CN107176450A - Electronic unit conveyer and electronic component inspection device - Google Patents

Abstract

The present invention provides an electronic component transport device and an electronic component inspection device capable of aligning electronic components with a simple mechanism. An electronic component transport device (10) that is a transport device is provided with: a support part (47) that is a movable base; The first surface of the IC device (9) holds the above-mentioned electronic component; A second surface different from one surface abuts, and the abutting portion presses the electronic component in a second direction different from the first direction when the holding portion moves in the first direction relative to the base portion.

Description

Electronic component transport device, and electronic component inspection device

technical field

The present invention relates to an electronic component transport device and an electronic component inspection device.

Background technique

Conventionally, for example, an electronic component inspection device that inspects electrical characteristics of electronic components such as IC devices is known. Generally, this electronic component inspection apparatus includes an inspection section for inspecting IC devices, and an electronic component transport device including a transport section for transporting IC devices to the inspection section. In the electronic component inspection apparatus described above, in order to accurately contact the external terminals of the carefully arranged IC device with the measurement terminals of the inspection unit, it is necessary to use an alignment mechanism such as centering for the application of the IC device.

As an example of such an alignment mechanism for an IC device, for example, Patent Document 1 discloses that an IC device is adsorbed to an adsorption nozzle (adsorption unit), and a claw member pair that moves in conjunction with the operation of an expansion member driven by a piston is used. A chuck device for positioning with a structure in which the four sides of the IC device are pressed at right angles and held while positioning (centering).

Patent Document 1: Japanese Patent Application Laid-Open No. 5-48299

However, for example, in the conventional alignment mechanism disclosed in Patent Document 1, in addition to the suction source for holding the IC device (electronic component), a mechanism such as a piston for positioning (centering) the IC device (electronic component) is required. etc. drive source. In other words, in order to perform positioning (centering) of IC devices (electronic components), it is necessary to use a complicated mechanism.

In addition, in the formation of an IC device (electronic component), when the dicing groove (groove portion) is used as a starting point to cut, for example, a protruding burr (protruding outward) sometimes occurs on the side surface of the IC device (electronic component). Due to the disorder of the external shape caused by the notch (inwardly recessed part), etc., the positioning (centering) of the IC device (electronic component) is difficult due to the disorder of the external shape.

Contents of the invention

The invention was made to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application example 1] The electronic component conveying device of this application example is characterized in that it includes: a base; part, which is arranged to be movable relative to the above-mentioned base part, and can be in contact with the second surface of the above-mentioned electronic component different from the above-mentioned first surface. When moving in one direction, the electronic component can be pressed in a second direction different from the first direction.

According to the electronic component conveying device described in this application example, when the holding part moves in the first direction relative to the base, the abutting part presses the electronic component in the second direction different from the first direction. The mechanism easily performs positioning (centering) of electronic components.

[Application Example 2] In the electronic component transport device described in the above application example, preferably, the electronic component can be held by the holding portion by suction.

According to this application example, the adsorption force of an electronic component can be easily changed. Thereby, the position of the held electronic component can be easily moved by pressing of the contact part, and positioning (centering) can be performed easily.

[Application Example 3] In the electronic component transport device described in the above application example, it is preferable that the suction of the electronic component and the movement of the holding portion relative to the base portion are performed by the same suction source.

According to this application example, the suction of the electronic component and the movement of the holding portion relative to the base are performed by the same suction source, so suction and holding can be performed by a simpler mechanism.

[Application Example 4] In the electronic component transport device described in the above application example, it is preferable that the contact portion is arranged so as to be rotatable relative to the base portion.

According to this application example, by making the contact part rotatable with respect to the base part, it is possible to press the electronic component in the second direction by a simple mechanism.

[Application Example 5] In the electronic component transporting device described in the above application example, it is preferable that the abutting portion abuts on the holding portion and rotates in conjunction with movement of the holding portion.

According to this application example, since the movement of the holding part in the first direction is used as the driving source for the rotation of the contact part, the movement of the holding part and the rotation of the contact part can be linked with an easy and simple mechanism.

APPLICATION EXAMPLE 6 In the electronic component transport device described in the above application example, it is preferable that the second direction is a direction perpendicular to the first direction.

According to this application example, since the electronic component is pressed from a direction perpendicular to the surface on which the electronic component is held, accurate positioning (centering) of the electronic component can be performed.

[Application example 7] In the electronic component transportation device described in the above application example, preferably, a plurality of the abutting parts are arranged, and the first abutting part and the second abutting part among the plurality of abutting parts are arranged along the first The moving directions are mutually opposite to each other, and the above-mentioned electronic components are pressed.

According to this application example, since the plurality of contact portions press the electronic component from opposite directions along the first moving direction, the electronic component can be positioned (centered) easily and accurately.

APPLICATION EXAMPLE 8 In the electronic component transport device described in the above application example, it is preferable that the first abutting portion and the second abutting portion are movable by the same amount of movement.

According to this application example, the positioning (centering) of the electronic component can be accurately performed by the contact portions having the same movement amount.

[Application example 9] In the electronic component transportation device described in the above application example, it is preferable to include a third abutting portion and a fourth abutting portion, and the third abutting portion and the fourth abutting portion are arranged along the The second moving directions perpendicular to the moving directions move in opposite directions to press the electronic component.

According to this application example, the plurality of abutting portions can be abutted and pressed against the electronic component by moving in two orthogonal directions (the first moving direction and the second moving direction), so that the electronic component can be easily and more reliably removed. The positioning (to the center).

APPLICATION EXAMPLE 10 In the electronic component transport device described in the above application example, it is preferable that the third abutting portion and the fourth abutting portion are movable by the same amount of movement.

According to this application example, the positioning (centering) of the electronic component can be accurately performed by moving the third contact portion and the fourth contact portion by the same amount of movement.

APPLICATION EXAMPLE 11 In the electronic component conveyance device described in the above application example, it is preferable that the contact portion includes an adjustment portion capable of changing a contact position with the electronic component.

According to this application example, since the contact position of the contact part and the electronic component can be finely set by the adjustment part, the positioning (centering) of the electronic component can be performed more finely.

[Application example 12] The electronic component inspection device of this application example is characterized by comprising: a holding unit that is movably arranged on the base unit and capable of holding the above-mentioned electronic component on the first surface of the electronic component; , which is arranged to be movable relative to the above-mentioned base, and can be in contact with the second surface of the above-mentioned electronic component different from the above-mentioned first surface; the electronic component loading part, which can place the above-mentioned electronic component; and the inspection part, which When the electronic component is inspected, the abutting portion presses the electronic component in a second direction different from the first direction when the holding portion moves in a first direction relative to the base.

According to the electronic component inspection device described in this application example, it is possible to provide an electronic component inspection device capable of easily and accurately positioning (centering) an electronic component with a simple mechanism.

[Application Example 13] The electronic component transport device of this application example is characterized in that it is an electronic component transport device capable of transporting electronic components cut along a groove portion having a wall surface, and the electronic component transport device includes: a component arrangement unit, It is in contact with the first surface of the above-mentioned electronic component so that the above-mentioned electronic component can be arranged; The second surface of the electronic component contacts, the second surface includes the wall surface, and the contact portion contacts the wall surface.

According to the electronic component conveying device described in this application example, the abutting portion is cut (divided) from the groove portion, which is the second surface intersecting the first surface, of the electronic component arranged in contact with the component arrangement portion along the first surface. ) abuts against the wall surface of the groove portion of the electronic component, enabling positioning (for example, centering) of the electronic component. The wall surface of the groove portion of the electronic component is formed by, for example, a cutting device, so the positional accuracy with respect to the electronic component is high, and there are no burrs (portions protruding outward) and notches (parts recessed inward) when breaking, for example. ) equal and smooth surface state. Therefore, positioning (centering) of the electronic component can be easily performed by a simple mechanism in which the abutting portion abuts against the wall surface (second surface) of the groove portion of the electronic component.

[Application example 14] In the electronic component conveying device described in the above application example 13, it is preferable that the above-mentioned component arrangement unit includes: a holding unit that holds the above-mentioned electronic component and can move; The electronic component can be placed by moving in a second direction perpendicular to the two surfaces, and the contact portion can press the electronic component by relative movement between the holding portion and the mounting portion.

According to the electronic component conveying device described in this application example, the electronic component is pressed against the contact portion by the relative movement of the holding portion and the mounting portion. In this way, the position of the electronic component held movably can be moved by a simple mechanism based on the pressing of the abutting portion, and positioning (centering) can be easily performed.

[Application example 15] In the electronic component transportation device described in the above application example 14, it is preferable that the contact portion has a contact surface, and the contact surface is arranged on the placement portion so as to be able to contact with the contact surface held by the holding portion. The above-mentioned wall surfaces of the electronic component are in contact with each other.

According to the electronic component conveying device described in this application example, by bringing the contact surface of the contact portion into contact with the wall surface of the electronic component held by the holding portion, the electronic component can easily slide along the contact surface, thereby enabling easy Misalignment in the rotational direction of the electronic component (inclination in plan view when the first surface is made the front) is corrected.

[Application example 16] In the electronic component transport device described in the above application example 14, it is preferable that the abutting portion has an abutting surface, and the abutting surface is arranged in the holding portion so as to be able to contact with the The above-mentioned wall surfaces of the electronic component are in contact with each other.

According to the electronic component conveying device described in this application example, by bringing the abutting surface into abutment with the wall surface of the electronic component placed on the mounting portion, the electronic component can easily slide along the abutting surface, thereby enabling easy correction of the electronic component. Misalignment in the direction of rotation (inclination in plan view when the first surface is made to be the front).

[Application example 17] In the electronic component conveying device described in any one of the above-mentioned application examples 13 to 16, it is preferable that a plurality of the above-mentioned abutting parts are arranged, and they are arranged so that they can be connected from at least the above-mentioned second direction and the above-mentioned second direction. The third direction perpendicular to the direction presses the wall surface.

According to the electronic component conveying device described in this application example, by arranging a plurality of abutting parts, the wall surface is pressed from the second direction and the third direction, so it is possible to easily correct the deviation of the rotation direction of the electronic component (make the second 1 inclination in plan view when one side becomes the front).

[Application Example 18] In the electronic component transport device according to any one of the above application examples 13 to 17, it is preferable that the electronic component is held by the holding portion or the mounting portion by suction.

According to the electronic component conveyance device described in this application example, the adsorption force of the electronic component can be easily changed, and an appropriate adsorption force can be obtained. Thereby, the held electronic component can be easily moved (slided) by pressing the contact part, and positioning (centering) can be easily performed.

[Application example 19] In the electronic component transport device described in the above application example 18, it is preferable that the electronic component held on the above-mentioned holding section or the above-mentioned placing section is relatively small in the pressing direction relative to the holding section or the placing section. The frictional force is smaller than the pressing force based on the above-mentioned abutting portion.

According to the electronic component conveying device described in this application example, since the frictional force of the electronic component in the pressing direction relative to the holding part or the mounting part is smaller (weaker) than the pressing force by the contact part, it can Pressing the portion easily moves (slides) the electronic component, thereby enabling positioning (centering) of the electronic component.

[Application example 20] In the electronic component transport device according to the above application example 18 or 19, it is preferable that the abutting portion is in a direction in which the abutting portion is arranged relative to the holding position of the holding portion or the placing portion. It has a predetermined offset and is in contact with the wall surface of the held electronic component.

According to the electronic component conveyance device described in this application example, the electronic component can be positioned (centered) accurately and reliably by pressing the abutting portion from the direction in which the electronic component is shifted.

[Application example 21] The electronic component inspection apparatus of this application example is characterized in that it is an electronic component inspection apparatus capable of transporting an electronic component cut along a groove portion having a wall surface, and the electronic component inspection apparatus includes: a component placement unit, It abuts against the first surface of the above-mentioned electronic component so that the above-mentioned electronic component can be arranged; the abutting part is arranged so as to be movable relative to the above-mentioned component arrangement part and capable of intersecting with the first surface of the above-mentioned electronic component. The second surface abuts; an inspection unit inspects the electronic component, the second surface includes the wall surface, and the abutting portion abuts the wall surface.

According to the electronic component inspection device described in this application example, the abutting portion is cut (divided) from the groove portion, which is the second surface intersecting the first surface, of the electronic component arranged in contact with the component arrangement portion along the first surface. ) abuts against the wall surface of the groove portion of the electronic component, enabling positioning (for example, centering) of the electronic component. The wall surface of the groove portion of the electronic component is formed by, for example, a cutting device, so the positional accuracy with respect to the electronic component is high, and there is no burr left when broken, so the surface state of the wall surface is flat. Therefore, it is possible to provide an electronic component inspection device capable of easily and accurately positioning (centering) an electronic component by a simple mechanism in which the abutting portion abuts against the wall surface (second surface) of the groove portion of the electronic component.

Description of drawings

FIG. 1 is a layout diagram showing the outline of an electronic component inspection device according to a first embodiment of the present invention.

2 is a plan view schematically showing a transport unit and an inspection unit of the electronic component inspection device according to the first embodiment.

3 is a cross-sectional view (perpendicular cross-sectional view) showing an arm unit and an inspection unit of a transport unit of the electronic component inspection device.

4 is a cross-sectional view (vertical cross-sectional view) showing a pressed state of an electronic component by an arm unit.

Fig. 5 shows an arrangement example of the chuck portion of the arm unit, and is a plan view taken along line A-A of Fig. 3 .

6 is a cross-sectional view (vertical cross-sectional view) showing Modification 1 of the chuck portion of the arm unit.

7 is a cross-sectional view (vertical cross-sectional view) showing Modification 2 of the chuck portion of the arm unit.

8 is a cross-sectional view (vertical cross-sectional view) of an arm unit of a transport unit of the electronic component inspection device according to the second embodiment of the present invention.

9 is a cross-sectional view (vertical cross-sectional view) of an arm unit of a transport unit of an electronic component inspection device according to a third embodiment of the present invention.

10 is a layout diagram showing an outline of an electronic component inspection device according to a fourth embodiment of the present invention.

11 is a plan view schematically showing a transport unit and an inspection unit of the electronic component inspection device according to the fourth embodiment.

12 is a sectional view (perpendicular sectional view) showing an arm unit and an inspection unit of a transport unit of the electronic component inspection device.

13 is a cross-sectional view showing an outline (before cutting) of cutting (segmentation) of an electronic component (IC device).

FIG. 14 is a cross-sectional view showing a cut (divided) electronic component (IC device).

15A is a cross-sectional view showing an electronic component (IC device) held at an offset position when viewed from the Y-axis direction.

15B is a cross-sectional view (viewed in the Y-axis direction) showing a state where one abutting portion faces an electronic component (IC device) held at an offset position.

15C is a cross-sectional view (viewed in the Y-axis direction) showing an electronic component (IC device) positioned by one contact portion.

16A is a cross-sectional view showing an electronic component (IC device) held at an offset position when viewed from the X-axis direction.

16B is a cross-sectional view (viewed in the X-axis direction) showing a state where the other abutting portion faces an electronic component (IC device) held at a shifted position.

16C is a cross-sectional view (viewed in the X-axis direction) showing an electronic component (IC device) positioned by the other contact portion.

17A is a plan view showing an electronic component (IC device) held at an offset position when viewed from the Z-axis direction.

17B is a plan view (viewed in the Z-axis direction) showing a state where the abutting portion faces an electronic component (IC device) held at an offset position.

17C is a plan view (viewed in the Z-axis direction) showing an electronic component (IC device) positioned by the abutting portion.

18 is a cross-sectional view (vertical cross-sectional view) showing a transport unit (arm unit and reciprocating device) of an electronic component inspection device according to a fifth embodiment of the present invention.

FIG. 19A is a cross-sectional view showing an electronic component (IC device) held at a shifted position with respect to the suction portion when viewed from the Y-axis direction.

19B is a cross-sectional view (viewed in the Y-axis direction) showing a state where one abutting portion faces an electronic component (IC device) held at an offset position.

19C is a cross-sectional view (viewed in the Y-axis direction) showing an electronic component (IC device) positioned by one contact portion.

20A is a cross-sectional view showing an electronic component (IC device) held at a shifted position with respect to the suction portion when viewed from the X-axis direction.

20B is a cross-sectional view (viewed in the X-axis direction) showing a state where the other abutting portion faces an electronic component (IC device) held at an offset position.

20C is a cross-sectional view (viewed in the X-axis direction) showing an electronic component (IC device) positioned by the other contact portion.

21 is a layout diagram showing an outline of an electronic component inspection device according to a sixth embodiment of the present invention.

Explanation of reference signs

1... Inspection device; 2... Supply part; 3... Supply side arrangement part; 341... Loading table; 4... Transport part; 41... Reciprocating device; 411... Recess; 42...supply robot; 421...supporting frame; 422...moving frame; 423...arm unit; 43...inspecting robot; 430...suction flow path; 433... arm unit; 434...pad; 437...pad; 438...coil spring; 439...pad; 44...recovery robot; 441...supporting frame; 442...moving Frame; 443...arm unit; 45...first base; 452...through hole; 46...second base; 462...second through hole; 463...first through hole; 467...recessed part; 47...supporting part as the base; 471...inner cavity; 472...chuck supporting part; 473...inner ring; 474...outer ring; 476.. .End face; 48...lower end; 49...adsorption part as holding part; 491...upper end; 492...inner cavity; 493...adsorption surface; 494...flange ;495...recessed part; 496...connecting hole; 497...suction port; 5...inspection part; 51...loading part (electronic component mounting part); ...probe; 523...side wall; 524...bottom; 525...relief groove; 526...wiring; 54...load board (circuit board); Arrangement part; 61... chuck part (1st chuck part); 62... chuck part (2nd chuck part); 61m, 62m... chuck part when releasing; 611, 621. ..connecting part; 612, 622... shaft; 613, 623... the other end; 614, 624... one end; 615, 625... connecting part; 63... chuck part (3rd chuck part); 64... chuck part (4th chuck part); 7... recovery part; 8... control part; 9... IC device; 91... main body part ;92...terminal; 10...conveyor; 11...base; 111...base surface; 12...cover; 13...injector; m1...arrow; m2, m3...arrow (second direction (first moving direction)); G...center of gravity; φd1...diameter of suction port; φd2...diameter of end surface.

detailed description

Hereinafter, the electronic component transport device and the electronic component inspection device of the present invention will be described in detail based on the embodiments shown in the drawings.

In addition, below, for convenience of description, as shown in the drawing, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. In addition, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. In addition, the direction parallel to the X axis is also called "X direction" or "second direction", the direction parallel to the Y axis is called "Y direction" or "third direction", and the direction parallel to the Z axis is also called "X direction" or "second direction". It is called "Z direction" or "first direction". In addition, the directions of the arrows of the X-axis, the Y-axis, and the Z-axis are also referred to as positive sides (positive directions), and the directions opposite to the arrows are also referred to as negative sides (negative directions). In addition, the "horizontal" referred to in the specification of this application is not limited to a perfect level, and includes a slightly (for example, less than about 5°) inclined state relative to the horizontal as long as it does not hinder the transportation of electronic components.

In addition, in the following embodiments, the positive side in the Z direction in the drawings is referred to as "up" or "upper", and the negative side in the Z direction is referred to as "down" or "below".

In addition, the inspection apparatus (electronic component inspection apparatus) shown in the following figures is used to inspect IC devices such as BGA (BallGrid Array) packages, LGA (Land Grid Array) packages, LCD (Liquid Crystal Display), OLED (Organic Electroluminescence Display), display devices such as electronic paper, various sensors such as CIS (CMOS Image Sensor), CCD (Charge Coupled Device), acceleration sensor, gyro sensor, pressure sensor, etc., and electronic components such as various oscillators including crystal oscillators A device for inspecting and testing (hereinafter simply referred to as "inspection") for electrical characteristics. In addition, below, for convenience of explanation, the case where the above-mentioned IC device is used as an electronic component to be inspected will be described as a representative, and this will be referred to as "IC device 9".

<First Embodiment>

First, an electronic component inspection device according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 5 . FIG. 1 is a layout diagram showing the outline of an electronic component inspection device according to a first embodiment of the present invention. 2 is a plan view schematically showing a transport unit and an inspection unit of the electronic component inspection device according to the first embodiment. 3 is a cross-sectional view (vertical cross-sectional view) of an arm unit and an inspection unit of a transport unit of the electronic component inspection device. 4 is a cross-sectional view (vertical cross-sectional view) showing a pressed state of an electronic component by the arm unit shown in FIG. 3 . Fig. 5 shows an example of arrangement of the chuck portion of the arm unit, and is a plan view viewed from the position A-A of Fig. 3 . In addition, in FIG. 3 and FIG. 4, one of the some arm units of a conveyance part is shown in figure.

As shown in FIG. 1 , an inspection apparatus 1 as an inspection apparatus for electronic components includes a supply unit 2 , a supply-side arrangement unit 3 , a conveyance unit 4 , an inspection unit 5 , a recovery-side arrangement unit 6 , a recovery unit 7 , and a system for carrying out these parts. The control part 8 of the control. In addition, the inspection device 1 has: a base 11 for arranging the supply unit 2, the supply-side arrangement unit 3, the transport unit 4, the inspection unit 5, the recovery-side arrangement unit 6, and the recovery unit 7; and a cover 12 for accommodating The supply-side alignment unit 3 , the transport unit 4 , the inspection unit 5 , and the recovery-side alignment unit 6 are covered on the base 11 . In addition, the base surface 111 which is the upper surface of the base 11 is substantially horizontal, and the constituent members of the supply-side alignment unit 3 , the transport unit 4 , the inspection unit 5 , and the collection-side alignment unit 6 are disposed on the base surface 111 .

Such an inspection apparatus 1 is configured such that the supply unit 2 supplies IC devices 9 to the supply-side array unit 3, arranges the supplied IC devices 9 on the supply-side array unit 3, and the transport unit 4 transports the arrayed IC devices 9 to the inspection unit. 5. The inspection unit 5 inspects the transported IC devices 9, the transport unit 4 transports/arranges the inspected IC devices 9 to the recovery side alignment unit 6, and the recovery unit 7 recovers the ICs arranged in the recovery side alignment unit 6. Device 9.

According to such an inspection apparatus 1 , supply, inspection, and collection of IC devices 9 can be automatically performed. In addition, in the inspection device 1, the transfer device is constituted by a part of the supply unit 2, the supply side arrangement unit 3, the transfer unit 4, the recovery side arrangement unit 6, the recovery unit 7, and a part of the control unit 8 other than the inspection unit 5 ( Electronic component delivery device) 10. The transport device 10 performs transport of the IC device 9 and the like.

Furthermore, as shown in FIG. 3 , the IC device 9 has a main body 91 and a plurality of terminals (electrodes) 92 provided outside the main body 91 . Each terminal 92 is electrically connected to the circuit part inside the main body part 91 . The shape of the main body portion 91 is not particularly limited, but in the present embodiment, the main body portion 91 has a substantially plate shape, and has a quadrangular shape in plan view when viewed from the Z direction. In addition, this quadrilateral is a square or a rectangle in this embodiment. In addition, each terminal 92 is provided on the lower part (or side part) of the main body part 91, and has a spherical shape, a hemispherical shape, or a flat plate shape, for example.

Hereinafter, the configurations of the transport unit 4 and the inspection unit 5 will be described.

"Department of Shipping"

As shown in FIG. 2 , the transport unit 4 constituting the electronic component transport device transports the IC devices 9 placed on the mounting table 341 of the supply-side array unit 3 to the inspection unit 5 , and completes the inspection by the inspection unit 5 . The IC devices 9 are transported to the unit of the collection side arrangement section 6 . Such a transport unit 4 has a reciprocating device 41 , a supply robot 42 , an inspection robot 43 , and a collection robot 44 .

-Reciprocating device-

The reciprocating device 41 is used to transport the IC devices 9 placed on the table 341 to the vicinity of the inspection section 5, and is further used to transport the inspected IC devices 9 inspected by the inspection section 5 to the vicinity of the collection side alignment section 6. reciprocating device. In such a reciprocating device 41, four recesses 411 for accommodating the IC device 9 are formed side by side along the X direction. In addition, the reciprocating device 41 is guided by a linear motion guide, and can reciprocate in the X direction by a drive source such as a linear motor.

-Supply Robot-

The supply robot 42 is a robot that transports the IC devices 9 placed on the mounting table 341 to the shuttle 41 . Such a supply robot 42 has: a supporting frame 421 supported by the base 11, a moving frame 422 supported by the supporting frame 421 and capable of reciprocating in the Y direction relative to the supporting frame 421, and four arm units supported by the moving frame 422. (manipulating the robot)423. Each arm unit 423 is equipped with a lifting mechanism and a suction nozzle, and can hold the IC device 9 by suction.

-check the robot-

The inspection robot 43 is a robot that transports the IC device 9 stored in the shuttle 41 to the inspection unit 5 and transports the IC device 9 that has been inspected from the inspection unit 5 to the shuttle 41 . Also, during inspection, the inspection robot 43 can press the IC device 9 against the inspection section 5 through the suction section 49 of the arm unit 433 and apply a predetermined inspection pressure to the IC device 9 .

As shown in FIG. 2, such an inspection robot 43 has: a support frame 431 supported by the base 11, a moving frame 432 supported by the support frame 431 and capable of reciprocating movement in the Y direction relative to the support frame 431, and a moved frame 432. Four arm units (handling robot) 433 are supported. The arrangement of each arm unit 433 is not particularly limited, and the illustrated arrangement is an example. In addition, each arm unit 433 is provided with the adsorption|suction part 49 (refer FIG. 3) etc. which adsorb|suck the IC device 9 so that it may mention later.

-Recycling robot-

The collection robot 44 is a robot that transports the IC device 9 that has been inspected by the inspection unit 5 to the collection side alignment unit 6 . Such a recovery robot 44 has: a supporting frame 441 supported by the base 11, a moving frame 442 supported by the supporting frame 441 and capable of reciprocating movement in the Y direction relative to the supporting frame 441, and four arm units supported by the moving frame 442. (manipulating the robot)443. Each arm unit 443 is provided with a lifting mechanism and a suction nozzle, and can hold the IC device 9 by suction.

Such a transport unit 4 transports the IC device 9 as follows. First, the reciprocating device 41 moves to the left side in the figure (negative X direction), and the supply robot 42 transports the IC device 9 placed on the mounting table 341 to the reciprocating device 41 (STEP1). Next, the reciprocating device 41 moves toward the center (positive X direction), and the inspection robot 43 transports the IC device 9 on the reciprocating device 41 to the inspection unit 5 (STEP2). Next, the inspection robot 43 transports the IC device 9 that has been inspected by the inspection unit 5 toward the shuttle 41 (STEP 3 ). Next, the reciprocating device 41 moves to the right side (positive X direction) in the figure, and the collection robot 44 transports the inspected IC devices 9 on the reciprocating device 41 to the collection side arrangement unit 6 (STEP4). By repeating such STEP1 to STEP4, the IC devices 9 arranged on the mounting table 341 of the supply-side array section 3 can be transported to the collection-side array section 6 via the inspection section 5 .

The configuration of the transport unit 4 has been described above, but as the structure of the transport unit 4, as long as the IC device 9 on the mounting table 341 can be transported to the inspection unit 5, the IC device 9 that has completed the inspection can be transported to the collection side. The transportation of the alignment unit 6 is not particularly limited. For example, the reciprocating device 41 may also be omitted, and any one of the supply robot 42, the inspection robot 43, and the collection robot 44 may carry out transportation from the loading table 341 to the inspection section 5 and alignment from the inspection section 5 to the collection side. Part 6 Shipping.

"Inspection Department"

The inspection unit 5 is a unit (tester) for inspecting and testing the electrical characteristics of the IC device 9 . As shown in FIG. 3 , the inspection unit 5 is used with a mounting portion (electronic component mounting portion) 51 detachably attached to a load board (circuit board) 54 built in the inspection portion 5 .

The mounting portion 51 is, for example, a resin socket for holding and mounting the IC device 9 , and can be replaced according to the type of the IC device 9 . Four recesses 52 (see FIG. 2 ) for accommodating the IC device 9 and an escape groove 525 for lowering the chuck parts 61 and 62 to be described later are provided on the upper surface of the mounting part 51 . The recessed portion 52 (see FIG. 2 ) can house and place IC devices 9 one by one. In addition, the number of recesses 52 formed is four in this embodiment, but is not limited thereto, and may be one, two, three, or five or more. In addition, the arrangement of the recesses 52 is arranged in one row along the X direction in this embodiment, but it is not limited to this, and may be arranged in a plurality of rows and rows along the X direction and the Y direction, or may be arranged along the Y direction. for 1 column.

As shown in FIG. 3 , the side wall portion 523 of each concave portion 52 has an inclined slope shape, thereby facilitating the insertion and removal of the IC device 9 . In addition, a plurality of probes (first conductive members) 522 electrically connectable (contactable) to the plurality of terminals 92 of the IC device 9 are provided on the bottom portion 524 of the concave portion 52 . Each probe 522 is electrically connected to the control unit 8 via wiring 526 provided on the load board 54 .

Each terminal 92 of IC device 9 placed on each recess 52 is pressed by arm unit 433 of inspection robot 43 against each probe 522 with a predetermined inspection pressure (see FIG. 4 ). Accordingly, each terminal 92 of the IC device 9 is electrically connected (contacted) to each probe 522 , and the IC device 9 is inspected via the probe 522 . The inspection of the IC device 9 is performed based on the program stored in the control unit 8 . In addition, each probe 522 may be configured to be able to expand and contract with respect to the bottom 524 .

"Department of Control"

The control unit 8 includes, for example, an inspection control unit and a drive control unit. The inspection control unit performs, for example, an inspection of the electrical characteristics of the IC device 9 arranged in the inspection unit 5 based on a program stored in a memory not shown. Also, the drive control unit controls the drive of each of the supply unit 2 , supply side alignment unit 3 , transport unit 4 , inspection unit 5 , recovery side alignment unit 6 , and recovery unit 7 to transport the IC devices 9 , for example. In addition, the control unit 8 can also perform temperature control of the IC device 9 .

Then, when performing an inspection of the electrical characteristics of the IC device 9, it is necessary to accurately match the positions of the terminals 92 of the IC device 9 with the positions of the probes 522 of the inspection section 5, and place the IC device 9 on a mounting surface. Section 51. In particular, for a small package or an IC device 9 with a multi-pin structure, the pitch between the terminals 92 is extremely narrow, and accordingly the pitch between the probes 522 is also narrow. The alignment between the terminals 92 and the probes 522 of the inspection unit 5 is more important. Of course, if the positions of the terminals 92 and the probes 522 are misaligned, the desired inspection cannot be performed, and it can be judged that the IC device 9 obtained through such an inspection has low reliability as a product. Hereinafter, the configuration of the arm unit 433 having an alignment function (alignment function) for preventing such a positional shift of the IC device 9 will be described.

-arm unit-

As shown in FIGS. 3 and 4 , the arm unit 433 has a structure that holds the IC device 9 (see FIG. 3 ) and can press the held IC device 9 against the mounting portion 51 (see FIG. 4 ).

The arm unit 433 has a first substrate 45, a second substrate 46, a support portion 47 as a base, a lower end portion 48, an adsorption portion 49 as a holding portion, and chuck portions 61 and 62 as abutting portions arranged in order from above. . In addition, a plurality of chuck parts 61 and 62 serving as abutting parts that function as positioning of the IC device 9 shown in FIGS. 3 and 4 are arranged. In this embodiment, as shown in FIG. 5 , chuck parts 61 and 62 provided on both sides along the X-axis direction with the suction part 49 interposed therebetween, and chuck parts 61 and 62 provided along the Y-axis direction with the suction part 49 interposed therebetween are provided. Chuck parts 63, 64 on both sides. In this embodiment, four chuck parts 61 , 62 , 63 , and 64 are shown, but the present invention is not limited thereto, and the number of arrangements, arrangement positions, and the like can be appropriately changed.

In addition, in this embodiment, the chuck part 61 corresponds to the first chuck part as the first contact part, the chuck part 62 corresponds to the second chuck part as the second contact part, and the chuck part 63 corresponds to the second chuck part as the second contact part. The chuck portion 64 corresponds to the third chuck portion as the third contact portion, and the chuck portion 64 corresponds to the fourth chuck portion as the fourth contact portion. The chuck parts 61 , 62 , 63 , and 64 each have the same configuration, and in the following description, the chuck parts 61 and 62 will be described as examples.

The first substrate 45 has a function of supporting the arm unit 433 and the like with respect to the moving frame 432 (see FIG. 2 ). The first substrate 45 has a planar upper surface and a lower surface. In addition, in the first substrate 45 , through-holes 452 constituting a part of the suction flow path 430 are opened on the upper and lower surfaces, and are connected to the ejector 13 as an air suction source on the upper surface side. Then, when the ejector 13 operates, the suction flow path 430 becomes a negative pressure state (vacuum state), and the IC device 9 can be adsorbed by the adsorption portion 49 .

In addition, when the ejector 13 operates, the space formed by the through-holes 452, 462, 463, etc. in the suction flow path 430 becomes a negative pressure state (vacuum state), so that the adsorption portion 49 can be moved upward (positive) with respect to the support portion 47. Z direction) to move. In this way, the suction of the IC device 9 and the movement of the suction portion can be performed by the same suction source (ejector 13 ), and a simpler mechanism can be obtained. In addition, in order to release this adsorption, it can be performed by performing vacuum breaking by the ejector 13.

The second substrate 46 is constituted by a plate member in this embodiment, and has a planar upper surface and a lower surface. In the arm unit 433 , the lower surface of the first substrate 45 is in contact with the upper surface of the second substrate 46 . In addition, a first through-hole 463 opening on the upper surface and a second through-hole 462 communicating with the first through-hole 463 and opening on the lower surface are formed in the second substrate 46, and are connected to the first substrate 45 on the upper surface side. The through hole 452 communicates. Accordingly, the first through hole 463 and the second through hole 462 can constitute a part of the suction flow path 430 together with the through hole 452 .

An annular recess 464 formed concentrically with the first through hole 463 and the second through hole 462 is formed on the upper surface of the second substrate 46 . The ring-shaped packing 434 is inserted into the concave portion 464 in a compressed state, whereby the airtightness between the first through hole 463 and the second through hole 462 constituting a part of the suction flow path 430 and the through hole 452 can be maintained.

In addition, the constituent materials of the first substrate 45 and the second substrate 46 are not particularly limited, and for example, various metal materials can be used, among which aluminum or an aluminum alloy is preferably used. By using aluminum or an aluminum alloy, it is possible to reduce the weight of the arm unit 433 .

The support portion 47 serving as a base supports a suction portion (holding portion) 49 for suctioning the IC device 9 so as to be movable (slidable) in the vertical direction. Furthermore, the support portion 47 rotatably supports the chuck portions 61 and 62 . The support portion 47 is constituted by a disk-shaped member in the present embodiment, and its planar upper surface is in contact with the lower surface of the second substrate 46 . In addition, the support portion 47 has a structure including an inner ring 473 , an outer ring 474 arranged concentrically with the inner ring 473 , and a chuck support portion 472 provided on the outer ring 474 .

The inner cavity portion 471 of the inner ring 473 communicates with the second through hole 462 of the second substrate 46 on the upper surface side (positive Z direction side). Thus, the lumen portion 471 can constitute a part of the suction flow path 430 . In addition, a part (upper end portion 491 ) of the adsorption portion 49 is inserted into the inner cavity portion 471 from the lower surface side (negative Z direction side).

An annular recess 467 formed concentrically with the inner ring 473 is formed above the connecting portion of the inner ring 473 and the outer ring 474 . The ring-shaped packing 437 is inserted into the concave portion 467 in a compressed state, whereby the airtightness between the inner cavity portion 471 and the first through hole 463 and the second through hole 462 can be maintained.

On the other hand, a coil spring 438 as an elastic member is disposed outside the inner ring 473 and below the outer ring 474 . When the coil spring 438 is stretched, its upper end is connected to the outer ring 474 , and its lower end is connected to the flange portion 494 of the adsorption portion 49 . Thereby, it is possible to bias the suction portion 49 downward. In addition, an inner ring 473 is inserted inside the coil spring 438 . Thereby, the coil spring 438 is supported from the inner side, thereby being able to expand and contract stably (see FIG. 3 and FIG. 4 ).

In addition, the chuck support portion 472 is disposed outside the inner ring 473 and located below the outer ring 474 on the outer side of the position where the coil spring 438 is disposed. The chuck support portions 472 are provided at positions corresponding to the four chuck portions 61 , 62 , 63 , and 64 , respectively. The chuck supporting portion 472 has a groove portion into which the chuck portions 61, 62 (63, 64) can be movably fitted, respectively, and supports the chuck portions 61, 62 so as to be rotatable, respectively, via shafts 612, 622 to be described later. .

The suction portion 49 as a holding portion is a member that suctions the IC device 9 and presses it against the placement portion 51 . The suction part 49 has a cylindrical shape, and its upper end part 491 fits into the inner cavity part 471 of the inner ring 473 of the support part 47 in a "loose fit" or "overfit" state. Thereby, the adsorption|suction part 49 can move stably in an up-down direction.

The suction portion 49 comes into contact with the upper surface (first surface) of the IC device 9 at a position where the lower end moves. In addition, at the position of the moving lower end of the suction part 49, the chuck parts 61 and 62 to be described later are retracted and opened. Then, by bringing the suction channel 430 into a negative pressure state (vacuum state), the suction unit 49 suctions the IC device 9 on the suction surface 493 and moves to the upper end position (moves in the first direction indicated by arrow m1 in FIG. 3 ). At this time, the chuck parts 61 and 62 for positioning described later are moved in the direction toward the IC device 9 (the second direction shown by the arrows m2 and m3 in FIG. The IC device 9 can be centered by contacting the outer peripheral surface (second surface) of the IC device 9 . And the suction part 49 moves downward (opposite to the first direction) along with the lowering of the arm unit 433, and presses the IC device 9 to the mounting part 51 (refer to FIG. 4 ). rise and move upward. Then, when the negative pressure state (vacuum state) of the suction channel 430 is released, the suction part 49 releases the suction of the IC device 9 and moves to the position of the lower end. In addition, the positions of the moving lower end and the moving upper end of the suction part 49 can be changed depending on, for example, the type of the IC device 9 .

One opening of the cavity portion 492 of the suction unit 49 communicates with the first through hole 463 of the second substrate 46 , and the other communicates with the suction port 497 through the connection hole 496 . Accordingly, the lumen portion 492 , the connection hole 496 , and the suction port 497 can constitute a part of the suction flow path 430 . Then, as described above, when the ejector 13 operates, the suction flow path 430 becomes a negative pressure state (vacuum state), whereby the IC device 9 can be adsorbed. At this time, the suction surface 493 of the suction portion 49 and the upper surface of the main body portion 91 of the IC device 9 are in close contact with each other, and the suction flow path 430 is hermetically sealed by the close contact. Accordingly, the negative pressure state of the suction flow path 430 can be maintained, thereby preventing the IC device 9 from coming off the adsorption portion 49 .

A flange portion 494 constituted by an enlarged diameter portion whose outer diameter is enlarged is formed on the outer peripheral portion of the adsorption portion 49 . The upper surface of the flange portion 494 abuts against the spring seat connecting the lower end of the coil spring 438 and the one end portions 614, 624 of the chuck portions 61, 62, and functions as a driving surface for vertical movement. In addition, the lower surface of the flange portion 494 functions as a stopper (abutment) that comes into contact with the lower end portion 48 when the suction portion 49 moves downward to stop the movement of the suction portion 49 .

An annular concave portion 495 formed concentrically with the upper end portion 491 is formed on the upper end portion 491 of the suction portion 49 fitted into the inner cavity portion 471 of the inner ring 473 of the support portion 47 . The ring-shaped packing 439 is inserted into the concave portion 495 in a compressed state. The packing 439 has elasticity, so that the contact area between the suction part 49 and the inner ring 473 (inner cavity part 471 ) can be suppressed, thereby reducing sliding resistance, and the suction part 49 can move smoothly in the inner ring 473 . In addition, the packing 439 can maintain the airtightness of the suction flow path 430 even when the suction part 49 is moving (sliding).

The chuck parts 61 , 62 (chuck parts 63 , 64 ), which are abutting parts, have a function of aligning (centering) the IC device 9 sucked by the sucking part 49 . The chuck parts 61 and 62 are connected to the chuck support part 472 provided on the outer ring 474 of the support part 47 serving as a base via shafts 612 and 622, and are arranged so as to be rotatable (movable) about the shafts 612 and 622.

The chuck portions 61 , 62 have one end portion 614 , 624 located on the flange portion 494 side of the adsorption portion 49 , and the other end portion 613 , 623 located on the opposite side to the shafts 612 , 622 . One end portions 614 and 624 are in contact with the upper surface of the flange portion 494 , and the other end portions 613 and 623 are in contact with the outer peripheral surface (second surface) of the IC device 9 . In addition, the outer peripheral surface (second surface) of the IC device 9 can also be called the side surface of the IC device 9 . Furthermore, the one end portions 614 and 624 move in conjunction with the movement of the flange portion 494 of the suction portion 49 in contact with the movement along the first direction. The movement of the one end portion 614, 624 causes the chuck portion 61, 62 to rotate around the shaft 612, 622, whereby the other end portion 613, 623 can move in the second direction (the first direction) perpendicular to the first direction. moving direction) (directions of arrows m2 and m3 shown in FIG. 3 ) to move.

Specifically, the chuck portion (first chuck portion) 61 and the chuck portion (second chuck portion) 62 face in opposite directions to each other in a second direction (first moving direction) perpendicular to the first direction. By moving the same amount of movement, the outer peripheral surface (second surface) of the IC device 9 is pressed. In this way, the plurality of chuck parts (first chuck part) 61 and chuck part (second chuck part) 62 are respectively moved in the first moving direction from opposite directions with the same amount of movement, and the IC device 9 Since pressing is performed, the positioning (centering) of the IC device 9 can be performed easily and accurately.

In addition, the chuck part (third chuck part) 63 and the chuck part (fourth chuck part) 64 provided on both sides of the suction part 49 along the Y-axis direction shown in FIG. The second moving direction perpendicular to the first moving direction moves in opposite directions by the same amount of movement, and presses the outer peripheral surface (second surface) of the IC device 9 . In other words, by the chuck part (the 3rd chuck part) 63 and the chuck part (the 4th chuck part) 64, it is possible to align with the chuck part (the 1st chuck part) 61 and the chuck part ( The second chuck portion) 62 presses the outer peripheral surface (second surface) of the IC device 9 in a direction perpendicular to the outer peripheral surface (second surface) of the IC device 9 .

In this way, the plurality of abutting portions (chuck portions 61, 62, 63, 64) can abut and press against the IC device 9 by moving in two orthogonal directions (the first moving direction and the second moving direction). The outer peripheral surface (second surface) enables easy and more reliable positioning (centering) of the IC device 9 .

In addition, it is preferable that the front end portion abutting on the upper surface of the flange portion 494 of one end portion 614, 624 and the front end portion abutting on the outer peripheral surface (second surface) of the IC device 9 of the other end portion 613, 623 Be spherical or hemispherical, respectively. In particular, the tip portion abutting on the upper surface of the flange portion 494 of the one end portion 614, 624 moves in the first direction while sliding on the upper surface of the flange portion 494. Therefore, in order to reduce the frictional resistance due to sliding , preferably spherical or hemispherical.

In this way, the chuck parts 61 and 62 are rotatable with respect to the chuck support part 472 provided on the outer ring 474 of the support part 47, whereby the IC device 9 can be pressed in the second direction by a simple mechanism. In addition, since the movement of the flange portion 494 of the suction portion 49 in the first direction is used as the drive source for the rotation of the chuck portions 61, 62, the movement of the suction portion 49 can be synchronized with the chuck portions 61, 62 by a simple mechanism. rotation linkage. In addition, since the outer peripheral surface (second surface) of the IC device 9 is pressed from a direction (second direction) perpendicular to the upper surface (first surface) on which the IC device 9 is held, it can be reliably and accurately pressed. Alignment (centering) of the IC device 9 .

In addition, one end portion 614 and the other end portion 613 are connected by connection portions 615 and 611 , and a fitting hole (not shown) to be fitted with the shaft 612 is provided in the connection portion 611 . In addition, the other one end portion 624 and the other end portion 623 are connected by connection portions 625 and 621 , and a fitting hole (not shown) to be fitted with the shaft 622 is provided in the connection portion 621 . The connection parts 615 and 611 are inclined with respect to the Z direction, and the center of gravity G of the chuck part 61 is located above the axis 612 and on the suction part 49 side. Similarly, the connecting portions 625 and 621 are configured to have an inclination with respect to the Z direction, and the center of gravity G of the chuck portion 62 is located above the axis 622 and on the suction portion 49 side. By positioning the center of gravity G in this way, the one end portions 614 , 624 can be brought into contact with the flange portion 494 by the own weight of the chuck portions 61 , 62 , and the installation structure of the chuck portions 61 , 62 can be simplified.

The chuck parts 61 and 62 move the suction part 49 downward (opposite to the first direction), and the other end parts 613 and 623 move in a direction away from the suction part 49 (opposite to the second direction). The states of the suction part 49 and the chuck parts 61 and 62 after the movement are shown by two-dot chain lines in FIG. 3 . That is, in conjunction with moving the suction portion 49 downward (the direction opposite to the first direction), the chuck portions 61, 62 are rotated in the direction in which the other end portion 613, 623 is opened, and become the chuck shown by the two-dot chain line. The states of the disk portions 61m and 62m. In addition, the suction portion 49 is in contact with the upper surface (first surface) of the IC device 9 at the position of the moving lower end of the suction portion 49 in the state where the chuck portions 61 and 62 are opened.

In addition, the chuck parts 61, 62 are linked with moving the suction part 49 upward (the first direction indicated by the arrow m1 in the figure), and the other end parts 613, 623 are directed toward the side of the suction part 49 (indicated by the arrow m1 in the figure). The second direction) indicated by the arrows m2 and m3 moves. Then, when the chuck portions 61, 62 move in the second direction, the other end portions 613, 623 press the outer peripheral surfaces (second surfaces) of the IC device 9 in directions facing the center side, respectively. By moving the IC device 9 , alignment (centering) of the IC device 9 can be performed.

At this time, the adsorption unit 49 adsorbs the IC device 9 on the adsorption surface 493 by bringing the suction flow path 430 into a negative pressure state (vacuum state). Here, the suction force F1 of the IC device 9 needs to be greater than the weight W1 of the IC device 9 . In addition, in the alignment (centering) of the IC device 9, the suction position of the IC device 9 is moved and corrected by pressing the chuck parts 61 and 62. It is necessary to make the pressing force P of the chuck parts 61 and 62 larger. That is, the relationship of P>F1>W1...(1) is established.

In addition, the suction force F1 of the IC device 9 is obtained from the correlation (product) of the cross-sectional area obtained from the diameter φd1 of the suction port 497 and the suction force of the injector 13 as the suction source. In addition, the pressing force P of the chuck parts 61 and 62 is caused by the moving force F2 of the upward movement of the suction part 49 and the one end parts 614 and 624 and the other end of the chuck parts 61 and 62 with the shafts 612 and 622 as fulcrums. The position (leverage principle) of the parts 613 and 623 is determined by the correlation.

In addition, the upward movement of the suction part 49 is performed while the suctioned IC device 9 is moved by being pressed by the chuck parts 61 and 62 . Therefore, the moving force F2 for moving the suction part 49 upward is set to be higher than the contact resistance (frictional force) R1 between the suction part 49 and the inner ring 473 (including the inner cavity part 471 and the packing 439 ) and the coil spring 438 . The sum of the spring force C1 and the pressing force P of the chuck parts 61 and 62 is large. That is, it becomes the relationship of F2>R1+C1+P...(2).

In addition, the moving force F2 of the upward movement of the adsorption part 49 is determined by the cross-sectional area of the adsorption part 49 obtained from the diameter φd2 of the end surface 476 of the upper end part 491 and the correlation (product) with the suction force of the ejector 13 as the suction source. ) to find out.

Here, the suction force of the ejector 13 as the suction source is the same, so by selecting the diameter φd1 of the suction port 497 and the diameter φd2 of the end surface 476 of the upper end portion 491 of the suction portion 49, the suction force F1 and the movement can be set. Force F2.

As shown in FIG. 4 , the lower end portion 48 can come into contact with the mounting portion 51 when the arm unit 433 presses the IC device 9 to the mounting portion 51 . The lower end portion 48 is formed of an annular member, and is connected to a chuck support portion 472 provided on an outer ring 474 of the support portion 47 . The upper surface of the lower end portion 48 functions as a contact member (stopper) that abuts against the flange portion 494 of the adsorption portion 49 to determine a stop position on the lower side of the adsorption portion 49 . Further, the lower end portion 48 is disposed at a position different from the adsorption portion 49 that is in direct contact with the IC device 9 , that is, concentrically with the adsorption portion 49 so as to surround the adsorption portion 49 . In addition, the lower surface 481 of the lower end portion 48 is the lowermost surface of the arm unit 433 except for the portion of the adsorption portion 49 that is in contact with the IC device 9 . Therefore, the lower end portion 48 includes the above-mentioned lowermost surface of the arm unit 433 .

The constituent materials of the above-mentioned support portion (base portion) 47, lower end portion 48, and adsorption portion (holding portion) 49 are not particularly limited. For example, various metal materials can be used. Among them, carbon steel is preferably used, and others may be aluminum, copper etc. Carbon steel is preferable because of its stable strength and good wear resistance.

In addition, the portion having the lower end portion 48 (hereinafter referred to as “the former”) and the portion on which the lower end portion 48 abuts (hereinafter referred to as the “latter”) are the arm unit 433 of the inspection robot 43 in this embodiment, and the former is the arm unit 433 of the inspection robot 43 . The latter is the placement unit 51 of the inspection unit 5, but is not limited thereto. For example, the former may be the arm unit 423 of the supply robot 42 and the latter may be the reciprocating device 41 , or the former may be the arm unit 433 of the inspection robot 43 and the latter may be the reciprocating device 41 .

According to the inspection device (electronic component inspection device) 1 of the first embodiment described above, the transport unit 4 is provided as the electronic component transport device. As a result, when the suction portion 49 as a holding portion for suctioning the IC device 9 as an electronic component moves in the first direction relative to the support portion 47 as a base, the chuck portions 61 and 62 as abutting portions move toward each other. By pressing the IC device 9 in the second direction (orthogonal) different from the first direction, the IC device 9 can be positioned (centered). In this way, positioning (centering) of the IC device 9 can be easily performed by a simple mechanism.

"Modification of contact part"

In addition, the modification examples shown below can be applied to the chuck parts 61 and 62 which are contact parts. Hereinafter, modifications of the chuck portions 61 and 62 will be described with reference to FIGS. 6 and 7 . FIG. 6 is a cross-sectional view (vertical cross-sectional view) showing Modification 1 of the chuck portion of the arm unit 433a. FIG. 7 is a cross-sectional view (vertical cross-sectional view) showing Modification 2 of the chuck portion of the arm unit 433b. In addition, in the description of this modification, the structure different from the said 1st Embodiment is demonstrated, and the same code|symbol is attached|subjected to the structure same as 1st Embodiment, and description is abbreviate|omitted.

(Modification 1)

The chuck parts 61a and 62a which are the abutting parts of Modification 1 shown in FIG. 6 have the function of aligning (centering) the IC device 9 sucked by the sucking part 49 as in the first embodiment. The chuck parts 61a, 62a are connected to the chuck support part 472 provided on the outer ring 474 of the support part 47 serving as the base via shafts 612, 622, and are arranged so as to be rotatable about the shafts 612, 622.

The chuck parts 61a, 62a have: one end part 614, 624 located on the side of the flange part 494 of the adsorption part 49, which is the same as that of the first embodiment; The other ends (adjustment parts) 81 and 82 of different structures. One end portions 614 and 624 are in contact with the upper surface of the flange portion 494 , and the other end portions 81 and 82 are in contact with the outer peripheral surface (second surface) of the IC device 9 .

The other end portions 81, 82 as adjustment portions are formed by screwing screw members 811, 821 provided with hemispherical front end portions 812, 822 into unillustrated threaded portions (external threads) provided on the connection portions 611a, 621a. be fixed. The other end portions 81 and 82 as adjustment portions are arranged so as to be able to change the contact position with the IC device 9 .

With the structure of Modification 1, it is possible to finely adjust the contact position of the other end portions 81, 82 with the outer peripheral surface (second surface) of the IC device 9, and it is possible to easily perform the pressing by the chuck portions 61a, 62a. Fine-tuning of input volume. Therefore, the positioning (centering) of the IC device 9 can be performed more finely.

(Modification 2)

The chuck parts 61b and 62b as the abutting parts of Modification 2 shown in FIG. 7 have the function of aligning (centering) the IC device 9 sucked by the sucking part 49 as in the first embodiment. The chuck parts 61b, 62b are connected to the chuck support part 472 provided on the outer ring 474 of the support part 47 serving as a base via shafts 612, 622, and are arranged so as to be rotatable around the shafts 612, 622.

The chuck parts 61b and 62b have one end part (adjustment part) 85 and 86 located on the side of the flange part 494 of the adsorption part 49 and having a structure different from that of the first embodiment, and one end part located opposite to the shafts 612 and 622 . The side and the other end portions 613, 623 are the same as those in the first embodiment. One end portions 85 and 86 are in contact with the upper surface of the flange portion 494 , and the other end portions 613 and 623 are in contact with the outer peripheral surface (second surface) of the IC device 9 .

One end portion (adjustment portion) 85, 86 is configured such that a screw member 851, 861 having a hemispherical front end portion 852, 862 is screwed into an unillustrated thread portion (external thread) provided on the connection portion 615b, 625b to be fixed. fixed. The one end portions 85 and 86 as adjustment portions are arranged so that the contact position with the flange portion 494 can be changed. That is, by changing (adjusting) the contact position between one end portion 85, 86 and the flange portion 494, the contact position between the other end portion 613, 623 and the outer peripheral surface (second surface) of the IC device 9 can be changed (adjusted). The connection position, and then the centering position of the IC device 9 can be adjusted.

With the configuration of Modification 2, by changing (adjusting) the contact position between one end portion 85, 86 and the flange portion 494, it is possible to finely adjust the outer peripheral surface of the IC device 9 with the other end portion 613, 623 (the second end portion 613, 623). 2 surfaces) can easily perform fine adjustment of the pushing amount of the chuck parts 61b, 62b (the other end parts 613, 623). Therefore, the positioning (centering) of the IC device 9 can be performed more finely.

In addition, it is also possible to apply a configuration in which the chuck portions 61a, 62a of Modification 1 and the chuck portions 61b, 62b of Modification 2 are used in combination. For example, one can be the chuck portion 61a of Modification 1 and the other can be the chuck portion 62b of Modification 2, or one can be the chuck portion 61b of Modification 2 and the other can be the chuck of Modification 1. part 62a.

In addition, in Modification 1 and Modification 2, it is possible to apply other chuck parts (similar to the chuck shown in FIG. The structure of the disk part (third chuck part) 63 and the chuck part (fourth chuck part) 64 corresponds to).

<Second Embodiment>

Next, an electronic component inspection device according to a second embodiment of the present invention will be described with reference to FIG. 8 . 8 is a cross-sectional view (perpendicular cross-sectional view) showing an arm unit of a transport unit of an electronic component inspection device according to a second embodiment of the present invention.

Hereinafter, the second embodiment of the electronic component conveying device and the electronic component inspection device of the present invention will be described with reference to this FIG. mark, omitting its description.

In the inspection apparatus (electronic component inspection apparatus) 1c of the second embodiment, the structure and the adsorption portion 49c as the holding portion of each arm unit 433c of the inspection robot 43c and the chuck portions 61c and 62c as the abutting portion are excluded. 49 and the chuck parts 61 and 62 are the same as the inspection device (electronic component inspection device) 1 of the first embodiment described above.

As shown in FIG. 8, in the inspection device 1c of this embodiment, one end portion 614c, 624c of the chuck portion 61c, 62c is brought into contact with the inclined surface 498a of the flange portion 498 of the suction portion 49c, and the inclined surface The chuck parts 61c, 62c are rotated in conjunction with the vertical movement of 498a. Hereinafter, this structure will be described in detail.

The suction part 49c as a holding part has a cylindrical shape, and its upper end 491 fits into the inner cavity 471 of the inner ring 473 of the support part 47 in a "loose fit" or "overfit" state as in the first embodiment. Thereby, the adsorption|suction part 49c can move stably to an up-down direction. Then, the suction portion 49c comes into contact with the upper surface (first surface) of the IC device 9 at the position of the moving lower end of the state where the chuck portions 61c and 62c described later are opened. Then, by bringing the suction flow path 430 into a negative pressure state (vacuum state), the suction portion 49c suctions the IC device 9 on the suction surface 493, and moves to the upper end position in the first direction. At this time, the chuck parts 61c and 62c described later move in the direction (second direction) toward the IC device 9 in conjunction with the movement of the suction part 49c, and come into contact with the outer peripheral surface (second surface) of the IC device 9, Thereby, centering of the IC device 9 can be performed. In addition, since the structure of the suction flow path 430 of the adsorption|suction part 49c and the adsorption|suction of the IC device 9 are the same as that of 1st Embodiment, description is abbreviate|omitted.

A flange portion 498 composed of an enlarged diameter portion whose outer diameter is enlarged is formed on the outer peripheral portion of the adsorption portion 49c. The upper surface of the flange portion 498 functions as a spring seat to which the lower end of the coil spring 438 is connected. In addition, the outer peripheral side surface of the flange portion 498 has an inclined surface 498a that decreases in diameter upward, and the inclined surface 498a abuts on one end portions 614c, 624c of the chuck portions 61c, 62c, and serves as a driving surface for vertical movement. function. In addition, the lower surface of the flange portion 498 functions as a stopper (abutment) that comes into contact with the lower end portion 48 to stop the movement of the adsorption portion 49c when the adsorption portion 49c moves downward.

The chuck parts 61c and 62c which are abutting parts have a function of aligning (centering) the IC device 9 sucked by the sucking part 49c. The chuck parts 61c, 62c are connected to the chuck support part 472 provided on the outer ring 474 of the support part 47 serving as a base via shafts 612, 622, and are arranged so as to be rotatable about the shafts 612, 622.

The chuck portions 61c, 62c have one end portion 614c, 624c located on the flange portion 498 side of the adsorption portion 49c, and the other end portion 613, 623 located on the opposite side to the shafts 612, 622. One end portions 614c and 624c are in contact with the inclined surface 498a which is the outer peripheral side surface of the flange portion 498 , and the other end portions 613 and 623 are in contact with the outer peripheral surface (second surface) of the IC device 9 . In addition, the outer peripheral surface (second surface) of the IC device 9 can also be called the side surface of the IC device 9 . Furthermore, the one end parts 614c and 624c move in conjunction with the movement (slide) along the first direction of the inclined surface 498a of the flange part 498 of the suction part 49c which abuts on it. By the movement of the one end portion 614c, 624c, the chuck portion 61c, 62c rotates around the shaft 612, 622, whereby the other end portion 613, 623 can move in the second direction (second direction) perpendicular to the first direction. 1 direction of movement) to move. In addition, the chuck parts 61c and 62c press the one ends 614c and 624c against the inclined surface 498a by the chuck parts 61c and 62c or biasing means (for example, coil springs, leaf springs, etc.). Thereby, one end part 614c, 624c can move along with the movement of the inclined surface 498a.

Specifically, the chuck portion (first chuck portion) 61c and the chuck portion (second chuck portion) 62c face in opposite directions to each other in a second direction (first moving direction) perpendicular to the first direction. By moving by the same amount of movement, the outer peripheral surface (second surface) of the IC device 9 is pressed. In this way, a plurality of chuck parts (first chuck part) 61c and chuck parts (second chuck part) 62c are moved in the same moving amount from opposite directions to each other in the first moving direction, and the IC device 9 is moved. By pressing, positioning (centering) of the IC device 9 can be performed easily and accurately.

In the structure of the second embodiment described above, when the suction portion 49c as the holding portion moves in the first direction relative to the support portion 47 as the base portion, the chuck portions 61c and 62c as the abutting portions are in contact with the first contact portion. The IC device 9 can be positioned (centered) by pressing the IC device 9 in a second direction that is different (orthogonal), and the above-mentioned holding portion constitutes the conveying portion 4c as an electronic component conveying device. In this way, the positioning (centering) of the IC device 9 can be easily performed by a simple mechanism.

<Third embodiment>

Next, an electronic component inspection device according to a third embodiment of the present invention will be described with reference to FIG. 9 . 9 is a cross-sectional view (perpendicular cross-sectional view) showing an arm unit of a transport unit of an electronic component inspection apparatus according to a third embodiment of the present invention.

Hereinafter, the third embodiment of the electronic component conveying device and the electronic component inspection device of the present invention will be described with reference to FIG. mark, omitting its description. In addition, the inspection device (electronic component inspection device) 1d according to the third embodiment differs from the chuck parts 61c and 62c in the structure of the chuck parts 65 and 66 which are contact parts of the arm units 433d of the inspection robot 43d. Others are the same as the inspection device 1c of the second embodiment described above.

In addition, the suction part 49c used as the movement source of the chuck parts 65 and 66 has a cylindrical shape, and has the same structure as 2nd Embodiment. Therefore, although the detailed description is omitted, the flange part 498 which consists of the diameter-enlarged part whose outer diameter enlarged is formed in the outer peripheral part of the adsorption|suction part 49c. The upper surface of the flange portion 498 functions as a spring seat to which the lower end of the coil spring 438 is connected. In addition, the outer peripheral side surface of the flange portion 498 has an inclined surface 498 a whose diameter decreases upward, and this inclined surface 498 a serves as a movement source of the chuck portions 65 , 66 . In addition, the lower surface of the flange portion 498 functions as a stopper (abutment) that comes into contact with the lower end portion 48 to stop the movement of the adsorption portion 49c when the adsorption portion 49c moves downward.

As shown in FIG. 9 , in the third embodiment, the chuck parts 65 and 66 are configured in a so-called curb shape (shaft shape). The chuck parts 65 and 66 have a function of aligning (centering) the IC device 9 sucked by the sucking part 49c. In the chuck part (first chuck part) 65 and the chuck part (second chuck part) 66 of this form, one end part 651a of the first bar member 651, 661 described later that constitutes the shape of the well fence , 661a abut against the inclined surface 498a of the flange portion 498 of the adsorption portion 49c, and move the chuck portion (the first chuck portion) 65 and the chuck portion (the second chuck portion) in conjunction with the vertical movement of the inclined surface 498a. Chuck part) 66 operates (opens and closes). Hereinafter, the chuck portions 65 and 66 of this embodiment will be described in detail.

One chuck part (first chuck part) 65 includes: a first rod member 651 and a second rod member 652 arranged parallel to each other along the X direction; The third rod member 653 and the fourth rod member 654 are arranged parallel to each other along the Z direction.

The first rod member 651 is disposed so that one end portion 651a faces the inclined surface 498a of the flange portion 498 of the adsorption portion 49c, and is rotatably connected to the intersecting third rod member 653 and the third rod member 653 via the axes Q11 and Q12. 4 rod parts 654. The second rod member 652 is disposed so that one end portion 652a faces the outer peripheral surface (second surface) of the IC device 9 adsorbed by the adsorbing portion 49c, and is rotatably connected to a third intersecting third rod member 652 through the axes Q13 and Q14. The rod member 653 and the fourth rod member 654 .

The third rod member 653 is connected to the chuck support portion 472d of the outer ring 474d provided on the support portion 47d via the axis C11 at the central portion of the first rod member 651 and the second rod member 652, and can be centered on the axis C11. Rotationally configured. The fourth rod member 654 is connected to the chuck support portion 472d of the outer ring 474d provided on the support portion 47d via the axis C12 at the central portion of the first rod member 651 and the second rod member 652, and can be centered on the axis C12. Rotationally configured.

The chuck portion (first chuck portion) 65 having such a structure can move the second rod member 652 in a direction opposite to the moving direction of the first rod member 651 . Specifically, for example, when the first rod member 651 is moved in the X direction, one end portions of the third rod member 653 and the fourth rod member 654 are moved in the above-mentioned direction interlockingly via the axes Q11 and Q12. As a result, the third rod member 653 and the fourth rod member 654 rotate about the axes C11 and C12. The third rod member 653 and the fourth rod member 654 rotate around the axes C11 and C12, so that the other ends of the third rod member 653 and the fourth rod member 654 move in the direction opposite to the direction in which the first rod member 651 moves. Move in the negative X direction. In conjunction with this movement, the second rod member 652 moves in the negative X direction via the axes Q13 and Q14. In this example, the chuck portion (first chuck portion) 65 moves in a direction away from the IC device 9 , that is, in a direction in which the chuck portion (first chuck portion) 65 opens.

In addition, the other chuck part (second chuck part) 66 includes: a first rod member 661 and a second rod member 662 arranged in parallel to each other along the X direction; 662 and the third rod member 663 and the fourth rod member 664 arranged parallel to each other along the Z direction.

The first rod member 661 is arranged so that one end portion 661a faces the inclined surface 498a of the flange portion 498 of the adsorption portion 49c, and is rotatably connected to the third rod member 663 and the fourth rod member that intersect each other through the axes Q21 and Q22. The rod member 664 is connected. The second rod member 662 is arranged so that one end portion 662a faces the outer peripheral surface (second surface) of the IC device 9 adsorbed by the adsorbing portion 49c, and is rotatably connected to the third intersecting third rod member 662 through the axes Q23 and Q24. The rod member 663 and the fourth rod member 664 are connected.

The third rod member 663 is connected to the chuck support portion 472d provided on the outer ring 474d of the support portion 47d via the shaft C21 at the central portion of the first rod member 661 and the second rod member 662, and is arranged so that the shaft C21 can be Center turns. The fourth rod member 664 is connected to the chuck support portion 472d of the outer ring 474d provided on the support portion 47d via the axis C22 at the central portion of the first rod member 661 and the second rod member 662, and is arranged so as to be able to Rotate for the center.

The chuck portion (second chuck portion) 66 having such a structure can move the second rod member 662 to the first rod member 661 by the same operation as the chuck portion (first chuck portion) 65 described above. Move in the opposite direction. Specifically, for example, when the first rod member 661 is moved in the negative X direction, one end portions of the third rod member 663 and the fourth rod member 664 are moved in the above-mentioned direction via the axes Q21 and Q22 in conjunction with each other. Accordingly, the third rod member 663 and the fourth rod member 664 rotate around the axes C21 and C22. The third rod member 663 and the fourth rod member 664 rotate around the shafts C21 and C22, so that the other ends of the third rod member 663 and the fourth rod member 664 move in the direction opposite to the moving direction of the first rod member 661. Move in the positive X direction. In conjunction with this movement, the second rod member 662 moves in the positive X direction via the axes Q23 and Q24. In this example, the chuck portion (second chuck portion) 66 moves in a direction away from the IC device 9 , that is, in a direction in which the chuck portion (second chuck portion) 66 opens.

In addition, in the chuck part (first chuck part) 65 and the chuck part (second chuck part) 66, one end part 651a, 661a of the first rod member 651, 661 and the suction part Coil springs 655 and 665 are provided as biasing means for contacting the inclined surface 498a of the flange portion 498 of the 49c.

As described above, in the chuck part (first chuck part) 65 and the chuck part (second chuck part) 66, one end part 651a, 661a of the first rod member 651, 661 is connected to the suction part 49c. The inclined surface 498a of the flange portion 498 comes into contact, and the chuck portion (first chuck portion) 65 and the chuck portion (second chuck portion) 66 are operated in conjunction with the vertical movement of the inclined surface 498a.

Here, the alignment (centering) operation of the IC device 9 by the chuck parts 65 and 66 will be described. The chuck parts 65, 66 move the one ends 651a, 661a of the first rod members 651, 661 in the directions of the arrows P1, P3 in the drawing in conjunction with the upward movement of the suction part 49c (in the direction of the arrow m1 in the figure). . Accompanying this, the third rod members 653, 663 and the fourth rod members 654, 664 rotate around the axes C11, C12 and C21, C22, respectively, and the second rod members 652, 662 move in the directions of arrows P2, P4 in the figure. Moving, the end portions 652a and 662a press the outer peripheral surface (second surface) of the IC device 9 . In this way, the plurality of chuck parts (first chuck part) 65 and chuck parts (second chuck part) 66 are moved in the same moving amount from opposite directions to each other in the first moving direction (X direction). Since the IC device 9 is pressed, the positioning (centering) of the IC device 9 can be performed easily and accurately.

In the structure of the third embodiment described above, when the holding portion 49c as the holding portion constituting the conveying portion 4 as the electronic component conveying device moves in the first direction relative to the supporting portion 47d as the base, it acts as the abutting portion. The IC device 9 can be positioned (centered) by pressing the IC device 9 in a second direction different (orthogonal) from the first direction by the chuck portions 65 and 66 of the IC device 9 . In this way, the positioning (centering) of the IC device 9 can be easily performed by a simple mechanism.

<Fourth embodiment>

First, an electronic component inspection device according to a fourth embodiment of the present invention will be described with reference to FIGS. 10 to 14 . 10 is a layout diagram showing an outline of an electronic component inspection device according to a fourth embodiment of the present invention. 11 is a plan view schematically showing a transport unit and an inspection unit of the electronic component inspection device according to the fourth embodiment. 12 is a cross-sectional view (vertical cross-sectional view) of an arm unit and an inspection unit of a transport unit of the electronic component inspection device. 13 is a cross-sectional view showing an outline (before cutting) of cutting (segmentation) of an electronic component (IC device). FIG. 14 is a cross-sectional view showing a cut (segmented) electronic component (IC device).

In addition, FIG. 12 shows one of the plurality of arm units of the transport unit.

As shown in FIG. 10 , an inspection apparatus 1A serving as an inspection apparatus for electronic components includes a supply unit 2 , a supply-side arrangement unit 3 , a transport unit 4A, an inspection unit 5A, a collection-side arrangement unit 6 , a collection unit 7 , and a system for carrying out these parts. The control part 8 of the control. In addition, the inspection device 1A has: a base 11 for arranging the supply unit 2 , the supply side alignment unit 3 , the transport unit 4A, the inspection unit 5A, the recovery side alignment unit 6 , and the recovery unit 7 ; The cover 12 of the base 11 covers the unit 4A, the inspection unit 5A, and the recovery-side alignment unit 6 . In addition, the base surface 111 which is the upper surface of the base 11 is substantially horizontal, and the constituent members of the supply-side alignment unit 3 , the conveyance unit 4A, the inspection unit 5A, and the collection-side alignment unit 6 are arranged on the base surface 111 .

The inspection apparatus 1A is configured such that the supply unit 2 supplies the IC devices 9 to the supply side arrangement unit 3, arranges the supplied IC devices 9 at the supply side arrangement unit 3, and the transport unit 4A transports the arranged IC devices 9 to the inspection unit 5A, The inspection unit 5A inspects the transported IC devices 9, the transport unit 4A transports/arranges the IC devices 9 that have been inspected to the collection side alignment unit 6, and the recovery unit 7 performs inspection on the IC devices 9 arranged on the recovery side alignment unit 6. Recycle. According to the inspection apparatus 1A described above, supply, inspection, and collection of IC devices 9 can be automatically performed. In addition, in the inspection device 1A, the transportation device is constituted by a part of the supply unit 2, the supply side alignment unit 3, the transportation unit 4A, the recovery side alignment unit 6, the collection unit 7, and the control unit 8, etc. except for the configuration of the inspection unit 5A. (Electronic component transport device) 10 . The transport device 10A performs transport of the IC device 9 and the like.

Furthermore, as shown in FIG. 12 , the IC device 9 has a main body portion 91 and a plurality of terminals (electrodes) 92 provided outside the main body portion 91 . Each terminal 92 is electrically connected to the circuit part inside the main body part 91 . The shape of the main body portion 91 is not particularly limited, but in the present embodiment, the main body portion 91 is substantially plate-shaped, and has a quadrangular shape when viewed from the Z direction, that is, in plan view. In addition, this quadrilateral is a square or a rectangle in this embodiment. Moreover, each terminal 92 is provided in the lower part (or side part) of the main-body part 91, and has spherical shape, a hemispherical shape, or a flat plate shape, etc., for example.

Hereinafter, the configurations of the transport unit 4A and the inspection unit 5A will be described.

"Department of Shipping"

As shown in FIG. 11 , the transport unit 4A constituting the electronic component transport device transports the IC devices 9 placed on the mounting table 341 of the supply-side array unit 3 to the inspection unit 5A, and transfers the IC devices 9 that have completed the inspection of the inspection unit 5A. The IC devices 9 are transported to the unit of the collection side array section 6 . Such a transport unit 4A has a reciprocating device 41 , a supply robot 42 , an inspection robot 43A, and a collection robot 44 .

-Reciprocating device-

The reciprocating device 41 is used to transport the IC devices 9 placed on the mounting table 341 to the vicinity of the inspection section 5A, and further transports the inspected IC devices 9 that have been inspected in the inspection section 5A to the collection side alignment section 6. The nearby reciprocating device. Four recesses 411 for accommodating IC devices 9 are formed in parallel along the X direction in such a reciprocating device 41 . In addition, the reciprocating device 41 is guided by a linear motion guide, and can reciprocate in the X direction by a drive source such as a linear motor.

-Supply Robot-

The supply robot 42 is a robot that transports the IC devices 9 placed on the mounting table 341 to the shuttle 41 . Such a supply robot 42 has: a supporting frame 421 supported by the base 11, a moving frame 422 supported by the supporting frame 421 and capable of reciprocating in the Y direction relative to the supporting frame 421, and four arm units supported by the moving frame 422. (manipulating the robot)423. Each arm unit 423 is equipped with a lifting mechanism and a suction nozzle, and can hold the IC device 9 by suction.

-check the robot-

The inspection robot 43A is a robot that transports the IC device 9 stored in the shuttle 41 to the inspection unit 5A, and transports the IC device 9 that has been inspected from the inspection unit 5A to the shuttle 41 . In addition, the inspection robot 43A can press the IC device 9 against the inspection part 5A by the suction part 49 (see FIG. 12 ) of the arm unit 433A during inspection, and apply a predetermined inspection pressure to the IC device 9 .

As shown in FIG. 11 , such an inspection robot 43A has: a support frame 431 supported by the base 11 , a moving frame 432 supported by the support frame 431 and capable of reciprocating movement in the Y direction relative to the support frame 431 , and a moved frame 432 Four arm units (holding robot) 433A are supported. The arrangement of each arm unit 433A is not particularly limited, but the illustrated arrangement is an example. In addition, as will be described later, each arm unit 433A has a suction portion 49 (see FIG. 12 ) for suctioning the IC device 9 , and the like.

-Recycling robot-

The collection robot 44 is a robot that transports the IC device 9 that has been inspected by the inspection unit 5A to the collection side alignment unit 6 . Such a recovery robot 44 has: a supporting frame 441 supported by the base 11, a moving frame 442 supported by the supporting frame 441 and capable of reciprocating movement in the Y direction relative to the supporting frame 441, and four arm units supported by the moving frame 442. (manipulating the robot)443. Each arm unit 443 is provided with a lifting mechanism and a suction nozzle, and can hold the IC device 9 by suction.

Such a transport unit 4A transports the IC device 9 as follows. First, the reciprocating device 41 moves to the left side in the figure (negative X direction), and the supply robot 42 transports the IC device 9 placed on the mounting table 341 to the reciprocating device 41 (STEP1). Next, the shuttle 41 moves toward the center (positive X direction), and the inspection robot 43A conveys the IC device 9 on the shuttle 41 to the inspection part 5A (STEP2). Next, the inspection robot 43A transports the IC device 9 that has been inspected by the inspection unit 5A toward the shuttle 41 (STEP 3 ). Next, the reciprocating device 41 moves to the right side (positive X direction) in the figure, and the collection robot 44 transports the inspected IC devices 9 on the reciprocating device 41 to the collection side arrangement unit 6 (STEP4). By repeating the above-mentioned STEP1 to STEP4, the IC device 9 can be conveyed to the collection side alignment part 6 via the inspection part 5A.

The configuration of the transport unit 4A has been described above, but as the configuration of the transport unit 4A, as long as the IC device 9 on the mounting table 341 can be transported to the inspection unit 5A, and the IC device 9 that has completed the inspection can be transported to the collection side The transportation of the alignment unit 6 is not particularly limited. For example, the reciprocating device 41 may also be omitted, and any one of the supply robot 42, the inspection robot 43A, and the collection robot 44 may carry out the transportation from the loading table 341 to the inspection section 5A, and the transportation from the inspection section 5A to the collection side alignment section 6. delivery.

"Inspection Department"

The inspection unit 5A is a unit (tester) for inspecting and testing the electrical characteristics of the IC device 9 . As shown in FIG. 12 , the inspection unit 5A is used with a mounting unit (component arrangement unit) 51A detachably attached to a load board (circuit board) 54 built in the inspection unit 5A.

The mounting portion 51A constituting the component placement portion is, for example, a resin socket for holding and mounting the IC device 9 , and can be replaced according to the type of the IC device 9 . 51 A of mounting parts which comprise this component arrangement|positioning part are equipped with the main body part 56, and the mounting base 57 which protrudes upward from a main body part. Since the IC device 9 is placed on the upper surface 571 of the mounting table 57 and the IC device 9 is slidably positioned, a surface state suitable for sliding, for example, a mirror-finished surface state is preferable. The mounting table 57 can mount IC devices 9 one by one. The air suction hole 504 opened in the upper surface 571 is provided in the main-body part 56 of the mounting part 51A, and the mounting table 57. In addition, although the number of mounting stages 57 formed is four in this embodiment, it is not limited to this, and it may be one, two, three, or five or more. In addition, the arrangement of the mounting tables 57 is arranged in one row along the X direction in this embodiment, but it is not limited to this, and a plurality of them may be arranged in rows and rows in the X direction and the Y direction, or may be arranged along the X direction. One column is arranged in the Y direction.

As shown in FIG. 12 , each mounting table 57 protrudes upward from the main body portion 56 so that the IC device 9 can be easily mounted on the upper surface 571 thereof. In addition, a plurality of probes (first conductive members) 522 electrically connectable (contactable) to the plurality of terminals 92 of the IC device 9 are provided on the mounting table 57 . Each probe 522 is electrically connected to the control unit 8 via unillustrated wiring provided on the load board 54 .

Each terminal 92 of IC device 9 mounted on each mounting table 57 is pressed against each probe 522 with a predetermined inspection pressure by pressing arm unit 433A of inspection robot 43A. Accordingly, each terminal 92 of the IC device 9 is electrically connected (contacted) to each probe 522 , and the IC device 9 is inspected via the probe 522 . The inspection of the IC device 9 is performed based on the program stored in the control unit 8 . In addition, each probe 522 may be configured to be able to expand and contract with respect to the upper surface 571 .

"Department of Control"

The control unit 8 includes, for example, an inspection control unit and a drive control unit. The inspection control unit performs, for example, an inspection of the electrical characteristics of the IC device 9 arranged in the inspection unit 5A based on a program stored in a memory not shown. Also, the drive control unit controls the drive of each of the supply unit 2 , supply side alignment unit 3 , transport unit 4A, inspection unit 5A, recovery side alignment unit 6 , and recovery unit 7 to transport IC devices 9 , for example. In addition, the control unit 8 can also perform temperature control of the IC device 9 .

Then, when performing inspection of the electrical characteristics of the IC device 9, it is necessary to correctly match the positions of the terminals 92 of the IC device 9 with the positions of the probes 522 of the inspection section 5A, and place the IC device 9 on a carrier. Setting part 51A. In particular, for a small package or an IC device 9 with a multi-pin structure, the pitch between the terminals 92 is extremely narrow, and accordingly, the pitch between the probes 522 is also narrow. The alignment between each terminal 92 and each probe 522 of the inspection unit 5A is more important. Of course, if the positions of the terminals 92 and the probes 522 are misaligned, the desired inspection cannot be performed, and it can be judged that the IC device 9 obtained through such inspection has low reliability as a product. Hereinafter, the configuration of the arm unit 433A having a positioning function (centering function) for preventing such a positional shift of the IC device 9 will be described.

In addition, as shown in FIG. 13 , for the IC device 9 used here, the so-called dicing that grinds (grinds) the IC device 9 by, for example, a rotating cutter blade (disc-shaped grinding wheel) DB, etc. will provide a plurality of IC devices 9. The substrates 900 arranged in parallel are cut and separated into individual pieces. In this specification, cutting (cutting) the substrate 900 along the cut groove is referred to as cutting or dividing. Specifically, the portion of the groove portion 918 formed in contact with the dicing blade DB is cut (cut), thereby obtaining the IC device 9 in pieces. In the present embodiment, IC devices 9 thus singulated are used. And, it can be seen that in the IC device 9 cut (cut) in this way, the wall surfaces (second surfaces) 913, 914 on both sides of the groove portion 918 cut by the dicing blade DB are stable in shape (good in shape accuracy), but the dicing blade DB For example, protrusions (burrs) 919 b , depressions (notches) 919 c , etc., as shown in FIG. 14 , are generated in the unreached cut (cut) portion of the DB, and the shape is unstable (poor shape accuracy).

-arm unit-

As shown in FIG. 12 , the arm unit 433A has a structure capable of holding the IC device 9 and pressing the held IC device 9 against the mounting portion 51A. The arm unit 433A has a first substrate 45 , a second substrate 46 , a support portion 47 d as a base, a lower end portion 48A, an adsorption portion 49 as a holding portion constituting a component arrangement portion, and a first contact portion 401 arranged in order from above. There are two contact portions with the second contact portion 402 (see FIG. 17B ). In addition, in this embodiment, as shown in FIG. 17B , the first abutting portion 401 and the second abutting portion 402 are aligned with the IC device 9 from two directions (second and third directions) orthogonal to each other. Wall surfaces 913 and 914 (refer to FIG. 14 ), which are side surfaces with stable shape (good shape accuracy), abut against each other, and are arranged so as to be pressable.

The first substrate 45 has functions such as supporting the arm unit 433A with respect to the moving frame 432 (see FIG. 11 ). The first substrate 45 has a planar upper surface and a lower surface. In addition, in the first substrate 45 , through-holes 452 constituting a part of the suction flow path 430 are opened on the upper and lower surfaces, and are connected to the ejector 13 as an air suction source on the upper surface side. Then, the suction flow path 430 is brought into a negative pressure state (vacuum state) by actuation of the ejector 13 , whereby the IC device 9 can be adsorbed by the adsorption portion 49 . In addition, the adsorption can be released by performing vacuum break by the ejector 13 .

The second substrate 46 is constituted by a plate member in the present embodiment, and has a planar upper surface and a lower surface. In the arm unit 433A, the lower surface of the first substrate 45 is in contact with the upper surface of the second substrate 46 . In addition, a first through-hole 463 opening on the upper surface and a second through-hole 462 communicating with the first through-hole 463 and opening on the lower surface are formed in the second substrate 46, and are connected to the first substrate 45 on the upper surface side. The through hole 452 communicates. Accordingly, the first through hole 463 and the second through hole 462 can constitute a part of the suction flow path 430 together with the through hole 452 .

An annular recess 464 formed concentrically with the first through hole 463 and the second through hole 462 is formed on the upper surface of the second substrate 46 . The ring-shaped packing 434 is inserted into the concave portion 464 in a compressed state, whereby the airtightness between the first through hole 463 and the second through hole 462 constituting a part of the suction flow path 430 and the through hole 452 can be maintained.

In addition, the constituent materials of the first substrate 45 and the second substrate 46 are not particularly limited. For example, various metal materials can be used, and among them, aluminum or an aluminum alloy is preferably used. By using aluminum or an aluminum alloy, it is possible to reduce the weight of the arm unit 433A.

The support portion 47d serving as a base supports a suction portion (holding portion) 49 that suctions the IC device 9 so as to be movable (slidable) in the vertical direction. In the present embodiment, the support portion 47 d is constituted by a disc-shaped member, and its planar upper surface is in contact with the lower surface of the second substrate 46 . Moreover, the support part 47d has the structure which has the inner ring 473 and the outer ring 474d arrange|positioned concentrically with this inner ring 473. As shown in FIG.

The inner cavity portion 471 of the inner ring 473 communicates with the second through hole 462 of the second substrate 46 on the upper surface side (positive Z direction side). Thus, the lumen portion 471 can constitute a part of the suction flow path 430 . In addition, a part (upper end portion 491 ) of the adsorption portion 49 is inserted into the inner cavity portion 471 from the lower surface side (negative Z direction side).

An annular recess 467 formed concentrically with the inner ring 473 is formed above the connecting portion of the inner ring 473 and the outer ring 474d. The ring-shaped packing 437 is inserted into the concave portion 467 in a compressed state, whereby the airtightness between the inner cavity portion 471 and the first through hole 463 and the second through hole 462 can be maintained.

On the other hand, the coil spring 438 as an elastic member is arrange|positioned outside the inner ring 473 and below the outer ring 474d. The upper end of the coil spring 438 is connected to the outer ring 474d and the lower end thereof is connected to the flange portion 494 of the adsorption portion 49 in the stretched state. Thereby, it is possible to bias the suction portion 49 downward. In addition, the inner ring 473 is inserted inside the coil spring 438 . Thereby, the coil spring 438 is supported from the inner side, thereby being able to expand and contract stably (see FIG. 12 ).

The lower end portion 48A is formed of a ring-shaped member, and is connected to the lower surface of the outer ring 474d of the support portion 47d. The upper surface 483 of the lower end portion 48A functions as a contact member (stopper) that contacts the flange portion 494 of the adsorption portion 49 and determines the stop position of the lower side of the adsorption portion 49 . Further, the lower end portion 48A is arranged at a position different from the adsorption portion 49 that is in direct contact with the IC device 9 , that is, concentrically with the adsorption portion 49 so as to surround the adsorption portion 49 . Further, a first contact portion 401 and a second contact portion 402 , which are contact portions described later, are connected to the lower surface 482 of the lower end portion 48A. In addition, the lower surface 482 of the lower end portion 48A is the lowermost surface of the arm unit 433A except for the suction portion 49 , the first contact portion 401 , and the second contact portion 402 that are in contact with the IC device 9 . In addition, in the lower end portion 48A, when the arm unit 433A presses the IC device 9 to the mounting portion 51A, the lower surface 482 may be able to contact the mounting portion 51A.

The suction part 49 as a holding part is a member that suctions the IC device 9 and presses it against the mounting part 51A. The adsorption part 49 has a cylindrical shape, and its upper end part 491 fits into the inner cavity part 471 of the inner ring 473 of the support part 47d in a state of "clearance fit" or "overfit". Thereby, the adsorption|suction part 49 can move stably in an up-down direction.

The suction portion 49 comes into contact with the upper surface 911 (see FIG. 14 ) of the IC device 9 at the position where the lower end moves. Then, the adsorption unit 49 adsorbs the IC device 9 on the adsorption surface 493 by bringing the suction flow path 430 into a negative pressure state (vacuum state). Then, the suction part 49 moves downward along with the lowering of the arm unit 433A, and presses the IC device 9 against the mounting part 51A (the mounting table 57 ). Then, when the mounted IC device 9 is pressed toward the upper surface 571 of the mounting table 57 via the suction portion 49 , the suction portion 49 receives the reaction force and moves upward against the urging force of the coil spring 438 . The coil spring 438 compresses only the movement amount of the adsorption part 49, and can further press the IC device 9 only by this compression amount. Accordingly, each terminal 92 of the IC device 9 can be brought into contact with the probe 522 corresponding to the terminal 92 . The pressed suction portion 49 moves upward as the arm unit 433A rises. Then, the suction portion 49 releases the suction of the IC device 9 by releasing the negative pressure state (vacuum state) of the suction flow path 430 . In addition, the positions of the moving lower end and the moving upper end of the suction portion 49 can be changed, for example, according to the type of the IC device 9 .

In the inner cavity portion 492 of the adsorption unit 49 , one opening communicates with the first through hole 463 of the second substrate 46 , and the other opening communicates with the adsorption port 497 through the connection hole 496 . Accordingly, the lumen portion 492 , the connection hole 496 , and the suction port 497 can constitute a part of the suction flow path 430 . Then, as described above, when the ejector 13 operates, the suction flow path 430 becomes a negative pressure state (vacuum state), whereby the IC device 9 can be adsorbed. At this time, the suction surface 493 of the suction portion 49 and the upper surface 911 (see FIG. 14 ) of the main body portion 91 of the IC device 9 are in close contact with each other, and the suction flow path 430 is hermetically sealed by the close contact. As a result, the negative pressure state of the suction flow path 430 is maintained, so that the IC device 9 can be prevented from coming off from the adsorption portion 49 .

The flange part 494 which consists of the diameter-enlarged part whose outer diameter enlarged is formed in the outer peripheral part of the adsorption|suction part 49. As shown in FIG. The upper surface of the flange portion 494 functions as a spring seat to which the lower end of the coil spring 438 is connected. In addition, the lower surface of the flange portion 494 functions as a stopper (abutment) that comes into contact with the lower end portion 48A when the suction portion 49 moves downward, and stops the movement of the suction portion 49 .

An annular concave portion 495 formed concentrically with the upper end portion 491 is formed on the upper end portion 491 of the adsorption portion 49 fitted in the inner cavity portion 471 of the inner ring 473 of the support portion 47d. The ring-shaped packing 439 is inserted into the concave portion 495 in a compressed state. The packing 439 has elasticity, so that the contact area between the suction part 49 and the inner ring 473 (inner cavity part 471 ) can be suppressed, so the sliding resistance can be reduced, and the suction part 49 can move smoothly in the inner ring 473 . In addition, the airtightness of the suction flow path 430 can be maintained even during the movement (slide) of the suction part 49 by the packing 439 .

The first abutting portion 401 and the second abutting portion 402, which are abutting portions connected to the lower surface 482 of the lower end portion 48A, have a position alignment ( to the center) function. As shown in FIG. 17B , the first abutting portion 401 is arranged so that it can be abutted against and pressed against the wall surface 913 that is the second surface of the IC device 9 from the second direction along the X-axis direction, and the second abutting portion 402 can be moved from The third direction along the Y-axis direction contacts and presses against the wall surface 914 which is the second surface of the IC device 9 . In this way, the first abutting portion 401 and the second abutting portion 402 are brought into abutment with the wall surfaces 913, 914 that are the second surface of the IC device 9, so the details of the first abutting portion 401 and the second abutting portion 402 will be described later. The abutting surfaces 403f and 404f of the contact surfaces 403f and 404f are arranged at positions facing the upper side (positive Z direction) of the IC device 9 as shown in FIG. 12 , for example.

As shown in FIG. 12 and FIG. 17B , the first abutting portion 401 and the second abutting portion 402 include thick portions 405, 406, and thin portions 403 extending from the underside of the thick portions 405, 406, 404. Furthermore, in the first contact portion 401 and the second contact portion 402 , the upper surfaces of the thick portions 405 and 406 are connected to the lower surface 482 of the lower end portion 48A. The thin-walled parts 403 and 404 have contact surfaces 403f and 404f provided in a planar shape as the end faces of the front ends. The contact surfaces 403 f and 404 f are arranged so as to be able to contact the wall surfaces 913 and 914 which are the second surfaces of the IC device 9 . Then, the contact surfaces 403f and 404f contact the wall surfaces 913 and 914 which are the second surfaces of the IC device 9 to perform positioning (centering) of the IC device 9 . In addition, it is preferable that the surface of the contact surface 403f, 404f is a smooth surface state without unevenness|corrugation, such as a mirror finish, for example.

In this way, for example, by contacting and pressing the mirror-finished planar abutment surfaces 403f, 404f against the wall surfaces 913, 914 of the IC device 9, the IC device 9 can easily slide along the abutment surfaces 403f, 404f. The deviation (inclination) of the rotation direction in plan view when the upper surface 911 (see FIG. 14 ) of the IC device 9 as the first surface is the front surface can be easily corrected, thereby enabling accurate positioning (centering).

The constituent materials of the support portion (base portion) 47, the lower end portion 48A, and the adsorption portion (holding portion) 49 are not particularly limited. For example, various metal materials can be used, among which carbon steel is preferably used, and aluminum and copper are also acceptable. Wait. Carbon steel is preferable because it has stable strength and good wear resistance.

In addition, the part having the lower end 48A (hereinafter referred to as "the former") and the part where the lower end 48A abuts (hereinafter referred to as the "latter"), in this embodiment, the former is the arm of the inspection robot 43A. The unit 433A, the latter is the placement unit 51A of the inspection unit 5A, but is not limited thereto. For example, the former may be the arm unit 423 of the supply robot 42 and the latter may be the reciprocating device 41 , or the former may be the arm unit 433A of the inspection robot 43A and the latter may be the reciprocating device 41 .

-positioning action-

15A to 15C, 16A to 16C, and 17A to 17C, the positioning operation of the electronic component (IC device 9) of the electronic component inspection apparatus according to the fourth embodiment will be described below. FIG. 15A is a cross-sectional view showing an IC device 9 as an electronic component held at a shifted position when viewed from the Y-axis direction. 15B is a cross-sectional view (viewed in the Y-axis direction) showing a state where one abutting portion (first abutting portion 401 ) is opposed to the IC device 9 held at an offset position. 15C is a cross-sectional view (viewed in the Y-axis direction) showing the IC device 9 positioned by one contact portion (first contact portion 401 ). FIG. 16A is a cross-sectional view showing an IC device 9 as an electronic component held at a shifted position when viewed from the X-axis direction. 16B is a cross-sectional view (viewed in the X-axis direction) showing a state where the other abutting portion (second abutting portion 402 ) is opposed to the IC device 9 held at the offset position. 16C is a cross-sectional view (viewed in the X-axis direction) showing the IC device 9 positioned by the other contact portion (second contact portion 402 ). 17A is a plan view showing an IC device as an electronic component held at a shifted position when viewed from the Z-axis direction (viewed along line A-A of FIG. 12 ). 17B is a plan view (viewed in the Z-axis direction) showing a state where the abutting portions (the first abutting portion 401 and the second abutting portion 402 ) are opposed to the IC device held at the offset position. 17C is a plan view (viewed in the Z-axis direction) showing the IC device 9 positioned by the contact portions (the first contact portion 401 and the second contact portion 402 ).

First, referring to FIG. 15A, FIG. 15B, FIG. 15C, and FIG. 17A, FIG. 17B, and FIG. 17C, the movement of the first abutting portion 401 that abuts against the wall surface 913 of the IC device 9 from the second direction along the X-axis direction is described. Be explained.

As shown in FIGS. 15A and 17A , the IC device 9 is placed with the lower surface 912 as the first surface facing the upper surface 571 of the mounting table 57 of the mounting portion 51A. In addition, the IC device 9 is sucked and held on the mounting table 57 by the air suction holes 504 of the mounting portion 51A having a negative pressure. As described above, if the IC device 9 is held by suction, the suction force can be easily changed, and the position of the IC device 9 can be easily moved (slidable) by pressing.

In addition, at this time, the IC device 9 is held with a predetermined offset (position shifted in advance) in the direction in which the first abutting portion 401 is arranged (see FIG. 15B ). Specifically, in this embodiment, since the first abutting portion 401 is located in the negative X direction, the IC device 9 is arranged offset so that the center position of the IC device 9 is located in the negative X direction with respect to the center position of the mounting table 57. .

Next, as shown in FIG. 15B and FIG. 17B , the arm unit 433A (refer to FIG. 12 ) is moved downward toward the IC device 9 so that the suction portion (holding portion) 49 is positioned near the upper surface 911 of the IC device 9 . Stop at the specified position in the direction. The predetermined position in the Z direction here is a position where the contact surface 403 f of the first contact portion 401 faces the wall surface 913 of the IC device 9 . At this time, the arm unit 433A (see FIG. 12 ) descends to a position where a space is provided between the contact surface 403 f of the first contact portion 401 and the wall surface 913 of the IC device 9 . Therefore, the center position of the suction portion (holding portion) 49 is shifted in the negative X direction with respect to the center position of the mounting table 57 similarly to the IC device 9 .

In addition, by relatively moving the arm unit 433A (see FIG. 12 ) and the mounting portion 51A in the direction along the X direction (the second direction), the contact surface 403 f of the first contact portion 401 contacts and presses against the mounting portion 51A. The wall surface 913 of the IC device 9 . In this embodiment, as shown in FIG. 15C and FIG. 17C , the arm unit 433A (see FIG. 12 ) moves in the direction of the arrow m11 in the figure relative to the fixed mounting portion 51A, whereby the first contact portion 401 The abutting surface 403f of the IC abuts and presses against the wall surface 913 of the IC device 9 . Thereby, the IC device 9 is slid (moved) on the mounting table 57 to a predetermined position, for example, a position where the center position of the IC device 9 substantially overlaps the center position of the suction portion (holding portion) 49, and alignment (centering) is performed. ). In other words, the lower surface 912 (first surface) of the IC device 9 slides on the mounting table 57 .

Next, referring to FIG. 16A, FIG. 16B, FIG. 16C and FIG. 17A, FIG. 17B, and FIG. 17C, the movement of the second abutting portion 402 abutting against the wall surface 914 of the IC device 9 from the third direction along the Y-axis direction will be described. Be explained.

As shown in FIGS. 16A and 17A , IC device 9 is sucked and held on mounting table 57 in the same manner as in FIG. 15A described above. At this time, the IC device 9 is held with a predetermined offset (position shifted in advance) in the direction in which the second abutting portion 402 is arranged (see FIG. 16B ). Specifically, in this embodiment, since the second abutting portion 402 is located in the positive Y direction, the IC device 9 is offset so that the center position of the IC device 9 is located in the positive Y direction with respect to the center position of the mounting table 57 . Off-site configuration.

Next, as shown in FIG. 16B and FIG. 17B , the arm unit 433A (see FIG. 12 ) is moved downward toward the IC device 9, and the suction portion (holding portion) 49 is moved close to the upper surface 911 of the IC device 9 in the Z direction. Stop at the specified position. The predetermined position in the Z direction here is a position where the contact surface 404 f of the second contact portion 402 faces the wall surface 914 of the IC device 9 . At this time, the arm unit 433A (see FIG. 12 ) descends to a position where a space is provided between the contact surface 404 f of the second contact portion 402 and the wall surface 914 of the IC device 9 . Therefore, the center position of the suction portion (holding portion) 49 is shifted from the center position of the mounting table 57 so as to be located in the positive Y direction like the IC device 9 .

In addition, by relatively moving the arm unit 433A (see FIG. 12 ) and the mounting portion 51A in the direction along the Y direction (third direction), the contact surface 404f of the second contact portion 402 is brought into contact with and pressed against. The wall surface 914 of the IC device 9 . In this embodiment, as shown in FIG. 16C and FIG. 17C , the arm unit 433A (see FIG. 12 ) moves in the direction of the arrow m12 in the figure relative to the fixed mounting portion 51A, whereby the movement of the second contact portion 402 The contact surface 404f contacts and presses against the wall surface 914 of the IC device 9 . Thereby, the IC device 9 is slid (moved) to a predetermined position on the stage 57, for example, a position where the center position of the IC device 9 substantially overlaps the center position of the suction portion (holding portion) 49, and alignment (centering) is performed. In other words, the lower surface 912 (first surface) of the IC device 9 slides on the mounting table 57 .

The suction force of the IC device 9 held on the mounting portion 51A (mounting table 57 ) is preferably smaller than the pressing force by the abutting portions (the first abutting portion 401 and the second abutting portion 402 ). In addition, the suction force of the IC device 9 held on the mounting portion 51A can also be referred to as the lower surface of the IC device 9 in the pressing direction of the contact portion (the first contact portion 401 and the second contact portion 402 ). 912 (the first surface) is the frictional force against the mounting portion 51A. In this way, the IC device 9 can be easily moved by the pressing of the contact parts (the first contact part 401 and the second contact part 402 ), and the positioning (centering) of the IC device 9 can be easily performed.

In addition, when the IC device 9 deviates in the rotation direction in plan view from the direction in which the upper surface 911 as the first surface is frontal (facing the upper surface 911 ), the position can be corrected. Specifically, by bringing the first abutting portion 401 and the second abutting portion 402 into abutment and pressing against the wall surfaces 913, 914 of the IC device 9, the corners of the IC device 9 follow the respective abutment surfaces 403f, 404f. Sliding allows the wall surfaces 913 and 914 to be in contact along the contact surfaces 403f and 404f, thereby enabling a state in which there is no rotational deviation.

In addition, in the above, the arm unit 433A (see FIG. 12 ) moves in the direction of the arrow m11 and the arrow m12 in the figure with respect to the fixed mounting portion 51A, whereby the first abutting portion 401 or the second abutting portion 402 moves. Instead, the IC device 9 is pressed, but not limited thereto. As shown in FIG. 17B , the IC device 9 mounted on the mounting portion 51A is moved in the directions of the arrow m13 and the arrow m14 with respect to the arm unit 433A (see FIG. 12 ) that does not move in the X direction and the Y direction. The IC device 9 can be pressed. That is, the IC device 9 mounted on the mounting portion 51A relatively moves with respect to the first abutting portion 401 and the second abutting portion 402 that do not move in the X direction and the Y direction, whereby the wall surface 913, 914 abuts and presses against the abutting surfaces 403f, 404f. Thereby, the IC device 9 is slid (moved) to a predetermined position on the mounting table 57, for example, a position where the center position of the IC device 9 substantially overlaps the center position of the suction portion (holding portion) 49, thereby enabling alignment (centering). ).

In addition, as described with reference to FIG. 17B , the first contact portion 401 and the second contact portion 402 are arranged so as to be able to contact and press the IC from two directions (second direction and third direction) orthogonal to each other. The walls 913 , 914 of the device 9 .

In this way, the plurality of arranged abutting portions (the first abutting portion 401 and the second abutting portion 402) press the wall surface 913, 914, so it is possible to easily and more reliably correct (center) the deviation of the rotation direction of the IC device 9 (the inclination in plan view when the upper surface 911 is made to be the front), along multiple directions (the second direction, and the The position of the third direction (orthogonal to the second direction) is shifted.

In addition, for the movement of the first abutting part 401 along the second direction and the movement of the second abutting part 402 along the third direction, either one may be moved first, or both may be moved along the second direction and the second direction at the same time. 3 directions to move.

According to the inspection apparatus (electronic component inspection apparatus) 1 of the fourth embodiment described above, on the upper surface 571 of the mounting table 57 constituting the mounting portion 51A of the component arrangement portion, the abutting portions (the first abutting portion 401 and the second abutting portion 401 ) The second surface intersecting the first surface (lower surface 912 ) of the IC device 9 arranged in contact with the first surface (lower surface 912 ) sucked and held by the abutting portion 402 ), that is, along the groove portion 918 On the other hand, the wall surfaces 913 and 914 of the cut (segmented) IC device 9 abut against each other, so that the IC device 9 can be positioned (for example, centered). The wall surfaces 913 and 914 generated by the groove portion 918 provided when the IC device 9 is singulated are formed by, for example, a dicing device or the like, so the positional accuracy with respect to the IC device 9 is high, and there are no protrusions 919b, The remaining deformed parts such as the recess 919c (see FIG. 14 ) have a flat surface. Therefore, the IC device 9 can be easily fixed by a simple mechanism in which the contact parts (the first contact part 401 and the second contact part 402) contact the wall surfaces (second surfaces) 913, 914 of the IC device 9. Positioning (to the center).

In addition, the IC device 9 is pressed against the abutting portion (first abutting portion 401 and second abutting portion 401 and second abutting portion 401) by relative movement between the suction portion 49 as the holding portion constituting the component placement portion and the mounting portion 51A (mounting table 57). section 402). In this way, the position of the IC device 9 held movable by suction can be moved by a simple mechanism based on the pressing of the abutting parts (the first abutting part 401 and the second abutting part 402), thereby enabling easy processing. Positioning (to the center).

<Fifth Embodiment>

Next, an electronic component inspection device according to a fifth embodiment of the present invention will be described with reference to FIG. 18 . 18 is a cross-sectional view (vertical cross-sectional view) showing a transport unit (arm unit and reciprocating device) of an electronic component inspection device according to a fifth embodiment of the present invention.

In addition, the upper side on the drawing of FIG. 18 is called "upper" or "upper", and the lower side is called "lower" or "below" (The same applies to the figure of other embodiment). In addition, in FIG. 18, the structure of one of the several arm units of a conveyance part, and the reciprocating apparatus corresponding to this arm unit is shown in figure.

Hereinafter, the fifth embodiment of the electronic component conveying device and the electronic component inspection device of the present invention will be described with reference to this FIG. mark, omitting its description.

The inspection apparatus 1B which is the electronic component inspection apparatus according to the fifth embodiment except the abutting portion (the fifth abutting portion 401 and the second abutting portion 402 ) The embodiment is the same as the inspection apparatus 1A of the fourth embodiment except that the structures and arrangement positions of the first contact portion 401B and the second contact portion 402B are different. Specifically, in the fourth embodiment described above, the contact portions (the first contact portion 401 and the second contact portion 402) are connected to the lower surface 482 of the lower end portion 48A, but in this embodiment, as shown in FIG. As shown in 18, the contact part (the first contact part 401B and the second contact part 402B) is connected to the reciprocating device 41 constituting the transport part 4B. Hereinafter, the structure of the contact part (1st contact part 401B and the 2nd contact part 402B) connected to the reciprocating device 41 and the reciprocating device 41 is mainly demonstrated.

The contact part (the first contact part 401 and the second contact part 402 ) as described in the above-mentioned fourth embodiment is not connected to the lower end part 48B of the structure of this embodiment. In addition, the length in the Z direction of the upper surface 483 and the lower surface 482 of the lower end portion 48B is smaller than the length in the Z direction of the upper surface 483 and the lower surface 482 of the lower end portion 48A. Other than that, the configuration of the lower end portion 48B of the present embodiment is the same as that of the lower end portion 48A of the fourth embodiment. Therefore, description of the lower end portion 48B is omitted.

Similar to the fourth embodiment shown in FIG. 11 , the reciprocating device 41 transports the IC devices 9 placed on the mounting table 341 to the vicinity of the inspection section 5A, and therefore further transports the IC devices 9 inspected in the inspection section 5A to a collection unit. Near the side arrangement part 6. Four recesses 411 for accommodating IC devices 9 are formed in parallel in the X direction on the shuttle 41 . In addition, the reciprocating device 41 is guided by a linear motion guide, and can reciprocate in the X direction by a drive source such as a linear motor. In addition, the number of recesses 411 formed is four in this embodiment, but is not limited thereto, and may be one, two, three, or five or more. In addition, the arrangement of the recesses 411 is arranged in one row along the X direction in this embodiment, but it is not limited to this, and a plurality of rows and columns may be arranged in the X direction and the Y direction, or may be arranged along the X direction. One column is arranged in the Y direction.

As shown in FIG. 18, the recess 411 is provided with a slope-shaped opening 413 dug into a concave and inclined side wall portion from the upper surface of the reciprocating device 41, and the IC device 9 provided at the bottom of the opening 413. The placement portion 414 and the relief portion 412 provided in a concave shape at the bottom of the opening 413 for avoiding contact with the terminals 92 of the IC device 9 . With respect to the recess 411 , the entrance and exit of the IC device 9 are facilitated by the slope-shaped opening 413 .

Two contact portions, a first contact portion 401B and a second contact portion 402B, are arranged on the upper surface 418 of the reciprocating device 41 . In addition, in this embodiment, the first abutting portion 401B and the second abutting portion 402B are arranged so as to be able to abut and press against the IC device 9 from two directions (second direction and third direction) orthogonal to each other. Wall surfaces 913, 914 (see FIG. 17A, FIG. 17B, FIG. 17C).

The first abutting portion 401B and the second abutting portion 402B, which are abutting portions connected to the upper surface 418 of the reciprocating device 41, have a position alignment ( to the center) function. Similar to the fourth embodiment described with reference to FIG. 17B , alignment (centring) of the IC device 9 on which the upper surface 911 as the first surface is adsorbed by the adsorption unit 49 is performed. Furthermore, the first abutting portion 401B is disposed so as to be able to abut against and press against the wall surface 913 which is the second surface of the IC device 9 from the second direction along the X-axis direction, and the second abutting portion 402B is disposed so as to be capable of being pressed from along the X-axis direction. The third direction in the Y-axis direction contacts and presses against the wall surface 914 which is the second surface of the IC device 9 .

As shown in FIG. 18 and FIG. 19A and FIG. 20A described later, the first abutting portion 401B and the second abutting portion 402B include thick-walled portions 405B, 406B, and from the upper side of the thick-walled portions 405B, 406B (the arm unit 433B side) the thin-walled portions 403B, 404B extending. Furthermore, in the first contact portion 401B and the second contact portion 402B, the lower surfaces of the thick portions 405B, 406B are connected to the upper surface 418 of the reciprocating device 41 . The thin portions 403B, 404B have contact surfaces 403Bf, 404Bf provided in a planar shape as the end faces of the front ends. The contact surfaces 403Bf and 404Bf are arranged so as to be able to contact the wall surfaces 913 and 914 which are the second surfaces of the IC device 9 . Then, the contact surfaces 403Bf and 404Bf contact the wall surfaces 913 and 914 which are the second surfaces of the IC device 9 to perform positioning (centering) of the IC device 9 . In addition, it is preferable that the surfaces of the contact surfaces 403Bf and 404Bf have smooth surface conditions without irregularities such as mirror finishing, as in the fourth embodiment.

-positioning action-

Hereinafter, the positioning operation of the electronic component (IC device 9 ) of the electronic component inspection apparatus according to the fifth embodiment will be described with reference to FIGS. 19A to 19C and FIGS. 20A to 20C . FIG. 19A is a cross-sectional view showing an IC device 9 as an electronic component held at a shifted position when viewed from the Y-axis direction. 19B is a cross-sectional view (viewed in the Y-axis direction) showing a state where one abutting portion (first abutting portion 401B) is opposed to the IC device 9 held at an offset position. 19C is a cross-sectional view (viewed in the Y-axis direction) showing the IC device 9 positioned by one contact portion (first contact portion 401B). FIG. 20A is a cross-sectional view showing IC device 9 as an electronic component held at an offset position when viewed from the X-axis direction. 20B is a cross-sectional view (viewed in the X-axis direction) showing a state where the other abutting portion (second abutting portion 402B) is opposed to the IC device 9 held at the offset position. 20C is a cross-sectional view (viewed in the X-axis direction) showing the IC device 9 positioned by the other contact portion (second contact portion 402B).

First, the operation of the first contact portion 401B that contacts the wall surface 913 of the IC device 9 from the second direction along the X-axis direction will be described with reference to FIGS. 19A , 19B, and 19C.

As shown in FIG. 19A , the suction portion 49 of the arm unit 433B is in contact with the upper surface 911 which is the first surface of the IC device 9 placed in the recess 411 of the reciprocating device 41 . At this time, the IC device 9 exists with a predetermined offset (shifted position in advance) in the direction in which the first abutting portion 401B is arranged. Specifically, in this embodiment, since the first abutting portion 401B is located in the negative X direction, the center position of the IC device 9 is located in the negative X direction with respect to the center position of the suction portion 49 as the holding portion. Mode offset configuration.

Next, as shown in FIG. 19B , the suction portion 49 (arm unit 433B: see FIG. 18 ) holding the IC device 9 by suction moves upward (direction indicated by arrow H1 in the figure) to a predetermined position. At this time, the IC device 9 is held (attracted) so that the center position of the IC device 9 is shifted in the negative X direction with respect to the center position of the holding portion 49 . In addition, the aforementioned predetermined position refers to a position where the contact surface 403Bf of the first contact portion 401B faces the wall surface 913 of the IC device 9 . In addition, a space is provided between the contact surface 403Bf of the first contact portion 401B and the wall surface 913 of the IC device 9 .

In addition, by relatively moving the suction part 49 (arm unit 433B) and the reciprocating device 41 in the direction along the X direction (second direction), the contact surface 403Bf of the first contact part 401B contacts and presses the IC. The wall 913 of the device 9 . In this embodiment, as shown in FIG. 19C , the reciprocating device 41 moves in the direction of the arrow m11 in the figure with respect to the fixed suction portion 49 , whereby the contact surface 403Bf of the first contact portion 401B contacts and presses against it. The wall surface 913 of the IC device 9 . Thereby, the IC device 9 held by the suction part 49 is slid (moved) to a predetermined position, for example, a position where the center position of the IC device 9 substantially overlaps the center position of the suction part (holding part) 49, and alignment is performed. (to the center).

Next, the operation of the second contact portion 402B that contacts the wall surface 914 of the IC device 9 from the third direction along the Y-axis direction will be described with reference to FIGS. 20A , 20B, and 20C.

As shown in FIG. 20A , the suction portion 49 of the arm unit 433B comes into contact with the upper surface 911 which is the first surface of the IC device 9 placed in the recess 411 of the reciprocator 41 , as in FIG. 19A described above. At this time, the IC device 9 exists with a predetermined offset (shifted position in advance) in the direction in which the second contact portion 402B is arranged. Specifically, in the present embodiment, since the second abutting portion 402B is located in the positive Y direction, the IC device 9 is positioned such that the center position of the IC device 9 is located in the positive Y direction with respect to the center position of the suction portion 49 as the holding portion. Offset configuration.

Next, as shown in FIG. 20B , the suction portion 49 (arm unit 433B) holding the IC device 9 by suction moves upward (direction indicated by arrow H1 in the figure) to a predetermined position. At this time, the IC device 9 is held (suctioned) so that the center position of the IC device 9 is shifted in the positive Y direction with respect to the center position of the holding portion 49 . In addition, the aforementioned predetermined position refers to a position where the contact surface 404Bf of the second contact portion 402B faces the wall surface 914 of the IC device 9 . In addition, a space is provided between the contact surface 404Bf of the second contact portion 402B and the wall surface 914 of the IC device 9 .

In addition, by relatively moving the suction part 49 and the reciprocator 41 in the Y direction (third direction), the contact surface 404Bf of the second contact part 402B contacts and presses the wall surface 914 of the IC device 9 . In this embodiment, as shown in FIG. 20C , the reciprocating device 41 moves in the direction of the arrow m12 in the figure with respect to the fixed suction portion 49 , whereby the contact surface 404Bf of the second contact portion 402B contacts and presses against it. The wall surface 914 of the IC device 9 . Thereby, the IC device 9 held by the suction part 49 is slid (moved) to a predetermined position, for example, a position where the center position of the IC device 9 substantially overlaps the center position of the suction part (holding part) 49, and alignment is performed. (to the center).

In addition, the IC device 9 is sucked and held by the suction portion (holding portion) 49 through the suction flow path 430 having a negative pressure. In this way, if the IC device 9 is held by suction, the suction force can be easily changed, and by pressing from the contact parts (the first contact part 401B and the second contact part 402B) in the X direction and the Y direction, the IC device 9 can be easily ground to move the position of the IC device 9 .

In addition, it is preferable that the suction force of the IC device 9 held by the suction portion 49 is smaller than the pressing force by the contact portions (the first contact portion 401B and the second contact portion 402B). In addition, the suction force of the IC device 9 held by the suction part 49 can also be referred to as the contact part (the first contact part 401B and the second contact part 401B and the second contact part 401B) of the IC device 9 with respect to the suction part 49. The frictional force in the pressing direction in which the connecting portion 402B) is pressed. In this way, the IC device 9 can be easily moved by pressing the abutting parts (the first abutting part 401B and the second abutting part 402B), and the positioning (centering) of the IC device 9 can be easily performed.

Further, in the fifth embodiment, the position of the IC device 9 can be corrected even when the IC device 9 deviates in the rotational direction in plan view from the direction in which the first surface (upper surface 911 ) becomes the front. Specifically, by bringing the first contact portion 401B and the second contact portion 402B into contact and pressing against the wall surfaces 913, 914 of the IC device 9, the corners of the IC device 9 follow the respective contact surfaces 403Bf, 404Bf. The sliding results in a state where the wall surfaces 913 and 914 are in contact along the contact surfaces 403Bf and 404Bf, and thus can be in a state where there is no rotational misalignment.

In addition, in the above, the reciprocating device 41 moves in the direction of the arrow m11 and the arrow m12 in the figure with respect to the suction part 49 fixed in the X direction and the Y direction, whereby the first contact part 401B or the second contact part 402B moves. Instead, the IC device 9 is pressed, but not limited thereto. For example, IC device 9 can be pressed by moving suction unit 49 , that is, IC device 9 held by suction unit 49 , in X direction and Y direction relative to reciprocator 41 that does not move in X direction and Y direction. In other words, the IC device 9 held by the suction part 49 moves relative to the first abutting part 401B and the second abutting part 402B that do not move in the X direction and the Y direction, and the wall surfaces 913 and 914 of the IC device 9 move. Contact and press against the contact surfaces 403Bf, 404Bf. As a result, the IC device 9 can be slid (moved) to a predetermined position while being held by the suction portion 49 , thereby enabling alignment (centering).

In addition, for the movement of the first abutting part 401B in the second direction and the movement of the second abutting part 402B in the third direction, either one may be moved first, or both may be moved in the second direction and the third direction at the same time. direction to move.

According to the inspection apparatus (electronic component inspection apparatus) 1B of the fifth embodiment described above, the abutting portions (the first abutting portion 401B and the second abutting portion 402B) can be in contact with the first surface (upper surface) of the IC device 9 . 911) The second intersecting surface, that is, the wall surfaces 913 and 914 of the IC device 9 cut (divided) along the groove 918 abut against each other, and the IC device 9 is positioned (for example, centered), wherein the IC device 9 It is arranged so that the first surface (upper surface 911 ) abuts against the suction portion 49 which is a holding portion constituting the component arrangement portion.

Further, the IC device 9 is pressed against the contact parts (the first contact part 401B and the second contact part 402B) by the relative movement of the suction part 49 and the reciprocating device 41 as the holding part constituting the component placement part. In this way, the position of the IC device 9 held movable by suction can be moved by a simple mechanism based on the pressing of the abutting parts (the first abutting part 401B and the second abutting part 402B), and the Positioning (to the center).

In this manner, according to the inspection device (electronic component inspection device) 1B of the fifth embodiment described above, the same effects as those of the inspection device (electronic component inspection device) 1 of the fourth embodiment are obtained.

<Sixth embodiment>

Next, an electronic component inspection device according to a sixth embodiment of the present invention will be described with reference to FIG. 21 . 21 is a layout diagram showing an outline of an electronic component inspection device according to a sixth embodiment of the present invention.

An inspection device 1C as an electronic component inspection device according to the sixth embodiment includes a supply unit 2 , a supply-side alignment unit 3 , a transport unit 4C, an inspection unit 5A, a collection-side alignment unit 6 , a collection unit 7 , and a device for controlling these units. Control part 8.

In addition, the inspection device 1C has: a base 11 for arranging the supply unit 2, the supply side alignment unit 3, the transport unit 4C, the inspection unit 5A, the recovery side alignment unit 6, and the recovery unit 7; The cover 12 of the base 11 covers the unit 4C, the inspection unit 5A, and the recovery-side alignment unit 6 .

In addition, the base surface 111 which is the upper surface of the base 11 is substantially horizontal, and the constituent members of the supply-side alignment unit 3 , the transport unit 4C, the inspection unit 5A, and the collection-side alignment unit 6 are arranged on the base surface 111 . In addition, in the inspection device 1C, the transportation is constituted by the configuration other than the inspection unit 5A, that is, the supply unit 2, the supply side arrangement unit 3, the transport unit 4C, the recovery side arrangement unit 6, the recovery unit 7, and a part of the control unit 8. The device (electronic component transport device) 10C. The transport device 10C performs transport of the IC device 9 and the like.

An inspection device 1C as an electronic component inspection device according to the sixth embodiment is different from the inspection device 1A according to the fourth embodiment in that it has a transport unit 4C in which a position detection unit 105 is added to the transport unit 4 of the fourth embodiment. Hereinafter, the description will focus on the configuration of the component position detection unit 105 which is a point different from the fourth embodiment described above, and the same configurations will be given the same reference numerals and their descriptions will be omitted.

The component position detection unit 105 included in the conveying unit 4C is equipped with, for example, controlling the aforementioned abutting units (first abutting units 401, 401B, second abutting units 402, 402B) visual positioning mechanisms such as movement.

The component position detection unit 105 of the present embodiment is held (suctioned) before the positioning (centering) of the abutting parts (the first abutting part 401 and the second abutting part 402 ) based on the above-mentioned fourth embodiment. The holding position of the IC device 9 on the mounting portion 51A (mounting table 57 ) is detected. The component position detection unit 105 includes a camera, and can obtain the holding position of the IC device 9 as image information.

In addition, the component position detection unit 105 of the sixth embodiment can also perform positioning (centering) of the contact parts (the first contact part 401B and the second contact part 402B) based on the above-mentioned fifth embodiment. The holding position of the IC device 9 held (adsorbed) by the suction portion 49 is detected.

The information of the detected holding position of the IC device 9 is processed by the control unit 8, for example, it is determined which one of the first abutting parts 401, 401B and the second abutting parts 402, 402B is to be moved first to be connected to the position of the IC device 9. The wall surfaces 913 and 914 are in contact with each other to operate the conveyance unit 4C. In addition, the control unit 8 determines which of the first abutting portions 401, 401B and the second abutting portions 402, 402B comes first based on, for example, the magnitude of the amount of deviation of the IC device 9, the amount of inclination (the amount of deviation in the rotation direction), and the like. Movement can be more efficiently and correctly positioned (centered). In addition, the control unit 8 can control the moving speed, moving amount, and the like of the first contact parts 401 and 401B and the second contact parts 402 and 402B based on the detected holding position information of the IC device 9 .

In this way, in addition to the configurations of the above-mentioned fourth and fifth embodiments, by using the configuration having the component position detection unit 105 described in the sixth embodiment, accurate positioning (centering) can be performed more efficiently.

As mentioned above, the electronic component transport device and the electronic component inspection device according to the present invention have been described with reference to the illustrated embodiment, but the present invention is not limited thereto, and each part constituting the electronic component transport device and the electronic component inspection device can perform the same functions as arbitrary structural substitutions. In addition, arbitrary constituents may be added.

In addition, the electronic component transport device and the electronic component inspection device of the present invention may combine arbitrary two or more configurations (features) of the above-described embodiments.

Claims (12)

1. An electronic component delivery device, characterized in that it has: base; a holding part configured to be movable relative to the base and capable of holding the electronic component on the first surface of the electronic component; and an abutting portion configured to be movable relative to the base and capable of abutting against a second surface of the electronic component different from the first surface, The contact portion can press the electronic component in a second direction different from the first direction when the holding portion moves in a first direction relative to the base. 2. The electronic component transport device according to claim 1, wherein: The electronic component can be held by the holding portion by suction. 3. The electronic component transport device according to claim 2, wherein: The suction of the electronic component and the movement of the holding portion relative to the base are performed by the same suction source. 4. The electronic component transport device according to any one of claims 1 to 3, wherein: The contact portion is configured to be rotatable relative to the base portion. 5. The electronic component transport device according to claim 4, wherein: The abutting portion abuts against the holding portion, and rotates in conjunction with movement of the holding portion. 6. The electronic component transport device according to any one of claims 1 to 5, wherein: The second direction is a direction perpendicular to the first direction. 7. The electronic component transport device according to any one of claims 1 to 6, wherein: There are multiple abutting parts, Among the plurality of contact parts, the first contact part and the second contact part move in directions opposite to each other along the first moving direction, and press the electronic component. 8. The electronic component transport device according to claim 7, wherein: The first contact portion and the second contact portion are each movable by the same amount of movement. 9. The electronic component delivery device according to claim 7 or 8, wherein: Equipped with: 3rd contact part and 4th contact part, The third contact portion and the fourth contact portion move in opposite directions to each other along a second moving direction perpendicular to the first moving direction, and press the electronic component. 10. The electronic component transport device according to claim 9, wherein: The third contact portion and the fourth contact portion are movable by the same amount of movement. 11. The electronic component transport device according to any one of claims 1 to 10, wherein: The contact part includes an adjustment part capable of changing a contact position with the electronic component. 12. An electronic component inspection device, comprising: a holding part that is movably disposed on the base and capable of holding the electronic component via the first surface of the electronic component; an abutting portion configured to be movable relative to the base, and capable of abutting against a second surface of the electronic component different from the first surface; an electronic component mounting section capable of mounting the electronic component; and inspection department, which conducts inspections of electronic components, The contact portion presses the electronic component in a second direction different from the first direction when the holding portion moves in a first direction relative to the base.