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TW200911950A - Circuit connecting adhesive film, connecting structure and method for manufacturing the connecting structure - Google Patents

Circuit connecting adhesive film, connecting structure and method for manufacturing the connecting structure Download PDF

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Publication number
TW200911950A
TW200911950A TW097114352A TW97114352A TW200911950A TW 200911950 A TW200911950 A TW 200911950A TW 097114352 A TW097114352 A TW 097114352A TW 97114352 A TW97114352 A TW 97114352A TW 200911950 A TW200911950 A TW 200911950A
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Taiwan
Prior art keywords
circuit
adhesive layer
connection
circuit member
adhesive
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TW097114352A
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Chinese (zh)
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TWI399420B (en
Inventor
Motohiro Arifuku
Nichiomi Mochizuki
Kouji Kobayashi
Takashi Nakazawa
Kazuyoshi Kojima
Yukihisa Hirosawa
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Hitachi Chemical Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001Core members of the layer connector
    • H01L2224/29099Material
    • H01L2224/2919Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06Polymers
    • H01L2924/0665Epoxy resin
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06Polymers
    • H01L2924/078Adhesive characteristics other than chemical
    • H01L2924/0781Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811Extrinsic, i.e. with electrical conductive fillers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19043Component type being a resistor

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

To improve transfer characteristics of a circuit connecting adhesive film to a circuit member while maintaining adhesion strength and long-term connection reliability after circuit connection at sufficiently high levels. Provided is a circuit connecting adhesive film to be used for bonding a first circuit member with a second circuit member. The circuit connecting adhesive film is provided with an adhesive layer and an adhesive layer laminated on the adhesive layer. When the circuit connecting adhesive film is adhered on a surface on a first connecting terminal side of the first circuit member, by permitting the adhesive layer to make contact with the first circuit member, the peeling strength is larger than that when the adhesive layer is adhered on a surface on the first connecting terminal side of the first circuit member, and the thickness of the adhesive layer is 0.1-5.0μm.

Description

200911950 九、發明說明 【發明所屬之技術領域】 本發明係關於電路連接用黏著薄膜、連接構造體及其 製造方法。 【先前技術】 爲使電路基板間或1C晶片等之電子零件與電路基板 以連接端子間電性連接之方式進行黏著,可使用於黏著劑 分散導電粒子之異方性導電黏著劑。例如,使異方性導電 黏著劑配置於電路基板之間,以其狀態進行加熱及加壓, 俾連接各別之電路基板具有之連接端子,於加壓方向具有 導電性,同時並於同一電路基板上對鄰接之連接端子係賦 予絕緣性,而可進行只對向之連接端子間的電器連接。異 方性導電黏著劑係例如有以環氧樹脂作爲主成分之電路連 接用黏著劑(例如參照專利文獻1 )。 薄膜狀之電路連接用黏著劑亦即電路連接用黏著薄膜 一般係使以有機溶劑溶解之電路連接用黏著劑塗佈於薄膜 基材上,再進行乾燥之方法來製造。因此,使用電路連接 用黏著薄膜而連接電路構件之際,必須使薄膜基材上之電 路連接用黏著薄膜轉印於任一的電路構件。電路連接用黏 著薄膜之轉印一般係使電路連接用黏著薄膜載置於電路構 件上,以進行加熱及/或加壓之方法來實施。 專利文獻1 :特開平3-16147號公報 -5- 200911950 【發明內容】 發明之揭示 發明欲解決之問題 但,電路構件之材料構成或電路構成、電路構件製造 時之表面污染等的原因,對電路構件之電路連接用黏著薄 膜的轉印性不充分,有時轉印之步驟的效率或良率會降低 。尤其,近年爲更提昇連接構造物之生產效率,用以轉印 於電路連接用黏著薄膜的電路構件之加熱或加壓的時間被 縮短,要得到充分的轉印性有漸變困難之傾向。 提昇轉印性之方法,係改變電路連接用黏著薄膜之材 料構成,而強化使電路連接用黏著薄膜貼黏於電路構件之 黏著力之方法。但,藉由材料構成之變更而提昇轉印性時 ,就連接電路構件後之黏著強度或長期連接信賴性等而言 要維持充分之程度乃極困難已明顯可知。 本發明係有鑑於上述事情者,目的在於··在電路連接 用黏著薄膜中,可使電路連接後之黏著強度或長期連接信 賴性維持於充分之程度,同時並謀求改善於電路構件之轉 印性。 用以解決課題之手段 在一者的態樣中,本發明係關於一種電路連接用黏著 薄膜,其爲介於具有第一之基板及其主面上所形成之第一 之連接端子之第一之電路構件、與具有第二之基板及其主 面上所形成之第二之連接端子之第二之電路構件之間’以 -6- 200911950 使對向之第一之連接端子與第二之連接端子$$電連接的 方式黏著第一之電路構件與第二之電路構件所使用之電路 連接用黏著薄膜。本發明之電路連接用黏著薄膜,其爲具 備黏著劑層Α與層合於該黏著劑層Α上之黏著劑層Β。在 黏著劑層B與第一之電路構件相接之方向上,將本發明之 電路連接用黏著薄膜貼合於第一之電路構件之第一之連接 端子側之面時的剝離強度,大於黏著劑層A貼合於第一之 電路構件之第一連接端子側之面之時的剝離強度。繼而黏 著劑層B之厚度爲〇.1至5.0 μπι。 在上述本發明之電路連接用黏著薄膜係於黏著劑層A 上具備可貼黏於電路構件時之剝離強度大的黏著劑層B, 此黏著劑層B具有上述特定範圍的厚度。藉此,使電路連 接後之黏著強度或長期連接信賴性維持於充分之程度,同 時並可改善於電路構件之轉印性。 在另一者的態樣中,本發明係關於一種連接構造物, 其爲具備:具有第一之基板及其主面上所形成之第一之連 接端子之第一之電路構件、具有第二之基板及其主面上所 形成之第二之連接端子且該第二之連接端子配置於與第一 之連接端子對向之第二之電路構件、與介於第一之電路構 件與第二之電路構件之黏著層,且,第一之電路構件與第 二之電路構件’以使對向之第一之連接端子與第二之連接 端子形成電連接的方式藉由黏著層黏著的連接構造物。本 發明之連接構造物的黏著層,係在黏著劑層B與第一之電 路構件相接之方向上’使上述本發明之電路連接用黏著用 200911950 薄膜介於第一之電路構件與第二電路構件之間, 下經由加熱及加壓而由電路連接用黏著薄膜所形 在上述本發明之連接構造物係藉具備由上述 電路連接用黏著薄膜所形成之黏著層,俾具有充 電路連接後的黏著強度及長期連接信賴性。又, 生產效率製造。 又在另一者的態樣中,本發明係關於一種連 之製造方法,其爲具備:使上述本發明之電路連 用薄膜在黏著層B與第一之電路構件相接之方向 第一之電路構件之第一之連接端子側之面的步驟 第二之電路構件之步驟,使得第一之連接端子與 接端子隔著電路連接用黏著用薄膜相對向;經由' 壓,使對向之第一之連接端子與第二之連接端子 接般,使第一之電路構件與第二之電路構件以電 薄膜所形成之黏著層予以黏著之步驟。 若依上述本發明之連接構造物的製造方法, 生產效率得到具有充分程度之電路連接後的黏著 期連接信賴性之連接構造物。 發明效果 若依本發明,在電路連接用黏著薄膜中,可 接後之黏著強度或長期連接信賴性維持於充分之 時並改善於電路構件之轉印性。又’若依本發明 接用黏著薄膜,亦可達成鄰接電路間之良好絕緣 於該狀態 友之層。 本發明之 分程度之 可以高的 接構造物 接用黏著 上貼合於 ;與設置 第二之連 加熱及加 形成電連 路連接用 可以高的 強度及長 使電路連 程度,同 之電路連 電阻。 -8- 200911950 用以實施發明之最佳形態 以下,詳細說明有關本發明之適當實施形態。但,本 發明係不限定於以下之實施形態。 圖1係表示具備一實施形態的電路連接用黏著薄膜之 層合片的截面圖。圖1所示之電路連接用黏著薄膜1係由 黏著劑層All與層合於黏著劑層All之一者面上的黏著 劑層B12所構成。電路連接用黏著薄膜1係於黏著劑層 A 1 1側所貼黏之基材薄膜4 1及於黏著劑層B 1 2側所貼黏 之基材薄膜42、以及層合片50構成。基材薄膜41及基材 薄膜42典型上係聚對苯二甲酸乙二酯(PET)薄膜。 圖2係表示一實施形態的連接構造物之截面圖。圖2 所示之連接構造物1〇〇係由具有第一之基板21及其主面 上所形成之第一之連接端子23之第一之電路構件20、與 具有第二之基板31及其主面上所形成之第二之連接端子 32之第二之電路構件30、與黏著層la所構成。第一電路 構件20及第二電路構件30係以第一連接端子間23與第 二連接端子33對向之方式,挾住黏著層la而配置。第一 電路構件20及第二電路構件3 0係藉由含導電粒子5之黏 著層la而黏著。對向之第一連接端子間23與第二連接端 子33係介由導電粒子5而電連接。另外,在第一基板21 上相鄰之第一連接端子23間、及在第二基板31上相鄰之 第二連接端子3 3間係實質上被絕緣。 電路連接用黏著薄膜1係可使用來用以製造連接構造 -9- 200911950 物100之異方性導電黏著薄膜(ACF )。連接構造物100 之黏著層la係由電路連接用黏著薄膜1所形成之層。 於電路連接用黏著薄膜1黏著劑層B12相接於第一電 路構件20之方向,貼黏於第一電路構件20之第一連接端 子23側的面時之剝離強度(以下稱「剝離強度B」)係 亦大於使黏著劑層All貼黏於第一電路構件20之第一連 接端子23側的面時之剝離強度(以下稱「剝離強度A」 )。剝離強度B係以相同的條件貼黏於電路構件上,只要 大於以相同條件所測定的剝離強度A即可。於電路構件之 電路連接用黏著薄膜或黏著劑層A之貼黏係宜隨加熱及加 壓而實施。加熱及加壓係宜以構成各黏著劑層之熱硬化性 樹脂的硬化實質上不進行的程度之條件實施。例如,藉由 70°C、〇.5MPa 5秒鐘的加熱及加壓,貼黏電路連接用黏著 薄膜或黏著劑層A。貼黏後之剝離強度係例如使電路連接 用黏著薄膜或黏著劑層A對於電路構件之主面朝90°C之 方向以50mm/分之剝離速度進行剝離之條件來測定。 以上述條件測定貼黏於電路構件及剝離強度時,剝離 強度B宜爲200N/cm以上。剝離強度B不足200N/cm,有 轉印性提昇之效果變小的傾向。從同樣之觀點,剝離強度 B更宜爲不足150N/cm。又,剝離強度B宜爲2000N/cm 以下。使電路連接用黏著薄膜貼黏於電路構件時,偏離貼 黏位置時,剝離電路連接用黏著薄膜,再度,貼黏電路連 接用黏著薄膜,但若剝離強度B超過2000N/cm,電路連 接用黏著薄膜會牢固地貼黏於電路構件上,有很難剝離之 -10- 200911950 傾向。本發明係剝離強度A小於剝離強度B時顯現效果, 故只要剝離強度A小於剝離強度B即可,此等強度之絕對 値無特別限定。 黏著劑層B 12之厚度爲0.1〜5·0μιη。若黏著劑層B 12之厚度不足Ο.ίμηι,轉印性提昇之效果有變小的傾向, 若超過5μιη,對於電路構件後之連接特性的黏著劑層Β1 2 之影響變大’黏著力、連接電阻、絕緣電阻之任一者的特 性有易降低之傾向。從同樣之觀點,黏著劑層Β 12之厚 度更宜爲1.0〜3.0μηι。 黏著劑層All之厚度係依照第一連接端子23及第二 連接端子33之高度等而適當選擇。黏著劑層All宜具有 對向之第一連接端子23及第二連接端子33之高度的和之 1/3~2倍厚度。若黏著劑層All之厚度不足1/3,於電路 構件間很難充分地塡充黏著劑,電路間之絕緣性有降低之 傾向,若超過2倍,有很難充分確保電路之導通的傾向。 若考慮一般的連接端子之高度,黏著劑層A之厚度宜爲 5 〜4 5 μιη 〇 黏著劑層A 1 1及黏著劑層Β 1 2係例如含有熱硬化性樹 脂及其硬化劑與高分子化合物。 熱硬化性樹脂係例如可適宜使用黏著手冊(第2版曰 刊工業新聞社刊、日本黏著協會編)II、以黏著劑編所記 述者。尤其,從信賴性之觀點,宜爲環氧樹脂及自由基聚 合性化合物。 環氧樹脂係可適宜使用具有2個以上之縮水甘油基之 -11 - 200911950 各種環氧化合物。環氧化合物之例係有:表氯醇與雙酚A 或F、黏著劑等所衍生之雙酚型環氧樹脂、表氯醇與酚酚 醛清漆或甲酚酚醛清漆所衍生之環氧酚醛清漆樹脂、具有 含萘環之骨架的萘系環氧樹脂、縮水甘油基胺、縮水甘油 基醚、聯苯、及脂環式。環氧樹脂宜含有氟原子之環氧化 合物。此等之環氧化合物係可單獨或組合兩種以上而使用 。又,環氧樹脂係使雜質離子(Na+、Cr等)或水解性氯 等之濃度降低至300ppm以下之高純度品,因防止電子遷 移,故佳。 環氧樹脂之硬化劑可舉例如咪唑系、聯胺系、三氟化 硼-胺錯合物、硫鎗鹽、胺醯亞胺、聚胺之鹽、及二氰二 醯胺。使此等之硬化劑以聚胺基甲酸酯系、聚酯系之高分 子物質等被覆而微膠囊化之微膠囊型的硬化劑係因延長可 使用時間,故佳。此等之硬化劑可單獨或組合而使用。亦 可倂用硬化劑、以及分解促進劑、抑制劑等。 自由基聚合性化合物係具有可藉活性自由基而聚合之 官能基(丙烯基、甲基丙烯基等)之化合物。自由基聚合 性化合物係可以單體、寡聚物的任一者的狀態使用,亦可 倂用單體與寡聚物。自由基聚合性化合物係可舉例如丙烯 酸酯化合物、甲基丙烯酸酯化合物、及馬來醯亞胺化合物 。自由基聚合性化合物係宜含有氟原子。亦可倂用含有氟 原子之自由基聚合性化合物與不含有氟之自由基聚合性化 合物。 丙烯酸酯化合物或甲基丙烯酸酯化合物、可舉例如環 -12- 200911950 氧基丙烯酸酯寡聚物、胺基甲酸酯丙烯酸酯寡聚物 丙烯酸酯寡聚物及聚酯丙烯酸酯寡聚物之自由基聚 聚物、三羥甲基丙烷三丙烯酸酯、聚乙二醇二丙烯 聚烷撐基甘醇二丙烯酸酯、季戊四醇丙烯酸酯、2_ 基丙烯酸酯、環己基丙烯酸酯'二環戊烯基丙烯酸 環戊烯氧基乙基丙烯酸酯、2- (2-乙氧基乙氧基) 烯酸酯、2-乙氧基乙基丙烯酸酯、2-乙基己基丙烯 正己基丙烯酸酯、2-羥乙基丙烯酸酯、羥丙基丙烯 異冰片基丙烯酸酯、異癸基丙烯酸酯、異辛基丙烯 正月桂基丙烯酸酯、2-甲氧基乙基丙烯酸酯、2-苯 基丙烯酸酯、四氫糠基丙烯酸酯、新戊二醇二丙烯 二季戊四醇六丙烯酸酯之自由基聚合性單官能或多 烯酸酯單體、以及第三丁基胺基乙基甲基丙烯酸酯 基甲基丙烯酸酯、二環戊烯氧基乙基甲基丙烯酸酯 乙基甲基丙烯酸酯、異冰片基甲基丙烯酸酯、異癸 丙烯酸酯、正月桂基丙烯酸酯 '硬脂基甲基丙烯酸 癸基甲基丙烯酸酯及縮水甘油基甲基丙烯酸酯之自 合性單官能或多官能甲基丙烯酸酯單體。此等係可 組合兩種類以上而使用。此等之中’爲抑制硬化收 予硬化後之柔軟性’宜爲胺基甲酸酯丙烯酸酯寡聚 ,自由基聚合性寡聚物係高黏度’故爲調整黏度, 黏度之自由基聚合性多官能丙烯酸酯單體等之一種] 以上的單體與自由基聚合性寡聚物倂用。 馬來醯亞胺化合物係可適宜使用具有2以上之 、聚醚 合性寡 酸酯、 氰基乙 酯、二 乙基丙 酸酯、 酸酯、 酸酯、 氧基乙 酸酯及 官能丙 、環己 、2-羥 基甲基 酯、三 由基聚 單獨或 縮,賦 物。又 宜使低 获2種 馬來醯 -13- 200911950 亞胺基的化合物。馬來醯亞胺化合物之具體例可舉例如1 -甲基-2,4-雙馬來醯亞胺苯、N,N’-間-苯撐基雙馬來醯亞胺 、N,N’-對苯撐基雙馬來醯亞胺、N,N’-間-甲苯撐基雙馬來 醯亞胺、N,N’-4,4-聯苯撐基雙馬來醯亞胺、N,N’-4,4-( 3,3’-二甲基-聯苯撐基)雙馬來醯亞胺、N,N’-4,4-( 3,3,-二甲基二苯基甲烷)雙馬來醯亞胺、Ν,Ν’-4,4- (3,3’-二乙 基二苯基甲烷)雙馬來醯亞胺、Ν,Ν’-4,4-二苯基甲烷雙馬 來醯亞胺' \,?^’-4,4-二苯基丙烷雙馬來酿亞胺、1^,:^’-4,4-二苯基醚雙馬來醯亞胺、Ν,Ν’- 3,3’-二苯基颯雙馬來醯亞 胺、2,2-雙(4- (4_馬來醯亞胺苯氧基)苯基)丙烷、2,2· 雙(3-第二丁基-4-8 (4-馬來醯亞胺苯氧基)苯基)丙烷 、1,1-雙(4- ( 4-馬來醯亞胺苯氧基)苯基)癸烷、4,4’-環己叉基-雙(1-(4-馬來醯亞胺苯氧基))-2·環己基苯 、及2,2-雙(4-(4-馬來醯亞胺苯氧基)苯基)六氟丙烷 。此等係可單獨或組合兩種類以上而使用。 自由基聚合性化合物係宜含有以下述式(1 )所示的 磷酸酯型甲基丙烯酸酯。藉此,金屬等對無機物表面之黏 著強度會更提昇。磷酸酯型甲基丙烯酸酯之調配量係構成 電路連接用黏著薄膜之成分中對於導電粒子以外之部分 100重量份’宜爲〇·〇〇1~5〇重量份’更宜爲0.5〜1〇重量 份。 -14- 200911950 [化1][Technical Field] The present invention relates to an adhesive film for connection of a circuit, a connection structure, and a method of manufacturing the same. [Prior Art] In order to adhere an electronic component such as a circuit board or a 1C wafer to a circuit board by electrically connecting the terminals, an anisotropic conductive adhesive for dispersing the conductive particles for the adhesive can be used. For example, the anisotropic conductive adhesive is disposed between the circuit boards, heated and pressurized in a state thereof, and connected to the connection terminals of the respective circuit substrates, having conductivity in the pressurizing direction, and simultaneously in the same circuit Insulation is provided to the adjacent connection terminals on the substrate, and electrical connection between the terminals to which only the opposite terminals are connected can be performed. The anisotropic conductive adhesive is, for example, an adhesive for circuit connection using an epoxy resin as a main component (see, for example, Patent Document 1). The film-form adhesive for circuit connection, that is, the adhesive film for circuit connection, is generally produced by applying an adhesive for circuit connection dissolved in an organic solvent to a film substrate, followed by drying. Therefore, when the circuit member is connected by using the adhesive film for circuit connection, it is necessary to transfer the adhesive film for circuit connection on the film substrate to any of the circuit members. The transfer of the adhesive film for circuit connection is generally carried out by placing the adhesive film for circuit connection on the circuit member for heating and/or pressurization. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The transfer property of the adhesive film for circuit connection of the circuit member is insufficient, and the efficiency or yield of the transfer step may be lowered. In particular, in recent years, in order to further improve the production efficiency of the connection structure, the time for heating or pressurizing the circuit member for transfer to the adhesive film for circuit connection is shortened, and it is difficult to obtain sufficient transferability. The method of improving the transferability is a method of changing the material of the adhesive film for circuit connection, and reinforcing the adhesion of the adhesive film for circuit connection to the circuit member. However, when the transfer property is improved by the change in the material composition, it is extremely difficult to maintain the sufficient degree of adhesion strength or long-term connection reliability after connecting the circuit member. In view of the above, the present invention has an object of providing an adhesive film for circuit connection in which adhesion strength or long-term connection reliability after circuit connection can be maintained to a sufficient extent, and at the same time, improvement in transfer of circuit members can be achieved. Sex. Means for Solving the Problem In one aspect, the present invention relates to an adhesive film for circuit connection, which is the first connection terminal formed between a first substrate and a main surface thereof Between the circuit member and the second circuit member having the second substrate and the second connection terminal formed on the main surface thereof, the first connection terminal and the second one are opposite to each other by -6-200911950 The connection terminal $ is electrically connected to adhere the adhesive film for circuit connection used by the first circuit member and the second circuit member. The adhesive film for circuit connection of the present invention is an adhesive layer which is provided with an adhesive layer and laminated on the adhesive layer. When the adhesive layer B of the present invention is bonded to the first circuit member in the direction in which the adhesive layer B is in contact with the first circuit member, the peeling strength when the adhesive film for circuit connection of the present invention is bonded to the first connection terminal side of the first circuit member is greater than the adhesion. The peeling strength when the agent layer A is bonded to the surface of the first circuit member on the first connection terminal side. Then, the thickness of the adhesive layer B is 〇.1 to 5.0 μπι. In the above-described adhesive film for circuit connection of the present invention, the adhesive layer A is provided with an adhesive layer B having a large peeling strength when adhered to a circuit member, and the adhesive layer B has a thickness in the above specific range. Thereby, the adhesion strength or the long-term connection reliability after the connection of the circuit is maintained to a sufficient extent, and the transfer property of the circuit member can be improved. In another aspect, the present invention relates to a connection structure comprising: a first circuit member having a first substrate and a first connection terminal formed on a main surface thereof, and having a second a second connection terminal formed on the substrate and the main surface thereof, wherein the second connection terminal is disposed on the second circuit member opposite to the first connection terminal, and the first circuit member and the second An adhesive layer of the circuit member, and the first circuit member and the second circuit member' are connected by an adhesive layer in such a manner that the first connecting terminal and the second connecting terminal are electrically connected Things. The adhesive layer of the connection structure of the present invention is in the direction in which the adhesive layer B is in contact with the first circuit member. The above-mentioned circuit-bonding adhesive for use in the present invention 200911950 film is interposed between the first circuit member and the second. The connection structure of the present invention is formed by an adhesive film for circuit connection between the circuit members by heating and pressurization. The connection structure of the present invention is provided with an adhesive layer formed by the above-mentioned adhesive film for circuit connection, and has a charging path after connection. Adhesion strength and long-term connection reliability. Also, production efficiency is manufactured. In another aspect, the present invention relates to a method of manufacturing the same, comprising: a circuit for connecting the circuit of the present invention to the first circuit in a direction in which the adhesive layer B is in contact with the first circuit member; Step of the second circuit member of the first connection terminal side of the member, the first connection terminal and the terminal are opposed to each other via the circuit for bonding the adhesive film; The connecting terminal is connected to the second connecting terminal, and the first circuit member and the second circuit member are adhered by an adhesive layer formed of an electric film. According to the method for producing a connection structure of the present invention described above, the connection structure having a sufficient adhesion reliability at the time of connection after the circuit connection is obtained in the production efficiency. According to the present invention, in the adhesive film for circuit connection, the adhesive strength after bonding and the long-term connection reliability are maintained sufficiently and the transfer property of the circuit member is improved. Further, if the adhesive film is used in accordance with the present invention, good insulation between adjacent circuits can be achieved in this state. The structure of the present invention can be attached to the adhesive structure with high degree of adhesion; and the connection with the second heating and the formation of the electrical connection can be used for high strength and long circuit connection. resistance. -8- 200911950 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a preferred embodiment of the present invention will be described in detail. However, the present invention is not limited to the following embodiments. Fig. 1 is a cross-sectional view showing a laminate sheet having an adhesive film for circuit connection according to an embodiment. The adhesive film 1 for circuit connection shown in Fig. 1 is composed of an adhesive layer A1 and an adhesive layer B12 laminated on one of the faces of the adhesive layer A1. The adhesive film 1 for circuit connection is composed of a base film 41 adhered to the side of the adhesive layer A 1 1 , a base film 42 adhered to the side of the adhesive layer B 1 2 , and a laminated sheet 50. The base film 41 and the substrate film 42 are typically polyethylene terephthalate (PET) films. Fig. 2 is a cross-sectional view showing a connection structure of an embodiment. The connection structure 1 shown in FIG. 2 is composed of a first circuit member 20 having a first substrate 21 and a first connection terminal 23 formed on the main surface thereof, and a substrate 31 having the second substrate The second circuit member 30 of the second connection terminal 32 formed on the main surface is formed of the adhesive layer 1a. The first circuit member 20 and the second circuit member 30 are disposed so as to sandwich the adhesive layer 1a so that the first connection terminal 23 and the second connection terminal 33 face each other. The first circuit member 20 and the second circuit member 30 are adhered by the adhesive layer la containing the conductive particles 5. The opposing first connection terminal 23 and the second connection terminal 33 are electrically connected via the conductive particles 5. Further, the first connection terminals 23 adjacent to each other on the first substrate 21 and the second connection terminals 33 adjacent to each other on the second substrate 31 are substantially insulated. The adhesive film 1 for circuit connection can be used to manufacture an anisotropic conductive adhesive film (ACF) of the connection structure -9-200911950. The adhesive layer 1a of the connection structure 100 is a layer formed of the adhesive film 1 for circuit connection. Peeling strength (hereinafter referred to as "peel strength B" when the adhesive film layer B12 for circuit connection is in contact with the first circuit member 20 and adhered to the surface of the first circuit member 20 on the side of the first connection terminal 23 The) is also larger than the peel strength (hereinafter referred to as "peeling strength A") when the adhesive layer A1 is adhered to the surface of the first circuit member 20 on the side of the first connection terminal 23. The peel strength B was adhered to the circuit member under the same conditions as long as it was larger than the peel strength A measured under the same conditions. The adhesive film for the circuit connection of the circuit member or the adhesive layer of the adhesive layer A should be applied with heating and pressing. The heating and the pressurization are preferably carried out under the condition that the hardening of the thermosetting resin constituting each of the adhesive layers is not substantially performed. For example, the adhesive film is bonded to the adhesive film A or the adhesive layer A by heating and pressurizing at 70 ° C, 〇 5 MPa for 5 seconds. The peeling strength after the adhesion is measured, for example, by the condition that the adhesive film or the adhesive layer A for circuit connection is peeled off at a peeling speed of 50 mm/min in the direction of 90 ° C from the main surface of the circuit member. When the adhesion to the circuit member and the peel strength are measured under the above conditions, the peel strength B is preferably 200 N/cm or more. When the peeling strength B is less than 200 N/cm, the effect of improving the transfer property tends to be small. From the same viewpoint, the peel strength B is more preferably less than 150 N/cm. Further, the peel strength B is preferably 2000 N/cm or less. When the adhesive film for circuit connection is adhered to the circuit member, when the adhesive position is deviated from the adhesive position, the adhesive film for the connection of the circuit is peeled off, and the adhesive film for the adhesive circuit is connected again. However, if the peel strength B exceeds 2000 N/cm, the circuit connection is adhered. The film will stick firmly to the circuit components and tend to be difficult to peel off. In the present invention, when the peel strength A is smaller than the peel strength B, the peeling strength A is less than the peel strength B, and the absolute strength of the strength is not particularly limited. The thickness of the adhesive layer B 12 is 0.1 to 5 · 0 μm. If the thickness of the adhesive layer B 12 is less than ί.ίμηι, the effect of the transfer property improvement tends to be small, and if it exceeds 5 μm, the influence of the adhesive layer Β1 2 on the connection characteristics after the circuit member becomes large. The characteristics of either the connection resistance or the insulation resistance tend to be lowered. From the same point of view, the thickness of the adhesive layer 12 is preferably 1.0 to 3.0 μm. The thickness of the adhesive layer A1 is appropriately selected in accordance with the height of the first connection terminal 23 and the second connection terminal 33, and the like. The adhesive layer All should preferably have a thickness of 1/3 to 2 times the sum of the heights of the first connection terminal 23 and the second connection terminal 33. When the thickness of the adhesive layer A1 is less than 1/3, it is difficult to sufficiently fill the adhesive between the circuit members, and the insulation between the circuits tends to be lowered. If it exceeds twice, it is difficult to sufficiently ensure the conduction of the circuit. . Considering the height of the general connection terminal, the thickness of the adhesive layer A is preferably 5 to 4 5 μm. The adhesive layer A 1 1 and the adhesive layer Β 1 2 are, for example, containing a thermosetting resin and a hardener and a polymer thereof. Compound. For the thermosetting resin, for example, an adhesive handbook (Second Edition, Journal of Industrial Press, Japan Adhesive Society) II, and an adhesive preparation can be used. In particular, from the viewpoint of reliability, an epoxy resin and a radical polymerizable compound are preferable. As the epoxy resin, various epoxy compounds having two or more glycidyl groups -11 - 200911950 can be suitably used. Examples of epoxy compounds are: bisphenol type epoxy resins derived from epichlorohydrin and bisphenol A or F, adhesives, etc., epoxy novolacs derived from epichlorohydrin and phenol novolac or cresol novolac A resin, a naphthalene epoxy resin having a skeleton containing a naphthalene ring, a glycidylamine, a glycidyl ether, a biphenyl, and an alicyclic ring. The epoxy resin preferably contains an epoxide of a fluorine atom. These epoxy compounds may be used singly or in combination of two or more. Further, the epoxy resin is a high-purity product in which the concentration of impurity ions (Na+, Cr, etc.) or hydrolyzable chlorine is lowered to 300 ppm or less, and it is preferable because electron migration is prevented. Examples of the curing agent for the epoxy resin include an imidazole-based compound, a hydrazine-based compound, a boron trifluoride-amine complex, a sulfur gun salt, an amine imide, a polyamine salt, and dicyanamide. It is preferred that the microcapsule-type curing agent which is coated with a polyurethane material, a polyester-based polymer material or the like and which is microencapsulated is used for a prolonged usable time. These hardeners can be used singly or in combination. A hardener, a decomposition accelerator, an inhibitor, etc. may also be used. The radically polymerizable compound is a compound having a functional group (propenyl group, methacryl group or the like) which can be polymerized by a living radical. The radically polymerizable compound may be used in the form of either a monomer or an oligomer, or a monomer or an oligomer may be used. The radical polymerizable compound may, for example, be an acrylate compound, a methacrylate compound or a maleimide compound. The radically polymerizable compound preferably contains a fluorine atom. A radical polymerizable compound containing a fluorine atom and a radical polymerizable compound not containing fluorine may also be used. The acrylate compound or the methacrylate compound may, for example, be a cyclo-12-200911950 oxy acrylate oligomer, a urethane acrylate oligomer acrylate oligomer, and a polyester acrylate oligomer. Free radical polymer, trimethylolpropane triacrylate, polyethylene glycol dipropylene polyalkylene glycol diacrylate, pentaerythritol acrylate, 2-ary acrylate, cyclohexyl acrylate 'dicyclopentenyl Cyclopenteneoxyethyl acrylate, 2-(2-ethoxyethoxy) enoate, 2-ethoxyethyl acrylate, 2-ethylhexyl propylene n-hexyl acrylate, 2- Hydroxyethyl acrylate, hydroxypropyl propylene isobornyl acrylate, isodecyl acrylate, isooctyl propylene n-lauryl acrylate, 2-methoxyethyl acrylate, 2-phenyl acrylate, four a radically polymerizable monofunctional or polyenoate monomer of hydroquinone acrylate, neopentyl glycol dipropylene dipentaerythritol hexaacrylate, and a third butylaminoethyl methacrylate methacrylate Dicyclopentenyloxyethylmethyl Ethyl ester ethyl methacrylate, isobornyl methacrylate, isodecyl acrylate, n-lauryl acrylate 'stearyl methacrylate methacrylate and glycidyl methacrylate Self-consistent monofunctional or polyfunctional methacrylate monomers. These systems can be used in combination of two or more types. Among these, 'softness after hardening to suppress hardening' is preferably urethane acrylate oligomerization, and radically polymerizable oligomer is high viscosity', so the viscosity is adjusted, and the free radical polymerizability of viscosity One of a polyfunctional acrylate monomer or the like] The above monomer is used in combination with a radically polymerizable oligomer. The maleic imine compound may suitably be a polyether oligoester, a cyanoethyl ester, a diethyl propionate, an acid ester, an acid ester, an oxyacetate, and a functional group C, Cyclohexyl, 2-hydroxymethyl ester, tri- or poly-condensation, excipient. It is also desirable to obtain two compounds of the Malay 醯-13-200911950 imine group. Specific examples of the maleic imine compound include, for example, 1-methyl-2,4-bismaleimide benzene, N,N'-m-phenylene bismaleimide, N,N'. - p-phenylene bismaleimide, N, N'-m-toluene bismaleimide, N, N'-4,4-biphenylene bismaleimide, N , N'-4,4-( 3,3'-dimethyl-biphenylene) bismaleimide, N,N'-4,4-( 3,3,-dimethyldiphenyl Methane) bismaleimide, anthracene, Ν'-4,4-(3,3'-diethyldiphenylmethane) bismaleimide, anthracene, Ν'-4,4-di Phenyl methane bismaleimide ' \,?^'-4,4-diphenylpropane bismaleimide, 1^,:^'-4,4-diphenyl ether double mala Imine, hydrazine, Ν'- 3,3'-diphenyl fluorene bismaleimide, 2,2-bis(4-(4-maleimide phenoxy)phenyl)propane, 2 ,2·bis(3-t-butyl-4-8(4-maleimidophenoxy)phenyl)propane, 1,1-bis(4-(4-maleimide)phenoxy Phenyl) decane, 4,4'-cyclohexylidene-bis(1-(4-maleimidophenoxy))-2.cyclohexylbenzene, and 2,2-bis(4) -(4-Malayimide Benzene Oxy)phenyl)hexafluoropropane. These may be used singly or in combination of two or more types. The radically polymerizable compound preferably contains a phosphate type methacrylate represented by the following formula (1). Thereby, the adhesion strength of the metal or the like to the surface of the inorganic material is further enhanced. The compounding amount of the phosphate type methacrylate is a component of the adhesive film for circuit connection, and 100 parts by weight of the portion other than the conductive particles is preferably 〇·〇〇1 to 5〇 parts by weight, more preferably 0.5 to 1〇. Parts by weight. -14- 200911950 [Chemical 1]

ο II ch3 (HO)3— p — och2 ch2 ococ-ch2ο II ch3 (HO)3— p — och2 ch2 ococ-ch2

Cl) n=1, 2, 3 上述磷酸酯型甲基丙烯酸酯係磷酸酐與2·羥乙基(甲 基)丙烯酸酯之反應而得到。具體上,有單(2-甲基丙烯 醯氧乙基)酸磷酸酯、二(2-甲基丙烯醯氧乙基)酸磷酸 酯。此等係可單獨或組合兩種類以上而使用。 自由基聚合性化合物之硬化劑係可使用藉光照射及/ 或加熱而產生活性自由基之自由基聚合起始劑。自由基聚 合起始劑係例如有含苯偶因乙基醚及異丙基苯偶因醚之苯 偶因醚、苯甲基及羥環己基苯基酮之苯甲基縮醛、二苯甲 酮及乙醯苯之酮類及其衍生物、硫雜蔥酮類、以及雙咪唑 類之光聚合起始劑。於此等之光聚合起始劑而依需要亦可 以任意之比組合胺類、硫化合物、磷化合物等之增感劑。 藉光照射而使各黏著劑層硬化時,必須依所使用之光源的 波長或所希望之硬化特性等而選擇最適的光聚合起始劑。 增感劑係有如脂肪族胺、含有芳香族基之胺、六氫化 吡啶般氮成爲環系之一部分者、磷甲苯基硫尿素、鈉二乙 基二硫磷酸酯、芳香族亞硫酸之可溶性鹽、Ν,Ν’-二甲基-對胺基苯並腈、Ν,Ν’-二乙基-對胺基苯並腈、:ν,Ν,-二( 冷-氰乙基)-對胺基苯並腈、Ν,Ν’ -二(々-氯乙基)-對胺 基苯並腈、三正丁基磷等。 -15- 200911950 苯丙酮、乙醯苯、氧雜蔥酮、4·甲基乙醯苯' 二苯甲 酮、芴、三苯基、聯苯、硫雜蔥酮、蔥醌、4,4’-雙(二甲 基胺基)二苯甲酮、4,4’-雙(二乙基胺基)二苯甲酮、菲 、萘、4-苯基乙醯苯、4-苯基二苯甲酮、1_碘化萘、2-碘 化萘、苊、2 -萘並腈、1-萘並腈、窟(chrysene)、苯甲 基、萘並苊、芘、1,2-苯並蒽、吖啶、蒽、茈、並四苯、 2-甲氧基萘等之非色素系增感劑、硫僅(thionine )、亞 甲基藍、光黃素(lumi flavin)、核黃素(riboflavin)、 光色素(lumichrome )、香豆素、補骨脂素(Psoralen ) 、8-甲氧基補骨脂素、6-甲基香豆素、5-甲氧基補骨脂素 、5 -羥基補骨脂素、香豆基二吡咯基甲酮、吖啶橘、吖啶 黃(acriflavin )、普魯黃素(proflavine )、焚光素( fluoresceine)、伊紅(eosine) Y、伊紅(eosine) B、赤 蘚紅鈉鹽(erythrosine)、薔薇孟加拉(rosebengal)等 之色素系增感劑。 亦可使用有機過氧化物及/或偶氮系化合物作爲自由 基聚合起始劑。有機過氧化物例如過氧化二醯基、過氧化 二烷基、過氧化二碳酸酯、過氧化酯、過氧化縮醛、氫過 氧化物及過氧化甲矽烷基。偶氮系化合物及/或有機過氧 化物1種或2種以上依目的之連接溫度、連接時間、操作 時間等適當選擇。從高反應性與操作時間而言,宜半衰期 10小時之溫度爲40 °C以上且半衰期1分鐘之溫度爲180 °C 以下的有機過氧化物,更宜半衰期1 〇小時之溫度爲60°C 以上且半衰期1分鐘之溫度爲170°C以下的有機過氧化物 -16- 200911950 爲抑制電路構件之連接端子的腐蝕,於有機過氧化物 中所含有的氯離子或有機酸宜爲5 OOOppm以下,更宜爲於 加熱分解後所產生之有機酸很少者。 過氧化二醯基係有:過氧化異丁基、過氧化2,4-二氯 苯甲醯基、過氧化3,5,5-三甲基己醯基、過氧化辛醯基、 過氧化月桂醯基、過氧化硬脂醯基、過氧化琥珀醯基、苯 甲醯基過氧化甲苯、及過氧化苯甲醯基。過氧化二烷基係 有:α,α’-雙(過氧化第三丁基)二異丙基苯、過氧化二 枯基、2,5-二甲基-2,5-二(過氧化第三丁基)己烷、及過 氧化第三丁基枯基。 過氧化二碳酸酯係有:二正丙基過氧化二碳酸酯、二 異丙基過氧化二碳酸酯、雙(4-第三丁基環己基)過氧化 二碳酸酯、二-2-乙氧基甲氧基過氧化二碳酸酯、二(2-乙 基己基過氧化)二碳酸酯、二甲氧基丁基過氧化二碳酸酯 、及二(過氧化3-甲基-3-甲氧基丁基)二碳酸酯。 過氧化醋係具有:枯基過氧化新癸酸酯、1,1,3,3 -四 甲基丁基過氧化新癸酸酯、1-環己基-1-甲基乙基過氧化壬 酸酯、第三己基過氧化新癸酸酯、第三丁基過氧化三甲基 乙酸酯、1,1,3,3-四甲基丁基過氧化-2-乙基己酸醋'2,5-二甲基-2,5·二(2-乙基己醯基過氧化)己烷、卜環己基_卜 甲基乙基過氧化-2 -乙基己酸酯、第三己基過氧化_2_乙基 己酸酯、第三丁基過氧化-2-乙基己酸酯、第三丁基過氧化 異丁酸酯、1,丨_雙(第二丁基過氧化)環己垸、弟一己基 -17- 200911950 過氧化異丙基單碳酸酯、第三丁基過氧化_3,5,5-三甲 酸酯、第三丁基過氧化月桂酸酯、2,5-二甲基-2,5-二 氧化間甲苯醯基)己烷、第三丁基過氧化異丙基單碳 、第三丁基過氧化-2-乙基己基單碳酸酯、第三己基過 苯甲酸酯、第三丁基過氧化乙酸酯及二(第三丁基過 )六氫對酞酸酯。 過氧化縮醛係具有1,1-雙(第三己基過氧化)-3 三甲基環己烷、1,1-雙(第三己基過氧化)環己烷、 雙(第三丁基過氧化)-3,3,5-三甲基環己烷、1,1-雙 三丁基過氧化)環十二碳烷、及2,2-雙(第三丁基過 )癸烷。 氫過氧化物有:氫過氧化二異丙基苯及氫過氧化 。過氧化甲矽烷基係有:過氧化第三丁基三甲基甲矽 、過氧化雙(第三丁基)二甲基甲矽烷基、過氧化第 基三乙烯基甲矽烷基、過氧化雙(第三丁基)二乙烯 矽烷基、過氧化三(第三丁基)乙烯基甲矽烷基、過 第三丁基三烯丙基甲矽烷基、過氧化雙(第三丁基) 丙基甲矽烷基及過氧化三(第三丁基)烯丙基甲矽烷: 此等之有機過氧化物係可1種單獨或組合2種以 使用。亦可使分解促進劑、抑制劑等與有機過氧化物 。又,使此等之有機過氧化物以聚胺基甲酸酯系、聚 之高分子物質等被覆而微膠囊化者係因延長可使用時 故佳。 亦可倂用有機過氧化物與前述之光聚合起始劑。 基己 (過 酸酯 氧化 氧化 ,3,5- 1,1- (第 氧化 枯基 烷基 三丁 基甲 氧化 二烯 基。 上而 倂用 酯系 間, 進一 -18- 200911950 步,依需要亦可以任意之比例添加胺類、硫化合物、磷化 合物等之增感劑。 於黏著劑層A及黏著劑層B所含有的高分子化合物係 宜選自由聚乙烯基丁縮醛、聚乙烯基甲醛、聚醯胺、聚M 亞胺、聚醯胺醯亞胺、聚酯、酚樹脂、環氧樹脂、苯氧樹 脂、聚胺基甲酸酯、聚酯胺基甲酸酯、聚芳酸酯、苯乙稀 樹脂、聚二甲基矽氧烷或丙烯酸橡膠、腈橡膠、NBR及 SBS所構成之群中的至少一種聚合物。此等係宜含有氟原 子。藉由使用此等,硬化時之應力緩和性優,黏著性更提 昇。以自由基聚合性之官能基改性此等之聚合物者係耐熱 性會提高,故佳。其情形係高分子化合物亦爲自由基聚合 性化合物。 若高分子化合物之重量平均分子量宜爲5000〜1 000000 。若重量平均分子量超過1000000,與其他之成分的混合 性有降低之傾向。 黏著劑層All及黏著劑層B12係含有導電粒子5。介 由導電粒子5而對向之連接端子間電連接,俾達成安定之 電路連接。但,無導電粒子5之情形,亦可藉對向之連接 端子間的直接接蝕以得到連接。如本實施形態般,黏著劑 層All及黏著劑層B12之兩者未必需要含有導電粒子5, 任一者亦可含有導電粒子5。 導電粒子5係有Au、Ag、Ni、Cu'及焊錫等之金屬 粒子、以及碳粒子。爲得到充分之操作時間係導電粒子5 之表層非Ni、Cu等之過渡金屬類,由Au、Ag、鈾屬的貴 -19- 200911950 金屬類所構成。此等之中尤宜爲Au。亦可使用具有由Ni 等之過渡金屬所構成之核體與被覆其表面之Au等的貴金 屬層之被覆粒子作爲導電粒子5。又,亦可使用具非導電 性之玻璃、陶瓷、塑膠等之核體與被覆其表面之金屬層, 金屬層的最外層爲貴金屬層的複合粒子作爲導電粒子5。 此複合粒子係電路連接用黏著薄膜被加熱及加壓時變形, 俾與連接端子之連接面積增加,信賴性提高,故佳。貴金 屬層之厚度係爲得到良好的電阻,宜爲100 A以上。爲更 確實地防止因貴金屬層的缺損等所產生之氧化還原作用產 生游離自由基而引起保存性降低,貴金屬層之厚度宜爲 3 0 0 A以上。 導電粒子5之調配量一般係各黏著劑層之中相對於導 電粒子5以外之成分100體積份於0.1-30體積份的範圍 調節用途。爲防止因過剩之導電粒子5的鄰接電路之短路 等,導電粒子5之調配量更宜爲0.1〜10體積份。 黏著劑層A 1 1及黏著劑層B 1 2係如以上之成分以外, 亦可含有塡充劑、軟化劑、促進劑、抗老化劑、著色劑、 耐燃劑、搖變劑、偶合劑及酚樹脂、或三聚氰胺樹脂、異 氰酸酯類。黏著劑層含有塡充劑時,連續信賴性會提高。 塡充劑之最大徑宜不足導電粒子5之粒徑。塡充劑之調配 量係宜爲各黏著劑層之中相對於導電粒子5以外之成分 100體積份爲5~60體積份。若超過60體積份,信賴性提 昇之效果會飽和,在不足5體積份中添加之效果少。偶合 劑就提昇黏著性而言宜爲具乙烯基、丙烯基、胺基、環氧 -20- 200911950 基、或異氰酸酯基的化合物。 使用如以上說明般’使上述之剝離強度B大於剝離強 度A之方式’調節黏著劑層、All及黏著劑層B12之組成 。提昇剝離強度B之具體方法,例如使黏著劑層b〗2的高 分子化合物之調配量小於黏著劑層A 1 1,使黏著劑層B 1 2 的化合物小於黏著劑層A 1 1等之方法。 電路連接用黏著薄膜1係連接時熔融流動而得到對向 之連接端子間之電連接後,硬化而保持連接者,故電路連 接用黏著薄膜1之流動性係重要因子。流動性係使厚 35μπι、5mmx5mm之電路連接用黏著薄膜挾於厚〇.7mm、 1 5 m m X 1 5 m m之2片玻璃間,進行1 5 0 °C、2 Μ P a ' 1 0秒間 之加熱及加壓,可評估對初期的面積(A )之加熱及加壓 後的面積(B )之比(=(B ) / ( A ))之値作爲指標。相 關之比的値宜爲1.0〜3.0,更宜爲1.5~2.5。不足1.3時, 因流動性不充份,故有時無法得到良好的連接,超過3.0 時係易產生氣泡,信賴性提昇效果會降低。 電路連接用黏著薄膜1之硬化後的4 0 °C之彈性率宜爲 100〜3 00 0MPa,更宜爲 5 00〜2000MPa° 在圖2之連接構造物100中,第一基板21爲玻璃基 板,第1連接端子23係由鉻所構成之鉻電路、又,第二 基板31係聚醯亞胺薄膜,第二連接端子32係由Cu所構 成之銅電路。亦即,第二電路構件30係具有聚醯亞胺薄 膜及形成於其主面上之銅電路之可撓性電路板。黏著層la 係具有源自於黏著劑層A 1 1之層1 1 a及黏著劑層B之層 -21 - 200911950 lib。但’此等之層的界線未必明確,亦有時兩層實質上 完全混合。 連接構造物1 〇 〇係例如藉由具備如下步驟之製造方法 來得到:使電路連接用黏著薄膜1,在黏著劑層B12與第 一之電路構件20相接之方向上貼合於第一之電路構件2〇 之第一之連接端子23側之面的步驟;設置第二之電路構 件30之步驟’使得第一之連接端子23與第二之連接端子 3 3隔著前述電路連接用黏著用薄膜1相對向;經由加熱及 加壓’使對向之第一之連接端子23與第二之連接端子33 形成電路連接般,使第一之電路構件20與第二之電路構 件30以電路連接用薄膜〗所形成之前述黏著層予以黏 著之步驟。 使電路連接用黏著薄膜1貼黏於第一電路構件20之 步驟更詳細地係例如從電路連接用黏著薄膜1剝離黏著劑 層B 1 2側的基材薄膜42,使黏著劑層B 1 2側朝向第一電 路構件20側而使電路連接用黏著薄膜1載置於第一電路 構件1 〇的第1連接端子23側之面,以其狀態加熱及加壓 之方法來實施。藉此,電路連接用黏著薄膜1從基材薄膜 4 1轉印至第一電路構件20。此時之加熱及加壓係例如藉 50~110°c、〇.1〜2MPa、0.5〜5秒鐘的條件來實施。具有電 路連接用黏著薄膜1優之轉印性,故即使以如此之短時間 亦可確實地使電路連接用黏著薄膜1貼黏於第一電路構件 20 ° 本發明係不限定於如以上說明之實施形態,只要不超 -22- 200911950 出本發明的意旨,可適當改變。例如,第一電路構件爲晶 片搭載用基板等之電路基板,第二電路構件亦可爲選自1C 晶片、電阻體晶片、及電容器晶片之晶片零件。又,第一 連接端子及第二連接端子之中至少一者的表面亦可由選自 金、銀、錫及舶族之金屬的至少一種所構成。或第一連接 端子及第二連接端子之中至少一者的表面亦可由銦-錫氧 化物所構成之透明電極來構成。進一步,第一基板及第二 基板之中至少一者的表面亦可由選自聚酯對酞酸酯、聚醚 颯、環氧樹脂、丙烯樹脂、聚醯亞胺樹脂、及玻璃之至少 一種所構成。又,第一基板及第二基板之中至少一者亦可 具有附著於其表面且由選自聚矽氧化合物、聚醯亞胺樹脂 及丙烯樹脂之至少一種。 【實施方式】 實施例 以下,依據實施例及比較例而更具體地說明本發明。 但本發明係不限定於以下之實施例。 實施例1 使苯氧樹脂(Union Carbide公司製、商品名PKHC) 55質量份、雙酚A型環氧樹脂(油化Shell Epoxy公司製 、商品名YL980 ) 5質量份、咪唑系硬化劑(旭化成工業 公司製、商品名Novacure HX- 3 94 1 ) 40質量份、及矽烷 偶合劑(日本Uni car公司製A1 87 ) 3質量份溶解於甲苯 -23- 200911950 中,傳到固形分50質量%之塗佈液A。 然後,使用塗佈裝置而使塗佈液塗佈於單面(塗佈塗 佈液之面)已實施離型處理之厚5 0 μιη的PET薄膜,以70 °C熱風乾燥燥10分鐘,於PET薄膜形成厚15 μιη之黏著 劑層(a )。 使苯氧樹脂(Union Carbide公司製、商品名PKHC ) 3〇質量份、雙酚A型環氧樹脂(油化Shell Epoxy公司製 、商品名YL9 80 ) 1 0質量份、咪唑系硬化劑(旭化成工業 公司製 '商品名Novacure HX-3941) 60質量份、及砂院 偶合劑(日本Uni car公司製A1 87 ) 3質量份溶解於甲苯 中,傳到固形分50質量%之塗佈液B。 然後,使用塗佈裝置而使塗佈液B塗佈於單面(塗佈 塗佈液之面)已實施離型處理之厚25 μιη的PET薄膜,以 7〇°C熱風乾燥燥10分鐘,於PET薄膜形成厚0.1 μη之黏 著劑層(b )。一邊以40°C加熱於上述所得到之黏著劑層 (a)與黏著劑層(b),一邊以輥層合機進行積層,得到 具有黏著劑層(a)作爲「黏著劑層A」,且具有黏著劑 層(b)作爲「黏著劑層B」之電路連接用黏著薄膜。 實施例2 相對於塗佈液A1 00質量份,分散具有聚苯乙烯系核 體(直徑:3μιη)與於其表面從內側依序所形成之Ni層及 Au層之導電粒子(平均粒徑:3·2μιη ) 5質量份,而得到 塗佈液C。使用塗佈裝置而使塗佈液C塗佈於單面(塗佈 -24 - 200911950 塗佈液之面)已實施離型處理之厚5 0 μιη的 70 °C熱風乾燥燥10分鐘,於PET薄膜形β 著劑層(c )。使黏著劑層(c )與黏著劑 例1同樣地進行積層,得到具有黏著劑層 著劑層A」,且具有黏著劑層(b )作爲「| 電路連接用黏著薄膜。 實施例3 相對於塗佈液B 100質量份,分散與使 液C者之導電粒子5質量份,而得到塗佈密 裝置而使塗佈液D塗佈於單面(塗佈塗佈滋 離型處理之厚25 μιη的PET薄膜,以70 °C 分鐘,俾於PET薄膜形成厚0.1 μηι之黏著: 黏著劑層(a)與黏著劑層(d)與實施例1 層,得到具有黏著劑層(a )作爲「黏著劑 有黏著劑層(d)作爲「黏著劑層B」之電 薄膜。 實施例4 使黏著劑層(c )與黏著劑層(d )與實 進行積層,得到具有黏著劑層(c )作爲「 ,且具有黏著劑層(d)作爲「黏著劑層I 用黏著薄膜。 PET薄膜,以 厚1 5 μιη之黏 ί ( b )與實施 (c )作爲「黏 i著劑層B」之 ί用於上述塗佈 ί D。使用塗佈 ί之面)已實施 熱風乾燥燥1 〇 劑層(d )。使 同樣地進行積 層A」,且具 路連接用黏著 施例1同樣地 黏著劑層A j 1」之電路連接 -25- 200911950 實施例5 除使實施例4之黏著劑層(d )的厚度爲5 μηι以外, 其餘係與實施例4同樣做法而得到電路連接用黏著薄膜。 實施例6 含有氟原子之聚醯亞胺樹脂的合成 於安裝有Dean-Stark回流冷卻器、溫度計、及攪拌器 之100ml分離式燒瓶中加入聚氧丙烯二胺15.Ommol及 2,2-雙[4- (4-胺基苯氧基)苯基]六氟丙烷105 .Ommol、N-甲基-2-吡咯烷酮2 8 7g作爲二胺化合物,於室溫下攪拌30 分鐘。 攪拌終了後,加入可與水共沸之芳香族烴的甲苯1 80g 、作爲四羧酸二酐之4,4’-六氟丙叉基酞酸二酐114.0mmol ’使溫度昇溫至50°C而攪拌1小時後,使溫度昇溫至160 °C而回流3小時。於水分定量接受器貯存理論量之水,確 認看不到水之流出後,除去水分定量接受器中之水與甲苯 ’使溫度上昇至1 8 0 °C而除去反應溶液中之甲苯,得到聚 醯亞胺樹脂之NMP溶液。使聚醯亞胺樹脂之NMP溶液以 甲醇再沉澱’粉碎、乾燥,而不含有矽原子,得到含有氟 原子之聚醯亞胺樹脂。於甲乙酮中使所得到之聚醯亞胺樹 脂以4 0 %質量%的濃度溶解。 聚酯胺基甲酸酯樹脂之合成 使用對酞酸作爲二羧酸、丙二醇作爲二醇、4,4,-二苯 -26- 200911950 基甲烷二異氰酸酯作爲異氰酸酯,而合成對酞酸/丙二醇 /4,4’-二苯基甲烷二異氰酸酯之莫耳比爲i.0/1.3/0.25之聚 酯胺基甲酸酯。使所得到之聚酯胺基甲酸酯於甲乙酮中以 2 0 %質量%的濃度溶解。 胺基甲酸酯丙烯酸酯之合成 使質量平均分子量800之聚己內酯二醇400質量份、 2 -羥丙基丙烯酸酯131質量份、作爲觸媒之二丁基錫二月 桂酸酯0.5質量份、作爲聚合抑制劑的氫醌單甲基醚1.〇 質量份一邊攪拌,一邊加熱至5 (TC而混合。然後,滴下異 氟爾酮二異氰酸酯222質量份,進一邊攪拌,一邊昇溫至 8 〇°C而進行胺基甲酸酯化反應。確認後異氰酸酯基的反應 率成爲99%以上,降低反應溫度而得到胺基甲酸酯丙烯酸 酯。使用第三己基過氧化2 -乙基己酸酯之50質量% DOP 溶液(日本油脂股份公司製、商品名Percure HO)作爲游 離自由基產生劑。 使聚醯亞胺樹脂10質量份、聚酯胺基甲酸酯50質量 份、聚酯胺基甲酸酯樹脂39質量份、磷酸酯型丙烯酸酯1 質量份、及第三己基過氧化2-乙基己酸酯5質量份溶解於 甲苯中,再分散與使用於上述塗佈液C者同樣的導電粒子 5質量份而得到塗佈液E。 使聚醯亞胺樹脂1〇質量份、聚酯胺基甲酸酯20質量 份、胺基甲酸酯丙烯酸酯樹脂69質量份、磷酸酯型丙烯 酸酯1質量份、及第三己基過氧化2-乙基己酸酯5質量份 -27- 200911950 溶解於甲苯中’再分散與使用於上述塗佈液 電粒子5質量份而得到塗佈液F。 與實施例1同樣做法,而使厚度1 5 μιη )與厚Ο.ίμιη之黏著劑層(f)分別形成於 使其等進行積層’而得到具有黏著劑層(, 劑層A」’且具有黏著劑層(f)作爲「黏马 路連接用黏著薄膜。 比較例1 除使黏者劑層(d)的厚度爲〇.〇8μιη, 實施例4同樣做法而得到具有黏著劑層( 劑層Α」’且具有黏著劑層(d)作爲「黏 路連接用黏著薄膜。 比較例2 除使黏著劑層(d)的厚度爲Mm以 施例4同樣做法而得到具有黏著劑層(〇 層Α」,且具有黏著劑層(d)作爲「黏著 連接用黏著薄膜。 比較例3 使厚度15μΠΐ之黏著劑層(c)作爲比 接用黏著薄膜。 C者同樣的導 之黏著劑層(e PET薄膜上, ί )作爲「黏著 I劑層Β」之電 又外,其餘係與 c )作爲「黏著 害劑層Β」之電 ,其餘係與實 作爲「黏著劑 層Β」之電路 例3之電路連 -28- 200911950 比較例4 使厚度15μηι之黏著劑層(d)作爲比較例4之電路連 接用黏著薄膜。 比較例5 使厚度15μηι之黏著劑層(e)作爲比較例5之電路連 接用黏著薄膜。 比較例6 使厚度15μιη之黏著劑層(f)作爲比較例6之電路連 接用黏著薄膜。 使電路連接用黏著薄膜貼黏於電路基板時之剝離強度 (轉印時之剝離強度)的測定 線寬50μιη、線距ΙΟΟμηι、厚0·4μηι之鉻電路5 00條 形成於玻璃(Corning公司製、商品名:#1737)上,準備 具有玻璃基板與作爲連接端子之鉻電路之電路基板。然後 ,剝離上述各實施例及比較例1、2之電路連接用黏著薄 膜的黏著劑層B側之PET薄膜,對於上述電路基板之鉻 電路側的面,黏著劑層B相接於電路基板之方向而載置, 以其狀態以7〇°C、〇.5MPa加熱及加壓5秒鐘,而使電路 連接用黏著薄膜貼黏於電路基板。其後,剝離黏著劑層A 側的PET薄膜。繼而,從電路連接用黏著薄膜之電路基板 的剝離強度以90°C剝離、剝離速度50mm/分的條件測定。 即使有關比較例3〜6的電路連接用黏著薄膜亦藉同樣之操 -29 - 200911950 作,進行貼黏及剝離強度之測定。 電路連接 使上述各實施例及比較例1、2之電路連接用黏著薄 膜的黏著劑層A側之面,對於上述電路基板之鉻電路側的 面而載置,以其狀態以70 °C、0.5 MPa加熱及加壓5秒鐘 ,而使電路連接用黏著薄膜貼黏於電路基板。繼而,剝離 黏著劑層A側的PET薄膜,於黏著劑層A上載置可撓性 電路板(F P C ),以1 8 0 °C、3 Μ P a加熱及加壓1 0秒鐘, 使各黏著劑層硬化,而電路基板與FPC涵蓋寬2mm而連 接之連接構造物。上述FPC係於聚醯亞胺薄膜(宇部興產 股份公司製、商品名、Upilex、厚25μιη)上直接形成線寬 50μιη、線距ΙΟΟμηι、厚8μηι之銅電路500條之2層構成 者。即使有關比較例3〜6的電路連接用黏著薄膜亦藉同樣 之操作,進行電路連接。 電路連接後之黏著強度的測定 電路連接後以90°C剝離、剝離速度50mm/分的條件測 定黏著強渡。黏著強度之測定係初期、與在85°C、85%RH 之高溫高濕槽中保持500小時後實施。 電路連接後之連接電阻的測定 電路連接後,使FPC之鄰接電路間的電阻値在初期以 85 °C ' 8 5%RH之高溫高濕槽中保持500小時後使用萬用表 -30- 200911950 (Multimeter )而測定。電阻値係以鄰接電路間之電阻 150點的平均(χ + 3 σ )表示。 [表1] 黏著劑層 Α/厚度 黏著劑層 Β/厚度 轉印時剝 離強度 [N/cm] 電路連接後黏著強度 ΓΝ/cml 電路連接後連接電阻 [Ω] 初期 80〇C~95%RH, 1000/j、時後 初期 80〇C~95%RH, 1000小時後 實施例1 (a) /15μηι (b) /0.1 μηι 0.40 7.3 3.8 1.5 2.4 實施例2 (C) /15μιη (b) /0.1 μπι 0.40 6.8 4.1 1.3 2.0 實施例3 ⑻ /15μιη (d) /0.1 μπι 0.35 7.1 3.9 1.3 2.0 實施例4 (c) /15μιη (d) /0.1 μΐΏ 0.35 7.0 4.2 1.2 1.8 實施例5 (c) /15μτη ⑷ /5μπι 0.35 7.3 4.0 1.3 1.9 實施例6 (e) /15μιη (f) /0.1 μπι 0.30 10.4 6.6 1.3 1.9 比較例1 (C) /15μιη (d) /0.08μπι 0.08 7.4 3.8 1.3 1.9 比較例2 (C) /15μπι (d) /6μπι 0.45 5.3 3.2 2.5 7.5 比較例3 (C) /15μιη te ytw 0.08 7.5 4.2 1.3 2.0 比較例4 (Φ /15μηι 姐 0.50 4.2 2.1 3.1 10.4 比較例5 ⑷ /15μιη Μ J \ w 0.04 11.1 6.8 1.2 1.8 比較例6 (f) /15μιη M V »、、 0.40 4.5 2.5 3.3 11.7 •31 - 200911950 如表1所示般,實施例1〜6之轉印時剝離強度係大於 相當於各別之電路連接用黏著薄膜具有之黏著劑層A目占# 於電路基板時之剝離強度即比較例3,5的轉印時剝離@胃 。實施例1〜6係評估之全部特性顯示良好的特性。比較例 1係黏著劑層(d)之厚度薄至0_08μηι,故轉印時剝離強 度低。黏著劑層(d)之厚度爲6μηι之比較例2係轉印時 剝離強度高,但電路連接後之黏著力低,連接電阻高。尤 其,高溫高濕試驗處理後之電阻的上昇顯著。不具有相當 於「黏著劑層Β」之層的比較例3、5係轉印時剝離強度 低。比較例4、6係分別只由黏著劑層(d )、黏著劑層( f)所構成,故電路連接後之黏著力低,連接電阻高。 【圖式簡單說明】 圖1係表示電路連接用黏著薄膜之一實施形態的截面 圖。 圖2係表示電路端子之連接構造之一實施形態的截面 圖。 【主要元件符號說明】 1:電路連接用黏著薄膜 I a :黏著層 5 :導電粒子Cl) n = 1, 2, 3 The above phosphate ester type methacrylate phosphoric anhydride is obtained by the reaction of 2, hydroxyethyl (meth) acrylate. Specifically, there are mono(2-methylpropenyloxyethyl) acid phosphate and bis(2-methylpropoxy oxyethyl) acid phosphate. These may be used singly or in combination of two or more types. As the curing agent for the radical polymerizable compound, a radical polymerization initiator which generates active radicals by light irradiation and/or heating can be used. The radical polymerization initiators are, for example, benzoin ethers containing benzoin ethyl ether and isopropyl benzoate, benzyl acetal of benzyl and hydroxycyclohexyl phenyl ketone, and diphenyl A photopolymerization initiator for ketones and acetophenones and derivatives thereof, squalenes, and bisimidazoles. These photopolymerization initiators may be combined with sensitizers such as amines, sulfur compounds, and phosphorus compounds in any ratio as needed. When the adhesive layer is cured by light irradiation, it is necessary to select an optimum photopolymerization initiator depending on the wavelength of the light source to be used, the desired curing property, and the like. The sensitizer is a soluble salt such as an aliphatic amine, an aromatic group-containing amine, a hexahydropyridine-like nitrogen to form a ring system, a phosphorus tolyl thiourea, a sodium diethyl dithiophosphate, and an aromatic sulfite. , Ν, Ν'-dimethyl-p-aminobenzonitrile, hydrazine, Ν'-diethyl-p-aminobenzonitrile, :ν,Ν,-di(cold-cyanoethyl)-p-amine Benzobenzonitrile, hydrazine, Ν'-bis(々-chloroethyl)-p-aminobenzonitrile, tri-n-butylphosphine, and the like. -15- 200911950 Phenylacetone, acetophenone, oxalyl ketone, 4·methyl acetophenone benzophenone, hydrazine, triphenyl, biphenyl, thiopurine, onion, 4,4' - bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, phenanthrene, naphthalene, 4-phenylethylbenzene, 4-phenyldiphenyl Methyl ketone, 1_iodonaphthalene, 2-iodonaphthalene, anthracene, 2-naphthonitrile, 1-naphthonitrile, chrysene, benzyl, naphthacene, anthracene, 1,2-benzo Non-pigment sensitizers such as guanidine, acridine, anthracene, anthracene, tetracene, 2-methoxynaphthalene, sulfur (thionine), methylene blue, lumi flavin, riboflavin , luminosity, coumarin, psoralen, 8-methoxypsoralen, 6-methylcoumarin, 5-methoxypsoralen, 5-hydroxyl Psoralen, coumarinylpyrrolidone, acridine orange, acriflavin, proflavine, fluoresceine, eosine Y, eosin Eosine) B, erythrosine, rosebengal, etc. Statin sensitizer. An organic peroxide and/or an azo compound can also be used as a radical polymerization initiator. Organic peroxides such as dinonyl peroxide, dialkyl peroxide, peroxydicarbonate, peroxyester, peracetal, hydroperoxide and methacrylate. One type or two or more types of azo compounds and/or organic peroxides are appropriately selected depending on the connection temperature, the connection time, the operation time, and the like. From the viewpoint of high reactivity and operation time, an organic peroxide having a half-life of 10 hours and a temperature of 40 ° C or more and a half-life of 1 minute and a temperature of 180 ° C or less is suitable for a half-life of 1 hour and a temperature of 60 ° C. The above-mentioned organic peroxide having a half-life of 1 minute and having a temperature of 170 ° C or lower is in the range of 170 ° C or less. In order to suppress the corrosion of the connection terminal of the circuit member, the chloride ion or the organic acid contained in the organic peroxide is preferably 5 0.000 ppm or less. It is more suitable for the organic acid produced after the decomposition by heating. Bismuth peroxides are: isobutyl peroxide, 2,4-dichlorobenzhydryl peroxide, 3,5,5-trimethylhexyl peroxide, octanyl peroxide, laurel Base, peroxystearyl group, amber azide, benzamidine peroxytoluene, and benzammonium peroxide. Dialkyl peroxides are: α,α'-bis(tributylbutyl peroxide)diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-di (peroxidation) Third butyl) hexane, and tributyl cumyl peroxide. Peroxydicarbonate is: di-n-propyl peroxydicarbonate, diisopropyl peroxydicarbonate, bis(4-t-butylcyclohexyl)peroxydicarbonate, di-2-B Oxymethoxy methoxy peroxydicarbonate, di(2-ethylhexylperoxy)dicarbonate, dimethoxybutyl peroxydicarbonate, and di(3-methyl-3-methylperoxide) Oxybutyl)dicarbonate. Peracetic acid vinegar has: cumyl peroxy neodecanoate, 1,1,3,3-tetramethylbutyl peroxy neodecanoate, 1-cyclohexyl-1-methylethyl peroxydecanoic acid Ester, third hexyl peroxy neodecanoate, tert-butylperoxytrimethyl acetate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoic acid vinegar '2 , 5-dimethyl-2,5·bis(2-ethylhexylperoxy)hexane, cyclohexyl-p-methylethylperoxy-2-ethylhexanoate, third hexyl peroxide 2-ethylhexanoate, tert-butylperoxy-2-ethylhexanoate, tert-butylperoxy isobutyrate, 1, 丨_bis(t-butylperoxy)cyclohexane弟一己基-17- 200911950 isopropyl monocarbonate, tert-butylperoxide _3,5,5-triformate, t-butylperoxylaurate, 2,5-dimethyl Base-2,5-di-m-tolylhydrazyl)hexane, tert-butylperoxyisopropyl monocarbon, tert-butylperoxy-2-ethylhexylmonocarbonate, third hexylperbenzoic acid An acid ester, a tert-butyl peroxyacetate, and a di(t-butylper)hexahydropyridyl ester. Peroxy acetal has 1,1-bis(Third-hexylperoxy)-3 trimethylcyclohexane, 1,1-bis(Third-hexylperoxy)cyclohexane, and di-tertiary Oxidation of -3,3,5-trimethylcyclohexane, 1,1-bistributylperoxy)cyclododecane, and 2,2-bis(t-butylperoxy)decane. Hydroperoxides are: diisopropylbenzene hydroperoxide and hydroperoxide. Methionyl peroxide is: tributyltrimethylformamidine peroxide, bis(t-butyl) dimethylformamidyl peroxide, perylene trivinylcarbenyl peroxide, peroxide double (Third butyl) divinyl fluorenyl, tris(t-butyl)vinylcarbenyl peroxide, tert-butyl triallylcarbonyl, peroxybis(t-butyl)propyl Formyl group and tris(t-butyl) allyl formane: These organic peroxides can be used singly or in combination of two or more. It is also possible to use a decomposition accelerator, an inhibitor, etc. with an organic peroxide. Further, it is preferred that the organic peroxide is coated with a polyurethane or a polymer material and the microcapsules are used for prolongation. Organic peroxides and the aforementioned photopolymerization initiators can also be used. Oxygen oxidative oxidation of perester (3,5- 1,1-(the oxidized cumyl alkyl tributyl methadienyl group. The upper oxime is used in the ester system, into a -18-200911950 step, as needed A sensitizer such as an amine, a sulfur compound or a phosphorus compound is added in an arbitrary ratio. The polymer compound contained in the adhesive layer A and the adhesive layer B is preferably selected from the group consisting of polyvinyl butyral and polyvinyl formaldehyde. Polyamide, poly M imine, polyamidimide, polyester, phenolic resin, epoxy resin, phenoxy resin, polyurethane, polyester urethane, polyarylate, At least one polymer of a group consisting of styrene resin, polydimethyl siloxane or acrylic rubber, nitrile rubber, NBR and SBS. These preferably contain a fluorine atom. By using this, when hardening The stress relaxation property is excellent, and the adhesiveness is further improved. It is preferred that the polymer having such a polymerizable functional group is improved in heat resistance, and the polymer compound is also a radical polymerizable compound. The weight average molecular weight of the polymer compound is preferably 5000 to 1,000,000 0. If the weight average molecular weight exceeds 1,000,000, the mixing property with other components tends to decrease. The adhesive layer All and the adhesive layer B12 contain conductive particles 5. The conductive terminals 5 are electrically connected to each other via the conductive particles 5俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾 俾The conductive particles 5 are not necessarily required to contain the conductive particles 5. The conductive particles 5 are composed of metal particles such as Au, Ag, Ni, Cu', and solder, and carbon particles. The surface layer of the conductive particles 5 is not a transition metal such as Ni or Cu, and is composed of Au, Ag, and uranium noble -19-200911950 metal. Among them, Au is particularly preferable. The core material composed of the transition metal and the coated particles of the noble metal layer such as Au coated on the surface thereof are used as the conductive particles 5. Further, a core body having non-conductive glass, ceramics, plastic, or the like and a metal covering the surface thereof may be used. layer, The outermost layer of the genus layer is a composite particle of a noble metal layer as the conductive particle 5. This composite particle-based circuit-bonding adhesive film is deformed when heated and pressurized, and the connection area between the 俾 and the connection terminal is increased, and the reliability is improved, so that the noble metal is preferable. The thickness of the layer is preferably 100 A or more. It is more effective in preventing the storage of free radicals due to redox generated by defects such as defects in the noble metal layer, and the thickness of the noble metal layer is preferably 3 0 0 A or more The amount of the conductive particles 5 is generally adjusted in the range of 0.1 to 30 parts by volume per 100 parts by volume of the components other than the conductive particles 5 in each of the pressure-sensitive adhesive layers. The amount of the conductive particles 5 is preferably 0.1 to 10 parts by volume in order to prevent short-circuiting of the adjacent circuits of the conductive particles 5 which are excessive. The adhesive layer A 1 1 and the adhesive layer B 1 2 may further contain a chelating agent, a softening agent, an accelerator, an anti-aging agent, a coloring agent, a flame retardant, a rocking agent, a coupling agent, and the like. Phenolic resin, or melamine resin, isocyanate. When the adhesive layer contains a chelating agent, the continuous reliability is improved. The maximum diameter of the ruthenium agent should be less than the particle size of the conductive particles 5. The amount of the chelating agent is preferably 5 to 60 parts by volume per 100 parts by volume of the components other than the conductive particles 5 among the respective adhesive layers. When it exceeds 60 parts by volume, the effect of the reliability improvement is saturated, and the effect of adding less than 5 parts by volume is small. The coupling agent is preferably a compound having a vinyl group, a propylene group, an amine group, an epoxy-20-200911950 group, or an isocyanate group in terms of adhesion. The composition of the adhesive layer, the All, and the adhesive layer B12 was adjusted by the method of "the above-mentioned peeling strength B is larger than the peeling strength A" as described above. A specific method for increasing the peel strength B, for example, a method in which the amount of the polymer compound of the adhesive layer b 2 is smaller than that of the adhesive layer A 1 1 such that the compound of the adhesive layer B 1 2 is smaller than the adhesive layer A 1 1 or the like . When the adhesive film 1 for connection to the circuit is melted and flowed to obtain electrical connection between the opposing connection terminals, and then the connection is made by curing, the fluidity of the adhesive film 1 for circuit connection is an important factor. The fluidity is such that the adhesive film for circuit connection of 35 μm and 5 mm x 5 mm is placed between two sheets of glass having a thickness of 7 mm and 15 mm X 1 5 mm at 150 ° C for 2 Μ P a '10 seconds. Heating and pressurization were used to evaluate the ratio of the area (A) after the initial area (A) and the area (B) after pressurization (= (B) / (A)). The relevant ratio should be 1.0 to 3.0, more preferably 1.5 to 2.5. When the amount is less than 1.3, the fluidity is not sufficient, so that a good connection may not be obtained, and when it exceeds 3.0, bubbles are likely to be generated, and the reliability improvement effect is lowered. The elastic modulus at 40 ° C after hardening of the adhesive film 1 for circuit connection is preferably 100 to 300 MPa, more preferably 50,000 to 2,000 MPa. In the connection structure 100 of FIG. 2, the first substrate 21 is a glass substrate. The first connection terminal 23 is a chrome circuit made of chrome, the second substrate 31 is a polyimide film, and the second connection terminal 32 is a copper circuit made of Cu. That is, the second circuit member 30 is a flexible circuit board having a polyimide film and a copper circuit formed on the main surface thereof. The adhesive layer la has a layer 11 1 a derived from the adhesive layer A 1 1 and a layer - 21 - 200911950 lib of the adhesive layer B. However, the boundaries of these layers are not necessarily clear, and sometimes the two layers are essentially completely mixed. The connection structure 1 is obtained, for example, by a manufacturing method having the following steps: bonding the circuit-attached adhesive film 1 to the first layer in the direction in which the adhesive layer B12 is in contact with the first circuit member 20 a step of providing a second surface of the circuit member 2 on the side of the connection terminal 23; and a step of providing the second circuit member 30 such that the first connection terminal 23 and the second connection terminal 3 are adhered via the above-described circuit connection The film 1 is opposed to each other; the first connecting terminal 23 and the second connecting terminal 33 are electrically connected by heating and pressing, so that the first circuit member 20 and the second circuit member 30 are electrically connected. The step of adhering the aforementioned adhesive layer formed by the film. The step of adhering the circuit-connecting adhesive film 1 to the first circuit member 20 is, for example, more specifically, peeling off the base film 42 on the side of the adhesive layer B 1 2 from the adhesive film 1 for circuit connection, so that the adhesive layer B 1 2 The side of the first circuit member 20 is placed on the side of the first circuit member 20, and the adhesive film 1 for circuit connection is placed on the side of the first connection terminal 23 of the first circuit member 1A, and is heated and pressurized in the state. Thereby, the adhesive film 1 for circuit connection is transferred from the base film 41 to the first circuit member 20. The heating and pressurization at this time is carried out, for example, under the conditions of 50 to 110 ° C, 〇1 to 2 MPa, and 0.5 to 5 seconds. Since the adhesive film 1 for circuit connection has excellent transfer property, the adhesive film 1 for circuit connection can be surely adhered to the first circuit member 20 ° in such a short time. The present invention is not limited to the above description. The embodiment can be appropriately changed as long as it does not exceed -22-200911950. For example, the first circuit member may be a circuit board such as a wafer mounting substrate, and the second circuit member may be a wafer component selected from the group consisting of a 1C wafer, a resistor wafer, and a capacitor wafer. Further, the surface of at least one of the first connection terminal and the second connection terminal may be composed of at least one selected from the group consisting of gold, silver, tin, and metal. Alternatively, the surface of at least one of the first connection terminal and the second connection terminal may be formed of a transparent electrode made of indium-tin oxide. Further, at least one of the first substrate and the second substrate may be made of at least one selected from the group consisting of polyester terephthalate, polyether oxime, epoxy resin, acrylic resin, polyimide resin, and glass. Composition. Further, at least one of the first substrate and the second substrate may have at least one selected from the group consisting of a polysiloxane, a polyimide resin, and an acrylic resin. [Embodiment] Hereinafter, the present invention will be more specifically described based on examples and comparative examples. However, the present invention is not limited to the following examples. Example 1 55 parts by mass of phenoxy resin (manufactured by Union Carbide Co., Ltd., trade name: PKHC), bisphenol A type epoxy resin (manufactured by Oily Shell Epoxy Co., Ltd., trade name YL980), 5 parts by mass, imidazole-based curing agent (Asahi Kasei) Industrial Co., Ltd., product name Novacure HX- 3 94 1 ) 40 parts by mass, and a decane coupling agent (A1 87, manufactured by Uni Car, Japan) 3 parts by mass dissolved in toluene-23-200911950, and passed to a solid content of 50% by mass. Coating liquid A. Then, using a coating device, the coating liquid was applied to a single-sided (coating liquid-coated surface) PET film having a thickness of 50 μm which had been subjected to release treatment, and dried by hot air at 70 ° C for 10 minutes. The PET film was formed into a 15 μm thick adhesive layer (a). 3 parts by mass of phenoxy resin (manufactured by Union Carbide Co., Ltd., trade name: PKHC), bisphenol A type epoxy resin (manufactured by Oily Shell Epoxy Co., Ltd., trade name YL9 80), 10 parts by mass, imidazole-based curing agent (Asahi Kasei) Industrial Co., Ltd. 'trade name Novacure HX-3941) 60 parts by mass and sand yard coupling agent (A1 87, manufactured by Uni Car, Japan) 3 parts by mass dissolved in toluene and passed to a coating liquid B having a solid content of 50% by mass. Then, using a coating device, the coating liquid B was applied to a single-sided (coating liquid-coated surface) PET film having a thickness of 25 μm which had been subjected to release treatment, and dried by hot air at 7 ° C for 10 minutes. An adhesive layer (b) having a thickness of 0.1 μη was formed on the PET film. The adhesive layer (a) and the adhesive layer (b) obtained by heating at 40 ° C were laminated by a roll laminator to obtain an adhesive layer (a) as an "adhesive layer A". Further, the adhesive layer (b) is used as an adhesive film for circuit connection of the "adhesive layer B". Example 2 The conductive particles having a polystyrene-based core body (diameter: 3 μm) and a Ni layer and an Au layer formed on the surface thereof from the inside were dispersed with respect to 00 parts by mass of the coating liquid A1 (average particle diameter: 3·2 μιη) 5 parts by mass to obtain a coating liquid C. The coating liquid C was applied to one side (coated on the surface of the coating liquid of the coating - 24, 2009, 119, 050, 00, 00, 00, 00, 00, 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 Film-shaped β-drug layer (c). The adhesive layer (c) was laminated in the same manner as in the adhesive example 1, to obtain an adhesive layer layer A", and an adhesive layer (b) was used as the "|adhesive film for circuit connection." 100 parts by mass of the coating liquid B, and 5 parts by mass of the conductive particles of the liquid C were dispersed to obtain a coating device, and the coating liquid D was applied to one side (the thickness of the coating coating and the galvanizing treatment was 25). The PET film of μιη was formed at a temperature of 70 ° C for a thickness of 0.1 μηι of the PET film: the adhesive layer (a) and the adhesive layer (d) and the layer of Example 1 to obtain an adhesive layer (a) as "The adhesive has an adhesive layer (d) as an electric film of "adhesive layer B." Example 4 The adhesive layer (c) and the adhesive layer (d) were laminated to each other to obtain an adhesive layer (c). As the ", and with the adhesive layer (d) as the "adhesive film for the adhesive layer I. PET film, with a thickness of 15 μm ί (b) and (c) as a "adhesive layer B" The ί is used for the above coating ί D. The surface of the coating (d) is applied by hot air drying. In the same manner, the laminated layer A" is used, and the circuit of the adhesive layer 1 a 1 1 1 is connected in the same manner as in the bonding example 1 - 200911950. Example 5 The thickness of the adhesive layer (d) of Example 4 is removed. The adhesive film for circuit connection was obtained in the same manner as in Example 4 except for 5 μηι. Example 6 Synthesis of Polyimine Resin Containing Fluorine Atom In a 100 ml separation flask equipped with a Dean-Stark reflux cooler, a thermometer, and a stirrer, polyoxypropylene diamine was added in an amount of 1. 0 mmol and 2,2-double. [4-(4-Aminophenoxy)phenyl]hexafluoropropane 105.Ommol, N-methyl-2-pyrrolidone 2 8 7 g as a diamine compound, and stirred at room temperature for 30 minutes. After the completion of the stirring, 1 80 g of toluene which can be azeotroped with water and 114.0 mmol of 4,4'-hexafluoropropylidene phthalic acid dianhydride as tetracarboxylic dianhydride were added to raise the temperature to 50 ° C. After stirring for 1 hour, the temperature was raised to 160 ° C and refluxed for 3 hours. The theoretical amount of water was stored in the moisture quantitative receiver, and it was confirmed that the water and the toluene in the water quantitative receiver were removed after the water was discharged, and the temperature was raised to 180 ° C to remove the toluene in the reaction solution to obtain a poly NMP solution of quinone imine resin. The NMP solution of the polyimide resin was re-precipitated with methanol to be pulverized and dried without containing a ruthenium atom to obtain a polyimine resin containing a fluorine atom. The obtained polyimine resin was dissolved in a concentration of 40% by mass in methyl ethyl ketone. The polyester urethane resin is synthesized by using p-citric acid as the dicarboxylic acid, propylene glycol as the diol, 4,4,-diphenyl-26-200911950 methane diisocyanate as the isocyanate, and synthesizing p-citric acid/propylene glycol/ The polyester urethane of 4,4'-diphenylmethane diisocyanate having a molar ratio of i.0/1.3/0.25. The obtained polyester urethane was dissolved in methyl ethyl ketone at a concentration of 20% by mass. Synthesis of urethane acrylate: 400 parts by mass of polycaprolactone diol having a mass average molecular weight of 800, 131 parts by mass of 2-hydroxypropyl acrylate, and 0.5 parts by mass of dibutyltin dilaurate as a catalyst. 1. The hydroquinone monomethyl ether as a polymerization inhibitor was heated to 5 (TC and mixed while stirring). Then, 222 parts by mass of isophorone diisocyanate was dropped, and the mixture was heated while stirring to 8 Torr. The urethanation reaction was carried out at ° C. After confirming that the reaction rate of the isocyanate group was 99% or more, the reaction temperature was lowered to obtain a urethane acrylate. The third hexyl peroxide 2-ethyl hexanoate was used. 50% by mass of a DOP solution (manufactured by Nippon Oil & Fat Co., Ltd., trade name Percure HO) as a free radical generator. 10 parts by mass of a polyimide resin, 50 parts by mass of a polyester urethane, and a polyester amine group 39 parts by mass of a formic acid ester resin, 1 part by mass of a phosphate ester type acrylate, and 5 parts by mass of a third hexylperoxy 2-ethylhexanoate are dissolved in toluene, and the dispersion is the same as that used for the coating liquid C described above. Conductive particles The coating liquid E was obtained in a ratio of 1 part by mass of the polyimine resin, 20 parts by mass of the polyester urethane, 69 parts by mass of the urethane acrylate resin, and 1 part by mass of the phosphate type acrylate. And the third hexyl peroxide 2-ethylhexanoate 5 parts by mass -27-200911950 dissolved in toluene' redispersed and used in the coating liquid electroparticles 5 parts by mass to obtain a coating liquid F. In the same manner, the thickness of the adhesive layer (f) of the thickness of 15 μm and the thickness of the adhesive layer (f) are respectively formed so as to be laminated to obtain an adhesive layer (, agent layer A"' and an adhesive layer. (f) As an adhesive film for viscous road connection. Comparative Example 1 was obtained in the same manner as in Example 4 except that the thickness of the adhesive layer (d) was 〇.〇8 μm, and an adhesive layer (agent layer ') was obtained. The adhesive layer (d) was used as the "adhesive film for adhesive bonding. Comparative Example 2, except that the thickness of the adhesive layer (d) was Mm, an adhesive layer was obtained in the same manner as in Example 4, and The adhesive layer (d) was used as the "adhesive film for adhesive bonding. Comparative Example 3 made the thickness 15 The adhesive layer (c) of the crucible is used as the adhesive film. The same adhesive layer (e PET film, ί) is used as the "adhesive I agent layer", and the rest is c) As the "adhesive layer", the rest of the circuit is the circuit of the example 3 of the "adhesive layer". -28-200911950 Comparative Example 4 The adhesive layer (d) having a thickness of 15 μm is used as Comparative Example 4 The adhesive film for circuit connection was used. Comparative Example 5 The adhesive layer (e) having a thickness of 15 μm was used as the adhesive film for circuit connection of Comparative Example 5. Comparative Example 6 A pressure-sensitive adhesive layer (f) having a thickness of 15 μm was used as a circuit of Comparative Example 6. Adhesive film for connection. The measurement of the peeling strength (peeling strength at the time of transfer) when the adhesive film for circuit connection is adhered to the circuit board is 50 μm, the line distance ΙΟΟμηι, and the thickness of 0. 4 μηι chrome circuit are formed in the glass (made by Corning). On the product name: #1737, a circuit board having a glass substrate and a chrome circuit as a connection terminal was prepared. Then, the PET film on the side of the adhesive layer B of the adhesive film for circuit connection of each of the above Examples and Comparative Examples 1 and 2 was peeled off, and the adhesive layer B was in contact with the circuit substrate on the surface on the chrome circuit side of the circuit board. The film was placed in a direction and heated and pressed at 7 ° C and 5 MPa for 5 seconds to adhere the circuit-attached adhesive film to the circuit board. Thereafter, the PET film on the side of the adhesive layer A was peeled off. Then, the peeling strength of the circuit board of the adhesive film for circuit connection was measured at a peeling speed of 90 ° C and a peeling speed of 50 mm / min. Even the adhesive films for circuit connection of Comparative Examples 3 to 6 were subjected to the same operation -29 - 200911950, and the adhesion and peel strength were measured. The surface of the adhesive layer on the side of the adhesive layer of the circuit-bonding adhesive film of each of the above-mentioned Examples and Comparative Examples 1 and 2 was placed on the surface of the circuit board on the side of the chrome circuit, and the state was 70 ° C. 0.5 MPa was heated and pressurized for 5 seconds, and the adhesive film for circuit connection was adhered to the circuit board. Then, the PET film on the side of the adhesive layer A was peeled off, and a flexible circuit board (FPC) was placed on the adhesive layer A, and heated and pressurized at 180 ° C, 3 Μ P a for 10 seconds to make each The adhesive layer is hardened, and the circuit substrate and the FPC cover a connection structure that is connected by a width of 2 mm. The FPC was formed by directly forming a two-layered copper circuit having a line width of 50 μm, a line pitch of ΙΟΟμηι, and a thickness of 8 μηm on a polyimide film (manufactured by Ube Industries, Ltd., trade name, Upilex, and thickness 25 μm). Even in the case of the adhesive films for circuit connection of Comparative Examples 3 to 6, the same operation was carried out to perform circuit connection. Measurement of adhesion strength after circuit connection After the circuit was connected, the adhesion was measured at a peeling rate of 90 ° C and a peeling speed of 50 mm / min. The measurement of the adhesive strength was carried out in the initial stage and after maintaining for 500 hours in a high-temperature and high-humidity bath of 85 ° C and 85% RH. After the connection circuit of the connection resistance after the circuit connection is connected, the resistance 邻接 between the adjacent circuits of the FPC is maintained at 85 ° C ' 8 5% RH in the high temperature and high humidity tank for 500 hours, and then the multimeter -30-200911950 (Multimeter) is used. ) and measured. The resistance 値 is expressed as the average (χ + 3 σ ) of the resistance between adjacent circuits of 150 points. [Table 1] Adhesive layer 厚度/thickness adhesive layer Β/thickness peeling strength during transfer [N/cm] Adhesive strength after circuit connection ΓΝ/cml Connection resistance after circuit connection [Ω] Initial 80〇C~95%RH , 1000/j, after the initial 80 〇C~95% RH, after 1000 hours Example 1 (a) /15μηι (b) /0.1 μηι 0.40 7.3 3.8 1.5 2.4 Example 2 (C) /15μιη (b) / 0.1 μπι 0.40 6.8 4.1 1.3 2.0 Example 3 (8) /15μηη (d) /0.1 μπι 0.35 7.1 3.9 1.3 2.0 Example 4 (c) /15μιη (d) /0.1 μΐΏ 0.35 7.0 4.2 1.2 1.8 Example 5 (c) / 15μτη (4) /5μπι 0.35 7.3 4.0 1.3 1.9 Example 6 (e) /15μιη (f) /0.1 μπι 0.30 10.4 6.6 1.3 1.9 Comparative Example 1 (C) /15μιη (d) /0.08μπι 0.08 7.4 3.8 1.3 1.9 Comparative Example 2 (C) /15μπι (d) /6μπι 0.45 5.3 3.2 2.5 7.5 Comparative Example 3 (C) /15μιη te ytw 0.08 7.5 4.2 1.3 2.0 Comparative Example 4 (Φ /15μηι Sister 0.50 4.2 2.1 3.1 10.4 Comparative Example 5 (4) /15μιη Μ J \ w 0.04 11.1 6.8 1.2 1.8 Comparative Example 6 (f) /15μιη MV », 0.40 4.5 2.5 3.3 11.7 • 31 - 200911950 As shown in Table 1, Examples 1 to 6 The peel strength at the time of transfer is larger than the peel strength of the adhesive layer A of the adhesive film of the respective circuit connection, which is the peeling strength at the time of the circuit board, that is, the peeling of the stomach at the time of transfer of Comparative Examples 3 and 5. All of the characteristics evaluated in the 1 to 6 series showed good characteristics. In Comparative Example 1, the thickness of the adhesive layer (d) was as thin as 0_08 μη, so the peel strength at the time of transfer was low. The thickness of the adhesive layer (d) was 6 μm. In the case of transfer, the peel strength is high, but the adhesion after the connection of the circuit is low, and the connection resistance is high. In particular, the resistance after the high-temperature and high-humidity test is significantly increased. There is no comparison of the layer corresponding to the "adhesive layer". In Examples 3 and 5, the peel strength was low at the time of transfer. In Comparative Examples 4 and 6, the adhesive layer (d) and the adhesive layer (f) were respectively formed, so that the adhesion after the circuit connection was low, and the connection resistance was high. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing an embodiment of an adhesive film for circuit connection. Fig. 2 is a cross-sectional view showing an embodiment of a connection structure of circuit terminals. [Description of main component symbols] 1: Adhesive film for circuit connection I a : Adhesive layer 5 : Conductive particles

II :黏著劑層A 1 2 :黏著劑層B -32 - 200911950 20 ‘·第1電路構件 21 :第1基板 23 :第一連接端子 3 0 :第二電路構件 3 1 :第二基板 3 3 :第二連接端子 41、42 :基材薄膜 1 0 0 :連接構造物 -33-II: Adhesive layer A 1 2 : Adhesive layer B - 32 - 200911950 20 '· First circuit member 21 : First substrate 23 : First connection terminal 3 0 : Second circuit member 3 1 : Second substrate 3 3 : Second connection terminal 41, 42: base film 1 0 0 : connection structure - 33-

Claims (1)

200911950 十、申請專利範圍 1· 一種電路連接用黏著薄膜,其爲 介於具有第一之基板及其主面上所形成之第 端子之第一之電路構件,與具有第二之基板及其 形成之第二之連接端子之第二之電路構件之間, 之前述第一之連接端子與前述第二之連接端子形 的方式黏著前述第一之電路構件與前述第二之電 使用之電路連接用黏著薄膜,其特徵爲, 具有黏著劑層A與層合於該黏著劑層A上 層B, 在前述黏著劑層B與前述第一之電路構件相 上,將該電路連接用黏著用薄膜貼合於前述第一 件之前述第一之連接端子側之面時的剝離強度, 黏著劑層A貼合於前述第一之電路構件之前述第 子側之面之時的剝離強度, 前述黏著劑層B之厚度爲0.1至5.0 μιη。 2. 如申請專利範圍第1項之電路連接用黏 其中,前述黏著劑層Α及前述黏著劑層Β中至少 有熱硬化性樹脂。 3. 如申請專利範圍第1或2項之電路連接 膜,其中,前述黏著劑層A及前述黏著劑層B中 爲含有導電粒子。 4. 一種連接構造物,其爲具備有 具有第一之基板及其主面上所形成之第一之 一之連接 主面上所 以使對向 成電連接 路構件所 之黏著劑 接之方向 之電路構 大於前述 一連接端 著薄膜, 一者爲含 用黏著薄 至少一者 連接端子 -34- 200911950 之第一之電路構件,與 具有第二之基板及其主面上所形成之第二之連接端子 ,且該第二之連接端子配置於與前述第一之連接端子對向 之第二之電路構件,與, 介於前述第一之電路構件與前述第二之電路構件之黏 著層,且, 前述第一之電路構件與前述第二之電路構件,以使對 向之前述第一之連接端子與前述第二之連接端子形成電連 接的方式藉由前述黏著層黏著的連接構造物, 其特徵爲, 前述黏著層爲,將具有黏著劑層A與層合於該黏著劑 層A上之黏著劑層B的電路連接用黏著用薄膜,在黏著劑 層B與前述第一電路構件相接之方向上介於前述第一之電 路構件與前述第二電路構件之間,於該狀態下經由加熱及 加壓而由前述電路連接用黏著薄膜所形成之層, 在前述黏著劑層B與前述第一之電路構件相接之方向 上,將該電路連接用黏著用薄膜貼合於前述第一之電路構 件之前述第一之連接端子側之面時的剝離強度,大於前述 黏著劑層A貼合於前述第一之電路構件之前述第一連接端 子側之面之時的剝離強度, 前述黏著劑層B之厚度爲〇.1至5.Ομιη。 5. —種連接構造物之製造方法,其爲具備有 具有第一之基板及其主面上所形成之第一之連接端子 之第一之電路構件,與 -35- 200911950 具有第二之基板及其主面上所形成之第二之連接端子 ,且該第二之連接端子配置於與前述第一之連接端子對向 之第二之電路構件,與, 介於前述第一之電路構件與前述第二之電路構之黏著 層,且, 前述第一之電路構件與前述第二之電路構件,以使對 向之前述第一之連接端子與前述第二之連接端子形成電連 接的方式藉由前述黏著層黏著的連接構造物之製造方法, 其特徵爲, 將具備有黏著劑層A與層合於該黏著劑層A上之黏 著劑層B之電路連接用黏著薄膜,在前述黏著層B與前述 第一之電路構件相接之方向上貼合於前述第一之電路構件 之前述第一之連接端子側之面的步驟,與 設置前述第二之電路構件之步驟,使得前述第一之連 接端子與前述第二之連接端子隔著前述電路連接用黏著用 薄膜相對向, 經由加熱及加壓,使對向之前述第一之連接端子與前 述第二之連接端子形成電路連接般,使前述第一之電路構 件與前述第二之電路構件以前述電路連接用薄膜所形成之 前述黏著層予以黏著之步驟, 在前述黏著劑層B與前述第一之電路構件相接之方向 上,將該電路連接用黏著用薄膜貼合於前述第一之電路構 件之前述第一之連接端子側之面時的剝離強度,大於前述 黏著劑層A貼合於前述第一之電路構件之前述第一連接端 -36- 200911950 子側之面之時的剝離強度, 前述黏著劑層B之厚度爲0.1至5. Ομπι。 6. 如申請專利範圍第5項之連接構造物 ,其中,前述第一之連接端子與前述第二之連 少一者之表面,爲由金、銀、錫與鉑族之金屬 少一種所構成。 7. 如申請專利範圍第5項之連接構造物 ,其中,前述第一之連接端子與前述第二之連 少一者之表面,爲由銦-錫氧化物所形成之透 成。 8 .如申請專利範圍第5項之連接構造物 ,其中,前述第一之基板與前述第二之基板中 表面,爲由聚對苯二甲酸酯、聚醚楓、環氧樹 樹脂、聚醯亞胺樹脂與玻璃所選出之至少一種 9 ·如申請專利範圍第5至8項中任一項 物之製造方法,其中,前述第一之基板與前述 中至少一者,其表面所附著者具有由聚矽氧化 亞胺樹脂及丙烯酸樹脂所選出之至少一種。 之製造方法 接端子中至 所選出之至 之製造方法 接端子中至 明電極所構 之製造方法 至少一者之 脂、丙烯酸 所構成。 之連接構造 第二之基板 合物、聚醯 -37-200911950 X. Patent Application No. 1. An adhesive film for circuit connection, which is a first circuit member between a first terminal formed on a first substrate and a main surface thereof, and a substrate having a second Between the second circuit members of the second connection terminals, the first connection terminal and the second connection terminal are connected to each other to connect the first circuit member to the second electrical circuit. The adhesive film is characterized in that an adhesive layer A is laminated on the upper layer B of the adhesive layer A, and the adhesive layer B is bonded to the first circuit member to bond the circuit-bonding adhesive film. The peeling strength at the surface of the first connecting terminal side of the first member, and the peeling strength when the adhesive layer A is bonded to the surface of the first circuit member on the first sub-side, the adhesive layer The thickness of B is 0.1 to 5.0 μm. 2. The adhesive for the circuit connection according to the first aspect of the patent application, wherein the adhesive layer and the adhesive layer are at least a thermosetting resin. 3. The circuit connecting film according to claim 1 or 2, wherein the adhesive layer A and the adhesive layer B contain conductive particles. A connection structure which is provided with a connection main surface having a first substrate and a first one formed on a main surface thereof so that an adhesive which is opposed to an electrical connection member is connected The circuit structure is larger than the connecting end of the film, one of the first circuit member including the adhesive terminal at least one of the connection terminals -34-200911950, and the second substrate and the second surface formed on the main surface thereof a connection terminal, wherein the second connection terminal is disposed on a second circuit member opposite to the first connection terminal, and is in an adhesion layer between the first circuit member and the second circuit member; The first circuit member and the second circuit member are connected to each other by the adhesive layer so that the first connection terminal and the second connection terminal are electrically connected to each other. The adhesive layer is an adhesive film for circuit connection having an adhesive layer A and an adhesive layer B laminated on the adhesive layer A, in the adhesive layer B and the foregoing a layer formed between the first circuit member and the second circuit member in a direction in which the circuit member is in contact with each other, and the layer formed by the adhesive film for circuit connection is heated and pressurized in this state, in the adhesive In the direction in which the layer B is in contact with the first circuit member, the peeling strength when the circuit-bonding adhesive film is bonded to the first connection terminal side of the first circuit member is greater than the adhesion The peeling strength when the layer A is bonded to the surface of the first circuit member on the first connection terminal side, and the thickness of the adhesive layer B is 0.1 to 5. Ομιη. 5. A method of manufacturing a connection structure, comprising: a first circuit member having a first substrate and a first connection terminal formed on a main surface thereof, and a substrate having a second with -35-200911950 And a second connection terminal formed on the main surface thereof, wherein the second connection terminal is disposed on the second circuit member opposite to the first connection terminal, and is interposed between the first circuit component and An adhesive layer of the second circuit structure, wherein the first circuit member and the second circuit member are configured to electrically connect the first connection terminal and the second connection terminal A method for producing a bonded structure to which the adhesive layer is adhered, characterized in that an adhesive film for connecting a circuit layer having an adhesive layer A and an adhesive layer B laminated on the adhesive layer A is provided in the adhesive layer a step of bonding B to a surface of the first circuit member in a direction in which the first circuit member is in contact with the first connection terminal side, and a step of providing the second circuit member The first connection terminal and the second connection terminal are opposed to each other via the circuit-connecting adhesive film, and the first connection terminal and the second connection terminal are formed to form a circuit via heating and pressurization. Connecting the first circuit member and the second circuit member to the adhesive layer formed by the circuit connecting film, and bonding the adhesive layer B to the first circuit member In the direction, the peeling strength when the circuit-bonding adhesive film is bonded to the surface of the first circuit member on the first connection terminal side is larger than the adhesion layer A is bonded to the first circuit member Ομπι。 The peeling strength of the first connecting end -36- 200911950 on the side of the sub-side, the thickness of the adhesive layer B is 0.1 to 5. Ομπι. 6. The connection structure according to claim 5, wherein the surface of the first connection terminal and the second one is made of a metal of gold, silver, tin and a platinum group. . 7. The connection structure according to claim 5, wherein the surface of the first connection terminal and the second one is formed by indium-tin oxide. 8. The connection structure of claim 5, wherein the surface of the first substrate and the second substrate is made of polyethylene terephthalate, polyether maple, epoxy resin, and poly The manufacturing method of any one of the above-mentioned first substrate and at least one of the foregoing, the surface of which is attached to at least one of the above-mentioned first substrate and at least one of the foregoing It has at least one selected from the group consisting of polyfluorene oxide resin and acrylic resin. The manufacturing method of the terminal is selected from the manufacturing method of the terminal to the manufacturing method of the electrode, and at least one of the resin and the acrylic. The connection structure of the second substrate composition, poly-醯-37-
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