201205753 六、發明說明： 【發明所屬之技術領域】 本發明是關於一種導線架的結構及其製造方法，特別是指— 種形成有串聯(或並聯)電路的導線架。 【先前技術】 導線架的作用為傳輸積體電路内之電子元件功能至 外部之系統板。導線架是封裝的三大物件（導線架、金線、 螢光粉封裝膠）中’最重要的一種物件。積體電路中除了 極少數的簡單功能晶片直接封裝（Molding)外，每一個積 體電路的每一片晶片都必須有一導線架配合，以組合成— 個完整可使用的積體電路。導線架依功能可分為單體導線 架及積體電路導線架’單體導線架中又含支援電晶體、二 極體和發光二極體等產品。 以發光二極體而言’ led(發光二極體)被廣泛應用來做為各領 域產品的光源，例如螢幕的背光、車燈光源、一般室内照明用燈 等’以螢幕的背光而言，例如電腦螢幕、手機螢幕、PDA螢幕... 4等。LED形成背光方式通常是在螢幕背後單側或兩側佈設多數 個LED模組，每一 LED模組内設置一顆LED晶片（體），且每一 LED模組之間以串聯或並聯方式電性連結，形成預定效果的光 源。但使用時常發生’因其中幾個LED模組内的LED晶片損壞 而無法發亮或形成光衰退，導致從外部觀看螢幕呈現有暗處的現 201205753 象，影響視覺效果。 而LED模組經常損壞的原因，主要是封裝不良所引起，更具 體而s可由LED的導線架來探討。請參閱第一圖為習知發光二極 體(LED)導線架半成品示意圖。傳統的導線架做法是先在一金屬板 件A上沖壓加工出眾多格具有預設形狀的導線區域B，再以塑膠 射出成型方式於该導線區域B上形成一絕緣殼體c,後再進行金 屬導線區域的接腳D打彎。傳統的LED封裳方式因LED的結構 # 型態而有不同，對於陽極、陰極焊墊分別在LED晶片頂面及底面 的型態者而言’是先把LED晶片固定在該絕緣殼體的範圍内(固 • 晶），使底面的陰極焊墊固設於導線區域的内引腳，再於LED陽極 -焊墊與導線區域的内引腳之間，以金屬細線連接(打線鍵合），後再 把完成固晶及打線鍵合的導線架，填充螢絲環氧樹脂保護晶片 (模造）；對於陽極、陰極焊塾皆在LED晶片同一側的型態者而言， 可採用上述打_合的方式，或者可_覆晶方式即將LE〇晶 φ片⑽轉，將陽極、陰極焊塾焊設於導線區域的内引腳，然後 進行膠體縣。但獨何種雜連財式，都相金屬導線區域 與塑膠絕緣殼體之間常結合不良而形成有間隙，LED晶片長時間 暴ί!·在大氣中’文到水氣或其他環境中的化學物質影響，會造成 LED晶片短路、金屬細線與焊純化產生更高阻抗、絲退…等 現象。 為解決LED模植在被應用過程中臨時熄滅或具有光衰退現 象，須從結構上對LED模組進行改良，—方面避免錢渗入模組、 201205753 提高LED的良率’另-方面驗設LED模組也相其他因素而 造成熄滅的情形，所以須對LED突然熄滅設想一因應之道。 此外，從前面介紹LED導線架的製作方式可知，傳統的導線 架製程大致上為金屬板件沖壓成型、絕緣殼體射出成型、接腳打 彎 '固晶、打線等多道工序，不僅費時，還需負擔料片以及工作 機具的成本。因此須對製程加以改良並簡化，以節省各方面成本 的支出。 _ 綜上所述，傳統LED導線架在製程上、結構上以及應用上， 分別存在有製造時耗費成本、結構結合不良以及無法克服應用 - 時，因LED突然熄滅而影響外觀視覺效果的問題。 【發明内容】 有鑒於此，本發明的其中一目的在於，提供一種具有串(並） 聯電路覆蓋表面之LED導_，藉由該電路，可直接在導線架上 •串(並)聯至少兩顆LED晶片，以解決傳統LED模組中因僅^單 顆LED曰曰片’若該LED B曰曰片損壞或光衰退會造成暗處，影 覺效果的問題。 本發明的另-目的在於，提供-種一體成型之LED導線架的 製造方法m统製造LED導線架所需的乡道X序，藉以節省 製造時間、節省物料以及工作機具的成本。 本發明的再—目的在於’提供—種—體成型的led導線乘择 構，藉以解續統轉架金屬導線區域與塑觀緣殼體間結合不 201205753 良，易使水氣滲入，造成LED晶片損壞的問題。 此外’本發明的又-目的在於，提供一種具有串(並)聯電路 之LED導線架’此導線架能提供不論是傳統的打線鍵合或覆晶封 裝皆適用。 為解決傳統LED導線架常因結構不良，而造成内部LED晶 片文損的問題，本發明提供了一種創新的導線架結構。包括一導 線架本體’其具有-設置槽，其巾，該導_本體的表面具有導 籲電線路結構，該設置槽供設置複數電子元件，且該等電子元件與 該導電線路結構電性連結，使該等電子元件可發生作用。其中， •導電線路結構可為串聯或並聯，使導線架内可同時㈣或並聯多 - 數個電子元件；其中，該電子元件可為LED晶片。 由於導線架本體上直接成型有導電線路結構，因此不會有傳 統導線架金屬祕區域趣職緣殼咖結合不㈣問題，後續 G 乂的封膠即可禁止水氣渗入晶片，避免造成晶片損壞。 Φ 又，由於複數顆led晶片在導線架上形成串聯或並聯，除可提高 發光面積外’若有其中一顆晶片損壞，還有其他備用的晶片，可 延長整個LED模組的使用壽命。此外，選擇本發明之具有複數咖 日日片的LED模組做為背光源或照明裝置時’與傳統僅具單顆晶片 的LED模組相較，無須串、並聯過多的咖模組便能達成較高 的發光效能’因此可節省模組之_串、並聯工序及成本。 如上所述導線架的製造方法，包括下列步驟： (1)提供一材料； 201205753 ⑵以該材料形成—導線架本體，該導線架本體具有一設置槽； (3)提供包括有鋼分子及油墨的—混合顏料； ⑷用該混合顏料對該導線架本體的部分表面進行喷印，形成 導電線路結構； (5)對該導電線路結構進行固化。 在本發明中，導電用的金屬材料與構成導線架本體之塑膠材 料之間為體成型，顛覆了傳統先成型出金屬部分再於金屬部分 修上結合塑膠殼體的做法，且本發明是直接在導線架本體上形成導 電線路結構’後續施做固晶的人員可以覆晶方式將晶片與金屬層 •電性連結，可省去傳統的打線工法，以及省去打線所需材料的成 - 本，對於晶體封裝而言，能縮小整體的體積。 【實施方式】 以下配合圖式及元件符號對本發明的實施方式做更詳細的說 # 明，俾使熟習該項技藝者在研讀本說明書後能據以實施。 請參閱第二圖，本發明之導線架結構主要包括一導線架本體 1 ’其中央形成一設置槽11，該導線架本體丨表面形成有導電線路 結構2，此導電線路結構2可為串聯線路或並聯線路。該設置槽 Π供設置複數電子元件3 ’且該等電子元件3電性連結於導電線 路結構2’使該等電子元件3之間形成串聯或並聯。其中，電子元 件3與導電線路結構2之間電性連結的方式可依電子元件3的型 fe而選擇用打線鍵合方式或覆晶方式。本發明導線架的特徵在 201205753 於，因導線架上成 的導電線路結構2 °字兩個以上相同電子元件3串聯或並聯 作用，另-方面，4Γ對於電子元件3所能釋㈣功效有加乘 另一電子元件3可;為_電子元件3受損或在功能上有瑕疯， 的導物可辦第三圖至第六圖，本發明是以哪 本體1呈娜X佳實施例。導縣具有—導線架本體1，該導線架 11導㈣乂體’中央形成一垂直向下切伸的LED晶片設置槽 2 的表面佈設料躲路結構2，該導魏路結構 ’、、、’5曰’導電線路結構2可為串聯或iM節。該LED晶片設置槽 11内可供電性連結至少_LED晶片，以使兩顆LED晶片能相 八串贼綱’如第二圖、第四圖所示即為兩種不同的並聯線路 :布實施例，第五圖、第六圖所示為兩種不同的串聯線路分布實 施例，並聯或㈣的形式不以此為限。由於導線架本體【上具 導電線路、，·。構2，對於陽極、陰極烊塾皆位於同側的LED晶片 31(如第三圖及第五圖)而言，雜連結於導線架的方式可以不用再 經過打線鍵合’而可選擇利用覆晶方式，_極、陰極焊墊直接 焊固在導電線路結構2上；對於陽極、陰極焊塾分別在上、下兩 側的LED晶片32(如第四圖及第六圖所示)而言，可先將㈣晶片 32的陰極焊墊焊固於導電線路結構2，陽極焊墊才用打線2!的方 式與導電線路結構2電性連結，這樣的做法可較傳統省去至少一 道打線的工序，因此本發明所提供的導線架應用方式相當廣泛。 導線架可一次串、並聯多顆led晶片好處在於，可提高LED發 201205753 光面積、提升亮度，另-方面，當其中一 LED晶片因受損產生光 衰退甚至滅的情形’另-LED晶可作為制，藉以提升整個 LED模組驗鱗命4顧方面，選縣發明之具有複數咖 晶片的LED模組做為背光源或直接照明時，與傳統僅具單顆晶片 的LED模組相較，無須串、並聯過多的咖模組便能達成較高 的發光效能，因此可節省模組之間的串、並聯工序及成本。 以上所述導線架的製造方法，可參考第七圖所示的製造步 #驟，以及第八A至第八D圖所示’各步驟的實施狀態示意圖。先 提供-材料7G1 ;此材料可為絕緣材料，例如塑膠，或為金屬材料， •亦可為包括至少一塑膠材料及至少-金屬材料的混合材料。再以 -所_的㈣職—導線架本體702 ;但為了便糧產，本實施例 較佳的做法是以該材料射出成型一具有複數格位的片體(如第八A 圖），每-格位巾結合—導翁本體卜之後的工序也是以整個片 體為單位去施作完成，若要導線架時，才以機賴切下片體 •上=導線架。但為方便介紹，以下皆以單個導線架的成型步驟做 為貫施例。請參閱第八B圖為導線架本體的剖面示意圖，其中央 一體成型地設有-設置槽u。再提供包括有銅分子及油墨的一混 合顏料703;其中，該油墨較佳者為uv固化油墨，亦可為傳： 墨。用該混合顏料對該導線架本體的部分表面進行喷印，形成導 電線路結構7〇4 ;喷印工作是以印刷機5來完成，可為連續式印刷 機或壓電式印刷機，本實施例是用麼電式噴墨印刷機釋出所述混 顏料來執仃噴印工作，便將混合顏料4噴印在導線架本體預設 201205753 的表面(如第八c圖所示)。最後，對該導電線路結構進行固化7〇父 由於本實施例是採用包含有UV固化油墨的混合顏料4,俾需採用 UV固化系統6來執行固化工作，而此Uv固化系統6可内建在該 壓電式喷墨印刷機上，或可為一台獨立的UV固化機。導電線路 結構2固化如第八D圖示意；導電線路結構2可為串聯(或並聯）。 所述設置槽11可供設置電子元件3，例如上段所述，在本發明實 施例中，係可供設置複數LED晶片，使該等LED晶片形成串聯 或並聯。 本發明導_在製程方面的優勢為，提供了一種—體成型之 •導線架的製造方法’省去傳統製造導線架所需的多道工序，藉以 纟卩省製造時間、節省物料以及工作機具的成本。制對LED導線 架而言’由於金屬材料與塑膠材料成型在—起，不會發生傳統導 線架金屬導顧域與歸絕緣殼體間結合林的問題，只要後續 的封膠無誤，即可禁止水氣滲入晶片，避免造成LED晶片損壞貝。 # 以上所述者僅為用以解釋本發明之較佳實施例，並非企圖具 以對本發明做任何形式上之限制，是以，凡有在相同之發明精神 下所作有關本發明之任何修飾或變更，皆仍應包括在本發明 保護之範疇。 201205753 【圖式簡單說明】 第一圖為習知發光二極體導線架半成品示意圖。 第二圖為本發明導線架示意圖。 第三圖顯示在本發明導線架上具有並聯的導電線路結構。 第四圖顯示在本發明導線架上具有另一並聯的導電線路結構。 第五圖顯示在本發明導線架上具有串聯的導電線路結構。 第六圖顯示在本發明導線架上具有另一串聯的導電線路結構。 第七圖為本發明導線架之製造流程說明。 第八A圖至第八D圖為本發明導線架成型過程示意圖。 ' 【主要元件符號說明】 1. 導線架本體 11.設置槽 2. 導電線路結構 21.打線 鲁3.電子元件 3LLED晶片 32.LED晶片 4. 混合顏料 5. 印刷機 6. UV固化系統 701.提供一材料 201205753 702. 以該材料形成一導線架本體’該導線架本體具有一設置槽 703. 提供包括有銅分子及油墨的一混合顏料 704. 用該混合顏料對該導線架本體的部分表面進行喷印，形成導電 線路結構 705. 對該導電線路結構進行固化 A. 金屬板件 B. 導線區域 φ C.絕緣殼體 D.接腳201205753 VI. Description of the Invention: [Technical Field] The present invention relates to a structure of a lead frame and a method of manufacturing the same, and more particularly to a lead frame formed with a series (or parallel) circuit. [Prior Art] The function of the lead frame is to transfer the function of the electronic components in the integrated circuit to the external system board. The lead frame is the most important item in the package of three major objects (lead frame, gold wire, phosphor powder encapsulant). In addition to a very small number of simple functional wafer direct packages, each integrated circuit of each integrated circuit must have a lead frame fit to be combined into a complete usable integrated circuit. According to the function, the lead frame can be divided into a single lead frame and an integrated circuit lead frame. The single lead frame also supports products such as a transistor, a diode and a light-emitting diode. In terms of light-emitting diodes, 'led (light-emitting diodes) are widely used as light sources for various fields, such as backlights for screens, light sources for lamps, lamps for general indoor lighting, etc. For example, computer screen, mobile phone screen, PDA screen... 4 and so on. LEDs are usually formed by backlighting a plurality of LED modules on one side or both sides of the screen. Each LED module is provided with one LED chip (body), and each LED module is connected in series or in parallel. Sexually connected to form a light source of a predetermined effect. However, it often occurs when the LED chips in several of the LED modules are damaged and cannot be brightened or light-degraded, resulting in the appearance of a darkened 201205753 image from the outside, which affects the visual effect. The reason why the LED module is often damaged is mainly caused by poor packaging, and it can be discussed by the lead frame of the LED. Please refer to the first figure for a schematic diagram of a semi-finished product of a conventional LED (LED) lead frame. The conventional lead frame method is to first press a plurality of wire regions B having a predetermined shape on a metal plate member A, and then form an insulating casing c on the wire region B by plastic injection molding, and then proceed. The pin D of the metal wire area is bent. The traditional LED sealing method differs depending on the structure of the LED. For the type of anode and cathode pads on the top and bottom of the LED chip, the LED chip is first fixed to the insulating housing. Within the range (solid crystal), the cathode pad on the bottom surface is fixed to the inner lead of the wire area, and then connected between the LED anode-pad and the inner lead of the wire area by a thin metal wire (wire bonding) Then, the lead frame that completes the solid crystal bonding and wire bonding is filled with the fluorescent epoxy resin protection chip (molding); for the type of the anode and the cathode soldering on the same side of the LED chip, the above-mentioned type can be used. _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ However, there is a gap between the metal wire area and the plastic insulating case, and the LED chip is violently exposed for a long time! In the atmosphere, the water is in the water or other environment. The influence of chemical substances will cause short circuit of LED chips, higher resistance of metal thin wires and solder purification, and wire retreat. In order to solve the problem that the LED mold is temporarily extinguished or has light decay during the application process, the LED module must be improved from the structure, so as to avoid money infiltrating the module, 201205753 improve the yield of the LED 'other-side inspection LED The module is also extinguished due to other factors, so it is necessary to imagine that the LED should be extinguished suddenly. In addition, from the introduction of the LED lead frame manufacturing method, the conventional lead frame process is generally a metal plate stamping molding, an insulating shell injection molding, a pin bending, a solid crystal, a wire, and the like, which is not only time consuming, There is also a need to bear the cost of the sheets and work tools. Therefore, the process must be improved and simplified to save costs in all aspects. _ In summary, the traditional LED lead frame in the process, structure and application, respectively, there are problems in manufacturing cost, poor structural combination and inability to overcome the application - when the LED suddenly extinguished and affect the visual effect of the appearance. SUMMARY OF THE INVENTION In view of the above, it is an object of the present invention to provide an LED guide having a series (parallel) circuit covering surface, by which the circuit can be directly connected to the lead frame. Two LED chips are used to solve the problem of shadows and shadows in the conventional LED module because only the LEDs are damaged or the light is degraded. Another object of the present invention is to provide a method for manufacturing an integrally formed LED lead frame, which is used to manufacture the home lane X sequence required for the LED lead frame, thereby saving manufacturing time, material saving, and cost of work tools. The second object of the present invention is to provide a led wire for forming a seed body, so that the combination between the metal wire region and the plastic edge casing is not good, and the water vapor is infiltrated, causing damage to the LED chip. The problem. Furthermore, it is a further object of the present invention to provide an LED lead frame having a series circuit and a lead frame which can be used for both conventional wire bonding and flip chip mounting. In order to solve the problem that the conventional LED lead frame often causes structural damage of the internal LED crystal due to poor structure, the present invention provides an innovative lead frame structure. The utility model comprises a lead frame body having a groove for the surface of the guide body, wherein the surface of the guide body has a conductive electric circuit structure, the setting groove is provided with a plurality of electronic components, and the electronic components are electrically connected to the conductive circuit structure So that the electronic components can function. Wherein, the conductive circuit structure may be connected in series or in parallel, so that the plurality of electronic components can be simultaneously (four) or connected in parallel in the lead frame; wherein the electronic component can be an LED chip. Since the conductive lead structure is directly formed on the lead frame body, there is no problem that the conventional lead frame metal secret area is not suitable for the combination of the shell and the coffee. The subsequent sealing of the G 乂 can prohibit the moisture from penetrating into the wafer to avoid wafer damage. . Φ Also, since a plurality of LED chips are connected in series or in parallel on the lead frame, in addition to improving the light-emitting area, if one of the wafers is damaged, there are other spare wafers, which can extend the service life of the entire LED module. In addition, when the LED module with the plurality of coffee Japanese chips of the present invention is selected as the backlight or the illumination device, compared with the conventional LED module with only a single wafer, the coffee module can be arranged without any string or parallel connection. Achieve higher luminous performance', thus saving module _ string, parallel process and cost. The manufacturing method of the lead frame as described above comprises the following steps: (1) providing a material; 201205753 (2) forming a lead frame body with the material, the lead frame body having a groove; (3) providing steel molecules and ink (4) printing a part of the surface of the lead frame body with the mixed pigment to form a conductive line structure; (5) curing the conductive line structure. In the present invention, the metal material for conducting electricity is formed integrally with the plastic material constituting the body of the lead frame, and the conventional method of forming the metal portion and then the metal portion is combined with the plastic case is superposed, and the present invention is directly Forming a conductive circuit structure on the lead frame body. The person who subsequently applies the solid crystal can electrically connect the wafer and the metal layer in a flip-chip manner, thereby eliminating the traditional wire-laying method and eliminating the need for the material required for the wire bonding. For crystal packaging, the overall volume can be reduced. [Embodiment] The embodiments of the present invention will be described in more detail below with reference to the drawings and the reference numerals, and can be implemented by those skilled in the art after studying this specification. Referring to the second figure, the lead frame structure of the present invention mainly comprises a lead frame body 1', and a centrally formed slot 11 is formed on the surface of the lead frame body. The conductive line structure 2 can be a series line. Or parallel lines. The arrangement slot is provided with a plurality of electronic components 3' and the electronic components 3 are electrically connected to the conductive line structure 2' such that the electronic components 3 are connected in series or in parallel. The manner in which the electronic component 3 and the conductive line structure 2 are electrically connected to each other may be selected by a wire bonding method or a flip chip method depending on the type of the electronic component 3. The lead frame of the present invention is characterized in 201205753, because two or more identical electronic components 3 of the conductive circuit structure formed on the lead frame are connected in series or in parallel, and on the other hand, the function of the electronic component 3 can be released. The other electronic component 3 can be used; the electronic component 3 is damaged or functionally mad, and the conductor can be used in the third to sixth figures. The present invention is based on which body 1 is a good embodiment. The guide county has a lead frame body 1 which guides (four) the body of the body to form a vertical downwardly-cut LED chip. The surface of the groove 2 is provided with a material hiding structure 2, which guides the structure of the road, ', , ' The 5" conductive line structure 2 can be a series or iM section. The LED chip setting slot 11 can be electrically connected to at least the _LED chip, so that the two LED chips can be connected to each other. As shown in the second figure and the fourth figure, two different parallel lines are provided: For example, the fifth and sixth figures show two different series line distribution embodiments, and the parallel or (four) form is not limited thereto. Because the lead frame body [with conductive lines, ·. For the LED chip 31 (such as the third figure and the fifth figure) in which the anode and the cathode are all on the same side, the way of the hybrid connection to the lead frame can be selected without using the wire bonding. In the crystal mode, the _ pole and cathode pads are directly soldered on the conductive circuit structure 2; for the anode and cathode solder dies, the LED chips 32 on the upper and lower sides respectively (as shown in the fourth and sixth figures) The cathode pad of the (4) wafer 32 can be first soldered to the conductive circuit structure 2, and the anode pad is electrically connected to the conductive circuit structure 2 by means of the wire 2!, which can save at least one wire line compared with the conventional one. Therefore, the lead frame provided by the present invention is widely used. The advantage of the lead frame for one string and parallel connection of multiple LED chips is that it can improve the LED area of 201205753 and increase the brightness. On the other hand, when one of the LED chips is damaged due to damage, the light is degraded or even extinguished. As a system, in order to improve the overall LED module inspection scale, the LED module with multiple coffee chips invented by the county as a backlight or direct illumination, compared with the traditional LED module with only a single wafer The need for stringing and paralleling too many coffee modules can achieve higher luminous performance, thereby saving string and parallel processes and costs between modules. For the manufacturing method of the lead frame described above, reference may be made to the manufacturing step shown in the seventh drawing and the implementation state of each step shown in the eighth to eighth D drawings. First, the material 7G1 is provided; the material may be an insulating material such as plastic or a metal material, or may be a mixed material including at least one plastic material and at least a metal material. Further, the (four) position of the _---the lead frame body 702; but for the convenience of grain production, the preferred embodiment of the present embodiment is to project a sheet having a plurality of positions (such as the eighth A picture) - The combination of the grid towel - the process after the body of the leader is also applied in units of the entire sheet. If the lead frame is to be used, the sheet is removed by the machine. However, for the convenience of introduction, the following steps are taken as a single embodiment of the forming process of a single lead frame. Please refer to FIG. 8B for a schematic cross-sectional view of the lead frame body, which is integrally formed with a groove u. Further, a mixed pigment 703 comprising copper molecules and an ink is provided; wherein the ink is preferably a uv-curable ink or a: ink. The mixed surface of the lead frame body is printed with the mixed pigment to form a conductive circuit structure 7〇4; the printing work is performed by the printing machine 5, which can be a continuous printing machine or a piezoelectric printing machine, the implementation For example, the mixed pigment is released by the electro-optical inkjet printer to perform the printing work, and the mixed pigment 4 is printed on the surface of the lead frame body preset 201205753 (as shown in the eighth c). Finally, the conductive line structure is cured. Since the present embodiment uses the mixed pigment 4 containing the UV-curable ink, the UV curing system 6 is not required to perform the curing work, and the Uv curing system 6 can be built in The piezoelectric ink jet printer may be a stand-alone UV curing machine. The conductive line structure 2 is cured as shown in the eighth diagram D; the conductive line structure 2 may be in series (or in parallel). The arrangement slot 11 is provided for the placement of the electronic component 3, as described, for example, in the above paragraph. In the embodiment of the invention, a plurality of LED chips are provided for forming the LED chips in series or in parallel. The invention has the advantage of providing a method for manufacturing a lead frame, which eliminates the need for multiple processes required for traditional manufacturing of lead frames, thereby saving manufacturing time, material saving, and work tools. the cost of. For the LED lead frame, due to the molding of the metal material and the plastic material, the problem of the combination between the traditional lead frame metal guide and the returning insulation housing does not occur, as long as the subsequent sealing is correct, it can be prohibited. Water vapor penetrates into the wafer to avoid damage to the LED chip. The above is only a preferred embodiment for explaining the present invention, and is not intended to limit the invention in any way, so that any modification or modification relating to the present invention may be made in the spirit of the same invention. Changes are still to be included in the scope of protection of the present invention. 201205753 [Simple description of the diagram] The first picture is a schematic diagram of the semi-finished product of the conventional LED lamp lead frame. The second figure is a schematic view of the lead frame of the present invention. The third figure shows a parallel conductive track structure on the leadframe of the present invention. The fourth figure shows another conductive circuit structure in parallel on the lead frame of the present invention. The fifth figure shows a conductive line structure in series on the lead frame of the present invention. The sixth figure shows another conductive line structure in series on the lead frame of the present invention. The seventh figure is a description of the manufacturing process of the lead frame of the present invention. 8A to 8D are schematic views showing a molding process of the lead frame of the present invention. ' [Main component symbol description] 1. Lead frame body 11. Set slot 2. Conductive line structure 21. Wire drawing 3. Electronic component 3LLED chip 32. LED chip 4. Mixed pigment 5. Printing machine 6. UV curing system 701. Providing a material 201205753 702. Forming a leadframe body with the material. The leadframe body has a mounting groove 703. A mixed pigment 704 comprising copper molecules and ink is provided. Part of the surface of the leadframe body is coated with the mixed pigment Printing is performed to form a conductive circuit structure 705. The conductive circuit structure is cured. A. Metal plate member B. Wire region φ C. Insulating housing D. Pin