201021657 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種印刷電路板相關技術，特別是關 於一種無核心基板之製作方法和用以製作無核心基板之 載板。 【先前技術】 現今之行動電話、個人數位助理（PDA)、薄膜電晶體 Φ 液晶顯示器（TFT-LCD)及許多各種電子產品之體積愈趨 縮小化，而置入這些電子產品的丰導體元件，亦須愈趨 輕、薄、短、小。為配合此一趨勢，係採用軟式印刷電路 板（flexible printed circuits，FPC)來作為電路板，諸如捲 帶式封裝（tape carrier package TCP)、薄膜覆晶封裝（chip on film COF)，其中之電路圖案已製作於一基底薄膜上。 第1圖為根據習知技術之具有厚核心層之半導體封裝 基板之剖面圖，如第1圖所示，習知技術中的半導體封裝 技術係於核心板104上形成電路層l〇6a、106b，並於核 參心板1〇4上形成導通孔1〇2，電性連接上下之電路層 106a、106b。爲減少導通孔1〇2所衍生出來之電桿的問題 和縮小封裝基板尺寸之目的，現已發展出無核心基板。然 而’無核心基板由於板厚較薄，其製作時，有機台方面限 制多、運送不易和板彎板翹等問題。另外，一些使用黏著 物無核心基板之製作技術則存在有殘膠的問題。 【發明内容】 根據上述問題，本發明提出一種無核心基板之製作方201021657 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a printed circuit board related art, and more particularly to a method for fabricating a coreless substrate and a carrier for fabricating a coreless substrate. [Prior Art] Today's mobile phones, personal digital assistants (PDAs), thin film transistors Φ liquid crystal displays (TFT-LCDs), and many other electronic products are becoming smaller and smaller, and the conductive elements of these electronic products are placed. It must also be lighter, thinner, shorter and smaller. To cope with this trend, flexible printed circuits (FPC) are used as circuit boards, such as tape carrier package TCP, chip on film COF, and circuits thereof. The pattern has been fabricated on a base film. 1 is a cross-sectional view of a semiconductor package substrate having a thick core layer according to the prior art. As shown in FIG. 1, a semiconductor package technology in the prior art forms a circuit layer 16a, 106b on a core board 104. And a via hole 1〇2 is formed on the core plate 1〇4, and the upper and lower circuit layers 106a and 106b are electrically connected. In order to reduce the problem of the poles derived from the via holes 1〇2 and to reduce the size of the package substrate, a coreless substrate has been developed. However, the "coreless substrate" has a problem of a large number of organic stages, difficulty in transportation, and warpage of the plate bending plate due to its thin plate thickness. In addition, some fabrication techniques using adhesive-free core substrates have problems with residual glue. SUMMARY OF THE INVENTION According to the above problems, the present invention provides a method for fabricating a coreless substrate.
097010/ 9024-A51329TW 3 201021657 法，包括以下步驟：提供一承栽板，放置一耐熱薄膜於承 載板上，進行一壓膜製程，將一絕緣層壓合至居讲此 熱薄膜上，其中耐熱薄膜不和絕緣層黏合，壓膜製程僅使 絕緣層在耐熱薄膜以外之區域和承載板黏合，於^緣層上 形成至少一電路層，及進行一切割製程，切割絕緣層^耐 熱薄膜之連接處’使承載板和其上及其下之結構層分離。 本發明於一實施例中，在進行壓膜製程之步驟之^，尚包 括可在該耐熱薄膜上放置一例如銅箔之金屬薄板，以使後 Φ續步驟不需再進行電鑛製程’即可對金屬薄板進行例如曝 光、顯影、钱刻之圖形化步驟。 爲避免金屬薄板的厚度太大，絕緣層在壓模製程其金 屬薄板的邊緣與承載板連接處，受到高度落差太大的影 響’其可能會使黏合造成影響’本發明另提出一種無核心 基板之衣作方法’包括以下步驟.提供一承載板，放置*~~ 絕緣層於承載板上，放置一耐熱薄膜於絕緣層上，放置一 金屬薄板於耐熱薄膜和絕緣層上，進行一壓膜製程，其中 耐熱薄膜不與絕緣層和金屬薄板黏合，於金屬薄板上形成 ⑩至少一電路層’及進行一切割製程，切割絕緣層和耐熱薄 膜之連接處’使承載板和絕緣層與其上及其下之結構層分 離。 本發明提出一種無核心基板之製作方法，包括以下步 驟：提供一製作無核心基板之核心板材，其中核心板材至 少最上層和最下層是玻纖樹脂板，放置一耐熱薄膜於玻纖 樹脂板上，放置一金屬薄板於玻纖樹脂板和耐熱薄膜上， 進行一壓合製程，使金屬薄板在耐熱薄膜以外之區域和玻 纖樹脂板黏合，於金屬薄板上形成至少一電路層’及進 097010/ 9024-A51329TW 4 201021657 行一切割製程’切割玻纖樹脂板和耐熱薄膜之連接處，使 核心板材和其上及其下之結構層分離。 根據上述，本發明提出一種製作無核心基板之核心板 材’包括複數層堆疊之玻纖樹脂板，且本發明另提出一種 製作無核心基板之核心板材，包括一承載板，至少一玻纖 樹脂板，貼合承載板之上表面和下表面。 本發明提出一種電路薄板之製造方法，包括以下步 驟：提供一承載板，放置一耐熱薄臈於承載板上，放置一 電路薄板於耐熱薄膜上，進行一壓臈製程，將一絕緣層壓 合至承載板和電路薄板上’其中耐熱薄膜不和承載板黏 合，壓膜製程僅使絕緣層在耐熱薄膜以外之區域和承載板 黏合’於電路薄板上形成至少一電路層，及進行一切割製 程’切割絕緣層和耐熱薄膜之連接處，使承載板和其上及 其下之電路薄板分離。 【實施方式】 第2A圖〜第2F圖繪示本發明一實施例無核心基板之 Φ 製作方法。首先’請參照第2A圖，提供一承載板202， 並在承載板202之第一侧和第二侧放置耐熱薄膜2〇4，值 得注意的是’耐熱薄膜204必須具有财熱特性，且不和承 載板202和後續形成之材料層黏著，耐熱薄膜204可例如 為聚醯亞胺(Polyimide)所組成。請參照第2B圖，進行一 壓膜製程’將一例如ABF絕緣膜（ajinomoto build-up fiim) 之絕緣層206壓合至承載板202和耐熱薄膜204上。值得 注意的是’由於耐熱薄膜204不和絕緣層206黏合，上述 壓膜製程僅使絕緣層206在财熱薄膜204以外之區域和承097010/ 9024-A51329TW 3 201021657 The method comprises the steps of: providing a bearing plate, placing a heat-resistant film on the carrier plate, performing a lamination process, and laminating an insulating laminate to the hot film, wherein the heat-resistant film is heat-resistant. The film is not bonded to the insulating layer, and the laminating process only bonds the insulating layer to the carrier sheet in a region other than the heat-resistant film, forms at least one circuit layer on the edge layer, and performs a cutting process to cut the insulating layer and the heat-resistant film. At 'where the carrier plate is separated from the structural layers above and below it. In an embodiment of the present invention, in the step of performing a lamination process, a metal sheet such as a copper foil may be placed on the heat-resistant film so that the subsequent step of Φ does not need to be performed again. The metal sheet can be subjected to a patterning step such as exposure, development, and engraving. In order to avoid the thickness of the metal thin plate is too large, the insulating layer is affected by the height drop too much at the junction of the edge of the metal thin plate and the carrier plate in the compression molding process, which may affect the adhesion. The present invention further proposes a coreless substrate. The coating method includes the following steps: providing a carrier plate, placing a *~~ insulating layer on the carrier plate, placing a heat-resistant film on the insulating layer, placing a thin metal plate on the heat-resistant film and the insulating layer, and performing a lamination film a process in which a heat-resistant film is not bonded to an insulating layer and a metal thin plate, and at least one circuit layer is formed on the metal thin plate and a cutting process is performed, and a joint between the cut insulating layer and the heat-resistant film is used to make the carrier plate and the insulating layer thereon The structural layer below it is separated. The invention provides a method for manufacturing a coreless substrate, comprising the steps of: providing a core plate for manufacturing a coreless substrate, wherein at least the uppermost layer and the lowermost layer of the core plate are glass fiber resin plates, and a heat resistant film is placed on the glass fiber resin plate. , placing a thin metal plate on the glass fiber resin plate and the heat-resistant film, performing a pressing process, bonding the metal thin plate to the glass fiber resin plate in a region other than the heat-resistant film, forming at least one circuit layer on the metal thin plate and entering 097010 / 9024-A51329TW 4 201021657 The one-cutting process 'cuts the junction of the glass fiber reinforced plastic sheet and the heat-resistant film to separate the core sheet from the structural layer above and below it. According to the above, the present invention provides a core sheet material for manufacturing a coreless substrate, which comprises a plurality of stacked glass fiber resin sheets, and the present invention further provides a core sheet material for manufacturing a coreless substrate, comprising a carrier sheet, at least one glass fiber resin sheet. , the upper surface and the lower surface of the carrier plate are attached. The invention provides a method for manufacturing a circuit board, comprising the steps of: providing a carrier plate, placing a heat-resistant thin plate on the carrier plate, placing a circuit board on the heat-resistant film, performing a pressing process, and laminating an insulation To the carrier board and the circuit board, wherein the heat-resistant film is not bonded to the carrier board, the film-pressing process only bonds the insulating layer to the carrier sheet in a region other than the heat-resistant film, and at least one circuit layer is formed on the circuit board, and a cutting process is performed. 'Cleaning the junction of the insulating layer and the heat-resistant film to separate the carrier board from the circuit board above and below it. [Embodiment] Figs. 2A to 2F illustrate a method of fabricating a Φ without a core substrate according to an embodiment of the present invention. First, please refer to FIG. 2A, a carrier plate 202 is provided, and a heat-resistant film 2〇4 is placed on the first side and the second side of the carrier plate 202. It is noted that the heat-resistant film 204 must have a heat-generating property, and The heat-resistant film 204 may be composed of, for example, polyimide, and adhered to the carrier sheet 202 and a subsequently formed material layer. Referring to Fig. 2B, a lamination process is carried out. An insulating layer 206 such as an ajonomoto build-up fiim is bonded to the carrier plate 202 and the heat-resistant film 204. It is to be noted that since the heat-resistant film 204 is not bonded to the insulating layer 206, the above-mentioned film-forming process only causes the insulating layer 206 to be in a region other than the heat-receiving film 204.
097010/ 9024-A51329TW 5 201021657 載板202黏合。&參照第2C圖，以半加成之方式於絕緣 層206上形成第一電路層208，請參照第2D圖，依需求 增加所需之電路層’例如圖示中之第二電路層210。請注 意’雖然本實施例僅描述到第二電路層21 〇，但電路層之 數量可依實際需求增加或減少。接著，請參照第2E圖和 第2F圖，第2F圖係為第2E圖之平面圖，進行一切割製 程，切割絕緣層206和耐熱薄膜204之連接處211，由於 耐熱薄膜204和其上之絕緣層206與其下之承載板202皆 Φ 不產生黏著，因此，上述之切割製程可使承載板202與其 上之結構層分離，如第2G圖所示，形成兩個無核心基板 212。 第3A圖〜第3G圖繪示本發明另一實施例無核心基板 之製作方法。首先，請參照第3A圖，提供一承載板302， 並在承載板之第一側和第二側放置耐熱薄膜304，同樣 的，本實施例耐熱薄膜304必須具有耐熱特性，且不和承 載板302和後續形成之材料層黏著，耐熱薄膜304可例如 為聚醯亞胺(Polyimide)所組成。請參照第3B圖，在耐熱 ❹ 薄膜304上放置例如銅箔之金屬薄板306。請參照第3C 圖，進行一壓膜製程，將一例如ABF絕緣膜之絕緣層308 壓合至承載板302和金屬薄板306上，值得注意的是，耐 熱薄膜304不與絕緣層308和金屬薄板306黏合，上述壓 膜製程僅使絕緣層308在耐熱薄膜304以外之區域和承載 板302黏合。請參照第3D圖’以半加成之方式於絕緣層 308上形成第一電路層310’請參照第3E圖’依需求增加 所需之電路層’例如圖示中之第二電路層312。請注意， 雖然本實施例僅描述到第二電路層312，但電路層之數量 097010/ 9024-A51329TW 6 201021657 可依實際需求增加或減少。接著，請參照第3F圖，進行 一切割製程，切割絕緣層308和耐熱薄膜304之連接處 311，由於财熱薄膜304和其上之金屬薄板306與其下之 承載板302皆不產生黏著，因此，上述之切割製程可使承 載板3 02與其上之結構層分離，如第3 G圖所示，形成兩 個無核心基板314a、314b。不同於上述實施例，本實施 例之兩個無核心基板314a、314b在製作好之後均包括金 屬薄板306，因此不需再進行電鍍製程，即可對金屬薄板 0 306進行例如曝光、顯影、#刻之圖形化步驟，形成連接 主基板之金屬墊（未繪示）。 請參照第3H圖，若金屬薄板350的厚度太大，由於 絕緣層在壓模製程其金屬薄板的邊緣與承載板連接處，受 到高度落差太大的影響，可能會對黏合造成影響。因此， 以下本發明以第31圖〜第3P圖描述上述問題之解決方 法。請參照第31圖，提供一承載板352，並將一例如ABF 絕緣膜之絕緣層354放置於承載板352之第一侧和第二侧 上。請參照第3J圖，在絕緣膜354上放置耐熱薄膜356， ® 同樣的，耐熱薄膜356必須具有耐熱特性，且不和絕緣層 354和後續形成之材料層黏著，耐熱薄膜356可例如為聚 醯亞胺。請參照第3K圖，在絕緣層354和耐熱薄膜356 上放置一金屬薄板358，由於本實施例利用金屬薄板358 與絕緣層354接合處360去除高低落差的影響，故本實施 例之金屬薄板358較無板厚的限制。接下來，請參照第 3L圖，進行一壓膜製程，將絕緣層354和承載板352黏 合，且金屬薄板358在耐熱薄膜356以外之區域和絕緣層 354黏合。請參照第3M圖，以半加成之方式於金屬薄板 097010/ 9024-A51329TW 7 201021657 358上形成第一電路層362，請參照第3N圖，依需求增 加所需之電路層，例如圖示中之第二電路層364。請注意， 雖然本實施例僅描述到第二電路層364，但電路層之數量 可依實際需求增加或減少。接著，請參照第30圖，進行 一切割製程，切割絕緣層354和耐熱薄膜356之連接處 366，由於耐熱薄膜356和其上之金屬薄板358與其下之 絕緣層354皆不產生黏著，因此，上述之切割製程可使承 載板352和絕緣層354與其上之結構層分離，如第3P圖 I 所示，形成兩個無核心基板368、370。 第4A圖〜第4F圖繪示本發明又另一實施例無核心基 板之製作方法，不同於第3A圖〜第3G圖實施例之壓膜製 程，本實施例係採用壓合製程，完成無核心基板之製作。 首先，請參照第4A圖，將玻纖樹脂板402(玻璃纖維包覆 樹脂之基板）依所需之厚度進行堆疊。請參照第4B圖，在 最上層和最下層之玻纖樹脂板402放置耐熱薄膜404，同 樣的，本實施例耐熱薄膜404必須具有耐熱特性，且不和 玻纖樹脂板402和後續形成之材料層黏著。請參照第4C ® 圖，將一例如銅箔之金屬薄板406放置在最上層和最下層 之玻纖樹脂板402和耐熱薄膜404上，接著進行一壓合製 程，使金屬薄板406在耐熱薄膜404以外之區域和玻纖樹 脂板402黏合。請參照第4D圖，以半加成之方式於金屬 薄板406上形成第一電路層408，並依需求增加所需之電 路層，例如圖示中之第二電路層410，同樣的，本實施例 僅描述到第二電路層410，但電路層之數量可依實際需求 增加或減少。請參照第4E圖，進行一切割製程，切割金 屬薄板406和财熱薄膜404之連接處411，由於耐熱薄膜 097010/ 9024-A51329TW 8 201021657 404和其上之金屬薄板406與其下之玻纖樹脂板402皆不 產生黏著，因此’上述之切割製程可使玻纖樹脂板402與 其上之結構層分離’如第4F圖所不，形成兩個無核心基 板412a、412b。類似於上述實施例，本實施例之兩個無 核心基板412a、412b在製作好之後均包括金屬薄板406， 因此不需再進行電鍍製程，即可對金屬薄板406進行例如 曝光、顯影、餘刻之圖形化步驟，形成連接主基板之金屬 整（未繪示）。 • 請注意，本實施例係在玻纖樹脂板402上放置一金屬 薄板406，並使用銅箔壓合製作基板，基板完成後，外觀 和使用方式與一般基板無異，後續使用半加成方式增層， 可適用於目前雙面增層之製程，可分離式基板由基材廠完 成，可免除許多製程步驟，做法較簡易。 由於玻纖樹脂板之價格較昂貴，因此，如第5A圖所 示，本發明於另一實施例可在一承載板502之上侧和下侧 放置玻纖樹脂板504，再如第5B圖所示，於玻纖樹脂板 504上放置耐熱薄膜506，同樣可達到上述實施例採用壓 ® 合製程，完成無核心基板製作的目的。後續之步驟係類似 於第4C圖〜第4F圖，爲簡潔，在此不詳細描述。 此外，根據上述實施例之概念，本發明以下以第6A 圖〜第6F圖另提出一電路薄板之製造方法，可解決電路薄 板在製作時’因厚度太薄所產生之板彎板翹等問題。首 先，請參照第6A圖，提供一承載板602，並在承載板602 之第一侧和第二侧放置耐熱薄膜604，同樣的，本實施例 耐熱薄膜604必須具有耐熱特性，且不和承載板602和後 續形成之材料層黏著，耐熱薄膜604可例如為聚醯亞胺 097010/ 9024-A51329TW 9 201021657 (Polyimide)所組成。請參照第6B圖，在耐熱薄膜604上 放置例如一電路薄板606，其中電路薄板606可以一般傳 統的電路板製程事先製作完成，例如將一玻璃纖維基板鑽 孔，並進行電鍍製程將通孔填滿，進行玻璃纖維基板上下 側之導通（由於此部份為習知的技術，不在此詳細描述其 步驟）。請參照第6C圖，進行一壓膜製程，將一例如ABF 絕緣膜之絕緣層608壓合至電路薄板606和承載板602 上，值得注意的是，上述壓膜製程僅使絕緣層608在耐熱 ❹ 薄膜604以外之區域和承載板602黏合。請參照第6D圖， 以半加成之方式於絕緣層608上形成所需之電路層610， 導通電路薄板606上之電路（圖式中僅繪示一層電路層 610,實際上可能有更多電路層）。接著，請參照第6E圖， 進行一切割製程，切割絕緣層608和耐熱薄膜604之連接 處611，由於耐熱薄膜604和其上之絕緣層608與其下之 承載板602皆不產生黏著，因此，上述之切割製程可使承 載板602與其上之結構層分離，如第6F圖所示，形成電 路板 612a、612b。 ® 如果電路薄板厚度太大，考量高度落差影響，可能會 對粘合造成影響，可參照第31圖〜第3P圖方式解決。絕 緣層置於承載板兩侧，並在絕緣層上放置耐熱薄膜，在絕 緣層和耐熱薄膜上放置一電路薄板，利用電路薄板與絕緣 層接合處黏合，去除高低落差影響。 根據上述實施例，本發明至少具有以下特點： 特點1 :目前之無核心基板之製作技術皆有使用黏著 物黏貼，相較之下本發明係使用絕緣層壓膜，使其和耐熱 薄膜連接，不需使用黏著物黏貼，因此無殘膠的問題且在 097010/ 9024-A51329TW 10 201021657 製程上更加簡便。 特點2 :本發明使用之絕緣層附著力較黏著物佳，可 避免製程中有藥水滲入所造成之良率損失。 特點3 :本發明係將耐熱薄膜放置於承載板上，在絕 緣層壓膜後，絕緣層僅會與承載板（或金屬板）黏貼，不會 與耐熱薄膜黏附，故切割耐熱薄膜周圍及可使之分離。 特點4 :本發明上述之製程方式可雙面生產，除可降 低板彎板翹之外，更可增加其產能。 以上提供之實施例係用以描述本發明不同之技術特 徵，但根據本發明之概念，其可包括或運用於更廣泛之技 術範圍。須注意的是，實施例僅用以揭示本發明製程、裝 置、組成、製造和使用之特定方法，並不用以限定本發明， 任何熟習此技藝者，在不脫離本發明之精神和範圍内，當 可作些許之更動與潤飾。因此，本發明之保護範圍，當視 後附之申請專利範圍所界定者為準。097010/ 9024-A51329TW 5 201021657 Carrier plate 202 is bonded. & Referring to FIG. 2C, the first circuit layer 208 is formed on the insulating layer 206 in a semi-additive manner. Referring to FIG. 2D, the required circuit layer is added as needed, for example, the second circuit layer 210 in the drawing. . Please note that although this embodiment is only described to the second circuit layer 21, the number of circuit layers may be increased or decreased according to actual needs. Next, referring to FIG. 2E and FIG. 2F, FIG. 2F is a plan view of FIG. 2E, performing a cutting process, cutting the joint 211 of the insulating layer 206 and the heat-resistant film 204, and insulating the heat-resistant film 204 and the heat-resistant film 204 thereon. The layer 206 and the underlying carrier plate 202 are both Φ-free. Therefore, the above-described cutting process can separate the carrier plate 202 from the structural layer thereon. As shown in FIG. 2G, two coreless substrates 212 are formed. 3A to 3G are views showing a method of fabricating a coreless substrate according to another embodiment of the present invention. First, referring to FIG. 3A, a carrier board 302 is provided, and the heat-resistant film 304 is placed on the first side and the second side of the carrier board. Similarly, the heat-resistant film 304 of the embodiment must have heat-resisting characteristics and does not match the carrier board. The 302 and the subsequently formed material layer are adhered, and the heat resistant film 304 may be composed of, for example, polyimide. Referring to Fig. 3B, a thin metal plate 306 of, for example, copper foil is placed on the heat-resistant ruthenium film 304. Referring to FIG. 3C, a lamination process is performed to bond an insulating layer 308 such as an ABF insulating film to the carrier 302 and the metal thin plate 306. It is noted that the heat-resistant film 304 is not bonded to the insulating layer 308 and the metal thin plate. 306 is bonded, and the above-mentioned lamination process only bonds the insulating layer 308 to the carrier 302 in a region other than the heat-resistant film 304. Referring to Fig. 3D, a first circuit layer 310' is formed on the insulating layer 308 by a semi-additive pattern. Please refer to Fig. 3E for the required circuit layer as required, for example, the second circuit layer 312 in the drawing. Please note that although this embodiment is only described to the second circuit layer 312, the number of circuit layers 097010/9024-A51329TW 6 201021657 may be increased or decreased according to actual needs. Next, referring to FIG. 3F, a cutting process is performed to cut the joint 311 of the insulating layer 308 and the heat-resistant film 304. Since the heat-generating film 304 and the metal sheet 306 thereon and the carrier sheet 302 therebelow are not adhered, The cutting process described above can separate the carrier plate 302 from the structural layer thereon, and as shown in FIG. 3G, two coreless substrates 314a, 314b are formed. Different from the above embodiments, the two coreless substrates 314a and 314b of the present embodiment each include a thin metal plate 306 after being fabricated, so that the metal thin plate 0 306 can be exposed, developed, etc., without performing an electroplating process. The engraving step of forming forms a metal pad (not shown) that connects the main substrate. Referring to Figure 3H, if the thickness of the thin metal plate 350 is too large, the adhesion of the insulating layer to the edge of the metal sheet in the compression molding process may be affected by the influence of the height drop. Therefore, the present invention will be described below with reference to Figs. 31 to 3P. Referring to Fig. 31, a carrier plate 352 is provided, and an insulating layer 354 such as an ABF insulating film is placed on the first side and the second side of the carrier plate 352. Referring to FIG. 3J, a heat-resistant film 356 is placed on the insulating film 354. Similarly, the heat-resistant film 356 must have heat-resistant characteristics and is not adhered to the insulating layer 354 and a subsequently formed material layer, and the heat-resistant film 356 can be, for example, a polyfluorene. Imine. Referring to FIG. 3K, a metal thin plate 358 is placed on the insulating layer 354 and the heat-resistant film 356. Since the metal sheet 358 and the insulating layer 354 are joined to each other to remove the influence of the height difference, the metal thin plate 358 of this embodiment is used. Less than the thickness limit. Next, referring to FIG. 3L, a lamination process is performed to bond the insulating layer 354 and the carrier plate 352, and the thin metal plate 358 is bonded to the insulating layer 354 in a region other than the heat-resistant film 356. Referring to FIG. 3M, the first circuit layer 362 is formed on the thin metal plate 097010/9024-A51329TW 7 201021657 358 by a semi-additive manner. Please refer to the 3N figure to increase the required circuit layer according to requirements, for example, in the figure. The second circuit layer 364. Please note that although this embodiment is only described to the second circuit layer 364, the number of circuit layers may be increased or decreased depending on actual needs. Next, referring to FIG. 30, a cutting process is performed to cut the joint 366 of the insulating layer 354 and the heat-resistant film 356. Since the heat-resistant film 356 and the metal thin plate 358 thereon and the insulating layer 354 thereon are not adhered, The cutting process described above allows the carrier plate 352 and the insulating layer 354 to be separated from the structural layer thereon. As shown in FIG. 3P, two coreless substrates 368, 370 are formed. 4A to 4F illustrate a method for fabricating a coreless substrate according to still another embodiment of the present invention. Unlike the lamination process of the embodiments of FIGS. 3A to 3G, the embodiment adopts a press-bonding process to complete no. The manufacture of the core substrate. First, referring to Fig. 4A, a glass fiber resin sheet 402 (a substrate made of a glass fiber-coated resin) is stacked in a desired thickness. Referring to FIG. 4B, the heat-resistant film 404 is placed on the uppermost and lowermost glass fiber resin sheets 402. Similarly, the heat-resistant film 404 of the present embodiment must have heat-resistant characteristics, and is not compatible with the glass fiber resin sheet 402 and the subsequently formed material. The layer is glued. Referring to FIG. 4C ® , a metal foil 406 such as a copper foil is placed on the uppermost and lowermost glass fiber reinforced plastic sheets 402 and the heat resistant film 404, followed by a pressing process to cause the metal thin plate 406 to be in the heat resistant film 404. The area other than the fiberglass resin board 402 is bonded. Referring to FIG. 4D, the first circuit layer 408 is formed on the metal thin plate 406 in a semi-additive manner, and the required circuit layer is added as needed, for example, the second circuit layer 410 in the figure. Similarly, the present embodiment The example is only described to the second circuit layer 410, but the number of circuit layers can be increased or decreased depending on actual needs. Referring to FIG. 4E, a cutting process is performed to cut the joint 411 of the thin metal plate 406 and the heat-treating film 404, and the heat-resistant film 097010/9024-A51329TW 8 201021657 404 and the metal thin plate 406 thereon and the glass fiber reinforced plastic board thereon None of the 402 is adhesive, so the above-described cutting process can separate the glass fiber reinforced plastic sheet 402 from the structural layer thereon. As shown in FIG. 4F, two coreless substrates 412a and 412b are formed. Similar to the above embodiment, the two coreless substrates 412a, 412b of the present embodiment each include a thin metal plate 406 after being fabricated, so that the metal thin plate 406 can be exposed, developed, and left, for example, without performing an electroplating process. The patterning step forms a metal integral (not shown) that connects the main substrate. • Note that in this embodiment, a thin metal plate 406 is placed on the glass fiber reinforced plastic sheet 402, and the substrate is formed by pressing the copper foil. After the substrate is completed, the appearance and the use manner are the same as those of the general substrate, and the subsequent use of the semi-additive method is adopted. The layering can be applied to the current double-layer layering process. The detachable substrate is completed by the substrate factory, which can eliminate many process steps and is simpler. Since the price of the glass fiber reinforced plastic sheet is relatively expensive, as shown in FIG. 5A, in another embodiment, the glass fiber reinforced resin sheet 504 can be placed on the upper side and the lower side of a carrier sheet 502, as shown in FIG. 5B. As shown in the figure, the heat-resistant film 506 is placed on the glass fiber reinforced plastic sheet 504, and the above embodiment can also be used to complete the coreless substrate production by using a press-bonding process. Subsequent steps are similar to those of Figures 4C through 4F, which are not described in detail herein for the sake of brevity. In addition, according to the concept of the above embodiment, the present invention further proposes a method for manufacturing a circuit board by using the 6A to 6F drawings, which can solve the problem that the board is bent due to the thickness being too thin during the manufacture of the circuit board. . First, referring to FIG. 6A, a carrier plate 602 is provided, and a heat-resistant film 604 is placed on the first side and the second side of the carrier plate 602. Similarly, the heat-resistant film 604 of the embodiment must have heat-resisting characteristics and is not supported. The plate 602 is adhered to a subsequently formed material layer, and the heat-resistant film 604 can be composed, for example, of polyimine 097010/9024-A51329TW 9 201021657 (Polyimide). Referring to FIG. 6B, for example, a circuit board 606 is placed on the heat-resistant film 604. The circuit board 606 can be fabricated in advance by a conventional circuit board process, for example, drilling a glass fiber substrate and performing a plating process to fill the through hole. The conduction is performed on the upper and lower sides of the glass fiber substrate (since this portion is a conventional technique, the steps thereof are not described in detail herein). Referring to FIG. 6C, a lamination process is performed to bond an insulating layer 608 such as an ABF insulating film to the circuit board 606 and the carrier board 602. It is noted that the above-mentioned lamination process only makes the insulating layer 608 heat resistant. The area other than the film 604 is bonded to the carrier plate 602. Referring to FIG. 6D, a desired circuit layer 610 is formed on the insulating layer 608 in a semi-additive manner, and the circuit on the circuit board 606 is turned on (only one circuit layer 610 is shown in the drawing, and actually there may be more Circuit layer). Next, referring to FIG. 6E, a cutting process is performed to cut the joint 611 of the insulating layer 608 and the heat-resistant film 604. Since the heat-resistant film 604 and the insulating layer 608 thereon and the underlying carrier plate 602 are not adhered, The cutting process described above allows the carrier plate 602 to be separated from the structural layers thereon, as shown in FIG. 6F, forming circuit boards 612a, 612b. ® If the thickness of the circuit board is too large, consider the influence of the height drop, which may affect the adhesion. Refer to Figure 31 to Figure 3P for solutions. The insulating layer is placed on both sides of the carrier plate, and a heat-resistant film is placed on the insulating layer, and a circuit board is placed on the insulating layer and the heat-resistant film, and the bonding between the circuit board and the insulating layer is performed to remove the influence of the high and low drop. According to the above embodiment, the present invention has at least the following features: Feature 1: The current non-core substrate fabrication techniques all use adhesive bonding, and the present invention uses an insulating laminate film to connect with the heat resistant film. No adhesive sticking is required, so there is no problem with residual glue and it is easier to make on the 097010/ 9024-A51329TW 10 201021657 process. Feature 2: The adhesion of the insulating layer used in the present invention is better than that of the adhesive, and the yield loss caused by the penetration of the medicinal water in the process can be avoided. Feature 3: In the present invention, the heat-resistant film is placed on the carrier plate. After the insulating laminate film, the insulating layer is only adhered to the carrier plate (or the metal plate), and does not adhere to the heat-resistant film, so the heat-resistant film is cut around and Separate it. Feature 4: The above-mentioned process mode of the present invention can be produced on both sides, and the production capacity can be increased in addition to reducing the bending of the plate. The embodiments provided above are intended to describe various technical features of the invention, but may be included or applied to a broader range of technical aspects in accordance with the teachings of the invention. It is to be understood that the embodiments are not intended to limit the invention, and the invention is not limited to the scope of the invention. When you can make some changes and retouch. Therefore, the scope of the invention is defined by the scope of the appended claims.
097010/ 9024-A51329TW 11 201021657 【圖式簡單說明】 第1圖顯示根據習知技術之具有厚核心層之半導體封 裝基板之剖面圖。 第2A圖〜第2G圖繪示本發明一實施例無核心基板之 製作方法。 第3A圖〜第3P圖繪示本發明另一實施例無核心基板之 製作方法。 第4A圖〜第4F圖繪示本發明又另一實施例無核心基板 之製作方法。 第5A圖〜第5B圖繪示本發明於另一實施例在一承載 板之上側和下侧放置玻纖樹脂板之相關製程。 第6A圖〜第6F圖繪示本發明一實施例電路薄板之製造 方法。 【主要元件符號說明】 102〜導通孔； 104〜核心板， 106a〜電路層； 106b〜電路層； 202〜承載板； 204〜耐熱薄膜； 206〜絕緣層； 208〜第一電路層； 210〜第二電路層； 211〜連接處； 212〜無核心基板； 302〜承載板； 304〜耐熱薄膜； 306〜金屬薄板； 308〜絕緣層； 310〜第一電路層； 311〜連接處； 312〜第二電路層； 314a〜無核心基板， 314b〜無核心基板； 350〜金屬薄板； 352〜承載板； 097010/ 9024-A51329TW 12 201021657 354〜絕緣膜； 358〜金屬薄板； 362〜第一電路層； 366〜連接處； 370〜無核心基板； 404〜耐熱薄膜； 408〜第'一電路層； 411〜連接處； 412b〜無核心基板； 504〜玻纖樹脂板， 602〜承載板； 606〜電路薄板； 610〜電路層； 612a〜電路板； 356〜耐熱薄膜； 360〜接合處； 364〜第二電路層； 368〜無核心基板； 402〜玻纖樹脂板； 406〜金屬薄板； 410〜第二電路層； 412a〜無核心基板； 502〜承載板， 506〜耐熱薄膜； 604〜对熱薄膜； 608〜絕緣層； 611〜連接處； 612b〜電路板。 097010/ 9024-A51329TW 13097010/ 9024-A51329TW 11 201021657 [Simplified Schematic] FIG. 1 is a cross-sectional view showing a semiconductor package substrate having a thick core layer according to the prior art. 2A to 2G are views showing a method of fabricating a coreless substrate according to an embodiment of the present invention. 3A to 3P are views showing a method of fabricating a coreless substrate according to another embodiment of the present invention. 4A to 4F are views showing a method of fabricating a coreless substrate according to still another embodiment of the present invention. 5A to 5B are views showing a process of placing a glass fiber resin board on the upper side and the lower side of a carrier sheet in another embodiment of the present invention. 6A to 6F are views showing a method of manufacturing a circuit board according to an embodiment of the present invention. [Main component symbol description] 102~ via hole; 104~ core board, 106a~ circuit layer; 106b~ circuit layer; 202~ carrier board; 204~ heat resistant film; 206~ insulating layer; 208~ first circuit layer; Second circuit layer; 211~ junction; 212~ coreless substrate; 302~ carrier plate; 304~ heat resistant film; 306~metal sheet; 308~insulation layer; 310~first circuit layer; 311~join; Second circuit layer; 314a~ coreless substrate, 314b~ coreless substrate; 350~metal sheet; 352~ carrier board; 097010/ 9024-A51329TW 12 201021657 354~ insulating film; 358~metal sheet; 362~ first circuit layer ; 366~ connection; 370~ coreless substrate; 404~ heat resistant film; 408~1' circuit layer; 411~ connection; 412b~ coreless substrate; 504~glass fiber resin board, 602~ carrier board; Circuit board; 610~ circuit layer; 612a~ circuit board; 356~ heat resistant film; 360~ joint; 364~ second circuit layer; 368~ coreless substrate; 402~glass resin board; 406~metal sheet; 0 to the second circuit layer; 412a~ no core substrate; 502~ carrier plate, 506~ heat resistant film; 604~ pair of thermal film; 608~ insulating layer; 611~ connection; 612b~ circuit board. 097010/ 9024-A51329TW 13