[go: up one dir, main page]

TW200908258A - Heat dissipation device assembly - Google Patents

Heat dissipation device assembly Download PDF

Info

Publication number
TW200908258A
TW200908258A TW96129551A TW96129551A TW200908258A TW 200908258 A TW200908258 A TW 200908258A TW 96129551 A TW96129551 A TW 96129551A TW 96129551 A TW96129551 A TW 96129551A TW 200908258 A TW200908258 A TW 200908258A
Authority
TW
Taiwan
Prior art keywords
cylinder
heat sink
screw
buckle
circuit board
Prior art date
Application number
TW96129551A
Other languages
Chinese (zh)
Other versions
TWI337772B (en
Inventor
Min Li
Lei Cao
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW96129551A priority Critical patent/TWI337772B/en
Publication of TW200908258A publication Critical patent/TW200908258A/en
Application granted granted Critical
Publication of TWI337772B publication Critical patent/TWI337772B/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation device assembly for dissipating heat from an electronic component mounted on a printed circuit board. The heat dissipation device assembly includes a heat sink and a plurality of fasteners. Each of the fasteners includes a post extending through the heat sink and the printed circuit board, a screw threadedly engaged in the post, a spring sandwiched between the heat sink and the screw, and a latch pivotably attached to the post. The screw presses the latch downwardly for pivoting the latch around the post, whereby the latch abuts against the printed circuit board. The spring sandwiched between the heat sink and the screw can make the heat sink to resiliently contact the electronic component for preventing a bad contact therebetween, and further make the heat sink to resiliently connect the printed circuit board for preventing the printed circuit board from being deformed.

Description

200908258 九、發明說明: 【發明所屬之技術領域】 一本發明涉及一種散熱裝置組合,特別係指一種對電 元器件散熱之散熱裝置組合。 【先前技術】 —諸如電腦中央處理器、北橋晶片、顯卡等高功率 元器件在運行時會產生大量之熱量,該等熱量如果不= 有效地散去,將直接導致溫度急劇上升,而嚴重影響到恭 子兀器件之正常運行。為此,需要散熱裝置來對該等電: ::件進行散熱,傳統之散熱裝置通常包括散熱器以: 政熱器固定到電子元器件上之扣具。 f 傳統之散熱裝置通常包括—散熱器及複數作為扣I而 使用之螺絲。所述電路板中部安裝— 處分別開設有四螺孔。所述散敎哭 其四角 ,Ω ^ 、…σ具有與上述電路板四虫萝 才對應之四通孔。四螺絲穿過散埶 不 ^ ^ „ …、。°之通孔而螺鎖於雷 器固定於電路板上。 。。件貼合’攸而將散熱 元由於螺絲本身為剛性構造,致使散熱器和電子 Β壬剛性接觸。這種剛性接觸宏县道功M Μ 子元器件施力不均,使散熱器與電子熱器對電 進而影響散熱器之散熱效率。且::::觸:良, 使散熱器和電路板之間呈剛性連接,容运會致 路板施力不均,使電路板發生形變。致政熱器對電 7 200908258 【發明内容】 有鑒於此,有必要提供一種與電子元器件彈性接觸之 散熱裝置組合。 一種散熱裝置組合,用於對安裝於電路板上之電子元 器件散熱,其包括一散熱器及複數扣合裝置,每一扣合裝 置包括一穿過散熱器和電路板之柱體、一螺鎖於柱體之螺 桿件、一夾置於螺桿件和散熱器間之彈簀、及一樞接於柱 體之扣具,該螺桿件向下抵壓扣具,使該扣具繞柱體樞轉 而抵壓該電路板。 與習知技術相比,本發明散熱裝置組合之扣合裝置具 有彈簧夹置於散熱器和螺桿件之間,可使散熱器與電子元 器件彈性接觸,從而避免散熱器與電子元器件間接觸不 良;且,散熱器與電路板彈性連接,從而防止電路板發生 形變。 【實施方式】 如圖1和2所示,本發明之散熱裝置組合用於對安裝 於電路板10上之電子元器件12散熱。該散熱裝置組合包 括一與電子元器件12接觸之散熱器20及複數將散熱器20 固定於電路板10上之扣合裝置30。所述電子元器件12安 裝於電路板10中部區域,四通孔14圍繞該電子元器件12 開設於電路板10四角處。 上述散熱器20安裝於電路板10上方,其由熱導性良 好之金屬材料製成。該散熱器20包括一基座(圖未標)及 200908258 伙基座上表面垂直向上延伸出之複㈣片(圖未標)。该 基座底面與電子元器件12接觸,以《其所產生之轨量。 所述基座四角處分別水平向外凸伸出四扣耳u,”、 扣耳22之中部均開設一盥帝攸 …人 板1〇通孔14對應且等大之 牙孔;4’供扣合裝置3Q穿過。每—穿孔Μ之内緣均開設 ^ 口(圖未標),用於與扣合裝置3〇相應結構相 每—扣合裝置如包括—穿過散熱請和電路板1〇之 36 .;" 32 ' ^ 34、及一搞接於柱體%下部之扣具38。請一併 茶閱圖3,所述螺择件3 2白# .« , π —、系才干件32包括-螺帽320、—設置於螺帽 下方之頸部322、-從頸部322向下延伸之螺接部324、 -形成於螺接部324下方之連接部326、及—從連接部似 向下凸伸之抵壓部328,其t所述螺帽320、頸部322、螺 接部324、連接部326、及抵壓们烈之橫截面積依次遞減。 所述螺桿件32頸部322之橫截面積大於散熱器2()穿孔μ 之面積,其螺接部324橫截面積小於散熱器加穿孔Μ之 面積,從而使螺桿件32不致從穿孔24内滑落。螺桿件幻 之螺帽320頂面向下凹陷出一十字螺口 3200,以方便螺絲 刀(圖未示)等工具對螺桿件32進行操作。 再如圖1所示,每一彈簧34由彈性之金屬線一體彎折 而成’其具有—螺旋狀之構造。該彈簧34之内徑大於上述 柱體36之外;^ ’以使彈菁34可圍繞該柱體%設置;又, 該彈簧34之内徑小於螺桿件32螺帽320之外徑而大於散 200908258 熱态20穿孔24之内徑,從而使彈菁%可彈性 件32之螺帽320及散熱器2〇之扣耳22之間。於螺桿 、請—併參閱圖1及圖4,每-柱體36自上而下… ^路板1G之通孔14及散熱器2Q之穿孔24接^ ::下方。所述柱體36包括一圓柱形 圖二螺 =體沿其轴向開設-上下貫通之圓孔,= 體之—内壁(圖未標)。所述内壁之上部區域形成 螺紋(圖未標),其與螺桿件32之螺接部 螺桿件錄體⑽。料筒體之外壁(圖:= 之中部區域水平向外凸伸出—半環形之擋止部362,該撞止 部362環繞所述筒體之外壁,以抵壓於散熱器2〇之: ^從而防止柱體36從電路板1〇之通孔14及散熱器2〇 :牙孔24.内滑落。.該擋止部如之兩端垂直向上形成二相 封设置之肩部364,該二肩部364沿筒體之軸向延伸,且苴 頂部與筒體頂面齊平。每-肩部364之橫截面積略小於散 Ή〇扣耳22缺口之橫截面積,使該等肩部364穿過散 ”,、扣20扣耳22之相應之缺口從而防止柱體%相對於電路 板1〇發生旋轉。所述筒體之下部區域開設—與筒體圓孔 360相通之收容槽366’其具有一第—通槽366〇、從第—通 槽3660兩側向下延伸之二第二通槽3662、及從第一通槽 3660中#向下延伸之一第三通槽3664。所述第一通槽%6〇 呈半環形,其位於筒體擋止部362相對一側之上方,其兩 端分別延伸至筒體之二肩部364位置處。每一第二通槽 3662包括一自第一通槽366〇 一端垂直向下延伸之平直段 10 200908258 (圖未標)及一斜向連接至該平直段下部之弧形段(圖未 -標)。所述第三通槽3664位於二第二通槽3662之間,且 貫穿筒體之底面,以收容扣具38。 « 每一扣具38由一十字形片體一體彎折而成,其包括一 抵壓部384、從該抵壓部384上部彎折而出之一受壓部 380、及從該受壓部38〇兩側向外延伸之二臂部382。所述 抵壓部384呈矩形,其外側面積小於柱體36第三通槽允料 之面積,從而使該抵壓部384可穿過該第三通槽3664而收 谷於柱體36之圓孔360内。所述受壓部38〇垂直於抵壓部 384,其橫截面積與抵壓部3δ4之橫截面積相等,該受壓部 380用於和螺桿件32之抵壓部328相配合而使螺桿件% 作用於扣具38(如圖6)。所述臂部382垂直於受壓部38〇, 其中每一臂部382之橫截面積小於抵壓部384之橫截面 積,該二臂部382收容於柱體36之第二通槽3662内而使 扣具38極接於柱體36。 如圖4和5所示,預裝扣具38和柱體36時,首先將 扣具38對準柱體36之收容槽366,將扣具38相對於柱體 36向内移動’使扣具38之受壓部38〇和臂部382水平穿過 柱體36之第一通槽366〇 ,其抵壓部384穿過柱體%之第 三通槽3664,直至扣具38收容於柱體%之圓孔36〇内; 然後使扣具38沿柱體36第二通槽3662之平直段向下移 動,直至扣具38之二臂部382容置於柱體36第二通槽3662 之弧形段内;此時扣具38之受壓部38〇完全收容於柱體% 之圓孔360内,其抵壓部384下部凸伸於柱體允之底面, 11 200908258 攸而7^成了扣具38和柱體36之預裝。 請參閱圖1、圖4、圖 人時,首# 、及圖7,組裝該散熱裝置組 口日才τ先將散熱器20貼置於+工_ 口上 5置於電子兀器件12上,使其四 扣斗22之穿孔24對準雷 預f好之i目π 路板10上之四通孔14。然後將已 卞貝表好之扣具38和柱體36你带枚a ij- ^ 電路板1〇下方向上穿過電路 板10之通孔14和散埶哭2〇夕咖 364 ^ ^ 、、、之牙孔24,使柱體36之肩部 364牙過散熱器2〇扣耳22 巧 4r, ^ _ 之缺 且柱體36之擋止部362200908258 IX. Description of the Invention: [Technical Field] The present invention relates to a heat sink assembly, and more particularly to a heat sink assembly for dissipating heat from an electrical component. [Prior Art] - High-power components such as computer central processing units, north bridge chips, graphics cards, etc. generate a large amount of heat during operation. If these heats are not effectively dispersed, they will directly cause a sharp rise in temperature, which will seriously affect Go to Kyoko's normal operation of the device. To this end, a heat sink is required to heat the electricity: The conventional heat sink usually includes a heat sink to: a fastener that is fixed to the electronic component by the heat exchanger. f Conventional heat sinks usually include a heat sink and a plurality of screws used as the buckle I. The central part of the circuit board is mounted with four screw holes. The divergence cries its four corners, and Ω ^ , ... σ has four through holes corresponding to the above-mentioned circuit board four insects. The four screws pass through the hole and do not ^ ^ „ ..., the through hole of the hole and the screw is fixed on the circuit board. The piece fits '攸 and the heat sink element is rigid due to the screw itself, resulting in the heat sink It is in rigid contact with the electronic cymbal. This rigid contact with the Hongxian Daogong M Μ sub-components is unevenly applied, so that the heat sink and the electronic heater are electrically connected to affect the heat dissipation efficiency of the heat sink. And:::: Touch: good , the rigid connection between the heat sink and the circuit board, the load will cause unevenness of the road board, and the circuit board is deformed. The heat exchanger is connected to electricity 7 200908258 [Invention content] In view of this, it is necessary to provide a A heat sink assembly in resilient contact with an electronic component. A heat sink assembly for dissipating heat from an electronic component mounted on a circuit board, comprising a heat sink and a plurality of fastening devices, each of the fastening devices including a through device a cylinder of the heat sink and the circuit board, a screw member screwed to the cylinder body, a magazine sandwiched between the screw member and the heat sink, and a buckle pivoted to the cylinder body, the screw member is pressed downward Pressing the buckle to make the buckle around the cylinder In turn, the fastening device of the heat dissipating device combination has a spring clip interposed between the heat sink and the screw member, so that the heat sink can be elastically contacted with the electronic component, thereby avoiding The contact between the heat sink and the electronic component is poor; and the heat sink is elastically connected to the circuit board to prevent the circuit board from being deformed. [Embodiment] As shown in FIGS. 1 and 2, the heat sink assembly of the present invention is used for mounting on the heat sink. The electronic component 12 on the circuit board 10 dissipates heat. The heat sink assembly includes a heat sink 20 in contact with the electronic component 12 and a plurality of fastening devices 30 for fixing the heat sink 20 to the circuit board 10. The electronic component 12 is mounted on a central portion of the circuit board 10, and four through holes 14 are formed around the electronic component 12 at four corners of the circuit board 10. The heat sink 20 is mounted above the circuit board 10 and is made of a metal material having good thermal conductivity. The heat sink 20 includes a base (not shown) and a plurality of (four) pieces (not shown) extending vertically upward from the upper surface of the base of the base of the base. "The amount of orbits produced by the pedestals. The four corners of the pedestal protrude horizontally outwardly from the four buckle ears u," and the middle part of the shackle 22 is provided with a 盥 盥 攸 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人Large perforation; 4' for the fastening device 3Q to pass through. The inner edge of each perforated crucible is opened (not shown), and is used for the corresponding structure with the fastening device 3〇. The fastening device includes, for example, the heat dissipation and the circuit board 1〇36.;&quot 32 ' ^ 34, and a fastener 38 attached to the lower part of the cylinder. Please refer to FIG. 3 together, the screw selection member 3 2 white # .« , π —, the trunk member 32 includes a nut 320, a neck portion 322 disposed under the nut, and a neck portion 322 a lower extending screw portion 324, a connecting portion 326 formed under the screw portion 324, and a pressing portion 328 protruding downward from the connecting portion, wherein the nut 320, the neck portion 322, and the screw joint The cross-sectional area of the portion 324, the connecting portion 326, and the pressing members are successively decreased. The cross-sectional area of the neck portion 322 of the screw member 32 is larger than the area of the through hole μ of the heat sink 2, and the cross-sectional area of the screw portion 324 is smaller than the area of the heat sink plus the perforation, so that the screw member 32 does not protrude from the through hole 24. Sliding down. A cross screw 3200 is recessed downwardly from the top of the screw member phantom screw 320 to facilitate the operation of the screw member 32 by a tool such as a screw cutter (not shown). Further, as shown in Fig. 1, each of the springs 34 is integrally bent by an elastic metal wire, which has a spiral structure. The inner diameter of the spring 34 is larger than the outer diameter of the cylinder 36; so that the elastic cyanine 34 can be disposed around the cylinder; and the inner diameter of the spring 34 is smaller than the outer diameter of the nut 320 of the screw member 32. 200908258 The hot state 20 has an inner diameter of 24, so that the nut 320 is between the nut 320 of the elastic member 32 and the lug 22 of the heat sink 2 . In the screw, please - and refer to Figure 1 and Figure 4, each column 36 from top to bottom ... ^ through-hole 14 of the plate 1G and the perforation 24 of the radiator 2Q are connected below. The cylinder 36 includes a cylindrical shape, a screw body, and a circular hole extending in the axial direction thereof, and the inner wall (not shown). The upper portion of the inner wall is formed with a thread (not shown) which is screwed to the screw member 32 to the screw member (10). The outer wall of the cylinder body (Fig. = = the middle portion protrudes horizontally outwardly - a semi-annular stop portion 362 that surrounds the outer wall of the cylinder to resist the heat sink 2: Therefore, the column 36 is prevented from sliding from the through hole 14 of the circuit board 1 and the heat sink 2: the tooth hole 24. The two ends of the blocking portion are vertically formed upward to form a two-phase sealing shoulder 364. The shoulders 364 extend in the axial direction of the cylinder, and the top of the crucible is flush with the top surface of the cylinder. The cross-sectional area of each shoulder 364 is slightly smaller than the cross-sectional area of the notch of the loose lug 22, so that the shoulders The portion 364 passes through the corresponding gap of the buckle 20 to prevent the cylinder body from rotating relative to the circuit board 1 . The lower portion of the cylinder body defines a receiving slot that communicates with the cylindrical hole 360. The 366' has a first through slot 366 〇, two second through slots 3662 extending downward from both sides of the first through slot 3660, and a third through slot 3664 extending downward from the first through slot 3660. The first through groove %6〇 is semi-annular, and is located above the opposite side of the barrel stopping portion 362, and its two ends respectively extend to the positions of the shoulder portions 364 of the cylindrical body. A second through slot 3662 includes a straight section 10 200908258 (not shown) extending perpendicularly from one end of the first through slot 366 及 and an arcuate section obliquely connected to the lower portion of the straight section (not shown) The third through groove 3664 is located between the two second through grooves 3662 and penetrates the bottom surface of the cylindrical body to receive the buckle 38. « Each of the fasteners 38 is integrally bent by a cross-shaped piece The method includes a pressing portion 384, a pressure receiving portion 380 bent from an upper portion of the pressing portion 384, and two arm portions 382 extending outward from both sides of the pressure receiving portion 38. The pressing portion 384 has a rectangular shape, and the outer side area thereof is smaller than the area of the third through groove of the column 36, so that the pressing portion 384 can pass through the third through groove 3664 to be received in the circular hole 360 of the column 36. The pressure receiving portion 38 is perpendicular to the pressing portion 384, and the cross-sectional area thereof is equal to the cross-sectional area of the pressing portion 3δ4, and the pressure receiving portion 380 is used to cooperate with the pressing portion 328 of the screw member 32. The screw member % acts on the clip 38 (Fig. 6). The arm portion 382 is perpendicular to the pressure receiving portion 38, wherein the cross sectional area of each arm portion 382 is smaller than the cross sectional area of the pressing portion 384. The two arm portions 382 are received in the second through slots 3662 of the cylinder 36 to fasten the clips 38 to the posts 36. As shown in Figures 4 and 5, when the clips 38 and the posts 36 are preloaded, the buckles are first buckled. The sleeve 38 is aligned with the receiving groove 366 of the cylinder 36 to move the buckle 38 inwardly relative to the cylinder 36. The pressure receiving portion 38 of the buckle 38 and the arm portion 382 are horizontally passed through the first through slot of the cylinder 36. 366〇, the pressing portion 384 passes through the third through groove 3664 of the cylinder body until the buckle 38 is received in the circular hole 36〇 of the cylinder body; then the buckle 38 is along the second through groove 3662 of the cylinder 36 The straight section of the clip 38 is moved downward until the two arm portions 382 of the clip 38 are received in the arcuate section of the second through groove 3662 of the cylinder 36; at this time, the pressed portion 38 of the clip 38 is completely received in the cylinder. In the round hole 360 of the lower portion, the lower portion of the pressing portion 384 protrudes from the bottom surface of the column body, and 11 200908258 is formed into a preloading of the buckle 38 and the column 36. Referring to FIG. 1 , FIG. 4 , FIG. 3 , and FIG. 7 , assembling the heat dissipating device group τ firstly places the heat sink 20 on the + working port 5 and places it on the electronic cymbal device 12 so that The through hole 24 of the four buckles 22 is aligned with the four through holes 14 on the ray board 10 of the reticle. Then, the buckles 38 and the cylinders 36 that have been shown in the mussels are brought a piece of a ij- ^ circuit board 1 〇 downwards through the through hole 14 of the circuit board 10 and the smashing cry 2 〇 咖 364 ^ ^,, The tooth hole 24 causes the shoulder 364 of the cylinder 36 to pass over the heat sink 2, the buckle ear 22, 4 _ 4, the missing portion of the cylinder 36 and the stop portion 362 of the cylinder 36

抵靠於電路板1〇之下# $ ^ 田正口丨JbZ 之扣耳2? 、。再將彈簧34放置於散熱器20 上,使其圍繞柱體36 $ μ 32之下邱咖λ I _ 6之上部。之後,將螺桿件 下4牙入柱體36之圓子[ ^ L ^360内,使其螺接部324與柱 肢%之螺紋相螺合,此 、狂 螺知32〇抵壓於彈簧34而將 具夹置於散熱器2〇之扣耳22Resist on the circuit board 1〇 # $ ^ 田正口丨 JbZ buckle ear 2?,. The spring 34 is then placed over the heat sink 20 so that it surrounds the upper portion of the cylinder 36 $ μ 32 below the Qiu λ I _ 6 . After that, the lower teeth of the screw member are placed into the circle of the cylinder 36 [^ L ^ 360, so that the screwing portion 324 is screwed with the thread of the column limb, and the snail is 32 〇 pressed against the spring 34. Attach the clip to the heatsink 2

Pa # 2和螺杯件32之螺帽32〇之 間,其抵壓部328懸置於扣呈3 〜 之 入庐浐杜π +撕 ,、川上方。取後,將螺絲刀插 入%才于件32之螺口 3200內,内丁护技 俨杜m — 向下处轉該螺桿件32,使螺 杯件32之抵壓部328抿靠扣且π ^ 件32之移動,强竺, 之受壓部38〇。隨著螺桿 移動?34受到壓縮而發 壓於散熱器20,使豆朝向中牧, 攸而向下抵 α π 朝向電路板10移動;此時螺桿件32 之抵壓部328向下推動^目Q ^ 、 38之-臂邻跑 受壓部,使其繞扣具 之—U 382向下旋轉;與此 384隨著抵壓部38〇之 #8之抵壓部 得動门上拓轉,從而抵壓雷改: 使其朝向散熱器2Θ移動;|^且 :, , 直至扣具38之受壓部qQn4_ 置於螺桿件32之抵麼 380被夹 低度4 328和柱體36之内壁 具38之抵壓部384與電 日’,使扣 时# 电路扳10之下表面緊密貼人,您而 將散熱器20固定於電路板1〇上。 。仗而 12 200908258 本《月放熱裝置組合之扣合裝置3〇具有彈簣34夾置於 ㈣器2G和螺桿件32之間,可使散熱器2q與電子元器和 舞性接觸,從而避免散熱㈣與電子元器件训接觸不 良,且政熱态與電路板1〇彈性連接 γ 10 發生形變。 据屮:Si,本發明確已符合發明專利之要件,遂依法 自| %。惟,以上所述者僅為本發明之較佳實施例, 之此限制本案之巾請專利_。舉凡熟悉本案技藝 ¥以=本發明之精神所作之等效修飾或變化,皆應涵 I於以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明實施例之部分立體分解圖。 圖2係圖1中散熱器之立體組裴圖。 圖3係圖1中螺桿件之放大分解圖。 圖4係圖1之螺桿件與扣具之放大分解圖 圖5係圖4之立體組裝圖。 圖6係圖2之縱向剖面圖 圖7係圖2之縱向剖面圖 【主要元件符號說明】 此時扣具處於未扣合狀態。 此時扣具處於扣合狀態。 電路板 1〇 通孔 14 才σ耳 扣合裝置 22 30 電子元器件 散熱器 穿孔 螺桿件 12 20 24 32 13 200908258 螺帽 320 螺口 3200 頸部 322 螺接部 324 連接部 326 抵壓部 328 、 384 彈簧 34 柱體 36 圓孔 360 擋止部 362 肩部 364 收容槽 366 第一通槽 3660 第二通槽 3662 第三通槽 3664 扣具 38 受壓部 380 臂部 382 14Between Pa # 2 and the nut 32 of the screw cup member 32, the pressing portion 328 is suspended from the buckle 3 to 庐浐 π + tear, above the river. After taking it, the screwdriver is inserted into the screw 3200 of the member 32, and the inner sleeve is turned into the screw member 32, so that the pressing portion 328 of the screw cup member 32 is buckled and π ^ The movement of the piece 32 is strong, and the pressure receiving portion 38 is closed. With the screw moving? 34 is compressed and pressed against the heat sink 20, so that the beans are oriented toward the middle, and then moved downward toward α π toward the circuit board 10; at this time, the pressing portion 328 of the screw member 32 pushes down the eyes Q ^ , 38 - The arm is adjacent to the pressure receiving portion, so that the U 382 is rotated downwards; and the 384 is pressed against the pressing portion of the pressing portion 38 of the pressing portion 38 to pressurize the door. It is moved toward the heat sink 2Θ; |^ and:, until the pressed portion qQn4_ of the buckle 38 is placed at the screw member 32, the clamp 380 is clamped to the lower portion 4 328 and the inner wall member 38 of the cylinder 36 is pressed. 384 and electric day', so that the bottom surface of the circuit board 10 is close to the person, you can fix the heat sink 20 on the circuit board 1 。. .仗而12 200908258 The "release device of the monthly heat release device combination 3" has a magazine 34 interposed between the (4) device 2G and the screw member 32, so that the heat sink 2q can be in contact with the electronic device and dance to avoid heat dissipation. (4) Poor contact with the electronic component training, and the political hot state and the circuit board 1〇 elastic connection γ 10 deformation. According to 屮: Si, the invention has indeed met the requirements of the invention patent, 遂 legally | However, the above description is only a preferred embodiment of the present invention, which limits the patent application of the present invention. Equivalent to the skill of the present invention. The equivalent modifications or variations made by the spirit of the present invention are within the scope of the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partially exploded perspective view of an embodiment of the present invention. 2 is a perspective view of a heat sink of the heat sink of FIG. 1. Figure 3 is an enlarged exploded view of the screw member of Figure 1. 4 is an enlarged exploded view of the screw member and the buckle of FIG. 1. FIG. 5 is an assembled perspective view of FIG. Fig. 6 is a longitudinal sectional view of Fig. 2. Fig. 7 is a longitudinal sectional view of Fig. 2 [Explanation of main component symbols] At this time, the buckle is in an unfastened state. At this time, the buckle is in the buckled state. Circuit board 1 through hole 14 σ ear fastening device 22 30 electronic component heat sink perforated screw member 12 20 24 32 13 200908258 nut 320 screw 3200 neck 322 screwing portion 324 connecting portion 326 pressing portion 328 384 spring 34 cylinder 36 circular hole 360 stop 362 shoulder 364 receiving groove 366 first through groove 3660 second through groove 3662 third through groove 3664 buckle 38 pressure portion 380 arm portion 382 14

Claims (1)

200908258 十、申請專利範圍: -種散熱裝置組合’用於對安裝於電路板上之電子元器件 散熱’其包括—散熱器及複數扣合I置,其改良在ς: 每-扣合裝置包括一穿過散熱器和電路板之柱體、二 鎖於柱體之螺桿件、—杰^ '、 干仟 又置於螺捍件和散熱器間之彈 黃、及-樞接於柱體之扣具,該螺捍件向下抵璧扣具, 使該扣具繞柱體樞轉而抵壓該電路板。 2·如申請專利範圍第i項所述之散熱裝置組合,其中該螺桿 件包括橫截面積依次遞減之一螺帽、位於螺帽下方之: 螺接部、及設置於螺接部下方之一抵壓部。 3. 如申請專利範圍第2項所述之散熱裝置組合,其中該柱體 包括—筒體,該筒體開設一上下貫穿之圓孔。 ^ 4. 如申請專利範圍帛3項所述之散熱裝f組合,其中該螺桿 2之螺接部螺鎖於上述筒體之圓孔内,其抵壓部容置於 筒體之圓孔内,其螺帽位於筒體外側。200908258 X. Patent application scope: - A combination of heat sinks 'is used to dissipate heat from electronic components mounted on a circuit board'. It includes a heat sink and a plurality of snap-on I. The improvement is in: Each-fastening device includes a cylinder passing through the radiator and the circuit board, two screw members locked to the cylinder, - Jie, 'dry, placed between the screw and the radiator, and - pivoted to the cylinder The buckle, the threaded member abuts the buckle downwardly, causing the buckle to pivot about the cylinder to press against the circuit board. 2. The heat sink assembly of claim i, wherein the screw member comprises a nut having a decreasing cross-sectional area, which is located below the nut: a screw portion, and one of the lower portions of the screw portion The pressure department. 3. The heat sink assembly of claim 2, wherein the cylinder comprises a cylinder, the cylinder opening a circular hole penetrating vertically. ^ 4. The combination of the heat dissipating assembly f described in claim 3, wherein the screw portion of the screw 2 is screwed into the circular hole of the cylinder, and the pressing portion is received in the circular hole of the cylinder The nut is located outside the cylinder. 5. 如申請專利範圍第4項所述之散熱裝置組合,其中該彈簧 夾置於螺桿件螺帽和散熱器之間且環繞上述柱體。 6. 如申請專利範圍第3項所述之散熱裝置組合,其中該柱體 還包括一自筒體外壁中部區域向外凸出之一擋止部,所 述擋止部環繞該筒體且抵壓上述散熱器。 7.如申請專利範圍第6項所述之散熱裝置組合,其中該柱體 還包括自筒體外壁上部區域向外延伸之二肩部,該二肩 部沿筒體軸向相對設置且與上述擋止部之兩端相互連 15 200908258 接。 8·如申請專利範圍第6項所述之散熱裝置組合,其中該柱體 之笱體下部區域開設一收容槽,該收容槽與上述擋止部 相對設置且與上述筒體之圓孔相連通。 9. 如申請專利範圍第8項所述之散熱裝置組合,其中該筒體 之收容槽具有—第一通槽、自第一通槽兩端向下延伸之 弟一通槽、及自弟一通槽中部向下延伸之一第三通槽。 10. 如申請專利範圍第9項所述之散熱裝置組合,其中該扣 具包括一另—抵壓部、由另一抵壓部一端彎折而出之一 冗壓部、及自受壓部兩側向外延伸之二臂部。 11. 如申請專利範圍第10項所述之散熱裝置組合,其中扣具 之二臂部分別收容於筒體收容槽之二第二通槽内,該二 :、之又壓邛位於筒體之圓孔内且抵靠於螺稈件之抵壓 邛,該扣具之另一抵壓部穿過筒體之圓孔且抿壓於上述 電路板。 - 、、 12= 重扣,裝置’用於將散熱器固定於安裝於電路板上之 ^*兀裔件上,其改良在於:其包括-柱體、-螺鎖於 芬-上方之螺桿件、—環繞柱體且抵壓螺桿件之彈菩、 及^區,於柱體下方之扣具,該螺桿件沿柱體向下㈣ 扣/、,使該扣具繞柱體向上樞轉。 12項所述之扣合裝置,其中該柱體開 之收;::穿之圓孔’且該柱體下方開設-與圓孔連通 16 200908258 14.如申請專利範圍第13項所述之扣八 括一抵虔部、由該抵麼部末端彎折^置,其中該扣具包 從該受壓部兩側分別向外延伸之二臂^之二受壓部、及 繼之圓孔内,該臂部收容於柱體:收^部 塵部部分向下凸出於柱體。 一 15.如申明專利範圍第14項所述之扣合裝置,其中該螺桿件 下部牙入柱體之圓孔内且抵壓扣具之受壓部。 f 16·如申請專利範圍第15項所述之扣合裝置,其中該彈簧抵 壓螺桿件之上部且環繞柱體之上部區域。 i. 175. The heat sink assembly of claim 4, wherein the spring clip is interposed between the screw nut and the heat sink and surrounds the cylinder. 6. The heat sink assembly of claim 3, wherein the cylinder further comprises a stop protruding outwardly from a central portion of the outer wall of the outer cylinder, the stop surrounding the cylinder and abutting Press the above radiator. 7. The heat sink assembly of claim 6, wherein the cylinder further comprises two shoulder portions extending outward from an upper portion of the outer wall of the cylinder, the shoulder portions being oppositely disposed along the axial direction of the cylinder body and the above The two ends of the stop are connected to each other 15 200908258. 8. The heat sink assembly of claim 6, wherein the lower portion of the body of the cylinder defines a receiving slot, the receiving slot is disposed opposite the blocking portion and is in communication with the circular hole of the cylinder. . 9. The heat sink assembly according to claim 8, wherein the receiving groove of the cylinder has a first through slot, a first slot extending downward from both ends of the first through slot, and a slot from the younger one. One of the third through grooves extends downward in the middle. 10. The heat sink assembly of claim 9, wherein the buckle comprises a further pressing portion, a crimping portion bent from one end of the other pressing portion, and a self-pressing portion Two arms extending outward on both sides. 11. The combination of the heat dissipating device of claim 10, wherein the two arm portions of the buckle are respectively received in the second through grooves of the cylindrical housing receiving groove, and the two ends are pressed in the cylindrical body. In the circular hole and against the pressing force of the screw member, the other pressing portion of the buckle passes through the circular hole of the cylindrical body and is pressed against the circuit board. - , , 12 = refasten, the device 'is used to fix the heat sink to the ^* 兀 安装 mounted on the circuit board, the improvement is that it includes - the cylinder, the screw part screwed to the fen - above - a buckle that surrounds the cylinder and presses against the screw member and the ^ region, under the cylinder, the screw member is buckled down (4) along the cylinder, so that the buckle pivots upward about the cylinder. The fastening device according to item 12, wherein the cylinder is opened; the: the hole is pierced and the lower portion of the cylinder is opened-connected with the hole 16 200908258 14. The buckle according to claim 13 An eight-in-one abutting portion is bent from the end of the abutting portion, wherein the buckle bag extends from the two sides of the pressure-receiving portion to the two-armed portion, and the subsequent round hole The arm portion is received in the column body: the dust portion of the receiving portion protrudes downward from the column body. A fastening device according to claim 14, wherein the lower portion of the screw member is inserted into the circular hole of the cylinder and presses against the pressed portion of the buckle. The fastening device of claim 15, wherein the spring abuts the upper portion of the screw member and surrounds the upper portion of the cylinder. i. 17
TW96129551A 2007-08-10 2007-08-10 Heat dissipation device assembly TWI337772B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96129551A TWI337772B (en) 2007-08-10 2007-08-10 Heat dissipation device assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96129551A TWI337772B (en) 2007-08-10 2007-08-10 Heat dissipation device assembly

Publications (2)

Publication Number Publication Date
TW200908258A true TW200908258A (en) 2009-02-16
TWI337772B TWI337772B (en) 2011-02-21

Family

ID=44723623

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96129551A TWI337772B (en) 2007-08-10 2007-08-10 Heat dissipation device assembly

Country Status (1)

Country Link
TW (1) TWI337772B (en)

Also Published As

Publication number Publication date
TWI337772B (en) 2011-02-21

Similar Documents

Publication Publication Date Title
US7652886B2 (en) Heat sink assembly having a fastener assembly for fastening the heat sink to an electronic component
US6611431B1 (en) Heat dissipation assembly
US11133238B2 (en) Heat sink fastening seat and securing device with gasket for use with electrical connector
US20120244742A1 (en) Low profile heat dissipating system with freely-oriented heat pipe
US7796390B1 (en) Fastener and heat sink assembly having the same
US6472742B1 (en) Thermal gap control
US6112378A (en) Fastening device for a heat sink
US7817427B2 (en) Fastener and heat sink assembly having the same
US20040052054A1 (en) Heat dissipating assembly
US7215550B1 (en) Heat sink fastener
US8437138B2 (en) Lower profile heat dissipating system embedded with springs
US7167370B2 (en) Fastener for mounting heat-radiator to electronic device
TWM349081U (en) Electrical connector assembly
US20090110511A1 (en) Elastic fastener
TW200908258A (en) Heat dissipation device assembly
US20140060895A1 (en) Clip assembly and heat dissipation device incorporating the same
US20140060894A1 (en) Clip assembly and heat dissipation device incorporating the same
US20090040728A1 (en) Fixing Structure and Heat Dissipation Device
CN101730442B (en) Heat radiation assembly fastener and heat radiation device
TWM526097U (en) Microprocessor spring lamination buckle device
TW201004550A (en) Heat dissipating device assembly and clip thereof
TWM424526U (en) Electrical connector assembly and heat dissipating system for the same
CN2377593Y (en) CPU carrier
TWI293859B (en) Heat sink retaining device
CN2519324Y (en) Computer radiator fixing device assembly

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees