveguide structure. The freedom degree of the pattern shape design of the optical waveguide is broad, and the high size accuracy of the core part (optical path) of the optical waveguide can be formed by the simple method. In addition, the optical waveguide have the flexibility and a long life. An example of the present invention is described below. The optical waveguide structure 1 is equipped with an optical waveguide 9 formed by laminating a core layer 93 and clad layers 91 and 92, a wiring substrate containing a flexible substrate 2 and conductor layer, and a light-emitting element 3 and a light-receiving element 4 arranged at the both ends of the optical waveguide 9. The core layer 93 has a core part constituting an optical path for the transmitted light and a clad part in its layer. The core part is formed by selectively irradiating an active radical ray to the core layer constituted with a composition comprising (A) cyclic olefin resin, (B) at least one of a monomer containing cyclic ether group and an oligomer containing cyclic ether group which have a different refraction index from (A), and a photo-acid-generating agent.

Description

201222034 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種光波導結構體及電子裝置。 本案係基於2010年4月6日於日本提出申請之日本特 願2010— 088097號、及2010年4月7日於日本提出申請 之曰本特願2010 — 089047號並主張優先權,其内容被援用 於此。 【先前技術】 近年來’作為光通信領域之光零件,而開發有光分支 結合器(光耦合器)、光多工/解多工器等,並期待用於該等 之光波導型元件》作為該光波導型元件(以 波導」),除了先前之石英系光波導以外,亦有容 案化)且富於通用性之聚合物系光波導,最近正積極地進 行後者之開發。 上述光波導通常於基板上由特定之配置(圖案)形成 而以光波導結構體之形式進行處I作為該光波導結相 體’揭示有於基板上形成特定之電氣配線電路、及由核< 部及包覆料職之光料,“於該光波導上安裝發另 兀件及受光元件者(例如參照專利文獻小 然而,上述專利文獻1所0 # TP,B5 1 光波導結構體存在女 下問題。 .汜波導之形成步 愒成傅輸光之光程 的圖案形狀之設計、選擇之自由度較窄 2.核心部之圖案形狀之精声 货度或尺寸精度較差 201222034 3 ·光彳s说之傳輪效率較低。 4.與電氣配線圖案組合之情形時’該配線圖案之設計之 自由度較窄。 [專利文獻1]日本特開2004 — 146602號公報 【發明内容] 本發明之目的在於提供一種具備可以簡單之方法形成 圖案形狀之設計之自由度較廣,尺寸精度較高之核心部(光 程),且可撓性及而十久性優異t光波導的光波導結構體及具 備該光波導結構體之電子裝置。 又,本發明之目的在於提供一種具備可以簡單之方法 形成圖案形狀之設計之自由度較廣,尺寸精度較高之核心 部(光程)’並且與發光元件或受光元件之光結合效率及耐 久性優異之光波導的光波導結構體及電子裝置。 上述目的係藉由下述(1)〜(75)之本發明而達成。 (1) 一種光波導結構體,其特徵在於具有: 具備具可撓性之可撓性基板、與設置於其至少一面真 形成有電氣配線之導體層的配線基板、及 設置於上述配線基板之一面側且具備折射率彼此不同 之核心部與包覆部的光波導,並且 上述核心部係藉由對由含有以下成分之組成物構成的 核心層選擇性地照射活性放射線而形成為所欲之形狀者: (A) 環婦(CyCnc 〇iefin)樹脂、 (B) 折射率與上述(a) $同,且具有環狀醚基之單 體及具有環狀醚基之寡聚物中之至少一者、及 201222034 (c)光酸產生劑。 (2 )如上述(1 )之光波導結構體,其中,上述(B ) 之晨狀峻基為氧雜環丁烧基(ox etanyl group)或環氧基。 (3 )如上述(1 )或(2 )之光波導結構體,其中,上 过' (A )之J衣稀樹脂為降获稀(norb〇inene)系樹脂。 (4 )如上述(1 )至(3 )中任一項之光波導結構體, '、中’上述(B)之折射率低於上述(a), 上述環稀樹脂具有藉由由上述(C )之光酸產生劑產生 之酸而脫離,並藉由脫離而降低上述(Λ)之折射率之脫離 性基。 ,(5)如上述(2)之光波導結構體,其中,上述(A) 衣婦樹月日於側鏈具有藉由由上述(c )之光酸產生劑產生 之酸而脫離之脫離性基, 上述⑻含有下述式(100)所記載之第i單體:201222034 VI. Description of the Invention: [Technical Field] The present invention relates to an optical waveguide structure and an electronic device. This case is based on Japan's special request 2010- 088097, which was filed in Japan on April 6, 2010, and the Japanese Patent Application No. 2010-089047, which was filed in Japan on April 7, 2010, and claims priority. Used for this. [Prior Art] In recent years, as optical components in the field of optical communication, optical branch combiners (optical couplers), optical multiplexers/demultiplexers, etc. have been developed, and are expected to be used for such optical waveguide type elements. As the optical waveguide type element (by waveguide), a polymer-based optical waveguide which is versatile and has a versatility in addition to the conventional quartz-based optical waveguide, has recently been actively developed. The optical waveguide is generally formed on a substrate by a specific arrangement (pattern) and is formed in the form of an optical waveguide structure. The optical waveguide junction body is formed as a specific electrical wiring circuit formed on the substrate, and is formed by a core < For the light of the part and the coating material, "the other member and the light-receiving element are mounted on the optical waveguide (for example, refer to the patent document. However, the above-mentioned Patent Document 1 has 0 # TP, B5 1 optical waveguide structure exists. The problem of the female. The formation of the waveguide is the design of the pattern shape of the optical path of the Fu-transmission, and the degree of freedom of selection is narrow. 2. The shape of the core is poor in the quality or dimensional accuracy of the pattern. 201222034 3 · Light彳s said that the efficiency of the transmission wheel is low. 4. When the electric wiring pattern is combined, the degree of freedom in the design of the wiring pattern is narrow. [Patent Document 1] JP-A-2004-146602 (Invention) It is an object of the invention to provide a light having a wide degree of freedom in designing a pattern shape and a high dimensional accuracy (optical path), and which is flexible and has excellent optical properties. The guide structure and the electronic device including the optical waveguide structure. Further, it is an object of the present invention to provide a core portion (optical path) having a wide degree of freedom in designing a pattern shape in a simple manner and having high dimensional accuracy. The optical waveguide structure and the electronic device of the optical waveguide which are excellent in light combining efficiency and durability with the light-emitting element or the light-receiving element. The above object is achieved by the present invention (1) to (75) below. An optical waveguide structure comprising: a flexible flexible substrate; a wiring substrate provided with a conductor layer on which at least one surface of the wiring is formed; and a surface side of the wiring substrate And an optical waveguide having a core portion and a cladding portion having different refractive indices, and the core portion is formed into a desired shape by selectively irradiating active radiation to a core layer composed of a composition containing the following components. : (A) CyCnc 〇iefin resin, (B) a monomer having the same refractive index as (a) above, and having a cyclic ether group and an oligomer having a cyclic ether group (2) The optical waveguide structure according to the above (1), wherein the morning (B) is an oxetane group (ox etanyl) (3) The optical waveguide structure according to (1) or (2) above, wherein the J-thin resin of the above (A) is a norb〇inene-based resin. (4) The optical waveguide structure according to any one of (1) to (3) above, wherein the refractive index of the above (B) is lower than the above (a), and the ring-thin resin is provided by the above ( The acid generated by the photoacid generator of C) is detached, and the detachment group of the refractive index of the above (Λ) is lowered by detachment. (5) The optical waveguide structure according to the above (2), wherein (A) the virgin tree has a detachment property in the side chain which is detached by the acid generated by the photoacid generator of the above (c) The above (8) contains the ith monomer described in the following formula (100):

其中,上述(B) 丁基之氡雜環丁烷 (6)如上述(5)之光波導結才 進而含有環氧化合物及具有2個氧 化合物中至少一者作為第2單體。 (100) 201222034 (7 )如上述 述(6 )之光波導結構體,其中,上述第 上述第Here, the (B) butyl fluorene heterocyclobutane (6) further contains an epoxy compound and at least one of two oxygen compounds as the second monomer, as in the optical waveguide junction of the above (5). (10) The optical waveguide structure according to (6) above, wherein the above-mentioned

0 — S i —結構中之至少1種。 項之光波導結構體, (9)如上述(5)至(8)中任一 其中上述(A)之環烯樹脂為降莰烯系樹脂。 (1〇)如上述(9)之光波導結構體,其中,上述降莰 烯系樹脂為降莰稀之加成聚合物。 (11)如上述(10)之光波導結構體,其中,上述降莰 烯之加成聚合物具有下述式(101)所記载之重複單位:0 — S i — at least one of the structures. (9) The cycloolefin resin of the above (A) is a norbornene-based resin, according to any one of the above (5) to (8). (1) The optical waveguide structure according to the above (9), wherein the norbornene-based resin is a reduced-thinning addition polymer. (11) The optical waveguide structure according to the above (10), wherein the addition polymer of the norbornene has a repeating unit described in the following formula (101):

[式中之η為0以上、9以下之整數]。 (12)如上述(1〇)或(11)之光波導結構體,其中, 上述降莰烯之加成聚合物具有下述式(102)所記載之重複 8 201222034 單位:[where η is an integer of 0 or more and 9 or less]. (12) The optical waveguide structure according to the above (1) or (11), wherein the addition polymer of the norbornene has a repetition described in the following formula (102): 8 201222034 Unit:

(13)如上述(5)至(12)中任一項之光波導結構體, 其中,上述式(1〇〇)所記載之第1單體之含量相 …野於上述 環烯樹脂1 0 0重量份,為1重量份以上、5 0重景^、 里物以下。 (14 )如上述(1 )至(13 )中任一項之光波導結構體, 其中,於上述核心層之經活性放射線照射之區域、與未照 射區域,源自上述(B )之結構體濃度不同。 (15)如上述(1)至(14)中任一項之光波導結構體, 其中’上述核心層之經活性放射線照射之區域與未照射區 域之折射率差為0.01以上。 (16 )如上述(1 )至(15 )中任一項之光波導結構體, 其中’將上述核心層之經活性放射線照射之區域作為上述 包覆。卩之至少一部为,將未照射區域作為上述核心部之至 少一部分。 201222034 (17) 如上述(1)至(16)中任一項之光波導結構體, 其中,上述光波導形成細長之形狀, 上述光波導以於其長邊方向之1個部位或2個部位以 上局部固定於上述配線基板。 (18) 如上述(17)之光波導結構體,其中,上述光 波導之固定係藉由接著劑而進行。 (1 9 )如上述(1 )至(18 )中任一項之光波導結構體, 其中,上述光波導形成細長之形狀, 上述光波導以於其長邊方向之2個部位以上局部固定 於上述配線基板, 於上述2個部位以上之固定部位中,於相鄰之固定部 位間’上述光波導係以彎曲之方式設置。 (20) 如上述(17)至(19)中任一項之光波導結構 體’其中’上述配線基板具備貫通上述配線基板之貫通孔, 上述光波導係利用插入上述貫通孔而局部固定於上述 配線基板。 (21) 如上述(20)之光波導結構體,其中,上述貫 通孔於俯視時形成具有沿著上述光波導之長邊方向之長軸 的細長形狀。 (22 )如上述(1 )至(2 1 )中任一項之光波導結構體, 其中,於該光波導結構體中,上述配線基板之可撓性較大 之區域與上述光波導具有俯視時互相偏移之部分。 (23 )如上述(17 )至(22 )中任一項之光波導結構 體’其中,上述配線基板具有可撓性相對較大之硬質(rigid) 201222034 部、與可撓性相對較小之可撓部, 上述光波導固定於上述配線基板之部位位於上述可撓 部。 (24 )如上述(丨)至(η )中任一項之光波導結構體, 其中’上述配線基板形成細長之形狀,且於其一部分具備 設置於上述可撓性基板之一面側之硬質的硬質基板, 該光波導結構體具有上述硬質基板所處之硬質部、及 其以外之區域即可挽部。 (25 )如上述(24)之光波導結構體,其具有複數個 上述可撓部, 複數個上述可撓部中之一部分的可撓部僅由上述光波 導構成。 (26 )如上述(24 )或(25 )之光波導結構體,其中, 上述硬質部具有設置於其内部之可通過光信號之光信號通 過區域,且 以上述光k號通過區域之一端與上述光波導由光學連 接之方式構成。 (27 )如上述(26 )之光波導結構體,其中,上述光 信號通過區域係以於厚度方向貫通上述硬質部之方式構 成。 (28 )如上述(丨)至(23 )中任一項之光波導結構體, 其具有載置於上述配線基板上之具有受光部之受光元件、 及具有發光部之發光元件, 上述受光部及上述發光部、與上述光波導分別以光學 11 201222034 連接。 (29)如上述(28)之光波導結構體,其具有複數個 上述光波導, 每個上述光波導均具有上述受光元件與上述發光元 件。 (30 )如上述(28 )或(29 )之光波導結構體,其中, 上述受光元件與上述光波導之連接部、及上述發光元件與 上述光波導之連接部分別藉由樹脂模具所覆蓋。 (3 1 )如上述(28 )至(30 )中任一項之光波導結構 體,其具有: 受光電路’其具備上述受光元件、控制上述受光元件 之運作的爻光用電氣元件、及上述電氣配線中連接上述受 光元件與上述受光用電氣元件之一部分;以及 發光電路’其具備上述發光元件、控制上述發光元件 之運作之發光用電氣元件、及上述電氣配線中連接上述發 光元件與上述發光用電氣元件之一部分。 (32 )如上述(3 1 )之光波導結構體,其中,上述發 光元件、上述受光元件、上述受光用電氣元件及上述發光 用電氣元件分別藉由樹脂模具所覆蓋。 (33)如上述(31)或(32)之光波導結構體,其中, 上述文光電路設置於上述可撓性基板之一端部,上述發光 電路設置於上述可撓性基板之另一端部, 當將上述電氣配線中包含於上述受光電路與上述發光 電路中以外之至少一部分作為第1電氣配線時,該第1電 12 201222034 氣配線自上述可撓性基板之一端部配置至另一端部為止。 (34) 如上述(33)之光波導結構體,其中,上述第i 電氣配線與上述受光電路及上述發光電路電氣分離。 (35) 如上述(33)或(34)之光波導結構體,其具 有: ' 第1端子部,其具備設置於上述可撓性基板之一端部, 用以使上述受光電路與外部連接之外部連接端子及用以使 上述第1電氣配線與外部連接之外部連接端子, 第2端子部,其具備設置於上述可撓性基板之另一端 部’用以使上述發光電路與外部連接之外部連接端子及用 以使上述第1電氣配線與外部連接之外部連接端子。 (36) 如上述(35 )之光波導結構體,其中,上述電 氣配線包含連接上述發光電路及上述受光電路、與上述外 部連接端子之間的第2電氣配線。 (37) 如上述(35)或(36)之光波導結構體,其中, 上述光波導、上述受光電路、上述發光電路及上述外部連 接端子配置成直線狀。 (38 )如上述(35 )至(37)中任一項之光波導結構 體’其中上述配線基板形成細長之形狀,且 上述外部連接端子具有沿著上述配線基板之長邊方向 排列之複數個焊墊。 (39)如上述(35 )至(37)中任一項之光波導結構 體,其中’上述配線基板形成細長之形狀, 上述外部連接端子具有沿著上述配線基板之寬度方向 13 201222034 排列之複數個焊墊。 (40) 如上述⑴至(39)中任一項之光波導結構體, ,,.上錢線基板係複數片之上述可撓性基板與複數層 之上述導體層交替積層而成之多層基板。 (41) —種電子裝置,其具備上述⑴至(4G)中任 一項之光波導結構體。 (42) 一種光波導結構體,其特徵在於:具有具備折 射率彼此不同之核心部與包覆部的光波導, 上述核心部具有橫剖面積朝一端部連續變大之擴 分,且 為藉由對由包含有以下成分之組成物構成的核心層選 擇性地照射活性放射線而形成為所欲之形狀者: (A) 環烯樹脂、 (B) 折射率與上述(A)不同,且具有環狀喊基之 體及具有環狀醚基之寡聚物中之至少一者、及 (C) 光酸產生劑。 (43 )如上述(42 )之光波導結構體,其中,上述 之環狀鍵基為氧雜環丁烧基(㈣㈣gn)up)或環氧基。 (44) 如上述(42)或(43)之光波導結構體,其中 上述(A)之環烯樹脂為降莰烯系樹脂。 (45) 如上述(42)至(44)中任—項之光波導結構 體,其中上述(B)之折射率低於上述(A), 上述環烯樹脂具有藉由由上述(c )之光酸產生劑產生 之酸而脫離’並藉由脫離而降低上述(A)之折射率之脫離 14 201222034 性基。 (4〇如上述(43)之光波導結構體,其中上述(a) 之環稀樹脂於側鏈上具有藉由由上述(c)之光酸產生劑產 生之酸而脫離之脫離性基, 上述(B)含有下述式(1〇〇)所記載之第i單體:The optical waveguide structure according to any one of the above (5) to (12), wherein the content of the first monomer described in the above formula (1) is incompatible with the above-mentioned cycloolefin resin 10 0 parts by weight, 1 part by weight or more, 50 weights, and the following. The optical waveguide structure according to any one of the above (1), wherein the region of the core layer irradiated with active radiation and the unirradiated region are derived from the structure of the above (B) The concentration is different. (15) The optical waveguide structure according to any one of (1) to (14), wherein the refractive index difference between the region irradiated with the active radiation of the core layer and the non-irradiated region is 0.01 or more. (16) The optical waveguide structure according to any one of the above (1) to (15) wherein the region of the core layer irradiated with the active radiation is coated as the above. At least one of the 卩 is such that the unirradiated area is at least a part of the core portion. The optical waveguide structure according to any one of the above aspects, wherein the optical waveguide has an elongated shape, and the optical waveguide has one or two portions in a longitudinal direction thereof. The above is partially fixed to the wiring board described above. (18) The optical waveguide structure according to (17) above, wherein the optical waveguide is fixed by an adhesive. The optical waveguide structure according to any one of the above aspects, wherein the optical waveguide has an elongated shape, and the optical waveguide is partially fixed to two or more portions in a longitudinal direction thereof. In the wiring board, the optical waveguide is provided in a curved portion between the adjacent fixed portions in the fixed portions of the two or more locations. (20) The optical waveguide structure according to any one of the above-mentioned (17), wherein the wiring board has a through hole penetrating the wiring board, and the optical waveguide is partially fixed to the through hole Wiring board. (21) The optical waveguide structure according to (20) above, wherein the through hole has an elongated shape having a long axis along a longitudinal direction of the optical waveguide in a plan view. The optical waveguide structure according to any one of the above-mentioned (1), wherein the optical waveguide structure has a region where the flexibility of the wiring substrate is large and the optical waveguide has a plan view The part that is offset from each other. (23) The optical waveguide structure according to any one of (17) to (22) wherein the wiring substrate has a rigid 201222034 portion having a relatively large flexibility and a relatively small flexibility. The flexible portion is located at the flexible portion in a portion where the optical waveguide is fixed to the wiring board. (B) The optical waveguide structure according to any one of the above-mentioned (a) to (n), wherein the wiring board has an elongated shape, and a part thereof has a hard surface provided on one surface side of the flexible substrate In the rigid substrate, the optical waveguide structure has a hard portion in which the hard substrate is located, and a region other than the hard substrate. (25) The optical waveguide structure according to (24) above, which has a plurality of the flexible portions, and the flexible portion of one of the plurality of flexible portions is constituted only by the optical waveguide. (26) The optical waveguide structure according to (24) or (25) above, wherein the hard portion has an optical signal passing region through which the optical signal is disposed, and the light k is passed through one end of the region The above optical waveguide is constructed by optical connection. (27) The optical waveguide structure according to (26) above, wherein the optical signal passing region is formed to penetrate the hard portion in a thickness direction. (A) The optical waveguide structure according to any one of the above-mentioned (2), comprising: a light-receiving element having a light-receiving portion mounted on the wiring board; and a light-emitting element having a light-emitting portion, wherein the light-receiving portion And the light-emitting portion and the optical waveguide are connected to each other by optical 11 201222034. (29) The optical waveguide structure according to (28) above, comprising a plurality of the optical waveguides, each of the optical waveguides having the light receiving element and the light emitting element. (30) The optical waveguide structure according to (28) or (29) above, wherein the connection portion between the light-receiving element and the optical waveguide and the connection portion between the light-emitting element and the optical waveguide are covered by a resin mold. (3) The optical waveguide structure according to any one of the above-mentioned (28), wherein the light-receiving circuit includes: the light-receiving element; the light-receiving electric element for controlling the operation of the light-receiving element; a part of the electric wiring and the light-receiving electric component; and a light-emitting circuit that includes the light-emitting element, an electric-emitting element that controls operation of the light-emitting element, and the light-emitting element and the light-emitting element Use one of the electrical components. (32) The optical waveguide structure according to the above (31), wherein the light-emitting element, the light-receiving element, the light-receiving electric element, and the light-emitting electrical element are each covered with a resin mold. (33) The optical waveguide structure according to (31) or (32), wherein the illuminating circuit is provided at one end of the flexible substrate, and the illuminating circuit is provided at the other end of the flexible substrate. When at least a part of the electric wiring included in the light receiving circuit and the light emitting circuit is the first electric wiring, the first electric 12 201222034 gas wiring is disposed from one end of the flexible substrate to the other end. . (34) The optical waveguide structure according to (33) above, wherein the i-th electrical wiring is electrically separated from the light-receiving circuit and the light-emitting circuit. (35) The optical waveguide structure according to the above (33) or (34), wherein: the first terminal portion includes one end portion of the flexible substrate, and the light receiving circuit is connected to the outside An external connection terminal and an external connection terminal for connecting the first electric wiring to the outside, and the second terminal portion includes an outer end portion provided on the other end of the flexible substrate to connect the light-emitting circuit to the outside A connection terminal and an external connection terminal for connecting the first electric wiring to the outside. (36) The optical waveguide structure according to (35), wherein the electric wiring includes a second electric wiring that connects the light-emitting circuit and the light-receiving circuit to the external connection terminal. (37) The optical waveguide structure according to the above (35) or (36), wherein the optical waveguide, the light receiving circuit, the light emitting circuit, and the external connection terminal are arranged in a straight line. The optical waveguide structure of any one of the above-mentioned (35) to (37) wherein the wiring board has an elongated shape, and the external connection terminals have a plurality of the plurality of terminals arranged along the longitudinal direction of the wiring board. Solder pad. The optical waveguide structure according to any one of the above-mentioned (35), wherein the wiring substrate has an elongated shape, and the external connection terminals have a plurality of rows arranged along a width direction 13 201222034 of the wiring substrate. Solder pads. (40) The optical waveguide structure according to any one of the above (1) to (39), wherein the multi-layer substrate of the plurality of flexible substrate and the plurality of conductor layers are alternately laminated . (41) An electronic device comprising the optical waveguide structure according to any one of (1) to (4G) above. (42) An optical waveguide structure comprising: an optical waveguide having a core portion and a cladding portion having different refractive indices; and the core portion has a widening of a cross-sectional area continuously increasing toward one end portion, and The core layer composed of the composition containing the following components is selectively irradiated with active radiation to form a desired shape: (A) a cycloolefin resin, (B) having a refractive index different from that of (A) above, and having At least one of a ring-shaped body and an oligomer having a cyclic ether group, and (C) a photoacid generator. (43) The optical waveguide structure according to the above (42), wherein the cyclic bond group is an oxetan group ((tetra)(tetra)gn)) or an epoxy group. (44) The optical waveguide structure according to (42) or (43) above, wherein the cycloolefin resin of the above (A) is a norbornene-based resin. (45) The optical waveguide structure according to any one of (42) to (44), wherein the (B) refractive index is lower than (A), the cycloolefin resin has the above (c) The acid generated by the photoacid generator is detached from ' and the detachment of the refractive index of the above (A) is lowered by detachment 14 201222034. (4) The optical waveguide structure according to (43) above, wherein the cycloaliphatic resin of the above (a) has a debonding group which is detached from the side chain by an acid generated by the photoacid generator of the above (c), The above (B) contains the ith monomer described in the following formula (1):

V,υ如上迷Q 46 )之光波導妹 進而含有環氧化合物及具有2個氧: ,,、上述⑻ 化合物中之至少一者作為第2單:…基之氧雜環丁炫 (48 )如上述(47 )夕 μ»、《 « 之先波導結構體,兑中卜、+,楚c 早體與上述第1單體之比例-中上述第2 里/上述第1單體之重量)計為〇ι〜"。 早體之重 (49 )如上述(45 )至(47) 體,其中上述脫離性基具有 —項之光波導結構 〜Ω Q . 、,告構、~ Si ~~ 芳;Μ >9 〇 — Si —結構中之至少丨種。 方基、,,。構及 (50)如上述(46)至(49 體’其中上述(Α)之環稀樹脂為降获婦二:光波導結構 ⑸)如上述(50)之光 …曰。 稱體,其中上述降莰 15 201222034 烯系樹脂為降莰烯之加成聚合物β (52 )如上述(51 )之光波導結構體,其中上述降其 稀之加成聚合物具有下述式(101)所記載之重複單位:人V, υ 迷 Q 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 46 As described above, (47) 夕μ», « « The first waveguide structure, the middle of the Bu, +, the ratio of the Chu and the first monomer - the weight of the above second / the first monomer Counted as 〇ι ~". The weight of the early body (49) is as described in the above (45) to (47), wherein the above-mentioned detachable group has the optical waveguide structure of the item - Ω Q . , , , , , , , , , , , , , , , , , , , , , , , , , , , — Si — at least one species in the structure. Fang Ji,,,. And (50) as in the above (46) to (49, wherein the ring-shaped resin of the above (Α) is a reduced film: an optical waveguide structure (5)) as in the above (50). The above-mentioned hail 15 201222034 olefinic resin is an alkylene oxide addition polymer β (52), wherein the above-mentioned thinning addition polymer has the following formula; (101) Repeated units recorded: person

(101) [式101中’ η為〇以上、9以下之整數]。 (53 )如上述(51 )或(52)之光波導結構體,其中 上述降莰烯之加成聚合物具有下述式(1〇2)所記載之重複 單位: 16 201222034(101) [In the formula 101, η is an integer of 〇 or more and 9 or less]. (53) The optical waveguide structure according to (51) or (52) above, wherein the addition polymer of the norbornene has a repeating unit as described in the following formula (1〇2): 16 201222034

體,其中 )至(53)中任-項之光波導結構 、中上述式(100)所記載之第i單體之含量相對於上 述裱烯樹脂100重量份’為i重量份以上、5〇重量份以下。 r)如上述(42)至(54)中任一項之光波導結構 昭,/、中於上述核心層之經活性放射線照射之區域、與未 照射區域’源自上述(B)之結構體濃度不同。 ” 6)如上述(42)至(55)中任一項之光波導結構 體,其中上述核心層之經活性放射線照射之區域與未照射 區域之折射率差為0.01以上。 (57)如上述(42)至(56)中任一項之光波導結構 ’其中將上述核心層之經活性放射線照射之區域作為上 述包覆部之至少一部分,將未照射區域作為上述核心部之 至少一部分。 (58)如上述(42)至(57)中任一項之光波導結構 體’其中’於上述擴張部分,上述核心部之俯視下之寬度 17 201222034 朝上述光波導之一端部連續變大。 (59 )如上述(42 )至(58 )中任一項之光波導結構 體其中於上述擴張部分,上述核心部之厚度朝上述光 波導之一端部連續變大。 (60)如上述(42)至(59)中任—項之光波導結構 體,其中,於上述擴張部分,上述核心部之俯視下之上述 核心部與上述包覆部之邊界線,以沿著朝上述光波導之一 端部開口之拋物線的方式形成。 (61 )如上述(42)至(60)中任一項之光波導結構 體,其中,於上述擴張部分,上述核心部之俯視下之上述 核心部與上述包覆部之邊界線或於厚度方向之上述核心部 與上述包覆部之邊界線,相對於上述核心部之上述一端部 之端面,而形成45度以上未達90度之角度。 (62) 如上述(42)至(61)中任一項之光波導結構 體’其中’上述核心部係上述一端部之端面面積大於上述 另一端部之端面面積。 (63) 如上述(42)至(62)中任一項之光波導結構 體,其中,於上述核心部之上述一最端部之俯視下的寬度 大於上述另一最端部之俯視的寬度。 (64 )如上述(42 )至(63 )中任一項之光波導結構 體’其中,上述核心部之上述一最端部之厚度厚於上述另 一最端部之厚度。 (65)如上述(42)至(64)中任一項之光波導結構 、 體’其中,上述核心部進而具有設置於上述擴張部分之另 18 201222034 立而部側’且橫剖面積朝另一端部連續變小之縮小部分。 (66 )如上述(65 )之光波導結構體,其中,於上述 、缩小部分’上述核心部之俯視下之寬度朝上述光波導之另 一端部連續變小。 U7)如上述(65)或(66)之光波導結構體,其中, 於上述縮小部分,上述核心部之厚度朝上述光波導之另一 端部連續變小。 (68 )如上述(65 )至(67)中任一項之光波導結構 體,其中,於上述縮小部分,上述核心部之俯視下之上述 核〜部與上述包覆部之邊界線,以沿著朝上述光波導之一 端部開口之抛物線的方式形成。 (69) 如上述(65)至(68)中任一項之光波導結構 體其中,於上述縮小部分,上述核心部之俯視下之上述 核“。卩與上述包覆部之邊界線或於厚度方向之上述核心部 與上述包覆部之邊界線,相對於上述核^部之上述—端部 之端面,而形成45度以上未達9〇度之角度。 而 (70) 如上述(42)至(69)中任—項之光波導結 體其中,上述光波導具備複數個上述核心部。 (71 )如上述(70 )之光波導結構體,其巾,上 數個核心部係並聯設置, 逆複 端部 向偏 一〆 “丨叫似^。节卜 之位置及另一端部之位置至少任—位置互相於長 移。 (72)如上述(70)或(71 之光波導結構體 其中, 19 201222034 於上述複數個核心部中相鄰之至少9加 z個核心部係以上、,十,_ 端部之位置與上述另一端部之位置 ' 方式構成。 成為互相相反之位置之 中任—項之光波導結構 彎曲之光程轉換部, 部之光彎曲而導入上述 光彎曲而導出至外部的 (73)如上述(42)至(72) 體’其中,上述光波導具有使光程 上述光程轉換部係以使來自外 核心部,或使傳播於上述核心部之 方式構成* (74)如上述(42)至(72) = , ^王’中任—項之光波導結構 體,其進而具有設置於上述光波導之至少一面,並且具備 基板、及設置於其至少一面且形成有電氣配線之導體層的 配線基板。 (75) —種電子裝置’其特徵在於具備上述(42)至 (74)中任一項之光波導結構體。 根據本發明’能夠以光之照射之簡單方法進行核心部 之圖案化,而獲得核心部之圖案形狀之設計的自由度較 廣,並且尺寸精度較高之核心部。 又’由於核心部之尺寸精度較高,故可獲得對發光元 件或受光元件具有優異之光結合效率之光波導。 進而,於由以降莰烯系樹脂(環烯系樹脂)為主之樹 脂組成物構成核心部之情形時,針對上述變形而難以產生 特別強之缺陷的效果較高,此外可進一步增大核心部與包 覆部之折射率差,並且耐熱性優異,結果可獲得性能更高 且耐久性更加優異之光波導。 20 201222034 又,電氣電路、光電路之形成均較為容易,可尺寸精 度良好地形成各種形狀者。尤其是,關於光電路,藉由選 擇曝光圖案,可形成任意形狀或配置之光程(核心部),又, 亦可明確地形成較細之光程,故有助於電路之積體化可 謀求裝置之小型化。 關於上述本發明之光波導結構體,光電路(光波導之 圖案)或電氣電路之設計之空間較寬,良率較好,可較高 地維持光傳輸性能,可靠性、财久性優異,富於通用性。 因此,藉由包含本發明之光波導結構體,可獲得可靠性較 高之各種電子零件及電子設備。 【實施亨式】 以下’依據隨附圖式所示之較佳之實施形態,對本發 明之光波導結構體及電子裝置進行詳細說明。 &lt;第1實施形態:圖1〜3 &gt; 圖1係表示本發明之光波導結構體之第1實施形態的 剖面圖’圖2為圖1所示之光波導之斜視圖,圊3係表示 本發明之光波導結構體之第1實施形態的平面圖。再者, 於以下說明中,將圖1中之上側設為「上」,下側設為「下」。 又’圖1、圖2誇張描繪層之厚度方向(各圖之上下方向)。 如圖1所示,本發明之光波導結構體1具備有基板2、 設置於基板2之下面之導體層5、設置於基板2上之發光元 件3及受光元件4、及設置於發光元件3之發光部3 1與受 光元件4之受光部41之間的光波導9。 光波導9係自圖2中下側依序積層包覆層(下側包覆 21 201222034 層)91、核心層93及包覆層(上側包覆層)92而成者,於 核心層93形成有特定圖案之核心部94與包覆部%。核心 部94係形成傳輸光之光程之部分,包覆部%係雖形成於 核心層93但不形成傳輸光之光程,而發揮與包覆層w、% 相同功能之部分。 作為核心層93之構成材料,可設為藉由光(例如紫外 線)之照射或藉由進-步加熱而改變折射率之材料。 上述材料之較佳例,可列舉 ‘”’ 叶 。举以含有本環丁烯系聚合物、降 沒稀系聚合物(樹脂)等環媾备 寻衣烯糸树月日之樹脂組成物作為主 材科者,尤佳為含有降茨婦系聚合物(作為主材料)者。 由上述材料所構成之核心層93對彎曲等變形之耐性優 異:尤其是,即便於重複臀曲變形之情形時,亦難以產生 二二&quot;4與包覆部95之剝離、或核心層93與鄰接之層(包 覆層91、92 )之層間剝離,亦可 』防止於核心部94内或包覆 # 95内產生微龜裂。其結 是 j、准符先波導9之光傳輸性 月匕,而獲得耐久性優異之光波導9。 又’於核心層93之構成材料中例如亦可含有抗氧化The optical waveguide structure of any one of the above-mentioned (53), wherein the content of the ith monomer described in the above formula (100) is i parts by weight or more and 5 Å with respect to 100 parts by weight of the terpene resin. Parts by weight or less. r) The optical waveguide structure according to any one of the above (42) to (54), wherein the region irradiated with the active radiation in the core layer and the unirradiated region 'from the structure of the above (B) The concentration is different. (6) The optical waveguide structure according to any one of (42) to (55), wherein a difference in refractive index between the region irradiated with the active radiation of the core layer and the unirradiated region is 0.01 or more. The optical waveguide structure of any one of (42) to (56) wherein the region irradiated with the active radiation of the core layer is at least a part of the cladding portion, and the unirradiated region is at least a part of the core portion. The optical waveguide structure 'in any of the above-mentioned (42) to (57), wherein the width 17 201222034 of the core portion in the plan view is continuously increased toward one end of the optical waveguide. The optical waveguide structure according to any one of the above-mentioned (42), wherein the thickness of the core portion is continuously increased toward one end of the optical waveguide. (60) as described above (42) The optical waveguide structure of any one of (59), wherein, in the expanding portion, a boundary line between the core portion and the cladding portion in a plan view of the core portion is along an end portion of the optical waveguide Parabolic The optical waveguide structure according to any one of the above-mentioned (42), wherein, in the expanded portion, a boundary line between the core portion and the cladding portion in a plan view of the core portion is formed. Or a boundary line between the core portion and the coating portion in the thickness direction is formed at an angle of not more than 90 degrees with respect to an end surface of the one end portion of the core portion. (62) As described in (42) above (61) The optical waveguide structure of any one of (61), wherein an end surface area of the one end portion is larger than an end surface area of the other end portion. (63) Any one of the above (42) to (62) The optical waveguide structure, wherein a width in a plan view of the one end portion of the core portion is larger than a width of a top view of the other end portion. (64) Any one of the above (42) to (63) The optical waveguide structure of the item, wherein the thickness of the one end portion of the core portion is thicker than the thickness of the other end portion. (65) The optical waveguide according to any one of the above (42) to (64) Structure, body, wherein the core portion further has a And the optical waveguide structure of the above-mentioned (65), wherein the above-mentioned core portion is reduced in the above-mentioned core portion. The width of the core waveguide is reduced toward the other end of the optical waveguide. The optical waveguide structure of the above (65) or (66), wherein the thickness of the core portion faces the optical waveguide The optical waveguide structure according to any one of the above-mentioned (65) to (67), wherein, in the reduced portion, the core portion of the core portion in a plan view and the above The boundary line of the cladding portion is formed along a parabola that opens toward one end of the optical waveguide. The optical waveguide structure according to any one of the above-mentioned (65), wherein, in the reduced portion, the core of the core portion in a plan view "the boundary line between the 包覆 and the cladding portion is The boundary line between the core portion and the coating portion in the thickness direction forms an angle of not more than 9 degrees with respect to the end surface of the end portion of the core portion, and is at least 90 degrees. (70) as described above (42) The optical waveguide junction of any one of (69), wherein the optical waveguide has a plurality of the core portions. (71) The optical waveguide structure of (70) above, wherein the plurality of core portions are connected in parallel Set, the reverse end of the direction is a little bit "squeaky like ^. The position of the gusset and the position of the other end are at least any position-shifted with each other. (72) The optical waveguide structure according to (70) or (71) above, wherein 19 201222034 is at least 9 plus z core portions adjacent to the plurality of core portions, and the position of the tenth and the _ end portions is the same as The position of the other end portion is configured to be an optical path conversion portion in which the optical waveguide structure of any one of the opposite ends is curved, and the light is bent to introduce the light bending and is led to the outside (73) as described above ( 42) to (72) a body, wherein the optical waveguide has a path length such that the optical path conversion portion is configured to be from an outer core portion or propagated to the core portion * (74) as described in (42) above (72) =, the optical waveguide structure of the above-mentioned item, further comprising a wiring provided on at least one surface of the optical waveguide, and having a substrate and a conductor layer provided with at least one surface of the optical wiring (75) An electronic device comprising: the optical waveguide structure according to any one of the above (42) to (74). According to the present invention, the core portion can be patterned by a simple method of light irradiation And get the picture of the core The design of the shape of the case has a wide degree of freedom, and the core portion has a high dimensional accuracy. Moreover, since the dimensional accuracy of the core portion is high, an optical waveguide having excellent optical coupling efficiency to the light-emitting element or the light-receiving element can be obtained. In the case where the core portion is composed of a resin composition mainly composed of a decene-based resin (cycloolefin-based resin), it is difficult to produce a particularly strong defect with respect to the above-described deformation, and the core portion can be further increased. The refractive index of the coating portion is poor, and the heat resistance is excellent. As a result, an optical waveguide having higher performance and more excellent durability can be obtained. 20 201222034 Moreover, it is easy to form an electric circuit and an optical circuit, and various types of optical circuits can be formed with good dimensional accuracy. In particular, with regard to the optical circuit, by selecting the exposure pattern, an optical path (core portion) of any shape or configuration can be formed, and a finer optical path can be formed explicitly, thereby contributing to the product of the circuit. The miniaturization of the device can be achieved. The optical waveguide structure of the present invention, the optical circuit (pattern of the optical waveguide) or the design of the electrical circuit The utility model has the advantages of wide space, good yield, high optical transmission performance, excellent reliability and longevity, and versatility. Therefore, by including the optical waveguide structure of the invention, high reliability can be obtained. Various electronic components and electronic devices. [Implementation of the invention] Hereinafter, the optical waveguide structure and the electronic device of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings. <First Embodiment: Fig. 1 1 is a cross-sectional view showing a first embodiment of the optical waveguide structure of the present invention. FIG. 2 is a perspective view of the optical waveguide shown in FIG. 1, and FIG. 3 shows an optical waveguide structure of the present invention. In the following description, in the following description, the upper side in FIG. 1 is referred to as "upper" and the lower side is referred to as "lower". Further, Fig. 1 and Fig. 2 exaggerate the thickness direction of the layer (the upper and lower directions of each figure). As shown in FIG. 1, the optical waveguide structure 1 of the present invention includes a substrate 2, a conductor layer 5 provided on the lower surface of the substrate 2, a light-emitting element 3 and a light-receiving element 4 provided on the substrate 2, and a light-emitting element 3. The optical waveguide 9 between the light-emitting portion 31 and the light-receiving portion 41 of the light-receiving element 4. The optical waveguide 9 is formed by sequentially laminating a cladding layer (lower cladding 21 201222034 layer) 91, a core layer 93, and a cladding layer (upper cladding layer) 92 from the lower side in FIG. 2 to form a core layer 93. There is a specific pattern of the core portion 94 and the cladding portion %. The core portion 94 forms part of the optical path for transmitting light, and the cladding portion % is formed on the core layer 93 but does not form an optical path for transmitting light, and functions as the same function as the cladding layers w and %. As a constituent material of the core layer 93, a material which changes its refractive index by irradiation with light (for example, ultraviolet rays) or by stepwise heating can be used. A preferred example of the above-mentioned material is a '"' leaf, and a resin composition containing a cyclopentene polymer such as the present cyclopentene polymer or a reduced rare polymer (resin), etc. The main material is especially suitable for those containing the sage polymer (as the main material). The core layer 93 composed of the above materials is excellent in resistance to deformation such as bending: in particular, even in the case of repeated hip deformation At the same time, it is also difficult to cause the peeling of the second portion &quot;4 with the covering portion 95, or the peeling between the core layer 93 and the adjacent layer (the covering layer 91, 92), or may be prevented from being inside or covered in the core portion 94. A microcrack is generated in #95. The knot is j, the optical transmission of the first waveguide 9 is obtained, and the optical waveguide 9 having excellent durability is obtained. Further, for example, the constituent material of the core layer 93 may contain an anti-corrosion. Oxidation

:卜折射率調整劑、塑化劑、增黏劑、加強劑、增感劑、 调平劑、消泡劑、密著助劑及難M n . 雖M劑專添加劑。抗氧化劑 加具有提高高溫穩錢、提高耐候性、抑制光劣化之 效::作為上述抗氧化劑’例如可列舉:㈣系、雙盼系、 :分糸等紛系、或芳香族胺系者。又,藉由添加塑化劑、 曰點劑、加強劑,亦可進一步增大對彎曲之耐性。 上述抗氧化劑所代表之添加•含有率(2種以上之情 22 201222034 形時為合計量)相對於核心層93之構成材料整體,較佳為 Ο/〜40重量%左右,更佳為3〜3〇重量%左右。若該量過 少,則無法充分發揮添加劑之功能,若量過多,則有根據 添加劑之種類或特性,而產生於核心部94中傳輸之光(傳 朽光)t穿透率之降低、圖案化不良、折射率不穩定等之 虞。 作為核心層93之形成方法,可列舉塗佈法。作為塗佈 法可列舉塗佈核心層形成用組成物(清漆等)並使其硬 化(固化)之方法、及塗佈具有硬化性之單體組成物並使 其硬化(固化)之方法。又,亦可採用塗佈法以外之方法 例如接合另外製造之片材之方法。 使用L罩對以上述方式所得之核心層93選擇性地昭 射光(活性放射線)’而使所欲形狀之核心部%圖案化:、、、 作為用於曝光之光,可列舉可見光、紫外光、紅外光、 雷射光等活性能量光線。又’亦 了不使用光,而使用X射 線等電磁波、或電子束等粒子射線。 於核心層9 3中,經朵昭私4 a九照射之部位之折射率降低,與未 座光照射之部位之間產生折射率 叮町手差。例如,核心層93之經 光照射之部位成為包覆部,土 勹匕後。丨95,未經照射之部位成為核心部 斗包覆部95之折射率與包霜爲 味 兴^復層91、92之折射率大致相 等。 對核心層93照射光後,進 。藉由附加該加熱步驟,可 95之折射率差,故而較佳。 又’亦有藉由以特定之圖案 行加熱而形成核心部94之情形 進一步增大核心部94與包覆部 23 201222034 再者,關於該原理等,以下將作詳細闡述。 作為所形成之核心、部94之圖案形狀,並無特別限定, 可為直線狀、包含弯曲部之形狀、異形、包含光程之分支 部、合流部或交又部之形狀、聚光部(寬度等減少之部分) 或光擴散部(寬度等增大之部A)、丨組合有該等中之2種 以上之形狀等任意者。本發明之特徵在於,藉由設定光之 ,…射圖案了谷易地形成任意形狀之核心部94。 關於光波導9之各部之構成材料及核心部94之形成方 法等,以下將作詳細闡述。 基板2為具有可撓性及絕緣性之可撓性基板。 基板2之構成材料,例如可列舉:環氧樹脂、酚樹脂、 雙順丁烯二醢亞胺樹脂、雙順丁烯二醯亞胺—三口井樹脂、三 坐樹知、聚二聚氰酸酯(p〇lycyanurate)樹脂、聚異三聚氰酸 酉旨樹脂、苯環丁烯(benzocyclobutene)樹脂、聚醯亞胺樹脂、 聚苯并口号°坐樹脂、降获稀樹脂等。又,該等材料可單獨使用, 亦可混合複數種而使用。 又,基板2亦可為複數層之積層體。例如可列舉積層 由相同組成(種類)之樹脂材料構成之第1層與第2層而 成者、及積層分別由不同組成(種類)之樹脂材料構成之 第1層與第2層而成者。再者’於積層體之層構成當然並 不限定於此。 基板2之厚度並無特別限定,通常較佳為5〜5()//m左 右更佳為10〜40/zm左右。若基板2之厚度在上述範圍 内,則可使光料結構體1成為具有充分之可撓性者。 24 201222034 基板2所具右 程度者。具體而士 撓性係例如可以人手容易地彎曲之 (拉伸彈性模數板2之揚氏模數(Y_g,S Μ〇_) 前後)為Hgp 一般之室溫環境下(2〇〜25°c 與基板2之下面H,更佳為2〜12 GPa左右。 形狀,而構成所^ 導體層5分別圖案化成特定之 人之配線或電路。導體層5之禮忐4士 例如可列舉銅、鋼系 之構成材料’ 導體層5之厚声二 鋁系合金等各種金屬材料。 旱度並無特別限定,通常較 右,更佳為5〜7〇心左右。 120心左 導體層5係例如可藉由金屬猪之接合 敷、蒸鍍、濺鍍等方法接者)、金屬鍍 a n 去而形成者。對導體層5之圖丨 如可使用I虫刻、印刷、遮罩等方法。 之圖案化例 方面於基板2形成有貫通孔21 + 填充有導電材料r在丨上ζ 、貝通孔2 1内 ”材科(例如鋼、銅系合 種金屬材料),而設 鋁系合金%各 „ ^ 〇 導體柱22。該導體柱22與導 及基板2之上面側電連接。 肖導體層5 發光元件3ι:*·:μ:α。 八有基D 30、固定於基台 部31、連接發光部Μ之 〇之表面的發光 金屬線32、及設置於基台 面之電極輝塾的 外部電路連接之外部電極33。又下;^以使發光部Μ與 被於基台30之表面堆&amp; χ ” 〇Ρ 31及金屬線32 〈表面堆成+球狀之樹 若對外部電極33通電,則發光部31發光所俊羞。 發光元件3係以外部電極3 接)之方式裝载於基板2上。 柱22接合(電連 25 201222034 另;方面,受光元件4具有基台4〇、固定於基台4〇之 的又光部41、連接受光部41之電極焊墊 〇之: refractive index modifier, plasticizer, tackifier, reinforcing agent, sensitizer, leveling agent, defoamer, adhesion aid and difficult M n . The antioxidant is added to improve the high temperature and to improve the weather resistance and to suppress the photodegradation. The above-mentioned antioxidants include, for example, (four) systems, double-dose systems, bifurcations, and the like, or aromatic amines. Further, by adding a plasticizer, a pestle, and a reinforcing agent, the resistance to bending can be further increased. The addition/content ratio represented by the above-mentioned antioxidant (the total amount of two or more kinds of 22, 2012,220,304 in total) is preferably about ~40% by weight, more preferably 3~, with respect to the entire constituent material of the core layer 93. 3〇% by weight. If the amount is too small, the function of the additive cannot be sufficiently exhibited. If the amount is too large, the light transmitted through the core portion 94 (transmission light) t is reduced in transmittance and patterned depending on the type or characteristics of the additive. Poor, unstable refractive index, etc. As a method of forming the core layer 93, a coating method can be mentioned. The coating method may be a method of applying a composition for forming a core layer (such as a varnish) and hardening (curing), and a method of applying a curable monomer composition and curing (curing) the composition. Further, a method other than the coating method, for example, a method of joining sheets produced separately may be employed. The core layer 93 obtained in the above manner is selectively irradiated with light (active radiation) using the L cover to pattern the core portion % of the desired shape:, as the light for exposure, visible light, ultraviolet light Active light rays such as infrared light and laser light. Further, electromagnetic waves such as X-rays or particle beams such as electron beams are used instead of light. In the core layer 9.3, the refractive index of the portion irradiated by the flowering body is reduced, and the refractive index of the portion irradiated with the non-station light is generated. For example, the portion of the core layer 93 that is irradiated with light becomes a cladding portion and is behind the soil.丨95, the portion where the unirradiated portion becomes the core portion The refractive index of the hopper portion 95 is substantially equal to the refractive index of the smear layer 91, 92. After the core layer 93 is irradiated with light, it is advanced. By adding this heating step, the refractive index of 95 can be made poor, so that it is preferable. Further, in the case where the core portion 94 is formed by heating in a specific pattern, the core portion 94 and the cladding portion 23 are further enlarged. 201222034 Further, the principle and the like will be described in detail below. The shape of the core portion 94 to be formed is not particularly limited, and may be a linear shape, a shape including a curved portion, an irregular shape, a branch portion including an optical path, a shape of a merging portion or a cross portion, and a condensing portion ( Any portion in which the width or the like is reduced, or a light diffusing portion (portion A in which the width or the like is increased), or a combination of two or more of these. The present invention is characterized in that the core portion 94 of an arbitrary shape is formed by setting the light, and the pattern is easily formed. The constituent materials of the respective portions of the optical waveguide 9 and the method of forming the core portion 94 will be described in detail below. The substrate 2 is a flexible substrate having flexibility and insulation properties. Examples of the constituent material of the substrate 2 include an epoxy resin, a phenol resin, a bis-butylene diimide resin, a bis-butenylene imide, a three-well resin, a three-seat tree, and a poly-cyanuric acid. An ester (p〇lycyanurate) resin, a polyisocyanuric acid resin, a benzocyclobutene resin, a polyimine resin, a polybenzoic acid resin, a reduced resin, and the like. Further, the materials may be used singly or in combination of plural kinds. Further, the substrate 2 may be a laminate of a plurality of layers. For example, the first layer and the second layer which are formed of a resin material having the same composition (type), and the first layer and the second layer which are composed of resin materials having different compositions (types) may be used. . Further, the layer constitution of the laminate is of course not limited thereto. The thickness of the substrate 2 is not particularly limited, and is usually preferably about 5 to 5 () / / m and more preferably about 10 to 40 / zm. When the thickness of the substrate 2 is within the above range, the light-structure structure 1 can be made sufficiently flexible. 24 201222034 Substrate 2 has the right degree. The concrete gentleness can be easily bent by hand (for example, the Young's modulus of the tensile elastic modulus plate 2 (Y_g, S Μ〇 _)) is Hgp in a normal room temperature environment (2〇~25°). c and the lower surface H of the substrate 2, more preferably about 2 to 12 GPa. The shape of the conductor layer 5 is patterned into a wiring or circuit of a specific person. The conductor layer 5 is exemplified by copper, The material of the steel system is a variety of metal materials such as a thick acoustic aluminum alloy such as the conductor layer 5. The degree of drought is not particularly limited, but is usually about 5 to 7 〇 center, and is preferably about 5 to 7 〇. It can be formed by metallized joints, vapor deposition, sputtering, etc., and metal plating. For the pattern of the conductor layer 5, for example, I insect engraving, printing, masking, or the like can be used. In the patterning example, the substrate 2 is formed with a through hole 21 + filled with a conductive material r in the upper ζ, the beacon hole 2 1 "material (for example, steel, copper-based metal material), and an aluminum alloy % each „ ^ 〇 conductor post 22 . The conductor post 22 is electrically connected to the upper surface of the lead and the substrate 2. Shore conductor layer 5 Light-emitting element 3ι:*·: μ: α. The octagonal base D 30 is provided on the base portion 31, the illuminating metal wire 32 connected to the surface of the illuminating portion Μ, and the external electrode 33 connected to the external circuit of the electrode illuminating surface provided on the base surface. Further, when the light-emitting portion Μ and the surface of the base 30 are stacked &amp; ” 〇Ρ 31 and the metal wire 32 (the surface is stacked and the spherical tree is energized to the external electrode 33, the light-emitting portion 31 emits light. The light-emitting element 3 is mounted on the substrate 2 so as to be connected to the external electrode 3. The column 22 is joined (electrical connection 25 201222034. In addition, the light-receiving element 4 has a base 4〇 and is fixed to the base 4〇. The light-emitting portion 41 and the electrode pad connected to the light-receiving portion 41

電極焊墊的金@ B 及8又置於基台4〇之下面且用以使受 ^ 41與外部電路連接之外部電極43。又,受光部41及 金屬線42被於基台4Q之表面堆成半球狀之樹 覆蓋。 “又光41接爻光信號,則轉換成電氣信號,自外部 電極43輸出。 受光元件4係以外部電極43與導體柱22接合(電連 接)之方式裝载於基板2上。 再者’於發光元件3中之發光部31及於受光元件4中 之受光部41除了分別纟1個發光點或1個受光點構成以 外’亦可為集合有複數個發光點或受光點。集合有複數個 發光點或受光點者’例如可列舉發光點或受光點配置成列 狀(例如發光點或受光點為lx4個、1χ12個)或行列狀(例 如發光點或受光點為nXnUgJ : η'爪為2以上之整數)者、 或複數個發光點或受光點不規則地(random)地配置者等。 Η月曰模具34於發光元件3之基台3〇之右側封閉發光 部31等。藉此,可形成發光部31未露出至外部而經封閉 之結構,故可保護發光部31免受污染、損傷、氧化等。其 結果,發光元件3之可靠性得到提高。 ,又,樹脂模具44於受光元件4之基纟4〇之左側封閉 文光部41等。藉此’可形成受光部41未露出至外部而經 封閉之結構,故可保護受光部41免受污染、損傷 '氧化等。 26 201222034 其結果,香也_ μ 又先兀件4之可 又’樹脂模具34、44之:件W高。 :樹脂材料,例如可列舉環料,較佳為具有絕緣性 樹脂、矽樹脂等。 軋树知、酚樹脂、降莰降莰烯 光波導9係以連結發 受光點的方式設置於 :1之發光點與受光部〇之 可利用光波導9光與遠技 與受光元件4之間。藉此’ 時)以各視時(自… 92之折射率介钇一 ^ 相對於包覆層91、 部94之包覆層91及92係構成分別位於核心 可士圓 部之包覆部者。藉由上述構成,核心部94 了如圖2所示,作為將其外周之全周包圍於包覆 程而發揮功能。 先 立光波導9之兩端部(與發光元件3及受光元件4之連 接4)由设置於發光元件3之樹脂模具34及設置於受光元 件4之樹脂模具44所覆蓋,而固定於發光元件3及受光元 件4。藉此,光波導9、發光元件3及受光元件4可形成二 體,而以1個零件(光配線)之形式進行操作。 再者,圖2所示之光波導9係包含i個核心部94,但 於1個光波導9所形成之核心部94之個數,例如可根據於 1個發光部3 1所設置之發光點之個數、或於1個受光部41 所設置之受光點之個數而設定,並無特別限定。 於本實施形態之光波導結構體1,若經由導體層5及導 27 201222034 體柱22對發光tg件3之外部電極33通電,則發光部3 1之 發光點發光,朝圖1中右方發出之光進入光波導9之核心 部94。於光波導9,一面於核心部94與包覆部(包覆層9卜 92及側方之包覆部95)之界面重複反射,一面於核心部94 内沿著其長邊方向(圖1中右方向)前進。並且,若光到 達受光部41之受光點’則於受光部41中光信號轉換為電 氣信號,而自外部電極43輸出。 關於上述光波導結構體卜於下述將詳細闡述,由於光 波導9係由高分子材料構成,妗 τ僻取故具有可撓性,且基板2亦 為具有可撓性之可撓性基板,故本、Λ道从冰碰 ^ 故先波導結構體1整體亦成 為具有優異之可撓性者。其結果,例如即便重複進行折彎 操作,亦不會破壞而可獲得耐久性優異之光波導結構體卜 又,光波導9與基杻9&gt; 並非直接固定,故進行折彎操 作時,光波導9與基板2可自由、货叙甘&amp;田 曰由活動。其結果,可防止局 部之應力集中,而更加確實地ρ 方止伴隧折彎操作之光波導9 之破壞。 &lt;第2實施形態:圖4 &gt; 於圖4表示本發明之光波導 等,。構體1之第2實施形態。 以下’對該光波導結構體1進杆 α 运仃說明’關於與上述第1實 施形態相同之事項,省略其說 兄月以不同點為中心加以說 明。 圖4為第2貫施形態之平面圖。 於本實施形態之光波導結構 ^ 遛先波導9、發光元件 3及又“件4之構成與上述不同,其以外相同。 28 201222034 即,於1個基板2上分別設置各為3個之光波導9、發 光元件3及受光元件4。藉此,可於3個光波導9同時進行 光通信,故可實現光波導結構體1之光通信的大容量化。 又,光波導9、發光元件3及受光元件4可形成一體,以1 個零件(光配線)之形式進行操作,故僅藉由適當變更裝 载於基板2上之光配線根數便可容易地變更於光波導結構 體1之光通信之容量。 &lt;第3實施形態:圖5 &gt; 於圖5表示本發明之光波導結構體1之第3實施形態。 以下,對該光波導結構體1進行說明,關於與上述第1實 施形態相同之事項’省略其說明,以不同點為中心加以說 明。 圖5為第3實施形態之平面圖。 於本貫施形態之光波導結構體1,光波導9、發光元件 3及受光元件4之構成與上述不同,其以外相同。 即,於1個基板2上設置3個光波導9、具備有3個發 光點之發光部3 1的發光元件3、及具備有3個受光點之受 光。卩41的受光元件4。藉此,可於3個光波導9同時進行 光通信,故可實現光波導結構體丨之光通信的大容量化。 又,3個光波導9、發光元件3及受光元件4可形成一體, 以1個零件(光配線)之形式進行操作。因此,可使裝載 於基板2上之作業變得容易,而容易製造光波導結構體卜 &lt;第4實施形態:圖6 &gt; 於圖6表示本發明之光波導結構體丨之第4實施形態。 29 201222034 以下,對該光波導結構體1進行說明,關於與上述第!實 施形態相同之事項,省略其說明,以不同點為中心加以1 明。 圖6為第4實施形態之平面圖。 於本實施形態之光波導結構體丨,光波導9、發光元件 3及受光元件4之構成與上述相同,其以外相同。 即,於1個基板2上設置形成有3個核心部料之】個 光波導9、具備有3個發光點之發光部3丨之發光元件3、 具備有3個受光點之受光部41之受光元件4 ^藉此,可於 3個光波導9同時進行光通信,故可實現光波導結構體丨之 光通信之大容量化。又,光波導9 '發光元件3及受光元件 4可形成一體,以1個零件(光配線)之形式進行操作。因 此,裝載於基板2上之作業變得容易,而容易製造光波導 結構體1。 &lt; &lt;第5實施形態:圖7 &gt; 於圖7分別表示本發明之光波導結構體丨之第5實施 形態。以下,對該光波導結構體1進行說明,關於與上述 第1實施形態相同之事項,省略其說明,以不同點為中心 加以說明。 圖7為第5實施形態之剖面圖。 於本實施形態之光波導結構體1,光波導9之構成與上 述不同’其以外相同。 即,光波導9形成細長之形狀,但自其長邊方向之中 心向左側偏移之點及向右側偏移之點之2個部位相對於其 30 201222034 板2而局部固定。藉由如此進行局9 與基板2之間於固定部位受到約束,但於其以外之部位並 不受到約束。於上述光波導結構體卜光波導9及基板可彼 此相對自由地變形’故容易緩和伴隨變形而產生於兩者間 之應力集中。 例如,將光波導結構體!於其長邊方向之中心折弯時, 由於位於折彎部之内側或外側,而於基板2與光波導9之 間產生位置偏移,但於光波導結構體1之長邊方向之中、、 附近’基板2與光波導9不受約束,故可容易地容許上述 位置偏移。其結果’可防止伴隨位置偏移之應力局部集中, 而防止伴隨折彎而使光波導結構體丨受到破壞。 圖7所示之光波導9相對於基板2而以2個固定部。 加以固;t。該2個固定部81只要為具有接著功能之構件即 可,例如可由接著劑、黏著膜、雙面黏㈣等各種接 件所構成。 各固定部81之位置並無特別限^,較佳為自基板2之 端部分別至基板2之總長之1〇〜4〇%左右内側之位置,更 佳為15〜35%左右内側之位置。 又,藉由局部固定光波導9與基板2之間,與完全不 固定之情形相比,可防止折彎操作時光波導9劇烈活動。 猎此’可確實地防止劇烈活動之光料9與其他構件干擾 而導致光料9之破壞,或者光波導9、與發光元件3及受 光元件4之連接部脫離。 再者,固定部81之個數或配置並無特別限定,可根據 31 201222034 伴隨折f操作之”部之位置等而適當設定。例如 部W數可為】個,亦可為3個以上。又,固1 之配置較佳為不配置於中央 Μ…丨… 更佳為以相對於光 :配: 長邊方向之中央而成為對稱關係之方式進 行配罝。 〈第6實施形態:圖8、9 &gt; 於圖8、9分別表示本發明之光波導結構體i之第 施形態。以下,對該光波導結構體!進行說明,關於與上 述第1 ' 5實施形態相同之事項, 丄1 項々略其說明,以不同點為 中心加以說明。 圖8為第6實施形態之剖面圖。 於本實施形態之光波導結構體 傅遐1先波導9之構成與上 述不同,其以外相同。 即,圖8所示之光浊邁0 4。如 皮導9相對於基板2而以2個固定 部81加以固定’於2個固定〇 疋。卩81之間,光波導9以彎曲 之方式設置。具體而言,光波導 等9具有U向上方突出之方 式彎曲之可撓部96。與可揞邱 以外之光波導9與基板2 之間相比,該可撓部96與基板2 蚁z之間產生更大之間隙。 若光波導9具有可撓部96 &gt;措 則與不具有可撓部96之情 形相比,於光波導結構體1之具,息士 又長邊方向之中央附近,光波 導結構體1更容易折彎。 圖9係用以說明將圖8 m , 口》所不之光波導結構體1於中央 附近折彎而成之狀態的圖。 於圖9,以將光波導結構體 再避1之兩端部向下壓之方式折 32 201222034 1之中央附近向上 發生變形,此時各 縮力,對位於折彎 彎。藉㈣折彎操作,W波導結構體 方突出之方式(以上面為山折之方式) 別對位於折f部之内側之基板2 _ 部之外側之光波導9賦予拉伸力。 之情形時,光波導9由於 中產生拉伸應力。因此, 光號之傳輪效率降低 ;於光波導9不具有可撓部96 該拉伸力而拉長,而於光波導9 有於光波導9產生不需要之變形 之虞。 相對於此,於光波導9The gold pads @B and 8 of the electrode pad are placed under the base 4 and are used to connect the external electrode 43 to the external circuit. Further, the light receiving portion 41 and the wire 42 are covered with a hemispherical tree on the surface of the base 4Q. When the light signal is connected to the light signal, it is converted into an electrical signal and outputted from the external electrode 43. The light receiving element 4 is mounted on the substrate 2 such that the external electrode 43 is bonded (electrically connected) to the conductor post 22. The light-emitting portion 31 of the light-emitting element 3 and the light-receiving portion 41 of the light-receiving element 4 may be formed by a plurality of light-emitting points or light-receiving points in addition to one light-emitting point or one light-receiving point. For example, the light-emitting point or the light-receiving point' may be arranged in a column shape (for example, a light-emitting point or a light-receiving point is 1×4, 1χ12) or a matrix (for example, a light-emitting point or a light-receiving point is nXnUgJ: η' claw The one or more of the light-emitting points or the light-receiving points are arranged irregularly. The moon-shaped mold 34 closes the light-emitting portion 31 and the like on the right side of the base 3 of the light-emitting element 3. Since the light-emitting portion 31 is formed so as not to be exposed to the outside and is closed, the light-emitting portion 31 can be protected from contamination, damage, oxidation, etc. As a result, the reliability of the light-emitting element 3 is improved. Further, the resin mold 44 is further improved. On the basis of the light-receiving element 4 On the left side of the fourth side, the light-receiving portion 41 and the like are closed, whereby the structure in which the light-receiving portion 41 is not exposed to the outside can be formed, so that the light-receiving portion 41 can be protected from contamination, damage, oxidation, etc. 26 201222034 Also, the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The resin and the hail-reducing decene-based optical waveguide 9 are provided between the light-emitting point of the light-emitting point and the light-receiving portion 1, and between the optical fiber 9 and the telephoto element and the light-receiving element 4 so as to connect the light-receiving point. The coating portion located at the core corrugated portion is formed in each of the viewing time (the refractive index of 92 from the coating layer 91 and the portion 94). In the core portion 94, as shown in Fig. 2, the entire circumference of the outer circumference is surrounded by the coating process. The both ends of the optical waveguide 9 (the connection with the light-emitting element 3 and the light-receiving element 4) Covered by the resin mold 34 provided in the light-emitting element 3 and the resin mold 44 provided on the light-receiving element 4, The light-emitting element 3 and the light-receiving element 4 are formed. Thereby, the optical waveguide 9, the light-emitting element 3, and the light-receiving element 4 can be formed in two parts and operated as one component (optical wiring). The number of the core portions 94 formed by one optical waveguide 9 can be, for example, the number of light-emitting points provided in one light-emitting portion 31, or The number of light receiving points provided by the one light receiving unit 41 is not particularly limited. The optical waveguide structure 1 of the present embodiment is illuminating the tg member 3 via the conductor layer 5 and the conductor 27 201222034 body column 22 When the external electrode 33 is energized, the light-emitting point of the light-emitting portion 31 emits light, and the light emitted to the right in FIG. 1 enters the core portion 94 of the optical waveguide 9. The optical waveguide 9 is repeatedly reflected at the interface between the core portion 94 and the cladding portion (the cladding layer 92 and the lateral cladding portion 95), and is along the longitudinal direction of the core portion 94 (FIG. 1). In the middle right direction) advance. When the light reaches the light receiving point of the light receiving unit 41, the light signal is converted into an electric signal in the light receiving unit 41, and is output from the external electrode 43. The optical waveguide structure described above will be described in detail below. Since the optical waveguide 9 is made of a polymer material, the optical waveguide 9 is flexible and the substrate 2 is also a flexible flexible substrate. Therefore, the tunnel and the tunnel are touched from the ice. Therefore, the waveguide structure 1 as a whole has excellent flexibility. As a result, for example, even if the bending operation is repeated, the optical waveguide structure excellent in durability can be obtained without being broken, and the optical waveguide 9 and the substrate 9 are not directly fixed, so that the optical waveguide is subjected to the bending operation. 9 and the substrate 2 are free, and the goods are narrated & As a result, the local stress concentration can be prevented, and the destruction of the optical waveguide 9 with the tunnel bending operation can be more reliably performed. &lt;Second Embodiment: Fig. 4 &gt; Fig. 4 shows an optical waveguide or the like of the present invention. The second embodiment of the structure 1. In the following, the description of the optical waveguide structure 1 is shown in the same manner as in the first embodiment, and the description of the same is omitted. Fig. 4 is a plan view showing a second embodiment. The optical waveguide structure of the present embodiment, the first waveguide 9, the light-emitting element 3, and the "member 4" are different from the above. 28 201222034 That is, three light beams are provided on one substrate 2, respectively. The waveguide 9, the light-emitting element 3, and the light-receiving element 4. Thereby, optical communication can be simultaneously performed in the three optical waveguides 9, so that the optical communication of the optical waveguide structure 1 can be increased in size. 3 and the light-receiving element 4 can be integrally formed and operated as one component (optical wiring). Therefore, the optical waveguide structure 1 can be easily changed only by appropriately changing the number of optical wirings mounted on the substrate 2. The third embodiment of the optical waveguide structure 1 of the present invention is shown in Fig. 5. The optical waveguide structure 1 will be described below. The same matters as in the first embodiment are omitted. The description will be made focusing on the differences. Fig. 5 is a plan view showing a third embodiment. The optical waveguide structure 1 of the present embodiment, the optical waveguide 9, the light-emitting element 3, and The composition of the light receiving element 4 and the above In other words, three optical waveguides 9, three light-emitting elements 3 including three light-emitting points, and three light-receiving points are provided on one substrate 2. By the light-receiving element 4, optical communication can be simultaneously performed in the three optical waveguides 9, so that the optical communication of the optical waveguide structure can be increased. Further, the three optical waveguides 9, the light-emitting element 3, and the light-receiving element 4 can be realized. It can be integrated and operated in the form of one component (optical wiring). Therefore, the work on the substrate 2 can be easily performed, and the optical waveguide structure can be easily manufactured. [Fourth embodiment: Fig. 6 &gt Fig. 6 shows a fourth embodiment of the optical waveguide structure according to the present invention. 29 201222034 Hereinafter, the optical waveguide structure 1 will be described, and the same matters as those of the above-described embodiment will be omitted. Fig. 6 is a plan view of the fourth embodiment. In the optical waveguide structure 本 of the present embodiment, the optical waveguide 9, the light-emitting element 3, and the light-receiving element 4 have the same configuration as described above. , set on one substrate 2 The optical waveguide 9 having three core materials, the light-emitting element 3 including the light-emitting portions 3 having three light-emitting points, and the light-receiving element 4 including the light-receiving portions 41 having three light-receiving points are provided. Since the three optical waveguides 9 perform optical communication at the same time, the optical communication of the optical waveguide structure can be increased in capacity. Further, the optical waveguide 9' of the light-emitting element 3 and the light-receiving element 4 can be integrated into one component (optical wiring) Therefore, the operation of loading on the substrate 2 becomes easy, and the optical waveguide structure 1 can be easily manufactured. &lt;&lt;Fifth Embodiment: Fig. 7 &gt; Fig. 7 shows the light of the present invention, respectively. The fifth embodiment of the waveguide structure is described below. The optical waveguide structure 1 will be described below, and the description of the same matters as those of the first embodiment will be omitted, and the differences will be mainly described. Fig. 7 is a cross-sectional view showing a fifth embodiment. In the optical waveguide structure 1 of the present embodiment, the configuration of the optical waveguide 9 is the same as that described above. That is, the optical waveguide 9 is formed into a long and thin shape, but the two points which are shifted to the left side from the center in the longitudinal direction and the points which are offset to the right side are partially fixed with respect to the 30 201222034 plate 2 . By doing so, the portion between the station 9 and the substrate 2 is restrained at the fixed portion, but the portion other than the substrate is not restrained. In the optical waveguide structure, the optical waveguide 9 and the substrate can be relatively freely deformed with each other, so that it is easy to alleviate the stress concentration caused by the deformation. For example, the optical waveguide structure! When bending at the center of the longitudinal direction, a positional displacement occurs between the substrate 2 and the optical waveguide 9 due to being located inside or outside the bent portion, but in the longitudinal direction of the optical waveguide structure 1, The 'substrate 2 and the optical waveguide 9 are not constrained in the vicinity, so the above positional shift can be easily accommodated. As a result, local stress concentration accompanying the positional deviation can be prevented, and the optical waveguide structure body can be prevented from being damaged by the bending. The optical waveguide 9 shown in FIG. 7 has two fixing portions with respect to the substrate 2. Solidify; t. The two fixing portions 81 may be any member having a function of a follow-up function, and may be composed of, for example, an adhesive, an adhesive film, or a double-sided adhesive (four). The position of each of the fixing portions 81 is not particularly limited, and is preferably from the end of the substrate 2 to the inner side of the total length of the substrate 2 of about 1 to 4%, and more preferably about 15 to 35% of the inner side. . Further, by partially fixing the optical waveguide 9 and the substrate 2, the optical waveguide 9 can be prevented from being vigorously moved during the bending operation as compared with the case where it is not fixed at all. This hunting can reliably prevent the vigorously moving light 9 from interfering with other members to cause destruction of the light 9 or the optical waveguide 9 and the connection portion between the light-emitting element 3 and the light-receiving element 4 to be separated. In addition, the number or arrangement of the fixing portions 81 is not particularly limited, and may be appropriately set according to the position of the portion of the portion of the operation of 31 201222034. For example, the number of the parts may be three or more. Further, it is preferable that the arrangement of the solid 1 is not disposed in the center 丨... 丨. More preferably, it is arranged so as to be symmetric with respect to the center of the light: distribution: the longitudinal direction. <Sixth embodiment: Fig. 8 9 and 9 respectively show the first embodiment of the optical waveguide structure i of the present invention. Hereinafter, the optical waveguide structure will be described, and the same matters as those of the first '5 embodiment will be described. Fig. 8 is a cross-sectional view showing a sixth embodiment. Fig. 8 is a cross-sectional view showing a sixth embodiment. The optical waveguide structure of the present embodiment has the same configuration as that of the first waveguide 9 described above. That is, the light turbidity shown in Fig. 8 is 0. If the skin guide 9 is fixed to the two fixing portions 81 with respect to the substrate 2, it is fixed between two fixed turns 卩 81, and the optical waveguide 9 is bent. Mode setting. Specifically, the optical waveguide or the like 9 has a U protruding upward. The curved flexible portion 96. A larger gap is formed between the flexible portion 96 and the substrate 2 ant z than between the optical waveguide 9 and the substrate 2 other than the yoke. If the optical waveguide 9 is flexible In the optical waveguide structure 1, the optical waveguide structure 1 is more easily bent in the vicinity of the center in the longitudinal direction of the optical waveguide structure 1 as compared with the case where the flexible portion 96 is not provided. A diagram for explaining a state in which the optical waveguide structure 1 of FIG. 8 is not bent near the center. In FIG. 9, the both ends of the optical waveguide structure are further prevented from being pressed downward. The method of folding 32 201222034 1 is deformed upwards near the center. At this time, the respective contraction forces are located at the bending bend. By the (four) bending operation, the W-wave structure is protruded in a manner (the above is a mountain fold). The optical waveguide 9 on the outer side of the substrate 2 _ portion on the inner side of the f portion is given a tensile force. In the case where the optical waveguide 9 generates tensile stress, the efficiency of the light transmission wheel is lowered, and the optical waveguide 9 is not The flexible portion 96 has the tensile force to be elongated, and the optical waveguide 9 has an unnecessary optical waveguide 9 Shaped danger. In contrast, the optical waveguide 9

V* 導9具有如圖8所示之可撓邱Q 情形時,無論對光波導 4 96之 语士 賦予拉伸力,抑或可撓部96抜指 肖除之狀‘⑯,均可抑制明顯之拉伸摩 力之發生。因此,可抑制伞吐道λ 呷應 制光作% 4 1 之不需要之變形,而抑 光k號之傳輸效率之下降。 又,藉由設置可撓部96,折料容易於光波導9 板2之間殘留間隙(夂 (…圖9 ),因此可防止光波導9與基 干擾因此gp便於重複進行折彎操 操作之情形時,亦可防止ά血盆4 于奶·考之 方止由與基板2之干擾引起的光波導9 之破壞。其結果,可谁一牛担t丄.甘 進步提尚光波導結構體1之耐靑曲 性、耐久性。 進而’藉由設置可撓部96’使得進行折f操作時施加 於手之力僅為主要於折彎基2時所產生之抗力,只要可 撓部96持續彎曲’則光波導9之抗力不會施加於手上。因 此’不但折f操作更加容易’而且幾乎不對錢導9產生 應力’故可提高耐久性。 33 201222034 又,藉由以各固定部81固定光波導9,可防止可撓部 96之恢復力直接波及發光元件3或受光元件4。因此,可 防止由於該恢復力而使該等元件受到破壞。 進而,於可撓部96之可撓量無需為如圖8所示之極少 量,亦可為可撓部96描成如具有半圓以上之周長之弧之程 度的可撓量《又,於該情形時,可將可撓部96捲繞在任意 軸上。 又,亦可不於光波導9設置可撓部96,而於基板2設 置可撓部。於該情形時,當以光波導結構體.丨之中央附近 向下方突出之方式(以下面為山折之方式)發生變形時, 可獲得上述作用 '效果。再者,設置於基板2之可撓部之 構成與上述可撓部96相同。 &lt;第7實施形態:圖1〇、ιι&gt; 於圖10、11分別表示本發明之光波導結構體丨之第7 實施形態。以下’對該光波導結構體丨進行說明,關於與 上述第5實施形態相同之事項,省略其說明,以不同點為 中心加以說明。 圖10為第7實施形態之剖面圖。 於本實施形態之光波導結構體1,固定部81之構成與 上述不同,其以外相同。 即,圖10所示之固定部81並非接著構件,而是藉由 設置於基板2之2個貫通孔23而構成。2個貫通孔23設置 於與上述第5實施形態中之固定部81相同之位置。並且, 藉由在各貫通孔23插入光波導9,使光波導9自基板2之 34 201222034 表側通過位於圖1 0之左側之貫通孔2 3,經配置於基板2之 裏側後’通過位於右側之貫通孔23再次配置於基板2之表 侧。如此以穿過基板2之表側與裏側之方式配置光波導9, 藉此使光波導9於各貝通孔23附近確實地固定於基板2。 並且,由於不使用接著構件等構件,而僅將光波導9插入 各貫通孔23來完成光波導9之固定’故可提高光波導結構 體1之結構之簡略化及製造容易性。 之長邊 細長之 圖11為圖10所示之光波導結構體1之平面圖 各貝通孔23於俯視時,形成具有沿著光波導9 方向之長軸的細長之形狀。若如此各貫通孔23形成 形狀,則於該各貫通孔23插入光波導9時,可無需將光波 導9以較小之曲率半徑折彎,而僅以摇成緩和之曲線之方 式彎曲來插人光波導9。其結果,可防止光波導9破裂或者 包覆層91、92與核心層93之間產生剝離。 進而,右各貫通孔23形成細長之形狀,則於光波導9 與各貫通孔23之間產生間隙。於對光波導結構體i進行折 彎操作之情形時,該間隙於錢導9與各貫通孔U之間長 邊方向之位置偏移變得容易H即便假設對光波導9 賦予拉伸力,亦可確實地防止產生明顯之拉伸應力。 再者’各貫通孔23之長軸之長度可根據光波導9之戸 度或基板2之厚度等而適當設定,於光波導9或基板2 : 厚之情形時,較佳為相對應地變長。 ▲又貫通孔23之個數及配置並無特別限定,可根據伴 隨折彎彳呆作之折寶部之位置等 寸叩迥田6又疋。例如,貫通孔 35 23 201222034 23之個數可為i個,亦可為3個以上。 丹考’於貫通子丨 4 之個數為奇數之情形時,只要使發光元件3及受一 相對於基板2之配置分別彼此表襄相反即可。〃件 又 員通孔23之配置較佳為不配置於令央附 更佳為以相對於光波導結構體1When the V* guide 9 has the flexible Q as shown in Fig. 8, the tensile force is given to the vocal of the optical waveguide 4 96, or the flexible portion 96 抜 refers to the shape of '16, which can suppress the obvious The occurrence of tensile force. Therefore, it is possible to suppress the unnecessary deformation of the umbrella channel λ 呷 制 制 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Further, by providing the flexible portion 96, the folding is easy to leave a gap (... FIG. 9) between the optical waveguide 9 plates 2, so that the optical waveguide 9 can be prevented from interfering with the base, so that the gp can be easily repeated for the bending operation. In the case of the case, it is also possible to prevent the damage of the optical waveguide 9 caused by the interference with the substrate 2 in the case of the blood test tube 4, and as a result, it is possible to improve the optical waveguide structure. The resistance to bending and durability of 1 is further improved by the provision of the flexible portion 96'. The force applied to the hand during the folding operation is only the resistance generated when the bending base 2 is mainly used, as long as the flexible portion 96 is provided. Continuous bending 'The resistance of the optical waveguide 9 is not applied to the hand. Therefore, 'not only the f operation is easier, but also hardly stresses the money guide 9', so the durability can be improved. 33 201222034 Also, by the fixed parts 81 fixing the optical waveguide 9 prevents the restoring force of the flexible portion 96 from directly affecting the light-emitting element 3 or the light-receiving element 4. Therefore, it is possible to prevent the elements from being damaged by the restoring force. Further, the flexible portion 96 can be prevented. The amount of deflection need not be as small as shown in Figure 8, or it can be The portion 96 is described as a flexible amount such as an arc having a circumference of a semicircle or more. Further, in this case, the flexible portion 96 may be wound on an arbitrary axis. Further, the flexible portion may not be provided with the flexible portion 96, the flexible portion is provided on the substrate 2. In this case, when the deformation is caused by the manner in which the vicinity of the center of the optical waveguide structure is protruded downward (in the form of a mountain fold below), the above-described effect can be obtained. Further, the configuration of the flexible portion provided on the substrate 2 is the same as that of the above-described flexible portion 96. <Seventh embodiment: Fig. 1A, Fig. 1 and Fig. 10 and Fig. 11 respectively show the optical waveguide structure of the present invention. In the seventh embodiment, the optical waveguide structure 丨 will be described below, and the description of the same matters as those in the fifth embodiment will be omitted, and the differences will be mainly described. Fig. 10 is a cross section of the seventh embodiment. In the optical waveguide structure 1 of the present embodiment, the configuration of the fixing portion 81 is the same as the above, and the fixing portion 81 shown in Fig. 10 is not a member but is provided on the substrate 2. The through holes 23 are formed. 2 The through hole 23 is provided at the same position as the fixing portion 81 in the fifth embodiment. Further, by inserting the optical waveguide 9 in each of the through holes 23, the optical waveguide 9 is passed from the front side of the substrate 2 to the front side of the substrate 2 at 201222034. The through hole 23 on the left side is disposed on the back side of the substrate 2 and then placed again on the front side of the substrate 2 through the through hole 23 located on the right side. Thus, the optical waveguide 9 is disposed so as to pass through the front side and the back side of the substrate 2, Thereby, the optical waveguide 9 is reliably fixed to the substrate 2 in the vicinity of each of the beacon holes 23. Further, since the optical waveguide 9 is inserted into each of the through holes 23 without using a member such as an adhesive member, the optical waveguide 9 is fixed. The structure of the optical waveguide structure 1 can be simplified and the ease of manufacture can be improved. The long side of the long side is elongated. Fig. 11 is a plan view of the optical waveguide structure 1 shown in Fig. 10. Each of the beacon holes 23 has an elongated shape having a long axis along the direction of the optical waveguide 9 in plan view. When the through holes 23 are formed in such a shape, when the optical waveguide 9 is inserted into each of the through holes 23, it is not necessary to bend the optical waveguide 9 with a small radius of curvature, and it is possible to bend only by bending into a gentle curve. Human optical waveguide 9. As a result, it is possible to prevent the optical waveguide 9 from being broken or peeling between the cladding layers 91, 92 and the core layer 93. Further, when the right through holes 23 are formed in an elongated shape, a gap is formed between the optical waveguide 9 and each of the through holes 23. In the case where the optical waveguide structure i is subjected to the bending operation, the gap is easily shifted in the longitudinal direction between the money guide 9 and each of the through holes U. Even if the tensile force is applied to the optical waveguide 9, It is also possible to surely prevent significant tensile stresses from occurring. Further, the length of the long axis of each of the through holes 23 can be appropriately set according to the twist of the optical waveguide 9, the thickness of the substrate 2, or the like. When the optical waveguide 9 or the substrate 2 is thick, it is preferably changed correspondingly. long. ▲The number and arrangement of the through-holes 23 are not particularly limited, and may be based on the position of the folding part that is accompanied by the bend. For example, the number of through holes 35 23 201222034 23 may be i or three or more. In the case where the number of the through-heads 4 is an odd number, the light-emitting elements 3 and the arrangement of the light-emitting elements 3 and the substrate 2 may be opposite to each other. The configuration of the member through hole 23 is preferably not disposed in the center of the member, and is preferably disposed in relation to the optical waveguide structure 1

Μ 透方向之中央而成A 對稱關係之方式進行配置。 為 〈第8實施形態:圖丨2 &gt; 於圖12表示本發明之光波導結構體ι之第8 態。以下,對該光波導結構體i進行說明,關於與上述第上 實施形態相同之事項1略其說明,以不同點為中心 說明。 圖12為第8實施形態之平面圖。 於本實施形態之光波導結構體丨,基板2之構成與上述 不同,其以外相同。 即,圖12所示之基板2於俯視時不與光波導9重疊, 具有互相偏移之部分。具有上述基板2之光波導結構體ι 於進行折彎操作時,可防止光波導9與基板2之干擾。因 此,進行折彎操作時光波導9難以受到損傷。 圖12( a)所示之基板2具有設置於中央附近之切口 24, 於設置該切口 24之部分’基板2之寬度較基板2之長邊方 向之兩多而部之寬度變窄。因此,於該部分,基板2之剛性 下降,故可更容易地折彎光波導結構體i。 又,切口 24係以俯視時與光波導9重疊之方式設置, 故於該部分,基板2與光波導9互相偏移。 36 201222034 另-方面’圖12(b)所示之基板2具有設置於中央附 近且沿著基2《長邊方向而形成之細長形狀之貫通孔 25。於設置該貫通孔25之部分,基板2之實f寬度仍較基 板2之長邊方向之兩端部之寬度變窄。 又,貫通孔25係以俯視時與光波導9重疊之方式設 置,故於該部分,基板2與光波導9互相偏移。 再者,士刀口 24及貝通孔25之形狀並無特別限定,例 如切口 24亦可分別設置於基板2之寬度方向之兩側。 &lt;第9實施形態:圖1 3 &gt; 於圖13表示本發明之光波導結構體丨之第9實施形 態。以下,對該光波導結構體丨進行說明,關於與上述第5 實施形態相同之事帛,省略其說明,以不同點為中心加以 說明。 圖13為第9實施形態之剖面圖。 於本實施形態之光波導結構體丨,配線基板之構成與上 述不同,其以外相同。 即’圖13戶斤#之配線基板具有可撓性基板之基板2、 分別積層於基板2之長邊方向之兩端部之下面之硬質硬質 基板即基板6、設置於基板2之下面之導體層5、及設置於 基板6之下面之導體層51。 於基板6形成有貫通孔,於貫通孔61内填充有導電 材料(例如銅、銅系合金、鋁、鋁系合金等各種金屬材料), 而形成導體柱62。該導體柱62與導體層5及導體層^電 連接。 37 201222034 基板6,只要為剛性大於基板2之絕緣性基板即可,例 如可列舉以紙、玻璃布、樹脂膜等作為基材,於該基材含 浸酚系樹脂、聚酯系樹脂、環氧系樹脂、氰酸酯樹脂、聚 醯亞胺系樹脂、氟系樹脂等樹脂材料而成者。 具體而言,可列舉:玻璃布一環氧覆銅積層板等玻璃 基材覆銅積層板、或玻璃不織布—環氧覆銅積層板等複合 銅V#積層板中所使用之絕緣基板’此外亦可列舉:聚謎醯 亞胺樹脂基板、聚醚酮樹脂基板、聚砜系樹脂基板等耐熱、 熱塑性之有機系硬質基板、或氧化鋁基板、氮化鋁基板、 碳化石夕基板等陶瓷系硬質基板。 又,基板6之平均厚度並無特別限定,較佳為3〇〇 &quot; m配置 Configure the A-symmetric relationship in the center of the direction. <Eighth Embodiment: Fig. 2 &gt; Fig. 12 shows an eighth state of the optical waveguide structure ι of the present invention. Hereinafter, the optical waveguide structure i will be described, and the same matters as those of the above-described first embodiment will be briefly described, and the differences will be mainly described. Figure 12 is a plan view showing an eighth embodiment. In the optical waveguide structure 本 of the present embodiment, the configuration of the substrate 2 is the same as the above, and the other configurations are the same. That is, the substrate 2 shown in FIG. 12 does not overlap the optical waveguide 9 in plan view, and has a portion that is offset from each other. When the optical waveguide structure having the substrate 2 described above is subjected to a bending operation, interference between the optical waveguide 9 and the substrate 2 can be prevented. Therefore, the optical waveguide 9 is hard to be damaged when the bending operation is performed. The substrate 2 shown in Fig. 12(a) has a slit 24 provided near the center, and the portion of the substrate 2 provided with the slit 24 has a width wider than that of the substrate 2 in the longitudinal direction. Therefore, in this portion, the rigidity of the substrate 2 is lowered, so that the optical waveguide structure i can be bent more easily. Further, since the slit 24 is provided so as to overlap the optical waveguide 9 in plan view, the substrate 2 and the optical waveguide 9 are offset from each other in this portion. 36 201222034 Another aspect The substrate 2 shown in Fig. 12(b) has an elongated hole 25 formed in the vicinity of the center and formed along the longitudinal direction of the base 2. In the portion where the through hole 25 is provided, the solid f width of the substrate 2 is still narrower than the width of both end portions in the longitudinal direction of the substrate 2. Further, since the through hole 25 is provided so as to overlap the optical waveguide 9 in plan view, the substrate 2 and the optical waveguide 9 are offset from each other in this portion. Further, the shape of the knife edge 24 and the billet hole 25 is not particularly limited, and for example, the slits 24 may be respectively provided on both sides in the width direction of the substrate 2. &lt;Ninth Embodiment: Fig. 13 &gt; Fig. 13 shows a ninth embodiment of the optical waveguide structure 本 of the present invention. In the following, the optical waveguide structure 丨 will be described, and the description of the same as the fifth embodiment will be omitted, and the description will be focused on the differences. Figure 13 is a cross-sectional view showing a ninth embodiment. In the optical waveguide structure 本 of the present embodiment, the configuration of the wiring board is different from the above, and the same applies to the other. In other words, the wiring board of Fig. 13 has a flexible substrate, the substrate 6 which is laminated on the lower surface of both ends of the substrate 2, and the substrate 6 which is disposed under the substrate 2. The layer 5 and the conductor layer 51 disposed under the substrate 6 are provided. A through hole is formed in the substrate 6, and a conductive material (for example, various metal materials such as copper, a copper alloy, aluminum, or an aluminum alloy) is filled in the through hole 61 to form a conductor post 62. The conductor post 62 is electrically connected to the conductor layer 5 and the conductor layer. 37 201222034 The substrate 6 may be an insulating substrate having a rigidity greater than that of the substrate 2, and examples thereof include paper, glass cloth, and a resin film as a base material, and the base material is impregnated with a phenol resin, a polyester resin, or an epoxy resin. A resin material such as a resin, a cyanate resin, a polyimide resin, or a fluorine resin. Specifically, a glass substrate copper-clad laminate such as a glass cloth-epoxy copper-clad laminate or an insulating substrate used in a composite copper V# laminate such as a glass non-woven fabric or an epoxy copper-clad laminate is used. Examples thereof include a heat-resistant and thermoplastic organic hard substrate such as a polymylon resin substrate, a polyether ketone resin substrate, and a polysulfone resin substrate, or a ceramic substrate such as an alumina substrate, an aluminum nitride substrate, or a carbonized carbide substrate. Hard substrate. Further, the average thickness of the substrate 6 is not particularly limited, and is preferably 3 〇〇 &quot; m

〜3mm左右,更佳為設為5〇〇&quot;m 之基板6成為具有充分之剛性者。 板而成之多層基板(増層式基板) 板之層間含有經圖案化之導電層 路。藉此,即便基板6為小面積 進而,基板6可為1片基板,亦可為積層複數層之基 路。藉此,It is preferably about 3 mm, and more preferably, the substrate 6 of 5 〇〇&quot;m becomes sufficiently rigid. The multi-layer substrate (layered substrate) of the board contains a patterned conductive layer between the layers of the board. Thereby, even if the substrate 6 has a small area, the substrate 6 may be a single substrate, or may be a substrate in which a plurality of layers are laminated. With this,

操作,另一 一方面於兩端部難 。於該情形時,於多層基 ’亦可形成任意之電氣電 ,亦可於内部構築複雜之 ’光波導結構體丨之長 對較高之硬質部丨丨。另一方 結構體1之長邊方向之中央附 ,故成為可撓性相對較高之可 體1於中央附近容易進行折彎 以折考。其結果,可防止設置 38 201222034 於光波導結構體1之兩端部之發光元件3及受光元件4伴 隨折彎操作而脫落或破壞。 &lt;第10實施形態:圖14&gt; 於圖14表示本發明之光波導結構體1之第1 〇實施形 態。以下,對該光波導結構體丨進行說明,關於與上述第9 實施形態相同之事項’省略其說明,以不同點為中心加以 說明。 圖14為第10貫施形態之剖面圖。 於本實施形態之光波導結構體丨,配線基板之構成與上 述不同,其以外相同。 即,圖14所示之配線基板具有:可撓性基板之基板2、 刀別積層於基板2之長邊方向之兩端部之上面及下面各為3 片之硬質之硬質基板即基板6、設置於基板2之下面之導體 ^ 5叹置於最上層之基板6之上面的導體層51及設置於 最下層之基板6之下面的導體層51。 光波導結構體1之長邊方向之兩端部設置有基板6,故 成為剛性相對較高之硬質部u。另一方面,未設置基板6 之光波導結構^ i之長邊方向之中央附近仍然維持基板2 可撓性,故成為可撓性相對較高之可撓部12。 具體而言’硬質部n係由自下方依序積層:於下面具 導體層51之基板6、於下面具備導體層5之基板2、基 二6'光波導9、於上面具備導體層51之基板6而成的積 均體構成。因此’藉由3片基板6可進—步增大硬質部H 之剛性。 39 201222034 —又於圖14之左側之硬質部^裝載表面安裝型之發光 元件3丨驅動發光元件3之發光的發光用I。 氣元件)35。發光元件3與 九用電 赏元用儿之35之間係經由導 體層51而電連接。藉此,可藉由發光用1C之35控制發光 兀件3之發光。即,於左側之硬質部i&quot;冓築具有發光元件 3與發光用1C之35之發光電路3〇〇。 &lt;另一方面’於圖14之右側之硬質部11裝載表面安裝型 &amp;光元件4、及藉由文光元件4而接受之信號增幅的受光 用1C (受光用電氣元件)45。受光元件4與受光用^之Operation, on the other hand, is difficult at both ends. In this case, any electric power can be formed in the multilayer base, and a complicated 'optical waveguide structure' can be internally constructed to have a relatively high hardness. Since the other side of the structure 1 is attached to the center in the longitudinal direction, the flexible body 1 having a relatively high flexibility is easily bent in the vicinity of the center to be folded. As a result, it is possible to prevent the light-emitting element 3 and the light-receiving element 4 which are disposed at both end portions of the optical waveguide structure 1 from being detached or broken by the bending operation. &lt;Tenth Embodiment: Fig. 14&gt; Fig. 14 shows a first embodiment of the optical waveguide structure 1 of the present invention. In the following, the optical waveguide structure 丨 will be described, and the same matters as those in the ninth embodiment will be omitted, and the differences will be mainly described. Figure 14 is a cross-sectional view showing a tenth embodiment. In the optical waveguide structure 本 of the present embodiment, the configuration of the wiring board is different from the above, and the same applies to the other. In other words, the wiring board shown in FIG. 14 includes a substrate 2 of a flexible substrate, and a substrate 6 which is a rigid hard substrate which is formed on the upper surface and the lower surface of both ends of the substrate 2 in the longitudinal direction. The conductor layer 5 disposed under the substrate 2 is placed on the conductor layer 51 above the uppermost substrate 6, and the conductor layer 51 disposed on the lower surface of the substrate 6 below. Since the substrate 6 is provided at both end portions in the longitudinal direction of the optical waveguide structure 1, the hard portion u having a relatively high rigidity is formed. On the other hand, in the vicinity of the center in the longitudinal direction of the optical waveguide structure ji in which the substrate 6 is not provided, the flexibility of the substrate 2 is maintained, so that the flexible portion 12 having a relatively high flexibility is obtained. Specifically, the 'hard portion n' is formed by sequentially stacking the substrate 6 on the lower mask conductor layer 51, the substrate 2 having the conductor layer 5 on the lower surface, the base 6' optical waveguide 9, and the conductor layer 51 on the upper surface. The substrate 6 is formed by a uniform body. Therefore, the rigidity of the hard portion H can be further increased by the three substrates 6. 39 201222034 - The hard part on the left side of Fig. 14 is mounted on the surface mount type of light-emitting element 3 to drive the light-emitting I of the light-emitting element 3. Gas element) 35. The light-emitting element 3 and the light-receiving element 35 are electrically connected via the conductor layer 51. Thereby, the light emission of the light-emitting element 3 can be controlled by the light-emitting 1C 35. In other words, the hard portion i&quot; on the left side has a light-emitting circuit 3 that has the light-emitting element 3 and the light-emitting 1C 35. &lt;On the other hand, the hard portion 11 on the right side of Fig. 14 is provided with a surface mount type &amp; optical element 4, and a light receiving 1C (light receiving electric element) 45 which is received by the light element 4. Light-receiving element 4 and light-receiving

Γ之間係經由導體層51而電連接。藉此,藉由受光元件4 受光並轉換成電氣信號後,將該電氣信號輸人至受光用IC 之45。即’於右側之硬質部u構築具有受光元件4與受光 用1C之45之受光電路4〇〇。 以上述方式於發光電路3〇〇與受光電路4〇〇之間進行 光通信》 又,於各硬質部11形成於厚度方向貫通其之貫通孔 於貝通孔61内填充導電材料,而形成導體柱62。該導 體柱62分別與導體層5及各導體層$ 1電連接。 於上述各硬質部丨丨,剛性較大,故對光波導結構體】 進行折奢操作時,硬質部11難以折彎,因此可防止發光電 路300或受光電路4〇〇之破壞。 “ 進而’於最上層之2片之基板6,對準發光元件3之發 光。卩3 1之位置及受光元件4之受光部41之位置而分別設 置貫通孔63。 201222034 又光波導9中’於對應於各貫通孔63之正下方之位 置分別形成光程轉換部97。 各光程轉換部97係以藉由去除光波導9之一部分,而 具有去除部分之内面之一部分相對於光波導9之核心部94 之軸線大致呈45。傾斜之傾斜面的方式形成。該傾斜面作為 如下反射面而發揮功能:以90。之角度進行反射,以使來自 發光部31之光導入核心部94,或者以9〇。之角度進行反射, 以使傳播於核心部94之光導入受光部4 j。 又,各貫通孔63係將來自發光部31之光導入光程轉 換部97’或者將來自光程轉換部97之光導入受光部41的 光5虎通過區域而發揮功能。 藉由如上之2個光程轉換部97及2個光信號通過區域 (貫通孔63),使發光部31與受光部41之間光學連接。 另-方面’於可撓部12’使於下面具備導體層5之美 及光波導9㈣基板6之厚度之間隙自下方依序酉土己 置。、即’可挽部12係由光波導9構成之可撓部、與基板2 構成之可撓部,2個可撓部構成。 於上述可撓部 ^i ^』训·雩操作 可防止光波導9與基板2之干擾, 傷 馊而防止光波導9受至 又, 述構成, 件接著, &lt;第 則1 可二部二之一者僅由光波導9所構成。若為 I禮光料9之兩端部以外之 :可確實::止伴㈣ 11貫轭形態:圖15、 201222034 於圖15、16表示本發明之光波導結構體t之第u實施 形態。以下,對該光波導結構體丨進行說明,關於The turns are electrically connected via the conductor layer 51. Thereby, the light receiving element 4 receives light and converts it into an electrical signal, and then the electrical signal is input to the light receiving IC 45. In other words, the light receiving portion 4 having the light receiving element 4 and the light receiving 1C 45 is constructed in the hard portion u on the right side. In the above-described manner, optical communication is performed between the light-emitting circuit 3A and the light-receiving circuit 4A. Further, a conductive material is filled in the through-holes 61 in the through-holes through which the hard portions 11 are formed in the thickness direction, thereby forming a conductor. Column 62. The conductor posts 62 are electrically connected to the conductor layer 5 and the respective conductor layers $1, respectively. In each of the hard portions, the rigidity is large. Therefore, when the optical waveguide structure is subjected to a folding operation, the hard portion 11 is hard to be bent, so that the light-emitting circuit 300 or the light-receiving circuit 4 can be prevented from being broken. Further, the two substrates 6 on the uppermost layer are aligned with the light-emitting elements 3. The through holes 63 are respectively provided at the positions of the 卩3 1 and the positions of the light-receiving portions 41 of the light-receiving elements 4. 201222034 In the optical waveguide 9 The optical path conversion portion 97 is formed at a position directly below each of the through holes 63. Each of the optical path conversion portions 97 is formed by removing a portion of the optical waveguide 9 and having a portion of the inner surface of the removed portion with respect to the optical waveguide 9 The axis of the core portion 94 is substantially 45. The inclined surface is formed as an inclined surface that functions as a reflection surface that reflects at an angle of 90 to introduce light from the light-emitting portion 31 into the core portion 94. Alternatively, the light is reflected at an angle of 9 导入 so that the light propagating through the core portion 94 is introduced into the light receiving portion 4 j. Further, each of the through holes 63 introduces light from the light emitting portion 31 into the optical path converting portion 97' or from the light. The light of the light conversion unit 97 is introduced into the light passing portion of the light receiving unit 41. The light emitting unit 31 and the light receiving unit are provided by the two optical path converting units 97 and the two optical signal passing regions (through holes 63). The portions 41 are optically connected. On the other hand, in the flexible portion 12', the gap between the thickness of the conductor layer 5 and the thickness of the optical waveguide 9 (four) substrate 6 is sequentially set from the bottom to the bottom of the substrate. That is, the handleable portion 12 is composed of the optical waveguide 9. The flexible portion and the flexible portion formed by the substrate 2 are configured by two flexible portions. The flexible portion can prevent interference between the optical waveguide 9 and the substrate 2, and prevent light from being damaged by the flexible portion. The waveguide 9 is subjected to the configuration described above, and then, the first one can be composed of only the optical waveguide 9. If it is the both ends of the I glazing material 9, it can be confirmed: Fig. 15 and 201222034 show the u-th embodiment of the optical waveguide structure t of the present invention in Figs. 15 and 16. Hereinafter, the optical waveguide structure 丨 will be described.

第1實施形態相同之事項,省略盆爷日日 ^ &lt;L '、覘明,以不同點為中心 加以說明。 圖1 5為第11貫施形態之平面圖。 於本實施形態之光波導結構體i中,配線基板之構成 與上述不同,其以外相同。 即’圖15所示之配線基板包含基板2、自基板2之長 邊方向之-端配設至另-端為…根第i電氣配線(導 體層)52。 於各第!電氣配線52之兩端部分別設置電極焊塾 551,而構成電氣通信用外部連接端子55匕。 又,於基板2之左側端部設置發光電路3〇〇,另一方面, 於右側端部設置受光電路400。於發光電路3〇〇與受光電路 400之間設置光波導9。 發光電路300具有鄰接配置於基板2上之發光元件3 及發光用35、及電連接該等之間之g 3電氣配線53。 同樣地,受光電路400具有鄰接配置於基板2上之受 光元件4及受光用1(:之45、及電連接該等之間之第3電氣 配線5 3。 自發光電路300至基板2之左端為止配設4根第2電 氣配線(導體層)54,於其端部分別設置電極焊塾⑸。同 樣地,自受光電路400至基板2之右端為止配設4根第2 電氣配線(導體層)54’於其端部分別設置電極焊墊551。 42 201222034 藉由該等各電極焊墊而構成光通信用外部連接端子55a。再 者’各電極焯墊5 5 1沿著各端面排列。 該等各端子中,位於基板2之左端之電氣通信用外部 端子55b與光通信用外部連接端子55a 一併構成第i端子部 55,位於基板2之右端之電氣通信用外部端子55b與光通 信用外部連接端子55a 一併構成第2端子部55,。 於上述光波導結構體1,於第丨端子部與第2端子 部55,之間不但可進行光通信,而且亦可同時進行電氣通 信。因此,可使電路設計之自由度得到飛躍地提高,而提 高電路之積體度。'亦一併具有無需另外準備電氣通信用之 結構體之優點。 又,各第1電氣配線52與發光電路3〇〇及受光電路4〇〇 電氣刀離,故難以爻該等電路產生之雜訊之影響。因此, 可以各第1電氣配線52進行可靠性較高之電氣通信。 再者,於本實施形態,光通信用外部連接端子55a、光 波導9、發光電路3〇〇及受光電路4〇〇配置成直線狀。上述 構成之光波導結構冑i例如可為用於對向配置之電路間之 連接者。 圖16為第11實施形態之剖面圖。 如圖16所示,構成發光電路3〇〇之發光元件3、發光 用1C之35及第3電氣配線53由樹脂模具34所覆蓋。同 樣',構成受光電路400之受光元件4、受光用伙及第 3電氣配線53由樹脂模具44所覆蓋。 藉由设置上述樹脂模具34、44,可形成發光電路 43 201222034 及受光電路400未露出至外部而經封閉之結構,故可保嗜 發光電路300及受光電路400免受污染、損傷、氧化等°。 其結果,各電路之可靠性得到提高。 &lt;第1 2實施形態:圖1 7 &gt; 於圖17表示本發明之光波導結構體丨之第12實施形 態。以下,對該光波導結構體丨進行說明,關於與上述第 Π實施形態相㈤之事項,省略其說明,以不同點為中心加 以說明。 圖17為第12實施形態之平面圖。 於本實施形態之光波導結構體!中,第i端子部乃及 第2端子部55’之構成與上述不同,其以外相同。 即,圖17所示之第1端子部55及第2端子部55•並未 設置於基板2之長邊方向之端面附近,而是設置於長邊方 向之端部之側面側。具體而言,構成圖17所示之第1端子 部Μ之各電極焊塾551沿著基板2之左側端部之側端面而排 列。同樣地,構成圖丨7所示之第2端子部55,之各電極焊 塾551沿著基板2之右側端部之寬度方向之側端面排列。 再者,各電極焊墊551之配置並不限定於圖17之配 置,例如構成第2端子部55,之各電極焊墊55丨亦可沿著與 圖1 7為相反側之側端面而排列。 -進而,各第1電氣配線52亦可並非設置於與光波導9 為同面上,而經由基板2設置於光波導9之背面側。In the same manner as in the first embodiment, the day of the pottery day &lt;L' and the description of the pot are omitted, and the differences will be mainly described. Figure 15 is a plan view of the eleventh embodiment. In the optical waveguide structure i of the present embodiment, the configuration of the wiring board is different from the above, and the other configurations are the same. That is, the wiring board shown in Fig. 15 includes the substrate 2, and the end from the end in the longitudinal direction of the substrate 2 is disposed to the other end as the i-th electrical wiring (conductor layer) 52. In each of the first! Electrode pads 551 are provided at both ends of the electric wiring 52 to constitute an external connection terminal 55 for electric communication. Further, a light-emitting circuit 3 is provided on the left end portion of the substrate 2, and a light-receiving circuit 400 is provided on the right end portion. An optical waveguide 9 is provided between the light-emitting circuit 3A and the light-receiving circuit 400. The light-emitting circuit 300 has a light-emitting element 3 and a light-emitting element 35 disposed adjacent to the substrate 2, and a g 3 electric wiring 53 electrically connected between the light-emitting elements. Similarly, the light-receiving circuit 400 has the light-receiving element 4 and the light-receiving 1 disposed on the substrate 2 (the 45, and the third electrical wiring 53 electrically connected between the two). The left end of the self-illuminating circuit 300 to the substrate 2 Four second electric wires (conductor layers) 54 are disposed, and electrode pads (5) are provided at the ends thereof. Similarly, four second electric wires (conductor layers) are disposed from the light receiving circuit 400 to the right end of the substrate 2 54' is provided with electrode pads 551 at the ends thereof. 42 201222034 The external communication terminals 55a for optical communication are formed by the electrode pads, and the respective electrode pads 5 5 1 are arranged along the respective end faces. Among the terminals, the electrical communication external terminal 55b located at the left end of the substrate 2 and the optical communication external connection terminal 55a constitute the i-th terminal portion 55, and the electrical communication external terminal 55b located at the right end of the substrate 2 communicates with the optical communication. The second terminal portion 55 is formed by the external connection terminal 55a. In the optical waveguide structure 1, not only optical communication but also electrical communication can be performed between the second terminal portion and the second terminal portion 55. Therefore, electricity can be made The degree of freedom in design is drastically improved, and the degree of integration of the circuit is improved. 'There is also an advantage that it is not necessary to separately prepare a structure for electrical communication. Moreover, each of the first electric wiring 52 and the light-emitting circuit 3 is light-receiving and receiving light. Since the circuit 4 is separated from the electric knife, it is difficult to affect the noise generated by the circuits. Therefore, the first electric wiring 52 can perform highly reliable electrical communication. Further, in the present embodiment, the optical communication is used. The external connection terminal 55a, the optical waveguide 9, the light-emitting circuit 3A, and the light-receiving circuit 4A are arranged in a straight line. The optical waveguide structure 胄i having the above configuration can be, for example, a connector for the circuit arranged in the opposite direction. The cross-sectional view of the eleventh embodiment. As shown in Fig. 16, the light-emitting element 3 constituting the light-emitting circuit 3, the light-emitting 1C 35, and the third electric wiring 53 are covered by the resin mold 34. Similarly, the light-receiving circuit is constructed. The light-receiving element 4, the light-receiving partner, and the third electric wiring 53 are covered with the resin mold 44. By providing the resin molds 34 and 44, the light-emitting circuit 43 201222034 and the light-receiving circuit 400 are not exposed to the outside. Since the structure is closed, the light-emitting circuit 300 and the light-receiving circuit 400 can be protected from contamination, damage, oxidation, etc. As a result, the reliability of each circuit is improved. <1st Embodiment> Fig. 1 7 &gt; Fig. 17 shows a twelfth embodiment of the optical waveguide structure according to the present invention. Hereinafter, the optical waveguide structure 丨 will be described, and the description of the fifth embodiment with respect to the above-described third embodiment will be omitted, and the difference will be centered on Fig. 17 is a plan view showing a twelfth embodiment. In the optical waveguide structure of the present embodiment, the configuration of the i-th terminal portion and the second terminal portion 55' is different from the above. In other words, the first terminal portion 55 and the second terminal portion 55• shown in Fig. 17 are not provided in the vicinity of the end surface in the longitudinal direction of the substrate 2, but are provided on the side surface side of the end portion in the longitudinal direction. Specifically, the electrode pads 551 constituting the first terminal portion 所示 shown in Fig. 17 are arranged along the side end faces of the left end portions of the substrate 2. Similarly, each of the electrode pads 551 constituting the second terminal portion 55 shown in Fig. 7 is arranged along the side end surface in the width direction of the right end portion of the substrate 2. Further, the arrangement of the electrode pads 551 is not limited to the arrangement of FIG. 17, and for example, the second terminal portions 55 may be formed, and the electrode pads 55A may be arranged along the side end faces on the opposite sides to those in FIG. . Further, each of the first electric wires 52 may be provided not on the same surface as the optical waveguide 9 but on the back side of the optical waveguide 9 via the substrate 2 .

上之光波導結構體1例如為對連接平面上之2點間 有用之結構體。 …B 44 201222034 &lt;第1 3實施形態:圖1 8 &gt; 於圖18表不本發明之光波導結構體1夕楚μ 一 |丹肋· i &lt;笫13實施形 態。以下,對該光波導結構體1進行說明,關於與上述第 u實施形態相同之事項,省略其說日月,以*同點為中心加 以說明。 圖1 8為第1 3實施形態之剖面圖。 於本實施形態之光波導結構體丨,配線基板之構成與上 述不同,其以外相同。 即,圖18所示之配線基板係由具有複數層之基板2與 設置於層間或層表面之導體層的積層基板(多層基板)構 成。又,於基板2形成有貫通孔2卜於貫通孔幻内填充有 導電材料’而形成導體柱22。 設置於積層基板之層間或下面之導體層5係經圖案介 者,可形成任意之電氣電路。藉此,與基板2為i層 形相比,可提高形成於配線基板上之電氣電路之積體度。 〈第14實施形態:圖23〜25&gt; 圖23係表示本發明之光波導結構體之第μ實施形雜 的剖面圖’圖24為圖23所示之光波導之斜視圖,圖則 表示圖23所示之紐導之核心層的平面圖。再者,於以下 說明中’將圖23中之上側設為「上」,下側設為「下」。又 圖23、24誇張描繪層之厚度方向(各圖之上下方向 如圖23所示,本發明之光波導結構體職 板臟、設置於基板_2之下面之導體層⑽广 基板觀上之發Μ件⑽及受光元件刪 發 45 201222034 光元件1003之發光部1031與受光元件1004之受光部ι〇4ΐ 之間的光波導1009。以基板1002與導體層i〇〇5構成配線 基板。 光波導1009係自圖24中下側依序積層包覆層(下側 包覆層)1091、核心層1093及包覆層(上側包覆層)1〇92 而成之帶狀者,於核心層1093形成有沿著形成帶狀之光波 導1009之長邊方向而設定的細長之特定圖案之核心部 與包覆部1095。核心部1094係形成傳輸光之光程之部分, 包覆部1095係雖形成於核心層1〇93但不形成傳輸光之光 程,而發揮與包覆層1091、1〇92相同之功能之部分。 核心層1093之構成材料,可為藉由光(例如紫外線) 之照射或藉由進一步加熱而改變折射率之材料。上述材料 之較佳例,可列舉以含有苯環丁烯系聚合物、降莰烯系聚 合物(樹脂)等環烯系樹脂之樹脂組成物作為主材料者, 尤佳為含有降莰烯系聚合物(作為主材料)者。 由上述材料所構成之核心層1〇93對彎曲等變形之耐性 優異,尤其是,即便於重複彎曲變形之情形時,亦難以產 生核心部1094與包覆部1095之剝離、或核心層1〇93與鄰 接之層(包錢1091、1092)之層間剝離,而防止於核心 部1094内或包覆部1〇95内產生微裂痕。其結果,可維持 光波導1009之光傳輸性能,而獲得耐久性優異之光波 1009 。 ' 又,於核心層1〇93之構成材料中例如亦可含有抗氧化 劑、折射率調整劑 '塑化劑、增黏劑、加強劑、增感劑、 46 201222034 /k ^ 者助劑及難燃劑等添加劑。抗氧介句 之添加有提高高溫穩定性、提古 匕训 里&quot; r “耐候性、抑制光劣化之效 果。上述抗氧化劑,例如可列舉單紛系、雙/ 等酚系、或芳香族胺系者。又,萨 。二酚糸 錯甶添加塑化劑、增黏劑、 加強劑,亦可進一步增大對彎曲之耐性。 上述抗氧化劑所代表之添加劑之含有率(於2種以上 之情形時為合計)相對於核心層1〇9 構成材料總體,較 佳為0.5〜40重量%左右,更佳A 平乂 文住馮3〜30重量%左右。若咳 量過少’則無法充分發揮添加劑之功能,#量過 二 根據添加劑之種類或特性’而有產生於核心部1〇94中傳 之光(傳輸光)之穿透率下降、圖宰化 ' 定等之虞。 ㈣化不良、折射率不穩 核心層1093之形成方法,可列舉塗佈法。塗佈法,可 列舉塗佈核心層形成用組絲(清漆等)並使立硬化(固 化)之方法、及塗佈具有硬化性之單體組成物並使其硬化 (固化)之方法。X,亦可採用塗佈法以外之方法例如接 合另外製造之片材之方法。 使用遮罩’對以上述方式所得之核心層则選擇性地 照射光(活性放射線),而使所欲形狀之核心部ι〇94圖案 化。 ·’、 用於曝光之光,可列舉可見光、紫外光、紅外光、雷 射光等活性能量光線。又’亦可不使用光’而使用X射線 等電磁波、或電子束等粒子射線。 於核心層1〇93中,經光照射之部位之折射率下降,與 47 201222034 未經光照射之部位間產生折射率差。例如,核心層則之 經光照射之部位成為包覆部1095,未經照射之部位成為核 心部難。包覆部1095之折射率與包覆層ι〇9ι、刪之 折射率大致相等。 又,亦有藉由以特定之圖案對核心層1〇93照射光後, 進行加熱而形成核心部1G94之情形。藉由附加該加執步 驟,可進-步增大核心部1094與包覆部1〇95之折射率差, 故而較佳。再者,關於該原理等,以下將作詳細闡述。 如圖24所示,所形成之核心部1094之圖案形狀係由 寬度朝左側端冑(長邊方向之_端部)連續變大之加寬部 分(擴張部分)1941、寬度朝右側端部(長邊方向之另一 端部)連續變小之減寬部分(縮小部分)1942、及設置於 該等加寬部分丨941與減寬部分1942之間且寬度—定之等 寬部分所構成。另一方面,如圖23所示,形成核心 部urn之核心層1093之厚度一定。因此,24所示之加 寬部分1941 &amp;核心部1094之橫剖面積朝左側端部連續變 大之部分,減寬部分1942為核心部1〇94之橫剖面積朝右 側端部連續變小之部分。進而,等寬部分194〇為核心部刪 之橫剖面積一定之部分。 核心部1094之圖案形狀除了上述加寬部分1941及減 分1942以外,亦可為具有弯曲部之形狀、具有分支部、 合流部或交又部之形狀、或組合有該等中之2種以上之形 狀等任意形狀者。再者,本發明之特徵在於,於該等圖案 之形成中,藉由設定光之照射圖帛,可容易地實現任意圖 48 201222034 案形狀。 關於光波導1 009之各部之構成材料及核心部丨〇94之 形成方法等,以下將作詳細闡述。 基板1 002為具有可撓性及絕緣性之可撓性基板。 基板1002之構成材料,例如可列舉:環氧樹脂、酚樹 脂、雙順丁稀二醯亞胺樹脂、雙順丁稀二酿亞胺—三口井樹 ::、二唑樹月旨、聚三聚氰酸酯樹脂、聚異三聚氰酸酯樹脂、 苯環丁烯樹脂、聚醯亞胺樹脂、聚苯并口号唑樹脂、降莰烯樹 脂等。又,該等材料可單獨使用,亦可混合複數種而使用。 又’基板1002亦可為複數層之積層體。例如可列舉將 由相同組成(種類)之樹脂材料構成之第ι層與第2層積 =將分別由不同組成(種類)之樹脂材料構成 …第2層積層而成者。再者,於 當然並不限定於此。 體之層構成 基板1002之厚度並無特別限定,通常較 :右,更佳為丨。〜…m左右。若基請2之厚度::: 範圍内’則光波導結構體1成為具有充分之可撓:者“ 基板所具有之可挽性為例 之程度者。具體而言,基板⑽2之揚氏模數^:地相 數)較佳^ 爾八悮致(拉伸彈性模 数)車义佳為於一般室溫環境下(2〇 左右,更佳為2〜l2GPa左右。 與基板1002之下面接合之導體層ι〇 特-之形狀,而構成所欲之配線或電 案化成 成材料,例如可列I# t / 體層1005之構 列舉銅 '銅系合金、銘、叙系合金等各種 49 201222034 金屬材料4體層i005之厚度並無特別限定,通常較佳 3〜12〇心左右,更佳為5〜70口左右。 導體層1005例如可藉由金屬落之接合(接著)、金屬 鍍敷4鍍、濺鍍等方法而形成。對導體層1〇〇5之圆案化 例如可使用蝕刻、印刷、遮罩等方法。 方面於基板1002形成有貫通孔丨〇21,於貫通孔 内填充有導電材料(例如銅'銅系合金K系合 金等各種金屬材料)’而設置導體柱1022。該導體柱1〇22 與導體層1005及基板讀之上面側電連接。 發光7L件1003具有基台1〇3〇、固定於基台之表 面的毛光部1031、連接發光部1031之電極焊墊與基台1030 之電極焊墊的金屬線1032、及設置於基台1030之下面且用 、,使發光彳1〇3 1與外部電路連接之外部電極1〇33。又,發 光# 1031及金屬、線1〇32被於基台1〇3〇之表面堆成半球狀 之樹脂模具1034所覆蓋。 右對外部電極1033通電,則發光部1〇31發光。 發光元件1003係以外部電極1〇33與導體柱1〇22接合 (電連接)之方式裝載於基板1002上。 另一方面,受光元件1〇〇4具有基台1〇4〇、固定於基台 104〇之表面的受光部1G41、連接受光部1G41之電極焊塾 與基台1040之電極焊墊的金屬線1〇42、及設置於基台ι〇4〇 ^下面且用以使受光部麗與外部電路連接之外部電極 1〇43。又,受光部1041及金屬線1042被於基台1〇4〇之表 面堆成半球狀之樹脂模具1 044所覆蓋。 50 201222034 若受光部1041接受光信號,則轉換成電氣信號,而自 外部電極1043輸出。 受光元件1004係以外部電極1〇43與導體柱1〇22接合 (電連接)之方式裴載於基板1〇〇2上。 再者,於發光元件1003中之發光部1〇31及於受光元 件urn中之受光部1041除了分別由&quot;固發光點或i個受 光點構成以外,亦可為集合有複數個發光點或受光點。集 合有複數個發光點或受光點者,例如可列舉發光點或受光 點配置成列狀(例如發光點或受光點為1χ4個、ΐχΐ2旬 或行列狀(例如發光點或受光點為nxm個:η、爪為2以上 之整數)者、或複數個發光點或受光點不規則地(⑽— 地配置者等。 樹脂模具1034於發光元件_之基台1〇3〇之右側封 閉發光部1G31等。藉此,可形成發光部1()31未露出至外 部而經封閉之結構,故可保護發光部1〇31免受污染、損傷、 氧化等。其結果,可提高發光元件i 〇〇3之可靠性。The upper optical waveguide structure 1 is, for example, a structure that is useful between two points on the connection plane. ...B 44 201222034 &lt;Third Embodiment 3: Fig. 1 8 &gt; Fig. 18 shows the optical waveguide structure 1 of the present invention, and the rib 13 is implemented. Hereinafter, the optical waveguide structure 1 will be described, and the same matters as those of the above-described fifth embodiment will be omitted, and the same point will be omitted. Fig. 18 is a cross-sectional view showing a third embodiment. In the optical waveguide structure 本 of the present embodiment, the configuration of the wiring board is different from the above, and the same applies to the other. That is, the wiring board shown in Fig. 18 is composed of a laminated substrate (multilayer substrate) having a plurality of substrates 2 and a conductor layer provided on the interlayer or the surface of the layer. Further, a through hole 2 is formed in the substrate 2, and a conductive material is filled in the through hole, and the conductor post 22 is formed. The conductor layer 5 disposed between or under the layers of the laminated substrate is patterned to form an arbitrary electrical circuit. Thereby, the degree of integration of the electric circuit formed on the wiring board can be improved as compared with the case where the substrate 2 is i-layered. Fig. 23 is a cross-sectional view showing a first embodiment of the optical waveguide structure of the present invention. Fig. 24 is a perspective view of the optical waveguide shown in Fig. 23, and Fig. A plan view of the core layer of the guide shown in Fig. 23. In the following description, the upper side in Fig. 23 is set to "up" and the lower side is set to "down". 23 and 24, the thickness direction of the layer is exaggerated (the upper and lower directions of each figure are as shown in FIG. 23, and the optical waveguide structure of the present invention is dirty, and the conductor layer (10) disposed under the substrate _2 is on the substrate. The hairpin (10) and the light-receiving element are detached 45. The optical waveguide 1009 between the light-emitting portion 1031 of the optical element 1003 and the light-receiving portion ι4 of the light-receiving element 1004. The substrate 1002 and the conductor layer i〇〇5 constitute a wiring substrate. The waveguide 1009 is a strip formed by sequentially laminating a cladding layer (lower cladding layer) 1091, a core layer 1093, and a cladding layer (upper cladding layer) 1〇92 from the lower side in FIG. 1093 is formed with a core portion and a cladding portion 1095 which are elongated and specific patterns which are set along the longitudinal direction of the strip-shaped optical waveguide 1009. The core portion 1094 forms a portion of the optical path for transmitting light, and the cladding portion 1095 is formed. Although it is formed in the core layer 1〇93 but does not form an optical path for transmitting light, it functions as the same function as the cladding layers 1091 and 1〇92. The constituent material of the core layer 1093 may be light (for example, ultraviolet light). Irradiation or change of refractive index by further heating A preferred example of the material is a resin composition containing a cycloolefin resin such as a benzenecyclobutene polymer or a norbornene polymer (resin) as a main material, and particularly preferably a halo. The olefin polymer (as a main material). The core layer 1 〇 93 composed of the above materials is excellent in resistance to deformation such as bending, and in particular, it is difficult to generate the core portion 1094 and the package even in the case of repeated bending deformation. The peeling of the covering portion 1095 or the separation between the core layer 1〇93 and the adjacent layers (including the money 1091 and 1092) prevents the occurrence of microcracks in the core portion 1094 or in the covering portion 1〇95. As a result, The light transmission performance of the optical waveguide 1009 is maintained, and the light wave 1009 excellent in durability is obtained. ' Further, for example, the constituent material of the core layer 1〇93 may contain an antioxidant, a refractive index adjuster, a plasticizer, and a tackifier. Additives, sensitizers, additives such as 46 201222034 /k ^ additives and flame retardants. Adding anti-oxidant sentences to improve high temperature stability, and improving the weather resistance and inhibiting photodegradation The effect of the above antioxidant For example, a phenanthrene-based or a bisphenol-based phenol-based or aromatic amine-based compound may be mentioned. Further, a plasticizer, a tackifier, and a reinforcing agent may be added to the bisphenol bismuth oxime, and the bending may be further increased. The content of the additive represented by the above antioxidant (in total of two or more kinds) is generally 0.5 to 40% by weight, more preferably about 0.5 to 40% by weight, based on the total amount of the core layer 1〇9. Living in von 3~30% by weight. If the amount of cough is too small, the function of the additive cannot be fully utilized. #量过2 According to the type or characteristic of the additive, there is light generated in the core part 1〇94 (transmission light) The penetration rate is reduced, and the graph is settled. (4) Poorization and refractive index instability The method of forming the core layer 1093 may be a coating method. The coating method may be a method of applying a core (forming varnish or the like) for forming a core layer, and curing (curing) the core layer, and a method of applying a curable monomer composition and curing (curing) the composition. X, a method other than the coating method, for example, a method of joining separately manufactured sheets may be employed. The core layer obtained in the above manner is selectively irradiated with light (active radiation) using a mask, and the core portion ι 94 of the desired shape is patterned. The light used for exposure includes active energy rays such as visible light, ultraviolet light, infrared light, and laser light. Further, electromagnetic waves such as X-rays or particle beams such as electron beams may be used without using light. In the core layer 1〇93, the refractive index of the portion irradiated with light is lowered, and a refractive index difference is generated between the portion where the light is not irradiated by 47 201222034. For example, the portion of the core layer that is irradiated with light becomes the cladding portion 1095, and the portion that is not irradiated becomes difficult to be the core portion. The refractive index of the covering portion 1095 is substantially equal to the refractive index of the cladding layer ι 9 . Further, the core layer 1 〇 93 is irradiated with light in a specific pattern, and then heated to form the core portion 1G94. By adding this additional step, the difference in refractive index between the core portion 1094 and the cladding portion 1〇95 can be further increased, which is preferable. Furthermore, the principle and the like will be described in detail below. As shown in FIG. 24, the pattern shape of the formed core portion 1094 is a widened portion (expanded portion) 1941 which is continuously enlarged in width toward the left end end _ (end portion in the longitudinal direction), and has a width toward the right end portion ( The other end portion of the long-side direction) is formed by continuously reducing the reduced portion (reduced portion) 1942 and the width-fixed portion of the widened portion 丨 941 and the widened portion 1942. On the other hand, as shown in Fig. 23, the thickness of the core layer 1093 forming the core portion urn is constant. Therefore, the cross-sectional area of the widened portion 1941 &amp; core portion 1094 shown in Fig. 24 is continuously increased toward the left end portion, and the reduced portion 1942 is such that the cross-sectional area of the core portion 1〇94 is continuously reduced toward the right end portion. Part of it. Further, the equal-width portion 194 is a portion in which the cross-sectional area of the core portion is constant. The pattern shape of the core portion 1094 may be a shape having a curved portion, a shape having a branch portion, a merging portion, or a cross portion, or a combination of two or more of the above, in addition to the widened portion 1941 and the reduced portion 1942. Any shape or the like. Further, the present invention is characterized in that in the formation of the patterns, the shape of any of the drawings of Fig. 48 201222034 can be easily realized by setting the illumination pattern of the light. The constituent materials of the respective portions of the optical waveguide 1 009 and the method of forming the core portion 丨〇94 will be described in detail below. The substrate 1 002 is a flexible substrate having flexibility and insulation properties. The constituent material of the substrate 1002 may, for example, be an epoxy resin, a phenol resin, a bis-butadiene diimide resin, or a di-butadiene di-imine-three well tree::, a diazole tree, a poly3 A polycyanate resin, a polyisocyanurate resin, a benzocyclobutene resin, a polyimide resin, a polybenzotriazole resin, a norbornene resin, or the like. Further, the materials may be used singly or in combination of plural kinds. Further, the substrate 1002 may be a laminate of a plurality of layers. For example, the first layer and the second layer which are composed of a resin material having the same composition (type) may be composed of a resin material having a different composition (type), and the second layer may be laminated. Furthermore, it is of course not limited to this. Layer Composition of Body The thickness of the substrate 1002 is not particularly limited, and is usually more preferably 右. ~...m or so. If the thickness of the base 2::: is within the range, the optical waveguide structure 1 is sufficiently flexible: "the degree of the substrate can be taken as an example. Specifically, the Young's mode of the substrate (10) 2 The number of ^: the number of ground phase) is better ^ Erqizhi (tensile elastic modulus) Che Yijia is in the general room temperature environment (about 2 ,, more preferably about 2~l2GPa. Between the underside of the substrate 1002 The shape of the conductor layer is 〇 〇 〇 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The thickness of the metal layer 4 layer i005 is not particularly limited, and is usually preferably about 3 to 12 angstroms, more preferably about 5 to 70. The conductor layer 1005 can be joined by metal (for example), metal plating, for example. A method such as plating, sputtering, or the like is formed. For the rounding of the conductor layer 1 to 5, for example, etching, printing, masking, or the like can be used. In the substrate 1002, a through hole 21 is formed, and the through hole is filled with Conductive materials (for example, various metal materials such as copper 'copper alloy K-based alloys') A conductor post 1022 is provided. The conductor post 1 22 is electrically connected to the conductor layer 1005 and the upper side of the substrate read. The light-emitting 7L member 1003 has a base 1〇3〇, a matte portion 1031 fixed to the surface of the base, and a connection light. The electrode pad of the portion 1031 and the metal wire 1032 of the electrode pad of the base 1030 and the external electrode 1 〇 33 provided on the lower surface of the base 1030 and connected to the external circuit by the illuminating 彳1〇31. The light-emitting element #1031 and the metal and the wire 1〇32 are covered by a resin mold 1034 which is hemispherical on the surface of the base 1〇3〇. When the right external electrode 1033 is energized, the light-emitting portion 1〇31 emits light. The external electrode 1〇33 is mounted on the substrate 1002 in such a manner as to be electrically connected to the conductor post 1〇22. On the other hand, the light receiving element 1〇〇4 has a base 1〇4〇 and is fixed to the base 104〇. The light-receiving portion 1G41 on the surface, the electrode wire connecting the electrode pad of the light-receiving portion 1G41 and the electrode pad of the base 1040, and the metal wire 1〇42 disposed on the base ι〇4〇, and the light-receiving portion and the outside The external electrode 1〇43 of the circuit is connected. Further, the light receiving unit 1041 and the metal wire 1042 are abutted on the base When the light receiving unit 1041 receives the optical signal, it is converted into an electrical signal and is output from the external electrode 1043. The light receiving element 1004 is an external electrode 1〇. 43 is bonded to the substrate 1〇〇2 in a manner of being electrically connected to the conductor post 1〇22. Further, the light-emitting unit 1〇31 in the light-emitting element 1003 and the light-receiving unit 1041 in the light-receiving element urn are respectively In addition to the &quot;solid light-emitting point or i light-receiving points, a plurality of light-emitting points or light-receiving points may be collected. For example, a plurality of light-emitting points or light-receiving points are arranged, for example, a light-emitting point or a light-receiving point is arranged in a column shape (for example, a light-emitting point or a light-receiving point is 1χ4, ΐχΐ2 or determinant (for example, a light-emitting point or a light-receiving point is nxm: η, the claw is an integer of 2 or more, or a plurality of light-emitting points or light-receiving points are irregularly arranged ((10)-ground arrangement, etc. The resin mold 1034 closes the light-emitting portion 1G31 on the right side of the base plate 1〇3〇 of the light-emitting element_ By this, it is possible to form a structure in which the light-emitting portion 1 () 31 is not exposed to the outside and is closed, so that the light-emitting portion 1〇31 can be protected from contamination, damage, oxidation, etc. As a result, the light-emitting element i can be improved. 3 reliability.

饵伽棋具1044於受光元件1004之基台1040之名 側封閉受光部難等。藉此,可形成受光部1041未露: 至外部L封之結構,故可保護受光部1G 損傷、氧化等。其結果,可提高受光元件⑽4之可靠广生。 又,樹脂模具1〇34、1044之構成材料 材料,例如可列舉環氧樹脂、盼樹脂降,稀 樹月a、矽樹脂等。 1031之發光點與受光部 光波導1009係以連結發光部 51 201222034 1041之受光點的方式設置於發光元件ι〇〇3與受光元件 1004之間。藉此,可藉由光波導1〇〇9光學連接發光點與受 光點。 光波導1009之核心部1 〇94係以俯視時(自圖23之上 方觀察時)以各發光點或各受光點重疊之圖案形狀而形 成。該核心部1094之折射率高於包覆部1〇95,又,相對於 包覆層1091、1092之折射率亦較高。包覆層1〇91及1〇92 係構成分別位於核心部1094之下部及上部之包覆部者。藉 由上述構成,可使核心部1〇94如圖24所示,作為將其外 周之全周包圍於包覆部之導光程而發揮功能。 光波導1009之兩端部(與發光元件1〇〇3及全光元件 1004之連接部)由設置於發光元件1〇〇3之樹脂模具 及設置於受光元件1004之樹脂模具1〇44所覆蓋,而固定 於發光元件1003及受光元件1〇〇4。藉此,光波導ι〇〇9、 發光元件1003及受光元件1〇〇4可形成一體,而以i個零 件(光配線)之形式進行操作。 再者,圖24所示之光波導1〇〇9係包含i個核心部 1〇94,但於!個光波導1〇〇9所形成之核心部ι〇94之個數, 例如可根據1個發光部1〇31所設置之發光點之個數、或^ 個受光部1041所設置之受光點之個數而設定,並無特別限 定。 於本實施形態之光波導結構體1〇〇1,若經由導體層 1〇05及導體柱1022對發光元件⑽3之外部電極1〇33通 電,則發光部1031之發光點發光,朝圖23中右方發出之 52 201222034 光進入光波導1009之核心部1〇94。於光波導1〇〇9,一面 於核心部1094與包覆部(包覆層109!、1092及侧方之包 覆。卩1095 )之界面重複反射,一面於核心部1 〇94内沿著其 長邊方向(圖23中右方向)前進。並且,若光到達受光部 1041之受光點,則於受光部1〇41中光信號轉換成電氣信 號’而自外部電極1043輸出。 關於上述光波導結構體丨00丨,於下述將作詳細闡述, 由於光波導1009係由高分子材料所構成,故具有可撓性, 且核心部1 094與包覆部1 〇95之折射率差較大,因此即便 光波導1009被折彎時,亦可具有充分之傳輸效率。 又,光波導1009與基板1〇〇2並非直接固定,故進行 折彎操作時,光波導1009與基板1〇〇2可自由活動。並且, Τ'防止局部之應力集中,而防止伴隨折彎操作之光波導 1009之破壞。其結果,可獲得耐久性優異之光波導結構體 1001 〇 此處,光波導結構體1001所具有之光波導1〇〇9具有 於俯視時,核心部1094之寬度朝左側端部連續變大之加寬 部分1 941、及核心部1 〇94之寬度朝右側端部連續變小之減 寬部分1 942。 於圖25 ( a)所示之加寬部分1941,其寬度以一定之比 例朝左側端部連續變大。又,於圖25 (a)所示之減寬部分 1942 ’其寬度以一定之比例朝右側端部連續變小。 如圖2 3所示,藉由以與加寬部分丨9 41之左側端面相 對向之方式配置發光元件1 〇〇3之發光點,可使光以較高之 53 201222034 效率入射至加寬部分1941。即,加寬部分1 94 1之左側端面 的面積大於右側端面’故可高效地接受自發光點放射之 光°尤其是’於使用半導體雷射作為發光元件1003之情形 時,使光具有特定之擴散角度而放射,故加寬部分1941之 左側端面之面積較大就提高發光元件1003與核心部1094 之光結合效率之觀點而言較為有效。此外,由於加寬部分 1941之左側端面之面積較大,故即便發光點相對於加寬部 刀1 941之左側端面的位置多少有所偏移,亦可抑制發光元 件1003與核心部1〇94之光結合效率明顯下降。因此,可 增加安裝發光元件1〇〇3時之位置容許量’而提高安裝容易 性。 又,於將加寬部分1941之左側最端部之寬度設為W1, 右側最端部之寬度設為W2時,W2較佳為W1之〇丨〜〇 9 倍左右,更佳為W1之〇·2〜〇_8倍左右。藉此,可形成抑制 來自核心部1094之光之洩漏的加寬部分1941。其結果,可 進一步提高發光元件1〇〇3與核心部1〇94之光結合效率。 又,於加寬部分1941中,核心部1094與包覆部1〇95 之邊界線、與上述核心部1094之左側端部之端面所成的角 度α 1較佳為45度以上未達90度,更佳為5〇度以上85度 以下。藉此,可無損核心部1〇94與包覆部1〇95之邊界面 之反射條件而形成加寬部分1941。其結果,可進一步提高 發光元件1003與核心部1094之光結合效率。再者,關於 核心部1094與包覆部1095之邊界線、與上述核心部1〇94 之左側端部之端面所成的角度,將成為9〇度以下之角度設 54 201222034 為上述α 右側二::面’如圖23所示,藉由以與減寬部分1942之 =面相對向之方式配置受光元件1_之受光點,可使 自減寬部分.1942 Φ Ρ * ^先以較高之效率入射至受光點。 ,錢部A 1942之右側端面之面積小於左側端面,故可 出射縮至更細之光,而可確實地入射至受光點之有效面 積。其結果,可提高核心部1〇94與受光元件1〇〇4之光結 合效率。此外’減寬部分1942之右側面積較小,故即便受 光點相對於減寬部》1942之右側端面的位置多少有所偏 移,亦可抑制受光元件1004與核心部1〇94之光結合效率 明顯下降《因此,可增加安裝受光元件1〇〇4時之位置容許 量,而提高安裝容易性。 又,當將減寬部分1942之左側最端部之寬度設為W3, 右側最端部之寬度設為W4時,W4較佳為W3之〇1〜〇 9 倍左右,更佳為W3之0,2〜0.8倍左右。藉此,可形成抑制 來自核心部1094之光之洩漏的減寬部分1942。其結果可 進一步提高核心部1 094與受光元件1004之光結合效率。 又,於減寬部分1942中’核心部1〇94與包覆部1〇95 之邊界線、與上述核心部1094之右側端部之端面所成的角 度較佳為45度以上未達90度’更佳為5〇度以上、85 度以下。藉此’可無損核心部1094與包覆部1〇95之邊界 面之反射條件而形成減寬部分1942。其結杲,可進_步提 高核心部1094與受光元件1004之光結合效率。再者,關 於核心部1094與包覆部1095之邊界線、與上述核心部1〇94 55 201222034 之右側端部之端面所成的角度 為上述〇: 2。 將成為90度以下之角度設 度W1設定為大於寬度W4。藉此,加寬部分1941 左側端面之面積大於減寬部分1942之右側端面 , 可更加確實地獲得如上所述之效果 '再者,加寬部分1941及減寬部分1942之各自之長度 並無特別限^ ’例如相對於寬度W2較佳為3〜1〇倍左右。 圖25(b)為圖25(〇所示之光波導1〇〇9之其他構成 立圖25(b)所示之光波導1〇〇9除了加寬部分ΐ94ι及減 寬部分1942之位置不同以外,與圖25 (a)所示之光波導 、、相同即,於圖25 ( a)中,加寬部分1941設置於核 心部1094之左側端部,減寬部分1942設置於右側端部, 與此相對’於圖25⑴中,加寬部分1941自核心部刪 之左側端部,僅以特定之距離朝内側(右側)移動,又, 減寬。卩刀1942自核心部1094之右側端部,僅以特定之距 朝内側(左侧)移動。並且,於加寬部分1941與核心部 1094之左側端面之間、及減寬部分1942與核心部1〇94之 右側端面之間分別有橫剖面積一定之等寬部分1 940。 上述圖25 (b)所示之光波導1〇〇9由於加寬部分1941 之左側端部之寬度W1及減寬部分1942之右側端部之寬度 W4與圖25 ( a)之情形相同,故為發揮與圖25 ( a)相同 之作用、效果者。即,該光波導1〇〇9成為對發光元件1 〇〇3 或文光元件1〇〇4之光結合效率較高者。 56 201222034 再者,加寬部分1941及減寬部分1942之位置、個數 等並無特別限定,可分別設置複數個。 &lt;第1 5實施形態:圖26〉 於圖26表示本發明之光波導結構體1001之第1 5實施 形態。以下,對該光波導結構體1 〇 〇 1進行說明,關於與上 述第14實施形態相同之事項’省略其說明,以不同點為中 心加以說明。 圖26係表示第1 5實施形態之核心層之平面圖。 於本實施形態之光波導結構體1 〇(H,光波導1009之構 成與上述不同,其以外相同。 即’於圖26(a)所示之光波導1009,於俯視下之加寬 部分1941'及減寬部分1942'的核心部1094與包覆部1095 之邊界線形成曲線。於加寬部分1 94 Γ,該曲線為朝核心部 1094之左側端部(一端部)開口之抛物線.又,於減寬部 分1942’中,該曲線亦為朝核心部1〇94之左側端部(一端 部)開口之拋物線。 於上述加寬部分1941,,左側端面之面積較大,故入射 光之入射效率得到提高。又,自發光元件1003出射而入射 至核心部1094之光於核心部1094與包覆部1095之邊界面 經反射時’以聚光於上述抛物線之焦點之方式進行反射。 其結果’可降低於核心部1094中之漏光量。又,於減寬部 刀1942 ’傳播於核心部之光亦於核心部1094與包覆 邛1 〇9 5之邊界面經反射時聚光。其結果,可自減寬部分 1942’之右側端面出射縮至更細之光。藉此,圖26 ( a )所示 57 201222034 之光波導1009成為對發光元件1003或受光元件1004之光 結合效率較高者。 圖26 ( b)為圖26 ( a)所示之光波導1〇〇9之其他構成 例0 圖26 ( b)所示之光波導1009除了加寬部分1941'及減 寬0卩刀1 942之位置不同以外,與圖26 ( a )所示之光波導 1 〇〇9相同。即’於圖26 ( a ),加寬部分1941'設置於核心部 之左側端部,減寬部分1 942,設置於右側端部,與此相 ;圖26 ( b )’加寬部分194 Γ自核心部1 〇94之左側端 ::,僅以特定之距離朝内側(右側)移動,又,減寬部分 杉匕。卩1094之右側端部,僅以特定之距離朝内側 左側)移動》並且,於加寬部分1941,與核心部刪之 左側端部之間、及減盲邱八 部之^ 減寬0h 1942,與核心部_之右側端 p之間分別存在寬度卩播_南丨$ #、 u .. (橫面積)一定之等寬部分1940。 上'述圖26(b)所示$ 、士,曾 之左側t 皮導I(H)9由於加寬部分时 側力而部之寬度W1及減窗邶八 W4與圖r 、 ^ 〇刀42之右側端部之寬度 之作用、w , 故為發揮與圖26 (a)相同 效果者。即,該光波導1〇〇 或受杏-从 成為對發光元件1003 又先70件1004之光結合效率較高者。 〈第16實施形態:圖27〉 於圖27表示本發明之光 ㈣。以下,對該光波導結構體i謝進::第16實施 、第Η實施形態相同之事項,省略其說明^於與上 心加以說明。 乂不同點為中 58 201222034 圖27係表示第i 6實施形態之剖面圖。 於本實施形態之光波導結構體1001中,光波導1009 之構成與上述不同,其以外相同。 即’圖27 ( a)所示之光波導1〇〇9係由核心層1093之 厚度朝其左側端部連續變大之厚膜部分(擴張部分)丨943、 核心層1093之厚度朝右側端部連續變小之薄膜部分(縮小 部分)1 944、及設置於該等厚膜部分丨943與薄膜部分丨944 之間且厚度—定之等厚部分1945所構成。另—方面,於核 心部1094之俯視之寬度雖未圖示,但保持一定。因此,圖 27 (a)所示之厚膜部分1943為核心部1〇94之橫剖面積朝 左側端部連續變大之部分,薄膜部分1944為核心部1〇94 之橫剖面積朝右側端部連續變小之部分。$而,等厚部分 1945為核心部丨094之橫剖面積一定之部分。 對於上述光波導1009’以與厚膜部分1943之左側端面 相對向之方式配置發光元件1〇〇3之發光點,藉此可使光以 較咼之效率入射至厚膜部分1943。 .^ 丨f知同發光兀件10 0 3 與核心部1094之光結合效率。 ϋ外’厚膜部分1 943之左 側知面之面積較大,故即便發 發光^相對於厚膜部分1 943之 左側端面的位置多少有所偏 1ΛΛ/1 j抑制發光元件1003與 x〜。 之光結合效率明顯下降。因 光元件1003 B#夕&amp; μ 因此,可增加安裝發 尤兀1干時之位置容許量, X , t ^ ^ ^ ν 阿安裝容易性。 田將尽骐部分1943之左側异灿 右側最端部之厚度設為T2時,^較:部之厚度設為T1, 左右’更佳為T1之。.2〜。·8倍左為T1之。」〜。.9倍 错此,可形成抑制來 59 201222034 自核心部1094之光之洩漏的厚膜部分1943。其結果,可進 一步提高發光元件1 003與核心部1 〇94之光結合效率。 又,於厚膜部分1 943,縱剖面之核心部1 〇94與各包覆 層1091、1092之邊界線、與上述核心部1〇94之左側端部 之端面所成的角度/9 1較佳為45度以上未達9〇度,更佳為 50度以上85度以下。藉此,可無損核心部1〇94與各包覆 層1091、1092之邊界面之反射條件而形成厚膜部分1943。 其結果,可進一步提高發光元件1003 結合效率。再者,關於核心部1094與各包覆層1091、1〇9: 之邊界線、與上述核心部1〇94之左側端部之端面所成的角 度,將成為90度以下之角度設為上述/51。 另方面,如圖27 ( a)所示,藉由以與薄膜部分1 之右側端面相斜而夕士e , 卞π之方式配置受光元件1 004之受光點,可 使自薄膜部分1944屮如L、,h - 出射之光以較尚之效率入射至受光點。 即,薄膜部分1944夕士 ν,〇 π 叫4之右側端面之面積小於左側端面,故可 出射縮至更細之本 ^ ^ 先而可確實地入射至受光點之有效面 積。其結果,可裎古—Α 核心部刪與受光元件聰之光結The bait board 1044 is difficult to close the light receiving portion on the name of the base 1040 of the light receiving element 1004. Thereby, the structure in which the light receiving portion 1041 is not exposed to the external L seal can be formed, so that the light receiving portion 1G can be protected from damage, oxidation, and the like. As a result, the reliability of the light receiving element (10) 4 can be improved. Further, examples of the material of the constituents of the resin molds 1 to 34 and 1044 include an epoxy resin, a resin resin, a rare resin, a resin, and the like. Light-emitting point and light-receiving portion of 1031 The optical waveguide 1009 is provided between the light-emitting element ι 3 and the light-receiving element 1004 so as to connect the light-receiving portion of the light-emitting portion 51 201222034 1041. Thereby, the light-emitting point and the light-receiving point can be optically connected by the optical waveguide 1〇〇9. The core portion 1 〇 94 of the optical waveguide 1009 is formed in a plan view in which each light-emitting point or each light-receiving point overlaps in a plan view (when viewed from above in Fig. 23). The core portion 1094 has a higher refractive index than the cladding portion 1〇95, and has a higher refractive index with respect to the cladding layers 1091 and 1092. The cladding layers 1〇91 and 1〇92 constitute the cladding portions located at the lower portion and the upper portion of the core portion 1094, respectively. According to the above configuration, the core portion 1〇94 can function as a light guiding path that surrounds the entire circumference of the outer periphery of the envelope portion as shown in Fig. 24 . Both end portions of the optical waveguide 1009 (connecting portions with the light-emitting element 1〇〇3 and the all-optical element 1004) are covered by a resin mold provided in the light-emitting element 1〇〇3 and a resin mold 1〇44 provided in the light-receiving element 1004. It is fixed to the light-emitting element 1003 and the light-receiving element 1〇〇4. Thereby, the optical waveguide 、9, the light-emitting element 1003, and the light-receiving element 1〇〇4 can be integrated and operated in the form of i parts (optical wiring). Furthermore, the optical waveguide 1〇〇9 shown in Fig. 24 includes i core portions 1〇94, but! The number of the core portions ι 94 formed by the optical waveguides 1 〇〇 9 can be, for example, the number of light-emitting points provided by one light-emitting portion 1 〇 31 or the light-receiving points set by the light-receiving portions 1041. The number is set and is not particularly limited. In the optical waveguide structure 1〇〇1 of the present embodiment, when the external electrodes 1〇33 of the light-emitting element (10) 3 are energized via the conductor layer 1〇05 and the conductor post 1022, the light-emitting point of the light-emitting unit 1031 emits light, and FIG. 23 The 52 201222034 light emitted from the right enters the core 1〇94 of the optical waveguide 1009. In the optical waveguide 1〇〇9, the interface between the core portion 1094 and the cladding portion (the cladding layer 109!, 1092 and the side cladding layer 卩1095) is repeatedly reflected, and is along the core portion 1 〇94. Its longitudinal direction (the right direction in Fig. 23) advances. When the light reaches the light receiving point of the light receiving unit 1041, the light signal is converted into an electrical signal ’ in the light receiving unit 1〇41 and outputted from the external electrode 1043. The optical waveguide structure 丨00丨 will be described in detail below. Since the optical waveguide 1009 is made of a polymer material, it has flexibility, and the core portion 1 094 and the cladding portion 1 〇 95 are refracted. Since the rate difference is large, even when the optical waveguide 1009 is bent, sufficient transmission efficiency can be obtained. Further, since the optical waveguide 1009 and the substrate 1〇〇2 are not directly fixed, the optical waveguide 1009 and the substrate 1〇〇2 are freely movable when the bending operation is performed. Further, Τ 'prevents local stress concentration and prevents damage of the optical waveguide 1009 accompanying the bending operation. As a result, the optical waveguide structure 1001 having excellent durability can be obtained. Here, the optical waveguide 1〇〇9 of the optical waveguide structure 1001 has a width in which the width of the core portion 1094 is continuously increased toward the left end portion in plan view. The widened portion 1 941 and the widened portion 1 942 in which the width of the core portion 1 〇 94 is continuously reduced toward the right end portion. The widened portion 1941 shown in Fig. 25 (a) has a width which continuously increases toward the left end portion by a certain ratio. Further, the width of the reduced portion 1942' shown in Fig. 25(a) is continuously reduced toward the right end portion by a constant ratio. As shown in FIG. 23, by arranging the light-emitting points of the light-emitting elements 1 and 3 in a manner opposite to the left end surface of the widened portion 丨91, the light can be incident on the widened portion with a higher efficiency of 2012201234. 1941. That is, the area of the left end surface of the widened portion 194 1 is larger than the right end surface ′, so that the light radiated from the light-emitting point can be efficiently received. In particular, when the semiconductor laser is used as the light-emitting element 1003, the light is made specific. Since the diffusion angle is radiated, the area of the left end surface of the widened portion 1941 is large, which is effective from the viewpoint of improving the light-binding efficiency of the light-emitting element 1003 and the core portion 1094. Further, since the area of the left end surface of the widened portion 1941 is large, even if the position of the light-emitting point is shifted from the left end surface of the widened portion knife 941, the light-emitting element 1003 and the core portion 1〇94 can be suppressed. The light combination efficiency is significantly reduced. Therefore, the positional tolerance amount when the light-emitting element 1〇〇3 is mounted can be increased to improve the ease of mounting. Further, when the width of the leftmost end portion of the widened portion 1941 is W1 and the width of the rightmost end portion is W2, W2 is preferably about W1 to about 9 times, more preferably W1. · 2 ~ 〇 _ 8 times or so. Thereby, a widened portion 1941 that suppresses leakage of light from the core portion 1094 can be formed. As a result, the light combining efficiency of the light-emitting element 1〇〇3 and the core portion 1〇94 can be further improved. Further, in the widened portion 1941, the angle α 1 between the boundary between the core portion 1094 and the covering portion 1〇95 and the end surface of the left end portion of the core portion 1094 is preferably 45 degrees or more and less than 90 degrees. More preferably, it is 5 degrees or more and 85 degrees or less. Thereby, the widened portion 1941 can be formed without deteriorating the reflection condition of the boundary surface between the core portion 1〇94 and the cladding portion 1〇95. As a result, the light combining efficiency between the light-emitting element 1003 and the core portion 1094 can be further improved. Further, the angle formed by the boundary line between the core portion 1094 and the covering portion 1095 and the end surface of the left end portion of the core portion 1〇94 is set to an angle of not less than 9 degrees Celsius 54 201222034 is the above-mentioned α right side two As shown in FIG. 23, by arranging the light receiving point of the light receiving element 1_ so as to face the = surface of the widened portion 1942, the self-reducing portion .1942 Φ Ρ * ^ can be made higher first. The efficiency is incident on the light receiving point. The area of the right end face of the money part A 1942 is smaller than the left end face, so that it can be diverged to a finer light, and can be surely incident on the effective area of the light receiving point. As a result, the light combining efficiency between the core portion 1〇94 and the light receiving element 1〇〇4 can be improved. Further, since the area on the right side of the reduced portion 1942 is small, the light-receiving efficiency of the light-receiving element 1004 and the core portion 1〇94 can be suppressed even if the position of the light-receiving portion is shifted with respect to the position of the right end surface of the widened portion 1942. Significantly lower "Therefore, the positional tolerance when the light-receiving element 1〇〇4 is mounted can be increased, and the ease of installation can be improved. Further, when the width of the leftmost end portion of the widened portion 1942 is W3 and the width of the rightmost end portion is W4, W4 is preferably about 〇1 to 〇9 times W3, more preferably W3. , 2 to 0.8 times or so. Thereby, the widened portion 1942 which suppresses the leakage of light from the core portion 1094 can be formed. As a result, the light combining efficiency of the core portion 1 094 and the light receiving element 1004 can be further improved. Further, in the widened portion 1942, the angle between the boundary line between the core portion 1〇94 and the covering portion 1〇95 and the end surface of the right end portion of the core portion 1094 is preferably 45 degrees or more and less than 90 degrees. 'More preferably 5 degrees or more and 85 degrees or less. Thereby, the widened portion 1942 is formed by the reflection condition of the boundary between the core portion 1094 and the cladding portion 1〇95. In the case of the knot, the light combining efficiency of the core portion 1094 and the light receiving element 1004 can be improved. Further, the angle formed by the boundary line between the core portion 1094 and the covering portion 1095 and the end surface of the right end portion of the core portion 1 〇 94 55 201222034 is the above 〇: 2. The angle setting W1 which is 90 degrees or less is set to be larger than the width W4. Thereby, the area of the left end surface of the widened portion 1941 is larger than the right end surface of the widened portion 1942, and the effect as described above can be obtained more surely. Further, the lengths of the widened portion 1941 and the widened portion 1942 are not particularly different. The limit ^' is preferably about 3 to 1 相对, for example, with respect to the width W2. Fig. 25(b) shows the position of the optical waveguide 1〇〇9 shown in Fig. 25 (the other configuration of the optical waveguide 1〇〇9 shown in Fig. 25(b) except that the widened portion ΐ94ι and the widened portion 1942 are different. In addition, in the same manner as the optical waveguide shown in FIG. 25(a), in FIG. 25(a), the widened portion 1941 is provided at the left end portion of the core portion 1094, and the widened portion 1942 is provided at the right end portion. In contrast, in Fig. 25 (1), the widened portion 1941 is cut from the core portion to the left end portion, and is moved toward the inner side (right side) only by a specific distance, and is further widened. The file 1942 is from the right end of the core portion 1094. , moving only toward the inner side (left side) at a specific distance, and between the widened portion 1941 and the left end surface of the core portion 1094, and between the reduced portion 1942 and the right end surface of the core portion 1〇94, respectively. The equal-width portion 1 940 having a constant sectional area. The optical waveguide 1〇〇9 shown in Fig. 25(b) is widened by the width W1 of the left end portion of the widened portion 1941 and the width W4 of the right end portion of the widened portion 1942. Since the case of Fig. 25(a) is the same, the same effect and effect as those of Fig. 25(a) are exerted. That is, the optical waveguide 1〇 9 is a higher light-binding efficiency to the light-emitting element 1 〇〇3 or the light-emitting element 1〇〇4. 56 201222034 Further, the position and number of the widened portion 1941 and the widened portion 1942 are not particularly limited. A plurality of the optical waveguide structures 1001 of the present invention are shown in Fig. 26. The optical waveguide structure 1 〇〇1 will be described below. The description of the same matters as the above-described fourteenth embodiment is omitted, and the description will be focused on the difference. Fig. 26 is a plan view showing the core layer of the fifth embodiment. The optical waveguide structure 1 of the present embodiment 〇 (H, the configuration of the optical waveguide 1009 is different from the above, and is the same as that of the optical waveguide 1009 shown in Fig. 26(a), the widened portion 1941' and the core portion 1094 of the widened portion 1942' in plan view. A curve is formed with the boundary line of the cladding portion 1095. In the widened portion 1 94 Γ, the curve is a parabola opening toward the left end portion (one end portion) of the core portion 1094. Again, in the reduced portion 1942', the curve Also on the left end of the core 1〇94 In the widened portion 1941, the area of the left end surface is large, so that the incident efficiency of incident light is improved. Further, the light emitted from the light-emitting element 1003 and incident on the core portion 1094 is in the core portion 1094. When the boundary surface of the cladding portion 1095 is reflected, it is reflected so as to be concentrated on the focal point of the parabola. The result can be reduced by the amount of light leakage in the core portion 1094. Further, it is transmitted to the widened portion knife 1942. The light of the core portion is also collected when the boundary between the core portion 1094 and the cladding 邛1 〇9 5 is reflected. As a result, the right end surface of the widened portion 1942' can be shrunk to a finer light. Thereby, the optical waveguide 1009 of 57 201222034 shown in Fig. 26 (a) has a higher light-binding efficiency with respect to the light-emitting element 1003 or the light-receiving element 1004. Fig. 26 (b) is another configuration example of the optical waveguide 1 〇〇 9 shown in Fig. 26 (a). The optical waveguide 1009 shown in Fig. 26 (b) except the widened portion 1941' and the widened 0 knives 1 942 The position is the same as that of the optical waveguide 1 〇〇 9 shown in Fig. 26 (a). That is, in Fig. 26 (a), the widened portion 1941' is disposed at the left end portion of the core portion, and the widened portion 1942 is disposed at the right end portion, and is in phase with this; Fig. 26 (b) 'widened portion 194 Γ From the left side of the core part 1 〇94::, only moves to the inner side (right side) at a specific distance, and further, the partial cedar is widened.右侧 1094 is moved to the right side of the inner side only by a specific distance, and is widened by 1941 between the widened portion 1941 and the left end of the core portion, and reduced by 0h 1942. Between the right end p of the core portion and the right end p of the core portion, there is a width portion 1940 of a certain width width _ Nan 丨 $ #, u .. (horizontal area). On the top of Figure 26 (b), $, Shi, the left side of the t-lead I (H) 9 due to the lateral force of the widened part of the width of the W1 and the reduction of the window 邶 eight W4 and the figure r, ^ 〇 The effect of the width of the right end portion of 42 and w is the same as that of Fig. 26(a). In other words, the optical waveguide 1 或 or the apricot- ing has a higher light-binding efficiency to the light-emitting element 1003. <Sixth embodiment: Fig. 27> Fig. 27 shows light (4) of the present invention. In the following, the optical waveguide structure i is exaggerated: the same matters as those in the sixteenth embodiment and the third embodiment are omitted, and the description thereof will be omitted.乂Different points are in the middle 58 201222034 Fig. 27 is a cross-sectional view showing the i-th embodiment. In the optical waveguide structure 1001 of the present embodiment, the configuration of the optical waveguide 1009 is different from the above, and the other configurations are the same. That is, the optical waveguide 1〇〇9 shown in Fig. 27(a) is a thick film portion (expanded portion) 丨943 which is continuously enlarged from the thickness of the core layer 1093 toward the left end portion thereof, and the thickness of the core layer 1093 is toward the right end. A film portion (reduced portion) 1 944 which is continuously reduced in size, and a portion 1945 which is disposed between the thick film portion 丨 943 and the film portion 丨 944 and has a thickness-constant thickness portion 1945. On the other hand, the width of the core 1094 in plan view is not shown, but it is constant. Therefore, the thick film portion 1943 shown in Fig. 27 (a) is a portion in which the cross-sectional area of the core portion 1 〇 94 is continuously increased toward the left end portion, and the film portion 1944 is the cross-sectional area of the core portion 1 〇 94 toward the right end. The part of the department that has become smaller. $, the equal thickness portion 1945 is a certain part of the cross-sectional area of the core portion 丨094. The light guide point of the light-emitting element 1?3 is disposed so that the optical waveguide 1009' faces the left end surface of the thick film portion 1943, whereby light can be incident on the thick film portion 1943 with a relatively high efficiency. .^ 丨f knows the light combining efficiency of the light-emitting element 10 0 3 and the core portion 1094. Since the area of the left side of the thick film portion 1 943 is large, the position of the left end surface of the thick film portion 1 943 is somewhat offset from the position of the left end surface of the thick film portion 1 943 by 1 ΛΛ / 1 j to suppress the light-emitting elements 1003 and x~. The light combination efficiency is significantly reduced. Therefore, the optical component 1003 B# 夕 &amp; μ can increase the position tolerance when mounting the hair dryer, X, t ^ ^ ^ ν is easy to install. When the thickness of the right end of the right side of the 1943 is set to T2, the thickness of the part is set to T1, and the left and right 'better is T1. .2~. · 8 times left is T1. ~~. This is a 9-fold error, and a thick film portion 1943 that suppresses the leakage of light from the core portion 1094 can be formed. As a result, the light combining efficiency of the light-emitting element 1 003 and the core portion 1 〇 94 can be further improved. Further, in the thick film portion 1 943, the angle between the core portion 1 〇 94 of the longitudinal section and the boundary line of each of the cladding layers 1091 and 1092 and the end surface of the left end portion of the core portion 1 〇 94 is Preferably, the temperature is 45 degrees or more and less than 9 degrees, more preferably 50 degrees or more and 85 degrees or less. Thereby, the thick film portion 1943 can be formed without impairing the reflection conditions of the boundary faces of the core portions 1〇94 and the respective cladding layers 1091 and 1092. As a result, the light-emitting element 1003 can be further improved in bonding efficiency. In addition, the angle formed by the boundary between the core portion 1094 and each of the cladding layers 1091 and 1〇9 and the end surface of the left end portion of the core portion 1〇94 is set to be 90 degrees or less. /51. On the other hand, as shown in Fig. 27 (a), by arranging the light receiving point of the light receiving element 1 004 so as to be inclined to the right end surface of the film portion 1, the film portion 1944 can be obtained. L,, h - The emitted light is incident on the light receiving point with a higher efficiency. That is, the area of the right end surface of the thin film portion 1944 士士 ν, 〇 π 4 4 is smaller than the left end surface, so that it can be condensed to a finer one, and can be surely incident on the effective area of the light receiving point. As a result, the core part of the Α古ΑΑ can be deleted and the light-receiving component Congzhi light knot

• 卜,由於薄膜部分1 944之右側面籍Μ I 便發光點相對於薄膜心 之右側面積較小’故即 卞於4膜部分1944之右側端面 偏移’亦可抑制香氺-μ t ^ ^ ^ ^ 又先7^件1004與核心部1094 $ #紝人q 率明顯下降。因舲γ y4之先結合效 許量,而提高安:容:1加安裝受光元件戰時之位置容 又田將溥臈部分1944之左側最端之展庳 右側最端部之厚廑π °厚度設為Τ3 , 早度叹為Τ4時,Τ4較佳為乃之〇.!〜〇_9箱 60 201222034 左右,更佳為T3之〇_2〜0.8倍左右。藉此,可形成抑制來 自核心部1094之光之洩漏的薄膜部分1944。其結果,可進 一步提高核心部1094與受光元件ι〇〇4之光結合效率。 又,於薄膜部分1944中,縱剖面之核心部1094與各 包覆層1 09 1、1 092之邊界線、與上述核心部1 〇94之右側 端部之端面所成的角度万2較佳為45度以上未達90度,更 佳為50度以上85度以下。藉此,可無損核心部1〇94與各 包覆層1091、1092之邊界面之反射條件而形成薄膜部分 1 944。其結果,可進一步提高核心部丨〇94與受光元件丨〇〇4 之光結合效率。再者,關於核心部1〇94與各包覆層ι〇9ι、 1092之邊界線、與上述核心部1()94之右側端部之端面所成 的角度’將成為90度以下之角度設為上述/32。 又,厚度T1設定為大於厚度丁4。藉此,厚膜部分1943 之左侧端面之面積大於箱、 '’専Μ。卩分1944之右側端面之面積, 故可更加確實地獲得如上所述之效果。 、 再者厚膜#分1943及薄膜部分1944之各自之 並無特別限定,例如相料# 位士+ 相對於核心部1094之寬度較佳為3〜 I U 左右。 I覆層1091、1092之厚度無論厚膜部 Ρ 公 ·, , * ^ ^ 1 , l\jy 1943抑或薄膜部分叫4均保持一定„ 圖27(b)為圖27 r 、 例。 (a)所示之光波導1009之其他構成 圖27(b)所示之光波 於厚度上局部不同以外, 導1009除了各包覆層109卜1092 其與圖27(a)所示之光波導1〇〇9 61 a 201222034 相同。即’於圖27 ( b),各包覆層1〇91、1092中,與厚膜 部分1943對應之部分之厚度朝核心部1〇94之左側端部連 續變小’另一方面,與薄膜部分1 944對應之部分之厚度朝 核心部1094之右側端部連續變大。再者,圖27 ( b )所示 之光波導1009之總厚度總體上一定。 於上述光波導1009,如圖27 ( a)般,可充分提高發光 元件1003或受光元件1004與核心部1〇94之光結合效率, 且可提咼薄膜部分1 944之機械強度。即,為補充薄膜部分 1944之厚度減少而增大各包覆層1〇91、1〇92之厚度,故可 防止光波導1 009之右側端部之機械強度下降。藉此,於組 裝光波導1009與受光元件1〇〇4時,可防止右側端部受到 損傷。 圖27(c)為圖27(a)所示之光波導1〇〇9之其他構成 例0 圖27(c)所示之光波導1〇〇9除了包覆層1〇91之厚度 局部不同,而包覆層1092之厚度保持一定以外,與圖27 (a)所示之光波導1〇〇9相同。即,於圖27 ( c),包覆層 1091之與厚膜部分1 943對應之部分的厚度朝核心部1 〇94 之左側端部連續變小,另一方面,與薄臈部分1944對應之 部分的厚度朝核心部1〇94之右側端部連續變大。又,包覆 層1092之厚度無論厚膜部分1943抑或薄膜部分1944均保 持一定。 於上述光波導1009,可獲得與圖27(b)所示之光波 導1009相同之作用、效果。 62 201222034 圖27 (d)為圖27 (a)所示之光波導1009之其他構成 例0 圖27 ( d)所示之光波導1〇〇9除了厚膜部分1943及薄 膜部分1944之位置不同以外,與圖27 (a)所示之光波導 1009相同。即,於圖27(a),厚膜部分1943設置於核心部 1094之左側端部’薄膜部分丨944設置於右側端部,與此相 對,於圖27 (d),厚膜部分1943自核心部1094之左側端 部’僅以特定之距離朝内側(右側)移動,又,薄膜部分 1944自核心部丨〇94之右側端部,僅以特定之距離朝内側(左 侧)移動。並且,於厚膜部分i 943與核心部1094之左側 端面之間、及薄膜部分1944與核心部1094之右侧端面之 間分別存在橫剖面積一定之等厚部分1945。 於上述光波導1009中,可獲得與圖27 ( a)所示之光 波導1009相同之作用、效果。 再者,於上述第14、第15實施形態,僅核心部1094 之寬度連續變化’於本實施形態(第16實施形態),僅核 心層1093之厚度連續變化,亦可使核心部1〇94之寬度與 核心層1093之厚度之兩者連續變化》即,於加寬部分1941 之核心層1093的厚度亦可如厚膜部分1943般變化,減寬 部分1942之核心層1〇93的厚度亦可如薄膜部分1944般變 化。於該情形時’與各實施形態相比,上述作用、效果更 加明顯。 〈第17實施形態:圖28 &gt; 於圖28表示本發明之光波導結構體1之第17實施形 63 201222034 態。以下,對該光波導結構體100丨推Μ 進仃說明,關於與上述 第16實施形態相同之事項,省略1蚱ΒΒ 一說明,以不同點為中心 加以說明。 圖2 8係表示第1 7實施形態之剖面圖。 於本實施形態之光波導結構體1〇〇1,光波導1〇〇9之構 成與上述不同,其以外相同。 即’於圖28⑴所示之光波導1〇〇9,於橫剖面之厚膜 部分㈣,及薄膜部分1944,中的核心部1〇94與各包覆層 1091、1092之邊界線形成曲線。於厚膜部分we,該曲線 為朝核心部1094之左側端部(一端部)開口之抛物線二/, 於薄膜部分测·中,該曲線亦為朝核心部1〇94之左側端 部(一端部)開口之拋物線。• 卜, since the right side of the film portion 1 944 is Μ I, the light-emitting point is smaller than the right side of the film core, so that the offset of the right end surface of the 4 film portion 1944 can also suppress the 氺-μt ^ ^ ^ ^ Also first 7^ pieces 1004 with the core part 1094 $ #纴人q rate dropped significantly. Because 舲 y y4 first combined with the amount of effect, and improve the safety: capacity: 1 plus the position of the installation of the light-receiving element in the wartime, the field will be the part of the left side of the 1944, the right end of the right side of the thickest part 廑 ° ° The thickness is set to Τ3, and the early sigh is Τ4, Τ4 is preferably 乃.!~〇_9 box 60 201222034 or so, more preferably T3 〇_2~0.8 times. Thereby, a film portion 1944 which suppresses leakage of light from the core portion 1094 can be formed. As a result, the light combining efficiency of the core portion 1094 and the light receiving element ι 4 can be further improved. Further, in the film portion 1944, the angle between the core portion 1094 of the longitudinal section and the boundary line between the cladding layers 119 and 092 and the end surface of the right end portion of the core portion 1 〇 94 is preferably 2 It is less than 90 degrees above 45 degrees, more preferably less than 50 degrees and less than 85 degrees. Thereby, the film portion 1 944 can be formed without impairing the reflection conditions of the boundary faces of the core portions 1〇94 and the respective cladding layers 1091 and 1092. As a result, the light combining efficiency of the core portion 94 and the light receiving element 丨〇〇4 can be further improved. Further, the angle ' formed by the boundary between the core portion 1〇94 and each of the cladding layers ι〇9ι, 1092 and the end surface of the right end portion of the core portion 1 () 94 will be an angle of 90 degrees or less. For the above /32. Further, the thickness T1 is set to be larger than the thickness D4. Thereby, the area of the left end surface of the thick film portion 1943 is larger than the case, '''. By dividing the area of the right end face of 1944, the effect as described above can be obtained more surely. Further, each of the thick film #1943 and the film portion 1944 is not particularly limited. For example, the width of the phase material #士士+ relative to the core portion 1094 is preferably about 3 to I U . The thickness of the I cladding layers 1091 and 1092 is constant regardless of the thick film portion, * ^ ^ 1 , l\jy 1943 or the film portion 4 (Fig. 27(b) is Fig. 27 r , an example. (a) The other components of the optical waveguide 1009 shown in Fig. 27(b) are partially different in thickness, and the guide 1009 is different from the optical waveguide 1 shown in Fig. 27(a) except for the respective cladding layers 109. 9 61 a 201222034 is the same. That is, in Fig. 27 (b), in each of the cladding layers 1〇91 and 1092, the thickness of the portion corresponding to the thick film portion 1943 is continuously reduced toward the left end portion of the core portion 1〇94. On the other hand, the thickness of the portion corresponding to the film portion 1944 is continuously increased toward the right end portion of the core portion 1094. Further, the total thickness of the optical waveguide 1009 shown in Fig. 27(b) is generally constant. As shown in Fig. 27(a), the waveguide 1009 can sufficiently improve the light-binding efficiency of the light-emitting element 1003 or the light-receiving element 1004 and the core portion 1〇94, and can improve the mechanical strength of the film portion 1944. The thickness of 1944 is reduced to increase the thickness of each of the cladding layers 1 〇 91 and 1 〇 92, so that the right end portion of the optical waveguide 1 009 can be prevented. The mechanical strength is lowered. Thereby, when the optical waveguide 1009 and the light receiving element 1〇〇4 are assembled, the right end portion can be prevented from being damaged. Fig. 27(c) is the optical waveguide 1〇〇9 shown in Fig. 27(a). Other configuration example 0 The optical waveguide 1〇〇9 shown in Fig. 27(c) is partially different in thickness except for the cladding layer 1〇91, and the thickness of the cladding layer 1092 is kept constant, as shown in Fig. 27(a). The optical waveguide 1 〇〇 9 is the same. That is, in Fig. 27 (c), the thickness of the portion of the cladding layer 1091 corresponding to the thick film portion 1 943 continuously decreases toward the left end portion of the core portion 1 〇 94, and on the other hand, The thickness of the portion corresponding to the thin portion 1944 is continuously increased toward the right end portion of the core portion 1 94. Further, the thickness of the cladding layer 1092 is kept constant regardless of the thick film portion 1943 or the film portion 1944. 1009, the same action and effect as the optical waveguide 1009 shown in Fig. 27(b) can be obtained. 62 201222034 Fig. 27 (d) is another configuration example of the optical waveguide 1009 shown in Fig. 27 (a). Fig. 27 (d) The optical waveguide 1〇〇9 shown is different from the position of the thick film portion 1943 and the film portion 1944, and the optical waveguide 1009 shown in Fig. 27(a). That is, in Fig. 27 (a), the thick film portion 1943 is disposed at the left end portion of the core portion 1094, and the film portion 丨 944 is disposed at the right end portion, whereas in Fig. 27 (d), the thick film portion 1943 The left end portion 'from the left end portion of the core portion 1094 moves toward the inner side (right side) only at a specific distance, and the thin film portion 1944 moves from the right end portion of the core portion 丨〇 94 toward the inner side (left side) only at a specific distance. Further, between the thick film portion i 943 and the left end surface of the core portion 1094 and between the film portion 1944 and the right end surface of the core portion 1094, there is a constant thickness portion 1945 having a constant cross-sectional area. In the optical waveguide 1009 described above, the same actions and effects as those of the optical waveguide 1009 shown in Fig. 27(a) can be obtained. Further, in the fourteenth and fifteenth embodiments, only the width of the core portion 1094 is continuously changed. In the present embodiment (the sixteenth embodiment), only the thickness of the core layer 1093 is continuously changed, and the core portion 1〇94 may be made. The width of the core layer 1093 and the thickness of the core layer 1093 are continuously changed. That is, the thickness of the core layer 1093 of the widened portion 1941 may also vary as the thick film portion 1943, and the thickness of the core layer 1〇93 of the reduced portion 1942 is also It can be changed as the film portion 1944. In this case, the above-described actions and effects are more remarkable than those of the respective embodiments. <Seventeenth Embodiment: Fig. 28> Fig. 28 shows a seventeenth embodiment of the optical waveguide structure 1 of the present invention 63 201222034. Hereinafter, the description will be made on the optical waveguide structure 100, and the same matters as those in the above-described sixteenth embodiment will be omitted, and the differences will be mainly described. Fig. 2 is a cross-sectional view showing the seventh embodiment. In the optical waveguide structure 1〇〇1 of the present embodiment, the configuration of the optical waveguide 1〇〇9 is the same as the above, and is the same as the above. That is, the optical waveguide 1 〇〇 9 shown in Fig. 28 (1), the thick portion (4) of the cross section, and the core portion 1 〇 94 of the thin film portion 1944 form a curve with the boundary line of each of the cladding layers 1091 and 1092. In the thick film portion we, the curve is a parabola two / opening toward the left end (one end) of the core portion 1094, and in the film portion, the curve is also toward the left end of the core portion 1 〇 94 (one end Part) Parabola of the opening.

於上述厚膜部分1943,,由於左側端面之面積較大’故 入射光之入射效率得到提高。又,自發光元件1〇〇3出射而 入射至核心部1094之光於核心部1〇94與包覆部ι〇95之邊 界面經反射時,以聚光於上述抛物線之焦點之方式進行反 射。其結果,可降低核心部1〇94中之漏光量。又,於薄骐 部分I944’中,傳播於核心部1094之光亦於核心部1〇94與 包覆部1095之邊界面經反射時聚光。其結果,可自薄膜部 分1944,之右側端面出射縮至更細之光。藉此’圖28 (aJ 所示之光波導1009成為對發光元件1003或受光元件1〇〇4 之光結合效率較高者。 圖28 ( b)、圖28 ( c)及圖28 ( d)分別為圖28 ( a) 所不之光波導1009之其他構成例。 64 201222034 该等除了圖27 ( b)、圖27 ( c)及圖27 ( d)分別所示 之厚膜部分1943及薄膜部分1944的核心部1094與各包覆 層1091、1〇92之邊界線形成抛物線以外,其與圖之8 (已) 所示之光波導1009相同。 再者’於上述第14、第15實施形態,僅核心部1〇94 之寬度連續變化,於本實施形態(第丨7實施形態),僅核 。層1093之厚度連續變化’亦可使核心部1 〇94之寬度與 核心層1093之厚度之兩者連續變化,即,加寬部分1941 或加寬部分1941,的核心層1〇93之厚度亦可如厚膜部分 1943或厚膜部分1943,般變化,減寬部分1942或減寬部分 1942’的核心層1〇93之厚度亦可如薄膜部分1944或薄膜部 分1944’般變化。於該情形時,與各實施形態相比,上述作 用、效果更加明顯。 〈第18實施形態:圖29、30 &gt; 於圖29表示本發明之光波導結構體丨〇〇1之第μ實施 形態。以下,對該光波導結構體1〇〇1進行說明,關於與上 述第14實施形態相同之事項,省略其說明,以不同點為中 心加以說明。 圖2 9係表示第1 8實施形態之剖面圖。 於本實施形態之光波導結構體1〇〇1,由基板1〇〇2與導 體層1005所構成之配線基板之構成與上述不同,其以外相 同。 即,圖29所不之配線基板具有,分別積層於光波導丨〇〇9 之長邊方向之兩端部之上面的基板1〇〇2、及設置於各基板 65 201222034 1002之上面之導體層1〇〇5。 於圖29之左側之基板1002裝載表面安裝型之發光元 件1003 '及驅動發光元件1〇〇3之發光的發光用ic (發光 用電氣元件)1035。發光元件1003與發光用1C之1〇35之 間係經由形成於導體層1 〇〇5之電氣配線而電連接。藉此, 可藉由發光用1C之1035控制發光元件1〇03之發光。即, 於左側之基板1002上構築具有發光元件1〇〇3與發光用ic 之1035之發光電路1300。 另一方面,於圖29之右側之基板1〇02裝載表面安裝 型之受光元件1004、及使藉由受光元件1〇〇4而接受之信號 增幅的受光用ic (受光用電氣元件)1045。受光元件1〇〇4 與爻光用1C之1045之間經由形成於導體層1〇〇5上之電氣 配線而電連接。藉此,藉由受光元件1004受光並轉換成電 氣信號後,將該電氣信號輸入至受光用IC之1〇45中而增 幅。即,於右側之基板1002上構築具有受光元件1〇〇4與 受光用1C之1045之受光電路14〇〇。 又,光波導1009中與發光元件1〇〇3之發光部1〇31之 正下方對應的位置形成光程轉換部1971。另一方面,光波 Μ受光元件_之受光部麗之正下方對應的 位置形成光程轉換部19 7 2。 各光程轉換部1971、1972係以藉由去除光波導ι〇〇9 之-部分,而具有去除部分之内面之—部分相對於光波導 1009之核〜部1〇94之軸線大致呈45。傾斜之傾斜面的方式 形成。該傾斜面作為如下反射面而發揮功能:以9〇。之角度 66 201222034 進行反射以使來自發光部1〇31之光導入核心部1094,或者 以90。之角度進行反射以使傳播於核心部1〇94之光導入受 光部1041中。 並且’可藉由光程轉換部1971、核心部1094及光程轉 換°卩1972光學連接發光部1 1與受光部1 〇41之間。藉此, 可藉由對發光電路1300與受光電路14〇0之間授受光而進 行光通信。 再者’於基板1〇〇2之厚度較薄之情形或基板1〇〇2具 有透光性之情形時,可如圖29般,以穿透基板1 〇〇2之方 式光千連接發光元件1〇〇3或受光元件1〇〇4與光波導 1〇〇9’視需要亦可沿著穿透基板1002之光之光程形成貫通 孔。 又,於反射面視需要亦可設置由金屬膜等構成之反射 膜。進而,亦可於去除部分填充折射率低於核心部⑺料之 材料。 圖30係表示第18實施形態所具備之光波導ι〇〇9之核 心層1093的平面圖。 圖30所示之核心層1093 (光波導⑽”具有於俯視 時核心部urn之寬度朝左側端部連續變大之加寬部分 1941、及核心部1〇94之寬度朝右 分194^ 而。P連續變小之減寬部 又’與加寬部分1941鄰接之光程轉換部1971以丈俯 視形狀包含加寬部分1941之左側端面 '、 你 p、+,土 β μ &lt;万式形成細長之形 狀。上述先程轉換部1971可高效地拢 筏焚自發光元件1003 67 201222034 之發光點放射之光而進行反射。其結果,光程轉換部丨97 i 有助於提高發光元件1003與核心部1094之光結合效率。 另一方面,與減寬部分! 942鄰接之光程轉換部丨972 亦形成其俯視形狀包含減寬部分1942之右側端面之形狀。 由於自減寬部分1942出射縮至較細之光,故可減小光程轉 換部1972之大小。 藉由上述各光程轉換部1971、1972與核心部1〇94而 構築光配線1098。 再者,於圖29,於光波導1 〇〇9之兩端部分別積層基板 1〇〇2,該基板1002之大小亦可為涵蓋光波導1〇〇9之總體 而積層程度之大小。於該情形時,涵蓋基板1 〇〇2之長邊方 向之總體而設置導體層1005,藉由在該導體層1〇〇5中形成 電氣配線亦可與上述光通信同時進行電氣通信。藉此,可 使光波導結構體1001之電路設計之自由度飛躍提高,亦提 高電路之積體度。此外,亦具有無需另外準備電氣通信用 之結構體之優點。 〈第19實施形態:圖31、32 &gt; 於圖31表示本發明之光波導結構體丨〇〇丨之第丨9實施 形態。以下,對該光波導結構體1〇〇1進行說明,關於與上 述第U、18實施形態相同之事項,省略其說明,以不同點 為中心加以說明。 圖31係表示第19實施形態所具有之光波導之核心層 的平面圖。 於本實施形態之光波導結構體丨〇〇丨,光波導丨〇〇9之構 68 201222034 成與上述不同,其以外相同。 即,於圖31所示之核心層1〇93 (光波導1〇〇9),於俯 視時並聯形成4根(複數根)由第18實施形態之核心部 1094、及與其對應之光程轉換部1971、1972所構成的光配 線 1098 。 4根光配線1098係分別於端部具有光程轉換部1971與 光程轉換部1 9 7 2者,於互相相鄰者彼此間,光程轉換部1 9 7 1 與光程轉換部1972之位置反轉。即,4根光配線1〇98中, 位於圖31之最上方者、與自上方起位於第三者係以光程轉 換部1971位於核心層1093之左側之方式形成。另一方面, 4根光配線1098中,自圖31之上方起位於第二及第四者係 以光程轉換部1971位於核心層1093之右側之方式形成。 如此,藉由使光配線1098中相鄰者彼此於長邊方向交 替反轉,而使必需更大空間之加寬部分1941彼此不會相 鄰。藉此,可更接近地配置光配線1098彼此,而提高光配 線1098之配設密度。其結杲,可謀求光波導結構體1〇〇1 之小型化及高積體化。 又,4根光配線1 098中,光程轉換部1 97 1位於右側之 2根與光程轉換部1971位於左側之2根係以於長邊方向上 偏移之方式形成。藉此,可使光配線1098彼此之間隔距離 進一步接近。其原因在於,必需相對較大空間之光程轉換 部1971及光程轉換部1972於長邊方向上偏移,故可避免 該等之干擾,可而於光配線1098彼此之間隔充裕。 再者,圖3 1所示之4根光配線1098之長度均為相同 69 201222034 程度,於各長度不同之情形時等,亦可以核心部1〇94之左 側或右側之任一者偏移之方式形成。 又,於圖31 ’ 4根光配線1098中,光程轉換部1971 位於右側之2根、及光程轉換部1971位於左側之2根分別 形成於長邊方向之相同位置,該等亦可以於長邊方向偏移 之方式形成。藉此’可使光配線1〇98彼此之間隔距離進一 步接近。 圖32係表示第丨9實施形態之平面圖。 圖32所示之光波導結構體1〇〇1具有分別積層於光波 導1009之長邊方向之兩端部之上面的基板ι〇〇2、及具備設 置於各基板1002之上面之導體層’ 1〇〇5的配線基板。 於圖32之左側之基板1〇〇2,根據各光程轉換部1971 之位置而裝載2個表面安裝型之發光元件1〇〇3、與1個發 光用1C之1035。各發光元件1〇〇3與發光用ic之1〇35之 間係經由形成於導體層1 〇〇5上之電氣配線!〇5 1而電連 接°藉此’可利用發光用1C之1035控制發光元件1〇〇3之 發光。即’於左側之基板1〇〇2構築具有發光元件1〇〇3與 發光用1C之1035之發光電路300。 又’於左側之基板1 〇〇2,根據各光程轉換部1972之位 置而裝载2個表面安裝型之受光元件丨0〇4與1個受光用IC 之1045。各受光元件ι〇〇4與受光用ic之1045之間係經由 形成於導體層1〇〇5上之電氣配線1051而電連接。藉此, 受光元件1〇〇4受光並轉換成電氣信號後,將該電氣信號輸 入至受光用1C之1045而增幅。即,於左側之基板上亦構 70 201222034 築具有受光元件1004與受光用ICl 045之受光電路1400, 而混載發光電路1300與受光電路1400。 另一方面,與左側之基板1002同樣地,於圖32之右 側之基板1002上亦可混載發光電路1300與受光電路1400。 根據上述光波導結構體1001,即便具有複數個光通信 之通道(光配線1098 ),亦可於面積相對較小之基板1〇〇2 上混載與複數個通道相對應之發光電路13〇〇與受光電路 1400。其結果,可實現光波導結構體1〇〇1之小型化及高積 體化。 Μ丄,対罘 ^ ^ ^ ^ 並非限定於該等者,只要不變更發明之主旨,亦可為其他 構成者。又,本發明亦可為組合有具備第丨〜第19實施形 態中之任意2種以上之實施形態構成者。 :亡所述,本發明之光波導結構體成為可自由地採取 *;)、、:折f vt而使基板或光波導彎曲之狀態(彎曲狀 狀離/者解除折彎#作而使基板或光波導伸張之狀態(伸張 行:電:。因A’例如可較佳地對含有鉸鏈部或滑動部之 :動電話、遊戲機,、筆記型個人 鏈部或滑動部使用。例如於行動 電子裝置之叙 體連接經由⑽部《2 ^ 光波導結構 鉸鏈部時,光波導結構體採:形時,當關閉行動電話之 光波導結構體採取伸當㈣鉸鏈部時, 藉此光波導結構體可長 之電連接及光學連接 人’ ’失持可動部之2點間 因此,3有光波導結構體之行動電 71 201222034 話(電子裝置)可提高其可靠性。 發光元件 進行光學 。尤其是, 效區域較 ,由於可 圍,故光 光波導結 又,如上所述之本發明之光波導結構體在盘 或受光元件、其他光波導、光纖之光通信用零: 連接時,成為具有可提高光結合效率之光波導者。 即便於連接指向性較低之發光元件、或受光之有 窄之受光兀件之情形時,亦可提高傳輸效率。又 擴大光波導與光通信用零件之位置偏移之容許範 波導或光通信用零件之安裝變得容易,而可提高 構體之製造容易性。 …又’藉由具備本發明之光波導結構體,可⑨2點間進 /亍门口口質之光通4 ,故可獲得可靠性較高之電子裝置(本 發明之電子裝置)。 再者,應用本發明之光波導結構體之電子裝置並不限 2上述者,例如可較佳地應用於行動電話、遊戲機、路由 器裝置、WDM裝置 '個人電腦、電視、家庭伺服器等電子 裝置類°亥專電子裝置均必須於例如LSI等演算裝置與 RAM等圮憶裝置之間高速傳輸大容量之資料。因此,藉由 使上述電子裝置含有本發明之光電氣混載基板,可消除電 氣配線特有之雜訊、信.號劣化等不良情形,故可期待其性 能之飛躍提高。 進而,光波導部分與電氣配線相比可大幅度削減發熱 置。因此,可提高基板内之積體度而謀求小型化,且可削 減冷卻所欲之電力,而可削減電子裝置整體之消耗電力。 &lt;光波導之製造方法&gt; 72 201222034 接著,對上述各實施形態中之光波導9、_(以下亦 記作光波導9)之製造方法及各部之構成材料等進行說明, 尤其是對核心部9,4、1〇94(以下亦記作核 方法進行詳細說明。 Μ 首先’於說明核心部94之形成方法之前,對用於形成 核心部94之感光性樹脂組成物進行說明。 (感光性樹脂組成物) 用於本實施形態之感光性樹脂組成物含有: (A )環烯樹脂、 (B) 折射率與(A)不同,且具有環狀醚基之單體及 具有環狀醚基之寡聚物中之至少一者'及 (C) 光酸產生劑。 其中’就確實地抑制光之傳播損失之產生之觀點而t, 較佳為含有於側鏈具有藉由由(C)光酸產生劑產生之 酸而脫離之脫離性基的環烯樹脂(A )、及 下述式(100)之單體。In the thick film portion 1943, since the area of the left end surface is large, the incident efficiency of incident light is improved. Further, when light emitted from the light-emitting element 1〇〇3 and incident on the core portion 1094 is reflected by the boundary surface between the core portion 1〇94 and the cladding portion ι 95, it is reflected so as to be concentrated on the focal point of the parabola. . As a result, the amount of light leakage in the core portion 1〇94 can be reduced. Further, in the thin portion I944', the light propagating through the core portion 1094 is also collected when the boundary between the core portion 1〇94 and the cladding portion 1095 is reflected. As a result, it is possible to retract from the right end surface of the film portion 1944 to a finer light. Therefore, the optical waveguide 1009 shown in aJ is a light combining efficiency with respect to the light-emitting element 1003 or the light-receiving element 1〇〇4. Fig. 28 (b), Fig. 28 (c), and Fig. 28 (d) These are other structural examples of the optical waveguide 1009 shown in Fig. 28(a). 64 201222034 These thick film portions 1943 and films are shown in Fig. 27 (b), Fig. 27 (c), and Fig. 27 (d), respectively. The core portion 1094 of the portion 1944 and the boundary line between the cladding layers 1091 and 1〇92 form a parabola, which is the same as the optical waveguide 1009 shown in Fig. 8. Further, in the above-mentioned 14th and 15th embodiments In the embodiment, only the width of the core portion 1〇94 is continuously changed. In the present embodiment (the seventh embodiment), only the core is continuously changed in thickness. The width of the core portion 1〇94 and the core layer 1093 can also be made. The thickness of both of the thicknesses, that is, the widened portion 1941 or the widened portion 1941, may be as thick as the thick film portion 1943 or the thick film portion 1943, and the widened portion 1942 may be widened or widened. The thickness of the core layer 1〇93 of the portion 1942' may also vary as the film portion 1944 or the film portion 1944'. In this case The above-described effects and effects are more apparent than those of the respective embodiments. <Embodiment 18: Figs. 29 and 30> Fig. 29 shows a μ-th embodiment of the optical waveguide structure 丨〇〇1 of the present invention. The optical waveguide structure 1 to 1 will be described, and the description of the same matters as those of the above-described fourteenth embodiment will be omitted, and the differences will be mainly described. Fig. 2 is a cross-sectional view showing the eighth embodiment. In the optical waveguide structure 1A1 of the present embodiment, the configuration of the wiring board formed by the substrate 1A2 and the conductor layer 1005 is the same as the above, and the wiring board of FIG. 29 has The substrate 1〇〇2 laminated on the upper surface of the both ends of the optical waveguide 丨〇〇9 and the conductor layer 1〇〇5 provided on the upper surface of each of the substrates 65201222034 and 1002. The substrate on the left side of FIG. 1002 is mounted on the surface-mounting type light-emitting element 1003' and the light-emitting ic (light-emitting electrical element) 1035 for driving the light-emitting element 1〇〇3. The light-emitting element 1003 and the light-emitting 1C are disposed between the light-emitting elements 1003. Layer 1 〇〇5 The gas wiring is electrically connected, whereby the light emission of the light-emitting element 1〇03 can be controlled by the light-emitting 1C 1035. That is, the light-emitting element 1〇〇3 and the light-emitting ic 1035 are formed on the substrate 1002 on the left side. On the other hand, the substrate 1 〇 02 on the right side of FIG. 29 is provided with a surface-mounting type light-receiving element 1004 and a light-receiving ic (light-receiving electric element) for amplifying a signal received by the light-receiving element 1〇〇4. ) 1045. The light-receiving element 1〇〇4 and the 1045 of the calendering 1C are electrically connected via an electric wiring formed on the conductor layer 1〇〇5. As a result, the light receiving element 1004 receives light and converts it into an electrical signal, and then the electrical signal is input to the light receiving IC 1 to 45 to increase the amplitude. In other words, a light receiving circuit 14A having 1045 of the light receiving element 1〇〇4 and the light receiving 1C is formed on the substrate 1002 on the right side. Further, an optical path conversion portion 1971 is formed at a position corresponding to the direct vicinity of the light-emitting portion 1A31 of the light-emitting element 1A3 in the optical waveguide 1009. On the other hand, the optical path converting portion 19 7 2 is formed at a position corresponding to the immediately below the light receiving portion of the light receiving element. Each of the optical path converting portions 1971 and 1972 is formed by removing the portion of the optical waveguide ι 9 and the portion having the inner surface of the removed portion is substantially 45 with respect to the axis of the core portion 1 〇 94 of the optical waveguide 1009. The inclined slope is formed in a manner. This inclined surface functions as a reflecting surface as follows: 9 inches. The angle 66 201222034 is reflected so that the light from the light-emitting portion 1〇31 is introduced into the core portion 1094, or 90. The angle is reflected so that the light propagating through the core portion 1〇94 is introduced into the light receiving portion 1041. Further, the optical path conversion unit 1971, the core portion 1094, and the optical path conversion 卩 1972 can optically connect the light-emitting portion 1 1 and the light-receiving portion 1 to 41. Thereby, optical communication can be performed by transmitting and receiving light between the light-emitting circuit 1300 and the light-receiving circuit 14〇0. Furthermore, when the thickness of the substrate 1〇〇2 is thin or the substrate 1〇〇2 has a light transmissive property, the light-emitting element can be lightly connected by penetrating the substrate 1〇〇2 as shown in FIG. 1〇〇3 or the light-receiving element 1〇〇4 and the optical waveguide 1〇〇9' may form a through-hole along the optical path of the light penetrating the substrate 1002 as needed. Further, a reflective film made of a metal film or the like may be provided on the reflecting surface as needed. Further, it is also possible to remove a material partially filled with a refractive index lower than that of the core portion (7). Fig. 30 is a plan view showing a core layer 1093 of the optical waveguide 11 of the eighteenth embodiment. The core layer 1093 (the optical waveguide (10)" shown in Fig. 30 has a widened portion 1941 in which the width of the core portion urn is continuously increased toward the left end portion in plan view, and the width of the core portion 1〇94 is divided toward the right. The widened portion in which P continuously decreases is further 'the optical path conversion portion 1971 adjacent to the widened portion 1941 includes the left end surface of the widened portion 1941 in a plan view shape, and you p, +, soil β μ &lt; The shape of the light-emitting element 1003 and the core portion can be efficiently reflected by the light-receiving portion of the light-emitting element 1003 67 201222034. The light combining efficiency of 1094. On the other hand, the optical path converting portion 972 adjacent to the widened portion 942 also has a shape in which the shape of the right side of the widened portion 1942 is included in the plan view. Since the light is light, the size of the optical path conversion unit 1972 can be reduced. The optical wiring 1098 is constructed by the optical path conversion units 1971 and 1972 and the core unit 1〇94. Further, in Fig. 29, the optical waveguide 1 is used.两端9 1〇〇2, the size of the substrate 1002 may be a size that covers the entirety of the optical waveguide 1〇〇9. In this case, the conductor layer 1005 is disposed to cover the entire longitudinal direction of the substrate 1〇〇2. By forming electrical wiring in the conductor layer 1A5, electrical communication can be performed simultaneously with the above-described optical communication. Thereby, the degree of freedom in circuit design of the optical waveguide structure 1001 can be greatly improved, and the product of the circuit can be improved. In addition, there is an advantage that it is not necessary to separately prepare a structure for electrical communication. <19th Embodiment: Figs. 31 and 32> Fig. 31 shows a ninth aspect of the optical waveguide structure of the present invention. In the following, the optical waveguide structure 1〇〇1 will be described, and the description of the same items as the above-described U and 18 embodiments will be omitted, and the differences will be mainly described. A plan view of the core layer of the optical waveguide of the embodiment. In the optical waveguide structure of the present embodiment, the configuration of the optical waveguide 689 201222034 is different from the above, and is the same as the above. The core layer 1 〇 93 (optical waveguide 1 〇〇 9) is formed in parallel in plan view, and four (multiple roots) are formed by the core portion 1094 of the eighteenth embodiment and the optical path conversion portions 1971 and 1972 corresponding thereto. The optical wiring 1098. The four optical wirings 1098 each have an optical path conversion unit 1971 and an optical path conversion unit 197 at the end, and are adjacent to each other, and the optical path conversion unit 1 9 7 1 and the light The position of the conversion unit 1972 is reversed. That is, among the four optical wirings 1 to 98, the uppermost portion of FIG. 31 and the third portion from the upper side are located on the left side of the core layer 1093 by the optical path conversion unit 1971. The way is formed. On the other hand, in the four optical wirings 1098, the second and fourth portions are formed from the upper side of Fig. 31 so that the optical path conversion portion 1971 is located on the right side of the core layer 1093. Thus, by making the adjacent ones of the optical wirings 1098 alternate with each other in the longitudinal direction, the widened portions 1941 which are required to have a larger space are not adjacent to each other. Thereby, the optical wirings 1098 can be arranged closer to each other, and the arrangement density of the optical wirings 1098 can be increased. In addition, it is possible to reduce the size and integration of the optical waveguide structure 1〇〇1. Further, in the four optical wirings 1 098, the optical path conversion unit 1 97 1 is formed such that two of the right side and the optical path conversion unit 1971 are located on the left side, and are shifted in the longitudinal direction. Thereby, the distance between the optical wirings 1098 can be made closer to each other. This is because the optical path converting portion 1971 and the optical path converting portion 1972 which are required to have a relatively large space are shifted in the longitudinal direction, so that the interference can be avoided, and the optical wirings 1098 can be sufficiently spaced from each other. Furthermore, the lengths of the four optical wirings 1098 shown in FIG. 31 are the same as the degree of 2012 20123434. When the lengths are different, the left or the right side of the core portion 1〇94 may be offset. The way is formed. Further, in the four optical wirings 1098 of FIG. 31, the optical path conversion unit 1971 is located on the right side and the optical path conversion unit 1971 is located on the left side at the same position in the longitudinal direction, and the like. The long side direction is offset. Thereby, the optical wirings 1 to 98 can be further spaced apart from each other. Figure 32 is a plan view showing a ninth embodiment. The optical waveguide structure 1〇〇1 shown in FIG. 32 has a substrate ι 2 stacked on both ends of the optical waveguide 1009 in the longitudinal direction, and a conductor layer provided on the upper surface of each substrate 1002. 1〇〇5 wiring board. On the substrate 1〇〇2 on the left side of Fig. 32, two surface-mount type light-emitting elements 1〇〇3 and one light-emitting 1C 1035 are mounted in accordance with the position of each optical path conversion unit 1971. Between each of the light-emitting elements 1〇〇3 and 1'35 of the light-emitting ic, the electrical wiring formed on the conductor layer 1〇〇5 is passed through! 〇5 1 is electrically connected to thereby illuminate the light-emitting element 1〇〇3 by the light-emitting 1C 1035. That is, the light-emitting circuit 300 having the light-emitting element 1〇〇3 and the light-emitting 1C 1035 is constructed on the substrate 1〇〇2 on the left side. Further, on the substrate 1 〇〇 2 on the left side, two surface-mounting light-receiving elements 丨0 to 4 and one light-receiving IC 1045 are mounted in accordance with the position of each of the optical path conversion units 1972. The light-receiving element ι4 and the light-receiving ic 1045 are electrically connected via the electric wiring 1051 formed on the conductor layer 1A5. Thereby, the light receiving element 1〇〇4 receives light and converts it into an electrical signal, and then the electrical signal is input to the light receiving 1C at 1045 to increase the amplitude. In other words, the light-receiving circuit 1400 having the light-receiving element 1004 and the light-receiving IC1 045 is formed on the substrate on the left side, and the light-receiving circuit 1300 and the light-receiving circuit 1400 are mixed. On the other hand, similarly to the substrate 1002 on the left side, the light-emitting circuit 1300 and the light-receiving circuit 1400 may be mixed on the substrate 1002 on the right side of Fig. 32. According to the above optical waveguide structure 1001, even if there are a plurality of optical communication channels (optical wiring 1098), the light-emitting circuits 13 corresponding to the plurality of channels can be mixed on the substrate 1〇〇2 having a relatively small area. Light receiving circuit 1400. As a result, it is possible to achieve miniaturization and high integration of the optical waveguide structure 1〇〇1. Μ丄, 対罘 ^ ^ ^ ^ is not limited to these, and may be other constituents as long as the subject matter of the invention is not changed. Furthermore, the present invention may be configured by combining any two or more embodiments having the second to the ninth embodiments. In the optical waveguide structure of the present invention, the substrate or the optical waveguide is bent in a state in which the optical waveguide structure of the present invention can be flexibly folded (f) to bend the substrate or the optical waveguide. Or the state in which the optical waveguide is stretched (extension: electric: because A' can be preferably used for a mobile phone, a game machine, a note-type personal chain or a sliding portion, for example, in the action. When the electronic device is connected via the (10) part of the "2 ^ optical waveguide structure hinge portion, when the optical waveguide structure is shaped, when the optical waveguide structure of the mobile phone is closed, the (four) hinge portion is adopted, thereby the optical waveguide structure The electrical connection and the optical connection of the human body can't be held between the two points of the movable part. Therefore, the mobile power of the optical waveguide structure is improved by the ability of the electronic device. Yes, the optical region is the same as the optical region, and the optical waveguide structure of the present invention has the optical communication structure of the optical disk or the light-receiving element, the optical waveguide, and the optical fiber. Can mention Optical waveguides with optical coupling efficiency, that is, when it is convenient to connect a light-emitting element having a low directivity or a light-receiving light-receiving member, the transmission efficiency can be improved, and the position of the optical waveguide and the optical communication component can be increased. The mounting of the allowable waveguide or the optical communication component is easy, and the manufacturing ease of the structure can be improved. Further, by providing the optical waveguide structure of the present invention, the mouth can be in/out at 92 points. The optical device 4 can provide a highly reliable electronic device (the electronic device of the present invention). Further, the electronic device to which the optical waveguide structure of the present invention is applied is not limited to the above, and can be preferably applied, for example. For mobile phones, game consoles, router devices, WDM devices, personal computers, televisions, home servers, and other electronic devices, high-speed electronic devices must be transmitted at high speed between computing devices such as LSIs and RAM devices. Therefore, by including the optical-electric hybrid substrate of the present invention in the electronic device, it is possible to eliminate problems such as noise and deterioration of the electric wiring. In addition, the optical waveguide portion can be significantly reduced in heat generation compared with the electric wiring. Therefore, the size of the substrate can be increased and the size can be reduced, and the power required for cooling can be reduced, and the electrons can be reduced. [Electric power consumption of the whole device. &lt;Manufacturing method of optical waveguides] 72 201222034 Next, the manufacturing method of the optical waveguide 9, _ (hereinafter also referred to as optical waveguide 9) and the constituent materials of the respective components in the above embodiments are performed. In particular, the core portions 9, 4, and 1 94 (hereinafter also referred to as the core method will be described in detail. Μ First, before the method of forming the core portion 94, the photosensitive resin composition for forming the core portion 94 is described. (Photosensitive Resin Composition) The photosensitive resin composition used in the present embodiment contains: (A) a cycloolefin resin; (B) a refractive index different from (A) and having a cyclic ether group And at least one of the oligomers having a cyclic ether group and (C) a photoacid generator. In the above, it is preferable to contain a cycloolefin resin having a debonding group which is desorbed by an acid generated by the (C) photoacid generator in the side point of the viewpoint of suppressing the generation of light propagation loss. And a monomer of the following formula (100).

(100) 上述感光性樹脂組成物成形為膜狀而形成光波導开4成 73 201222034 用膜’進而用作含有折射率不同之區域之膜,例如光波導 膜。 即藉由使用上述感光性樹脂組成物,可提供光之傳 播損失之產生得到抑制之光波導膜等。其中,於形成彎曲 之光波導之情形時,可明顯抑制光之傳播損失之產生。 進而,可提供使用上述光波導膜之光配線、含有上述 光配線與電氣電路之光電氣混載基板。根據上述光配線及 光電氣混載基板,τ改善於先前之電氣配線中成為問題之 ΕΜΙ (電磁干擾),可較先前大幅度提高信號傳達速度。 又,亦可提供使用光波導膜 波導膜’可謀求省空間化,故可有助於電子裝置之小型化 作為上述電子裝置,具體可列舉:電腦、飼服器1 動電話、遊戲機器、記憶體測試器、外觀檢査機器人等。 二下’依序對感光性樹脂組成物之成分進料細閣述‘ ((A)環烯樹脂) 馬碩保感光性樹脂組成物之 成形性而添加纟,且係成為基質聚合物者。 此處,環稀樹脂可為未經取代者 所取代者。 j j馮虱經其他 系樹脂等 作為環稀樹脂,例如可列舉降获 脂笙β 〃日 本% 丁烯 其中’就耐熱性、透明性等觀點而 莰烯系樹脂。 °較佳為使用降 作為降莰烯系樹脂,例如可列舉: 74 201222034 .(1)使降莰烯型單體進行加成(共)聚合而獲得之降 莰烯型單體之加成(共)聚合物、 (2)降莰烯型單體與乙烯一烯烴類之加成共聚 物、 (3 )降莰烯型單體與非共軛二烯、及視需要之其他單 體之加成共聚物之類之加成聚合物、 (4 )降莰烯型單體之開環(共)聚合物、及視需要使 該(共)聚合物氫化而成之樹脂、 (5) 降或婦型單體與乙稀或^ 一稀煙類之開環丑聚 物、及視需要使該(共)聚合物氫化而成之樹脂、 (6) 降莰烯型單體與非共軛二烯、或其他單體之開環 共聚物、及視需要使該(共)聚合物氫化而成之聚合物之 類之開環聚合物。作為該等聚合物,彳列舉無規共聚物、 嵌段共聚物、交替共聚物等。 路寻陴坎綿糸樹脂例如可藉由開環複分解聚合 (ROMP)、ROMP與氫化反應之組合、利用自由基或陽離 子之聚合、使用陽離子性鈀聚合起始劑之聚合、使用其以 外之聚合起始齊| (例如鐘^ λ 〈列如螺或其他過渡金屬之聚合起始劑) 之聚合等公知之所有聚合方法而獲得。 -亥寻之中,作為降㈣系樹脂,較佳為加成(共)聚 合物。就富於透明,生、耐熱性及可撓性之方面而言,加成 (共)聚合物亦較佳。例如有時藉由感光性樹脂組成物形 成膜後^由焊料而安裝電氣零件等。於上述情形時,必 須具有較网之耐熱性即耐回焊性,故較佳為加《(共)聚 75 201222034 合物。又,藉由感光性樹脂組成物形成膜而組入製品中時, 有時例如於80°C左右之環境下使用。於上述情形時,就確 保耐熱性之觀點而言,較佳為加成(共)聚合物。 其中,降莰烯系樹脂較佳為含有具有含聚合性基之取 代基的降莰烯之重複單位、或具有含有芳基之取代基的降 莰烯之重複單位者。 作為具有含有聚合性基之取代基的降莰烯之重複單 位,較佳為具有含有環氧基之取代基的降莰烯之重複單 位、具有含有(甲基)丙烯酸基之取代基的降莰烯之重複單 位、及具有含有烷氧基矽基之取代基的降莰烯之重複單位 中之至)1種。於各種聚合性基中’就反應性較高之方面 而言’較佳為該等聚合性基。 種以上之上述含有聚合性基之降莰(100) The photosensitive resin composition is formed into a film shape to form an optical waveguide, and the film is used as a film having a region having a different refractive index, for example, an optical waveguide film. In other words, by using the above-mentioned photosensitive resin composition, it is possible to provide an optical waveguide film or the like which suppresses generation of light propagation loss. Among them, in the case of forming a curved optical waveguide, the occurrence of light propagation loss can be remarkably suppressed. Further, it is possible to provide an optical wiring using the optical waveguide film, and an optical-electric hybrid substrate including the optical wiring and the electric circuit. According to the optical wiring and the optical-electric hybrid substrate, τ is improved as a problem (electromagnetic interference) which is a problem in the prior electrical wiring, and the signal transmission speed can be greatly improved as compared with the prior art. Further, since the use of the optical waveguide film waveguide film can be provided to save space, it is possible to contribute to downsizing of the electronic device as the above-mentioned electronic device, and specific examples thereof include a computer, a feeding device, a mobile phone, a game device, and a memory. Body tester, visual inspection robot, etc. In the case of the composition of the photosensitive resin composition, the composition of the photosensitive resin composition is sequentially added. ((A) Cycloolefin resin) The moldability of the photosensitive resin composition of Mashio is added, and ruthenium is added, and it is a matrix polymer. Here, the ring-thin resin may be replaced by an unsubstituted one. J j von 虱 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他° is preferably used as a norbornene-based resin, and for example, 74 201222034 (1) addition of a norbornene-type monomer obtained by addition (co)polymerization of a norbornene-type monomer ( Co-polymer, (2) addition copolymer of norbornene type monomer and ethylene monoolefin, (3) norbornene type monomer and non-conjugated diene, and other monomers as needed An addition polymer such as a copolymer, (4) a ring-opening (co)polymer of a norbornene type monomer, and a resin obtained by hydrogenating the (co)polymer as needed, (5) a ring-opening ugly polymer of a cation monomer and ethylene or a thin smog, and a resin obtained by hydrogenating the (co)polymer as needed, (6) a norbornene type monomer and a non-conjugated two A ring-opening polymer such as a ring-opening copolymer of an olefin or another monomer, and a polymer obtained by hydrogenating the (co)polymer as needed. As such polymers, hydrazines include random copolymers, block copolymers, alternating copolymers and the like. The resin can be obtained by, for example, ring-opening metathesis polymerization (ROMP), combination of ROMP and hydrogenation reaction, polymerization using a radical or a cation, polymerization using a cationic palladium polymerization initiator, and polymerization using the same. It is obtained by all known polymerization methods such as polymerization of a ring ^ λ < column such as a polymerization initiator of a spiro or other transition metal. In the middle of the search, as the (four)-based resin, an addition (co)polymer is preferred. Addition (co)polymers are also preferred in terms of transparency, heat, heat resistance and flexibility. For example, an electrical component or the like may be mounted by solder after forming a film by a photosensitive resin composition. In the above case, it is necessary to have the heat resistance of the net, that is, the reflow resistance, so it is preferable to add "(co)poly 75 201222034 compound. Moreover, when forming a film by a photosensitive resin composition and incorporating into a product, it may be used, for example, in the environment of about 80 degreeC. In the above case, an addition (co)polymer is preferred from the viewpoint of ensuring heat resistance. Among them, the norbornene-based resin is preferably a repeating unit containing a norbornene having a substituent containing a polymerizable group or a repeating unit having a norbornene having a substituent of an aryl group. The repeating unit of the norbornene having a substituent containing a polymerizable group is preferably a repeating unit of norbornene having a substituent having an epoxy group, and a rhodium having a substituent containing a (meth)acryl group. One of the repeating units of the alkene and one of the repeating units of the norbornene having a substituent containing an alkoxyfluorenyl group. Among the various polymerizable groups, 'the polymerizable group is preferred in terms of high reactivity. More than the above-mentioned hail containing polymerizable groups

又,若使用含有 烯之重複單位者,則 另一方面,藉由 重複單位,可南丨田 76 201222034 ⑷藉二In addition, if a repeating unit containing an olefin is used, on the other hand, by repeating the unit, Nandatian 76 201222034 (4)

(式(1)中,R!表示碳數卜 — ^ Μ 〇. , * _ , 10之燒基,a表示 之整數’1)表不1〜3之Μ权 〜3 ,Pi/qi為2〇以下) 式(1 )之降莰烯系樹脂 猎由以下方式劁造。 錯由使具有1^之降茨稀、與於側鍵 &quot; 烯溶解於甲苯中,並使 、.,、有%氧基 &lt; 降扛 、&quot;人 用Nl化合物(A)作為㉚ 牛故 液聚合而獲得(1)。 為觸媒進行落(In the formula (1), R! represents the carbon number - ^ Μ 〇., * _ , 10 is the base, a represents the integer '1), the table is not 1 to 3, the weight is ~3, and the Pi/qi is 2 〇The following) The decene-based resin of formula (1) is smashed in the following manner. The error is caused by having 1^, and the side bond &quot; olefin is dissolved in toluene, and, ., has % oxy &lt; 扛, &quot; human Nl compound (A) as 30 牛Therefore, liquid polymerization is carried out to obtain (1). Falling into the catalyst

Ph Ph Η \ /Ph Ph Η \ /

(A) 再者 於側鍵具有環备甘 ,衣氧基之降莰烯之製 方法例如 77 201222034 (i) ( i i )所述。 (〇降莰烯曱醇(NB-CH2-〇H)之合成 使藉由DCPD (二環戊二烯)之裂解而生成之cpd (環 戍二烯)與〇:烯烴(CH2=CH-CH2-OH)於高溫高壓下反 應0(A) Further, the method of producing a decene having a ring-forming group and a methoxy group in the side bond is as described in, for example, 77 201222034 (i) (i i ). (Synthesis of terpene decyl sterol (NB-CH2-〇H) cpd (cyclodecadiene) and hydrazine: olefin (CH2=CH-CH2) formed by cleavage of DCPD (dicyclopentadiene) -OH) reacts at high temperature and pressure

Δ 〇Δ 〇

X= CI^OH (ii )環氧降莰烯之合成 藉由降莰烯甲醇與表氣醇之反應而生成。X = CI^OH (ii) Synthesis of epoxy norbornene It is formed by the reaction of norbornene methanol with surface gas alcohol.

再者,於式⑴中,於…或3之情形時 氣醇之亞曱基變成伸乙基、伸丙基等者。 衣 式(1)所表示之降莰烯系樹脂中,就可 耐熱性之並存之觀點而言,尤佳為心為碳數卜10之燒生與 且…分料1之化合物’例如丁基降获烯與甲心二, 基喊降㈣之共聚物、己基㈣_甲基 4兩 烯之共聚物、癸基降莰烯與甲A 土醚降莰 兴^基%氧丙基醚降莰烯之共聚 78 201222034 物等。Further, in the formula (1), in the case of ... or 3, the fluorenylene sulfhydryl group becomes an ethyl group, a propyl group or the like. In the norbornene-based resin represented by the formula (1), in view of the coexistence of heat resistance, it is particularly preferable that the compound is a compound of a carbon number of 10 and a compound of the compound 1 such as a butyl group. A copolymer of alkene and ketone II, a copolymer of keithing (4), a copolymer of hexyl (tetra)-methyl 4 olefin, a decyl decene and a methyl ether, a hydroxypropyl ether Copolymerization of olefins 78 201222034 and the like.

(2) R3 (式(2)中,R2表示碳數ι〜1〇 ^ ^ _ 2 士《甘 * λ 疋基’ R3表示氫原 子或曱基’ c表示0〜3之整數,一2為2〇以下) 式⑺之降茨烯系樹脂可藉由使具有R2之降获稀盘 於側鏈具有丙烯酸基及甲基丙稀酸基之降“溶解於甲/苯 中,使用上述Ni化合物(a )作蛊缻树、办&gt; 初〈A)作為觸媒進行溶液聚合而獲 得。 再者,4⑺所表示之降莰烯系聚合物中,就可撓性 與耐熱性之兩立之觀點而言,尤佳為h為碳數4〜1〇之烷 基,且c為1之化合物,例如丁基降莰烯與丙烯酸2_ (5 — 降坎烯基)甲酯之共聚物、己基降莰烯與丙烯酸2 — (5 —降 茨稀基)甲醋之共聚物、癸基降莰烯與丙烯酸2〜(5_降获 烯基)甲酯之共聚物等。 79 201222034(2) R3 (in the formula (2), R2 represents a carbon number ι~1〇^^ _ 2 士 "甘 * λ 疋 ' ' R3 represents a hydrogen atom or a thiol group c represents an integer of 0 to 3, a 2 is 2) The following formula (7) of the decyl-based resin can be dissolved in a/benzene by the reduction of the acrylic group and the methyl acrylate group in the side chain of the reduced rare disk having R2, using the above-mentioned Ni compound (a) eucalyptus, office &gt; initial <A) is obtained by solution polymerization as a catalyst. Further, in the norbornene-based polymer represented by 4 (7), flexibility and heat resistance are both established. In view of the above, a compound wherein h is a C 4 to 1 fluorene alkyl group and c is 1, for example, a copolymer of butyl norbornene and 2 - (5 - pentanyl) methyl acrylate, hexyl group Copolymer of norbornene with acrylic acid 2-(5-norzyl) methyl vinegar, copolymer of fluorenyl norbornene with acrylic acid 2~(5_epo-alkenyl)methyl ester, etc. 79 201222034

3 (式(3)中,R4表示碳數1〜1〇之烷基,各心分另 獨立表示碳數1〜3夕、拉其 J之烷暴d表不〇〜3之整數,p3/q3 $ 20以下) &quot; 式(3 )之樹脂可藉由使具有&amp;之降莰烯、與於側鏈多 有烧氧基石夕基之降获烯溶解於曱苯中,使用上述%化合彩 (A)作為觸媒進行溶液聚合而獲得。 再者,式(3)所表示之降莰烯系聚合物中,尤佳為尺 為反數4〜1〇之烧基,且4為i或2, &amp;為甲基或乙基之# 合物,例如丁基降获烯與降获烯基乙基三甲氧基石夕烷之兴 聚物、己基降获烯與降㈣基乙基三甲氧基魏之共聚 物、録降获稀與降获稀基乙基三曱氧基石夕烧之共聚物、 :基降坎烯與三乙氧基矽基降莰烯之共聚物、己基降莰稀 與三乙氧切基降㈣之共聚物、癸基降莰烯與三乙氧基 矽:降莰烯之共聚物、丁基降莰烯與三甲氧基矽基降莰烯 =共聚物、己基降获烯與三甲氧基碎基降获烯之共聚物、 癸基降U與三甲氧切基㈣烯之共聚物等。 2012220343 (In the formula (3), R4 represents an alkyl group having a carbon number of 1 to 1 Å, and each of the cores is independently represented by a carbon number of 1 to 3 Å, and an alkane burst of the argon is not an integer of 3, p3/ Q3 $20 or less) &quot; The resin of the formula (3) can be obtained by dissolving the decene having &amp; and the reduced olefin having an alkyloxy group in the side chain in the benzene, using the above-mentioned % compound Color (A) was obtained as a catalyst for solution polymerization. Further, in the norbornene-based polymer represented by the formula (3), it is particularly preferably an anthracene having an inverse number of 4 to 1 Å, and 4 is i or 2, and is a methyl group or an ethyl group. a compound such as a butyl-reduced olefin with a polyether derived from an alkenylethyltrimethoxy-xanthene, a copolymer of hexyl-reduced ene and a (tetra)ethyltrimethoxy-propane, a copolymer of dilute ethyl tributary trioxane, a copolymer of carbene and triethoxy decyl decene, a copolymer of hexyl carbazide and triethoxy decyl (4), Mercapto-decene and triethoxy hydrazine: a copolymer of norbornene, butyl decene and trimethoxy decyl decene = copolymer, hexyl-reduced olefin and trimethoxy-based olefin The copolymer, a copolymer of thiol-reduced U and trimethoxy succinyl (tetra) olefin, and the like. 201222034

4 (式中,Rs表示碳數1〜10之烷基’心及Μ分別獨立 表示下述S (5)〜(7)所表示之取代基,但並不同時為 同一之取代基。又,p4/q4 + r為以下) ‘ 藉由使具有R5之降茨稀、與於側鍵具有〜及 莰烯溶解於甲苯中,使用Ni 2降 液聚合而獲得⑷。 化。物(幻作為觸媒進行溶4 (wherein Rs represents an alkyl group having 1 to 10 carbon atoms, and oxime independently represents a substituent represented by the following S (5) to (7), but is not the same substituent at the same time. P4/q4 + r is the following). (4) is obtained by dissolving R5, and the side bond having ~ and terpene dissolved in toluene, and using Ni 2 down-liquid polymerization to obtain (4). Chemical. Material (phantom dissolved as a catalyst)

(式(5)中,e表示〇〜3之整數,f表示 3之整數) 201222034 °V-〇 數)(In the formula (5), e represents an integer of 〇~3, and f represents an integer of 3) 201222034 °V-〇 number)

(式( 6 中(in the formula (6

示氫原子或甲基,g表示 之整Showing a hydrogen atom or a methyl group, and g means

(式(7)中 表示。〜3之整數)4刀別獨立表不碳數1〜3之烷基,h 再者作為式(4)所表示之降乒嬌 列舉:丁基降莰 人烯系聚合物,例如可 ., 砍烯、己基降莰烯或癸基降莰烯之# . 與丙烯酸2一(5一降乒铳其、田t 〜人烯之任-者、 某計 ⑴曰及降获烯基乙基三甲氧(Expressed in the formula (7). Integer of ~3) 4 knives are not independently represented by the alkyl group having 1 to 3 carbon atoms, and h is further represented by the formula (4): butyl hydrazine A polymer, for example, a decene, a hexyl decene or a decyl decene #. with an acrylic acid 2 (5 a ping ping 、, a t t ~ a ene ren - a certain (1) 曰Alkenyl ethyltrimethoxy

基夕烧、三乙氧朗降获稀或三甲氧基石夕基降㈣J -者之三元共聚物;丁基降获稀、己基降㈣或癸基降获 稀之任-者、與丙烯酸2—(5—降㈣基)㈣、及f基環 氧丙基麵降获烯之三元共聚物;丁基降莰烯、己基降莰烯 82 201222034 或癸基降莰烯之任一者、與曱基環氧丙基醚降莰烯、降获 稀基乙基三曱氧基矽烷、三乙氧基矽基降莰烯或三曱氧基 石夕基降莰烯之任一者之三元共聚物等。A ternary copolymer with a dilute or a trimethoxy sulphate (4) J-form; a butyl reduction, a hexyl reduction (tetra) or a thiol reduction, and an acrylic acid 2 —(5—falling (tetra)yl) (d), and f-based epoxypropyl surface-reduced olefinic terpolymer; butyl norbornene, hexyl nordecene 82 201222034 or decyl-decene, Ternary with any of decyl epoxy propyl ether decene, reduced dilute ethyl tridecyl decane, triethoxy decyl decene or tridecyl decyl decene Copolymers, etc.

(式(8)中’I表示1〜10之烷基,Rs表示氫原子、 曱基或乙基’ Ar表示芳基,乂丨表示氧原子或亞曱基,^表 示碳原子或矽原子,i表示0〜3之整數,j表示1〜3之整 數,p5/q5為20以下) 藉由使具有R7之降莰烯、與於側鏈含有_ (CH2) __ χ 一X2(R8)3_j(Ar)j之降莰烯溶解於曱苯中,使用Ni化合物作 為觸媒進行溶液聚合而獲得(8 )。 再者,式(8)所表示之降莰烯系聚合物中,較佳為父 為氧原子、X2為矽原子、Ar為笨基者。 進而,就可撓性、耐熱性及折射率控制之觀點而言, 尤佳為R7為碳數4〜10之烷基、Χι為氧原子、&amp;為矽原子、 Ar為苯基、Rs為甲基、i為1、j為2之化合物,例如丁基 83 201222034 降获稀與二苯基曱基降获 干吹碲甲礼基矽烷之共聚物、己基降 莰烯與二苯基曱基降茲,膝 常人烯甲氧基矽烷之共聚物、癸基降莰 烯與二苯基曱基降莰烯甲 吹碲甲氧基矽烷之共聚物等。 具體而言,較佳兔# , 平住為使用如下之降莰烯系樹脂。(In the formula (8), 'I represents an alkyl group of 1 to 10, Rs represents a hydrogen atom, a fluorenyl group or an ethyl group. 'Ar represents an aryl group, 乂丨 represents an oxygen atom or an anthracene group, and ^ represents a carbon atom or a ruthenium atom, i represents an integer of 0 to 3, j represents an integer of 1 to 3, and p5/q5 is 20 or less.) By lowering the decene having R7 and _(CH2)__ χ to X2(R8)3_j in the side chain The terpene of (Ar)j is dissolved in toluene, and solution polymerization is carried out using a Ni compound as a catalyst to obtain (8). Further, in the norbornene-based polymer represented by the formula (8), it is preferred that the parent is an oxygen atom, X2 is a halogen atom, and Ar is a stupid base. Further, from the viewpoint of flexibility, heat resistance and refractive index control, it is particularly preferred that R7 is an alkyl group having 4 to 10 carbon atoms, Χ is an oxygen atom, &amp; is a halogen atom, Ar is a phenyl group, and Rs is a compound in which methyl, i is 1, and j is 2, for example, butyl 83 201222034, a copolymer of dilute and diphenyl fluorenyl, which is a dry-blown decyl decane, hexyl norbornene and diphenyl fluorenyl Descending, a copolymer of knee olefinic methoxy decane, a copolymer of decyl decylene and diphenyl fluorenyl decylene, and a methoxy decane. Specifically, it is preferred that the rabbit # is used to use a norbornene-based resin as follows.

(9 可為式⑴ 、:、性及折射率控制之觀點而言,亦 心為碳M、^a7 1〇之烧基、Xl為亞甲基、 合物:4基、R8為氣原子、1為為1之化 降茨二=降㈣與苯基乙基降㈣之共聚物、己基 基降==稀之共聚物、癸基降編苯基乙 進而’亦可使用如下者作為降莰烯系樹脂。 84 201222034(9) From the viewpoints of the formula (1), :, and the refractive index control, the carbon is also a carbon group, the alkyl group of Xa1 is 〇, the X1 is a methylene group, the compound is 4 groups, and R8 is a gas atom. 1 is a copolymer of 1 = Desc. 2 = 降 (4) and phenylethyl ( (4), hexyl group = = = dilute copolymer, fluorenyl group phenyl group B can be used as the following Ethylene resin. 84 201222034

基,較佳為s:降低樹脂之折射率之脫離性 少為—8卜二苯基結構及-〇1卜二苯基結構之至 例如’式⑴所表示之降㈣U合物中,X1為氧原 、\為矽原子、Ar為苯基者成為具有脫離性基者。 又,式(3)中,有時於烷氧基矽基之 分脫離。 χ3之部 例如,於使用式(9)之降获稀系樹脂之情形時,可推 85 201222034 測藉由由光酸產生劑(記作PAG)產生之酸,如以下般進 行反應。再者,此處,僅表示脫離性基之部分,又對i = 1之情形進行說明。The base, preferably s: the detachment of the refractive index of the resin is reduced to be -8 di-diphenyl structure and - 〇1 di-diphenyl structure to, for example, the descending (tetra) U compound represented by the formula (1), X1 is Oxygen, \ is a ruthenium atom, and Ar is a phenyl group. Further, in the formula (3), the alkoxy fluorenyl group may be separated. For example, in the case where the rare resin is obtained by the formula (9), the acid generated by the photoacid generator (referred to as PAG) can be measured by the following method, and the reaction is carried out as follows. Here, only the part of the detachment group is shown here, and the case where i = 1 is explained.

進而 氧基者。 果。 #除了式(9 )之結構以外,亦可為於側鏈具有環 :由使用上述者具有可形成密著性優異之膜之效 作為具體例,有如下者。Further oxygen. fruit. In addition to the structure of the formula (9), the side chain may have a ring: the film having excellent adhesion can be used as a specific example, and the following are specific examples.

(式(31 )中, 式(31)所示之 二苯基曱基降莰烯曱 ?7/(17+1*2為 2〇 以下) 、與 0- 化合物例如可藉由使己基降莰烯 氧基矽烷(於側鏈含有 86 201222034(In the formula (31), the diphenylfluorenylnordecene oxime 7/(17+1*2 is 2 Å or less) represented by the formula (31), and the 0-compound can be reduced by, for example, hexyl group. Alkenyloxydecane (in the side chain containing 86 201222034

Sl(CH3)(Ph)2之降㈣)及環氧降ί£㈣解於甲苯中,使用 Νι化5物作為觸媒進行溶液聚合而獲得。 ((B)具有環狀醚基之單體、具有環狀醚基之寡聚物) 繼而,S ( B)之成分進行說明。 成为(B)係具有環狀醚基之單體及具有環狀醚基之寡 4物中之至少-者。該成分(B )只要為折射率與成分(A) 之樹月曰不同’且與成分(A )之樹脂具有相容性即可。成分 (B )與成^ ( A)之樹脂之折射率差較佳為G.G1以上。 再者’成分(B)之折射率可高於成分(A)之樹脂, 但較佳為成分(B)之折射率低於成分之樹脂。 成分(B)之具有環狀峻基之單體、具有環狀鱗基之寡 聚物係於酸之存在下,藉出戸弓 — &lt;仔在下藉由開%而聚合者。若考慮到單體、 养聚物之擴散性,則該單體之分 — 別乂千肢心刀千里(重量平均分子量)、 券聚物之分子量(重量平均分子|丨 十里)分別較佳為100以上、 400以下。 成分(B)例如具有氧雜環丁基 丞次氧基。上述環狀醚 土藉由酉文谷易開環,故而較佳。 作為具有氧雜環丁基之單體、且 男乳雜% 丁基之寬命 物’較佳為選自下述式(11)〜( ^ 嗲簟、〇)之群中者。藉由使用 以寺’具有波長850 nm附近之透明 而…“— 逻月性優異’可使可撓性與 耐熱性並存之優點。又,該等可 干殉便用,亦可混合而使 87 11 )201222034 〇2H5The drop of Sl(CH3)(Ph)2 (4)) and the epoxy reduction (4) were obtained by solution polymerization using toluene in the toluene and using Νι 5 as a catalyst. ((B) Monomer having a cyclic ether group, oligomer having a cyclic ether group) Next, the components of S (B) will be described. (B) is at least one of a monomer having a cyclic ether group and an oligo 4 having a cyclic ether group. The component (B) may be a resin having a refractive index different from that of the component (A) and having compatibility with the resin of the component (A). The difference in refractive index between the component (B) and the resin of the product (A) is preferably G.G1 or more. Further, the component (B) may have a higher refractive index than the component (A), but it is preferably a component (B) having a lower refractive index than the component. The monomer having a cyclic squaring group of the component (B) and the oligo group having a cyclic squara group are in the presence of an acid, and are borrowed from the scorpion bow. In consideration of the diffusibility of the monomer and the aroma, the monomer is preferably divided into a thousand limbs (weight average molecular weight) and a molecular weight of the granule (weight average molecule | 丨 10 mile), respectively. 100 or more and 400 or less. Component (B) has, for example, an oxetanyl oximeoxy group. The above cyclic ether soil is preferred because it is easy to open the ring. The monomer having an oxetanyl group and a homogenate of male butyl butyl is preferably selected from the group consisting of the following formulas (11) to (^ 嗲簟, 〇). By using the temple's transparency with a wavelength of around 850 nm..."--the excellent reliability of the moon" can make the flexibility and heat resistance coexist. Moreover, these can be used dry or mixed to make 87 11)201222034 〇2H5

C2H5C2H5

(12 )(12)

(13 )(13)

(14) C2H5(14) C2H5

c2h5 88 (15 ) (16 )201222034C2h5 88 (15 ) (16 )201222034

卜 0C2H5 、〇c2hsBu 0C2H5, 〇c2hs

(17 ) (18 ) (式(18)中,n為0以上、3以下) C2H5(17) (18) (in the formula (18), n is 0 or more and 3 or less) C2H5

C2H5 (19 ) Η 89 201222034 (20 ) C2Hs^&lt;3 於如上之單體及寡聚物中,就確保與成分(A )之樹脂 之折射率差的觀點而言,較佳為使用式(13)、( 15)、( 16)、 (17)、(20)所表示之化合物。 進而’若考慮到與成分⑷之樹脂具有折射率差之方 面、分子量較小而單體之運動性較高之方面、單體不容易 揮發之方面,則尤佳為使用式(2G)、式(15)所表示之化 合物。 又,作為具有氧雜環丁基之化合%,可使用以下之式 (32)、式(33)所表示之化合物。作為式(32)所表示之 化合物’可使用東亞合成製之商品名m〇x#,作為式⑶) 所表示之化合物,可使用東亞合成製之商品名〇x—sq等。C2H5 (19 ) Η 89 201222034 (20 ) C2Hs^&lt;3 In the above monomers and oligomers, from the viewpoint of ensuring a difference in refractive index from the resin of the component (A), it is preferred to use the formula ( 13), (15), (16), (17), (20) compounds. Further, it is preferable to use the formula (2G), in view of the fact that the resin of the component (4) has a refractive index difference, the molecular weight is small, the mobility of the monomer is high, and the monomer is not easily volatilized. (15) The compound represented. Further, as the compounding ratio of the oxetanyl group, the compounds represented by the following formulas (32) and (33) can be used. As the compound represented by the formula (32), a product represented by the formula (3) can be used as the compound represented by the formula (3), and the trade name 〇x-sq of the East Asian synthesis can be used.

90 (33) (33)20122203490 (33) (33)201222034

、八中,i或2) 又,作為具有環氧基之單體、且古s _ 例如ό]· q /、有%氧基之寡聚物, 門舉如下者。飧且古谱与《 之存在T r β /、有衣氧基之單體、寡聚物係於酸 &lt;存在下,耜由開環而聚合者。 作為具有環氧基之g + 用U 體、,、有環氧基之寡聚物,可使 用以下之式(34)〜(39)所矣-土 應變能量較大、反…s 其令’就環氧環之 心優&quot;之觀點而言,較佳為使用式(36) )所表示之脂環式環氧單體。 上^式(34 )所表示之化合物為環氧降莰烯,作為 述化口物’例如可使用Pr〇merus公司製造之Ερ·。式 俨)所表不之化合物為7 —環氧丙氧基丙基三曱氧基矽 作為該化合物,例如可使用T〇ray D()w C()rning SiHc〇ne 公司製造之z— 6040。又,式(36)所表示之化合物為2 — ’ 環氧5衣己基)乙基三曱氧基石夕烧,作為該化合物,例 如可使用東京化成製造之E0327。 進而’式(37)所表示之化合物為3,4 —環氧環己烯基 甲基~ 3,’4’ 一環氡環己烯曱酸酯,作為該化合物,例如可使 用 Daicel Chemical 公司製造之 Celloxide 2021P。又,式(38) 所表示之化合物為1,2_環氧—4—乙烯基環己烷,作為該 化合物’例如可使用Daicel Chemical公司製造之Cell〇xide 91 201222034 2000 ° :8,9二環氧擰 Chemical 公司 進而,式(39)所表示之化合物為1,2 檬烯,作為該化合物,例如可使用(Daicel 製造之 Celloxide 3000)。And VIII, i or 2) Further, as an oligomer having a monomer having an epoxy group and having an oxy group, such as ό]·q / and having a % oxy group, the following are mentioned. And the ancient spectrum and "the existence of T r β /, the monomer having an oxy group, the oligomer is in the presence of an acid, and the oxime is polymerized by ring opening. As the oligomer having an epoxy group, a U-form, an epoxy group-containing oligomer, the following formulas (34) to (39) can be used, and the strain energy is large, and the anti-s... From the viewpoint of the core of the epoxy ring, it is preferred to use the alicyclic epoxy monomer represented by the formula (36)). The compound represented by the above formula (34) is an epoxy norbornene, and as the above-mentioned opening, for example, Ερ· manufactured by Pr〇merus Co., Ltd. can be used. The compound represented by the formula 为) is 7-glycidoxypropyltrimethoxy oxime as the compound, and for example, Z-6040 manufactured by T〇ray D()w C()rning SiHc〇ne Co., Ltd. can be used. . In addition, the compound represented by the formula (36) is a 2 - 'epoxy-5-hexyl)ethyltrimethoxylate, and as the compound, E0327 manufactured by Tokyo Chemical Industry Co., Ltd. can be used. Further, the compound represented by the formula (37) is 3,4-epoxycyclohexenylmethyl~3, '4'-cyclodecene hexene decanoate, and as the compound, for example, Daicel Chemical Co., Ltd. can be used. Celloxide 2021P. Further, the compound represented by the formula (38) is 1,2-epoxy-4-vinylcyclohexane, and as the compound, for example, Cell〇xide 91 manufactured by Daicel Chemical Co., Ltd. 201222034 2000 °: 8, 9 may be used. Further, the compound represented by the formula (39) is 1,2 cimol, and as the compound, for example, Celloxide 3000 manufactured by Daicel can be used.

92 201222034 ο92 201222034 ο

(3 8)(3 8)

(3 9) 丁基之寡聚物、與具有環氧基之單體、呈.具有氧雜$ 物作為(Β )之成分。 /、裱氧基之募支 具有氧雜環丁其夕留挪 衣丁基之早體、具有氧雜環 然開始聚合之起雍 基之暴聚物虽丨 喽始反應較慢’但生長反應 具有環氧基之單舻 目士 „ 與此相對 體、具有%氧基之寡聚物雖然㈤ 起始反應較快,作在I ^Λ μ、'開始聚合之 雜環丁基之單體、具有 θ由併用具有氧 Α之簞辦目士基之寡聚物、與具有環氧 暴之早體、具有環氧其 乳 ^ , 風基之养聚物,可於照射光時,碹眘从 產生光照射部分盥耒昭鼾 貧地 -、禾&quot;、、射部分之折射率差。 ^ (β)成分之添加量相對於(A)成分100重量份 較佳為1重量份LV L CA 切 50重量份以下,更佳為2重量份以 0重讀以下。冑此,具有可實現核心/包覆間之折射 车调文,而謀求可撓性與耐熱性之並存之效果。 ((c)光酸產生劑) 93 201222034 作為光ι產生劑,只要為吸收光之能量而生成布忍斯 =或路易斯酸者即可’例如可列舉:三苯基疏三敗甲烧 % δ夂鹽:,(4 -二級丁基苯基)鏽—三氟甲烷磺酸鹽等銃鹽 類’對硝基苯基重氮六氟磷酸鹽等重氮鹽類;名安鹽類;鱗 鹽類;二笨基鐄三氣甲烧續酸鹽、(三異丙苯基)銷—四(五 氟苯基)硼酸鹽等錤鹽類;醌二疊氮(quin〇ne以^七)類;雙 (苯基磺醯基)重氮曱烷等重氮甲烷類;卜苯基—卜^一甲 基本基)《氧基—卜苯甲醯基甲院、N_經基萘二甲酿亞 胺-三氟甲烷磺酸酯等磺酸酯类員;二苯基二颯等二砜類; 二(2,4,6 -三氣甲基卜均三卩井、2—(3,4 —亞甲二氧基苯基) 一 4,6—雙一(二氯甲基)一均三畊等三畊類等化合物。該等光 西久產生劑可單獨使用,或組合複數種而使用。 光酸產生劑之含量相對於(A)成分1〇〇重量份,較佳 為0.01重量份以上、〇.3重量份以下,更料〇 〇2重量份 以上、0.2重量份以下。藉此,具有反應性提高之效果。 感光性樹脂組成物除了以上之(A )、( B )、( c )之成分, 亦可含有增感劑等添加劑。 增感劑係具有增大光酸產生劑對光之感度,減少光酸 產生劑之活化(反應或分解)所欲之時間或能量之功能, 或使光之波長變化為適合於光酸產生劑之活化之波長的功 能者。 作為上述增感劑,可根據光酸產生劑之感度或增感劑 之吸收之峰值波長而適當選擇,並無特別限定,例如可列 舉:9,10—二丁氧基蒽(CAS編號第76275 _ 14_4號)之 94 201222034 類之蒽類、σ山酮類、蒽醌類、菲類、筷類、苯并芘類、庚類 (fluoranthenes )、紅螢烯類、芘類、陰丹士林類、硫卩星—9 一酮類(thioxanthen—9—ones)等,該等可單獨使用,或 以混合物之形式使用。 作為增感劑之具體例’例如可列舉:2 —異丙基—9h _ 硫卩星一9 —酮、4一異丙基一9H—硫0星一 9_酮、五—氣—4 — 丙氧基氧硫d星、酚噻畊(phenothiazine )或該等之混合物。 增感劑之含量於感光性樹脂組成物中較佳為〇 〇1重量 進而更佳為1重量%以上。 %以上’更佳為〇. 5重量。/。以上,進市 再者’上限值較佳為5重量%以下。 口( C )之光酸產生 中記載之第1單體 以上感光性樹脂組成物中,尤佳為含有作為成分(A) 之於側鏈具有脫離性基之環烯樹脂、成分(c)之光酸 劑、及作為成分(B )之下述式(1 〇〇 ) 的感光性樹脂組成物。(3 9) A butyl oligomer, a monomer having an epoxy group, and a component having an oxo group as (Β). /, the support of the oxime has an oxetane oxime, the early body of the butyl group, the uranium group having an oxo group starting to polymerize, although the reaction starts slowly, but the growth reaction Monomers having an epoxy group „ Opposite to the oligomer having a % oxy group, although (5) the initial reaction is faster, the monomer of the heterocyclic butyl group which starts to polymerize at I ^ Λ μ, An oligomer having θ and using an oxime-based oxime group, an early body having an epoxy burst, an epoxy-based emulsion, and a wind-based nutrient, can be used when irradiating light The difference in refractive index of the light-irradiated portion 盥耒 鼾 鼾 - 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 50 parts by weight or less, more preferably 2 parts by weight, and the following is re-read at 0. Thus, it is possible to achieve a coexistence between flexibility and heat resistance by modulating the car between the core and the cladding. ) Photoacid generator) 93 201222034 As a photo-producing agent, as long as it absorbs the energy of light, it produces Brons = or Lewis acid. For example, triphenyl sulfonate can be burned% δ 夂 salt: (4-dibutyl phenyl) rust - trifluoromethanesulfonate and the like sulfonium salt 'p-nitrophenyl diazo hexafluoro Diazo salts such as phosphates; Mingan salts; scale salts; diphenyl sulfonate, tris(phenylidene), tetrakis(pentafluorophenyl)borate, etc.醌 醌 叠 ( 〇 〇 〇 〇 〇 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; a sulfonate group such as a benzamidine group, a N-trans-naphthyldiamine-trifluoromethanesulfonate; a disulfone such as a diphenyldifluorene; and a second (2,4,6-three) Compounds such as three-till and other three-tillage, such as gas, methyl, tetrazolium, 2-(3,4-methylenedioxyphenyl), 4,6-bis-di(dichloromethyl) The photonic acid generator may be used singly or in combination of plural kinds. The content of the photoacid generator is preferably 0.01 parts by weight or more and 〇.3 parts by weight or less based on 1 part by weight of the component (A). 2 parts by weight or more and 0.2 parts by weight or less. Thereby, having reactivity The photosensitive resin composition may contain an additive such as a sensitizer in addition to the components (A), (B), and (c) above. The sensitizer has an increase in the sensitivity of the photoacid generator to light. , a function of reducing the time (or reaction) of activation (reaction or decomposition) of the photoacid generator, or changing the wavelength of light to a wavelength suitable for activation of the photoacid generator. As the above sensitizer, It is not particularly limited as long as it is appropriately selected depending on the sensitivity of the photoacid generator or the peak wavelength of absorption of the sensitizer, and for example, 94, 2012-1234 of 9,10-dibutoxyanthracene (CAS No. 76275 _ 14_4) Anthraquinones, sigma ketones, anthraquinones, phenanthrenes, chopsticks, benzopyrenes, fluoranthenes, red fluorenes, anthraquinones, indanthrene, thiopurine-9 A ketone (thioxanthen-9-ones) or the like, which may be used singly or in the form of a mixture. Specific examples of the sensitizer include, for example, 2-isopropyl- 9h-thiol star- 9-ketone, 4-isopropyl- 9H-sulfur 0-star-9-one, and 5-gas-4. Propoxy oxysulfide d-star, phenothiazine or a mixture of these. The content of the sensitizer is preferably 〇1 by weight and more preferably 1% by weight or more based on the photosensitive resin composition. More than % is more preferably 〇. 5 weight. /. The above upper limit is preferably 5% by weight or less. In the photosensitive resin composition of the first monomer or more described in the production of the photoacid of the mouth (C), it is particularly preferred to contain the cycloolefin resin having the detachable group as the component (A) and the component (c). A photoacid agent and a photosensitive resin composition of the following formula (1) as the component (B).

(A )’可使用如上述者,例如可列舉 樹脂(A ) ’ :環己烯、 之環烯 、環辛 95 201222034 稀等早環體單體之聚合物;降获稀、降获二稀、二環戊二 烯一氫一裱戊二烯、四環十二烯、三環戊二稀、 咏戊二炼、四措_ 衣戍一烯、二氫四環戊二烯等多環體單 聚合物等。該黛夕Λ Λ 4之中,可較佳地使用自多環體單體之 物中選摆$ 1 〜σ 種以上之環烯樹脂。藉此,可提高樹脂之耐 熱性。 八再者,作為聚合形態,可應用無規聚合、嵌段聚合等 ^之形也。例如作為降莰烯型單體之聚合之具體例,降 ,烯型早體之(共)聚合物、降莰烯型單體與“―烯烴類 等可八聚之其他單體之共聚物、及該等共聚物之氫化物等 符合具體例。1亥等環烯樹脂可藉由公知之聚合法而製造, 其聚合方法有加成聚合法與開環聚合法,上述之中,較佳 ,以加成聚合法而獲得之環烯樹脂(尤其是降获烯系樹脂) 即’降莰烯系化合物之加成聚合物)。藉此,透明性、耐 熱性及可撓性優異。 +作為上述脫離性基,係指藉由由光酸產生劑產生之酸 )之作用來切斷分子之_部分而脫離者。具體而言, 較佳為於分子結構中(側鏈)具有如上所述之-0-結構、 -S卜芳基結構及Si—結構中之至少!種者。如上所 述之脫離性基藉由酸(H+)之作用而相對容易地脫離。 之脫離性基,較佳為—S i —-贫| a址„ —本基結構及一Ο — Si 結構之至少一者 上述脫離性基中,作為藉由脫離而降低樹脂之折射率 苯基 上述脫離性基之含量並無特別限定,較佳為於上述側 96 201222034 鍵具有脫離性基之環炸樹脂中之10〜8〇重量%,尤立是更 佳為2〇〜60重量%。若含量為上述範圍内,則尤其是可撓 性與折射率調變功能(增大折射率差之效果)之並存優異。 作為上述於側鏈具有脫離性基之環烯樹脂,較佳為具 有下述式(1〇1)及7或下述式(102)所表示之重複單位者。 藉此,可提高樹脂之折射率。(A) ' can be used as described above, for example, a resin of the resin (A)': cyclohexene, cycloolefin, cyclooctane 95 201222034 dilute early ring monomer; reduction of rare, reduced dilute Polycyclic compounds such as dicyclopentadiene monohydrogen pentadiene, tetracyclododecene, tricyclopentaene, ruthenium pentoxide, tetrazole _ ketene, dihydrotetracyclopentadiene Single polymer, etc. Among the above-mentioned Λ4, it is preferable to use a cycloolefin resin of more than one kind from the polycyclic monomer. Thereby, the heat resistance of the resin can be improved. In addition, as the polymerization form, a random polymerization, a block polymerization, or the like can be applied. For example, as a specific example of polymerization of a norbornene-type monomer, a copolymer of a (co)polymer of an olefinic type, a norbornene-type monomer, and a copolymer of another monomer such as an olefin; The hydride of the copolymers and the like are in accordance with specific examples. The cycloolefin resin such as 1 hai can be produced by a known polymerization method, and the polymerization method includes an addition polymerization method and a ring-opening polymerization method, and among the above, preferably. A cycloolefin resin obtained by an addition polymerization method (especially an ethylenic resin-reduced), that is, an addition polymer of a decene-based compound, is excellent in transparency, heat resistance, and flexibility. The above-mentioned detachment group means a part which is cleaved by the action of an acid generated by a photoacid generator, and is detached. Specifically, it is preferable to have a molecular structure (side chain) as described above. The at least one of the -0-structure, the -S-arylene structure and the Si-structure. The detachable group as described above is relatively easily detached by the action of the acid (H+). —S i —- poor | a site „ — the base structure and a Ο — at least one of the Si structures The content of the above-mentioned detachable group of the phenyl group is not particularly limited as long as the reticular group of the phenyl group is reduced by the detachment, and it is preferably 10 to 8 in the ring-fried resin having the detachable group of the above-mentioned side 96 201222034 bond. 〇% by weight, 尤立 is more preferably 2〇~60% by weight. When the content is within the above range, in particular, the flexibility and the refractive index modulation function (the effect of increasing the refractive index difference) are excellent. The cycloolefin resin having a cleavable group in the side chain is preferably a repeating unit represented by the following formula (1〇1) and 7 or the following formula (102). Thereby, the refractive index of the resin can be increased.

(式101中 ,打為〇以上、9以下之整數) 97 201222034(In the formula 101, it is an integer of 〇 or more and 9 or less.) 97 201222034

(102) 上述感光性樹脂組成物含有上述式(丨〇〇)所記載之單 體(以下稱作第丨單體)。藉此,可進一步擴大左右之核心 /包覆間之折射率差。 、第單體之3量並無特別限定,相對於上述於側鏈具 有脫離性基之環烯樹脂⑽重量份,較佳為i重量份以上、 5〇重量伤以下’尤佳為2重量份以上' 2〇重量份以下。藉 此’可實現核心/包覆間之折射率調變,謀求可撓性與: 熱性之並存。 上述般,於將上述第丨單體與於側鏈具有脫離性 環稀樹脂加以併用之情形時,核心、/包覆間之折射率 與可撓性之平衡優異,其原因可認為如下 首先,於使用如上之感 心/包覆間之折射率調變優 照射等所產生之酸,而使第 單體之反應性優異。若第1 體之硬化性變高,藉由第i 光性樹脂組成物之情形時,核 異其原因在於,藉由利用光 1單體開始聚合反應時,第i 單體之反應性優異,則第丨單 翠體之濃度梯度而產生之第1 98 201222034 單體之擴散性得到提 射區域之折射率差。冑6 了增大先照射區域與未照 又,第1單體為一宫能,故進行聚合 性樹脂組成物之交聯密度並不那麼高。因此:丨生:: 異。 可撓性亦優 ^上述感光性樹脂組成物並無特別限定, 述第1單體不同之第2簞俨 有,、上 』之第2早體。再者,所謂與上 不同之第2單體,可盘紝接丁门 &lt;昂1早體 了為、構不同之單體,亦可 同之單體。 〇刀卞里不 其中’第2單體可作為成分( 環氧化合物、盘式(⑽)所矣一土 3有例如可列舉 ”式(100)所表不者不同之其 化合物、乙稀喊化合物等。該等之中 =丁燒 / ^ 3 〇fe T 权佳為%氧化合物 (尤其疋知環式環氧化合物) 物ί罝古9加e J及―s肊之氧雜環丁烷化合 物匕有2個氧雜環丁基之單體)之至少4 :高上述第1單體與上述環烯樹脂之反應性, 透明性,且提高波導之耐熱性。 呆持 作為第2單體,具體可列舉 上诚上述式(丨5)之化合物、 这式(12)之化合物、上述式(11)之化合物、上述式( 之化合物、上述式(19)之化合物、 之化合物。 。物、上述式(34)〜(39) MS 2單體之含量並無特別限定,相對於上述 樹月曰100重量份,較佳為i重 烯 士甘θ s 里知以上、5〇重量份以下, 尤其疋更佳為2重量份以上、20啬θ八 一 rt 〇重罝份以下。藉此,可辐 问與上述第1單體之反應性。 私 99 201222034 又上述第2單體與上述第i單體之併用比例亦並無 特別限定,以重量比(上述第2單體之重量/上述第丨單 體之重量)計,較佳為0」〜卜尤佳為〇1〜〇6。若併用比 例為上述範圍内,則反應性之速度與波導之耐熱性之平 優異。 、 光酸產生劑之含量並無特別限定,相對於上述於側鏈 具有脫離性基之環烯系樹脂1〇〇重量份,較佳為〇 〇1重量 份以上、0.3重量份以下,尤其是更佳為〇 〇2重量份以上、 0.2重量份以下。若含量未滿下限值,則存在反應性降低之 情形,若超出上述上限值,則存在於光波導上產生著色’ 光損失降低之情形〇 上述感光性樹脂組成物除了上述環烯系樹脂、光酸產 生劑、第1單體及第2單體以外,亦可含有硬化觸媒、抗 氧化劑等。 又,上述感光性樹脂組成物可用作核心部94之形成用 之組成物。 (光波導之製造方法及光波導之第1製造方法) 圖19、20、21分別為模式地表示光波導之製造方法之 步驟例的剖面圖’圖33〜35分別為模式地表示光波導之第 1造方法之步驟例的剖面圖。 此處,以使用成分(Β )之折射率低於成分(A)之環 烯樹脂之情形之感光性樹脂組成物來製造光波導的方法為 例進行說明。 首先’如圖19 ( A )、圖3 3 ( A )所示,使感光性樹脂 100 201222034(102) The photosensitive resin composition contains the monomer described in the above formula (hereinafter referred to as "the second monomer"). Thereby, the difference in refractive index between the core and the cladding can be further expanded. The amount of the third monomer is not particularly limited, and is preferably i part by weight or more, and 5 Å or less by weight, and particularly preferably 2 parts by weight, based on the weight of the cycloolefin resin having a debonding group in the side chain. Above '2〇 parts by weight or less. By this, the refractive index modulation between the core and the cladding can be achieved, and flexibility and heat can be coexisted. In the case where the above-mentioned second monomer and the side chain have a debondable cycloaliphatic resin, the balance between the refractive index and the flexibility between the core and the coating is excellent. The reason is as follows: The reactivity of the first monomer is excellent in the use of the acid generated by the above-mentioned centrifugation/coating between the refractive index and the like. When the hardenability of the first body is high, in the case of the ith photo-resin composition, the reason for the difference is that the reactivity of the i-th monomer is excellent when the polymerization reaction is started by using the light 1 monomer. The diffusion of the first 98 201222034 monomer produced by the concentration gradient of the 丨 丨 翠 body gives the refractive index difference of the lifted area.胄6 Increasing the area to be irradiated first and not irradiating, and the first monomer is a uterine energy, the crosslinking density of the polymerizable resin composition is not so high. Therefore: Twins:: Different. The above-mentioned photosensitive resin composition is not particularly limited, and the second monomer which is different from the first monomer is the second precursor of the above. Furthermore, the second monomer, which is different from the above, can be spliced to the Dingmen &lt; Ang 1 has a different composition, and can also be the same monomer. In the file, the second monomer can be used as a component (epoxy compound, disk type ((10)), and the soil 3 can be exemplified by the compound of the formula (100). Compounds, etc. Among these = butyl sinter / ^ 3 〇fe T is preferably a % oxygen compound (especially known as a cyclic epoxy compound) ί罝古9 plus e J and ―s肊 oxetane At least 4 of the compound having two oxetanyl monomers; high reactivity of the first monomer with the cycloolefin resin, transparency, and improved heat resistance of the waveguide. Specific examples thereof include a compound of the above formula (丨5), a compound of the formula (12), a compound of the above formula (11), a compound of the above formula (a compound, a compound of the above formula (19), or a compound thereof. The content of the MS 2 monomer in the above formulas (34) to (39) is not particularly limited, and it is preferably one or more of the weight of the above-mentioned tree sorghum θ s and less than 5 parts by weight. In particular, it is preferably 2 parts by weight or more and 20 啬 θ 八 rt 〇 〇 罝 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The reactivity of the body. Private 99 201222034 The ratio of the second monomer to the ith monomer is also not particularly limited, and is based on the weight ratio (the weight of the second monomer or the weight of the second monomer). Preferably, the content of the photoacid generator is not particularly limited, and the ratio of the reactivity is preferably equal to the heat resistance of the waveguide. It is preferably 〇〇1 part by weight or more and 0.3 parts by weight or less, and more preferably 〇〇2 parts by weight or more, and 0.2 parts by weight based on 1 part by weight of the cycloolefin-based resin having a cleavable group in the side chain. When the content is less than the lower limit, the reactivity may be lowered. When the content exceeds the above upper limit, the coloring loss may occur in the optical waveguide. The photosensitive resin composition is not limited to the above. The cycloolefin resin, the photoacid generator, the first monomer, and the second monomer may contain a curing catalyst, an antioxidant, etc. Further, the photosensitive resin composition may be used as a core portion 94. Composition (optical waveguide The manufacturing method and the first manufacturing method of the optical waveguide) FIGS. 19, 20, and 21 are cross-sectional views schematically showing an example of the steps of the method for manufacturing the optical waveguide. FIGS. 33 to 35 are schematic diagrams showing the first method of manufacturing the optical waveguide. A cross-sectional view of a step example. Here, a method of manufacturing an optical waveguide using a photosensitive resin composition in which the refractive index of the component (Β) is lower than that of the cycloolefin resin of the component (A) will be described as an example. As shown in Fig. 19 (A) and Fig. 3 3 (A), the photosensitive resin 100 201222034

組成物溶解於溶劑,製備清漆900、! 9〇(U 、Μ下亦記作、主 900 ) ’將該清漆900塗佈於包覆層91、丨 ^ ^ 包覆層91)上。 以下亦記作 作為將感光性樹脂組成物製備成清漆狀 4 ’合剛,例如 可列舉:二乙醚、二異丙醚、1,2—二曱氧其 一 „ τ虱基乙烷(DMe)、 1,4 一一 D号燒、四氫呋喃(THF )、四氫D比喃(TH # 一 ^ r J、琴曱鍵、 二乙二醇二甲騎(diglyme )、二乙二醇乙驗Γ上 / 醉乙醚(卡必醇)等醚 系、;谷劑;甲基赛路蘇、乙基料蘇、苯㈣路蘇等赛路蘇 系溶劑;⑼、戊烧、庚烧、環己统等脂肪族煙系溶齊“ 曱苯、二曱苯、苯、均三曱苯等芳香族煙系溶劑;。比咬、 吡畊、咬喃,&quot;塞吩、甲基吼„各咬酮等芳香族雜環化合 物系溶劑;N,N—二曱基曱醯胺(DMF)、N _ ° y ,1N 一甲基乙醯 胺(DMA)等醯胺系溶劑;二氯甲烷、氯仿、 友 ^ , 一乳乙 烷等鹵素化合物系溶劑;乙酸乙酯、乙酸曱酯、曱酸乙酯 等醋系溶劑;二甲基亞硬(DMS〇)、環丁碼等硫化:物= 溶劑之各種有機溶劑;或含有該等之混合溶劑。 〃 接著,於光波導9之包覆層91上塗佈清漆9〇〇後,進 行乾燥,使溶劑蒸發(脫溶劑^藉此,如圖19 ( b )、圖 33 (B)所示,清漆900成為光波導形成用之膜91〇、i9i〇 (以下亦記作膜910)。該膜91〇藉由下述光之照射,而為 形成有核心部94與包覆部95、1〇95 (以下亦記作包覆部 95)之核心層93、1093 (以下亦記作核心層93)。 此處,作為塗佈清漆900之方法,例如可列舉:刮刀 法、旋塗法、浸潰法、台式塗佈(table c〇a〇法、喷霧法、 101 201222034 敷料y—O法、簾塗佈法、模塗法之方法,但並 ::疋於孩等。作為包覆層91,例如可使用折射率低於下 樹脂Π:…’例如可使用含有降㈣編與環氧 接著,對膜910選擇性地照射光(例如紫外線 此時,如圖20(A)、圖34(A)所示,於膜91〇之上 方配置形成有開口之遮罩M。經由該遮罩M之開口對膜 照射光。 、 所使用之光,例如可列舉於波長2 〇 〇〜4 5 〇 n m之範圍具 有峰值波長者。藉此,$亦取決於光酸產生劑之組成,但 可使光酸產生劑相對容易地活化。 又,光之照射量並無特別限定,較佳為〇.〖〜9 左右,更佳為0.2〜6 J/Cm2左右,進而更佳為〇 2〜3 cm2左右。 再者,於使用如雷射光般指向性較高之光之情形時, 亦可省略遮罩Μ之使用。 膜910中,於經光照射之區域,由光酸產生劑產生酸。 藉由所產生之酸而使成分(Β )聚合。 於未經光照射之區域,未由光酸產生劑產生酸,故成 分(Β)不進行聚合。於照射部分,成分(Β)進行聚合形 成聚合物,故成分(Β )量變少。與此相應,未照射部分之 成刀(Β )擴散至照射部分,藉此,於照射部分與未照射部 分產生折射率差。 此處,於成分(Β )之折射率低於環烯樹脂之情形時, 102 201222034 ::未照射部分之成分⑻擴散至照射部分,而使未照射 p刀之折射率變高,且使照射部分之折射率變低。 再者,成分(B)進行聚合而成之聚合物與具有環狀醚 基之單體之折射率差為〇以上、0.001以下左右,可認為折 射率大致相同。 如此於使用上述感光性樹脂組成物之情形時,可藉由 由光酸產生劑產生之酸,而開始成分(B)之聚合。 進而,用於本發明之環烯樹脂亦可未必具有脫離性 基,於使用具有脫離性基之環稀樹脂作為成分(A)之情形 時,產生以下作用。 於.、、、射光之郤为,藉由由光酸產生劑產生之酸,使琿 稀樹脂之脫離性基脫離m基結構、—Si_二笨基 、。構及Q Si —苯基結構等脫離性基之情形時,可藉由 脫離而降低樹脂之折射率。 列耵半因此,照射部分之折射率與脫 離性基之脫離前相比進一步降低。The composition is dissolved in a solvent to prepare a varnish 900,! 9 〇 (U, Μ, also referred to as main 900) ‘The varnish 900 is applied to the coating layer 91 and the 包覆 ^ ^ cladding layer 91). The following is also referred to as preparing a photosensitive resin composition into a varnish-like shape, and examples thereof include diethyl ether, diisopropyl ether, and 1,2-dioxamethane. 1,4, one, D, THF, tetrahydrofuran (THF), tetrahydrogen D, methane (TH #一^r J, Qinqin, diethylene glycol, diglyme, diethylene glycol Ethers such as upper/drunken ether (carbitol); gluten; methyl celecoxib, ethyl sulphate, benzene (tetra) lusu, etc.; (9), pentylene, gamma, hexidine Aliphatic smoke is dissolved in aromatic solvents such as toluene, diphenyl, benzene, and triterpene; compared to biting, pyridin, biting, &quot;cephene, methyl hydrazine Aromatic heterocyclic compound solvent; N,N-didecyl decylamine (DMF), N _ ° y, 1N monomethyl acetamide (DMA) and other amide-based solvents; dichloromethane, chloroform, Friend ^ , a solvent such as a halogen compound such as lactide; a vinegar solvent such as ethyl acetate, decyl acetate or ethyl citrate; dimethyl hard (DMS oxime), cyclobutyl or the like vulcanization: substance = solvent Various organic solvents Or containing the mixed solvent. 〃 Next, after coating the varnish 9 on the coating layer 91 of the optical waveguide 9, drying is performed to evaporate the solvent (by solvent removal, as shown in Fig. 19 (b), As shown in Fig. 33(B), the varnish 900 is a film 91〇, i9i〇 (hereinafter also referred to as a film 910) for forming an optical waveguide. The film 91 is formed with a core portion 94 by irradiation with light described below. The core layers 93 and 1093 (hereinafter also referred to as the core layer 93) of the covering portions 95 and 1 95 (hereinafter also referred to as the covering portion 95). Here, as a method of applying the varnish 900, for example, Scraper method, spin coating method, dipping method, table coating (table c〇a〇 method, spray method, 101 201222034 dressing y-O method, curtain coating method, die coating method, but also::疋As the coating layer 91, for example, a refractive index lower than that of the lower resin Π:... can be used, for example, a film having a lower (four) braid and an epoxy can be used, and the film 910 can be selectively irradiated with light (for example, ultraviolet rays at this time, such as 20(A) and 34(A), a mask M having an opening formed thereon is disposed above the film 91. The film is irradiated with light through the opening of the mask M. The light used is, for example, a peak wavelength in the range of 2 〇〇 to 4 5 〇 nm. Thus, $ also depends on the composition of the photoacid generator, but the photoacid generator can be activated relatively easily. Further, the amount of irradiation of light is not particularly limited, and is preferably 〇. 〜~9 or so, more preferably about 0.2 to 6 J/cm 2 , and even more preferably 〇 2 to 3 cm 2 or so. In the case of light having a high directivity, the use of a mask may be omitted. In the film 910, an acid is generated by a photoacid generator in a region irradiated with light. The component (Β) is polymerized by the acid produced. In the region which is not irradiated with light, acid is not generated by the photoacid generator, so that the component (Β) is not polymerized. In the irradiated portion, the component (Β) is polymerized to form a polymer, so that the amount of the component (Β) is small. In response to this, the knives (Β) of the unirradiated portion are diffused to the irradiated portion, whereby a refractive index difference is generated between the irradiated portion and the unirradiated portion. Here, when the refractive index of the component (Β) is lower than that of the cycloolefin resin, 102 201222034: the component (8) of the unirradiated portion diffuses to the irradiated portion, and the refractive index of the unirradiated p-knife becomes high, and the irradiation is made The refractive index of the part becomes lower. Further, the difference in refractive index between the polymer obtained by polymerizing the component (B) and the monomer having a cyclic ether group is 〇 or more and 0.001 or less, and it is considered that the refractive index is substantially the same. When the photosensitive resin composition is used as described above, the polymerization of the component (B) can be started by the acid generated by the photoacid generator. Further, the cycloolefin resin to be used in the present invention may not necessarily have a debonding group, and when a cycloaliphatic resin having a debonding group is used as the component (A), the following effects occur. The light emitted by the photoacid generator is such that the detachable group of the bismuth resin is separated from the m-based structure, -Si_diphenyl. In the case of a Q Si-phenyl structure or the like, the refractive index of the resin can be lowered by detachment. Therefore, the refractive index of the irradiated portion is further lowered as compared with that before the detachment of the detached group.

繼而,加熱膜9 10。於該加埶半挪七 A 峰加熱步驟中,經光照射之照射 部分之成分(B)進一步聚合。只 了承口另一方面,於該加熱步驟中, 未照射部分之成分(B )揮發。拉 货鞛此,於未照射部分,成分 (B)變少,形成接近於環烯樹脂之折射率。 於該膜91〇中,如圖20(b)、圖34(b)所示,經光 照射之區域成為包覆部95,未照射區域成為核心部94。核 心部94中之源自上述成分(卩、 取刀之結構體濃度、與包覆部 95中之源自上述成分(B )之妹槿舻,曾命 構體濃度不同。具體而言’ 核心部94中之源自成分(b )之έ士椹駚.曲 &lt;、,,σ構體浪度低於包覆部95 103 201222034 中之源自成分(B)之結構體濃度。 又,包覆部95之拆私座乂 核…之折射率差… 0 1Π ^ Λ' 上 藉由上述方式,於膜 910上形成核心部94 Λ於膜 “ 匕覆。&quot;5,而獲得核心層93。 18〇r . . φ ^ …識度並無特別限定,較佳為30〜 180C左右,更佳為4〇〜16〇。〇左右。 巧 又,加熱時間較佳A讯—从 I佳馮叹疋為經光照射 分(B)之聚合反應大致 …、射‘刀的成 ,., '。束具體而言,較佳為(^〜2 小時左右’更佳為(Μ〜!小時左右。 3 〇·1 2 其後’於該核心層()飞μ a|_ 、 ^ i 上貼附與包覆層91相同之膜β 该膜成為包覆層92、1〇92 ( η ττ ★ 膜 2 (以下亦記作包覆層92 )。一對 9=9置2係以自與包覆部95…方一心部 再者’包覆層92亦可並非藉由貼附膜狀者而是藉由在 核〜層93上塗佈液狀材料並使其硬化(固化 丄、 ^〜乃法而形 成0 藉由以上步驟可獲得圖21、圖35所示之光波導9。 、又,於藉由用於本發明之感光性樹脂組成物而獲得光 波導9之情形時,焊料耐回焊性尤其優異。進而,即便於 脊曲光波導9之情形時亦可減少光損失。 再者,於上述說明,對將感光性樹脂組成物直接供給 至包覆層91上’而形成膜910 (核心層93 )之情形進行了 說明,亦町於另一基材上形成膜910 (核心層93 )後,將 所得之核心層93轉印至包覆層91或包覆層92上,其後經 104 201222034 由核心層93而重疊包覆層9i與包覆層92。 繼而,對本實施形態之作用效果進行說明。 若對本實施形態中所使用之感光性樹脂組成物照射 光’則由光酸產生劑產生酸,僅於照射部分進行成分(b) 之聚合。由此’照射部分之成分(B )之量變少,故未照射 口P刀之成刀(B )擴散至照射部’藉此’於照射部分與未照 射部分產生折射率差。具體而言,於本實施形態中,由於 使用折射率高於成分⑻之經取代或未經取代之環稀樹脂 作為基質聚合物,故由於未照射部分之成 射部分而使未照射部分之折射率高於照射部分之折射率:、 '、此外’若於光照射後進行感光性樹脂組成物之加熱, 則成分(B)自未照射部分揮發。藉此,於照射部分與未照 射部分進一步產生折射率差。 如此般藉由使用感光性樹脂組成物,可於照射部分斑 未照射部分確實地形成折射率差。又,根據本發明’可僅 以照射光之簡單方法使核心部圖案化。例如,藉由適當選 擇”等之曝光圖案,可形成任意形狀或配置之光= 二P X亦可明確地形成較細之光程,故有助於 積體化’而謀求褒置之小型化1, 核心部之圖案形狀之設計的自由度較廣,並 = 尚之核心部。 丁首度較 之降知藉由熱酸產生齊1使具有氧雜環丁基等 物:有:有:聯之技術。然而,用於上述技術之組成 物雜環丁基等之鳴系樹脂 105 201222034 物。並且,該組成物係加熱組成物整體,使組成物整體產 生交聯結構者。因此,先前使用之該組成物中全無如下技 術〜心即藉由選擇性地照射光來產生酸,而選擇性地產 生聚合,使單體擴散至單體濃度變少之區域,從而形成濃 度差。 ^相對於此,本實施形態中所使用之感光性樹脂組成物 係發現如下者:若選擇性地照射&amp;,則藉由酸之產生而使 照射部分中之成分(B )之量變少,故未照射部分之成分(B ) 擴散至照射部分,藉此於照射部分與未照射部分產生折射 率差。 又,於將環烯樹脂設.為具有藉由由光酸產生劑產生之 酉文而脫離,並藉由脫離而降低成分(A )之環稀樹脂之折射 率的脫離性基者之情形時,可使經光照射之區域之折射率 與未照射區域相比確實地降低。 另一方面,於將環烯樹脂設為不具有脫離性基者之情 形時’側鏈化學性變得穩定’故可抑制由於光照射或加熱 等條件而使核心部、包覆部之折射率發生變動。 … 進而’於本實施形態中,使用降获稀系樹脂作為成分 (A)。藉此,可確實地提高特定波長下之光穿透性,而可 確實谋求傳播損失之降低。 ……丁 W W〜可y外,稭由將爸 95與核心部94之折射率差設為0.01以上,可將光3 封入核心部94内,而可抑制光之傳播損失之產生。 另一方面’先前已知含有聚合物、單體、助觸起 106 201222034 媒前驅物作為光波導形成用之組成物者。 其中,單體係藉由光之照射而形成反應物,可使經光 照射之區域之折射率與未照射區域之折射率不同者。 又,觸媒前驅物係可使單體之反應(聚合反應、交聯 反應等)開始之物質’且為利用藉由光之照射而活化的助 觸媒之作用而使活化溫度發生變化之物質。藉由該活化溫 度之變化,而使光之照射區域與未照射區域之間開始單 體之反應之溫度不同,結果僅於照射區域形成反應物。 與此相對,本實施形態中所使用之感光性樹脂組成物 無需設為上述含有大量金屬元素之物質。因此,可防止如 上所述之傳播損失之增加,而獲得傳播效率優異且耐熱性 優異之光波導9。 即便於使用上述先前之組成物之情形時,亦可藉由光 照射而分開製作核心部與包覆部,但根據本實施形態中所 使用之感光性樹脂組成物,可進一步擴大核心部%與包覆 部95之折射率差,且耐熱性得到提高,故可獲得可靠性更 高之光波導9。其主要係由使成分(A)及成分(b)之組 成最佳化而產生者。 另方面,於上述觸媒前驅物含有相對較多之把等金 屬元素,故會導致吸收傳播於光波導之光而增加傳播損失 之副作用。尤其是,使光波導彎曲時,該傾向明顯。又, 亦存在由於含有觸媒前驅物,而使耐熱性降低,回焊時傳 播效率降低之問題。 即便於使用上述先前之組成物之情形時,亦可藉由光 107 201222034 照射而分開製作核心部與包覆部,但根據本實施形態所使 用之感光性樹脂組成物,可進一步擴大核心部1094與包覆 部1095之折射率差,且耐熱性得到提高,故可獲得可靠性 更高之光波導1009。其主要係由使成分(a)及成分(B ) 之組成最佳化而產生者。 (光波導之第2製造方法) 再者,於製造第16實施形態及第17實施形態之光波 導1009時’藉由上述方法形成於俯視下之核心部1 〇94之 形狀’此外亦藉由以下方法形成縱剖面之核心層1〇93之形 狀。 以下,對光波導之第2製造方法進行說明,除了形成 於縱剖面之核心層1〇93之形狀以外,與第i製造方法相 同。 圖36 38分別為模式地表示光波導之第2製造方法 步驟例的斜視圖。再者,於圖36〜38,以穿透核心層ic 覆層1 092之方式進行描繪。又,於_ 38,對相當於 心部94之區域標上點。 、 如圖36(a)所示,準備包覆層1091。該包覆 面根據欲製造之核心層1〇93之厚度變化而形成 疋之1¾差。具去,南 冉者此處,以製造圖27(c)所示之光波導1〇 於苴說明。於圖27(〇所示之光波導1009中 分胸貝’。端^設置厚膜部分1943 ’於右側端部設置薄膜 :厚度變:而一:二’包覆層_之上面根據核心層1〇 上下起伏,與此相對下成為水平之平滑面 108 201222034 於圖36(a),準備將該包覆層1091分別延長至兩端側者作 為下側包覆層用母材109P。該下側包覆層用母材丨〇9丨,, 具有於自長邊方向之左側端面稍向右侧移動之部位包含上 面朝左側端部降低而緩緩變低之第1面丨91 i、及與其相連 朝左升高而缓缓變高之第2面1912。又,具有於自長邊方 向之右側端面稍向左側移動之部位包含上面朝右側端部上 升而緩缓變高之第3面1913 '及與其相連朝右降低而緩緩 變低之第4面1914。其中,第1面19li及第3面1913之 上面之傾斜程度分別與圖27 ( c )所示之核心層1 〇93之厚 膜部分1 943及薄膜部分1944之下面之傾斜程度對應。另 一;方面,第2面1912及第4面1914之上面之傾斜程度與 分:別使第1面1911及第3面1913反轉而成者相同。又該 #面以外之上表面成為水平面。 接著,使感光性樹脂組成物溶解於溶劑而製備清漆 1900,將該清漆1900塗佈於下側包覆層用母材i〇9i,上。 其後,經過乾燥獲得膜191〇 (參照圖36 ( b))。 接著,對膜1910選擇性地照射光。此時,如圖36 ( c) 所示,於膜1910之上方配置形成有開口之遮罩M,經由該 開口對膜1910照射光。藉此,於照射區域與未照射區域之 間產生折射率差。再者,此處,經光照射之區域成為包覆 部1095,未照射區域成為核心部1〇94 (參照圖( 〇。 以上述方式於膜191〇上形成核心層1〇93。 接著,以圖37 (〇所示之2個切割面s切割所得之膜 1910與下側包覆層用母材1〇91,之積層體。該2個切割面$ 109 201222034 為分別沿著設置於下側自逋 J巴覆層用母材1091,之上面之第1面 1911與第2面1912之邊w蟪、β够 透界線及第3面1913與第4面1914 之邊界線的面。藉由以切 切割面S切割上述積層體,可獲得 (下側)包覆層1 〇 91血秒心爲! η Λ , ”核。層1〇93之積層體(參照圖37 (f ) ) ° 接著,如圖3 8 ( g ) 層1092。藉由以上步驟 1009。 所示’於核心層1093上貼附包覆 ’可獲得圖38 (h)所示之光波導 再者,於上述說明’對圖27(c)所示之光波導觀 之製造方法進行了說明,只要視需要於乾燥膜MO時,一 面使膜1 91 0之上面成形(你丨耗拖 〇 取心(例如機械加工、壓花等)一面乾 燥即可0藉此,亦可使膜191〇 j况犋iyi〇之上面上下起伏,而可製造 圖 27(a)、圖 27(b)及圓 27ΓγΜ ήί·- 固“〔d)所不之光波導1〇〇9。 又,步驟之順序並不限定於上述者 w、工返考,例如亦可於貼附 用以形成包覆層1092之母材後以切割面s進行切割。 以上,對本發明進行了說明,但本發明並非限定於上 述實施形態者,可達成本發明之目的之範圍内的變形、改 良等包含於本發明者。 又,於上述貫施形態’使用感光性谢&amp;丄 阳4生樹脂組成物形成光 波導膜,但並不限於此,亦可用於全傻Η ^ 王像片荨。上述感光性 樹脂組成物適合形成混合存在折射率較莴 ,π干权问之區域與折射率 較低之區域之膜。 繼而’對本發明之實施例進行說明。 Α.光波導之製造 110 201222034 (實施例1 ) (1)具有脫離性基之降莰烯系樹脂之合成 於水分及氧氣濃度均控制在lppm以下而充滿乾燥氮氣 之套手工作箱中,於5〇〇mL小玻璃瓶稱量己基降莰烯(hexy norbornene) ( HxNB ) 7_2g ( 40. lmmol )、二苯基曱基降莰稀 曱氧基矽烷12.9g ( 40.1 mmol),添加脫水曱苯6〇g與乙酸 乙酉曰11 g,覆蓋石夕製之封塞物(seaier),密栓上部。 接著,於1 OOmL小玻璃瓶中稱量下述化學式(B )所表 不之Nl觸媒IWg ( 3.2mmol)與脫水曱苯1〇mL ,放入攪 拌器晶片(stinrerehip)並密栓,充㈣拌觸媒使其完全溶 解。 以注射器準確稱量該下述化學式(B )所表示之犯觸 媒溶液K將其定量地注入至上述溶解有2種降获稀之 j玻璃瓶中,於室溫下攪拌i小時,結果確認到明顯之黏 度上升。此時’拔掉塞子’添加四氫π夫喃(thf ) 進行 攪拌,獲得反應溶液。 於100mL燒杯添加乙酸野95g、過氧化氫水18§㈠農 度30%)、離子交換水3Gg,進行攪拌,當場製備過醋酸水 溶液。接著,將該水溶液總量添加至上述反應溶液,檀掉 1 2小時,進行Ni之還原處理。 接著,將完成處理之反應溶液換移至分液漏斗中,去 除下部之水層後,添加異丙醇之3G%水溶&amp;丨⑽紅, 劇烈授拌。靜置而完全進行二層分離後去除水層。以合古十3 次重複該水洗過程後,將油層滴加至非常過量之丙酮中 111 201222034 使生成之聚合物再次沈澱,藉由過濾與濾液分離後,於設 定為60 C之真空乾燥機中進行加熱乾燥i 2小時,藉此獲得 聚合物#1。聚合物#1之分子量分佈利用GPC( Gel permeatic)n Chromatography ’凝膠滲透層析法)測定,Mw = 10萬、Mn=4 萬。又,聚合物#1中之各結構單位之莫耳比藉由利用NMr 鑑定,己基降莰烯結構單位為50m〇1%、二苯基甲基降莰烯 甲氧基矽烷結構單位為50mol%。又,利用Metric〇n所得之 折射率為1.55 (測定波長:633 nm )。Then, the film 9 10 is heated. In the heating step of the twisting and halving, the component (B) of the irradiated portion irradiated with light is further polymerized. On the other hand, in the heating step, the component (B) of the unirradiated portion is volatilized. When the material is not irradiated, the component (B) is reduced to form a refractive index close to that of the cycloolefin resin. In the film 91, as shown in Figs. 20(b) and 34(b), the region irradiated with light becomes the cladding portion 95, and the unirradiated region becomes the core portion 94. The core portion 94 is derived from the above-mentioned components (the concentration of the structure of the knives and the knives, and the concentration of the components derived from the component (B) in the coating portion 95, which are different from the concentration of the structure. Specifically, the core In the portion 94, the gentleman's enthalpy of the component (b) is less than the structure concentration of the component (B) in the coating portion 95 103 201222034. The difference in refractive index of the nucleus of the cladding portion 95 is 0 1 Π ^ Λ'. The core portion 94 is formed on the film 910 by the above method, and the core layer is obtained by the film "匕." 93. 18〇r . . φ ^ ... The degree of recognition is not particularly limited, preferably about 30 to 180 C, more preferably 4 〇 to 16 〇. 〇 。. Coincidence, heating time is better A - from I The sigh of the sigh of the sigh of the light (B) is approximately..., the formation of the knives, ., '. The bundle is preferably (^~2 hours or so) better (Μ~! hours) 3 〇·1 2 Thereafter, the same film as the cladding layer 91 is attached to the core layer () flying μ a|_ , ^ i , and the film becomes the cladding layer 92, 1 〇 92 ( η ττ ★ Membrane 2 (below It is referred to as a coating layer 92). A pair of 9=9 is set to 2, and the core portion of the cladding portion 95 is also a 'cladding layer 92' or may be attached by a film, but by a core. The liquid material is applied to the layer 93 and hardened (curing 丄, ^ 〜 method to form 0). The optical waveguide 9 shown in FIG. 21 and FIG. 35 can be obtained by the above steps. When the optical waveguide 9 is obtained by the photosensitive resin composition of the present invention, the solder reflow resistance is particularly excellent. Further, even in the case of the curved optical waveguide 9, the light loss can be reduced. The case where the photosensitive resin composition is directly supplied onto the coating layer 91 to form the film 910 (core layer 93) is described, and after the film 910 (core layer 93) is formed on another substrate, The obtained core layer 93 is transferred onto the cladding layer 91 or the cladding layer 92, and then the cladding layer 9i and the cladding layer 92 are overlapped by the core layer 93 via 104 201222034. Next, the effects of the embodiment will be described. When the photosensitive resin composition used in the present embodiment is irradiated with light, acid is generated from the photoacid generator. The polymerization of the component (b) is carried out only in the irradiated portion. Thereby, the amount of the component (B) in the irradiated portion is reduced, so that the non-irradiated P-knife (B) is diffused to the irradiating portion 'by this' in the irradiating portion The refractive index difference is generated from the unirradiated portion. Specifically, in the present embodiment, since a substituted or unsubstituted cycloaliphatic resin having a higher refractive index than the component (8) is used as the matrix polymer, the unirradiated portion is formed. When the portion is irradiated, the refractive index of the unirradiated portion is higher than the refractive index of the irradiated portion: ', and 'when the photosensitive resin composition is heated after the light is irradiated, the component (B) is volatilized from the unirradiated portion. Thereby, a refractive index difference is further generated between the irradiated portion and the unilluminated portion. By using the photosensitive resin composition as described above, the difference in refractive index can be surely formed in the portion where the spot is not irradiated. Further, according to the present invention, the core portion can be patterned only by a simple method of irradiating light. For example, by appropriately selecting the exposure pattern of "etc., it is possible to form light of any shape or arrangement. = Two PXs can also form a finer optical path clearly, which contributes to the integration of the body and reduces the size of the device. The design of the pattern shape of the core part has a wide degree of freedom, and is still the core part of the core. The first time of the Ding is compared with the one that is produced by the hot acid, so that it has an oxetanyl group and the like: However, it is used in the composition of the above-mentioned technique, such as a heterocyclic butyl group, etc. 2012 201234. Further, this composition heats the entire composition to cause a crosslinked structure as a whole of the composition. There is no such technique in the composition, that is, by selectively irradiating light to generate an acid, and selectively generating a polymerization, and diffusing the monomer to a region where the monomer concentration is small, thereby forming a concentration difference. In the photosensitive resin composition used in the present embodiment, it is found that when the irradiation is selectively performed, the amount of the component (B) in the irradiated portion is reduced by the generation of the acid, so that the irradiation is not performed. Part of the component (B) To the irradiated portion, a refractive index difference is generated between the irradiated portion and the unirradiated portion. Further, the cycloolefin resin is provided to have a detachment by the photoacid generator, and the composition is lowered by detachment. In the case of the detachment of the refractive index of the ring-hard resin of (A), the refractive index of the region irradiated with light can be surely lowered as compared with the unirradiated region. On the other hand, the cycloolefin resin is set to When the detachment base is not provided, the 'side chain chemistry becomes stable', so that the refractive index of the core portion and the cladding portion can be suppressed from changing due to conditions such as light irradiation or heating. Further, in the present embodiment The use of a rare resin is used as the component (A). Thereby, the light transmittance at a specific wavelength can be surely improved, and the loss of propagation can be surely reduced. ......WW~ can be y, the straw will be The refractive index difference between the dad 95 and the core portion 94 is set to 0.01 or more, and the light 3 can be enclosed in the core portion 94, thereby suppressing the generation of light propagation loss. On the other hand, 'previously known to contain a polymer, a monomer, and a helper Touch 106 201222034 media precursor As a composition for forming an optical waveguide, a single system forms a reactant by irradiation of light, and the refractive index of the region irradiated with light is different from the refractive index of the unirradiated region. The substance which causes the reaction of the monomer (polymerization reaction, crosslinking reaction, etc.) to start, and which is a substance which changes the activation temperature by the action of the promoter which is activated by irradiation of light. When the temperature changes, the temperature at which the reaction between the light irradiation region and the non-irradiation region starts is different, and as a result, the reactant is formed only in the irradiation region. In contrast, the photosensitive resin composition used in the present embodiment is used. It is not necessary to use the above-mentioned substance containing a large amount of metal elements. Therefore, it is possible to prevent the increase in propagation loss as described above, and to obtain the optical waveguide 9 which is excellent in propagation efficiency and excellent in heat resistance. In other words, when the above-mentioned prior composition is used, the core portion and the cladding portion can be separately formed by light irradiation. However, according to the photosensitive resin composition used in the embodiment, the core portion % can be further expanded. Since the cladding portion 95 has a difference in refractive index and heat resistance is improved, the optical waveguide 9 having higher reliability can be obtained. It is mainly produced by optimizing the composition of the component (A) and the component (b). On the other hand, since the above-mentioned catalyst precursor contains a relatively large amount of metal elements, it causes absorption of light propagating through the optical waveguide to increase the side effect of propagation loss. In particular, this tendency is remarkable when the optical waveguide is bent. Further, since the catalyst precursor is contained, the heat resistance is lowered, and the propagation efficiency at the time of reflow is lowered. In other words, when the above-mentioned prior composition is used, the core portion and the cladding portion can be separately formed by irradiation of the light 107 201222034. However, according to the photosensitive resin composition used in the embodiment, the core portion 1094 can be further enlarged. The difference in refractive index from the cladding portion 1095 and the heat resistance are improved, so that the optical waveguide 1009 having higher reliability can be obtained. It is mainly produced by optimizing the composition of the component (a) and the component (B). (Second Manufacturing Method of Optical Waveguide) In the case of manufacturing the optical waveguide 1009 of the sixteenth embodiment and the seventeenth embodiment, the shape of the core portion 1 〇 94 formed in the plan view by the above method is also The following method forms the shape of the core layer 1〇93 of the longitudinal section. Hereinafter, the second manufacturing method of the optical waveguide will be described, and the same as the i-th manufacturing method except for the shape of the core layer 1〇93 formed in the vertical cross section. Fig. 36 38 is a perspective view schematically showing an example of the second manufacturing method of the optical waveguide. Furthermore, in Figs. 36 to 38, the core layer ic cladding layer 1 092 is penetrated. Further, at _38, a point corresponding to the heart 94 is marked. As shown in Fig. 36 (a), a coating layer 1091 is prepared. The cladding surface forms a 13⁄4 difference in the thickness of the core layer 1〇93 to be manufactured. Here, the latter is used to manufacture the optical waveguide shown in Fig. 27(c). In Fig. 27 (the optical waveguide 1009 shown in Fig. 27), the thick film portion 1943 is provided at the right end portion of the film: thickness is changed: and one: two 'cladding layer' is formed according to the core layer 1 〇 〇 〇 , 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 The base material for the cladding layer is 9丨, and the portion that moves slightly to the right side from the left end surface in the longitudinal direction includes the first surface 91i that is lowered toward the left end portion and gradually lowered, and The second surface 1912 that is raised toward the left and gradually increases in height. Further, the portion that is slightly moved to the left side from the right end surface in the longitudinal direction includes a third surface 1913 that rises upward toward the right end portion and gradually increases in height. And the fourth surface 1914 which is connected to the lower side and gradually lowers to the right. The inclination of the upper surface of the first surface 19li and the third surface 1913 is respectively the same as that of the core layer 1 〇 93 shown in Fig. 27 (c). The thickness of the thick film portion 1 943 and the lower portion of the film portion 1944 corresponds to each other. On the other hand, the second face 1912 and the fourth face The degree of inclination of the upper surface of 1914 is the same as that of the first surface 1911 and the third surface 1913. The surface above the # surface is a horizontal surface. Next, the photosensitive resin composition is dissolved in a solvent. The varnish 1900 is prepared, and the varnish 1900 is applied onto the base material i〇9i of the lower cladding layer. Thereafter, the film 191 is obtained by drying (see FIG. 36(b)). Next, the film 1910 is selectively selected. At this time, as shown in FIG. 36(c), a mask M having an opening is disposed above the film 1910, and the film 1910 is irradiated with light through the opening. Thereby, the irradiated area and the unirradiated area are irradiated with light. In this case, the region irradiated with light becomes the cladding portion 1095, and the unirradiated region becomes the core portion 1〇94 (see Fig. 形成. The core layer 1 is formed on the film 191〇 in the above manner. Next, the laminated body of the film 1910 and the base material for the lower cladding layer 1〇91 which are cut by the two cutting faces s shown in Fig. 37 are shown in Fig. 37. The two cutting faces are $109 201222034. The first surface 1911 and the second surface 1912 on the upper surface of the base material 1091 which is disposed on the lower side The side w蟪, β is sufficient to open the boundary line and the surface of the boundary line between the third surface 1913 and the fourth surface 1914. By cutting the laminated body with the cut surface S, the (lower side) cladding layer 1 〇 91 blood seconds can be obtained. The heart is! η Λ , "nuclear. Layer 1 〇 93 layer body (refer to Figure 37 (f)) ° Next, as shown in Figure 3 8 (g) layer 1092. By the above step 1009. Show 'in the core layer 1093 The optical waveguide shown in Fig. 38 (h) is attached to the top of the package, and the method of manufacturing the optical waveguide shown in Fig. 27 (c) is described above, as long as it is required to dry the film. In the case of MO, the surface of the film 1 0 0 is formed on one side (you can use a drag on the core (for example, machining, embossing, etc.) to dry it, thereby making the film 191 〇j condition 犋iyi〇 Up and down, the optical waveguides 1〇〇9 of Fig. 27(a), Fig. 27(b) and the circle 27ΓγΜ ήί·- 固 "[d) can be manufactured. Further, the order of the steps is not limited to the above, and the test may be performed, for example, after the base material for forming the cladding layer 1092 is attached, and then cut by the cut surface s. The present invention has been described above, but the present invention is not limited to the above embodiments, and modifications, improvements, etc. within the scope of the object of the invention are included in the present invention. Further, the optical waveguide film is formed by using the photosensitive X-ray & yangyang resin composition in the above-described embodiment. However, the present invention is not limited thereto, and it can also be used for the entire image. The above-mentioned photosensitive resin composition is suitable for forming a film in which a region having a refractive index higher than that of a lettuce, a π dry weight, and a region having a low refractive index is mixed. Next, an embodiment of the present invention will be described.制造. Manufacture of optical waveguides 110 201222034 (Example 1) (1) The synthesis of a decene-based resin having a detaching group is controlled in a hand-working box filled with dry nitrogen gas having a moisture and oxygen concentration of less than 1 ppm. 5〇〇mL small glass bottle weighed hexy norbornene (HxNB) 7_2g (40. lmmol ), diphenyl fluorenyl hydrazine decyloxy decane 12.9g (40.1 mmol), dehydrated benzene 6 g and 11 g of ethyl acetate, covering the sea eagle seal (seaier), the top of the dense plug. Next, the Nl catalyst IWg (3.2 mmol) represented by the following chemical formula (B) and the dehydrated hydrazine benzene 1 〇 mL were weighed in a 100 mL vial and placed in a stirrer chip (stinrerehip) and fused (4) Mix the catalyst to dissolve it completely. The catalyst solution K represented by the following chemical formula (B) was accurately weighed by a syringe and quantitatively injected into the above-mentioned glass bottle in which two kinds of reduced and diluted j bottles were dissolved, and stirred at room temperature for 1 hour, and the result was confirmed. The apparent viscosity rises. At this time, the plug was removed and tetrahydropyrene (thf) was added and stirred to obtain a reaction solution. 95 g of acetic acid field, 18 § of agricultural hydrogen peroxide (30%), and 3 gg of ion-exchanged water were added to a 100 mL beaker, and stirring was carried out to prepare an aqueous acetic acid solution on the spot. Next, the total amount of the aqueous solution was added to the above reaction solution, and the reduction treatment of Ni was carried out for 12 hours. Next, the treated reaction solution was transferred to a separatory funnel, and after removing the lower aqueous layer, 3 G% of water-soluble &amp; 丨(10) red of isopropanol was added, and the mixture was vigorously mixed. The aqueous layer was removed after standing for two layers of separation. After repeating the water washing process for 13 times, the oil layer was added dropwise to a very large amount of acetone. 111 201222034 The resulting polymer was again precipitated, separated from the filtrate by filtration, and placed in a vacuum dryer set at 60 C. Heat drying was performed for 2 hours, whereby Polymer #1 was obtained. The molecular weight distribution of the polymer #1 was measured by GPC (Gel Permeatic) n Chromatography 'gel permeation chromatography, and Mw = 100,000 and Mn = 40,000. Further, the molar ratio of each structural unit in the polymer #1 was identified by using NMr, the structural unit of hexylnordecene was 50 m〇1%, and the structural unit of diphenylmethylnordecene methoxydecane was 50 mol%. . Further, the refractive index obtained by Metric〇n was 1.55 (measurement wavelength: 633 nm).

Ph PhPh Ph

聚合物#1 (2 )感光性樹脂組成物之製造 於H)〇mL之玻璃容器稱量1〇g之經純化之上述聚合物 =,於其中添加均三甲苯40g、抗氧化劑irg_x 1〇76(1 ~Geigy公司製造)〇.〇lg、環己基氧雜環丁烧單體(式2〇 气100)所不之帛1單體,東亞合成製造之 112 201222034 CAS#483303— 25- 9,分子量為 186,沸點為 125°C/1.33 kPa) 2g、光酸產生劑 RhodorsilPhotoinitiator 2074 ( Rhodia 公司製造,CAS# 178233 — 72 — 2 ) ( 1.36E — 2g,乙酸乙酯 O.lmL中)’使均勻溶解後’藉由〇.2μ m之PTFE過濾器進 行過濾,獲得潔淨之感光性樹脂組成物清漆V1。 (3)光波導膜之製造 (下側包覆層之製作) 於矽晶圓上’藉由到刀均勻塗佈感光性降莰烯樹脂組 成物(Promerus公司製造,Avatrel 2000P清漆)後,投入 45°C之乾燥機1 5分鐘。完全去除溶劑後,對經塗佈之整個 面照射紫外線100mJ,於乾燥機中以120。(:加熱1小時,使 塗膜硬化’形成下側包覆層。所形成之下側包覆層之厚度 為20# m,無色透明’折射率為1.52(測定波長:633 nm)。 (核心層之形成) 於上述下側包覆層上’藉由刮刀均勻'地塗佈感光性樹 脂組成物清漆V1後’投入45°C之乾燥機15分鐘。完全去 除溶劑後,壓接光罩’以500 mJ / cm2選擇性地照射紫外 線°除去遮罩,於乾燥機中以45°C 30分鐘、以85°C 30分 鐘、以150°C 1小時分三個階段進行加熱。加熱後,確認到 出現非常鮮明之波導圖案。又,確認到核心部及包覆部之 形成。 (上側包覆層之形成) 於聚醚颯(PES )膜上,將預先以乾燥厚度成為2〇//m 之方式積層Avatrel 2000P而成之乾膜貼合於上述核心層, 113 201222034 投入設定為140°C之真空貼合機中進行熱壓接。其後,以 1 OOmJ全面照射紫外線,於乾燥機中,以12〇&lt;&gt;c加熱1小時, 使Avatrel 2000P硬化,形成上侧包覆層,獲得光波導。此 時’上側包覆層無色透明,其折射率為1 52。 (4 )評價 (光波導之損失評價) 經由5〇V m多之光纖,將自850nm之VCSEL (表面發 光雷射)發出之光導入上述光波導,以2〇〇vm多之光纖進 行受光,測定光之強度》再者,測定係採用回截(cutback、 方法。將光波導之長邊方向作為橫軸,將插入損失繪製成 縱軸,其結果測定值準確地排列於直線上,由其斜度可算 出傳播損失為〇.〇3 dB/ cm。 (核心部與包覆部之折射率差) 上述(核心層之形成)所形成之於水平方向鄰接的左 右之核心部一包覆部間之折射率差係藉由以下方式求出。 藉由加拿大國EXF0公司製造之〇ptical waveguide analyzer0WA— 9500對光波導照射波長656 nm之雷射光, 分別實測核心區域及包覆區域之折射率,算出該等之差。 其結果’折射率差為0.02。 (實施例2 ) (1 )不具有脫離性基之降莰烯系樹脂之合成 於水刀及氧氣濃度均控制在lppm以下而充滿乾燥氮氣 之套手工作知令,於5〇〇mL小玻璃瓶中稱量己基降茨稀 (HXNB ) 9.4g ( 53.lmmo1 )、苯基乙基降获稀 l〇.5g 114 201222034 乙酸乙酯1 1 g,覆蓋矽 (53.1mm〇l),添加脫水甲苯6〇g與 製之封塞物,密检上部。 者,於1〇〇mL小玻璃瓶中稱量上述化學式(B)所表 示之犯觸媒2.06g(3.2mm〇1)與脫水甲苯1〇机,放入授 拌器晶片並密栓’充分授拌觸媒使其完全溶解。 以注射器準福稱量上述化學式⑻所表示之Ni觸媒 溶液ImL,將其定量地注人至上述溶解有2種㈣稀之小 玻璃瓶中’於室溫下攪#丨小時,結果確認到明顯之黏度 上升。此時’拔掉塞子’添加四氫呋喃(thf ) 進行攪 拌,獲得反應溶液。 於100mL燒杯添加乙酸酐9 5g、過氧化氮水i8g (濃 度30%)、離+交換水3〇g進行㈣,當場製備過醋酸水溶 液。接著,將該水溶液總量添加至上述反應溶液,攪拌1 2 小時進行Ni之還原處理。 接著,將完成處理之反應溶液換移至分液漏斗中,去 除下部之水層後,添加異丙醇之3〇%水溶液1〇〇mL,進行 劇烈攪拌。靜置而完全進行二層分離後去除水層。以合計3 次重複該水洗過程後,將油層滴加至非常過量之丙酮中, 使生成之聚合物再次沈澱,藉由過濾與濾液分離後,於設 定為60°C之真空乾燥機中進行加熱乾燥12小時,藉此獲得 聚合物#2。聚合物#2之分子量分佈利用GPC測定,Mw=9 萬、Mn=4萬。又,聚合物#2中之各結構單位之莫耳比藉由 利用NMR之鑑定’己基降莰烯結構單位為5〇 m〇i%、苯基 乙基降莰烯結構單位為50 mol%。又,利用Metricon所得 115 201222034 之折射率為1.54 (測定波長:633 nm)。Polymer #1 (2) Manufacture of photosensitive resin composition In a glass container of H) 〇mL, weighed 1 〇g of the purified polymer =, and added mesitylene 40g, antioxidant irg_x 1〇76 (1 ~ manufactured by Geigy Co., Ltd.) 〇 〇 lg, cyclohexyl oxacyclobutane monomer (Formula 2 Xenon 100) 帛 1 monomer, manufactured by East Asia Synthetic 112 201222034 CAS#483303— 25- 9, Molecular weight is 186, boiling point is 125 ° C / 1.33 kPa) 2 g, photoacid generator Rhodorsil Photoinitiator 2074 (manufactured by Rhodia Co., Ltd., CAS # 178233 - 72 - 2 ) ( 1.36E - 2g, ethyl acetate in 0.1 mL) After uniformly dissolving, 'filtered by a PTFE filter of 2 μm to obtain a clean photosensitive resin composition varnish V1. (3) Fabrication of an optical waveguide film (production of a lower cladding layer) After a uniform coating of a photosensitive norbornene resin composition (Avatrel 2000P varnish manufactured by Promerus) on a crucible wafer Dryer at 45 ° C for 1 5 minutes. After the solvent was completely removed, the coated surface was irradiated with ultraviolet rays of 100 mJ and 120 in a dryer. (: heating for 1 hour to harden the coating film to form a lower side cladding layer. The thickness of the lower side cladding layer formed was 20# m, and the colorless transparent 'refractive index' was 1.52 (measurement wavelength: 633 nm). Formation of a layer] On the lower cladding layer, the photosensitive resin composition varnish V1 was uniformly applied by a doctor blade, and then placed in a dryer at 45 ° C for 15 minutes. After completely removing the solvent, the pressure mask was crimped. The ultraviolet ray was selectively irradiated at 500 mJ / cm 2 to remove the mask, and the mixture was heated in a drier at 45 ° C for 30 minutes, at 85 ° C for 30 minutes, and at 150 ° C for 1 hour in three stages. After heating, it was confirmed. When a very clear waveguide pattern appears, it is confirmed that the core portion and the cladding portion are formed. (Formation of the upper cladding layer) On the polyether enamel (PES) film, the dry thickness is 2 〇//m in advance. The dry film formed by laminating Avatrel 2000P is adhered to the above core layer, 113 201222034 is put into a vacuum laminator set to 140 ° C for thermocompression bonding. Thereafter, the ultraviolet ray is completely irradiated with 100 Å in the dryer. , heated at 12 〇&lt;&gt;c for 1 hour to harden Avatrel 2000P The upper cladding layer is used to obtain an optical waveguide. At this time, the upper cladding layer is colorless and transparent, and its refractive index is 152. (4) Evaluation (loss evaluation of optical waveguide) The optical fiber via 5 〇V m will be from 850 nm. The light emitted by the VCSEL (surface-emitting laser) is introduced into the optical waveguide, and the light is received by an optical fiber of 2 〇〇vm, and the intensity of the light is measured. Further, the measurement system uses a cutback method. The side direction is plotted as the horizontal axis, and the insertion loss is plotted as the vertical axis. As a result, the measured value is accurately arranged on the straight line, and the propagation loss can be calculated as 〇.〇3 dB/cm. (The core portion and the cladding portion (Refractive Index Difference) The difference in refractive index between the core portions and the cladding portions formed by the above-mentioned (formation of the core layer) in the horizontal direction is obtained by the following method: 〇ptical manufactured by the Canadian company EXF0 The waveguide analyzer 0WA-9500 irradiates the optical waveguide with laser light having a wavelength of 656 nm, and respectively measures the refractive indices of the core region and the cladding region, and calculates the difference therebetween. The result is that the refractive index difference is 0.02. (Example 2) (1) No detachment base The synthesis of the decene-based resin is carried out in a water-jet knives and the oxygen concentration is controlled below 1 ppm and filled with dry nitrogen. The hexyl thiophene (HXNB) 9.4g is weighed in a 5〇〇mL small glass bottle. 53.lmmo1), phenylethyl reduced rare l〇.5g 114 201222034 ethyl acetate 1 1 g, covered with hydrazine (53.1mm〇l), added dehydrated toluene 6〇g and the plugged material, the upper part of the dense inspection . Weigh 2.06g (3.2mm〇1) of the catalyst represented by the above formula (B) and dehydrated toluene in a 1〇〇mL small glass bottle, put it into the mixer chip and sew it Mix the catalyst to dissolve it completely. ImL of the Ni catalyst solution represented by the above chemical formula (8) was weighed in a syringe, and it was quantitatively injected into the above-mentioned two kinds of (four) thin glass bottles, which were stirred at room temperature for one hour, and it was confirmed. The apparent viscosity increases. At this time, the plug was removed and tetrahydrofuran (thf) was added and stirred to obtain a reaction solution. Into a 100 mL beaker, 95 g of acetic anhydride, i8 g of nitrogen peroxide water (concentration: 30%), and 3 〇g of + exchanged water were added to carry out (iv), and an aqueous acetic acid solution was prepared on the spot. Next, the total amount of the aqueous solution was added to the above reaction solution, and the mixture was stirred for 12 hours to carry out a reduction treatment of Ni. Next, the reaction solution which had been subjected to the treatment was transferred to a separatory funnel, and after removing the lower aqueous layer, 1 mL of a 3 % aqueous solution of isopropyl alcohol was added thereto, followed by vigorous stirring. The aqueous layer was removed after standing for two layers of separation. After repeating the water washing process for a total of three times, the oil layer was added dropwise to a very large amount of acetone, and the resulting polymer was again precipitated, separated from the filtrate by filtration, and then heated in a vacuum dryer set at 60 °C. It was dried for 12 hours, whereby Polymer #2 was obtained. The molecular weight distribution of the polymer #2 was measured by GPC, and Mw = 90,000 and Mn = 40,000. Further, the molar ratio of each structural unit in the polymer #2 was determined by NMR, and the structural unit of hexylpentene was 5 〇 m〇i%, and the structural unit of phenylethyl decene was 50 mol%. Further, the refractive index of 115 201222034 obtained by Metricon was 1.54 (measurement wavelength: 633 nm).

(聚合物#2 ) (2 )感光性樹脂組成物之製造 於100mL之玻璃容器稱量1〇g經純化之上述聚合物 #2,於其中添加均三甲苯40g、抗氧化劑irganox i〇76( Ciba —Geigy公司製造)〇 〇lg、環己基氧雜環丁烷單體(式2〇 所示者’東亞合成製造之CHOX、CAS#483303 — 25 - 9,分 子量為186,沸點為125°c/1.33kpa)2g、光酸產生劑(Polymer #2) (2) Production of photosensitive resin composition 100 g of a glass container was weighed and 1 g of the purified polymer #2 was added thereto, and 40 g of mesitylene and an antioxidant irganox i〇76 were added thereto. Ciba - manufactured by Geigy, 〇〇 lg, cyclohexyl oxetane monomer (CH2, manufactured by East Asia Synthetic Co., Ltd., CAS#483303 - 25 - 9, molecular weight 186, boiling point 125 °c) /1.33kpa) 2g, photoacid generator

RhodorsilPhotoinitiator 2074 ( Rhodia 公司製造, CAS#178233 - 72- 2 ) ( 1.3 6E- 2g,乙酸乙酯 〇.imL 中), 使均勻溶解後,藉由0.2 # m之PTFE過濾器進行過濾,獲 得潔淨之感光性樹脂組成物清漆V2。 (3)光波導膜之製造 (下側包覆層之製作) 製作與實施例1相同之下側包覆層。 (核心層之形成) 於上述下側包覆層上,藉由刮刀均勻地塗佈感光性樹 116 201222034 脂組成物清漆V2後,投入45°c之乾燥機丨5分鐘。完全去 除溶劑後,壓接光罩,以5〇〇 mJ/ cm2選擇性地照射紫外 線。除去遮罩,於乾燥機中以45°c 3〇分鐘、以85。〇八 鐘、以15(TC 1小時分三個階段進行加熱。加熱後,確認= 出現非常鮮明之波導圖案。χ,確認到核心部及包覆部之 形成。 (上側包覆層之形成) 製作與實施例1相同之上側包覆層。 (4 )評價 藉由與實施例1相同之方法進行評價。可算出傳播損 失為0_04dB/cm。核心部與包覆部之折射率差為〇 〇1。 (實施例3 ) (1 )具有脫離性基之降莰烯系樹脂之合成 以與實施例1相同之方法製作降㈣系樹脂。 (2 )感光性樹脂組成物之製造 於l〇〇mL之玻璃容器稱^ 1〇g經純化之上述聚合 #ι,於其中添加均三甲苯40g、抗氧化齊Urgan〇x i〇76( c】 -Gelgy么、司製造)0.01g、二官能氧雜環丁烧單體(式(ι :不者,東亞合成製造之D〇x、CAS#i8934—⑻一,分 量為214,沸點為119°C /0.67 kPa ) 2g、光酸產生 Rh〇dorsilPhotoinitiat〇r 2〇74 (灿〇仙公司製造 CAS# 178233 - 72 - 2 ) ( 1.36E- 2g &gt; 7 m ^ g乙酉义乙酯0.1 mL中) 使均勻溶解後,藉由〇.2/^m之 ^ 過濾器進行過濾,《 得潔淨之感光性樹脂組成物清漆ν “ 117 201222034 (3)光波導膜之製造 (下側包覆層之製作) 製作與實施例1相同之下側包覆層。 (核心層之形成) 於上述下側包覆層上,藉由刮刀均句地塗佈感光性樹 脂組成物清漆V3後,投入45。(:之乾燥機1 5分鐘。完全去 除/谷劑後’壓接光罩’以5〇〇 mj/ cm2選擇性地照射紫外 線°除去遮罩,於乾燥機中以45〇C3〇分鐘、以85&lt;t3〇分 鐘、以1 5〇t 1小時以三個階段進行加熱。加熱後,確認到 出現非常鮮明之波導圖案。又,確認到核心部及包覆部之 形成。 (上側包覆層之形成) 製作與實施例1相同之上側包覆層。 (4 )評價 藉由與實施例1相同之方法進行評價。可算出傳播損 失為0.04 dB/cm。核心部與包覆部之折射率差為〇 〇1。 (實施例4 ) (1 )具有脫離性基之降莰稀系樹脂之合成 以與實施例1相同之方法製作降莰烯系樹脂。 (2 )感光性樹脂組成物之製造 於100 mL之玻璃容器稱量1〇g經純化之上述聚合物 #卜於其中添加均三甲苯4〇g、抗氧化劑Irgan〇x 1〇76( —Geigy公司製造)〇.〇lg、脂環式環氧單體(式(37)所 示者 ’ Daicel Chemical 製造之 Cell〇xide2〇21p、CAS#2386 118 201222034 —87—0,分子量為252,沸點為i88°C/4 hPa) 2g、光酸 產生劑 RhodorsilPhotoinitiator 2074 ( Rhodia 公司製造, CAS#178233 - 72- 2 ) ( 1.36E- 2g,乙酸乙酯 O.lmL 中), 使均勻溶解後,藉由〇·2# m之PTFE過濾器進行過濾,獲 得潔淨之感光性樹脂組成物清漆V4。 (3)光波導膜之製造 (下側包覆層之製作) 。 製作與貫施例1相同之下側包覆層。 (核心層之形成) 於上述下側包覆層上,藉由到刀均勻塗佈感光性樹脂 組成物清漆V4後,投入45。(:之乾燥機15分鐘《完全去除 溶劑後,壓接光罩,以5〇〇 cm2選擇性地照射紫外線。 除去遮罩,於乾燥機中以4rc 3〇分鐘、以85t 3〇分鐘、 以150。〇1小時以三個階段進行加熱。加熱後,確認到出現 非常鮮明之波導圖案。又,確認到核心部及包覆部之形成。 (上側包覆層之形成) 製作與實施例1相同之上側包覆層。 (4 )評價 藉由與實施例1相同之方法進行評價。可算出傳播損 失為0.04 dB/cm。核心部與包覆部之折射率差為〇 〇1。貝 (實施例5) (1 )具有脫離性基之降获稀系樹脂之合成 以與實施例1相同之方法製作降莰烯系樹脂。 (2 )感光性樹脂組成物之製造 119 201222034 於100 mL之玻璃谷器稱置1 〇g經純化之上述聚合物 #1,於其中添加均三曱苯40g、抗氧化劑Irgan〇x 1〇76( ciba 一 Geigy公司製造)O.Olg、環己基氧雜環丁烷單體(式2〇 所示者’東亞合成製造之CHOX)lg、脂環式環氧單體(Daicel Chemical 製造,Celloxide 2021P ) ig、光酸產生劑 RhodorsilPhotoinitiator 2074 ( Rhodia 公司製造, CAS#178233 - 72- 2 ) ( 1.36E-2g,乙酸乙酯 〇 lmL 中), 使均勻溶解後’藉由0.2 /z m之PTFE過濾器進行過渡,獲 得潔淨之感光性樹脂組成物清漆V5。 (3)光波導膜之製造 (下側包覆層之製作) 製作與實施例1相同之下側包覆層。 (核心層之形成) 於上述下側包覆層上,藉由到刀均勻塗佈感光性樹脂 組成物清漆V5後,投入45°C之乾燥機15分鐘。完全去除 溶劑後’壓接光罩,以5〇〇 mj/ cm2選擇性地照射紫外線。 除去遮罩,於乾燥機中以45 °C 30分鐘、以85 °C 30分鐘、 以15〇°c 1小時以三個階段進行加熱。加熱後’確認到出現 非常鮮明之波導圖案。又,確認到核心部及包覆部之形成。 (上側包覆層之形成) 製作與實施例1相同之上側包覆層。 (4 )評價 藉由與實施例1相同之方法進行評價。可算出傳播損 失為0.03 dB/ cm。核心部與包覆部之折射率差為〇.〇i。 120 201222034 (實施例6) (1 )具有脫離性基之降莰烯系樹脂之合成 以與實施例1相同之方法製作降莰烯系樹脂。 (2 )感光性樹脂組成物之製造 於100 mL之玻璃容器稱量1 〇g經純化之上述聚合物 #1,於其中添加均三甲苯40g、抗氧化劑 —Geigy公司製造)0.01g、環己基氧雜環丁烷單體(式2〇 所示者’東亞合成製造之CHOX ) i.5g、光酸產生劑 RhodorsilPhotoinitiator 2074 ( Rhodia 公司製造, CAS#178233 —72—2)( 1.36E_2g,乙酸乙酯 〇lmL 中), 使均勻溶解後,藉由0.2 μ m之PTFE過濾器進行過濾,獲 得潔淨之感光性樹脂組成物清漆V6。 (3)光波導膜之製造 (下側包覆層之製作) 製作與實施例1相同之下側包覆層。 (核心層之形成) 於上述下側包覆層上,藉由刮刀均勻塗佈感光性樹脂 組成物清漆V6後,投入45。(:之乾燥機15分鐘。完全去除 溶劑後’壓接光罩,以500 mJ/ cm2選擇性地照射紫外線。 除去遮罩,於乾燥機中以45°C 30分鐘、以85 °C 30分鐘、 以1 50°C 1小時以三個階段進行加熱。加熱後,確認到出現 非常鮮明之波導圖案。又,確認到核心部及包覆部之形成。 (上側包覆層之形成) 製作與實施例1相同之上側包覆層。 121 201222034 (4 )評價 藉由與實施例1相同之方法進行評價。 J异出傳播損 失為0.03 dB/Cm。核心部與包覆部之折 、 干左马0.01。 (實施例7) (1)具有脫離性基之降莰烯系樹脂之合成 於水分及氧氣濃度均控制在lppm以下而充滿乾燥氮顏 之套手工作箱中,&amp; 500mL小玻璃瓶稱量己基降莰词 (HxNB) SJgUHmm。〗)、二苯基甲基降_甲氧基石夕煩 (diPhNB) 8.7g (27.1麵〇1)、環氧降获烯(EpNB) 4^ (27.1mmol)’添加脫水曱苯6〇g與乙酸乙酯i ·: 製之封塞物,並密栓上部。 ' 石 接著,於100 mL小玻璃瓶中稱量上述化學式(B)戶片 表不之Νι觸媒1.75g (3.2mmol)與脫水曱苯1〇祉,放入 攪拌器晶片並密栓,充分攪拌觸媒使其完全溶解。 以注射器準確稱量該上述化學式⑻所表示之犯觸 媒溶液lmL,將其定量地注人至上述溶解有3種降获稀之 小玻璃瓶中’於室溫下㈣丨小時,結果確認利顯之點 度上升。此時拔掉塞子,添加四氫咬喃(THF),進行携 拌,獲得反應溶液。 於100紅燒杯添加乙酸酐9_5g'過氧化氫水18g (濃 度30%)、離子交換水3Qg進行㈣,#場製備過醋酸水溶 液。接著’將該水溶液總量添加至上述反應溶液中揽摔12 小時,進行Ni之還原處理。 接著,將完成處理之反應溶液換移至分液漏斗中,去 122 201222034 除下部之水層後,添加異 門%之30%水溶液i〇〇mL,進耔 劇烈授拌。靜置而完全進行二八 —9刀離後去除水層。以合計3 次重複該水洗過程後,將油禺 行曲層滴加至非常過量之丙酮中, 使生成之聚合物再次沈澱,蕻 —、 错由過濾與濾液分離後,於設 疋為60°C之真空乾燥機中加埶 …、乾紐12小時,藉此獲得聚合 #3。聚合物#3之分子量分佈利用GPC測定,Mw=8萬、 14萬。又,聚合物#3中之各結構單位之莫耳比藉由利 用NMR之鑑定,己基降莰烯处 那、,,α構早位為40 mol%、二笨美 曱基降莰稀曱氧基石夕烧結構單位 早位為30 mol%、環氧降莰烯結 構早位為30 mol°/〇。又,利用Mptr; , 用Metncon所得之折射率為1.53 (測定波長:633 nm )。Rhodorsil Photoinitiator 2074 (manufactured by Rhodia, CAS#178233 - 72- 2 ) ( 1.3 6E- 2g, ethyl acetate 〇.imL), after homogeneous dissolution, filtered by 0.2 # m PTFE filter to obtain clean Photosensitive resin composition varnish V2. (3) Production of optical waveguide film (Production of lower cladding layer) The lower cladding layer was produced in the same manner as in Example 1. (Formation of core layer) On the lower cladding layer, the photosensitive tree 116 201222034 was used to uniformly apply the varnish V2, and then placed in a dryer at 45 ° C for 5 minutes. After completely removing the solvent, the photomask was crimped and the ultraviolet rays were selectively irradiated at 5 〇〇 mJ/cm2. The mask was removed and dried at 45 ° C for 3 minutes in the dryer. After eight hours, the heating was carried out in three stages of 15 (TC 1 hour. After heating, it was confirmed that a very clear waveguide pattern appeared. χ, the formation of the core portion and the cladding portion was confirmed. (Formation of the upper cladding layer) The same upper side cladding layer as in Example 1 was produced. (4) Evaluation was performed by the same method as in Example 1. The propagation loss was calculated to be 0_04 dB/cm. The refractive index difference between the core portion and the cladding portion was 〇〇 1. (Example 3) (1) Synthesis of a decene-based resin having a cleavable group A ruthenium-based resin was produced in the same manner as in Example 1. (2) Production of a photosensitive resin composition was carried out. The glass container of mL is weighed and purified, and the above-mentioned polymerization #1 is added thereto, and 40 g of mesitylene, 90 g of anti-oxidation, Urgan〇xi〇76 (c)-Gelgy, manufactured by the company, 0.01 g, and difunctional oxygen are added thereto. Cyclobutane monomer (Form: ι: no, D东亚x, CAS#i8934—(8) one, component 214, boiling point 119°C /0.67 kPa) 2g, photoacid produces Rh〇dorsilPhotoinitiat〇 r 2〇74 (CAS# 178233 - 72 - 2 manufactured by Chancella Inc.) ( 1.36E- 2g &gt; 7 m ^ g After 0.1 mL is dissolved uniformly, it is filtered by a filter of 〇.2/^m^, "Clean photosensitive resin composition varnish ν" 117 201222034 (3) Manufacture of optical waveguide film (lower side package) (Preparation of coating) The same side cladding layer as in Example 1 was produced. (Formation of Core Layer) After the photosensitive resin composition varnish V3 was uniformly applied to the lower cladding layer by a doctor blade, Inject 45. (: The dryer is 1 5 minutes. After the complete removal / the granules, the 'crimp reticle' is selectively irradiated with ultraviolet rays at 5 〇〇mj/cm2 to remove the mask, 45 〇C3 in the dryer In the minute, the heating was performed in three stages at 85 ° lt; t3 〇 minutes and 1 5 〇 t for 1 hour. After heating, it was confirmed that a very clear waveguide pattern appeared. Further, the formation of the core portion and the cladding portion was confirmed. Formation of coating layer) The same upper side cladding layer as in Example 1 was produced. (4) Evaluation was performed by the same method as in Example 1. The propagation loss was calculated to be 0.04 dB/cm. Core portion and cladding portion The difference in refractive index is 〇〇1. (Example 4) (1) The sparseness of the detachment group Synthesis of Resin The decene-based resin was produced in the same manner as in Example 1. (2) The photosensitive resin composition was produced in a 100 mL glass container, and 1 〇g of the purified polymer was added thereto. Mesitylene 4〇g, antioxidant Irgan〇x 1〇76 (made by Geigy) 〇.〇lg, alicyclic epoxy monomer (shown by formula (37)' Cellexxide2 manufactured by Daicel Chemical 21p, CAS#2386 118 201222034 —87—0, molecular weight 252, boiling point i88°C/4 hPa) 2g, photoacid generator Rhodorsil Photoinitiator 2074 (manufactured by Rhodia, CAS#178233 - 72- 2 ) ( 1.36E- 2 g, ethyl acetate (0.1 mL) was uniformly dissolved, and then filtered through a PTFE filter of 〇·2# m to obtain a clean photosensitive resin composition varnish V4. (3) Fabrication of an optical waveguide film (production of a lower cladding layer). The lower side cladding layer was produced in the same manner as in Example 1. (Formation of Core Layer) On the lower cladding layer, the photosensitive resin composition varnish V4 was uniformly applied to the blade, and then 45 was introduced. (: dryer for 15 minutes) After completely removing the solvent, the photomask was crimped and the ultraviolet rays were selectively irradiated at 5 〇〇cm2. The mask was removed and dried in a dryer at 4 rc for 3 minutes, at 85t for 3 minutes. 150. The heating was carried out in three stages in one hour. After heating, it was confirmed that a very clear waveguide pattern appeared. Further, the formation of the core portion and the cladding portion was confirmed. (Formation of the upper cladding layer) Production and Example 1 The same upper side cladding layer. (4) Evaluation was performed by the same method as in Example 1. The propagation loss was calculated to be 0.04 dB/cm. The refractive index difference between the core portion and the cladding portion was 〇〇1. Example 5) (1) Synthesis of a reduced-resistance resin having a debonding group A norbornene-based resin was produced in the same manner as in Example 1. (2) Production of a photosensitive resin composition 119 201222034 In 100 mL The glass granules were prepared by dissolving 1 〇g of the above-mentioned polymer #1, and adding 40 g of stilbene benzene, antioxidant Irgan 〇 x 1 〇 76 (manufactured by Ciba-Geigy Co., Ltd.) O. Olg, cyclohexyloxyheterocycle Butane monomer (CHOX of East Asia Synthetic Co., Ltd.) Ring epoxy monomer (manufactured by Daicel Chemical, Celloxide 2021P) ig, photoacid generator Rhodorsil Photoinitiator 2074 (manufactured by Rhodia, CAS#178233 - 72-2) ( 1.36E-2g, ethyl acetate in 1mL), After uniformly dissolving, the transition was carried out by a 0.2/zm PTFE filter to obtain a clean photosensitive resin composition varnish V5. (3) Production of optical waveguide film (production of lower cladding layer) Production was the same as in Example 1. Lower side cladding layer (Formation of core layer) The photosensitive resin composition varnish V5 was uniformly applied onto the lower cladding layer by a knife, and then placed in a dryer at 45 ° C for 15 minutes. After the solvent, the film is crimped and selectively irradiated with ultraviolet light at 5 〇〇mj/cm2. The mask is removed and dried in a dryer at 45 ° C for 30 minutes, at 85 ° C for 30 minutes, at 15 ° C for 1 hour. The heating was carried out in three stages. After heating, it was confirmed that a very clear waveguide pattern appeared. Further, the formation of the core portion and the cladding portion was confirmed. (Formation of the upper cladding layer) The same upper side cladding as in Example 1 was produced. (4) Evaluation by the same as Example 1 The same method was used for evaluation. The propagation loss was calculated to be 0.03 dB/cm. The difference in refractive index between the core and the cladding was 〇.〇i. 120 201222034 (Example 6) (1) Decane having a detachment group Synthesis of a resin The decene-based resin was produced in the same manner as in Example 1. (2) Production of a photosensitive resin composition In a 100 mL glass container, 1 〇g of the above-mentioned polymer #1 was purified. Among them, 40 g of mesitylene, 0.01 g of an antioxidant-made by Geigy Co., Ltd., a cyclohexyloxetane monomer (CHOX of East Asia Synthetic Co., Ltd. shown in Formula 2) i.5 g, photoacid generator Rhodorsil Photoinitiator 2074 (Manufactured by Rhodia, CAS#178233 - 72-2) ( 1.36E_2g, ethyl acetate in 1 mL), after homogeneous dissolution, filtration through a 0.2 μm PTFE filter to obtain a clean photosensitive resin composition Varnish V6. (3) Production of optical waveguide film (Production of lower cladding layer) The lower cladding layer was produced in the same manner as in Example 1. (Formation of Core Layer) On the lower cladding layer, the photosensitive resin composition varnish V6 was uniformly applied by a doctor blade, and then 45 was introduced. (: dryer for 15 minutes. After completely removing the solvent, 'press the reticle and selectively irradiate the ultraviolet ray at 500 mJ/cm2. Remove the mask and dry at 45 ° C for 30 minutes at 85 ° C for 30 minutes. The heating was carried out in three stages at 1 50 ° C for 1 hour. After heating, it was confirmed that a very clear waveguide pattern appeared. Further, the formation of the core portion and the cladding portion was confirmed. (Formation of the upper cladding layer) The same upper side cladding layer of Example 1. 121 201222034 (4) Evaluation was carried out by the same method as in Example 1. The J-emission propagation loss was 0.03 dB/cm, and the core portion and the cladding portion were folded, and the left was left. Horse 0.01. (Example 7) (1) Synthesis of a decene-based resin having a detaching group, in a hand-working box filled with a dry nitrogen film with a moisture and oxygen concentration of less than 1 ppm, &amp; 500 mL of a small glass Bottle weighing hexyl hydrazine (HxNB) SJgUHmm. 〖), diphenylmethyl _ methoxy 夕 烦 (diPhNB) 8.7g (27.1 〇 1), epoxy olefin (EpNB) 4 ^ ( 27.1 mmol) 'Addition of dehydrated hydrazine 6 〇g and ethyl acetate i ·: The plug was prepared and the upper part was tightly packed. ' Stone Next, weigh the above formula (B) in a 100 mL vial to measure 1.75 g (3.2 mmol) of Νι catalyst and dehydrated hydrazine benzene, put it into a stirrer wafer and sew it tightly, stir well The catalyst is completely dissolved. Accurately weigh 1 mL of the catalyst solution represented by the above chemical formula (8) in a syringe, and quantitatively inject it into the above-mentioned three kinds of reduced glass bottles, which are dissolved in a small glass bottle at room temperature (four) for a few hours. Significantly increased. At this time, the stopper was pulled out, tetrahydrogenated (THF) was added, and the mixture was stirred to obtain a reaction solution. An acetic acid aqueous solution was prepared by adding acetic anhydride 9_5 g of hydrogen peroxide (18 g (concentration: 30%) and ion-exchanged water of 3Qg) to a red beaker. Then, the total amount of the aqueous solution was added to the above reaction solution for 12 hours to carry out a reduction treatment of Ni. Then, the reaction solution that has been processed is transferred to a separatory funnel, and 122 201222034 is added to the lower aqueous layer, and then a 30% aqueous solution of i% mL is added, and the mixture is vigorously mixed. After standing still, the water layer was removed after the two-eighth to nine-knife separation. After repeating the water washing process for a total of three times, the oil smashing layer was dropped into a very large amount of acetone to precipitate the polymer again, and the 蕻-, 错 was separated from the filtrate by filtration, and the enthalpy was set to 60°. In a vacuum dryer of C, 埶..., dry for 12 hours, thereby obtaining polymerization #3. The molecular weight distribution of the polymer #3 was measured by GPC, and Mw = 80,000 and 140,000. Further, the molar ratio of each structural unit in the polymer #3 is determined by NMR, and the hexyl decanoene is at a position of 40 mol%, and the second structure is reduced to 40 mol%. The unit of the base stone smoldering structure is 30 mol% in the early position and 30 mol/〇 in the early structure of the epoxy decene structure. Further, using Mptr;, the refractive index obtained by Metncon was 1.53 (measurement wavelength: 633 nm).

聚合物#3 於100 mL之玻璃容器稱量1〇 經純化之上述聚合物 #3,於其中添加均三曱苯4〇 抗窗 g 机氧化劑 Irganox 1076( Ciba —Geigy公司製造)〇.01g、環已其 _ 基氧雜環丁烷單體(式20 所示者,東亞合成製造之CH〇x、,ΛPolymer #3 Weighed 1 〇 of the above-mentioned polymer #3 in a glass container of 100 mL, and added thereto a sulphuric acid Irganox 1076 (manufactured by Ciba-Geigy Co., Ltd.) 01.01g, The ring has its _ oxetane monomer (expressed by Formula 20, manufactured by East Asia Synthetic CH〇x, Λ

RhodorsilPhotoinitiator 2074 X ) 、光酸產生劑RhodorsilPhotoinitiator 2074 X ), photoacid generator

Rh〇dia公司製造 123 201222034 CAS#178233- 72 - 2 ) ( 1.36E — 2g,乙酸乙酯 〇 lmL 中), 使均勻溶解後,藉由〇.2/z m之PTFE過濾器進行過濾,獲 得潔淨之感光性樹脂組成物清漆V7。 (3)光波導膜之製造 (下側包覆層之製作) 製作與實施例1相同之下側包覆層。 (核心層之形成) 於上述下側包覆層上,藉由刮刀均勻地塗佈感光性樹 脂組成物清漆V7後,投入45°C之乾燥機1 5分鐘。完全去 除溶劑後,壓接光罩,以500 mj/ cm2選擇性地照射紫外 線。除去遮罩,於乾燥機中以45°C30分鐘、以85〇C3〇分 鐘、以150°C 1小時以三個階段進行加熱。加熱後,確認到 出現非常鮮明之波導圖案。又,確認到核心部及包覆部之 形成。 ° (上側包覆層之形成) 製作與實施例1相同之上層包覆層。 (4 )評價 藉由與實施例1相同之方法進行評價。可算出傳播損 失為〇_〇4 dB/cm。核心部與包覆部之折射率差為〇 〇2。 將以上於實施例1〜7所得之光波導膜之評價結果八、 表1。 〇不於 124 201222034Rh〇dia manufactures 123 201222034 CAS#178233- 72 - 2 ) ( 1.36E — 2g, ethyl acetate 〇 1mL), after homogeneous dissolution, it is filtered by 〇.2/zm PTFE filter to obtain cleanliness. The photosensitive resin composition varnish V7. (3) Production of optical waveguide film (Production of lower cladding layer) The lower cladding layer was produced in the same manner as in Example 1. (Formation of Core Layer) On the lower cladding layer, the photosensitive resin composition varnish V7 was uniformly applied by a doctor blade, and then placed in a dryer at 45 ° C for 15 minutes. After completely removing the solvent, the photomask was crimped and the ultraviolet rays were selectively irradiated at 500 mj/cm2. The mask was removed, and heating was carried out in a drier at 45 ° C for 30 minutes, at 85 ° C for 3 minutes, and at 150 ° C for 1 hour in three stages. After heating, it was confirmed that a very distinctive waveguide pattern appeared. Further, it was confirmed that the core portion and the cladding portion were formed. ° (Formation of Upper Side Coating Layer) The same upper layer coating layer as in Example 1 was produced. (4) Evaluation Evaluation was carried out by the same method as in Example 1. The propagation loss can be calculated as 〇_〇4 dB/cm. The difference in refractive index between the core portion and the cladding portion is 〇 〇2. The evaluation results of the optical waveguide films obtained in the above Examples 1 to 7 are shown in Table 1. 〇不于 124 201222034

聚合物 單體 傳播 損失 [dB/ cm] 核心/包覆 間 之折射率差 氧雜環丁烷 環氧 實施例1 (4 \1 U \ CHOX (相對於聚合 物 為 20 phr) 無 0.03 0.02 實施例2 Η IQ\ \〇] CHOX 20 phr 無 0.04 0.01 實施例3 與實施例1相同 DOX 20 phr 無 0.04 0.01 實施例4 與實施例1相同 無 脂環式環 氧 20 phr 0.04 0.01 實施例5 與實施例1相同 CHOX 10 phr 脂環式環 氧 10 phr 0.03 0.01 實施例6 與實施例1相同 CHOX 15 phr 無 0.03 0.01 實施例7 / \ / \ / \ . CHOX 10 phr 無 0.04 0.02 HMti 於實施例1〜7,若對感光性樹脂組成物照射光,則由 光酸產生劑產生酸,僅於照射部分進行具有環狀醚基之單 體之聚合。並且,由於於照射部分中之未反應單體量變少, 故為消除於照射部分/未照射部分間所產生之濃度梯度, 125 201222034 未照射部分之單體擴散至照射部分。 又,若於光照射後進行加熱’則單體自未照射部分揮 發。 根據以上,於核心部與包覆部之間,源自單體之結構 體濃度不同,於包覆部,源自具有環狀醚基之單體之結構 體變多,於核心部,源自具有環狀醚基之單體之結構體變 少。其原因可認為,於核心部與包覆部之間產生0.01以上 之相對較大之折射率差。 再者,於實施例1〜7形成了直線狀之光波導,但於形 成曲線狀(曲率半徑為1 〇 mm左右)之光波導之情形時, 光損失明顯較少》 進而’實施例1〜7所得之光波導膜之耐熱性較高,具 有260°C之耐回焊性。 (實施例8) (1)具有脫離性基之降莰烯樹脂之合成 於具有脫離性基之降莰烯系樹脂之合成十,使用苯基 曱基降获稀曱氧基石夕烧l〇.4g(40.1mmol)替代二苯基甲 土降莰婦甲氧基石夕烧12.9g ( 40.1 mmol ),除此以外,進行 二實施例1相同之操作。所得之於側鏈具有脫離性基之降 坎稀系樹脂B (式1〇3 )之分子量利用Gpc測定,Mw=上! 萬Μη 5萬。又’各結構單位之莫耳比利用之鑑定, 土降获烯結構單位為5〇m〇1%、苯基二甲基降获稀甲氧基 錢結構單位A 50m〇1%。又,由MetHc〇n所得之折射率為 (測定波長:633 nm)e 126 201222034 (2 )感光性樹脂組成物之製造 除了使用降莰烯系樹脂B替代聚合物#1以外’與實施 例1同樣地獲得感光性樹脂組成物。 (3)光波導膜之製造 除了使用含有降莰烯系樹脂B之上述感光性樹脂組成 物以外,與實施例1同樣地獲得光波導膜。 與實施例1同樣地進行光波導之損失評價’結果所得 光波導膜之傳播損失為〇.〇3 dB/ cm。Polymer monomer propagation loss [dB/cm] Core/cladding refractive index difference oxetane epoxy Example 1 (4 \1 U \ CHOX (20 phr relative to polymer) No 0.03 0.02 Implementation Example 2 Η IQ\ \〇] CHOX 20 phr No 0.04 0.01 Example 3 Same as Example 1 DOX 20 phr No 0.04 0.01 Example 4 The same as Example 1 alicyclic epoxy 20 phr 0.04 0.01 Example 5 Example 1 Same CHOX 10 phr alicyclic epoxy 10 phr 0.03 0.01 Example 6 Same as Example 1 CHOX 15 phr No 0.03 0.01 Example 7 / \ / \ / \ . CHOX 10 phr No 0.04 0.02 HMti In the examples 1 to 7, when the photosensitive resin composition is irradiated with light, an acid is generated by the photo-acid generator, and polymerization of the monomer having a cyclic ether group is carried out only in the irradiated portion. Further, due to the unreacted single in the irradiated portion The amount of the body is reduced, so that the concentration gradient generated between the irradiated portion and the unirradiated portion is eliminated, 125 201222034 The unirradiated portion of the monomer diffuses to the irradiated portion. Further, if the heating is performed after the light irradiation, the monomer is not irradiated. Partially evaporated. According to the above, Between the core portion and the cladding portion, the concentration of the structure derived from the monomer is different, and the structure derived from the monomer having a cyclic ether group is increased in the coating portion, and the core portion is derived from the cyclic ether. The structure of the monomer of the base is small. The reason for this is that a relatively large refractive index difference of 0.01 or more is generated between the core portion and the coated portion. Further, in Examples 1 to 7, a linear shape is formed. In the case of forming an optical waveguide having a curved shape (having a radius of curvature of about 1 mm), the optical loss is remarkably small. Further, the optical waveguide films obtained in Examples 1 to 7 have high heat resistance and have 260. Reflow resistance of °C. (Example 8) (1) Synthesis of a norbornene resin having a debonding group. Synthesis of a norbornene-based resin having a debonding group. The same operation as in Example 1 was carried out except that the decyl oxide was burned to 4 g (40.1 mmol) instead of diphenyl carbazide methoxy methoxy sulphate 12.9 g (40.1 mmol). The molecular weight of the side chain having a detachment-based slab-type resin B (formula 1 〇 3) is determined by Gpc, Mw = upper! Μη 50,000. In addition, the identification of the Moerby of each structural unit, the unit of the olefin structure is 5〇m〇1%, and the phenyl dimethyl group is reduced by the weak methoxyl structure unit A 50m〇1% Further, the refractive index obtained by MetHc〇n is (measurement wavelength: 633 nm) e 126 201222034 (2) Production of photosensitive resin composition except that decene-based resin B is used instead of polymer #1' 1 A photosensitive resin composition was obtained similarly. (3) Production of optical waveguide film An optical waveguide film was obtained in the same manner as in Example 1 except that the above-mentioned photosensitive resin composition containing a norbornene-based resin B was used. The propagation loss of the optical waveguide film obtained as a result of the evaluation of the loss of the optical waveguide in the same manner as in the first embodiment was 〇.3 dB/cm.

(實施例9) (1 )除了使用以下者作為感光性樹脂組成物以外,進 行與實施例1相同之操作。 於1 OOmL之玻璃容器稱量實施例1所得之降获烯系樹 脂l〇g,於其中添加均三曱苯40g、抗氧化劑Irgan〇x 1〇76 (Ciba — Geigy公司製造)〇.〇lg、環己基氧雜環丁烷單體(式 127 201222034 (100)所示之第1單體,東亞合成製造之CH〇x ' CAS#483303 - 25 -9,分子量為 186,沸點為 125〇c/133 kPa) lg、二官能氧雜環丁烷單體(式(104)所示之第2 單體,東亞合成製造之DOX、CAS#18934~〇〇—4,分子量 為214,沸點為U9〇c / 〇·67 kPa) lg、光酸產生劑 RhodorsilPhotoinitiator 2074 ( Rhodia 公司製造, CAS#178233 - 72- 2 ) ( i_36E_2g,己酸乙酿 〇 lmL 中), 使均勻溶解後’藉自0.2 &quot; m之pTFE過據器進行過滤,製 備潔淨之核心層用之感光性樹脂組成物清漆。 (2)光波導膜之製造 除了使用上述(1 )之感光性樹脂組成物以外,與實施 例1同樣地獲得光波導膜。 與實施例1同樣地進行光波導之損失評價,結果所得 光波導膜之傳播損失為〇.〇4dB/cm。(Example 9) (1) The same operation as in Example 1 was carried out except that the following was used as the photosensitive resin composition. The olefinic resin obtained in Example 1 was weighed in a 100 mL glass container, and 40 g of stilbene was added thereto, and Irgan 〇x 1〇76 (manufactured by Ciba — Geigy Co., Ltd.) was added thereto. Cyclohexyloxycyclobutane monomer (the first monomer represented by Formula 127 201222034 (100), CH〇x ' CAS#483303 - 25 -9 manufactured by East Asia Synthetic, having a molecular weight of 186 and a boiling point of 125〇c /133 kPa) lg, difunctional oxetane monomer (the second monomer represented by formula (104), DOX, CAS#18934~〇〇-4, manufactured by East Asia Synthetic, having a molecular weight of 214 and a boiling point of U9 〇c / 〇·67 kPa) lg, photoacid generator Rhodorsil Photoinitiator 2074 (manufactured by Rhodia, CAS#178233 - 72- 2 ) (i_36E_2g, hexanoic acid 〇 mL lmL), so that it dissolves evenly 'borrowed from 0.2 &quot The pTFE filter of m is filtered to prepare a photosensitive resin composition varnish for the clean core layer. (2) Production of optical waveguide film An optical waveguide film was obtained in the same manner as in Example 1 except that the photosensitive resin composition of the above (1) was used. The loss of the optical waveguide was evaluated in the same manner as in Example 1. As a result, the propagation loss of the obtained optical waveguide film was 〇.4 dB/cm.

(104) (實施例1 〇 ) 之操::使用M下者作為環烯以外,進行與實施例1相同 (1)降莰烯系樹脂c之合成 使用公知之手·沐r Η列如日本特開2003 — 252963號公 128 201222034 環複分解聚合 C。 報),進行苯基乙基降莰烯(PENB)單體之開 獲得下述式(105)所表示之降莰烯系樹脂 (2 )感光性樹脂組成物製造 除了使用降茨烯系樹脂C替代聚合物#1以外,與實施 例1同樣地獲得感光性樹脂組成物。 (3)光波導膜之製造 除了使用含有降获稀系樹脂c之上述感光性樹脂組成 物以外,與實施例1同樣地獲得光波導膜。 與實施例1同樣地進行光波導之損失評價,結果所得 光波導膜之傳播損失為〇.05 dB/ cm。(104) (Example 1 〇) Operation: The same as Example 1 except that M is used as the cycloolefin. (1) The synthesis of the decene-based resin c is carried out using a known hand. JP-A-2003-252963, No. 128 201222034 Ring metathesis polymerization C. In the case of the phenylethyl norbornene (PENB) monomer, the norbornene-based resin represented by the following formula (105) is obtained. (2) The photosensitive resin composition is produced except that the norbornene-based resin C is used. A photosensitive resin composition was obtained in the same manner as in Example 1 except for the polymer #1. (3) Production of optical waveguide film An optical waveguide film was obtained in the same manner as in Example 1 except that the photosensitive resin composition containing the rare resin c was used. The loss of the optical waveguide was evaluated in the same manner as in Example 1. As a result, the propagation loss of the obtained optical waveguide film was 〇.05 dB/cm.

(實施例11 ) 除了將第1單體之調配量變更為〇. 5 g以外,與實施例 1同樣地製作光波導膜* 再者,所得光波導膜之傳播損失為0.10 dB/cm。 129 201222034 (實施例12 ) 除了將第1單體之調配量變更為4.〇g以外,與實施例 1同樣地製作光波導膜。 再者’所得光波導膜之傳播損失為〇.1〇 dB/cm。 (比較例1 ) 除了未使用第1單體以外,與實施例1同樣地製作光 波導膜。 再者,所得光波導膜之傳播損失為0.90 dB/cm。 (比較例2 ) (1)各成分之合成 &lt;觸媒前驅物:Pd(OAc)2(P(Cy)3)2之合成&gt; 於裝有漏斗之2 口圓底燒瓶,於一 7 8。(:下攪拌由 pd(〇Ac)2 ( 5.00g ’ 22.3mmol)與 CH2C12 ( 30mL)構成之紅 褐色懸浮液。 於漏斗中加入 P(Cy)3( 13.12mL( 44.6 mmol))之 CH2C12 谷液·( 3 0 mL ) ’並且,用15分鐘滴加至上述撥拌懸浮液中。 其結果,自紅褐色緩緩變成黃色。 於 7 8 C下授样1小時後,將懸浮液加溫至室溫,進 而攪拌2小時,以己烷(20 mL)加以稀釋。 接著,於空氣中過濾該黃色之固體,以戊烷清洗 (5xi0mL) ’使其真空乾燥。 2次收集物係將濾液冷卻至〇°c而分離,與上述同樣地 進行清洗並加以乾燥。藉此,獲得觸媒前驅物。 (2 )感光性樹脂組成物之製造 130 201222034 於100mL之玻璃容器稱量1〇g經純化之上述聚合物 #1於,、十添加均—曱笨40g、抗氧化劑Irgan〇x 1〇76( —Geigy公司製造)0.01g、二甲基雙(降莰烯甲氧基)矽烷 (SO〇 2.4g、上述觸媒前驅物(2 6E— 2g)、光酸產生劑 RhodorsilPhotoinitiator 2074 ( Rh〇dia 公司製造, CAS#m233 - 72- 2 )( 1.36E—2g,乙酸乙 3旨 〇imL 中), 使均勻溶解後’藉由〇.2ym之PTFE過濾器進行過據,獲 得潔淨之感光性樹脂組成物清漆。 (3)光波導膜之製造 (下側包覆層之製作) 製作與貫施例1相同之下側包覆層。 (核心層之形成) 於上述下側包覆層上,藉由刮刀均勻塗佈所製備之清 漆後,投入45 C之乾燥機15分鐘。完全去除溶劑後,壓接 光罩,以500 mJ/cm2選擇性地照射紫外線。除去遮罩,於 乾燥機中以45130分鐘、以85t3〇分鐘、以15〇ti小時 以三個階段進行加熱。加熱後,確認到出現波導圖案。又, 確認到核心部及包覆部之形成。 (上側包覆層之形成) 製作與實施例1相同之上側包覆層 (4 )評價 藉由與實施例1相同之方法進行評價。可算出傳播損 失為0.05 dB/cm。核心部與包覆部之折射率差為〇 〇〇5。 B•光波導之評價 131 201222034 對各貫施例及比較例所得之光波導進行以下評價。將 °平^項目與内容一併表示。將所得之結果示於表2。 1 ·光損失 將自850 nm之VCSEL (表面發光雷射)發出之光經由 5〇Mm《之光纖導入上述光波導,以2〇〇ym《之光纖進行受 光'則定光之強度。再者,測定係採用回截方法,將波導 長繪製成橫軸、插入損失繪製成縱軸,結果測定值準確地 排列於直線上,由其斜度算出傳播損失。 2 ·耐熱性 將上述光波導投入高溫高濕槽(85〇c,85%RH ),評價 濕熱處理500 ,j、時後之傳播損失。又,亦同時確認有無因 回焊處理(於N2環境下,最大溫度26(rC//6〇秒)引起之 傳播損失之劣化。 再者,此處之傳播損失之測定與丨之光損失之測定方 法相同。 3·光波導之彎曲損失 對具有10mm之曲率半徑之光波導膜的光強度之彎曲 損失進行評價。將自㈣⑽之VCSEL (表面發光雷射)發 出之光經由50&quot;m多之光纖導入上述光波導膜之端面,以 200//之光纖自另一端進行受光,測定光之強度(參照下 述式)。將使長度相等之光波導膜彎曲時所產生的損失之增 量定義為「弯曲損失」,如圖22、圖39所*,以使光心 膜形成曲線狀之情形之插入損失與使光波導膜形成直線狀 之情形之插入損失的差表示「·脊曲損失。 132 201222034 插入損失[dB]二一lOlog (出射光強度/入射光強度) 彎曲損失==(曲線下之插入損失)一(直線下之插入 損失) [表2] 聚合物 單體 光損失 [dB/cm] 彎曲 損失 [dB/cm] 耐熱性穿 卜價 85〇C85% RH 500hr 260〇C 回焊 實施例1 圓 CHOX 0.03 0.7 0.05 0.04 實施例8 ^(h) \ ύΐ CHOX 0.03 0.8 0.05 0.05 實施例9 與實施例1相同 CHOX DOX 0.04 0.9 0.04 0.05 實施例10 \〇 ) CHOX 0.05 0.9 0.10 0.36 實施例11 與實施例1相同 CHOX 0,10 1.2 0.11 0.11 實施例12 與實施例1相同 CHOX 0.10 U 0.12 0.11 比較例1 與實施例1相同 無 0.90 2.5 0.99 1.12 比較例2 與實施例1相同 SiX 0.05 1.9 1.35 1.50 由表2可明確般顯示,實施例1、8〜12之光損失較低, 光波導之性能優異。 又,顯示實施例1、8〜12之高溫高濕處理後及回焊處 理後之光損失亦較小,耐熱性亦優異。 133 201222034 又,暗示尤其是實施例1、8、9、10之彎曲損失亦較 小,即便使光波導彎曲使用亦發揮充分之性能。 進而,使用各實施例及比較例所得之光波導膜,製作 上述第1實施形態之光波導結構體,結果與使用各比較例 所得之光波導膜之光波導結構體相比,使用各實施例所得 之光波導膜之光波導結構體分別可獲得傳輸損失較低。 又,使用各實施例所得之光波導膜之光波導結構體均 具有優異之可撓性,進而,由於如上述般光波導膜之-曲 損失較低’故即便重複進行折彎操作,亦可維持高品質之 光通信。 又’藉由與各實施例及比較例相同之方法製作包含加 寬部分及減寬部分之光波導膜,結果相比以與各實施例及 比較例相同之方法而製作之核心部之寬度一定的光波導 膜,可確認到光損失之降低。 又’同樣地藉由與各實施例及比較例相同之方法製作 包含厚膜部分及薄膜部分之光波導膜,結果仍確認到光損 失之降低。 [產業上之可利用性] 本發明之光波導結構體係光電路(光波導之圖案)或 電氣電路之設計之空間較寬,良率較高,可較高地維持光 傳輸性能、可靠性、耐久性優異,富有通用性。因此,藉 八備本發明之光波導結構體,可獲得可靠性較高之各種 電子零件及電子裝置。因而’本發明於產業上極其有用。 134 201222034 【圖式簡單說明】 圖1係表示本發明之光波導結構體之第1實施形態的 剖面圖。 圖2係表示圖1所示之光波導之斜視圖。 圖3係表示本發明之光波導結構體之第1實施形態的 平面圖。 圖4係表示本發明之光波導結構體之第2實施形態的 平面圖。 圖5係表示本發明之光波導結構體之第3實施形態的 平面圖。 圖6係表示本發明之光波導結構體之第4實施形態的 平面圖。 圖7係表示本發明之光波導結構體之第5實施形態的 剖面圖。 圖8係表示本發明之光波導結構體之第6實施形態的 剖面圖。 圖9係用以說明將圖8所示之光波導結構體於中央附 近折彎而成之狀態的圖。 圖10係表示本發明之光波導結構體之第7實施形態的 剖面圖。 圖11係表示圖10所示之光波導結構體之平面圖。 圖12係表示本發明之光波導結構體之第8實施形態的 平面圖。 圖13係表示本發明之光波導結構體之第9實施形態的 135 201222034 剖面圖。 圖1 4係表示本發明之光波導結構體之第1 0實施形態 的剖面圖 圖15係表示本發明之光波導結構體之第11實施形態的 平面圖。 圖16係表示本發明之光波導結構體之第丨丨實施形態的 剖面圖。 圖1 7係表示本發明之光波導結耩體之第12實施形態 的平面圖。 圖1 8係表示本發明之光波導結構體之第1 3實施形態 的剖面圖。 圖1 9係模式地表示光波導之製造方法之步驟例的剖面 圖。 圖20係模式地表示光波導之製造方法之步驟例的剖面 圖。 圖2 1係模式地表示光波導之製造方法之步驟例的剖面 圖。 圖22係模式地表示於實施例之彎曲損失之測定方法的 圖。 圖23係表示本發明之光波導結構體之第14實施形態 的剖面圖。 圖24係表示圖23所示之光波導之斜視圖。· 圖25係表示圖a所示之光波導之核心層的平面圖。 圖26係表示本發明之光波導結構體之第15實施形態 136 201222034 之核心層的平面圖。 圖”係表示本發明之光 的剖面圖。 導、·。構體之第16實施形態 導結構體之第17實施形態 圖28係表示本發明之光波 的剖面圖。 圖29係表示本發明之光波導姓 的剖面圖。 '‘。冓體之第18實施形態 圖30係表示本發明之光波 之核心層的平面圖。 構體之第18實施形態 圖31係表示本發明之光波 之核心層的平面圖。 籌體之第19實施形感 體之第1 9實施形態 圈32係表示本發明之光波導結構 的平面圖。 法之步驟例的 _ 3 3係模式地表示光波導之第丨製造方 剖面蘭° 阖34係模式地表示光波導第製 农每方法之步驟例的 剖面圖。 _ 35係模式地表示光波導之第1製 π崎々去之步驟例的 剖面闺 圖36係模式地表示光波導之第2製造(Example 11) An optical waveguide film was produced in the same manner as in Example 1 except that the amount of the first monomer was changed to 〇. 5 g. Further, the propagation loss of the obtained optical waveguide film was 0.10 dB/cm. 129 201222034 (Example 12) An optical waveguide film was produced in the same manner as in Example 1 except that the amount of the first monomer was changed to 4. 〇g. Further, the propagation loss of the obtained optical waveguide film was 〇.1 〇 dB/cm. (Comparative Example 1) An optical waveguide film was produced in the same manner as in Example 1 except that the first monomer was not used. Further, the propagation loss of the obtained optical waveguide film was 0.90 dB/cm. (Comparative Example 2) (1) Synthesis of each component &lt;catalyst precursor: synthesis of Pd(OAc) 2 (P(Cy) 3) 2 &gt; 2-neck round bottom flask equipped with a funnel, at 7 8. (: A reddish brown suspension consisting of pd(〇Ac) 2 (5.00 g '22.3 mmol) and CH2C12 (30 mL) was stirred under stirring. P (Cy) 3 ( 13.12 mL ( 44.6 mmol)) of CH2C12 Valley was added to the funnel. Liquid·(30 mL) 'And, it was added dropwise to the above-mentioned mixing suspension in 15 minutes. As a result, it gradually turned from reddish brown to yellow. After 1 hour of application at 7 8 C, the suspension was warmed. The mixture was stirred at room temperature for 2 hours and diluted with hexane (20 mL). The yellow solid was filtered in air and washed with pentane (5 xi0 mL). The mixture was cooled to 〇°c and separated, and washed and dried in the same manner as above to obtain a catalyst precursor. (2) Production of photosensitive resin composition 130 201222034 Weigh 1 〇g in a 100 mL glass container The above-mentioned polymer #1 was purified, and 10 g of sulphate, 40 g of an antioxidant, Irgan 〇x 1 〇 76 (manufactured by Geigy Co., Ltd.), 0.01 g, and dimethyl bis(northene methoxy) decane (SO) were added. 〇2.4g, the above catalyst precursor (2 6E-2g), photoacid generator Rhodorsil Photoinitiator 2074 ( Rh〇dia Manufactured, CAS#m233 - 72- 2 ) ( 1.36E - 2g, acetic acid B 3 〇 imL), after homogeneous dissolution, 'by 〇. 2ym PTFE filter to obtain clean photosensitive resin (3) Fabrication of optical waveguide film (production of lower cladding layer) The same lower cladding layer as in Example 1 was produced. (Formation of core layer) On the lower cladding layer, The prepared varnish was uniformly applied by a doctor blade, and then placed in a 45 C dryer for 15 minutes. After completely removing the solvent, the mask was crimped, and ultraviolet rays were selectively irradiated at 500 mJ/cm 2 to remove the mask in the dryer. The heating was carried out in three stages at 45,130 minutes, 85 t3 〇 minutes, and 15 〇 ti hours. After heating, it was confirmed that the waveguide pattern appeared. Further, the formation of the core portion and the cladding portion was confirmed. The same as in Example 1, the evaluation of the upper side cladding layer (4) was carried out in the same manner as in Example 1. The propagation loss was calculated to be 0.05 dB/cm. The difference in refractive index between the core portion and the cladding portion was 〇 〇〇 5. B• Optical Waveguide Evaluation 131 201222034 For each application and The optical waveguide obtained in the comparative example was subjected to the following evaluation. The item was shown together with the contents. The results obtained are shown in Table 2. 1 · Light loss is transmitted from the light source of the 850 nm VCSEL (surface emitting laser) 5〇Mm "The optical fiber is introduced into the above optical waveguide, and the intensity of the light is fixed by the optical fiber of 2"ym". Further, the measurement system employs a truncation method in which the waveguide length is plotted on the horizontal axis and the insertion loss is plotted on the vertical axis. As a result, the measured values are accurately arranged on the straight line, and the propagation loss is calculated from the slope. 2. Heat resistance The optical waveguide was placed in a high-temperature and high-humidity bath (85 〇 c, 85% RH), and the propagation loss after the wet heat treatment of 500, j and time was evaluated. At the same time, it is also confirmed whether there is any deterioration of the propagation loss caused by the reflow process (maximum temperature 26 (rC//6 〇 second) in the N2 environment. Furthermore, the measurement of the propagation loss here and the loss of the light of 丨The measurement method is the same. 3. The bending loss of the optical waveguide evaluates the bending loss of the light intensity of the optical waveguide film having a radius of curvature of 10 mm. The light emitted from the VCSEL (surface luminescence laser) of (4) (10) is passed through 50&quot; The optical fiber is introduced into the end surface of the optical waveguide film, and the optical fiber is received from the other end by an optical fiber of 200//, and the intensity of the light is measured (refer to the following formula). The incremental definition of the loss caused by bending the optical waveguide film having the same length is defined. In the case of the "bending loss", as shown in Figs. 22 and 39, the difference between the insertion loss in the case where the optical film is formed into a curved shape and the insertion loss in the case where the optical waveguide film is formed in a straight line indicates "the ridge loss." 132 201222034 Insertion loss [dB] 21 lOlog (exit light intensity / incident light intensity) Bending loss == (insertion loss under the curve) 1 (insertion loss under the line) [Table 2] Polymer monomer light loss [dB] /cm] bend Flex loss [dB/cm] Heat resistance penetration price 85〇C85% RH 500hr 260〇C Reflow example 1 Round CHOX 0.03 0.7 0.05 0.04 Example 8 ^(h) \ ύΐ CHOX 0.03 0.8 0.05 0.05 Example 9 Example 1 Same CHOX DOX 0.04 0.9 0.04 0.05 Example 10 \〇) CHOX 0.05 0.9 0.10 0.36 Example 11 Same as Example 1 CHOX 0,10 1.2 0.11 0.11 Example 12 Same as Example 1 CHOX 0.10 U 0.12 0.11 Comparison Example 1 Same as Example 1 No 0.90 2.5 0.99 1.12 Comparative Example 2 Same as Example 1 SiX 0.05 1.9 1.35 1.50 It can be clearly shown from Table 2 that the light loss of Examples 1, 8 to 12 is low, and the performance of the optical waveguide Further, it is shown that the light loss after the high-temperature and high-humidation treatment and the reflow treatment of Examples 1 and 8 to 12 is also small, and the heat resistance is also excellent. 133 201222034 Further, it is suggested that, in particular, Examples 1, 8, and 9, The bending loss of 10 is also small, and sufficient performance is exhibited even when the optical waveguide is bent. Further, the optical waveguide structure obtained in each of the examples and the comparative examples is used to produce the optical waveguide structure according to the first embodiment, and the result and use are obtained. Income from each comparative example In the optical waveguide structure of the optical waveguide film, the optical waveguide structure of the optical waveguide film obtained in each of the embodiments can be used to obtain a lower transmission loss. Further, the optical waveguide structure using the optical waveguide film obtained in each of the embodiments can be used. Since it has excellent flexibility, and since the optical waveguide film has a low loss of curvature as described above, high-quality optical communication can be maintained even if the bending operation is repeated. Further, an optical waveguide film including a widened portion and a reduced portion was produced by the same method as in each of the examples and the comparative examples, and as a result, the width of the core portion produced by the same method as that of the respective examples and comparative examples was constant. The optical waveguide film can be confirmed to have a reduction in light loss. Further, in the same manner as in the respective examples and comparative examples, an optical waveguide film including a thick film portion and a thin film portion was produced, and as a result, a decrease in light loss was confirmed. [Industrial Applicability] The optical waveguide structure system of the present invention has a wide space for designing an optical circuit (pattern of an optical waveguide) or an electric circuit, and has a high yield, and can maintain optical transmission performance, reliability, and durability at a high level. Excellent and versatile. Therefore, by the optical waveguide structure of the present invention, various electronic components and electronic devices having high reliability can be obtained. Thus, the present invention is extremely useful in the industry. 134 201222034 [Brief Description of the Drawings] Fig. 1 is a cross-sectional view showing a first embodiment of the optical waveguide structure of the present invention. Fig. 2 is a perspective view showing the optical waveguide shown in Fig. 1. Fig. 3 is a plan view showing a first embodiment of the optical waveguide structure of the present invention. Fig. 4 is a plan view showing a second embodiment of the optical waveguide structure of the present invention. Fig. 5 is a plan view showing a third embodiment of the optical waveguide structure of the present invention. Fig. 6 is a plan view showing a fourth embodiment of the optical waveguide structure of the present invention. Fig. 7 is a cross-sectional view showing a fifth embodiment of the optical waveguide structure of the present invention. Fig. 8 is a cross-sectional view showing a sixth embodiment of the optical waveguide structure of the present invention. Fig. 9 is a view for explaining a state in which the optical waveguide structure shown in Fig. 8 is bent near the center. Fig. 10 is a cross-sectional view showing a seventh embodiment of the optical waveguide structure of the present invention. Fig. 11 is a plan view showing the optical waveguide structure shown in Fig. 10. Fig. 12 is a plan view showing an eighth embodiment of the optical waveguide structure of the present invention. Fig. 13 is a cross-sectional view showing the 135 201222034 of the ninth embodiment of the optical waveguide structure of the present invention. Fig. 14 is a cross-sectional view showing a tenth embodiment of the optical waveguide structure of the present invention. Fig. 15 is a plan view showing an eleventh embodiment of the optical waveguide structure of the present invention. Fig. 16 is a cross-sectional view showing a third embodiment of the optical waveguide structure of the present invention. Fig. 1 is a plan view showing a twelfth embodiment of the optical waveguide junction of the present invention. Fig. 18 is a cross-sectional view showing a thirteenth embodiment of the optical waveguide structure of the present invention. Fig. 19 is a cross-sectional view schematically showing an example of the steps of a method of manufacturing an optical waveguide. Fig. 20 is a cross-sectional view schematically showing an example of the steps of a method of manufacturing an optical waveguide. Fig. 2 is a cross-sectional view schematically showing an example of the steps of a method of manufacturing an optical waveguide. Fig. 22 is a view schematically showing a method of measuring the bending loss in the embodiment. Figure 23 is a cross-sectional view showing a fourteenth embodiment of the optical waveguide structure of the present invention. Fig. 24 is a perspective view showing the optical waveguide shown in Fig. 23. Figure 25 is a plan view showing the core layer of the optical waveguide shown in Figure a. Fig. 26 is a plan view showing the core layer of the fifteenth embodiment 136 201222034 of the optical waveguide structure of the present invention. Fig. 28 is a cross-sectional view showing the light wave of the present invention. Fig. 29 is a cross-sectional view showing the light wave of the present invention. Fig. 29 is a cross-sectional view showing the light wave of the present invention. Fig. 30 is a plan view showing the core layer of the light wave of the present invention. Fig. 31 shows the core layer of the light wave of the present invention. The ninth embodiment of the present invention is the plan view of the optical waveguide structure of the present invention. The _3 3 system of the method example shows the 丨 manufacturing side profile of the optical waveguide. The blue 阖34 system schematically shows a cross-sectional view of a step example of each method of the optical waveguide. The _35 system schematically shows a cross-sectional view of the first example of the π rugged optical waveguide. FIG. 36 schematically shows Second manufacture of optical waveguide

&lt;々床之步雜例日J 斜視圈° 阖37係模式地表示光波導之第2製造方法之步鱗例的 斜視圖。 圓38係模式地表示光波導之第2製造方法之步鱗例的 137 201222034 斜視圖。 損失之測定方法的 圖39係模式地表示於實施例之彎曲 圖。 【主要元件符號說明】 1 光波導結構體 2 基板 21 貫通孔 22 導體柱 23 貫通孔 24 切口 25 貫通孔 3 發光元件 30 基台 31 發光部 32 金屬線 33 外部電極 34 樹脂模具 35 發光用1C (發 300 發光電路 4 受光元件 41 受光部 42 金屬線 43 外部電極 44 樹脂模具 用電氣元件) 138 201222034 45 受光用IC (受光用電氣元件 400 受光電路 5 導體層 51 導體層 52 第1電氣配線 53 第3電氣配線 54 第2電氣配線 551 電極焊墊 5 5a 光通信用外部連接端子 55b 電氣通信用外部連接端子 55 第1端子部 55' 第2端子部 6 基板 61 貫通孔 62 導體柱 63 貫通孔(光信號通過區域) 81 固定部 9 光波導 91 包覆層 92 包覆層 93 核心層 94 核心部 95 包覆部 96 可撓部 139 201222034 97 900 910 Μ 1001 1002 1021 1022 1003 1030 1031 1032 1033 1034 1035 1300 1004 1040 1041 1042 1043 1044 1045 1400 光程轉換部 清漆 膜 遮罩 光波導結構體 基板 貫通孔 導體柱 發光元件 基台 發光部 金屬線 外部電極 樹脂模具 發光用1C (發光用電氣元件) 發光電路 受光元件 基台 受光部 金屬線 外部電極 樹脂模具 受光用1C (受光用電氣元件) 受光電路 140 201222034 1005 導體層 105 1 電氣配線 1009 光波導 1091 包覆層 109Γ 下側包覆層用母材 1911 第1面 1912 第2面 1913 第3面 1914 第4面 1092 包覆層 1093 核心層 1094 核心部 1940 等寬部分 1941 、 1941' 加寬部分 (擴張部分) 1942 、 1942' 減寬部分 (縮小部分) 1943 、 1943' 厚膜部分 (擴張部分) 1944 、 1944' 薄膜部分 (縮小部分) 1945 等厚部分 1095 包覆部 1971 、 1972 光程轉換部 1098 光配線 1900 清漆 1910 膜 S 切割面 141&lt;Turning of the trampoline step J squint angle 阖37 is a perspective view showing a step scale of the second manufacturing method of the optical waveguide. The circle 38 is a perspective view showing a step 126 201222034 of the second manufacturing method of the optical waveguide. Fig. 39 is a curved view schematically showing the embodiment. [Description of main components] 1 Optical waveguide structure 2 Substrate 21 Through-hole 22 Conductor post 23 Through-hole 24 Cut-out 25 Through-hole 3 Light-emitting element 30 Base 31 Light-emitting portion 32 Metal wire 33 External electrode 34 Resin mold 35 Light-emitting 1C ( Light 300 Light-emitting circuit 4 Light-receiving element 41 Light-receiving unit 42 Metal wire 43 External electrode 44 Electrical component for resin mold) 138 201222034 45 Light-receiving IC (light-receiving electric component 400 Light-receiving circuit 5 Conductor layer 51 Conductor layer 52 First electric wiring 53 3 electric wiring 54 second electric wiring 551 electrode pad 5 5a optical communication external connection terminal 55b electrical communication external connection terminal 55 first terminal portion 55' second terminal portion 6 substrate 61 through hole 62 conductor post 63 through hole ( Optical signal passage area) 81 Fixing portion 9 Optical waveguide 91 Covering layer 92 Covering layer 93 Core layer 94 Core portion 95 Covering portion 96 Flexible portion 139 201222034 97 900 910 Μ 1001 1002 1021 1022 1003 1030 1031 1032 1033 1034 1035 1300 1004 1040 1041 1042 1043 1044 1045 1400 Optical path conversion part varnish film cover light Waveguide structure substrate through-hole conductor column light-emitting device base light-emitting portion metal wire external electrode resin mold light-emitting 1C (light-emitting electrical component) light-emitting circuit light-receiving element base light-receiving part metal wire external electrode resin mold light-receiving 1C (electricity for light-receiving Element) Light-receiving circuit 140 201222034 1005 Conductor layer 105 1 Electrical wiring 1009 Optical waveguide 1091 Coating layer 109 Γ Lower cladding layer base material 1911 First surface 1912 Second surface 1913 Third surface 1914 Fourth surface 1092 Coating layer 1093 Core layer 1094 core portion 1940 isometric portion 1941, 1941' widened portion (expanded portion) 1942, 1942' reduced portion (reduced portion) 1943, 1943' thick film portion (expanded portion) 1944, 1944' film portion (reduced Part) 1945 equal thickness part 1095 cladding part 1971, 1972 optical path conversion part 1098 optical wiring 1900 varnish 1910 film S cutting surface 141

Claims (1)

201222034 七、申請專利範圍: 1,種光波導結構體,具有具備折射率彼此不同之核心 部與包覆部的光波導, 該核心部,具有橫剖面積朝一端部連續變大之擴張部 分’且藉由對由含有以下成分之組成物構成的核心層選擇 性地照射活性放射線而形成為所欲之形狀·_ (A) 環稀(cyclic olefin)樹脂、 (B) 折射率與該(A)不同,且具有環狀喊之單體 及具有環狀蝴基之寡聚物中之至少一者、及 (C )光酸產生劑(phot〇acid generating agent)。 2. 如申請專利範圍第i項之光波導結構體,其中,該(B) 之環狀醚基為氧雜環丁烷基(oxetanyl gr〇up)或環氧基。 3. 如申請專利範圍第2項之光波導結構體,其中,該(a) 之環烯樹脂於側鏈具有藉由由該(c)之光酸產生劑產生之 醆而脫離之脫離性基, 該(B)含有下述式(1〇〇)所記載之第i單體:201222034 VII. Patent application scope: 1. An optical waveguide structure having an optical waveguide having a core portion and a cladding portion having different refractive indices, the core portion having an expanded portion whose cross-sectional area continuously increases toward one end portion' And by selectively irradiating the core layer composed of the composition containing the following components with active radiation to form a desired shape, _ (A) a cyclic olefin resin, (B) a refractive index and the (A) And having at least one of a ring-ringing monomer and an oligomer having a cyclic butterfly group, and (C) a phosphor acid generating agent. 2. The optical waveguide structure according to claim i, wherein the cyclic ether group of (B) is an oxetanyl gr〇up or an epoxy group. 3. The optical waveguide structure according to claim 2, wherein the cycloolefin resin of (a) has a debonding group which is detached from the side chain by the photoacid generator of (c) (B) contains the ith monomer described in the following formula (1〇〇): Ο(100) 4.如申請專利範圍第1項至第3項中任一項之光波導結 142 201222034 構體”中’於该擴張部分,該核心部之俯視下之寬度朝 該光波導之一端部連續變大。 5.如申請專利範圍第1項至第4項中任一項之光波導結 構體,其t,於該擴張部分,該核心部之厚度朝該光波導 之一端部連續變大。 6 ·如申明專利範圍第1項至第5項中任一項之光波導結 構體/、中於该擴張部分,該核心部之俯視下之該核心 #與°亥包覆部之邊界線,以沿著朝該光波導之-端部開口 之抛物線的方式形成。 7.如申請專利範圍帛1項至第6項中任一項之光波導結 構體’其巾,於該擴張部 &gt;,該才玄心部之俯視下之該核心 4與》玄包覆部之邊界線或於厚度方向之該核心部與該包覆 郤之邊界、線相對於該核心部之該一端部之端面,形成45 度以上未達90度之角度。 8·如申請專利㈣第1項至第7項中任—項之光波導結 構體,、中,该梭心部之該一端部之端面面積大於該另一 端部之端面面積。 &quot;。月專利範圍帛j項至第8項中任一項之光波導結 構體,其中,該核心部之該-最端部之俯視下的寬度大於 該另一最端部之俯視下的寬度。 1〇.如申請專利範圍第i項至第9項中任—項之光波導 結構體’其中,該核心部之該—最端部之厚度厚於該另一 最端部之厚度。 士申吻專利靶圍第1項至第1〇項中任一項之光波導 143 201222034 結構體’其中,該核心部進而具有設置於該擴張部分之另 一端部側,且橫刮面積朝另一端部連續變小之縮小部分。 12. 如申請專利範圍第11項之光波導結構體,其中,於 該縮小部分’該核心部之俯視下之寬度朝該光波導之另一 端部連續變小。 13. 如申請專利範圍第u項或第a項之光波導結構 體’其中’於該縮小部分,該核心部之厚度朝該光波導之 另一端部連續變小。 14. 如申請專利範圍第11項至第η項中任一項之光波 導結構體’其中,於該縮小部分’該核心部之俯視下之該 核心部與該包覆部之邊界線,以沿著朝該光波導之一端部 開口之拋物線的方式形成。 15. 如申請專利範圍第丨丨項至第14項中任一項之光波 導結構體,其中,於該縮小部分,該核心部之俯視下之該 核心部與該包覆部之邊界線或於厚度方向之該核心部與該 包覆部之邊界線,相對於該核心部之該一端部之端面,形 成45度以上未達9〇度之角度。 16. 如申請專利範圍第1項至第15項中任-項之光波導 結構體,其中,該光波導具備複數個該核心部。 17. 如申睛專利範圍第16項之光波導結構體,其中,該 複數個核心部係並聯設置, 該複數個核心部中相鄰之至少2個核心部係1部之 位置及另-端部之位置至少任一位置互相於長邊方向偏 144 201222034 18.如申請專利範圍第16項或第17項之光波導結構 體,其中,s亥複數個核心部中相鄰之至少2個核心部中, 該一端部之位置與該另一端部之位置構成為互相相反之位 置。 19_如申請專利範圍第丨項至第18項中任—項之光波導 結構體,其中,s亥光波導具有使光程彎曲之光程轉換部, 該光程轉換部係以使來自外部之光彎曲而導入該核心 部’或使傳播於該核心部之光彎曲而導出至外部的方式構 成。 2〇_如申請專利範圍第1項至第19項中任一項之光波導 結_體.’其進而具有配線基板,該配線基板係設置於該光 波導之至少一面’並且具備基板、及設置於其至少一面且 形成有電氣配線之導體層。 21. —種電子裝置,其具備申請專利範圍第i項至第2〇 項中任一項之光波導結構體。 22. —種光波導結構體,其具有: 具備具可撓性之可撓性基板、與設置於其至少一面且 形成有電氣配線之導體層的配線基板、及 設置於該配線基板之一面側且具備折射率彼此不同之 核心部與包覆部的光波導, 該核心部係藉由對由含有以下成分之組成物所構成的 核心層選擇性地照射活性放射線而形成為所欲之形狀者: (A) 環烯樹脂、 (B) 折射率與該(A)不同’且具有環狀醚基之單體 145 201222034 之至少一者、及 及具有環狀醚基之寡聚物 (c)光酸產生劑。 146Ο(100) 4. The optical waveguide junction 142 201222034 in the structure of the invention, wherein the width of the core portion in the plan view is toward the optical waveguide The optical waveguide structure according to any one of claims 1 to 4, wherein, in the expanded portion, the thickness of the core portion is continuous toward one end of the optical waveguide 6. The optical waveguide structure according to any one of items 1 to 5 of the patent specification, wherein the core portion and the core portion are in a plan view of the core portion a boundary line formed in a parabola along an opening toward the end of the optical waveguide. 7. The optical waveguide structure of any one of claims 1 to 6 Partially, the boundary line of the core 4 and the sinuous cladding portion in the plan view or the boundary between the core portion and the cladding in the thickness direction, and the end of the line relative to the core portion The end face of the part is formed at an angle of 45 degrees or more and less than 90 degrees. 8·If applying for a patent (4), items 1 to 7 In the optical waveguide structure of any of the items, the end surface area of the one end portion of the bobbin portion is larger than the end surface area of the other end portion. &quot;. Patent range 帛j to item 8 The optical waveguide structure of the item, wherein a width in a plan view of the end portion of the core portion is larger than a width in a plan view of the other end portion. 1〇. The optical waveguide structure of the middle-item, wherein the thickness of the end portion of the core portion is thicker than the thickness of the other end portion. The first to the first items of the patent target range of Shishen Kiss An optical waveguide 143 201222034 structure, wherein the core portion further has a reduced portion which is disposed on the other end side of the expanded portion and which is continuously smaller toward the other end portion. An optical waveguide structure of the eleventh aspect, wherein a width of the reduced portion "the core portion in a plan view is continuously reduced toward the other end of the optical waveguide. 13. The light of the item or the item a of claim The waveguide structure 'where' is in the reduced portion, the core The thickness of the portion is continuously reduced toward the other end of the optical waveguide. 14. The optical waveguide structure of any one of clauses 11 to n of the patent application, wherein the reduced portion is a top view of the core portion The boundary line between the core portion and the cladding portion is formed along a parabola opening toward one end of the optical waveguide. 15. As in any one of claims 1-4 to 14 The optical waveguide structure, wherein, in the reduced portion, a boundary line between the core portion and the cladding portion in a plan view or a boundary line between the core portion and the cladding portion in a thickness direction of the core portion is opposite to the The end face of the one end portion of the core portion forms an angle of not more than 9 degrees above 45 degrees. 16. The optical waveguide structure of any one of clauses 1 to 15, wherein the optical waveguide has a plurality of the core portions. 17. The optical waveguide structure of claim 16, wherein the plurality of core portions are arranged in parallel, and at least two of the plurality of core portions are adjacent to each other and the other end At least one position of the portion is offset from each other in the longitudinal direction 144 201222034 18. The optical waveguide structure of claim 16 or 17, wherein at least two cores adjacent to the core portion In the portion, the position of the one end portion and the position of the other end portion are opposite to each other. The optical waveguide structure according to any one of the preceding claims, wherein the optical waveguide has an optical path conversion portion that bends the optical path, and the optical path conversion portion is externally The light is bent and introduced into the core portion', or the light propagating through the core portion is bent and led to the outside. The optical waveguide junction body of any one of the above-mentioned items, wherein the wiring substrate is provided on at least one side of the optical waveguide and includes a substrate, and A conductor layer provided on at least one side thereof and having electrical wiring formed thereon. An electronic device comprising the optical waveguide structure according to any one of claims 1 to 2. An optical waveguide structure comprising: a flexible flexible substrate; a wiring substrate provided with a conductor layer on at least one surface of which is formed with electrical wiring; and a surface side provided on one side of the wiring substrate And an optical waveguide having a core portion and a cladding portion having different refractive indices, the core portion being formed into a desired shape by selectively irradiating the active layer with a core layer composed of a composition containing the following components. : (A) a cycloolefin resin, (B) at least one of a monomer 145 201222034 having a refractive index different from the (A) and having a cyclic ether group, and an oligomer having a cyclic ether group (c) Photoacid generator. 146
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