CN106531730B - LED package assembly and manufacturing method thereof - Google Patents
LED package assembly and manufacturing method thereof Download PDFInfo
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- CN106531730B CN106531730B CN201610932468.3A CN201610932468A CN106531730B CN 106531730 B CN106531730 B CN 106531730B CN 201610932468 A CN201610932468 A CN 201610932468A CN 106531730 B CN106531730 B CN 106531730B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0364—Manufacture or treatment of packages of interconnections
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Abstract
This application discloses LED package assembling and its manufacturing methods.The LED package assembling includes: lead frame, has bearing pads, multiple pins separated from each other and multiple external pads；First LED element, the second LED element and third LED element, are fixed on jointly on the bearing pads of the lead frame, and are electrically connected with the bearing pads and the multiple pin；And encapsulating compound, for covering the lead frame and light being allowed to appear, the multiple pin is for providing interconnecting area, the multiple pin is electrically connected with the multiple external pads respectively, wherein, the bearing pads are separated from each other with the multiple pin, and provide interconnecting area for being electrically connected with the multiple pin.The LED package assembling is by reducing the exposed surface of lead frame to improve contrast.
Description
Technical field
The present invention relates to LED encapsulation technologies, more particularly, to for the LED package assembling of LED display and its manufacture
Method.
Background technique
LED display has a superiority of following aspect: high gray scale, wide visible angle, color abundant and customizable
Screen shape.Therefore, it is each to be widely used in industry, traffic, commercial advertisement, information publication, sports tournament etc. for LED display
A field.
The pixel element used in LED display is LED.Pixel element is, for example, surface mount device (Surface
Mounted Devices, i.e. SMD) packaged type LED package assembling.Each LED package assembling may include lead frame, peace
Three LED elements for showing three kinds of colors of red, green, blue respectively and covering lead frame and permission light on lead frame
The resin encapsulant appeared.Three respective light emission sides of LED element are the side of packed material covering.When displaying an image, often
The brightness of three LED elements of a LED package assembling is controlled, so as to realize colour light-emitting using color mixing.
In above-mentioned LED package assembling, LED is mounted on lead frame.The lead frame is for example manufactured by PCB manufacture craft
It forms, layer on surface of metal therein can be with silver-plated equal noble metals to improve electric conductivity.After the package has been finalized, the metal of lead frame
Layer surface is also exposed to the encapsulating compound bottom of encapsulated moulding.When LED package assembling is used to illuminate, metal layer table in lead frame
The brightness of illumination can be improved in the reflex in face, it might even be possible to which additional reflection coating is to improve brightness.However, being sealed by LED
When arrangement forms LED display as pixel unit, due to the exposed surface reflection environment light of leadframe metal layer,
The contrast of LED display will deteriorate.With the raising of LED display resolution ratio, the size of LED element and LED package assembling
Also reduce.In the SMD LED package assembling of small spacing, the contrast of the exposed surface of leadframe metal layer to LED display
Influence it is especially significant.
Therefore, it is desirable to further decrease the leadframe metal layer surface in LED package assembling to the contrast of LED display
Adverse effect.
Summary of the invention
In view of the above problems, the object of the present invention is to provide a kind of improved LED package assembling and its manufacturing method, pass through
Reduce the exposed surface of leadframe metal layer to improve contrast.
According to an aspect of the present invention, a kind of LED package assembling is provided, comprising: lead frame, have bearing pads, each other every
The multiple pins and multiple external pads opened；First LED element, the second LED element and third LED element, are fixed on jointly
On the bearing pads of the lead frame, and it is electrically connected with the bearing pads and the multiple pin；And encapsulating compound, for covering
The lead frame simultaneously allows light to appear, the multiple pin for providing interconnecting area, the multiple pin respectively with it is described more
A external pads electrical connection, wherein the bearing pads are separated from each other with the multiple pin, and are provided interconnecting area and be used for and institute
Multiple pin electrical connections are stated, first LED element, second LED element and the third LED element respectively include anode
Electrode and cathode electrode, also, the anode electricity of first LED element, second LED element and the third LED element
One of pole and cathode electrode are commonly connected to the same pin in the multiple pin.
Preferably, the LED package assembling further include: the 4th LED element is fixed on the bearing pads of the lead frame,
4th LED element includes anode electrode and cathode electrode, and the 4th LED element is electrically connected with the multiple pin,
In, one of anode electrode and cathode electrode of the 4th LED element connect the same pin.
Preferably, first LED element, second LED element and the third LED element issue red respectively
Light, green light and blue light, and it is unlimited to put in order.
Preferably, the LED package assembling further include: a plurality of bonding wire, first LED element, the 2nd LED
Element, the third LED element are connected to the multiple draw via the corresponding bonding wire in a plurality of bonding wire respectively
Foot.
Preferably, the bearing pads and first LED element, second LED element and the third LED element it
One anode electrode or cathode electrode is connected.
Preferably, the bearing pads are connected to the multiple draw via the corresponding bonding wire in a plurality of bonding wire
Respective pins in foot.
Preferably, first LED element, second LED element and the respective light emission side of third LED element are
The side covered by the encapsulating compound.
Preferably, first LED element is fixed on the bearing pads using conducting resinl.
Preferably, the lead frame be double-layered circuit board, the lead frame includes PCB substrate, the bearing pads with it is described
Multiple pins are located at the first surface of the PCB substrate, and the multiple external pads are located at the second surface of the PCB substrate,
The multiple pin passes through via hole and the multiple external pads realization electricity between the first surface and second surface respectively
Connection.
Preferably, first LED element is fixed on the bearing pads using conducting resinl.
Preferably, the shape of at least one pin in the multiple pin is only to retain the unfilled corner water chestnut at a complete angle
Shape, the bearing pads are directed toward at the complete angle, and the interconnecting area is located at the top at the complete angle.
According to another aspect of the present invention, a kind of method for manufacturing LED component is provided, comprising: lead frame is formed,
Bearing pads and multiple pins separated from each other are limited in the lead frame；Multiple LED elements are fixed on the lead frame；
Using bonding wire, the multiple LED element and the bearing pads are connected to the multiple pin；It is pressed and molded,
Encapsulating compound is formed on the lead frame；And cutting separation, LED component cutting is independent component, wherein described
Bearing pads are separated from each other with the multiple pin, and are provided interconnecting area and be used to be electrically connected with the multiple pin, the multiple
One of anode electrode and cathode electrode of LED element are commonly connected to the same pin in the multiple pin.
Preferably, the positioning that lead frame includes: the multiple pin using PCB manufacture craft in PCB substrate is formed
Place gets through out multiple via holes respectively；Bearing pads and described more are formed in the first surface of PCB substrate using PCB manufacture craft
A pin；And it is formed in the second surface of PCB substrate respectively with the multiple pin by described more using PCB manufacture craft
Multiple external pads of a via hole electrical connection.
Preferably, it is fixed between the step on the lead frame the step of forming lead frame and by multiple LED elements,
Further include: the coat of metal is formed on the bearing pads and the multiple pin to improve electric conductivity, and improves the leaching of solder
Lubricant nature.
It preferably, include: by the multiple LED member by the step that the multiple LED element is fixed on the lead frame
The non-light emission side of part is fixed on the bearing pads in the lead frame.
It preferably, include: using more described in conductive adhesive by the step that multiple LED elements are fixed on the lead frame
At least one LED element in a LED element.
It preferably, include: that the lead frame is put into mold the step of forming encapsulating compound on the lead frame, by institute
The light emission side for stating multiple LED elements injects the encapsulating compound to the leadframe surfaces.
LED package assembling according to an embodiment of the present invention, the bearing pads in lead frame need not serve as pin, therefore carry
Pad, which can be saved, extends to the extension of PCB substrate corner in lead frame below LED element, exists to reduce bearing pads
The surface area of the encapsulating compound bottom surface exposure of encapsulated moulding.
In preferred embodiment, the shape of at least one pin in the multiple pin is only to retain a complete angle
Unfilled corner diamond shape, to reduce at least one pin in the encapsulation of encapsulated moulding while not increasing the bonding line length
Expect the surface area of bottom surface exposure.
The change of above-mentioned lead frame shape and its change with LED element connection type, so that the metal surface of lead frame
The ratio shared by the encapsulating compound bottom surface of encapsulated moulding is substantially reduced.When LED element does not shine, the metal watch of lead frame
Face also can the reflection to environment light also can accordingly reduce, to improve the contrast of LED display.
Further, since the area of lead frame bearing pads reduces, and regular shape, therefore after encapsulation can be with
Reduce the stress between encapsulating compound and lead frame, so that stress distribution is uniform, to be not easy to deform.
Detailed description of the invention
By referring to the drawings to the description of the embodiment of the present invention, above-mentioned and other purposes of the invention, feature and
Advantage will be apparent from.
Fig. 1 shows the decomposition perspective view of LED package assembling according to prior art.
Fig. 2 shows the decomposition perspective views of LED package assembling according to an embodiment of the present invention.
Fig. 3 shows the decomposition perspective view of the LED package assembling of alternate embodiment according to an embodiment of the present invention.
Fig. 4 shows the flow chart of LED package assembling manufacturing method according to an embodiment of the present invention.
Specific embodiment
The various embodiments that the present invention will be described in more detail that hereinafter reference will be made to the drawings.In various figures, identical element
It is indicated using same or similar appended drawing reference.For the sake of clarity, the various pieces in attached drawing are not necessarily to scale.
The present invention can be presented in a variety of manners, some of them example explained below.
Fig. 1 shows the decomposition perspective view of LED package assembling according to prior art.LED package assembling 100 includes lead frame
110, LED element 120 to 140 and encapsulating compound 150, wherein LED element 120 to 140 is mounted on lead frame 110, encapsulation
Material 150 is translucent material, is covered in the surface of lead frame 110.In the figure for the sake of clarity, by the encapsulation of package assembling 100
It separates and shows between material 150 and other parts.
Lead frame 110 is the double-layered circuit board manufactured by PCB technology, including PCB substrate 117, multiple external pads 116,
Bearing pads 111 (or being " crystal bonding area ") and multiple pins 112.Multiple pins 112 are located at PCB substrate 117 with bearing pads 111
The same side, and opposite with multiple external pads 116 positioned at 117 other side of PCB substrate respectively, multiple pins 112 and carrying
Pad 111 is realized by the via hole in PCB substrate 117 with corresponding multiple external pads 116 be electrically connected respectively.Bearing pads 111 are used
In providing mechanical support for LED element 120 to 140.Since bearing pads 111 itself are also conduction, bearing pads 111 are also simultaneous
As pin, for being electrically connected with LED element 120, and the edge of PCB substrate is extended to, is used for and corresponding PCB substrate
The external pads 116 of the other side are realized by via hole and are electrically connected, to provide being electrically connected between LED element 120 and external circuit
It connects.The multiple pin 112 is separated from each other, and for being electrically connected with LED element 120 to 140, and extends respectively to PCB substrate
Edge, be respectively used to the external pads 116 of the corresponding PCB substrate other side by via hole realize be electrically connected, with provide
Being electrically connected between LED element 120 to 140 and external circuit.In addition, at least one pin in the multiple pin 112 is same
When be connected to LED element 120 to 140, to provide the electrical connection between the LED element 120 to 140.
Lead frame 110 can be manufactured by PCB manufacture craft, such as limited and carried using the methods of pattern transfer and etching
The shape of pad and pin.Wherein, bearing pads and multiple pins can also include additional coating to improve electric conductivity, for example, by
The conductive coating that material selected from noble metals such as gold, silver forms bearing pads 111 and multiple pins 112.Further, lead frame
110 may include internal pads 114, be electrically connected between LED element for accommodating solder.
LED element 120 to 140 is respectively the light-emitting component of one of redgreenblue.LED element 120 to 140 respectively includes
Anode electrode and cathode electrode, and internal includes PN junction.Apply between the anode electrode and cathode electrode of LED element positive
When voltage, LED element conducting, electronics injects the area P from the area N, and hole enters the area N from the area P, to utilize minority carrier and majority
The recombination luminescence of carrier.LED element 120 to 140 can be fixed on the supporting region of lead frame 110 using bonding agent.
The characteristics of according to internal structure, the anode electrode and cathode electrode of LED element 120 to 140 can be formed in LED member
On the same surface or opposite surface of part.For example, the red LED member that LED element 120 is vertical structure is shown in FIG. 1
Part, anode electrode 121 and cathode electrode (not shown) are respectively formed on opposite surface.In the prior art, LED element
120 anode electrode 121 is set to the upper surface of LED element 120.LED element 130 and 140 is respectively the blue of planar structure
LED element and green LED elements.For example, the anode electrode 131 and cathode electrode 132 of LED element 130 are respectively arranged at LED member
It the upper surface of part 130 and is separated from each other.
LED element 120 is fixed on the bearing pads of lead frame 110 using conducting resinl (such as elargol), while realizing LED
Being electrically connected between the cathode electrode of element 120 and bearing pads 111.Using bonding wire 115, by LED element 130 and 140
Cathode electrode is respectively connected to the corresponding pin in multiple pins 112, and by the anode electrode of LED element 120 to 140
A common pin being connected in multiple pins 112.
The light that encapsulating compound 150 allows LED element 120 to 140 to generate appears, and the material of encapsulating compound 150 is, for example, epoxy
Resin.
External pads 116 with external circuit for being electrically connected.For example, the external pads 116 of LED package assembling can be adopted
It is fixed on a printed circuit with solder, and is further connected to display driver circuit via printed circuit board.
The display driver circuit provides driving letter to the LED element 120 to 140 of LED package assembling 150 at work
Number, by controlling the brightness of each LED element, to generate the luminous and desired brightness of desired color.By LED package assembling
After forming LED display as pixel unit, which can show in image under the control of driving circuit
Hold.
In the LED package assembling of the above-mentioned prior art, bearing pads 111 are applied not only to provide for LED element 120 to 140
Mechanical support, and itself be also used as a pin, extends to the corner of PCB substrate 117 below LED element, and with it is right
The external pads 116 for 117 other side of PCB substrate answered are realized by via hole and are electrically connected.
In addition, multiple pins 112 respectively include first part and outside for being electrically connected with LED element 120 to 140
The second part and the middle section extended between the first and second that pad 116 is electrically connected by via hole.Institute
The first part of multiple pins 112 is stated for providing interconnecting area, is electrically connected with bonding wire 115.In example shown in Fig. 1,
The first part of the multiple pin 112 is ribbon.
The shape of above-mentioned lead frame 110 and its connection type with LED element, so that the metal surface of lead frame 110 exists
Ratio shared by 150 bottom surface of encapsulating compound of encapsulated moulding is excessively high.Even if when LED element does not shine, the gold of lead frame 110
Metal surface also can reflection environment light, so as to cause LED display contrast deteriorate.
Fig. 2 shows the decomposition perspective views of LED package assembling according to an embodiment of the present invention.LED package assembling 200 includes drawing
Wire frame 210, LED element 220 to 240 and encapsulating compound 250, wherein LED element 220 to 240 is mounted on lead frame 210,
Encapsulating compound 250 is translucent material, is covered in the surface of lead frame 210.In the figure for the sake of clarity, by package assembling 200
It separates and shows between encapsulating compound 250 and other parts.
Compared with the LED package assembling 100 of the prior art shown in FIG. 1, LED package assembling according to an embodiment of the present invention
LED element 220 to 240 and encapsulating compound 250 it is same as the prior art, the difference is that the structure of lead frame 210 and its company
Connect mode.Difference is only described below, and something in common is then omitted the detailed description.
Lead frame 210 is the double-layered circuit board manufactured by PCB technology, including PCB substrate 217, multiple external pads 216,
Bearing pads 211 (or being " crystal bonding area ") and multiple pins 212.Multiple pins 212 are located at PCB substrate 217 with bearing pads 211
The same side, and opposite with multiple external pads 216 positioned at 217 other side of PCB substrate respectively, multiple pins 212 and carrying
Pad 211 is electrically connected with corresponding multiple external pads 216 by the via hole in PCB substrate 217 respectively.Bearing pads 211 are for being
LED element 220 to 240 provides mechanical support.Bearing pads 211 itself are also conduction, in this embodiment for providing inside
Electrical connection, to provide the electrical connection between LED element 220 and the corresponding pin in multiple pins 212.The multiple pin
212 are separated from each other, and for being electrically connected with LED element 220 to 240, and the outside of encapsulating compound are extended to, to provide LED element
Being electrically connected between 220 to 240 and external circuit.In addition, at least one pin in the multiple pin 212 is connected to simultaneously
LED element 220 to 240, to provide the electrical connection between the LED element 220 to 240.
Lead frame 210 can limit the shape of bearing pads and pin with PCB manufacture craft.Wherein, the carrying in lead frame 210
Pad and multiple pins can also include additional coating to improve electric conductivity, for example, by the material pair selected from noble metals such as gold, silver
The conductive coating that bearing pads 211 and multiple pins 212 are formed.Further, lead frame 210 may include internal pads 214, use
In accommodating solder to be electrically connected between LED element.
LED element 220 to 240 is respectively the light-emitting component of one of redgreenblue, and it is unlimited to put in order.For example,
The red LED element that LED element 220 is vertical structure, anode electrode 221 and cathode electrode (not shown) point is shown in FIG. 2
It is not formed on opposite surface.In the embodiment of the present invention, the anode electrode 221 of LED element 220 is set to LED element
220 upper surface.LED element 230 and 240 is respectively the blue-led element and green LED elements of planar structure.For example, LED
The anode electrode 231 and cathode electrode 232 of element 230 are respectively arranged at the upper surface of LED element 230 and are separated from each other.
LED element 220 is fixed on the bearing pads of lead frame 210 using conducting resinl (such as elargol), while realizing LED
Being electrically connected between the cathode electrode of element 220 and bearing pads 211.Using bonding wire 215, by bearing pads 211, LED element
230 and 240 cathode electrode is respectively connected to the corresponding pin in multiple pins 212, and by LED element 220 to 240
Anode electrode be connected to a common pin in multiple pins 212.
The light that encapsulating compound 250 allows LED element 220 to 240 to generate appears, and the material of encapsulating compound 250 is, for example, epoxy
Resin.The thickness for encapsulating the LED package assembling completed is about 0.5mm to 1.5mm, and length is about 0.5mm to 2mm, and width is about
0.5mm to 2mm.
External pads 216 with external circuit for being electrically connected.For example, the external pads 216 of LED package assembling can be adopted
It is fixed on a printed circuit with solder, and is further connected to display driver circuit via printed circuit board.
The display driver circuit provides driving letter to the LED element 220 to 240 of LED package assembling 250 at work
Number, by controlling the brightness of each LED element, to generate the luminous and desired brightness of desired color.By LED package assembling
After forming LED display as pixel unit, which can show in image under the control of driving circuit
Hold.
In the LED package assembling of the embodiment, bearing pads 211 are used to provide mechanical support for LED element 220 to 240,
And for providing internal electrical connection for LED element 220.Bearing pads 211 can only include being used to support LED element 220 to 240
First part, and for bonding wire 215 connect second part.Compared with the LED package assembling 100 of the prior art,
In the LED package assembling 200 of the embodiment, bearing pads 211 need not serve as pin, thus bearing pads 211 can save from
220 to 240 lower section of LED element extends to the extension of PCB substrate corner, to reduce bearing pads 211 in encapsulated moulding
250 bottom surface of encapsulating compound exposure surface area.
In addition, multiple pins 212 respectively include first part and outside for being electrically connected with LED element 220 to 240
The second part and the middle section extended between the first and second that pad 216 is connected by via hole.It is described
The first part of multiple pins 212 is electrically connected for providing interconnecting area with bonding wire 215.In the example shown in figure 2, institute
The first part for stating only one pin in multiple pins 212 is ribbon, the first part of excess-three pin for triangle (i.e.
One angle part of band, i.e. right angled triangle).Gold of the lead frame 210 in 250 bottom surface of the encapsulating compound exposure of encapsulated moulding
Metal surface includes the first part of the multiple pin 212.However, the shape due at least one pin changes, so that first
Partial shape is triangle, and the top of triangle is arranged in pad, so that it is sudden and violent on 217 surface of PCB substrate to reduce pin 212
The surface area of dew.
The shape of above-mentioned lead frame 210 and its connection type with LED element, so that the metal surface of lead frame 210 exists
Ratio shared by 250 bottom surface of encapsulating compound of encapsulated moulding is substantially reduced.When LED element does not shine, the gold of lead frame 210
Metal surface also can the reflection to environment light also can accordingly reduce, to improve the contrast of LED display.
In above-mentioned embodiment shown in Fig. 2, the LED element 220 to 240 in LED package assembling 200 is with the side of common-anode
Formula connection.As a kind of alternative embodiment, as shown in figure 3, the LED element 220 to 240 in LED package assembling 300 is with common cathode
The mode of pole connects, for example, the red LED element that LED element 220 is vertical structure, 221 He of anode electrode is shown in FIG. 3
Cathode electrode (not shown) is respectively formed on opposite surface, and the anode electrode 221 of LED element 220 is set to LED element
The cathode electrode of 220 upper surface, LED element 220 be electrically connected with bearing pads 211 and with the cathode electrode of LED element 230 232,
The cathode electrode 242 of LED element 240 is commonly connected to the same pin in multiple pins 212, realizes LED element 220 to 240
Common cathode connection.
Fig. 4 shows the flow chart of LED package assembling manufacturing method according to an embodiment of the present invention.
In step S01, the manufacture of lead frame is completed using PCB manufacture craft.Such as first by the more of PCB substrate
Multiple via holes of the first surface by PCB substrate to second surface are got through at a pin positioning, and using mask in PCB substrate
First surface limits the shape of bearing pads and pin, then leading to overetched method to be formed includes bearing pads and multiple pins
Metal layer；The multiple pin is real with the external pads of the second surface of corresponding PCB substrate by the multiple via hole respectively
It is now electrically connected, to form the main structure of lead frame.As described above, being adopted in LED package assembling according to an embodiment of the present invention
The bearing pads of lead frame be with pin independent component separated from each other, be only used for support LED element and internal be electrically connected be provided
It connects.Preferably, lead frame may include internal pads, be electrically connected between LED element for accommodating solder.
In step S02, it is preferable that carry out leadframe surfaces processing.The step is for example including surface clean and forms gold
Belong to coating.The conductive plating being made of the material selected from noble metals such as gold, silver is formed in the bearing pads of lead frame and the surface of pin
Layer.The conductive coating can improve electric conductivity, and improve the wellability of solder.
In step S03, using bonding agent, multiple LED elements of redgreenblue are fixed on to the bearing pads of lead frame
On.For red LED element, since the LED element has vertical structure, anode electrode and cathode electrode are located at LED
On the apparent surface of element, therefore red LED element can be bonded in the carrying of lead frame using conducting resinl (such as elargol)
On pad and the electrical connection both realized.
In step S04, using bonding wire, the electrode of LED element and bearing pads are connected to multiple pins.The step
Suddenly for example including solder is placed on the bearing pads of lead frame and the interconnecting area of pin, by heating so that solder flows back, and
Bonding wire is welded in the interconnecting area of bearing pads and pin.
In step S05, the lead frame for having fixed LED element is placed in a mold, injection resin etc. encapsulating compounds into
Row compression molding.The encapsulating compound can be translucent material, and the light for allowing LED element to generate appears.Encapsulating compound also could be formed with
Optical emission exit, such as the pyramidal optical emission exit formed in resin encapsulant, and three respective light emission sides of LED element
It is exposed to the bottom of optical emission exit.
In step S06, by above-mentioned steps be formed by multiple LED package assemblings be separated by way of cutting it is more
A independent LED package assembling.
In the above-described embodiment, the method that the main structure of lead frame is directly formed using PCB manufacture craft is described.
In alternate embodiments, using the machining process of punching press, the shape of bearing pads and pin is limited using mold shape, and
And can also include additional support frame with temporary support bearing pads and pin, after completing encapsulation, lead is cut off using press machine
Connection between frame and support frame, so that LED package assembling forms independent element, to form the main structure of lead frame.
It is as described above according to the embodiment of the present invention, these embodiments details all there is no detailed descriptionthe, also not
Limiting the invention is only the specific embodiment.Obviously, as described above, can make many modifications and variations.This explanation
These embodiments are chosen and specifically described to book, is principle and practical application in order to better explain the present invention, thus belonging to making
Technical field technical staff can be used using modification of the invention and on the basis of the present invention well.Protection model of the invention
The range that the claims in the present invention are defined should be subject to by enclosing.
Claims (18)
1. a kind of LED package assembling, comprising:
Lead frame has bearing pads, multiple pins separated from each other and multiple external pads；
First LED element, the second LED element and third LED element, are fixed on jointly on the bearing pads of the lead frame, and
It is electrically connected with the bearing pads and the multiple pin；And
Encapsulating compound, for covering the lead frame and light being allowed to appear, the multiple pin is described more for providing interconnecting area
A pin is electrically connected with the multiple external pads respectively,
Wherein, the bearing pads are separated from each other with the multiple pin, and the bearing pads include for drawing with the multiple
The interconnecting area of foot electrical connection,
First LED element, second LED element and the third LED element respectively include anode electrode and cathode electricity
Pole, also, the anode electrode and cathode electrode of first LED element, second LED element and the third LED element
In a common pin being commonly connected in the multiple pin,
In the anode electrode and cathode electrode of first LED element, second LED element and the third LED element
Another is electrically connected with 3 corresponding pins except the common pin respectively.
2. LED package assembling according to claim 1, further includes:
4th LED element is fixed on the bearing pads of the lead frame, and the 4th LED element includes anode electrode and cathode
Electrode, the 4th LED element are electrically connected with the multiple pin, wherein the anode electrode and cathode of the 4th LED element
One of electrode connects the common pin.
3. LED package assembling according to claim 1, wherein first LED element, second LED element and institute
It states third LED element and issues red light, green light and blue light respectively, and it is unlimited to put in order.
4. LED package assembling according to claim 1, further includes: a plurality of bonding wire, it is first LED element, described
Second LED element, the third LED element are connected to via the corresponding bonding wire in a plurality of bonding wire described respectively
Multiple pins.
5. LED package assembling according to claim 1, wherein the bearing pads and first LED element, described the
Two LED elements are connected with the anode electrode of one of the third LED element or cathode electrode.
6. LED package assembling according to claim 4, wherein the bearing pads are via in a plurality of bonding wire
Corresponding bonding wire is connected to the respective pins in the multiple pin.
7. LED package assembling according to claim 1, wherein first LED element, second LED element and institute
Stating the respective light emission side of third LED element is the side covered by the encapsulating compound.
8. LED package assembling according to claim 1, wherein first LED element is fixed on described using conducting resinl
On bearing pads.
9. LED package assembling according to claim 1, wherein the lead frame is double-layered circuit board, the lead frame packet
PCB substrate is included, the bearing pads and the multiple pin are located at the first surface of the PCB substrate, the multiple external pads
Positioned at the second surface of the PCB substrate, the multiple pin passes through the mistake between the first surface and second surface respectively
Hole is electrically connected with the realization of the multiple external pads.
10. LED package assembling according to claim 1, wherein anode electrode and the cathode electricity of first LED element
Pole is formed on opposite surface.
11. LED package assembling according to claim 1, wherein the shape of at least one pin in the multiple pin
For the unfilled corner diamond shape for only retaining a complete angle, the bearing pads are directed toward at the complete angle, and the interconnecting area is positioned at described
The top at complete angle.
12. a kind of method for manufacturing LED component, comprising:
Lead frame is formed, bearing pads and multiple pins separated from each other are limited in the lead frame；
Multiple LED elements are fixed on the lead frame；
Using bonding wire, the multiple LED element and the bearing pads are connected to the multiple pin；
It is pressed and molded, forms encapsulating compound on the lead frame；And
LED component cutting is independent component by cutting separation,
Wherein, the bearing pads are separated from each other with the multiple pin, and the bearing pads include for drawing with the multiple
The interconnecting area of foot electrical connection,
One in the anode electrode and cathode electrode of the multiple LED element be commonly connected to it is public in the multiple pin
Pin,
In the anode electrode and cathode electrode of the multiple LED element another respectively with it is multiple except the common pin
The corresponding pin electrical connection.
13. according to the method for claim 12, wherein forming lead frame includes: using PCB manufacture craft
Multiple via holes are got through out respectively at the positioning of the multiple pin in PCB substrate；
The bearing pads and the multiple pin are formed in the first surface of PCB substrate；And
The multiple outsides being electrically connected respectively with the multiple pin by the multiple via hole are formed in the second surface of PCB substrate
Pad.
14. according to the method for claim 12, wherein forming lead frame includes:
The shape of the bearing pads and the multiple pin is limited by the punching press of the sheet material to metal material；And
Punching separation, to cut off the connection between the lead frame and support frame.
15. according to the method for claim 12, being fixed on described draw in the step of forming lead frame and by multiple LED elements
Between step on wire frame, further includes: on the bearing pads and the multiple pin formed the coat of metal to improve electric conductivity,
And improve the wellability of solder.
16. according to the method for claim 12, wherein the multiple LED element is fixed on the step on the lead frame
It suddenly include: on the bearing pads that the non-light emission side of the multiple LED element is fixed in the lead frame.
17. according to the method for claim 12, wherein the step packet being fixed on multiple LED elements on the lead frame
It includes: using at least one LED element in the multiple LED element of conductive adhesive.
18. according to the method for claim 12, wherein on the lead frame formed encapsulating compound the step of include: by institute
It states lead frame to be put into mold, injects the encapsulating compound from the light emission side of the multiple LED element to the leadframe surfaces.
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| CN106783817B (en) | 2016-11-25 | 2019-02-05 | 杭州美卡乐光电有限公司 | LED package assembly, LED module and manufacturing method thereof |
| CN106871078A (en) * | 2017-03-28 | 2017-06-20 | 山东晶泰星光电科技有限公司 | A kind of integrated substrates of surface-adhered type RGB LED and its manufacture method |
| CN106847801B (en) * | 2017-03-28 | 2023-09-15 | 山东捷润弘光电科技有限公司 | A surface-mounted RGB-LED packaging module and its manufacturing method |
| CN106992169A (en) * | 2017-04-27 | 2017-07-28 | 山东晶泰星光电科技有限公司 | A kind of upside-down mounting RGB LED encapsulation modules and its display screen |
| CN109920902A (en) * | 2019-03-07 | 2019-06-21 | 深圳市华星光电半导体显示技术有限公司 | LED brackets, LED devices and edge-mounted backlight modules |
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| CN103238226A (en) * | 2010-10-07 | 2013-08-07 | 科锐公司 | Multiple configuration light emitting devices and methods |
| CN203631548U (en) * | 2013-12-23 | 2014-06-04 | 深圳市九洲光电科技有限公司 | Fully colorful surface mounted device |
| CN206282882U (en) * | 2016-10-31 | 2017-06-27 | 杭州美卡乐光电有限公司 | LED package assemblings |
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| JP5010716B2 (en) * | 2010-01-29 | 2012-08-29 | 株式会社東芝 | LED package |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103238226A (en) * | 2010-10-07 | 2013-08-07 | 科锐公司 | Multiple configuration light emitting devices and methods |
| CN203631548U (en) * | 2013-12-23 | 2014-06-04 | 深圳市九洲光电科技有限公司 | Fully colorful surface mounted device |
| CN206282882U (en) * | 2016-10-31 | 2017-06-27 | 杭州美卡乐光电有限公司 | LED package assemblings |
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