CN2377593Y

CN2377593Y - CPU carrier

Info

Publication number: CN2377593Y
Application number: CN 99211258
Authority: CN
Inventors: 叶志强
Original assignee: Dazhong Computer Co ltd
Current assignee: Dazhong Computer Co ltd
Priority date: 1999-05-26
Filing date: 1999-05-26
Publication date: 2000-05-10
Anticipated expiration: 2009-05-26

Abstract

The utility model relates to a CPU connecting device, which is convenient and reliable to assemble. The CPU carrying device comprises a heat radiating plate, a back plate, a combination screw, an elastic element and a mainboard, and is characterized in that the heat radiating plate is provided with a heat conducting part, the back plate is arranged below the heat radiating plate and is connected with the heat radiating plate through the combination screw and the elastic element, the mainboard is arranged between the heat radiating plate and the back plate, and the CPU is connected with the heat conducting part of the heat radiating plate. It is used for computers.

Description

CPU carrier

本实用新型涉及电脑中央处理器，尤其是指其连结装置。The utility model relates to a computer central processing unit, in particular to a connecting device thereof.

现有笔记本电脑中央处理器承载装置，其为中央处理器以螺丝锁固于散热板上，藉散热板协助散热，这种锁固方式，以螺丝压紧，若力量过大，会使中央处理器受损，过小又恐怕锁固不牢，调整锁紧力以及组装都很麻烦。The existing notebook computer central processing unit carrying device is that the central processing unit is locked on the cooling plate by screws, and the heat dissipation is assisted by the cooling plate. This locking method is compressed by screws. If the force is too large, the central processing unit will be damaged. If the device is damaged, it is too small and may not be locked firmly. It is very troublesome to adjust the locking force and assemble.

本实用新型的目的是提供一种组装比较方便可靠的中央处理器承载装置。The purpose of the utility model is to provide a central processing unit carrying device which is relatively convenient and reliable to assemble.

本实用新型的目的是这样实现的：中央处理器承载装置，其包括：散热板、背板、结合螺丝、弹性元件以及主机板，其特征是：该散热板上具有导热部，背板设于散热板下方并以结合螺丝及弹性元件将其连结；而主机板设于散热板与背板之间，中央处理器与散热板的导热部相连结。The purpose of this utility model is achieved like this: a central processing unit carrying device, which includes: a heat dissipation plate, a back plate, a combination screw, an elastic element and a main board, and is characterized in that: the heat dissipation plate has a heat conduction portion, and the back plate is located on The bottom of the cooling plate is connected with combining screws and elastic components; the main board is arranged between the cooling plate and the back plate, and the central processing unit is connected with the heat conducting part of the cooling plate.

上述设计，由于弹性元件及导热部的设置，避免了中央处理器受锁压力过大过小的问题，并且组装时不需要费时地对其进行调整，从而达到了组装比较方便可靠的效果。The above design, due to the arrangement of the elastic element and the heat conduction part, avoids the problem of too much or too little locking pressure of the central processing unit, and does not require time-consuming adjustment during assembly, thereby achieving the effect of relatively convenient and reliable assembly.

下面通过附图和实施例对本实用新型再作进一步说明：The utility model is described further below by accompanying drawing and embodiment:

图1为本实用新型立体图；Fig. 1 is a perspective view of the utility model;

图2为本实用新型立体分解图；Fig. 2 is a three-dimensional exploded view of the utility model;

图3为本实用新型从另一角度观视的立体图；Fig. 3 is a stereogram viewed from another angle of the utility model;

图4为本实用新型剖视示意图；Fig. 4 is a schematic cross-sectional view of the utility model;

图5为图4的局部放大图；Figure 5 is a partially enlarged view of Figure 4;

图6为本实用新型另一实施例的立体分解图；Fig. 6 is a three-dimensional exploded view of another embodiment of the utility model;

图7为本实用新型另一实施例的剖视示意图；Fig. 7 is a schematic cross-sectional view of another embodiment of the utility model;

图8为图7的局部放大图；Figure 8 is a partially enlarged view of Figure 7;

如图1-5所示，本实用新型包括：散热板10、背板11、结合螺丝12、弹性元件13以及主机板20，其特征是：该散热板10上具有导热部16，背板11设于散热板10下方并以结合螺丝12及弹性元件13将其连结；而主机板20设于散热板10与背板11之间，中央处理器23与散热板10的导热部16相连结。其中，于散热板10上设套筒17，背板11上设有螺接柱19，结合螺丝12配合于该散热板10的套筒17，结合螺丝12穿出套筒17底部并螺接结合于该背板11的螺接柱19上；主机板20上设置中央处理器23，中央处理器23以导热胶25与该散热板10的导热部16连接。其中，散热板10上设有一散热器14。其中，散热板10上设有一风扇15。其中，弹性元件13为一种压缩弹簧。其中，弹性元件13与结合螺丝12之间各设有一垫圈26。其中，套筒17底部各设有一穿孔18，结合螺丝12由穿孔18穿出套筒17底。其中，主机板20有穿孔21并供螺接柱19贯穿，主机板20及背板11藉螺丝22锁附结合一体，使背板11固定于主机内部，主机板20插有一基座24，中央处理器23插于基座24上。散热板10呈一方形板体，以金属等良导热材料制成。设于电脑内部。产生的热量能导出并降温。As shown in Figures 1-5, the utility model includes: a heat dissipation plate 10, a back plate 11, a combination screw 12, an elastic element 13 and a main board 20, and is characterized in that: the heat dissipation plate 10 has a heat conduction portion 16, and the back plate 11 The main board 20 is located between the heat sink 10 and the back plate 11 , and the central processing unit 23 is connected to the heat conduction portion 16 of the heat sink 10 . Wherein, a sleeve 17 is provided on the cooling plate 10, and a threaded post 19 is provided on the back plate 11, and the coupling screw 12 is matched with the sleeve 17 of the cooling plate 10, and the coupling screw 12 passes through the bottom of the sleeve 17 and is screwed together. On the screwed posts 19 of the back plate 11 ; on the motherboard 20 is provided a CPU 23 , and the CPU 23 is connected to the heat conduction portion 16 of the heat sink 10 with a heat conduction glue 25 . Wherein, a heat sink 14 is disposed on the heat dissipation plate 10 . Wherein, a fan 15 is disposed on the cooling plate 10 . Wherein, the elastic element 13 is a compression spring. Wherein, a washer 26 is respectively provided between the elastic element 13 and the coupling screw 12 . Wherein, the bottom of the sleeve 17 is respectively provided with a perforation 18 , and the screw 12 passes through the bottom of the sleeve 17 through the perforation 18 . Wherein, the main board 20 has a perforation 21 for the threaded post 19 to pass through. The main board 20 and the back board 11 are locked and combined by screws 22, so that the back board 11 is fixed inside the main board. The main board 20 is inserted with a base 24, and the center The processor 23 is plugged into the base 24 . The heat dissipation plate 10 is a square plate made of good heat conducting materials such as metal. located inside the computer. The heat generated can be dissipated and cooled.

如图5～8所示，其中，弹性元件27设于散热板10及背板11之间，结合螺丝12穿过弹性元件27两端。其中，弹性元件27为一种弹片。其中，结合螺丝12穿出散热板10底部螺接于该背板11，弹性元件13设于结合螺丝12及散热板10之间。可藉该等弹性元件13推动散热板10位移，使散热板的导热部16弹性压置于中央处理器23上。由此可见，本实用新型组装的方便性，可靠性。As shown in FIGS. 5-8 , the elastic element 27 is disposed between the heat dissipation plate 10 and the back plate 11 , and the coupling screw 12 passes through both ends of the elastic element 27 . Wherein, the elastic element 27 is a kind of shrapnel. Wherein, the connecting screw 12 passes through the bottom of the cooling plate 10 and is screwed to the back plate 11 , and the elastic element 13 is arranged between the connecting screw 12 and the cooling plate 10 . These elastic elements 13 can be used to push the heat dissipation plate 10 to move, so that the heat conduction portion 16 of the heat dissipation plate is elastically pressed on the central processing unit 23 . This shows that the convenience and reliability of the utility model assembly.

Claims

1, central processing unit bogey, it comprises: heat sink, backboard, in conjunction with screw, flexible member and motherboard is characterized in that: have heat-conducting part on this heat sink, backboard is located at the heat sink below and in conjunction with screw and flexible member it is linked; And motherboard is located between heat sink and the backboard, and the heat-conducting part of central processing unit and heat sink is connected.

2, central processing unit bogey as claimed in claim 1, it is characterized in that: wherein, establish sleeve on heat sink, backboard is provided with the post that is spirally connected, be matched with the sleeve of this heat sink in conjunction with screw, pass the cover tube bottom and be spirally connected in conjunction with screw and be incorporated on the post that is spirally connected of this backboard; Central processing unit is set on the motherboard, and central processing unit is connected with the heat-conducting part of this heat sink with heat-conducting glue.

3, central processing unit bogey as claimed in claim 2 is characterized in that: wherein, heat sink is provided with a heating radiator.

4, central processing unit bogey as claimed in claim 2 is characterized in that: wherein, heat sink is provided with a fan.

5, central processing unit bogey as claimed in claim 2 is characterized in that: wherein, flexible member is a kind of compression spring.

6, central processing unit bogey as claimed in claim 2 is characterized in that: wherein, flexible member respectively is provided with a packing ring with combining between the screw.

7, central processing unit bogey as claimed in claim 2 is characterized in that: wherein, the cover tube bottom respectively is provided with a perforation, pass sleeve in conjunction with screw by perforation at the bottom of.

8, central processing unit bogey as claimed in claim 2 is characterized in that: wherein, motherboard has perforation and runs through for the post that is spirally connected, and motherboard and backboard mat screw lock and integrally combine.

9, central processing unit bogey as claimed in claim 2 is characterized in that: wherein, flexible member is located between heat sink and the backboard, passes the flexible member two ends in conjunction with screw.

10, central processing unit bogey as claimed in claim 9 is characterized in that: wherein, flexible member is a kind of shell fragment.

11, central processing unit bogey as claimed in claim 1 is characterized in that: wherein, pass the heat sink bottom in conjunction with screw and be bolted in this backboard, flexible member is located in conjunction with between screw and the heat sink.