201103385 六、發明說明： 10-2009-0062095 號之201103385 VI. Description of the invention: 10-2009-0062095
本申請案主張韓國專利申請案 優先 出， 【發明所屬之技術領域】This application claims that the Korean patent application is preferred, [Technical field to which the invention pertains]
印刷電路板之製造方法。 【先前技術】 隨著電子工業之發展’對於更小及更高功能性的電子 部件之需求亦逐漸增加。特別是基於更輕、更薄、更短 小的個人行動裝置之市場趨勢造就了更薄的印刷電路 板。有別於習知方法的固定部件之方式已然興起。嵌入 式印刷電路板是一個實例，此電路板令，諸如1C之主動 元件或諸如MLCC電容器之被動元件固定於印刷電路板 内側，透過此等系統化結合，造成更高密度的元件以及 封裝本身改善的可靠度與表現。 本發明意圖解決諸如下述之問題，該等問題是由於在 製造部件嵌入式印刷電路板期間嵌入厚電子部件所引 發。 在相關技藝中，當具有200 μιη至1〇〇〇 μπι或更小之厚 201103385 度的電子部件（例如多層陶瓷電容器，MLCC)嵌入核心 板時，如第1圖所示，藉由核心板10(其中形成空腔14 及電路12 )中的附著層20而嵌入電子部件3〇，然後， 堆疊由以玻璃纖維44填充的樹脂42製成的絕緣體4〇以 改善該電路板的彎曲。然而，如第2圖所繪示在此實 例中，電子部件30變得更厚，環繞電子部件的空間及通 孔不會完全被絕緣體的樹脂42所填充。此產生電路板中 的空洞50並且造成可靠度不佳，因而需要改善。 為解決上述問題，如第3圖中所繪示，其建議一種使 用包括厚樹脂42’的絕緣體40,之方法，但此方法如第4 圖所繪示般會不如期望地增加印刷電路板的整體厚度。 【發明内容】 本發明提供一種嵌入電子部件的印刷電路板以及該印 刷電路板的製造方法；甚至於藉由使用薄絕緣體而執行 的且層製程中’该方法可防止電子部件周圍及電路圖案 之間出現因樹脂内容物降解所引發的空洞，並且解決電 子部件在疊層製程期間由填充絕緣體的背襯材料所造成 的電子部件變形之問題。 本發明之態樣提供一種嵌入電子部件之印刷電路板的 製艳方法’其包括：提供-核心，其具有-電路圖案 形成於其之—表面上，—空腔穿透該核心板；將一附著 層附著至該核心、板的_下表面，以致覆蓋該空腔；將一 201103385 電子部件配置於該附著層之一上表面，該上表面對應該 空腔；藉由堆疊一第一絕緣體於該核心板之一上表面上 以致該空腔被填滿而覆蓋該電路圖案，該第一絕緣體不 具有填充於其中的背襯材料；以及，堆疊一第二絕緣體 於該核心板的上侧及下側二者上，其中該第二絕緣體具 有填充於其中的一背襯材料。 本發明的另一態樣提供一種嵌入電子部件的印刷電路 板’其具有：-核心板，其具有—内層電路形成於其表 面上，且一空腔穿透該核心板；一電子部件，其嵌入於 該空腔H-絕緣體，其堆疊於該核心板的一上表 面上以填充戎空腔並且覆蓋該内層電路，且該第一絕 緣體不具有填充於其中的背襯材料；一第二絕緣體，其 堆疊於該核心板之上側與下側二者上，並且，該第二絕 緣體具有填充於其中的一背襯材料；以及一電路圖案， 其形成於該第二絕緣體上。 在此，該第一、絕緣體以及該第二絕緣體的档m是以相 同材料製成。 本發明之額外態樣以及優點部份將於其後的說明書中 提出’部份藉參考說明書而將顯而易見，或可藉由實行 本發明而習得。 【實施方式】 本發明容許各種更動及數種實施例，特定實施例將繪 201103385 示於圖式中，並且在繕寫的說明書中詳細描述。然而， 此非欲限制本發明於操作的特定模式，應認知到，本發 明涵蓋所有不背離本發明之精神與技術範疇的更動、等 效型式以及替代型式。 根據本發明之某實施例之製造嵌入電子部件的印刷電 路板的方法可藉由參考伴隨的圖式於後文獲得更詳細之 描述。在此給予該等相同或對應的部件相同的元件符號 (其非關圖式編號）’並且省略多餘的描述。 第5圖是一流程圖，其繪示根據本發明之實施例製造 一種嵌入電子部件之印刷電路板的方法，而第6圖至第 10圖顯示根據本發明之實施例製造—種嵌入電子部件之 印刷電路板的方法。 首先’如第6圖所繪示’備製一核心板i i 〇，其被空 腔114所穿透且具有形成於其上的内層電路112(S10)。 然後’附著層120附著至核心板11 〇的下表面以致覆蓋 該空腔114( S20)。例如敷銅層壓板（copper_elad laminate， CCL )可用做核心板11 〇，而玻璃纖維所填充的環氧樹脂 亦可用於增強剛性。内層電路丨12形成於核心板丨1〇的 表面上。 在敷銅層壓板用做核心板U 0的實例中，種晶層可藉 由無電電鑛的方式形成於敷銅層壓板的兩個表面上，以 形成内層電路112於該二表面上，且隨後電路圓案可藉 由電鍍的方式選擇性地形成。另一範例中，可藉由蝕刻 形成在敷銅層壓板之兩個表面上的一部分銅膜而形成内 201103385 層電路112。 空腔114形成於核心板no的某部份中（例如，中心 伤）。空腔114是電子部件14〇嵌入的空間’且可藉由 使用機械式鑽頭或雷射鑽頭形成。此處理過的空腔n4 之下側可由附著層1 20密封。 然後，電子部件140配置於附著層12〇之對應空腔114 的上表面上（S30，參考第6圖藉由以此方式配置電 子邛件140，電子部件14〇可附著並且固定至透過空腔 114而暴露的附著層〗2〇之上表面。 接著，不以背襯材料背襯的第一絕緣體13〇堆疊於核 〜板11〇的上表面以填充空腔114，因而内層圖案受覆蓋 (S40,參考第6圖與第7圖）。 因此，倘若平坦表面形成於核心板11〇的上部區域是 藉由將不以背襯材㈣襯的第—絕緣體nG (即底漆樹 月曰）堆疊於核心板110之上表面上（内層電路n2形成 於該核心板上），其不僅能使空腔U4的剩餘空間受第一 絕緣體130填充以致能固定電 疋电于邛件14〇，亦可使通孔 的内側也被第一絕緣體13 0填充。A method of manufacturing a printed circuit board. [Prior Art] With the development of the electronics industry, the demand for smaller and higher-functional electronic components has gradually increased. In particular, market trends based on lighter, thinner, and shorter personal mobile devices have resulted in thinner printed circuit boards. The way in which fixed parts differ from conventional methods has arisen. An embedded printed circuit board is an example that allows active components such as 1C or passive components such as MLCC capacitors to be attached to the inside of a printed circuit board. This systematic combination results in higher density components and improved package itself. Reliability and performance. The present invention is intended to solve problems such as those caused by embedding thick electronic components during the manufacture of components embedded in a printed circuit board. In the related art, when an electronic component (for example, a multilayer ceramic capacitor, MLCC) having a thickness of 200 μm to 1 〇〇〇 μm or less, such as a multilayer ceramic capacitor (MLCC), is embedded in a core board, as shown in FIG. 1, by the core board 10 The adhesive layer 20 (where the cavity 14 and the circuit 12 are formed) is embedded in the electronic component 3, and then the insulator 4 made of the resin 42 filled with the glass fiber 44 is stacked to improve the bending of the circuit board. However, as shown in Fig. 2, in this embodiment, the electronic component 30 becomes thicker, and the space surrounding the electronic component and the through hole are not completely filled with the resin 42 of the insulator. This creates voids 50 in the board and results in poor reliability and therefore needs improvement. In order to solve the above problem, as shown in FIG. 3, it proposes a method of using the insulator 40 including the thick resin 42', but this method may increase the printed circuit board as desired, as shown in FIG. Overall thickness. SUMMARY OF THE INVENTION The present invention provides a printed circuit board embedded in an electronic component and a method of manufacturing the printed circuit board; even in a layer process by using a thin insulator, the method prevents the periphery of the electronic component and the circuit pattern The void caused by the degradation of the resin content occurs, and the problem of deformation of the electronic component caused by the backing material filled with the insulator during the lamination process of the electronic component is solved. Aspects of the present invention provide a method of embossing a printed circuit board embedded in an electronic component, which includes: providing a core having a circuit pattern formed on a surface thereof, a cavity penetrating the core plate; An adhesion layer is attached to the lower surface of the core and the board so as to cover the cavity; an electronic component of 201103385 is disposed on an upper surface of the adhesion layer, the upper surface corresponding to the cavity; by stacking a first insulator The upper surface of one of the core plates is such that the cavity is filled to cover the circuit pattern, the first insulator does not have a backing material filled therein; and a second insulator is stacked on the upper side of the core plate and On both sides of the lower side, wherein the second insulator has a backing material filled therein. Another aspect of the present invention provides a printed circuit board embedded in an electronic component having: a core board having an inner layer circuit formed on a surface thereof and a cavity penetrating the core board; an electronic component embedded therein The cavity H-insulator is stacked on an upper surface of the core plate to fill the cavity and cover the inner layer circuit, and the first insulator does not have a backing material filled therein; a second insulator, It is stacked on both the upper side and the lower side of the core board, and the second insulator has a backing material filled therein; and a circuit pattern formed on the second insulator. Here, the first m, the insulator and the second m of the second insulator are made of the same material. Additional aspects and advantages of the invention will be set forth in the description which follows. [Embodiment] The present invention is susceptible to various modifications and several embodiments. The specific embodiments are shown in the drawings, and are described in detail in the written description. However, it is to be understood that the invention is not limited to the specific mode of operation of the present invention. It is to be understood that the invention encompasses all alternative, equivalent, and alternative embodiments without departing from the spirit and scope of the invention. A method of manufacturing a printed circuit board embedded in an electronic component according to an embodiment of the present invention can be described in more detail later by referring to the accompanying drawings. Here, the same or corresponding components are given the same component symbols (which are not schematic figures) and the redundant description is omitted. 5 is a flow chart showing a method of manufacturing a printed circuit board embedded in an electronic component according to an embodiment of the present invention, and FIGS. 6 to 10 are views showing an embedded electronic component manufactured according to an embodiment of the present invention. The method of printing a circuit board. First, as shown in Fig. 6, a core board i i 备 is prepared which is penetrated by the cavity 114 and has an inner layer circuit 112 formed thereon (S10). Then, the adhesion layer 120 is attached to the lower surface of the core plate 11 to cover the cavity 114 (S20). For example, a copper-clad laminate (CCL) can be used as the core plate 11 〇, and epoxy resin filled with glass fibers can also be used to enhance rigidity. The inner layer circuit 12 is formed on the surface of the core board 丨1〇. In the example in which the copper-clad laminate is used as the core plate U 0 , the seed layer may be formed on both surfaces of the copper-clad laminate by electroless plating to form the inner layer circuit 112 on the two surfaces, and The circuit case can then be selectively formed by electroplating. In another example, the inner 201103385 layer circuit 112 can be formed by etching a portion of the copper film formed on both surfaces of the copper clad laminate. The cavity 114 is formed in a portion of the core board no (e.g., a center injury). The cavity 114 is a space in which the electronic component 14 is embedded and can be formed by using a mechanical drill or a laser drill. The underside of this treated cavity n4 may be sealed by an adhesive layer 2020. Then, the electronic component 140 is disposed on the upper surface of the corresponding cavity 114 of the adhesion layer 12A (S30, by referring to FIG. 6 by configuring the electronic component 140 in this manner, the electronic component 14 can be attached and fixed to the transparent cavity 114. The exposed adhesion layer is 2 〇 the upper surface. Next, the first insulator 13 不 not backed by the backing material is stacked on the upper surface of the core-plate 11 以 to fill the cavity 114, and thus the inner layer pattern is covered ( S40, refer to FIGS. 6 and 7). Therefore, if the flat surface is formed in the upper region of the core plate 11〇, the first insulator nG (ie, the primer tree moon) which is not lining the backing material (four) Stacked on the upper surface of the core board 110 (the inner layer circuit n2 is formed on the core board), which not only enables the remaining space of the cavity U4 to be filled by the first insulator 130 so as to be able to fix the electric power to the element 14 The inner side of the through hole can also be filled with the first insulator 130.
形成於核心板11 〇才μL 之上表面上的内層電路112亦被身 一絕緣體130所覆蓋。再者 電子部件140的電名 )以面朝向上配置（即，倘若電子部件14 是^面朝上的方式嵌入）’電子部件14〇的電極（圖 示）亦可被樹脂覆蓋。 因此， 倘若在使用由背襯材料背襯以 増加結構剛性的 201103385 第二絕緣體150的疊層製妇批 製程執行之前，將不以額外背襯 材料背襯的第一絕緣體！ ^仏<e 瓶130堆疊於核心板110上，則所 有空腔114内側的剩餘咖p弓 、工間、通孔内側的空間、電路圖 案112之間的空間及電路 电塔圖案與電子部件140之電極之 間的空間都能被填充^ & ' 因此，甚至於以後續製程堆疊具 有低樹脂含4的第二絕緣體15〇的實例中，其容許空腔 W通孔電路圖案112之間的空間及電路圖案112與 電子部件140之電極（圖中未示）之間的空間中無空洞 形成。 接著’附著層120被移除（S50，參考第8圖）’然後 由彦襯材料154背襯的第二絕緣體15〇堆疊於核心板ιι〇 的上侧與下側二者上（S6〇，參考第9圖）。在此，第二 絕緣體150的樹脂可由相同於第一絕緣體13〇的材料製 成。即，可使用第二絕緣體丨5〇，其包括與第一絕緣體 13〇相同、用以填充空腔114與通孔的材料。藉由使用 此類相同材料的絕緣體，由第一絕緣體13〇及第二絕緣 體150的表面間熱膨脹係數差異所引發的彎曲的機會較 v ’因此提供第一絕緣體13〇及第二絕緣體15〇之間適 當的附著。此解決了層之間分層所引發的問題。 進一步言之，既然所有空腔丨丨4内側、通孔内側及電 路圖案112之間的空洞皆被第一絕緣體130所填充，則 在不可能產生空洞的情況下，可使用具有低樹脂含量的 薄的第二絕緣體，其造成更薄的印刷電路板。再者，第 ~絕緣體130可執行介於第二絕緣體150中所填充的背 9 201103385The inner layer circuit 112 formed on the upper surface of the core board 11 is also covered by the body insulator 130. Further, the electric name of the electronic component 140 is disposed so as to face up (i.e., if the electronic component 14 is face-up). The electrode (illustration) of the electronic component 14A can also be covered with a resin. Therefore, the first insulator that is not backed by the additional backing material will be used before the lamination process using the backing material backing to add structural rigidity to the 201103385 second insulator 150! ^仏<e bottle 130 is stacked on the core board 110, and the remaining inside of all the cavities 114, the space inside the working space, the inside of the through hole, the space between the circuit patterns 112, and the circuit tower pattern and electronic components The space between the electrodes of 140 can be filled with ^ & '. Therefore, even in the case of stacking the second insulator 15 having a low resin content 4 in a subsequent process, it allows the cavity W to pass between the via circuit patterns 112. There is no void in the space between the space and circuit pattern 112 and the electrode (not shown) of the electronic component 140. Then the 'adhesion layer 120 is removed (S50, refer to FIG. 8)' and then the second insulator 15 背 backed by the lining material 154 is stacked on both the upper side and the lower side of the core board ι (S6〇, reference Figure 9). Here, the resin of the second insulator 150 may be made of the same material as the first insulator 13A. That is, a second insulator 丨5〇 including the same material as the first insulator 13 用以 for filling the cavity 114 and the through hole can be used. By using such an insulator of the same material, the chance of bending caused by the difference in thermal expansion coefficient between the surfaces of the first insulator 13 and the second insulator 150 is higher than v 'thereby providing the first insulator 13 and the second insulator 15 Appropriate adhesion. This solves the problem caused by layering between layers. Further, since all the cavities inside the cavity 丨丨4, the inside of the via hole, and the cavity between the circuit patterns 112 are filled by the first insulator 130, it is possible to use a resin having a low resin content in the case where voids are impossible. A thin second insulator that results in a thinner printed circuit board. Furthermore, the first insulator 130 can be performed with the back filled in the second insulator 150.
然後，另一電路圖案162 表面（參考第10圖）。形成 上的電路圖案162可受阻焊 162形成於第二絕緣體15〇的上 形成於第二絕緣體150之上表面 阻焊160保護’如第1〇圖所示。 當然，倘若欲製造具有更多層的印刷電路板，額外的疊 層製程可以無需形成阻焊16〇的形式執行。 繪示於第10圖的是透過上述此類製程所製造的印刷 電路板。根據本發明之實施例的印刷電路板中，電子部 件140固定於形成在核心板11〇中的空腔ιΐ4之内側，Then, another circuit pattern 162 is surfaced (refer to Fig. 10). The formed circuit pattern 162 is formed by the solder resist 162 formed on the second insulator 15A and formed on the upper surface of the second insulator 150. The solder resist 160 is protected as shown in FIG. Of course, if a printed circuit board having more layers is to be fabricated, an additional lamination process can be performed without forming a solder mask. Illustrated in Fig. 10 is a printed circuit board manufactured by such a process as described above. In the printed circuit board according to the embodiment of the present invention, the electronic component 140 is fixed to the inside of the cavity ΐ4 formed in the core board 11〇,
不以背襯材料背襯）而受填充。第一絕緣體130亦覆 隨後’第二絕緣體150 (由背襯材料 154背襯）堆疊於核心板11〇(第一絕緣體堆疊於其 上）的上側及下側二者上，然後，電路圖案162形成於 第二絕緣體150上。 如上所述，因為第—絕緣體13〇及第二絕緣體15〇的 樹脂152皆由相同材料製成，由第一絕緣體13〇及第二 絕緣體150的表面間熱膨脹係數差異所引發的彎曲的機 會較少，因此提供第一絕緣體13〇及第二絕緣體15〇之 間適當的附著。 10 201103385 已藉參考特定實施例詳加描述本發明之精神，該等實 施例僅為說明目的，而不欲限制本發明。應認知到，熟 習此技藝者可不背離本發明之範疇與精神而變更或修改 本發明。 因此’在附加的申請專利範圍中’可查得上述以外的 許多實施例》 【圖式簡單說明】 第1圖至第4圖顯示根據相關技藝之製造一種嵌入電 子部件之印刷電路板的方法。 第5圖為一流程圖，其繪示根據本發明之實施例製造 一種嵌入電子部件之印刷電路板的方法。 第6圖至第圖顯示根據本發明之實施例製造一種嵌 入電子部件之印刷電路板的方法。 【主要元件符號說明】 44、44’玻璃纖維 50空洞 11 0核心板 Π2電路 114空腔 120附著層 1 3 0電子部件 10核心板 12電路 14空腔 20附著層 30電子部件 40絕緣體 42、42’樹脂 201103385 140第一絕緣體 150第二絕緣體 152樹脂 154背襯材料 160 阻焊 162電路圖案 S10-S50 步驟Not filled with backing material backing). The first insulator 130 is also overlaid with the 'second insulator 150 (backed by the backing material 154) on both the upper side and the lower side of the core board 11 (on which the first insulator is stacked), and then the circuit pattern 162 Formed on the second insulator 150. As described above, since the resin 152 of the first insulator 13 and the second insulator 15 is made of the same material, the chance of bending caused by the difference in thermal expansion coefficient between the surfaces of the first insulator 13 and the second insulator 150 is higher. Since it is small, proper adhesion between the first insulator 13A and the second insulator 15A is provided. 10 201103385 The spirit of the present invention has been described in detail with reference to the specific embodiments, which are intended to be illustrative only and not limiting. It will be appreciated that those skilled in the art can change or modify the invention without departing from the scope and spirit of the invention. Therefore, many embodiments other than the above can be found in the scope of the appended claims. [Schematic Description of the Drawings] Figs. 1 to 4 show a method of manufacturing a printed circuit board in which an electronic component is embedded according to the related art. Figure 5 is a flow chart illustrating a method of fabricating a printed circuit board embedded in an electronic component in accordance with an embodiment of the present invention. Fig. 6 through Fig. 6 show a method of manufacturing a printed circuit board embedded in an electronic component according to an embodiment of the present invention. [Main component symbol description] 44, 44' fiberglass 50 cavity 11 0 core plate Π 2 circuit 114 cavity 120 adhesion layer 1 3 0 electronic component 10 core plate 12 circuit 14 cavity 20 adhesion layer 30 electronic component 40 insulator 42, 42 'Resin 201103385 140 First Insulator 150 Second Insulator 152 Resin 154 Backing Material 160 Solder Mask 162 Circuit Pattern S10-S50 Step