JP2013198944A - Dicing apparatus and dicing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a package from being damaged by an end material of dicing, when diced with a terminal surface facing down.SOLUTION: A dicing apparatus is provided for cutting out an individual package, while placing a substrate 30 on a cutting table 10 with a connection terminal 33 directing downward, the substrate with a plurality of resin sealed semiconductor chips mounted thereon and having the connection terminal 33 for each semiconductor chip, wherein the cutting table 10 has a package holding table 11 for holding the individual package to be cut out and an end material holding column 14 for holding the end material produced by the cutting.

Description

  Embodiments described herein relate generally to a dicing apparatus and a dicing method used for manufacturing a semiconductor device.

  In a dicing apparatus for cutting out individual packages from a substrate on which a plurality of semiconductor chips are mounted, the substrate is placed on a cut table having a groove in the dicing area with the terminal surface facing upward, and the substrate is mounted with a blade. I try to cut it. In this apparatus, in order to efficiently remove offcuts and cutting waste generated by dicing, a large groove having a width wider than that between adjacent packages is formed in the cut table.

  On the other hand, in recent years, due to various requirements for semiconductor packages, there are cases where dicing is necessary with the terminal surface facing down. However, when dicing with the terminal surface facing down, the end material due to dicing falls into the groove, which may contact the terminals of the package and damage the package.

JP 2011-66114 A

  The problem to be solved by the invention is to provide a dicing apparatus and a dicing method capable of preventing the end material caused by dicing from damaging the package even when dicing with the terminal surface facing downward.

  In the dicing apparatus according to the embodiment, a plurality of resin-sealed semiconductor chips are mounted, and a substrate having a connection terminal for each semiconductor chip is placed in an individual package in a state where the connection terminal is placed on a cut table. It is configured to cut out. The cut table includes a package holding table that holds the individual packages to be cut out, and end material holding columns that hold the end materials generated by the cutting.

The side view which shows the basic composition of the dicing apparatus concerning 1st Embodiment. The perspective view which shows the structure of the cut table used for the dicing apparatus of FIG. Process sectional drawing for demonstrating the dicing method concerning 1st Embodiment. The schematic diagram for demonstrating the reason for dicing in two places of a dicing area | region. The side view which shows the relationship between the width | variety and the clearance of the end material in the 1st Embodiment, and an end material holding | maintenance pillar. The side view which shows the structure of the cut table used for the dicing apparatus concerning 2nd Embodiment. Sectional drawing which shows the specific structure of the package holding stand and end material holding column which were used for 2nd Embodiment.

  Hereinafter, a dicing apparatus and a dicing method of an embodiment will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a side view showing a basic configuration of a dicing apparatus according to the first embodiment.

  This apparatus has a jig (cut table) 10 for placing and adsorbing a resin-sealed substrate and a blade 20 for cutting the substrate.

  The cut table 10 is formed of an elastic member such as rubber and is used by being set on a flat metal stage (not shown). On the cut table 10, a package holder 11 for holding individual packages cut out by dicing is provided, and a wide groove portion 12 is formed in the other dicing area. As shown in the perspective view of FIG. 2, the opening 13 is provided in the portion of the holding base 11 on which the individual packages are mounted, and each opening 13 is connected to a suction port 18 provided in the underlying metal stage or the like. Has been. When dicing, the package area of the substrate 10 is sucked and held.

  The groove portion 12 is for preventing the cut table itself from being damaged when the blade 20 penetrates the substrate, and is widely formed so as to include the end portions of the individual packages between the adjacent packages. Yes.

  An end material holding column 14 is installed in the groove 12 of the cut table 10 to prevent an excessive portion (end material) generated after cutting from entering the terminal surface. The holding column 14 may be attached to a necessary portion of the cut table 10 or may be formed by processing the cut table itself. Similarly, the package holder 11 may be attached to a necessary portion of the cut table 10 or may be formed by processing the cut table itself.

  When the cut table itself is processed, a portion other than the portions corresponding to the package holding table 11 and the end material holding pillar 14 is grooved into a relatively thick cut table. Thereby, the cut table in which the holding table 11 and the holding column 14 are integrally formed with the base unit can be obtained.

  Next, a dicing method using this apparatus will be described with reference to FIG.

  First, as shown in FIG. 3A, the cut table 10 shown in FIG. 1 is prepared for a substrate 30 on which a plurality of semiconductor chips are mounted and resin-sealed. Here, the substrate 30 is obtained by mounting a semiconductor chip (not shown) in each package region on the wiring substrate 31 and sealing the top with a resin layer 32. Are provided with connection terminals 33 such as solder balls.

  Next, as shown in FIG. 3B, the substrate 30 is positioned and set on the cut table 10 with the connection terminal 33 of the substrate 10 facing down. That is, the substrate 30 is positioned so that the dicing area of the substrate 30 matches the groove 12 of the cut table 10. More specifically, the substrate 30 is mounted on the cut table 10 with the connection terminals 33 facing downward so that the dicing line of the substrate 30 is located in a region between the package holding table 11 and the end material holding column 14. Put. Then, the substrate 30 is sucked and fixed by the opening 13 provided for each holding table 11.

  Next, as shown in FIG. 3C, the blade 30 is used to cut the substrate 30 along the dicing line. At this time, since the individual package regions are adsorbed by the openings 13, the substrate 30 does not move and dicing by the blade 20 can be performed satisfactorily. Further, since the substrate 30 is placed so that the dicing line does not overlap the package holding table 11 and the end material holding column 14, the holding table 11 and the holding column 14 are not damaged by the blade 20.

  FIG. 3D shows a state where dicing is completed. The individually cut package 40 is held on the package holding table 11, and the end material 50 generated by dicing is further held on the end material holding column 14. For this reason, the end material 50 does not fall and contact the connection terminal 33 of the substrate 30, and damage due to the contact of the end material 50 can be prevented in advance.

  When the dicing is completed, after the end material 50 is removed, the suction to the package area is stopped and each package 40 is taken out. Then, the process proceeds to dicing of the next substrate.

  Each semiconductor chip on the substrate 30 is electrically connected by a conductor 36, as shown in FIG. For this reason, each semiconductor chip needs to be diced for each semiconductor chip as shown by an arrow in the drawing in order to separate the conductor 36 along with the cutting with the adjacent chip. That is, it is necessary to perform dicing at two locations in the dicing area.

  Further, as shown in FIG. 5, the width L1 of the end material holding column 14 is set smaller than the width L2 of the end material 50 cut out by dicing so that the cut table itself (the holding column 14) is not damaged by the blade 20. Has been. Further, by making the clearance C between the end of the holding column 14 and the end of the semiconductor package 40 smaller than the size of the end material 50, the end material 50 falls into the groove 12 of the cut table 10 and the semiconductor package terminal It can be reliably prevented from entering the surface.

  As described above, according to the present embodiment, the end material holding pillar 14 is provided in the groove portion 12 of the cut table 10, thereby preventing the end material 50 from entering the semiconductor package terminal surface and preventing package damage due to dicing. can do. As a result, good dicing of the semiconductor package with the terminal surface facing down is possible.

(Second Embodiment)
FIG. 6 is a side view showing the main configuration of the dicing apparatus according to the second embodiment. In addition, the same code | symbol is attached | subjected to FIG. 1 and an identical part, and the detailed description is abbreviate | omitted.

  The difference between this embodiment and the first embodiment described above is that not only the package holding base 11 but also the end material holding column 14 is provided with an opening 17 for suction. When such an opening 17 is present, the end material 50 separated from the substrate 10 during dicing can be reliably held on the holding column 14.

  In FIG. 7, the specific cross section of the package holding stand 11 and the end material holding pillar 14 is shown. The holding base 11 is provided with a relatively large opening 13, and a suction port 18 of the base table is connected to a portion located in the opening 13. Thus, by making the opening 13 on the holding base 11 side larger than the suction port 18, the package 40 can be held more reliably. Further, the end material prevention column 14 is provided with a small opening 17, and the opening 17 is connected to a suction port 19 of the base table.

  With such a configuration, the end material 50 can be prevented from entering the semiconductor package terminal surface during dicing, and package damage due to dicing can be prevented. It is also possible to prevent the end material 50 from splashing upward and coming into contact with the substrate surface during dicing. Therefore, the same effects as those of the first embodiment can be obtained, and it is possible to more reliably prevent damage to the package.

(Modification)
The present invention is not limited to the above-described embodiments.

  In the embodiment, a BGA (Ball Grid Array) is taken as an example of a substrate to be diced, but the present invention is not limited to this and can be applied to an LGA (Land Grid Array). That is, the present invention can be applied to a case where a semiconductor chip has a connection terminal on a resin-sealed substrate and dicing is performed with the connection terminal facing down.

The cut table is not limited to rubber, and any cut table may be used as long as it has enough elasticity not to damage the substrate even if it comes into contact with the substrate. Further, a porous material may be used as long as it has an elasticity that does not damage the substrate. In this case, the entire substrate can be sucked to the cut table side without providing an opening for each of the package holding table and the end material holding column. Several embodiments of the present invention have been described. The embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 10 ... Cut table 11 ... Package holding stand 12 ... Groove part 13, 17 ... Opening 14 ... End material holding pillar 18, 19 ... Suction port 20 ... Blade 30 ... Board | substrate 31 ... Wiring board 32 ... Resin layer 33 ... Connection terminal 35 ... Electrode 36 ... Conductor 40 ... Package 50 ... End material

Claims (5)

A dicing apparatus for cutting a substrate having a plurality of resin-encapsulated semiconductor chips and having connection terminals for each semiconductor chip into individual packages with the connection terminals placed on a cut table. And
The cut table has a package holding table for holding the individual package to be cut out, and an end material holding column for holding an end material generated by the cutting,
The substrate is a BGA package having solder balls on the cut table surface side,
A suction means for sucking the substrate toward the cut table is provided on the upper surface of the end material holding column,
The dicing apparatus is characterized in that a width of the end material holding column is smaller than a width of the end material. A dicing apparatus for cutting a substrate having a plurality of resin-encapsulated semiconductor chips and having connection terminals for each semiconductor chip into individual packages with the connection terminals placed on a cut table. And
2. The dicing apparatus according to claim 1, wherein the cut table includes a package holding table that holds the individual packages to be cut out, and end material holding columns that hold the end materials generated by the cutting.   3. The dicing apparatus according to claim 2, wherein the substrate is a BGA package having solder balls on the cut table surface side.   The dicing apparatus according to claim 2 or 3, wherein suction means for sucking the substrate toward the cut table is provided on an upper surface of the end material holding column. A dicing method for cutting a plurality of resin-encapsulated semiconductor chips and cutting out a substrate having connection terminals for each semiconductor chip into individual packages,
Using a cut table having a package holding table for holding the individual package to be cut out and an end material holding column for holding the end material generated by the cutting,
The substrate is placed on the cut table with the connection terminal facing downward so that a dicing line of the substrate is positioned between the package holding table and the end material holding pillar, and then the substrate is diced. A dicing method comprising cutting a line with a blade.

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