200823640 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，特別涉及一種以液體作爲 媒介之散熱裝置。 _ 【先前技術】 中央處理器等高功率電子元件在運行過程中會産生大 里之熱夏，如果這些熱量不能被有效地散去，將直接導致 溫度上升，而嚴重影響到電子元件之正常運行。爲此，需 要散熱裝置來對電子元件進行散熱，傳統之散熱裝置爲單 純風冷式，通常包括基座以及複數從基座頂部延伸出來之 散熱鰭片。基座用於與電子元件接觸，以吸收電子元件産 ,之熱量’並將熱量擴散至散熱鰭片i，由散熱鰭片將： 1散發至環境空氣中。該散熱裝置在電子元件發熱量不是 很大之時候，可以滿足電子元件之散熱需求。然而，隨著 電子技術之不斷發展’電子元件之資料處理速度越來越 相應地，其產生之熱量也越來越多，傳統之風冷散孰 裝置也越來越無法滿足電子元件之散熱需求。 【發明内容】 裝置 有鑒於此，有必要提供一種散熱效率較 兩之液冷散熱 一種液冷散熱裝置，用於散發— ^ 冰 电子兀件産生之埶 I，其包括一殼體，所述殼胃… 肿宮0h 有—詩容納冷媒之 腔至，所述破體包括一吸敎部株 及…。卩件、一散熱部件及一冷媒驅 200823640 動部件，所述吸熱部件用於吸收所述電子元件産生之熱 f，所述冷媒驅動部件用於驅動所述冷媒於所述腔室内循 環流今，以將所述吸熱部件吸收之熱量傳遞給所述散熱部 件’由所述散熱部件將熱量散發出去。 …° 上述液冷散熱裝置與習知風冷散熱裝置相比，採用a 媒之對流來傳遞熱量，能有效提高散熱效率。 ^ 【實施方式】 、圖1至圖5示出了本發明液冷散熱裝置之一實施例， &液冷政熱裝置可用來散發諸如電腦中央處理器等電子元 件（未圖示）產生之熱量，其主要包括由吸熱部件1〇 熱部件20及冷媒驅動部件3〇構成之殼體，該殼體内形成 有用於容納冷媒之腔室4〇。吸熱部件1〇用於吸收電子元件 産生之熱量，冷媒驅動部件3〇用於驅動冷媒於腔室内 循環流動’以將吸熱部彳1G吸收之熱量傳遞給散熱部件 20，由散熱部件20將熱量散發到環境空氣中，從而實現 子元件之散熱需求。 如圖1及圖2所示"及熱部件1〇安裝在散熱部件2〇 氏端’其在本實施例中大體呈圓盤狀，並可採用諸如銅、 =等導熱性能良好之材料—體製成。吸熱部件^之底部旦 ^ 一平坦之吸熱面12,頂部形成—突起之熱交換面14。^ :=呈突起設置可以提高吸熱部件1〇與冷媒之間之 =料，熱交換面周圍設置有複數扇形熱交換片Μ，相 …、父換片16之間形成冷媒通道18，以進—步提高熱交換 6 200823640 率〇 散熱部件20在本實施例中大體呈圓柱狀，並包括一圓 筒狀丰體22，圓筒狀本體22之外側壁上設置複數間隔排列 之放射·狀散熱鰭片24，内側壁向心地延伸出複數間隔排列 之内鰭片26,形成複數縱向溝槽。圓筒狀本體22之底端與 吸熱部件10配合，頂端與冷媒驅動部件3〇配合，以形成 腔至40。爲防止腔室40泄漏，還可在圓筒狀本體22與吸 熱部件10和冷媒驅動部件3〇之間設置密封圈8〇。 政熱部件20之圓筒狀本體22共軸地欲置有一圓筒狀 内筒體50，内筒體50可以採用塑膠、金屬等材料製成。内 筒體50外徑最好與散熱部件2〇之圓筒狀本體22内壁面之 内鰭片26頂端圍成之圓筒之直徑相適應，以便内筒體5〇 能緊密地結合於腔室40内。當然，根據需要，也可以在内 筒體50和/或散熱部件2〇之圓筒狀本體22上設置卡扣結 構，使内筒體50與圓筒狀本體22牢固地結合在一起。内 筒體50之高度要小於散熱部件2〇之圓筒狀本體22之高 度，以使當内筒體50嵌置於圓筒狀本體22中時，在圓筒 狀本體22之下端留出空間給吸熱部件1〇之熱交換片18, 上端留出空間給冷媒驅動部件30之葉輪31。 内筒體50嵌置在散熱部件20之圓筒狀本體22中以 後，將腔室40分隔形成一循環流道，該循環流道包括一由 内同體50之内壁面圍成之第一流道42以及一由内筒體5〇 之外壁面同放熱部件2〇之圓筒狀本體22之内壁面形成之 第一 /;,L道44。第一流道42和第二流道44之上端通過預留 7 200823640 給冷媒驅動部件30之葉輪31之空間連通，下端通過吸熱 部件10之相鄰熱交換片16之間冷媒通道連通。優選地， 吸熱岬件10位於第一流道42之正下方，且其熱交換片16 圍成之圓柱體之直徑與散熱部件2〇之圓筒狀本體22内壁 面之内鰭片26頂端圍成之圓筒之直徑相適應，頂端剛好與 内筒體50之底端接觸，以使從第二流道44返回之冷媒僅 通過吸熱部件10之冷媒通道18回流到第一流道42中，以 提高冷媒與吸熱部件1G之間之熱交換率。散熱部件2〇之 圓筒狀本體22之内鰭片26將第二流道44分隔成複數微流 道，以提高冷媒與散熱部件2G之間之熱交換率，從而可以 提高散熱效率。 貫施例中，冷媒驅動部件3G爲轴流泵，憑藉其葉 輪31轉動’可以將第—流道42底端之吸熱後之冷媒向上 抽吸’抽到腔室40頂端後向四周分配給第二流道Μ。爲減 Γ:一止二輪31將冷媒向第二流道4 4分配時部分冷媒回流 ^1道42’在内筒體5〇頂部還設置 該穿—小』 可，定，還在吸200823640 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device using a liquid as a medium. _ [Prior Art] High-power electronic components such as the central processing unit generate heat during the operation. If the heat cannot be effectively dissipated, it will directly cause the temperature to rise, which will seriously affect the normal operation of the electronic components. To this end, heat sinks are required to dissipate the electronic components. Conventional heat sinks are purely air-cooled and typically include a pedestal and a plurality of heat sink fins extending from the top of the pedestal. The pedestal is used to contact the electronic component to absorb the heat generated by the electronic component and to dissipate heat to the heat sink fin i, which is radiated by the heat sink fins into the ambient air. The heat dissipating device can satisfy the heat dissipation requirement of the electronic component when the heat quantity of the electronic component is not large. However, with the continuous development of electronic technology, the data processing speed of electronic components is becoming more and more corresponding, and the heat generated by them is increasing. The traditional air-cooling and diverging devices are increasingly unable to meet the heat dissipation requirements of electronic components. . SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a liquid-cooling heat dissipating device with a heat dissipating efficiency lower than two liquid cooling devices for dissipating the 冰I generated by the ice electronic component, which includes a casing, the casing Stomach... Swollen Palace 0h There is a poem to accommodate the cavity of the refrigerant, the broken body includes a sucking part and .... a member, a heat dissipating member, and a refrigerant drive 200823640, the heat absorbing member for absorbing heat generated by the electronic component, wherein the refrigerant driving member is configured to drive the refrigerant to circulate in the chamber, The heat absorbed by the heat absorbing member is transmitted to the heat dissipating member', and the heat is dissipated by the heat dissipating member. ... ° The liquid cooling device described above uses a medium convection to transfer heat compared to the conventional air cooling device, which can effectively improve the heat dissipation efficiency. [Embodiment] FIG. 1 to FIG. 5 show an embodiment of the liquid cooling device of the present invention, and the liquid cooling device can be used to dissipate electronic components (not shown) such as a computer central processing unit. The heat mainly includes a casing composed of the heat absorbing member 1 and the refrigerant driving member 3, and a chamber 4 for accommodating the refrigerant is formed in the casing. The heat absorbing member 1 is for absorbing heat generated by the electronic component, and the refrigerant driving member 3 is for driving the refrigerant to circulate in the chamber to transmit heat absorbed by the heat absorbing portion 彳1G to the heat radiating member 20, and the heat is radiated by the heat radiating member 20. Into the ambient air, so as to achieve the heat dissipation requirements of the sub-components. As shown in Fig. 1 and Fig. 2, the "hot component 1" is mounted on the end of the heat dissipating member 2, which is substantially disk-shaped in this embodiment, and can be made of a material having good thermal conductivity such as copper or = Made of body. The bottom of the heat absorbing member ^ is a flat heat absorbing surface 12, and the top portion forms a heat exchange surface 14 of the protrusion. ^ := The protrusion setting can increase the material between the heat absorbing member 1 〇 and the refrigerant, and a plurality of fan-shaped heat exchange sheets are arranged around the heat exchange surface, and the refrigerant passage 18 is formed between the father and the replacement sheet 16 to enter Step-Enhanced Heat Exchange 6 200823640 The heat-dissipating heat-dissipating member 20 is substantially cylindrical in this embodiment, and includes a cylindrical body 22 on which a plurality of radiating fins are arranged on the outer side wall of the cylindrical body 22 24. The inner sidewall extends centripetally from the plurality of spaced apart inner fins 26 to form a plurality of longitudinal grooves. The bottom end of the cylindrical body 22 is engaged with the heat absorbing member 10, and the top end is engaged with the refrigerant driving member 3 to form a cavity 40. In order to prevent leakage of the chamber 40, a seal ring 8 is also provided between the cylindrical body 22 and the heat absorbing member 10 and the refrigerant driving member 3A. The cylindrical body 22 of the thermal component 20 is coaxially disposed with a cylindrical inner cylinder 50 which may be made of plastic, metal or the like. The outer diameter of the inner cylinder 50 is preferably adapted to the diameter of the cylinder surrounded by the tips of the inner fins 26 of the inner wall surface of the cylindrical body 22 of the heat dissipating member 2 so that the inner cylinder 5 can be tightly coupled to the chamber. 40 inside. Of course, a snap-fit structure may be provided on the cylindrical body 22 of the inner cylinder 50 and/or the heat dissipating member 2, as needed, so that the inner cylinder 50 and the cylindrical body 22 are firmly joined. The height of the inner cylinder 50 is smaller than the height of the cylindrical body 22 of the heat dissipating member 2 so that when the inner cylinder 50 is embedded in the cylindrical body 22, a space is left at the lower end of the cylindrical body 22. The heat exchange sheet 18 of the heat absorbing member 1 has a space for the upper end to the impeller 31 of the refrigerant driving member 30. After the inner cylinder 50 is embedded in the cylindrical body 22 of the heat dissipating member 20, the chamber 40 is partitioned to form a circulation flow path including a first flow path surrounded by the inner wall surface of the inner body 50. 42 and a first/;, L-channel 44 formed by the inner wall surface of the cylindrical body 22 having the outer wall surface of the inner cylinder 5〇 and the heat releasing member 2〇. The upper ends of the first flow path 42 and the second flow path 44 are in communication with the space of the impeller 31 of the refrigerant driving member 30 by the reserved 7 200823640, and the lower end is communicated by the refrigerant passage between the adjacent heat exchange sheets 16 of the heat absorbing member 10. Preferably, the heat absorbing element 10 is located directly below the first flow path 42, and the diameter of the cylindrical body surrounded by the heat exchange sheet 16 is surrounded by the top end of the inner fin 26 of the inner wall surface of the cylindrical body 22 of the heat dissipating member 2 The diameter of the cylinder is adapted so that the top end is just in contact with the bottom end of the inner cylinder 50 so that the refrigerant returning from the second flow passage 44 is only returned to the first flow passage 42 through the refrigerant passage 18 of the heat absorbing member 10 to improve The heat exchange rate between the refrigerant and the heat absorbing member 1G. The inner fins 26 of the cylindrical body 22 of the heat dissipating member 2 divide the second flow path 44 into a plurality of micro flow passages to increase the heat exchange rate between the refrigerant and the heat radiating member 2G, thereby improving heat dissipation efficiency. In the embodiment, the refrigerant driving member 3G is an axial flow pump, and by the rotation of the impeller 31, the heat-absorbing refrigerant at the bottom end of the first flow passage 42 can be sucked up to the top of the chamber 40 and distributed to the periphery. Second-rate road. In order to reduce the enthalpy: a portion of the second round 31 distributes the refrigerant to the second flow passage 4 4 when the refrigerant is recirculated. ^1 channel 42' is also provided at the top of the inner cylinder 5 〇.
綜上所述，本發明符合發明專利要 利申請。惟，以上所述者僅為本發明之較佳實;例，S 8 200823640 熟悉本案技藝之人士，在要 或變化，Mm 本發3讀神所作之等效修飾 Μ化白應涵盍於以下之申請專利範圍内。 【圖式簡單說明】 圖.1係本發明液冷散熱裝置—實施例之分解圖。 圖2係圖1所示熱交換器之局部剖視圖。 圖3係圖1所不泵於葉輪朝上時之結構示意圖。 圖4係圖1所示液冷散熱裝置之組合圖。 圖5係圖4所示液冷散熱裝置之I-Ι向剖視圖。 【主要元件符號說明】 吸熱部件 10 熱交換面 14 冷媒通道 18 筒狀本體 22 内鰭片 26 葉輪 31 第一流道 42 内筒體 50 穿孔 53 固定架 70 吸熱面 12 熱交換片 16 散熱部件 20 散熱鰭片 24 冷媒驅動部件 30 腔室 40 第二流道 44 頂端蓋 51 風扇 60 密封圈 80In summary, the present invention is in accordance with the invention patent application. However, the above is only the preferred embodiment of the present invention; for example, S 8 200823640 is familiar with the skill of the present invention, and is required or changed, and Mm is issued in accordance with the following application. Within the scope of the patent. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded view of a liquid cooling device of the present invention. Figure 2 is a partial cross-sectional view of the heat exchanger shown in Figure 1. Figure 3 is a schematic view of the structure of Figure 1 when the pump is not facing upward. Figure 4 is a combination diagram of the liquid cooling heat sink shown in Figure 1. Figure 5 is a cross-sectional view, taken along line I- of the liquid cooling device of Figure 4; [Main component symbol description] Heat absorbing member 10 Heat exchange surface 14 Refrigerant channel 18 Cylindrical body 22 Inner fin 26 Impeller 31 First flow path 42 Inner cylinder 50 Perforation 53 Fixing frame 70 Heat absorbing surface 12 Heat exchange sheet 16 Heat sink 20 Heat dissipation Fin 24 refrigerant drive unit 30 chamber 40 second flow path 44 top cover 51 fan 60 seal 80