TW201208147A - Optical element device and fabricating method thereof - Google Patents

Abstract

Disclosed are: an optical element device from which heat is easily dissipated and which can prevent short circuiting between electrodes; and a production method therefor. In one example, an optical element is disclosed which comprises: a substrate having an insulating layer traversing there-through and a plurality of zones which are spaced apart by the insulating layer and are electrically independent from each other; an optical element formed on the upper part of the substrate; an electrically conductive wire for electrically connecting the optical element and at least one zone on the substrate; and a protective layer which is formed on the upper part of the substrate in such a way as to enclose the optical element and electrically conductive wire on the inside.

Description

201208147 [0009] The present invention provides an optical element device capable of reducing the amount of loss of a phosphor by injecting a phosphor into a recess of a substrate. [0010] The present invention provides an optical element device that enhances the heat dissipation performance of the optical element and the phosphor by increasing the relative contact area of the optical element and the phosphor with the substrate. [0011] The present invention provides an optical component device that is easy to manufacture and has a manufacturing process by forming a groove on a substrate by mechanical and/or chemical treatment. [0012] The present invention forms a silver plating layer or plating on a substrate. The nickel/silver layer provides optical component insertion that enhances wire bonding and enhances light reflectivity. [0014] [Method for Solving the Problem] [0014] A method of manufacturing an optical element device manufactured according to the present invention includes: forming a module process for covering a module layer of an end surface and a lower end surface of a metal plate; After plating is exposed to a region outside the module layer, an insulating layer penetrating the metal plate is formed, and the a|barrier metal plate is an insulating layer process of a substrate having a plurality of regions separated by the insulating layer; The module layer is configured to expose the removal module layer of the substrate; the optical component mounting process for mounting the optical component to the upper end of the substrate; and the electronic bonding process of connecting the optical component or the substrate through the conductive wire; and the substrate The upper end forms a protective layer process for coating the optical element and the conductive line. The module layer process is characterized in that the mask solution is coated or glued to the upper end surface and the lower end surface of the substrate. 099138606 Form No. A0101 Page 4 of 82 1003064566-0 [0015] 201208147 [0016] [0018] [0019]

[0020] The above-mentioned insulating layer process is characterized in that an insulating layer of a double-concave shape is formed on the upper end surface and the lower end surface of the substrate. At the same time, the (4) material of the light material device according to the present invention includes: a metal plate process for synthesizing a metal plate by a plurality of metals (four); a process for forming an adhesive on the boundary surface of the metal plate; and the metal plates are mutually exchanged through the above-mentioned substrate a stacking process of stacking and bonding; cutting in a direction perpendicular to the surface of the metal plate to form a cutting process of a substrate having a plurality of regions separated by the foregoing substrate and insulated from each other; mounting the optical component to the substrate The upper end of the optical component is (four); the conductive element is connected to the first learning element or the aforementioned electronic connection (4) to form a cladding-fresh component de-energized layer process on the upper end of the substrate. Wherein, the above metal plate process can be anodized on the outer edge of the metal plate and the above-mentioned gold > 1 plate process can be permeable to sandblasting, chemical sealing, grinding, polishing, etc. Sewage. And the substrate in the above process can be a liquid adhesive or film. The optical component device manufactured by the present invention comprises: an insulating layer penetrating through the substrate; and a substrate having a plurality of regions insulated from each other by the insulating layer; a fresh component mounted on the upper end of the substrate; and the optical component or the substrate a conductive wire; and a protective layer on the upper end of the substrate, which internally covers the optical element and the conductive line. Wherein, at the upper end of any of the regions of the substrate, an electrode layer formed of a combination of one of gold, silver, copper, aluminum, nickel, and tungsten or one of the materials may be added. Form No. A0101 Page 5 of 82 1003064566-0 201208147 [0023] Further, the insulating layer of the above substrate may be formed by anodizing the inside of the substrate. [0024] Further, the insulating layer of the substrate may be in the shape of a double cone perpendicular to the substrate. Further, the insulating layer of the substrate may be formed of a subsequent agent or an insulating film formed between the regions of the substrate. Further, the contact surface between each of the regions of the substrate and the insulating layer may form a rough surface by one of sandblasting, chemical recording, polishing, and light removal. Further, the lower end surface of the optical element is adhered to a region on the substrate via a conductive adhesive. [0028] Further, a metal layer corresponding to each region of the substrate may be further added to the lower end of the substrate. Further, a fixing layer covering the insulating layer may be added to the upper end surface or the lower end of the substrate. [0030] Further, the above fixed layer can be obtained by polyphthalamide (Poly Phthal)

Further formed of Amid, PPA), epoxy resin, photosensitive interlayer adhesive or a mixture thereof [0031] Further, an upper end reflection layer corresponding to the above-mentioned fixed layer may be further added to the upper end of the substrate. [0032] Meanwhile, the optical element device manufactured according to the present invention comprises: a substrate having a groove; an optical element located at the groove of the substrate; a conductive line connecting the substrate and the optical element; and filling the groove of the substrate And 099138606 Form No. A0101 Page 6 / Total 82 Page 1003064566-0 201208147 [0033] [0035] [0038] [0038] [0038] The optical element covering the optical element and the conductive line described above. The substrate includes: a first surface having the first surface of the recess and a second surface opposite to the first surface; a first gold plating layer on the first surface of the conductive body; and a second surface on the conductive body The second gold plating layer. The recess includes a bottom surface on which the optical element is mounted, and an inclined surface inclined from the bottom surface to the first surface. The first gold plating layer may be formed by silver plating or nickel plating and silver plating. The second gold plating layer may be formed by electroplating by an alloy of gold, nickel, copper, tin or one of them. Further, on the outer side of the substrate recess, an insulating layer which partitions the substrate in two or more regions in the horizontal direction may be further added. The optical element is mounted on one of the side substrates centered on the insulating layer, and the other side substrate is coupled to the optical element through the conductive line. Further, the fluorescent layer is covered with a transparent sealing portion. The conductive wire extends to the outside of the groove, and the conductive wire extending to the outside of the groove is covered by the transparent sealing portion. The upper end of the transparent sealing portion has a convex shape. Further, an insulating region in which the substrate is separated by two or more regions in a horizontal direction can be further formed inside the substrate recess. The above conductive line is located inside the groove. The upper end of the above fluorescent layer is convex. Moreover, there are at least two optical elements in the substrate recess. Further, the substrate has at least two grooves. An insulating layer capable of electrically separating the substrate horizontally is formed outside each of the grooves. An insulating layer capable of electrically separating the substrate horizontally is formed inside each of the grooves 099138606 Form No. A0101 Page 7 of 82 1003064566-0 201208147 [0039] Further, a step is formed along the circumference of the substrate groove. At least one of the holes is formed in the above step. [0040] Further, at least one recess is formed in a bottom surface of the groove. A step is formed along the circumference of the groove of the above substrate. At least one of the cavities is formed in the above step. [Effects] [0042] The basic material of the optical element device manufactured according to the present invention is aluminum or aluminum alloy, so that the thermal energy generated by the optical element can be efficiently transmitted to the lower end of the substrate. Further, according to the optical element device manufactured by the present invention, by separating the substrate into a plurality of regions and vertically penetrating the insulating layer of the substrate, the first electrode layer and the second electrode layer at the upper end of each region can be prevented from being electrically connected. Further, the optical element device manufactured by the present invention can increase the luminous efficiency by concentrating the light source emitted from the optical element and outputting it. Further, the optical element device manufactured according to the present invention can form a concave groove on the substrate and inject a phosphor therein, thereby reducing the amount of consumption of the phosphor. Further, according to the optical element device manufactured by the present invention, by increasing the relative contact area between the optical element and the phosphor and the substrate, the heat dissipation performance of the optical element and the phosphor can be improved. Further, according to the optical element device manufactured by the present invention, grooves are formed on the substrate by mechanical and/or chemical processing, so that the production process can be simplified without requiring other structures. [0048] Moreover, the optical component device manufactured according to the present invention can form a mineral silver layer or a mineral nickel/silver layer through the substrate, and can strengthen the wire bonding and 099138606 Form No. A0101 Page 8 of 82 1003064566-0 201208147 [0049] [0051] [0053] [0053] 提升 Enhance light reflectivity. [Embodiment] In the technical field to which the present invention pertains, the present invention can be easily implemented by a person having ordinary knowledge, and will be described in detail below with reference to the correct example of the present invention. The following is a description of the construction of an optical component device manufactured according to an example of the present invention. Fig. 1 is a cross-sectional view showing an optical component device manufactured according to an embodiment of the present invention. 2 is a bottom view of a substrate used in an optical component device according to an embodiment of the present invention. Referring to FIG. 1 and FIG. 2, an optical component device (100) manufactured according to an example of the present invention includes a substrate (110) and a first electrode layer (120). ), a second electrode layer (130), a separator (140), an optical element (150), a conductive line (160), and a protective layer (170). The above substrate (110) is composed entirely of a plate formed in a single direction. The substrate (110) supports the optical element (150) and is connected to an external PCB or the like. [0055] The substrate (110) includes a first region (111) in the middle and a second region (112) and a third region (113) separated on both sides of the first region (111). The optical element (150) is formed at an upper end of the first region (111). Therefore, the thermal energy of the optical element (150) can be easily conducted to the lower side of the substrate (110) through the first region (111). Moreover, the first electrode layer (120) is at the upper end of the second region (112), the above-mentioned 099138606 form number Α0101, page 9 / total 82 page 1003064566-0 201208147 second electrode layer (130) in the third region (113) Upper end. Further, since the first region (Π1) to the third region (113) are formed of a metal, they have excellent thermal conductivity. The material of the first region (111) to the third region (113) is aluminum or alloy, and the thermal conductivity of aluminum and aluminum alloy is about 13 〇 to 25 Å κ], so that it has good thermal conductivity. Therefore, the first region (1Η) to the third region (113) described above can effectively conduct thermal energy of the optical element (15〇) mounted at the upper end thereof to the outside. Further, an insulating layer (114) is formed between the first region (ill) and the second region (112) and between the first region (πΐ) and the third region (113). Referring to Fig. 2, the insulating layer (114) is perpendicular to the substrate (110) and penetrates the substrate (no), and is juxtaposed between the first region (111) to the third region (113). Therefore, the above first region (U1) to third region (113) are insulated from each other. The insulating layer (114) may be formed by subjecting the above aluminum or aluminum alloy to an anode. That is, when the region on which the insulating layer (114) is formed on the upper end surface and the lower end surface is exposed, the insulating layer (114) can be formed by oxidizing aluminum or aluminum alloy. So, in the picture! The insulating layer (114) is a flat surface on both sides in the vertical direction. However, if the upper and lower surfaces of the substrate (110) are anodized at the same time, the insulating layer (114) is a double-sided recess. Cone (d〇uMe c〇ne) shape. The first electrode layer (120) is at an upper end of the second region (112) of the substrate (11 〇). The first electrode layer (12 〇) may have a double structure in which a lower electrode layer is formed over the second region (112) and an upper electrode layer is formed at the upper end of the lower electrode layer, although there is no special figure*. It is an electrode layer having only the lower electrode layer or the upper terminal (four). At this time, the first electrode layer (120) may be made of gold (Au), silver (Ag), copper (Cu), indium (Al), nickel 099138606, form number A0101, page / total 82 pages 1003064566-0 201208147 [ 0059] Ο [0060] 006 [0061] (Νΐ), a combination of cranes (7) or one of them. Further, it is effective to form the first electrode layer (120) by using light which is excellent in conductivity and capable of reflecting the optical element (5 〇), and further improving the luminous efficiency of silver (Ag). The second electrode layer (130) is disposed at an upper end of the third region (113) on the substrate (110). The second electrode layer (130) is symmetrical to the first electrode layer (12A) and has an opposite electrode to the first electrode layer (12A). For example, when the first electrode layer (12 〇) is connected to the positive electrode, the second electrode layer (130) is connected to the negative electrode. In the same manner as the first electrode layer (12A), the second electrode layer (130) should have a lower electrode layer and an upper electrode layer, or one of them. Since the second electrode layer 6130) is configured in the same manner as the first electrode layer (120), detailed description thereof will be omitted. The spacers (140) are formed on the upper ends of the first electrode layer (_) and the second electrode layer (130), respectively. The spacer (14A) is vertically protruded upward from the upper end faces of the first electrode layer (120) and the second electrode layer (130). The partition (140) is partitioned from a region where the protective layer (17 〇) can be formed. The above separator (140) may be formed of a photoreactive epoxy resin, a photosensitive adhesive (PSR) or a mixture thereof, and may be formed by using a silicone rubber depending on the case. The optical element (150) is located above the substrate (no). The optical element (150) is located at the upper end of the first region (iu) in the region of the substrate (11 〇). Further, the optical element (150) is fixed above the first region (111) through an adhesive (151). The optical element (150) emits light and can project light onto the substrate (110). The optical element (150) can be made up of a Light Emitting Diode (LED) 099138606 Form No. A0101 Page 11 of 82 1003064566-0 201208147. Further, the optical element (150) is connected to the electrode layer (120, 130) through the conductive line (160). Therefore, the power signal input through the substrate (110) can be transmitted to the optical element (150) through the electrode layers (120, 13A). [0064] The conductive wire (160) connects the electrode layers (12A, 13A) to the optical element (150), respectively. In order to maintain the high conductivity of the above conductive wires (16 turns), the above conductive wires (160) are usually formed of gold, copper or aluminum. When the conductive line (160) is formed, one end can form a ball bonding region at the optical element (15 〇), and the other end can form a ball-and-talk joint at the electrode layer (120, 130). 51:1汕1;)〇11 (11) area. Of course, one of the above conductive wires (160) may be formed on the electrode layer (120, 130) to form a ball joint region, and the other end may form a stitch joint region on the optical member (150). The protective layer (170) is located on the substrate (11〇) in a region partitioned by the spacer (140). Further, the main filling protective layer (17 〇) internally covers the optical element (150) and the conductive line (160). The above protective layer (Π0) protects the above optical element (15〇) and the conductive line (16〇) from external pressure. Further, the protective layer (170) may be made of an epoxy resin mixed with a general fluorescent substance type 099138606. The above-mentioned fluorescent substance can receive visible light or ultraviolet light generated by the above optical element (15 Å), and is converted into visible light after being stabilized. Therefore, the above-mentioned protective layer (17〇) formed of the working substance can convert the light generated from the above optical element (150) into red, green and blue (RGB) light or white light. Therefore, the optical component device (_) manufactured according to the example of the present invention can be used as a backlight module of a liquid crystal display panel (Liqiud Crystal Display Panel). Form No. A0101 Page 12 of 82 page 1003064566-0 201208147 (Back Light Unit, BLU ) to use. [0065] As described above, the optical element device (100) manufactured according to the example of the present invention is configured such that the substrate (110) is made of aluminum or aluminum alloy having good thermal conductivity, so that the heat generated by the optical element (150) can be effectively performed. Conducted to the lower end of the substrate (110). Moreover, the optical component device (100) manufactured according to the example of the present invention can divide the substrate (110) into the first region (111) to the third region (113) by the insulating layer (114) penetrating the substrate (110) vertically. The regions prevent the first electrode layer (120) and the second electrode layer (130) located at the upper ends of the second region (112) and the third region (113) from being electronically connected. The following is a description of the constitution of an optical element device fabricated in accordance with another example of the present invention. 3 is a cross-sectional view of an optical element device fabricated in accordance with another example of the present invention. In the present example, the same reference numerals are given to the parts having the same configuration or function as the previous example, and the differences from the previous example will be described below. As shown in FIG. 3, an optical element device (200) manufactured according to another example of the present invention includes a substrate (110), a first electrode layer (120), a second electrode layer (130), and an optical element (150). Conductive wire (160), protective layer (270) The protective layer (270) is formed on the upper end of the substrate (110), and covers the optical element (150) and the conductive wire (160). The protective layer (270) is on the upper end of the substrate (110) and has a curved outer shape. Even if the device has no barrier layer, the protective layer (280) can be formed by using a high-viscosity coating material or a metal molding method. That is, the above protective layer (270) does not have to be divided into its formation area through the form 099138606 Form No. A0101, Page 13 of the 1003064566-0 201208147. Therefore, the optical element device (200) of the present example can omit the spacer layer in manufacturing as compared with the previous example. That is, the optical component device (200) in this example can relatively shorten the process time and reduce the cost. The following is a description of the construction of an optical element device manufactured according to another example of the present invention. 4 is a cross-sectional view of an optical element device fabricated in accordance with another example of the present invention. [0072] As shown in FIG. 4, an optical element device (300) manufactured according to another example of the present invention includes a substrate (110), a first electrode layer (120), a second electrode layer (130), and an optical element (150). The conductive layer (160) and the protective layer (370) 007 [0073] The protective layer (370) is located at the upper end of the substrate (110) and covers the optical element (150) and the conductive line (160). Moreover, the protective layer (370) is perpendicular to the substrate (110), and its side and plane are approximately ninety degrees. The protective layer (280) does not need to be separated by a partition region, and after the epoxy resin mixed with the general fluorescent material is applied to the upper end of the substrate (110) and hardened, according to the substrate (110) The shape can be formed by cutting. Therefore, the optical element device (300) manufactured according to another example of the present invention has a simpler process than the foregoing example, so that the cost can be reduced and the manufacturing time can be shortened. The following is a description of the construction of an optical element device manufactured according to another example of the present invention. 5 is a cross-sectional view of an optical element device manufactured in accordance with another example of the present invention. 099138606 Form No. A0101 Page 14/82 Page 1003064566-0 201208147 [0078] [0079] [0080] As shown in FIG. 5, an optical element device manufactured according to another example of the present invention ( 400) comprising a substrate (410) 'second electrode layer (13 〇), optical element (450), spacer (140), conductive line (16 〇), protective layer (17 〇). The substrate (410) includes a first region (411) and a third region (ιι3) adjacent to the first region (411). The first zone (411) is a unidirectional plate. The upper end of the first region (411) is the above optical element (45 turns). The material of the first region (4ΐι) is aluminum or aluminum alloy, so that the thermal energy of the optical element (45〇) can be effectively conducted to the lower end. Further, the first region (411) is electronically coupled to the lower end mask of the optical element (450). Therefore, the first region (411) provides a path for transmitting a signal through the first electrode located at the lower end of the optical element (450). At this time, the first region (411) transmits the insulating layer (114) and the second region. (113) having independent currents, and the third region 13) is coupled to the second electrode of the optical element (45A) through the conductive line (160). The optical element (450) is fixed to the upper end of the substrate (410) via a conductive adhesive (451). The optical element (45 turns) is formed on the upper end of the first region (411) in the substrate (410). The optical element (45 turns) forms a first electrode such as a p-type through the lower end region, and a second electrode 'such as an N-type at the upper end. Further, the first electrode of the optical element (45 Å) is connected to the first region (411) of the substrate (410) through the conductive adhesive (451) at the lower end. The second electrode of the optical element (45A) is coupled to the second electrode layer (130) through the conductive line (160). Therefore, as described above, the optical component manufactured according to another example of the present invention is equipped with 099138606, Form No. A0101, Page 15 of 82, 1003064566-0 201208147. (400) The size of the device can be reduced because it can have only a single electrode layer. . The following is a description of the construction of an optical element device manufactured according to another example of the present invention. 6 is a cross-sectional view of an optical element device manufactured in accordance with another example of the present invention. As shown in FIG. 6, an optical element device (500) manufactured according to another example of the present invention includes a substrate (110), a first electrode layer (12A), a second electrode layer (130), and a separator (14). 〇) 'Lower substrate (540), lower fixed layer (545) 'Upper fixed layer (546) 'Optical element (15〇), conductive wire (160), protective layer (170) 6 - f. V::.. ......

[0084] The lower end substrate (540) is formed at a lower end of the substrate (no). The lower substrate (540) corresponds to the first region (111), the second region (112), and the second region (113) of the substrate (11) and is formed at a lower end thereof. When the optical element device <5〇〇 manufactured by another example of the present invention is connected to an external circuit such as a PCB, the lower end of the lower substrate (54〇) is joined by a solder ball to increase the substrate (1).丨〇) The bonding force with the solder ball....- (solder ball). Due to the buckle, the lower end substrate (5 4 0) can be formed using a copper material that is well bonded to the flux. [0085] The lower end fixing layer (545) is formed at a lower end of the substrate (11 〇). The lower fixing layer (545) corresponds to the lower end of the insulating layer (114), and extends to the peripheral region of the insulating layer (114) to be bonded to the lower substrate (540). That is, the lower end fixing layer (545) is bonded to the lower end substrate (54) in such a manner as to cover the insulating layer (114). Therefore, the lower fixing layer (545) can protect the insulating layer (114) which is less durable than the first region (iu), the second region (112), and the third region (113) from overpressure 099138606. Form No. A0101 Page 16 of 82 1003064566-0 201208147 [0086] [0088] 〇 [0089] Force. The lower fixing layer (545) may be made of poly Phthal Amid (PPA), epoxy resin, Photo Sensitive Paste or a mixture thereof. The upper fixed layer (546) is formed on the upper end of the substrate (110). The upper fixing layer (546) covers the insulating layer (114), and is bonded to the first region (111) and the electrode layers (120, 130) in a peripheral region of the insulating layer (114). Therefore, the upper fixing layer (546) is the same as the lower fixing layer (545), and the insulating layer (114) can be protected from excessive pressure. Moreover, the upper fixed layer (546) reflects the light emitted by the optical element (150) to the upper end of the substrate (110) to improve the light-emitting efficiency of the device. The material of the upper fixing layer (546) may be poly Phthal Amid (PPA), epoxy resin, Photo Sensitive Paste or a mixture thereof. The following is a description of the construction of an optical element device manufactured according to another example of the present invention. Figure 7 is a cross-sectional view showing an optical element device manufactured in accordance with another example of the present invention. As shown in FIG. 7, an optical element device (600) manufactured according to another example of the present invention includes a substrate (410), a second electrode layer (130), a spacer (140), a lower substrate (640), and a lower fixed layer ( 645), an upper fixed layer (646), an optical element (450), a conductive line (160), and a protective layer (170). The lower end substrate (640) corresponds to the first area (411) of the substrate (410) and Three districts (113). The lower substrate (640) may be formed of a copper material that is well bonded to the solder balls. At this time, the electronic signal under the optical element (450) can be transmitted through the lower substrate (640) located at the lower end of the first (099138606) form number A0101, page 17 / page 82, 1003064566-0 [0090] 201208147 area (411). . That is, the lower end substrate (640) can not only dissipate the thermal energy generated by the optical element (450), but also the path through which the electronic signal of the optical element (450) can be transmitted. [0091] The lower fixing layer (645) corresponds to the lower end of the insulating layer (114) and extends to a region around the insulating layer (114). The lower fixing layer (645) is bonded to the lower end substrate (640) in a state of covering the insulating layer (H4) to protect the insulating layer (114). Therefore, the above-mentioned lower end fixing layer (645) can protect the poorly-filled insulating layer (114) from external pressure. The above-mentioned lower end fixing 45) can be made by using Poly Phthal Amid (PPA) 'epoxy resin, photosensitive interlayer adhesive CPSR) or a mixture thereof. [0〇92] The upper fixed layer (646) corresponds to the upper end of the insulating layer (114) and extends to the area around the insulating layer (114). The shape of the upper end fixing layer (646) corresponds to the lower end field setting (a45). The upper fixing layer (646) and the lower fixing layer (645) simultaneously protect the insulating layer (114). Moreover, the upper fixed layer (646) reflects the light source generated by the optical element (150) to improve light efficiency. The above upper fixing layer (gw) may be made of poly Phthal Amid (ppA), epoxy resin "photosensitive interlayer adhesive (PSR) or a mixture thereof. [0093] The following is a description of the construction of an optical element device manufactured according to another example of the present invention. [0095] FIG. 8 is a cross-sectional view of an optical component device manufactured according to another example of the present invention. As shown in FIG. 8, an optical component device 1003064566-0 manufactured according to another embodiment of the present invention is shown in FIG. Pages / 82 pages 201208147 (700) comprising a substrate (410), a first electrode layer (720), a second electrode layer (130), a separator (140), a lower substrate (640), a lower fixed layer (645), The upper fixed layer (646), the optical element (150), the conductive line (160), and the protective layer (170). The first electrode layer (720) is formed on the first region (411) of the substrate (410). The first electrode layer (720) passes through the insulating layer (114) and the second electrode layer (130) independently of each other in current. The upper end of the first electrode layer (720) is fixed to the optical element (150) through an adhesive (ι 51). And the above-mentioned first electrode layer (72()) 3⁄4 over-conducting wire (16〇) is connected to the above-mentioned optical element (150). [0〇97] The following is an optical element device structure manufactured according to another example of the present invention. Description. l - bird slowing down? [0098] FIG. 9 is a cross-sectional view of an optical elemental device manufactured according to another example of the present invention. [0099] As shown in FIG. 9, an optical element device manufactured according to another example of the present invention ( 800) comprising a substrate (410), a separator (14 〇), a lower substrate (640), a Q lower fixing layer (645), an upper fixing layer (846), an optical element (150), a conductive wire (860), a protective layer (170). [0100] The upper end fixing layer (846) is formed on an upper end of the substrate (410). The upper fixing layer (846) corresponds to the above insulating layer (114). That is, the upper fixing layer (846) covers the upper end of the insulating layer (114), and simultaneously protects the insulating layer (114) from external pressure with the lower fixing layer (645). Moreover, the upper fixed layer (846) reflects the light source illuminating efficiency of the light source generated by the optical element (150). Since the upper end of the substrate (41 〇) has no other electrode layers, the upper fixed layer (846) is directly connected to the above-mentioned 1003064566-0 099138606 form number Α0101 page 19/82 page 201208147 substrate (410). [0101] The optical element (15 0) is fixed by the adhesive (151) in the first region (411) of the substrate (410) not covered by the upper fixing layer (846). Further, the optical element (150) may be coupled to the first region (411) and the third region (113) of the substrate (410) not covered by the upper fixed layer (846) through the conductive line (860). [0102] The conductive wire (860) connects the optical element (150) and the substrate (410). The above conductive wire (860) should be formed of aluminum. When the substrate (410) is also made of the same aluminum material, since the conductive wire (86〇) and the substrate (410) can be effectively joined, the substrate can be easily connected to the substrate without an additional electrode layer ( 410) Combination. Therefore, when the conductive wire (860) and the substrate (410) are made of aluminum or the same material, it is not necessary to form an additional electrode layer, so that the manufacturing cost and time can be reduced. [0103] The following is a description of the construction of an optical element device manufactured according to another example of the present invention: 0.

1 is a cross-sectional view of an optical element device manufactured according to another example of the present invention. [0105] As shown in FIG. 10, an optical element device (900) manufactured according to another example of the present invention includes a substrate (410), First electrode layer (12 〇), second electrode layer (130), separator (140), lower end substrate (64 〇), lower end fixing layer (645), upper end fixing layer (646), upper end reflecting layer (947) , optical element (150), conductive wire (160), protective layer (17〇). [0106] The upper end reflection layer (947) is formed on the upper end of the substrate (41 〇). The upper end of the upper reflective layer (947) does not require an additional insulating layer. Unlike 099138606 Form No. A0101 Page 20 of 82 1003064566-0 201208147 [0107] [0108]

[0109] The upper fixed layer (646) is required to correspond to the upper end of the insulating layer (114), and the upper reflective layer (947) needs to reflect the light source generated by the optical element (150). Further, since the upper end reflection layer (947) and the upper end fixing layer (646) are symmetrical to each other, the light reflectance can be improved, so that the luminous efficiency of the device can be improved. The following is a description of the manufacturing method of the optical element device according to the example of the present invention. Fig. 11 is a flow chart for explaining a method of fabricating an optical element device in an example of the present invention. 12a to 12h are schematic views showing a method of fabricating an optical element device according to an example of the present invention. As shown in FIG. 11, the manufacturing method of the optical component device (100) according to the example of the present invention includes: a module layer process (S1), an insulation layer process (S2), a module removal process (S3), and a sealing process (S4). ), electrode layer process (S5), separator process (S6), optical component mounting process (S7), electronic bonding process (S8), and protective layer process (S9). The respective processes of Fig. 11 will be described below with reference to Figs. 12a to 12h. Referring to Figures 11 and 12a, the module layer process (S1) refers to a process of forming a module layer (10) on the upper end surface and the lower end surface of the metal plate (110'). The above metal plate (110') is formed of Shao or Ming alloy. Moreover, the module layer (10) can be formed by exposing, developing or sticking the mask film after applying the mask liquid. Referring to Figures 11 and 12b, the insulating layer process (S2) refers to a process in which an area not covered by the module layer (10) is subjected to anodizing treatment to form an insulating layer (114). The insulating layer (114) vertically penetrates the above-mentioned 099138606 Form No. A0101 Page 21 / Total 82 Page 1003064566-0 [0111] 201208147 The metal plate (110') is one side thicker and extends the long side of the metal plate (110,) The direction is formed. The insulating layer (H4) partitions the metal plate (u) from the first region (111) to the third region (113) to have the first region (111) to the third region (113) and The substrate (11 〇) of the insulating layer (114). Further, in the drawing, the two sides of the insulating layer (114) in the vertical direction are flat sides, but after the anode surface is treated on the upper end surface and the lower end surface of the metal plate (Π0,), the insulating layer (114) may be The center of the side is inwardly recessed in the shape of a double cone. Referring to FIGS. 11 and 12c, the removal module layering (S3) refers to an iron process in which the module layer (1 〇 ) is separated from the substrate (I I 〇 ). The module layer (ίο) can be removed by an ashing process when the mask liquid is formed, and can be removed from the substrate (11〇) when the film is formed. [0113] Referring to FIG. 11 The above sealing process (S4) means that the micropores inside the insulating layer (n) formed in the above insulating layer process (S3) are filled with a mixture of BCB (Benzocyclobuten), insulating organic mash "distilled water" or one of them. The process of filling the hole is described as the process of filling the hole. The process is because the above-mentioned insulating film (114) is easily damaged by external pressure, so the above-mentioned insulating layer can be improved by filling the most vulnerable pores with the above substances ( 114) Mechanical strength and improved insulation performance. [0114] When the pores are sealed by BCB or an insulating organic substance, a heat hardening process for hardening at a certain temperature may be further added. [0115] After the process (S4), a polishing process for removing impurities (burr or scratch) formed on the surface of the substrate (110) may be added. And 099138606 Form No. A0101 Page 22 of 82 1003064566-0 201208147 [0116] Ο [ 0117] Ο [0118] Through the above-mentioned polishing process, the light source generated by the optical element mounted on the first region (111) of the substrate (110) can be effectively reflected, thereby improving the light efficiency. The polishing process is generally performed by buff polishing. 11 and 12d, the electrode layer process (S5) means that a first electrode layer (120) is formed on an upper end of the second region (112) of the substrate (no), and a second electrode is formed on an upper end of the second region (113). The first electrode layer (12〇) and the second electrode layer (130) may be a single layer or a double layer, and the first electrode layer (12〇) and the second electrode layer. (13〇) may be formed of gold, silver, steel, aluminum, nickel, tungsten or an alloy thereof which is excellent in electrical conductivity and is highly viscous. At this time, the first electrode layer (12 〇) and the second electrode layer (130) It is formed by one of the methods of electroless ore, electric key, adhesive, spray (Plazma arch spray, cold spray (c〇ld spray)) or a combination thereof. For example, a post-process When the material of the conductive wire used is gold (Au), the first electrode layer (120) and the second electrode (13〇) can be formed by using silver (Ag) which is excellent in conductivity and can effectively reflect the light of the optical element, and if the material of the conductive line is ig(A1), even if the first electrode layer (120) is not provided The second electrode layer (13〇), the aluminum conductive wire can also be effectively bonded to the substrate (110). When the electrode layer is formed by electroless plating or electroplating, it is formed in the region of the substrate (110). The first electrode layer (120) and the second electrode layer (130)' may be additionally subjected to a masking process. Further, when the above-described spraying method is used, the first electrode layer (12 〇) and the 099138606 can be selectively formed on the region of the substrate (110) using a mask. Form No. A0101 Page 23 / Total 82 Page 1003064566 -0 [0119] 201208147 Two electrode layer (130). Referring to FIG. 11 and FIG. 2e, the spacer process (S6) refers to a process of forming the spacer (140) at the upper end of the electrode layer (120, 130). The spacers (140) are each perpendicular and protrude from the upper ends of the electrode layers (12, 130). The above-mentioned separator (140) can be formed by screen printing or mold molding, and the material can be Poly Phthal Amid (PPA), epoxy resin, and photosensitive. A barrier glue (PSR) or a mixture thereof or silicone. Referring to Figures 11 and 12f, the above-described Anhan optical component process refers to a process of mounting an optical component (150) on the upper end of the base (110). As described above, the optical element (15A) may be a light emitting diode (LED). The optical element (150) is adhered to the upper end of the first region (111) of the substrate (110) through an adhesive (151) on the lower end surface. Referring to Fig. 11 and Fig. 12g, the electronic connection process (S8) refers to a process of connecting the electrode layer (! 2 〇 v) 3 〇 to the optical element (150) by a conductive wire (160). The external signal of the bonding layer (12〇, 13〇) can be transmitted to the optical element (150) through the conductive line (WO) to control the operation of the optical element (15〇). Referring to FIG. 11 and FIG. 12h, the above protection The layer process (39) refers to a process of applying a fluorescent substance in a region defined by the separator (1 40) to form a protective layer (17 〇). The protective layer (17 〇) is formed on the substrate (11 〇) The upper end is covered with the optical element (15 〇) and the conductive line (16 〇). The protective layer (170) protects the optical element (15 〇) from external impact. The protective layer (170) can also use the above optical layer. Light source conversion by element (15〇) 099138606 Form No. A0101 Page 24/82 Page 1003064566-0 201208147 [0124] [0126] Ο [0127] Ο is white light. The following describes another example of the present invention. Method of fabricating an optical component device. Figure 13 is a diagram illustrating another embodiment of the present invention. A flow chart of a method for fabricating an optical component device of the example. Fig. 14aui4e is a schematic view illustrating a method of fabricating an optical component device according to another embodiment of the present invention. Referring to Fig. 13, a method of fabricating an optical component device according to another example of the present invention includes Sheet metal process (S1), adhesive process (S2), stack process (S3), cutting process (S4), electrode layer process (S5), separator process (S6), optical component maintenance (S7) ), electronic connection cracking (S8), protective layer process (S9). The following is a description of each process in Figure 3, please refer to Figure 14a to Figure 14e, referring to Figure 13 and Figure 14a, the above metal plate process (si) Refers to the process of forming three plate-shaped metal plates (111, 112, 113'). In the case of FIG. 14a, three metal plates (111, 112, 113) are taken as an example, but the metal plates are used. The quantity is not limited to this, that is, the number of metal plates can be increased or decreased according to the required substrate area. The material of the above metal plates (111, 112', 113,) can be aluminum, aluminum alloy, copper, copper. Alloy, and to improve the above metal plates (111', 112, 113,) The adhesion between the agents and the insulation and voltage resistance between the metal plates (111', 112', 113') can be anodized in advance on the surface of the metal plates (111, 112, 113). In addition, in order to improve the adhesion between the metal plate (111, 112, '113') and the adhesive, the boundary surface of the metal plate may be sandblasted, chemically etched, ground or polished to have a surface roughness. . The metal plates (1U, 112', 113') are arranged side by side in the vertical direction to form each of the desired substrates. 099138606 Form No. A0101 Page 25 / Total 82 Page 1003064566-0 201208147 Area. Referring to FIGS. 13 and 14b, the above-described adhesive process (S2) refers to forming an adhesive on a boundary surface between the above-mentioned metal plates (111, 112' '113') ( 114) The production process. The above-mentioned adhesive (114') bonds the metal plates (111, 112, 113,) to each other, and insulates the metal plates (m', 112', 113') from the other metal plates. The above adhesive (114) may be a film of a liquid adhesive or a sheet. The above-mentioned adhesive agent (114) is an insulating layer of the substrate in the subsequent process. Referring to Fig. 13 and Fig. 14c, the stacking process (S3) of Ji refers to a process of stacking the metal plates (m, 丨丨2, 丨13) by using the above-mentioned adhesive (114) as a medium. Namely, an adhesive (114) is formed between the above metal plates (ln, 112, 11 3') to bond the metal plates (111, 112, 113') to each other and to each other. Referring to Figures 13, 14d and 14e, the above-mentioned cutting process (S4) refers to cutting the above-mentioned metal plates (111, 112, 1:13) through the stack of adhesives (1丨4,) in a vertical direction. ..) The process of making a salty table '(.11 〇). The process will cause the metal plate (111, 1, 2, 113') to form the first region (111), the second region (112) and the third region (113) of the substrate (110), and the above adhesive (114) An insulating layer (114) of the substrate (ho). Therefore, the horizontal direction spacing during cutting is the final thickness of the substrate (110) in the vertical direction. Further, after the above-described cutting process (S4), a polishing process capable of removing impurities (burr and scratch) to more effectively reflect the light source of the optical element can be added. After that, the electrode layer process (S5) and the separator process (S6) 'optical component security 099138606 form number A0101 page 26 / total 82 pages 1003064566-0 201208147 process (S7), electronic connection process (S8) and protective layer The optical component device (100) according to another example of the present invention can be fabricated by the process (S9). However, since the electrode layer process (S5), the spacer process (S6), the optical component mounting process (S7), the electron bonding process (S8), and the protective layer process (S9) are the same as the foregoing examples, the above processes are omitted. Detailed description. [0132] An optical element device fabricated in accordance with another example of the present invention is described below. 15a, 15b and 15c are a cross-sectional view of an optical element device and a plan view of a strip substrate according to another example of the present invention. [0134] As shown in FIG. 15a, an optical element device (1101) fabricated according to another example of the present invention includes a substrate (1110), an optical element (112〇';), a conductive line (1130), and a phosphor (1140). ). Further, the present invention may further comprise a sealing portion (115 〇) at the upper end of the phosphor (1140). [0135] The substrate (111A) includes a conductor (1111) having a groove (1111a) of a certain size, a first gold plating layer (1112), and a second gold plating layer (1113). The conductor (1111) has a Q-th side (111 ld) of a groove (1111a) of a certain size and a first face (lllle) which is opposite to the first face (lllld) and whose surface is flat. Further, the substrate (mo) further includes an insulating layer (1114) which is located outside the groove (1111a) and which is divided into two or more regions in the horizontal direction. Through the partition of the insulating layer (114), the substrate (111〇) has at least two regions insulated from each other in the horizontal direction. Among them, the conventional substrates are generally separated from each other by the insulating layer in the vertical direction, instead of the horizontal direction. [0136] The above-mentioned electric conductor (11Π) can utilize the metal plate with superior electrical and thermal conductivity properties 1003064566- 099138606 Form No. A0101 Page 27 of 82 pages 201208147 formed. For example, the above-mentioned conductor (1 1 1 1 ) may be formed of aluminum, an aluminum alloy, copper, a copper alloy, iron, an iron alloy or the like, but the present invention is not limited to the above materials. At the same time, the above-mentioned electric conductor (11U) can not only efficiently transmit an electronic signal to the optical element (1120), but also can easily and quickly discharge the thermal energy generated by the optical element (1120) to the outside of the apparatus. The groove (111 la) of a certain size includes a bottom surface (1111b) on which the optical element (1120) is mounted, and an inclined surface (iiiic) inclined from the bottom surface (iiiib) toward the first surface (111d). Therefore, the shape of the groove (1111a) is approximately bowl-shaped, facilitating the filling of the phosphor (114〇) to the inside of the above-mentioned groove (111 la). That is, although the substrate (1110) does not have a dam of a certain thickness, the phosphor (1'1.40) can be easily loaded into a predetermined space. [0137] The first gold plating layer (1112) is formed with a certain thickness according to the groove (1 iiia) and the first surface (11 lid). At this time, the first gold plating layer (1112) may be formed by silver plating, or may be formed by plating nickel and then silver plating. However, the present invention is not limited by the above materials, and other materials may be used to form the keys. The above-mentioned silver material not only has good solderability with the conductive wire (113〇), but also effectively reflects the light source of the optical element (112〇) and the phosphor (1140). Moreover, when the first gold plating layer (1112) is mirror-finished, the above reflectance can be more effectively improved, and the optical element device (1101) manufactured according to the example of the present invention has more excellent luminous efficiency. The first gold plating layer (1112) is further divided into two regions insulated from each other according to the insulating layer (1114). The second gold plating layer (1113) is formed to have a certain thickness along the second surface (lllle). The second gold plating layer (1113) can be formed by electroplating gold, nickel, copper 099138606 Form No. A0101, page 28, page 82, 1003064566-0 [0138] 201208147, tin or its alloy or its equivalent. However, the present invention is not limited to the above materials, and may be formed by electroplating using other materials. Further, since the above-mentioned fluxes such as gold, nickel, copper, and tin have good solderability, the optical component device (1101) manufactured according to another example of the present invention can be improved. The second gold layer (11 13) is further divided into two regions insulated from each other according to the insulating layer (1114). [0139] The insulating layer (1114) which divides the above substrate (1110) into two regions insulated from each other in the horizontal direction may be a general insulating sheet, p〇ly Imide (PI) ' Benzo Cyclo Butene (BCB) ' Poly Benz

The equivalents of Oxazole (PBO), Bismaleimide Triazine (BT), phenolicresin, epoxy, and Silicone are formed, but the present invention is not limited by the material of the above insulating layer (1114). Further, when the substrate (1110) is made of Ming or Ming alloy, the material of the insulating layer (1114) may be an aluminum anode treated film formed by anodizing aluminum. [0140] The above optical element (1120) is located on the bottom surface (1U lb) of the groove (1111a) of the substrate (111〇). When the lower end of the optical element (1120) has an electrical contact, the optical element (1120) is electrically connected to the bottom surface (11 lib) of the recess (11 iia) via a conductive adhesive (1121). That is, the optical element (1120) is electrically connected to the first gold plating layer (1112) on the bottom surface (1111b) of the recess (1111a) via the conductive adhesive (1121). Wherein, the conductive adhesive (1121) may be a eutectic solder: a high melting solder (High Lead solder: Sn95Pb), a lead-free solder (lead-free solder: SnAg, a SnAu 'SnCu' nZn). , 099138606 Form No. A0101 Page 29 / Total 82 Page 1003064566-0 201208147

The SnZnBi, SnAgCu, SnAgBi, etc. are formed, and the material of the above-mentioned conductive adhesive (1121) is not limited in the present invention. Further, the optical element (1120) may be a general light emitting diode (LED), and the type of the optical element (112A) is not limited in the present invention. The conductive line (1130) electrically connects the substrate (111〇) and the optical element (11 2 0) to each other. For example, one end of the conductive line (11 3 〇) is connected to the optical element (1120) by ball bonding, and the other end is connected to the first gold plating layer of the substrate (1110) by stitch bonding. (1112). Of course, it can also be connected in the opposite way. The optical element (112〇) is electrically connected to the substrate (1110) formed on the right side of the insulating layer (1114) through the conductive adhesive (1121) at the lower end; the optical element (1120) The upper end is connected to the substrate (111〇) on the side through the conductive line (1130) and the center of the insulating layer (1114). Because .. &quot;:;:;:·: : ... :..., the above-mentioned optical component (1120) can supply the power of different polarities through the right substrate (1110) and the left Russian substrate (111〇). The optical element (1120) can in turn be driven. Further, since the above-mentioned conductive line (113 〇) has to extend from the above-mentioned optical element (1120) to the left side substrate (11 〇), it can extend to the outside of the above-mentioned groove (1111a). Therefore, as will also be explained below, when the phosphor (1140) is formed only inside the recess (1U1a), the above-mentioned conductive line (11 30) will extend to the outside of the above-mentioned phosphor (114 〇). Meanwhile, the above-mentioned conductive wire (1130) may be a general gold wire, an aluminum wire, a copper wire or an equivalent of the above materials. The material is not limited herein. [0142] The above-mentioned phosphor (11 40) is filled in the above-mentioned groove 099138606, the form number A0101, page 30 / page 82, 1003064566-0 201208147 Ο [0143] ❹ (1111a) 'and completely covers the above The optical element (Π20) covers only a portion of the above-mentioned conductive line (1130). That is, the glare body (1140) completely covers the bottom surface (1111|:) of the groove (11118), the inclined surface (1111c), and the surface of the optical element (1120), but covers only the conductive line (1130). partial area. At this time, since the phosphor (114 0 ) is only filled inside the recess (1111 a ), the present invention can minimize the usage of the phosphor (1140), that is, if the phosphor (1140) The amount of use of the phosphor (n4〇) will be greatly increased not only by covering the upper end region of the substrate (1110) covering the groove (iina) at the same time. The phosphor (H40) can be absorbed from the optical charge (112〇) to emit light of a specific wavelength of .... &quot; and converted into light of other wavelengths. Therefore, an optical element device (Π01) having a desired color can be easily produced by properly selecting the type of the above-mentioned phosphor (1140). The sealing portion (1150) is formed at an upper end of the phosphor (114) and the substrate (1110). That is, the sealing portion|(115〇) is formed not only on the upper end of the phosphor (1140) but also on the upper end of the first gold plating layer (1112) and the insulating layer (1114). Further, the sealing portion (115 〇) covers not only the phosphor (1140) but also a conductive line (113 穿透) extending outward through the phosphor (114 〇). Therefore, it is possible to protect the conductive wire (1130) from the outside through the above-mentioned sealing portion (115〇). In order to allow the light emitted by the optical element (1120) and the phosphor (H40) to be output to the outside without changing its properties, the material of the sealing portion (11 5 〇) can be transparent. A light resin such as a silicone resin, an epoxy resin or the like. However, the present invention does not limit the material of the above-mentioned sealing portion (115). As described above, the above-mentioned sealing portion (115〇) can be protected not only from the outside. 099138606 Form No. A0101 Page 31/82 Page 1003064566-0 201208147 The above-mentioned conductive wire (1130) can also protect the above-mentioned phosphor (114〇). . Further, as shown in Fig. 15b, the upper end of the sealing member (1150) of the optical element device (1102) manufactured according to the example of the present invention may have an upwardly convex shape (1151). Thus, the optical element device fabricated according to another example of the present invention can condense the light generated by the optical element (1120) and the phosphor (1140) and then output the light to the outside. Of course, the sealing portion (115 〇) may be a concave shape in addition to the shape (11 51 ) protruding toward the upper end. [0145] Moreover, as shown in FIG. 1c, the substrate used in the present invention may be a strip-shaped plate. That is, the groove (111 la ) on the plate is in the form of a matrix having rows and columns, and the insulating layer (1114) is linear. Such a strip substrate (i u 0_s) can mass produce a large number of optical component devices at a low price. Moreover, after the production process is completed, the strip substrate (1110-S) can be sawed according to the vertical dotted line of Fig. 1. Further, although not shown in the drawing, the above strip substrate (1110) -S) After the production process is completed, the longitudinal and lateral cutting can be simultaneously performed to form an optical component device having only a single groove (1.111a) and a single optical element (1120). [0146] As described above, The optical element device (11〇1, 1102) manufactured according to another example of the present invention, through the substrate (1110), forms a groove (mia), and the light emitted by the optical element (1120) is concentrated in a certain area, and then the light is output. Therefore, the luminous efficiency can be improved. [0147] Further, an optical element device (11〇ι, 1102) manufactured according to another example of the present invention is filled with a phosphor (114〇) on a substrate (111〇). The groove (1111a)' can reduce the consumption of the phosphor (114〇). [0148] Further, an optical element device manufactured according to another example of the present invention (11〇1, 099138606, Form No. A0101, page 32/total 82 pages 1003064566-0 201208147 [0149] [0150] [0151] [0152] ❹ [0153] 1102), through The relative contact area between the optical element (112〇) and the phosphor (114〇) and the substrate (11 ίο) allows the thermal energy generated by the optical element (112〇) and the phosphor (1140) to pass through the substrate (111〇) And the optical component device (Η1, 1102) manufactured according to another example of the present invention can improve the soldering of the bonding wire because an additional gold plating layer is formed on the substrate (ι 11〇). Fig. 16a, Fig. 16b and Fig. 16c are a cross-sectional view of an optical element device and a plan view of a strip substrate manufactured according to another example of the present invention. The optical element device (1201) manufactured by another example of the present invention is similar to the optical element device (11〇1) of Fig. 15a. Therefore, only the differences will be described below. As shown in Fig. 16a, another example according to the present invention The manufactured optical component device (1201) has an insulating layer (1214) located inside the recess (11113) of the substrate (1210) instead of the outer side 9 of the recess (11113), that is, the insulating layer (1214) distinguishes the substrate in the horizontal direction. (12ι〇), and the insulating layer (丨214) is not formed in the groove (111 The outer side of 1a) is formed inside the groove (1) ua). More specifically, since the insulating layer (1214) vertically penetrates from the bottom surface (1111b) of the recess (in ia) to the second surface (lllle) of the substrate (12 )), the substrates (1210) have each other in the horizontal direction. Independent current. Further, since the insulating layer (1214) is formed inside the recess (ima), the conductive wire (12 3 0) does not need to be soldered to the outside of the recess (11 U a ). That is, the conductive wire (1230) can be welded to the inside of the recess (ni la). Therefore, one end of the conductive wire (1230) is bonded to the optical element (112〇), and the other end is joined to 099138606. Form No. A0101 Page 33 / Total 82 Page 1003064566-0 201208147 The first gold plating layer located inside the groove (1111a) ( 1112). Therefore, the conductive line (1230) is also formed inside the groove (1111a), so that part of the conductive line (1230) does not need to extend to the phosphor ( 1140) Outside. Thus, the optical element device (丨2 〇丨) manufactured according to another example of the present invention can have a smaller volume. At the same time, since the conductive wire (123〇) does not extend to the outside of the phosphor (1140), it is not necessary to form the sealing portion (115〇). Therefore, the optical element device (丨2 制造) manufactured according to another example of the present invention can not only reduce the material cost but also reduce the thickness of the device. Further, as shown in Fig. 16b, the phosphor (1240) of the optical element device (1202) manufactured according to another example of the present invention may have an upwardly convex shape (1241). Thus, the optical element device (1 202) manufactured according to another example of the present invention can concentrate the light generated by the optical element (112 〇) and the phosphor (124 汇) in a certain area and then transfer it to the outside. Of course, conversely, the phosphor is in the shape of a concave at the upper end. Further, as shown in Fig. 16c, the substrate used in the present invention may be in the form of a strip. That is, the groove (1111a) on the plate is in the form of a row and a row, and the insulating layer (1214) is linear. Such a strip substrate (121〇_s) can mass produce a large-sized optical element device at a low price. Moreover, the strip substrate (111〇_s) can be cut according to the vertical dotted line of the figure after the production granulation is completed. Moreover, although not shown in the drawing, the above-mentioned strip substrate (121〇- illusion is completed after the production process, 1 simultaneous longitudinal and lateral cutting to make only a single groove (1111a) and single-optical Optical element device 099138606 of the component (112〇) Form No. A0101 Page 34/82 Page 1003064566-0 201208147 [0157] FIGS. 17a and 17b are optical element devices manufactured according to another example of the present invention [0158] Schematic of the method. As shown in Fig. 17a, the substrate (1110) is ground by a grinder (1 300) having a bottom surface (1301) and an expansion surface (1302), and a substantially circular or elliptical shape is formed thereon. a groove (1111a), that is, a substrate (1110) formed by insulating layers (1114) with horizontally insulated regions, and a substrate (1110) polished by a grinder (1300) to form a groove having a certain depth (1111a), wherein the bottom surface (1301) of the grinder (1 300) corresponds to the bottom surface (11 lib) of the groove (1111a), and the expansion surface (1 3 0 2) of the grinder (1 300) corresponds to the groove (1 3 0 2) 111 1 a) inclined surface (1 111 c). [0159] For example, the above grinding machine (1 300) It can be a super-hard diamond tool with a bottom surface (1301) and an expansion surface (1302). The super-hard diamond tool has higher strength and hardness than the general processed material (such as aluminum or aluminum alloy), and can be easily processed for materials. The deformation is less and the correct shape is machined, and the long life of the super-hard diamond tool can prolong the tool exchange period to improve the production performance. [0160] 凹槽 As shown in Fig. 17b, the groove can also be formed by wet etching The wet etching method can form a groove by exposing a region where the groove is to be formed to the etching solution after the film covers the region other than the groove, wherein the film is not etched when used. The solution generates a reaction material, and the solution used in the above wet etching is a solution capable of etching aluminum or aluminum alloy, and the etching rate can be accurately controlled by maintaining the etching solution at a certain temperature. [0161] Meanwhile, as shown in FIG. 17b, The grooves can also be formed by dry etching. The dry etching can be performed by dry etching equipment, and the mixed gas or plazma is injected under vacuum to form a groove. 099138606 Form No. A0101 Page 35 of 82 1003064566-0 201208147 Covering other areas than the groove with a protective film. [0162] Further, in the embodiment of the present invention, only the above-mentioned wet etching method or dry etching method is used. It is difficult to form a groove, so it can be formed by using the two methods at the same time. [0163] Moreover, the surface of the groove formed by wet etching or dry etching is rather irregular, so that after the above process, the concave can be adjusted by machining. Roughness of the groove surface: roughness. 18a, 18b, 18c, and 18d are enlarged cross-sectional views showing a partial cross-sectional view of a portion of a substrate and an optical element device manufactured according to another embodiment of the present invention. [0165] The optical element device (14〇1) in FIG. 18a is similar to the optical element device (1201) of FIG. 16a; the optical element device (u〇2) in FIG. 18b and the optical element device in FIG. i6b (12 〇2) )similar. Therefore, only the differences will be explained below. [0166] As shown in FIG. 18a, an optical component device (1401) manufactured according to another embodiment of the present invention can mount a plurality of optical components (1120) on a substrate (141). At the same time, the conductive line (1430) can electronically connect the optical element (1120) to the substrate (1410) or form an electrical connection between the optical elements (1120). Further, a phosphor (144 Å) is filled in the above-mentioned groove (111 la) to cover a plurality of optical elements (1丨2〇) and a plurality of conductive lines (1430). [〇167] Thus, the optical element device (1401) manufactured according to another example of the present invention can improve the light output efficiency due to the fact that a plurality of optical elements (112 turns) are provided on the military one groove (lllla). 099138606 Form No. A0101 Page 36 / Total 82 Page 1003064566-0 201208147 [0170] [0170] [0171] [0174] As shown in FIG. 18b, another example according to the present invention The optical component device (1402) manufactured has a shape in which the working body (1440) is convex toward the upper end (丨441). Thus, the optical element device (14〇2) manufactured according to another example of the present invention can concentrate the light generated by the optical element (1120) and the phosphor (1440) to a certain area and then output to the outside. On the contrary, the above phosphor (144 〇) may have a shape in which the upper end is recessed. Further, as shown in Fig. 18c, the plane shape of the groove (in ia) is substantially elliptical. Further, the insulating layer (1414) is in the shape of a straight line crossing the above-mentioned groove (mia). Further, a plurality of light elements (112 〇) are located on the inner side 6 of the above-mentioned groove (1111 a ) and, as shown in Fig. 18d, the plane shape of the groove (lllla,) is substantially quadrangular. Of course, the insulating layer (1414) ,) is a linear shape that traverses the groove (lllla,), and a plurality of optical elements (112〇') are located inside the groove (1111a'). Further, the planar shape of the groove is only one example. In addition, various shapes such as a triangle, a square, a pentagon, a hexagon, and the like may be used, and the planar shape of the groove is not limited in the present invention. FIGS. 19a, 19b, and 19c are another example according to the present invention. A cross-sectional view of the manufactured optical component device. The optical component device (1501) of Figure 19a is similar to the optical component device (1101) of Figure 15a; the optical component device (15〇2) of Figure 19b and the optical component device of Figure 16a (1201) The following is only a description of the difference. 099138606 Form bat number A0101 Page 37 / Total 82 page 1003064566-0 201208147 [0175] As shown in FIG. 19a, an optical element device manufactured according to another embodiment of the present invention (1 501 ) The substrate (1 51 〇a) has a plurality of grooves (1111a) spaced apart at a certain interval, and each of the grooves (illla) has an optical element (112〇). Moreover, each groove (1111a) has an outer side The substrate (151〇a) is divided into insulating layers (1514a) of different regions insulated from each other in the horizontal direction, and each optical element (1120) is connectable to the adjacent substrate (1510a) through the conductive line (113〇). The sealing portion (115〇) covers all the phosphors (1140) and the conductive wires (113〇) extending through the phosphor precursor to the outside. The transparent sealing portion (the above-mentioned transparent sealing portion is not shown in the drawing) The area corresponding to the optical element (11 20) may be a shape that protrudes toward the upper end. [0176] Thus, the substrate of the optical element device (15〇1) manufactured according to another example of the present invention ( 510a) has a plurality of grooves (11Ua) and a plurality of optical elements (1120). Therefore, another example of the present invention can provide a large-area optical element device (1501). [0177] As shown in FIG. 19b, The substrate ('1'51:01>) of the optical component device (1 502) manufactured by the other embodiment of the invention has a plurality of. Further, the recess (iiHa) has an insulating layer (1 514 b ) in each of the recesses (1111a) for distinguishing the substrate (151〇b) in a horizontal direction from each other. Of course, each recess (1111 a ) The optical element (1120) is connected to the adjacent substrate (15101) through the conductive line (113〇). Here, the above-mentioned conductive line (113〇) does not extend to the outside of the groove (1111a). Therefore, the phosphor (114 〇) can sufficiently protect the above-mentioned conductive wire (1130), so that it is not necessary to separately form the sealing portion. [0178] As described above, the substrate (1510b) of the optical element device (1502) manufactured according to another example of the present invention has a plurality of grooves (iiHa) and optical 099138606. Form No. A0101, page 38/82, 1003064566- 0 201208147 The component (11 2 0 ), and no additional sealing part is required, so that the optical component device (15 〇 2) with a single structure and a thin structure can be manufactured. [0179] As shown in FIG. 19c, in the optical element device (1503) manufactured according to another example of the present invention, the phosphor (154〇) injected into each of the grooves (111a) has a shape protruding upward (1541). . Therefore, the optical element device (1 503) manufactured according to another example of the present invention can concentrate the light generated by the optical element (1120) and the phosphor (1540) in a certain area and then output to the outside. Of course, the phosphor (1540) may be in the shape of a depression except that it has a shape (1541) that protrudes toward the upper end. .::. .... . . . .

20a and 20b are diagrams and plan views of an optical element device manufactured by another example of the present invention. The optical component device (1601) of Figure 20a is similar to the test component device (1401) of Figure 18a. The optical component device (1602) of Figure 20b is similar to the optical component device (1402) of Figure 18b. Therefore, only the differences will be explained below. [0182] As shown in Fig. 20a, an optical element device (1601) manufactured according to another example of the present invention has a plurality of insulating layers (1614a) in a single recess (1111a) of the substrate (1610a). Of course, this insulating layer (1614a) divides the substrate (1610a) into a plurality of regions that are insulated from each other. Moreover, each of the bottom surfaces (11 lib) of the differentiated grooves (1111a) has an optical element (1120). Further, each of the optical elements (1120) is electrically connected to the adjacent substrate (1610a) via the conductive line (1130) and the insulating layer (1614a). [0183] Furthermore, by filling the phosphor (1140) into a single recess (1111a), all of the optical elements (1120) inside the recess (1111a) can be covered. And 099138606 Form No. A0101 Page 39 / Total 82 Page 1003064566-0 201208147 [0181] [0187] [0188] [0188] This phosphor (1140) can also cover all the conductive lines (113〇) ). Therefore, the optical element device (16〇1) manufactured according to another example of the present invention has a plurality of optical elements (112〇) on a single groove (1111a) and all at the lower end of the optical element (11 20). The substrates (161〇a) are insulated from each other, so that a plurality of optical elements (112 turns) connected in series or in parallel can be easily formed. Furthermore, since the arrangement of a plurality of optical elements (1120) is formed in a single groove (11Ua), the process of the phosphor (丨14〇) can be simplified. As shown in Fig. 20b, an optical element device (16〇2) manufactured according to another example of the present invention has a shape in which the phosphor (164〇) protrudes toward the upper end (1641). Thus, the optical element device (16〇2) manufactured according to another example of the present invention can concentrate the optical element (1120) and the light source generated by the fluorescent light (1 64 〇) to a certain area and then output to the outside. Of course, the above phosphor (164 〇) may also have a shape in which the upper end is recessed. As shown in Fig. 20c, one of the large grooves (1111a) on the substrate (161〇a) can arrange 3x3 optical precursors (mo). Of course, in order to form an electronic connection between the optical element (112 0 ) and the substrate (161 〇 a ), 3 X 3 conductive lines (113 〇) are used. Further, since the enamel layer (16 Ua) is also in the shape of three straight lines, the substrate (1610a) has four regions which are insulated from each other in the horizontal direction. Thus, the substrate (1610a) of the present invention has three optical elements (1120) connected in series and three in parallel. Therefore, it is easy to manufacture an optical component device of the desired brightness (1,630). Of course, the connection type of the current of the optical element (112 〇) can be varied considerably. The present invention is not limited to the connection form shown. Figure 21 is a cross-sectional view of an optical component device manufactured according to another example of the present invention. 099138606 Form No. A010] Page 40/82 of 1003064566-0 201208147 [0190] [0190] [0192] As shown in FIG. It is shown that the optical element device (1700) manufactured according to another example of the present invention may have an insulating layer (1714) in the shape of a checkerboard. The insulating layer (1714) in Fig. 21 has a linear shape of 3x2". Therefore, the substrate (171〇) has 12 regions insulated from each other. Among them, the optical element (π 20) is located in one of the nine insulating substrates (1710). As described above, another embodiment of the present invention can produce an optical element device (1700) having a plurality of optical elements (1120) connected in series or in parallel by appropriately adjusting the connection position of the conductive lines (1130). 22a, 22b, and 22c are a cross-sectional view, a plan view, and a cross-sectional view of an optical element device manufactured according to another example of the present invention. The optical element device (1800) of Figs. 22a and 22b and the optical element device of Fig. 16a (1201) is similar. Therefore, only the differences will be explained below.

[0193] As shown in FIG. 22a and FIG. 22b, an optical element device (1800) manufactured according to another example of the present invention is a groove (111 la) and a firefly on a substrate (1810). The bonding force between the light bodies (1140) forms a step depth (11 lid) around the inclined surface (1111c) of the groove (lllia). Of course, the depth of the above step (lllld) is smaller than the depth of the above groove (1111a). Further, the step (111 Id) is formed in an annular shape around the inclined surface (1111c) of the groove (1111a). Further, the first gold plating layer (1112) is also formed on the surface of the above step (lllld). As described above, since the joint area between the groove (1111a) and the phosphor (1140) is enlarged, the connection between the groove (1111a) and the phosphor (1140) can be increased. 099138606 Form No. A0101 Page 41 / Total 82 pages 1003064566-0 [0194] 201208147 Heli. [099] [0199] As shown in FIG. 22c, 'in the optical element device (1801) manufactured according to another example of the present invention, 'a phosphor implanted into a recess (nila) 184〇) can be a shape that protrudes upward from the upper end (1841). Therefore, the optical element device (1801) manufactured according to another example of the present invention allows the light generated by the optical element (112〇) and the polishing body (1840) to be concentrated in a certain area and then output to the outside. Of course, the phosphor (1840) may be in the shape of a depression in addition to the shape of the upward projection (1841). Moreover, such a convex or concave shape glory can be similarly applied to the optical element device of Figs. 23a to 26 below. Fig. 2 3 a and Fig. 2 3 b are a cross-sectional view and a plan view of an optical element device manufactured according to another example of the present invention. As shown in FIG. 23a and FIG. 23b, the optical component device (1900) manufactured according to another example of the present invention is used to lift the uiia and rong on the substrate (1910). The bonding force of the light body (1140) can form more than one recess (1111 e) with a certain depth between the lnic and the step (1111 d). The depth of the above-mentioned recess (lllle) may be smaller or larger than the above-mentioned recess (iiHa). Further, the above-mentioned holes formed on the substrate (1910) may be plural or annular. Further, the first gold layer (1112) is formed along the surface of the step (lllld) and the recess (lllle). As described above, the bonding area between the groove (1111a) and the phosphor (114 turns) is increased, and the bonding force between the groove (111a) and the phosphor (114 turns) can be more effectively improved. 099138606 FIG. 24a, FIG. 24b and FIG. 24c are a cross-sectional view and a plan view of an optical device No. A0101, page 42/82, 1003064566-0 201208147, manufactured according to another example of the present invention. 24a, 24b, and 24c, the optical element device (2000, 2000a, 2000b) manufactured according to another example of the present invention is a junction between the lift groove (1111a) and the phosphor (1140). The force forms a cavity with a certain depth on the bottom surface (1111b) of the groove (ima). Of course, the above-mentioned cavity (1111〇 is deeper than the bottom surface (11111) of the groove (1111&amp;)). Further, as shown in Fig. 24b, the above-mentioned concave holes (ll11f) formed on the bottom surface (mib) of the recess (iina) may be a plurality of or a circular shape as shown by the circle 24c. The hole in Figure 24c is indicated by the symbol π nr. Of course, the surface of the above-mentioned cavity (1111{, 1111) also has a first gold plating layer (1112). [0203] Thus, since the joint area between the groove (1111a) and the phosphor (1) 40) is increased, the bonding force between the groove (1111a) and the phosphor (1140) can be increased [0204] Ο [ Fig. 25a, Fig. 25b and Fig. 25c are a plan view and a plan view of an optical element device manufactured according to another example of the present invention. As shown in FIG. 25a, FIG. 25b and FIG. 25c, an optical element device (2100, 2100a, 2100b) manufactured according to another example of the present invention forms one or more around the bottom surface (mib) of the recess (iiila) of the substrate (2110). The cavity (llllf) forms a step (11 lid) around the inclined surface (llllc) of the groove (lllla). Further, the above-mentioned recesses (11 Ilf) formed on the bottom surface (11 lib) may be several or in a ring shape. (indicated by the surface symbol 丨丨丨^') and the 'segment difference (lllld) is formed around the inclined surface (11 lie) and is substantially annular. Of course, the above holes (llllf,) and the step difference 099138606 Form No. A0101 Page 43 / Total 82 pages 1003064566-0 201208147 (mid) The surface also has a first gold plating layer (1112). [0206] Thus, since the joint area between the groove (1111a) and the phosphor (1140) is increased, the bonding force between the groove Uilla) and the phosphor (114〇) can be increased [〇2〇7] Figure 26 is a cross-sectional view of an optical element device manufactured according to another example of the present invention. [02] The optical element device (2200) manufactured according to another example of the present invention is shown on the substrate (2120). The bottom surface (llllb) of the recess (iiiia) forms one or more recesses (1111f), and forms a step difference (lllld) at the end of the tilting system (1丨丨丨c), and then on the above-mentioned step (UUd) Form more than one hole (11 lie). Therefore, the phosphor (1丨40) can adhere to the bottom surface (illlb), the liiif, the inclined surface (11Uc), the step (lllld), and the other concave of the recess (iula) of the substrate (2120). The hole (lllle) can increase the bonding area between the phosphor (114〇) and the groove (1111). [0209] Thus, the joint area between the groove (1111 a) and the phosphor (η 40) increases. Therefore, the bonding force between the groove (lllla) and the phosphor (114〇) can be increased. [〇21〇] As described above, only a plurality of optical element devices and methods for fabricating the same according to the present invention are used. Therefore, the present invention is not limited to the above examples, and as the scope of the following patent application, without departing from the spirit of the invention, various changes may be made in the field of the invention, and may be considered as The technical spirit of the present invention. [Simple description of the drawing] 099138606 Form No. A0101 Page 44/82. 1003064566-0.201208147 [0211] FIG. 1 is a cross-sectional view of an optical element device manufactured according to an example of the present invention. The bottom surface of the substrate used in the optical component device manufactured according to the example of the present invention Figure 3 is a cross-sectional view of an optical component device made in accordance with another embodiment of the present invention. Figure 4 is a cross-sectional view of an optical component device fabricated in accordance with yet another embodiment of the present invention. Figure 6 is a cross-sectional view of an optical component device manufactured according to still another embodiment of the present invention. Figure 7 is a cross-sectional view of an optical component device manufactured according to still another embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 9 is a cross-sectional view of an optical component device manufactured according to still another example of the present invention. FIG. 10 is a cross-sectional view of an optical component device manufactured according to still another example of the present invention. A flow chart of a method of fabricating an optical component device manufactured according to an embodiment of the present invention. Fig. 12a to Fig. 12h are schematic views showing a method of fabricating an optical component device manufactured according to an example of the present invention. Fig. 13 is a view showing an optical component manufactured according to an example of the present invention. A flow chart of another method of the device. Fig. 14a to Fig. 14e are schematic views showing another manufacturing method of the optical element device manufactured according to the example of the present invention. Figure 15b and Figure 15c are cross-sectional views of a device and a strip substrate of an optical device device according to another embodiment of the present invention. Figures 16a, 16b and 16c are cross-sectional views of an optical device device manufactured according to another example of the present invention. And a plan view of a strip substrate. Fig. 17a and Fig. 17b are schematic views showing a method of fabricating an optical element device manufactured according to another example of the present invention. 099138606 Form No. A0101 Page 45 of 82 1003064566-0 201208147 Fig. 18a, Fig. 18b 18c and 18d are cross-sectional views of an optical element device manufactured according to another example of the present invention and an enlarged plan view of a partial region of the substrate. FIGS. 19a, 19b, and 19c are optical element devices manufactured according to another example of the present invention. Sectional view. 20a, 20b and 20c are a cross-sectional view and a plan view of an optical element device manufactured according to another example of the present invention. Figure 21 is a cross-sectional view showing an optical element device manufactured according to another example of the present invention. Figure 2 2a, Figure 22b and Figure 22c are a cross-sectional view, a plan view and a cross-sectional view of an optical element device manufactured according to another example of the present invention. Figures 23a and 23b are a cross-sectional view and a plan view of an optical element device manufactured in accordance with another example of the present invention. Figures 24a, 24b and 24c are a cross-sectional view and a plan view of an optical element device manufactured in accordance with another example of the present invention. Figures 25a, 25b and 25c are a cross-sectional view and a plan view of an optical element device manufactured in accordance with another example of the present invention. Figure 26 is a cross-sectional view of an optical element device manufactured according to another example of the present invention [0212] 099138606 [Description of main component symbols] 100-2200: optical component device 110, 410: substrate 112: second region 114: insulating layer first Electrode layer 130: second electrode layer form number A0101 page 46/82 pages 111, 411: first area 113: third area 120, 720 '920: 140: partition 1003064566-0 201208147

150, 450: optical element lines 160, 860: conductive 170, 270, 370: protective layer substrate 540 '640: lower end 545, 645: lower fixed layer fixed layer 546, 646: upper end 947: upper end reflective layer 1110: substrate 1111: Conductor 1111 a : recess 1111b : bottom surface 1111 c : inclined surface 11111d : first surface lllle : second surface 1112 : first gold plating layer 1113 : second gold plating 1114 : insulating layer 1120 : optical element 1121 : conductive adhesive 1130 : Conductor 1140 : Phosphor 1150 : Sealing part 099138606 Form No. A0101 Page 47 / Total 82 Page 1003064566-0 201208147 智专收字1003064566-0 DTD Version: 1.0.2 Patent Case No. 099 38606 11 1__»丨 Date: February 25, 100, invented manure instruction manual (1) &lt;&gt;丨&lt;^ Thereof&quot; (^ i2〇io.oi) (2 010,011 to: (10) ※Application number: 099138606 ※IPC classification: ※ Application曰: Bamboo ff, f 〇一, invention name: optical component device and its making method

Optical Element Device and Fabricating Method II. Abstract of the Invention: The present invention discloses an optical element device which can effectively dissipate heat and prevent short circuit of an electrode, and a method of manufacturing the same. For example, the optical element device of the present invention comprises a substrate having an insulating layer penetrating through the substrate and a plurality of regions insulated from each other by the insulating layer; an optical element mounted on the upper end of the substrate; and a conductive line connecting the optical element and the substrate : coating a protective layer of the optical element and the conductive line on the upper end of the substrate. III. Abstracts of English Invention: ❹ 099138606 Form No. A0101 Page 1 of 82 1003064566-0

Claims (1)

7.201208147 ❹ 裁 The above-mentioned metal plate is cut in the vertical direction of the above-mentioned boundary surface to form a substrate of a plurality of regions insulated from each other by the above-mentioned adhesive, and the optical component of the optical 7L is cracked to the upper end of the substrate. a process for forming an electronic connection between the optical element and a region of the substrate through a conductive line; and forming a protective layer covering the optical element and the conductive line at the upper end of the substrate. The manufacturing method of the optical element device according to the fourth aspect of the present invention, wherein the metal plate process is one of the nozzles, The method of chemical etching, grinding, and polishing forms a surface thick chain on the above-mentioned boundary surface. For example, in the fourth aspect of the invention, the manufacturing method of the optical component device is the use of a liquid adhesive or a film adhesive in the above-mentioned test article. A pre-learning device comprising: a substrate having an insulating layer extending through the thickness of the substrate, and the insulating layer separating the substrate into different regions insulated from each other; t covering the upper end or lower end of the insulating layer a fixed layer of a layer; an optical element mounted on the upper end of the upper core; a conductive line connecting the optical element to the '^^ area of the substrate; and an inner protective layer of the optical layer. And a conductive wire formed on the upper end of the substrate. The optical component device of the R. _ 诵 威 纤 , , , , , , , , , 49 49 49 49 49 49 49 49 49 49 49 49 49 49 49 49 49 49 49 49 49 49 49 49 49 Formed from Poly Phthal Amid (PPA), epoxy resin, photosensitive interlayer adhesive or a mixture thereof. 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The optical element device according to claim 8, wherein the electrode layer is formed of gold, silver, copper, aluminum, nickel, tungsten or a combination thereof at an upper end of one or more regions of the substrate. The optical element device of claim 8, wherein the insulating layer located inside the substrate is formed by anodization. The optical element device according to claim 8, wherein the insulating layer of the substrate is formed by an adhesive or an insulating paste between the substrate regions. The optical component device of claim 13, wherein the substrate region and the insulating layer are adjacent to each other by a method of sand blasting, chemical etching, grinding, and polishing. The optical element device according to claim 8, wherein the lower end surface of the optical element is formed on a region of the substrate by a conductive adhesive. The optical element device according to claim 8, wherein a metal layer corresponding to each of the regions of the substrate is further formed at a lower end of the substrate. An optical component device comprising: a substrate having a recess; an optical component mounted on the recess of the substrate; a conductive line connecting the substrate and the optical component with a current; and filling the recess of the substrate to encapsulate the above An optical element and a phosphor of the above-mentioned conductive line. The optical component device of claim 17, wherein the above-mentioned base 099138606 form number A0101 page 50 / total page 82 1003064566-0 201208147 19 . 20 . ❹ 21 · 22 . 23 . 〇V 24 . 25 . 26 The plate includes: a first body having the first surface of the groove and a second surface opposite to the first surface; a first gold plating layer formed on the first surface of the conductor; and a second layer formed on the conductor The second gold plating layer. The optical element device according to claim 18, wherein: the groove is a bottom surface on which the optical element is mounted; and an inclined surface inclined from the bottom surface toward the first surface. The optical component device of claim 18, wherein the first gold plating layer is silver plated or nickel plated and then silver plated. The optical component device of claim 18, wherein the second gold plating layer is formed by electroplating with gold, nickel, copper, tin or an alloy thereof. The optical element device according to claim 17, wherein an insulating layer which divides the substrate into two or more regions in the horizontal direction is formed on the outer side of the substrate recess. The optical element device according to claim 22, wherein the optical element is galvanically connected to the substrate on one end of the insulating layer and electrically connected to the substrate at the other end by the conductive line. The optical element device according to claim 17, wherein the fluorescent layer is covered with a transparent sealing portion. The optical component device of claim 24, wherein the conductive wire extends to an outer side of the recess, and the transparent sealing portion covers a conductive line extending outside the recess. The optical component device according to claim 24, wherein the upper end of the transparent sealing portion has a convex shape. The optical component device according to claim 17, wherein the horizontal direction of the substrate is divided into two or more 099138606, the form number A0101, the 51st page, the total 82 page, 1003064566-0 201208147 Insulation layer. 28. The optical component device of claim 27, wherein the conductive wire is located inside the recess. The optical component device according to claim 27, wherein the upper end of the fluorescent layer has a convex shape. The optical component device of claim 17, wherein two or more optical components are mounted in the substrate recess. The optical component device according to claim 30, wherein the two or more optical components are covered by the fluorescent layer, and the upper end of the fluorescent layer has a convex shape. The optical component device of claim 17, wherein the substrate has more than two grooves. The optical component device according to claim 32, wherein the two or more grooves are each covered by the fluorescent layer, and the upper end of the fluorescent layer has a convex shape. The optical element device according to claim 31, wherein a region in which the substrates are separated from each other in the horizontal direction is formed outside the respective grooves. The optical element device according to claim 31, wherein a region in which the substrates are separated from each other in the horizontal direction is formed inside the respective grooves. 36. The optical component device of claim 17, wherein a step is formed along a circumference of the substrate recess. 37. The optical component device of claim 36, wherein the step has more than one recess. 38. The optical component device of claim 17, wherein the above-mentioned 099138606 Form No. A0101, page 52, total 82, 1003064566-0 201208147, more than one recess is formed in the bottom surface of the groove. Therein, a step is formed around the groove of the optical element device substrate as described in the above 39*, as described in claim 38. 40. One or more pits are formed in the optical component device section as described in claim 39. ❹ ❹ 099138606 Form No. A0101 Page 53 of 82 1003064566-0 100201208147 Eight, Figure · 150 151 160 170 Figure 1 110 099138606 Form No. A0101 Page 54 of 82 1003064566-0