CN102638944B - Circuit connecting adhesive film, connecting structure and method for manufacturing the connecting structure - Google Patents

Abstract

The present invention provides an adhesive film for circuit connection, a bonded structure, and a method for producing the same. The present invention also provides an application of an adhesive film as an adhesive film for circuit connection, the adhesive film has an adhesive layer A and an adhesive layer B on A, and the adhesive film for circuit connection is interposed between the first circuit part Between the second circuit part, the first circuit part has a first substrate and first connection terminals formed on its main surface, the second circuit part has a second substrate and second connection terminals formed on its main surface, The first circuit component and the second circuit component are bonded in such a manner that the opposing first connection terminal and the second connection terminal are electrically connected, and the first circuit component is placed in the direction where the adhesive layer B is in contact with the first circuit component. The peel strength when the adhesive film is pasted on the first connection terminal side of the first circuit component is greater than the peel strength when the adhesive layer A is attached to the first connection terminal side of the first circuit component, and the thickness of the adhesive layer B is 0.1 to 3.0 μm.

Description

Adhesive film for circuit connection, bonded structure, and manufacturing method thereof

This application is a divisional application of a Chinese patent application with the filing date of the original application being April 17, 2008, the application number being 200880004949.1, and the title of the invention being "Adhesive Film for Circuit Connection, Bonding Structure, and Manufacturing Method Thereof".

technical field

The present invention relates to an adhesive film for circuit connection, a bonded structure, and a method for producing the same.

Background technique

An anisotropic conductive adhesive in which conductive particles are dispersed in the adhesive can be used to bond circuit boards together or electronic components such as IC chips and circuit boards to electrically connect connection terminals to each other. For example, an anisotropic conductive adhesive is provided between the circuit boards. In this state, the connection terminals of the respective circuit boards can be connected by heating and pressure, and the conductivity can be maintained in the direction of pressure. At the same time, insulation can be imparted to adjacent connection terminals on the same circuit board, and electrical connection can be performed only between the connection terminals in opposite directions. As an anisotropic conductive adhesive, for example, there is an adhesive for circuit connection mainly composed of an epoxy resin (for example, refer to Patent Document 1).

A film-like circuit-connecting adhesive, that is, a circuit-connecting adhesive film is generally produced by coating a film base material with a circuit-connecting adhesive dissolved in an organic solvent, followed by drying. Therefore, when connecting circuit components using the adhesive film for circuit connection, it is necessary to transfer the adhesive film for circuit connection on the film base material to any one of the circuit components. The transfer of the adhesive film for circuit connection is generally carried out by placing the adhesive film for circuit connection on a circuit component and heating and/or applying pressure.

Patent Document 1: Japanese Patent Application Laid-Open No. 3-16147.

Contents of the invention

However, the transferability of the circuit-connecting adhesive film to the circuit member may be insufficient due to the material composition or circuit structure of the circuit member, surface contamination during circuit member manufacture, etc., and the efficiency or yield of the transfer process may decrease. Especially in recent years, in order to further improve the production efficiency of bonded structures, it tends to become more and more difficult to obtain sufficient transferability by shortening the heating or pressurization time for transferring the adhesive film for circuit connection to the circuit member.

As a method of improving transferability, it is effective to change the material composition of the adhesive film for circuit connection to increase the adhesive force when the adhesive film for circuit connection is attached to a circuit component. However, when the transferability is improved by changing the material composition, it has been found that it is extremely difficult to maintain a sufficient level from the viewpoint of the bonding strength after connecting circuit components, long-term connection reliability, and the like.

The present invention was made in view of the above-mentioned problems, and its object is to provide an adhesive film for circuit connection that maintains the adhesive strength after circuit connection and long-term connection reliability at a sufficient level, and at the same time realizes the adhesion to circuit components. Improvement in transferability.

In one aspect, the present invention relates to an adhesive film for circuit connection interposed between a first circuit part and a second part, wherein the first circuit part has a first substrate and a first substrate formed on a main surface thereof. A connection terminal, the second circuit component has a second substrate and a second connection terminal formed on its main surface, using the circuit connection adhesive film for electrically connecting the opposing first connection terminal and the second connection terminal The first circuit component and the second circuit component are bonded in a manner. The adhesive film for circuit connection according to the present invention has an adhesive layer A and an adhesive layer B laminated on the adhesive layer A. The peel strength when the adhesive film for circuit connection according to the present invention is attached to the surface of the first connection terminal side of the first circuit member in the direction where the adhesive layer B is in contact with the first circuit member is higher than that when the adhesive layer is attached A has a high peel strength when attached to the surface on the first connection terminal side of the first circuit member. The thickness of the adhesive layer B is 0.1 to 5.0 μm.

In the above-mentioned adhesive film for circuit connection according to the present invention, the adhesive layer B having a high peel strength when attached to a circuit member is provided on the adhesive layer A, and the adhesive layer B has a thickness within the above-mentioned specific range. Thereby, the adhesive strength after circuit connection and long-term connection reliability can be maintained at a sufficient level, and the transferability to a circuit part can be improved simultaneously.

In terms of another aspect, the present invention relates to a connection structure having a first circuit component, a second circuit component, and an adhesive layer interposed between the first circuit component and the second circuit component, wherein the first circuit The component has a first substrate and first connection terminals formed on its main surface, and the second circuit component has a second substrate and second connection terminals formed on its main surface, and is arranged such that the second connection terminals are connected to the first The connection terminals are facing each other, and the first circuit component and the second circuit component are bonded through the adhesive layer to electrically connect the opposite first connection terminal and the second connection terminal. The adhesive layer of the bonded structure according to the present invention is formed by interposing the above-mentioned adhesive film for circuit connection according to the present invention between the first circuit member in the direction in which the adhesive layer B is in contact with the first circuit member. In this state, between the second circuit member and the second circuit member, heat and pressure are applied to form an adhesive layer from the adhesive film for circuit connection.

The bonded structure according to the present invention has a sufficient level of adhesive strength after circuit connection and long-term connection reliability by having an adhesive layer formed of the adhesive film for circuit connection according to the present invention. In addition, it can be manufactured with high production efficiency.

Furthermore, this invention relates to the manufacturing method of the said bonded structure from another aspect. The method of manufacturing a bonded structure according to the present invention includes the step of applying the adhesive layer B described above to the surface of the first connection terminal side of the first circuit member in a direction in which the adhesive layer B is in contact with the first circuit member. The process of sticking the adhesive film for circuit connection; the process of arranging the second circuit component in such a way that the first connection terminal and the second connection terminal face each other across the adhesive film for circuit connection; The form of the terminal and the second connection terminal is a step of bonding the first circuit member and the second circuit member with an adhesive layer formed of an adhesive film for circuit connection by applying heat and pressure.

According to the method for producing a bonded structure according to the present invention, a bonded structure having a sufficient level of adhesive strength after circuit connection and long-term connection reliability can be obtained with sufficiently high production efficiency.

According to the present invention, the adhesive film for circuit connection can maintain sufficient levels of adhesive strength and long-term connection reliability after circuit connection, and can improve transferability to circuit components. In addition, with the adhesive film for circuit connection of the present invention, good insulation resistance between adjacent circuits can be obtained.

Description of drawings

FIG. 1 is a cross-sectional view showing one embodiment of an adhesive film for circuit connection.

Fig. 2 is a cross-sectional view showing an embodiment of a connection structure of circuit terminals.

Symbol Description

1 Adhesive film for circuit connection

1a adhesive layer

5 conductive particles

11 Adhesive layer A

12 Adhesive layer B

20 first circuit components

21 first substrate

23 first connection terminal

30 second circuit component

31 second substrate

33 Second connection terminal

41, 42 Substrate film

100 connection structures

Detailed ways

Hereinafter, preferred embodiments of the present invention will be specifically described. However, the present invention is not limited to the following embodiments.

FIG. 1 is a cross-sectional view showing a laminated board having an adhesive film for circuit connection according to an embodiment. The adhesive film 1 for circuit connection shown in FIG. 1 is comprised from the adhesive bond layer A11 and the adhesive bond layer B12 laminated|stacked on one surface of the adhesive bond layer A11. The adhesive film 1 for circuit connection constitutes a laminate 50 together with the base film 41 attached to the adhesive layer A11 side and the base film 42 attached to the adhesive layer B12 side. The base film 41 and the base film 42 are typically polyethylene terephthalate (PET) films.

FIG. 2 is a cross-sectional view showing a bonded structure according to one embodiment. The connection structure 100 shown in FIG. 2 consists of a first circuit component 20 having a first substrate 21 and first connection terminals 23 formed on its main surface, a second substrate 31 and a first connecting terminal 23 formed on its main surface. The second circuit component 30 and the adhesive layer 1a consist of two connection terminals 32 . The first circuit component 20 and the second circuit component 30 sandwich the adhesive layer 1 a so that the first connection terminal 23 and the second connection terminal 32 face each other. The first circuit member 20 and the second circuit member 30 are adhered by the adhesive layer 1 a containing the conductive particles 5 . The opposite first connection terminal 23 and the second connection terminal 32 are electrically connected through the conductive particles 5 . On the other hand, the first connection terminals 23 adjacent to each other on the first substrate 21 and the second connection terminals 33 adjacent to each other on the second substrate 31 are substantially insulated from each other.

The adhesive film 1 for circuit connection is an anisotropic conductive adhesive film (ACF) used for manufacturing the bonded structure 100. As shown in FIG. The adhesive layer 1 a of the bonded structure 100 is a layer formed of the adhesive film 1 for circuit connection.

The peeling strength (hereinafter referred to as " The peeling strength B") is greater than the peeling strength (hereinafter referred to as "peeling strength A") when the adhesive layer A11 is attached to the surface of the first connection terminal 23 side of the first circuit member 20 . The peeling strength B should just be larger than the peeling strength A measured under the same conditions when it sticks to a circuit member under the same conditions. It is preferable to stick the adhesive film for circuit connection or the adhesive layer A to a circuit member while heating and pressurizing. Heating and pressurization are preferably performed under conditions that do not substantially cure the thermosetting resin constituting each adhesive layer. For example, the adhesive film for circuit connection or the adhesive layer A is pasted by heating and pressurizing for 5 seconds at 70 degreeC and 0.5 MPa. The peel strength after sticking can be measured, for example, under the conditions of peeling the adhesive film for circuit connection or the adhesive layer A in the direction of 90° C. with respect to the main surface of the circuit component at a peeling speed of 50 mm/min.

When the adhesion to a circuit member and the peel strength are measured under the above conditions, the peel strength B is preferably 200 N/cm or more. If the peel strength B is less than 200 N/cm, the effect of improving transferability tends to be reduced. From the same viewpoint, the peel strength B is more preferably less than 150 N/cm. In addition, the peel strength B is preferably 2000 N/cm or less. When sticking the adhesive film for circuit connection to the circuit part, if the sticking position is deviated, the adhesive film for circuit connection can be peeled off and the adhesive film for circuit connection can be pasted again, but if the peel strength B exceeds 2000N/cm, Then, the adhesive film for circuit connection is firmly attached to the circuit component and tends to be difficult to peel off. Since the present invention finds the effect that the peel strength A is smaller than the peel strength B, as long as the peel strength A is smaller than the peel strength B, the absolute values of these strengths are not particularly limited.

The thickness of the adhesive bond layer B12 is 0.1-5.0 micrometers. If the thickness of the adhesive layer B12 is less than 0.1 μm, the effect of improving the transferability tends to be reduced, and if it exceeds 5.0 μm, the influence of the adhesive layer B12 on the connection characteristics after circuit connection becomes large, and it is easy to reduce the adhesion. The tendency of any one of the characteristics of relay, connection resistance and insulation resistance. From the same viewpoint, the thickness of the adhesive layer B12 is more preferably 1.0 to 3.0 μm.

The thickness of the adhesive layer A11 is appropriately selected according to the height of the first connection terminal 23 and the second connection terminal 33 . Preferably, the adhesive layer A11 has a thickness of 1/3 to 2 times the sum of the heights of the opposing first connection terminal 23 and second connection terminal 33 . If the thickness of the adhesive layer A11 is less than 1/3, the adhesive cannot be sufficiently filled between the circuit components, and the insulation between the circuits tends to be reduced. If it exceeds 2 times, it may be difficult to secure a sufficient circuit. conduction tendency. Considering the height of a general connection terminal, the thickness of the adhesive layer A is preferably 5 to 45 μm.

The adhesive layer A11 and the adhesive layer B12 contain, for example, a thermosetting resin and its curing agent, and a polymer compound.

As the thermosetting resin, for example, the thermosetting resin described in Adhesives Section II. of "Adhesive Handbook" (2nd edition, Nikkan Kogyo Shimbun, Japan Adhesive Association edited) can be suitably used. Especially from the viewpoint of reliability, epoxy resins and radically polymerizable compounds are preferable.

Various epoxy compounds having two or more glycidyl groups are suitably used as the epoxy resin. Examples of epoxy compounds are bisphenol-type epoxy resins derived from epichlorohydrin and bisphenol A or F, AD, etc., novolac epoxy resins derived from epichlorohydrin and phenol novolac or cresol novolac Resin, naphthalene-based epoxy resin, glycidyl amine, glycidyl ether, biphenyl and alicyclic type with naphthalene ring structure. The epoxy resin preferably contains an epoxy compound having a fluorine atom. These epoxy compounds can be used individually or in combination of 2 or more types. In addition, since electron migration can be prevented, the epoxy resin is preferably a high-purity product that reduces the concentration of impurity ions (Na ⁺ , Cl ^-, etc.) or hydrolyzable chlorine to 300 ppm or less.

Examples of curing agents for epoxy resins include imidazole-based, hydrazide-based, boron trifluoride-amine complexes, sulfonium salts, aminoimides, polyamine salts, and dicyandiamide. In order to extend the usable time, it is preferable to coat these curing agents with polyurethane-based or polyester-based polymers and microencapsulate them. These curing agents can be used alone or in combination. Along with the curing agent, decomposition accelerators, inhibitors, and the like can also be used in combination.

The radically polymerizable compound is a compound having a functional group (acryloyl group, methacryloyl group) polymerized by living radicals. As the radically polymerizable compound, monomers and oligomers may be used in any form, and monomers and oligomers may be used in combination. Examples of the radically polymerizable compound include acrylate compounds, methacrylate compounds, and maleimide compounds. The radically polymerizable compound preferably contains a fluorine atom. A radically polymerizable compound containing a fluorine atom and a radically polymerizable compound not containing a fluorine atom may be used in combination.

Examples of acrylate compounds or methacrylate compounds include free radicals such as epoxy acrylate oligomers, urethane acrylate oligomers, polyether acrylate oligomers, and polyester acrylate oligomers. Polymeric oligomers, such as trimethylolpropane triacrylate, polyethylene glycol diacrylate, polyalkylene glycol diacrylate, pentaerythritol acrylate, 2-cyanoethyl acrylate, cyclohexyl acrylate, Dicyclopentenyl acrylate, dicyclopentenyloxyethyl acrylate, 2-(2-ethoxyethoxy)ethyl acrylate, 2-ethoxyethyl acrylate, 2- Ethylhexyl, n-hexyl acrylate, 2-hydroxyethyl acrylate, hydroxypropyl acrylate, isobornyl acrylate, isodecyl acrylate, isooctyl acrylate, n-lauryl acrylate, 2-methoxyethyl acrylate radically polymerizable monofunctional or polyfunctional acrylate monomers such as ester, 2-phenoxyethyl acrylate, tetrahydrofuran acrylate, neopentyl glycol diacrylate and dipentaerythritol hexaacrylate, and tert-butyl Aminoethyl methacrylate, cyclohexyl methacrylate, dicyclopentenyloxyethyl methacrylate, 2-hydroxyethyl methacrylate, isobornyl methacrylate, iso Radical polymerizable monofunctional or polyfunctional methacrylate monomers such as decyl ester, n-lauryl methacrylate, stearyl methacrylate, tridecyl methacrylate, and glycidyl methacrylate. These can be used individually or in combination of 2 or more types. Among them, urethane acrylate oligomers are preferable in order to suppress cure shrinkage and impart flexibility after curing. In addition, since the radically polymerizable oligomer has a high viscosity, it is preferable to use together with the radically polymerizable oligomer one or two or more kinds of radically polymerizable polyfunctional acrylate monomers at a low concentration in order to adjust the viscosity. of monomers.

As the maleimide compound, those having two or more maleimide groups are suitably used. Specific examples of maleimide compounds include 1-methyl-2,4-bismaleimidebenzene, N,N'-m-phenylene bismaleimide, N,N '-P-phenylene bismaleimide, N,N'-m-methylphenylene bismaleimide, N,N'-4,4-bis-phenylene bismaleimide , N, N'-4,4-(3,3'-dimethyl-bisphenylene)bismaleimide, N,N'-4,4-(3,3'-dimethyl Diphenylmethane) bismaleimide, N,N'-4,4-(3,3'-diethyldiphenylmethane) bismaleimide, N,N'-4,4 -Diphenylmethane bismaleimide, N,N'-4,4-diphenylpropane bismaleimide, N,N'-4,4-diphenylether bismaleimide Amine, N,N'-3,3'-diphenylsulfone bismaleimide, 2,2-bis(4-(4-maleimidephenoxy)phenyl)propane, 2, 2-bis(3-sec-butyl-4-(4-maleimidephenoxy)phenyl)propane, 1,1-bis(4-(4-maleimidephenoxy)benzene base) decane, 4,4'-cyclohexylene-bis(1-(4-maleimidephenoxy)-2-cyclohexyl)benzene, and 2,2-bis(4-(4- Maleimide (phenoxy)phenyl)hexafluoropropane. These can be used individually or in combination of 2 or more types.

It is preferable that a radically polymerizable compound contains the phosphate-type methacrylate represented by following formula (1). Thereby, the adhesive strength with respect to the surface of an inorganic substance, such as a metal, can be further improved. The compounding amount of the phosphate ester type methacrylate is preferably 0.001 to 50 parts by weight, more preferably 0.5 to 10 parts by weight, based on 100 parts by weight of the components other than the charged particles in the components constituting the adhesive film for circuit connection.

Chemical 1

n=1, 2, 3

The above-mentioned phosphate-type methacrylate is obtained as a reaction product of anhydrous phosphoric acid and 2-hydroxyethyl (meth)acrylate. Specifically, there are mono(2-methacryloyloxyethyl)acid phosphate and di(2-methacryloyloxyethyl)acid phosphate. These can be used individually or in combination of 2 or more types.

As the curing agent for the radically polymerizable compound, a radical polymerization initiator that generates active radicals by light irradiation and/or heating is used. Examples of radical polymerization initiators include benzoin ethers such as benzoin diethyl ether and isopropyl benzoin ether, benzil ketals such as benzil and hydroxycyclohexyl phenyl ketone, benzil Ketones such as ketones and acetophenone and their derivatives, thioxanthones, and photopolymerization initiators containing bisimidazoles. In these polymerization initiators, sensitizers such as amines, sulfur compounds, and phosphorus compounds may be combined in an arbitrary ratio as needed. When curing each adhesive layer by light irradiation, it is necessary to select an optimum photopolymerization initiator according to the wavelength of the light source to be used, desired curing characteristics, and the like.

As a sensitizer, there are aliphatic amines, aromatic group-containing amines, compounds such as piperidine whose nitrogen forms a part of the ring system, o-tolylthiourea, sodium diethyldithiophosphate, and soluble salts of aromatic sulfinic acids , N,N'-dimethyl-p-aminobenzonitrile, N,N'-diethyl-p-aminobenzonitrile, N,N'-bis(β-cyanoethyl)-p-aminobenzonitrile, N , N'-bis(β-chloroethyl)-p-aminobenzonitrile, tri-n-butylphosphine, etc.

Propiophenone, acetophenone, xanthone, 4-methylacetophenone, benzophenone, fluorene, triphenylene, biphenyl, thioxanthone, anthraquinone, 4,4'-bis( Dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, phenanthrene, naphthalene, 4-phenylacetophenone, 4-phenylbenzophenone, 1- Iodonaphthalene, 2-iodonaphthalene, acenaphthene, 2-naphthalenecarbonitrile, 1-naphthalenecarbonitrile, 1,2-triphenylene, benzil, fluoranthene, pyrene, 1,2-benzanthracene, acridine Non-pigment sensitizers such as pyridine, anthracene, perylene, tetracene, 2-methoxynaphthalene, thionine, methylene blue, flavin, riboflavin, chromium pigment, coumarin, psoralen, 8 -Methoxypsoralen, 6-methylcoumarin, 5-methoxypsoralen, 5-hydroxypsoralen, coumarylpyrone, acridine orange, acriflavine , proflavin, fluorescent yellow, eosin Y, eosin B, erythrosine, rose bengal and other pigment sensitizers.

An organic peroxide and/or an azo compound can be used as a radical polymerization initiator. As organic peroxides there may be used, for example, diacyl peroxides, dialkyl peroxides, peroxydicarbonates, peroxyesters, peroxyketals, hydroperoxides and silyl peroxides. The azo compound and/or organic peroxide can be appropriately selected from the target connection temperature, connection time, pot life, and the like. From the viewpoint of high reactivity and pot life, an organic peroxide having a half-life of 10 hours at a temperature of 40° C. or higher and a half-life of 1 minute at a temperature of 180° C. or lower is preferable, and a half-life of 10 hours at a temperature of 60° C. or higher is preferred. Organic peroxides with a half-life of 1 minute at temperatures below 170°C.

In order to suppress corrosion of connection terminals of circuit components, it is preferable to contain 5000 ppm or less of chlorine ions or organic acids in the organic peroxide, and it is more preferable to contain less organic acids after thermal decomposition.

Diacyl peroxides include isobutyl peroxide, 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, lauryl Acyl Peroxide, Stearyl Peroxide, Succinic Peroxide, Benzoyl Toluene Peroxide, and Benzoyl Peroxide. Examples of dialkyl peroxides include α, α'bis-(tert-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-bis(tert-butyl butyl peroxide) hexane, and tert-butyl cumene peroxide.

As peroxydicarbonate, there are di-n-propyl peroxydicarbonate, diisopropyl peroxydicarbonate, bis(4-tert-butylcyclohexyl)peroxydicarbonate, di-2-ethoxymethyl Oxyperoxydicarbonate, bis(2-ethylhexylperoxy)dicarbonate, dimethoxybutyl peroxydicarbonate, and bis(3-methyl-3-methoxybutyl peroxy)dicarbonate.

Peroxyesters include cumyl peroxyneodecanoate, 1,1,3,3-tetramethylbutylperoxyneodecanoate, 1-cyclohexyl-1-methylethylperoxyneodecanoate Ester, tert-hexyl peroxyneodecanoate, tert-butyl peroxy-tert-valerate, 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate, 2,5-di Methyl-2,5-di(2-ethylhexanoylperoxy)hexane, 1-cyclohexyl-1-methylethylperoxy-2-ethylhexanoate, tert-hexylperoxy-2- Ethylhexanoate, tert-butylperoxy-2-ethylhexanoate, tert-butylperoxyisobutyrate, 1,1-bis(tert-butylperoxy)cyclohexane, isopropyl peroxide tert-hexyl monocarbonate, tert-butyl peroxy-3,5,5-trimethylhexanoate, tert-butyl peroxylaurate, 2,5-dimethyl-2,5-di(m-toluene Acylperoxy)hexane, tert-butyl peroxyisopropyl monocarbonate, tert-butyl peroxy-2-ethylhexyl monocarbonate, tert-hexyl peroxybenzoate, tert-butyl peroxyacetate, and di (tert-butylperoxy)hexahydroterephthalate.

As peroxyketals, there are 1,1-bis(tert-hexylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis(tert-hexylperoxy)cyclohexane, 1,1- Bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis(tert-butylperoxy)cyclododecane, and 2,2-bis(tert-butylperoxy Oxygenated) decane.

Examples of the hydroperoxide include dicumyl hydroperoxide and cumene hydroperoxide. Examples of silyl peroxides include tert-butyltrimethylsilyl peroxide, bis(tert-butyl)dimethylsilyl peroxide, tert-butyltrivinylsilyl peroxide, Bis(tert-butyl)divinylsilyl peroxide, tri(tert-butyl)vinylsilyl peroxide, tert-butyl triallyl silyl peroxide, bis(tert-butyl) ) diallylsilyl peroxide, and tri(tert-butyl)allylsilyl peroxide.

These organic peroxides can be used individually or in combination of 2 or more types. It is also possible to use decomposition accelerators, inhibitors, etc. together with organic peroxides. In addition, in order to prolong the usable time, it is preferable to coat these organic peroxides with polyurethane-based or polyester-based polymers and microencapsulated organic peroxides.

The aforementioned photopolymerization initiator may be used together with the organic peroxide. Further, according to need, sensitizers such as amines, sulfur compounds, and phosphorus compounds can be added in arbitrary proportions.

The polymer compound contained in the adhesive layer A and the adhesive layer B is preferably made of polyvinyl butyral, polyvinyl formal, polyamide, polyimide, polyamideimide, polyvinyl Ester, phenolic resin, epoxy resin, phenoxy resin, polyurethane, polyester urethane, polyarylate, styrene resin, polydimethylsiloxane or acrylic rubber, nitrile rubber, NBR and SBS At least one polymer selected from the group consisting of. These preferably contain fluorine atoms. By using these, the stress relaxation property at the time of hardening is excellent, and adhesiveness can be improved further. Polymers obtained by modifying these polymers with radically polymerizable functional groups are more preferable because of improved heat resistance. In this case, the polymer compound may be a radically polymerizable compound.

The weight-average molecular weight of the polymer compound is preferably 5,000 to 1,000,000. When the weight average molecular weight exceeds 1,000,000, the miscibility with other components tends to decrease.

Adhesive layer A11 and adhesive layer B12 contain conductive particles 5 . Stable circuit connection is realized by electrically connecting opposing connection terminals to each other via conductive particles 5 . However, even when there is no conductive particle 5, connection can be obtained by direct contact between opposing connection terminals. Both of the adhesive layer A11 and the adhesive layer B12 need not necessarily contain the conductive particles 5 as in the present embodiment, and only one of them may contain the conductive particles 5 .

The conductive particles 5 include metal particles such as Au, Ag, Ni, Cu, and solder, and carbon particles. In order to obtain a sufficient pot life, the surface layer of the conductive particle 5 is preferably composed of noble metals such as Au, Ag, and platinum-group elements instead of transition metals such as Ni and Cu. Au is particularly preferred among them. As the conductive particles 5 , coated particles containing a core made of a transition metal such as Ni and a noble metal layer such as Au covering the surface can be used. In addition, as the conductive particles 5 , composite particles including a core body of nonconductive glass, ceramics, plastic, etc., a metal layer covering the surface, and a noble metal layer as the outermost layer of the metal layer can also be used. Such composite particles are preferred because they deform when the adhesive film for circuit connection is heated and pressurized, thereby increasing the contact area with the connection terminal and improving reliability. For good resistance, the thickness of the noble metal is preferably above. In order to more reliably prevent the generation of free radicals under the oxidation-reduction action caused by the defect of the noble metal layer and cause a decrease in storage stability, the thickness of the noble metal layer is preferably above.

Usually, the compounding quantity of the electroconductive particle 5 is adjusted to 0.1-30 volume parts with respect to 100 volume parts of components other than the electroconductive particle 5 in each adhesive bond layer according to a use. In order to prevent the short circuit of an adjacent circuit etc. by excess electroconductive particle 5, it is more preferable that the compounding quantity of the electroconductive particle 5 is 0.1-10 volume parts.

Adhesive layer A11 and adhesive layer B12 can also contain fillers, softeners, accelerators, anti-aging agents, colorants, flame retardants, thixotropic agents, coupling agents and Phenolic resin or melamine resin, isocyanate, etc. When the adhesive layer contains a filler, connection reliability is improved. The maximum particle diameter of the filler is preferably less than the particle diameter of the conductive particles 5 . It is preferable that the compounding quantity of a filler is 5-60 volume parts with respect to 100 volume parts of components other than the conductive particle 5 in each adhesive bond layer. If it exceeds 60 parts by volume, the effect of improving reliability is saturated, and if it is less than 5 parts by volume, the effect of addition is small. As the coupling agent, a compound having a vinyl group, an acryl group, an amino group, an epoxy group, or an isocyanate group is preferable from the viewpoint of improving adhesiveness.

The compositions of the adhesive layer A11 and the adhesive layer B12 are adjusted so that the above-mentioned peel strength B is greater than the peel strength A using the components described above. As a specific method for improving the peel strength B, for example, the compounding amount of the polymer compound in the adhesive layer B12 is smaller than that of the adhesive layer A11, and the molecular weight of the compound in the adhesive layer B12 is smaller than that of the adhesive layer A11. method.

The adhesive film 1 for circuit connection is a film that melts and flows at the time of connection, and after realizing the electrical connection between the opposing connection terminals, it cures and maintains the connection. Therefore, the fluidity of the adhesive film 1 for circuit connection is an important factor. . Fluidity For example, sandwich an adhesive film for circuit connection with a thickness of 35 μm and 5 mm × 5 mm between two sheets of glass with a thickness of 0.7 mm and 15 mm × 15 mm, heat and press for 10 seconds, heat and apply The value of the ratio ((B)/(A)) of the area (B) after pressing to the initial area (A) was evaluated as an index. The value of the ratio involved is preferably 1.3 to 3.0, more preferably 1.5 to 2.5. When it is less than 1.3, good connection may not be obtained due to insufficient fluidity, and when it exceeds 3.0, air bubbles are likely to be generated and the effect of improving reliability may be reduced.

The elastic modulus at 40° C. after curing of the adhesive film 1 for circuit connection is preferably 100 to 3000 MPa, more preferably 500 to 2000 MPa.

In the bonded structure 100 of FIG. 2 , the first substrate 21 is a glass substrate, and the first connection terminals 23 are chrome circuits made of chromium. In addition, the second substrate 31 is a polyimide film, and the second connection terminal 32 is a copper circuit made of Cu. That is, the second circuit component 30 is a flexible circuit board having a polyimide film and a copper circuit formed on its main surface. The adhesive layer 1 a has a layer 11 a derived from the adhesive layer A11 and a layer 12 a derived from the adhesive layer B. However, the boundaries of these layers do not have to be clear, and it may also be the case that the two layers are actually completely mixed.

The bonded structure 100 can be produced by the following manufacturing method, for example. This manufacturing method includes: a sticking process of sticking the adhesive film 1 for circuit connection to the surface of the first connection terminal 23 side of the first circuit component 20 in the direction where the adhesive layer B12 is in contact with the first circuit component 20; In the second circuit component 30, the first connection terminal 23 and the second connection terminal 33 face each other with the adhesive film 1 for circuit connection sandwiched between them; in order to electrically connect the opposing first connection terminal 23 and the second connection terminal 33, A process of bonding the first circuit member 20 and the second circuit member 30 with the adhesive layer 1 a formed of the adhesive film 1 for circuit connection by heating and pressing.

The step of attaching the adhesive film 1 for circuit connection to the first circuit member 20 is, for example, performed in more detail by peeling off the base film 42 on the side of the adhesive layer B12 from the adhesive film 1 for circuit connection. The adhesive layer B12 side faces the first circuit member 20 side, and the adhesive film 1 for circuit connection is placed on the surface of the first connection terminal 23 side of the first circuit member 10 and heated and pressed in this state. Thus, the adhesive film 1 for circuit connection is transferred from the base film 41 to the first circuit member 20 . The heating and pressurization at this time are performed on conditions of, for example, 50 to 110° C., 0.1 to 2 MPa, and 0.5 to 5 seconds. Since the adhesive film 1 for circuit connection has excellent transferability, even in such a short period of time, the adhesive film 1 for circuit connection can be reliably pasted on the first circuit member 20 .

The present invention is not limited to the embodiments described above, and can be appropriately changed unless departing from the gist of the present invention. For example, the first circuit component may be a circuit substrate such as a chip mounting substrate, and the second circuit component may be a chip component selected from IC chips, resistor chips, and capacitor chips. In addition, the surface of at least one of the first connection terminal and the second connection terminal may be composed of at least one selected from gold, silver, tin, and platinum group metals. Alternatively, the surface of at least one of the first connection terminal and the second connection terminal may be composed of a transparent electrode containing indium-tin oxide. Further, at least one surface of the first substrate and the second substrate may be composed of at least one selected from PET, polyethersulfone, epoxy resin, acrylic resin, polyimide resin, and glass. In addition, at least one of the first substrate and the second substrate may have at least one selected from organosilicon compound, polyimide resin, and acrylic resin attached on its surface.

Example

Hereinafter, based on an Example and a comparative example, this invention is demonstrated more concretely. However, the present invention is not limited to the following examples.

Example 1

Dissolve 55 parts by mass of phenol resin (manufactured by Union Carbide Corporation, trade name PKHC), 5 parts by mass of bisphenol A epoxy resin (manufactured by Yuhua Shell Epoxy Co., Ltd., trade name YL980), 40 parts by mass in toluene Imidazole-based curing agent (manufactured by Asahi Kasei Industries, trade name NOVACURE HX-3941) and 3 parts by mass of silane coupling agent (manufactured by Unica, A187) to obtain a coating with a solid content of 50% by mass. cloth liquid A.

Then, the coating solution A was coated with a coating device on a PET film with a thickness of 50 μm that had been subjected to mold release treatment on one side (the surface on which the coating solution was applied), and dried with hot air at 70° C. for 10 minutes. An adhesive layer (a) having a thickness of 15 μm was formed on the PET film.

Dissolve 30 parts by mass of phenol resin (manufactured by Union Carbide Corporation, trade name PKHC), 10 parts by mass of bisphenol A epoxy resin (manufactured by Yuhua Shell Epoxy Co., Ltd., trade name YL980), 60 parts by mass in toluene Imidazole-based curing agent (manufactured by Asahi Kasei Industries, trade name NOVACURE HX-3941) and 3 parts by mass of silane coupling agent (manufactured by Unica, A187) to obtain a coating with a solid content of 50% by mass. cloth liquid B.

Then, the coating solution B was coated with a coating device on a PET film with a thickness of 25 μm that had been subjected to mold release treatment on one side (the surface on which the coating solution was applied), and dried with hot air at 70° C. for 10 minutes. An adhesive layer (b) having a thickness of 0.1 μm was formed on the PET film. The above-obtained adhesive layer (a) and adhesive layer (b) were laminated with a roll laminator while heating at 40°C to obtain an adhesive layer (a) as "Adhesive layer A". ", the adhesive layer (b) is an adhesive film for circuit connection as "adhesive layer B".

Example 2

With respect to 100 parts by mass of the coating solution A, 5 parts by mass of conductive particles (average Particle diameter: 3.2 μm) to obtain a coating solution C. Next, the coating solution C was coated with a coating device on a PET film with a thickness of 50 μm that had been subjected to mold release treatment on one side (the surface on which the coating solution was applied), and dried with hot air at 70° C. for 10 minutes. An adhesive layer (c) having a thickness of 15 μm was formed on the PET film. In the same manner as in Example 1, the adhesive layer (c) and the adhesive layer (b) were laminated to obtain the adhesive layer (c) as "adhesive layer A" and the adhesive layer (b) as " Adhesive film for circuit connection of adhesive layer B".

Example 3

With respect to 100 parts by mass of the coating liquid B, 5 parts by mass of the same conductive particles as those used in the above coating liquid C were dispersed to obtain a coating liquid D. Then, the coating liquid D was applied on a PET film with a thickness of 25 μm and subjected to a release treatment on one side (the surface on which the coating liquid was applied) using a coating device, and dried with hot air at 70° C. for 10 minutes. An adhesive layer (d) having a thickness of 0.1 μm was formed on the PET film. In the same manner as in Example 1, the adhesive layer (a) and the adhesive layer (d) were laminated to obtain the adhesive layer (a) as "adhesive layer A" and the adhesive layer (d) as " Adhesive film for circuit connection of adhesive layer B".

Example 4

In the same manner as in Example 1, the adhesive layer (c) and the adhesive layer (d) were laminated to obtain the adhesive layer (c) as "adhesive layer A" and the adhesive layer (d) as " Adhesive film for circuit connection of adhesive layer B".

Example 5

Except having changed the thickness of the adhesive bond layer (d) of Example 4 into 5 micrometers, it carried out similarly to Example 4, and obtained the adhesive film for circuit connection.

Example 6

Synthesis of Polyimide Resin Containing Fluorine Atoms

In a 1000 mL separable flask with a Dean-Stark reflux cooler, thermometer and stirrer were added 15.0 mmol of polyoxypropylenediamine as a diamine compound and 105.0 mmol of 2,2-bis[(4-( 4-aminophenoxy)phenyl)]hexafluoropropane and 287g of N-methyl-2-pyrrolidone were stirred at room temperature for 30 minutes.

After stirring, add 180g of aromatic hydrocarbon toluene and 114.0mmol of 4,4'-hexafluoropropylene diphthalic dianhydride as tetracarboxylic dianhydride, and the temperature rises to 50 ℃, after stirring for one hour, the temperature was raised to 160 ℃, and reflux was carried out for 3 hours. Then, store a theoretical amount of water in the moisture quantitative receiver (moisture content measuring device), and after confirming that the outflow of water cannot be seen, remove the water and toluene in the moisture quantitative receiver, and remove the toluene in the reaction solution after the temperature rises to 180°C. toluene to obtain an NMP solution of polyimide resin. The NMP solution of the polyimide resin was reprecipitated in methanol, pulverized and dried to obtain a polyimide resin containing no silicon atoms but containing fluorine atoms. The obtained polyimide resin was dissolved in methyl ethyl ketone at a concentration of 40% by mass.

Synthesis of Polyester Polyurethane Resin

Terephthalic acid/propylene glycol/4,4'-diphenylmethane is obtained using terephthalic acid as dicarboxylic acid, propylene glycol as diol, and 4,4'-diphenylmethane diisocyanate as isocyanate The molar ratio of diisocyanate is polyester polyurethane resin of 1.0/1.3/0.25. The obtained polyester polyurethane resin was dissolved in methyl ethyl ketone at a concentration of 20% by mass.

Synthesis of Urethane Acrylates

While stirring 400 parts by mass of polycaprolactone diol with an average weight average molecular weight of 800, 131 parts by mass of 2-hydroxypropyl acrylate, 0.5 parts by mass of dibutyltin dilaurate as a catalyst, and 1.0 parts by mass of as The hydroquinone monomethyl ether of the polymerization inhibitor was mixed while heating to 50°C. Then, 222 parts by mass of isophorone diisocyanate was dripped, and it heated up to 80 degreeC, stirring further, and performed urethanization reaction. After confirming that the reaction rate of the isocyanate group reached 99% or more, the reaction temperature was lowered to obtain urethane acrylate. A 50% by weight DOP solution of tert-hexylperoxy-2-ethylhexanoate (manufactured by NOF Corporation, trade name Palkyua HO) was used as a free radical generator.

Dissolve 10 parts by mass of polyimide resin, 50 parts by mass of polyester polyurethane resin, 39 parts by mass of urethane acrylate, 1 part by mass of phosphate ester acrylate and 5 parts by mass of tert-hexyl peroxide Oxidized 2-ethylhexanoate, here, 5 parts by mass of the same conductive particles 5 as used in the above-mentioned coating solution C were dispersed to obtain a coating solution E.

Dissolve 10 parts by mass of polyimide resin, 20 parts by mass of polyester polyurethane resin, 69 parts by mass of urethane acrylate, 1 part by mass of phosphate ester acrylate and 5 parts by mass of tert-hexyl peroxide Oxygen-2-ethylhexanoate, here, 5 parts by mass of the same conductive particles 5 as those used in the above-mentioned coating liquid C were dispersed to obtain a coating liquid F.

In the same manner as in Example 1, an adhesive layer (e) with a thickness of 15 μm and an adhesive layer (f) with a thickness of 0.1 μm were respectively formed on the PET film, and they were laminated to obtain an adhesive layer (e). As "adhesive layer A", the adhesive layer (f) is an adhesive film for circuit connection as "adhesive layer B".

Comparative example 1

Except that the thickness of the adhesive layer (d) was changed to 0.08 μm, the adhesive layer (c) was obtained as "adhesive layer A" in the same manner as in Example 4, and the adhesive layer (d) was obtained as " Adhesive film for circuit connection of adhesive layer B".

Comparative example 2

Except that the thickness of the adhesive layer (d) was changed to 6 μm, the adhesive layer (c) was obtained as "adhesive layer A" in the same manner as in Example 4, and the adhesive layer (d) was obtained as "adhesive layer A". Adhesive film for circuit connection of adhesive layer B".

Comparative example 3

The adhesive layer (c) with a thickness of 15 μm was used as the adhesive film for circuit connection of Comparative Example 3.

Comparative example 4

The adhesive layer (d) having a thickness of 15 μm was used as the adhesive film for circuit connection of Comparative Example 4.

Comparative Example 5

The adhesive layer (e) having a thickness of 15 μm was used as the adhesive film for circuit connection of Comparative Example 5.

Comparative Example 6

The adhesive layer (f) having a thickness of 15 μm was used as the adhesive film for circuit connection of Comparative Example 6. Measurement of peel strength (peel strength during transfer) when sticking the adhesive film for circuit connection to the circuit board

By forming 500 chromium circuits with a line width of 50 μm, a pitch of 100 μm, and a thickness of 0.4 μm on glass (manufactured by Corning (コニンゲ) Co., Ltd., trade name: #1737), a glass substrate and a connecting terminal are prepared. Circuit board for chrome circuits. Then, the PET film on the side of the adhesive layer B of the adhesive film for circuit connection of each of the above-mentioned Examples and Comparative Examples 1 and 2 was peeled off, and the surface of the chrome circuit side of the above-mentioned circuit board was coated with the adhesive layer B and The circuit boards were placed in contact with each other, and in this state, heating and pressure were performed at 70° C. and 0.5 MPa for 5 seconds, and the adhesive film for circuit connection was stuck on the circuit board. Then, the PET film on the adhesive layer A side was peeled off. The peeling strength of the adhesive film for circuit connections peeled from the circuit board was measured under conditions of 90 degreeC peeling and a peeling speed of 50 mm/min. About the adhesive film for circuit connections of Comparative Examples 3-6, the measurement of sticking and peeling strength was performed by the same operation.

circuit connection

The surface on the side of the chromium circuit of the above-mentioned circuit board was placed on the surface of the adhesive layer B side of the circuit connection adhesive film of the above-mentioned examples and Comparative Examples 1 and 2, and in this state, at 70 ° C and 0.5 MPa, Heating and pressure were performed for 5 seconds, and the adhesive film for circuit connection was pasted on the circuit board. Then, the PET film on the adhesive layer A side was peeled off. Place a flexible circuit board (FPC) on the adhesive layer A, and heat and press at 180°C and 3MPa for 10 seconds to cure each adhesive layer to obtain a circuit board connected with a width of 2mm. And the connection structure of FPC. The above-mentioned FPC used 500 copper circuits with a line width of 50 μm, a pitch of 100 μm, and a thickness of 8 μm directly formed on a polyimide film (manufactured by Ube Industries, Ltd., trade name: Upilex, thickness: 25 μm). layers of circuit boards. About the adhesive film for circuit connections of Comparative Examples 3-6, the circuit connection was performed by the same operation.

Determination of adhesive strength after circuit connection

After circuit connection, the adhesive strength was measured under the conditions of peeling at 90° C. and a peeling speed of 50 mm/min. The measurement of the adhesive strength after holding|maintaining in the high-temperature high-humidity tank of 85 degreeC and 85%RH for 500 hours at the initial stage was performed.

Measurement of connection resistance after circuit connection

After the circuit connection, the resistance value between the adjacent circuits of the FPC was measured at the initial stage and after being kept in a high-temperature, high-humidity tank at 85° C. and 85% RH for 500 hours using a multimeter. The resistance value is expressed as an average (X+3σ) of resistances at 150 points between adjacent circuits.

Table 1

As shown in Table 1, the peel strength ratios of Examples 1 to 6 at the time of transfer correspond to the peel strengths of Comparative Examples 3 and 5 when the adhesive layer A included in the respective circuit-connecting adhesive films is attached to the circuit board. When the peel strength is high. Examples 1 to 6 showed favorable properties for all the evaluated properties. Since the thickness of the adhesive bond layer (d) of the comparative example 1 was as thin as 0.08 micrometer, peel strength at the time of transfer was low. In Comparative Example 2 in which the thickness of the adhesive layer (d) was 6 μm, the peel strength at the time of transfer was high, but the adhesive force after circuit connection was low and the connection resistance was high. In particular, the rise in electrical resistance after the high-temperature, high-humidity test treatment was remarkable. In Comparative Examples 3 and 5, which did not have a layer corresponding to the "adhesive layer B", the peel strength at the time of transfer was low. Since Comparative Examples 4 and 6 consisted of only the adhesive layer (d) and the adhesive layer (f), respectively, the adhesive force after circuit connection was low and the connection resistance was high.

Claims (22)

1. an application, it is the application of adhering film as adhesive film for circuit connection,

Described adhering film has bond layer A and the bond layer B of lamination on this bond layer A,

Described adhesive film for circuit connection is between the first circuit block and second circuit parts, wherein, the first splicing ear that the first circuit block has first substrate and forms on its first type surface, the second splicing ear that second circuit parts have second substrate and form on its first type surface, this adhesive film for circuit connection is used to so that bonding described the first circuit block of mode and the described second circuit parts of relative described the first splicing ear and described the second splicing ear electrical connection

Join with described bond layer B and described the first circuit block towards, the peel strength when face of described the first splicing ear side to described the first circuit block is pasted this adhering film peel strength when pasting described bond layer A to the face of the described first splicing ear side of described the first circuit block is large, wherein, described peel strength is the value while pasting this adhering film by the heating in 5 seconds under 70 DEG C, 0.5MPa and pressurization

The thickness of described bond layer B is 0.1～3.0 μ m.

2. application according to claim 1, wherein, curing agent and macromolecular compound that described bond layer A and described bond layer B contain thermosetting resin, described thermosetting resin.

3. application according to claim 2, wherein, described thermosetting resin comprises epoxy resin or free-radical polymerised compound.

4. application according to claim 2, wherein, described macromolecular compound comprises at least a kind of polymer selecting in the group who is made up of polyvinyl butyral resin, polyvinyl formal, polyamide, polyimides, polyamidoimide, polyester, phenol resin, epoxy resin, phenoxy resin, polyurethane, PAUR, polyarylate, styrene resin, dimethyl silicone polymer, acrylic rubber, acrylonitrile-butadiene rubber, NBR and SBS.

5. application according to claim 2, wherein, the weight average molecular weight of described macromolecular compound is 5000～1000000.

6. application according to claim 2, wherein, meets following (i) and (ii) this two side,

(i) use level of the described macromolecular compound of described bond layer B is less than the use level of the described macromolecular compound of described bond layer A,

(ii) weight average molecular weight of the described macromolecular compound of described bond layer B is less than the weight average molecular weight of the described macromolecular compound of described bond layer A.

7. according to the application described in any one in claim 1～6, wherein, at least one in described bond layer A and described bond layer B contains conducting particles.

8. application according to claim 7, wherein, with respect to the composition 100 volume % beyond conducting particles described in the described bond layer that contains described conducting particles, the use level of described conducting particles is 0.1～30 volume %.

9. application according to claim 7, wherein, described adhesive film for circuit connection is anisotropic conductive adhesive film.

10. according to the application described in any one in claim 1～6, wherein, the thickness of described bond layer A is 5～45 μ m.

11. according to the application described in any one in claim 1～6, and wherein, the thickness of described bond layer B is 1.0～3.0 μ m.

12. 1 kinds of application, it is for adhering film is for the application of the manufacture of adhesive film for circuit connection,

Described adhering film has bond layer A and the bond layer B of lamination on this bond layer A,

Described adhesive film for circuit connection is between the first circuit block and second circuit parts, wherein, the first splicing ear that the first circuit block has first substrate and forms on its first type surface, the second splicing ear that second circuit parts have second substrate and form on its first type surface, this adhesive film for circuit connection is used to so that bonding described the first circuit block of mode and the described second circuit parts of relative described the first splicing ear and described the second splicing ear electrical connection

Join with described bond layer B and described the first circuit block towards, the peel strength when face of described the first splicing ear side to described the first circuit block is pasted this adhering film peel strength when pasting described bond layer A to the face of the described first splicing ear side of described the first circuit block is large, wherein, described peel strength is the value while pasting this adhering film by the heating in 5 seconds under 70 DEG C, 0.5MPa and pressurization

The thickness of described bond layer B is 0.1～3.0 μ m.

13. application according to claim 12, wherein, curing agent and macromolecular compound that described bond layer A and described bond layer B contain thermosetting resin, described thermosetting resin.

14. application according to claim 13, wherein, described thermosetting resin comprises epoxy resin or free-radical polymerised compound.

15. application according to claim 13, wherein, described macromolecular compound comprises at least a kind of polymer selecting in the group who is made up of polyvinyl butyral resin, polyvinyl formal, polyamide, polyimides, polyamidoimide, polyester, phenol resin, epoxy resin, phenoxy resin, polyurethane, PAUR, polyarylate, styrene resin, dimethyl silicone polymer, acrylic rubber, acrylonitrile-butadiene rubber, NBR and SBS.

16. application according to claim 13, wherein, the weight average molecular weight of described macromolecular compound is 5000～1000000.

17. application according to claim 13, wherein, meet following (i) and (ii) this two side,

(i) use level of the described macromolecular compound of described bond layer B is less than the use level of the described macromolecular compound of described bond layer A,

(ii) weight average molecular weight of the described macromolecular compound of described bond layer B is less than the weight average molecular weight of the described macromolecular compound of described bond layer A.

18. according to the application described in any one in claim 12～17, and wherein, at least one in described bond layer A and described bond layer B contains conducting particles.

19. application according to claim 18, wherein, with respect to the composition 100 volume % beyond conducting particles described in the described bond layer that contains described conducting particles, the use level of described conducting particles is 0.1～30 volume %.

20. application according to claim 18, wherein, described adhesive film for circuit connection is anisotropic conductive adhesive film.

21. according to the application described in any one in claim 12～17, and wherein, the thickness of described bond layer A is 5～45 μ m.

22. according to the application described in any one in claim 12～17, and wherein, the thickness of described bond layer B is 1.0～3.0 μ m.