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TW201144837A - Electronic component testing device and electronic component transport method - Google Patents

Electronic component testing device and electronic component transport method

Info

Publication number
TW201144837A
TW201144837A TW100116571A TW100116571A TW201144837A TW 201144837 A TW201144837 A TW 201144837A TW 100116571 A TW100116571 A TW 100116571A TW 100116571 A TW100116571 A TW 100116571A TW 201144837 A TW201144837 A TW 201144837A
Authority
TW
Taiwan
Prior art keywords
electronic component
imaging
holding part
testing
testing device
Prior art date
Application number
TW100116571A
Other languages
Chinese (zh)
Other versions
TWI500943B (en
Inventor
Masakuni Shiozawa
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW201144837A publication Critical patent/TW201144837A/en
Application granted granted Critical
Publication of TWI500943B publication Critical patent/TWI500943B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

An electronic component testing device includes a first imaging device for imaging an upper-surface electrode of an electronic component before the electronic component is held by a holding part, a second imaging device for imaging a contact terminal provided to a testing head, a third imaging device for imaging a lower-surface electrode of the electronic component held by the holding part, and a fourth imaging device for imaging a testing socket. A control device controls the position adjustment part of the testing head to adjust the position of the holding part, and thereby controlling, based on images captured by the first and second imaging devices, a holding orientation when the holding part holds the electronic component, and controlling, based on the images captured by the third and fourth imaging devices, a holding orientation of the holding part in relation to the testing socket.
TW100116571A 2010-05-14 2011-05-11 Electronic component testing device and electronic component transport method TWI500943B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010111825A JP5621313B2 (en) 2010-05-14 2010-05-14 Electronic component inspection apparatus and electronic component conveying method

Publications (2)

Publication Number Publication Date
TW201144837A true TW201144837A (en) 2011-12-16
TWI500943B TWI500943B (en) 2015-09-21

Family

ID=44911213

Family Applications (2)

Application Number Title Priority Date Filing Date
TW104124284A TWI567402B (en) 2010-05-14 2011-05-11 Electronic component testing device and electronic component transport method
TW100116571A TWI500943B (en) 2010-05-14 2011-05-11 Electronic component testing device and electronic component transport method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW104124284A TWI567402B (en) 2010-05-14 2011-05-11 Electronic component testing device and electronic component transport method

Country Status (5)

Country Link
US (1) US8816709B2 (en)
JP (1) JP5621313B2 (en)
KR (1) KR101905895B1 (en)
CN (2) CN102288887B (en)
TW (2) TWI567402B (en)

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* Cited by examiner, † Cited by third party
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TWI471569B (en) * 2012-07-06 2015-02-01 Nihon Micronics Kk Electrical contactor and contact method of the same
TWI553321B (en) * 2014-04-30 2016-10-11 佰歐特有限公司 Apparatus for testing
TWI563269B (en) * 2014-04-30 2016-12-21 Bioptro Co Ltd Apparatus for testing
TWI615624B (en) * 2015-10-30 2018-02-21 Seiko Epson Corp Electronic component conveying device and electronic component inspection device
US9964588B2 (en) 2013-04-17 2018-05-08 Techwing Co., Ltd. Handler for testing semiconductor device and method for checking whether semiconductor device remains using the same
TWI674230B (en) * 2016-06-01 2019-10-11 日商精工愛普生股份有限公司 Electronic component conveying device and electronic component inspection device

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JP2013145140A (en) * 2012-01-13 2013-07-25 Advantest Corp Handler device and testing device
JP2013145134A (en) * 2012-01-13 2013-07-25 Advantest Corp Handler device and testing device
JP2013145132A (en) * 2012-01-13 2013-07-25 Advantest Corp Handler device and testing method
JP5942459B2 (en) * 2012-02-14 2016-06-29 セイコーエプソン株式会社 Handler and parts inspection device
JP5024494B1 (en) * 2012-03-05 2012-09-12 富士ゼロックス株式会社 Method for manufacturing mounting device and substrate device
TWI452310B (en) * 2012-05-03 2014-09-11 Chroma Ate Inc Test device for stacked wafers
JP6083140B2 (en) * 2012-07-20 2017-02-22 セイコーエプソン株式会社 Electronic component conveying device and electronic component inspection device
JP2014085230A (en) 2012-10-24 2014-05-12 Advantest Corp Electronic component handling device, electronic component testing device, and method for testing electronic component
US9230682B2 (en) * 2012-12-26 2016-01-05 Broadcom Corporation Method and system for automated device testing
TWI456213B (en) * 2013-01-18 2014-10-11 Hon Tech Inc Electronic component working unit, working method and working equipment thereof
US9465383B2 (en) * 2013-06-27 2016-10-11 Asm Technology Singapore Pte Ltd Apparatus and method of using an imaging device for adjustment of at least one handling device for handling semiconductor components
JP6241204B2 (en) * 2013-10-31 2017-12-06 セイコーエプソン株式会社 Force detection device and robot
JP6490600B2 (en) * 2014-02-13 2019-03-27 日本発條株式会社 Inspection unit
KR101748256B1 (en) * 2014-03-25 2017-06-16 가부시키가이샤 어드밴티스트 Handler apparatus, adjusting method of handler apparatus and test apparatus
KR101748239B1 (en) * 2014-03-25 2017-06-16 가부시키가이샤 어드밴티스트 Actuator, handler apparatus and test apparatus
JP2016156715A (en) * 2015-02-25 2016-09-01 セイコーエプソン株式会社 Electronic component conveying device and electronic component inspection device
JP6543958B2 (en) * 2015-02-26 2019-07-17 セイコーエプソン株式会社 Electronic component conveying apparatus and electronic component inspection apparatus
EP3075702B1 (en) * 2015-03-31 2021-02-17 OSAI A.S. S.p.A. Testing method and unit for micro electromechanical systems
JP6684792B2 (en) * 2015-07-06 2020-04-22 株式会社Ｆｕｊｉ Mounting device, imaging processing method, and imaging unit
KR102332339B1 (en) * 2015-07-08 2021-12-01 삼성전자주식회사 Vacuum socket and semiconductor detecting device including the same
JP2017151011A (en) * 2016-02-26 2017-08-31 セイコーエプソン株式会社 Electronic component conveying device and electronic component inspection device
CN107176450A (en) * 2016-03-09 2017-09-19 精工爱普生株式会社 Electronic unit conveyer and electronic component inspection device
JP2017173075A (en) * 2016-03-23 2017-09-28 セイコーエプソン株式会社 Electronic component conveying device and electronic component inspection device
JP2018017607A (en) * 2016-07-28 2018-02-01 セイコーエプソン株式会社 Electronic component conveyance apparatus and electronic component inspection apparatus
TW201810483A (en) * 2016-08-26 2018-03-16 美商三角設計公司 Offline vision assist method and apparatus for integrated circuit device vision alignment
TWI649567B (en) * 2016-09-29 2019-02-01 日商精工愛普生股份有限公司 Electronic component transfer device and electronic component inspection device
KR102461013B1 (en) * 2016-10-13 2022-11-01 (주)테크윙 Handler for testing electronic devices and method for adjusting teaching point thereof
JP6903268B2 (en) * 2016-12-27 2021-07-14 株式会社Ｎｓテクノロジーズ Electronic component transfer device and electronic component inspection device
MX2019009399A (en) * 2017-02-10 2019-11-05 Optofidelity Oy Method, an all-in-one tester and computer program product.
DE112017007108T5 (en) * 2017-02-22 2019-11-21 Sintokogio, Ltd. Test System
JP2018136239A (en) * 2017-02-23 2018-08-30 セイコーエプソン株式会社 Electronic component conveying device and electronic component inspection device
JP2018141699A (en) * 2017-02-28 2018-09-13 セイコーエプソン株式会社 Electronic component conveyance device and electronic component inspection device
US10297043B2 (en) * 2017-04-07 2019-05-21 Advantest Corporation Detector for detecting position of IC device and method for the same
JP2019027923A (en) * 2017-07-31 2019-02-21 セイコーエプソン株式会社 Pressure device, electronic component conveyance device, and electronic component inspection device
JP2019027924A (en) * 2017-07-31 2019-02-21 セイコーエプソン株式会社 Electronic component conveying device, electronic component inspection device, positioning device, component conveying device, and positioning method
TWI627416B (en) * 2017-08-31 2018-06-21 Test device with temperature control zone unit and test classification device thereof
KR20200011352A (en) * 2018-07-24 2020-02-03 (주)테크윙 Photographing apparatus for processing equipment of electronic components
JP2020051939A (en) * 2018-09-27 2020-04-02 セイコーエプソン株式会社 Electronic component conveyance device and electronic component inspection device
CN109541439B (en) * 2018-12-10 2020-11-13 通富微电子股份有限公司 Adjusting method, detecting device and adjusting system for chip testing feeding direction
KR102760368B1 (en) * 2018-12-11 2025-02-03 (주)테크윙 Handler for testing electronic components
TWI702493B (en) * 2019-09-09 2020-08-21 英業達股份有限公司 Testing method and system of socket
KR102319388B1 (en) * 2020-07-16 2021-11-01 주식회사 아이에스시 Connecting apparatus for electrical test
TWI764518B (en) * 2021-01-15 2022-05-11 鴻勁精密股份有限公司 Pressing mechanism and testing equipment using the same

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JP2001133500A (en) * 1999-11-01 2001-05-18 Agilent Technologies Japan Ltd Electronic parts-measuring tool and electrode used for it
JP4740405B2 (en) * 2000-11-09 2011-08-03 東京エレクトロン株式会社 Alignment method and program recording medium
AU2002237553A1 (en) 2002-03-07 2003-09-16 Advantest Corporation Electronic component testing apparatus
JP4511942B2 (en) * 2002-11-28 2010-07-28 株式会社アドバンテスト POSITION DETECTION DEVICE, POSITION DETECTION METHOD, AND ELECTRONIC COMPONENT CONVEYING DEVICE
WO2006059360A1 (en) * 2004-11-30 2006-06-08 Advantest Corporation Electronic component handling apparatus
DE112005003533T5 (en) * 2005-04-11 2008-03-06 Advantest Corp. Handling device for electronic components
JP4768318B2 (en) 2005-05-31 2011-09-07 ヤマハ発動機株式会社 IC handler
JP4767147B2 (en) 2005-11-16 2011-09-07 パナソニック株式会社 Inspection apparatus and inspection method
CN1967261A (en) * 2005-11-16 2007-05-23 松下电器产业株式会社 Inspection device and inspection method
JP4803006B2 (en) * 2006-11-29 2011-10-26 セイコーエプソン株式会社 IC handler
JP4539685B2 (en) * 2007-06-22 2010-09-08 セイコーエプソン株式会社 Component conveyor and IC handler
KR101341566B1 (en) 2007-07-10 2013-12-16 삼성전자주식회사 A socket, a test equipment, and method for manufacturing a multi-chip semiconductor device package
JP5088167B2 (en) * 2008-02-22 2012-12-05 東京エレクトロン株式会社 PROBE DEVICE, PROBING METHOD, AND STORAGE MEDIUM
CN101967261B (en) 2010-10-09 2012-03-07 内蒙古大学 A preparation method of superabsorbent resin containing plant nutrient elements and auxin

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI471569B (en) * 2012-07-06 2015-02-01 Nihon Micronics Kk Electrical contactor and contact method of the same
US9964588B2 (en) 2013-04-17 2018-05-08 Techwing Co., Ltd. Handler for testing semiconductor device and method for checking whether semiconductor device remains using the same
TWI553321B (en) * 2014-04-30 2016-10-11 佰歐特有限公司 Apparatus for testing
TWI563269B (en) * 2014-04-30 2016-12-21 Bioptro Co Ltd Apparatus for testing
TWI615624B (en) * 2015-10-30 2018-02-21 Seiko Epson Corp Electronic component conveying device and electronic component inspection device
TWI674230B (en) * 2016-06-01 2019-10-11 日商精工愛普生股份有限公司 Electronic component conveying device and electronic component inspection device

Also Published As

Publication number Publication date
KR20110126060A (en) 2011-11-22
TW201610450A (en) 2016-03-16
KR101905895B1 (en) 2018-10-08
JP5621313B2 (en) 2014-11-12
TWI567402B (en) 2017-01-21
TWI500943B (en) 2015-09-21
CN102288887A (en) 2011-12-21
US8816709B2 (en) 2014-08-26
CN105738793B (en) 2018-09-04
CN105738793A (en) 2016-07-06
US20110279136A1 (en) 2011-11-17
JP2011242149A (en) 2011-12-01
CN102288887B (en) 2016-02-03

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees