JPH11333775A - Parts sucking device, parts handling device, and parts testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately align the center of a part and the center of a suction head by introducing negative pressure to a suction pad, arranging an aligning member to be moved in such a direction as to be brought into contact with the outer periphery of the part on the periphery of the suction pad, and adjusting the relative positions of the suction pad and the part. SOLUTION: Hook members 14 are arranged on four parts with respect to a movable shaft 6 and symmetrically with respect to an axis of a suction device 2. When a part such as an IC chip 35 to be tested is sucked to a suction pad 22 of the suction device 2, vacuum pressure is introduced to the suction pad 22. In this case, vacuum pressure partially acts so that first arms 16 of the hook members 14 may be moved in such a direction as to be brought into contact with the outer periphery of the IC chip 35. Therefore, the suction of the IC chip 35 by the suction pad 22 can be performed in a state where the relative positions of the suction pad 22 and the IC chip 35 are adjusted and the centers of the IC chip 35 and the suction device 2 are accurately aligned.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component suction device, a component handling device, and a component test device, and more particularly, to a component suction device for suctioning electronic components such as IC chips, and a component handling device having the same. The present invention relates to an apparatus and a component test apparatus having the same.

[0002]

2. Description of the Related Art In the course of manufacturing semiconductor devices and the like,
A test device for testing an electronic component such as an IC chip finally manufactured is required. In such a test apparatus, a component handling apparatus called a handler is used. In this handler, a large number of IC chips stored in a tray are suctioned by a component suction device and conveyed onto a test head of a test device, and each IC chip is brought into electrical contact with the test head to test the IC chips. Do. Then, when the test is completed, each IC chip is carried out of the test head by a component suction device having a suction head, and is placed on a tray according to the test result, whereby sorting into categories such as non-defective products and defective products is performed.

[0005] In this type of test apparatus, IC chips are exchanged between a customer tray and a test tray before and after a test. As a test device for performing a test by bringing an IC chip into contact with a test head, a device of a type in which an IC chip is pressed on a test head while mounted on a test tray is known. This type of test equipment mainly consists of DRAM, SRAM, EPROM, E
It is used for testing a memory IC chip such as an EPROM, and can test many IC chips at a time.

Further, after applying a thermal stress to the IC chips stored in the customer tray by using a heat plate or the like, the IC chips are suctioned several times at a time by a suction head and carried to a socket of a test head, where the IC chips and the IC chips are combined. A device of a type that makes electrical contact with a socket is also known. In a test process of a test apparatus of this type, an IC chip is pressed against a test head while being sucked by the suction head. This type of test apparatus is mainly used to test an IC chip having a built-in logic circuit or analog circuit.

[0005]

However, particularly in the handler used in the latter type of test apparatus, the IC chip to be tested is sucked by the suction head and transported to the upper portion of the test head, and then the terminals of the IC chip are connected. It has been difficult to accurately position and connect to the lead terminals of the socket of the test head. This is because it is difficult for the conventional handler to accurately position the center of the IC chip and the center of the suction head when the IC chip to be tested is suctioned to the suction head of the handler.

Therefore, in the conventional handler, after the IC chip sucked by the suction head is transported to the upper portion of the socket of the test head, the IC chip is brought closer to the socket, and
Before the chip terminals touch the socket lead terminals,
The suction with the IC chip by the suction head is once released. By once releasing the suction of the IC chip by the suction head, the IC chip is guided by a guide side wall of the socket and fits inside the socket by its own weight, and the IC chip and the socket are aligned with each other. Terminal contacts socket lead terminals. Thereafter, the test is performed by pressing the IC chip with the tip of the suction head in the socket direction.

In the conventional handler, if the terminal of the IC chip is directly connected to the lead terminal of the socket without temporarily releasing the suction of the IC chip by the suction head, the lead terminal may be bent or the IC chip may be bent. May be damaged. This is because it is difficult for the conventional handler to accurately position the center of the IC chip and the center of the suction head when the IC chip to be tested is suctioned to the suction head of the handler. If a displaced IC chip is forcibly inserted into a socket, the terminals of the IC chip and the lead terminals of the socket will not be aligned, and the lead terminals may be bent or the IC chip terminals may be damaged.

For this reason, in the conventional handler, it is necessary to temporarily release the suction of the IC chip by the suction head before the terminal of the IC chip comes into contact with the lead terminal of the socket, and the test index time is long. There was a problem of becoming.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has a relatively simple component configuration, which allows a component such as an IC chip to be positioned and sucked and held with high precision, and a component testing apparatus. Component suction device that can reduce the test index time when used for
It is an object to provide a component handling device and a component testing device.

[0010]

In order to achieve the above object, a component suction device according to the present invention includes a suction pad to which a component is sucked by introducing a negative pressure, and a device arranged around the suction pad. A positioning member that moves in a direction that comes into contact with the outer peripheral portion of the component by introducing a negative pressure to the suction pad, and adjusts a relative position between the suction pad and the component.

The component suction apparatus according to the present invention further comprises a movable shaft on which the suction pad is mounted, and a suction head body for holding the movable shaft movably in a predetermined range in the axial direction. The movable shaft is relatively moved in the axial direction with respect to the suction head body by using a part of the negative pressure introduced into the drive source as a driving source, and the positioning member is driven in conjunction with the axial movement of the movable shaft. Preferably.

[0012] It is preferable that the positioning member is a hook member that pivots in accordance with the relative movement of the movable shaft in the axial direction.

When no negative pressure is applied to the suction pad, the weight of the movable shaft acts on the movable shaft, and the movable shaft is moved in the opposite direction to the case where the negative pressure is applied to the suction pad. However, it is preferable that the suction head body is configured to move relative to the suction head body in the axial direction.

A return spring is mounted between the movable shaft and the suction head main body. When a negative pressure is not applied to the suction pad, the return pad is spring-loaded by the spring force of the return spring. It is preferable that the movable shaft is configured to move relative to the suction head main body in the axial direction in a direction opposite to the case where the negative pressure is introduced.

In the present invention, the positioning member is
It is preferable that the suction pads are arranged on all sides.

A component handling apparatus according to the present invention has a component suction device and a moving means for moving the component suction device in at least one direction, and the component suction device has the above-described configuration. I have.

According to the present invention, there is provided a component testing apparatus comprising: a component suction device; moving means for moving the component suction device in at least one direction; and a test head for testing components conveyed by the component suction device. And the component suction device has the above-described configuration.

[0018]

With the component suction device, the component handling device having the same, and the component test device having the same according to the present invention, when a component such as an IC chip to be tested is suctioned onto the suction pad of the component suction device, the suction pad is used. Negative pressure is introduced into. At that time, a part of the negative pressure acts to move the positioning member in a direction in which the positioning member contacts the outer peripheral portion of the component.
As a result, when a component is sucked by the suction pad, the relative position between the suction pad and the component is adjusted, and the component is sucked by the suction pad while the center of the component and the center of the suction head are accurately positioned. Will be

Therefore, in the component handling device according to the present invention, when the component is sucked by the component suction device at the first position, the component suction device is moved by the moving means, and the component is set at the second position. At the first position, the component and the component suction device are automatically aligned. Therefore, at the second position, it is not necessary to align the component with the second position, and only the component suction device and the second position need to be aligned. Therefore, at the second position, there is no need to perform an operation such as temporarily releasing the suction of the component by the suction pad before setting the component to the second position. Therefore,
The index handling time for parts handling can be reduced.

Further, in the component testing apparatus according to the present invention, when the components accommodated in the tray are sucked by the component suction device, the components and the component suction device are automatically aligned. Therefore, when a component is set in the socket of the test head, there is no need to align the component with the socket, but only the component suction device and the second position. Therefore, at the socket position of the test head, the operation of temporarily releasing the suction of the component by the suction pad before setting the component to the socket and aligning the component with the socket becomes unnecessary. Therefore, the index time of the component test can be reduced.

Further, in the component sucking apparatus, the component handling apparatus having the same, and the component testing apparatus having the same according to the present invention, the positioning member is driven by using a negative pressure, which is always required for picking up the components, as a driving source. Therefore, the device configuration can be made relatively simple, there are few failures, and the manufacturing cost is relatively low. In addition, since no other power source is required, a compact device configuration can be achieved, and space can be saved.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments shown in the drawings.

FIG. 1 is a cross-sectional view of a main part of a component suction apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a main part along line II-II shown in FIG. 1, and FIG. FIG. 4 is a schematic plan view of the test apparatus, FIG. 4 is a partial cross-sectional side view of the component test apparatus shown in FIG. 3, FIG. 5 is a cross-sectional view of main parts of the component test apparatus shown in FIGS. Side view, FIG. 7
11 are process diagrams showing the operation of the component suction device shown in FIG.

First Embodiment A component suction device 2 shown in FIGS. 1 and 2 is used as one constituent member for an IC chip component testing device 30 shown in FIGS. 3 and 4, for example. First, the I shown in FIGS.
The overall configuration of the C chip component test device 30 will be described.

As shown in FIGS. 3 and 4, the IC chip component testing apparatus 30 of the present embodiment is an apparatus for performing a heating test in a state where the temperature of an IC chip as a component to be tested is higher than normal temperature. Handler 32 and test head 3
4 and a test main device 36.

The handler 32 includes an IC chip 3 to be tested.
5 are sequentially conveyed to an IC socket 36 provided in a test head 34, and an operation is performed in which the IC chips 35 having undergone the test are classified according to the test results and stored in a predetermined tray.

The IC socket 3 provided on the test head 34
6 is connected to a main test device 36 through a cable 38, and connects an IC chip 35 detachably attached to the IC socket 36 to the main test device 36 through a cable 38. The IC chip 35 is tested by the test signal.

The handler 32 has a base 40, and an IC chip transport drive portion is mounted mainly on the base 40. A control device mainly for controlling the handler 32 is built in a lower portion of the base 40, but a space portion 42 is partially provided.
Is provided. In this space portion 42, the test head 34
Are exchangeably arranged, and holes 44 formed in the base 40 are provided.
Through this, the IC chip 35 can be mounted on the IC socket 36.

On the base 40, as shown in FIG. 3, two sets of first and second XY moving devices (moving means of the present invention)
46 and 48 are provided. An IC chip 35 to be tested by the first XY moving device 46
And a task of sorting the tested IC chips 35. The other second XY moving device 48 is
The IC chip 35 supplied by the buffer 50 is transported onto the test head 34, and the tested IC chip 35 is transported from the test head 34 to the other buffer 51.

The first XY moving device 46 has a first X-axis rail 49 extending along the X-axis direction, and is configured to be movable in the X-direction along the first X-axis rail 49. A first Y-axis rail 51 extending along the first Y-axis rail 51 and a first movable head 53 movable in the Y direction along the first Y-axis rail 51
And The first XY moving device 46 includes a base 40
The upper first area 52 is a transportable area.

The other second XY moving device 48 is configured to extend in the X-axis direction and to be movable in the X-direction along the second X-axis rail 54.
A second Y-axis rail 55 extending along the Y-axis direction;
A second movable head 57 movable along the axis rail 55 in the Y direction. This XY moving device 48 is
The second area 56 on 0 is a transportable area.

In the first transportable area 52, a supply tray 58 storing an IC chip 35 to be tested is stored.
Sorting trays 60, 61, 62, 63 for sorting and storing the tested IC chips 35 in accordance with the test results;
While the portion 64 where the empty trays are stacked is arranged,
A heat plate 65 is arranged near the buffer 50.

The heat plate 65 is formed of, for example, a metal material, and has a plurality of IC storage recesses 66 for storing the IC chips 35 to be tested. It is transported by the XY moving device 46. The heat plate 65 is heated by a heater (not shown) in order to heat the IC chip 35 before the test at a predetermined temperature. The IC chip 35 to be tested is heated to a desired temperature on the heat plate 65, and then transferred to the buffer 50 by using the moving device 46, and is conveyed to the test head 34 by the second XY moving device 48. Tested there. That is, the test is performed on the IC chip 35 at a temperature higher than the normal temperature.

The buffers 50 and 51 are configured to be movable in the X direction along the rails 68 and 69, and the operation area 52 of the first XY movement device 46 and the operation area of the second XY movement device 48 It is configured so as to reciprocate with 56. That is, the buffer 50 performs an operation of moving the IC chip 35 under test from the region 52 to the region 56, and the buffer 51 performs an operation of carrying out the tested IC chip 35 from the region 56 to the region 52. This buffer 5
Due to the presence of 0 and 51, the XY moving devices 46 and 48 are configured to operate without interfering with each other.

Each of the XY moving devices 46 and 48 has a Z-axis driving means 70 mounted thereon. The Z-axis driving means 70 allows the tray or the heat plate 6
5, or the operation of picking up the IC chip 35 from the test head 34 and the operation of lowering the IC chip 35 on the tray and the heat plate 65 or the test head 34.

FIG. 5 shows a schematic configuration of the Z-axis driving means 70 used in the IC test apparatus. In this example, the Z-axis driving unit 70 mounted on the first XY moving device 46 will be described as an example.

A hollow portion is formed in the first Y-axis rail 51 of the first XY moving device 46, and a screw shaft 72 and a guide shaft 74 are housed in the hollow portion. The screw shaft 72 has a first
The moving body 76 of the movable head 53 is screwed together and the screw shaft 72 is driven to rotate, so that the moving body 76 can move along the guide shaft 74 in the Y-axis direction. Note that the guide shaft 74 is
, And guides the movement of the moving body 76 in the Y-axis direction.

As shown in FIG. 5, the Z-axis driving means 70 mounted on the first XY moving device 46 has two air cylinders 78 and 80 mounted vertically downward as shown in FIG.
It is also possible to operate the air cylinders 78 and 80 as a pair and to adsorb and transport two IC chips 35 at a time.

In this embodiment, a heater (not particularly shown) is provided on the vacuum suction pad 82 mounted on the air cylinder 78.
Is used to transport the IC chip 35 heated by the heat plate 65 to the buffer 50. The vacuum suction pad 84 attached to the other air-silling 80 is not provided with a heater and is used in a portion for transporting the IC chip 35 at a normal temperature. That is, it is used when the IC chips 35 are conveyed from the supply tray 58 to the heat plate 65, or when the tested IC chips 35 are sorted from the buffer 51 and stored in the respective sorting trays 60, 61, 62, and 63.

The structure of the second XY moving device 48 is as follows.
The structure is the same as that of the first XY moving device 48 shown in FIG. 5 except that the structure for holding the vacuum suction pad is different. The structure for holding the vacuum suction pad will be described later.

On the other hand, an IC provided in the test head 34
The socket 36 is not mounted directly on the test head 34 as shown in FIG. 6, for example, but is mounted via several members. That is, the test head 3
4, a motherboard 86 is mounted on the upper surface of the motherboard 86.
A replacement adapter 88 is detachably attached. On the replacement adapter 88, a board spacer 90 and a socket board 92 are mounted.
Is installed.

When the type of the IC chip 35 to be tested has changed, the replacement adapter 88 is removed from the motherboard 86 and another adapter 88 is attached.
Inspection of different IC chips 35 can be supported.
When the contents of the test are significantly changed, the test head 34 shown in FIG. 4 is detached from the handler 32, and another test head 34 is inserted into the space portion 4 of the handler 32.
2 can be dealt with.

Next, referring mainly to FIGS. 1 and 2,
The component suction device 2 according to the present embodiment will be described. The component suction device 2 according to the present embodiment shown in FIG. 1 includes a Z-axis driving unit 70 of the second XY moving device 48 shown in FIGS.
Is attached to the lower end of the IC chip 35 for vacuum suction of the IC chip 35.

As shown in FIG. 1, the component suction device 2 according to the present embodiment has a suction head main body 4. The suction head main body 4 is connected to a Z-axis driving means 70 shown in FIG. 5, and the whole component suction apparatus 2 is held by the Z-axis driving means 70 so as to be movable in the Z-axis direction.

As shown in FIG. 1, four support pieces 10 are mounted on the lower portion of the suction head main body 4. The suction head body 4 and the support piece 10 are connected and fixed by means of bolts and nuts. These suction head bodies 4
And the movable shaft 6 on the center axis of the support piece 10
It is arranged movably in a predetermined movable range along the axial direction. The four support pieces 10 are arranged so as to surround four sides of the movable shaft 6 as shown in FIG. The movable shaft 6 is movably held in the Z-axis direction with respect to the suction head main body 4 by a bearing 3 arranged inside the suction head main body 4.

A rotary shaft 12 having an axis in a plane substantially perpendicular to the axis of the movable shaft 6 is fixed (or rotatably mounted) to each support piece 10. A hook member 14 as a positioning member is rotatably mounted on each rotating shaft 12 (or is rotatably mounted on the supporting piece 10 together with the rotating shaft 12).

Each hook member 14 has a relatively long first arm 16 and a relatively short second arm 18, and the arms 16 and 18 are in a substantially vertical relationship. Each first
Each hook member 14 is attached to the rotating shaft 12 such that the arm 16 faces downward at a predetermined inclination along the Z-axis direction, and each second arm 18 projects toward the movable shaft 6.

A flange 8 is integrally formed at a substantially central portion of the movable shaft 6. The flange 8 may be formed separately from the movable shaft 6 and attached to the shaft 6. A body 17 having an outer diameter smaller than the outer diameter of the flange 8 is integrally or separately provided below the flange 8. A small-diameter portion 21 having an outer diameter smaller than the outer diameter of the body 17 is integrally or separately provided at a lower portion of the body 17. Below the small diameter portion 21, the pad holding portion 15 is provided integrally or separately. The outer diameter of the pad holding portion 15 is substantially the same as the outer diameter of the body 17, and an engagement groove 20 is formed on the outer periphery of the small diameter portion 21 located between the pad holding portions 15. The distal ends of the two arms enter and engage with the engagement grooves 20.

At the center of the pad holder 15, a suction pad 22 is mounted. The suction pad 22 is preferably made of, for example, an elastic rubber material or a synthetic resin so as not to damage the IC chip 35 to be sucked. Alternatively, it can be made of metal. The head body 4, the support piece 10, and the movable shaft 6 are preferably made of metal because rigidity is required.
It may be made of a synthetic resin. In addition, the hook member 14
Since it has a portion that comes into contact with the IC chip 35,
The chip 35 is preferably made of a synthetic resin that is less likely to damage the chip 35. However, the chip 35 is not necessarily made of a synthetic resin, but may be made of a metal or the like.

The pad holding section 15 is provided with a heating means such as a heater (not shown).
5 to heat the IC chip 35. This is to prevent the temperature from dropping before the IC chip 35 is mounted on the socket 36 of the test head 34 shown in FIGS. The pad 22 may be heated so that the IC chip 35 is heated and held from the pad 22.

A vacuum suction hole 28 is formed along the center axis of the pad 22. The suction hole 28 is formed in the vacuum evacuation shaft hole 7 formed along the axis of the movable shaft 6.
Is in communication with The shaft hole 7 for vacuum evacuation communicates with the vacuum inlet 26 via a vacuum cylinder chamber 29 formed in the upper center of the head body 4.

A return spring 27 is mounted in the vacuum cylinder chamber 29. The upper end of the return spring 27
The lower end is in contact with the upper ceiling of the vacuum cylinder chamber 29 of the head body 4, and the lower end is in contact with the upper step of the movable shaft 6, so that the movable shaft 6 is constantly pressed downward. However, since the outer peripheral portion of the flange 8 of the movable shaft 6 engages with the step portion 13 formed inside the support piece 10, the movable shaft 6 is also moved by the spring force of the return spring 27. 4 and support piece 1
It does not fall down from zero.

The vacuum cylinder chamber 29 communicates with the bearing 3, but is sealed by the V-shaped packing 11 attached to the lower end of the bearing 3, and a vacuum pressure is introduced into the vacuum inlet 26. , Vacuum pressure. In the present invention, the vacuum pressure does not necessarily mean an absolute vacuum pressure, but may be a negative pressure.

The vacuum inlet 26 is connected to a vacuum pressure generator through a conduit (not shown), and a vacuum pressure is introduced into the vacuum inlet 26 based on a control signal from a controller. I have. When a vacuum pressure is introduced into the vacuum inlet 26, the pressure is introduced into the suction hole 28 of the suction pad 22 through the shaft hole 7, and the vacuum suction of the IC chip 35 by the suction pad 22 is enabled. The vacuum pressure is also introduced into the vacuum cylinder chamber 29, and the movable shaft 6 is moved by the pressure difference between the pressure in the vacuum cylinder chamber 29 and the atmospheric pressure in a state where the IC chip 35 is adsorbed on the adsorption pad 22. It is lifted upward against the spring force of the return spring 27. The upward movement of the movable shaft 6 in the Z-axis direction is restricted by the outer peripheral portion of the flange 8 abutting against a stopper surface 9 formed at the lower end portion of the head main body 4. That is, the movable shaft 6 is formed by subtracting the thickness of the flange 8 from the distance in the Z-axis direction between the step portion 13 of the support piece 10 and the stopper surface 9 of the head body 4.
It is movable in the axial direction within a range of the axial distance corresponding to the axial distance.

FIG. 9 shows a state in which a vacuum pressure is applied to the suction hole 28 of the suction pad 22 to suck the IC chip 35. In this state, the movable shaft 6 is pulled upward along the Z-axis direction by the vacuum pressure acting on the vacuum cylinder chamber 29. As a result, the engagement groove 2 of the movable shaft 6
The second arm 18 of the hook member 14 engaged with the first arm 16 is forcibly rotated upward, and
Pivots inward about the pivot shaft 12 and comes into contact with the outer peripheral portion of the IC chip 35.

The hook members 14 are arranged in four directions with the movable shaft 6 as a center. The hook members 14 are symmetrical to each other with respect to the axis of the component suction device 2. They are almost the same. Therefore, the IC chip 35 is forcibly moved in the plane direction by the first arm 16 of the hook member 14 while the first arm 16 is rotated inward as described above, while the IC chip 35 is being suction-held by the suction pad 22. It will be moved and its center will be almost exactly aligned with the axis of the device 4. Since the second arms 18 of all the hook members 14 are engaged with the engagement grooves 20 of the movable shaft 6 under the same conditions, all the hooks are moved by moving the movable shaft 6 in the vertical direction. The members 14 all rotate around the respective rotation shafts 12 at substantially the same rotation angle.

Next, the operation of sucking and conveying the IC chip 35 as a component using the component suction device 2 according to the present embodiment will be described mainly with reference to FIGS.

First, as shown in FIG. 7, the suction device 2 is positioned above the buffer 50. Suction device 2 of the present embodiment
Is mounted on the movable head 57 of the second XY moving device 48 shown in FIGS. 3 and 4, so that the second XY moving device 48 is required to position the suction device 2 on the heat plate 65. In this case, the position may be controlled in the X and Y axis directions. Note that the buffer 50 has moved to the second area 56 side along the rail 68. The buffer 50 has an IC
A concave portion 50a for accommodating the chip 35 is formed, and the center position of the concave portion 50a and the axial center position of the suction device 2 are
Accurately aligned. However, the center position of the IC chip 35 housed in the concave portion 50a and the axial center position of the suction device 2 are not always accurately aligned. This is because the IC chip 35 is not always set at the center of the recess 50a.

Next, as shown in FIG. 8, the entire suction device 2 is lowered along the Z-axis direction, and the lower end of the suction pad 22 is brought into contact with the upper surface of the IC chip 35. The downward movement of the suction device 2 is performed by the Z-axis driving means 70 of the second XY movement device 48 shown in FIGS. At a position where the lower end of the suction pad 22 is brought into contact with the upper surface of the IC chip 35, the downward movement of the suction device 2 is stopped, and then, or simultaneously or before, a vacuum pressure is introduced into the vacuum inlet 26.
As a result, the pressure is applied to the suction pad 2 through the shaft hole 7.
2 into the suction holes 28, and the IC is
The chip 35 is vacuum-adsorbed.

At the same time, the vacuum pressure is also introduced into the vacuum cylinder chamber 29, and the IC chip 35 is adsorbed on the suction pad 22, and the vacuum pressure is moved by the pressure difference between the pressure in the vacuum cylinder chamber 29 and the atmospheric pressure. The shaft 6 is lifted upward along the Z axis against the spring force of the return spring 27. The upward movement of the movable shaft 6 in the Z-axis direction is restricted by the outer peripheral portion of the flange 8 abutting against a stopper surface 9 formed at the lower end portion of the head main body 4.

As a result of the movable shaft 6 moving upward along the Z-axis direction, the second arm 18 of the hook member 14 engaged with the engagement groove 20 of the movable shaft 6 is forcibly rotated upward. At the same time, the first arm 16 is
It rotates inward about the center 2 and comes into contact with the outer peripheral portion of the IC chip 35. The hook members 14 are arranged in four directions with the movable shaft 6 as a center. The hook members 14 are located at line-symmetric positions with respect to the axis of the component suction device 2, and the shape and size of the hook members 14 are substantially the same. is there. Therefore, the IC chip 35 is forcibly moved in the plane direction by the first arm 16 of the hook member 14 while the first arm 16 is rotated inward as described above, while the IC chip 35 is being suction-held by the suction pad 22. It will be moved and its center will be almost exactly aligned with the axis of the device 4.

Thereafter, FIG. 9 shows a state in which the suction device 2 is moved upward in the buffer 50. In the state shown in FIG. 9, as described above, the first arm 16 of the hook member 14
With the rotation, the suction pad 22 sucks and holds the IC chip 35 in a state where the center position of the IC chip 35 and the axis of the device 2 are accurately aligned. In this state, vacuum pressure is still being introduced into the vacuum inlet 26.

Next, as shown in FIG.
While holding 5, the entire suction device 2 is positioned on the socket 36 on the test head 34 (see FIG. 56). The movement of the suction device 2 is performed by controlling the movement of the second XY moving device 48 shown in FIGS. 3 and 4 in the X and Y directions.

As described above, the center of the IC chip 35 and the axis of the suction device 2 are accurately aligned by the action of the hook member 14. The axis of the suction device 2 and the center of the socket 36 are aligned in advance. Therefore, as shown in FIG. 11, the entire suction device 2 is simply moved downward along the Z-axis direction.
With the male terminal 35a of the C chip 35 and the female terminal of the socket 36 correctly aligned, the IC chip 35
Can be attached to the socket 36. Therefore,
Contact between the terminals 35a and 36a is stabilized, and the terminal 36a
Of the IC chip and damage to the terminal 35a of the IC chip is reduced.

In testing the IC chip 35, the introduction of vacuum pressure from the vacuum inlet 26 is stopped and the suction pad 2
2, the IC chip 35 is pressed by the pad holding portion 15 and / or the tip of the support piece 10, and the test is performed in a state where the connection between the terminals 35a and 36a is secured. During the test, the IC chip 35 may be heated from the pad holding portion 15 and / or the support piece 10 so that the IC chip 35 is not cooled.

When the test of the IC chip 35 is completed,
A vacuum pressure is introduced into the vacuum inlet 26, the IC chip 35 is sucked by the suction pad 22, and the entire suction device 2 is pulled upward from the socket 36 along the Z-axis direction. The state is the same as FIG. Tested IC chip 3
5 is moved to above buffer 51 shown in FIG.
It is lowered into the recess of the buffer 51. In this state, only the buffer 50 shown in FIG.
This is the same as the state shown in FIG. When no vacuum pressure is introduced into the vacuum inlet 26, the movable shaft 6 is moved downward with respect to the head main body 4 by the spring force of the return spring 27 and the weight of the movable shaft 6, and the flange 8 is moved. It stops at a position where it engages with the step 13 of the support piece 10.

In the component suction device 2, the handler 32 having the same, and the component testing device 30 having the same, the component such as the IC chip 35 to be tested is suctioned to the suction pad 22 of the component suction device 2 according to the present embodiment. At this time, a vacuum pressure is introduced into the suction pad 22. At this time, a part of the vacuum pressure acts to move the first arm 16 of the hook member 14 in a direction in which the first arm 16 contacts the outer peripheral portion of the IC chip 35. As a result, when the IC chip 35 is suctioned by the suction pad 22, the relative position between the suction pad 22 and the IC chip 35 is adjusted, and the center of the IC chip 35 and the center of the suction device 2 are accurately positioned. Then, the IC chip 35 is sucked by the suction pad 22.

Therefore, the handler 3 according to the present embodiment
2 and the test apparatus 30 having the same, the IC chip 3
5 is sucked by the component suction device 2 at the position of the buffer 50, the component suction device 2 is moved by the second XY moving device 48, and when the IC chip 35 is set at the position of the socket 36, At the position, the IC chip 35 and the component suction device 2 are automatically aligned.
Therefore, it is not necessary to align the IC chip 35 with the socket 36 at the position of the socket 36.

Therefore, at the position of the socket 36, unlike the prior art, an operation such as temporarily releasing the suction of the component by the suction pad 22 before setting the IC chip 35 in the socket becomes unnecessary. Therefore, it is possible to reduce the index time of component handling by the handler 32.

The component suction device 2 according to the present embodiment
In the handler 32 having the same and the component testing apparatus 30 having the same, the hook member 14 is driven by using a vacuum pressure, which is always required for suctioning the IC chip 35, as a drive source, so that the apparatus configuration is relatively small. , Which has few failures and relatively low manufacturing costs. In addition, since no other power source is required, a compact device configuration can be achieved, and space can be saved.

It should be noted that the present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention.

For example, the place where the suction device 2 shown in FIG. 1 is mounted is not limited to the movable head 57 of the second XY moving device 48 shown in FIGS.
6 may be attached to the movable head 53. Further, the component suction device according to the present invention can be used not only in the component testing device shown in FIGS. 3 and 4 but also in other component testing devices or component handling devices other than the testing device.

[0073]

As described above, according to the component suction apparatus, the component handling apparatus having the same, and the component test apparatus having the same according to the present invention, when the component is sucked by the suction pad, the suction pad is used. By adjusting the relative position between the component and the component, the center of the component and the center of the suction head can be accurately positioned.

Therefore, in the component handling apparatus according to the present invention, the index time for component handling can be reduced.

Further, in the component test apparatus according to the present invention, the index time of the component test can be reduced.

Further, in the component suction device, the component handling device having the same, and the component test device having the same according to the present invention, the positioning member is driven by using a negative pressure, which is always required for component suction, as a drive source. Therefore, the device configuration can be made relatively simple, there are few failures, and the manufacturing cost is relatively low. In addition, since no other power source is required, a compact device configuration can be achieved, and space can be saved.

[Brief description of the drawings]

FIG. 1 is a sectional view of a main part of a component suction device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a main part along line II-II shown in FIG.

FIG. 3 is a schematic plan view of a component testing device including a component handling device.

FIG. 4 is a partial cross-sectional side view of the component test apparatus shown in FIG.

FIG. 5 is a sectional view of a main part of the component test apparatus shown in FIGS. 3 and 4.

FIG. 6 is a side view of a main part of the test head.

FIG. 7 is a process chart showing the operation of the component suction device shown in FIG.

FIG. 8 is a process chart showing the operation of the component suction device shown in FIG.

FIG. 9 is a process chart showing the operation of the component suction device shown in FIG.

FIG. 10 is a process chart showing the operation of the component suction device shown in FIG.

FIG. 11 is a process chart showing the operation of the component suction device shown in FIG.

[Explanation of symbols]

 2 parts suction device 4 head body 6 movable shaft 10 support piece 14 hook member (positioning member) 22 suction pad 30 component testing device 32 handler (component handling device) 35 IC chip 34 test Head 36 Socket 52 First XY moving device 48 Second XY moving device (moving means)

Claims (8)

[Claims] A suction pad to which a component is sucked by introducing a negative pressure; and a direction in which the suction pad is arranged around the suction pad and which comes into contact with an outer peripheral portion of the component by introducing a negative pressure to the suction pad. And a positioning member for adjusting the relative position between the suction pad and the component. 2. The apparatus further comprises: a movable shaft on which the suction pad is mounted; and a suction head body for holding the movable shaft movably in a predetermined range in an axial direction, wherein a negative pressure introduced into the suction pad is provided. The movable shaft is relatively moved in the axial direction with respect to the suction head body by using a part as a drive source, and the positioning member is driven in conjunction with the axial movement of the movable shaft. Item 4. The component suction device according to Item 1. 3. The component suction device according to claim 2, wherein the positioning member is a hook member that rotates and moves in accordance with the axial relative movement of the movable shaft. 4. In a state in which a negative pressure is not introduced to the suction pad, the weight of the movable shaft acts on the movable shaft, and the movable shaft is moved in a direction opposite to a case where a negative pressure is introduced to the suction pad. 4. The component suction device according to claim 2, wherein the movable shaft is configured to move in the axial direction relative to the suction head body. 5. A return spring is mounted between the movable shaft and the suction head main body, and when no negative pressure is applied to the suction pad, the suction force is applied by the spring force of the return spring. The component according to any one of claims 2 to 4, wherein the movable shaft is configured to move relative to the suction head main body in the axial direction in a direction opposite to a case where a negative pressure is introduced into the pad. Suction device. 6. The component suction device according to claim 1, wherein the positioning members are arranged on four sides of the suction pad. 7. A component suction device, and a moving means for moving the component suction device in at least one direction, wherein the component suction device includes a suction pad to which a component is sucked by introducing a negative pressure; A positioning member that is arranged around the suction pad and moves in a direction that comes into contact with the outer peripheral portion of the component by introducing a negative pressure to the suction pad, and adjusts a relative position between the suction pad and the component, A component handling device having: 8. A component suction device, comprising: a component suction device; moving means for moving the component suction device in at least one direction; and a test head for testing components conveyed by the component suction device. However, a suction pad to which a component is sucked when a negative pressure is introduced is disposed around the suction pad, and by introducing a negative pressure to the suction pad, the suction pad moves in a direction in contact with an outer peripheral portion of the component. And a positioning member for adjusting a relative position between the suction pad and the component.