CN104386359A - Substrate packaging structure and substrate packaging structure set - Google Patents

Abstract

A substrate packaging structure includes a carrier plate, a clamping portion, a substrate and a protective film. The carrier plate has a carrier surface and a seat. The outer edge of the carrier surface is connected to the inner edge of the seat, and the inner edge of the seat has a plurality of abutting surfaces. The clamping portion is arranged on the carrier surface and adjacent to one of the abutting surfaces. The substrate is arranged on the carrier surface, and the side edge of the substrate abuts against these abutting surfaces. The protective film is attached to the substrate, and the protective film covers the substrate and has a positioning portion extending out of the substrate, and the clamping portion is clamped with the positioning portion. A substrate packaging structure group is also proposed.

Description

Substrate packaging structure and substrate packaging structure group

technical field

The present invention relates to a substrate packaging structure and a substrate packaging structure group, and in particular to a substrate packaging structure and a substrate packaging structure group capable of preventing substrates from being damaged due to collisions.

Background technique

With the development of technology, display panels have been widely used in various electronic products such as tablet computers, smart phones or flat-screen TVs in today's society. Specifically, display panels are mainly composed of components that are not resistant to collisions such as glass and flexible printed circuit boards. Therefore, display panel manufacturers need to package and fix display panels when shipping or storing them. Collision prevention is carried out in the substrate carrying tray, so as to avoid damage to the display panel caused by collision or vibration.

FIG. 1 is a top view of a panel and a substrate carrier in the prior art. Specifically, please refer to FIG. 1 , the substrate packaging structure 50 can fix the panel 60 by the inner edge 52 of the base body, but at the same time, the flexible printed circuit board 62 on one side of the panel 60 will also contact the inside of the base body. edge52. During the transportation, the flexible printed circuit board 62 will be pressed due to the movement of the panel 60 in the inner edge 52 of the base body, and then the flexible printed circuit board 62 will be damaged.

Contents of the invention

An embodiment of the present invention provides a substrate packaging structure, which can avoid collision between the substrate and the substrate packaging structure when carrying a substrate.

An embodiment of the present invention provides a substrate packaging structure group, which can fix at least two substrates on at least two substrate packaging structures, in addition to avoiding the collision between the substrate and the substrate packaging structure, it can also prevent the substrate from detaching Substrate package structure.

An embodiment of the present invention provides a substrate packaging structure, which includes a carrier plate, a locking portion, a substrate, and a protective film. The carrying plate has a carrying surface and a base. The outer edge of the bearing surface is connected to the inner edge of the seat body, and the inner edge of the seat body has a plurality of abutting surfaces. The substrate is arranged on the carrying surface. The side edges of the substrate abut against these abutting surfaces. The protective film is attached on the substrate and has a positioning portion extending out of the substrate. The engaging part is engaged with the positioning part.

In an embodiment of the present invention, the above-mentioned carrying surface further has at least one groove, and the substrate covers the groove.

In an embodiment of the present invention, the above-mentioned positioning portion has at least one opening, and the engaging portion is a protrusion passing through the opening.

In an embodiment of the present invention, the above-mentioned protrusion has an enlarged portion at the top, and at least one slit is formed at the edge of the opening.

In an embodiment of the present invention, the above-mentioned substrate is further connected to a circuit board, the circuit board and the positioning portion are located on opposite sides of the substrate, and there is a distance between the circuit board and the inner edge of the seat on the same side.

In an embodiment of the present invention, the above-mentioned substrate is further connected to a circuit board, the circuit board and the positioning portion are located on the same side of the substrate, and the positioning portion further extends to the outside of the circuit board.

In an embodiment of the present invention, the above-mentioned positioning part has an opening, and the engaging part can be disassembled on the bearing surface. The engaging part includes a fixing part and a post, and the post is inserted into the opening. The post is connected, and the other end of the fixing part is inserted into the seat body.

In an embodiment of the present invention, the above-mentioned fixing part is partly straddled by the positioning part.

In an embodiment of the present invention, a buffer portion is provided on the post, and when the post is inserted into the hole, the buffer portion is positioned on the hole to suppress the protective film or be inserted into the hole with the post.

In an embodiment of the present invention, the above-mentioned engaging portion carries the positioning portion, the contours of the engaging portion and the positioning portion match, and the contours of the engaging portion and the positioning portion shrink toward the substrate.

In an embodiment of the present invention, the above protective film completely covers the substrate.

An embodiment of the invention provides a substrate packaging structure group, which includes at least two substrate packaging structures. These substrate packaging structures are stacked with each other, and each substrate packaging structure includes a structure such as the above-mentioned substrate packaging structure, wherein each substrate packaging structure includes a bottom surface opposite to the carrying surface, the bottom surface has a vertically extending bottom column, and the bottom column Set within the projection range of the engaging part.

In an embodiment of the present invention, the base column of one substrate packaging structure is located above the positioning portion of another substrate packaging structure.

In an embodiment of the present invention, the height of the above-mentioned bottom column is not greater than the height difference between the top of the base and the bearing surface.

Based on the above, in the substrate packaging structure and the substrate packaging structure group provided by the embodiments of the present invention, the collision between the substrate and the inner edge of the seat can be reduced by the engagement between the engaging portion and the positioning portion of the protective film. . In the substrate packaging structure set provided by the embodiment of the present invention, the vertically extending bottom column prevents the substrate from detaching from the substrate packaging structure when stacking a plurality of substrate packaging structures.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

Description of drawings

FIG. 1 is a top view of a substrate and a substrate packaging structure in the prior art;

2A is a partial perspective view of a plurality of substrate packaging structures according to the first embodiment of the present invention;

2B is a top view of a plurality of substrate packaging structures according to the first embodiment of the present invention;

Fig. 2C is a partial top view according to area A in Fig. 2B;

2D is a top view of the substrate of the first embodiment of the present invention;

2E is a cross-sectional view of the substrate packaging structure group in the first embodiment of the present invention;

2F is a partial cross-sectional view of the substrate packaging structure group in the first embodiment of the present invention;

2G is a top view of the substrate in other embodiments of the present invention;

Figure 2H is a top view of the substrate in other embodiments of the present invention;

2I is a partial cross-sectional view of the substrate packaging structure in the first embodiment of the present invention;

3A is a top view of a substrate of a second embodiment of the present invention;

3B is a top view of the substrate packaging structure of the second embodiment of the present invention;

Fig. 3C is a partial cross-sectional view of the substrate packaging structure group according to the third embodiment of the present invention;

4 is a top view of a panel and a substrate packaging structure according to a fourth embodiment of the present invention;

5A is a top view of a panel and a substrate packaging structure according to a fifth embodiment of the present invention;

Figure 5B is a sectional view along section line I3I3' in Figure 5A;

Fig. 5C is a perspective view of the engaging part in the fifth embodiment of the present invention.

A: area

I1I1', I2I2', I3I3': Hatching

50, 100A, 100B, 100C, 100D: substrate packaging structure

52: Bearing Depression

110: carrying plate

60, 130: Substrate

62: Flexible printed circuit board

112: bearing surface

114: Groove

120: seat body

121: inner edge

122: top surface

132: Protective film

134A, 134B, 134C, 134D: positioning unit

136A: opening

137A: Gap

138A, 138C, 138D: circuit board

140A, 140B, 140C: engagement part

142: Expansion Department

142C: Buffer

144C: fixed part

146C: post

150: bottom surface

152: Bottom Post

Detailed ways

FIG. 2A is a partial perspective view of a plurality of substrate packaging structures according to the first embodiment of the present invention. FIG. 2B is a top view of a plurality of substrate packaging structures according to the first embodiment of the present invention. FIG. 2C is a partial top view according to area A in FIG. 2B . FIG. 2D is a top view of the substrate of the first embodiment of the present invention. It should be noted that in FIG. 2A and FIG. 2B a plurality of identical substrate packaging structures are interconnected, so the substrate packaging structure 100A in the following description refers to these interconnected identical substrate packaging structures. one of the structures. 2A and FIG. 2B omit the drawing of the substrate or only show a substrate, so as to clearly illustrate the substrate packaging structure of the first embodiment of the present invention. Referring to FIG. 2A to FIG. 2D , in the first embodiment of the present invention, the substrate packaging structure 100A includes a carrier plate 110 , an engaging portion 140A, a substrate 130 and a protective film 132 . In this embodiment, the carrying tray 110 has a carrying surface 112 and a seat 120 , and the substrate 130 is disposed on the carrying surface 112 .

In detail, please refer to FIG. 2B, FIG. 2C and FIG. 2D. In the first embodiment of the present invention, the protective film 132 is attached on the substrate 130, and the protective film 132 covers the substrate 130 and has a positioning extending out of the substrate 130. part 134A. In this embodiment, the outer edge of the bearing surface 112 is connected to the inner edge 121 of the seat body 120, the inner edge 121 of the seat body 120 has a plurality of abutting surfaces 122, and the side edges of the substrate 130 abut against these abutting surfaces 122 . In this embodiment, the engaging portion 140A is disposed on the carrying surface 112 and adjacent to one of the abutting surfaces 122 , and the engaging portion 140A engages with the positioning portion 134A. Since the substrate 130 in this embodiment can engage the positioning portion 134A of the protective film 132 attached thereon with the engaging portion 140A, the substrate 130 can be subjected to pressure in a direction parallel to the surface of the substrate 130 when it is placed on the carrying surface 112. Therefore, the contact between the substrate 130 and the inner edge 121 of the seat body 120 can be reduced, thereby reducing the damage to the substrate 130 caused by moving, storing or bumping the substrate packaging structure 100A.

Further, please refer to FIG. 2C and FIG. 2D. In the first embodiment of the present invention, the substrate 130 is further connected to a circuit board 138A, the circuit board 138A and the positioning portion 134A are located on opposite sides, and the circuit board 138A and the same side There is a distance between inner edges 121 of the seat body 120 . On the other hand, the protective film 132 completely covers the substrate 130 in this embodiment, but it is not limited thereto. In other embodiments, the protective film 132 may partially cover the substrate 130 . Therefore, since the positioning portion 134A of the protective film 132 can be engaged with the engaging portion 140A, when the substrate packaging structure 100A is moved, the circuit board 138A connected to the substrate 130 will not collide with the inner edge 121 of the seat body 120 and cause damage. , thereby enhancing the protection effect on the substrate 130 .

2E is a cross-sectional view of the substrate packaging structure group in the first embodiment of the present invention. FIG. 2F is a partial cross-sectional view of the substrate packaging structure group in the first embodiment of the present invention. It should be noted that the sectional view of FIG. 2E may correspond to the section line I1I1' of FIG. 2B, and the partial sectional view of FIG. 2F may correspond to the section line I2I2' of FIG. 2B. Please refer to FIG. 2E and FIG. 2F. In this embodiment, the substrate packaging structure group includes a plurality of the above-mentioned substrate packaging structures 100A, and these substrate packaging structures 100A are partially connected to each other and partially stacked on each other, so that the substrates can be limited to each other. stack between the two substrate package structures.

Specifically, please refer to FIG. 2B and FIG. 2F , in this embodiment, the carrying surface 112 has a groove 114 for enhancing the strength of the substrate packaging structure. In this embodiment, the substrate 130 can be a liquid crystal display panel, and the groove 114 corresponds to the visible area of the liquid crystal display panel. The substrate 130 covers the groove 114, which can prevent the visible area from directly contacting the bearing surface 112. Some embodiments are not limited thereto. The protective film 132 is attached on the surface of the substrate 130 facing away from the substrate packaging structure.

FIG. 2G is a top view of a substrate in another embodiment of the present invention. FIG. 2H is a top view of a substrate in another embodiment of the present invention. FIG. 2I is a partial cross-sectional view of the substrate packaging structure in the first embodiment of the present invention. Specifically, please refer to FIG. 2B, FIG. 2D and FIG. 2E. In the first embodiment of the present invention, the positioning portion 134A has an opening 136A, and the engaging portion 140A is a protrusion 140A and passes through the opening 136A. Not limited to this. Please refer to FIG. 2G and FIG. 2I. In other embodiments, the boss 140A has an enlarged portion 142, and the edge of the opening 136A has slits 137A (here four are taken as an example), so that the enlarged portion 142 of the boss 140A can pass through, and make the opening 136A engage with the boss 140A so that it will not be disengaged due to vibration or collision. In detail, the size of the protrusion 140A and the opening 136A in the above-mentioned embodiment of the present invention will roughly match the engaging portion 140A, so that the locking will not be easily loosened because the opening 136A is too large. In other embodiments, please refer to FIG. 2H , the edge of the opening 136A may further have eight slits 137A.

For example, in the above-mentioned embodiments of the present invention, the substrate 130 is a liquid crystal display panel, and the substrate packaging structure 100A is a container used to package the liquid crystal display module for transportation after the liquid crystal display module is fabricated. However, in some other embodiments, the substrate 130 may be a circuit board, and the invention is not limited thereto.

In detail, please refer to FIG. 2C and FIG. 2D. In the first embodiment of the present invention, the circuit board 138A is, for example, a flexible printed circuit board, and the substrate packaging structure 100A is, for example, made of polyethylene terephthalate. (Polyethylene Terephthalate, PET), but not limited thereto. In other embodiments, the substrate packaging structure 100A can be made of foam material (such as expanded polyethylene (EPE)) or polystyrene (Polystyrene, PS) (that is, Styrofoam) and the like. A panel of substrates is formed from packaged structural materials.

It must be noted here that the following embodiments use the component numbers and partial content of the previous embodiments, wherein the same numbers are used to denote the same or similar components, and descriptions of the same technical content are omitted. For the description of omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.

3A is a top view of a substrate of a second embodiment of the present invention. 3B is a top view of the substrate packaging structure of the second embodiment of the present invention. Referring to FIG. 3A and FIG. 3B , in the second embodiment of the present invention, the substrate packaging structure 100B and the protective film 132 are substantially the same as the substrate packaging structure 100A and the protective film 132 in the first embodiment of the present invention. The difference is that the engaging portion 140B of the second embodiment of the present invention carries the positioning portion 134B, the engaging portion 140B matches the contour of the positioning portion 134B, and the contours of the engaging portion 140B and the positioning portion 134B go inward toward the substrate 130 shrink. More specifically, in this embodiment, the width of the engaging portion 140B and the positioning portion 134B parallel to the edge of the substrate 130 connected to the positioning portion 134B is smaller at a portion close to the substrate 130 than at a portion away from the substrate 130 . More specifically, in this embodiment, the engaging portion 140B and the positioning portion 134B are each in a T-shape and match each other. Therefore, in this embodiment, the contours of the engaging portion 140B and the positioning portion 134B are matched and engaged with each other, and because the contours of the engaging portion 140B and the positioning portion 134B shrink toward the direction of the substrate 130, the engaging portion 140B and the positioning portion When the parts 134B are engaged, the base plate 130 cannot move toward the inner edge 121 of the seat facing the circuit board 138A, thereby preventing the circuit board 138A from being damaged due to collision with the inner edge 121 of the surrounding seat, which has higher safety.

FIG. 3C is a partial cross-sectional view of the substrate packaging structure group according to the third embodiment of the present invention. Specifically, please refer to FIG. 3B and FIG. 3C , the substrate packaging structure group of the third embodiment of the present invention includes a plurality of substrate packaging structures, which are similar to the substrate packaging structure 100B of the second embodiment above, and these substrate packaging structures 100B are stacked on top of each other. Each substrate packaging structure 100B includes a bottom surface 150 opposite to the carrying surface 112 , the bottom surface 150 has a vertically extending bottom post 152 , and the bottom post is disposed within the projection range of the engaging portion 140B. Therefore, when these substrate packaging structures 100B are stacked, in addition to engaging with each other through the engaging portion 140B and the positioning portion 134B, the substrate 130 can also be constrained in the direction perpendicular to the bottom surface 150 by the bottom column 152 . bit.

Further, referring to FIG. 3C , in the third embodiment of the present invention, the base column 152 of the substrate packaging structure 100B is located above the positioning portion 134B of another substrate packaging structure 100B, and the height of the base column 152 is not greater than the seat The height difference between the top of the body 120 and the carrying surface 112, therefore, when at least two substrate packaging structures 100B in the substrate packaging structure group overlap, it will not be difficult to stack each other because the bottom column 152 of one of the substrate packaging structures 100B protrudes .

FIG. 4 is a top view of a substrate and a substrate packaging structure according to a fourth embodiment of the present invention. Please refer to FIG. 4 , in the fourth embodiment of the present invention, the substrate packaging structure 100C and the protective film 132 are substantially the same as the above-mentioned substrate packaging structure 100A and the protective film 132 in the first embodiment of the present invention, the difference is that The circuit board 138C to which the substrate is connected is located not only on one side relative to the positioning portion 134C, but also on the other two sides. The circuit board 138C is kept at a distance from the inner edge 121 of the housing. Referring to FIG. 4 , the positioning portion 134C has a plurality of openings 136A, and the engaging portion 140A is a protrusion, and the engaging portion 140A passes through the openings 136A, but is not limited thereto. Please refer to FIG. 4 , in this embodiment, the substrate carried by the substrate packaging structure 100C is, for example, a liquid crystal display panel, but is not limited thereto.

Please refer to FIG. 4 , in other embodiments, the engaging portion 140A can also be a pin, for example, the engaging portion 140A passes through the opening 136A, and the engaging portion 140A is detachably assembled to other parts of the substrate packaging structure 100C, That is to say, the engaging portion 140A can be directly inserted into the substrate packaging structure 100C through the opening 136A, and at this time, the substrate packaging structure 100C can be made of polystyrene, for example. Therefore, the substrate packaging structure 100C of FIG. 4 can fix the panel through the engagement of the boss and the positioning portion 134C or the engagement of the pin and the positioning portion 134C. Since the circuit board 138C is not in contact with the inner edge 121 of the seat, Damage to the circuit board 138C due to collision can be avoided.

5A is a top view of a panel and a substrate packaging structure according to a fifth embodiment of the present invention. Fig. 5B is a cross-sectional view along the section line I3I3' in Fig. 5A. Please refer to FIG. 5A and FIG. 5B. In the fifth embodiment of the present invention, the substrate packaging structure 100D and the protective film 132 are substantially the same as the substrate packaging structure 100C and the protective film 132 in the fourth embodiment of the present invention described above. The advantage is that the substrate is also connected to the circuit board 138D on the side where the positioning part 134D is located, the positioning part 134D extends beyond the circuit board 138D, and the engaging part 140C engages the part of the positioning part 134D extending outside the circuit board 138D. In other words, in the above other embodiments, the positioning portion extends to the outside of the circuit board without covering the circuit board, while the positioning portion 134D of this embodiment covers the circuit board 138D and extends outside the circuit board 138D.

Fig. 5C is a perspective view of the engaging part in the fifth embodiment of the present invention. Specifically, please refer to FIG. 5A to FIG. 5C. In this embodiment, the positioning portion 134D has a plurality of openings 136A, the engaging portion 140C is detachable from the bearing surface 112, and the engaging portion 140C includes a fixing portion 144C and Post 146C. The post 146C is inserted into the opening 136A, one end of the fixing part 144C is connected to the post 146C, and the other end of the fixing part 144C is inserted into the seat body 120, and the end of the fixing part 144C inserted into the seat body 120 in this embodiment has a T-shaped cross section , and the seat body 120 has a corresponding T-shaped slot for inserting one end of the fixing portion 144C having a T-shaped cross-section, so that the engaging portion 140C is fitted with the seat body 120 . The fixing portion 144C is partly straddled by the positioning portion 134D, and a buffer portion 142C is disposed on the post 146C, and in this embodiment, the buffer portion 142C and the post are inserted into the opening 136A. In detail, in this embodiment, the post 146C and the fixing portion 144C are plastic parts with relatively high hardness, while the buffer portion 142C is formed of an elastic material (for example, plastic, rubber), so as to protect the substrate 130 from collisions. break, and at the same time make the engagement between the engaging portion 140C and the opening 136A more stable, but the present invention is not limited thereto. In other embodiments, both the post 146C and the buffer portion 142C can be made of elastic material, and the cross-sectional size of the post 146C can be matched with the opening 136A, and the buffer portion 142C disposed on the post 146C will Located outside the opening 136A, that is, the buffer portion 142C will press the part of the positioning part 134D of the protective film 132 to strengthen and fix the protective film when the post 146C passes through the opening 136A, or be located above the part of the positioning part 134D to limit the protective film 132 of the mobile.

More specifically, please refer to FIG. 5A , in the fifth embodiment of the present invention, the panel is connected with a plurality of circuit boards 138D, and each of these circuit boards 138D is connected with four sides of the panel. In this embodiment, by engaging the positioning portion 134D with a plurality of engaging portions 140C (here four engaging portions 140C are taken as an example), these circuit boards 138D will not contact the inner edge 121 of the base body 120 , Therefore, damage to the above-mentioned circuit board due to collision can be avoided.

To sum up, in the substrate packaging structure and the substrate packaging structure group provided by the embodiments of the present invention, through the engagement between the engaging portion and the positioning portion of the protective film, when the protective film is attached to a substrate, , the substrate can be fixed on the substrate packaging structure, and at the same time, the circuit board or the connection port connected with the substrate can keep a distance from the inner edge of the seat body. Therefore, collisions between the circuit board and the inner edge of the housing can be reduced.

Although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be defined by the protection scope of the appended claims.

Claims (14)

1. A substrate packaging structure, comprising: A carrying plate has a carrying surface and a seat body, wherein the outer edge of the carrying surface is connected to the inner edge of the seat body, and the inner edge of the seat body has a plurality of abutting surfaces; a locking part is arranged on the carrying surface and adjacent to one of the abutting surfaces; A base plate is arranged on the carrying surface, and the side edges of the base plate are against the abutting surfaces; and A protective film is pasted on the substrate, and the protective film covers the substrate and has a positioning part extending out of the substrate, and the engaging part is engaged with the positioning part. 2. The substrate packaging structure according to claim 1, wherein the carrying surface further has at least one groove, and the substrate covers the groove. 3 . The substrate packaging structure according to claim 1 , wherein the positioning portion has at least one opening, and the engaging portion is a protrusion passing through the opening. 4 . 4 . The substrate packaging structure according to claim 3 , wherein the top of the protrusion has an enlarged portion, and the edge of the opening has at least one slit. 5. The substrate packaging structure according to claim 1, wherein the substrate is further connected to a circuit board, the circuit board and the positioning portion are located on opposite sides of the substrate, and the circuit board and the seat on the same side There is a distance between the inner edges of the body. 6. The substrate packaging structure according to claim 1, wherein the substrate is further connected to a circuit board, the circuit board and the positioning portion are located on the same side of the substrate, and the positioning portion further extends to the outside of the circuit board . 7. The substrate packaging structure according to claim 1, wherein the positioning portion has an opening, the engaging portion is detachable from the bearing surface, the engaging portion includes a fixing portion and a post, The post is inserted into the opening, one end of the fixing part is connected with the post, and the other end of the fixing part is inserted into the base. 8 . The substrate packaging structure according to claim 7 , wherein the fixing part straddles the positioning part. 9. The substrate packaging structure according to claim 7, wherein a buffer portion is provided on the post, and when the post is inserted into the opening, the buffer portion is located on the opening to suppress the protective film Or be inserted into the opening with the post. 10. The substrate packaging structure according to claim 1, wherein the engaging portion carries the positioning portion, the engaging portion matches the contour of the positioning portion, and the engaging portion matches the contour of the positioning portion shrink inward toward the substrate. 11. The substrate packaging structure according to claim 1, wherein the protective film completely covers the substrate. 12. A group of substrate packaging structures, characterized in that it comprises at least two substrate packaging structures, the substrate packaging structures are stacked with each other, each of the substrate packaging structures comprises the structure as claimed in claim 10, wherein each of the substrate packaging structures The structure includes a bottom surface opposite to the carrying surface, the bottom surface has a bottom column extending vertically downwards, and the bottom column is arranged within the projection range of the engaging portion. 13 . The substrate packaging structure set according to claim 12 , wherein the base column of the one substrate packaging structure is located above the positioning portion of the other substrate packaging structure. 14 . 14. The substrate packaging structure set as claimed in claim 12, wherein the height of the bottom column is not greater than the height difference between the top of the base and the bearing surface.