200949968 九、發明說明： 【發明所屬之技術領域】 以及=======測試， 麟織縣本之咖朗置大幅 -般晶片於完成切割作業後，業者 段封裝製程之成本浪費’因此在執 ❹=試作r以測試晶片的電性是二》=== 探針卡丄！，該探針二==，於:架上架設一 良品晶片之測試器12 1 3 1以置載^ 3台2機H3 ’該載台機構1 3係於一滑軌 進及移出之4 : 載巧⑶可=:驅動作移 €1 ΙΪΓ™ 動:Ϊ以二於J針11下方位置處，再以驅動源驅 t ΛΤΙΐΐΙ Ami 115 3 1 35，該推移^ 35可於二由驅動源驅動位移之推移件 微推移晶片位移以利對位測^ = 1 3 4吸附晶片時’稍 時，童你以人工你irti式，睛參閱第2圖’於進行晶片測試 1 3^1! 3 待測之晶片1 4放置於載台機構 待測晶片1 4，為使待，以真空取放器1 3 4吸附 推 日日 &位以利測試，請參閱第3、4圖所示，當治具 200949968 13 3上之待測晶片14定位完畢後，該載台機構i 3即載送治 具1 3 3及待測之晶片14位移至探針1 1卡之探針1 11下 方，治具13 3即由驅動源驅動作上升位移，而穿伸機羊 孔中’以令待測之晶片i 4接聰針卡工工之探針 針V，觸導通待測之晶片14，以執行晶片1 4的測 ^作業’該控齡！ 2於判別待測之晶片i 4為良品或不良品 Ο 便於===输狄㈣蹲__處，俾 缺弊該晶片職裝置就設備成本及職產脑言，其仍有如下之 1 ·晶片置於治具上之定位問題： if=試^置1Q為使晶片於治具13 3上定位，而於治 八13 3之頂面设有真空取放器工3 4及一 觝: 1 3 5，2 3 3 4吸附晶片時，鑛推移晶片位移來達成定位 二 式因僅以真空取放器13 4吸附，而導致i定位= =片接觸探針111的運送過程中，即易 成疋位上之偏移，而晶片接ϋ震動等因素造 因此稍有偏移即使得(約叫__)， 2 曰i iL定位之穩定性仍有待加強。τ丄1之探針 二曰片與探針鱗概細之問題： 片必才能有效進行晶 之電性接觸，其係藉由2 =吏1 日片與探針保持良好 移使晶片保持接觸探針載/ 3 3的上升位 士:置將 晶片執行測試作業中進行其他晶片的運 200949968 3 口機構1 3之待機_過長，而大幅降_試產能。 式作業區必須對應配置—載台機構13之問題： 業▲區必須對應配置载台機構1 3，才能各別將 曰 1% 至各測試作業區位置’並藉由載台機構13之治具 移使晶片保持接觸探針1 u，如為增加產 月s 1組測試裝置時’則必須相對增設數組之載台機構 載台機構13於晶片執行測試作業中無法充分 ^用載U的晶片的運送作業，因此相 機構13將徒增設備之成本。 撕w數組之載口 如何ΐ講求降低設備成本及提升檢測產能之趨勢下， 測產::ΐ為業的降低待機時間，進而有效提升檢 【發明内容】 係包係i提供一種晶片測試用之移載測試裝置，其 件，而試套座’該移載载具係具有取放器及下麼 兩側設有;枢座底==二試套座係於底座 =，i座係以彈簧及滑片架設於底座之上二 可使晶片之接點準確對位於底座° aa f人^^套座時’ 達到穩定定位例針保_之電性接觸， t發明次一目的係提供一種晶片 套座係以複數個陣列 ===該 仃測试’進而達到大幅提升測試產能之效益 量之曰曰片進 本發明另-目的係提供一種晶片測試用之移載測試襄置，該 200949968 ，試套座於移麵具之取放置人後，由 Πί'定的定位及與測針保持良好之電性接觸 ;具之下壓件不需保持壓抵於晶片之上方，移载而載 續進行其他測試套座的入料作業， =可移動接 ^用’有效減少移載載具的待機時間，使&载 大使用效能及提升測試產能之效益。 、】發揮最 測試測試裝置，該 Ο ❹ 片之上方，移載載具而移接於晶 進而可同雜㈣_ 細其他似套朗續作業， 效益 測试套座使用’達到有效降低設備成本之 【實施方式】 實施$^=1^；明作更進一步之瞭解，兹舉一較佳 豐6甘圖’本發明主要係針對應用於晶片（ChiP或 2及導引座23 主要包括有底座21、上座2 ?1該底座21係於兩侧設有可彈性樞轉之麼夾件 插w 1 +2，底座21内則設有複數個插置孔213，以# 14，並使該微小測針21二 出插置孔21 3 ’而可—端電性接觸晶片另-端則雷 排=置Ϊϊί 2 Γ^2 1 4係依據待測晶片接點位置而對應 對應置孔2 1 3内，而使待測晶片之接點可 2二底j ^ ; -上座2 2係以數個彈簧2 2 1及滑片2 以降置田設有抵頂件2 2 3、2 2 4，使得上座= 2 1『^、”頂件2 2 3、2 2 4分別抵壓於廢夾件 開啟，以，而使壓夾件2 1 1、2 1 2可向外搞轉 供待別曰曰片置入於底座2 1内，並於上座2 2上升而使 200949968 抵頂件2 2 3、2 2 4脫離抵顧夾件2 χ !、9 η 0 士 壓央件2 1 1、2 1 2自動樞轉壓夾待測晶片， 日、，可令 底座21內之微小測針214保持良好之^性接與 2^係設於底座2 1及上座2 2之框架内，其依^巧引座 ❹ 1 2屢夾待測晶片，進而達到穩定定位及二電ίί 針型:測 接_ ’該針點2 1 5 1可稍作彈性變形得接H ^了使待測晶片於測試套座2 〇内保持穩定定“良好的電= 方式 iis 試; 移載1=====晶ro 巧:5 ___座2 訂 ΤΓ ======士 200949968 歷壓夾件2 1 1、2 1 2，而使;1夾件2 1 2、2 ；ι ? 轉開啟。請參閱第i 2圖，當壓夾件2， ^ 2了向外樞 載載具5 0之取放器5 i將會下=== 2 1内’待測晶片4 0於置入底座2 1叫，可利 ^心座 之導斜面2 3 1 ’而使待測晶片導引滑入 ❹ ❹ 時壓夾件21 1、212即自動柩轉麼夾待測曰# 12，此 0於測試套座2 寺 本發明由於測試套座2 ◦本身可將待m巧觸’ 良好的電性，使得移賴具5 Q片定位及 進而可_減概伽m套座制=f料作業’ 5 0的待機時間以發揮最大使用效亦具 及有效降低設備成本之效益。 ^違到美升測試產能 據此，本發明實為一深具實用性及進步性 產品及刊物公開，從而允符發明專利申請ί;: ΐ依4 【圖式簡單說明】 第1圖.習式晶片測試裝置之示意圖。 第2圖：習式晶片測試裝置之動作示朗（ 第3圖：習式晶片測試裝置之動作示意圖（ 第4圖.習式晶片測試裝置之動作示意圖（。 第5圖：本發明測試套座之分解示意圖。— 第6圖.本發明測試套座之組合示意圖。 =7圖：本發明測試套座另—種測針型態之 第8圖：本發明測試套座陣列於測試板之示意圖:。 200949968 ❹ 第9圖：本發明移載載具與測試套座之示意圖。 第1 0圖：本發明移載載具將晶片置入測試套座之示意圖（一）。 第11圖：本發明移載載具將晶片置入測試套座之示意圖（二）。 第1 2圖：本發明移載載具將晶片置入測試套座之示意圖（三）。 第1 3圖：本發明移載載具將晶片置入測試套座之示意圖（四）。 【主要元件符號說明】 習式部分： 1 0 :測試裝置 1 1 :探針卡 1 2 :試器 13:載台機構 131:滑執 13 4 :真空取放器 1 4 .晶片 本發明部分： 2 0 :測試套座 2 1 :底座 211;壓夾件 2 1 4 :測針 2 1 5 :金屬薄片 2 2 :上座 2 21 :彈簧 2 2 4 :抵頂件 2 3 :導引座 3 0 :測試板 4 0 ·待測晶片 5 0 :移載載具 51 :取放器 5 2 :下壓件 111 探針 13 2 :載台 13 5 :推移件 212:壓夾件 2151:針點 2 31 :導斜面 1 3 3 :治具 213:插置孔 216:間隔片 2 2 3 :抵頂件 11200949968 IX. Description of the invention: [Technical field of invention] And ======= test, Linzhi County, the company's coffee lang set a large-scale wafer after the completion of the cutting operation, the cost of the manufacturer's packaging process is wasted' In the implementation of the test = test r to test the electrical properties of the wafer is two "=== probe card 丄! , the probe two ==, on: a tester 12 1 3 1 for erecting a good wafer on the rack to carry ^ 3 sets of 2 machines H3 'The stage mechanism 1 3 is attached to and removed from a slide rail 4: Load (3) can be:: drive to move €1 ΙΪΓTM movement: Ϊ to the position below the J pin 11, and then drive source t ΛΤΙΐΐΙ Ami 115 3 1 35, the switch ^ 35 can be driven by the drive source Displacement of the displacement of the micro-transfer wafer to facilitate the alignment test ^ = 1 3 4 when the wafer is adsorbed 'slightly, the child you artificially use your irt type, see the picture 2' for the wafer test 1 3^1! 3 The measured wafer 14 is placed on the stage of the wafer to be tested 1 4, in order to be used, the vacuum picker 1 34 is used to push the day & position for the test, please refer to the figures 3 and 4, when After the positioning of the wafer 14 to be tested on the fixture 200949968 13 3 is completed, the stage mechanism i 3 carries the fixture 133 and the wafer 14 to be tested is displaced to the probe 1 11 of the probe 1 1 card. The 13 3 is driven by the driving source for the upward displacement, and the probe pin V of the penetrating machine is connected with the probe pin V of the worker to be tested, and the wafer 14 to be tested is turned on to perform the test. Wafer 1 4 Test ^ Jobs 'The age of control! 2 In the discriminating of the wafer i 4 to be tested as a good or defective product, it is convenient for === loss of Di (four) 蹲 __, 俾 俾 该 该 该 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片The positioning problem of the wafer placed on the fixture: if= test 1Q is to position the wafer on the fixture 13 3, and the top of the ruler 13 13 is provided with a vacuum pick-and-place device 3 4 and a stack: 1 3 5, 2 3 3 4 When the wafer is adsorbed, the displacement of the wafer is shifted to achieve the positioning. The second type is only adsorbed by the vacuum picker 13 4, resulting in i positioning = = during the transport of the sheet contact probe 111, The offset in the clamp position, and the slight difference in the vibration of the wafer, etc., makes the stability of the positioning (about __), 2 曰i iL still to be strengthened. The problem of the probe 曰1 and the probe scale is as follows: The film must be able to effectively make the electrical contact of the crystal, which is kept in contact with the wafer by 2 = 吏1. Needle load / 3 3 rising position: set the wafer to perform other test operations in the test operation 200949968 3 port mechanism 1 3 standby _ too long, and drastically _ test capacity. The working area must be configured correspondingly—the problem of the stage mechanism 13: The industry ▲ area must be configured with the stage mechanism 13 in order to be able to individually set 曰1% to the position of each test area and to use the fixture of the stage mechanism 13 Shifting the wafer to keep in contact with the probe 1 u, if it is to increase the production period s 1 set of test devices, then the stage mechanism stage mechanism 13 must be relatively added to the array. In the wafer execution test operation, the U-loaded wafer cannot be fully used. Shipping operations, so the organization 13 will increase the cost of the equipment. How to reduce the cost of equipment and improve the detection capacity under the trend of tearing the w array of the port, measuring production: ΐ ΐ 的 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 发明 发明 发明 发明Transfer the test device, its parts, and the test socket 'the transfer carrier has the pick and place and the lower side of the two sides; the pivot base == two test sockets are attached to the base =, the i seat is spring And the slider is arranged on the base 2, so that the contact of the wafer can be accurately located on the base, and the electrical contact is achieved when the seat is stabilized. The pedestal is a plurality of arrays === the 仃 test' to achieve a substantial increase in the effectiveness of the test capacity. The invention further provides a transfer test device for wafer testing, the 200949968, After the tester is placed on the mask, the positioning is made by the Πί' and the stylus is in good electrical contact with the stylus; the lower pressing member does not need to be pressed against the top of the wafer, and the loading is carried out. Carry out the feeding operation of other test sockets, = removable connection Effectively reduce the standby time of the transfer vehicle, enabling & to increase the efficiency of the use and increase the efficiency of the test capacity. , the most tested test device, above the ❹ 片 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , [Embodiment] Implementation of $^=1^; further understanding of the invention, a preferred embodiment of the invention is directed to the application of the wafer (ChiP or 2 and the guide seat 23 mainly includes a base 21 The upper base 2?1 is provided with a clamping member w1 +2 for elastically pivoting on both sides, and a plurality of insertion holes 213 are provided in the base 21 to #14, and the micro measurement is performed The needle 21 has two insertion holes 21 3 ' and the other end is electrically contacted with the other end of the wafer, and the thunder row is set to Ϊϊ 2 2 Γ ^ 2 1 4 according to the position of the contact of the wafer to be tested, corresponding to the corresponding hole 2 1 3 The contact point of the wafer to be tested can be 2nd and 2nd bottoms; - the upper seat 2 2 is connected with a plurality of springs 2 2 1 and the sliding piece 2 to set the topping member 2 2 3, 2 2 4 to make the upper seat = 2 1 "^," the top piece 2 2 3, 2 2 4 respectively press against the waste clip to open, so that the press clamp 2 1 1 , 2 1 2 can be turned outward for the other pieces Into the base 2 1 And in the upper seat 2 2 rises so that 200949968 abuts the top piece 2 2 3, 2 2 4 out of the clamp 2 χ !, 9 η 0 士 press the central part 2 1 1 , 2 1 2 automatic pivoting clamp to be tested The wafer, the day, the micro stylus 214 in the base 21 can be kept in good condition and the 2^ is arranged in the frame of the base 2 1 and the upper seat 2 2 , and the stylus is placed in the frame of the base 2 1 and the upper seat 2 2 Measure the wafer to achieve stable positioning and two-electricity ίί pin type: Measure _ 'The pin point 2 1 5 1 can be slightly elastically deformed to connect H ^ so that the wafer to be tested remains stable in the test socket 2 “" Good electricity = mode iis test; transfer 1 ===== crystal ro skill: 5 ___ seat 2 order ΤΓ ======士200949968 calendar clamp 2 1 1 , 2 1 2, and so; 1 Clamp 2 2 2, 2; ι ? Turn on. Please refer to Figure i 2, when the clamping member 2, ^ 2 has the outer armor carrier 50, the picker 5 i will be down === 2 1 'The wafer to be tested 40 is placed on the base 2 1 , and the guide bevel 2 3 1 ' of the core can be guided to slide the wafer to be tested into the ❹ ❹ when the clamp 21 21, 212 is automatically柩 么 夹 待 待 曰 12 # 12, this 0 in the test set 2 Temple This invention is due to the test set 2 ◦ itself can be Touching 'good electricality, which makes it possible to shift the 5 Q-position and further reduce the standby time of the gamma-seat system to the maximum operation efficiency and reduce the cost of equipment. ^ Violation of the US test capacity According to this, the present invention is a practical and progressive product and publication, thus allowing the invention patent application;: ΐ 4 [simple description] Figure 1. Schematic diagram of a conventional wafer test apparatus. Figure 2: Action diagram of the conventional wafer test apparatus (Fig. 3: Schematic diagram of the operation of the conventional wafer test apparatus (Fig. 4. Schematic diagram of the operation of the conventional wafer test apparatus (Fig. 5: Test suite of the present invention) Schematic diagram of the decomposition. - Fig. 6. Schematic diagram of the combination of the test socket of the present invention. Fig. 7: Fig. 8 of the test sleeve of the present invention. Fig. 8 is a schematic view of the test socket array of the present invention on the test board: 200949968 ❹ Figure 9: Schematic diagram of the transfer carrier and the test socket of the present invention. Figure 10: Schematic diagram of the transfer carrier of the present invention for placing the wafer into the test socket (1). Figure 11: The present invention Schematic diagram of the transfer carrier placing the wafer into the test socket (2). Figure 12: Schematic diagram of the transfer carrier of the present invention placing the wafer into the test socket (3). Figure 13: Transfer of the present invention Schematic diagram of the carrier placing the wafer into the test socket (4) [Explanation of main component symbols] Conventional part: 1 0 : Test device 1 1 : Probe card 1 2 : Tester 13: Stage mechanism 131: Slipper 13 4 : Vacuum pick-and-placer 1 4 . Wafer Part of the invention: 2 0 : Test socket 2 1 : base 211; press clamp 2 1 4 : stylus 2 1 5 : foil 2 2 : upper seat 2 21 : spring 2 2 4 : abutment 2 3 : guide 3 0 : test board 4 0 · wait Measuring wafer 50: Transfer carrier 51: Pick and place device 5 2: Lower pressing member 111 Probe 13 2: Stage 13 5: Pushing member 212: Pressing member 2151: Needle point 2 31: Leading bevel 1 3 3 : jig 213: insertion hole 216: spacer 2 2 3 : abutting member 11