200837412 九、發明說明： 【發明所屬之技術領域】 • 本發明係關於一種應用於超高速電子電路板及相關介面連 結’可搭配不同電接頭，及適用於現有高速路由器及交換器中介 面積體電路之光信號互連，以方便高速ic匯流排訊號連結之高速 迷你型光信號排線1C。 【先前技術】 由於高速寬頻需求的急遽成長，為避免超寬頻訊號在高密度 Γ: 銅導線間傳輸干擾問題，在設計上已日趨困難，但現有之光信號 互連裝置複雜度高，製造成本較現有之電子產品高出許多，因此 一直無法有效應用，一般短距離高速光信號連接多屬於點對點之 光介面連接方式，要作出超小體積之排線連接實屬不易，尤其LD Array及PINArray (檢光放大器陣列）之光纖封裝更是困難。 有鑑於此，本發明提出之超小體積、低成本、易量產製造且 使用間便之南速光5虎排線新型產品，主要是利用Hole與垂 直共振腔面射型雷射陣列（Vertical cavity surface emitting Laser 〇 Array，VCSEL_Array)及檢光放大器陣列（PINArray)結合而成 之Fiber Hole Array，解決陣列式晶圓對光纖封裝之技術瓶頸，同 時大大提高量產良率及降低製造成本，使得此高速光信號排線得 以簡便方式大量生產，對於纖核(Fiber c〇re)極小之單模光纖亦可 暢行無阻，此高速光信號排線可預防此超高速電子電路板及相關 介面並行傳倾造叙相干擾及尺寸過小時魏高_訊號在電 路板上傳送時阻抗(Impedance)不匹配所產生之雜訊輻射干擾等問 題，並可使咼速訊號傳輸時不受其他高頻電路板上之元件干擾。 光通訊最初只用在長距轉輸，但現在已有光纖將伺服器連 5 200837412 結^只有幾米距離之路由器和交換器上之應用，在室内主機互連 之^下步為晶片之間的互連，期望光電元件的應用就如同忙 •晶片在電路板上—樣㈣，但t置光學組件比裝置IC晶片要 ，難許多’因為當裝置光電子元件時騎料介#差異大，不易整 二光學波導和其他光學傳輪路徑定位必馳正至_以内，目 前尚需人為操作不易量產，成本相對提高許多。曾經提出相關產 品原型之公司如l)Fuji X議製作之85Qnm頻帶VCSEL原型， 2)NEC製作之1300nm頻帶似既原型，皆將所需光電子元件一 起整合在BGA難·板上，3)OKI㈣光學互連祕板原型， 4)·ΝΤΤ提出配有光學輸入/輸出介面之1(：，具有和裝置電子組件中 所使用之相同表面裝置之產品，5)美國PeregrineSemic〇ndu伽公 司lOGbps光學收發機建於藍寶石基板上之模組，上述國外大廠所 ，出之產品’在製作程序上極為_且成本太高，同時缺乏 彈性，因此一直無法有效應用。 由此可見，上述習用方式仍有諸多缺失，實非一良善之設計， 而亟待加以改良。 y 本㈣明人餅上述方式麟生的各顿點，乃亟思加 以改良創新’並歸年苦錄t旨潛心研究後，終於成功研發完成 本件高速迷你型光信號排線IC，以達成一低成本且使用簡便之高 速超迷你體積1C光連接排線’解決裝置複雜度高且製作程序極為 困難之高成本問題，讓光電元件的應舰如同Ic晶#在電路板上 使用一樣簡易。 【發明目的】 本發明之主要目的係在於提供一種低成本且使用簡便之高速 6 200837412 迷你型光信號排線ic。 本發明之次要目的錄於提供—種謂決裝置健度高，且 .=程序極為_之高成本問題，讓光電元件的應用就如同IC晶 电路板上使用-樣簡易的高速迷你型光信號排線ic。 本發明之又-目的係在於提供一種方便超高速電子電路板及 相關介面連結使用’且可解決高密度佈_路板上不易佈放超高 速傳輸線之限制。 、本發明之再一目的係在於提供一種可用於掀蓋手機之旋轉(取 代現有f子電路職板)及筆記型《等小尺寸高速光信號排線之 〇 用。 【發明内容】 為達成上述目的，本發明所提供之高速迷你型光信號排線 ic ’係利用光纖置入孔陣列（Fiber H〇ie Array)，解決陣列式晶 圓對光纖封裝之技術瓶頸，以提高量產良率及降低製造成本，使 得此光信號互連排線1C得以簡便方式大量生產；其主要包含： 具有光纖置入孔(Fiber Hole)之垂直共振腔面射型雷射陣列 (VCSELArray)； 〇 具有光纖置入孔(FiberHole)之檢光放大器陣列(PIN Array); 以及 大直徑光核(Core)之多模光纖。 【實施方式】 請參閱圖一，取陣列中其中一個晶圓來說明，本發明所提供 之高速迷你型光訊號排線1C，包括： 多模光纖，多模光纖之兩端分別置入光纖置入孔1 ; 具有光纖置入孔1之垂直共振腔面射型雷射陣列（VCSEL Array ) 2，該垂直共振腔面射型雷射陣列2之光源可為LED或其他 7 200837412 面射型雷射； 具有光纖置入孔1之檢光放大器陣列(PINArray)3,該檢光放 大器陣列之材質可為矽（Si )晶圓；以及 大直徑光核(Core)之多模光纖4。 其中具有光纖置入孔1之垂直共振腔面射型雷射陣列2及具 有光纖置入孔1之檢光放大器陣列3，在VCSEL發光區/PIN收光 區5 ’均各自以微機電系統SyMemS， MEMS)技術製作出直徑ι〇〇μιη高3〇μιη及直徑 130μπι 高 (80〜ΙΟΟμιη)同心圓柱的光纖置入孔丨，只需以機器量產作固定式光 插入之對焦封裝即可以膠固定連接作一體成型之封裝，如此可大 幅降低佔主要成本之封裝費。200837412 IX. INSTRUCTIONS: [Technical Fields of the Invention] The present invention relates to an ultra-high-speed electronic circuit board and related interface connection, which can be used with different electrical connectors, and is applicable to existing high-speed routers and switches. The optical signals are interconnected to facilitate the high-speed mini optical signal cable 1C connected by the high-speed ic bus signal. [Prior Art] Due to the rapid growth of high-speed broadband demand, in order to avoid the problem of transmission of ultra-wideband signals in high-density Γ: copper wires, the design has become more and more difficult, but the existing optical signal interconnection device has high complexity and manufacturing cost. It is much higher than the existing electronic products, so it has not been effectively applied. Generally, short-distance high-speed optical signal connections are mostly point-to-point optical interface connections. It is not easy to make ultra-small cable connections, especially LD Array and PINArray ( Optical fiber packaging for optical amplifier arrays is even more difficult. In view of this, the present invention proposes an ultra-small-volume, low-cost, mass-produced and easy-to-manufacture, and uses a new product of the South Speed Light 5 Tiger Line, mainly using a Hole and a vertical cavity surface-emitting laser array (Vertical). The Fiber Hole Array, which combines the cavity surface emitting laser (Array Array, VCSEL_Array) and the SPECT array, solves the technical bottleneck of the array wafer to the optical package, and greatly improves the mass production yield and reduces the manufacturing cost. The high-speed optical signal cable can be mass-produced in a simple manner, and the single-mode fiber of the fiber core can be unimpeded. The high-speed optical signal cable can prevent the ultra-high-speed electronic circuit board and related interfaces from being transmitted in parallel. Destructive phase interference and size is too small Wei Gao _ signal on the board when transmitting impedance (Impedance) mismatch caused by noise radiation interference and other issues, and can make idle signal transmission without other high frequency circuit board Component interference. Optical communication was originally only used for long-distance transfer, but now there is a fiber-optic server connected to the router and the switch on the switch, which is only a few meters away. Interconnection, it is expected that the application of the optoelectronic component is as busy as the wafer on the circuit board (4), but the t-distribution optical component is more difficult than the device IC chip, because it is difficult to make a large difference in the device optoelectronic components. The positioning of the two optical waveguides and other optical transmission paths must be within _, and it is still difficult to mass-produce for human operation, and the cost is relatively high. The company that has proposed the prototype of the product, such as l) prototype of the 85Qnm band VCSEL made by Fuji X, 2) the 1300nm band produced by NEC seems to be the prototype, the required optoelectronic components are integrated together on the BGA hard board, 3) OKI (four) optics Interconnected prototype prototype, 4)·Proposed to have optical input/output interface 1 (:, with the same surface device used in the device electronic components, 5) US PeregrineSemic〇ndu gamma lOGbps optical transceiver The modules built on the sapphire substrate, the products of the above-mentioned foreign manufacturers, are extremely expensive in the production process, and the cost is too high, so they are not effective. It can be seen that there are still many shortcomings in the above-mentioned methods of use, which is not a good design, but needs to be improved. y This (four) Ming cakes in the above-mentioned way Lin Sheng's various points, is the thought of improving and innovating 'and returning to the years of hard work t research, finally successfully developed this high-speed mini optical signal cable IC to achieve a The low-cost and easy-to-use high-speed ultra-mini size 1C optical connection cable' solves the high cost of high complexity and extremely difficult production process, making the optoelectronic component's ship as easy to use as Ic Crystal# on the board. [Object of the Invention] The main object of the present invention is to provide a high-speed 6 200837412 mini optical signal cable ic which is low in cost and easy to use. The secondary object of the present invention is recorded in the provision of a high-quality mini-light, and the high cost of the program is extremely high, and the application of the optoelectronic component is as simple as the high-speed mini light on the IC crystal circuit board. Signal line ic. Still another object of the present invention is to provide a convenient ultra-high-speed electronic circuit board and associated interface for use, and to solve the limitation that a high-density cloth board is difficult to deploy an ultra-high-speed transmission line. A further object of the present invention is to provide a device that can be used for the rotation of a flip phone (replaces the existing f sub-circuit board) and the notebook type "such as a small-sized high-speed optical signal cable. SUMMARY OF THE INVENTION In order to achieve the above object, the high-speed mini optical signal cable ic ' provided by the present invention utilizes a fiber optic array to solve the technical bottleneck of the array wafer to the optical fiber package. In order to improve the mass production yield and reduce the manufacturing cost, the optical signal interconnection cable 1C can be mass-produced in a simple manner; the main components include: a vertical cavity surface-emitting laser array having a fiber hole (Fiber Hole) VCSELArray); PIN PIN Array with FiberHole; and Multimode fiber with large diameter photo core (Core). [Embodiment] Referring to FIG. 1 , one of the wafers in the array is taken to illustrate that the high-speed mini optical signal cable 1C provided by the present invention includes: a multimode optical fiber, and two ends of the multimode optical fiber are respectively placed in the optical fiber. Inlet hole 1; a vertical cavity surface type laser array (VCSEL Array) 2 having an optical fiber insertion hole 1 , the light source of the vertical cavity surface type laser array 2 can be an LED or other 7 200837412 surface type lightning A PINArray 3 having a fiber insertion hole 1 , the material of which may be a 矽 (Si ) wafer; and a multi-mode optical fiber 4 of a large diameter photo core (Core). The vertical cavity surface-emitting laser array 2 having the fiber insertion hole 1 and the light-detecting amplifier array 3 having the fiber insertion hole 1 are respectively in the VCSEL light-emitting area/PIN light-receiving area 5' each having the MEMS SyMemS , MEMS) technology to produce a fiber diameter of ι〇〇μιη high 3〇μιη and diameter 130μπι high (80~ΙΟΟμιη) concentric cylinder into the hole, only need to be mass-produced for fixed optical insertion of the focus package can be glued The fixed connection is a one-piece package, which can significantly reduce the packaging cost at the main cost.
U 另外，請參閱圖二，大直徑光核(Core)之多模光纖4主要用來 連接垂直共振腔面射型雷射陣列2及檢光放大器陣列3,由於所連 接之距離極短(小於lm)，無光傳輸損失及紐(dispersi〇n)問題， 對光功率的強度要求不高，為求降低光定位聚焦封裝之成本，可 加大多模光纖4之光核直徑，以增大其光輕合餘裕(T〇lerance)，配 合連，發散角極小之VCSEL光源及刚之封裝，只f以機器作量 產固定式之對焦封裝。請參關三，再者，垂直共振腔面射型雷 射陣列2之電接腳可直接連接至雷射驅動器，而檢光放大器陣列3 之電接腳亦了直接連接後級放大;此電接腳可依不同頻率更換 不同型式之電接頭介面，由於本發明所提供之高速迷侧光訊赛 排線1C對外連結均為電的接頭，對板之製造業者而言使用十u 分^更，光纖長度的調整亦十分方便，成本更低於電的高頻 跳線，另外，本發明所提供之高速迷你型光訊號排線〖，亦可以 因應夕個通道(Channel)數佩排_料 似’雖積小’且不易互相干擾，彈性大；本發明所 8 200837412 你型光訊號排線1C，同時亦可直接焊著於IC外殼7之pin腳，或 與電路板6接合成光信號互連排線1(：產品，見圖四所示；再 者、’多模光纖4可任意繞圈，幾乎無功率損失之虞，故確實可以 成為體積極小，低成本，易組裝，不受電磁干擾，且不需額外接 地佈線、阻抗匹及避免帛音等措施之小尺寸超高速光信號互連 產品。 【特點及功效】 本發明所提供之高速迷你型絲麟線IG，與其他習用技術 相互比較時，更具備下列優點： Ο u 1、本發明之光電元件的細就如同IC晶片在電路板上使用一 樣簡易。 2本發明製作成本極低’體積小，方便做成光連接排線IC。 3、 本發明使用之不同電接頭，可適用於現有高速路由器及交 換器中介面積體電路之光信號互連。 4、 本發明製作良品機率高’裂置簡便，極富彈性(多模光纖可 任意繞圈，幾乎無功率損失之虞），可任意轉向，完全沒有 高速訊號前時叙相差(phase勝_㈣及輕射衰 減專問題。 惟細=乃針對本發明之—可行實施例進行具體說明， W貫β例亚非用以限制本發明之專利範圍，凡 藝精^所為之等效實施或變更，均應包含於本案之專利範圍中。 僂絲^所述，本案不僅於技術思想上確屬觸，並具備習用之 法定笋明St上,多項功效’已充分符合新穎生及進步性之U In addition, please refer to Figure 2, the large-diameter photonic core (Core) multimode fiber 4 is mainly used to connect the vertical cavity surface-emitting laser array 2 and the optical amplifier array 3, because the connected distance is extremely short (less than Lm), no optical transmission loss and dispersi〇n problem, the intensity of optical power is not high, in order to reduce the cost of optical positioning and focusing package, the optical core diameter of multimode fiber 4 can be increased to increase its Light and light balance (T〇lerance), coupled with a very small divergence angle VCSEL light source and just the package, only f machine to mass production fixed focus package. Please refer to the third. Furthermore, the electrical pins of the vertical cavity surface type laser array 2 can be directly connected to the laser driver, and the electrical pins of the optical amplifier array 3 are directly connected to the rear stage for amplification; The pin can be replaced with different types of electrical connector interfaces according to different frequencies. Since the high-speed side optical optical cable 1C provided by the present invention is an electrical connector, the manufacturer of the board uses ten points. The adjustment of the length of the optical fiber is also very convenient, and the cost is lower than the high frequency jumper of the electric power. In addition, the high-speed mini optical signal cable provided by the present invention can also be used for the number of channels in the evening. It seems that 'though small' and it is not easy to interfere with each other, and the elasticity is large; the invention 8 200837412, your type optical signal cable 1C, can also be directly soldered to the pin of the IC casing 7, or joined to the circuit board 6 to form an optical signal. Interconnect cable 1 (: product, as shown in Figure 4; in addition, 'multimode fiber 4 can be arbitrarily wound, almost no power loss, so it can be positive, low cost, easy to assemble, no Exposed to electromagnetic interference, and no additional ground wiring, Small-size ultra-high-speed optical signal interconnection products that resists horses and measures such as snoring. [Features and Effects] The high-speed mini-Silin IG provided by the present invention has the following advantages when compared with other conventional technologies: Ο u 1. The fineness of the photovoltaic element of the present invention is as simple as the use of the IC chip on the circuit board. 2. The invention is extremely inexpensive to manufacture and has a small volume, which is convenient for making an optical connection cable IC. 3. Different use of the present invention The electrical connector can be applied to the optical signal interconnection of the existing high-speed router and the intermediate area circuit of the switch. 4. The invention has high probability of making good products, 'cracking is simple and flexible, and the multi-mode fiber can be arbitrarily wound, almost no power. Loss 虞), can be arbitrarily turned, there is no high-speed signal before the phase difference (phase win _ (four) and light radiation attenuation specific problem. Only fine = for the present invention - a feasible embodiment to specify, W beta It is not intended to limit the scope of the patents of the present invention, and the equivalent implementation or modification of the art should be included in the patent scope of this case. Indeed touch, and have a clear legal shoots St conventional, the more effect 'has been fully in line with new life and progress of the
Hffm法提出申請’懇請貴局核准本件發明 專利申請案，靖㈣，域魏。 丰午毛月 【圖式簡單說明】 9 200837412 請參閱以下有關本發明之詳細說明及其附圖，將可進一朵瞭 解本發明之技術内容及其目的功效；有關附圖為： ' 圖一為本發明高速迷你型光信號排線ic之分解圖； 圖二為該高速迷你型光信號排線之一體成型封裝圖； 圖三為該咼速迷你型光信號排線ic應用於免電路超高速光信 號互連排線圖；以及 圖四為該高速迷你型光信號排線IC應用於RF電路板之Ic封 裝圖。 、【主要元件符號說明】 1 光纖置入孔 2 垂直共振腔面射型雷射陣列 3 檢光器陣列 4 多模光纖 5 VCSEL發光區/pin接收區 6 RF電路板 . 7 1C外殼 10The Hffm Law applies for an application. You are requested to approve the patent application for this invention, Jing (4), Wei Wei. Fengyin Maoyue [Simple Description] 9 200837412 Please refer to the following detailed description of the present invention and its accompanying drawings, which will be understood to understand the technical contents of the present invention and its effects. The related drawings are as follows: The exploded view of the high-speed mini optical signal cable ic of the present invention; FIG. 2 is a body molding package diagram of the high-speed mini optical signal cable; FIG. 3 is the idle mini optical signal cable ic applied to the circuit-free super A high-speed optical signal interconnection wiring diagram; and FIG. 4 is an Ic package diagram of the high-speed mini optical signal wiring IC applied to the RF circuit board. [Main component symbol description] 1 Fiber insertion hole 2 Vertical cavity surface-emitting laser array 3 Detector array 4 Multimode fiber 5 VCSEL illuminating area/pin receiving area 6 RF circuit board . 7 1C housing 10