200900334 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種包裝結構，且特別係關於一種 用於液晶面板之包裝結構。 【先前技術】 如圖1所示，習知液晶面板之包裝結構10包括有底座u, 底座11具有承載面12。承載面12係於底座η中形成凹槽， 供承載液晶面板20。液晶面板20包括有基板24以及電路模 組22。例如，電路模組22可為印刷電路板，且電路模組22 與基板24之間均以若干軟性電路板26連接。 將液晶面板20置入包裝結構1〇後，如圖2所示，液晶面 板20相對於包裝結構1〇會形成若干接觸部位，亦即支撐受力 點A(如虛線圈選位置）。當運送並包裝尺寸較大的液晶面板2〇 半成品時，通常液晶面板2〇係以平放的方式裝載於包裝結構 10中，如圖2所示。然而習知的包裝結構1〇與液晶面板2〇 間所產生的支撐受力點A不足，使得支撐液晶面板2〇的力量 無法被有效分散。換言之，上述包裝方式無法有效解決液晶面 板20在運送過程中，遭遇碰撞，甚至破損風險等問題。為了 改善支撐力量過於集中在少數之支撐受力點八上的問題，其它 作法還會增加包裝結構1〇與液晶面板2〇間的缓衝距離，或是 增設緩衝材料’例如：放置紙箱、料或其它緩衝材質於其中。 然而如此的作法亦未能有效解決前述問題。 除此之外，前述包裝結構1〇僅能承载單獨一片液晶面板 5 200900334 20，以避免載重增加時之應力集中狀況；如此一來，對大量製 造生產的面板廠商而言，無疑會大幅增加包裝及運輸成本。x 【發明内容】 本，明之目的在於提供—種包輯構，肋增加承载基 板之數量。 本發明之另一目的在於提供一種包裝結構，用以減 材之體積。 、本U之#目的在於提供—種液晶面板之包裝結構， 用以增加承載基板之數量。 用㈣本另—目的在於提供—種液晶面板之包裝結構， 用以縮小包材之體積。 1/ 本發明之包裝結_縣載至少—顧，此觀裝 上:承恤定位片。承載盤具有上表面及下表面，上表= 個齒定：：卜定位片具有兩相對側邊、複數 幅凹槽係成形於之°跨 合，定位部供齒部定位。兩側板伸’卡槽供定位片嵌 使每中’承載盤之上、下表面輪廓係相互對應， 之上表面Τ增加承载數量並供裝箱。承載盤 承載基板。為了“^且與定位部係彼此相鄰並供 數根定位片 裳，或以多個整合為-之方式使用=兩兩結合方式組 它需求而定。 談用^看所需承叙基板或其 6 200900334 署ΓΓ植片之齒部仙對於槪電路板_間隙所設 ΐ於ΙΓ穿越液“板之_並與承麵之定位部嵌合。相 之另—侧邊帆跨越液晶面板之電路模組之邊緣，而 ^田=則相對容置電路歡。因此每4位細圭係可壓制 點 =覆液純板之電路模組，使本發明之包裝結構支撐受力 數立曰加且不受側向力之影響。 【實施方式】 本發明係提供-種包材減少縣載數量增加之包裝結構 及其使用之液晶面板包裝結構。以較佳實施例而言，基板係指 大尺寸半成品之液晶面板，且以平放的方式運送。此外，本發 明更可承載-片以上之液晶面板。然而在不同實施例中，基板 亦可應用於巾小型尺寸之液晶面板；或具細似結構並應用於 半導體、化工、傳統工業或其它不同領域中之基板。以下即配 合所附贼，it-步酬本發明之各式具體實施麻其步驟。200900334 IX. Description of the Invention: [Technical Field] The present invention relates to a packaging structure, and in particular to a packaging structure for a liquid crystal panel. [Prior Art] As shown in FIG. 1, a conventional packaging structure 10 for a liquid crystal panel includes a base u having a bearing surface 12. The bearing surface 12 is formed in the base η to form a recess for carrying the liquid crystal panel 20. The liquid crystal panel 20 includes a substrate 24 and a circuit module 22. For example, the circuit module 22 can be a printed circuit board, and the circuit module 22 and the substrate 24 are connected by a plurality of flexible circuit boards 26. After the liquid crystal panel 20 is placed in the package structure 1 as shown in Fig. 2, the liquid crystal panel 20 forms a plurality of contact portions with respect to the package structure 1 , i.e., supports the force point A (e.g., the dotted position of the dotted line). When transporting and packaging a relatively large-sized liquid crystal panel 2 〇 semi-finished product, the liquid crystal panel 2 is usually mounted in a flat manner in the package structure 10 as shown in FIG. However, the conventional support structure 1〇 and the support point A of the liquid crystal panel 2 are insufficient, so that the force supporting the liquid crystal panel 2〇 cannot be effectively dispersed. In other words, the above packaging method cannot effectively solve the problem that the liquid crystal panel 20 encounters a collision or even a risk of damage during transportation. In order to improve the support force is too concentrated on a few of the support points of the force point, other methods will increase the buffer structure between the packaging structure 1〇 and the LCD panel 2, or add buffer material 'for example: place the carton, material Or other buffer material in it. However, such an approach has not effectively solved the aforementioned problems. In addition, the foregoing packaging structure 1 can only carry a single liquid crystal panel 5 200900334 20 to avoid stress concentration when the load is increased; thus, for a large number of manufacturing panel manufacturers, the packaging will undoubtedly be greatly increased. And transportation costs. x [Summary of the Invention] The purpose of the present invention is to provide a package structure in which the ribs increase the number of carrier substrates. Another object of the present invention is to provide a packaging structure for reducing the volume of the material. The purpose of this U is to provide a packaging structure of a liquid crystal panel for increasing the number of carrier substrates. (4) The other purpose is to provide a packaging structure for the liquid crystal panel to reduce the volume of the packaging material. 1/ The packaging knot of the invention _ county at least - Gu, this view on: support positioning film. The carrier disk has an upper surface and a lower surface, and the upper surface=the teeth are fixed: the positioning piece has two opposite sides, and the plurality of grooves are formed in the θ span, and the positioning portion is positioned for the tooth portion. The two sides of the plate extend the card slot for the positioning piece to be embedded so that the upper and lower surface contours of each of the middle carrier plates correspond to each other, and the upper surface is increased by the number of carriers and is provided for the box. The carrier tray carries the substrate. In order to "^ and the positioning parts are adjacent to each other and for a number of positioning pieces, or in a plurality of integrations - the use of two-two combination means it depends on the need to use ^ to see the required substrate or Its 6 200900334 ΓΓ ΓΓ ΓΓ 齿 槪 槪 槪 槪 槪 槪 槪 槪 槪 槪 槪 槪 槪 槪 槪 槪 间隙 间隙 间隙 间隙 间隙 间隙 间隙 间隙 间隙 间隙 间隙 间隙 间隙 间隙 间隙 间隙 间隙In contrast, the side sails span the edge of the circuit module of the liquid crystal panel, while the ^ field = is relatively accommodating the circuit. Therefore, every 4 digits can suppress the point = the circuit module of the liquid-coated pure board, so that the support structure of the present invention is subjected to a force and is not affected by the lateral force. [Embodiment] The present invention provides a packaging structure for reducing the number of county loads and a liquid crystal panel packaging structure for use. In the preferred embodiment, the substrate refers to a liquid crystal panel of a large size semi-finished product and is shipped in a flat manner. In addition, the present invention can carry more than one liquid crystal panel. However, in various embodiments, the substrate can also be applied to a small-sized liquid crystal panel of a towel; or a substrate having a fine structure and applied to semiconductors, chemicals, conventional industries, or other fields. The following is the accompanying thief, which is a step-by-step implementation of the various embodiments of the invention.
如圖3及圖4所示’本發明之包裝結構⑽係供承載液晶 面板200。液晶面板200更包含複數個電路模組2〇2及複數片 軟性電路板206。電路模組202係分別藉由軟性電路板2〇6與 液晶面板200連接。本發明包含承載盤12〇及定位片11〇。承 載盤120具有上表面122及下表面124。如圖3之實施例中， 上表面122較佳為承載盤12〇之凹面，下表面124較佳則為結 構性之凹面。因此，此一凹凸結構機制係使每一承載盤12〇之 上表面122得以與相鄰每一承載盤12〇之下表面124疊合。此 外，上表面122具有至少一~f·槽128及至少一定位部13〇。卡 槽128及疋位部130之數量係根據所承載之液晶面板2〇〇之設 7 200900334 計而決定。如圖3所示之實施例中，由於液晶面板200係連接 三個電路模組2〇2，因此承載盤120上至少會分別設置三個卡 槽128及三個定位部130。然而在其它不同的實施例中，液晶 面板200之側邊亦可能連接二個電路模組202，甚至一個或其 它不同側之電路模組202。因此承載盤120之卡槽128及定位 部130之數量則需作相對應之設置。簡言之，不論承載基板或 液晶面板200之電路模組202如何變化，卡槽128及定位部 130之數量較佳係為成對設置。 如圖3所示之實施例，液晶面板2〇〇具有三個電路模組As shown in Figs. 3 and 4, the packaging structure (10) of the present invention is used to carry the liquid crystal panel 200. The liquid crystal panel 200 further includes a plurality of circuit modules 2〇2 and a plurality of flexible circuit boards 206. The circuit module 202 is connected to the liquid crystal panel 200 via a flexible circuit board 2〇6, respectively. The invention comprises a carrier tray 12 and a positioning tab 11〇. The carrier disk 120 has an upper surface 122 and a lower surface 124. In the embodiment of Fig. 3, the upper surface 122 is preferably a concave surface of the carrier disk 12, and the lower surface 124 is preferably a structural concave surface. Therefore, this relief structure mechanism allows the upper surface 122 of each carrier disk 12 to be overlapped with the adjacent lower surface 124 of each carrier disk 12 . Further, the upper surface 122 has at least one ~f·slot 128 and at least one positioning portion 13A. The number of the card slot 128 and the clamping portion 130 is determined according to the setting of the liquid crystal panel 2, 200900334. In the embodiment shown in FIG. 3, since the liquid crystal panel 200 is connected to the three circuit modules 2〇2, at least three card slots 128 and three positioning portions 130 are respectively disposed on the carrier 120. However, in other different embodiments, the side of the liquid crystal panel 200 may also be connected to two circuit modules 202, or even one or more different side circuit modules 202. Therefore, the number of the card slot 128 and the positioning portion 130 of the carrier 120 needs to be set correspondingly. In short, regardless of how the circuit module 202 of the carrier substrate or the liquid crystal panel 200 is changed, the number of the card slot 128 and the positioning portion 130 is preferably set in pairs. As shown in the embodiment of FIG. 3, the liquid crystal panel 2 has three circuit modules.
囚此y刀別提供三個定位片110。每一定位片110具有兩 相對應之側邊112、複數個齒部丨μ及跨幅凹槽Mg。每一齒 部114係設於定位片11〇其中之一侧邊112並從突出定位片 1—1〇之表面方向延伸。相對於齒部114之另一侧邊112，則從 疋位片11〇之表面方向延伸並連接整個側邊112。跨幅凹槽ιΐ6 則成形於兩側邊112之間並沿兩侧邊112延伸。在如圖3之實 施例中’跨幅凹槽116較佳係與電路模組2〇2之寬度相當，而 可將電路模組202包覆其中。此外，每一齒部丨14之寬度設計， 較佳係與概f路板間之_ 大小相#。因此每一歯 部114對液晶面板2〇〇 ,亦具有定位之功效。 當定位片112組裝於承載盤12〇時，每一定位片ιι〇之至 少-躲係與相對應之卡槽128相互嵌合，而齒部ιΐ4則可與 相應之疋位部13G嵌合。進—步而言，每一齒部ιΐ4係可穿越 液晶面板200之間隙204並與承载盤12〇之定位部咖嵌^越 以達定位之功效。相對於齒部114之另一側❹2貝越口 晶面板之電路额202之邊緣，而可與承載盤120之卡样 8 200900334 128嵌合。如圖3所示之實施例中，定位部13〇較佳係 狹長型的槽縫。在此所言之槽縫係可連通上、下表面122’\1條 以形成通槽。然而在其它不_實施财，定位部⑽亦$ 置為複數個單-孔洞，亦即每一孔洞係相對於齒部114而= 置。 °又 請同時參考圖4，當定位片110之每一齒部114穿越液曰 面板200之間隙204並與承載盤12〇之定位部13〇嵌合時，= 一侧邊112則與形狀相符之卡槽128相互嵌合。因此每—定位 片110之兩御J 112係可定位並包覆液晶面板之電路模組 202兩侧。換言之’齒部114與跨幅凹槽116係在不同方向^ 分別產生對液晶面板200及電路模組2〇2之定位效果。在如圖 4之實施例中，液晶面板2〇〇之電路模組2〇2分別受三定位片 no所定位，較佳係可完整地包覆並定位於承載盤12〇上，使 液晶面板202械不易受側向力影響而移動。顯見地，本實施 例之包裝結構100中，以結構簡單且設計精巧之每一定位片 110 ’即可使液晶面板200每邊之支撐受力點延伸成為支稽受 力面B(如虛線圓圈），使承載之基板/液晶面板2〇〇具有較大 之保護及避免損壞之效果。 實際的包裝步驟係將液晶面板2〇〇置放於承載盤上， 亚以不具電賴組202之-側邊132相職靠於不具卡槽！28 之側壁134内。其次’再分別將每一定位片HQ後合於相對應 尺寸之卡槽128上，進-步使齒部114穿過液晶面板之間 隙204’並插入於定位部13〇中。如此即完成每一液晶面板2〇() 之包裝。此外，定位片110或承載盤12〇之材質一般以樹脂、 塑膠、聚合泡棉、聚對苯二甲酸乙二醇酯（p〇丨yethylene 9 200900334 tefephthalate，PET)或其它複合性塑料等製成。 然而在如® 5之實施射，亦可僅以兩相對設置之定位 對液晶面板200進行定位；或是將原本個別獨立之單一定 位^ΠΙΟ整合成-门字形之定位片110，如圖6所示。基此， 不論係以較少的定位片11G或整合定位片m的方式，均可以 得到定位之目的。因此應用定位片11〇於實際地包襄過程中， 可視現場情況、組裝需求或其它狀況，使本發明具有更多便利 性及靈活性。 本發明之承載盤120係可彼此堆疊並相互卡合，因此承載 盤120在相互堆疊的過程中，可增加液晶面板/基板2〇〇於垂 直方向（即正向力）之壓合定位關係。如圖7所示，為本發明包 裝結構實際包裝並將液晶面板裝箱之實施例圖。在此實施例 中’本發明之包裝結構100係可承載複數片液晶面板200及使 用至少一片吸震材料300。其中吸震材料300係置放於每一液 晶面板200之間，主要係供保護液晶面板2〇〇之間避免摩擦， 以及緩和並吸收運送過程中產生之震動力量。吸震材料3〇〇設 有與液晶面板200之間隙204相對應之孔洞302 ’以供定位片 110之齒部114穿過。在此所言之吸震材料300之材質包含泡 棉、紙板或其它吸震材質。在如圖7所示之實施例中，較佳係 包裝2片具有二個電路模組202之液晶面板200，且每一液晶 面板200之間更置放一片吸震材料300。然而在其它不同的實 施例中，亦可包裝2片以上之液晶面板/基板200，並置放一 片以上之吸震材料300。 在如圖7所示之包裝過程中，較佳係分別將液晶面板 200、吸震材料300及液晶面板200置放於承載盤120上，並 10 200900334 以不具電路模組202之二側邊抵靠不具卡槽128及定位部 次:ΓΓ每一定位片110喪合於相對應尺寸 之卡槽128上，亚進一步使齒部114分別穿過液晶面板咖 隙204及吸震材料300之孔洞3〇2，再插入於定位部⑽令。 以如此步驟，再分別逐一完成其它盤之包裝，並堆疊於 包裝之承_ 12〇上。由於上方承麵m之下表面丨 之上表面122端緣，因此可提供足 夠之支撐力’使上方承載盤12〇之下表面124不致壓迫其下方 區、日日面板2〇〇。最後放入紙箱棚、封裝，即可送入待運送 ⑽之^^ 述實施例主要不同在於：承載盤 如圖設計，而卡槽128則為凹槽設計。 槽128之深度係較承載盤120之容置空間126 施〜、疋位片110之表面118相嵌合。在如圖8所示之實 如圖Q祕兩側之卡槽128較佳係不需設置定位部130。然而在 13^及+:之另一側邊’亦可設置與上一實施例所述之定位部 同結構之1 128。換言之，在本實施射，可同雜用兩種不 圖9所7、疋位# 110及承載盤120，以定位液晶面板200。如 之跨幅^面板2GG之電路模組⑽係定位於定位片110 邊，鱼备:内，並分別以齒部114及相對於齒部U4之侧 片m承栽盤120形成支撐受力面B。再加上不同結構之定位 ^以増加液晶面板200之支撐受力面B。 將兩=裝二侧邊具有電路模、組202之液晶面板200時，首先 110之表面118組裝於呈凹槽之卡槽128中。其 11 200900334 次，將液晶面板200之間隙204插設相對於齒部114上。再者， 將另一定位片130相對插入卡槽128及呈孔洞之定位片130 中。如此以完成具有三個電路模組202之液晶面板200之包 裝。因此以上述包裝步驟，完成每一承載盤12〇之堆疊。然而 在不同的實施例中，每一承載盤亦可承載2片以上之液晶面板 /基板’且每一液晶面板/基板之間更置放吸震材料，再放入紙 柏中’以完成包裂程序。 此外’亦可將個別單一之定位片13〇整合為一片定位片 130 ’意即定位片13〇之齒部ι14及與齒部ι14對應設置之側 邊較佳係朝同-方向延伸設置。換言之，此呈―门字形定位片 130之跨幅凹槽ι16係供與液晶面板之電路模組（圖未繪示）放 置’並藉由兩側邊112分別延伸之齒部114及相對齒部114之 侧邊與承麵翻定位之效果。當採如圖1()所示之定位 片110吟，承載盤12〇即可不需設置定位部13〇，亦即設置呈 凹槽之卡槽128即可。細在不_實施 裝之液晶面板/基板之設計而改變。.厅而匕The y knife is provided with three positioning pieces 110. Each of the positioning pieces 110 has two opposite side edges 112, a plurality of teeth 丨μ and a traverse groove Mg. Each of the teeth 114 is disposed on one of the side edges 112 of the positioning piece 11 and extends from the surface of the protruding positioning piece 1-1. With respect to the other side 112 of the tooth portion 114, the entire side edge 112 extends from the surface direction of the clamping piece 11A. The span groove ι 6 is formed between the side edges 112 and extends along the side edges 112. In the embodiment of Fig. 3, the span groove 116 preferably corresponds to the width of the circuit module 2〇2, and the circuit module 202 can be covered therein. In addition, the width of each of the teeth 丨 14 is designed to be _ size # between the slabs. Therefore, each of the fins 114 has a positioning effect on the liquid crystal panel 2 . When the positioning piece 112 is assembled to the carrier tray 12, each of the positioning pieces ιι is at least engaged with the corresponding card slot 128, and the tooth portion 4 is fitted to the corresponding clamping portion 13G. In the case of the step, each of the teeth ι 4 can pass through the gap 204 of the liquid crystal panel 200 and be positioned with the positioning portion of the carrier 12 to achieve the positioning effect. With respect to the other side of the tooth portion 114, the edge of the circuit board 202 of the transsilicon panel can be engaged with the card sample 8 200900334 128 of the carrier disk 120. In the embodiment shown in Fig. 3, the positioning portion 13 is preferably a slit type slit. The slot system as described herein can connect the upper and lower surfaces 122'\1 to form a through groove. However, in other implementations, the positioning portion (10) is also set to a plurality of single-holes, that is, each hole is set relative to the tooth portion 114. Please also refer to FIG. 4, when each tooth portion 114 of the positioning piece 110 passes through the gap 204 of the liquid helium panel 200 and fits into the positioning portion 13 of the carrier disk 12, the side 112 matches the shape. The card slots 128 are fitted to each other. Therefore, each of the two J-series of the positioning sheet 110 can position and cover both sides of the circuit module 202 of the liquid crystal panel. In other words, the tooth portion 114 and the cross recess 116 are in different directions to produce a positioning effect on the liquid crystal panel 200 and the circuit module 2〇2, respectively. In the embodiment of FIG. 4, the circuit modules 2〇2 of the liquid crystal panel 2 are respectively positioned by the three positioning pieces no, and preferably are completely covered and positioned on the carrier tray 12, so that the liquid crystal panel is 202 machinery is not easily affected by lateral forces. Obviously, in the packaging structure 100 of the embodiment, each of the positioning pieces 110 ′ having a simple structure and a delicate design can extend the support point of each side of the liquid crystal panel 200 to become a bearing surface B (such as a dotted circle). The substrate/liquid crystal panel 2 that is carried is provided with greater protection and damage. The actual packaging step is to place the liquid crystal panel 2 on the carrier tray, and the side-side 132 of the non-electrical group 202 does not have a card slot! 28 is in the side wall 134. Next, each of the positioning pieces HQ is further assembled to the corresponding size of the card slot 128, and the tooth portion 114 is advanced through the liquid crystal panel gap 204' and inserted into the positioning portion 13A. This completes the packaging of each liquid crystal panel 2(). In addition, the material of the positioning piece 110 or the carrier 12 is generally made of resin, plastic, polymer foam, polyethylene terephthalate (P〇丨yethylene 9 200900334 tefephthalate, PET) or other composite plastics. . However, in the implementation of the method of 5, the liquid crystal panel 200 may be positioned only by two relative positioning positions; or the original single independent positioning unit may be integrated into a gate-shaped positioning piece 110, as shown in FIG. Show. Therefore, the positioning can be achieved regardless of the manner in which the positioning piece 11G or the positioning piece m is integrated. Therefore, the application of the positioning piece 11 in the actual packaging process, depending on the site situation, assembly requirements or other conditions, makes the invention more convenient and flexible. The carrier trays 120 of the present invention can be stacked on each other and can be engaged with each other. Therefore, during the process of stacking the carriers 120, the liquid crystal panel/substrate 2 can be increased in the vertical direction (ie, the positive force). As shown in Fig. 7, an embodiment of the package of the present invention is actually packaged and the liquid crystal panel is packaged. In this embodiment, the package structure 100 of the present invention can carry a plurality of liquid crystal panels 200 and use at least one sheet of shock absorbing material 300. The shock absorbing material 300 is placed between each liquid crystal panel 200, mainly for protecting the liquid crystal panel from rubbing between the two sides, and mitigating and absorbing the vibration force generated during the transportation. The shock absorbing material 3 is provided with a hole 302' corresponding to the gap 204 of the liquid crystal panel 200 for the tooth portion 114 of the positioning piece 110 to pass therethrough. The material of the shock absorbing material 300 as used herein includes foam, cardboard or other shock absorbing material. In the embodiment shown in FIG. 7, two liquid crystal panels 200 having two circuit modules 202 are preferably packaged, and a shock absorbing material 300 is placed between each liquid crystal panel 200. However, in other different embodiments, more than two liquid crystal panels/substrate 200 may be packaged and one or more shock absorbing materials 300 may be placed. In the packaging process shown in FIG. 7, the liquid crystal panel 200, the shock absorbing material 300, and the liquid crystal panel 200 are preferably placed on the carrier 120, and 10 200900334 is abutted on the side of the circuit module 202. Without the card slot 128 and the positioning portion: ΓΓ each positioning piece 110 is smashed into the corresponding size of the card slot 128, and further the teeth 114 are respectively passed through the liquid crystal panel rib 204 and the hole 3 〇 2 of the shock absorbing material 300 , and then inserted in the positioning section (10) order. In this way, the other trays are individually packaged and stacked on the packaging tray. Due to the surface 丨 upper surface 122 end edge of the upper bearing surface m, sufficient support force can be provided to prevent the lower surface 124 of the upper carrier disk 12 from pressing the lower region and the day panel 2〇〇. Finally, it is put into the carton shed and packaged, and can be sent to be transported. (10) The main difference of the embodiment is that the carrier disk is designed as shown in the figure, and the card slot 128 is designed as a groove. The depth of the groove 128 is matched with the accommodating space 126 of the carrier 120 and the surface 118 of the clamping piece 110. It is preferable that the card slot 128 on both sides of the real image shown in Fig. 8 does not need to be provided with the positioning portion 130. However, the other side of the 13^ and +: may also be provided with the same structure as the positioning portion described in the previous embodiment. In other words, in the present embodiment, the liquid crystal panel 200 can be positioned by misusing the two types of terminals 7, 110 and the carrier 120. For example, the circuit module (10) of the spanning panel 2GG is positioned on the side of the positioning piece 110, and the fish is internally: and the supporting force receiving surface is formed by the tooth portion 114 and the side plate m bearing plate 120 with respect to the tooth portion U4, respectively. B. In addition, the positioning of different structures is added to increase the supporting force surface B of the liquid crystal panel 200. When the two sides are provided with the liquid crystal panel 200 of the circuit module and the group 202, the surface 118 of the first 110 is assembled in the groove 128 of the groove. 11 200900334 times, the gap 204 of the liquid crystal panel 200 is inserted relative to the tooth portion 114. Furthermore, another positioning piece 130 is inserted into the card slot 128 and the positioning piece 130 in the hole. Thus, the packaging of the liquid crystal panel 200 having the three circuit modules 202 is completed. Therefore, in the above packaging step, the stacking of each carrier tray 12 is completed. However, in different embodiments, each carrier can also carry more than two liquid crystal panels/substrates' and a shock absorbing material is placed between each liquid crystal panel/substrate, and then placed in the cypress to complete the cleavage. program. Further, the individual positioning pieces 13A can be integrated into a single positioning piece 130', that is, the tooth portion ι14 of the positioning piece 13〇 and the side portion corresponding to the tooth portion ι14 are preferably extended in the same direction. In other words, the span groove ι16 of the gate-shaped positioning piece 130 is provided for the circuit module (not shown) of the liquid crystal panel, and the tooth portion 114 and the opposite tooth portion respectively extended by the side edges 112 are respectively The effect of the side of the 114 and the bearing surface. When the positioning piece 110 is shown in Fig. 1 (), the carrier 12 〇 can be disposed without the positioning portion 13 〇, that is, the groove 128 can be provided. The details are changed without the design of the liquid crystal panel/substrate. Hall
勺=111 ^圖12所示’為本發明定位片及使用此定位片之 至f施例圖。在本實施例中，包含至少一承载盤 及下表ΐ 定位#11{)。承載盤120更包含上表面122 12所示之實施例中，上表面122較佳可 ^凸心下表面124可為凹陷部，使上表面122盘下表 付以相互嵌合恤騎疊粒。細林 、 ===，陷部，下表面124亦可為為 12 200900334 =目對第-粒妓⑽之絲辦二定位裝置⑽。連接部 170知別連接每一第二定倾置⑽， =中形她182侧㈣狀一裝= 之形狀相似，以套合第一定位裝置15〇。 係^如圖^ ^不之實蝴中’定位片170之連接部170較佳 係第疋位裝置⑽—體成形製成。然而在其它不同的實施Spoon = 11 11 ^ Figure 12 shows the positioning piece of the present invention and the example of the use of the positioning piece to f. In this embodiment, at least one carrier disk and the following table 定位 positioning #11{) are included. The carrier disk 120 further includes an upper surface 12212. The upper surface 122 preferably has a convex lower surface 124 which may be a recessed portion, such that the upper surface 122 is placed on the lower surface of the disk to be fitted to each other. The fine forest, ===, the trapped portion, and the lower surface 124 may also be 12 200900334 = mesh-to-grain (10) wire-handling device (10). The connecting portion 170 is known to connect each of the second fixed tiltings (10), and the medium-shaped female 182 side (four)-shaped one-piece shape is similar in shape to fit the first positioning device 15A. The connecting portion 170 of the positioning piece 170 is preferably formed by the body forming device (10). However in other different implementations
i成。在亦可ΐ第二定位裝置18°分別製成後再連接 „ 、知例中，定位片110材質較佳係為聚對苯二甲酸 k_(P〇lyethylene tereph制收，ρΕΤ)。然而在其它 不同的實施辦，亦可包含旨、_、聚合 性塑料或其組合。 又在如圖11及圖12所示之實施例中，第—定位裝置⑽ 及第二定位裝置180形狀較佳係呈矩形定位柱15〇及矩形之定 位柱套180。然而在圖12右側所示之實施例中，第一定位裝置 150及第二定位裝置18〇之形狀亦可為橢圓形之定位柱⑽及 麵形之定錄套⑽，如此靖觀套合。細在其它不同 的實施例巾’第-定域置⑽及第二定位裝置刷亦可為三 角形、多邊形或其它不同的形狀。此外，第一定位裝置15〇較 佳係為以複_且排成成直線方式設置於承_⑽之上表面 122上。然而在如圖12所示之實施例中，第一定位裝置^印 較佳係以兩個不同直_狀複數轉—定位駭⑽排列設 置:成。此外，第-^位裝置15G亦可單獨且非直線的排财 式設置於上表© 122上，端視需承載之液晶面板或承載物品（圖 未繪示）而決定。定位片110之複數個第二定位裝置⑽則相 對依據不同設置、不_狀之第—定絲置⑽峨計。例如 13 200900334 ’定位^170較朗以兩個直線排列 t刀I、有複數個第二定位裝置⑽，且相對應地套合於第一 疋位裝置150上。特服，在本實施射 二 =裝置⑽呈矩形’右下方之每—第二定位裝係二 练上所述，藉由本實施例之定位片ιι〇上之第二定位 :^:1位裝置150套合，成為新的凸柱結構，供與液晶i into. In addition, the second positioning device can be separately fabricated and then connected to „, and in the example, the positioning piece 110 material is preferably poly-terephthalic acid k_(P〇lyethylene tereph, ρΕΤ). Different implementations may also include a medium, a polymeric plastic, or a combination thereof. Also in the embodiment shown in FIGS. 11 and 12, the first positioning device (10) and the second positioning device 180 are preferably in the shape of The rectangular positioning post 15〇 and the rectangular positioning post sleeve 180. However, in the embodiment shown on the right side of FIG. 12, the shape of the first positioning device 150 and the second positioning device 18〇 may also be an elliptical positioning post (10) and a surface. The shape of the set of sleeves (10), such as Jingjing fit. Fine in other different embodiments of the towel 'first-position (10) and the second positioning device brush can also be triangular, polygonal or other different shapes. In addition, the first Preferably, the positioning device 15 is disposed in a complex manner on the upper surface 122 of the carrier (10). However, in the embodiment shown in FIG. 12, the first positioning device is preferably Two different straight _ shape complex turn - positioning 骇 (10) arrangement setting: into. In addition The first-position device 15G can also be disposed on the upper table © 122 in a separate and non-linear manner, and is determined by the liquid crystal panel or the carrier article (not shown) to be carried. The second positioning device (10) is based on different settings, not the first-fixed wire setting (10). For example, 13 200900334 'positioning ^ 170 is more horizontally arranged in two straight lines t-knife I, there are a plurality of second positioning devices (10), And correspondingly fits on the first clamping device 150. The special service, in the present embodiment, the second device (10) is rectangular, and the second positioning device is in the lower right side, by the second embodiment. The second positioning on the positioning piece ιι〇: ^: 1 position device 150 sets, becomes a new convex column structure, for LCD
第-載物品⑽树句定位設置。抑原本設置 f⑽強度且不易斷裂外’更可使所承載之物品數 篁增加，達到降低成本之效果。 本發明雖由上述相關實施例加以描述，然而上述實施例僅 為實林伽之_。必⑽旨出岐，已贿之實施例並非用 申請專利範圍。換言之，包含於本發明之精神 及補之修改及解設置均包含於本㈣之申料概圍内。The first-loaded item (10) tree sentence positioning setting. The original setting f (10) strength and not easy to break outside 'more can increase the number of items carried, to achieve the effect of reducing costs. The present invention has been described by the above related embodiments, but the above embodiment is only a syllabary. It must be (10) that the example of bribery is not the scope of patent application. In other words, the spirit and scope of the present invention and the modifications and solutions are included in the scope of the application (4).
/ \ KJ 【圖式簡單說明】圖1為客知包裝結構與液晶面板之分解圖； 力圖.=組裝平面圖’顯示包裝結構舆液晶面板間切受 ==彻嫩侧，嘛恢级结構定位片 圖4為圖3組裝後之立體圖； 圖5為本發明定位片之較佳實施例圖； 圖6為本發明疋位片之另—較佳實施例圖； 圖7為本發明包裝結構包裝基板並賴之實施例圖； 14 200900334 圖8為本發明包裝結構之另一較佳實施例圖； 圖9為圖8承載基板之立體圖； 圖10為本發明定位片之另一較佳實施例圖； 圖11為本發明定位片之又一較佳實施例圖；及 圖12為使用圖11之定位片之包裝結構實施例圖。 【主要元件符號說明】 100包裝結構 110定位片 112侧邊 114齒部 116跨幅凹槽 118表面 120承載盤 122上表面 124下表面 126容置空間 128卡槽 130定位部 132侧邊 134側壁 150第一定位裝置 170連接部 180第二定位裝置 182開孔 15 200900334 200基板/液晶面板 202電路模組 204間隙 206軟性電路板 300吸震材料 302孔洞 400紙箱 B支撐受力面/ \ KJ [Simple diagram description] Figure 1 is an exploded view of the customer-known packaging structure and liquid crystal panel; force diagram. = assembly plan 'display packaging structure 舆 liquid crystal panel between the cut == the tender side, the recovery structure positioning map 4 is a perspective view of a preferred embodiment of the positioning piece of the present invention; FIG. 6 is a view of another preferred embodiment of the positioning piece of the present invention; FIG. 8 is a perspective view of another embodiment of the package structure of the present invention; FIG. 9 is a perspective view of the carrier substrate of FIG. 8; FIG. 11 is a view showing still another preferred embodiment of the positioning piece of the present invention; and FIG. 12 is a view showing an embodiment of a packaging structure using the positioning piece of FIG. [Main component symbol description] 100 package structure 110 positioning piece 112 side edge 114 tooth portion 116 span groove 118 surface 120 carrier disk 122 upper surface 124 lower surface 126 accommodation space 128 card slot 130 positioning portion 132 side 134 side wall 150 First positioning device 170 connecting portion 180 second positioning device 182 opening 15 200900334 200 substrate / liquid crystal panel 202 circuit module 204 gap 206 flexible circuit board 300 shock absorbing material 302 hole 400 carton B supporting force surface