201210964 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種燒結金剛石製之劃線輪、及具有此劃 - 線輪之劃線裝置、及使用此劃線輪之劃線方法。 一 【先前技術】 先前’將貼合2片玻璃基板而形成之貼合玻璃基板藉由 一系列之劃線步驟及斷裂步驟而裁剪為複數個單位貼合破 〇 璃之技術眾所周知（例如，專利文獻丨）。 另外，藉由於刀尖之稜線部形成突起部，而不產生水平 裂痕，使㈣垂直裂痕產生於玻璃板上之技術先前亦眾所 周知（例如，專利文獻2)。 另外，使形成貼合基板之表面背面之單板基板不上下反 轉及水平方向旋轉90。，而水平方向地於正交之兩個方向 上連續分割之技術先前亦眾所周知（例如，專利文獻 進而，藉由使輪之外徑、槽之深度、槽間之稜線之長度 〇 為所期望範圍，而使劃線輪之刀尖之磨損降低，使劃線輪 長壽命化之技術先前亦眾所周知（例如，專利文獻4)。 [先技術文獻] [專利文獻] [專利文獻1]日本專利第3042 192號說明書 [專利文獻2]曰本專利第3074143號說明書 [專利文獻3]國際公開第2005/087458號 [專利文獻4]國際公開第2009/148073號 【發明内容】 154079.doc 201210964 [發明所欲解決之問題] 此處，作為使劃線工數降低之方法之一，列舉如下方 法.最大限度削減劃線輪與脆性材料基板隔離移動之時 間，最大限度確保劃線輪與脆性材料基板（例如，玻璃基 板等）抵接之時間。 然而，此方法會產生如下問題：於使脆性材料基板抵接 (fe入）之狀態下，使劃線輪之行進方向變化，根據情形有 時刀尖之突起部缺損。 ^ 因此本發明之目的在於提供一種可於脆性材料基板上 开^成良好之劃線之劃線輪、及此具有劃線輪之劃線裝置、 及使用此劃線輪之劃線方法。 [解決問題之技術手段] 為了解決上述問題，技術方案1之發明之特徵在於：其 係燒結金剛石製之劃線輪，i包括：圓盤狀之本體部；設 置於上述本體部之外周之圓環狀之刀；沿著上述刀之最外 周部而設且具有複數個突起部之刀尖；上述刀之厚度從上 ,本體部之中心朝向上述刀尖變小，通過上述刀之最外周 部之中心轴之平面之剖面成v形狀，I突起部設置於沿著 上述刀尖而形成之複數個槽中鄰接之槽之間，上述燒结 剛石包含65.0〜75,〇重量％之金剛石、3 〇〜1〇〇重量％之超 微粒子碳化物、及其餘部分之結合㈣，上述㈣石 1粒徑為以七μΓη之範圍，上述結合材料係、 分之鐵系金屬。 ~ 取 另外’技術方案2之發明如技術方案i之劃線輪，其中 154079.doc 201210964 上述超微粒子碳化物為6.0〜8〇重量％之範圍，並且包含 1.0〜4.0重量％之碳化欽、及其餘部分之碳化鶴。 另外’技術方案3之發明之特徵在於包括··劃線單元， #藉由使如技術方案1或2之劃線輪相對於脆性材料基㈣ * 接轉冑而於上述脆性材科基板上形成m及保持單 元，其保持上述脆性材料基板，且使被保持之上述脆性材 料基板相對於劃線單元而相對性地移動。 〇 另外’技術方案4之發明之特徵在於：其係利用如技術 方案1或2之劃線輪於脆性材料基板上形成劃線之方法且 包括如下步驟：⑷使上述劃線輪與上述脆性材料基板抵 接，且於與上述脆性材料基板平行之第丨水平方向使上述 劃線輪相對性地移動；及（b)於上述步驟（a)之後，於使上 述劃線輪與上述脆性材料基板抵接之狀態下，將上述割線 輪之移動方向變更為與上述第1水平方向不同、且與i述 脆性材料基板平行之第2水平方向。 Q [發明之效果] 根據技術方案1至技術方案4之發明，構成劃線輪之燒結 金剛石包含65.0〜75.0重量❶/❶之金剛石、3〇〜1〇〇重量$之 超微粒子碳化物、及其餘部分之結合材料，並且金剛石之 平均粒徑為0.6〜1.5 μιη之範圍，結合材料係以鈷為主成分 之鐵系金屬。 由此，此燒結金剛石製之劃線輪不僅可提高耐磨損性及 耐衝擊強度特性’亦可提高耐扭動強度特性。即，於使劃 線輪與成為切斷對象之脆性材料基板抵接之狀態下，即使 154079.doc 201210964 於使劃線輪之行進方向變化之情形時，亦可有效地防止刀 尖之突起部缺損。因此，可實現劃線輪之進一步長妄么 化。 乂 可叩 尤其，根據技術方案2之發明，超微粒子碳化物包含 〜4.0重量％之碳化鈦。由&，於燒結過程中之金剛石之 熔融凝固日夺’可抑制金剛石粒子之異常粒成長。因此，可 進而使耐扭動強度特性提高。 【實施方式】 <1.劃線裝置之構成> 以下’-面參照m對本發明之實施形態進行詳細 圖1及圖2係分別表示劃線裝置1之整體構成之-例之正 面圖及側面® °圖3及®4係表示劃線輪50附近之構成之一 例之正面圖及仰視圖。圖5係用以說明後傾轉向效應之仰 視圖。 劃線裝们係例如玻璃基板或者陶:是基板等般，於由脆 性材料而形成之基板（以下，亦僅稱為「脆性材料基板」）4 之表面，劃入劃線（切縫：縱向裂痕）之裝置。 如圖1及圖2所示，劃線農置1主要包括：保持單元10、 劃線單元20、拍攝部單元6〇、及控制單元％。再者，於圖 154079.doc 1 及以後之各圖中，為了使該等單元之方向關係明確，而 2 :據需要適當附上將z軸方向設為錯直方向、將χγ平面設 為水平面之ΧΥΖ正交座標系統。 201210964 之表面形成劃線SL後，脆性材料基板4上將產生於垂直方 向（Z軸方向）延伸之垂直裂痕κ(劃線步驟）。 而且，藉由對產生了此垂直裂痕Κ之脆性材料基板4賦予 - 應力（斷裂步驟），而從形成了劃線SL之脆性材料基板4之 - 主面至其相反侧之主面為止使垂直裂痕Κ成長，從而將脆 性材料基板4切斷，將此方法稱為「割斷」。 另一方面，僅通過劃線步驟（即，不執行斷裂步驟），使 ◎ 垂直裂痕Κ自脆性材料基板4之劃線S L之主面伸展至相反 側之主面為止，從而將脆性材料基板4切斷，將此方法稱 為「分割」。 該等割斷及分割係於用以切斷之本質之要素為垂直裂痕 之伸展之方面，較使用切出切屑為用以切斷之本質之要素 之金剛石切割鋸（cutting saw)(或者輪）、或者金剛石切割鋸 (dicing saw)之研削切斷更好之切斷方法。 另外，作為利用本實施形態之劃線方法能夠割斷或者分 Ο 割之脆性材料基板4之材質之例，可列舉玻璃、陶瓷、 石夕、或者藍寶石等。尤其’近年來，作為通信機器關聯之 高頻模塊所使用之基板，自HTCC(High Temperature fired Ceramics，高溫共燒陶瓷）向比較容易加工之 LTCC(L〇W Temperature Co_fired Ceramics，低溫共燒陶瓷） 之過渡正在加速。因此，本實施形態之劃線方法將日益有 效地被使用。 保持單元1〇保持脆性材料基板4,並且使被保持之脆性 材料基板4相對於劃線單元2〇而相對性地移動。如圖 154079.doc 201210964 不，保持單元10設置於基部10a上，且主要具有平台u、 滾珠螺桿機構12、及馬達13。 此處’基部l〇a例如由大致長方體狀之石定盤而形成， 且其上表面（與保持單元10相向之面）被平坦加工。藉此， 可降低基部l〇a之熱膨脹，可使由保持單元1〇保持之脆性 材料基板4良好地移動。 平台11吸附保持所載置之脆性材料基板4。另外，平台 Π使被保持之脆性材料基板4於箭頭ar 1方向（X軸正或者 負方向：以下，亦簡稱為「進退方向」）進退，並且向箭 頭R1方向旋轉。如圖1及圖2所示，平台丨丨主要具有吸附部 11a、旋轉台lib、及移動台11〇。 吸附部11 a設置於旋轉台11 b之上侧。如圖1及圖2所示， 脆性材料基板4能夠載置於吸附部1丨&之上表面。另外，於 吸附部11 a之上表面格子狀地配置有複數個吸附槽（圖示省 略）。因此’於載置著脆性材料基板4之狀態下，將各吸附 槽内之環境排氣（吸引），由此脆性材料基板4被吸附部na 吸附。 旋轉台lib設置於吸附部na之下側，且使吸附部Ua以 與Z軸大致平行之旋轉軸1 id為中心而旋轉。另外，移動台 1 lc設置於旋轉台1 lb之下側，且沿著進退方向，使吸附部 11a及旋轉台lib移動。 因此’被平台11吸附保持之脆性材料基板4於箭頭AR1 方向進退’並且以隨著吸附部11 a之進退動作而移動之旋 轉軸lid為中心而旋轉。 154079.doc 201210964 滾珠螺桿機構12配置於平台11之下側，且使平台U於箭 頭AR1方向進退。如圖1及圖2所示，滾珠螺桿機構12主要 具有進給螺桿12a與螺母12b。 進給螺桿12a為沿著平台11之進退方向延伸之棒體。於 進給螺桿12a之外周面設置有螺旋狀之槽（圖示省略）。另 外’進給螺桿l2a之一端由支持部可旋轉地支持，進給 螺桿12a之另一端由支持部14b可旋轉地支持。進而，進給 0 螺桿l2a與馬達丨3連動連結，若馬達13旋轉，則進給螺桿 12a於其旋轉方向上旋轉。 螺母12b隨著進給螺桿12a之旋轉，藉由未圖示之滾珠之 滾轉運動’而於箭頭AR1方向進退。如圖1及圖2所示，螺 母12b被固定於移動台11(；之下部。 因此’當驅動馬達13，馬達13之旋轉力傳達到進給螺桿 12a後’螺母12b於箭頭AR1方向進退。其結果，固定了螺 母12b之平台11與螺母12b同樣地於箭頭AR1方向進退。 〇 一對導軌15、16限制行進方向中之平台11之移動。如圖 2所示’ 一對導軌15、16於基部10a上，於箭頭AR2方向僅 隔開特定距離而固定。 複數個（本實施形態中為2個）滑動部17(17a、17b)沿著導 軌15於箭頭AR1方向滑動自如。如圖1及圖2所示，各滑動 部17(17a、17b)於移動台11c之下部，於箭頭AR1方向僅隔 開特定距離而固定。 複數個（本實施形態中為2個：然而，為便於圖示，僅記 載滑動部18a)滑動部18沿著導軌16於箭頭AR1方向滑動自 154079.doc 201210964 如。如圖1及圖2所示，夂、來 各滑動部18與滑動部17(17a、17 同樣地，於移動台1 i C之下A 卜 卜。P ’於前頭AR1方向僅隔開特定 距離而固定。 如此，當將馬達13之旋轉力賦予滚珠螺桿機構12後，平 台11沿著一對導軌15、16移動。因此，可確保進退方向中 之平台11之直進性。 劃線單元20彳目料制料元職持之㈣材料基板 4，使燒結金剛石製之劃線輪5〇(參照圖墳接轉動，由此 於脆性材料基板4之表面形成劃線儿。如圖}及圖2所示， 劃線單元20主要具有頭部3〇與驅動部4〇。 頭部30由未圖示之升降·加廢機構，自被保持之劃線輪 50對脆性材料基板4之表面，賦予擠壓力（以下，亦僅稱為 「劃線負荷」）。如圖3所示，頭部3〇具有支架％。另外， 支架35為旋轉自如地保持劃線輪5〇之要素。如圖3所示， 支架35主要具有銷36、支持框體37、及迴轉部38。 銷36係於插入至貫通劃線輪5〇之貫通孔5〇&中之狀態下 固定之棒體。此處，如圖3及圖4所示，貫通孔5〇a沿著與χ 轴大致平行之旋轉軸50b延伸。 如圖3所示，支持框體37係以覆蓋貫通孔5〇&之兩個開口 (兩端）之方式而配置之構造物。自貫通孔5〇a之兩端突出之 銷36相對於支持框體37可旋轉地設置。因此，被銷％固定 之劃線輪50相對於支持框體37旋轉自如。 如圖3所示，迴轉部38設置於支持框體37之上部，且以 與Z轴大致平行之旋轉軸38a為中心而使支持框體37旋轉。 154079.doc •10· 201210964 如圖4所示，自下表面觀察之迴轉部38之旋轉軸38a之位置 與脆性材料基板4中之保持單元1G之設置位置50c偏移。 藉 如圖5所示，當劃線輪50之行進方向自箭頭AR3(2 * 賴線）方向變化為箭頭趨（實線）方向時，由於後傾轉向 ， 效應，使得旋轉軸他周圍之轉矩作用於劃線輪5〇。因 此，劃線輪50於箭頭们方向轉動，劃線輪切之位置自2點 鏈線位置變化為實線位置。 〇 如此，劃線輪50之行進方向變化’即便於劃線輪50之姿 勢相對於行進方向僅偏移角度〇1之情形時，箭頭们方向之 轉矩亦作用於劃線輪50。其結果，劃線輪5〇迴轉，使劃線 輪50之姿勢與劃線輪5〇之行進方向大致平行。 驅動部40使劃線輪50所設置之頭部3〇於箭頭ar2方向 軸正或者負方向：以下，亦僅稱為「往返方向」）往返。 如圖2所示，驅動部4〇主要具有支柱41、軌道42、及馬達 43 ° 〇 複數根（本實施形態中為2根）支柱41(41a、41b)自基部 l〇a起於上下方向軸方向）延伸。如圖2所示，各導執a 於被夾持於支柱41a、41b之間之狀態下，對該等支柱 41a、41b固定。 複數根（本實施形態中為2根）導執42限制往返方向上之 頭部30之移動。如圖2所示，複數根導軌42於上下方向僅 1¾開特定距離而固定。 馬達43與未圖示之進給機構（例如，滾珠螺桿機構）連動 連結。藉此，若馬達43旋轉，則頭部3〇沿著複數根導軌42 154079.doc 11 201210964 於箭頭AR2方向往返。 藉由使劃線輪50於脆性材料基板4上壓接轉動，而於脆 性材料基板4上形成劃線SL(參照圖3)。劃線輪5_如係將 燒結金剛石（P〇1yCrystalline diam〇nd:乡晶鑽石，以下亦 簡稱為「PCD」則而成者。再者，關於劃線輪50之詳細 之構成將於下文敘述。 拍攝部單元60拍攝被保持單元1〇保持之脆性材料基板 4。如圖2所示，拍攝部單元60具有複數個相 …、 65b)。 複數個（本實施形態中為2台）相機65(仏、㈣）如圖i及 圖2所示，配置於保持單元10之上方。各相機65(仏、6叫 拍攝脆性材料基板4上所形成之特徵性之部分（例如，對準 標記（圖示省略））之圖傻。麸诒 "圄诼然後，根據由各相機65(65a、 65b)所拍攝之圖像，求出脆性材料基板化位置及姿勢。 此處，所謂脆性材料基板4之「位置」，係指絕對座標系 統中之脆性材料基板4上之任意之位置。另外，所謂脆性 材料基板4之「㈣」，係“對於料3q之往返方向之脆 性材料基板4之基準線（例如’於脆性材料基板4為四方形 之情形時，為4邊中之1邊）之傾斜。 進而，於本實施形態中，使用四方形之脆性材料基板 4 於脆性材料基板4之4個角部中鄰接之⑽角部形成對準 心.己另外’各對準標記由所對應之相機仏、奶拍攝， 根據該等已拍攝之圖像，求出絕對座標系統中之各對準標 記之位置。然後’根據該㈣準標記之位置，運算脆料 154079.doc 12 201210964 料基板4之位置及姿勢。 控制單元90實現劃線裝置1之各要素之動作控制、及資 料運算。如圖1及圖2所示，控制單元主要具有 R〇M(Read Only Memory，唯讀記憶體）91、RAM(Rand〇m Access Memory，隨機存儲記憶體）92、及 cpu(centrai Processing Unit，中央處理單元）93。201210964 6. DISCLOSURE OF THE INVENTION [Technical Field] The present invention relates to a scribing wheel made of sintered diamond, a scribing device having the scribing wheel, and a scribing method using the scribing wheel. [Prior Art] The technique of cutting a laminated glass substrate formed by laminating two glass substrates by a series of scribing steps and breaking steps is known as a plurality of units for bonding broken glass (for example, a patent) Literature 丨). Further, the technique of forming (4) vertical cracks on the glass plate by the ridge line portion of the blade edge without forming a horizontal crack is known in the prior art (for example, Patent Document 2). Further, the single-plate substrate on which the front and back surfaces of the bonded substrate are formed is not rotated upside down and rotated 90 in the horizontal direction. The technique of continuously dividing in two directions orthogonally in the horizontal direction is also known in the prior art (for example, the patent document further singulates the outer diameter of the wheel, the depth of the groove, and the length of the ridge line between the grooves to a desired range. The technique of reducing the wear of the cutting edge of the scribing wheel and prolonging the life of the scribing wheel is also known in the prior art (for example, Patent Document 4). [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent No. 3042 No. 192 [Patent Document 2] Japanese Patent No. 3074143 (Patent Document 3) International Publication No. 2005/087458 [Patent Document 4] International Publication No. 2009/148073 [Summary of Invention] 154079.doc 201210964 [Invention The problem to be solved] Here, as one of the methods for reducing the number of scribing operations, the following method is listed. The time for the separation movement of the scribing wheel and the brittle material substrate is minimized, and the scribing wheel and the brittle material substrate are ensured to the utmost extent. The time of abutment (for example, a glass substrate, etc.) However, this method has a problem in that the traveling of the scribing wheel is performed in a state in which the brittle material substrate is abutted. In the case of change, the protrusion of the blade tip may be defective depending on the situation. Therefore, it is therefore an object of the present invention to provide a scribing wheel which can be opened on a substrate of a brittle material and which has a scribing wheel. The apparatus and the scribing method using the scribing wheel. [Technical means for solving the problem] In order to solve the above problem, the invention of claim 1 is characterized in that it is a scrim wheel made of sintered diamond, i includes: a disc shape a main body portion; an annular knife provided on an outer circumference of the main body portion; a blade edge provided along the outermost peripheral portion of the blade and having a plurality of protrusions; the thickness of the knife is from the center of the main body portion The cutting edge is reduced in size, and a cross section of a plane passing through a central axis of the outermost peripheral portion of the blade is formed into a v shape, and an I protrusion is provided between adjacent grooves in a plurality of grooves formed along the cutting edge, and the sintering is performed. The gangue contains 65.0 to 75, 〇% by weight of diamond, 3 〇~1 〇〇% by weight of ultrafine particle carbide, and the balance of the remaining part (4), the above (4) stone 1 particle size is in the range of 7 μΓη, the above bonding material Department, Iron-based metal. ~ Take another invention of the second aspect of the invention, such as the scribing wheel of the technical solution i, wherein 154079.doc 201210964 the above ultrafine particle carbide is in the range of 6.0 to 8% by weight, and contains 1.0 to 4.0% by weight. The carbonization of the carbonization, and the rest of the carbonized crane. In addition, the invention of the third aspect of the invention is characterized by including a scribing unit, # by connecting the scribing wheel as in the first or second aspect with respect to the brittle material base (four)* Further, m and a holding unit are formed on the brittle material substrate, and the brittle material substrate is held, and the brittle material substrate held is relatively moved with respect to the scribing unit. The invention is characterized in that it uses a scribing wheel according to claim 1 or 2 to form a scribe line on a brittle material substrate and includes the following steps: (4) abutting the scribing wheel against the brittle material substrate, and The horizontal direction of the brittle material substrate parallel to the relative movement of the scribing wheel; and (b) after the step (a), the scribing wheel and the brittle material base In a state where the plate abuts, the moving direction of the sprocket wheel is changed to a second horizontal direction which is different from the first horizontal direction and which is parallel to the brittle material substrate. [Effect of the Invention] According to the inventions of the first aspect to the fourth aspect, the sintered diamond constituting the scribing wheel comprises 65.0 to 75.0 Å/❶ of diamond, 3 〇1 to 1 〇〇 of the weight of the ultrafine particle carbide, and The remaining portion of the bonding material, and the average particle diameter of the diamond is in the range of 0.6 to 1.5 μm, and the bonding material is an iron-based metal mainly composed of cobalt. Therefore, the sintered diamond-made scribing wheel can improve not only the wear resistance and the impact strength resistance but also the torsional strength resistance. In other words, in a state where the scribing wheel is brought into contact with the brittle material substrate to be cut, even if 154079.doc 201210964 changes the traveling direction of the scribing wheel, the protrusion of the cutting edge can be effectively prevented. Defect. Therefore, further advancement of the scribing wheel can be achieved. In particular, according to the invention of claim 2, the ultrafine particle carbide contains -4.0% by weight of titanium carbide. By &, the solidification of the diamond during the sintering process can suppress the abnormal grain growth of the diamond particles. Therefore, the torsional strength characteristics can be further improved. [Embodiment] <1. Configuration of the scribing device> The following is a detailed description of the embodiment of the present invention with reference to the embodiment of the present invention. FIG. 1 and FIG. 2 are front views showing an example of the overall configuration of the scribing device 1 and Side Views FIG. 3 and FIG. 4 are front and bottom views showing an example of the configuration of the vicinity of the scribing wheel 50. Fig. 5 is a bottom view for explaining the backward tilting effect. For example, a glass substrate or a ceramic substrate is used as a substrate, and the surface of the substrate (hereinafter simply referred to as "brittle material substrate") 4 formed of a brittle material is drawn into a scribe line (cut: longitudinal direction). Rift) device. As shown in FIGS. 1 and 2, the scribing farm 1 mainly includes a holding unit 10, a scribing unit 20, an imaging unit 6A, and a control unit %. Furthermore, in the drawings of FIG. 154079.doc 1 and later, in order to clarify the direction relationship of the units, 2: appropriately, the z-axis direction is set to the wrong direction, and the χγ plane is set to the horizontal plane. The Orthogonal Coordinate System. After the scribe line SL is formed on the surface of 201210964, a vertical crack κ extending in the vertical direction (Z-axis direction) is generated on the brittle material substrate 4 (line step). Further, by applying a stress (fracture step) to the brittle material substrate 4 on which the vertical crack is generated, the vertical surface is formed from the main surface of the brittle material substrate 4 on which the scribe line SL is formed to the opposite side. The crack is grown to cut the brittle material substrate 4, and this method is referred to as "cutting". On the other hand, the ◎ vertical crack Κ is extended from the main surface of the scribe line SL of the brittle material substrate 4 to the main surface on the opposite side by the scribing step (that is, the scission step is not performed), thereby the brittle material substrate 4 Cut off, this method is called "segmentation." These cuts and splits are based on the fact that the element for cutting off is the extension of the vertical crack, and the cutting saw (or wheel) is used to cut off the chip as the essential element for cutting, Or a diamond cutting saw (dicing saw) to cut a better cutting method. Further, examples of the material of the brittle material substrate 4 which can be cut or divided by the scribing method of the present embodiment include glass, ceramics, stone sap, or sapphire. In particular, in recent years, LTCC (L〇W Temperature Co_fired Ceramics, low temperature co-fired ceramics) which is relatively easy to process from HTCC (High Temperature Fired Ceramics) is used as a substrate for high-frequency modules associated with communication equipment. The transition is accelerating. Therefore, the scribing method of the present embodiment will be used more and more effectively. The holding unit 1 holds the brittle material substrate 4 and relatively moves the held brittle material substrate 4 with respect to the scribing unit 2〇. As shown in FIG. 154079.doc 201210964 No, the holding unit 10 is disposed on the base 10a and mainly has a platform u, a ball screw mechanism 12, and a motor 13. Here, the base portion 10a is formed, for example, by a substantially rectangular parallelepiped stone plate, and its upper surface (the surface facing the holding unit 10) is flattened. Thereby, the thermal expansion of the base 10a can be lowered, and the brittle material substrate 4 held by the holding unit 1 can be moved well. The platform 11 adsorbs and holds the brittle material substrate 4 placed thereon. Further, the platform 进 advances and retreats the held brittle material substrate 4 in the direction of the arrow ar 1 (X-axis positive or negative direction: hereinafter, also referred to as "advance and retreat direction"), and rotates in the direction of the arrow R1. As shown in Figs. 1 and 2, the platform 丨丨 mainly has an adsorption unit 11a, a rotary table lib, and a mobile station 11A. The adsorption portion 11a is provided on the upper side of the rotary table 11b. As shown in FIGS. 1 and 2, the brittle material substrate 4 can be placed on the upper surface of the adsorption portion 1丨& Further, a plurality of adsorption grooves (not shown) are arranged in a lattice shape on the upper surface of the adsorption portion 11a. Therefore, in a state in which the brittle material substrate 4 is placed, the environment in each adsorption tank is exhausted (sucked), whereby the brittle material substrate 4 is adsorbed by the adsorption portion na. The turntable lib is disposed on the lower side of the adsorption unit na, and rotates the adsorption unit Ua around the rotation axis 1 id substantially parallel to the Z axis. Further, the mobile station 1 lc is disposed on the lower side of the rotary table 1 lb, and moves the adsorption portion 11a and the rotary table lib in the advancing and retracting direction. Therefore, the brittle material substrate 4 adsorbed and held by the stage 11 advances and retreats in the direction of the arrow AR1 and rotates around the rotation axis lid that moves in accordance with the advancing and retracting action of the adsorption portion 11a. 154079.doc 201210964 The ball screw mechanism 12 is disposed on the lower side of the platform 11 and advances and retracts the platform U in the direction of the arrow AR1. As shown in Figs. 1 and 2, the ball screw mechanism 12 mainly has a feed screw 12a and a nut 12b. The feed screw 12a is a rod extending in the advancing and retracting direction of the stage 11. A spiral groove (not shown) is provided on the outer peripheral surface of the feed screw 12a. Further, one end of the feed screw l2a is rotatably supported by the support portion, and the other end of the feed screw 12a is rotatably supported by the support portion 14b. Further, the feed 0 screw l2a is coupled to the motor cymbal 3, and when the motor 13 rotates, the feed screw 12a rotates in the rotational direction. The nut 12b advances and retreats in the direction of the arrow AR1 by the rolling motion of the ball (not shown) as the feed screw 12a rotates. As shown in Fig. 1 and Fig. 2, the nut 12b is fixed to the moving table 11 (the lower portion. Therefore, 'when the motor 13 is driven, the rotational force of the motor 13 is transmitted to the feed screw 12a', the nut 12b advances and retreats in the direction of the arrow AR1. As a result, the platform 11 to which the nut 12b is fixed advances and retreats in the direction of the arrow AR1 in the same manner as the nut 12b. The pair of guide rails 15, 16 restrict the movement of the stage 11 in the traveling direction. As shown in Fig. 2, a pair of guide rails 15, 16 The base portion 10a is fixed only by a predetermined distance in the direction of the arrow AR2. A plurality of (two in the present embodiment) sliding portions 17 (17a, 17b) are slidable along the guide rail 15 in the direction of the arrow AR1. As shown in Fig. 2, each of the sliding portions 17 (17a, 17b) is fixed to the lower portion of the moving table 11c by a predetermined distance in the direction of the arrow AR1. A plurality of (in the present embodiment, two: however, for convenience) Only the sliding portion 18a is shown. The sliding portion 18 slides along the guide rail 16 in the direction of the arrow AR1 from 154079.doc 201210964. As shown in FIGS. 1 and 2, each sliding portion 18 and the sliding portion 17 (17a, 17 Similarly, under the mobile station 1 i C A Bu Bu. P 'in the front AR1 Thus, when the rotational force of the motor 13 is imparted to the ball screw mechanism 12, the stage 11 moves along the pair of guide rails 15, 16. Therefore, the straightness of the platform 11 in the advancing and retracting direction can be ensured. The scribing unit 20 (4) the material substrate 4 of the scribing unit 20, and the scribing wheel 5' of the sintered diamond is rotated (see the figure for rotation), thereby forming a scribing surface on the surface of the brittle material substrate 4. As shown in Fig. 2 and Fig. 2, the scribing unit 20 mainly has a head portion 3A and a driving portion 4A. The head portion 30 is provided by a lifting/disposing mechanism (not shown), from the held scribing wheel 50 to a brittle material. The surface of the substrate 4 is given a pressing force (hereinafter also referred to simply as "streaking load"). As shown in Fig. 3, the head portion 3 has a bracket %. Further, the bracket 35 is rotatably held by the scribing wheel 5 As shown in Fig. 3, the bracket 35 mainly has a pin 36, a support frame 37, and a turning portion 38. The pin 36 is inserted into the through hole 5〇& a fixed rod. Here, as shown in Figs. 3 and 4, the through hole 5〇a is substantially parallel to the χ axis. The support shaft 37 is a structure that is disposed so as to cover the two openings (both ends) of the through holes 5〇& as shown in Fig. 3. The two ends of the through holes 5〇a protrude from the through holes 5〇a. The pin 36 is rotatably provided with respect to the support frame 37. Therefore, the scribing wheel 50 fixed by the pin % is rotatable relative to the support frame 37. As shown in Fig. 3, the revolving portion 38 is provided in the support frame 37. The upper portion is rotated about the rotation shaft 38a substantially parallel to the Z-axis, and the support frame 37 is rotated. 154079.doc •10· 201210964 The position of the rotation shaft 38a of the turning portion 38 as viewed from the lower surface is as shown in FIG. It is offset from the set position 50c of the holding unit 1G in the brittle material substrate 4. As shown in FIG. 5, when the traveling direction of the scribing wheel 50 changes from the direction of the arrow AR3 (2* ray line) to the arrow direction (solid line) direction, due to the backward tilting, the effect causes the rotation axis to rotate around him. The moment acts on the scribing wheel 5〇. Therefore, the scribing wheel 50 is rotated in the direction of the arrows, and the position of the scribing wheel is changed from the position of the chain of 2 o'clock to the position of the solid line.如此 Thus, the direction of travel of the scribing wheel 50 changes. Even if the posture of the scribing wheel 50 is shifted by only the angle 〇1 with respect to the traveling direction, the torque in the direction of the arrows acts on the scribing wheel 50. As a result, the scribing wheel 5 turns, and the posture of the scribing wheel 50 is substantially parallel to the traveling direction of the scribing wheel 5?. The driving unit 40 causes the head portion 3 provided on the scribing wheel 50 to be slid in the direction of the arrow ar2, the axis is positive or negative: below, and is also referred to simply as "reciprocating direction". As shown in Fig. 2, the drive unit 4〇 mainly has a support 41, a rail 42 and a motor 43°. The plurality of bases (two in the present embodiment) of the pillars 41 (41a, 41b) start from the base 10a in the up and down direction. The axis direction) extends. As shown in Fig. 2, each of the guides a is fixed to the pillars 41a and 41b while being sandwiched between the pillars 41a and 41b. The plurality of roots (two in the present embodiment) guide 42 restricts the movement of the head portion 30 in the reciprocating direction. As shown in Fig. 2, the plurality of guide rails 42 are fixed at a specific distance of only 13⁄4 in the up and down direction. The motor 43 is coupled to a feed mechanism (for example, a ball screw mechanism) (not shown). Thereby, if the motor 43 rotates, the head 3 turns back and forth in the direction of the arrow AR2 along the plurality of guide rails 42 154079.doc 11 201210964. The scribing wheel 50 is pressed and rotated on the brittle material substrate 4 to form a scribe line SL on the brittle material substrate 4 (see Fig. 3). The scribing wheel 5_ is a sintered diamond (P〇1yCrystalline diam〇nd: hereinafter, also referred to as "PCD" hereinafter. Further, the detailed structure of the scribing wheel 50 will be described later. The imaging unit 60 captures the brittle material substrate 4 held by the holding unit 1A. As shown in Fig. 2, the imaging unit 60 has a plurality of phases..., 65b). A plurality of (two in the present embodiment) cameras 65 (仏, (4)) are disposed above the holding unit 10 as shown in Figs. i and 2 . Each of the cameras 65 (仏, 6 is called a picture of a characteristic portion formed on the brittle material substrate 4 (for example, an alignment mark (not shown)). The bran "圄诼, then, according to each camera 65 The image taken at (65a, 65b) is used to determine the position and posture of the brittle material substrate. Here, the "position" of the brittle material substrate 4 means any position on the brittle material substrate 4 in the absolute coordinate system. The "(4)" of the brittle material substrate 4 is the "reference line for the brittle material substrate 4 in the reciprocating direction of the material 3q (for example, when the brittle material substrate 4 is square, it is one of the four sides). Further, in the present embodiment, the square-shaped brittle material substrate 4 is used to form an alignment center at the corners of the four corner portions of the brittle material substrate 4 (10). Corresponding camera 奶, milk shooting, according to the captured images, find the position of each alignment mark in the absolute coordinate system. Then 'according to the position of the (four) standard mark, calculate the brittle material 154079.doc 12 201210964 Substrate 4 The control unit 90 realizes the operation control and data calculation of each element of the scribing device 1. As shown in Figs. 1 and 2, the control unit mainly has R〇M (Read Only Memory) 91. , RAM (Rand〇m Access Memory) 92, and cpu (centrai Processing Unit) 93.
R〇M(Read Only Mem〇ry)91係所謂非揮發性之記憶部， 例如，儲存程式9U。再者，作為⑽则，亦可使用讀寫 自如之非揮發性記憶體即快閃記憶體。ΚΑΜ(—R〇M (Read Only Mem〇ry) 91 is a so-called non-volatile memory unit, for example, a storage program 9U. Further, as (10), a non-volatile memory which is freely readable and writable, that is, a flash memory can also be used. ΚΑΜ(—
Access Memory)92係揮發性之記憶部，例如，儲存π· 之運算所使用之資料。 CPU(Central Processing Unit)93 執行根據⑽刪之程式 9U之控制（保持單元1G之進退·旋轉動作、及由驅動部微 行之頭部3〇之往返動作等之控制）、及脆性材料基板4之位 置及姿勢運算等之資料處理。Access Memory 92 is a volatile memory unit, for example, a data used to store π· operations. The CPU (Central Processing Unit) 93 executes the control of the program 9U according to (10) (the advancement and retreat of the holding unit 1G, the rotation operation, and the control of the reciprocation of the head of the driving unit 1), and the brittle material substrate 4 Data processing such as position and posture calculation.
例如，CPU93 (1) 運算脆性材料基板4之位置及姿勢，並且 (2) 根據此位置及姿勢之運瞀 連^結果，使旋轉台lib旋轉動 作，且使移動台11 c進退動作， 由此執行相對於頭部3〇之脆性材料基板4之對準處理。 <2.劃線輪之構成> 之一例之側面圖及正面 如圖3至圖7所示，劃線 ’下底面較上底面而言 圖6及圖7係表示劃線輪5〇之構成 圖。圖8係圖6之A部分之放大圖。 輪50係以2個圓錐台之下底面（其中 154079.doc -13- 201210964 面積大）相互對向之方式而配置者，且具有大致圓盤形狀 (算盤珠形狀）。如圖6至圖8所示，劃線輪5〇主要具有本體 部5 1、刀52、及刀尖52a。 如圖6及圖7所示，本體部51形成為圓盤狀，於本體部51 之中心附近沿著旋轉軸50b而設置有貫通本體部51之貫通 孔50a。另外，於本體部51之外周設置有圓環狀之本體部 51 ° 如圖6所示，刀52係由以旋轉軸5〇b為中心之同心圓狀之 内周及外周而形成之圓環狀體。如圖7所示，刀52正面觀 察為v字狀。沿著旋轉軸50b之刀52之厚度几（參照圖乃隨 著自旋轉軸50b侧朝向刀尖52a逐漸變小。 刀尖523沿著刀52之最外周部（即，刀52中距旋轉轴5扑 之距離最大、刀52之厚度Tb最小之部分）而設置。如圖8所 示，刀尖52a具有突起部54，並且於刀尖52a設置有槽53盥 稜線54a。 〃 複數個槽53係設置於刀尖52a之側面觀察大致乂字狀之凹 部。如圖8所示，鄰接之槽53沿著刀52之外周僅隔開所期 望之間距P而形成。 如圖8所示，複數個突起部54沿著本體部51之最外周部 而没置。更具體而言，各突起部54設置於沿著刀尖Ua而 設置之複數個槽53中鄰接之槽53之間。 *再者，圖8中，為便於圖示，僅記載有3個槽53、及4個 犬起口P 54。另外，形成於刀尖…之複數個槽為微米級 且意圖加工者。因此，複數個槽53係區別於由刀尖％形 154079.doc -14- 201210964 成時之研削加工而必然形成之研削條痕。 <2 · 1 ·劃線輪之尺寸> 此處，劃線輪50之外徑Dm(參照圖7)較佳為更 佳為1〜3(mm))之範圍。於劃線輪50之外徑！^小於i mm之 情形時，劃線輪50之操作性及耐久性降低。另一方面，於 劃線輪50之外徑Dm大於5 mm之情形時，有時劃線時之垂 直裂痕K相對於脆性材料基板4不形成得較深。 〇 另外，劃線輪％之厚度Th(參照圖7)較佳為〇.5〜12 (mm)(更佳為〇.5〜l.l(mm))之範圍。於劃線輪5〇之厚度Th 小於0.5 mm之情形時，有時加工性及操作性降低。另一方 面’於劃線輪50之厚度Th大於12 mm之情形時，劃線輪5 〇 之材料及製造用之成本變高。 另外，刀52之刀尖角Θ2(參照圖7)通常為鈍角，較佳為 9O<02S16O(deg)(更佳為 ι00$θ2$ 14〇(deg))之範圍。再 者’刀尖角Θ2之具體之角度根據切斷之脆性材料基板4之 Q 材質、及/或厚度等而適當設定。 另外，形成於刀尖52a之槽53之深度Dp(換而言之突起部 54之高度）較佳為1〜60(μηι)，通常為2〜25(μηι)(更佳為 3〜15(μιη))之範圍。 另外，鄰接之槽53之間之間距Ρ(參照圖8)較佳為 20〜2〇0(μιη)(更佳為30〜7〇(μιη))之範圍。於鄰接之槽53之 間之間距Ρ小於2 0 μιη之情形時’會有劃線輪$ 〇之刀尖5 2 a 之磨損變大、耐久性降低之情形。另一方面，於該間距p 大於200 μηι之情形時’會有無法於脆性材料基板4上形成 154079.doc -15- 201210964 良好之垂直裂痕κ之情形。 另外，形成於鄰接之槽53之間之稜線54a之長度L(參照 圖8)較佳為25〜75(μπι)(更佳為25〜75(μηι))之範圍。於該稜 線54a之長度L小於25 μηι之情形時’將產生無法確保充分 之有效切削長度’因而導致劃線輪5 〇之壽命變短之問題。 另外’槽53之寬度W相對於稜線54a之長度L之比例 Rt(=W/L)較佳為〇.5〜5.0(更佳為丨〇〜3.5)之範圍。於此情形 時，可充分確保有效切削長度。 <2.2 ·劃線輪中所包含之材料> 另外，劃線輪5〇之成形所使用之燒結金剛石具有金剛石 粒子與其餘部分之結合相，較佳為相鄰之金剛石粒子彼此 相互結合。由於相鄰之金剛石粒子彼此相互結合，可獲得 優異之耐磨損性及強度。 此處，對燒結金剛石中所包含之材料中之金剛石粒子、 及、’’CT &相中所包含之結合材料及添加劑進行說明。 金剛石粒子之平均粒徑較佳為5 (陶更佳為 0.7〜Ι.Ο(μιη))之範圍。 此恿，劃線輪50係 ，•入、、个τ承銳3 -。因此’金剛石粒子之平均粒徑必需為至少15 _以— 之超微粒子。 κ rw·0 μπι之情形時 於金剛石晶界令裂痕容易傳播。因此，當扭動力反覆作 於刀尖％之突起部54時，會助長此突起部54之缺損。 釔果將產生劃線輪50之壽命變短之問題。 J54079.doc ** 16- 201210964 燒結金剛石争之金剛石之含量較佳為65 〇~75 〇(重量 %)(更佳為68·0〜72.〇(重量％): 85.0〜86·〇(容量。/。)）之範圍。 此處，於金剛石之含量小於68〇重量％之情形時，燒結金 剛石之耐磨損性降低。 作為添加劑，例如，較佳地使用選自鎢、鈦、鈮、鈕之 至少1種以上之元素之超微粒子碳化物。 此處’燒結金剛石中之超微粒子碳化物之含量較佳為 0 3.〇〜10.0(重量％)之範圍。 更佳為’超微粒子碳化物之含量為6〇〜8〇(重量。/。）之範 圍’超微粒子碳化物包含U〜4.0(重量％)之碳化鈦與其餘 部分之碳化鎢。藉此，於燒結過程中之金剛石之熔融凝固 時’可抑制金剛石粒子之異常粒成長。因此，可進而使耐 扭動強度特性提高。 作為結合材料’通常，較佳地使用鐵族元素。作為鐵族 凡素，例如可列舉鈷、鎳、鐵等，其中鈷較佳。另外，燒 〇 結金剛石中之結合材料之含量較佳為金剛石及超微粒子碳 化物之其餘部分，更佳為20〜25(重量％)之範圍。 再者’本實施形態中之「重量％」係根據利用EDX (Energy Dispersive x_ray Spectr〇metry，能量彌散χ射線光 谱測定）而進行之元素分析來求出。另一方面，「容量％」 係指金剛石粒子之合計體積相對於包含孔隙之燒結金剛石 之總體積之比例。 .劃線輪之製造方法〉 於說明劃線輪5 0之製造方法時，首先，說明燒結金剛石 154079.doc -17- 201210964 之燒結方法，接著，對自燒結金剛石 進行說明。 線輪50之方法 <3.1.燒結金剛石之燒結方法> 此處’對燒結金剛石之燒結方法 中，首先，將上述金剛石粒子、結合材丁=月。此燒結方法 人甘^ a 口材枓、添加劑加以混 ^其久’金剛石於熱力學性地穩定之高溫及超Μ下， I亥等混合物燒結。由此，製造燒結金剛石。 此處，於燒結時，超高壓產生裝 ^ 王衮置之模具内之壓力較佳 為5〜㈣之範圍。另外，此模具内之溫度較佳為跡 1900( C )之範圍。 <3.2·劃線輪之成形方法> 此處’對自所製造出之燒結金剛石成形劃線輪5〇之方法 進行說明。首先’本成形方法中，首先，自較佳厚度 (〇.5〜i .2(mm))之燒結金剛石切取所期望之半徑之圓盤。 其次，肖|!圓盤之周緣部，以使沿著旋轉轴5〇b之刀以 厚度Tb隨著自旋轉軸50b側朝向刀尖52a而逐漸變小。藉 此，於圓盤之周緣部，形成正面觀察為v字狀之刀“。 …、:後利用雷射加工、放電加工、或者研削加工等先前 a知之加工方法，於刀尖52a形成複數個槽。再者本 實施形態之劃線輪50如上所述直徑小（1〜5(mm))，槽53之 形成要求加工精度。因此，作為槽53之加工方法推薦雷射 加工，作為所使用之雷射光，可列舉例如YAG(yttrium aluminum garnet，釔鋁石榴石）雷射。 <4.劃線方法> 154079.doc -18- 201210964 此處、’對藉由劃線輪5G而於脆性材料基板4上形成劃線 SL之方法進行說明。 於本方法t，頭部30之劃線輪5〇由未圖示之升降加壓 - 漏而相對於跪性材料基板4M接。另外，驅動保持單元 1G之馬達13、及/或驅動部4G之馬達43,使頭㈣相對於 被保持單元10保持之脆性材料基板4而於水平面内相對性 地移動®此，於脆性材料基板4上由劃線輪卿成所期 0 望之劃線SL，且產生垂直裂痕κ。 此處，劃線負荷較佳為5〜5〇(Ν)(更佳為。〜％…)）之範 圍。另外，劃線輪50相對於脆性材料基板4之移動速度（以 下’亦僅稱為「劃線速度」）較佳為5〇〜扇(mm/sec)之範 圍。再者，劃線負荷及劃線速度之具體性之值可根據脆性 材料基板4之材質、及/或厚度等而適當設定。 另外，於脆性材料基板4上’對應頭部3〇之相對移動， 形成如以下之劃線SL。 〇 例如，若於使馬達43停止之狀態下，驅動馬達13，則於 使頭部30停止之狀態下’使保持單元1〇於進退方向（圖R 箭頭AR1方向）移動。即，頭部3〇相對於被保持單元ι〇保持 之脆性材料基板4於進退方向相對移動。因此，於脆性材 料基板4之上表面，形成沿著此進退方向之劃線SL(參照圖 3)。 另一方面，若於使馬達13停止之狀態下，驅動馬達43， 則於保持單元10停止之狀態下，使頭部3〇於往返方向（圖2 之箭頭AR2方向）移動。即，頭部30相對於被保持單元1〇保 154079.doc -19- 201210964 持之脆性材料基板4於往返方向相對移動。因此，於脆性 材料基板4之上表面，形成沿著此往返方向之劃線儿(參照 圖3)。 另外，若各馬達13、43之動作狀態自（1)馬達43停止、 馬達13驅動之狀態變化為⑺馬達13停止、馬達伽動之狀 態，則頭部30之移動方向因後傾轉向效應而自與脆性材料 基板4平订之進退方向（第丨水平方向）變化為往返方向（第2 水平方向）。即，劃線輪50保持與脆性材料基板4抵接之狀 態’劃線輪50之刀尖52a之方向變更叩度。因此，於脆性 材料基板4之上表面形成大致L字狀之劃線sl(參照圖3)。 進而，於馬達13、43同時旋轉之情形時，頭部3〇之行進 方向成為相對於進退方向（箭頭AR1方向）及往返方向（箭頭 AR2方向）而傾斜之狀態。心匕，於脆性材料基板4之上表 7成相對於進退方向及往返方向而傾斜之狀態之劃線 參照圖3)β進而，於使馬達13、43之旋轉數變化之情 开/時形成曲線狀之劃線SL(參照圖3)。 此處’於本實施形態中，將為了形成大致L字狀之劃線 而使脆ί生材料基板4產生垂直裂痕κ(參照圖3)之情況亦稱 為「L字劃線」。 再者於害1丨斷之情形時，利用斷裂裝置（圖示省略）’對 “生材料基板4之主面中⑴形成了劃線儿之主面(以下，亦 •{苔牙冉為「芬/ 、 ‘"、 >成面」）、（2)與形成面為相反側之主面賦予應 直"口此，於劃線步驟中，產生於脆性材料基板4上之垂 裝痕Κ成長至與形成面為相反側之面為止，從而脆性材 154079.doc •20· 201210964 料基板4被切斷（斷裂步驟）。 另外，於分割之情形時，利用劃線步驟形成深的垂直裂 痕K。因此，不需要斷裂裝置（圖示省略），僅利用劃線步 驟即可切斷脆性材料基板4。 <5.本實施形態中之劃線輪之優點> 如以上般，本實施形態之劃線輪5〇為燒結金剛石製，此 燒結金剛石包含65·〇〜75 〇重量％之金剛石、3 〇〜ι〇 〇重量 〇 %之超微粒子碳化物、及其餘部分之結合材料，並且金剛 石之平均粒徑為〇.6〜15 μηι之範圍，結合材料係以銘為主 成分之鐵系金屬。 藉此，此劃線輪5〇不僅可提高耐磨損性及耐衝擊強度特 性’還可提高耐扭動強度特性。#，於使劃線輪50與脆性 材料基板4抵接之狀態下，即便於使劃線輪50之行進方向 變化之情形時，亦可有效地防止刀尖52a之突起部54缺 損。因此，可實現劃線輪5〇之進一步長壽命化。 、For example, the CPU 93 (1) calculates the position and posture of the brittle material substrate 4, and (2) according to the result of the position and posture, the rotating table lib is rotated, and the moving table 11c is moved forward and backward. The alignment process of the brittle material substrate 4 with respect to the head 3 is performed. <2. Configuration of the scribing wheel> The side view and the front side of one example are as shown in Figs. 3 to 7 , and the lower bottom surface of the scribing line is compared with the upper bottom surface. Figs. 6 and 7 show the scribing wheel 5 Make up the picture. Figure 8 is an enlarged view of a portion A of Figure 6. The wheel 50 is disposed such that the bottom surfaces of the two truncated cones (where 154079.doc -13 - 201210964 are large) are opposed to each other, and have a substantially disc shape (abacus bead shape). As shown in Figs. 6 to 8, the scribing wheel 5 〇 mainly has a body portion 51, a blade 52, and a blade edge 52a. As shown in Figs. 6 and 7, the main body portion 51 is formed in a disk shape, and a through hole 50a penetrating the main body portion 51 is provided along the rotating shaft 50b in the vicinity of the center of the main body portion 51. Further, an annular main body portion 51 is provided on the outer circumference of the main body portion 51. As shown in Fig. 6, the knife 52 is a ring formed by concentric inner and outer circumferences around the rotation axis 5〇b. Shape. As shown in Fig. 7, the knife 52 is viewed in a v-shape on the front side. The thickness of the blade 52 along the rotating shaft 50b (refer to the figure gradually decreases toward the blade edge 52a as the self-rotating shaft 50b side. The blade edge 523 is along the outermost peripheral portion of the blade 52 (i.e., the blade 52 is spaced from the rotating shaft) 5 is provided with the largest distance and the smallest thickness Tb of the blade 52. As shown in Fig. 8, the blade edge 52a has a projection portion 54, and the blade edge 52a is provided with a groove 53 ridge line 54a. 〃 A plurality of grooves 53 A substantially U-shaped recess is formed on the side of the blade edge 52a. As shown in Fig. 8, the adjacent groove 53 is formed along the outer circumference of the blade 52 only by a desired distance P. As shown in Fig. 8, the plural The protrusions 54 are not disposed along the outermost peripheral portion of the body portion 51. More specifically, each of the protrusions 54 is provided between the adjacent grooves 53 in the plurality of grooves 53 provided along the blade edge Ua. In Fig. 8, for convenience of illustration, only three grooves 53 and four dog mouths P 54 are described. Further, a plurality of grooves formed in the blade edge are in the order of micrometers and intended to be processed. The groove 53 is different from the grinding streak which is inevitably formed by the grinding process of the cutting edge % shape 154079.doc -14- 201210964. <2 • 1) Size of the scribing wheel> Here, the outer diameter Dm (refer to FIG. 7) of the scribing wheel 50 is preferably in the range of preferably 1 to 3 (mm). On the outer diameter of the scribing wheel 50! When the thickness is less than i mm, the scribe wheel 50 has reduced operability and durability. On the other hand, when the outer diameter Dm of the scribing wheel 50 is larger than 5 mm, the vertical crack K at the time of scribing may not be formed deep with respect to the brittle material substrate 4. Further, the thickness Th of the scribing wheel % (refer to Fig. 7) is preferably in the range of 〇.5 to 12 (mm) (more preferably 〇.5 to l.l (mm)). When the thickness Th of the scribing wheel 5 is less than 0.5 mm, workability and workability may be lowered. On the other hand, when the thickness Th of the scribing wheel 50 is larger than 12 mm, the material of the scribing wheel 5 及 and the cost for manufacturing become high. Further, the blade edge angle Θ 2 (refer to Fig. 7) of the blade 52 is usually an obtuse angle, preferably a range of 9O < 02S16O (deg) (more preferably ι00 $ θ2 $ 14 〇 (deg)). Further, the specific angle of the blade edge angle 2 is appropriately set depending on the Q material, and/or the thickness of the brittle material substrate 4 to be cut. Further, the depth Dp (in other words, the height of the projection 54) formed in the groove 53 of the blade edge 52a is preferably 1 to 60 (μηι), and is usually 2 to 25 (μηι) (more preferably 3 to 15 ( The range of μιη)). Further, the distance between the adjacent grooves 53 (see Fig. 8) is preferably in the range of 20 to 2 〇 0 (μιη) (more preferably 30 to 7 〇 (μιη)). When the distance between the adjacent grooves 53 is less than 20 μm, the wear of the blade edge 5 2 a of the scribing wheel is increased and the durability is lowered. On the other hand, when the pitch p is larger than 200 μη, there is a case where a good vertical crack κ of 154079.doc -15 - 201210964 cannot be formed on the brittle material substrate 4. Further, the length L (see Fig. 8) of the ridgeline 54a formed between the adjacent grooves 53 is preferably in the range of 25 to 75 (μm) (more preferably 25 to 75 (μηι)). When the length L of the ridgeline 54a is less than 25 μm, the problem arises that a sufficient effective cutting length cannot be ensured, resulting in a shortened life of the scribing wheel 5 。. Further, the ratio Rt (= W / L) of the width W of the groove 53 to the length L of the ridge line 54a is preferably in the range of 〇. 5 to 5.0 (more preferably 丨〇 to 3.5). In this case, the effective cutting length can be sufficiently ensured. <2.2 - Material contained in the scribing wheel> Further, the sintered diamond used for the formation of the scribing wheel 5 has a bonding phase of the diamond particles and the remaining portion, and it is preferable that the adjacent diamond particles are bonded to each other. Since adjacent diamond particles are bonded to each other, excellent wear resistance and strength can be obtained. Here, the diamond particles in the material contained in the sintered diamond, and the bonding materials and additives contained in the ''CT & phase' will be described. The average particle diameter of the diamond particles is preferably in the range of 5 (pottery is preferably 0.7 to Ι.Ο (μιη)). In this case, the scribing wheel 50 is a system, and the τ is sharply 3 -. Therefore, the average particle size of the diamond particles must be at least 15 Å to ultrafine particles. In the case of κ rw·0 μπι, cracks are easily spread at the grain boundary of diamond. Therefore, when the twisting force is repeatedly applied to the projection portion 54 of the cutting edge portion, the defect of the projection portion 54 is promoted. The result will be that the life of the scribing wheel 50 is shortened. J54079.doc ** 16- 201210964 The content of diamond in sintered diamond is preferably 65 〇~75 〇 (% by weight) (more preferably 68·0~72. 〇 (% by weight): 85.0~86·〇 (capacity) /.)) The scope. Here, when the content of the diamond is less than 68% by weight, the abrasion resistance of the sintered diamond is lowered. As the additive, for example, an ultrafine particle carbide of at least one element selected from the group consisting of tungsten, titanium, niobium and a button is preferably used. Here, the content of the ultrafine particle carbide in the sintered diamond is preferably in the range of from 0.3 to 10.0 (% by weight). More preferably, the content of the ultrafine particle carbide is in the range of 6 Torr to 8 Torr (by weight). The ultrafine particle carbide contains U to 4.0 (% by weight) of titanium carbide and the remainder of the tungsten carbide. Thereby, the abnormal grain growth of the diamond particles can be suppressed when the diamond is solidified during the sintering process. Therefore, the torsional strength characteristics can be further improved. As the bonding material 'In general, an iron group element is preferably used. Examples of the iron group include cobalt, nickel, iron, and the like, and among them, cobalt is preferred. Further, the content of the bonding material in the sintered diamond is preferably the remainder of the diamond and the ultrafine particle carbide, more preferably in the range of 20 to 25 (% by weight). Further, "% by weight" in the present embodiment is obtained by elemental analysis by EDX (Energy Dispersive x-ray Spectrometry). On the other hand, "% by volume" means the ratio of the total volume of the diamond particles to the total volume of the sintered diamond containing the pores. <Manufacturing Method of Scribing Wheel> In the description of the manufacturing method of the scribing wheel 50, first, a sintering method of sintered diamond 154079.doc -17-201210964 will be described, and then, self-sintering diamond will be described. Method of Reel 50 <3.1. Sintering Method of Sintered Diamond> Here, in the method of sintering sintered diamond, first, the above-mentioned diamond particles and a bonding material are used. The sintering method is a mixture of sputum and an additive, and the mixture is sintered for a long time. The diamond is sintered at a high temperature which is thermodynamically stable and under a high temperature. Thereby, sintered diamond is produced. Here, at the time of sintering, the pressure in the mold of the ultrahigh pressure generating device is preferably in the range of 5 to (4). Additionally, the temperature within the mold is preferably in the range of trace 1900 (C). <3.2·Method of Forming the Scribing Wheel> Here, a method of manufacturing the sintered diamond-forming scribing wheel 5〇 will be described. First, in the present molding method, first, a disk having a desired radius is cut out from a sintered diamond having a preferable thickness (〇.5 to i.2 (mm)). Next, the peripheral portion of the disc|shaft is such that the thickness Tb of the blade along the rotating shaft 5〇b gradually decreases toward the blade edge 52a from the side of the rotating shaft 50b. In this way, a knife having a v-shape on the front side is formed on the peripheral portion of the disk. Then, a plurality of processing methods such as laser processing, electric discharge machining, or grinding processing are used, and a plurality of blades are formed on the blade edge 52a. Further, the scribing wheel 50 of the present embodiment has a small diameter (1 to 5 (mm)) as described above, and the formation of the groove 53 requires processing precision. Therefore, laser processing is recommended as the processing method of the groove 53 as used. For the laser light, for example, YAG (yttrium aluminum garnet) laser is used. <4. Scribe method> 154079.doc -18- 201210964 Here, 'by the scribing wheel 5G A method of forming the scribe line SL on the brittle material substrate 4 will be described. In the present method t, the scribing wheel 5 of the head portion 30 is connected to the inert material substrate 4M by the lift-down/drain which is not shown. The motor 13 of the holding unit 1G and/or the motor 43 of the driving unit 4G relatively move the head (4) in the horizontal plane with respect to the brittle material substrate 4 held by the holding unit 10, on the brittle material substrate 4. Scratch the wheel into the desired line SL, and produce vertical Crack κ. Here, the scribing load is preferably in the range of 5 to 5 〇 (more preferably 〜%...). In addition, the moving speed of the scribing wheel 50 with respect to the brittle material substrate 4 (below below) Also referred to as "scribing speed" is preferably a range of 5 〇 to fan (mm/sec). Further, the specific value of the scribing load and the scribing speed can be appropriately set depending on the material, and/or thickness of the brittle material substrate 4. Further, on the brittle material substrate 4, the relative movement of the head portion 3' is formed, and a scribe line SL as follows is formed. For example, when the motor 13 is driven while the motor 43 is stopped, the holding unit 1 is moved in the advancing and retracting direction (the direction of the arrow R1 in the direction of the arrow AR1) while the head portion 30 is stopped. That is, the head portion 3〇 relatively moves in the advancing and retracting direction with respect to the brittle material substrate 4 held by the holding unit ι. Therefore, a scribe line SL (see Fig. 3) along the advancing and retracting direction is formed on the upper surface of the brittle material substrate 4. On the other hand, when the motor 43 is driven in a state where the motor 13 is stopped, the head portion 3 is moved in the reciprocating direction (the direction of the arrow AR2 in Fig. 2) while the holding unit 10 is stopped. That is, the head 30 is relatively moved in the reciprocating direction with respect to the brittle material substrate 4 held by the holding unit 1 154079.doc -19-201210964. Therefore, a scribe line along the reciprocating direction is formed on the upper surface of the brittle material substrate 4 (see Fig. 3). Further, when the operation state of each of the motors 13 and 43 is changed from (1) the motor 43 is stopped and the state of the motor 13 is changed to (7) the motor 13 is stopped and the motor is galvanized, the moving direction of the head 30 is due to the backward tilting effect. The advancing direction (the horizontal direction) that is aligned with the brittle material substrate 4 changes to the reciprocating direction (the second horizontal direction). In other words, the scribing wheel 50 maintains the direction of the blade edge 52a of the scribing wheel 50 in a state in which it is in contact with the brittle material substrate 4. Therefore, a substantially L-shaped scribe line sl is formed on the upper surface of the brittle material substrate 4 (see Fig. 3). Further, when the motors 13 and 43 are simultaneously rotated, the traveling direction of the head portion 3 is inclined with respect to the advancing and retracting direction (arrow AR1 direction) and the reciprocating direction (arrow AR2 direction). The sputum is formed on the brittle material substrate 4 in a state in which the surface 7 is inclined with respect to the advancing and retracting directions and the reciprocating direction. Referring to FIG. 3), β is formed when the number of rotations of the motors 13 and 43 is changed. Curved line SL (refer to Figure 3). Here, in the present embodiment, the case where the vertical crack κ (see Fig. 3) is generated in order to form the substantially L-shaped scribe line is also referred to as "L-line". In the case of the damage, the main surface of the main surface of the green material substrate 4 (1) is formed by the breaking device (not shown). Fen / , '", > face"), (2) and the main face on the opposite side of the forming surface are given a straight " mouth, in the scribing step, produced on the brittle material substrate 4 The dent is grown to the side opposite to the forming surface, so that the brittle material 154079.doc • 20· 201210964 is cut off (breaking step). Further, in the case of division, a deep vertical crack K is formed by the scribing step. Therefore, the brittle material substrate 4 can be cut by only the scribing step without the need for a breaking device (not shown). <5. Advantages of the scribing wheel in the present embodiment> As described above, the scribing wheel 5〇 of the present embodiment is made of sintered diamond, and the sintered diamond contains 65·〇 to 75 〇% by weight of diamond, 3 〇 〇〇 〇〇 〇〇 〇〇 之 之 之 之 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超 超Thereby, the scribing wheel 5〇 can improve not only the wear resistance and the impact strength characteristic but also the torsional strength resistance. When the scribing wheel 50 and the brittle material substrate 4 are brought into contact with each other, even when the traveling direction of the scribing wheel 50 is changed, the protrusion 54 of the blade edge 52a can be effectively prevented from being damaged. Therefore, the life of the scribing wheel 5〇 can be further extended. ,
<6.變形例> 以上 料發明之實施形態進行了說明，但本發明並 限定於上述實施形態，可進行各種變形。 於本實施形態中，說明了設置於刀尖❿之複數個槽η 之形狀為側面觀察大❹字狀之情況，但並不限定 圖9至圖U係表示劃線㈣之刀尖❿上所形成之槽η之盆 Π:圖另：圖9所示’槽53例如亦可為側面觀察梯形狀 狀或者矩職’如圖1〇及圖11所示’亦可為側面觀察圓弧 狀孰者矩形狀之凹部。 154079.doc 201210964 [實施例] 以下，根據實施例it-步對本發明進行詳細說明，但本 發明並不對該等例作任何限定。 〈實施例1> 此處’對實施例❻行說明。圖12係用以說明耐扭動測 試之平面圖。圖13係表示實施例丨及比較例i、2所分別對 應之劃線輪50之材質及尺寸、及耐扭動測試之條件之圖。 此耐扭動測試中，如圖12所示，反覆執行l字劃線。而 且，藉由觀察各劃線輪50之刀尖523之突起部54之缺損狀 況，來判斷實施例1、及比較例丨、2所分別對應之劃線輪 50之耐扭動強度特性β ™ 如圖13所示，關於構成實施例丨之劃線輪5〇之燒結金剛 石，金剛石之平均粒徑及含量、鐵族金屬之含量、及超微 粒子碳化物之含量均為較佳之範圍内。 另一方面，構成比較例i之劃線輪5〇之燒結金剛石於以 下方面與構成實施例〗之劃線輪5〇之燒結金剛石不同·· (1) 金剛石之平均粒徑大於較佳之範圍之上限值， (2) 金剛石之含量小於較佳之範圍之下限值，且 (3) 碳化物之含量多於較佳之範圍之上限值。 另外，構成比較例2之劃線輪50之燒結金剛石於以下方 面與構成實施例1之劃線輪50之燒結金剛石不同： (1)金剛石之平均粒徑小於較佳之範圍之下限值。 此處，耐扭動測試中所執行之[字劃線按照以下順序執 订。首先，於使保持單元10之馬達丨3停止之狀態下，驅動 154079.doc -22- 201210964 部40之馬達43驅動，由此頭部30之劃線輪5〇於丫軸正方向 移動。由此，於脆性材料基板4上形成長度D〗之劃線 SL1。 -其次，使驅動部40之馬達43自驅動狀態變為停止狀態， 使保持單元1〇之馬達13自停止狀態變為驅動狀態。由此， 劃線輪50之刀尖52a之突起部54與脆性材料基板4抵接（侵 入），且因後傾轉向效應而劃線輪50之行進方向變化約9〇 度。 ❹ 繼而’藉由使頭部30之劃線輪5〇進而於X軸正方向移 動，而於脆性材料基板4上形成長度D2之劃線SL2。 然後，於將形成劃線SLi、SL2之[字劃線執行複數次之 後，求出刀尖52a之突起部54之缺損狀況（例如，突起部54 之缺損個數）’由此求出實施例1、及比較例1、2所分別對 應之劃線輪50之耐扭動強度特性。 圖14係表示耐扭動測試前之實施例1之劃線輪50之突起 ◎ 邠54之照片。圖15係表示耐扭動測試後（將l字劃線執行 1〇〇〇_人之後）之實施例1之劃線輪50之突起部54之照片。如 圖14及圖15所示，雖然耐扭動測試後之實施例1之突起部 54存於猶微之缺損，但藉由執行次之後之劃線輪％亦 可良好地執行L字劃線。 圖16及圖18係表示耐扭動測試前之比較例1及2之劃線輪 5〇之大起部54之照片。圖17及圖19係表示耐扭動測試後 (將L字劃線執行1〇次之後）之比較例1及2之劃線輪％之突 起部54之照片。 154079.doc •23· 201210964 比較例1及2之劃線輪5 0如圖17及圖19所示，於執行10次 之時間點突起部54明顯缺損，無法繼續進行10次以上劃線 步驟。 然後，認為比較例1及2之結果起因於以下情況。即，比 較例1之金剛石之含量為64.0重量％，小於較佳之範圍 (68.0〜72.0(重量％))之下限值。由此，認為比較例1之劃線 輪50之耐磨損性降低。因此，認為比較例1之劃線輪5〇之 壽命比實施例1之劃線輪50短。 另外’比較例2之金剛石之平均粒徑為o s μιη，小於較 佳之範圍（0.6〜1.5(μιη))。由此，與實施例1相比而比較例2 中，金剛石晶界容易產生裂痕，刀尖52a之突起部54容易 缺損即，與貫細*例1相比而比較例2之耐扭動強度特性 差。因此，認為比較例2之劃線輪5〇之壽命比實施例丨之劃 線輪5 〇短。 如此，於使由實施例丨之燒結金剛石而製作之割線輪5 與脆性材料基板4抵接之狀態下，即便於使此劃線輪⑽ 订進方向變化之情形時，亦可有效地防止刀尖52a之突南 部51 缺損。因此，可實現劃線輪5〇之進一步長壽命化。 <貫施例2 > 此處’對實施例2進行說明。 HI > 圖20係表不貫施例2及比較 試之條件之圖。 材貝及尺寸、及耐扭動測 如圖20所示，關於構 石，金剛石之平均粒徑及含广線輪5〇之燒結金剛 垔、鐵族金屬之含量、及超微 154079.doc .24· 201210964 粒子碳化物之含量均為較佳 之耗圍内。另外，實施例2 中，執行與實施相同之耐扭動測試。 ^此’由實_2之燒、结金剛石而製作之劃線輪5〇亦與 貫細例1之情況相同，可實現進-步長壽命化。 [產業上之可利用性j 地本實施形態之劃線輪於如下方面有益：不僅提高财磨損 性及耐衝擊強度特性，请裎古 行 遇柃同耐扭動強度特性，且可於幹<6. Modifications> The embodiment of the invention has been described above, but the present invention is not limited to the above embodiment, and various modifications can be made. In the present embodiment, the case where the plurality of grooves η provided in the blade edge 为 are viewed in a large U shape on the side is described. However, the U-shaped line of the scribe line (four) is not limited to FIG. 9 to FIG. The basin 形成 of the groove η formed: Fig. 9: The groove 53 can be viewed from the side of the ladder shape or the position of the workpiece, as shown in Fig. 1 and Fig. 11, and can also be viewed from the side. Rectangular recess. 154079.doc 201210964 [Examples] Hereinafter, the present invention will be described in detail based on the examples, but the present invention is not limited thereto. <Embodiment 1> Here, the embodiment will be described. Figure 12 is a plan view showing the torsion resistance test. Fig. 13 is a view showing the materials and dimensions of the scribing wheel 50 and the conditions of the withstand torque test in the respective examples and the comparative examples i and 2. In this torsion resistance test, as shown in FIG. 12, the 1-line line is repeatedly executed. Further, by observing the defect state of the projection portion 54 of the blade edge 523 of each scribing wheel 50, the torsional strength characteristic β TM of the scribing wheel 50 corresponding to each of the first embodiment and the comparative examples 丨 and 2 is determined. As shown in Fig. 13, with respect to the sintered diamond constituting the scribing wheel 5 of the embodiment, the average particle diameter and content of the diamond, the content of the iron group metal, and the content of the ultrafine particle carbide are all in a preferable range. On the other hand, the sintered diamond constituting the scribing wheel 5 of Comparative Example i is different from the sintered diamond constituting the scribing wheel 5 of the embodiment in the following points: (1) The average particle diameter of the diamond is larger than the preferred range. The upper limit, (2) the content of diamond is less than the lower limit of the preferred range, and (3) the content of carbide is more than the upper limit of the preferred range. Further, the sintered diamond constituting the scribing wheel 50 of Comparative Example 2 is different from the sintered diamond constituting the scribing wheel 50 of the first embodiment in the following points: (1) The average particle diameter of the diamond is less than the lower limit of the preferred range. Here, the [word lines executed in the torsion resistance test are executed in the following order. First, in a state where the motor 丨3 of the holding unit 10 is stopped, the motor 43 of the drive unit 154079.doc -22-201210964 is driven, whereby the scribing wheel 5 of the head 30 is moved in the positive direction of the x-axis. Thereby, a scribe line SL1 having a length D is formed on the brittle material substrate 4. - Next, the motor 43 of the drive unit 40 is brought into a stopped state from the driving state, and the motor 13 of the holding unit 1 is changed from the stopped state to the driven state. Thereby, the projection 54 of the blade edge 52a of the scribing wheel 50 abuts (invades) the brittle material substrate 4, and the traveling direction of the scribing wheel 50 changes by about 9 degrees due to the backward tilting effect. Then, by drawing the scribing wheel 5 of the head 30 and moving in the positive X-axis direction, a scribe line SL2 having a length D2 is formed on the brittle material substrate 4. Then, after the plurality of scribe lines SLi and SL2 are formed, the defect state of the protrusion portion 54 of the blade edge 52a (for example, the number of defects of the protrusion portion 54) is obtained. 1. The torsional strength characteristics of the scribing wheel 50 corresponding to each of the comparative examples 1 and 2. Fig. 14 is a photograph showing the projection ◎ 邠 54 of the scribing wheel 50 of the first embodiment before the torsion resistance test. Fig. 15 is a photograph showing the projection 54 of the scribing wheel 50 of the first embodiment after the torsion resistance test (after the execution of the 1st character line). As shown in Fig. 14 and Fig. 15, although the projections 54 of the first embodiment after the torsion resistance test are present in a subtle defect, the L-line can be satisfactorily performed by performing the scribing wheel % after the execution. . Fig. 16 and Fig. 18 are photographs showing the large starting portion 54 of the scribing wheel 5 of Comparative Examples 1 and 2 before the torsion resistance test. Fig. 17 and Fig. 19 are photographs showing the projections 54 of the scribing wheel % of Comparative Examples 1 and 2 after the torsion resistance test (after the L-line is performed 1 time). 154079.doc • 23· 201210964 The scribing wheels 50 of Comparative Examples 1 and 2 are clearly missing as shown in Figs. 17 and 19 at the time of execution 10 times, and the scribing step cannot be continued 10 times or more. Then, the results of Comparative Examples 1 and 2 were considered to be caused by the following cases. Namely, the content of the diamond of Comparative Example 1 was 64.0% by weight, which was less than the lower limit of the preferred range (68.0 to 72.0% by weight). Therefore, it is considered that the wear resistance of the scribing wheel 50 of Comparative Example 1 is lowered. Therefore, it is considered that the life of the scribing wheel 5 of Comparative Example 1 is shorter than that of the scribing wheel 50 of the first embodiment. Further, the average particle diameter of the diamond of Comparative Example 2 is o s μιη, which is smaller than the preferable range (0.6 to 1.5 (μιη)). Therefore, in Comparative Example 2, compared with Example 1, the diamond grain boundary is likely to be cracked, and the protrusion 54 of the blade edge 52a is easily broken, that is, the torsional strength of Comparative Example 2 is higher than that of Example 1 Poor characteristics. Therefore, it is considered that the life of the scribing wheel 5 of Comparative Example 2 is shorter than that of the scribing wheel 5 of the embodiment. In the state in which the sprocket wheel 5 produced by the sintered diamond of the embodiment is brought into contact with the brittle material substrate 4, the knife can be effectively prevented even when the direction of the scribing wheel (10) is changed. The southern tip of the tip 52a is 51 defective. Therefore, the life of the scribing wheel 5〇 can be further extended. <Example 2 > Here, Example 2 will be described. HI > Figure 20 is a diagram showing the conditions of Example 2 and the comparison test. The material shell and size, and the torsion resistance test are shown in Fig. 20. Regarding the constitutive stone, the average particle diameter of the diamond and the content of the sintered diamond gangue, the iron group metal containing the wide wheel 5 、, and the ultrafine 154079.doc. 24· 201210964 The content of particle carbides is within the preferred cost range. Further, in the second embodiment, the same torsion resistance test as the implementation was performed. ^ This is the same as the case of the fine example 1 in the case of the burning of the solid or the diamond, and the life of the step can be extended. [Industrial Applicability] The scribing wheel of the present embodiment is advantageous in that it not only improves the wear and impact strength characteristics, but also the resistance to twisting strength characteristics, and can be dried.
式脆性材料基板上產生較深之垂直裂痕。 【圖式簡單說明】 圖1係表示本發明之實施形態中之劃線裝置之整體構成 之—例之正面圖； 圖2係表示本發明之實施形態令之劃線裝置之整體構成 之一例之側面圖； 圖3係表示劃線輪附近之構成之一例之正面圖； 圖4係表示劃線輪附近之構成之一例之仰視圖； 圖5係用以說明後傾轉向效應之仰視圖； 圖6係表示劃線輪之構成之一例之側面圖； 圖7係表示劃線輪之構成之一例之正面圖； 圖8係圖6之A部分之放大圖； 圖9係表示形成於劃線輪之刀尖之槽形狀之其他例之 圖10係表示形成於劃線輪之刀尖之槽形狀之1 圖； ，、他例之 154079.doc •25· 201210964 圖12係用以說明耐扭動測試之平面圖； 圖13係用以說明實施例1、比較例1、及比較例2之測試 條件之圖； 圖I4係表示耐扭動測試前之實施例1之劃線輪之突起部 之照片； 圖1 5係表不耐扭動測試後之實施例1之劃線輪之突起 之照片； ° 圖1 6係表不耐扭動測試前之比較例丨之劃線輪之突起 之照片； 比較例1之劃線輪之突起部 之 圖1 7係表示耐扭動測試後 之照片； 昭係表不耐扭動測試前之比較例2之劃線輪之突起呷 之照片； 圖1 9係表示耐扭動測試後 之照片；及 之比較例2之劃線輪之突起部 圖2 〇係用以說明杳#友| 1 剛試 兄月實鈀例2、比較例i、及比較例 條件之圖。 < 【主要元件符號說明】 1 劃線裝置 4 脆性材料基板 10 保持單元 20 劃線單元 30 頭部 154079.doc -26- 201210964 40 驅動部 50 劃線輪 51 本體部 52 刀 52a 刀尖 53 槽 54 突起部 54a 棱線 60 拍攝部單元 90 控制單元 SL 劃線 K 垂直裂痕A deeper vertical crack is produced on the substrate of the brittle material. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front elevational view showing an overall configuration of a scribing apparatus according to an embodiment of the present invention. FIG. 2 is a view showing an example of an overall configuration of a scribing apparatus according to an embodiment of the present invention. Fig. 3 is a front view showing an example of the configuration of the vicinity of the scribing wheel; Fig. 4 is a bottom view showing an example of the configuration of the vicinity of the scribing wheel; Fig. 5 is a bottom view for explaining the backward tilting effect; 6 is a side view showing an example of the configuration of the scribing wheel; FIG. 7 is a front view showing an example of the configuration of the scribing wheel; FIG. 8 is an enlarged view of a portion A of FIG. 6; Fig. 10 of another example of the shape of the groove of the blade tip is a view showing the shape of the groove formed in the blade edge of the scribing wheel; and, for example, 154079.doc • 25· 201210964 Fig. 12 is for explaining the torsion resistance Fig. 13 is a view for explaining the test conditions of Example 1, Comparative Example 1, and Comparative Example 2; Fig. 12 is a photograph showing the projection of the scribing wheel of Example 1 before the torsion resistance test. Figure 1 5 shows the scribing wheel of Example 1 after the test is not resistant to twisting Photograph of the protrusion; ° Fig. 1 6 is a photograph of the protrusion of the scribing wheel of the comparative example before the torsion test; Figure 1 of the protrusion of the scribing wheel of the comparative example 1 shows the resistance after the torsion test Photograph; Photograph of the protrusion of the scribing wheel of Comparative Example 2 before the tactile test; Figure 1 shows the photograph after the torsion resistance test; and the protrusion of the scribing wheel of Comparative Example 2 Figure 2 〇 is used to illustrate 杳#友| 1 just try the brothers and months of palladium case 2, comparative example i, and the conditions of the comparative example. < [Description of main component symbols] 1 scribing device 4 brittle material substrate 10 holding unit 20 scribing unit 30 head 154079.doc -26- 201210964 40 driving portion 50 scribing wheel 51 body portion 52 knife 52a blade tip 53 slot 54 protrusion 54a ridge line 60 imaging unit 90 control unit SL line K vertical crack
G 154079.doc -27-G 154079.doc -27-