201105461 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種玻璃基板之去角裝置，特別是關於一 種藉由去角用磨石對液晶顯示器、電漿顯示器等所使用之 FPD(Flat Panel Display，平板顯示器）用玻璃基板之端面進 行去角加工的玻璃基板之去角裝置。 【先前技術】 液晶顯示器、電漿顯示器等所使用之FpD用玻璃基板係 將熔融玻璃成形為板狀，其後於切割/折斷步驟中，切割 折斷為特定矩形大小之玻璃基板後，藉由去角裝置之去角 用磨石對其端面進行W加工，以去除產生料端面的毛 邊0 於此種去角裝置中’若相對於玻璃基板之端面的去角用 磨石之高度發生變化，則存在去角加工後之玻璃基板之端 面加工變得不均勾，使得形狀及尺寸偏離產品規格的情 況此時，必需將磨石之高度修正至符合產品規格之位 置，即，創造出滿足產品規格之條件。 於專利文獻It，揭示有對磨石高度之玻璃基板進行修 正之去角裝置。該去角裝置係用以修正磨石高冑，以使作 動開始後隨即被去自τ + Trf> t h 角加工之玻璃基板與作動開始後經過一 定時間後被去角加工之破璃基板之磨削量不會產生差異。 具體而言’㈣雷射位移計敎載置被進行去角之玻璃基 板的吸附平台之高度。由雷射位移計測定之吸附平台的高 度資訊經由放大4 从八态破發廷至控制部，於控制部中，利用預 I47492.doc 201105461 先所輸入之換算資料，基於吸附平台之高度資訊，算出磨 石之適當南度’並利用機械手（robot)在上下方向上調整磨 石，以使磨石達到適當高度。 先行技術文獻 專利文獻 專利文獻1 :日本專利特開2〇〇3 — 25丨98號公報 【發明内容】 發明所欲解決之問題 然而，專利文獻1之玻璃基板之去角裝置係利用雷射位 移計檢測出吸附平台之高度，並基於該高度修正磨石之高 度’而並非直接檢測出磨石之實際溝槽、即按住玻璃基板 之端面對端面進行去角之溝槽之高度而修正溝槽之高度， 故存在無法高精度地修正磨石高度之缺點。 又，玻璃基板之去角質量並非僅取決於磨石之高度，亦 受到磨石之芯偏擺或磨石之壽命影響。即，當磨石產生有 芯偏擺或磨石之壽命已終結時，存在去角加工後之玻璃基 板之端面形狀變差’良率下降之問題。於專利文獻i之去 角裝置中，甚至無法檢測出磨石之芯偏擺或磨石之壽命。 本發明鮮於上述情況而成者，目的在於提供—種可高 質量地對玻㈣板之端面進行去角加工之㈣基板之 裝置。 解決問題之技術手段 本發明為達成上述目的，提供_種玻璃基板之去角裝 置’其特徵在於包含：平台，其用以保持玻璃基板；圓柱 147492.doc 201105461 =磨：，其在其軸方向上以特定間隔形成有複數條環狀 端面進行去角加工;旋轉驅動:千二 =磨之玻璃基板之 :移::」其使上述磨石在與上述平台所保持之玻璃基: 正父的方向上移動’·第2移動部，其使上述磨石在上 述平台所保持之玻璃基板之面方向上移動；溝槽形狀檢測 機構’其檢測出上述磨石之複數條環狀溝槽之包含上述正 交方向及上述面方向的位置資訊的溝槽形狀；及控制部， 其記憶上述磨石被安裝於上述旋轉驅動部之基準位置的位 置上之包含上述正交方向及上述面方向之位置資訊的設計 值之基準溝槽形狀’並根據該基準溝槽形狀及由上述溝样 形狀檢測機構檢測出之上述溝槽形狀控制上述第印 及/或上述第2移動部。 根據本發明，將磨石安裝於旋轉驅動部，藉由溝槽形狀 檢測機構檢測出該磨石之溝槽形狀，並將表示溝槽形狀之 貧訊輸出至控制部。於控制部中，記憶有被安裝於旋轉驅 動部之基準位置的位置上之磨石之包含上述正交方向及上 述面方向之位置資訊的設計值之基準溝槽形狀。根據上述 基準溝槽形狀以及由溝槽形狀檢測機構檢測出之上述溝槽 形狀，控制第！移動部及/或第2移動部’使磨石向與玻^ 基板之面方向正交之方向及/或玻璃基板之面方向移動， 從而創造出磨石之條件。 根據本發明，設有直接檢測出磨石之溝槽形狀的溝㈣ 狀檢測機構，因此可高精度地修正磨石之高度，且可修^ 147492.doc 201105461 磨石之芯偏擺，進而可檢測出磨石之壽命。因此，根據本 發明，可高質量地對玻璃基板之端面進行去角加工。 若磨石被安裝於旋轉驅動部之基準位置，則平台所保持 之玻璃基板之端面會藉由磨石之溝槽於產品規格内進行去 角加工。所謂控制部中所記憶之基準溝槽形狀，不僅包括 溝槽之形狀，而且亦包括上述正交方向及上述面方向之位 置資訊，且由溝槽形狀檢測機構檢測出之實際溝槽形狀亦 包括上述正交方向及上述面方向之位置資訊。即，使實際 溝槽形狀與基準溝槽形狀重疊，並運算其位置偏移量，藉 此y獲得正交方向(高度方向)之修正量，從而由控制㈣ 制第1移動部，以使磨石移動僅該修正量的距離。 又，較佳為，本發明之上述控制部在更換上述磨石時對 由上述溝槽形狀檢測機構檢測出之上述溝槽形狀與上述所 記憶之基準溝槽職進行比較，#上述溝槽形狀與該基準 溝槽形狀不-致時，控制上述第動部使上述磨石移動 以使上述溝槽形狀與該基準溝槽形狀—致，並在— 置使第1移㈣停止。藉此，根據本發明，可自動且古斧 度地修正磨石之高度。 勁且间精 t马，本發明之上述控制部在上述去角加工 由上述溝槽形狀檢測機構檢測出之十 記憶之基準溝槽形狀進行比較’運算二:與广 控制上述第2移動部使上述磨石移動以抵 磨 在抵消之位置使第2移動部停止。藉據：里，3 自動地使磨石之磨削率丨若據本發明，可 之磨料（右為精加工用磨石則為研磨率）為 147492.doc 201105461 固定，因此可進行高精度之去角加工。 又，較佳為，本發明之上述控制部中，記憶用以判定上 述溝槽之壽命的壽命溝槽形狀，在上述去角加工時對由上 述溝槽形狀檢測機構檢測出之上述溝槽形狀與上述所記憶 之壽命溝槽形狀進行比較，當上述溝槽形狀成為上述壽命 溝槽形狀時，控制上述第!移動部以使用上述磨石之下一 條溝槽。藉此，根據本發明，可自動判定磨石之溝槽壽 命，且可自動設定下一條溝槽。 、又，較佳為，本發明之上述磨石為粗加工去角用磨石及/ 或精加工去角用磨石。作為本發明之對象的磨石，既可為 粗加工去角用磨石’亦可為精加工去角用磨石。並且，亦 可為將粗加工去角用磨石及精加工去角用磨石搭载於同一 頭部（head)之磨石。此時，可藉由一台溝槽形狀檢測機構 檢測出粗加工去角用磨石及精加工去角用磨石之溝槽形 狀’因此可削減溝槽形狀檢測機構之台數。 發明之效果 如以上所述，根據本發明之玻璃基板之去角裝置設有 直接檢測出磨石之包含位置資訊之溝槽形狀的溝槽形狀檢 測機構，因此可高質量地對玻璃基板之端面進行去角加 工。 【實施方式】 以下’根據隨附圖式，說明本發明之玻璃基板之去角事 置的較佳實施形態。 圖1A及1B中表示有實施形態之玻璃基板之去角裂置的 147492.doc 201105461 平面圖。又，於圖1A*，表示有例如與2〇〇〇χ18〇〇 之 液晶顯示器用玻璃基板1〇之長邊1〇A、1〇B相對向地，將 切角（corner cut)用之磨石16、粗加工去角用之第】磨石 12、精加工去角用之第丨磨石18、粗加工去角用之第2磨石 14及精加工去角用之第2磨石2〇，與玻璃基板丨^之各個長 邊10A、10B大致平行地，且自磨石之行進方向（X方向）之 前方以上述順序配置於特定位置的平面圖。再者，於圖Μ 及1 B中係例示液b曰顯示器用玻璃基板1 〇，但亦可為電衆 顯示器用玻璃基板。又，切角用之磨石16雖亦可配置於X 方向之行進方向後段，但自提高節拍（tact)之觀點考慮， 配置於行進方向前段。 玻璃基板10被吸附保持於圖中虛線所示之去角平台22。 又，磨石12〜20—面藉由各個未圖示之旋轉用驅動部以特 定旋轉數旋轉，一面藉由未圖示之移動用驅動部在又方向 (配置於長邊10A側及10B側的磨石群均在又方向上移動， 但各自為相反方向）上以固定速度移動。藉此，進行玻璃 基板10之角部Cl、C2之切角加工、玻璃基板1〇之長邊 10A、10B之粗去角加工、及精去角加工。 磨石12宜自長邊l〇A、10B之大致中央部開始去角並 且於通過長邊10A、10B之時點停止去角加工。又，磨石 14於已通過磨石12之起點若干量之時點停止去角加工。對 於磨石18、20,亦實施與磨石12、14分別相同之動作。 再者，於切角時，自提高節拍之觀點考慮設有專用之磨 石16,但亦可代替磨石16,使磨石12朝向相對於χ方向傾 147492.doc 201105461 斜之方向移動而對玻璃基板10之角部C1、C2進行切角加 工。 如圖1A所示，藉由各個磨石12〜2〇，同時進行長邊 〇A 10B之粗去角加工、精去角加工及角部c i、C2之切201105461 VI. Description of the Invention: [Technical Field] The present invention relates to a glass substrate chamfering device, and more particularly to an FPD (Flat) used for a liquid crystal display, a plasma display, etc. by a chamfering grindstone Panel Display (Panel Display) A chamfering device for a glass substrate that is subjected to a chamfering process using an end surface of a glass substrate. [Prior Art] A glass substrate for FpD used in a liquid crystal display, a plasma display, or the like is formed into a plate shape by a glass substrate, and then, after being cut and broken into a glass substrate having a specific rectangular size in a cutting/breaking step, The corner of the corner device is machined with a grindstone to remove the burrs of the end face of the material. In such a chamfering device, 'if the angle of the grindstone relative to the end face of the glass substrate changes, the height of the grindstone changes. In the case where the end surface of the glass substrate after the chamfering process becomes uneven, so that the shape and the size deviate from the product specifications, it is necessary to correct the height of the grindstone to meet the product specifications, that is, to meet the product specifications. The conditions. In the patent document It, there is disclosed a chamfering device for correcting a glass substrate having a grindstone height. The dehorning device is used for correcting the grinding stone sorghum so that the glass substrate processed from the τ + Trf > angle is immediately after the start of the operation, and the glass substrate which has been subjected to the dehorning process after a certain period of time after the start of the operation is ground. There is no difference in the amount of cut. Specifically, the (4) laser displacement meter mounts the height of the adsorption platform of the glass substrate to be chamfered. The height information of the adsorption platform measured by the laser displacement meter is amplified from the eight state to the control department. In the control unit, the conversion data input by the pre-I47492.doc 201105461 is used to calculate the grinding based on the height information of the adsorption platform. The appropriate south of the stone 'and the robot is used to adjust the grindstone in the up and down direction to make the grindstone reach the appropriate height. [Problem to be Solved by the Invention] However, the dehorning device of the glass substrate of Patent Document 1 utilizes a laser displacement. The height of the adsorption platform is detected, and the height of the grindstone is corrected based on the height, and the actual groove of the grindstone is not directly detected, that is, the height of the groove of the end face of the glass substrate is removed Since the height of the groove is high, there is a disadvantage that the height of the grindstone cannot be corrected with high precision. Moreover, the quality of the chamfer of the glass substrate is not only determined by the height of the grindstone, but also by the core yaw of the grindstone or the life of the grindstone. That is, when the life of the grindstone is eccentric or the life of the grindstone is terminated, there is a problem that the shape of the end surface of the glass substrate after the chamfering process is deteriorated, and the yield is lowered. In the corner device of Patent Document i, it is not even possible to detect the life of the core yaw or the grindstone of the grindstone. The present invention has been developed in view of the above-mentioned circumstances, and an object thereof is to provide a device for (4) a substrate which can be subjected to a high-quality chamfering of an end face of a glass plate. Means for Solving the Problems In order to achieve the above object, the present invention provides a chamfering device for a glass substrate, which is characterized by comprising: a platform for holding a glass substrate; a cylinder 147492.doc 201105461 = grinding: in its axial direction A plurality of annular end faces are formed at a specific interval to perform chamfering processing; and the rotary driving: the two-two=grinding glass substrate: shift::" the glass base of the grindstone held on the platform: the father's Moving in the direction of the second moving portion, the grinding stone is moved in the surface direction of the glass substrate held by the platform; and the groove shape detecting mechanism detects the inclusion of the plurality of annular grooves of the grinding stone a groove shape of the position information in the orthogonal direction and the surface direction; and a control unit that stores the position including the orthogonal direction and the surface direction at a position where the grindstone is attached to a reference position of the rotation driving unit The reference groove shape of the design value of the information is controlled according to the reference groove shape and the groove shape detected by the groove-like shape detecting mechanism, and the above printing and/or The second moving unit. According to the invention, the grindstone is attached to the rotary drive unit, and the groove shape detecting means detects the groove shape of the grindstone, and outputs the lean signal indicating the groove shape to the control unit. The control unit stores a reference groove shape of a design value including the position information of the orthogonal direction and the surface direction of the grindstone attached to the position of the reference position of the rotation driving unit. According to the above-described reference groove shape and the shape of the groove detected by the groove shape detecting means, the control is performed! The moving portion and/or the second moving portion 'moves the grinding stone in a direction orthogonal to the surface direction of the glass substrate and/or in the direction of the surface of the glass substrate to create a condition of the grindstone. According to the present invention, the groove (four) detecting mechanism for directly detecting the groove shape of the grindstone is provided, so that the height of the grindstone can be corrected with high precision, and the core of the grindstone can be repaired by the 147492.doc 201105461 The life of the grindstone is detected. Therefore, according to the present invention, the end surface of the glass substrate can be subjected to chamfering with high quality. If the grindstone is mounted at the reference position of the rotary drive unit, the end face of the glass substrate held by the platform is chamfered by the groove of the grindstone within the product specifications. The reference groove shape stored in the control unit includes not only the shape of the groove but also the position information of the orthogonal direction and the surface direction, and the actual groove shape detected by the groove shape detecting mechanism also includes Position information of the orthogonal direction and the surface direction. In other words, the actual groove shape is overlapped with the reference groove shape, and the positional shift amount is calculated, whereby y obtains the correction amount in the orthogonal direction (height direction), thereby controlling (4) the first moving portion to make the grinding The stone moves only the distance of the correction amount. Further, preferably, the control unit according to the present invention compares the groove shape detected by the groove shape detecting means with the stored reference groove position when the stone is replaced, and the groove shape is When the shape of the reference groove is not uniform, the first moving portion is controlled to move the grindstone so that the groove shape and the reference groove shape are aligned, and the first shift (four) is stopped. Thereby, according to the present invention, the height of the grindstone can be automatically and automatically corrected. In the above-described control unit of the present invention, the control unit of the present invention compares the reference groove shape of the ten memories detected by the groove shape detecting means in the above-described chamfering processing, and the second moving unit is controlled by the second moving unit. The grindstone moves to stop the second moving portion at the offset position. According to the present invention, the abrasive material (the grinding rate of the finishing stone for finishing is 147492.doc 201105461) is fixed, so that high precision can be performed. Dehorning processing. Further, preferably, the control unit of the present invention stores a life groove shape for determining the life of the groove, and the groove shape detected by the groove shape detecting means during the chamfering process. In comparison with the shape of the life groove described above, when the groove shape is in the shape of the life groove, the first moving portion is controlled to use one groove below the grindstone. Thereby, according to the present invention, the groove life of the grindstone can be automatically determined, and the next groove can be automatically set. Further, preferably, the above-mentioned grindstone of the present invention is a rough grinding stone for sharpening and/or a grinding stone for finishing chamfering. The grindstone which is the object of the present invention may be a grindstone for roughing and chamfering, or a grindstone for finishing chamfering. Further, it is also possible to use a grindstone for roughing and chamfering and a grindstone for finishing the chamfer on the same head. At this time, the number of the groove shape detecting means can be reduced by detecting the groove shape of the rough machining chamfering stone and the finishing chamfering stone by a groove shape detecting means. Advantageous Effects of Invention As described above, the chamfering device for a glass substrate according to the present invention is provided with a groove shape detecting mechanism that directly detects a groove shape including position information of the grindstone, so that the end surface of the glass substrate can be high quality Perform the chamfering process. [Embodiment] Hereinafter, preferred embodiments of the glass substrate of the present invention will be described with reference to the accompanying drawings. A plan view of 147492.doc 201105461 of the glass substrate of the embodiment is shown in Figs. 1A and 1B. Moreover, in FIG. 1A*, for example, the corner cuts are used to face the long sides 1〇A and 1〇B of the glass substrate 1液晶 of the liquid crystal display of 2〇〇〇χ18〇〇. Stone 16, rough machining and chamfering] Grinding stone 12, finishing honing stone 18, roughing and chamfering 2nd grindstone 14 and finishing chamfering 2nd grindstone 2 That is, a plan view which is disposed substantially parallel to the respective long sides 10A and 10B of the glass substrate and arranged in the above-described order in the order from the traveling direction (X direction) of the grindstone. Further, in Figs. 1 and 2B, a glass substrate 1 for liquid display is used, but a glass substrate for an electric display may be used. Further, the grindstone 16 for the chamfering angle may be disposed in the rear direction of the traveling direction in the X direction, but is disposed in the front direction of the traveling direction from the viewpoint of improving the tact. The glass substrate 10 is adsorbed and held by the chamfering platform 22 shown by a broken line in the drawing. Further, the grinding stones 12 to 20 are rotated by a specific number of rotations by the respective rotation driving portions (not shown), and are disposed in the other direction (on the long sides 10A side and the 10B side) by the moving drive unit (not shown). The group of grindstones move in the opposite direction, but each in the opposite direction, moving at a fixed speed. Thereby, the chamfering processing of the corner portions C1 and C2 of the glass substrate 10, the rough chamfering processing of the long sides 10A and 10B of the glass substrate 1 and the fine cornering processing are performed. The grindstone 12 should start to be chamfered from the substantially central portion of the long sides l〇A, 10B and stop the chamfering at the time of passing the long sides 10A, 10B. Further, the grindstone 14 stops the chamfering process at a point when the starting point of the grindstone 12 has passed. For the grindstones 18 and 20, the same operations as those of the grindstones 12 and 14 are also performed. Further, in the case of the chamfering angle, a special grindstone 16 is provided from the viewpoint of improving the beat, but the grindstone 16 may be replaced so that the grindstone 12 is inclined in the direction of the 147492.doc 201105461 with respect to the χ direction. The corner portions C1 and C2 of the glass substrate 10 are chamfered. As shown in Fig. 1A, the roughing of the long side 〇A 10B, the fine cornering processing, and the cutting of the corners c i and C2 are simultaneously performed by the respective grindstones 12 to 2 〇.
角加工，其後，如圖1B所示，使玻璃基板10移動至去角步 驟之下游側，且旋轉90度，藉此同時進行短邊1 D 之粗去角加工 '精去角加工及剩下角部ο、以之切角加 工。並且，只要不使玻璃基板1〇移動至去角步驟之下游 側，而在同-位置同時實施四邊之去肖加工，便可縮短玻 璃基板10之生產線長度，設備亦會變得廉價，但是同時對 玻璃基板10之四邊進行去角加工，必需在狹窄空間配置多 個去角用頭部’因此在設備構成上較為困難。此外，去角 加工雖可對玻璃基板10之每一邊實施，但自提高節拍之觀 點考慮，理想的是如上所述同時對兩邊進行去角加工。 此外，於圖丨八及⑺中，係說明設置有如切角用之磨石 16、粗加工去角用之磨石12、14及精加工去角用之磨石 18、20般複數台磨石12〜2〇的去角裝置，但並不限定於 此0 即，可利用一台粗加工去角用之磨石及一台精加工去角 用之磨石對玻璃基板10之一邊進行去角加工。亦即，亦可 應用於統-去角而非分割去角。但是，自提高節拍之觀點 考慮’理想的是如上所述進行分割去角。 或者，亦可應用於僅設有切角用之磨石16，僅設有粗加 工去角用之磨石12、14,或僅設有精加工去角用之磨石 147492.doc 201105461 Μ、20的去角裝置。但是，由於可利用後述—台雷射位移 计30(參照圖2 :溝槽形狀檢測機構）檢測出複數合去角用磨 石1 14 16' 18、20之溝槽形狀，因此本發明對圖ία及 1B所示之併用複數台磨石之去角裝置有效。 圖2係在粗加工去角用之磨石12(14)中添加有實施形態 之去角裝置之構成的系統構成圖。 該系統包含雷射位移計3〇、控制器32、運算部(控制 部）34及操作部36，亦共通用於切角用之磨石16及精加工 去角用之磨石18、2G°即’該系統在圖1A及1B所示之去 角裝置中’對於長邊10B側之磨石群設置有K，對於長邊 10A側之磨石群設置有1 a。w 丁 ^ ^ 听又直有1 α。以下，將以磨石12(14)為例說 明本系統之特徵，但對於磨石16、18、2()亦係相同。 百先U12係在其軸方向上以特定間隔形成有複數條 用以對玻璃基板10之端面進行去角加工之環狀溝槽12八、 12B、12C的圓柱狀磨石。各個溝槽12八、ΐ2Β、μ..·為相 同形狀，形成為越朝向磨石12之外周部寬幅越寬之錐形 狀。又，溝槽12A、12B、12C…之錐形面與溝槽之内底面 形成特定角度。此外，於溝槽12A、12B' nc之内面， 高溫燒結有鑽石研磨粒等之研磨粒。 於磨石1 2之上部，藉由i同— 稭由未圖不之螺釘（bolt)固定有平板 狀之凸㈣’於該凸㈣之上表m設置有沿著磨石 12之中心轴的軸40。該軸40可裝卸地保持於主轴（旋轉驅 動部）44之油整夾盤46,該主轴（旋轉驅動部）44係可自由上 下移動地支持於磨石頭部42β即，磨石⑵系於更換時及維 147492.doc 201105461 護時經由油壓夹盤46裝卸於主軸44 ’並且經由油塵夾盤46 傳遞主轴44之旋轉驅動力，藉此以特定旋轉數旋轉。再 者，當軸40相對於油壓夾盤46之軸偏離而安裝時，即，當 磨石12^'偏擺之狀態安裝時，藉由後料射位移計州: 測出芯偏擺，故而此時，於去角加卫前，#由操作人員之 手動操作修正芯偏擺。 主軸44如上所述，經由未圓示之藤舳 固丁炙等執上下移動自如地支 持於磨石頭部42，且於其上部連结伺g 逆…彳』服馬達（第I移動部）48 之主軸(未圖示）’藉由词服馬達48之動力，以微米單位之 精度相對於磨石頭部42上下移動。藉由此動作，磨石邮 與玻璃基板H)之面正交之方向上進行上下移動，因此對磨 石 12之溝槽 12A、12B、12C·..之 沒以被未早位之精度進 行調整。 經由未圖示之導軌在水平方向上㈣ 自如地㈣支持，並於其側部連結伺服馬達（第2移動部）5( ，主㈣，藉由祠服馬達50之動力，使磨石頭部仙微米 :立=精度水平移動。藉由該動作，磨石12在玻璃基㈣ 方向上水平移動’因此對相對於破璃基板狀端面的 =2:溝槽12A、12B、12C·..之水平方向位置以微米單 之精度進行調整。關於磨石16、18、2g 述磨石頭部42、主軸44 ·由壓夾盤 ’、σ匕3上 馬達# MM#、·馬達48及飼服 其次對系統構成進行說明。 配置，可檢測出 雷射位移計3G之檢測面係與磨石12對向 147492.doc 201105461 磨石12之複數條溝槽12A、12B、12C…之位置及形狀。將 包含該位置資訊之表示溝槽形狀的資訊自雷射位移計3〇經 由控制器32輸出至運算部34。此處所示之所謂位置資訊， 係與去角平〇 22所保持之玻璃基板1 〇之面正交之方向的位 置資訊及該玻璃基板1〇的面方向之位置資訊。 於内置於運算部34的記憶部中，記憶有磨石12被安裝於 主軸44之油壓夾盤46之基準位置的位置上之磨石12之設計 值的基準溝槽形狀（亦包含上述位置資訊）。並且，運算部 34根據所記憶之基準溝槽形狀以及由雷射位移計％檢測出 之實際溝槽形狀（亦包含上述位置資訊），經由操作部刊控 制伺服馬達48及/或伺服馬達50，以使磨石12在上述正交 方向及/或上述面方向上移動。 又於運鼻部34上連接未圖不之監視器，於該監視 中’與上述基準溝槽形狀重疊顯示上述實際溝槽形狀。藉 由觀察s亥監視器，可視認出實際溝槽形狀相對於基準溝槽 形狀之位置偏移’且可一面觀察該監視器，一面修正磨石 12之芯偏擺。 即’根據本系統’將新的磨石12安裝於主軸44之油壓爽 盤46 ’藉由雷射位移計3〇檢測出該磨石12之溝槽i2A、 12B、12C.._之位置及形狀，將包含位置資訊之表示溝槽形 狀之資訊輸出至運算部34。於運算部34之記憶部中，如上 所述6己憶有被安裝於主轴4 4之油壓夾盤4 6之基準位置的位 置上的包含位置資訊的磨石12之設計值之基準溝槽形狀， 因此運算部34根據該基準溝槽形狀以及由雷射位移計3〇檢 147492.doc -12- 201105461 測出之實際溝槽形狀控制伺服馬達48及/或伺服馬達5〇， 使磨石12在上下方向及/或水平方向上移動，創造出磨石 12之條件。 因此’根據實施形態之去角裝置，設有直接檢測磨石12 之溝槽形狀的雷射位移計30，因此可高精度地修正磨石12 之高度’且可修正磨石12之芯偏擺，進而可檢測出磨石12 之壽命。其詳細情況將於後述。因此，藉由實施形態之去 角裝置’可高質量地對玻璃基板10之端面進行去角加工。 若作具體而言，則運算部34於磨石更換時對由雷射位移 片3 0彳欢測出之實際溝槽形狀及溝槽位置、即、圖3 a之細線 所示之實際溝槽形狀α及α之位置與圖3 A之粗線所示之基準 溝槽形狀β及P之位置進行比較。繼而，運算部34於實際溝 槽形狀α及α之位置在上下方向上與基準溝槽形狀β及ρ之位 置不一致時，運算其偏移量a。繼而，運算部34控制伺服 馬達48 ’使磨石12在上下方向（圖3A中為上方向）上移動僅 其偏移量a的距離。藉此，如圖3B所示，實際溝槽形狀α及 位置與基準溝槽形狀β及β之位置在上下方向上一致。 因此，藉由實施形態之去角裝置，可自動且高精度地修正 磨石12之高度。由於磨石12之高度被高精度地修正至滿足 產品規格之位置，故可防止產生僅玻璃基板1〇之端面之一 部分成為鏡面的產品缺陷。又，由於玻璃基板1〇之端面尺 寸符合產品規格’因此玻璃基板1〇之良率得到提高。 進而，運算部3 4於去角加工時對由雷射位移計3 〇檢測出 之實際溝槽形狀及溝槽位置、即、圖4Α之細線所示之實際 147492.doc •13· 201105461 溝槽形狀α及α之位置與圖4A之粗線所示之基準溝槽形狀β 及β之位置進行比較，運算出實際溝槽之磨損量b，控制伺 服馬達50使磨石12在水平方向（圖4A中為左方向）上移動以 抵消該磨損量b，並在圖4B所示之抵消之位置使伺服馬達 5〇停止。藉此，藉由實施形態之去角裝置，可自動地使磨 石12之磨削率（羞為精加工用磨石則為研磨率）為固定，因 此可進行高精度之去角加工，玻璃基板1〇之外形尺寸亦會 變得大致固定。 又，於運算部34中，如圖5所示記憶用以判定溝槽壽命 之壽命溝槽形狀γ，於去角加工時對由雷射位移計儿檢測 出之實際溝槽形狀、即、圖5之細線所示之實際溝槽形狀& 與圖5之粗線所示之壽命溝槽形狀γ進行比較。 繼而，運算部34於實際溝槽形狀α與壽命溝槽形狀7一致 時，控制伺服馬達48使磨石12向卜古狡缸 咬〇仗居石U向上方移動，以使用磨石12 之下一條溝槽（例如溝槽12Β)。鋅 /丹h ΙΖϋ)錯此’错由實施形態之去 ，裝置’可自動地判定磨石12之溝槽12Α、ι2β' Μ .之 奇命，且可自動地設定自壽命已終結之溝槽"Α算起下一 條之溝槽12B。 Γ上為本系統之作用。於本系統中，提高設備能力時磨 二：：加、厚度小於03匪之玻璃基板之厚度變薄、作 裝步驟良率對策之玻璃基板之端面的鏡面化(例如， a值j於0.2微米）之嚴格管理形態方面變得良好。 =，=雷射位移計3〇而進行之溝槽形狀及溝槽位置 的確遇，當_於心12之更換時進行，但亦可於每當一 147492.doc 201105461 塊玻璃基板1 〇之去角加工結束時實施，且亦可於每當複數 塊之加工結束時實施。若考慮到生產率，則後者較佳。 [實施例] 使用雷射位移計，使運算部識別出處於玻璃基板之端面 之面寬幅規格内的磨石正規高度，有意將規定值之薄板 (填隙片）插入至去角裝置’以產生上述磨石正規高度與實 際磨石高度之高低差，於自動修正上述高低差後，確認到 可將磨石誘導為處於面寬幅規格内的磨石高度。 [比較例] 更換磨石後’對玻璃基板之端面進行去角加工，藉由測 定台實施面寬幅確認後發現處於規格外，再次輸入磨石之 南度方向之修正量而再次實施去角加工，以創造出條件。 其結果為’亦存在產生有複數塊玻璃基板之損耗的情況。 參照特定之實施態樣詳細說明了本申請案，但業者當 知，可不脫離本發明之精神及範圍而加以各種變更或修 正。 本申請案係基於2009年4月3曰申請之曰本專利申請書 (曰本專利特願2〇〇9-091402)者，將其内容作為參照併入於 本案。 【圖式簡單說明】 圖1Α係實施形態之玻璃基板之去角裝置之平面圖。 圖1B係貫施形態之玻璃基板之去角裝置之平面圖。 圖2係圖1所示之去角裝置之系統構成圖。 圖3 A係用以說明磨石之溝槽之高度修正的說明圖。 147492.doc •15- 201105461 圖3B係用以說明磨石之溝槽之高度 圖4A係用以說明磨石之溝槽之磨損量修正=圖 圖4B係用以說明磨石之 飞月圖 霉槽之磨知夏修正的說明圖 【主要元件符號說明】 圖5係用以說明磨石之、.蕃 士 乃靨石之溝槽之寿命判定的說明圖。 10 玻璃基板 12 粗加工去角用之第1磨石 14 粗加工去角用之第2磨石 16 切角用之磨石 18 精加工去角用之第1磨石 20 精加工去角用之第2磨石 22 去角平台 30 雷射位移計 32 控制器 34 運算部 36 操作部 38 凸緣 40 轴 42 磨石頭部 44 主軸 46 油壓夾盤 48 伺服馬達 50 伺服馬達 52 主軸 147492.doc -16 -Angular processing, and then, as shown in FIG. 1B, the glass substrate 10 is moved to the downstream side of the chamfering step, and rotated by 90 degrees, thereby performing the rough chamfering process of the short side 1 D at the same time. The lower corner ο is cut by the chamfer. Further, as long as the glass substrate 1〇 is not moved to the downstream side of the chamfering step, and the four sides are simultaneously processed at the same position, the length of the production line of the glass substrate 10 can be shortened, and the apparatus becomes inexpensive, but at the same time When the four sides of the glass substrate 10 are subjected to the chamfering process, it is necessary to arrange a plurality of cornering heads in a narrow space. Therefore, it is difficult to configure the apparatus. Further, although the chamfering processing can be performed on each side of the glass substrate 10, it is desirable to perform the chamfering processing on both sides as described above from the viewpoint of improving the beat. In addition, in Fig. 8 and (7), it is described that the grindstone 16 for cutting angle, the grindstone 12, 14 for roughing and chamfering, and the grindstone for finishing chamfering 18, 20 multiple grindstones 12 to 2 去 of the chamfering device, but is not limited to 0. That is, one roughing and cornering grindstone and one finishing chamfering grindstone can be used to chamfer one side of the glass substrate 10 machining. That is, it can also be applied to the system-de-angle rather than the segmentation. However, from the viewpoint of improving the beat, it is desirable to perform the division and chamfer as described above. Alternatively, it can be applied to a grindstone 16 provided only for chamfering, only a grindstone 12, 14 for roughing and chamfering, or only a grindstone for finishing chamfering 147492.doc 201105461 Μ 20 dehorning device. However, since the groove shape of the plurality of angle-removing grindstones 1 14 16' 18, 20 can be detected by the above-described laser displacement meter 30 (see FIG. 2: groove shape detecting means), the present invention is directed to the drawings. Ία and 1B are effective in combination with a plurality of grindstones. Fig. 2 is a system configuration diagram in which a chamfering device of the embodiment is added to the grindstone 12 (14) for roughing and chamfering. The system includes a laser displacement meter 3, a controller 32, a calculation unit (control unit) 34, and an operation unit 36, and is also commonly used for the grindstone 16 for chamfering and the grindstone for finishing chamfering 18, 2G° That is, the system is provided with K for the grindstone group on the long side 10B side and 1 a for the grindstone group on the long side 10A side in the chamfering device shown in Figs. 1A and 1B. w Ding ^ ^ Listen and have 1 α. Hereinafter, the characteristics of the present system will be described by taking the grindstone 12 (14) as an example, but the grindstones 16, 18, and 2 () are also the same. The first U12 is formed with a plurality of cylindrical grindstones of annular grooves 12, 12B, and 12C for exfoliating the end faces of the glass substrate 10 at specific intervals in the axial direction. Each of the grooves 12, ΐ2, and μ.. has the same shape, and is formed into a tapered shape which is wider toward the outer periphery of the grindstone 12. Further, the tapered faces of the grooves 12A, 12B, 12C, ... form a specific angle with the inner bottom surface of the grooves. Further, on the inner faces of the grooves 12A and 12B' nc, abrasive grains such as diamond abrasive grains are sintered at a high temperature. On the upper part of the grindstone 1 2, by the same i-straw, a flat plate-shaped convex (four) is fixed by a bolt (not shown). On the convex (four), the surface m is disposed along the central axis of the grindstone 12 Axis 40. The shaft 40 is detachably held by the oil level chuck 46 of the main shaft (rotation drive unit) 44, and the main shaft (rotation drive unit) 44 is rotatably supported by the grinding stone portion 42β, that is, the grindstone (2) is replaced. The time and dimension 147492.doc 201105461 is attached to and detached from the main shaft 44' via the hydraulic chuck 46, and the rotational driving force of the main shaft 44 is transmitted via the dust chuck 46, thereby rotating at a specific number of rotations. Furthermore, when the shaft 40 is mounted with respect to the axis of the hydraulic chuck 46, that is, when the grindstone 12'' is yawed, the state is measured by the post-displacement meter: the core yaw is measured, Therefore, at this time, before the corner is added, the manual deflection of the core is corrected by the operator. As described above, the main shaft 44 is supported by the grindstone portion 42 so as to be movable up and down by means of an unillustrated rattan raft, and is connected to the upper portion of the grindstone portion (the first moving portion) 48. The main shaft (not shown) moves up and down with respect to the grinding stone portion 42 with an accuracy of micrometers by the power of the motor 48. By this action, the grindstone moves up and down in the direction orthogonal to the plane of the glass substrate H), so that the grooves 12A, 12B, and 12C·.. of the grindstone 12 are not subjected to the accuracy of the prior position. Adjustment. It is supported by a rail (not shown) in the horizontal direction (4) freely (4), and a servo motor (second moving portion) 5 (the main (4)) is connected to the side portion thereof, and the power of the motor 50 is used to make the stone portion Micron: vertical = precision horizontal movement. With this action, the grindstone 12 moves horizontally in the direction of the glass base (four) 'so the level of the groove 2A, 12B, 12C... relative to the glass substrate end face = 2 The direction position is adjusted with the accuracy of micrometer single. About the grindstone 16, 18, 2g, the grinding stone part 42, the main shaft 44 · by the pressing chuck ', σ 匕 3 upper motor # MM#, · motor 48 and feeding clothes second The configuration of the system is described. The position and shape of the plurality of grooves 12A, 12B, 12C, which are detected by the detection surface of the laser displacement meter 3G and the grindstone 12, 147492.doc 201105461, will be detected. The information indicating the groove shape of the position information is output from the laser displacement meter 3 to the arithmetic unit 34 via the controller 32. The so-called position information shown here is the glass substrate 1 held by the chamfer plate 22 Position information in the direction orthogonal to the plane and the face of the glass substrate The position information is stored in the memory unit of the computing unit 34, and the reference groove shape of the design value of the grindstone 12 at the position where the grindstone 12 is attached to the reference position of the hydraulic chuck 46 of the main shaft 44 is stored ( The calculation unit 34 also controls the servo motor 48 via the operation unit based on the stored reference groove shape and the actual groove shape (including the position information) detected by the laser displacement meter %. And/or the servo motor 50 moves the grindstone 12 in the orthogonal direction and/or the surface direction. Further, a monitor that is not shown is connected to the nose portion 34, and the reference ditch is used in the monitoring. The groove shape is superimposed to display the actual groove shape. By observing the s-helium monitor, the positional deviation of the actual groove shape from the reference groove shape can be visually recognized and the monitor can be observed while the grindstone 12 is being corrected. The core yaw. That is, the new grindstone 12 is mounted on the oil pressure plate 46 of the main shaft 44 according to the present system. The groove i2A, 12B, 12C of the grindstone 12 is detected by the laser displacement meter 3〇. ._ location and shape, will pack The information indicating the groove shape including the position information is output to the calculation unit 34. In the memory unit of the calculation unit 34, as described above, the position of the reference position of the hydraulic chuck 46 attached to the spindle 4 4 is recalled. The reference groove shape of the design value of the grindstone 12 including the position information is calculated by the calculation unit 34 according to the reference groove shape and the actual groove measured by the laser displacement meter 3 147492.doc -12-201105461 The shape control servo motor 48 and/or the servo motor 5〇 move the grindstone 12 in the up and down direction and/or the horizontal direction to create the condition of the grindstone 12. Therefore, the degaussing device according to the embodiment is provided with direct detection. The grooved laser displacement meter 30 of the grindstone 12 can correct the height of the grindstone 12 with high precision and correct the core yaw of the grindstone 12, thereby detecting the life of the grindstone 12. The details will be described later. Therefore, the end face of the glass substrate 10 can be subjected to the chamfering process with high quality by the embodiment of the corner removing device. Specifically, the actual groove shape and the groove position which are calculated by the laser displacement piece 30 when the grinding unit is replaced, that is, the actual groove shown by the thin line of FIG. 3 a The positions of the shapes α and α are compared with the positions of the reference groove shapes β and P shown by the thick lines in Fig. 3A. Then, when the position of the actual groove shape α and α does not coincide with the positions of the reference groove shapes β and ρ in the vertical direction, the calculation unit 34 calculates the offset amount a. Then, the arithmetic unit 34 controls the servo motor 48' to move the grindstone 12 by a distance of only the offset amount a in the vertical direction (upward direction in Fig. 3A). Thereby, as shown in Fig. 3B, the actual groove shape α and the position coincide with the positions of the reference groove shapes β and β in the vertical direction. Therefore, the height of the grindstone 12 can be automatically and accurately corrected by the embodiment of the chamfering device. Since the height of the grindstone 12 is accurately corrected to a position that satisfies the product specifications, it is possible to prevent a product defect in which only one end portion of the end surface of the glass substrate becomes a mirror surface. Further, since the end face size of the glass substrate 1 is in conformity with the product specifications, the yield of the glass substrate 1 is improved. Further, the arithmetic unit 34 detects the actual groove shape and the groove position detected by the laser displacement meter 3 去 during the chamfering process, that is, the actual 147492.doc •13·201105461 groove shown by the thin line in FIG. The positions of the shapes α and α are compared with the positions of the reference groove shapes β and β shown by the thick lines in FIG. 4A, and the actual groove wear amount b is calculated, and the servo motor 50 is controlled to make the grindstone 12 in the horizontal direction (Fig. The left direction in 4A is moved upward to cancel the wear amount b, and the servo motor 5 is stopped at the offset position shown in Fig. 4B. Thereby, the grinding rate of the grindstone 12 (the shaving rate for the finishing grindstone is automatically fixed) can be automatically fixed by the chamfering device of the embodiment, so that the high-precision chamfering process can be performed. The outer dimensions of the substrate 1 are also substantially fixed. Further, in the calculation unit 34, as shown in FIG. 5, the life groove shape γ for determining the groove life is stored, and the actual groove shape detected by the laser displacement meter at the time of the chamfering process, that is, the map The actual groove shape & shown by the thin line of 5 is compared with the life groove shape γ shown by the thick line of Fig. 5. Then, when the actual groove shape α coincides with the life groove shape 7, the arithmetic unit 34 controls the servo motor 48 to move the grindstone 12 upward toward the Bugu cylinder U to use the grindstone 12 A groove (for example, groove 12Β). Zinc/丹hΙΖϋ) is wrong. The 'device' can automatically determine the groove 12Α, ι2β' 磨 of the grindstone 12, and can automatically set the groove from the end of life. " Calculate the next groove 12B. It is the role of this system. In the present system, when the equipment capacity is improved, the thickness of the glass substrate is increased by a thickness of less than 03 Å, and the end surface of the glass substrate is mirrored (for example, a value of j is 0.2 μm). The strict management form has become good. =, = the position of the groove and the position of the groove made by the laser displacement meter are 3 确, when the replacement of the heart 12 is carried out, but it can also be done every time a 147492.doc 201105461 glass substrate 1 This is done at the end of the corner machining and can also be carried out whenever the processing of the plurality of blocks is completed. The latter is preferred if productivity is considered. [Examples] Using a laser displacement meter, the calculation unit recognizes the regular height of the grindstone in the surface width specification of the end surface of the glass substrate, and intentionally inserts a predetermined value of the thin plate (shielding sheet) into the chamfering device' The height difference between the regular height of the grindstone and the actual grindstone height is generated, and after the height difference is automatically corrected, it is confirmed that the grindstone can be induced to a grindstone height within a face width specification. [Comparative example] After the grinding stone was replaced, the end surface of the glass substrate was subjected to chamfering, and after the surface width of the measuring table was confirmed, it was found that it was outside the specification, and the correction amount in the south direction of the grindstone was again input, and the chamfering was performed again. Processing to create conditions. As a result, there is also a case where a loss of a plurality of glass substrates occurs. The present application has been described in detail with reference to the specific embodiments thereof. It is understood that various changes and modifications may be made without departing from the spirit and scope of the invention. The present application is based on a patent application filed on Apr. 3, 2009 (the entire disclosure of Japanese Patent Application No. 2-9-091402), the content of which is incorporated herein by reference. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a chamfering device for a glass substrate of an embodiment. Fig. 1B is a plan view showing a chamfering device of a glass substrate of a form. Fig. 2 is a system configuration diagram of the chamfering device shown in Fig. 1. Fig. 3A is an explanatory view for explaining the height correction of the groove of the grindstone. 147492.doc •15- 201105461 Figure 3B is used to illustrate the height of the groove of the grindstone. Figure 4A is used to illustrate the wear amount correction of the groove of the grindstone. Figure 4B is used to illustrate the mold of the grindstone. Explanation of the correction of the groove of the milled summer [Description of the main components] Fig. 5 is an explanatory diagram for explaining the life determination of the groove of the grindstone. 10 Glass substrate 12 The first grindstone for roughing and chamfering 14 The second grindstone for roughing and chamfering 16 The grindstone for chamfering 18 The first grindstone for finishing chamfering 20 Finishing and chamfering 2nd grindstone 22 Dehorning platform 30 Laser displacement gauge 32 Controller 34 Calculation part 36 Operation part 38 Flange 40 Axis 42 Grinding stone part 44 Spindle 46 Hydraulic chuck 48 Servo motor 50 Servo motor 52 Spindle 147492.doc - 16 -