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TW201109147A - Substrate breaking apparatus - Google Patents

Substrate breaking apparatus Download PDF

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Publication number
TW201109147A
TW201109147A TW099102468A TW99102468A TW201109147A TW 201109147 A TW201109147 A TW 201109147A TW 099102468 A TW099102468 A TW 099102468A TW 99102468 A TW99102468 A TW 99102468A TW 201109147 A TW201109147 A TW 201109147A
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TW
Taiwan
Prior art keywords
substrate
breaking
bar
brittle material
breaking bar
Prior art date
Application number
TW099102468A
Other languages
Chinese (zh)
Other versions
TWI432304B (en
Inventor
Masanobu Soyama
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
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Publication of TW201109147A publication Critical patent/TW201109147A/en
Application granted granted Critical
Publication of TWI432304B publication Critical patent/TWI432304B/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
    • B28B11/14—Apparatus or processes for treating or working the shaped or preshaped articles for dividing shaped articles by cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/06—Cutting or splitting glass tubes, rods, or hollow products
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)

Abstract

Provided is a substrate breaking apparatus which can accurately perform breaking position alignment even in the case where a brittle material substrate to be broken is thin and is to be broken with a small pitch. The substrate breaking apparatus is provided with: a substrate supporting plate (2) having an opening section (7) formed thereon in a rectangular shape that corresponds to the shape of a brittle material substrate (1); an elastic film (4) which is formed on the upper surface of the substrate supporting plate (2) and covers the opening section (7); upper breaking bars (6a, 6b) which are arranged to move in the vertical direction above the elastic film (4) and break the substrate along a scribe line (11); and a lower breaking bar (5) which is arranged to move in the vertical direction below the elastic film (4) and breaks the substrate along the scribe line (11). The lower breaking bar (5) is brought into contact with the side opposite to the side having the scribe line (11) formed thereon with pressure along the scribe line (11), and in the state where the brittle material substrate (1) is sandwiched between the lower breaking bar (5) and the first upper breaking bar (6a), the substrate is broken by means of the upper breaking bar (6b).

Description

201109147 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種可不依賴於板厚而高質量地分斷如形 成有劃線之玻璃板般之脆性材料基板的基板分斷裝置。 【先前技術】 當分斷由陶瓷等之脆性材料所構成之LTCC(LowBACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate breaking device which can cut a brittle material substrate such as a glass plate which is formed with a scribe line without depending on a sheet thickness. [Prior Art] When the LTCC (Low) composed of a brittle material such as ceramic is broken

Temperature Co-fired Ceramics，低溫共燒陶瓷）基板而切 取複數個電子零件時，會於LTCC基板之表面形成劃線， 並且附加特定之荷重。藉此，沿所形成之劃線分斷 基板，而切取複數個電子零件。 田LTCC基板之厚度較薄之情形時，於通常之基板分斷 裝置中，有可能會附加過大之荷重，從而不僅產生垂直裂 痕甚至產生始料未及之水平裂痕。由於產生水平裂痕， 故而已刀斷之電子零件之截面無法成均質，於切取要求分 斷精度之電子零件時將成為問題。 進行分斷。例如， 置，其係於利用一 匕已^出各種辦法來使得即使為薄板亦可高精度地 於專利文獻1中揭示有一種基板分斷裝Temperature Co-fired Ceramics, when a plurality of electronic components are cut, a scribe line is formed on the surface of the LTCC substrate, and a specific load is added. Thereby, the substrate is separated along the formed scribe line, and a plurality of electronic parts are cut out. When the thickness of the LTCC substrate is thin, in the conventional substrate breaking device, an excessive load may be added, thereby not only generating vertical cracks or even horizontal cracks which are not expected. Since the horizontal crack is generated, the cross section of the electronic component that has been cut off cannot be homogenized, and it becomes a problem when cutting out the electronic component requiring the breaking accuracy. Make a break. For example, it is possible to use a variety of methods to make it possible to accurately disclose a substrate breaking device even in the case of a thin plate.

置之精度高，而且即使為如 146054.doc 201109147 黏合基板般薄之基板，亦可高精度地進行分斷。 [先行技術文獻] [專利文獻] [專利文獻1]日本專利特開2006-289625號公報 【發明内容】 [發明所欲解決之問題] 然而，於如專利文獻1所揭示之基板分斷裝置中，由於 以兩點支持成為分斷對象之基板，利用進行支持之位於兩 點間之分斷棒來分斷基板，故而會產生不少由薄板即基板 之撓曲所引起之分斷位置之偏移。當用於小型電子零件之 切取時，對分斷位置而言，需要可應對極小間距之定位精 度。 τ田八八進行分斷 時：在連續分斷時難以檢測出用以特別規定分斷位置之標 記等。因此’ 4 了高精度地特別規定分斷位置，每當執行 成為分斷對象之基板之定位操作時，均必需至少使位於上 方之分斷棒移動以確保標記等之視場，從而 得繁瑣之問題。 本發明係、#於上述情況開發而成者，目的在於提供 基板分斷裝置，其即使於分斷 ’、種 ^ η , τ豕之脆性材料基板為薄 板’且則、間距進行分斷之情形時 斷位置之定位。 门4度地進行分 [解決問題之技術手段] 達成上述目的，第1發明之基板分斷裝置係沿_ 146054.doc 201109147 分斷表面形成有上述劃線之脆性材钭基板者，纟特徵在 於：其包括：基板支持板，其形成有與上述脆性材料基板 之形狀對應之方形之開口部；彈性薄膜，其覆蓋上述開口 部而搭載於該基板支持板之上表面，以固定上述脆性材料 基板；^上分斷棒及第2上分斷棒，其等係以可於該彈性 薄膜之上方朝上下方向移動之方式而配設，沿上述劃線進 行分斷；以及下分斷棒，其係以可於上述彈性薄膜之下方 朝上下方向移動之方式而配設，沿上述劃線進行分斷；且 使上述下分斷棒在與形成有上述劃線之側相反之側沿上述 劃線而屋接，於利用上述下分斷棒與上述第ι上分斷棒夹 ::性材料基板之狀態下，藉由上述第2上分斷棒進 :1發明中’包括：基板支持板，其形成有與脆性材 ^板之形狀對應之方形之開口部；彈性薄膜，其 部：搭載於該基板支持板之上表面，以固定脆性材 科基板；幻上分斷棒及第2上分斷棒， :薄膜之上方朝上下方向移動之方式而配設，沿割線^ 刀斷，以及下分斷棒，其係以可於彈性薄膜之下方朝上^ 方向移動之方式而配設，沿劃線進行分斷。使 2成有劃線之側相反之側沿劃線而麼接，於利用下分斷 /第1上分斷棒夾持脆性材料基板之狀態下，藉由第2上 分斷棒進行分斷，藉此可確實地 :精度地進行分斷位置之定位。又二 位置’而使得即使於以小間距進行分斷之情形時亦不會 146054.doc 201109147 產生始料未及之裂痕，並且於已分斷之截面產生凹凸之可 能性低。 又，第2發明之基板分斷裝置如第丨發明，其中上述彈性 薄膜係藉由配設於上述開口部之四邊周圍之薄膜壓接機構 而固著於上述基板支持板上》 於第2發明中’彈性薄膜係藉由配設於開口部之四邊周 圍之薄膜壓接機構而固著於基板支持板上，藉此可縮短彈 性薄膜與方形之脆性材料基板之間隔，將由彈性薄膜之伸 長所引起之位置偏移控制在最小限度。 又，第3發明之基板分斷襞置如第丨或第2發明，其中於 上述第1上分斷棒及上述第2上分斷棒之上方配設有攝像裝 置；藉由上述攝像裝置拍攝賦予至上述脆性材料基板之標 圮，以進行上述脆性材料基板之設置位置之調整；且包括 斜向移動機構，其可使上述第丨上分斷棒及上述第2上分斷 棒相對於上述基板支持板朝以特定角度傾斜之方向移動。 <於第3發明中’於第！上分斷棒及第2上分斷棒之上方配 又有攝像裝置。藉由攝像裝置拍攝賦予至脆性材料基板之 標記，以進行脆性材料基板之設置位置之㈣4括斜向 移動機構’其可使第1上分斷棒及第2上分斷棒相對於基板 支持板朝以特定角度傾斜之方向移動，藉此，可於分斷開 始制用攝像裝置拍攝賦予至脆性材料基板之標記，從而 可问精度地進行分斷位置之定位。 ，第4發明之基板分斷裝置如第】或第2發明，其中於 述第！上分斷棒及上述第2上分斷棒之上方配設有攝像裝 146054.doc 201109147 置；藉由上述攝像裝置拍攝賦予至上述脆性材料基板之標 記，以進行上述脆性材料基板之設置位置之調整；且包= 水平移動機構，其可使上述第丨上分斷棒及上述第2上分斷 棒相對於上述基板支持板朝大致水平方向移動。 於第4發明中，於第丨上分斷棒及第2上分斷棒之上方配 没有攝像裝置。藉由攝像裝置拍攝賦予至脆性材料基板之 標記，以進行脆性材料基板之設置位置之調整。包括水平 移動機構，其可使第丨上分斷棒及第2上分斷棒相對於基板 支持板朝大致水平方向移動，藉此，可於分斷開始前利用 攝像裝置拍攝賦予至脆性材料基板之標記，從而可高精度 地進行分斷位置之定位。 [發明之效果] 如上所述’使下分斷棒與形成有劃線之側相反之側沿劃 線而壓接’於利用下分斷棒與第1上分斷棒夾持脆性材料 基板之狀態下’藉由第2上分斷棒進行分斷，藉此可確實 地沿劃線進行分斷’從而可高精度地進行分斷位置之定 位。又’藉由自上下支持分斷位置，即使於以小間距進行 分斷之情形時，亦不會產生始料未及之裂痕，並且於已分 斷之截面產生凹凸之可能性低。 【實施方式】 以下’根據表示本發明之實施形態之圖式詳細地說明本 發明。圖1係表示本發明之實施形態之基板分斷裝置之構 成的於與包含脆性材料之脆性材料基板之移動方向大致正 交之面的截面圖。 146054.doc 201109147 本發明之實施形態之基板分斷裝置如圖1所示，使用切 割框3暴露黏著性強之彈性薄膜4，使其自切割框3内之下 表面固定於包含開口部7之基板支持板2之上表面⑼如， 藉由基板支持板2之真空吸附機構）。彈性薄膜4之上表面 具有強黏著性，藉由該黏著性可保持成為切割或分斷之對 象之脆性材料基板1。 基板刀斷褒置包括：兩根上分斷棒6a、6b，其等可於在 基板支持板2之開口部7之上表面安裝有成為分斷對象之脆 性材料基板1之狀態下，於脆性材料基板丨之上側上下移 動；以及一根下分斷棒5，其可於彈性薄臈4之下側上下移 動。在設置於彈性薄膜4上之脆性材料基板！之上表面形成 有複數條劃線11、π、... β 當利用基板分斷裝置分斷脆性材料基板〗時，使上分斷 棒6a、6b跨越在脆性材料基板i之上表面形成之劃線二而 下降，使下分斷棒5上升以與劃線u之位置吻合，藉此沿 劃線11分斷脆性材料基板1。 圖2係表示安裝有LTCC基板丨作為脆性材料基板丨之狀態 的平面圖。將複數個電子零件一體成形之LTcc基板〗為= 形，因此於基板支持板2之中央部設有方形之開口部7。以 覆蓋方形之開口部7之方式载置彈性薄膜4，利用作為設於 基板支持板2之外側之薄膜暴露機構而發揮作用之切割 暴露彈性薄膜4，固定基板支持板2(例如，藉由上表面之 真空吸附機構）。於LTCC基板1JL賦予有與下分斷棒$之位 置對準用標記（對準標記）8。例如，藉由利用攝像裝置等自 146054.doc 201109147 上方拍攝LTCC基板1之表面，可根據已拍攝之位置對準用 標記8對分斷位置進行定位。 圖3係表示於安裝有1^(：(：基板〗之狀態下進行有切割處 . 理之狀態的平面圖。如圖3所示’藉由切割裝置，以可對 所安裝之LTCC基板1切取電子零件之方式縱橫地形成複數 條劃線 1 1、11、...。 於切割處理後，朝基板分斷裝置移動，進行位置對準。 於進行位置對準之後，在經㈣之面黏貼保護 之表面之保護薄片，以使用有三根分斷棒之三點彎曲方式 進打加壓而分斷。圖4係示意性地說明本發明之實施形態 之基板分斷裝置之分斷處理的截面圖。 如圖4⑷所示’本實施形態之基板分斷裝置係以跨越在 安裝於基板支持板2上之LTCC基板i之上表面形成之劃線 11之方式配置兩根上分斷棒6a、6b，使其中一根上分斷棒 6a下降，且使下分斷棒5自下方上升至劃線n之位置。藉 此，利用上下分斷棒挾持LTCC基板丨，即使kltcc基板i 上產生有f曲、撓曲等之情形時，亦可藉由分斷棒之壓力 而調整成大致水平。 其後’可藉由使另一根上分斷棒此下降而沿劃線u分斷 LTCC基板1。分斷後使上分斷棒&、讣上升且使下分斷 棒5下降之後’使基板支持板2間距移動直至下―劃線11處 於下刀斷棒5之正上方’重複上述動作，藉此分斷ltcc基 板1。 上分斷棒6a、6b及下分斷棒5之移動順序並不限定於上 I46054.doc 201109147 述順序。例如’先僅使上分斷棒6a、6b下降至夾持成為分 斷對象之劃線11般之位置，並按壓至成為分斷對象之 LTCC基板1，藉此緩解彎曲、撓曲等，於此狀態下使下分 斷棒5自下方上升。藉此，可沿劃線u分斷LTCC基板i。 藉由在已分斷之狀態下自彈性薄膜4之背側進行uv (Ultraviolet,紫外線）照射，使黏著力消失，由此可使各 電子零件作為分離之小片自彈性薄膜4剝離。 如此’使下分斷棒5在與形成有劃線丨丨、11、…之側相 反之側沿一條劃線11而壓接，於利用下分斷棒5與上分斷 棒6a失持LTCC基板1之狀態下，使上分斷棒讣下降而進行 分斷，因此可高精度地特別規定進行分斷之劃線丨丨，藉由 自上下支持分斷位置，即使於以小間距進行分斷之情形 時，亦難以產生始料未及之裂痕，並且於已分斷之截面產 生凹凸之可能性變低，從而亦可用於小電子零件之切取。 再者，於上分斷棒6a、讣之上方配設位置對準用之攝像 裝置。藉由攝像裝置，拍攝賦予至1^(：(：基板丨之位置對準 用標記8，以調整LTCC基板丨之設置位置。圖5係表示使上 分斷棒6a、讣上下移動之情形時之基板分斷裝置與搬像裝 置之位置關係的示意圖。 圖5(a)係表示使上分斷棒以、讣上升後之狀態的示意 圖圖5(b)係於分斷時使上分斷棒6a、6b下降後之狀態的 示〜、圖於所有情形時上分斷棒6a、6b均成為障礙，無法 使用攝像裝置20拍攝賦予至LTCC基板1上之位置對準用標 記8 ’從而無法進行分斷位置之定位。 146054.doc 201109147 因此，於本實施形態中，包括斜向移動機構，其可使上 分斷棒6a、6b相對於基板支持板2朝特定角度傾斜之方向 移動，藉此可利用攝像裝置2〇拍攝位置對準用標記8，從 而可確實地進行分斷位置之定位。 圖6係表示使本發明之實施形態之基板分斷裝置之上分 斷棒6a、6b上下移動時的基板分斷裝置與攝像裝置之位^ 關係的示意圖。圖6⑷係表示使上分斷棒“、补上升後之 狀態的示意圖，圖6(b)係表示於分斷時使上分斷棒❿ 下降後之狀態的示意圖。 如圖6⑻所示，於使上分斷棒心、6b下降之狀態，上分 斷棒6a、6b成為障礙，無法使用攝像裝置2〇拍攝賦予至 LTCC基板i上之位置對準用標記8，從而無法進行位置對 準。然而，如圖6(a)所示，於使上分斷棒仏、讣朝斜上方 上升之狀態’貝上分斷棒以、6b不會成為拍攝之障礙，從 可使用配叹於上方之攝像裝置2〇拍冑賦予至基板1 上之位置對準用標記8。 再者，使利用攝像裝置20進行拍攝成為可能之方法並不 疋於上述使上分斷棒6a、6b朝斜上方上升之方法，亦可 4如L括可使上分斷棒6a、6b相對於基板支持板2朝大致 夂平方向移動之水平移動機構，當進行位置對準時，以可 拍攝攝像裝置20正下方之方式使上分斷棒6a、6b面向圖6 朝左右方向移動。 如上所述，根據本實施形態，使下分斷棒5在與形成有 線11、11、. . .之側相反之側沿劃線丨〗而壓接，於利用下 H6054.doc 201109147 刀斷棒5與_h分斷棒以夾持脆性材料即基板1之狀態 下、藉由上分斷棒6b進行分斷，藉此可確實地沿劃線Η進 行分斷，從而可高精度地進行分斷位置之定位。又，藉由 自上下支持分斷位置，即使於以小間距進行分斷之情形 時’亦不會產生始料未及之裂痕，並且於已分斷之截面產 生凹凸之可能性低。 再者，成為分斷對象者並不限定MLTCC基板，只要為 必需以小間距進行分斷之包含脆性材料之基板，則並無特 别阡疋此外，當然，只要在本發明之主旨之範圍内，則 可進行多種變形、替換等。 【圖式簡單說明】 圖1係表示本發明之實施形態之基板分斷裝置之構成的 於/、脆丨生材料基板之移動方向大致正交之面的截面圖； 圖2係表示安裝有LTCC基板之狀態的平面圖； 圖3係表示於安裝有LTCC基板之狀態下進行有切割處理 之狀態的平面圖； 圖4(a)、圖4(b)係示意性地說明本發明之實施形態之基 板分斷裝置之分斷處理的截面圖； 圖5(a)、圖5(b)係表示使上分斷棒上下移動之情形時的 基板分斷裝置與攝像裝置之位置關係的示意圖；及 圖6(a)、圖6(b)係表示使本發明之實施形態之基板分斷 裝置之上分斷棒上下移動時的基板分斷裝置與攝像裝置之 位置關係的示意圖。 【主要元件符號說明】 146054.doc 12 201109147 1 脆性材料基板（LTCC基板） 2 基板支持板 3 切割框（薄膜壓接機構） 4 彈性薄膜 5 下分斷棒 6、6a、6b 上分斷棒 7 開口部 8 位置對準用標記（對準標記） 11 劃線 20 攝像裝置 146054.doc -13 -The precision is high, and even if it is a substrate as thin as the 146054.doc 201109147 bonded substrate, it can be cut with high precision. [PRIOR ART DOCUMENT] [Patent Document 1] Japanese Laid-Open Patent Publication No. 2006-289625 [Draft of the Invention] [Problems to be Solved by the Invention] However, in the substrate breaking device disclosed in Patent Document 1, Since the substrate which becomes the object to be separated is supported by two points, the substrate is separated by the branching bar between the two points which is supported, and thus the breaking position caused by the deflection of the thin plate, that is, the substrate, is generated. shift. When used for cutting small electronic parts, it is necessary to cope with the positioning accuracy of extremely small pitches for the breaking position. When the τ田八八 is divided, it is difficult to detect the mark for specifying the breaking position at the time of continuous breaking. Therefore, the position of the breaking position is specified with high precision. Whenever the positioning operation of the substrate to be the object of the breaking is performed, it is necessary to move at least the breaking bar located above to ensure the field of view of the mark or the like, which is cumbersome. problem. The present invention has been developed in the above-mentioned circumstances, and an object of the present invention is to provide a substrate breaking device which is capable of breaking a gap even if the substrate of the brittle material of the τ豕 is a thin plate. Positioning of the break position. The door is divided into four degrees. [Technical means for solving the problem] The above object is achieved. The substrate breaking device according to the first aspect of the invention is characterized in that the slab-shaped brittle material 钭 substrate is formed along the surface of _ 146054.doc 201109147. The method includes a substrate supporting plate formed with a rectangular opening corresponding to the shape of the brittle material substrate, and an elastic film covering the opening and mounted on an upper surface of the substrate supporting plate to fix the brittle material substrate And a second upper breaking bar, which is disposed so as to be movable upward and upward in the upper direction of the elastic film, and is divided along the above-mentioned scribe line; and a lower breaking bar, And being arranged to move in a vertical direction below the elastic film, and to be separated along the scribe line; and to cause the lower breaking bar to follow the scribe line on a side opposite to a side on which the scribe line is formed And the housing is connected by using the above-mentioned lower breaking rod and the above-mentioned first ι upper breaking rod: in the state of the material substrate, by the above-mentioned second upper breaking rod: 1 invention includes 'substrate support plate, Its formation a rectangular opening corresponding to the shape of the brittle material; an elastic film, the part of which is mounted on the upper surface of the substrate supporting plate to fix the brittle material substrate; the magic upper breaking bar and the second upper breaking bar, : The upper side of the film is arranged to move in the vertical direction, and the cutting line is cut along the secant line, and the lower breaking rod is arranged so as to be movable in the upward direction of the elastic film, and is carried out along the scribe line. Break. The side opposite to the side with the scribe line is connected by a scribe line, and the second upper break bar is used for cutting in a state where the brittle material substrate is sandwiched by the lower break/first upper break bar. In this way, it is possible to reliably position the position of the breaking position with precision. The second position is such that even in the case of breaking at a small pitch, 146054.doc 201109147 does not have an unexpected crack, and the possibility of unevenness in the cross section that has been broken is low. According to a second aspect of the invention, in the substrate cutting device of the second aspect of the invention, the elastic film is fixed to the substrate supporting plate by a film pressing mechanism disposed around four sides of the opening portion. The 'elastic film' is fixed to the substrate supporting plate by a film pressing mechanism disposed around the four sides of the opening, thereby shortening the distance between the elastic film and the square brittle material substrate, and the elongation of the elastic film The resulting positional offset is kept to a minimum. According to a third aspect of the present invention, in the second aspect of the present invention, in the second aspect of the invention, the image forming apparatus is disposed above the first upper breaking bar and the second upper breaking bar; and the image capturing device is photographed by the image capturing device Providing a mark to the brittle material substrate to adjust the installation position of the brittle material substrate; and including a tilting movement mechanism for allowing the second upper breaking bar and the second upper breaking bar to be opposite to The substrate support plate is moved in a direction inclined at a specific angle. <In the third invention, ' There is an imaging device above the upper split bar and the second upper split bar. The imaging device is configured to capture the mark applied to the substrate of the brittle material to perform the position of the brittle material substrate (4), and the oblique moving mechanism is configured to "make the first upper breaking bar and the second upper breaking bar relative to the substrate supporting plate". By moving in a direction inclined at a specific angle, it is possible to capture the mark applied to the brittle material substrate at the start of the production of the image forming apparatus, and it is possible to accurately position the breaking position. The substrate breaking device according to the fourth aspect of the invention is as described in the first or second invention, which is described above! An imaging device 146054.doc 201109147 is disposed above the upper breaking bar and the second upper breaking bar; and the marking applied to the brittle material substrate is captured by the imaging device to perform the setting position of the brittle material substrate. And a package=horizontal moving mechanism that moves the second upper breaking bar and the second upper breaking bar in a substantially horizontal direction with respect to the substrate supporting plate. According to the fourth aspect of the invention, the imaging device is disposed above the second upper breaking bar and the second upper breaking bar. The mark applied to the substrate of the brittle material is imaged by the image pickup device to adjust the position of the brittle material substrate. The horizontal moving mechanism is configured to move the second upper breaking bar and the second upper breaking bar in a substantially horizontal direction with respect to the substrate supporting plate, thereby being capable of capturing the substrate applied to the brittle material by using the imaging device before the breaking starts. Marked so that the positioning of the breaking position can be performed with high precision. [Effects of the Invention] As described above, 'the lower branching bar is pressed against the side opposite to the side on which the scribe line is formed by the scribe line', and the brittle material substrate is sandwiched by the lower breaking bar and the first upper breaking bar. In the state, the division is performed by the second upper breaking bar, whereby the cutting can be surely performed along the scribe line, so that the positioning of the breaking position can be performed with high precision. Further, by supporting the breaking position from the upper and lower sides, even when the breaking is performed at a small pitch, cracks which are not expected to occur are not generated, and there is a low possibility that unevenness is generated in the cross section which has been cut. [Embodiment] Hereinafter, the present invention will be described in detail based on the drawings showing embodiments of the present invention. Fig. 1 is a cross-sectional view showing a surface of a substrate cutting device according to an embodiment of the present invention which is substantially orthogonal to a moving direction of a brittle material substrate containing a brittle material. 146054.doc 201109147 The substrate cutting device according to the embodiment of the present invention exposes the elastic film 4 having strong adhesion by using the dicing frame 3, and is fixed to the lower surface of the dicing frame 3 from the opening portion 7 as shown in FIG. The upper surface (9) of the substrate supporting plate 2 is, for example, a vacuum suction mechanism by the substrate supporting plate 2. The upper surface of the elastic film 4 has a strong adhesive property, and the adhesive property can be maintained as the brittle material substrate 1 which is the object of cutting or breaking. The substrate blade breaking device includes two upper breaking bars 6a and 6b which can be used for brittle material in a state in which the brittle material substrate 1 to be separated is attached to the upper surface of the opening portion 7 of the substrate supporting plate 2. The upper side of the substrate 移动 is moved up and down; and a lower breaking rod 5 is movable up and down on the lower side of the elastic thin raft 4. The brittle material substrate provided on the elastic film 4! The upper surface is formed with a plurality of scribe lines 11, π, ... β. When the brittle material substrate is separated by the substrate breaking device, the upper breaking bars 6a, 6b are formed across the upper surface of the brittle material substrate i. The scribing line 2 is lowered, and the lower breaking bar 5 is raised to coincide with the position of the scribing line u, whereby the brittle material substrate 1 is separated along the scribing line 11. Fig. 2 is a plan view showing a state in which an LTCC substrate is mounted as a brittle material substrate. Since the LTcc substrate in which a plurality of electronic components are integrally formed is in the shape of a =, a square opening portion 7 is provided in the central portion of the substrate supporting plate 2. The elastic film 4 is placed so as to cover the square opening portion 7, and the cut-off elastic film 4 functions as a film exposure mechanism provided on the outer side of the substrate supporting plate 2, and the substrate supporting plate 2 is fixed (for example, by Surface vacuum adsorption mechanism). A mark (alignment mark) 8 for alignment with the lower break bar $ is given to the LTCC substrate 1JL. For example, by photographing the surface of the LTCC substrate 1 from above the 146054.doc 201109147 by means of an image pickup apparatus or the like, the position of the breaking position can be positioned in accordance with the positional alignment mark 8 that has been photographed. 3 is a plan view showing a state in which a cutting position is performed in a state where 1^(::substrate) is mounted. As shown in FIG. 3, a cutting device is used to cut the mounted LTCC substrate 1. In the form of electronic parts, a plurality of lines 1 1 , 11 , . . . are formed vertically and horizontally. After the cutting process, the substrate breaking device is moved to perform positional alignment. After the alignment is performed, the surface is pasted on the surface of (4). The protective sheet of the protective surface is divided by pressurization using a three-point bending method with three breaking bars. Fig. 4 is a schematic cross-sectional view showing the breaking process of the substrate breaking device according to the embodiment of the present invention. As shown in Fig. 4 (4), the substrate breaking device of the present embodiment has two upper breaking bars 6a, 6b disposed so as to span the scribe lines 11 formed on the upper surface of the LTCC substrate i mounted on the substrate supporting plate 2. One of the upper breaking bars 6a is lowered, and the lower breaking bar 5 is raised from the lower side to the position of the scribe line n. Thereby, the LTCC substrate 挟 is held by the upper and lower breaking bars, even if f is generated on the kltcc substrate i By breaking, etc., by breaking The pressure is adjusted to be substantially horizontal. Thereafter, the LTCC substrate 1 can be separated along the scribe line u by lowering the other upper breaking rod. After the breaking, the upper breaking rod & After the broken bar 5 is lowered, 'the substrate supporting plate 2 is moved until the lower line - the straight line 11 is directly above the lower blade breaking bar 5'. The above operation is repeated, thereby dividing the ltcc substrate 1. The upper dividing bars 6a, 6b and the lower portion The order of movement of the breaking bars 5 is not limited to the above-mentioned order of I46054.doc 201109147. For example, 'only the upper breaking bars 6a, 6b are lowered to the position of the scribe line 11 which is the object to be cut, and pressed to The LTCC substrate 1 to be separated is used to relieve bending, deflection, etc., and the lower breaking bar 5 is raised from below in this state. Thereby, the LTCC substrate i can be separated along the scribe line u. In the state of being separated, uv (ultraviolet) irradiation is performed from the back side of the elastic film 4, so that the adhesive force disappears, whereby the electronic parts can be peeled off from the elastic film 4 as separate pieces. 5 along a line opposite to the side on which the scribe lines 11, 11, ... are formed In the state in which the LTCC substrate 1 is lost by the lower breaking bar 5 and the upper breaking bar 6a, the upper breaking bar is lowered and divided, so that the breaking can be specified with high precision. By scribing 丨丨, by supporting the breaking position from the upper and lower sides, even in the case of breaking at a small pitch, it is difficult to generate cracks that are not expected, and the possibility of occurrence of irregularities in the cross section that has been broken becomes low. In addition, it is also possible to cut the small electronic components. Further, an imaging device for positioning is disposed above the upper breaking bar 6a and the cymbal. By means of the imaging device, the imaging is given to 1^(:(: substrate 丨The alignment mark 8 is used to adjust the set position of the LTCC substrate. Fig. 5 is a schematic view showing the positional relationship between the substrate cutting device and the image bearing device when the upper breaking bars 6a and 讣 are moved up and down. Fig. 5(a) is a schematic view showing a state in which the upper splitting bar is raised by 讣, and Fig. 5(b) is a view showing a state in which the upper splitting bars 6a and 6b are lowered at the time of breaking. In the case of the case, the upper breaking bars 6a and 6b are both obstructed, and the positioning alignment mark 8' applied to the LTCC substrate 1 cannot be imaged by the image pickup device 20, so that the positioning of the breaking position cannot be performed. 146054.doc 201109147 Therefore, in the present embodiment, an oblique movement mechanism is provided which can move the upper breaking bars 6a, 6b in a direction inclined with respect to the substrate supporting plate 2 at a specific angle, whereby the image pickup device 2 can be utilized. The position alignment mark 8 is photographed so that the positioning of the breaking position can be surely performed. Fig. 6 is a view showing the relationship between the substrate breaking device and the image pickup device when the breaking bars 6a and 6b are vertically moved by the substrate breaking device according to the embodiment of the present invention. Fig. 6 (4) is a schematic view showing a state in which the upper breaking bar is "upwardly raised", and Fig. 6 (b) is a view showing a state in which the upper breaking bar is lowered at the time of breaking. As shown in Fig. 6 (8), When the upper breaking core and the 6b are lowered, the upper breaking bars 6a and 6b become obstacles, and the alignment mark 8 applied to the LTCC substrate i cannot be imaged by the imaging device 2, and the alignment cannot be performed. As shown in Fig. 6(a), in the state where the upper branch is broken and the cymbal is raised upwards obliquely, the top of the bar is broken, and 6b does not become an obstacle to the shooting, and the camera can be used with the sigh. The device 2 is applied to the alignment mark 8 on the substrate 1. The method of making the image by the image pickup device 20 is not inconsistent with the above method of raising the upper breaking bars 6a, 6b upward. And a horizontal moving mechanism that can move the upper breaking bars 6a, 6b relative to the substrate supporting plate 2 in a substantially flat direction, and can be made in a manner directly below the image capturing device 20 when positioning is performed. The upper split bars 6a, 6b move toward the left and right in the direction of Fig. 6. As described above, according to the present embodiment, the lower breaking bar 5 is pressed against the side opposite to the side on which the wires 11, 11, and . are formed, and the bar is broken by the use of H6054.doc 201109147. 5 and _h the breaking bar is divided by the upper breaking bar 6b in a state where the brittle material, that is, the substrate 1, is sandwiched, whereby the breaking can be surely performed along the scribe line, so that the cutting can be performed with high precision Positioning of the broken position. Moreover, by supporting the breaking position from the upper and lower sides, even in the case of breaking at a small pitch, 'there is no crack in the unfinished material, and the unevenness is generated in the cross section that has been broken. Further, the object to be divided is not limited to the MLTCC substrate, and is not particularly limited as long as it is a substrate containing a brittle material that needs to be separated at a small pitch. Of course, as long as the gist of the present invention is In the range, various modifications, replacements, and the like can be performed. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a configuration of a substrate cutting device according to an embodiment of the present invention, and a moving direction of a brittle biomaterial substrate is substantially orthogonal. Sectional view of the face; Figure 2 shows the installation Fig. 3 is a plan view showing a state in which a dicing process is performed in a state in which an LTCC substrate is mounted; and Figs. 4(a) and 4(b) are views schematically showing an embodiment of the present invention. FIG. 5(a) and FIG. 5(b) are schematic diagrams showing the positional relationship between the substrate breaking device and the imaging device when the upper breaking bar is moved up and down; 6(a) and 6(b) are schematic diagrams showing the positional relationship between the substrate breaking device and the image pickup device when the breaking bar is moved up and down on the substrate cutting device according to the embodiment of the present invention. DESCRIPTION OF SYMBOLS 146054.doc 12 201109147 1 Brittle material substrate (LTCC substrate) 2 Substrate support plate 3 Cutting frame (film crimping mechanism) 4 Elastic film 5 Lower breaking bar 6, 6a, 6b Upper breaking bar 7 Opening portion 8 Positioning mark (alignment mark) 11 Line 20 Camera 146054.doc -13 -

Claims (1)

201109147 七、申請專利範圍： 1. 一種基板分斷裝置，其係沿劃線分斷表面形成有上述劃 線之脆性材料基板者，其特徵在於： 其包括： 基板支持板，其形成有與上述脆性材料基板之形狀對 應之方形之開口部； 彈性薄膜，其覆蓋上述開口部而搭載於該基板支持板 之上表面，以固定上述脆性材料基板； 第1上分斷棒及第2上分斷棒，其等係以可於該彈性薄 膜之上方朝上下方向移動之方式而配設，沿上述劃線進 行分斷；以及 下分斷棒，其係以可於上述彈性薄膜之下方朝上下方 向移動之方式而配設，沿上述劃線進行分斷；且 使上述下分斷棒在與形成有上述劃線之側相反之側沿 上述劃線而壓接，於利用上述下分斷棒與上述第1上分 斷棒夾持上述脆性材料基板之狀態下，藉由上述第2上 分斷棒進行分斷。 2. 如請求項1之基板分斷裝置，其中 上述彈性薄膜係藉由配設於上述開口部之四邊周圍之 薄膜壓接機構而固著於上述基板支持板上。 3·如凊求項1或2之基板分斷裝置，其中 於上述第1上分斷棒及上述第2上分斷棒之上方配設有 攝像裝置； 藉由上述攝像裝置拍攝賦予至上述脆性材料基板之標 146054.doc 201109147 、進行上述脆性材料基板之設置位置之調整丨且 包括斜向移動機構，其可使上述第丨上分斷棒及上述 第2上分斷棒相對於上述基板支持板朝以特定角度傾斜 之方向移動。 4·如凊求項1或2之基板分斷裝置，其中 於上述第1上分斷棒及上述第2上分斷棒之上方配設有 攝像裝置； 藉由上述攝像裝置拍攝賦予至上述脆性材料基板之標 s己，以進行上述脆性材料基板之設置位置之調整；且 包括水平移動機構，其可使上述第分斷棒及上述 第2上分斷棒相對於上述基板支持板朝大致水平方向移 動0 146054.doc201109147 VII. Patent application scope: 1. A substrate breaking device, which is characterized in that the above-mentioned scribe line brittle material substrate is formed along a scribe line, and is characterized in that: the substrate support plate is formed with the above a rectangular shaped opening corresponding to the shape of the brittle material substrate; the elastic film covering the opening and mounted on the upper surface of the substrate supporting plate to fix the brittle material substrate; the first upper breaking bar and the second upper breaking a rod, which is disposed so as to be movable in the vertical direction above the elastic film, and is separated along the scribe line; and a lower breaking rod which is vertically movable below the elastic film Arranging along the moving line, and dividing the lower dividing rod on the side opposite to the side on which the scribe line is formed, and pressing the scribe line on the side opposite to the side line on which the scribe line is formed, The first upper breaking bar is divided by the second upper breaking bar in a state in which the first upper breaking bar is sandwiched by the brittle material substrate. 2. The substrate breaking device according to claim 1, wherein the elastic film is fixed to the substrate supporting plate by a film press-fitting mechanism disposed around the four sides of the opening. 3. The substrate cutting device according to claim 1 or 2, wherein an imaging device is disposed above the first upper breaking bar and the second upper breaking bar; and the image is applied to the brittleness by the imaging device The substrate of the material 146054.doc 201109147, the adjustment position of the brittle material substrate is adjusted, and includes an oblique moving mechanism, which can support the above-mentioned second upper breaking bar and the second upper breaking bar with respect to the substrate The plate moves in a direction that is inclined at a specific angle. 4. The substrate cutting device according to claim 1 or 2, wherein an imaging device is disposed above the first upper breaking bar and the second upper breaking bar; and the image is applied to the brittleness by the imaging device a material substrate for adjusting the position of the brittle material substrate; and a horizontal moving mechanism for causing the first breaking bar and the second upper breaking bar to be substantially horizontal with respect to the substrate supporting plate Direction movement 0 146054.doc
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