200846845 . 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種在電子電路基板、液晶元件用玻 璃基板、PDP用玻璃元件基板等平面基板形成電路圖案 • (Pattern)的曝光繪圖裝置。 【先前技術】 φ 形成電路圖案於平面基板的曝光繪圖裝置係，習知係 以將轉寫光罩和作為被曝光體的基板接觸的接觸方式或不 被接觸的非接觸方式的曝光裝置作為主流。最近從光罩的 管理和保養方面，如專利文獻1或專利文獻2所示般，對 於不使用轉寫光罩而將繪圖光直接照射至基板而繪圖電路 圖案的曝光繪圖裝置的要求變高。 此曝光繪圖裝置係，將應轉寫的圖案作為繪圖資料， 傳送至曝光繪圖裝置，在曝光繪圖裝置，藉由此資料，進 _ 行根據作為空間光調變元件的DMD(Digital Microiirro]： Dev 1 ce ’數位微型反射鏡元件）元件的控制，照射繪圖光， 在平面基板將電路圖案繪圖的裝置。曝光繪圖裝置係可享 受不使用光罩的最大優點。 如專利文獻3所示般’在曝光緣圖製程中，為了設定 在基板繪圖的電路圖案的位置，在曝光製程前，預先在基 板的周邊開小直徑的孔，將這些孔作為對位符號 (alignment mark)，決定曝光的電路圖案的位置和姿勢。 特別在電子電路基板，在基板的兩面形成電路圖案的情形 5 7106-9470-PF;Tungming 200846845 較多，以在基板的表5 & ,,, m 面、對位符號一致的方式，貫通基 板的小直徑的孔被使用。 [專利文獻丨]日本特開2006-1 13413 [專利文獻2]日本特開2006-343684 • [專利文獻3]日本特開2006-267191 【發明内容】 _ [發明所欲解決之問題] 然而，在孔加工中附著的塵埃、以及移動過程中附著 於孔的塵埃落下至其他基板，或在光阻塗佈等的加工中的 加熱工程引起孔周邊的變形，這些問題在要求高解析度的 基板上成為問題。 因此，本發明提供一種曝光繪圖裝置，在基板的兩面 上形成將在繪圖電路圖案時所必要的對位符號。 [解決問題之技術手段] > 第一觀點的曝光繪圖裝置係包括：基板投入部，將形 成有感光層的基板投入至基板校正位置；校正部，將被投 入至此基板校正位置的上述基板校正至所定位置；符號形 成部，對於藉由枚正部被校正的基板的第一面以及第二 面，形成第一及第二對位符號；以及繪圖部，基於第一及 第二對位符號，將電路圖案繪圖至基板的第一面及第二面。 藉由此構成，不需將貫通基板的第一面及第二面的孔 作為對位符號，即可形成第一及第二對位符號。因此，不 會有附著於孔的塵埃落下至其他基板。 7106-947O-PF;Tungming 6 200846845 在第二觀點的曝光繪圖裝置中，符號形成部係藉由短 波長的照明光，在基板的兩面上同時形成上述第一及第二 對位符號。 在第二觀點的曝光繪圖裝置中，藉由短波長的照明 光，可在兩面同時形成。 第三觀點的曝光繪圖裝置係更包括：記憶部，記憶第 一對位符號和第二對位符號的二次元平面的差異情報；其 中繪圖部係’基於第一對位符號將電路圖案繪圖於第一面 上’且基於第二對位符號及差異情報將電路圖案繪圖於第 二面上 〇 卩使在精德、製作的符號形成部，在第一面的第一對位 付唬和第二面的第二對位符號之間會產生誤差。然而，第 三觀點的曝光緣圖裝置係，藉由將此誤差作為差異情報而 A憶在e憶部中’纟將電路圖案繪圖之際，I用此差異情 報可將第一面的電路圖案和第二面的電路圖案正確地對 應。 在第四觀點的曝光繪圖裝置中，符號形成部係具有第 一面付唬形成部和第二面符號形成部，各個符號形成部可 在與上述基板平行的二次元平面移動，且可在對於上述二 次元平面直交的方向移動。 藉由此構成，由於第一面符號形成部及第二面符號形 成部係可接近基板，可以少的光量且短時間形成第_對位 符ί虎以及弟二對位符發。 第五觀點的曝光綠圖裝置係在第四觀點中，符號形成 7106-9470-PF;Tungming 7 200846845 -部係具有僅在第-面符號形成部的一方照射短波長的照明 光的機構。 藉由此構成，對於只需在第一面形成電路圖案的基板 而吕，可僅在第一面形成第一對位符號。 第六觀點的曝光繪圖裝置的基板投入部係具有將上述 基板移動至不同於基板投入位置的位置的搬送裝置，其更 包括從基板校正位置搬送基板至被曝光體台的搬送部。 • 符號形成部不在和基板校正位置相同的位置形成對位 符號的情形，藉由搬送部移動基板即可。 [發明的效果] 目前在其他製程形成對位符號的製程可省略，可在電 路圖案形成製程之直前形成對位符號，可減少總共的製程 數。亦即，本發明的曝光繪圖裝置係，即使在完全沒有預 先形成對位符號的繪圖第一層的基板上，也可形成直接繪 圖圖案用的對位符號。 【實施方式】 〈第一曝光繪圖裝置及第二曝光繪圖裝置的概略構成〉 第1圖係為配置第一曝光繪圖裝置10及第二曝光繪圖 裝置100的上視圖。 在本實施例中，因為作為平面基板的被曝光基板CB係 弟一面及笫二面均被曝光，第一曝光綠圖裝置1Q之外，將 弟一曝光繪圖裝置1 〇 〇並列配置。亦即，第一曝光繪圖裝 置10係將被曝光基板CB的第一面曝光，第二曝光繪圖裝 7106-9470-PF;Tungming 8 200846845 置1 0 0係將被曝光基板CB的第二面曝光，雖然使用將被曝 光基板CB從第一面反轉至第二面的反轉部70，僅藉由第 一曝光纟會圖裝置10將被曝光基板CB的兩面繪圖也可，但 為了提高被曝光基板CB的生產量（每一時間的生產量），準 備第二曝光繪圖裝置100。 第一曝光繪圖裝置10係，大致由基板投入部2 0、校 正部3 0、符號形成部4 0、第一搬送部5 0、第一繪圖部⑽、 以及待機台70所構成。第二曝光繪圖装置1〇〇係，大致由 第二搬送部15 0、第二繪圖部16 0、以及搬出台18 0所構成。 從第1圖的左侧，塗佈著光阻的被曝光基板被搬送 過來。搬送確認感測器SS1確認被曝光基板CB。接著，基 板投入部20的旋轉滾子21(參考第3圖）旋轉。被曝光基 板CB被搬送至基板投入部2 0的右端的話，搬入確認感測 器SS2確認被曝光基板CB。被曝光基板CB完全被搬入至 基板投入部2 G後，旋轉滾子21停止，進行被曝光基板 的校正，其次，在被曝光基板CB的周邊部，對位符號 係藉由符號形成部40被形成。 之後’被曝光基板CB係藉由第一搬送部5 0被載置於 弟一繪圖部6 0的被曝光體台6 8。第一繪圖部6 〇係在被曝 光基板CB的第一面繪圖電路圖案。電路圖案的緣圖終了的 被曝光基板CB係，藉由第一搬送部50將第一面和第二面 反轉’被搬送至待機台7 0。在第一搬送部5 0不具有反轉 機構的情形，待機台70具有將被曝光基板CB從第一面反 轉至第二面的機構也可。 7106-9470-PF;Tungming 9 200846845 ' 其—人，被曝光基板CB係藉由第二搬送部15 0被載置於 第二繪圖部160的被曝光體台68。第二繪圖部16〇係在被 曝光基板CB的第二面繪圖電路圖案。電路圖案的繪圖終了 的被曝光基板CB係，藉由第二搬送部15〇被搬送至搬出台 180。之後，被曝光基板cb係被搬送至下一製程。 在第1圖，為了提高生產量第一曝光繪圖裝置丨〇及第 二曝光繪圖裝置1〇〇並行配置。在比起生產量更考慮設備 φ 導入成本的情形中，從待機台7〇使被曝光基板CB再次回 到第一曝光繪圖裝置1 〇，在被曝光基板CB的第二面繪圖 電路圖案也可。又，第一曝光繪圖裝置1〇及第二曝光繪圖 裝置1 0 0係，因為除了基板投入部2 〇、校正部3 〇、及符號 形成部40之外，大致相同，以下以第一曝光繪圖裝置1〇 作為代表說明各構成。 〈弟一曝光纟會圖裝置的構成〉 第2圖係為第一曝光繪圖裝置1〇的立體圖。第3圖係 • 為第一曝光繪圖裝置10的正面圖（XZ面）。第4圖係為第 一曝光繪圖裝置1〇的側面圖（γζ面）。這些第3圖至第4 圖係特別以基板投入部20、校正部30、符號形成部4〇、 及弟一搬送部5 0為中心被繪製。 基板投入部20係，具有複數的旋轉滾子2ι以及旋轉 旋轉滾子21的未圖示的驅動馬達。旋轉滾子21係複數個 平行地設置，在旋轉滾子21的一端，安裝有承受藉由皮帶 或金屬線（wire)被傳達的旋轉力的扣鏈齒輪或滑輪。作為 傳達旋轉旋轉滾子21的驅動馬達的旋轉力的手段，除扣鏈 7106-9470-PF;Tungming 10 200846845 ，齒輪或滑輪以外，也可採用根據圓筒狀的磁鐵（magnet)的 傳達方法。又，基板投入部2〇係，具有確認被曝光基板 CB的搬入及到達的搬送確認感測器SS1及搬入確認感測器 SS2 〇 &正部係具有校正用氣缸（air cy 1 inder)31，可將 校正板33上下動作。在校正板33，校正銷35被安裝。被 曝光基板CB被搬送，旋轉滾子21的旋轉停止為止，校正 • 板33係被配置在下端；在旋轉滾子21停止而校正被曝光 基板CB之際，校正板33係移動至上端。在第3圖，係為 校正板33移動至上端的圖示，在第4圖，係為校正板 移動至下端的圖示。 校正板33移動至上端的話，安裝於校正板33的校正 銷35係移動至和被曝光基板CB抵接的高度。校正板33係 具有將校正銷35移動於水平方向的水平移動驅動部34, 銷35係可在水平方向移動約1 。被曝光基板⑶係， I例如’為635mm X 535mm的矩形形狀，校正銷35係沿著被 曝光基板CB的四邊被配置。 夺虎形成。卩40係，在藉由校正銷35被校正的被曝光 二板,CB的四邊的第一面形成第一對位符号虎aM1，在第二面 形成第二對位符號。有關符號形成部4G的詳細係在後 第搬适部50係具有手（hand)部53，其具備複數 ，空吸著的真空塾（pad)51;又，手部53係具有上下驅 部54及水平驅動部55。相對於對位符號AM被形成的被 7106-9470^PF;Tungniing n 200846845 光基板CB，真空墊51從上方下降而真空吸著，被曝光基 板CB係被吊起。之後，被曝光基板CB係藉由水平驅動部 55 ’被移動至第一繪圖部6〇的被曝光體台68上。又，上 下驅動部54係將被曝光基板CB載置於被曝光體台68，真 空墊51的真空吸著被解除^此時，被曝光體台68的真空 吸者係動作，被曝光基板CB係被確實地固定於被曝光體台 68。又，第一搬送部5〇係具有使被曝光基板cb的第一= 反轉至第二面的反轉轉子59。在第】圖中’在從繪圖部6〇 搬送至待機台70之際，被曝光基板CB藉由反轉轉子”從 第一面反轉至第二面。 〈被曝光體的校正和對位符號> 第5圖係為投入至基板投入部2〇的基板校正位置的被 曝光基板⑽上視圖。從第5圖理解般，相對於被曝光基 板CB各邊，分別設置著兩個校正鎖35。將—邊決定位置 時’兩個校正銷為較佳地。又，校正㈣係如箭頭Μ般， 對於被曝光基板CB的四邊，從以虛線描㈣μ㈣μ 實線描㈣位置。藉此，被曝光基板⑶的校正終了後，校 正銷35係從以實線描緣的位置回到以虛線描繪的位置。 又，配置於四個場所的篇缺犯> 琢所扪付說形成部40係從退避位置移 動至被曝光基板CB的周邊位詈。μ 邃彳置四個符號形成部40係在 被曝光基板CB的各邊，將一個或複數個對位符號AM藉由 短波長光曝光而形成。符號形成部4。係為了提高生產量， 將被曝光基板CB @第一面和第二面同時曝光為較佳地。 又，對位符號AM係，從0O.5m"Wimm程度的圓形或十 7106-9470-PF;Tungming 12 200846845 子型的符號开彡此口 · 付琉禾狀即可，在第5圖中，在第一面的一邊形成 有必lmm的四個圓形的對位符號AM。 〈符號形成部> 第6圖係表示一個符號形成部40的圖示，其中第6(a) 圖為上視圖，第6(b)圖為侧視圖，第6(c)圖為正視圖。 卜符號形成部40係具有在被曝光基板CB的第一面形成200846845. [Technical Field] The present invention relates to an exposure drawing device in which a circuit pattern is formed on a planar substrate such as an electronic circuit board, a glass substrate for a liquid crystal element, or a glass element substrate for a PDP. . [Prior Art] φ An exposure drawing device for forming a circuit pattern on a planar substrate, which is conventionally used as a contact mode in which a transfer mask is brought into contact with a substrate as an object to be exposed or a non-contact type exposure device which is not in contact . In the management and maintenance of the reticle, as disclosed in Patent Document 1 or Patent Document 2, the exposure drawing apparatus for directly drawing the drawing light onto the substrate without using the transfer mask and drawing the circuit pattern has become high. The exposure drawing device transmits the pattern to be transferred as drawing material to the exposure drawing device, and in the exposure drawing device, the data is used to perform DMD (Digital Microiirro) as a spatial light modulation component: Dev 1 ce 'digital micro-mirror element) A device that controls the illumination of the drawing light and plots the circuit pattern on a planar substrate. Exposure drawing devices offer the greatest advantage of not using a reticle. As shown in Patent Document 3, in the exposure edge pattern process, in order to set the position of the circuit pattern drawn on the substrate, before the exposure process, small diameter holes are opened in the periphery of the substrate in advance, and these holes are used as alignment symbols ( Alignment mark) determines the position and orientation of the exposed circuit pattern. In particular, in the case of an electronic circuit board, a circuit pattern is formed on both sides of the substrate 5 7106-9470-PF; Tungming 200846845 is often used, and the substrate is penetrated in such a manner that the surface of the substrate 5 & Small diameter holes are used. [Patent Document 日本] Japanese Patent Laid-Open No. 2006-1 13413 [Patent Document 2] Japanese Laid-Open Patent Publication No. 2006-343684. [Patent Document 3] Japanese Laid-Open Patent Publication No. 2006-267191 [Draft of the Invention] _ [Problems to be Solved by the Invention] However, The dust adhering to the hole processing and the dust adhering to the hole during the movement are dropped to other substrates, or the heating process in the processing of the photoresist coating or the like causes deformation of the periphery of the hole, and these problems require a substrate having a high resolution. It became a problem. Accordingly, the present invention provides an exposure drawing apparatus which forms alignment symbols necessary for drawing a circuit pattern on both sides of a substrate. [Technical means for solving the problem] The first aspect of the exposure drawing apparatus includes: a substrate input portion that inputs a substrate on which a photosensitive layer is formed to a substrate correction position; and a correction portion that corrects the substrate to be input to the substrate correction position a predetermined position; a symbol forming portion, forming first and second alignment symbols for the first surface and the second surface of the substrate corrected by the positive portion; and a drawing portion based on the first and second alignment symbols Drawing the circuit pattern to the first side and the second side of the substrate. According to this configuration, the first and second alignment symbols can be formed without using the holes of the first surface and the second surface of the substrate as alignment symbols. Therefore, dust adhering to the holes does not fall to other substrates. 7106-947O-PF; Tungming 6 200846845 In the exposure drawing apparatus of the second aspect, the symbol forming portion simultaneously forms the first and second alignment symbols on both sides of the substrate by the illumination light of a short wavelength. In the exposure drawing apparatus of the second aspect, the illumination light of a short wavelength can be simultaneously formed on both sides. The exposure drawing apparatus of the third aspect further includes: a memory unit that memorizes the difference information of the second element plane of the first alignment symbol and the second alignment symbol; wherein the drawing unit draws the circuit pattern based on the first alignment symbol On the first side, and based on the second alignment symbol and the difference information, the circuit pattern is drawn on the second surface, so that the first pair of the first surface is prepared and printed in the symbol forming portion of the first surface. An error occurs between the second alignment symbols on the two sides. However, the third aspect of the exposure edge map device, by using this error as the difference information, A recalls in the e-memory section, when the circuit pattern is drawn, I can use the difference information to the first side of the circuit pattern. Corresponding to the circuit pattern on the second side. In the exposure drawing device of the fourth aspect, the symbol forming portion has a first surface forming portion and a second surface symbol forming portion, and each of the symbol forming portions is movable in a quadratic plane parallel to the substrate, and The above-mentioned quadratic plane moves in the direction of orthogonality. According to this configuration, since the first surface symbol forming portion and the second surface symbol forming portion are accessible to the substrate, the _paralog and the second aligner can be formed with a small amount of light and a short time. The exposure green image device of the fifth aspect is a fourth aspect, the symbol formation is 7106-9470-PF, and the Tungming 7 200846845 - part has a mechanism for irradiating illumination light of a short wavelength only on one side of the first surface symbol formation portion. With this configuration, the first alignment symbol can be formed only on the first surface for the substrate on which the circuit pattern is to be formed only on the first surface. The substrate input unit of the exposure drawing device of the sixth aspect has a transfer device that moves the substrate to a position different from the substrate input position, and further includes a transfer unit that transports the substrate from the substrate correction position to the object to be exposed. • The symbol forming unit does not form a registration mark at the same position as the substrate correction position, and the substrate can be moved by the transfer unit. [Effects of the Invention] The process of forming alignment symbols in other processes can be omitted, and alignment symbols can be formed immediately before the circuit pattern forming process, and the total number of processes can be reduced. That is, the exposure drawing apparatus of the present invention can form a registration symbol for a direct drawing pattern even on a substrate on which the first layer of the drawing of the alignment symbol is not formed in advance. [Embodiment] <Schematic Configuration of First Exposure Drawing Device and Second Exposure Drawing Device> Fig. 1 is a top view showing the first exposure drawing device 10 and the second exposure drawing device 100. In the present embodiment, since the exposed substrate CB as the planar substrate is exposed on both sides and both sides, the first exposure greening device 1Q is arranged in parallel with the first exposure drawing device 1 . That is, the first exposure drawing device 10 exposes the first side of the exposed substrate CB, and the second exposure drawing device 7106-9470-PF; Tungming 8 200846845 sets 1 0 0 to expose the second side of the exposed substrate CB Although the inversion portion 70 that inverts the substrate CB to be exposed from the first surface to the second surface is used, only the two sides of the substrate to be exposed CB may be drawn by the first exposure image display device 10, but in order to improve The second exposure drawing device 100 is prepared by exposing the throughput of the substrate CB (the amount of production per time). The first exposure drawing device 10 is basically constituted by a substrate input unit 20, a correction unit 30, a symbol forming unit 40, a first transfer unit 50, a first drawing unit (10), and a standby unit 70. The second exposure drawing device 1 is substantially constituted by the second transfer unit 150, the second drawing unit 160, and the carry-out table 18. From the left side of Fig. 1, the exposed substrate coated with the photoresist is transferred. The conveyance confirmation sensor SS1 confirms the substrate CB to be exposed. Next, the rotating roller 21 (refer to Fig. 3) of the substrate input unit 20 is rotated. When the exposed substrate CB is transported to the right end of the substrate input unit 20, the carry-in confirmation sensor SS2 confirms the exposed substrate CB. After the exposed substrate CB is completely carried into the substrate input portion 2G, the rotating roller 21 is stopped to correct the substrate to be exposed, and secondly, the alignment symbol is surrounded by the symbol forming portion 40 in the peripheral portion of the exposed substrate CB. form. Thereafter, the exposed substrate CB is placed on the exposed object stage 6 of the drawing unit 60 by the first transfer unit 50. The first drawing portion 6 is drawn on the first surface of the exposed substrate CB to draw a circuit pattern. The exposed substrate CB is terminated by the first transfer unit 50, and the first surface and the second surface are reversed by the first transfer unit 50, and are transported to the standby station 70. In the case where the first transport unit 50 does not have the reversing mechanism, the standby station 70 may have a mechanism for reversing the exposed substrate CB from the first surface to the second surface. 7106-9470-PF; Tungming 9 200846845' The exposure substrate CB is placed on the exposure target stage 68 of the second drawing unit 160 by the second transfer unit 150. The second drawing portion 16 is drawn on the second surface of the substrate CB to be drawn. The exposed substrate CB, which has been drawn by the circuit pattern, is transported to the carry-out station 180 by the second transport unit 15A. Thereafter, the exposed substrate cb is transported to the next process. In Fig. 1, in order to increase the throughput, the first exposure drawing device and the second exposure drawing device 1 are arranged in parallel. In the case where the device φ introduction cost is considered more than the throughput, the exposed substrate CB is returned from the standby station 7 to the first exposure drawing device 1 again, and the circuit pattern can be drawn on the second surface of the exposed substrate CB. . Further, the first exposure drawing device 1A and the second exposure drawing device 100 are basically the same except for the substrate input unit 2, the correction unit 3, and the symbol forming unit 40, and the first exposure drawing is as follows. The device 1 〇 is used as a representative to explain each configuration. <Configuration of Younger Exposure Drawing Device> Fig. 2 is a perspective view of the first exposure drawing device 1A. Fig. 3 is a front view (XZ plane) of the first exposure drawing device 10. Fig. 4 is a side view (γζ plane) of the first exposure drawing device 1〇. The third to fourth figures are drawn mainly on the substrate input unit 20, the correction unit 30, the symbol forming unit 4A, and the first-transport unit 50. The substrate input unit 20 includes a plurality of rotary rollers 2i and a drive motor (not shown) that rotates the rotary rollers 21. The rotary rollers 21 are provided in plural numbers in parallel, and at one end of the rotary roller 21, a chain gear or a pulley that receives a rotational force transmitted by a belt or a wire is attached. As means for transmitting the rotational force of the drive motor that rotates the rotary roller 21, in addition to the buckle 7106-9470-PF; Tungming 10 200846845, a gear or a pulley may be used in accordance with a method of transmitting a cylindrical magnet. In addition, the substrate input unit 2 has a transfer confirmation sensor SS1 and a carry-in confirmation sensor SS2 that confirms the loading and arrival of the exposed substrate CB. The positive portion has a calibration cylinder (air cy 1 inder) 31. The calibration plate 33 can be moved up and down. At the correction plate 33, the correction pin 35 is mounted. The substrate to be exposed CB is transported, and the rotation of the rotary roller 21 is stopped. The correction plate 33 is placed at the lower end. When the rotary roller 21 is stopped and the exposed substrate CB is corrected, the correction plate 33 is moved to the upper end. In Fig. 3, the correction plate 33 is moved to the upper end, and in Fig. 4, the correction plate is moved to the lower end. When the correction plate 33 is moved to the upper end, the correction pin 35 attached to the correction plate 33 is moved to a height abutting on the exposed substrate CB. The correction plate 33 has a horizontal movement driving portion 34 that moves the correction pin 35 in the horizontal direction, and the pin 35 is movable in the horizontal direction by about one. The substrate (3) to be exposed is, for example, a rectangular shape of 635 mm X 535 mm, and the correction pin 35 is disposed along the four sides of the substrate CB to be exposed. Capture the tiger. In the 卩40 system, on the exposed two plates corrected by the correction pin 35, the first side of the four sides of the CB forms the first aligning symbol tiger aM1, and the second side forms the second aligning symbol. The details of the symbol forming portion 4G include a hand portion 53 having a plurality of vacuum suction pads 51, and a hand 53 having an upper and lower drive portion 54. And a horizontal drive unit 55. The vacuum pad 51 is lowered from above and vacuumed with respect to the light substrate CB of the 7106-9470^PF; Tungniing n 200846845 formed with the alignment symbol AM, and the exposed substrate CB is lifted. Thereafter, the exposed substrate CB is moved to the exposure target table 68 of the first drawing portion 6A by the horizontal driving portion 55'. Further, the upper and lower drive unit 54 mounts the substrate CB to be exposed on the object to be exposed 68, and the vacuum suction of the vacuum pad 51 is released. At this time, the vacuum absorber of the exposure unit 68 operates, and the substrate CB is exposed. It is fixed to the exposed body stage 68. Further, the first conveying unit 5 has an inverted rotor 59 that reverses the first to the second surface of the substrate to be exposed cb. In the drawing, when the image is conveyed from the drawing unit 6 to the standby unit 70, the exposed substrate CB is reversed from the first surface to the second surface by the reverse rotor. <Correction and alignment of the exposed object Symbols Fig. 5 is a top view of the substrate to be exposed (10) placed at the substrate correction position of the substrate input portion 2A. As understood from Fig. 5, two correction locks are respectively provided for each side of the substrate CB to be exposed. 35. When the position is determined, the two calibration pins are preferably. In addition, the correction (4) is as shown by the arrow ,, and the four sides of the exposed substrate CB are drawn from the dotted line (four) μ (four) μ solid line (four) position. After the correction of the exposure substrate (3) is completed, the correction pin 35 returns to the position drawn by the broken line from the position where the solid line is drawn. Further, the document is placed in four places. The retracted position is moved to the peripheral position of the exposed substrate CB. The four symbol forming portions 40 are disposed on the sides of the exposed substrate CB, and one or a plurality of alignment symbols AM are exposed by short-wavelength light. The symbol forming unit 4. In order to increase the throughput, Exposure substrate CB @ first side and second side are simultaneously exposed to be preferred. Also, the alignment symbol AM is from 0. 5m "Wimm degree circular or ten 7106-9470-PF; Tungming 12 200846845 subtype In the fifth figure, four circular alignment symbols AM of 1 mm are formed on one side of the first surface. <Signature forming unit> Fig. 6 An illustration showing a symbol forming portion 40, wherein the sixth (a) is a top view, the sixth (b) is a side view, and the sixth (c) is a front view. The symbol forming portion 40 has a Forming the first side of the exposure substrate CB
第對位付號AM1的第一頭41ϋ以及在第二面形成第二對 位付號ΑΜ2的第二頭41D。 苐頭41U係藉由第一頭用氣缸42U沿著第一滑動| …上下移動…第二…藉由二:：: 42D沿著第—滑動導件44可上下移動。藉由共用第一頭 和第一頭41D的滑動導件，降低成本且提高兩個定位精度。 又’第一頭41ϋ及第二頭41D係被載置於滑動台45， /月動。45係藉由台用氣缸46可在水平方向沿著第二滑動 V件48私動。又’在第6圖中，雖然未圖示，但符號形成 部40係具有和第二滑動導件48正交的第三滑動導件，可 將滑動纟45帛與第二滑動導件48正交的方向移動。 符號形成部40係，被曝光基板CB被校正之後，在將 第-頭41U和第二頭41D在上下開啟的狀態下，接近被曝 光基板CB。又，符號形成部4〇到達形成第一及第二對位 符號AM1及AM2的所定位置之後，第一頭41ϋ和第二頭41d 關閉般接近被曝光基板CB，符號形成部4〇係從第一頭41ϋ 和第一頭41D照射短波長的光。形成第一及第二對位符號 AM 1及ΑΜ2之後，進行相反的動作，回到原來的位置。 7106-9470-PF;Tungming 13 200846845 在本實施例中，第一頭41U及第二頭41D係，具有開 關（on/off)控制容易的LED光源（LED1及LED2(參考第7 圖））’此LED光源發射波長為365nm的光。然而，作為第 一頭41U及第二頭41D的光源，藉由超高壓水銀燈等，將 短波長光藉由光纖導光也可。The first head 41ϋ of the first registration payout number AM1 and the second header 41D of the second alignment payout number 在2 are formed on the second side. The hoe 41U is moved up and down along the first slide by the first head cylinder 42U. The second... can be moved up and down along the first slide guide 44 by the second:::42D. By sharing the sliding guides of the first head and the first head 41D, the cost is reduced and the two positioning accuracy is improved. Further, the first head 41ϋ and the second head 41D are placed on the slide table 45, and the moon is moved. The 45 series is movable in the horizontal direction along the second sliding V piece 48 by the table cylinder 46. Further, in Fig. 6, although not shown, the symbol forming portion 40 has a third sliding guide orthogonal to the second sliding guide 48, and the sliding jaw 45帛 and the second sliding guide 48 can be positive. Move in the direction of the intersection. The symbol forming unit 40 is close to the exposed substrate CB in a state where the first head 41U and the second head 41D are opened up and down, after the exposed substrate CB is corrected. Further, after the symbol forming portion 4A reaches the predetermined position where the first and second alignment symbols AM1 and AM2 are formed, the first head 41ϋ and the second head 41d are closed as close to the exposed substrate CB, and the symbol forming portion 4 is from the first A 41 ϋ head and a first head 41D illuminate light of a short wavelength. After the first and second alignment symbols AM 1 and ΑΜ 2 are formed, the opposite operation is performed to return to the original position. 7106-9470-PF; Tungming 13 200846845 In the present embodiment, the first head 41U and the second head 41D are LED light sources (LED1 and LED2 (refer to FIG. 7)) which are easy to switch on/off. This LED light source emits light having a wavelength of 365 nm. However, as the light source of the first head 41U and the second head 41D, the short-wavelength light may be guided by the optical fiber by an ultrahigh pressure mercury lamp or the like.
又’在被曝光基板CB之中，不必在兩面將電路圖案綠 圖而僅在單一面將電路圖案繪圖的物件也被包含。在此類 的情形中，僅使第一頭41U藉由第一頭用氣缸42U做上下 移動般進行控制也可。又，第一頭41u或第二頭41d的光 源的光強度強的話，不必將第一頭41ϋ和第二頭41D接近 被曝光基板CB，不必設置第一滑動導件軻、第二頭用氣缸 42D及第二滑動導件48。 第7圖係為符號形成部4〇的第-頭41U及第二頭⑽ 的擴大圖。在第7圖’將第-頭41U的UD1及第二頭仙 的LED2的誤差擴大描繪。 對位符號AM係’成為繪圖部6()將電路圖案繪圖在被 曝光基板CB時的基準。因此，作為將電路圖案繪圖至被曝 光基板CB的第-面和第二面時的基準，假如第—面的第一 對位符號AM1和第二面的第二對位符號AM2不一致的話， 第：面的電路圖案和第二面的電路圖案不一致。因此，有 將第-頭4111或第二頭㈣精密製作的必萎。然而，即使 精密製作’些微的差異（誤差）將會產生。因此，在本實施 例’將些微的差異情報記憶在記憶部92(參考第9圖卜 第一頭4UJ的光源L腿和第二頭仙的光源led2係， 14 7106-9470-PF；Tungming 200846845 .在X方向輕ΔΧ的差異，在γ方向存的差異。又， 實際上，在測試用基板TES使用光源ledi和光源LED2, 形成第一及第二對位符號AM1及AM2，藉由顯微鏡等的量 測衣置，里測其差異。此差異情報係被記憶在記憶部9 2。 繪圖部60係在基於對位符號AM形成電路圖案之際，考慮 此差異情報而繪圖。 〈繪圖部的構成〉 φ 第8圖係表示繪圖部6 0的概略立體圖。繪圖部6 〇係 大致包括照明光學系統61、空間光調變部65、投影光學系 統67以及被曝光體台68。在本實施例中，也有為了可對 大面積的被曝光體CB做曝光而具備兩系統的照明光學系 統的構成的情形。繪圖部6 0的兩個第一照明光學系統6 ^ 一工 及6卜2係具有高壓水銀燈（未圖示）。 由反射光學元件62-1及反射光學元件62_2被分離成 八道的曝光光線IL係由全反射鏡63 — 】至全反射鏡63-8被 • 反射至Y方向。由全反射鏡63-1至全反射鏡63-8所反射 的曝光光線IL係入射於八個第二照明光學系統64-1至第 二照明光學系統64-8。 入射於第二照明光學系統64-1至第二照明光學系統 64-8的曝光光線IL係被成形為適當的光量及光束形狀， 而被照射至作為空間光調變元件的排成一列的八個DMD元 件65-1至MD元件65-8。DMD元件65-1至DMD元件65-8 係由被供給的圖像資料將曝光光線IL做空間調變。由 元件65-1至MD元件65-8所調變的光束係經由投影光學 7106-9470-PF;Tungming 15 200846845 • 系統67-1至投影光學系統67-8，作為所定的倍率之後， 被照射至被曝光基板CB〇DMD元件654係基於電路圖案， 例如，開關（on/off)驅動配置成1〇24χ128〇的陣列狀的 131 0720個的微型反射鏡Μ。 此繪圖部6〇係，具有三個對位檢測系統Απ、對位檢 測系統AC2以及對位檢測系統AC3(對位檢測系統AC3係未 圖不）。對位檢測系統AC係檢測出形成於被曝光基板CB的 • 對位符號AM。繪圖部6〇係從對位符號AM的檢測結果，基 於電路圖案的信號，補正微型反射鏡M的開關驅動。 繪圖部60係在投影光學系統67的z方向下侧，具備 支持第一照明光學系統61、第二照明光學系統64以及投 影光學系統67等的框體69。在框體69上配置著一對導軌， 在這些導軌上搭載著被曝光體台68。此被曝光體台68係 藉由，例如，步進馬達等被驅動。藉此，被曝光體台68係 沿著一對導執，在作為這些的長度方向的γ方向，對於投 • 影光學系統67相對移動。在被曝光體台68上設置著從基 板杈正位置被搬送的被曝光基板CB，此被曝光基板在 被曝光體台68上由真空吸附而被固定。被曝光體台68係 被構成為，又可於X方向移動，又可移動到投影光學系統 67的焦點位置般可在z方向移動。 緣圖部60係’在被曝光基板cb繪圖之際，使用高壓 水銀燈的光源之外’使用短波長的LED光源或短波長的雷 射光也可。又’代替由鏡子及透鏡構成的第一照明光學系 統δ 1及第二照明光學系統64，使用光纖也可。 7106-9470-pp.Tungming 16 200846845 . 〈第一曝光繪圖裝置的繪圖用的方塊構成〉 第9圖係為第一曝光繪圖’裝置1 〇的主要構成的方塊 圖。使用第9圖，特別對有關基於對位符號A·，在被曝光 基板CB繪圖電路圖案做說明。 主控制部90係和基板投入部2〇、校正部3〇、符號形 成部40、第一搬送部50、以及第一繪圖部6〇連接，相互 進行信號的交換。Further, among the substrates to be exposed CB, it is not necessary to include the circuit pattern green on both sides and the object in which the circuit pattern is drawn only on a single surface. In such a case, only the first head 41U may be controlled by the first head cylinder 42U moving up and down. Further, if the light intensity of the light source of the first head 41u or the second head 41d is strong, it is not necessary to bring the first head 41ϋ and the second head 41D close to the exposed substrate CB, and it is not necessary to provide the first sliding guide 轲 and the second head cylinder. 42D and second sliding guide 48. Fig. 7 is an enlarged view of the first head 41U and the second head (10) of the symbol forming portion 4A. In Fig. 7, the error of the UD1 of the first head 41U and the LED 2 of the second head is enlarged. The alignment symbol AM system ' serves as a reference when the drawing portion 6 () draws a circuit pattern on the substrate CB to be exposed. Therefore, as a reference for drawing the circuit pattern to the first surface and the second surface of the exposed substrate CB, if the first alignment symbol AM1 of the first surface and the second alignment symbol AM2 of the second surface are inconsistent, The circuit pattern of the surface is inconsistent with the circuit pattern of the second surface. Therefore, there is a need to precisely make the first head 4111 or the second head (four). However, even the precise production of 'slight differences (errors) will occur. Therefore, in the present embodiment, the slight difference information is memorized in the memory unit 92 (refer to the light source L leg of the first head 4UJ and the light source led2 of the second head, 14 7106-9470-PF; Tungming 200846845; The difference in light ΔΧ in the X direction, the difference in the γ direction. In fact, in the test substrate TES, the light source ledi and the light source LED2 are used to form the first and second alignment symbols AM1 and AM2, by means of a microscope or the like. The measurement is measured and the difference is measured. The difference information is stored in the memory unit 92. The drawing unit 60 draws a circuit pattern based on the alignment symbol AM, and draws the difference information. Configuration φ Fig. 8 is a schematic perspective view showing the drawing unit 60. The drawing unit 6 includes substantially the illumination optical system 61, the spatial light modulation unit 65, the projection optical system 67, and the exposure target stage 68. In this embodiment In addition, there is a case where a two-system illumination optical system is provided for exposing a large-area exposure body CB. The two first illumination optical systems 6 of the drawing unit 60 have a High pressure mercury lamp (not shown) The exposure light IL separated into eight by the reflective optical element 62-1 and the reflective optical element 62_2 is reflected from the total reflection mirror 63-] to the total reflection mirror 63-8 to the Y direction. From the total reflection mirror 63-1 to The exposure light IL reflected by the total reflection mirror 63-8 is incident on the eight second illumination optical systems 64-1 to the second illumination optical system 64-8. Incident to the second illumination optical system 64-1 to the second illumination optical The exposure light IL of the system 64-8 is shaped into an appropriate amount of light and a beam shape, and is irradiated to eight DMD elements 65-1 to 65-8 which are arranged in a line as spatial light modulation elements. DMD elements The 65-1 to DMD element 65-8 spatially modulates the exposure light IL from the supplied image data. The beam modulated by the element 65-1 to the MD element 65-8 is via projection optics 7106-9470- PF; Tungming 15 200846845 • System 67-1 to projection optical system 67-8, after a predetermined magnification, is irradiated onto the exposed substrate CB〇DMD element 654 based on a circuit pattern, for example, an on/off drive configuration Array of 131 0720 miniature mirrors in an array of 1〇24χ128〇. This drawing section The 〇 system has three alignment detection systems Απ, a registration detection system AC2, and a registration detection system AC3 (the alignment detection system AC3 is not shown). The alignment detection system AC detects the formation on the exposed substrate CB. The alignment unit AM. The drawing unit 6 corrects the switching drive of the micro mirror M based on the detection result of the alignment symbol AM based on the signal of the circuit pattern. The drawing unit 60 is on the lower side in the z direction of the projection optical system 67. A housing 69 that supports the first illumination optical system 61, the second illumination optical system 64, the projection optical system 67, and the like is provided. A pair of guide rails are disposed on the frame 69, and the exposed object table 68 is mounted on the guide rails. The exposed body stage 68 is driven by, for example, a stepping motor or the like. Thereby, the exposure target stage 68 moves relative to the projection optical system 67 in the γ direction as the longitudinal direction along the pair of guides. The substrate to be exposed 68 is provided with an exposed substrate CB that is transported from the substrate positive position, and the exposed substrate is fixed by vacuum suction on the exposed body 68. The exposed body table 68 is configured to be movable in the X direction and moved to the z-direction as it is to the focus position of the projection optical system 67. The edge portion 60 may be a short-wavelength LED light source or a short-wavelength laser light other than the light source of the high-pressure mercury lamp when drawing on the exposed substrate cb. Further, instead of the first illumination optical system δ 1 and the second illumination optical system 64 composed of a mirror and a lens, an optical fiber may be used. 7106-9470-pp.Tungming 16 200846845 . <Block configuration for drawing of the first exposure drawing device> Fig. 9 is a block diagram showing the main configuration of the first exposure drawing device 1 . The drawing of the circuit pattern on the substrate CB to be exposed is explained with reference to Fig. 9, in particular, based on the alignment symbol A·. The main control unit 90 is connected to the substrate input unit 2, the correction unit 3A, the symbol forming unit 40, the first transfer unit 50, and the first drawing unit 6A, and exchanges signals with each other.
• 主控制部90係，具有預先記憶形成於測試用基板TES 的第一及第二對位符號AM1及AM2的差異情報的對位符號 差異記憶部92，且具有記憶將電路圖案繪圖用的繪圖資料 的繪圖資料記憶部93。主控制部90係，更從對位檢測系 統AC得到各被曝光基板CB的對位符號AM的位置情報。演 算部91係，基於對位符號am的位置情報、第一及第二對 位符號AM1及AM2的差異情報、以及繪圖.資料，驅動DM]) 元件65的微型反射鏡μ，在載置於被曝光體台68的被曝 ® 光基板CB繪圖。又，以第一面的對位符號基準繪圖的話， 演算部91係不使用第一及第二對位符號AM1及αμ2的差異 情報，基於對位符號AM的位置情報及繪圖資料，驅動MD 元件65的各微型反射鏡|第一及第二對位符號ami及am2 係在第二面中被使用。 〈第一曝光繪圖裝置及第二曝光繪圖裝置的動作〉 第10圖係為第一曝光繪圖裝置1〇的動作的流程圖。 在步驟Rl 1中，感測器SS1係確認被曝光基板CB從外 部被搬入至基板投入部2〇。 7106-9470-PF；Tungming 17 200846845The main control unit 90 has a registration symbol difference storage unit 92 that preliminarily stores difference information of the first and second alignment symbols AM1 and AM2 formed on the test substrate TES, and has a drawing for memory circuit pattern drawing. The drawing data storage unit 93 of the data. The main control unit 90 further obtains positional information of the alignment symbol AM of each of the exposed substrates CB from the registration detecting system AC. The calculation unit 91 drives the DM]) micro-mirror μ of the element 65 based on the positional information of the alignment symbol am, the difference information between the first and second alignment symbols AM1 and AM2, and the drawing data. The exposed light substrate CB of the exposed body stage 68 is drawn. Further, when the drawing is based on the reference symbol of the first surface, the calculation unit 91 does not use the difference information between the first and second alignment symbols AM1 and αμ2, and drives the MD element based on the position information and the drawing data of the alignment symbol AM. Each of the micro mirrors 65 of the first and second alignment symbols ami and am2 are used in the second plane. <Operation of First Exposure Drawing Device and Second Exposure Drawing Device> Fig. 10 is a flowchart showing the operation of the first exposure drawing device 1A. In step R11, the sensor SS1 confirms that the exposed substrate CB is carried from the outside to the substrate input portion 2A. 7106-9470-PF; Tungming 17 200846845
” 在〃驟R12 + ’方疋轉旋轉滾子21，搬送被曝光基板CB 至基板投入部2 0的基板校正位置。 在步驟R13中，感測器SS2確認基板是否到達至基板 校正位置。 在^驟R14中，旋轉滾子21的旋轉停止（在步驟 中感測器SS2確認到基板到達至基板校正位置時）。 其次，在步驟R15中，校正部3〇的校正銷35藉由校 .正用氣缸31上升，校正銷35係抵接於被曝光基板⑶的四 邊的外周，使被曝光基板CB移動至校正位置。 在步驟R16中，符號形成部4〇係從待機位置沿著被曝 光基板CB的外周在水平方向移動，移動至對位符號龍的 形成位置。 在步驟R17中’符號形成部4〇的第一頭41ϋ及第二頭 41D係朝接近被曝光基板CB的方向做上下移動，移動至形 成對位符號AM的最適當位置。 ►在步驟R18中，光源LED1及光源LED2點燈，在被曝 光基板CB的第-面及第二面同時形成第一及第二對位符 號 AM1 及 AM2。 在步驟R19中，上下頭41回到原來的位置，此兩個頭 的間隔變寬，符號形成部40回到待機位置。 在步驟R20 +，第一搬送部5〇冑空吸著被曝光基板 CB，搬送到被曝光體台68，解除被曝光基板的真空吸 著。又，被曝光體台68係真空吸著被曝光基板CB。 在步驟R21中，對位檢測系統AC係觀察被曝光基板 7106-9470-PF;Tungming 18 200846845The step R12 + 'turns the rotating roller 21 to transport the substrate to be exposed CB to the substrate correction position of the substrate input portion 20. In step R13, the sensor SS2 confirms whether or not the substrate has reached the substrate correction position. In step R14, the rotation of the rotating roller 21 is stopped (in the step, the sensor SS2 confirms that the substrate reaches the substrate correction position). Next, in step R15, the correction pin 35 of the correcting portion 3 is corrected by the calibration. The cylinder 31 is raised, and the correction pin 35 abuts against the outer circumference of the four sides of the substrate (3) to be exposed, and the exposed substrate CB is moved to the correction position. In step R16, the symbol forming portion 4 is exposed from the standby position. The outer circumference of the substrate CB moves in the horizontal direction and moves to the formation position of the alignment symbol dragon. In step R17, the first head 41ϋ and the second head 41D of the symbol forming portion 4〇 are made up to the direction close to the substrate CB to be exposed. Moving, moving to the most appropriate position to form the alignment symbol AM. ► In step R18, the light source LED1 and the light source LED2 are lit, and the first and second alignments are simultaneously formed on the first side and the second side of the exposed substrate CB. Symbols AM1 and AM2 In step R19, the upper and lower heads 41 return to the original position, the interval between the two heads is widened, and the symbol forming portion 40 returns to the standby position. In step R20+, the first conveying portion 5 is sucked and exposed. The substrate CB is transported to the exposure target table 68 to release the vacuum suction of the substrate to be exposed. Further, the exposed substrate 68 vacuum-absorbs the exposed substrate CB. In step R21, the alignment detection system AC is exposed. Substrate 7106-9470-PF; Tungming 18 200846845
' CB的第一面的第一對位符號AMI。又，基於被曝光基板CB 的第一對位符號AMI ’在被曝光基板CB將電路圖案藉由D肋 元件65繪圖。 在步驟R22中，藉由第一搬送部5〇將被曝光基板CB 移動至待機台70，第一搬送部50的反轉轉子59或待機台 70係將被曝光基板CB反轉。藉此，被曝光基板CB的第二 面的繪圖準備完成。 _ 在步驟R23中’第二搬送部150吸著被曝光基板cb， 搬送至第二被曝光體台68，解除被曝光基板CB的真空吸 著。又’第二被曝光體台68係真空吸著被曝光基板CB。 在步驟R24中，第二繪圖部1的對位檢測系統Ac係'The first alignment symbol AMI of the first side of the CB. Further, the circuit pattern is drawn by the D rib element 65 on the substrate to be exposed CB based on the first alignment symbol AMI ' of the substrate CB to be exposed. In step R22, the exposed substrate CB is moved to the standby station 70 by the first transport unit 5, and the reverse rotor 59 or the standby unit 70 of the first transport unit 50 reverses the exposed substrate CB. Thereby, the drawing preparation of the second surface of the exposed substrate CB is completed. In the step R23, the second conveying unit 150 sucks the substrate to be exposed cb, and transports it to the second object to be exposed 68, thereby releasing the vacuum suction of the substrate CB to be exposed. Further, the second object to be exposed 68 vacuum-absorbs the substrate CB to be exposed. In step R24, the alignment detecting system Ac of the second drawing unit 1 is
觀察第二面的第二對位符號AM2。又，基於被曝光基板CB 的第二對位符號AM2以及第一對位符號AM1和第二對位符 遽ΔΜ2的差異位置，在被曝光基板CB將電路圖案藉由繪圖 部160繪圖。在第二面的電路圖案的繪圖之際，由於第一 _ 對位符號ami和第二對位符號AM2的差異位置被考慮，第 一面的電路圖案和第二面的電路圖案係正確地對應而被繪 圖。 在步驟R25中，第二搬送部15〇係吸著第一面及第二 面的繪圖完成的被曝光基板CB，搬送至搬出台180。 在本實施例中，雖然校正部30及符號形成部40被設 置在不同於被曝光台68的位置，但設置在被曝光體台68 的周圍也可。這樣的話，可使第一曝光繪圖裝置的設置 面積變小。然而，將丟失被曝光基板CB的待機位置，而有 7106-9470-PF;Tungming 19 200846845 可能降低生產量。 號二ί本實施例’雖然設置形成第-面的第-對位符 〜 弟-面的第二對位符號繼的符號形成部40,但 也可分別設置僅形成第一對位符號韻的符號形成部和僅 形成第二對位符號AM2的符號形成部。 【圖式簡單說明】 • 第1圖係為配置第一曝光繪圖裝置10及第二曝光繪圖 裝置100的上視圖； 第2圖係為第一曝光繪圖裝置1〇的立體圖； 第3圖係為第一曝光繪圖裝置的正面圖（^面）； 第4圖係為第一曝光繪圖裝置1 〇的側面圖（γζ面）； 第5圖係為投入至基板投入部2()的基板校正位置的被 曝光基板CB的上視圖； 第δ圖係表示一個符號形成部4〇的圖示，其中第6(a) 藝圖為上視圖，第6(b)圖為側視圖，第6(c)圖為正視圖； 第7(a)圖至第7(b)圖係為符號形成部40的第一頭41U 及苐二頭41D的擴大圖； 第8圖係表示繪圖部6〇的概略立體圖； 第9圖係為第一曝光繪圖裝置1 g的主要構成的方塊 圖；以及 第10圖為第一曝光繪圖裝置1〇的動作的流程圖。 【主要元件符號說明】 7l〇6-9470-PF;Tungining 20 200846845 10〜第一曝光繪圖裝置；20〜基板投入部；Observe the second alignment symbol AM2 of the second side. Further, based on the difference position between the second alignment symbol AM2 of the substrate to be exposed CB and the first alignment symbol AM1 and the second alignment symbol 遽ΔΜ2, the circuit pattern is drawn by the drawing unit 160 on the substrate to be exposed CB. At the drawing of the circuit pattern of the second side, since the difference position of the first _ registration symbol ami and the second alignment symbol AM2 is considered, the circuit pattern of the first surface and the circuit pattern of the second surface correspond correctly And being drawn. In step R25, the second transport unit 15 sucks the exposed substrate CB on the first surface and the second surface, and transports it to the carry-out table 180. In the present embodiment, the correction portion 30 and the symbol forming portion 40 are provided at positions different from the exposure stage 68, but may be provided around the exposure target table 68. In this case, the installation area of the first exposure drawing device can be made small. However, the standby position of the exposed substrate CB will be lost, and there is 7106-9470-PF; Tungming 19 200846845 may reduce the throughput. The second embodiment of the present invention is configured to form a second alignment symbol of the first-to-paragraph-to-face-to-face symbol forming portion 40, but it is also possible to separately provide only the first alignment symbol. The symbol forming portion and the symbol forming portion forming only the second alignment symbol AM2. BRIEF DESCRIPTION OF THE DRAWINGS: Fig. 1 is a top view of a first exposure drawing device 10 and a second exposure drawing device 100; Fig. 2 is a perspective view of a first exposure drawing device 1; Front view of the first exposure drawing device (^ face); Fig. 4 is a side view (γζ face) of the first exposure drawing device 1; Fig. 5 is a substrate correction position input to the substrate input portion 2 () The upper view of the exposed substrate CB; the δth figure shows an illustration of a symbol forming portion 4〇, wherein the sixth (a) art is a top view, and the sixth (b) is a side view, a sixth (c) Fig. 7(a) to Fig. 7(b) are enlarged views of the first head 41U and the second head 41D of the symbol forming portion 40; Fig. 8 is a view showing the outline of the drawing unit 6〇 Fig. 9 is a block diagram showing the main configuration of the first exposure drawing device 1g; and Fig. 10 is a flow chart showing the operation of the first exposure drawing device 1A. [Main component symbol description] 7l〇6-9470-PF; Tungining 20 200846845 10~first exposure drawing device; 20~ substrate input portion;
30~校正部； 3 3〜校正板； 40〜符號形成部； 41D〜第二頭； 51〜真空墊； 54〜上下驅動部； 60〜第一繪圖部； 62〜全反射鏡； 65〜DMD元件； 70〜待機台； 150〜第二搬送部； AC〜對位檢測系統； CB〜被曝光基板； SS2〜搬入確認感測器。 31〜校正用氣缸； 3 5〜校正銷； 41U〜第一頭； 50〜第一搬送部； 53〜手部； 5 5〜水平驅動部； 61〜第一照明光學系統； 64〜第二照明光學系統； 68〜被曝光體台； 100〜第二曝光繪圖裝置； 160〜第二繪圖部； AM〜對位符號； SS1〜搬送確認感測器；30~correction section; 3 3~correction plate; 40~symbol formation section; 41D~second head; 51~vacuum pad; 54~upper and lower drive section; 60~first drawing section; 62~total mirror; 65~DMD Component; 70 to standby station; 150 to second transfer unit; AC to alignment detection system; CB to exposed substrate; SS2 to carry in confirmation sensor. 31~calibration cylinder; 3 5~ calibration pin; 41U~ first head; 50~ first transfer part; 53~ hand part; 5 5~ horizontal drive part; 61~ first illumination optical system; 64~ second illumination Optical system; 68~ exposed body table; 100~second exposure drawing device; 160~second drawing part; AM~paragraph symbol; SS1~transfer confirmation sensor;
7106-9470-PF;Tungming 217106-9470-PF; Tungming 21