TW201020870A - Manufacturing methods of touch display panel and electronic device applied with the same - Google Patents

Abstract

A method of manufacturing a touch display panel including the following steps is provided. A first substrate with a touch structure disposed on a first surface of the first substrate is provided. A dummy substrate is disposed on the first surface and covers the touch structure. A cover layer is disposed on a second surface of the first substrate, wherein the second surface is opposite to the first surface. A second substrate with an active structure disposed on a first surface of the second substrate is provided. The two substrates are assembled, so that the active structure faces the cover layer, and a display medium layer is formed between the two substrates. The dummy substrate is removed. A method of manufacturing an electronic device including the method of manufacturing the touch display panel is also provided.

Description

201020870

TW4771PA IX. Description of the Invention: [Technical Field] The present invention relates to a touch display panel and a method of manufacturing the same, and more particularly to a touch display panel and an electronic device capable of improving yield method. [Prior Art]

With the development of flat panel display technology, the display effect of flat panel displays has been greatly improved. Moreover, due to advances in process technology, the cost of driving flat-panel displays has declined, making flat-panel displays popular with consumers in the market. In order to improve the convenience of use, in recent years, the industry has integrated touch panels into flat display devices and applied them to various electronic devices. The user can perform various operations by clicking on the screen directly on the panel, thereby providing a more convenient and user-friendly operation mode. Generally, in the manufacturing method of the touch display panel, in order to form the touch filter structure and the color filter structure of the display panel on the two surfaces of the same glass substrate respectively, the glass substrate must be flipped after the touch structure is formed. The control structure is in contact with the conveyor belt or platform of the process machine. As a result, it is easy to cause the touch structure to rub against the conveyor belt or the platform, thereby causing scratches. This reduces the yield of the process. In addition, since the touch structure is formed on the surface of the glass substrate, the touch structure is damaged when the glass substrate is thinned, and thus cannot be performed under the process steps. Furthermore, since the glass substrate must maintain a certain structural strength to ensure that the glass substrate does not rupture during the subsequent process steps, it is difficult to thin the glass substrate in 201020870. Special {Table 7 of the glass substrate has been formed with touch

The thickness of the glass substrate cannot be further lowered, and the thickness of the touch display panel cannot be effectively reduced. It is difficult to achieve the current demand for product thinning on the market. SUMMARY OF THE INVENTION The present invention provides a method for manufacturing a touch display panel and an electronic device, which is covered by a dummy substrate on a touch structure, thereby avoiding the problem that the touch-free structure is damaged in the process. In turn, the yield of the process is improved. In addition, the step of thinning the substrate can be smoothly performed in the process to reduce the overall thickness of the touch display panel.

According to the first aspect of the present invention, the first substrate and the second substrate are actively formed. According to the first aspect of the present invention, a method for manufacturing a touch display panel is provided, which comprises the following steps. A first substrate is provided, and one of the first substrates has a touch structure on the first surface. A dummy substrate is disposed on the surface of the first substrate and overlying the touch structure. A cover layer is formed on the second surface of the substrate, the second surface being opposite to the first surface. Providing a second substrate, wherein the first surface of the first substrate has a cover layer of the main substrate, and in the second aspect of the first substrate and the second substrate, the manufacturing device of the electronic device has a touch display A panel, in the method of manufacturing the same, is a method of manufacturing a display panel. 6 201020870

1 W4//1FA In order to make the above description of the present invention more comprehensible, the preferred embodiments are described below, and are described in detail with reference to the accompanying drawings. In the manufacturing method of the touch display panel, the method of covering the touch structure with the virtual substrate protects the touch structure from damage during the process and improves the process yield. In addition, the thinning operation of the first substrate and/or the second substrate can be performed in the process to reduce the thickness of the touch display panel. The following is a detailed description of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Further, in the drawings, the unnecessary elements are omitted in the drawings to clearly show the technical features of the present invention. Referring to Fig. 1, a flowchart of a method of manufacturing a touch display panel in accordance with a preferred embodiment of the present invention is shown. The method for manufacturing the touch display panel of the present embodiment includes the following steps: First, a first substrate 110' is provided as shown in steps S1 and 2A, wherein FIG. 2A is a schematic view showing the first substrate 11'. One of the first surfaces 110 of the first substrate 110 has a touch structure lu. In the embodiment, the touch structure 111 is an example of a capacitive touch structure. Please refer to FIGS. 2B and 2C simultaneously. FIG. 2B is a top view of the touch structure in FIG. 2A. FIG. 2C is a second view. A cross-sectional view along the line AA in the figure. The capacitive touch structure includes, for example, a conductive layer 111a, a first insulating layer 111b, an electrode layer 111c, and a second insulating layer 111d. The conductive layer 111a is placed on the first surface 11 of the first substrate 110 as above, which may be a single layer junction 201020870

TW4771PA m structure or multi-layer structure, and the material of the conductive layer 111a includes: transparent (such as indium tin oxide, indium zinc oxide _), cadmium tin (CTO), cadmium zinc oxide (cz 〇), aluminum zinc oxidation (Az〇), planer (ΑΤΟ), oxidized (Hf〇), indium tin zinc oxide (ιτζ〇), lexical = other suitable materials, or combinations of the above), opaque conductive materials (such as gold and silver, iron , tin, cadmium, molybdenum, aluminum, titanium, niobium, tantalum, a material thereof, the above oxide, the above-described telluride, the above-mentioned oxynitride alloy, or a combination thereof, or the above transparent and opaque conductive Combination of materials. The first insulating layer 111b covers the conductive layer 111a for electrically isolating the conductive layer ma and the electrode layer 111c. The first insulating layer 111b may be an early layer structure or a multilayer structure, and the material thereof is, for example, an inorganic material, an organic material, or a combination thereof. The inorganic material is, for example, cerium oxide, cerium nitride, cerium oxynitride, other suitable materials or a combination thereof, and the organic material is, for example, photoresist, polyarylene ether (PAE), polyfluorene, polyacetate, poly Alcohols, polycondensates, benzocyclclobutene (BCB), HSQ (hydrogen silsesquioxane), MSQ (methyl silesquioxane), xenon-oxycarbons (SiOC-H), polyethers, polyketones, hydrazines Polyaldehydes, polyphenols, polycycloalkanes, polyalkylene oxides, polyacetylenes, polyphenols, other suitable materials or combinations thereof. The organic material is exemplified in the embodiment of the present invention, but is not limited thereto. The electrode layer 111c may be a single layer structure or a multilayer structure, and the material thereof is, for example, a transparent conductive material (for example, indium tin oxide (ITO), an oxide of oxide (IZO), a bismuth tin oxide (CTO), or a oxidized (CZO), IS word (ΑΖΟ), #§ tin oxide (ΑΤΟ), oxidation (HfO), indium tin zinc oxide (ΙΤΖΟ), zinc compound, other suitable materials, or 8 201020870

1 W^/Vl^A The above combination), the layer nid covers the first insulating layer 11115. In the second insulation, the second insulation UlcJ1' serves to protect the electrode layer 111c. The material is, for example, Yisong Song 1Ud, which may be a single layer structure or a multilayer structure, and is oxidized, nitrogen cut, machine material or a combination thereof. The inorganic material is, for example, yttrium oxide, other suitable materials or a combination thereof, and the organic material f is, for example, a photoresist, a polyarylene ether (PAE),

Polyfluorenes, polyesters, polyalcohols, polyolefins, benzocyclclobutene (BCB), HSQ (hydrogen silsesquioxane), MSQ (methyl silesquioxane), xenon hydrocarbons (SiOC-H), Polyethers, polyketones, polyaldehydes, polyphenols, polycycloalkanes, polyalkylene oxides, polyacetylenes, polyphenols, other suitable materials or combinations thereof. The organic material is exemplified in the embodiment of the present invention, but is not limited thereto. In the present embodiment, the capacitive touch structure 111 shown in FIGS. 2B and 2C is taken as an example for description. However, the touch structure lu is not limited to this,

Other touch structures m disposed on the first substrate no for integration with the display panel, such as resistive, piezoelectric, pressure capacitive, photo-sensitive, push-type, or other suitable touch structures, or A combination of at least the above two modes can be applied thereto. In addition, the conductive layer 111a and the electrode layer 111c respectively have two (four) case portions (not connected with the connection portion (not shown) of the case portion (the fourth), wherein the connection portion of the conductive layer 11U and the connection portion of the electrode layer (1)e are In other embodiments, the pattern portion of the conductive layer U1a and the pattern portion of the electrode layer me may each be two or more, and the connection portion between the conductive portion (1) & and the secret layer Ule may be similar. Top view of the pattern portion of the upper or electric layer ma and the pattern portion of the electrode layer Ule 9 201020870

The TW4771PA can be rectangular, trapezoidal, triangular, rectangular, rhombic, hexagonal, pentagonal, oblong, or other suitable shape. Referring to FIG. 3A, a schematic diagram of the dummy substrate 130 disposed on the /substrate 110 is illustrated. The manufacturing method of the present embodiment then performs a little #S2, and a dummy substrate 130 is disposed on the first surface 110a of the second board 110 and overlies the touch structure 111. That is, the inner surface of the dummy substrate 130 corresponds to the upper surface of the touch structure 111 and the inner surface of the first substrate 110 (i.e., the surface 110a). In one embodiment, the dummy substrate 130 can be disposed on the first substrate 11A via a sealant layer 150 or the sealant layer 150 is disposed on the dummy substrate 130 such that the dummy substrate 130 is disposed on the first substrate. On the first surface 110a of 110. Please refer to FIG. 3B for a plan view of the sealant layer 150 and the first substrate 110. The sealant layer 150 is wound around the touch structure 111 and has a plurality of openings 150a. As shown in FIG. 3B, the sealant layer 150 includes at least four openings 150a, and the openings l5〇a' preferably correspond to the four corners of the touch structure 111, respectively, as an example, but are not limited thereto. Can also be set in other locations. In addition, the sealant layer 150 and the touch structure 111 can selectively have a gap d. The embodiment has the gap d as an example, but is not limited thereto, and may not have the gap, but the edges thereof are aligned. But not covering each other. In addition, the manufacturing method of the present embodiment, the dummy substrate 130 and the touch structure 111 may selectively have a gap g′ to enable the dummy substrate 130 to buffer in the subsequent process steps, but is not limited thereto, and the dummy substrate 130 When the touch structure ill is attached via the sealant layer 150, the gap g may not be provided. Furthermore, this embodiment takes the virtual base 201020870

The i W4//irA board 130 and the touch structure ill have a gap g as an example. However, in order to maintain the stability of the gap g, the step of sprinkling the gap on the first substrate 110 is more optional. The virtual substrate and the touch structure in is provided with a gap g, so that the dummy substrate 130 can be buffered in the subsequent process step to prevent the touch structure 111 from contacting the touch structure 111 to protect the touch structure 111 from damage. . In addition, in other embodiments, the virtual substrate 130 is not only adhered to the sealant layer 150 but also electrostatically adsorbed on the first substrate and covers the touch element 111. There is no gap g between the 130 and the touch element 111 or other suitable combination. Next, the manufacturing method of this embodiment executes step S3 to form a cover layer. Referring to FIG. 4, a schematic diagram of the Joe cover layer 112 formed on the first substrate 110 is illustrated. The cover layer 1 2 is formed on a second surface 110b of the first substrate U, which is opposite to the second surface 110a, that is, the outer surface of the first substrate 110. In practical applications, the cover layer 112 includes, for example, at least one of an alignment layer, a transparent electrode, and a color filter. Before performing step S3, it is preferable to flip the first substrate 11 of the dummy substrate 130 to be flipped so that the first substrate U is disposed on the conveyor belt or the platform via the dummy substrate 130. The phenomenon that the structure 111 is scratched by friction 'but not limited to this' can be designed according to the machine forming the cover layer without first turning over the first substrate 110 provided with the dummy substrate I30. Then, in step S4, a second substrate is provided. Referring to FIG. 5, a schematic diagram of the second substrate 120 and the /substrate U0 is shown. Second 201020870

One of the first surface 120a of the TW4771PA substrate 120 has an active structure 12, that is, an inner surface of the second substrate 120. In practical application, the active structure 121 includes, for example, a plurality of thin film transistors. Next, the steps of pairing the two substrates 110, 120 are performed. Referring to FIG. 6, a schematic diagram of the first substrate 110 and the second substrate 120 after the pair is shown. As shown in step S5, the active substrate 121 of the second substrate 120 is opposed to the cover layer 112 of the first substrate 110, and the first substrate 110 and the second substrate 120 are disposed on the first substrate 110 and the second substrate 120. A display medium layer 140 is formed therebetween. That is, the upper surface of the active structure 121 of the second ® substrate 120 corresponds to the upper surface of the cover layer 112 of the first substrate 110. In practical applications, the display medium layer 140 is formed on the first substrate no or the second substrate 120 by a drop method (ODF), for example, before the pair of substrates 110 and 120. Further, the display medium layer 140 may be formed between the first substrate 110 and the second substrate 120 by implantation after the pair of substrates no, 120. The display medium layer 14 formed by the dropping method or the injection method is a non-self-luminous material, for example, a liquid crystal (Liquid Crystal; LC) material, an electrophoretic material; however, the technology of the present invention is not limited thereto, and the display is not limited thereto. The dielectric layer 140 can also be, for example, an electroluminescent material and is formed on the second substrate 120 prior to the pair of substrates 11 , 120 , and can be located above or below the active structure 121 . The display medium layer may also be, for example, a single layer structure or a multilayer structure of a non-self-luminous material and an electroluminescent material. Then, the manufacturing method of this embodiment proceeds to step S6, and the dummy substrate 130 is removed. Please refer to FIG. 7 , which is shown removed from the first substrate 11 ( ) 12 201020870

1 W4//li"A virtual substrate 130 is not intended. Take the 3B figure as an example, but it is not limited to this. Since the sealant layer 150 has a gap d with the touch structure 111, the method of removing the dummy substrate 130 from the gap d and the first substrate 110 and the second substrate 120 after the group can be used to remove the surrounding touch. The sealant layer 150 of the control structure. Among them, the splitting method can be applied to at least one of a laser method, a cutter wheel and a diamond knife. However, the manner of removing the dummy substrate 130 is not limited thereto, and the other is to separate the first substrate 11 and the dummy substrate 130, or directly polish or etch the dummy substrate 13; or remove static electricity between the substrates; or It is to directly remove the sealant layer 150, which can be applied thereto. After the dummy substrate 130 is removed, the touch display panel 1 is completed. Furthermore, the manufacturing method of the present embodiment selectively performs the thinning step of the first substrate 110 and/or the second substrate 120. Please refer to Fig. 8 for a schematic view showing the thinning step of the first substrate 11A. In the manufacturing method of the present embodiment, when the first substrate 110 is exemplified by an inorganic transparent substrate (for example, glass, quartz, or other suitable material), it is preferable to thin the step S2 after the dummy substrate 130 is disposed. . Of course, the first substrate 11〇 may not be thinned according to the design requirements. If the first substrate 11 is made of an organic transparent material (for example, polyenes, polybenzazoles, polyalcohols, polyesters, rubbers, thermoplastic polymers, thermosetting polymers, polyaromatic hydrocarbons, polyacrylonitrile) When the acid esters, polycarbonates, other suitable materials, the above derivatives or the combination thereof are used, the thickness of the first substrate 110 can be appropriately selected to be thinned or not, preferably The portion of the organic transparent substrate can exhibit a relatively thin thickness and, therefore, does not require thinning. In addition, in other embodiments, the second substrate 120 is made of an inorganic transparent substrate (for example, glass, quartz or other suitable materials) or inorganic opaque 13 201020870 TW4771PA, t material (for example, enamel, ceramic, other suitable materials or The combination of the above may also not be thinned. In detail, the first substrate 110 has been thinned first by an inorganic transparent substrate (for example, glass, quartz or other suitable materials) or an inorganic opaque material (for example, a stone piece, a ceramic, other suitable materials, or a combination thereof). The thickness is applied to an additional support film (not shown), and after the touch display panel is completed, additional support film is removed as needed. The method of thinning the first substrate 110 is to perform a thinning step of the second surface 11b of the first substrate 110 to thin the first substrate 110 to the first substrate 11A, wherein the thinning step can be used. Grinding and / or money engraving. As shown in FIG. 8, when the thinning step of the first substrate 110 is performed, the dummy substrate 13 protects the touch structure 111 to prevent the touch structure 111 from being damaged. In addition, the dummy substrate 13A can also provide the function of the strength support of the first substrate 110, so that the first substrate u can smoothly perform the thinning step. Please refer to FIG. 9 , which illustrates a schematic diagram of the thinning step of the second substrate 12 . Preferably, the second substrate 120 is exemplified by an inorganic transparent substrate (for example, glass, quartz or other suitable material) or an inorganic opaque material (for example, a ruthenium, a ceramic, another suitable material, or a combination thereof). After the step S5 of the first substrate 110 and the second substrate 120, the thinning step of the second substrate 120 is performed. Of course, depending on the design requirements, the second substrate 12 may be thinned or the second substrate 120 may not be thinned directly after the step S6. The first substrate 120 is made of an organic transparent material (for example, a polyolefin, a polyfluorene, a polyester, a polyester, a rubber, a thermoplastic polymer, a thermosetting polymer, a polyaromatic hydrocarbon, or a polymethylpropionic acid). In the case of an oxime ester, a polycarbonate, another suitable material, the above-mentioned derivative or a combination thereof, it is preferable to reduce the thickness of the second substrate 12 by the thickness of the second substrate 12, preferably, Part of the organic transparent 201020870

The thickness of the TW4771FA, therefore, does not require thinning. In addition, the other ^ : 'th substrate 12G is made of an inorganic transparent substrate (for example, glass, stone or other suitable material) or an inorganic opaque material (for example, sliced, pottery,

Other suitable materials or combinations thereof may also not be thinned. In detail, the second substrate 12G is firstly immersed in an inorganic transparent substrate (for example, glass, 5 inches or other suitable material), such as slicing, shouting, other suitable materials, or a combination thereof. Thinning to the thickness of the # and placing it on the additional wafer (L). After the touch display panel is completed, the second substrate 120 is removed after the second substrate 120 is removed. A thinning step is performed on a second surface 12〇b of the first surface 12〇a to thin the second substrate 12 to the second substrate 12〇, wherein the thinning step may use grinding and/or Etching method. As shown in FIG. 9, when the thinning step of the first substrate 120 is performed, the dummy substrate 13 protects the touch structure 111' from damage to the touch structure 1U. By selectively performing the thinning step of the first substrate no and/or the second substrate 12, the thickness of the touch display panel 100 can be further reduced. In addition, since the dummy substrate 130 is overlaid on the touch structure U1 during the thinning step, the problem that the touch structure 1 is scratched, damaged by the force, and corroded by the chemical solvent can be avoided. On the other hand, the touch display panel 100 of the above-described embodiment of the present invention can be used in an electronic device, and the manufacturing method of the electronic device also includes the manufacturing method of the touch display panel 1A of the above embodiment. Please refer to FIG. 1 for the function block diagram of the electronic device 300 including the touch display panel 100. The touch display panel 1 can be electrically connected to the electronic component 2 and the electronic device 30A. It should be noted here that the electronic component 2 package 15 201020870

The TW4771PA includes, for example, a control element, an operating element, a processing element, an input element, a memory element, a driving element, a light-emitting element, a protection element, a sensing element, a detecting element, other functional elements, or a combination of the foregoing. Moreover, the types of the electronic device 300 include: a portable product (such as a mobile phone, a camera, a camera, a notebook computer, a game machine, a music player, an electronic mail transceiver, a map navigator, a digital photo frame, or the like), Audio and video products (such as audio and video projectors or similar products), screens, televisions, outdoor / indoor billboards or projector panels. The touch display panel and the electronic device manufacturing method disclosed in the above embodiments of the present invention use a virtual substrate to cover the touch structure, so that in various process steps (for example, yellow light process, etching, splashing) The step of plating and thinning the substrate) avoids scratching of the first substrate and the touch structure. In this way, the thinning step of the first substrate and/or the second substrate can be performed in the process of the touch display panel without damage to the touch structure, thereby further improving the yield of the product. In addition, the above manufacturing method does not limit the type of the touch display panel, and the touch display panel including the capacitive type, the resistive type, the self-luminous display, and the non-self-luminous display can be applied to the manufacturing method of the above-described embodiment of the present invention. It is compatible with the conventional touch display panel process. In the above, the present invention has been disclosed in the above preferred embodiments, but it is not intended to limit the present invention. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. 16 201020870

1 W4//l^A [Simplified Schematic Description] FIG. 1 is a flow chart showing a method of manufacturing a touch display panel according to a preferred embodiment of the present invention; FIG. 2A is a schematic view showing a first substrate; 2A is a top view of the touch structure in FIG. 2A; FIG. 2C is a cross-sectional view taken along line A-A' in FIG. 2B; FIG. 3A is a schematic view showing a virtual substrate disposed on the first substrate; The figure shows a top view of the sealant layer and the first substrate; ® FIG. 4 is a schematic view showing the cover layer formed on the first substrate; FIG. 5 is a schematic view showing the second substrate and the first substrate; A schematic view of the first substrate and the second substrate after the group; FIG. 7 is a schematic view showing the removal of the dummy substrate from the first substrate; FIG. 8 is a schematic view showing the thinning step of the first substrate; FIG. 10 is a schematic diagram showing the function of the thinning process of the second substrate; and FIG. 10 is a functional diagram of the electronic device including the touch display panel. [Main component symbol description] 100: touch display panel 110, 110': first substrate 110a: The first surface 110b of the first substrate: the second surface 111 of the first substrate: Touch structure 111a: conductive layer 17 201020870

TW4771PA lllb: first insulating layer 111c: electrode layer llld: second insulating layer 112: cover layer 120, 120': second substrate 120a: first surface 120b of second substrate: second surface 121 of second substrate: active Structure 130: virtual substrate 140: display medium layer 150: sealant layer 150a: opening 200: electronic component 300: electronic device d: gap g: interval 18

Claims (1)

201020870 1 wh / / ir/\ X. Patent application scope: 1. A method for manufacturing a touch display panel, comprising: providing a first substrate, wherein a first surface of the first substrate has a touch structure; a dummy substrate on the first surface of the first substrate and overlying the touch structure; forming a cover layer on a second surface of the first substrate, the second surface system Relative to the first surface; • providing a second substrate having an active structure on a first surface of the second substrate; pairing the first substrate and the second substrate to the active structure of the second substrate Forming a dielectric layer between the first substrate and the second substrate with respect to the cover layer of the first substrate; and removing the dummy substrate. 2. The method of claim 1, wherein the method of forming the display medium layer comprises using a Drop Droping (ODF) method prior to arranging the first substrate and the second substrate. Forming the display medium layer on the first substrate or the second substrate. 3. The method of claim 1, wherein the method of forming the display medium layer comprises forming the display medium layer by injecting after the first substrate and the second substrate are grouped. Between the first substrate and the second substrate. 4. The manufacturing method of claim 1, after the setting of the virtual substrate, further comprising: 201020870 TW4771PA performing a thinning step on the second surface of the first substrate to thin the first Substrate. 5. The manufacturing method of claim 1, after the pair of the first substrate and the second substrate, further comprising: performing a thinning step on the second surface of the second substrate The second substrate is turned on. 6. The manufacturing method of claim 1, wherein the dummy substrate is disposed on the first substrate via a sealant layer, the sealant layer surrounding the touch structure and having a plurality of openings. The manufacturing method of claim 6, wherein the sealant layer has a gap with the touch structure, and at least four openings respectively correspond to the four corners of the touch structure. 8. The manufacturing method of claim 6, wherein the step of removing the dummy substrate comprises: cutting the dummy substrate and the first substrate and the second substrate after the pair to remove the surrounding The sealant layer of the touch structure. 9. The manufacturing method of claim 1, wherein the step of placing the dummy substrate comprises: spraying a plurality of spacers on the first substrate to enable the dummy substrate and the touch structure Has a spacing. 10. The method of manufacturing of claim 1, wherein the cover layer comprises at least one of an alignment layer, a transparent electrode, and a color filter. A method of manufacturing an electronic device, comprising the method of manufacturing a touch display panel according to claim 1, wherein the method of manufacturing the touch display panel according to claim 1 twenty one