KR101276508B1 - Optical interconnection module - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photovoltaic wiring module for high speed data transfer between boards in a device or high speed data transfer between devices. To provide a photoelectric wiring module based on an optical device package (eg, VCSEL PKG, PD PKG).
To this end, the present invention is a photoelectric wiring module, comprising: a substrate having wiring and electrode pads for mounting and connecting devices; An electrical connector mounted to the substrate for electrical connection to an external device; An optical device package for performing photoelectric conversion or all-optical conversion of a signal; An optical control element controlling a driving of the optical element package; And an optical transmission path for transmitting an optical signal emitted or incident from the optical device package, wherein the optical device package has a structure in which an optical device chip is covered by a housing, and the optical device package is used for electrical connection with the substrate. The lead of the optical device package is mounted to be electrically connected to the electrode pad formed on the upper surface of the substrate, the light input or output direction of the optical device chip has a horizontal structure, such as the longitudinal direction of the substrate It provides a photoelectric wiring module, characterized in that.

Description

Photoelectric wiring module

The present invention relates to a photovoltaic wiring module, and more particularly, to a photoelectric wiring module for high-speed data transfer between boards or high-speed data transfer between devices in a device.

In particular, the present invention relates to a photoelectric wiring module based on an optical device package (eg, VCSEL PKG, PD PKG) having a horizontal alignment structure for optical butt-coupling and passive optical alignment.

Recent electronic devices (e.g. smartphones, smart TVs, computers, tablet PCs, displays, digital cameras, camcorders, MP3s, game consoles, navigation, etc.) are becoming more powerful, faster, more compact, and smaller (thinner) thanks to the development of IT technology. It's going on.

Recent electronic device trends require high-speed data transfer technologies such as high-definition and 3D video content within and between devices, resulting in signal attenuation, noise, EMI / EMC, impedance matching, cross talk, skew, and miniaturization of connection wiring. The back is emerging as a big issue.

In general, electrical connectors are used in copper-based wiring, that is, in devices, and between devices, and electric cables are used between devices.

However, not only does copper wiring not meet the need for large-capacity data high-speed transmission, but also does not solve various technical issues in line with the recent electronic device trend mentioned above.

In order to solve this problem, optical wiring technology has recently been researched and developed. In other words, the optical wiring is capable of transmitting high-capacity data at high speed by replacing the parallel electric signal lines of several dozen channels with the serial optical signal lines, and solving the technical problems such as noise, EMI / EMC, impedance matching, cross talk, skew, and miniaturization of connection wiring. I can eliminate it.

1 is a perspective view of an embodiment of a prior art optical cable module used for board-to-board connections in a device.

The optical cable module shown in FIG. 1 is the content disclosed in Japanese Patent No. 4631671 (name of the invention: "electronic device having an optical cable module and an optical cable module") (hereinafter referred to as 'prior art 1'). The explanation is as follows.

The optical cable module of FIG. 1 includes a transmitter 10a and a receiver 10b. The transmitter includes a VCSEL chip 3a, an electrode pad 5a, a bonding wire 7a, and a liquid resin 8a on a substrate 6a. And a height supporting member 4a, and the receiving portion is composed of a PD chip 3b, an electrode pad 5b, a bonding wire 7b, a liquid resin 8b, and a height supporting member 4b on the substrate 6b. It consists of the optical waveguide 2 by the connection wiring between a transmitter and a receiver.

Referring to the operation of the optical cable module of FIG. 1, an electrical signal (ie, image data) of a main board connected to a transmitter is controlled by a driver-IC (not shown) through an electrode pad 5a on the substrate 6a. 3a) is converted into an optical signal, and is emitted vertically upward from the VCSEL chip 3a and reflected on a 45 ° mirror surface at the end of the optical waveguide 2 and transmitted to the receiver through the optical waveguide 2.

In the receiver, the optical signal is vertically reflected downward through the 45 ° mirror surface at the end of the optical waveguide 2 and is incident on the PD chip 3b on the substrate 6b. Through control of the TIA (not shown), the PD chip 3b is converted into an electrical signal and input to a display board connected to the receiver.

Figure 2 is a perspective view of one embodiment of a prior art photoelectric conversion module used for chip-to-chip connection in a device.

The photoelectric conversion module illustrated in FIG. 2 is disclosed in Korean Patent No. 810665 (name of the invention: “photoelectric conversion module and its manufacturing method”) (hereinafter, referred to as “Prior Art 2”). same.

In the photoelectric conversion module of FIG. 2, a transmitter 200 and a receiver 300 are configured on a PCB 500, and an optical waveguide 400 is configured as a connection line between the transmitter and the receiver.

The transmitter 200 includes an IC substrate 200a, electrode pads 211 and 212 formed on the upper surface of the IC substrate 200a, electrode pads 220 formed on the side of the IC substrate 200a, and the electrode pad. Driver-IC 230 bonded to the upper surface of the IC substrate 200a through 211 and 212, and a VCSEL chip 251 bonded to the side of the IC substrate 200a through the electrode pad 220. do.

The receiver 300 includes an IC substrate 300a, electrode pads 311 and 312 formed on the upper surface of the IC substrate 300a, an electrode pad 320 formed on the side of the IC substrate 300a, and the electrode pad. TIA 330 bonded to the upper surface of the IC substrate 300a through 311 and 312, and a PD chip 350 bonded to the side of the IC substrate 300a through the electrode pad 320.

However, the prior art 1 has a vertical alignment structure using a 45 ° mirror plane between the VCSEL chip and the optical waveguide, and uses a height support member, which is disadvantageous in terms of optical loss, optical coupling spacing, and low magnification. There is a problem.

In addition, the prior art 1 uses a sealed liquid resin to protect the VCSEL chip, there is a problem that the optical focusing is not properly performed because the optical waveguide is affected by the expansion of the liquid resin.

In addition, the prior art 1 requires a 45 ° optical waveguide process in the manufacturing process, and has a problem in that the mass production speed is remarkably decreased because the alignment between the VCSEL chip and the optical waveguide needs to be finely adjusted by hand.

Prior art 2 does not guarantee the fixing of the VCSEL chip because the VCSEL chip is mounted on the side of the IC substrate using electrode pads and solder balls, and thus there is a problem of physical mounting instability of the VCSEL chip.

In addition, the prior art 2 does not guarantee physical fixation of the optical waveguide because the optical waveguide is mounted on the surface of the VCSEL chip using an adhesive, and thus there is a problem in that optical focusing is not properly performed.

In addition, the prior art 2 has a problem in that the manufacturing process is not guaranteed to ensure the reliability of the process to mount the VCSEL chip on the side of the IC substrate by using the pick-up equipment in the manufacturing process, significantly reduced production.

Accordingly, the present invention has been proposed to solve the above problems and meet the above requirements, while ensuring low cost, miniaturization (height / area), mass productivity (easiness of manufacture, process simplification), and guarantee optical coupling reliability. In order to ensure the physical stability of component mounting, the present invention provides a photoelectric wiring module for high-speed data transfer between boards or high-speed data transfer between devices within a device.

That is, the present invention is to provide a commercially available photovoltaic wiring module that can be applied universally in and between devices while having a low cost, high reliability manufacturing process, and in particular, butt-coupling, passive optical alignment ( An object of the present invention is to provide a photoelectric wiring module based on an optical device package (eg, VCSEL PKG, PD PKG) having a horizontal alignment structure for passive alignment.

The objects of the present invention are not limited to the above-mentioned objects, and other objects and advantages of the present invention which are not mentioned can be understood by the following description, and will be more clearly understood by the embodiments of the present invention. It will also be readily apparent that the objects and advantages of the invention may be realized and attained by means of the instrumentalities and combinations particularly pointed out in the appended claims.

In order to achieve the above object, the present invention provides a photoelectric wiring module, comprising: a substrate on which wiring and electrode pads for mounting and connecting devices are formed; An electrical connector mounted to the substrate for electrical connection to an external device; An optical device package for performing photoelectric conversion or all-optical conversion of a signal; An optical control element controlling a driving of the optical element package; And an optical transmission path for transmitting an optical signal emitted or incident from the optical device package, wherein the optical device package has a structure in which an optical device chip is covered by a housing, and the optical device package is used for electrical connection with the substrate. The lead of the optical device package is mounted to be electrically connected to the electrode pad formed on the upper surface of the substrate, the light input or output direction of the optical device chip has a horizontal structure, such as the longitudinal direction of the substrate It provides a photoelectric wiring module, characterized in that.

The present invention as described above can be used as it is, without any additional processing of devices and components of the photoelectric wiring module, easy to mass production with low cost, high reliability, easy to process the process of mounting such devices and components on the substrate, manufacturing speed, etc. Can ensure the mass production of. In addition, it is not necessary to perform the mirror surface processing process of an optical transmission path.

In addition, the present invention is a horizontal alignment structure between the optical device package and the optical transmission path, the optical device package and the optical transmission path can be directly connected (butt-coupling) at a distance close to each other without a separate member such as a lens, a mirror, When optical device package and optical transmission path are combined, passive optical alignment can be performed instead of active optical alignment that performs position adjustment while measuring with measurement equipment, ensuring optical coupling reliability, physical stability of component mounting, etc. can do.

In addition, since the present invention has a horizontal alignment structure instead of vertical alignment, it is possible to miniaturize and reduce the size of the photoelectric wiring module by minimizing the light coupling separation distance.

In addition, the present invention can be applied universally in and between devices, and can be applied to an application product to ensure performance and reliability, thereby enabling commercialization of the photoelectric wiring module.

1 is a perspective view of one embodiment of a prior art optical cable module used for board-to-board connections in a device;
2 is a perspective view of one embodiment of a prior art photoelectric conversion module used for in-device chip connection.
3 is a perspective view of an embodiment of a photoelectric wiring module according to the present invention;
Figure 4 is a perspective view of an embodiment of an optical device package proposed in the present invention.
Figure 5 is a perspective view of an embodiment of a photoelectric wiring module having a transceiver according to the present invention.
6 is an explanatory diagram for showing a device to which the photoelectric wiring module of the present invention is applied.
7 is an explanatory diagram showing an electrical connector used in the photoelectric wiring module of the present invention.

The above objects, features, and advantages will become more apparent from the detailed description given hereinafter with reference to the accompanying drawings, and accordingly, those skilled in the art to which the present invention pertains may share the technical idea of the present invention. It will be easy to implement. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a perspective view of an embodiment of a photoelectric wiring module according to the present invention.

As shown in FIG. 3, the transmitting unit or the receiving unit of the photoelectric wiring module 30 according to the present invention is an electrical connector 32, an optical control element 33, an optical element package 34, and an optical transmission path on the substrate 31. 35 and an electrode pad 36.

4 is a perspective view of an embodiment of an optical device package according to the present invention, and a perspective view is shown for the purpose of understanding the present invention. 4A is a perspective view of the optical device package 34 viewed from a 45 ° side view, and FIG. 4B is a perspective view of the optical device package 34 viewed from the bottom up.

As shown in FIGS. 4A and 4B, the optical device package of the present invention includes a housing 45 having an opening 46 having a predetermined size, an optical device chip 44 mounted in the housing 45, and an optical device chip. The lead 43 is electrically connected to the electrode pad 42 of the 44 and exposed to the outside from the bottom surface of the housing 45. Here, the housing 45 may have a structure that covers all of the optical device chip 44 or covers only a part of the side surface of the optical device chip 44 in the light incident or exiting direction. Such an optical device package of the present invention may be defined as a 'side view optical device package', and may be implemented by packaging an injection molded housing, a metal lead, and an optical device chip.

In particular, in the present invention, the lead 43 of the optical device package 34 is formed on the bottom surface of the housing 45 to be electrically connected to the electrode pad 36 formed on the top surface of the substrate 31. The optical element chip 44 is mounted in the housing 45 so that the direction of light incidence or emission is parallel to the mounting position of the optical element package 34 on the 31. Here, in mounting the optical device package 34 to the substrate 31, flip chip bonding, SMT, between the lead 43 of the optical device package 34 and the electrode pad 36 of the substrate 31. , Reflow or wire bonding can be used.

Figure 4c is a perspective view showing another embodiment of the optical device package proposed in the present invention.

As shown in FIG. 4C, in the optical device package according to another exemplary embodiment, an electrode pad 82 is formed on an upper surface of the insulating substrate 81, and is electrically connected to the electrode pad 82 on the upper surface of the insulating substrate 81. The lead 83 is formed on the side of the insulating substrate 81. The optical device chip 84 is mounted on the electrode pad 82 on the upper surface of the insulating substrate 81, and includes a housing 85 covering the optical device chip 84 on the upper surface of the insulating substrate 81. The upper portion of the housing 85 is formed with an opening 86 having a predetermined size. Such an optical device package may be implemented by packaging an injection molding housing, a metal lead, and an optical device chip.

The lead 83 of the optical device package of FIG. 4C is mounted to be electrically connected to the electrode pad 36 formed on the upper surface of the substrate 31 so that the optical device chip is mounted when the optical device package is mounted on the substrate 31. The light incidence or emission direction of the 44 is made on the same horizontal line as the longitudinal direction of the substrate 31.

The reason why the optical device package as shown in Figure 4 in the present invention is as follows.

In general, a vertical cavity surface emitting laser diode (VCSEL) is a type in which a DBR laser is rotated at its end, and light is emitted from a non-lateral surface unlike a normal LD.

That is, the die of the VCSEL chip is mounted on the upper surface of the substrate of the photoelectric wiring module to emit light upward, and the path must be changed vertically at 90 ° using a 45 ° mirror surface to couple the light with the optical transmission path. .

In other words, the VCSEL chip cannot be mounted on the substrate to emit light toward the optical transmission path mounted on the substrate, and thus, when the VCSEL chip is mounted on the upper surface of the substrate or on the side of the substrate as described in the related art. You can see that there are a lot of problems.

On the other hand, the well-known LED package also has a structure in which leads are formed on the side opposite to the light exit surface (i.e., the die portion of the chip), which also cannot emit light toward the optical transmission path mounted on the substrate. That is, even if the LED package structure is dedicated to the photoelectric wiring module, optical coupling cannot be guaranteed.

Thus, in the present invention, the VCSEL chip and the optical transmission path are arranged on the same axis in parallel on the substrate to enable optical coupling. In the present invention, it is defined as a 'horizontal alignment structure'. The optical device package shown in FIG. 4 is provided, and from this, optical direct connection (butt-coupling) and passive optical alignment (passive-alignment) can be achieved.

Of course, since the VCSEL and the PD have the same structure, in the present invention, the PD can be packaged as an optical device as shown in FIG. 4. That is, the light emitting device package 54 and the light receiving device package 64 to be described later follow the structure of the optical device package 34 described above.

The light emitting device package 54 includes a light emitting device chip, and the light emitting device chip may be implemented as a VCSEL, an LED, or the like having a predetermined wavelength band and performance of several to several tens of Gbps, and preferably, the VCSEL. The light receiving device package 64 may include a light receiving device chip, and the light receiving device chip may be implemented with a PD or the like.

The optical coupling structure between the optical device package 34 and the optical transmission path 70 of the present invention will be described later in detail.

Hereinafter, the present invention will be described with reference to FIG. 5 as a photoelectric wiring module including a transmitter and a receiver in order to understand the technical description.

5 is a perspective view of an embodiment of a photoelectric wiring module having a transceiver according to the present invention.

As shown in FIG. 5, the transmitting unit 50 of the photoelectric wiring module 40 according to the present invention includes a first electrical connector 52, a light emitting control element 53, and a light emitting device package (1) on the first substrate 51. 54 and a first electrode pad 55, and the receiver 60 includes a second electrical connector 62, a light receiving control element 63, a light receiving element package 64, and a second on the second substrate 61. An electrode pad 65 is included, and an optical transmission path 70 is formed between the transmitter 50 and the receiver 60. In addition, a separate electrical wire for transmitting an electrical signal may be further formed on the first substrate 51 of the transmitter 50, the optical transmission path 70, and the second substrate 61 of the receiver 60. .

Elements and components of the photoelectric wiring module of FIG. 5, that is, the first electrical connector 52, the light emitting control element 53, the light emitting element package 54, the second electric connector 62, the light receiving control element 63, and the light receiving element The device package 64 has a structure disposed on the substrates 51 and 61 independently of each other. These devices and components can be mounted on the substrate individually or simultaneously through any one process or optional combination process such as flip chip bonding, SMT, reflow, wire bonding, and the like. have.

The first substrate 51 and the second substrate 61 are provided with wirings and electrode pads for mounting (mounting) various elements. The substrates 51 and 61 may be formed of a substrate having insulation characteristics such as a single-sided PCB, a double-sided PCB, a multilayer PCB, an FPC, an IC substrate, an interposer, and are preferably a multilayer PCB that is easy to implement high density and miniaturized circuits.

That is, as shown in FIG. 5, the first substrate 51 has a first electrode pad 55 for electrical connection with the first electrical connector 52, the light emitting control device 53, and the lead (die) of the light emitting device package 54. Wirings and electrode pads are formed. The second substrate 61 includes wirings and electrodes, such as a second electrical connector 62, a light receiving control element 63, and a second electrode pad 65 for electrical connection with a lead (die) of the light receiving element package 64. The pad is formed.

The light emitting control device 53 drives and controls the light emitting device package 54 to convert the electric signal into an optical signal through an electric signal signal processing input through the first electric connector 52. The light emission control element 53 may be composed of components such as a SerDes chip, a driver IC, and a resistor.

The light receiving control device 63 drives and controls the light receiving device package 64 so as to convert an optical signal received from the optical transmission path 70 into an electrical signal to process the signal. The light receiving control device 63 may be formed of components such as a TIA (Trans-impedance Amplifier), an amplifier, a SerDes chip, and the like.

The optical transmission path 70 may be implemented as an optical waveguide, an optical fiber (eg, POF, etc.), and may include a core and a clad as an optical transmission medium.

The optical coupling between the light emitting device package 54 and the optical transmission path 70 and the optical coupling between the light receiving device package 64 and the optical transmission path 70 will be described in detail with reference to FIGS. 3 and 4 as follows. same.

3 and 4, the lead 43 of the optical device package 34 is mounted on the electrode pad 36 on the substrate 31, and the core protruding to a predetermined length of the optical transmission path 35 is mounted on the optical device package. It is inserted into an opening 46 having a predetermined size formed on the housing 45 of the 34. In this case, the core end of the optical transmission path 35 is inserted to a position (eg, a separation distance within several tens of micrometers) which is almost close to the exit surface (or the entrance surface) of the optical device chip 44 in the optical device package 34. It is desirable to. In addition, the diameter of the opening 46 of the optical device package 34 is preferably equal to or larger than the diameter of the core of the optical transmission path 35.

Then, the light-transmitting epoxy is injected through the opening 46 of the optical device package 34 to fill the inside of the housing 45, so that the optical transmission path 35 core and the optical device chip 44 exiting surface (or Compensating the light coupling between the (incident surface), and to shake the core of the optical transmission path 35 to be fixedly attached. Here, the light transmissive epoxy has a refractive index similar to that of the optical transmission path 35, and it is preferable to use a polymer-based epoxy having good light transmittance. For example, a light transmissive epoxy having a refractive index of 1.2 to 1.8 and a light transmittance of 80 to 95% in the wavelength band of the optical transmission path 35 may be used.

On the other hand, in order to prevent shaking and fixed attachment of the optical transmission path 35, the optical transmission path 35 may be placed on the substrate 31 and epoxy bonding and filling may be performed on the side and bottom surfaces of the optical transmission path 35.

The photoelectric wiring module of the present invention having the optical coupling structure between the optical device package and the optical transmission path as described above has the following advantages.

The components and parts of the photoelectric wiring module including the optical device package can be used as they are without additional processing, and the mass production is easy with low cost and high reliability. The mass productivity of this etc. can be ensured. In addition, it is not necessary to perform the mirror surface processing process of an optical transmission path.

As a horizontal alignment structure between the optical device package and the optical transmission path, the optical device package and the optical transmission path can be directly butt-coupling at a close distance to each other without a separate member such as a lens and a mirror, and the optical device package and the optical transmission path When combined with a furnace, passive optical alignment can be performed instead of active optical alignment that performs position adjustment while measuring with measurement equipment, and can guarantee optical coupling reliability and physical stability of component mounting.

Because of the horizontal alignment structure rather than the vertical alignment, the optical coupling separation distance can be minimized, thereby miniaturizing and lowering the photoelectric wiring module.

It can be applied universally in and between devices, and can be applied to application products to ensure performance and reliability, thereby enabling the commercialization of photoelectric wiring modules.

Next, an electrical connector, ie, an electrical connection interface, of the photoelectric wiring module of the present invention will be described with reference to FIGS. 6 and 7.

6 is an explanatory diagram for showing a device to which the photoelectric wiring module of the present invention is applied, and FIG. 7 is an explanatory diagram for showing an electrical connector used in the photoelectric wiring module of the present invention.

The photoelectric wiring module of the present invention can be used for high-speed data transfer between boards in a device or high-speed data transfer between devices. When mounted in a device, the photoelectric wiring module is mounted on a board, and when mounted between devices, The wiring module is mounted on the device.

To this end, the transmitter 50 and the receiver 60 of the photoelectric wiring module include a first electrical connector 52 and a second electrical connector 62 for electrical connection with a board or device, respectively. In addition, generally, the electrical connection interface with the board is referred to as an electrical connector, and the electrical connection interface with the device is generally referred to as an electrical terminal. In the present invention, the electrical connector is defined as including an electrical terminal.

The video data transmission between the CPU and the display in the smartphone for the photoelectric wiring module in the device is taken as an example, and the video data transmission between the DVD and the smart TV for the photoelectric wiring module between the devices is as follows.

In the photoelectric wiring module in the device, the first electrical connector 52 on the first substrate 51 of the transmitter 50 is mounted (detachable) on the main board to make an electrical connection, and the electrical signal sent from the main board is the first. It is input to the light emission control element 53 through the electrical connector 52. On the other hand, the second electrical connector 62 on the second substrate 61 of the receiver 60 is mounted (detachable) on the display board to make an electrical connection, and the electrical signal received from the light receiving control element 63 is second. It is input to the display board through the electrical connector 62.

In the device-to-device photoelectric wiring module, the first electrical connector 52 on the first substrate 51 of the transmitter 50 is attached (detachable) to the output port of the DVD to make an electrical connection, and the electrical signal of the DVD is the first. It is input to the light emission control element 53 through the electrical connector 52. On the other hand, the second electrical connector 62 on the second substrate 61 of the receiver 60 is mounted (detachable) to the input port of the smart TV to make an electrical connection, the electrical signal received from the light receiving control element 63 Is input to the smart TV through the second electrical connector (62).

In FIG. 3, the electrical connector is mounted on the lower surface of the substrate as an example. However, the electrical connector is mounted on the same side (substrate upper surface) or the side surface of the substrate or the upper surface (or lower surface) and the side on which other components such as an optical device package are mounted. Can be.

In addition, although the electrical connector structure / shape is exemplarily illustrated in FIG. 3, the electrical connector used in the photoelectric wiring module of the present invention as shown in FIG. 7 includes a B2B connector, an FPC connector, a PCB to Wire connector, an MMI connector, and an HDMI connector. Various electrical connectors, such as USB connectors, can be mounted on the board.

In the above-described embodiment of the present invention, the photoelectric wiring module of the unidirectional data transmission has been described as an example. However, the transmission / reception unit is configured together with the first substrate 51 and the transmission / reception unit is configured together with the second substrate 61 for bidirectional data transmission. An optoelectronic wiring module may be implemented, and a plurality of transceiver units, that is, an optical device package array, may be configured on each of the first substrate 51 and the second substrate 61 to implement an optoelectronic wiring module for multi-channel bidirectional data transmission.

In addition, in an embodiment of the present invention, an optical device package is formed by packaging an optical device chip in an injection molding housing, but an optical device (for example, VCSEL and PD) and an optical control device (for example, Driver-IC, TIA, SerDes) It can also be implemented in a single package together in an injection molding housing.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. The present invention is not limited to the drawings.

31 substrate 32 electrical connector
33: optical control device 34: optical device package
35: optical transmission path 36: electrode pad
42: electrode pad 43: lead
44: optical element chip 45: housing
46: opening

Claims (12)

In the photoelectric wiring module,
A substrate on which wiring and electrode pads are formed for mounting and connecting devices;
An electrical connector mounted to the substrate for electrical connection to an external device;
An optical device package for performing photoelectric conversion or all-optical conversion of a signal;
An optical control element controlling a driving of the optical element package; And
It includes an optical transmission path for transmitting an optical signal emitted or incident from the optical device package,
The optical device package is a structure in which the optical device chip is covered with a housing,
The optical device package includes a lead for electrical connection with the substrate,
The lead of the optical device package is mounted so as to be electrically connected to the electrode pad formed on the upper surface of the substrate, the light input or output direction of the optical device chip has a horizontal structure as the longitudinal direction of the substrate Wiring module.
The method of claim 1,
The optical device package,
A housing having an opening of a predetermined size;
An optical device chip mounted in the housing;
A lead electrically connected to an electrode pad of the optical device chip and exposed to the outside from a bottom surface of the housing
Optoelectronic wiring module comprising a.
delete The method of claim 1,
The optical device package,
An electrode pad is formed on an upper surface of the insulating substrate, a lead electrically connected to the electrode pad on the upper surface of the insulating substrate is formed on the side of the insulating substrate, and an optical device chip is mounted on the electrode pad on the upper surface of the insulating substrate. An opening having a predetermined size is formed in a housing covering an optical device chip on an upper surface of a substrate.
delete The method according to claim 2 or 4,
In optical coupling between the optical element package and the optical transmission path,
And a core protruding to a predetermined length of the optical transmission path into an opening formed in a housing of the optical device package.
The method according to claim 6,
In inserting the optical transmission path,
And inserting an end of the optical transmission path core to a position close to an exit surface or an entrance surface of an optical device chip in the optical device package.
The method according to claim 6,
In optical coupling between the optical element package and the optical transmission path,
Optoelectronic wiring module, characterized in that to fill the inside of the optical device package by injecting a light-transmissive epoxy through the opening of the optical device package.
The method according to claim 6,
The optical device package,
And mounting on the substrate by any one of flip chip bonding, SMT, reflow, and wire bonding on the electrode pad of the substrate.
The method of claim 1,
The electrical connector,
A photoelectric wiring module having an interface for being electrically connected to a board in a device.
The method of claim 1,
The electrical connector,
A photoelectric wiring module having an interface for electrically connecting to an external port of a device.
The method of claim 10 or 11,
The electrical connector,
And an upper surface of the substrate or a lower surface of the substrate or a side surface of the substrate or an upper surface and a side surface of the substrate or a lower surface and a side surface of the substrate.

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