201029075 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種封襞結構的製造方法，且特別 是有關於一種半導體元件之封裝結構的製造方法。 【先前技術】 ，半導體之封裝結構的製程中，晶片在與基板電性連 接後，以一封膠密封晶片與基板，以成為_封裝體。然 •後再對該封裝體進行切割動作，以將封裝艘切割成為多 顆封裝結構。 習知的切割方法中，係將封裝體固定（mount)於膠 帶（，pe) ’例如是紫外光型的膠帶上後，再切割封裝體 成為/夕顆封褒結構。切割完成後，貼附於膠帶上的封裝 、"構^再照射紫外光，才能對封裝結構進行抓取（pick) 及收料（place)動作，以利後續的出貨流程。 然而，上述習知的切割方法，具有多項缺點，以下 鲁係舉部分缺點進行說明。 第―、在將封裝體貼附至膠帶前，須以人工方式， ，地將膠帶黏貼至_框架上’此係相當耗時且衍生人 力成太。 第二 上 , 由於需以人工方式手動地黏貼膠帶至框架 ^此種切割方法會受到人為緩慢動作的限制而降低 產能或限制產能的提升空間。 、封裝結構在切割完成後，須再以紫外光照射 ’因此衍生了紫外光設備的新購成本及維護成 3 201029075 本，並且紫外光设備亦需額外佔用場地空間。 第四、從黏貼膠帶至框架、切割、照射紫外光到收 料至少需要三台機台。分別是以_機台、紫外光照 射機台及用以對封裝結構進;^抓取並收料的機台。諸多 的機台係相當佔用場地空間且相當消耗成本。 【發明内容】 根據本發明之封裝結構之製造方法，可快速地將封 裝體切割成多個封裝結構。由於不需要習知技術中的朦 帶’所以省去人工手動貼附膠帶的成本及工時，並且連 同紫外光設備的成本也可省去，大幅降低了總體成本。 根據本發明之-方面，提出—種封裝結構之製造方 法。製造方法包括以τ步驟H基板。提供數個晶 片電ί±連接晶片與基板。以一封勝密封晶片，以使晶 片與基板形成一封装體。設置封裝體至一真空吸力平 台，以使封裝體受真空吸力平台之一真空吸力的吸附而 固定於真空吸力平台上。其t真空吸力平台之内部具有 數個吸氣道’該些吸氣道的位置對應至該些晶片的位 置。以及’沿著—蝴路购賊裝體，蝴路徑經過 該些吸氣道中相鄰二者之間。。 根據本發明之另—方面，提出—種封裝結構之製造 方法。製造方法包括以下步驟。提供一封装體。設置封 裝體至一真空吸力平台，以使封裝體受真空吸力平台之 一真空吸力的吸附而固定於真空吸力平台上。其中&空 吸力平台之内部具有數個吸氣道，該些吸氣道的位置對 201029075 應至該些晶片的位置。以及，沿著一切割路徑切割封裝 體，切割路徑經過該些吸氣道中相鄰二者之間。 為讓本發明之上述内容能更明顯易懂，下文特舉一 較佳實施例’並配合所附圖式’作詳細說明如下： 【實施方式】 本發明之封裝結構之製造方法，係利用真空吸力吸 附住封裝體後，再對封裝體進行切割，以使封裝體成為 •多個封裝結構。相較於習知技術’由於本方法不需要膠 帶，所以省去人工手動貼附膠帶的成本及工時 ，並且連 同紫外光設備的成本也可省去，大幅降低了總體成本。 以下係舉出較佳實施例做詳細說明，然此實施例僅 為本發明之發_神下關種實施方式，其說明之文字 與圖示並不會對本發明之欲保護範圍進行限縮。 4參照第1圖’其♦不依照本發明較佳實施例之封 裝結構的製造方法流程圖。封裝結構㈣造方法包括以 φ 下流程。 首先，於步驟麗中，提供-基板202。請同時參 照第2圖，其綠示第！圖之步驟sl〇2中所提供之基板示 意圖。 接著，於步驟S104中，提供數個晶片2〇4。請同時 參照第3圖，其綠示第2圖之基板及晶片之示意圖。晶 片204為一覆晶式晶片，其上具有數個第二導電部2〇8, 例如是錫球（Solder ball)，用以電性連接晶片2〇4與 基板202。 ' 5 201029075 i wjzjnr/v 再來’於步驟SI06中，設置晶片204至基板202之 一第一表面206上，並於步驟S108中，以晶片204上的 第二導電部208來電性連接晶片204與基板202。如第4 圖所不’其緣示第3圖之晶片與基板電性連接之示意圖。 然後，於步驟S110中，以一封膠210密封晶片204 與第一導電部2〇8，以使基板202、晶片204及第二導電 部208成為一封裝體212。如第5圖所示，其繪示第4圖 之晶片與第二導電部受密封之示意圖。 然後，於步驟S112中，形成數個第一導電部214於 ❹ 基板202之一第二表面216上。如第6圖所示’其繪·示 第5圖之基板上設置有第一導電部之示意圖。第一導電 部214例如是錫球（Solder ball)。 然後，請同時參照第7圖，其繪示固定住第6圖之 封裝體的示意圖。於步驟S114中，以一真空吸力pi吸 附住封裝體212，以固定住封装體212。在本步驟中，係 將封裝體212設置於一真空吸力平台218，以使封裝體 212受真空吸力平台218之真空吸力F1的吸附而固定於 參 真空吸力平台218上。如此’在後續的切割步驟中，被 切割完成的封裝體212才不會脫離真空吸力平台218。其 中，真空吸力F1的負壓值可為-70kpa或其它數值。然只 要是能夠穩固地吸附住封裝體212的真空吸力F1，其負 壓值可為任意數值’並不受本實施例的限制。 較佳但非限定地’真空吸力平台218包括一軟質元 件（未繪示），其材質例如是橡膠材料。軟質元件用以當 封裝體212固定於真空吸力平台218上時，與封裝體212 6 201029075 接觸。如此，可降低或避免真空吸力平台218上的封裝 體2i2因為封膠210與真空吸力平台218的接觸所可能 造成的磨損。 此外，在將封裝體212設置於真空吸力平台218之201029075 VI. Description of the Invention: [Technical Field] The present invention relates to a method of manufacturing a sealing structure, and more particularly to a method of manufacturing a package structure of a semiconductor element. [Prior Art] In the process of packaging a semiconductor, after the wafer is electrically connected to the substrate, the wafer and the substrate are sealed with a glue to form a package. Then, the package is cut to cut the package into a plurality of package structures. In the conventional cutting method, the package is mounted on a tape (pe), for example, on an ultraviolet-type tape, and then the package is cut into a package structure. After the cutting is completed, the package attached to the tape, "construction ^ and then ultraviolet light, in order to pick and place the package structure, in order to facilitate the subsequent shipping process. However, the above conventional cutting method has a number of disadvantages, and the following disadvantages are explained. First, before attaching the package to the tape, the tape must be manually attached to the frame. This is quite time consuming and deriving. Second, because the tape needs to be manually applied to the frame manually. This cutting method can be limited by artificial slow movements to reduce productivity or limit productivity. After the cutting is completed, the package structure must be irradiated with ultraviolet light. Therefore, the new cost of the ultraviolet light device is derived and maintained as 3 201029075, and the ultraviolet light device also needs to occupy additional space. Fourth, at least three machines are required from the adhesive tape to the frame, cutting, and irradiating the ultraviolet light to the receiving material. They are _machine, UV illuminator, and machine for picking up and receiving materials. Many machine systems take up considerable space and are quite costly. SUMMARY OF THE INVENTION According to the manufacturing method of the package structure of the present invention, the package body can be quickly cut into a plurality of package structures. Since the 朦 tape in the prior art is not required, the cost and labor of manual manual tape attachment are eliminated, and the cost of the ultraviolet light device can be eliminated, which greatly reduces the overall cost. According to an aspect of the invention, a method of manufacturing a package structure is proposed. The manufacturing method includes a step H substrate in τ. Several wafers are provided to connect the wafer to the substrate. The wafer is sealed with a win to form a package with the substrate. The package is placed to a vacuum suction platform so that the package is fixed to the vacuum suction platform by vacuum suction of one of the vacuum suction platforms. The interior of the t vacuum suction platform has a plurality of inspiratory passages. The positions of the inhalation passages correspond to the positions of the wafers. And the thief body is purchased along the butterfly road, and the path of the butterfly passes between the adjacent ones of the suction channels. . According to another aspect of the present invention, a method of manufacturing a package structure is proposed. The manufacturing method includes the following steps. A package is provided. The package body is arranged to a vacuum suction platform so that the package body is fixed to the vacuum suction platform by the vacuum suction of the vacuum suction platform. The & empty suction platform has a number of inhalation channels inside, and the positions of the inhalation channels are to the position of the wafers for 201029075. And cutting the package along a cutting path through which the cutting path passes between adjacent ones of the inhalation channels. In order to make the above-mentioned contents of the present invention more comprehensible, a preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings: [Embodiment] The manufacturing method of the package structure of the present invention utilizes vacuum After the suction is sucked on the package, the package is cut to make the package a plurality of package structures. Compared with the prior art, since the method does not require a tape, the cost and labor of manual manual tape attachment are eliminated, and the cost of the ultraviolet light device can be eliminated, which greatly reduces the overall cost. The preferred embodiments are described in detail below. However, the embodiments are merely examples of the invention, and the description and the illustrations are not intended to limit the scope of the invention. 4 is a flow chart showing a method of manufacturing a package structure which is not in accordance with a preferred embodiment of the present invention. The package structure (4) method includes the process under φ. First, in step Li, a substrate 202 is provided. Please also refer to Figure 2, which is green! The substrate schematic provided in step sl1 of the figure. Next, in step S104, a plurality of wafers 2〇4 are provided. Please refer to Fig. 3 at the same time, which shows the schematic diagram of the substrate and the wafer of Fig. 2 in green. The wafer 204 is a flip chip having a plurality of second conductive portions 2, 8 such as solder balls for electrically connecting the wafers 2 and 4 to the substrate 202. '5 201029075 i wjzjnr/v again, in step SI06, the wafer 204 is disposed on one of the first surfaces 206 of the substrate 202, and in step S108, the wafer 204 is electrically connected to the second conductive portion 208 on the wafer 204. And the substrate 202. FIG. 4 is a schematic view showing the electrical connection between the wafer and the substrate in FIG. Then, in step S110, the wafer 204 and the first conductive portion 2〇8 are sealed with a glue 210 so that the substrate 202, the wafer 204, and the second conductive portion 208 become a package 212. As shown in Fig. 5, it is a schematic view showing that the wafer and the second conductive portion of Fig. 4 are sealed. Then, in step S112, a plurality of first conductive portions 214 are formed on one of the second surfaces 216 of the substrate 202. As shown in Fig. 6, a schematic view of the substrate shown in Fig. 5 is provided with a first conductive portion. The first conductive portion 214 is, for example, a solder ball. Then, please refer to Fig. 7 at the same time, which shows a schematic diagram of the package holding the figure of Fig. 6. In step S114, the package body 212 is attracted by a vacuum suction force pi to fix the package body 212. In this step, the package body 212 is disposed on a vacuum suction platform 218 to fix the package body 212 to the vacuum suction platform 218 by the suction of the vacuum suction force F1 of the vacuum suction platform 218. Thus, in the subsequent cutting step, the package 212 that has been cut is not detached from the vacuum suction platform 218. Among them, the vacuum suction force F1 may have a negative pressure value of -70 kPa or other values. However, as long as the vacuum suction force F1 of the package body 212 can be firmly sucked, the negative pressure value can be any value ' and is not limited by the embodiment. Preferably, but not limited to, the vacuum suction platform 218 includes a flexible member (not shown) made of, for example, a rubber material. The soft component is used to contact the package 2206 201029075 when the package 212 is secured to the vacuum suction platform 218. As such, the wear of the package 2i2 on the vacuum suction platform 218 due to contact of the sealant 210 with the vacuum suction platform 218 can be reduced or avoided. In addition, the package body 212 is disposed on the vacuum suction platform 218.
刖，可倒置（reverse)封裝體212，使封裝體212的封 膠210面對真空吸力平台218。如此，真空吸力平台218 吸附到的是封裝體212的封膠210。封膠21〇的外表面並 無其它功能性結構，故以吸附住封膠21〇的方式來固定 住封裝體212的方式並不會破壞封裝體gig上具有電子 電路功能的結構，例如是第一導電部214。 此外，雖然本實施例係以倒置封裴體212為例作說 明，然亦可在不用倒置封裝體212的情況下將封裝體212 固定於真空吸力平台。舉例來說，請參照第8圖，其繪 示本發明之另一實施例的真空吸力平台示意圖。該另一 實施例的真空吸力平台224可在封裝體212不倒置的情 況下吸附住第6圖之封裝體212的封膠21〇。更進一步地 說，只要適當地改修真空吸力平台218 (真空吸力平台 不於第7圖），即可使其成為可將封裝體212往真 方向吸附的真心及力平台224。只需對封裝 真空吸力平j苹的平移動作，就能將封裝體212移動至 212的上方:/24 ’真空吸力平台224可直接從封裝體 及附住封裝體212。 此外，试 的真空吸力：A照第9圖’其繪示本發明之再—實施例 需平移封裝於台示意圖°真空吸力平台230的設計使僅 212至真空吸力平台23〇’在不需要倒置封 7 201029075 i 裝體2_情況下’真空吸力平台23〇仍 體212。真空吸力平台230之内部可具有數個吸氣道 232。吸氣道232與一真㈣（未繪示）相通並於真空吸 力平台230的機台表面234露出數個開口咖 娜 的位置對應至晶片204的位置且開σ細 口部214的排列範圍，以將對應之該些 第-導電#214各納至吸氣道咖内。由 都對應至-侧口 236’故確保㈣後 = ^地被㈣在真空吸力平台咖上，以待後續製程的 請同時參照第10圖，其繪千 网丹臀不切割本發明之封裝體的 示意圖。然後，於步驟S116中，對笛7 以-切割刀具s，例如㈣^對第7圖之封裝體212’ …Pw」 (Saw)從相鄰的二吸氣道 220之間切割封裝體212為數個封I結構2〇〇。至此，完 成本實施例之封裝結構2〇〇。其中， 半導體結構。 Μ，封裝結構綱例如是 由於封裝體212受到真空吸力平台218的真空吸力 F1吸附的關係’在切割過程中’被切割完成的封裝結構 200並不會脫離真空吸力平台218或_出去 ，而是緊緊 地被吸附在真空吸力平台218上，以待後續餘的處理。 此外’真工吸力平台218之内部可具有數個吸氣道 220。吸氣道220與“真空源相通並於真空吸力平台218 的機台表面228露出數個開σ概。開口㈣的位置對應 至晶片204的位置。也就是說，每個晶片綱都對應至 -個開口 222,以確保每個封裝結構減切割完成 後，穩固地被吸附在真空吸力平台218上，以待後續製 程的處理。 如第10圖所示’真空吸力平台218更具有凹槽226。 凹槽226設置於該些吸氣遒220中相鄰二者之間’用以 讓切割刀具S通過，以讓切割刀具s徹底地將兩個封裝 結構200切割分離。 請參照第Π圖，其繪示沿著第丨〇圖之方向 VI觀看 到的封裝體示意圖。在切割過程中，沿著第一切割路徑 φ P1及第二切割路徑P2切割封装體212,第一切割路徑P1 及第二切割路徑P2皆經過該些晶片2()4中相鄰二者之間 '的位置。在切割步驟S116中，可只使用一把切割刀具， 沿著第一切割路徑P1及第二切割路徑P2切割封裴體 212。或者’亦可使用多把切割刀具，分別沿著第一切割 路徑P1及第二切割路徑P2切割封裝體212。或者，亦可 使用多把切割刀具，先一起沿著第一切割路徑？1切割封 裝體212完成後，再一起沿著第二切割路徑p2繼續切割 ❹封裝體212。本實施例並無限制用於切割封裝體212之切 割刀具S的數量、對封裝體212的切割順序及切割方式。 可視對產能、製程設備或其它要求，來決定切割刀具s 的數量、對封裝體212的切割順序及切割方式。 本實施例之封裝結構的製造方法，在切'割步驟中並 不需要如習知技術的膠帶’因此省去人卫手動貼附膠帶 工時。此外，由於係採用真空吸力固定封裝結構的設計， 故除了省去習知技術中以膠帶固定封裝體的動作及以紫 外光照射封裝結構的動作外，還可把對封裝體的切割動 9 201029075Alternatively, the package 212 can be reversed such that the encapsulant 210 of the package 212 faces the vacuum suction platform 218. Thus, the vacuum suction platform 218 is adsorbed to the sealant 210 of the package 212. The outer surface of the sealant 21 has no other functional structure, so the manner of fixing the package 212 by adsorbing the sealant 21〇 does not damage the structure having the electronic circuit function on the package gig, for example, A conductive portion 214. In addition, although the embodiment is described by taking the inverted package body 212 as an example, the package body 212 can be fixed to the vacuum suction platform without the inverted package body 212. For example, please refer to Fig. 8, which is a schematic view of a vacuum suction platform according to another embodiment of the present invention. The vacuum suction platform 224 of the other embodiment can adsorb the sealant 21 of the package 212 of Fig. 6 without the package 212 being inverted. Furthermore, as long as the vacuum suction platform 218 is properly modified (the vacuum suction platform is not in Fig. 7), it can be made into a true force platform 224 that can adsorb the package 212 in the true direction. The package 212 can be moved over the 212 only by the translational action of the package vacuum: the /24' vacuum suction platform 224 can be directly attached from the package and to the package 212. In addition, the vacuum suction of the test: A according to FIG. 9 'which shows the re-embodiment of the invention - the embodiment needs to be translated and packaged on the table. The vacuum suction platform 230 is designed so that only 212 to the vacuum suction platform 23 〇 ' does not need to be inverted Seal 7 201029075 i In the case of the 2_ case, the vacuum suction platform 23 is still 212. The interior of the vacuum suction platform 230 can have a plurality of suction passages 232. The position of the inhalation channel 232 communicating with a true (four) (not shown) and exposing the plurality of openings on the machine surface 234 of the vacuum suction platform 230 corresponds to the position of the wafer 204 and the arrangement of the σ thin mouth portion 214 is The corresponding first-conducting #214 are each included in the inhalation coffee bean. Since all correspond to the - side port 236', it is ensured that (4) after = ^ ground cover (four) on the vacuum suction platform coffee, for the subsequent process, please refer to the same figure 10, which does not cut the package of the invention Schematic diagram. Then, in step S116, the package cutter 212 is cut from the adjacent two suction passages 220 by the -cutting tool s, for example, (four)^to the package 212' of the Fig. 7 (Paw) (Saw). The structure of the I structure is 2〇〇. So far, the package structure of the cost embodiment is completed. Among them, the semiconductor structure. That is, the package structure is, for example, because the package body 212 is attracted by the vacuum suction force F1 of the vacuum suction platform 218. The package structure 200 that is cut during the cutting process is not separated from the vacuum suction platform 218 or _, but It is tightly adsorbed on the vacuum suction platform 218 for subsequent processing. In addition, the interior of the 'sports suction platform 218 may have a plurality of inhalation passages 220. The suction passage 220 communicates with the "vacuum source and exposes a plurality of open σ on the machine surface 228 of the vacuum suction platform 218. The position of the opening (4) corresponds to the position of the wafer 204. That is, each wafer corresponds to - An opening 222 is provided to ensure that each package structure is firmly adsorbed on the vacuum suction platform 218 after the cutting is completed, for subsequent processing. As shown in FIG. 10, the vacuum suction platform 218 further has a recess 226. A groove 226 is disposed between the adjacent ones of the suction ports 220 for allowing the cutting tool S to pass, so that the cutting tool s thoroughly cuts and separates the two package structures 200. Referring to the figure, A schematic diagram of the package viewed along the direction VI of the second diagram is shown. During the cutting process, the package 212 is cut along the first cutting path φ P1 and the second cutting path P2, and the first cutting path P1 and the second The cutting path P2 passes through the position between the adjacent ones of the wafers 2 () 4. In the cutting step S116, only one cutting tool can be used along the first cutting path P1 and the second cutting path P2. Cutting the sealing body 212. Or 'may also make The package body 212 is cut along the first cutting path P1 and the second cutting path P2 by using a plurality of cutting tools. Alternatively, a plurality of cutting tools may be used to first complete the package 212 along the first cutting path? Thereafter, the ❹ package 212 is further cut along the second cutting path p2. This embodiment does not limit the number of cutting knives S for cutting the package 212, the cutting order of the package 212, and the cutting method. The capacity, process equipment or other requirements determine the number of cutting tools s, the cutting order of the package 212, and the cutting method. The manufacturing method of the package structure of this embodiment does not require a conventional technique in the cutting step. The tape's therefore eliminates the need for manual tape attachment time. In addition, due to the vacuum suction to fix the package structure, the tape is used to fix the package and the ultraviolet light is used to illuminate the package structure. In addition to the action, the cutting of the package can also be moved 9 201029075
TW5254FA 作、對封裝結構200的抓取及收料動作整合至同一機台， 該同一機台例如是一包含有真空吸力平台218或224的 機台°如此，可便節省不少設備的新購及維護成本。此 外’在切割封裝體212的過程中並不需要人工的介入， 此對於建置全自動化生產線具有相當大的幫助。因此， 本實施例之封裝結構2〇〇的製造方法可縮短作業工時及 降低對人力的需求，相當適合量產且可使產能大幅地提 南0 此外，雖然本實施例之晶片204係以覆晶式晶片為 例作說明，然於其它實施態樣中，晶片204也可以是非 覆晶式晶片。舉例來說，晶片204可以具有數個銲墊（未 繪示），以數條銲線（未繪示）電性連接晶片2〇4上的銲 墊與基板202。當然，封膠210可對銲線加以密封，以使 銲墊受到封膠210保護。 本發明上述實施例所揭露之封裝結構之製造方法， 具有多項優點，以下僅列舉部分優點說明如下： 第一、封裝結構之製造方法的切割步驟中並不需要 如習知技術的膠帶，因此省去人工手動貼附膠帶的作業 工時、人力成本及膠帶成本。 、 第二、封裝結構之切割步驟係可以一台機台，例如 是一包含有真空吸力平台218或224的機台來完成。且 切割封裝體的過程中不需要人工的介入，故具有建置全 自動化生產線的優勢。因此，本發明之封裝結構的製造 方法相當適合量產且可使產能大幅提高。 第三、上述實施例之封裝結構之製造方法除了省去 201029075 M. t 9 t Λ Λ Μ- 習知技術中以膠帶固定封裝體的動作及以紫外光照射封 裝結構的動作外，還可將對封裝體的切割動作、對封裝 結構200的抓取及收料動作整合至同一機台，例如是— 包含有真空吸力平台218或224的機台。如此，便節省 不少設備的新購及維護成本。 綜上所述’雖然本發明已以一較佳實施例揭露如 上，然其並非用以限定本發明。本發明所屬技術領域中 具有通常知識者，在不脫離本發明之精神和範圍内，當 • 可作各種之更動與潤飾。因此，本發明之保護範圍當視 後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖繪示依照本發明較佳實施例之封裝結構的製 造方法流程圖。 第2圖緣示第1圖之步驟幻〇2中所提供之基板示意 圖。 第3圖繪示第2圖之基板及晶片之示意圖。 第4圖綠示第3圖之晶片與基板電性連接之示意圖。 第5圖％示第4圖之晶片與第二導電部被密封之示 意圖。 第6圖缯·示第5圖之基板上設置有第一導電部之示 意圖。 第7圖繪示固定第6圖之封裝體的示意圖。 第8圖繪示本發明之另一實施例的真空吸力平台示 意圖。 第9圖繪示本發明之再一實施例的真空吸力平台示 201029075 i 意圖。 第ίο圖繪示切割本發明之封裝體的示意圖。 第11圖繪示沿著第10圖之方向VI觀看到的封裝體 示意圖。 【主要元件符號說明】 200 ： 封裝結構 202 ： 基板 204 ： 晶片 206 ： 第一表面 208 ： 第二導電部 210 ： 封膠 212 ： 封裝體 214 ： 第一導電部 216 ： 第二表面 218、224、230 :真空吸力平台 220、232 :吸氣道 222、236 :開口 ❿ 226 :凹槽 228、234 :機台表面 FI、F2 :真空吸力 P1 第一切割路徑 P2 第二切割路徑 VI 方向 S :切割刀具 S102—S116 :步驟 12The TW5254FA is used to integrate the picking and receiving operations of the package structure 200 to the same machine. The same machine is, for example, a machine including a vacuum suction platform 218 or 224. This saves a lot of new equipment purchases. And maintenance costs. In addition, no manual intervention is required in the process of cutting the package 212, which is of great help in building a fully automated production line. Therefore, the manufacturing method of the package structure 2 of the embodiment can shorten the working time and reduce the labor demand, and is quite suitable for mass production and can greatly increase the capacity. Further, although the wafer 204 of the embodiment is The flip-chip wafer is taken as an example, but in other embodiments, the wafer 204 may also be a non-over-clad wafer. For example, the wafer 204 may have a plurality of pads (not shown) electrically connected to the pads on the wafer 2〇4 and the substrate 202 by a plurality of bonding wires (not shown). Of course, the sealant 210 seals the bond wire so that the pad is protected by the sealant 210. The manufacturing method of the package structure disclosed in the above embodiments of the present invention has a plurality of advantages. The following only some of the advantages are described as follows: First, the cutting step of the manufacturing method of the package structure does not require a tape as in the prior art, thus saving The labor, labor cost and tape cost of manual tape attachment. Second, the cutting step of the package structure can be performed by a machine, such as a machine including a vacuum suction platform 218 or 224. Moreover, there is no need for manual intervention in the process of cutting the package, so it has the advantage of building a fully automated production line. Therefore, the manufacturing method of the package structure of the present invention is quite suitable for mass production and can greatly increase the productivity. Thirdly, in the manufacturing method of the package structure of the above embodiment, in addition to the action of fixing the package by tape and the action of irradiating the package structure with ultraviolet light in the conventional technology of 201029075 M. t 9 t Λ Λ Μ - The cutting action of the package, the grasping and receiving operations of the package structure 200 are integrated into the same machine, for example, a machine including a vacuum suction platform 218 or 224. This saves a lot of new equipment purchase and maintenance costs. The invention has been described in terms of a preferred embodiment, and is not intended to limit the invention. Those skilled in the art having the knowledge of the present invention can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow chart showing a method of fabricating a package structure in accordance with a preferred embodiment of the present invention. Fig. 2 is a schematic view of the substrate provided in the illusion 2 of the first drawing. FIG. 3 is a schematic view showing the substrate and the wafer of FIG. 2. Fig. 4 is a schematic view showing the electrical connection between the wafer and the substrate in Fig. 3 green. Fig. 5 is a view showing the wafer and the second conductive portion of Fig. 4 being sealed. Fig. 6 is a view showing the arrangement of the first conductive portion on the substrate of Fig. 5. FIG. 7 is a schematic view showing the package of FIG. 6 fixed. Fig. 8 is a view showing a vacuum suction platform of another embodiment of the present invention. FIG. 9 is a view showing a vacuum suction platform according to still another embodiment of the present invention. Fig. guq is a schematic view showing the cutting of the package of the present invention. Fig. 11 is a view showing the package viewed along the direction VI of Fig. 10. [Main component symbol description] 200: package structure 202: substrate 204: wafer 206: first surface 208: second conductive portion 210: encapsulant 212: package body 214: first conductive portion 216: second surface 218, 224, 230: vacuum suction platform 220, 232: suction passage 222, 236: opening 226 226: groove 228, 234: machine table surface FI, F2: vacuum suction P1 first cutting path P2 second cutting path VI direction S: cutting Tool S102-S116: Step 12