TWI485455B - Optoelectronic hybrid interconnect - Google Patents

Description

Photoelectric hybrid connector

The present invention relates to electronic connectors, and more particularly to an opto-electric hybrid connector.

A connector is usually provided in the electronic device to electrically connect with another component to enable the electronic device to communicate with or transmit signals to other devices. However, with the advancement of technology, electronic devices are moving toward a trend of thinning and thinning. The connector plastic body made by the conventional mold and the conductive terminals made by applying the stamping technology are not easily installed in the thin and light electronic device. The prior art proposes a miniature connector suitable for mounting in a thin and light electronic device. Wherein, the micro connector has a plurality of conductive terminals, and the insertion component can be inserted into the micro connector, and the electrical terminals are electrically connected to the electronic device. For example, the HDMI (High-Defenition Multimedia Interface) connector is used for transmitting digital audio signals and digital picture signals on the same wire, and has a high-performance transmission interface that is not affected by the length of the wire.

In addition, an optical bonding technology for a bismuth-based micro-optical platform utilizes free-space optical transmission, which can be used as an application platform for board-to-board or USB 3.0 optical bonding technology. Architecturally, the optical connection transceiver module of the bismuth-based micro-optical platform comprises: a 45-degree micro-reflective surface of a monolithic body, a V-shaped groove for placing an optical fiber array, a high-frequency transmission line with 2.5 GHz, and a tin-gold solder. Etc., and a surface-emitting laser and photodetector can be packaged onto the micro-optical platform via appropriate optical alignment. The 矽-based micro-optics platform has completed 2.5 GHz/channel transmission speed.

However, the performance of the above described transmission interface or connector has yet to be improved, so that the present invention proposes a connection device based on a micro-optical platform.

The present invention provides an opto-electric hybrid connector including a first transmission interface for transmitting electrical signals, an optocoupler module coupled to the first transmission interface for converting between the optical signal and the electrical signal, and a second transmission interface. The coupling of the optoelectronic coupling module includes a telecommunication transmission medium and an optical signal transmission medium for transmitting the electrical signal through the telecommunication transmission medium, and transmitting the optical signal by the optical signal transmission medium, wherein the telecommunication transmission medium and the optical signal transmission medium It is wrapped in a cable.

The optocoupler module comprises a semiconductor substrate having a concave platform formed therein, the first end of the concave platform has a reflective surface, and the concave platform has an array of grooves for arranging the optical signal transmission medium, and the transmission line is formed on the semiconductor substrate An optical component is coupled to the transmission line of the semiconductor substrate via the conductive bump, disposed to be adjacent to the first end, and coupled to the optical signal transmission medium via the reflective surface; and a chip coupled to the optical component. The telecommunication transmission medium comprises a metal wire; the optical signal transmission medium comprises an optical fiber.

According to another aspect of the present invention, an opto-electric hybrid connector includes: a first transmission interface coupled to the first electronic device for transmitting the first electrical signal; and a third transmission interface coupled to the second electronic device for transmission a first electrical coupling module coupled to the first transmission interface for converting between the first optical signal and the first electrical signal; and a second optical coupling module coupled to the second transmission The interface is used for converting between the second optical signal and the second electrical signal; and the second transmission interface is coupled to the first optocoupler module and the second optocoupler module, including the telecommunication transmission medium and the optical signal transmission medium, The first and second optical signals are transmitted by the optical signal transmission medium, and the first and second optical signals are transmitted by the optical signal transmission medium, wherein the electrical signal transmission medium and the optical signal transmission medium are wrapped in a cable.

The invention will be described in detail below in conjunction with its preferred embodiments and the accompanying drawings. It should be understood that all of the preferred embodiments of the invention are intended to be illustrative only and not limiting. Therefore, the invention may be applied to other embodiments in addition to the preferred embodiments. The invention is not limited to any embodiment, but should be determined by the scope of the appended claims and their equivalents.

The invention provides an opto-electric hybrid connector, wherein the optocoupler module integrates optical components (VCSELs/Photo-Detector) and optical fibers in a micro-optical platform; in addition, the optocoupler module also includes an optical connector with a waveguide or A waveguide integrated single-wafer integrated circuit in which a waveguide integrated single-wafer integrated circuit integrates an integrated circuit and a waveguide on a single germanium-based wafer or an SOI (Silicon On Insulator)-based wafer.

The first figure shows a functional block diagram of an opto-electric hybrid connector in accordance with an embodiment of the present invention. As shown in the first figure, the opto-electric hybrid connector 10 includes a first transmission interface 11, a second transmission interface 12, and a photoelectric coupling module 13. The first transmission interface 11 and the second transmission interface 12 are coupled to the optocoupler module. 13. The first transmission interface 11 is used for connecting a connection interface of an electronic device to facilitate transmission or reception of an electrical signal by the electronic device; A transmission interface 11 is coupled to the optoelectronic coupling module 13 to facilitate the transmission of electrical signals therebetween. The optocoupler module 13 is used for converting between an optical signal and an electrical signal. The second transmission interface 12 includes an electrical signal transmission medium and an optical signal transmission medium, and is coupled to the photoelectric coupling module 13. Therefore, the second transmission interface 12 can transmit/receive the electrical signal to/from the optocoupler module 13 through the telecommunication transmission medium, and transmit/receive the optical signal to/from the optocoupler module 13 through the optical signal transmission medium. . In other words, the electrical signal can be transmitted bidirectionally between the first transmission interface 11 and the optocoupler module 13; similarly, the electrical signal and/or the optical signal can be transmitted between the second transmission interface 12 and the optocoupler module 13 in two directions. The actual application is selected, but the optical signal and the electrical signal can be converted by the photoelectric coupling module 13 in the meantime.

The second figure shows an opto-electric hybrid connector in accordance with an embodiment of the present invention. As shown in the second figure, the opto-electric hybrid connector includes a first transmission interface 21, a second transmission interface 22, and an optocoupler module 23, wherein the first transmission interface 21 and the second transmission interface 22 are coupled to the optocoupler module 23 . The first transmission interface 21 is connected to the connection interface of an electronic device through a connection interface 21a, such as a pin, for facilitating transmission or reception of an electrical signal by the electronic device; and the first transmission interface 21 is connected through the connection. The interface 21a, for example, a pin, is coupled to the optocoupler module 23 to facilitate the transmission of electrical signals therebetween. The optocoupler module 23 can be covered with a housing 24 to protect it from the external environment. The second transmission interface 22 includes a plurality of wires 25, such as copper wires, and a plurality of optical fibers 26, wherein the plurality of wires 25 and 26 are wrapped in a cable 22a. Therefore, the second transmission interface 22 can transmit/receive the electrical signals to/from the optocoupler module 23 through the plurality of wires 25, and transmit the optical signals to/from the optocoupler module 23 through the optical fibers 26. That is, the electrical signal can be transmitted bidirectionally through the pin 21a between the first transmission interface 21 and the optocoupler module 23.

In addition, the optocoupler module 23 includes a semiconductor substrate 29, a wafer 27, and a light element 32. The wires 25, the semiconductor substrate 29, and the wafer 27 of the second transfer interface 22 are disposed on a printed circuit board 30. Electrical connection. The wafer 27 is, for example, a driver circuit wafer or a control wafer. The semiconductor substrate 29 is a Sillcon Optical Bench having a concave platform 38 having an array of grooves (refer to FIG. 5) to facilitate the arrangement of the optical fibers 26 thereon, and the transmission line 31 is formed. The semiconductor substrate 29 is mounted on the semiconductor substrate 29 to facilitate electrical connection between the wafer 27 and the optical element 32. Light element 32 is a light emitting or receiving element, for example comprising a laser, a vertical cavity surface emitting laser (VCSEL), a photodetector or a light emitting diode.

The wires 25 and the optical fibers 26 in the second transmission interface 22 are respectively disposed on the printed circuit board 30 and the semiconductor substrate 29 in the optocoupler module 23, so that the second transmission interface 22 and the optocoupler module 23 can pass through. The plurality of wires 25 and the optical fibers 26 transmit the electrical signals and the optical signals bidirectionally, depending on the actual application, but the wafer 27 and the optical components 32 on the optocoupler module 23 can be used to perform the optical signal and the electrical signal. Conversion.

In one embodiment, the first transmission interface 21 is a wired transmission interface, including but not limited to an HDMI transmission interface, a USB transmission interface, a display panel transmission interface, RS-232, RS-422, RJ-45, and Fire Wire. Etc., or Active Optical Cable interface, Light Peak, Thunderbolt, single-ended electrically conductive interface, single-ended interface with optical or opto-electric hybrid interface, bidirectional transmission interface, can be used in the present invention.

Taking HDMI as an example, in high-speed signal transmission (for example, four optical fibers) is a one-way transmission (Transmitter to Receiver), and other transmitters such as USB connectors are in the form of transceivers, meaning single-ended ( Single End) has both receiving and transmitting modules. In addition, the light-emitting sub-assembly and the light-receiving sub-assembly (TOSA and ROSA: Transmitter optical sub-assembly and Receiver optical sub-assembly) are arranged on the same side to form a bi-directional optical sub-assembly (BOSA). Included. In other words, the first transmission interface 21 of the present invention can be applied to an interface for one-way transmission or two-way transmission.

The third figure shows a cross-sectional view of an optocoupler module in accordance with an embodiment of the present invention. In this embodiment, two sets of photoelectric coupling modules are included, which are miniaturized passive optical connection transmitting end modules and receiving end modules, which respectively include semiconductor substrates 29a and 29b, wafers 27a and 27b, light emitting elements 32a and light receiving elements. 32b, the semiconductor substrates 29a and 29b and the wafers 27a and 27b are electrically connected to the printed circuit boards 30a and 30b, respectively. The wafers 27a and 27b are, for example, a driver circuit wafer or a control wafer. The semiconductor substrates 29a and 29b include a concave platform and reflective surfaces 37a and 37b having an angle (for example, 45 degrees) having groove arrays 35a and 35b thereon for facilitating the arrangement of the optical fibers 26 thereon. 35a and 35b are, for example, V-groove arrays, and the 45-degree reflecting surfaces 37a and 37b can be used as optical reflecting surfaces required for various types of photovoltaic elements. The transmission lines 31a and 31b are, for example, high-frequency transmission lines having a frequency of 10 GHz or higher, which are formed on the semiconductor substrates 29a and 29b, respectively, to facilitate electrical connection of the wafers 27a and 27b, and the light-emitting elements 32a and 32b. For example, the transmission lines 31a and 31b are electrically connected to the wafers 27a and 27b through wire bonds 34a and 34b, respectively, and the transmission lines 31a and 31b are respectively transmitted through (conductive) solder bumps 33a and 33b. The light emitting element 32a and the light receiving element 32b are electrically connected. Further, the transmission lines 31a and 31b may be electrically connected to the wafers 27a and 27b by a Flip-Chip Bonding method. The light-emitting element 32a includes, for example, a laser, a vertical cavity surface radiation laser (VCSEL) or a light-emitting diode, and the light-receiving element 32b includes, for example, a photodetector.

The optical fiber 26 includes a core portion 26b and a Cladding portion 26a. The core portion 26b is a portion for transmitting an optical signal in the optical fiber, and the covering portion 26a is covered on the periphery of the core portion 26b to enable light to be present. Transmitted in core part 26b. The refractive index of the core portion 26b must be greater than the refractive index of the coated portion 26a to cause total reflection of the light. In addition, a protective layer may be added to protect the periphery of the covered portion 26a to prevent damage to the covered portion 26a and the core portion 26b of the optical fiber.

In one embodiment, the semiconductor substrates 29a and 29b respectively have a specific depth formed by a concave platform, and the first end of the concave platform forms a reflecting surface 37a and 37b, and the concave platform has The groove arrays 35a and 35b. The reflecting surfaces 37a and 37b are 45-degree reflecting surfaces.

For example, the light-emitting element 32a and the light-receiving element 32b are disposed to be close to the first end of the concave platform, and optically couple the optical fiber 26 via the reflective surfaces 37a and 37b. Therefore, the light path 40 between the light-emitting element 32a and the light-receiving element 32b includes that light emitted from the light-emitting element 32a enters the optical fiber 26 via reflection of the reflective surface 37a, passes through the optical fiber 26, and then enters the light through the reflection of the reflective surface 37b. The component 32b is received to receive an optical signal.

In one embodiment, the miniaturized passive optical connection transmitter module and the transmission line 31 of the receiver module are respectively electrically connected to the light emitting component or the light receiving component 32 through the conductive portion 33, and the semiconductor substrate 29 is 矽基微. a Silicon Optical Bench, and a molding material 41 is used to fill (fill) the concave platform, and the optical fiber 26 is attached to the molding material 41 in the groove array. As shown in the fourth figure. The light-emitting element or light-receiving element 32 is configured (formed) on the ruthenium-based micro-optical platform. For example, the upper surface of the molding material 41 is flush with the upper surface of the concave platform of the conductor substrate 29. Based on the array of grooves 35 in the optical table (concave platform), the fibers 26 are passively aligned with the array of grooves, as shown in the fifth figure. For one embodiment, the groove pitch of the groove array is typically 250 microns, and the groove width 70 is designed or adjusted for different specifications, with 4 channels within 5 square meters on the optical table. (channel) to transmit 10 Gbps. For one embodiment, the structural tolerance of the optical component is ±10 micrometers, the alignment tolerance of the optical system is ±20 micrometers, and the optical path of the light-emitting component 32 to the optical fiber 26 is approximately 200 micrometers via 40a. .

The sixth figure shows a functional block diagram of a system in accordance with the present invention. As shown in the sixth figure, the system 50 includes a first transmission interface 51, a second transmission interface 52, a third transmission interface 53, a first optocoupler module 54, a second optocoupler module 55, and a first electronic device. The first and second electronic devices 57 are coupled to the first and second transmission interfaces 52 and 52, and the second transmission interface 52 and the third transmission interface 53 are coupled to the second optical coupling module 55. . The first transmission interface 51 is used to connect the connection interface of the electronic device 56 to facilitate the first electronic device 56 to transmit or receive an electrical signal; and the first transmission interface 51 is coupled to the first optocoupler module 54 for facilitating telecommunications. The number is passed in between. The third transmission interface 53 is used to connect the connection interface of the second electronic device 57 to facilitate the second electronic device 57 to transmit or receive an electrical signal; and the third transmission interface 53 is coupled to the second photoelectric coupling module 55 to Conducive to the transmission of electrical signals in the meantime. The second transmission interface 52 includes an electrical signal transmission medium and an optical signal transmission medium, and is coupled to the first photoelectric coupling module 54 and the second photoelectric coupling module 55. Therefore, the first electronic device 56 and the second electronic device 57 can transmit and receive electrical signals bidirectionally or unidirectionally through the transmission interface and the optocoupler module.

The seventh figure shows an opto-electric hybrid connector in accordance with another embodiment of the present invention. As shown in the seventh figure, the opto-electric hybrid connector further includes a power converter 61, a power control chip 60, a fiber adapter 66, an average resistor 63, and a modulation resistor 64. A signal input 65 can be input through a pin 21a to input its signal, and a pin 21a is electrically connected to the power control chip 60. The fiber optic adapter 66 can be coupled to the fiber 26 with its fiber optic connector. The power converter 61 is an external power source, and is electrically connected to the power control chip 60 via a wire 25b. A plurality of wires 25a are disposed on the printed circuit board. The external power supply 61 mainly considers whether the power consumption of the OE converter can be completed within the power supply of a specific connector. For example, the USB can provide a maximum current of 5V and 500-900 mA, which is equivalent to 2.5 mW. , while HDMI can provide 5V, 50mA or 500 mA. External power supplies will be introduced or not required. When the internal power supply is not enough to supply to the optocoupler module, the power control chip 60 can be passed to activate the add-on power converter 61 for power supply. The average resistor 63 and the modulation resistor 64 are electrically connected to the wafer 27 for fixing the average current and the modulation current of the light-emitting element 32.

The present invention has been described above by way of a preferred example, and is not intended to limit the spirit of the invention. Modifications and similar configurations made within the spirit and scope of the invention are intended to be included within the scope of the appended claims.

10. . . Photoelectric hybrid connector

11, 21, 51. . . First transmission interface

12, 22, 52. . . Second transmission interface

13,23. . . Photoelectric coupling module

13,23. . . Photoelectric coupling module

21a. . . Connection interface

22a. . . Cable

twenty four. . . shell

25, 25a, 25b. . . wire

26. . . optical fiber

26a. . . Covered part

26b. . . Core part

27, 27a, 27b. . . Wafer

29, 29a, 29b. . . Semiconductor substrate

30, 30a, 30b. . . A printed circuit board

31, 31a, 31b. . . Transmission line

32. . . Optical component

32a. . . Light-emitting element

32b. . . Light receiving element

33. . . Conductive part

33a, 33b. . . Welding bump

34a, 34b. . . Welding wire

35, 35a, 35b. . . Groove array

37a, 37b. . . Reflective surface

38. . . Concave platform

40, 40a. . . Light path

41. . . Molding material

50. . . system

53. . . Third transmission interface

54. . . First optocoupler module

55. . . Second optocoupler module

56. . . First electronic device

57. . . Second electronic device

60. . . Power control chip

61. . . Power converter

63. . . Average resistance

64. . . Modulation resistor

65. . . Signal input

66. . . Fiber optic adapter

70. . . Groove width

The first figure shows a functional block diagram of an opto-electric hybrid connector in accordance with an embodiment of the present invention.

The second figure shows an opto-electric hybrid connector in accordance with an embodiment of the present invention.

The third figure shows a cross-sectional view of an optocoupler module in accordance with an embodiment of the present invention.

The fourth figure shows a cross-sectional view of a photocoupler module in accordance with another embodiment of the present invention.

The fifth figure shows a cross-sectional view of a groove array in accordance with an embodiment of the present invention.

Figure 6 is a functional block diagram of a system in accordance with one embodiment of the present invention.

Figure 7 is a schematic illustration of an optocoupler module in accordance with another embodiment of the present invention.

10. . . Photoelectric hybrid connector

11. . . First transmission interface

12. . . Second transmission interface

13. . . Photoelectric coupling module

Claims (10)

An opto-electric hybrid connector, comprising: a first transmission interface for transmitting a first electrical signal; a first optocoupler module coupled to the first transmission interface for converting between the first optical signal and the first electrical signal And a second transmission interface coupled to the first optoelectronic coupling module, comprising a telecommunication transmission medium and an optical signal transmission medium, to facilitate transmission of the first electrical signal by the telecommunication transmission medium, and the optical transmission medium Transmitting the first optical signal, wherein the optical signal transmission medium and the optical signal transmission medium are encapsulated in a cable; wherein the first photoelectric coupling module comprises: a semiconductor substrate having a concave platform formed therein The first end of the concave platform has a reflective surface, and the concave platform has an array of grooves for configuring the optical signal transmission medium. The opto-electric hybrid connector of claim 1, wherein the first optocoupler module comprises an optical connector with a waveguide or a waveguide integrated single-chip integrated circuit. The opto-electric hybrid connector of claim 1, wherein the first optocoupler module further comprises: a transmission line formed on the semiconductor substrate; and an optical component coupled to the transmission line of the semiconductor substrate via the conductive bump, Arranged to be close to the first end and coupled to the light via the reflective surface a signal transmission medium; a chip coupled to the optical element. The opto-electric hybrid connector of claim 3, wherein the optical component comprises a laser, a vertical cavity surface radiation laser, a photodetector or a light emitting diode. The opto-electric hybrid connector of claim 1, wherein the first transmission interface comprises a single-ended electrically conductive interface, a single-ended interface having an optical or opto-electric hybrid configuration, or a bidirectional transmission interface. The opto-electric hybrid connector of claim 1, wherein the telecommunication transmission medium comprises a metal wire; and the optical signal transmission medium comprises an optical fiber. The opto-electric hybrid connector of claim 1, further comprising a control chip coupled to the optocoupler module. The opto-electric hybrid connector of claim 7, wherein the control chip is coupled to an external power source. The opto-electric hybrid connector of claim 1, further comprising: a second optocoupler module coupled to the second transmission interface for converting between the second optical signal and the second electrical signal; and a third transmission interface, Coupling the second optocoupler module for transmitting the Second signal. The opto-electric hybrid connector of claim 9, wherein the first and the second optocoupler modules are identical in structure.