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TW201108929A - Radiation type heat sink with built-in heat conduction pipe - Google Patents

Radiation type heat sink with built-in heat conduction pipe Download PDF

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Publication number
TW201108929A
TW201108929A TW099138975A TW99138975A TW201108929A TW 201108929 A TW201108929 A TW 201108929A TW 099138975 A TW099138975 A TW 099138975A TW 99138975 A TW99138975 A TW 99138975A TW 201108929 A TW201108929 A TW 201108929A
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TW
Taiwan
Prior art keywords
heat
heat pipe
pipe
built
core
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Application number
TW099138975A
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Chinese (zh)
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TWI484896B (en
Inventor
chong-xian Huang
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chong-xian Huang
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Application filed by chong-xian Huang filed Critical chong-xian Huang
Priority to TW099138975A priority Critical patent/TW201108929A/en
Priority to JP2010274464A priority patent/JP5745264B2/en
Priority to US12/975,379 priority patent/US20120118536A1/en
Priority to DE202010013223U priority patent/DE202010013223U1/en
Priority to KR2020110000839U priority patent/KR200465687Y1/en
Publication of TW201108929A publication Critical patent/TW201108929A/en
Application granted granted Critical
Publication of TWI484896B publication Critical patent/TWI484896B/zh

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

A radiation type heat sink with built-in heat conduction pipe includes a core tube socket assembly, a plurality of heat sinks and more than one heat conduction pipes. The heat sink is disposed on the outer peripheral wall of the core tube socket assembly. It's mainly to combine more than one heat conduction pipes with an inner hollow wall and/or of the hollow of the core tube socket. The heat conduction pipe is embedded into the default groove of the inner wall and/or bottom of the core tube socket assembly, and exposes the bottom of the heat conduction pipe to direct contact with the heat source to improve heat transfer coefficiency of the heat dissipator. The whole system is to fulfill the compact condition and there is no need to weld.

Description

201108929 六、發明說明: 【發明所屬之技術領域】 本發明係涉及一種輻射型散熱器的改良,特別是一種 具有内置導熱管的輻射型散熱器設計,為適用於中央處理 器(CPU)、發光二極體(LED)燈具或其它發熱單元,藉以 提供快速散熱功效。 【先前技術】 習知輻射型散熱器,係包含複數個散熱片及一管形座 • 體所組成,如本國發明第1269146號專利所揭示習知散熱器 ,複數個散熱片係呈輻射方向植立而設於管形座體的外壁 面,管形座體可實施為圓形、方形或其它任意形狀的管體 或實心體,但前述的習知輻射型散熱器,其熱源(如中央 處理器CPU、發光二極體LED燈具或其它發熱單元等)只 能通過管形座體與複數個散熱片進行散熱,故散熱效果緩 慢,無法滿足快速散熱的需求。 【發明内容】 • 本發明之主要目的,乃在於提供一種具有内置導熱管 的輻射型散熱器設計,係包括一核心管座、複數個散熱片 及一個以上的導熱管,複數個散熱片係結合於核心管座的 外周壁,其特別是在核心管座的中空内壁或/及底部埋入 結合一個以上的導熱管,使導熱管可嵌置結合於核心管座 内壁或/及底部預設的嵌槽,並露出導熱管底部可直接接 觸熱源,藉此提高散熱器的散熱功率。 本發明之次要目的,乃在於提供一種具有内置導熱管 201108929 的輻射型散熱器設計,所述核心管座係在中空内壁或/及 底部預設-個以上可供導熱管緊配結合的嵌槽,該嵌槽可 在一側或兩側設有包覆邊壁,於導熱管匹配嵌入後,令包 覆邊壁產生變开> 而將導熱管穩固夾持,使導熱管與核心管 座形成良好的緊配固定,完全不需焊接結合。 本發明之再一目的,乃在於提供一種具有内置導熱管 的輕射型政熱器设计,所述核心管座的一端為開口狀,另 一端為一封閉面,該封閉面除了開設一個以上的鎖孔外, 並開設一個或兩個呈相互對應的貫穿孔,藉此將導熱管貫 穿該貫穿孔,使導熱管底部形成外露嵌置的緊配結合。 本發明之另一目的,乃在於提供一種具有内置導熱管 的輻射型散熱器設計,所述核心管座係可於底部再套置結 合一底板,並與核心管座的封閉面、導熱管底部形成同一 切齊面。 本發明之又一目的,乃在於提供一種具有内置導熱管 的輕射型散熱器設計,所述核心管座係可視需要而任意實 施為圓形、方形或其它規則或不規則的幾近形狀,且核心 管座係依據導熱管配置結合的數量,而開設相對匹配形狀 與數量的嵌槽,以供一個以上的導熱管嵌置結合。 本發明之又一目的,乃在於提供一種具有内置導熱管 的輻射型散熱器設計,所述導熱管的形狀或配置結合的數 量,均可視需要而任意改變或增減,該導熱管形狀係包括 但不限於如U形、L形、I形、C形或其它各種造型,主 要係以能供匹配嵌合於核心管座内壁或/及底部,並露出 導熱管底部即為已足;又所述複數個散熱片的形狀或數量 201108929 ’同理可依不同需要而改變或增減,至於散熱片與核 座的結合方式,亦無特別限制必要,包括但不限於如採 一體成型或焊接結合或嵌插結合等方式,均屬可行實施。 【實施方式】 茲依附圖實施例將本發明結構特徵及其他作用、 詳細說明如下: ’ Μ如第-圖至第五圖所示,係指本發明使用於U形導熱 管的組合實施例,其係包括一核心管座工、複數個散^ • 一個以上的υ形導熱管3;其中的核心管座1係-中 空管座,其外周壁係結合設有複數個呈輻射方向植立的散 熱片f,且於管座的中空内壁並埋入結合一個以上的Μ 導熱管3,為在核心管座工的内壁預設一個以上可嵌置結 合導熱管3的嵌槽η,而於導熱管3嵌置結合後,使導熱 g底::31可呈露出’令導熱管3可直接接觸熱源(如中央 处里器CPU、發光二極體LED燈具或其它發熱單元等), 藉此提高散熱功率,獲得快速散熱的效果。 如第六圖所示,上述設於核心管座1内壁的嵌槽u, 其較佳實施方式係使嵌槽⑽著核心管座工的内壁而呈轴 向分佈,核心管座1的一端為開口狀(如第三圖),另-端 :邛則為封閉面12(如第四圖),該底部封閉面12除了開設 個X上的鎖孔121外,並開設兩個相互對應的貫穿孔13 ’且於封閉面12的外端面再開設-底部嵌槽14,並使貫穿 孔13係相通位於底部嵌槽μ,因此可將。形導熱管3貫穿 通過兩,貝穿孔13,並使導熱管底部31嵌入底部嵌槽, 使導熱&底部31與底部嵌槽u形成外露嵌置的緊配結合, 201108929 且U形導熱管底部31係與底部封閉面12的外端面形成貼平 切齊的狀態(如第五圖)。至於所述的鎖孔121,其主要係提 供熱源元件的鎖固結合(例如發光二極體㈣燈具或 發熱單元等)。 ' 上述圖不係揭示一種開設兩個相互對應的貫穿孔13的 實施形態,其係專供適用於U形導熱管3的貫穿結合;但 同理可知,若本發明係採用L形導熱管而搭配組成(如第 十Γ圖^第十七圖所不的另一實施例),則只需將L形導 熱管的單-垂直端貫穿單一個貫穿孔13,即可獲得相同的 嵌置結合效果,而將L形導熱管的單一水平端直接嵌置結 合於底部嵌槽14即可,故本發明適用於:形導熱管的貫穿 結合,係只要開設單一個貫穿孔13即已足夠。 再者’依本發明設計,上述設於核心管座1内壁的嵌 槽11(或底部嵌槽14),其係可在-側或兩側增設-包覆邊 壁m(如第一、三或七圖所示),當導熱管3於匹配嵌入嵌 槽11後,即可令一側或兩側的包覆邊壁111產生變形,進而 將導熱管3穩固夾持,使導熱管3與核心管座!形成良好 的緊配固定’也因此完全不需額外使料接結合。 上述的複數個散熱片2,係與習知散熱片構造相當, ^關其形狀或數量或分佈形態,皆可依不同f要而任意改 變或增減,例如核心管座1的外周壁係可局部或全部設有 複數個散熱片2,而散熱片2的數量、形狀或植設位置, 亦均可自由改變,且散熱片2與核心、管座χ的結合方式, 亦無限制必要,包括但不限於如採用一 或如實施例圖所示的叙插結合等各種方式,均屬 201108929 ο 如第七圖所示’本發明設於嵌槽11 一側或兩側的包覆 邊壁111係呈適當凸起狀’因此可簡易配合衝壓模具5朝向 凸起狀的包覆邊壁111施力擠壓(如箭號方向),以迫使包覆 邊壁111產生變形(如第八圖),進而將導熱管3包夾固持, 與導熱管3形成極佳的緊配結合(如第八、九圖)。 如第十圖所示,本發明亦可於核心管座1的底部再套 置結合一環形的底板4,使底板4抵持於散熱片2,並與 # 核心官座1的底部封閉面12、導熱管底部31構成同一切齊 面(如第十一圖)。’ 依本發明設計,所述導熱管3的配置數量係可任意增 減如第十一、十二圖所示’其亦可在核心管座1中空内 壁或/及底部分別開設嵌槽丨丨或/及底部嵌槽14,用以相 對提供二個U形導熱管3可同時埋入核心管座1的中空内 壁或/及底部,而同理可知,其亦可改採複數個L形或其 他形狀的導熱管而埋入結合組成。 籲 纟發明的核心管座1,係可視需要而任意實施為圓形 、方形或其它規則或不規則形狀,且核心管座1可配置結 合一個或一個以上的導熱管,且嵌槽11的雜也是相對匹 配於導熱管而設;如第十四、十五圖所示,即揭露一種方 形的核心管座1實施形態,除了外觀形狀改變外,其餘有 關核心管座1、複數個散熱片2及一個以上的導熱管3等 主要兀件的配置及結構特徵,或利用包覆邊壁1U的變形而 完成導熱管3的包夾固持,以及使導熱管底部31可呈露出 的嵌合緊配構造成,均屬同理應用。 201108929 t如第十六圖與第十七圖所示,係本發明使用於L形導 ,管3 a的具體實施例,為包括—核心、管座丄、複數個散熱 2及至少一個l形導熱管3a;關於核心管座1、散熱片 2、内壁或底部的嵌槽11或14的實施原理,均屬相同,但 L形導熱管3 a的垂直端只需貫穿單一貫穿孔13即可。 —如第十八圖與第十九圖所示,係本發明使用於】形導 熱管3b的另-具體實施例,為包括—核心管座丄、複數個 散熱片2及至少-個L形導熱管3 b;關於核心管座丄、散 …片2的實施原理’均屬相同,但丨形導熱管3 b並不且有 垂直端’因此可省略内壁嵌槽11,而只需形狀匹配的I形 底部嵌槽14b即已,若係对多數個I形導熱管3b, 則亦相對設有多數個底部嵌槽14b即可。 同理可知,如第二十圖與第 T 一 ---------圖所示,係本發明 ❹於C形導熱f3e的又—具體實施例,同樣是包括一核 2座y複數個散熱片2及至少—虹形導熱管3 =二、散熱片2的實施原理,均屬相同,但€形 導…& 3C也不具有垂直端,因此也省略内壁嵌槽11,而口 形底部嵌槽14。即已足夠,若係設有多數: /厂s C ’則亦相對設有多數個底部嵌槽i4c即可。 器設;上:Ϊ構:發明所為具有内置導熱管的輻射型散熱 散=Γ及手段運用’皆明顯不同於習知散熱 器’且政熱功效亦更為進步,故具有新穎性與進步性 此依法提㈣請’敬祈料審查並賜轉利為禱。‘、、 201108929 【圖式簡單說明】 第圖為本發明第一實施例的組合立體圖。 第=圖為本發明第—實施例呈倒置狀態組合立體圖。 第一圖為本發明第—實施例的分解立體圖。 第四圖為第一圖的上視圖。 第五圖為本發明第一實施例的組合斷面圖。 第六圖為本發明中的核心管座斷面圖。 第七圖為本發明配合誠模具針對包覆邊壁施以擠座 的狀態示意圖。 第八圖為第七圖於擠壓完成後使導熱管形成緊配包夾 的狀態示意圖。 九圖為本發日月第—實施例於另-角度的組合斷面圖 0 十圖為本發明再套置結合一環形底板的第二實施例 組合立體圖。 第十一圖為第十圖的組合斷面圖。 第十二圖為本發明配置結合三個ϋ形導熱管的第三實 施例組合立體圖。 第十二圖為第十二圖的組合斷面圖。 第十四圖為本發明採用方形核心管座的第四實施例組 合立體圖。 第十五圖為第十四圖的組合斷面圖。 第十六圖為本發明採用L形導熱管的第五實施例組合 底視圖。 第十七圖為第十六圖的A—a剖面圖。 201108929 第十八圖為本發明採用i形導熱管的第六實施例組合 底視圖。 第十九圖為第十八圖的A — A剖面圖。 第二十圖為本發明採用c形導熱管的第七實施例組合 底視圖。 σ 第二十一圖為第二十圖的A—Α剖面圖。 【主要元件符號說明】 1 核心管座 11 嵌槽 111 包覆邊壁 12 封閉面 121 鎖孔 13 貫穿孔 14 底部嵌槽 2 散熱片 3 導熱管 31 導熱管底部 4 底板 5 衝壓模具 3a L形導熱管 3b I形導熱管 3c C形導熱管 14b I形底部嵌 14c C形底部嵌槽201108929 VI. Description of the Invention: [Technical Field] The present invention relates to an improvement of a radiation type heat sink, and more particularly to a radiation type heat sink design having a built-in heat pipe, which is suitable for a central processing unit (CPU) and illumination Diode (LED) luminaires or other heat-generating units to provide rapid heat dissipation. [Prior Art] A conventional radiation type heat sink is composed of a plurality of heat sinks and a tubular body. The conventional heat sink disclosed in Japanese Patent No. 1269146, a plurality of heat sinks are implanted in a radiation direction. Standing on the outer wall surface of the tubular seat body, the tubular seat body can be implemented as a circular, square or any other shape of the pipe body or solid body, but the aforementioned conventional radiation type heat sink has a heat source (such as central processing) The CPU, the LED lamp or other heat-generating unit, etc. can only dissipate heat through the tubular body and the plurality of heat sinks, so the heat dissipation effect is slow and cannot meet the requirement of rapid heat dissipation. SUMMARY OF THE INVENTION The main purpose of the present invention is to provide a radiant heat sink design with a built-in heat pipe, which comprises a core tube seat, a plurality of heat sinks and more than one heat pipe, and a plurality of heat sinks are combined. In the outer peripheral wall of the core socket, especially in the hollow inner wall or/and the bottom of the core socket, more than one heat pipe is embedded, so that the heat pipe can be embedded and integrated on the inner wall of the core pipe or/and the bottom preset The slot is exposed and the bottom of the heat pipe is exposed to directly contact the heat source, thereby increasing the heat dissipation power of the heat sink. A secondary object of the present invention is to provide a radiant heat sink design having a built-in heat pipe 201108929, which is preset on the hollow inner wall or/and the bottom of the heat pipe to be tightly coupled. a groove, the groove can be provided with a side wall on one side or both sides, and the cover side wall is opened after the heat pipe is matched and embedded; and the heat pipe is firmly clamped to make the heat pipe and the core pipe The seat is well formed and tightly fixed, and no welding is required at all. A further object of the present invention is to provide a light-emitting type of a heat exchanger having a built-in heat pipe, wherein the core pipe has an open end at one end and a closed surface at the other end, and the closed surface has more than one opening. Outside the keyhole, one or two through holes corresponding to each other are opened, thereby passing the heat pipe through the through hole, so that the bottom of the heat pipe is formed with a tightly fitted tight fit. Another object of the present invention is to provide a radiant heat sink design having a built-in heat pipe, which can be further sleeved at the bottom and combined with a bottom plate, and the closed surface of the core pipe seat and the bottom of the heat pipe Form the same tangent plane. Another object of the present invention is to provide a light-emitting heat sink design having a built-in heat pipe, which can be arbitrarily implemented as a circular, square or other regular or irregular near shape, as needed. And the core tube base is formed according to the number of the heat pipe arrangement, and a matching groove with a matching shape and number is provided for more than one heat pipe to be embedded and combined. Another object of the present invention is to provide a radiant heat sink design having a built-in heat pipe, the shape or the number of configurations of the heat pipe can be arbitrarily changed or increased as needed, and the heat pipe shape includes However, it is not limited to U-shaped, L-shaped, I-shaped, C-shaped or other various shapes, mainly for matching and fitting to the inner wall or/and the bottom of the core pipe socket, and exposing the bottom of the heat pipe is sufficient; The shape or the number of the plurality of heat sinks 201108929 'The same can be changed or increased according to different needs. As for the combination of the heat sink and the core seat, there is no special limitation, including but not limited to, such as integrated molding or welding. Or inserting and combining, etc., are feasible implementation. [Embodiment] The structural features and other functions of the present invention are described in detail below with reference to the accompanying drawings: ' As shown in the first to fifth figures, the present invention refers to a combined embodiment of the U-shaped heat pipe. The system includes a core tube seat, a plurality of holes, and more than one υ-shaped heat pipe 3; wherein the core tube 1 is a hollow tube seat, and the outer peripheral wall is combined with a plurality of radiation directions. The heat sink f, and embedded in the hollow inner wall of the pipe socket and integrated with more than one heat pipe 3, for the inner wall of the core pipe block, one or more recesses η which can be combined with the heat pipe 3 are preset. After the heat pipe 3 is embedded and combined, the heat conduction g bottom:: 31 can be exposed to make the heat pipe 3 directly contact the heat source (such as the central CPU, the LED lamp or other heat generating unit, etc.) Improve heat dissipation and achieve fast heat dissipation. As shown in the sixth figure, the above-mentioned preferred embodiment of the recessed groove u provided on the inner wall of the core stem 1 is such that the recessed groove (10) is axially distributed on the inner wall of the core stem, and one end of the core stem 1 is Open-ended (as shown in the third figure), the other end: the 邛 is the closed surface 12 (as shown in the fourth figure), the bottom closed surface 12 is provided with two interlocking holes 121 on the X, and two mutually corresponding through-openings are opened. The hole 13' and the outer end surface of the closing surface 12 are further provided with a bottom fitting groove 14, and the through holes 13 are communicated with each other at the bottom groove μ, so that it can be. The heat pipe 3 penetrates through the two, the perforation 13 and the bottom 31 of the heat pipe is embedded in the bottom groove, so that the heat conduction & bottom 31 and the bottom groove u form a tight fit, 201108929 and the bottom of the U-shaped heat pipe The 31 series forms a flat and tangential state with the outer end surface of the bottom closed surface 12 (as shown in the fifth figure). As for the keyhole 121, it mainly provides a locking combination of heat source elements (e.g., a light-emitting diode (four) lamp or a heat generating unit, etc.). The above figures do not disclose an embodiment in which two mutually corresponding through holes 13 are provided, which are exclusively for the through-bonding of the U-shaped heat pipe 3; but it is also known that the present invention uses an L-shaped heat pipe. With the composition (such as the other embodiment of the tenth figure and the seventeenth figure), the single-vertical end of the L-shaped heat pipe can be penetrated through the single through hole 13 to obtain the same embedded combination. The effect is that the single horizontal end of the L-shaped heat pipe is directly embedded and coupled to the bottom groove 14 , so the present invention is applicable to the through-bonding of the heat pipe, and it suffices to open a single through hole 13 . Furthermore, according to the invention, the above-mentioned recessed groove 11 (or the bottom recessed groove 14) provided on the inner wall of the core pipe base 1 can be additionally provided on the side or both sides to cover the side wall m (such as the first and third sides). Or the seven-figure), when the heat-conducting tube 3 is matched with the embedded recessed groove 11, the one or both sides of the covered side wall 111 can be deformed, thereby firmly holding the heat-conducting tube 3, so that the heat-conducting tube 3 and Core socket! A good tight fit is formed, so there is no need to additionally bond the joints at all. The plurality of fins 2 described above are equivalent to the conventional fin structure, and the shape or the number or the distribution pattern can be arbitrarily changed or increased according to different f, for example, the outer wall of the core socket 1 can be A plurality of fins 2 are partially or entirely provided, and the number, shape or planting position of the fins 2 can also be freely changed, and the manner in which the fins 2 are combined with the core and the tube holder is not limited, including However, the present invention is not limited to the various methods, such as the use of one or the combination of the embodiment shown in the embodiment, and belongs to 201108929. As shown in the seventh figure, the present invention is provided with a side wall 111 provided on one side or both sides of the slot 11 It is in a proper convex shape. Therefore, it can be easily pressed and pressed toward the convex coated side wall 111 (such as the arrow direction) to force the covering side wall 111 to deform (as shown in the eighth figure). Then, the heat pipe 3 is clamped and held, and forms an excellent tight fit with the heat pipe 3 (such as the eighth and ninth figures). As shown in the tenth figure, the present invention can also be placed on the bottom of the core socket 1 to be coupled with a ring-shaped bottom plate 4, so that the bottom plate 4 abuts against the heat sink 2, and the bottom sealing surface 12 of the # core seat 1 The bottom portion 31 of the heat pipe constitutes the same tangential plane (as shown in FIG. 11). According to the design of the present invention, the number of the heat-conducting tubes 3 can be arbitrarily increased or decreased as shown in the eleventh and twelfth drawings, which can also be respectively formed in the hollow inner wall or/and the bottom of the core socket 1 Or / and the bottom recess 14 for providing two U-shaped heat pipes 3 at the same time can be buried in the hollow inner wall or/and the bottom of the core socket 1, and it is also known that a plurality of L-shaped or Other shapes of heat pipes are buried in a combined composition. The core socket 1 of the invention may be arbitrarily implemented as a circular, square or other regular or irregular shape as needed, and the core socket 1 may be configured to incorporate one or more heat pipes, and the grooves 11 are mixed. It is also relatively matched to the heat pipe; as shown in the fourteenth and fifteenth figures, a square core socket 1 embodiment is disclosed, except for the appearance shape change, and the other related core sockets 1 and the plurality of heat sinks 2 And more than one arrangement and structural features of the main components such as the heat pipe 3, or the deformation of the heat pipe 3 by the deformation of the cladding wall 1U, and the fitting of the bottom portion 31 of the heat pipe can be exposed. Constructed as a similar application. 201108929 t As shown in the sixteenth and seventeenth embodiments, the present invention is applied to an L-shaped guide, and the specific embodiment of the tube 3 a includes a core, a tube holder, a plurality of heat sinks 2, and at least one shape. The heat transfer pipe 3a; the implementation principle of the groove 11 or 14 of the core pipe seat 1, the heat sink 2, the inner wall or the bottom is the same, but the vertical end of the L-shaped heat pipe 3 a only needs to penetrate through the single through hole 13 . - As shown in Figs. 18 and 19, the present invention is used in another embodiment of the heat transfer tube 3b, comprising - a core tube holder, a plurality of fins 2, and at least one L shape The heat transfer tube 3 b; the implementation principle of the core tube holder 散, the sheet 2 is the same, but the 导热-shaped heat pipe 3 b does not have a vertical end ′ so the inner wall slot 11 can be omitted, and only the shape matching is required The I-shaped bottom recess 14b is already provided. If a plurality of I-shaped heat pipes 3b are provided, a plurality of bottom cavities 14b are also provided. Similarly, as shown in the twentieth and t-th-------- diagrams, the present invention is in the form of a C-shaped heat conduction f3e, which also includes a core 2 y. The plurality of fins 2 and at least the i-shaped heat pipe 3 = 2, the implementation principle of the fins 2 are the same, but the ... shape & 3C does not have a vertical end, so the inner wall slot 11 is also omitted, and The bottom of the mouth is shaped with a groove 14. That is enough, if there is a majority: / factory s C ′, there are also a number of bottom recessed slots i4c. The device is designed to be a radiation-type heat dissipation device with a built-in heat pipe. This is stipulated in the law (4), please pray for the review and give the benefit of prayer. ‘,, 201108929 [Simplified illustration of the drawings] The first figure is a combined perspective view of the first embodiment of the present invention. Fig. = is a perspective view showing the combination of the first embodiment of the present invention in an inverted state. The first figure is an exploded perspective view of the first embodiment of the present invention. The fourth figure is a top view of the first figure. Fig. 5 is a sectional view showing the combination of the first embodiment of the present invention. Figure 6 is a cross-sectional view of the core tube holder of the present invention. The seventh figure is a schematic view of the state in which the mold is applied to the coated side wall by the Chenggong mold. The eighth figure is a schematic view showing the state in which the heat transfer tube is tightly fitted and clamped after the extrusion is completed. 9 is a combined sectional view of the first embodiment of the present invention in another embodiment. FIG. 10 is a perspective view showing a second embodiment of the present invention in combination with an annular bottom plate. The eleventh figure is a combined sectional view of the tenth figure. Fig. 12 is a perspective view showing a combination of a third embodiment in which the present invention is combined with three dome-shaped heat pipes. Figure 12 is a combined sectional view of the twelfth figure. Fig. 14 is a perspective view showing a combination of a fourth embodiment of the present invention using a square core stem. The fifteenth figure is a combined sectional view of the fourteenth figure. Figure 16 is a bottom plan view of a fifth embodiment of the present invention using an L-shaped heat pipe. Figure 17 is a cross-sectional view of the A-a of Figure 16. 201108929 The eighteenth embodiment is a bottom view of a sixth embodiment of the present invention using an i-shaped heat pipe. Figure 19 is a cross-sectional view of the A-A of the eighteenth figure. Fig. 20 is a bottom plan view showing a combination of a seventh embodiment of the present invention using a c-shaped heat transfer tube. σ The twenty-first figure is the A-Α section of the twentieth diagram. [Main component symbol description] 1 Core socket 11 Inlay 111 Covered side wall 12 Closed surface 121 Locking hole 13 Through hole 14 Bottom groove 2 Heat sink 3 Heat pipe 31 Heat pipe bottom 4 Base plate 5 Stamping die 3a L-shaped heat conduction Tube 3b I-shaped heat pipe 3c C-shaped heat pipe 14b I-shaped bottom embedded 14c C-shaped bottom groove

Claims (1)

201108929 七、申請專利範圍: 1、 二種具有内置導熱管的輻射型散熱器,係包括一核心 管座、複數個散熱片及一個以上的導熱管,其特徵在 於該核〜I座係-中空管座,於夕卜周壁結合設有複 數個散熱片,且管座於中空内壁或/及底部並預設一 個以上可嵌入結合導熱管的嵌槽,使導熱管底部為露 出而直接接觸熱源。 2、 如中請專利範圍第丄項所述具有内置導熱管的賴射型 _ 散熱器,該中空内壁的嵌槽係沿著核心管座的内壁而 呈轴向分佈。 3、 如申請專利範圍第i項所述具有内置導熱管的輻射型 散熱器,該核心管座的一端為開口狀,另一端為底部 封閉面,該封閉面係開設一個以上或複數組兩個相互 對應的貫穿孔,以供一個以上的導熱管貫穿通過貫穿 孔而形成緊配結合。 4、 如申請專利範圍第1項所述具有内置導熱管的輻射型 鲁 散熱器,§亥底部的散槽係設於核心管座的底部封閉面 0 5、 如申請專利範圍第4項所述具有内置導熱管的輻射型 政熱器’ S亥底部的後槽係開設一個以上或複數組兩個 相互對應的貫穿孔,且貫穿孔係相通位於底部嵌槽。 6、 如申請專利範圍第4項所述具有内置導熱管的輻射型 散熱器’該核心管座的底部封閉面係與導熱管的底部 形成貼平切齊。 7、 如申請專利範圍第1項所述具有内置導熱管的輻射型 11 201108929 散熱器,該導熱管係一 u形導熱管。 8、 如申請專利範圍第1項所述具有内置導熱管的輻射型 散熱器,該導熱管係一L形導熱管。 9、 如申請專利範圍第1項所述具有内置導熱管的輻射型 散熱器,該導熱管係一 I形導熱管。 10、 如申請專利範圍第1項所述具有内置導熱管的輻射型 散熱器,該導熱管係一 C形導熱管。 11、 如申請專利範圍第1項所述具有内置導熱管的輻射型 散熱器,該核心管座中空内壁或/及底部的嵌槽,係 在一側或兩側設有一包覆邊壁’於導熱管匹配嵌入喪 槽後’利用包覆邊壁產生變形而將導熱管包失固持。 12、 如申請專利範圍第i項所述具有内置導熱管的輻射型 散熱器,該核心管座的底部係套置結合一環形的底板 ,且該環形底板係與核心管座的底部封閉面、導熱管 底部構成同一切齊面。 & 12201108929 VII. Patent application scope: 1. Two kinds of radiation type radiators with built-in heat pipe, including a core tube seat, a plurality of heat sinks and one or more heat pipes, which are characterized in that the core ~I seat system - middle The empty pipe seat is provided with a plurality of heat sinks on the outer wall of the outer wall, and the pipe seat is arranged on the hollow inner wall or/and the bottom portion and one or more recessed grooves which can be embedded and combined with the heat pipe, so that the bottom of the heat pipe is exposed and directly contacts the heat source. . 2. The radiant type _ radiator having a built-in heat pipe according to the above-mentioned patent scope, the groove of the hollow inner wall is axially distributed along the inner wall of the core pipe seat. 3. The radiant heat sink having a built-in heat pipe as described in claim i, wherein one end of the core pipe is open and the other end is a bottom closed face, and the closed face is open one or more or two. Corresponding through holes for forming one or more heat pipes through the through holes to form a tight fit. 4. If the radiation type Lu heat radiator with built-in heat pipe is mentioned in the scope of claim 1 of the patent application, the groove at the bottom of the sea is disposed at the bottom closed surface of the core pipe block, as described in item 4 of the patent application scope. A radiant type of heat exchanger having a built-in heat pipe 'The bottom groove of the bottom of the S-hai has one or more or two arrays of corresponding through holes, and the through holes are located in the bottom groove. 6. A radiant heat sink having a built-in heat pipe as described in claim 4, wherein the bottom closed surface of the core pipe is flush with the bottom of the heat pipe. 7. The radiant type 11 201108929 heat sink having a built-in heat pipe as described in claim 1 of the patent scope, the heat pipe is a u-shaped heat pipe. 8. A radiant heat sink having a built-in heat pipe as described in claim 1 of the patent scope, the heat pipe being an L-shaped heat pipe. 9. The radiant heat sink having a built-in heat pipe as described in claim 1 of the patent scope, the heat pipe being an I-shaped heat pipe. 10. A radiant heat sink having a built-in heat pipe as described in claim 1 of the patent scope, the heat pipe being a C-shaped heat pipe. 11. The radiant heat sink having a built-in heat pipe according to claim 1, wherein the hollow inner wall or/and the bottom of the core pipe are provided with a covered side wall on one or both sides. After the heat pipe is matched and embedded in the stagnation groove, the heat-transfer tube is lost and retained by the deformation of the coated side wall. 12. The radiant heat sink having a built-in heat pipe as described in claim i, the bottom of the core pipe sleeve is coupled to an annular bottom plate, and the annular bottom plate is closed to the bottom of the core pipe base, The bottom of the heat pipe forms the same tangential plane. & 12
TW099138975A 2010-11-12 2010-11-12 Radiation type heat sink with built-in heat conduction pipe TW201108929A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW099138975A TW201108929A (en) 2010-11-12 2010-11-12 Radiation type heat sink with built-in heat conduction pipe
JP2010274464A JP5745264B2 (en) 2010-11-12 2010-12-09 Radiant heat exhaust
US12/975,379 US20120118536A1 (en) 2010-11-12 2010-12-22 Radial heat sink with heat pipe set therein
DE202010013223U DE202010013223U1 (en) 2010-11-12 2010-12-28 Polysymmetric heat sink with heat pipe group arranged therein
KR2020110000839U KR200465687Y1 (en) 2010-11-12 2011-01-28 Radial heat sink with heat pipe set

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US20120118536A1 (en) 2012-05-17
KR200465687Y1 (en) 2013-03-06
DE202010013223U1 (en) 2011-05-12
JP2012102993A (en) 2012-05-31
JP5745264B2 (en) 2015-07-08
KR20120003557U (en) 2012-05-22

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