201008426 六、發明說明： 【發明所屬之技術領域】 本發明，係有關於在將配線層與絕緣層交互作了層積 之多層印刷基板中，爲了將相鄰接之配線層作層間連接， 而被配置在絕緣層內之通孔中的導電體之製造方法。 【先前技術】 0 在先前技術之多層印刷配線基板中，例如，係如同在 美國專利公報6889433 (對應於日本特開2001-24323號公 報）中所記載一般，在被形成於作爲絕緣層之樹脂薄膜處 的通孔內，塡充將在導電性之金屬粒子中添加了導電性之 塡充物或是樹脂粒子者與溶劑相混合並作了攪拌的導電糊 ，並使用此導電糊來進行相鄰接之配線層（電路圖案層） 的層間連接。 但是，當將導電糊塡充於通孔中時，爲了不使導電糊 φ 附著在通孔以外之樹脂薄膜的表面上，係在成爲通孔之導 電糊塡充入口側的樹脂薄膜之表面上，貼著有保護薄膜。 爲了在此種貼著了保護薄膜之樹脂薄膜上形成通孔，例如 ，係從保護薄膜側而照射有雷射光。藉由此雷射光之照射 ，而形成將被形成在與樹脂薄膜之保護薄膜的貼著面相反 側之面上的電路圖案層作爲底面之有底孔。將此有底孔作 爲通孔，並將導電糊塡充在該通孔內。而，在導電糊之塡 充後，係將保護薄膜從樹脂薄膜而剝離，並得到在通孔內 塡充了導電糊之樹脂薄膜。 -5- 201008426 如先前技術一般，當使用保護薄膜而將導電糊塡充在 通孔中的情況時，首先，係有必要經由雷射加工等，來在 保護薄膜以及樹脂薄膜上形成成爲通孔之有底孔。在此有 底孔之形成時，係必定會產生加工屑。於此，導電糊，係 被塗布在保護薄膜上，並經由以刷毛等來推入至通孔內， 而被作塡充。故而，若是加工屑附著在保護薄膜的表面上 ，則在對於通孔內之導電糊的塡充時，會產生該加工屑被 混入至導電糊中的可能性。若是此種加工屑混入至被塡充 於通孔中之導電糊中，則會成爲使層間連接之信賴性降低 的重要原因。因此，係必須要頻繁地對導電糊作交換，而 使製造成本提高。 又，在將保護薄膜剝離時，亦會有產生導電糊之崩壞 或是導電糊之落下至樹脂薄膜上的可能性。在此種情況中 ，可以想見，會有使層間連接之連接信賴性降低，或是產 生短路不良等的問題之事態。 【發明內容】 本發明，係爲有鑑於此種問題而進行者，其目的，係 在於提供一種：在多層印刷基板中，能夠將層間連接之連 接信賴性提昇的層間連接用導電體之製造方法。 本揭示之其中一種形態所致的導電體之製造方法，係 爲在將配線層與絕緣層交互作了層積之多層印刷基板中， 爲了將相鄰接之配線層作層間連接，而被配置在絕緣層內 之通孔處的導電體之製造方法’並具備有塡充工程、和加 -6 - 201008426 ，係 閉空 的溝 前述 中， 性移 ，並 述加 留在 件之 動構 述模 在取 溝部 層之 了的 故而 用保 此， 而， 壓工程、和切離工程、以及取出工程。在塡充工程中 在密閉空間內塡充銀粒子與錫粒子之混合粉體，該密 間’其中一面係由具備有對應於應形成之導電體形狀 部之模構件所成，而該模構件之對向面，係由可對於 模構件而相對性地移動之移動構件所成。在加壓工程 係使前述移動構件以接近前述模構件的方式來作相對 動，而對被塡充在前述密閉空間中之混合粉體作加壓 推入至前述模構件之溝部中。在切離工程中，係在前 壓工程後，爲了將無法塞入前述模構件之溝部中而殘 前述模構件表面上的混合粉體，從被推入了前述模構 溝部中的混合粉體來切離，而在前述模構件與前述移 件之間，使構成前述密閉空間之側面構件與殘留在前 構件表面上之混合粉體一同地在前述模構件上滑動。 出工程中，係從前述模構件之溝部，來將由對應於該 之形狀的前述混合粉體所成之導電體取出。 在此種導電體之製造方法中，係預先製作與絕緣 通孔的形狀相對應之導電體。而後，如此這般所製作 導電體，係在絕緣層之各通孔內被個一個地作配置。 ，不會有加工屑混入至導電體中之虞，又，不需要使 護薄膜，即能夠將導電體配置在絕緣層之通孔內，因 亦不會產生保護薄膜之剝離時的導電糊之崩壞等。故 能夠對於層間連接之信賴性的降低作抑制。 本揭示之另外一種形態所致的導電體之製造方法，係 爲在將配線層與絕緣層交互作了層積之多層印刷基板中， 201008426 爲了將相鄰接之配線層作層間連接，而被配置在絕緣層內 之通孔處的導電體之製造方法，並具備有印刷工程、和加 熱工程、以及回收工程。在印刷工程中，係以使其具備有 與應形成之導電體形狀相對應之形狀的方式，而將把銀粒 子與錫粒子混合在溶劑中所製造了的導電糊，印刷在耐熱 板上。在加熱工程中，係將被印刷有前述導電糊之耐熱板 ，藉由蒸氣式回銲裝置來以數秒尺度的時間而加熱至前述 錫粒子之融點以上的溫度。在回收工程中，係將藉由前述 加熱而被固化了的導電體，從前述耐熱板而回收。 在此導電體之製造方法中，亦係預先製作與絕緣層之 通孔的形狀相對應之導電體。如此這般所製作了的導電體 ，係在絕緣層之各通孔內被一個一個地作配置。故而，不 會有加工屑混入至導電體中之虞。又，不需要使用保護薄 膜，即能夠將導電體配置在絕緣層之通孔內，因此，亦不 會產生保護薄膜之剝離時的導電糊之崩壞等。故而，能夠 對於層間連接之信賴性的降低作抑制。 【實施方式】 首先，使用圖1A〜圖1F，對於使用有藉由本發明之 各實施形態所製造的層間連接用導電體之多層印刷基板的 製造方法之其中一例作說明。 如圖1A中所示一般，首先，準備在身爲絕緣性基材 之樹脂薄膜1的單側表面上貼著有身爲導體之金屬層2的 薄膜。樹脂薄膜1，例如，係爲由聚醚醚酮樹脂65〜35重 -8 - 201008426 量％與聚醚醯亞胺樹脂35〜65重量％所成的厚度25〜 75μιη之熱可塑性樹脂薄膜。金屬層2，例如係藉由厚度 18μιη之銅箔而形成。 接著，實施在樹脂薄膜1之表面上形成藉由導體所構 成的電路圖案3之電路圖案形成工程。電路圖案形成工程 ，雖係可藉由蝕刻、印刷、蒸鍍、電鍍等來進行，但是， 在本實施形態中，如圖1Β所示，係對被貼著於圖1Α之樹 Λ 脂薄膜1上的金屬層2作蝕刻，而將金屬層2形成爲所期 望之圖案3，而在單面處作成第1電路圖案層（配線層） 10 ° 接著，如圖1C中所示一般，藉由在未被設置有電路 圖案層10之側的樹脂薄膜1表面上照射二氧化碳雷射， 而在樹脂薄膜1上形成複數個的以電路圖案3作爲底面之 有底的通孔4(通孔形成工程）。各通孔4之開口徑，例 如係爲ΙΟΟμιη〜150μιη左右，在後述之導電體配置工程中 φ 所被配置之1個的導電體（九片體）5，係爲可被容納於 通孔4內之大小。亦即是，通孔4之開口尺寸’係被形成 爲較被形成爲圓柱狀之導電體5的成爲最大直徑之部分而 些許大。 成爲通孔4之底面的電路圖案3之部位’係爲在將複 數之樹脂薄膜1多層化時，成爲用以進行電路圖案3之層 間連接的電極之部位。在通孔4之形成中’係藉由對二氧 化碳雷射之輸出與照射時間等作適當的調整，而設爲不會 在電路圖案3上開孔。 -9- 201008426 在通孔4之形成中，除了使用二氧化碳雷射以外，亦 可使用準分子雷射等。雖然亦可使用雷射以外之鑽頭加工 等的通孔形成方法，但是，雷射束所致之開孔加工，係能 夠以細微之口徑來開孔，且不會對電路圖案3造成過度的 損傷，故爲理想。 接下來，如圖1D中所示一般，將導電體5在各通孔 4中各配置1個（導電體配置工程）。導電體5，例如係 可使用在通孔4之形成位置處而具備有貫通孔之金屬遮罩 ，來配置在通孔4內。具體而言，導電體5係在金屬遮罩 上被作複數載置，並藉由刮槳板（squeegee)—般之刷毛 來使導電體5移動。如此一來，在金屬遮罩之被形成有貫 通孔的位置處，導電體5係落下至通孔4中。藉由此，能 夠將導電體5 —個一個地配置在各通孔4內。又，爲了將 導電體5配置在通孔4內，亦可不使用金屬遮罩，而在樹 脂薄膜1上藉由刷毛等來使導電體5移動，並將殘餘之多 餘的導電體5回收。 藉由此導電體配置工程而被作了配置之狀態的導電體 5，在將各樹脂薄膜1作層積時，爲了確實地進行與相鄰 接之樹脂薄膜1的電路圖案間之電性連接，故係以成爲與 通孔4之開口邊緣部的表面相同之高度或是僅些許地突出 爲理想。又，在通孔4內，於通孔4之內周面與導電體5 之外周面之間，係以被形成有空隙爲理想。此係因爲，爲 了能夠容易地將導電體5配置在通孔4內，以及當在後續 之加熱•加壓工程中而使導電體5變形的情況時’能夠以 -10- 201008426 將上述空隙塡埋的方式來使導電體5變形之故。 接著’如圖1E中所示一般，將經由圖ία〜圖1D之 工程所製造了的於單面上被形成有電路圖案3且於通孔4 內被配置有導電體5的樹脂薄膜1，作複數枚的層積。而 後’對於將樹脂薄膜1作了複數枚層積後之層積體，藉由 未圖示之真空加熱衝壓機，而在真空條件下來一面從上下 兩面作加熱一面作加壓。在此加熱•加壓工程中，例如， 0 係將樹脂薄膜1之層積體加熱至250〜350 °C，同時，在1 〜lOMPa的壓力下來作10〜20分鐘間的加壓。 藉由上述之加熱•加壓工程，複數枚之樹脂薄膜1係 相互被作熱融著’並一體化。進而，通孔4內之導電體5 係被燒結，並與位置在其之兩端處的電路圖案3作金屬結 合。具體而言，導電體5中之銀粒子與錫粒子係合金化， 同時，導電體5之錫成分與構成電路圖案3之銅箔的Cu 成分係相互作固相擴散，並在導電體5與電路圖案3之間 Q 的介面處形成固相擴散層。藉由此，而得到藉由導電體5 來將相鄰接之電路圖案3作了電性層間連接之多層印刷基 板 1 0 0。 (第1實施形態） 接著，針對本發明之第1實施形態中的層間連接用導 電體5之製造方法作說明。首先，使用圖2，針對導電 體5之製造裝置作說明。 於圖2中，鑄模20，係被形成爲略筒狀。該筒狀內部 -11 - 201008426 中’係被投入有由銀粒子與錫粒子所成之混合粉體，並將 該混合粉體作保持。在本實施形態中所使用之混合粉體， 係如上述一般，爲由銀粒子與錫粒子所成。但是，銀粒子 ，由於若是不進行任何處理，則銀粒子彼此係容易固結， 因此，係於該表面上，包覆有作爲分散材之硬脂酸。藉由 此，將銀粒子與錫粒子作了混合之混合粉體，係能夠維持 良好的流動性。另外，在本實施形態中，由於係並沒有必 要將混合粉體糊化，因此，在混合粉體中，係並未包含有 任何的溶劑等。 九片模21，係爲被形成有多數之對應於應形成的導電 體（九片）5之形狀的形狀之溝（貫通孔）者。此九片模 21，例如係爲藉由不鏽鋼合金等所構成。上述之鑄模20, 係被搭載於九片模21上。在與對於鑄模20而被配置有九 片模21之側的相反側之鑄模20的開口部處，衝頭22係 可滑動地被插入於鑄模20之內面。藉由此，在鑄模20之 內部，係被形成有密閉空間，該密閉空間，其中一面係由 九片模21之表面所成，而其之對向面係由衝頭22之前端 面所成。 在此製造裝置中，鑄模20係對應於側面構件，而九 片模21係對應於模構件，衝頭22係對應於移動構件。 九片模21，係被支持於基底23上。基底23，係於其 之中央部處具備有九片模21之支持部，於該支持部與周 邊部之間，係被設置有階段差。以與該階段差相卡合的方 式，而在基底23上設置有殼體25。此殼體25，係以使鑄 -12- 201008426 模20以及九片模21相對於基底23而不會偏移的方式， 來將鑄模20以及九片模21作保持者。 但是，如後述一般，鑄模20，係有必要沿著與九片模 21之表面相平行的方向而在九片模21之表面上作滑動。 因此，係沿著該滑動方向，而在殼體25與鑄模20之間設 置有空隙2 6。 如此這般，爲了就算是在殼體25與鑄模20之間被設 _ 置有空隙26，亦能夠在使鑄模20作滑動的滑動時以外之 期間而將鑄模20保持在殼體25上，故在殼體25處，係 從左右兩方向而插入有可動桿24。此可動桿24之前端， 由於係與鑄模20之外面相抵接，因此，就算是存在有空 隙26，鑄模20亦係經由殼體25 (可動桿24 )來以使其之 位置不會偏移的方式而被作保持。可動桿24，例如係被螺 絲鎖入至被形成在殼體25處之螺溝內，若是被朝向一方 向旋轉，則前端部係進入至殻體25內之更深處，而若是 φ 被朝向相反方向旋轉，則係後退。 針對使用如同上述一般地被構成之導電體5之製造裝 置來製造導電體5的方法作說明。 首先，如圖2中所示一般，使左右兩側之可動桿的前 端抵接於鑄模20，並將鑄模20牢固地保持在殻體25上。 而後，從衝頭22之被插入至鑄模20的開口部處，來將銀 粒子與錫粒子之混合粉體投入至鑄模20的內部，之後， 將衝頭22插入至鑄模20中（粉體塡充工程）。藉由此， 混合粉體，係成爲被塡充在經由鑄模20和九片模21以及 -13- 201008426 衝頭22所形成的密閉空間中的狀態。 將導電體5之製造裝置’經由未圖示之衝壓裝置來從 上下方向作挾持，並如圖3中所示一般’使衝頭22相對 於九片模21來作相對性移動’而對於密閉空間內部之混 合粉體作加壓（加壓工程）。藉由此’密閉空間內之混合 粉體，係被推入至九片模21之溝部中。此時，例如，係 以對於混合粉體而施加15〇Mpa以上之荷重的方式來施加 壓縮，並保持90秒左右。其結果’混合粉體，由於係被 強力地壓縮，因此，如圖4中所示一般’係被無空隙地作 緻密成形並結合。因此，能夠對於經由九片模21之溝部 所形成的導電體5之機械性強度以及形狀維持性充分地作 確保，而能夠使將導電體配置在通孔中時之電性導電性提 昇。 若是上述之加壓工程結束，則係將導電體5之製造裝 置從衝壓裝置而取出。而後，如圖5中所示一般，使可動 桿24旋轉，並使鑄模20相對於九片模21而作數釐米的 移動。此時，鑄模20，由於其之朝向與九片模21之表面 相垂直的方向之移動係藉由殼體25而被作限制，因此， 係不會從九片模21而浮起，而以在九片模21之表面上滑 動的方式來移動。又，當使鑄模20移動時，由於係成爲 維持在將衝頭22插入至鑄模20中的狀態，因此，衝頭22 亦係在與九片模21之表面相平行的方向上移動。 如此這般，若是使鑄模20以及衝頭22在與九片模21 之表面相平行的方向上移動，則藉由鑄模20以及衝頭22 -14- 201008426 而被保持之九片模21的表面上所殘留之混合粉體’亦係 與鑄模20以及衝頭22 —同地在與九片模21之表面相平 行的方向上移動。 於此，在上述之加壓工程中，衝頭22，係對被塡充在 密閉空間內之混合粉體全體作加壓。因此，能夠將混合粉 體緻密地推壓進入九片模21之溝部中，另一方面，被推 入至九片模21之溝部內的混合粉體，係亦會與殘留在九 _ 片模21之表面上的混合粉體一體化。 因此，在本實施形態中，係如同上述一般，而實施使 鑄模20以及衝頭22與所保持之混合粉體一同地在與九片 模21之表面相平行的方向上作移動（滑動）的切離工程 。藉由此，能夠將在加壓工程中而被一體化了的九片模21 之溝部內的混合粉體與殘留在九片模21之表面上的混合 粉體作切離。 特別是，在本實施形態中，由於係在藉由衝頭22而 Q 將混合粉體作壓抑的狀態下’而實施上述之切離工程，因 此，在切離工程中，能夠對於九片模21之溝部內的混合 粉體從溝部內而浮起一事作抑制。其結果，能夠沿著九片 模21之表面而將溝部內的混合粉體與九片模21之表面上 的混合粉體作切離。 在實施了切離工程後，如圖6中所示一般，將九片模 21與基底23 —起地來從殼體25而取出。取出了的九片模 21，係如圖7中所示一般，被放置在加熱器30上並被加 熱（加熱工程）。此加熱工程，例如，係在較硬脂酸之融 -15- 201008426 點（約70 °C )爲更高之120〜150 °C的溫度下，而進行3〜 5分鐘。 如同上述一般，銀粒子’由於粒子彼此係容易固結， 因此，若是在銀粒子原本的狀態下’則其之作爲粉體的流 動性係降低。故而，在本實施形態中’係在銀粒子之表面 上包覆作爲分散材之硬脂酸’而確保混合粉體之流動性。 但是，當對混合粉體加壓並使其一體化時’該硬脂酸反倒 會有使結合力變弱之虞。因此’如上述一般，在切離工程 後，實施加熱工程，並將九片模21加熱至能夠使硬脂酸 溶融的溫度。藉由此，在混合粉體中，由於能夠促進銀粒 子彼此之固結，因此，混合粉體之結合力係變強，而能夠 使機械性強度或是形狀維持力更進而提昇。 在加熱工程後，如圖8中所示一般，將導電體（九片 )5從九片模21之溝部而取出（取出工程）。此取出工程 ，例如，係在將九片模21搭載於九片收集殼體31處的狀 態下，而以使九片模21彎曲的方式來施加外力。在本實 施形態中，爲了提昇生產性，在九片模2 1處，係被形成 有多數之溝部，並且，各個的溝部之口徑（導電體之尺寸 )，係爲非常小（例如直徑爲ΙΟΟμιη〜150μιη )。因此， 相較於對於各個的導電體（九片）5而施加某種之外力並 從九片模21來取出，係以對於九片模21而以使其彎曲的 方式來施加外力並將導電體5取出爲較容易且較有效率。 藉由實施上述之各工程，能夠得到用以進行多層印刷 基板之層間連接的對應於樹脂薄膜1之通孔形狀的導電體 -16- 201008426 於此，在圖9A、圖9B中’展示藉由上述之各工程而 製造了的導電體5之其中一例。由圖9A、圖9B中’可以 觀察到，包含有銀粒子與錫粒子之混合粉體’係成爲了非 常緻密之圓柱形狀。藉由此’可以得知，係得到了電性連 接信賴性、耐久性均爲良好的導電體5。 如上述一般，在本實施形態所致之導電體5的製造方 法中，係不需要如同先前技術一般地而將導電糊塡充於樹 脂薄膜（絕緣層）的通孔中，而係以使能夠將相鄰接之配 線層作層間連接的方式來預先製作對應於絕緣層之通孔的 形狀之導電體。如此這般所製作了的導電體，係在絕緣層 之各通孔內被一個一個地作配置。故而，不會有加工屑混 入至導電體中之虞。又’由於並不需要使用保護薄膜，即 能夠將導電體配置在絕緣層之通孔內，因此，亦不會產生 保護薄膜之剝離時的導電糊之崩壞等。由於此些理由，藉 φ 由使用預先對應於通孔之形狀的導電體，能夠對於層間連 接之信賴性降低一事作抑制。 (第2實施形態） 接著，針對本發明之第2實施形態中的層間連接用導 電體5之製造方法作說明。 首先，如圖1 〇中所示一般，將被形成有對應於應形 成之導電體5的形狀之複數的孔部123之薄片狀遮罩122 ，載置在耐熱板121上。例如，薄片狀遮罩122，係由金 -17- 201008426 屬製之金屬遮罩所成，耐熱板，係由氟素樹脂或是鐵弗龍 (註冊商標）等之樹脂性的板所成。 而後，如圖1 〇中所示一般，使用刮漿板一般之刷毛 124，而將在第1溶劑中混合銀粒子與錫粒子所製造的導 電糊125，塡充至薄片狀遮罩122之複數的孔部123中。 薄片狀遮罩122之孔部123的開口 口徑以及厚度，例如， 係考慮加熱時之收縮量，而設爲Φ150μιηχ60μιη。又，導 電糊125，係爲將銀粒子與錫粒子混合在身爲單萜烯醇（ Monoterpene Alcohol)的一種之松油醇中所製造者。於銀 粒子中，係爲了防止銀粒子彼此之固結，而被包覆有由硬 脂酸所成之分散材。藉由此，銀粒子與錫粒子係在第1溶 劑中均一地分布。 如圖11中所示一般，若是結束了對於薄片狀遮罩122 之孔部123的導電糊125之塡充，則如圖12中所示一般 ，將薄片狀遮罩122，朝向與耐熱板121之導電糊125的 印刷面相垂直的方向移動。如此這般，薄片狀遮罩122, 若是導電糊125之塡充結束，則係從耐熱板121而被除去 。其結果，在耐熱板1 2 1上，係被印刷形成有對應於所期 望之導電體形狀的形狀之導電糊125。 被印刷了導電糊125之耐熱板121，係藉由於圖13中 所示之蒸氣式回銲裝置（VPS裝置），130而被進行回銲 加熱。亦即是，當導電糊125被加熱時，薄片狀遮罩i 22 係被除去，且導電糊125之側面亦被露出。VPS裝置130 ，係如同週知一般，藉由以加熱器1 3 1來將氟素系惰性液 -18- 201008426 體132加熱，而使其氣化，並將該蒸氣作爲熱媒體，而能 夠在對應於氟素惰性液體132之沸點的溫度下來進行回靜 加熱者。另外，在此VPS裝置130中，係可依存於所使用 之液體的種類，而使回銲加熱溫度改變。又，藉由以對氟 素系惰性液體1 32作加熱之加熱器1 3 1的溫度來使蒸氣的 量作變化，亦能夠對回銲加熱溫度作調節。此係因爲，若 是蒸氣之量有所增減，則透過蒸氣所供給至工件處之熱量 & 亦會有所增減，因此而能夠對回銲加熱溫度作調節之故。 在本實施形態中，係藉由V P S裝置1 3 0，而將被印刷 有導電糊125之耐熱板121，僅以數秒尺度的短時間而加 熱至錫之融點（約232 °C )以上的溫度。於此，所謂數秒 尺度，係指1秒以上未滿10秒，例如係爲3秒。 如上述一般，在用以將樹脂薄膜1作層積並形成多層 基板100的加熱加壓工程中，被配置在樹脂薄膜1之通孔 4中的導電體5，係有必要與樹脂薄膜丨一同變形。此事 0 ’換言之，係代表，在導電體5中，係有必要使錫以及銀 分別作爲單獨之成分而殘留。此係因爲，若是錫以及銀作 爲單獨之成分而殘留，則在用以形成多層基板1 00之加熱 加壓工程中，由於錫成分係溶融，因此能夠使導電體5變 形之故。若是導電體5之略全體爲由錫以及銀之合金所成 的情況時，則其之融點係變得非常高（400 °C以上），同 時’導電體5係變得非常硬。因此，在上述之加熱加壓工 程中’導電體5之變形係成爲困難，同時，會變得無法與 電路圖案3作金屬接合，而會顯著地對連接信賴性造成損 -19- 201008426 害° 關於此點，在本實施形態中，由於係經由VPS裝置 1 3 0，而僅以數秒尺度之短時間來對導電糊1 2 5作加熱， 因此，係僅有一部分的錫粒子會與銀粒子合金化。故而， 在藉由以VPS裝置130來對導電糊125加熱所製造的導電 體5中，除了錫與銀之合金部分以外，錫以及銀係分別作 爲單獨之成分而殘留。故而，上述之導電體5，當在作爲 層間連接用導電體而被配置在樹脂薄膜1之通孔4中的狀 態下，而藉由加熱以及加壓而使複數枚之樹脂薄膜1被一 體化時，導電體5，係能夠與樹脂薄膜1 一同變形。又， 導電體5之錫成分，係成爲能夠與電路圖案3之Cu成分 相互擴散並作金屬接合。藉由此，經由導電體5，而能夠 將相鄰接之電路圖案3作良好的層間連接。 於此，錫粒子，通常，其表面係經由氧化錫而被包覆 。因此，當使導電糊125之錫粒子的一部分與銀粒子合金 化並製造導電體5時，於回銲加熱中，係有必要將該氧化 錫破壞。在本實施形態中，作爲回銲裝置，藉由使用 VPS 裝置130，而解決了此問題。亦即是，在VPS裝置130中 ，身爲熱媒之蒸氣，係在接觸到低溫之工件（導電糊125 )時液化，並產生體積之急遽的收縮（爆縮）。此爆縮之 能量，係突破錫粒子表面之氧化錫。其結果，從氧化錫之 被破壞的場所起，溶融後之錫係流出，並成爲能夠與銀粒 子合金化。如此這般，在導電體5中，藉由錫粒子之一部 分與銀粒子合金化，而能夠確保作爲層間連接用導電體之 -20- 201008426 充分的強度。 在VPS裝置130所致之回銲加熱後，進行冷卻以及乾 燥，而後，使用圖14中所示之裝置140，而將導電體5回 收。圖14中所示之裝置140，係在內部作爲洗淨液而被塡 充有第2溶劑142。又，在裝置140之其中一面處，係被 裝著有超音波振動元件141。於此，第2溶劑142，係爲 與第1溶劑相異者，並以超音波之傳達以及九片之飛散防 I 止爲目的而被使用。作爲第2溶劑142，只要不會對九片 Ο 的品質造成影響，則能夠使用任意之溶劑，例如，係使用 乙醇。 搭載有導電體5之耐熱板121，係被浸漬在圖14中所 示之裝置140的第2溶劑142中。第2溶劑142，係於該 狀態下，藉由驅動超音波振動元件141，而使耐熱板121 藉由經由第2溶劑142所傳達而來之超音波而振動。藉由 此振動，被搭載在耐熱板121上之導電體5，係從耐熱板 φ 121而分離，並被放出至第2溶劑142中。藉由導電體5 在第2溶劑142中浮游一事，能夠將附著在導電體5處之 煤等的不純物除去。如此這般，於圖14中所示之裝置140 ，係亦具備導電體5之洗淨作用。而後，將第2溶劑142 中之導電體5，使用未圖示之濾網來作回收。 藉由以上之製造方法，而能夠製作與樹脂薄膜1之通 孔4的形狀相對應之導電體5。如此這般所製作了的導電 體5，係在樹脂薄膜1之各通孔4內被一個一個地作配置 。故而’不會有如同先前技術一般之加工屑混入至導電體 -21 - 201008426 5中之虞。由於此些理由，藉由使用預先對應於通孔4之 形狀的導電體，能夠對於層間連接之信賴性降低一事作抑 制。 特別是’在本實施形態中，係如同上述一般，藉由使 用VPS裝置130來對包含有銀粒子以及錫粒子之導電糊 125作回銲加熱’而製造了導電體5。因此，能夠在將被 印刷形成於耐熱板121上之導電糊125的形狀作保持的同 時’而製造具備有作爲層間連接用導電體所必要的強度之 例如，作爲回銲裝置，若是並非使用上述之VPS裝置 130，而係使用藉由以加熱器或是紅外線來提昇工件之氛 圍溫度而進行回銲加熱的裝置之情況時，則就算是加熱至 260 °C，亦無法得到作爲層間連接用導電體所必要的強度 。可以想見，此係因爲，若是僅提昇工件之氛圍溫度，則 係無法破壞上述之錫粒子表面的氧化錫（氧化錫之融點係 超過100(TC )，而由於該氧化錫，錫與銀間之合金化係被 妨礙之故。 另外，在本實施形態中，爲了製造包含有錫粒子與銀 粒子之導電糊，作爲第1溶劑，係使用松油醇。作爲第1 溶劑，除了松油醇以外，例如亦可考慮包含松香以及活性 劑之助溶劑（flux )。然而，當使用助溶劑的情況時，由 於該活性劑之作用，錫粒子之表面的氧化被膜係被除去， 而銀粒子與錫粒子間之濕濡性係增加。因此，當藉由V P S 裝置130而對導電糊125作了加熱時，將導電糊125維持 -22- 201008426 在被印刷至耐熱板121上時之形狀一事，係爲困難。相對 於此，在松油醇中，由於係並不具備有如同助溶劑一般之 活性作用，因此，能夠將導電糊125之形狀維持爲略原樣 地而製造導電體5。 圖15A，係爲展示使用當作爲第1溶劑而使用松油醇 的情況時所得到之導電體5的圖，圖1 6 A，係爲圖1 5 A中 所示之導電體5的擴大圖，圖17A，係爲當使用此導電體 I 5來在多層基板1〇〇中而將相鄰接之電路圖案3作層間連 接時的導電體5之剖面的圖。另一方面，圖15B，係爲展 示使用當作爲第1溶劑而使用助溶劑的情況時所得到之導 電體5的圖，圖16B，係爲圖15B中所示之導電體5的擴 大圖，圖17B，係爲當使用此導電體5來在多層基板1〇〇 中而將相鄰接之電路圖案3作層間連接時的導電體5之剖 面的圖。 如同由圖15B、圖16B而能夠確認一般，當將助溶劑 φ 作爲第1溶劑而使用的情況時，導電體5，係無法維持導 電糊125之圓柱形狀，而成爲接近半球形狀。相對於此， 當將松油醇作爲第1溶劑而使用的情況時，如同由圖15A 、圖1 6 A而能夠確認一般，導電體5，係幾乎維持在圓柱 形狀。其結果，在使用助溶劑的情況時之導電體5，由於 係無法將樹脂薄膜1之通孔4內的空間充分地塡埋，因此 ，如圖17B中所示一般，在層間連接時，係於各處而產生 有空孔，但是，當使用有松油醇的情況時之導電體5,係 如圖17A中所不一般，層間連接時之空孔，係成爲僅有極 -23- 201008426 少數。由此，可以得知，在製造層間連接用之導電體時， 作爲第1溶劑，係以使用松油醇爲理想。 (其他實施例） 本發明，係將合適之實施形態作爲參考並作了記述， 但是，應理解到，本發明，係並不被該實施形態或是構造 所限定。本發明，係亦包含有各種之變形例或是在均等範 圍內之變形。進而，應理解到，適當之各種的組合或是形 態、或者是包含該些中之其中一要素或是其以上又或是其 以下之其他的組合或是形態，亦係被包含於本發明之範疇 或是思想範圍內。 例如，在上述實施形態中，作爲樹脂薄膜1，係使用 有由聚醚醚酮樹脂65〜35重量％與聚醚醯亞胺樹脂35〜 65重量％所成之熱可塑性樹脂薄膜。但是，樹脂薄膜，係 並不被限定於此，亦可爲在聚醚醚酮樹脂與聚醚醯亞胺樹 脂中而塡充了非導電性塡充物之薄膜，且亦可使用聚醚醚 酮（PEEK)、聚醚醯亞胺（PEI)、液晶薄膜等。 又，在上述之第1實施形態中，於導電體5之製造方 法中，雖係在切離工程後實施了加熱工程，但是，當就算 是不使用分散材，在混合粉體之流動性上亦不會有問題， 而並未在銀粒子處包覆有分散材的情況時，則係可將加熱 工程省略。 【圖式簡單說明】 -24- 201008426 關於本發明之上述目的以及其他目的、特徵或優點， 藉由一面參考所添附之圖面一面參考下述之詳細記述，係 成爲更加明確。 圖1A〜圖1F，係爲用以對多層印刷基板之各製造工 程作說明的工程別剖面圖。 圖2，係爲用以對在本發明之第1實施形態所致的層 間連接用導電體之製造方法中的粉體塡充工程作說明之剖 面圖。 圖3，係爲用以對加壓工程作說明之剖面圖。 圖4，係爲展示藉由前述加壓工程而使混合粉體被成 形後的狀態之剖面圖。 圖5，係爲用以對切離工程作說明之剖面圖。 圖6，係爲展示將九片（pellet)模從殼體而取下後的 狀態之圖。 圖7，係爲用以對加熱工程作說明之剖面圖。 圖8，係爲用以對九片（pellet)取出工程作說明之剖 面圖。 圖9A、圖9B，係爲展示藉由圖2〜圖8之各工程而 製造了的導電體5之圖。 圖1 〇，係爲用以對在第2實施形態所致的層間連接用 導電體之製造方法中的印刷工程作說明之圖。 圖1 1，係爲展示印刷工程結束後的狀態之圖。 圖12，係爲展示將薄片狀遮罩從耐熱板而取下後的狀 態之圖。 -25- 201008426 圖13,係爲展示對於被印刷有導電糊之耐熱板而進行 回銲加熱之蒸氣式回銲裝置的圖。 圖14，係爲展示用以將導電體從耐熱板而分離並回收 的裝置之圖。 圖1 5 A，係爲展示當作爲第1溶劑而使用松油醇的情 況時所得到之導電體的圖。 圖15B，係爲展示當作爲第1溶劑而使用助溶劑（ flux )的情況時所得到之導電體的圖。 φ 圖16A，係爲於圖15A中所示之導電體的擴大圖。 圖16B，係爲於圖15B中所示之導電體的擴大圖。 圖17A，係爲展示使用當作爲第1溶劑而使用松油醇 的情況時所得到之導電體，來在多層基板中將相鄰接之電 路圖案作層間連接時的導電體之剖面的圖。 圖17B，係爲展示使用當作爲第1溶劑而使用助溶劑 的情況時所得到之導電體，來在多層基板中將相鄰接之電 路圖案作層間連接時的導電體之剖面的圖。 _ 【主要元件符號說明】 1 :樹脂薄膜 2 :金屬層 3 :電路圖案 4 :通孔 5 :導電體 1〇 :電路圖案層 26- 201008426 20 : 21 : 22 : 23 : 24 : 25 : 26 :201008426 VI. Description of the invention: [Technical Field to Which the Invention Is Along] The present invention, In a multilayer printed substrate in which a wiring layer and an insulating layer are alternately laminated, In order to connect adjacent wiring layers as layers, A method of manufacturing an electrical conductor disposed in a through hole in an insulating layer. [Prior Art] 0 In the prior art multilayer printed wiring board, E.g, It is as described in U.S. Patent No. 6,889,343 (corresponding to Japanese Patent Laid-Open Publication No. 2001-24323). In a through hole formed at a resin film as an insulating layer, a conductive paste in which a conductive filler or a resin particle is added to a conductive metal particle and mixed with a solvent and stirred. This conductive paste is used to perform interlayer connection of adjacent wiring layers (circuit pattern layers). but, When the conductive paste is filled in the through hole, In order not to adhere the conductive paste φ to the surface of the resin film other than the through hole, On the surface of the resin film which becomes the inlet side of the conductive paste filling hole of the through hole, A protective film is attached. In order to form a through hole in the resin film to which the protective film is attached, E.g , The laser light is irradiated from the side of the protective film. By the illumination of the laser light, On the other hand, a circuit pattern layer to be formed on the surface opposite to the adhesion surface of the protective film of the resin film is formed as a bottomed hole of the bottom surface. Use the bottomed hole as a through hole. A conductive paste is filled in the through hole. and, After charging the conductive paste, The protective film is peeled off from the resin film. A resin film in which a conductive paste is filled in the through hole is obtained. -5- 201008426 As in the prior art, When a protective film is used to fill the conductive paste in the through hole, First of all, It is necessary to pass laser processing, etc. A bottomed hole which becomes a through hole is formed in the protective film and the resin film. When there is a bottom hole, The system must produce machining chips. herein, Conductive paste, Is coated on the protective film, And pushed into the through hole by bristles or the like, It was used as a supplement. Therefore, If the processing debris adheres to the surface of the protective film, Then, when charging the conductive paste in the through hole, This may cause the possibility that the machining chips are mixed into the conductive paste. If such processing chips are mixed into the conductive paste which is filled in the through holes, This is an important reason for reducing the reliability of the connection between layers. therefore, The system must exchange the conductive paste frequently. And the manufacturing cost is increased. also, When peeling off the protective film, There is also a possibility that the conductive paste collapses or the conductive paste falls onto the resin film. In this case, I can imagine, There will be a reduction in the reliability of the connection between the layers, Or a problem that causes problems such as a short circuit. SUMMARY OF THE INVENTION The present invention, In order to carry out such problems, Its purpose, It is to provide a kind of: In a multilayer printed substrate, A method of manufacturing an electrical conductor for interlayer connection capable of improving the connection reliability of interlayer connections. A method of manufacturing an electrical conductor caused by one of the forms of the present disclosure, In a multilayer printed substrate in which a wiring layer and an insulating layer are alternately laminated, In order to connect adjacent wiring layers as layers, And a method of manufacturing an electric conductor disposed at a through hole in the insulating layer ’ And plus -6 - 201008426, a groove that is closed, in the foregoing, Sexual shift, And the description of the moving structure of the piece is used to take the ditch layer. and, Pressure engineering, And cutting off the project, And take out the project. In a filling project, filling a mixed powder of silver particles and tin particles in a closed space, One of the sides is formed by a mold member having a shape corresponding to the shape of the conductor to be formed. And the opposite side of the mold member, It is formed by a moving member that can be relatively moved with respect to the mold member. In the pressurizing process, the moving member is moved in a manner close to the mold member, On the other hand, the mixed powder which is filled in the sealed space is pressurized and pushed into the groove portion of the mold member. In the separation project, After the preloading project, In order to prevent the mixed powder on the surface of the mold member from being inserted into the groove portion of the mold member, Cut away from the mixed powder pushed into the aforementioned mold groove portion, And between the aforementioned mold member and the aforementioned moving member, The side members constituting the sealed space are slid on the mold member together with the mixed powder remaining on the surface of the front member. Out of the project, From the groove of the aforementioned mold member, The conductor formed of the above-mentioned mixed powder corresponding to the shape is taken out. In the method of manufacturing such an electrical conductor, An electrical conductor corresponding to the shape of the insulating via is prepared in advance. then, Such an electrical conductor is produced in this way, They are arranged one by one in each of the through holes of the insulating layer. , There will be no flaws in which the machining chips are mixed into the conductor. also, No need to protect the film, That is, the electric conductor can be disposed in the through hole of the insulating layer, Since the peeling of the conductive paste at the time of peeling of the protective film does not occur, etc. Therefore, it is possible to suppress the decrease in the reliability of the interlayer connection. A method of manufacturing an electrical conductor by another form of the present disclosure, In a multilayer printed substrate in which a wiring layer and an insulating layer are alternately laminated, 201008426 In order to connect adjacent wiring layers as layers, And a method of manufacturing an electric conductor disposed at a through hole in the insulating layer, And have printing engineering, And heating engineering, And recycling works. In printing engineering, In such a manner as to have a shape corresponding to the shape of the conductor to be formed, a conductive paste produced by mixing silver particles with tin particles in a solvent, Printed on a heat-resistant board. In the heating project, a heat-resistant plate to be printed with the aforementioned conductive paste, The vapor reflow device is heated to a temperature above the melting point of the tin particles in a few seconds. In the recycling project, An electric conductor that is solidified by the aforementioned heating, It is recovered from the aforementioned heat-resistant plate. In the method of manufacturing the electric conductor, Also, an electric conductor corresponding to the shape of the through hole of the insulating layer is prepared in advance. The electrical conductor thus produced, They are arranged one by one in each of the through holes of the insulating layer. Therefore, There is no flaw in the process of mixing the machining chips into the conductor. also, No need to use a protective film, That is, the electric conductor can be disposed in the through hole of the insulating layer, therefore, There is also no occurrence of collapse of the conductive paste when the protective film is peeled off. Therefore, It is possible to suppress the reduction in the reliability of the interlayer connection. [Embodiment] First, Using FIG. 1A to FIG. 1F, An example of a method of manufacturing a multilayer printed board using the conductor for interlayer connection manufactured by each of the embodiments of the present invention will be described. As shown in Figure 1A, First of all, A film having a metal layer 2 as a conductor is attached to one surface of the resin film 1 which is an insulating substrate. Resin film 1, E.g, It is a thermoplastic resin film having a thickness of 25 to 75 μm formed of a polyetheretherketone resin of 65 to 35 by weight -8 to 201008426 and a polyether oximeimide resin of 35 to 65 wt%. Metal layer 2, For example, it is formed by a copper foil having a thickness of 18 μm. then, A circuit pattern forming process of forming the circuit pattern 3 formed of a conductor on the surface of the resin film 1 is carried out. Circuit patterning engineering, Although it can be etched, print, Evaporation, Electroplating, etc. but, In this embodiment, As shown in Figure 1, The metal layer 2 adhered to the resin film 1 of Fig. 1 is etched. The metal layer 2 is formed into the desired pattern 3, And the first circuit pattern layer (wiring layer) is formed on one side at 10 °, then As shown in Figure 1C, By irradiating a carbon dioxide laser on the surface of the resin film 1 on the side not provided with the circuit pattern layer 10, On the resin film 1, a plurality of through holes 4 having a circuit pattern 3 as a bottom surface are formed (through hole forming process). The opening diameter of each through hole 4, For example, it is about ιμιη~150μιη, One conductor (nine piece) 5 in which φ is disposed in a conductor arrangement project to be described later, It is sized to be accommodated in the through hole 4. That is, The opening size ' of the through hole 4 is formed to be somewhat larger than the portion of the conductor 5 formed into a cylindrical shape which becomes the largest diameter. The portion of the circuit pattern 3 which becomes the bottom surface of the through hole 4 is formed by multilayering the plurality of resin films 1 It becomes a part of an electrode for performing interlayer connection of the circuit pattern 3. In the formation of the through hole 4, the output of the carbon dioxide laser, the irradiation time, and the like are appropriately adjusted. It is assumed that the hole is not formed in the circuit pattern 3. -9- 201008426 In the formation of the through hole 4, In addition to using a carbon dioxide laser, Excimer lasers and the like can also be used. Although it is also possible to use a through hole forming method such as machining of a drill other than a laser, but, Opening processing caused by a laser beam, The system can open holes with a small diameter. And does not cause excessive damage to the circuit pattern 3, Therefore, it is ideal. Next, As shown in Figure 1D, Each of the conductors 5 is disposed in each of the through holes 4 (conductor arrangement). Conductor 5, For example, a metal mask having a through hole at a position where the through hole 4 is formed may be used. It is arranged in the through hole 4. in particular, The conductor 5 is placed on the metal mask as a plurality of pins. The electric conductor 5 is moved by a squeegee-like bristles. As a result, At a position where the metal mask is formed with a through hole, The conductor 5 is dropped into the through hole 4. By this, The conductors 5 can be disposed in each of the through holes 4 one by one. also, In order to dispose the electric conductor 5 in the through hole 4, You can also use no metal cover. On the resin film 1, the conductor 5 is moved by bristles or the like. The remaining excess conductor 5 is recovered. The electric conductor 5 in a state in which it is configured by the electric conductor arrangement work, When each resin film 1 is laminated, In order to reliably perform electrical connection with the circuit pattern of the adjacent resin film 1, Therefore, it is desirable to have the same height as the surface of the opening edge portion of the through hole 4 or only slightly protrude. also, In the through hole 4, Between the inner circumferential surface of the through hole 4 and the outer circumferential surface of the conductor 5, It is desirable to form a void. This is because In order to easily arrange the electric conductor 5 in the through hole 4, Further, when the conductor 5 is deformed in the subsequent heating/pressurization process, the conductor 5 can be deformed so that the void is buried by -10-201008426. Then' as shown in Figure 1E, A resin film 1 in which a circuit pattern 3 is formed on one surface and a conductor 5 is disposed in the through hole 4, which is manufactured by the process of FIG. 1A to FIG. 1D, Make a stack of multiples. Then, for the laminate in which the resin film 1 is laminated in plural, The vacuum heating press is not shown, In the vacuum condition, the upper and lower sides are heated while being pressurized. In this heating and pressurization project, E.g, 0, the laminate of the resin film 1 is heated to 250 to 350 ° C, Simultaneously, Pressurize at a pressure of 1 to 10 MPa for 10 to 20 minutes. By the above heating and pressure engineering, A plurality of resin films 1 are thermally fused together and integrated. and then, The conductor 5 in the through hole 4 is sintered. The metal pattern is bonded to the circuit pattern 3 at its both ends. in particular, The silver particles in the conductor 5 are alloyed with the tin particles. Simultaneously, The tin component of the conductor 5 and the Cu component of the copper foil constituting the circuit pattern 3 are solid phase-diffused with each other. And a solid phase diffusion layer is formed at the interface of the Q between the conductor 5 and the circuit pattern 3. By this, A multilayer printed substrate 100 in which the adjacent circuit patterns 3 are electrically connected by means of the conductor 5 is obtained. (First Embodiment) Next, A method of manufacturing the interlayer connection conductor 5 in the first embodiment of the present invention will be described. First of all, Using Figure 2, A description will be given of a manufacturing apparatus of the conductor 5. In Figure 2, Mold 20, It is formed into a slightly cylindrical shape. The cylindrical interior -11 - 201008426 is filled with a mixture of silver particles and tin particles. The mixed powder is kept. The mixed powder used in the present embodiment, As above, It is made of silver particles and tin particles. but, Silver particles, Because if you don't do any processing, The silver particles are easily consolidated with each other. therefore, Attached to the surface, It is coated with stearic acid as a dispersion material. With this, a mixed powder in which silver particles and tin particles are mixed, It is able to maintain good fluidity. In addition, In this embodiment, Since it is not necessary to gelatinize the mixed powder, therefore, In the mixed powder, The system does not contain any solvents and the like. Nine die 21, It is a groove (through hole) in which a plurality of shapes corresponding to the shape of the conductor (nine pieces) 5 to be formed are formed. This nine-piece model 21, For example, it is composed of a stainless steel alloy or the like. The above mold 20, It is mounted on the nine-piece mold 21. At the opening of the mold 20 on the side opposite to the side on which the nine molds 21 are disposed for the mold 20, The punch 22 is slidably inserted into the inner surface of the mold 20. By this, Inside the mold 20, The system is formed with a confined space. The confined space, One of the sides is formed by the surface of the nine-piece mold 21, The opposite surface is formed by the front end of the punch 22. In this manufacturing device, The mold 20 corresponds to the side member, And the nine-piece mold 21 corresponds to the mold member, The punch 22 corresponds to the moving member. Nine die 21, It is supported on the substrate 23. Substrate 23, It has a support part with nine molds 21 at its central part. Between the support and the peripheral, The system is set to have a phase difference. In a manner that is incompatible with the phase difference, A housing 25 is provided on the base 23. This housing 25, In a manner such that the mold -12- 201008426 mold 20 and the nine mold 21 are not offset from the substrate 23, The mold 20 and the nine-piece mold 21 are used as holders. but, As will be described later, Mold 20, It is necessary to slide on the surface of the nine-piece mold 21 in a direction parallel to the surface of the nine-piece mold 21. therefore, Follow the sliding direction, A gap 26 is provided between the casing 25 and the mold 20. So, In order to provide a gap 26 between the casing 25 and the mold 20, It is also possible to hold the mold 20 on the casing 25 while the mold 20 is being slidably slid. So at the housing 25, A movable lever 24 is inserted from both the left and right directions. The front end of the movable rod 24, Since the system is in contact with the outer surface of the mold 20, therefore, Even if there is a gap 26, The mold 20 is also held via the casing 25 (movable rod 24) so that its position does not shift. Movable rod 24, For example, it is locked by a screw into a screw groove formed at the housing 25, If it is rotated in one direction, Then the front end portion enters deeper into the casing 25, And if φ is rotated in the opposite direction, Then it is back. A method of manufacturing the conductor 5 using the manufacturing apparatus of the conductor 5 which is generally configured as described above will be described. First of all, As shown in Figure 2, The front ends of the movable rods on the left and right sides are brought into contact with the mold 20, The mold 20 is firmly held on the casing 25. then, The punch 22 is inserted into the opening of the mold 20, The mixed powder of silver particles and tin particles is put into the interior of the mold 20, after that, The punch 22 is inserted into the mold 20 (powder filling project). By this, Mixed powder, It is in a state of being filled in a sealed space formed by the mold 20 and the nine-piece mold 21 and the punch 22 of the -13-201008426. The manufacturing apparatus ” of the conductor 5 is held up and down by a press device (not shown). Further, as shown in Fig. 3, the punch 22 is generally moved relative to the nine-piece mold 21 to pressurize the mixed powder inside the sealed space (pressure engineering). By means of the mixed powder in the 'closed space, It is pushed into the groove of the nine-piece mold 21. at this time, E.g, Applying compression by applying a load of 15 〇 Mpa or more to the mixed powder. And keep it for about 90 seconds. The result 'mixed powder, Because the system is strongly compressed, therefore, As shown in Fig. 4, the general shape is densely formed and bonded without voids. therefore, The mechanical strength and shape maintenance of the conductor 5 formed through the groove portion of the nine-piece mold 21 can be sufficiently ensured. On the other hand, the electrical conductivity when the conductor is disposed in the through hole can be improved. If the above pressure engineering is over, Then, the manufacturing apparatus of the electric conductor 5 is taken out from the press device. then, As shown in Figure 5, Rotating the movable rod 24, The mold 20 is moved by a few centimeters relative to the nine-piece mold 21. at this time, Mold 20, The movement in the direction perpendicular to the surface of the nine-piece mold 21 is restricted by the casing 25, therefore, The system does not float from the nine-piece mold 21, It is moved in such a manner as to slide on the surface of the nine-piece mold 21. also, When the mold 20 is moved, Since the system is maintained in a state in which the punch 22 is inserted into the mold 20, therefore, The punch 22 is also moved in a direction parallel to the surface of the nine-piece mold 21. So, If the mold 20 and the punch 22 are moved in a direction parallel to the surface of the nine-piece mold 21, Then, the mixed powder 'remaining on the surface of the nine-piece mold 21 held by the mold 20 and the punches 22-14-201008426 is also in the same manner as the mold 20 and the punch 22, and the nine-piece mold 21 The surfaces move in parallel directions. herein, In the above pressurized engineering, Punch 22, The whole of the mixed powder which is filled in the sealed space is pressurized. therefore, The mixed powder can be densely pressed into the groove portion of the nine-piece mold 21, on the other hand, The mixed powder that is pushed into the groove portion of the nine-piece mold 21, The system is also integrated with the mixed powder remaining on the surface of the nine-sheet mold 21. therefore, In this embodiment, As above, Further, a cutting operation for moving (sliding) the mold 20 and the punch 22 together with the held mixed powder in a direction parallel to the surface of the nine-piece mold 21 is carried out. By this, The mixed powder in the groove portion of the nine-piece mold 21 integrated in the press working can be separated from the mixed powder remaining on the surface of the nine-piece mold 21. especially, In this embodiment, Since the above-described detachment process is performed in a state in which the mixed powder is suppressed by the punch 22, Therefore, In the separation project, It is possible to suppress the floating powder in the groove portion of the nine-piece mold 21 from floating in the groove portion. the result, The mixed powder in the groove portion and the mixed powder on the surface of the nine-piece mold 21 can be cut away along the surface of the nine-piece mold 21. After the implementation of the separation project, As shown in Figure 6, in general, The nine-piece mold 21 is taken out from the casing 25 together with the base 23. The nine pieces of mold 21 taken out, As shown in Figure 7, in general, It is placed on the heater 30 and heated (heating engineering). This heating project, E.g, It is at a temperature of 120~150 °C at a temperature of -15- 201008426 (about 70 °C). And carry out 3 to 5 minutes. As above, Silver particles 'Because the particles are easily consolidated with each other, therefore, If the silver particles are in the original state, the fluidity of the powder is lowered. Therefore, In the present embodiment, 'the stearic acid as a dispersion material is coated on the surface of the silver particles' to ensure the fluidity of the mixed powder. but, When the mixed powder is pressurized and integrated, the stearic acid has a tendency to weaken the binding force. Therefore, as above, After cutting off the project, Implement heating engineering, The nine-piece mold 21 is heated to a temperature at which stearic acid can be melted. By this, In the mixed powder, Since it can promote the consolidation of silver particles, therefore, The binding force of the mixed powder is strong, It can increase the mechanical strength or shape retention. After the heating project, As shown in Figure 8, in general, The conductor (nine pieces) 5 is taken out from the groove portion of the nine-piece mold 21 (taken out). This removal project, E.g, When the nine-piece mold 21 is mounted on the nine-piece collection casing 31, The external force is applied in such a manner that the nine-piece mold 21 is bent. In this embodiment, In order to improve productivity, At the 9-piece model 2, The system is formed with a majority of the ditch, and, The diameter of each groove (the size of the conductor), The system is very small (for example, the diameter is ΙΟΟμιη~150μιη). therefore, Applying an external force to the respective conductors (nine pieces) 5 and taking them out from the nine-piece mold 21, It is easier and more efficient to apply an external force and take out the electric conductor 5 in such a manner that it is bent for the nine-piece mold 21. By implementing the above-mentioned projects, An electric conductor corresponding to the shape of the through hole of the resin film 1 for performing interlayer connection of the multilayer printed substrate can be obtained -16-201008426 In Figure 9A, In Fig. 9B, one example of the conductor 5 manufactured by the above-described respective processes is shown. Figure 9A, It can be observed in Figure 9B, The mixed powder comprising silver particles and tin particles has a very dense cylindrical shape. By this, you can know that Electrical connection reliability, The electric conductor 5 is excellent in durability. As above, In the method of manufacturing the electric conductor 5 according to the embodiment, It is not necessary to fill the conductive paste in the through holes of the resin film (insulating layer) as in the prior art. The conductors having a shape corresponding to the through holes of the insulating layer are preliminarily formed in such a manner that the adjacent wiring layers are connected to each other. The electrical conductor thus produced, They are arranged one by one in each of the through holes of the insulating layer. Therefore, There is no flaw in the process of mixing the machining chips into the conductor. And because there is no need to use a protective film, That is, the electrical conductor can be disposed in the through hole of the insulating layer, therefore, Also, the collapse of the conductive paste at the time of peeling of the protective film does not occur. For these reasons, By using φ by using an electrical conductor that corresponds in advance to the shape of the through hole, It is possible to suppress the reduction in the reliability of the interlayer connection. (Second embodiment) Next, A method of manufacturing the interlayer connection conductor 5 in the second embodiment of the present invention will be described. First of all, As shown in Figure 1, the general, a sheet-like mask 122 to be formed with a plurality of holes 123 corresponding to the shape of the conductor 5 to be formed, It is placed on the heat-resistant plate 121. E.g, a sheet-like mask 122, It is made of a metal mask made of gold -17- 201008426. Heat resistant plate, It is made of a fluorocarbon resin or a resin plate such as Teflon (registered trademark). then, As shown in Figure 1, the general, Use a squeegee general bristles 124, On the other hand, the conductive paste 125 produced by mixing the silver particles and the tin particles in the first solvent is The plurality of holes 123 of the sheet-like mask 122 are filled. The opening diameter and thickness of the hole portion 123 of the sheet-like mask 122, E.g, Consider the amount of shrinkage when heating, It is set to Φ150μιηχ60μιη. also, Conductor paste 125, It is produced by mixing silver particles and tin particles in terpineol which is a kind of monoterpene Alcohol. In silver particles, In order to prevent the silver particles from consolidating each other, It is coated with a dispersion made of stearic acid. By this, The silver particles and the tin particles are uniformly distributed in the first solvent. As shown in Figure 11, in general, If the charging of the conductive paste 125 for the hole portion 123 of the sheet-like mask 122 is completed, Then as shown in Figure 12, a sheet-like mask 122, The film is moved in a direction perpendicular to the printing surface of the conductive paste 125 of the heat-resistant plate 121. So, a sheet-like mask 122, If the charge of the conductive paste 125 is over, Then, it is removed from the heat-resistant plate 121. the result, On the heat-resistant plate 1 2 1 A conductive paste 125 having a shape corresponding to the shape of the desired electric conductor is printed. The heat-resistant plate 121 on which the conductive paste 125 is printed, By the vapor reflow device (VPS device) shown in Fig. 13, 130 is reflowed and heated. That is, When the conductive paste 125 is heated, The lamella mask i 22 is removed, And the side surface of the conductive paste 125 is also exposed. VPS device 130, As is well known, The fluorine-based inert liquid -18-201008426 body 132 is heated by the heater 133. And make it vaporized, And use the vapor as a heat medium, It is possible to carry out the reheating at a temperature corresponding to the boiling point of the fluorine-containing inert liquid 132. In addition, In this VPS device 130, It can depend on the type of liquid used. The reheating heating temperature is changed. also, The amount of vapor is changed by the temperature of the heater 131 which is heated by the fluorine-based inert liquid 1 32, It is also possible to adjust the reheating heating temperature. This is because If the amount of steam increases or decreases, The amount of heat supplied to the workpiece through the vapor & There will also be increases and decreases, Therefore, it is possible to adjust the reheating heating temperature. In this embodiment, By means of the V P S device 1 300, And the heat-resistant plate 121 to be printed with the conductive paste 125, It is heated to a temperature above the melting point of tin (about 232 °C) in a short time on a few seconds scale. herein, The so-called seconds scale, Means more than 1 second and less than 10 seconds. For example, it is 3 seconds. As above, In a heating and pressurizing process for laminating the resin film 1 and forming the multilayer substrate 100, The electric conductor 5 disposed in the through hole 4 of the resin film 1, It is necessary to deform together with the resin film. This matter 0 ‘in other words, Department representative, In the electrical conductor 5, It is necessary to leave tin and silver as separate components. This is because If tin and silver remain as separate components, In the heating and pressurizing process for forming the multilayer substrate 100, Since the tin component is dissolved, Therefore, the conductor 5 can be deformed. If the entire conductor 5 is made of tin and an alloy of silver, Then the melting point becomes very high (above 400 °C), At the same time, the conductor 5 became very hard. therefore, In the heating and pressurizing process described above, the deformation of the conductor 5 becomes difficult. Simultaneously, It becomes impossible to make a metal joint with the circuit pattern 3, And it will significantly damage the reliability of the connection. -19- 201008426 害 ° On this point, In this embodiment, Because it is via the VPS device 1 3 0, And the conductive paste 1 2 5 is heated only for a short time on a few seconds scale. therefore, Only a portion of the tin particles are alloyed with the silver particles. Therefore, In the conductor 5 manufactured by heating the conductive paste 125 by the VPS device 130, Except for the alloy parts of tin and silver, Tin and silver are left as separate components. Therefore, The above electrical conductor 5, When it is disposed in the through hole 4 of the resin film 1 as a conductor for interlayer connection, When a plurality of resin films 1 are integrated by heating and pressurization, Conductor 5, It can be deformed together with the resin film 1. also, The tin component of the electrical conductor 5, The Cu component can be mutually diffused and metal-bonded to the circuit pattern 3. By this, Via the electrical conductor 5, It is possible to make the adjacent circuit patterns 3 a good interlayer connection. herein, Tin particles, usually, The surface is coated with tin oxide. therefore, When a part of the tin particles of the conductive paste 125 is alloyed with the silver particles to form the conductor 5, In reflow heating, It is necessary to destroy the tin oxide. In this embodiment, As a reflow device, By using the VPS device 130, And solved this problem. That is, In the VPS device 130, As a vapor of heat medium, Liquefaction when exposed to a low temperature workpiece (conductive paste 125), And produces a rapid contraction (burst) of volume. The energy of this explosion, It breaks through the tin oxide on the surface of tin particles. the result, From the damaged place of tin oxide, After the melting, the tin flows out. It becomes alloyed with silver particles. So, In the electrical conductor 5, By alloying one part of the tin particles with the silver particles, It is possible to ensure sufficient strength as a conductor for interlayer connection -20- 201008426. After the reflow heating caused by the VPS device 130, Cooling and drying, then, Using the device 140 shown in Figure 14, The conductor 5 is recovered. The device 140 shown in Figure 14, The second solvent 142 is filled with a cleaning liquid inside. also, At one side of the device 140, The ultrasonic vibration element 141 is mounted. herein, The second solvent 142, Is different from the first solvent, It is used for the purpose of supersonic transmission and nine pieces of flying prevention. As the second solvent 142, As long as it does not affect the quality of the nine pieces, Can use any solvent, E.g, Ethanol is used. a heat-resistant plate 121 equipped with a conductor 5, It is immersed in the second solvent 142 of the apparatus 140 shown in Fig. 14. The second solvent 142, In this state, By driving the ultrasonic vibration element 141, On the other hand, the heat-resistant plate 121 is vibrated by the ultrasonic waves transmitted through the second solvent 142. With this vibration, The electric conductor 5 mounted on the heat-resistant plate 121, Separated from the heat-resistant plate φ 121, It is discharged to the second solvent 142. By the electric conductor 5 floating in the second solvent 142, The impurities such as coal adhering to the conductor 5 can be removed. So, The device 140 shown in Figure 14, The system also has the cleaning effect of the electric conductor 5. then, The electric conductor 5 in the second solvent 142, Use a filter (not shown) for recycling. With the above manufacturing method, On the other hand, the electric conductor 5 corresponding to the shape of the through hole 4 of the resin film 1 can be produced. The conductor 5 thus produced, These are arranged one by one in the respective through holes 4 of the resin film 1. Therefore, there is no such thing as the prior art processing chips mixed into the conductor -21 - 201008426. For these reasons, By using an electrical conductor that corresponds in advance to the shape of the through hole 4, It is possible to suppress the reduction in the reliability of the interlayer connection. In particular, in this embodiment, As above, The conductor 5 is produced by reheating the conductive paste 125 containing silver particles and tin particles by using the VPS device 130. therefore, For example, it is possible to manufacture the strength necessary for the interlayer connection conductor while maintaining the shape of the conductive paste 125 printed on the heat-resistant plate 121. As a reflow device, If the VPS device 130 described above is not used, When a device for reflowing heating by raising the ambient temperature of the workpiece by a heater or infrared rays is used, Even if it is heated to 260 °C, It is also impossible to obtain the strength necessary for the conductor for interlayer connection. I can imagine, This is because If only the ambient temperature of the workpiece is raised, It is impossible to destroy the tin oxide on the surface of the above tin particles (the melting point of tin oxide exceeds 100 (TC), And because of the tin oxide, The alloying between tin and silver is hindered. In addition, In this embodiment, In order to manufacture a conductive paste containing tin particles and silver particles, As the first solvent, Terpineol is used. As the first solvent, In addition to terpineol, For example, a flux containing rosin and an active agent can also be considered. however, When using a solvent, Due to the action of the active agent, The oxide film on the surface of the tin particles is removed, The wetness between the silver particles and the tin particles increases. therefore, When the conductive paste 125 is heated by the V P S device 130, Maintaining the conductive paste 125 -22- 201008426 in the shape of being printed on the heat-resistant plate 121, It is difficult. Relative to this, In terpineol, Since the system does not have the same activity as the co-solvent, therefore, The conductor 5 can be manufactured by maintaining the shape of the conductive paste 125 as it is. Figure 15A, A diagram showing the conductor 5 obtained when the terpineol is used as the first solvent, Figure 1 6 A, An enlarged view of the conductor 5 shown in FIG. Figure 17A, This is a cross-sectional view of the conductor 5 when the conductors I 5 are used in the multilayer substrate 1 to connect the adjacent circuit patterns 3 as interlayers. on the other hand, Figure 15B, A diagram showing the conductor 5 obtained when a co-solvent is used as the first solvent, Figure 16B, An enlarged view of the conductor 5 shown in Fig. 15B, Figure 17B, This is a cross-sectional view of the electric conductor 5 when the electric conductor 5 is used to connect the adjacent circuit patterns 3 in the multilayer substrate 1A. As shown in Figure 15B, Figure 16B, it can be confirmed that When the cosolvent φ is used as the first solvent, Conductor 5, It is impossible to maintain the cylindrical shape of the conductive paste 125. And become close to the hemisphere shape. In contrast, When terpineol is used as the first solvent, As shown in Figure 15A, Figure 1 6 A can confirm the general, Conductor 5, The system is almost in the shape of a cylinder. the result, Conductor 5 in the case of using a co-solvent, Since the space in the through hole 4 of the resin film 1 cannot be sufficiently buried, Therefore, As shown in Figure 17B, When connecting between layers, Lined up everywhere to create holes, but, When using the conductor 5 in the case of terpineol, As shown in Figure 17A, Empty holes when connecting between layers, The system became only a few -23- 201008426. thus, It can be known that When manufacturing an electrical conductor for connection between layers, As the first solvent, It is ideal to use terpineol. (Other Embodiments) The present invention, The appropriate implementation form is taken as a reference and described. but, It should be understood that this invention, The system is not limited by this embodiment or construction. this invention, The system also includes various modifications or variations within an equal range. and then, It should be understood that Appropriate combinations or forms, Or a combination or form comprising one or more of the elements, or more It is also included within the scope of the invention or the scope of the invention. E.g, In the above embodiment, As the resin film 1, A thermoplastic resin film composed of 65 to 35 wt% of polyetheretherketone resin and 35 to 65 wt% of polyetherimide resin is used. but, Resin film, The system is not limited to this, It may also be a film in which a non-conductive chelating agent is filled in a polyetheretherketone resin and a polyether oxime resin. Polyetheretherketone (PEEK) can also be used, Polyetherimine (PEI), Liquid crystal film, etc. also, In the first embodiment described above, In the method of manufacturing the electrical conductor 5, Although the heating project was carried out after the separation project, but, When not using dispersing materials, There is no problem with the fluidity of the mixed powder. When the silver particles are not coated with a dispersion material, The heating project can be omitted. BRIEF DESCRIPTION OF THE DRAWINGS -24- 201008426 Regarding the above objects and other objects of the present invention, Feature or advantage, Referring to the detailed description below with reference to the attached drawings, The system became more explicit. Figure 1A to Figure 1F, It is an engineering sectional view for explaining each manufacturing process of a multilayer printed substrate. figure 2, It is a cross-sectional view for explaining a powder charging process in the method for producing a layer-connecting conductor according to the first embodiment of the present invention. image 3, It is a cross-sectional view for explaining the pressurized engineering. Figure 4, A cross-sectional view showing a state in which the mixed powder is formed by the above-described pressurization process. Figure 5, It is a sectional view for explaining the excision project. Figure 6, This is a diagram showing the state in which the pellet is removed from the casing. Figure 7, It is a sectional view for explaining the heating project. Figure 8, It is a cross-sectional view for explaining the ejection of a pellet. Figure 9A, Figure 9B, A diagram showing the conductors 5 manufactured by the respective processes of Figs. 2 to 8 is shown. Figure 1 Oh, It is a figure for explaining the printing process in the manufacturing method of the electrical conductor for interlayer connection by the 2nd Embodiment. Figure 1 It is a picture showing the state after the end of the printing project. Figure 12, It is a view showing a state in which the sheet-like mask is removed from the heat-resistant sheet. -25- 201008426 Figure 13, A diagram showing a vapor reflow soldering apparatus that performs reflow heating for a heat-resistant sheet on which a conductive paste is printed. Figure 14, A diagram showing a device for separating and recovering an electrical conductor from a heat resistant plate. Figure 1 5 A, The figure shows the electric conductor obtained when the terpineol was used as the first solvent. Figure 15B, This is a view showing the conductor obtained when a flux is used as the first solvent. φ Figure 16A, It is an enlarged view of the conductor shown in Fig. 15A. Figure 16B, It is an enlarged view of the conductor shown in Fig. 15B. Figure 17A, An electric conductor obtained by using a terpineol as a first solvent, A cross-sectional view of a conductor when adjacent circuit patterns are connected in layers in a multilayer substrate. Figure 17B, An electric conductor obtained by using a cosolvent as a first solvent, A cross-sectional view of a conductor when adjacent circuit patterns are connected in layers in a multilayer substrate. _ [Main component symbol description] 1 : Resin film 2 : Metal layer 3 : Circuit pattern 4 : Through hole 5 : Conductor 1〇 : Circuit pattern layer 26- 201008426 20 : twenty one : twenty two : twenty three : twenty four : 25 : 26 :
3 1 ： 100 ： 121 ： 122 ： 123 ： 124 ： 125 :3 1 : 100 : 121 : 122 : 123 : 124 : 125 :
13 1： 132 ： 140 ： 141 ： 142 ： 鑄模 九片模 衝頭 基底 可動桿 殻體 空隙 加熱器 九片收集殼體 多層印刷基板 耐熱平板 薄片狀遮罩 孔部 刷毛 導電糊 蒸氣式回銲裝置 加熱器 氟素系惰性液體 裝置 超音波振動元件 第2溶劑 -2713 1:132 : 140 : 141 : 142 : Molded nine-piece die punch base movable rod housing gap heater nine-piece collection housing multilayer printed substrate heat-resistant flat sheet-like mask hole bristles conductive paste steam reflow device heating Fluorine-based inert liquid device ultrasonic vibration element second solvent-27