TWI873228B - Improved structure of electronic component with optical coupling characteristics - Google Patents

Abstract

The present invention is an improved structure of an electronic component with optical coupling characteristics, which is mainly composed of an insulator, a light-emitting unit and a photosensitive unit. The insulator has a top surface and a bottom surface, and the light-emitting unit and the photosensitive unit are arranged on the top surface of the insulator and are adjacent to each other and electrically insulated, wherein a light channel is formed between the light-emitting unit, the photosensitive unit and the insulator. Thus, the light-emitting unit and the photosensitive unit can be configured without being restricted by the structure of the traditional electronic component lead frame, thereby achieving the purpose of improving the optical coupling efficiency.

Description

Improved structure of electronic components with optocoupler characteristics

The present invention relates to an improved structure of an electronic component, in particular to an improved structure of an electronic component with optical coupling characteristics.

Generally speaking, in order to transmit electrical signals between circuits with different power supply levels and prevent the electrical signals from being subjected to different interferences, it is necessary to transmit electrical signals between different circuits in an electrically isolated manner, and optocoupler components are usually used to achieve electrically isolated electrical signal transmission.

The aforementioned optocoupler can be called an optocoupler, an opto-isolator or an opto-isolator, and can be referred to as an optocoupler for short. The characteristic of an optocoupler is that it uses light (including visible light, infrared light, etc.) as a medium to transmit electrical signals between two ends that are not electrically connected. Therefore, an optocoupler can be used to achieve the need for electrical isolation.

However, the structure of the known optocoupler is easily affected and limited by its lead frame. Furthermore, since the lead frame is used to electrically connect to the external circuit, in order to achieve the purpose of electrical isolation, the lead frame in the optocoupler must be divided into a light-emitting side lead frame and a photosensitive side lead frame, and an isolation area must be formed between the light-emitting side lead frame and the photosensitive side lead frame, that is, the structure of the optocoupler is also limited by the distance between the isolation areas of the lead frame. The structure of the lead frame often leads to poor coupling effects, and problems such as difficulty in testing and modification after packaging, resulting in low conversion efficiency and high manufacturing costs. Therefore, it is indeed necessary to propose further improvement plans.

In view of the above-mentioned shortcomings of the existing technology, the main purpose of the present invention is to provide an improved structure of an electronic component that transmits electrical signals by light, which sets the light-emitting and light-sensitive structures adjacent to each other on the same side, and enables the optical coupling to be configured without being restricted by the structure of the traditional electronic component lead frame, thereby achieving the purpose of improving the optical coupling efficiency.

The main technical means adopted to achieve the above purpose is to make the improved structure of the aforementioned electronic component with optical coupling characteristics include: an insulator having a top surface and a bottom surface; a light-emitting unit disposed on the top surface of the insulator; and a photosensitive unit disposed on the top surface of the insulator, adjacent to the light-emitting unit, and electrically insulated from the light-emitting unit; wherein an optical channel is formed between the light-emitting unit, the photosensitive unit and the insulator.

According to the above structure, the light-emitting unit and the photosensitive unit are arranged on the insulator and located on the same surface, and at the same time, the light channel is formed between the light-emitting unit and the photosensitive unit, so that the relative position of the light-emitting unit and the photosensitive unit is not restricted by the structure of the traditional electronic component lead frame, and the purpose of improving the optical coupling efficiency is achieved.

100, 200, 300: electronic components

110: Insulation Body

111: Top

112: Bottom

113: Side

120: Light-emitting unit

121: Shiny surface

130: Photosensitive unit

131: Finishing surface

140: Optical channel

210: Conductor layer

220: Reflective layer

Figure 1 is a schematic diagram of the structure according to the first embodiment of the present invention.

Figure 2 is another structural schematic diagram according to the first embodiment of the present invention.

Figure 3 is a schematic diagram of the structure of the second embodiment of the present invention.

Figure 4 is a schematic diagram of the structure of the third embodiment of the present invention.

Figure 5 is a schematic diagram of the structure of the fourth embodiment of the present invention.

Figure 6 is a schematic diagram of the structure of the fifth embodiment of the present invention.

Regarding the preferred embodiment of the improved structure of the electronic component with optical coupling characteristics of the present invention, please refer to FIG. 1. The electronic component 100 includes an insulator 110, a light-emitting unit 120, and a photosensitive unit 130.

The insulator 110 has a top surface 111 and a bottom surface 112 facing each other, wherein the top surface 111 is used to carry the light-emitting unit 120 and the photosensitive unit 130.

The light-emitting unit 120 is disposed on the top surface 111 of the insulator 110 and connected to the insulator 110. The light-emitting unit 120 is used to receive an electrical signal from the outside and emit light in response to the electrical signal.

The photosensitive unit 130 is disposed on the top surface 111 of the insulator 110 and connected to the insulator 110. The photosensitive unit 130 is adjacent to the light-emitting unit 120 and is spaced a distance from the light-emitting unit 120 on the top surface 111 of the insulator 110. The photosensitive unit 130 is used to sense the light generated by the light-emitting unit 120 and generate a corresponding sensing electrical signal, and the sensing electrical signal is associated with the electrical signal received by the light-emitting unit 120.

Since the light-emitting unit 120 and the photosensitive unit 130 are disposed on the insulator 110 and are electrically isolated from each other by the insulator 110, the distance between the light-emitting unit 120 and the photosensitive unit 130 is not limited by the structure of the lead frame of the electronic component 100, and can have a shorter light transmission distance, have a better coupling effect, and achieve the purpose of improving the optical coupling efficiency.

Furthermore, the light-emitting unit 120 has a light-emitting surface 121, and the direction of the light-emitting surface 121 is toward the top surface 111 of the insulator 110, so that the light generated by the light-emitting unit 120 is emitted toward the top surface 111 of the insulator 110.

Furthermore, the photosensitive unit 130 has a light-collecting surface 131, and the direction of the light-collecting surface 131 is toward the top surface 111 of the insulator 110, so that the photosensitive unit 130 senses the light transmitted in the insulator 110.

In the preferred embodiment, at least a portion of the insulator 110 is light-transmissive, so a light channel 140 can be provided between the light-emitting unit 120 and the photosensitive unit 130, that is, the light channel 140 is formed in the insulator 110 between the light-emitting unit 120 and the photosensitive unit 130, as shown in FIG. 2 . Furthermore, the light channel 140 of the light-transmissive insulator 110 is composed of the light-emitting surface 121 of the light-emitting unit 120, the interior of the insulator 110, and the light-receiving surface 131 of the photosensitive unit 130, that is, the direction of light transmission is from the light-emitting surface 121 to the photosensitive unit 130 via the light channel 140, so the light generated by the light-emitting unit 120 is sensed by the photosensitive unit 130 through the light channel 140, and the photosensitive unit 130 generates the corresponding sensing electrical signal accordingly.

In the preferred embodiment, the insulator 110 can be implemented as a light-transmitting substrate or a glass substrate, thereby improving the light transmittance of the insulator 110 and forming the light channel 140, and the present invention is not limited to this.

In the preferred embodiment, the electronic component 100 is a photocoupler. Furthermore, the photocoupler includes an analog photocoupler or a digital photocoupler, whereby the electronic component 100 can be suitable for analog circuits or digital circuits, thereby improving the convenience of circuit design.

In this embodiment, the light-emitting unit 120 includes a light-emitting diode to generate visible light or invisible light, and the present invention is not limited thereto.

In this embodiment, the photosensitive unit 130 includes a photoresistor, a photodiode, a phototransistor, a silicon controlled rectifier (SCR) and other photoelectric elements to convert the sensed light into the corresponding sensing electrical signal, and the present invention is not limited to this.

Regarding another embodiment of the improved structure of the electronic component with optical coupling characteristics of the present invention, please refer to FIG. 3 . The difference between FIG. 3 and the embodiment of FIG. 1 is that the electronic component 200 further includes a conductive layer 210 and a reflective layer 220 , and the conductive layer 210 and the reflective layer 220 are disposed on the top surface 111 of the insulator 110 . Thus, the light-emitting unit 120 and the photosensitive unit 130 can be electrically connected to the external circuit by connecting to the conductive layer 210, so that the light-emitting unit 120 can receive external electrical signals, and the photosensitive unit 130 can transmit the generated sensing electrical signals to the external circuit for further circuit operation, and the light emitted by the light-emitting unit 120 can be reflected by the reflective layer 220 to the photosensitive area of the photosensitive unit 130 to improve the optical coupling efficiency.

In this embodiment, the conductor layer 210 is disposed on the top surface 111 of the insulator 110 and connected to the insulator 110, the reflective layer 220 is disposed on the top surface 111 of the insulator 110 and connected to the insulator 110, and the conductor layer 210 and the reflective layer 220 do not shield the light channel 140, the light emitting surface 121 and the light receiving surface 131.

In one embodiment, the reflective layer 220 can be implemented by an insulating material, such as ceramic oxide, and the present invention is not limited thereto. Therefore, in this embodiment, the reflective layer 220 can be disposed on the top surface 111 between the light-emitting unit 120 and the photosensitive unit 130, while maintaining electrical insulation between the light-emitting unit 120 and the photosensitive unit 130, and improving optical coupling efficiency.

Regarding another embodiment of the improved structure of the electronic component with optical coupling characteristics of the present invention, please refer to FIG. 4. The difference between FIG. 4 and the embodiment of FIG. 3 is that the wire layer 210 of the electronic component 300 of FIG. 4 is disposed on the top surface 111 of the insulator 110 and connected to the insulator 110, the reflective layer 220 is disposed on the wire layer 210 and connected to the wire layer 210, and the wire layer 210 and the reflective layer 220 do not shield the light channel 140, the light emitting surface 121 and the light receiving surface 131.

Regarding another embodiment of the improved structure of the electronic component with optical coupling characteristics of the present invention, please refer to FIG. 5. The difference between the embodiment of FIG. 5 and FIG. 4 is that in this embodiment, the reflective layer 220 of the electronic component 400 of FIG. 5 is disposed on the top surface 111 of the insulator 110 and connected to the insulator 110, the wire layer 210 is disposed on the reflective layer 220 and connected to the wire layer 210, and the wire layer 210 and the reflective layer 220 do not shield the light channel 140, the light emitting surface 121 and the light receiving surface 131.

In this embodiment, the light-emitting unit 120 and the photosensitive unit 130 can be connected to the wire layer 210 by wire bonding or flip chip technology, and the present invention is not limited thereto.

Regarding another embodiment of the improved structure of the electronic component with optical coupling characteristics of the present invention, please refer to Figure 6. The difference between the embodiment of Figure 6 and Figure 5 is that the reflective layer 220 of the electronic component 500 in Figure 6 is arranged on the bottom surface 112 of the insulator 110 and connected to the insulator 110, the wire layer 210 is arranged on the top surface 111 of the insulator 110 and connected to the wire layer 210, and the wire layer 210 does not shield the light channel 140, the light emitting surface 121 and the light receiving surface 131. In one embodiment, the reflective layer 220 may also be disposed on the side of the electronic component 500. Taking FIG. 6 as an example, the reflective layer 220 may be disposed on the side 113 of the insulator 110.

In one embodiment, the reflective layer 220 can be realized by processes such as transfer, screen printing, masking, stripping, exposure, and coating, and the present invention is not limited thereto.

In one embodiment, the material of the reflective layer 220 is metal, white paint, insulating reflective material, scattering material, etc., and the present invention is not limited thereto.

In the embodiment where the reflective layer 220 is disposed on the bottom surface 112 of the insulator 110, the reflective layer 220 can be implemented by a metal wire frame, thereby utilizing the existing structure to achieve the purpose of reflecting light, thereby reducing cost consumption.

In one embodiment, the light-emitting unit 120 and the photosensitive unit 130 can be connected to the conductive layer 210 by solder balls or metal bumps, and the present invention is not limited thereto.

In one embodiment, the wire layer 210 can be implemented with a light-transmitting conductive material, such as a transparent conductive film ITO, to avoid shielding the light channel 140, and the present invention is not limited to this.

In summary, due to the improved structure of the electronic component with optical coupling characteristics of the present invention, the light emitting unit 120 and the photosensitive unit 130 are arranged on the top surface 111 of the insulator 110, and the light is transmitted by forming the optical channel 140 in the insulator 110, so that the light emitting unit 120 and the photosensitive unit 130 can be electrically isolated from each other by the insulator 110, so that their relative positions will not be restricted by the structure of the lead frame of the electronic component, and the purpose of improving the optical coupling efficiency is achieved.

100: Electronic components

110: Insulation Body

111: Top

112: Bottom

120: Light-emitting unit

121: Shiny surface

130: Photosensitive unit

131: Finishing surface

Claims (6)

An improved structure of an electronic element with optical coupling characteristics, comprising: a light-transmissive insulator having a top surface and a bottom surface; a light-emitting unit, which is disposed on the top surface of the light-transmissive insulator, and further comprises: a light-emitting surface, the direction of which is toward the top surface of the light-transmissive insulator; a photosensitive unit, which is disposed on the top surface of the light-transmissive insulator and adjacent to the light-emitting unit and electrically insulated from the light-emitting unit, and further comprises: a light-collecting surface, the direction of which is toward the top surface of the light-transmissive insulator; and a conductive A conductor layer and a reflective layer, the conductor layer and the reflective layer are arranged on the top surface of the light-transmissive insulator, and the reflective layer is also arranged on the side surface of the light-transmissive insulator; wherein a light channel is formed between the light-emitting unit, the photosensitive unit and the light-transmissive insulator; wherein the light channel is formed in the light-transmissive insulator between the light-emitting unit and the photosensitive unit; wherein the light channel is formed by the light-emitting surface of the light-emitting unit, the interior of the light-transmissive insulator and the light-collecting surface of the photosensitive unit. The improved structure of the electronic component with optical coupling characteristics as described in claim 1, wherein the light-transmissive insulator is a light-transmissive substrate or a glass substrate. An improved structure of an electronic component with optical coupling characteristics as described in claim 1, wherein the electronic component is a photocoupler. The improved structure of an electronic component with optical coupling characteristics as described in claim 3, wherein the optical coupler includes an analog optical coupler or a digital optical coupler. The improved structure of the electronic component with optical coupling characteristics as described in claim 4, wherein the light-emitting unit is a light-emitting diode. The improved structure of the electronic component with photocoupler characteristics as described in claim 1, wherein the photosensitive unit is a photoresistor, a photodiode, a phototransistor or a silicon controlled rectifier.

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