TWI418462B - Method for transferring thin film to substrate - Google Patents

Description

Method for transferring film to substrate

The present invention generally relates to transferring a film to a target substrate, and more particularly to transferring a single layer film of conductive material from a temporary surface to a touch sensitive surface.

There are many types of input devices currently available for performing operations in computing systems, such as buttons or buttons, mice, trackballs, touch sensor panels, joysticks, touch screens, and the like. In particular, touch screens are becoming increasingly popular due to their ease of operation and versatility, as well as their reduced price. The touch screen can include: a touch sensor panel, which can be a transparent panel having a touch sensitive surface; and a display device, such as an LCD panel, which can be partially or completely located in the touch sensor The panel is then such that the touch sensitive surface can cover at least a portion of the viewable area of the display device. The touch screen allows the user to touch the touch sensor panel by using a finger, stylus or other object at a location indicated by a user interface (UI) being displayed by the display device. To perform various functions. In general, the touch screen can recognize the touch event and the location of the touch event on the touch sensor panel, and a computing system can then interpret the touch event based on the display that occurs when the touch event occurs. And thereafter one or more actions can be performed based on the touch event.

In some embodiments, a touch sensor panel can be implemented as an array of pixels formed of a conductive material, such as indium tin oxide (ITO), patterned to span multiple sensing lines. The strips are driven and separated from one another by a dielectric material. The electrically conductive material can be disposed on the back side of the touch sensitive surface to detect a touch received on a front side of the touch sensitive surface. The driving lines and the sensing lines may be formed on opposite sides of a substrate. Alternatively, the drive lines and the sense lines may be formed adjacent to each other or in close proximity on the same layer on a single side of a substrate. A typical substrate for the conductive material can be made of glass or some other transparent substrate that is sufficiently strong to directly fabricate the drive and sense lines thereon. However, with the ever-increasing need for smaller, thinner, flexible and non-flat touch sensor panels, it is difficult and expensive to fabricate drive and sense lines directly on the substrates required for such panels. of.

The present invention relates to the transfer of a single layer of a conductive material from a temporary substrate to a target substrate for use in a device such as a touch sensitive sensor panel. In some embodiments, the transfer can be achieved by: fabricating a block comprising a substrate layer, a single layer film, and a temporary substrate; transferring the block to a target substrate; and removing the temporary substrate . In some embodiments, the transfer can be achieved by: fabricating a large block comprising a substrate layer, a single layer film, and a temporary substrate; cutting the large block into individual smaller blocks; The individual sub-blocks are transferred to a target substrate; and the temporary substrate is removed from each individual sub-block.

In the following description of the preferred embodiments, reference to the drawings Other embodiments may be utilized and structural changes may be made without departing from the scope of the preferred embodiments of the invention.

The present invention relates to the transfer of a single layer film of electrically conductive material to a substrate for use in a device such as a touch sensitive sensor panel. In some embodiments, the transfer can be achieved by patterning a single layer of conductive material on one side of a transfer substrate and then transferring the patterned material from the transfer substrate to a target substrate. This approach advantageously allows the patterned material to be transferred to any target substrate, where the target substrate can be a substrate that is not tolerant to standard manufacturing processes (eg, a soft plastic substrate or a very thin substrate), or A substrate (eg, a non-planar substrate) of the fabrication equipment.

Although embodiments of the invention are described and illustrated herein in terms of a touch sensor panel, it should be understood that embodiments of the invention are not limited to such panels, but are generally applicable to other touch and proximity The panel of the test technology and any substrate onto which the film can be fabricated.

1A illustrates an exemplary film block having a sheet for forming a substrate layer on the surface of the sheet in accordance with an embodiment of the present invention. In the example of FIG. 1A, the sheet 105 has a substrate layer 110 disposed on a surface. The sheet 105 can comprise glass or any other suitable material that can provide a temporary platform for making a film block and then be easily removed from the block. The base layer 110 can include an etch stop material such as tantalum nitride, hafnium oxide or any other suitable material that does not chemically react with chemicals (eg, hydrogen fluoride) that can be used to remove the flakes 105 by chemical etching. The base layer 110 may be deposited on the surface of the sheet 105 by plasma enhanced chemical vapor deposition (PECVD) or any other suitable deposition method. The substrate layer 110 can be rigid, semi-rigid, flexible or deformable depending on the application of the film block.

1B illustrates an exemplary thin film block of FIG. 1A patterned with a single layer of film on one surface of the substrate layer in accordance with an embodiment of the present invention. In the example of FIG. 1B, the pattern of the film 115 may be deposited on a surface of one of the base layers 110 in a single layer. The thin film patterns can be used as conductive traces for carrying signals and can include transparent materials such as a single layer of indium tin oxide (SITO). Although SITO may be referred to herein for illustrative purposes, it should be understood that other conductive materials may also be used in accordance with embodiments of the present invention. The thin film patterns can form part of a touch sensor for carrying a touch image in a touch sensitive device, such as a touch panel. The patterned film can be deposited on one surface of the substrate layer using sputtering or any other suitable method for placing the patterned film 115 on the substrate layer 110.

1C illustrates an exemplary film block of FIG. 1B having a transfer layer adhered to the patterned single layer film by a removable adhesive, in accordance with an embodiment of the present invention. In the example of FIG. 1C, a layer of removable adhesive 120 can coat the patterned film 115. The removable adhesive 120 can include water non-sol or any other suitable material that can temporarily adhere the two layers together and then be dissolved or otherwise removed. A transfer layer 125 can be placed on top of the removable adhesive 120, which helps to adhere the transfer layer to the underlying patterned film 115. The transfer layer 125 can comprise a polymer such as polyethylene terephthalate (PET) or any other suitable material capable of supporting a film block for transfer to a substrate in accordance with embodiments of the present invention. The transfer layer 125 can be laminated or otherwise placed on the removable adhesive 120. The transfer layer 125 can be rigid, semi-rigid, flexible or deformable depending on the application of the film block.

FIG. 1D illustrates the exemplary film block of FIG. 1C with the manufactured sheet removed, in accordance with an embodiment of the present invention. In the example of FIG. 1D, the sheet 105 can be removed to prepare the film block for transfer to a substrate. The sheet 105 can be removed by chemical etching using a chemical such as hydrogen fluoride. Alternatively, the sheet 105 can be removed by mechanical means or a combination of chemical-mechanical methods.

1E illustrates an exemplary substrate having the exemplary film block illustrated in FIG. 1D transferred to a surface of the substrate and adhered to the substrate by a permanent adhesive, in accordance with an embodiment of the present invention. . In the example of FIG. 1E, a layer of permanent adhesive 130 may be laminated or otherwise adhered to the base layer 110 of the film block. The permanent adhesive 130 can be adhered to a surface of the base layer 110 opposite the surface of the base layer on which the patterned film 115 is disposed. The permanent adhesive 130 can be laminated or otherwise adhered to one surface of the substrate 140 along with the film block. Thus, the stacking order can be substrate 140, permanent adhesive 130, substrate layer 110, patterned film 115, removable adhesive 120, and transfer layer 125. Optionally, opaque material 135 can be adhered to the edges of substrate 140 and permanent adhesive 130 to provide an aesthetic edge to the substrate. The permanent adhesive 130 can include any other suitable material that is non-solufiable or capable of permanently adhering the two layers together. The substrate 140 can comprise glass, plastic or any other transparent material. The substrate 140 can be rigid, semi-rigid, flexible or deformable depending on the application of the substrate. In some embodiments, the substrate 140 can be a cover material for a touch sensitive device, wherein the front side of the substrate 140 can receive a touch, and the back side of the substrate can have a film block transferred thereto to detect the received Touch.

1F illustrates the exemplary substrate and film block shown in FIG. 1E with the transfer layer removed from the film block in accordance with an embodiment of the present invention. In the example of FIG. 1F, the transfer layer 125 can be removed from the removable adhesive 120 by delamination or otherwise, and then removed or otherwise removed from the patterned film 115. The removable adhesive from the film removes the transfer layer. Alternatively, the removable adhesive 120 can be dissolved or otherwise removed from the film, thereby removing the transfer layer 125 along with the removable adhesive 120. The resulting substrate and film block are currently ready for further processing. In some embodiments, one end of a flexible circuit can be bonded to the patterned film 115, and an anti-reflective film can be laminated or otherwise coated on the patterned film 115 to further form a Touch sensitive device. Optionally, one or more spacers can be attached to the anti-reflective film to provide a connection for other components of the touch sensitive device.

2 illustrates an exemplary method for transferring a film to a substrate in accordance with an embodiment of the present invention. A glass sheet can be provided as a temporary platform for making a transferable film block. An etch stop layer (e.g., base layer 110 in FIG. 1A) can be applied to the glass sheet (205). The etch stop layer can be deposited, laminated or otherwise applied to the sheet. A single layer of film (210) can be patterned on one of the etch stop layers. For example, the patterned film can be SITO. A transfer layer can be adhered to the patterned monolayer (215) by a removable adhesive. The removable adhesive can be applied to the patterned film and the transfer layer then laminated or otherwise placed on top of the removable adhesive.

After the transferable film block has been fabricated, the glass sheet (220) can be removed. To this end, the film block can be exposed to an etch chemistry that etches away the glass flakes. The etch stop layer protects the remainder of the film stack from chemical damage. Alternatively, a mechanical method can be used to remove the glass flakes. The remaining film stack (including the transfer layer, removable adhesive, patterned film, and etch stop layer) can be transferred to a substrate and adhered to the substrate (225) using a permanent adhesive. The permanent adhesive can be laminated or otherwise adhered to the etch stop layer and then laminated or otherwise adhered to one of the surfaces of the substrate. Thus, the etch stop layer can be closest to the substrate, followed by the patterned film, followed by the removable adhesive, and the transfer layer furthest from the substrate.

The transfer layer and the removable adhesive (230) can be removed from the patterned film. The removable adhesive can be dissolved in a solvent or otherwise removed from the removable adhesive, thereby removing the transfer layer along with the removable adhesive. Alternatively, the transfer layer can be stripped or otherwise removed from the removable adhesive and then the removable adhesive can be dissolved or otherwise removed from the patterned film. The removable adhesive. The resulting substrate-film block combination can be further processed to provide a suitable circuit.

In an alternate embodiment, the etch stop layer can be replaced with a plastic or polyimide layer that can be bonded to one of the glass sheets. The sheet can then be removed from the film block by de-bonding the glass sheet to the plastic or polyimide layer.

FIG. 3 illustrates another exemplary method for transferring a film to a substrate in accordance with an embodiment of the present invention. For cost effectiveness, multiple film patches can be fabricated on a large glass sheet at a time and then separated for transfer to individual substrates. In the example of Figure 3, a large glass sheet can be provided on which a plurality of film blocks will be fabricated from a large film block. A large film block (305) can be fabricated on the glass sheet. The large film block may have a base layer formed on one of the glass sheets, a single layer film (for example, SITO) patterned on one surface of the base layer, and one of the patterned films may be formed on the patterned film. A removable adhesive layer and a transfer layer formed on the removable adhesive layer. The large film block can be fabricated using, for example, the method of FIG.

The glass flakes and the film stack fabricated thereon can be die cut into a plurality of smaller chunks (310). The smaller chunks can be cut to any size suitable for transfer to the substrate. Each of the smaller blocks may include a portion of the glass sheet, a portion of the substrate layer formed on the glass sheet portion, a portion of the patterned film formed on the substrate layer portion, the removable adhesive Forming a portion of the patterned film portion and a portion of the transfer layer formed on the removable adhesive portion.

For each smaller chunk, the glass flake portion can be removed using, for example, the method of FIG. The remainder of the smaller film block can be applied to the individual cover glass (315) by a permanent adhesive. The smaller film block can be applied using, for example, the method of FIG. The transfer layer and the removable adhesive can be removed (320) from the patterned film using, for example, the method of FIG. A flexible circuit can be attached to the patterned film to form a touch panel, wherein the cover glass can receive a touch and the film block attached thereto can detect the touch (325). Optionally, an anti-reflective layer or any other suitable layer can be applied to the patterned film, and a spacer can be attached to the anti-reflective layer to join other components.

4A-4D illustrate an exemplary curved substrate having an exemplary film block transferred thereto in accordance with an embodiment of the present invention. In the example of FIG. 4A, the base layer 410 can be adhered to one of the concave surfaces of the curved substrate 440 by a permanent adhesive 430. A patterned single layer film 415 can be disposed on one surface of the substrate layer 410. In the example of FIG. 4B, the base layer 410 can be adhered to one of the convex surfaces of the curved substrate 440 by a permanent adhesive 430. A patterned single layer film 415 can be disposed on one surface of the substrate layer 410. In the example of FIG. 4C, the curved substrate 440 can have a raised surface and a flat surface opposite the raised surface. The base layer 410 can be adhered to the flat surface of the curved substrate 440 by a permanent adhesive 430. A patterned single layer film 415 can be disposed on one surface of the substrate layer 410. In the example of FIG. 4D, curved substrate 440 can have a concave surface and a flat surface opposite the concave surface. The base layer 410 can be adhered to the flat surface of the curved substrate 440 by a permanent adhesive 430. A patterned single layer film 415 can be disposed on one surface of the substrate layer 410.

The curved substrate can be rigid, semi-rigid, flexible or deformable. The rigidly curved substrate can be permanently formed to be curved. The semi-rigid, flexible, and deformable curved substrate can be dynamically formed to be curved and not formed to be curved. It should be understood that the substrate is not limited to a curved shape, but may include any substantially non-planar surface with which a transferred film block can be associated in accordance with embodiments of the present invention.

Figure 5A illustrates an exemplary film block having a sheet for forming a substrate layer on the surface of the sheet in accordance with an embodiment of the present invention. In the example of FIG. 5A, sheet 505 has a substrate layer 510 disposed on a surface. The sheet 505 can comprise glass or any other suitable material that can provide a temporary platform for making a film block and then be easily removed from the block. The substrate layer 510 can include an etch stop material such as tantalum nitride, hafnium oxide or any other suitable material that does not chemically react with chemicals (eg, hydrogen fluoride) that can be used to remove the sheet 505 by chemical etching. The substrate layer 510 can be deposited on the surface of the sheet 505 by PECVD or any other suitable deposition method. The substrate layer 510 can be rigid, semi-rigid, flexible or deformable depending on the application of the film block.

Figure 5B illustrates an exemplary thin film block of Figure 5A patterned with two spaced apart single layer films on one surface of the substrate layer in accordance with an embodiment of the present invention. In the example of FIG. 5B, the pattern of film 515 may be deposited on a surface of one of the substrate layers 510 in a single layer. The thin film patterns can be used as conductive traces for carrying signals and can include transparent materials such as ITO. The thin film patterns can form part of a touch sensor for carrying a touch image in a touch sensitive device, such as a touch panel. The patterned film can be deposited on one surface of the substrate layer using sputtering or any other suitable method for placing the patterned film 515 on the substrate layer 510.

A separation layer 545 can be disposed on the patterned film 515. The pattern of the film 550 may be deposited in a single layer on the surface of the separation layer opposite to the surface of the separation layer 545 disposed on the patterned film 515. As with the patterned film 515, the thin film pattern 550 can be used as a conductive trace for carrying signals and can include a transparent material such as ITO. The thin film patterns can form part of a touch sensor for carrying a touch image in a touch sensitive device, such as a touch panel. The patterned film can be deposited on one surface of the separation layer using sputtering or any other suitable method for placing the patterned film 550 on the separation layer 545. The separation layer 545 can be rigid, semi-rigid, flexible or deformable depending on the application of the film block. The separation layer 545 can be glass or some other transparent dielectric material. The patterned films 515, 550 can be formed as double layer indium tin oxide (DITO) on opposite sides of the separation layer 545.

In an alternate embodiment, the separation layer 545 can be omitted and the patterned films 515, 550 can be laminated to each other to form a dual SITO.

5C illustrates an exemplary film block of FIG. 5B having a transfer layer adhered to the patterned single layer film by a removable adhesive, in accordance with an embodiment of the present invention. The outermost layer. In the example of FIG. 5C, a layer of removable adhesive 520 can coat the outermost layers of the patterned films 550. The removable adhesive 520 can include water non-sol or any other suitable material that can temporarily adhere the two layers together and then be dissolved or otherwise removed. A transfer layer 525 can be placed on top of the removable adhesive 520, which helps to adhere the transfer layer to the underlying patterned film 515. The transfer layer 525 can comprise a polymer such as PET or any other suitable material capable of supporting a film block for transfer to a substrate in accordance with embodiments of the present invention. The transfer layer 525 can be laminated or otherwise placed on the removable adhesive 520. The transfer layer 525 can be rigid, semi-rigid, flexible or deformable depending on the application of the film block.

Figure 5D illustrates the exemplary film block of Figure 5C with the manufactured sheet removed, in accordance with an embodiment of the present invention. In the example of Figure 5D, the sheet 505 can be removed to prepare the film block for transfer to a substrate. The sheet 505 can be removed by chemical etching using a chemical such as hydrogen fluoride. Alternatively, the sheet 505 can be removed by mechanical means or a combination of chemical-mechanical methods.

5E illustrates an exemplary substrate having the exemplary film block of FIG. 5D transferred to a surface of the substrate and adhered to the substrate by a permanent adhesive, in accordance with an embodiment of the present invention. . In the example of FIG. 5E, a layer of permanent adhesive 530 can be laminated or otherwise adhered to the base layer 510 of the film block. The permanent adhesive 530 can be adhered to a surface of the base layer 510 opposite the surface of the base layer on which the patterned film 515 is disposed. The permanent adhesive 530 can be laminated or otherwise adhered to one surface of the substrate 540 along with the film block. Thus, the stacking order can be substrate 540, permanent adhesive 530, substrate layer 510, patterned film 515, separation layer 545, second patterned film 550, removable adhesive 520, and transfer layer 525. Optionally, an opaque material 535 can be adhered to the edges of the substrate 540 and the permanent adhesive 530 to provide an aesthetic edge to the substrate. The permanent adhesive 530 can include water that is not sol or any other suitable material that can permanently adhere the two layers together. The substrate 540 can comprise glass, plastic or any other transparent material. The substrate 540 can be rigid, semi-rigid, flexible or deformable depending on the application of the substrate. In some embodiments, the substrate 540 can be a cover material for a touch sensitive device, wherein the front side of the substrate 540 can receive a touch, and the back side of the substrate can have a film block transferred thereto to detect Receive the touch.

Figure 5F illustrates the exemplary substrate and film block shown in Figure 5E with the transfer layer removed from the film block in accordance with an embodiment of the present invention. In the example of FIG. 5F, the transfer layer 525 can be removed from the removable adhesive 520 by delamination or otherwise, and then removed or otherwise removed from the patterned film 550. The removable adhesive from the film removes the transfer layer. Alternatively, the removable adhesive 520 can be dissolved or otherwise removed from the film 550, thereby removing the transfer layer 525 along with the removable adhesive 520. The resulting substrate and film block are currently ready for further processing. In some embodiments, one end of a flexible circuit can be bonded to one or both of the patterned films 515, 550, and an anti-reflective film can be laminated or otherwise coated The patterned film 550 is patterned to further form a touch sensitive device. Optionally, one or more spacers can be attached to the anti-reflective film to provide a connection for other components of the touch sensitive device.

Figure 6 illustrates an exemplary method for transferring a film to a substrate in accordance with an embodiment of the present invention. A glass sheet can be provided as a temporary platform for making a transferable film block. An etch stop layer can be applied to the glass flakes (605). The etch stop layer can be deposited, laminated or otherwise applied to the sheet. One or more single layer films (610) may be patterned on one surface of the etch stop layer. For multiple layers, a separate layer can be deposited between each patterned film. For example, the patterned film can be SITO, DITO or dual SITO. A transfer layer can be adhered to the outermost layer (615) of the patterned single layers by a removable adhesive. The removable adhesive can be applied to the patterned film and the transfer layer then laminated or otherwise placed on top of the removable adhesive.

After the transferable film block has been fabricated, the glass sheet (620) can be removed. To this end, the film block can be exposed to an etch chemistry that etches away the glass flakes. The etch stop layer protects the remainder of the film stack from chemical damage. Alternatively, a mechanical method can be used to remove the glass flakes. The remaining film block (including the transfer layer, removable adhesive, one or more patterned films, one or more separation layers, and an etch stop layer) can be transferred to a substrate and permanently bonded The agent adheres it to the substrate (625). The permanent adhesive can be laminated or otherwise adhered to the etch stop layer and then laminated or otherwise adhered to one of the surfaces of the substrate. Thus, the etch stop layer can be closest to the substrate, followed by the one or more patterned films and separation layers, followed by the removable adhesive, and the transfer layer furthest from the substrate.

The transfer layer and the removable adhesive can be removed (630) from the patterned film. The removable adhesive can be dissolved in the solvent or otherwise removed, whereby the transfer layer will be removed along with the removable adhesive. Alternatively, the transfer layer can be stripped or otherwise removed from the removable adhesive and then the removable adhesive can be dissolved or otherwise removed from the patterned film. The removable adhesive. The resulting substrate-film block combination can be further processed to provide a suitable circuit.

In an alternate embodiment, the etch stop layer can be replaced with a plastic or polyimide layer that can be bonded to one of the glass sheets. The sheet can then be removed from the film stack by debonding the glass sheet from the plastic or polyimide layer.

7A illustrates an exemplary mobile phone 736 that can include a touch sensor panel 724, display device 730, and other computing system blocks, wherein the touch sensor panel can be fabricated on one side of a transfer substrate And a plurality of coplanar single-layer touch sensors in the single layer and transferred from the transfer substrate to the back side of the touch sensor panel.

7B illustrates an exemplary digital media player 740 that can include a touch sensor panel 724, a display device 730, and other computing system blocks, wherein the touch sensor panel can have one of a transfer substrate fabricated A plurality of coplanar single-layer touch sensors in a single layer on the side and transferred from the transfer substrate to the back side of the touch sensor panel.

7C illustrates an exemplary personal computer 744 that can include a touch sensor panel (trackpad) 724 and display 730 and other computing system blocks, wherein the touch sensor panel can be fabricated on a transfer substrate. A plurality of coplanar single-layer touch sensors in a single layer on one side and transferred from the transfer substrate to the back side of the touch sensor panel.

The mobile phone, media player, and personal computer of Figures 7A, 7B, and 7C can have a touch sensor that is easy to manufacture and transfer in accordance with an embodiment of the present invention.

FIG. 8 illustrates an exemplary computing system 800 that can include one or more of the embodiments of the invention described above. Computing system 800 can include one or more panel processors 802 and peripheral devices 804, and panel subsystem 806. Peripheral device 804 can include, but is not limited to, a random access memory (RAM) or other type of memory or memory, a watchdog timer, and the like. Panel subsystem 806 can include, but is not limited to, one or more sense channels 808, channel scan logic 810, and driver logic 814. Channel scan logic 810 can access RAM 812, autonomously read data from the sense channels, and provide control of the sense channels. Additionally, channel scan logic 810 can control driver logic 814 to generate various frequency and phase stimulation signals 816 that can be selectively applied to the drive lines of touch sensor panel 824. In some embodiments, panel subsystem 806, panel processor 802, and peripheral device 804 can be integrated into a single application specific integrated circuit (ASIC).

The touch sensor panel 824 can include a capacitive sensing medium having a plurality of driving lines and a plurality of sensing lines, although other sensing media can also be used. According to an embodiment of the invention, either or both of the drive line and the sense line can be fabricated on a transfer substrate and transferred from the transfer substrate to the touch sensor panel. Each intersection of the drive line and the sense line can represent a capacitive sensing node and can be viewed as an image element (pixel) 826 that is considered to capture a touch of the touch sensor panel 824 It can be especially useful. (In other words, the multi-touch panel in which the touch event occurs after the panel subsystem 806 has determined whether a touch event has been detected at each touch sensor in the touch sensor panel. The pattern of the touch sensor can be regarded as the "image" of the touch (for example, the pattern of the finger touching the panel). Each sense line of touch sensor panel 824 can drive sense channel 808 (also referred to herein as an event detection and demodulation circuit) in panel subsystem 806.

Computing system 800 can also include host processor 828 for receiving output from panel processor 802 and performing actions based on the outputs, which can include, but are not limited to, moving objects such as cursors or indicators, scrolling Or pan, adjust control settings, open files or files, view menus, make selections, execute commands, operate peripheral devices coupled to the host device, answer calls, make calls, hang up calls, change volume or audio settings, Store information related to telephone communications (such as address, frequently dialed number, answered calls, missed calls), login to a computer or computer network, restricted access to authorized computers to access computers or computer networks, loading and The user preferences of the computer desktop configuration associated user profiles, permission to access web content, launch specific programs, encrypt or decode messages, and/or the like. Host processor 828 can also perform additional functions that may not be associated with panel processing, and can be coupled to program storage 832 and display device 830, such as an LCD panel, to provide a UI to a user of the device. The display device 830, together with the touch sensor panel 824, can form a touch screen 818 when partially or completely under the touch sensor panel.

Please note that one or more of the above functions may be stored in a memory (eg, one of the peripheral devices 804 in FIG. 8) and executed by the panel processor 802 or stored in the program storage 832. And executed by the firmware executed by the host processor 828. The firmware may also be stored and/or transferred in any computer readable medium for use by or in connection with an instruction execution system, apparatus or device, such as a computer based system, A system containing a processor, or other system that can take instructions from the instruction execution system, apparatus, or device and execute the instructions. In the context of this document, a "computer-readable medium" can be any medium that can contain or store a program for use by or in connection with the instruction execution system, apparatus, or device. The computer readable medium can include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, portable magnetic disk (magnetic), random access memory (RAM) (magnetic), Read-only memory (ROM) (magnetic), erasable programmable read-only memory (EPROM) (magnetic), portable optical disc (such as CD, CD-R, CD-RW, DVD, DVD-R or DVD) -RW), or flash memory (such as a compact flash card, a secure digital card, a USB memory device, a memory stick, and the like).

The firmware may also be propagated in any transmission medium for use by or in connection with an instruction execution system, apparatus or device, such as a computer-based system, a processor-containing system, or Other systems from which the instruction execution system, device, or device takes instructions and executes the instructions. In the context of this document, "transmission medium" can be any medium that can communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device. The transmission readable medium can include, but is not limited to, an electronic, magnetic, optical, electromagnetic or infrared wired or wireless communication medium.

Accordingly, in some embodiments, a method for transferring a film to a substrate is disclosed, the method comprising: providing a flexible transfer block on a manufacturing sheet, the flexible transfer block comprising the placement a flexible layer on the sheet, a patterned single layer film formed on top of the flexible layer, and a transfer layer adhered to the top of the patterned single layer; The flexible layer removes the manufactured sheet; transferring the flexible transfer block to a substrate having a substantially non-planar surface, the flexible layer being adjacent to the substrate; and from the patterned single layer Remove the transfer layer.

In some embodiments where the substantially non-planar surface is a curved surface, the flexible transfer block is transferred to the curved surface of the substrate to conform thereto.

In some embodiments where the substantially non-planar surface is a curved surface opposite a generally planar surface, the flexible transfer block is transferred to the substantially planar surface of the substrate.

In some embodiments in which the substrate is deformable to form a substantially non-planar surface, the flexible transfer block is deformed with the substrate to conform to the deformable substantially non-planar surface of the substrate.

In some embodiments in which the substrate is flexible to form a substantially non-planar surface, the flexible transfer block flexes with the substrate to conform to the flexible substantially non-planar surface of the substrate.

In some embodiments, a method for transferring a film to a substrate is disclosed, the method comprising: forming a film block having a substrate layer formed on a fabrication sheet, forming a layer on the substrate layer a single layer film of a pattern, and a temporary layer adhered to the top of the patterned single layer; the film block is cut into smaller blocks, each smaller block having a portion of the manufactured sheet, the substrate layer a portion of the single layer of film formed on the portion of the substrate, a portion of the pattern formed on the portion of the substrate layer, and a portion of the temporary layer adhered to the portion of the patterned layer a portion of the upper portion; and for each of the smaller chunks, the portion of the fabricated sheet is removed from the portion of the base layer, and the combined portion of the base layer, the patterned single layer, and the temporary layer is applied to A surface of the cover glass, the portion of the base layer adhered to the surface of the cover glass, and the portion of the temporary layer is removed from the portion of the patterned single layer.

In some embodiments, the method further comprises, for each smaller chunk, attaching a flex circuit to the portion of the patterned monolayer after removing the portion of the temporary layer.

In some embodiments, the method further comprises, for each smaller chunk, applying an anti-reflective layer to the portion of the patterned monolayer after removing the portion of the temporary layer.

In some embodiments, the cover glass has a front surface configured to receive a contact and a back surface opposite the front surface, the back surface being adhered to the portion of the base layer.

In some embodiments, the cover glass and the combined portion of the base layer and the patterned monolayer form a touch sensitive device.

In some embodiments, in a system including a sensor panel having a touch surface, the touch surface has a front side configured to receive a touch and a back side opposite the front side A method for transferring a film to the sensor panel, the method comprising: applying a substrate layer to a substrate; patterning at least one single layer film into the substrate layer, the at least one single layer The film includes a conductive material configured to detect the touch; a transfer layer is adhered to the top of the at least one patterned single layer; the substrate is removed from the substrate layer; the combined substrate layer is at least patterned Transferring the single layer and the transfer layer to the back side of the touch surface, wherein the base layer is disposed on the back side and the transfer layer is disposed farthest from the back side; and from the at least one patterned single The layer removes the transfer layer.

In some embodiments, patterning the at least one single layer film comprises: patterning a first single layer film onto the substrate layer; placing a dielectric material on top of the first patterned single layer film And patterning a second single layer film on top of the dielectric material, wherein the transfer layer is adhered to the top of the second patterned single layer.

In some embodiments, patterning the at least one single layer film comprises: patterning a first single layer film onto the substrate layer; and patterning a second single layer film on top of the first single layer, Wherein the transfer layer is adhered to the top of the second patterned single layer.

In some embodiments, a mobile phone including a touch sensor panel is disclosed. The touch sensor panel includes: a touch surface having a configuration to receive a touch front side and a a back side opposite the front side; and a plurality of coplanar single-layer touch sensors configured to detect the touch, the touch sensors being fabricated on one side of a transfer substrate And moving from one side of the transfer substrate to the back side of the touch surface.

In some embodiments, a digital media player including a touch sensor panel is disclosed. The touch sensor panel includes: a touch surface having a configuration configured to receive a touch front side And a back side opposite to the front side; and a plurality of coplanar single-layer touch sensors configured to detect the touch, the touch sensors being fabricated on one of the transfer substrates In a single layer on the side and from the side of the transfer substrate to the back side of the touch surface.

In some embodiments, a computer including a touch sensor panel is disclosed. The touch sensor panel includes: a touch surface having a configuration to receive a touch front side and a The opposite side of the front side; and a plurality of coplanar single-layer touch sensors configured to detect the touch, the touch sensors being fabricated on one side of a transfer substrate And transferring from one side of the transfer substrate to the back side of the touch surface.

Although the present invention has been fully described in connection with the embodiments of the present invention, it will be understood that Such changes and modifications are to be understood as included within the scope of the invention as defined by the appended claims.

105. . . Thin slice

110. . . Base layer

115. . . Film/patterned film

120. . . Removable adhesive

125. . . Transfer layer

130. . . Permanent adhesive

135. . . Opaque material

140. . . Substrate

410. . . Base layer

415. . . Patterned single layer film

430. . . Permanent adhesive

440. . . Curved substrate

505. . . Thin slice

510. . . Base layer

515. . . Film/patterned film

520. . . Removable adhesive

525. . . Transfer layer

530. . . Permanent adhesive

535. . . Opaque material

540. . . Substrate

545. . . Separation layer

550. . . Patterned film

724. . . Touch sensor panel

730. . . monitor

736. . . Exemplary mobile phone

740. . . Exemplary digital media player

744. . . Exemplary personal computer

800. . . Exemplary computing system

802. . . Panel processor

804. . . Peripheral device

806. . . Panel subsystem

808. . . Sensing channel

810. . . Channel scan logic

812. . . Random access memory (RAM)

814. . . Drive logic

815. . . Charge pump

816. . . Stimulus signal

824. . . Touch sensor panel

826. . . Image element (pixel)

828. . . Host processor

830. . . Display device

832. . . Program storage

1A illustrates an exemplary film block having a sheet formed thereon, wherein a substrate layer is on the surface of the sheet, in accordance with an embodiment of the present invention;

1B illustrates an exemplary thin film block of FIG. 1A patterned with a single layer of film on one surface of the substrate layer in accordance with an embodiment of the present invention;

1C illustrates an exemplary film block of FIG. 1B having a transfer layer adhered to the patterned single layer film by a removable adhesive, in accordance with an embodiment of the present invention;

1D illustrates an exemplary film block of FIG. 1C from which the fabricated sheet is removed, in accordance with an embodiment of the present invention;

1E illustrates an exemplary substrate having the exemplary film block illustrated in FIG. 1D transferred to a surface of the substrate and adhered to the substrate by a permanent adhesive, in accordance with an embodiment of the present invention. ;

1F illustrates the exemplary substrate and film block of FIG. 1E removed from the film stack in accordance with an embodiment of the present invention;

2 illustrates an exemplary method for transferring a film to a substrate in accordance with an embodiment of the present invention;

3 illustrates another exemplary method for transferring a film to a substrate in accordance with an embodiment of the present invention;

4A illustrates an exemplary curved substrate having an exemplary film block transferred to a concave surface of the substrate and adhered to the substrate by a permanent adhesive, in accordance with an embodiment of the present invention;

4B illustrates an exemplary curved substrate having an exemplary film block transferred to a raised surface of the substrate and adhered to the substrate by a permanent adhesive, in accordance with an embodiment of the present invention;

4C illustrates an exemplary substrate having a raised surface and a flat surface, wherein an exemplary film stack is transferred to the planar surface of the substrate and adhered to the substrate by a permanent adhesive, in accordance with an embodiment of the present invention;

4D illustrates an exemplary substrate having a recessed surface and a flat surface, wherein an exemplary film stack is transferred to the planar surface of the substrate and adhered to the substrate by a permanent adhesive, in accordance with an embodiment of the present invention;

5A illustrates an exemplary film block having a sheet for making a substrate layer on the surface of the sheet in accordance with an embodiment of the present invention;

5B illustrates an exemplary thin film block of FIG. 5A patterned with two spaced apart single layer films on one surface of the substrate layer in accordance with an embodiment of the present invention;

5C illustrates an exemplary film block of FIG. 5B having a transfer layer adhered to the patterned single layer film by a removable adhesive, in accordance with an embodiment of the present invention. Outermost layer;

Figure 5D illustrates an exemplary film block of Figure 5C from which the fabricated sheet is removed, in accordance with an embodiment of the present invention;

5E illustrates an exemplary substrate having the exemplary film block of FIG. 5D transferred to a surface of the substrate and adhered to the substrate by a permanent adhesive, in accordance with an embodiment of the present invention. ;

Figure 5F illustrates the exemplary substrate and film block of Figure 5E removed from the film stack in accordance with an embodiment of the present invention;

6 illustrates another exemplary method for transferring a film to a substrate in accordance with an embodiment of the present invention;

7A illustrates an exemplary mobile phone having a touch sensor panel including a film transferred thereto, in accordance with an embodiment of the present invention;

7B illustrates an exemplary digital media player having a touch sensor panel including a film transferred thereto, in accordance with an embodiment of the present invention;

7C illustrates an exemplary computer having a touch sensor panel including a film transferred thereto; and

8 illustrates an exemplary computing system including a touch sensor panel utilizing a film transferred thereto in accordance with an embodiment of the present invention.

(no component symbol description)

Claims (14)

A method for forming a plurality of touch sensor panels, the method comprising: forming a thin film block by applying a substrate layer to a fabrication sheet, a layer An inorganic conductive film is patterned into a touch electrode on top of the base layer, and a transfer layer is adhered to the top of the patterned inorganic conductive film; the film block is cut into a plurality of smaller blocks Each of the smaller chunks has a portion of the fabricated sheet, the substrate layer, and the transfer layer; and for each of the smaller chunks, the fabrication is removed from the substrate layer a sheet, the base layer, the patterned inorganic conductive film, and the transfer layer are transferred to a surface of a substrate, the substrate layer is in contact with the substrate, and the patterned inorganic conductive film is patterned. The transfer layer is removed and a flex circuit is attached to the patterned inorganic conductive film. The method of claim 1, wherein patterning an inorganic conductive film into the touch electrode on top of the base layer comprises: forming a plurality of conductive material portions into a coplanar touch sensor. The method of claim 1, wherein the transfer layer is adhered to the patterned The top of the inorganic conductive film comprises: depositing a layer of removable adhesive on the patterned inorganic conductive film; and placing the flexible transfer layer on the removable adhesive layer The top layer is adhered to the patterned inorganic conductive film. The method of claim 1, wherein removing the manufactured sheet from the substrate layer comprises chemically etching the manufactured sheet. The method of claim 1, wherein transferring the base layer, the patterned layer of the inorganic conductive film, and the transfer layer to a surface of a substrate comprises: depositing a permanent adhesive on the surface of the substrate And placing the substrate layer on top of the permanent adhesive to adhere the substrate layer, the patterned inorganic conductive film, and the transfer layer to the surface of the substrate. The method of claim 3, wherein the removing the flexible transfer layer from the patterned inorganic conductive film comprises dissolving the removable adhesive in a solvent. The method of claim 1, wherein the substrate layer comprises an etch stop material. The method of claim 1, wherein the substrate comprises a non-planar surface, and transferring the base layer, the patterned layer of the inorganic conductive film, and the transfer layer to the surface of the substrate comprises: The layer, the patterned inorganic conductive film of the layer, and the combined deformation of the transfer layer conform to the non-planar surface of the substrate. The method of claim 1, wherein the inorganic conductive film comprises indium oxide tin. The method of claim 1, wherein the transfer layer comprises a polymer. The method of claim 1, wherein the substrate layer comprises plastic. The method of claim 11, wherein applying the substrate layer to a manufacturing sheet comprises bonding the plastic to the manufacturing sheet. The method of claim 11, wherein removing the manufactured sheet from the substrate layer comprises de-bonding the plastic to the manufactured sheet. The method of claim 1, wherein the substrate is a cover material for one of the touch sensitive devices.