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TW200745377A - Conductive powder plated by electroless plating and process for producing the same - Google Patents

Conductive powder plated by electroless plating and process for producing the same

Info

Publication number
TW200745377A
TW200745377A TW096107804A TW96107804A TW200745377A TW 200745377 A TW200745377 A TW 200745377A TW 096107804 A TW096107804 A TW 096107804A TW 96107804 A TW96107804 A TW 96107804A TW 200745377 A TW200745377 A TW 200745377A
Authority
TW
Taiwan
Prior art keywords
electroless plating
melamine resin
plated
core powder
conductive powder
Prior art date
Application number
TW096107804A
Other languages
Chinese (zh)
Other versions
TWI419996B (en
Inventor
Masaaki Oyamada
Yasuhiro Abe
Original Assignee
Nippon Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemical Ind filed Critical Nippon Chemical Ind
Publication of TW200745377A publication Critical patent/TW200745377A/en
Application granted granted Critical
Publication of TWI419996B publication Critical patent/TWI419996B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

A conductive powder plated by electroless plating which, even when composed of fine particles having an average particle diameter of, in particular, 20 μm or smaller, has excellent deposit adhesion imparted thereto without using chromic acid, which is causative of environmental pollution, permanganic acid, etc.; and a process for industrially advantageously producing the powder. The conductive powder plated by electroless plating is characterized by comprising a core powder coated with a melamine resin and a metallic coating film deposited thereon by electroless plating.The process is characterized by comprising: a step in which a core powder is brought into contact with an initial condensate for a melamine resin and the initial condensate is polymerized to obtain a core powder coated with a melamine resin; a step in which a noble metal is deposited on the surface of the core powder coated with the melamine resin; and a step in which the core powder having the noble metal deposited thereon is plated by electroless plating.
TW096107804A 2006-03-28 2007-03-07 Conductive electroless plating powder and its manufacturing method TWI419996B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006089152A JP4849930B2 (en) 2006-03-28 2006-03-28 Conductive electroless plating powder and method for producing the same

Publications (2)

Publication Number Publication Date
TW200745377A true TW200745377A (en) 2007-12-16
TWI419996B TWI419996B (en) 2013-12-21

Family

ID=38609208

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096107804A TWI419996B (en) 2006-03-28 2007-03-07 Conductive electroless plating powder and its manufacturing method

Country Status (5)

Country Link
JP (1) JP4849930B2 (en)
KR (1) KR101305574B1 (en)
CN (1) CN101415863B (en)
TW (1) TWI419996B (en)
WO (1) WO2007119417A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI586833B (en) * 2015-10-15 2017-06-11 Electroless platinum plating solution

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009054386A1 (en) 2007-10-22 2009-04-30 Nippon Chemical Industrial Co., Ltd. Coated conductive powder and conductive adhesive using the same
US8124232B2 (en) 2007-10-22 2012-02-28 Nippon Chemical Industrial Co., Ltd. Coated conductive powder and conductive adhesive using the same
WO2011158783A1 (en) * 2010-06-16 2011-12-22 ソニーケミカル＆インフォメーションデバイス株式会社 Conductive particles, method for producing same and anisotropically conductive adhesive
JP5505149B2 (en) * 2010-06-16 2014-05-28 デクセリアルズ株式会社 Conductive particles, method for producing the same, and anisotropic conductive adhesive
JP5505156B2 (en) * 2010-06-30 2014-05-28 デクセリアルズ株式会社 Conductive particles, method for producing the same, and anisotropic conductive adhesive
CN102167838B (en) * 2010-12-21 2012-11-28 苏州纳微生物科技有限公司 Polymer composite microsphere containing dendritic structure, anisotropic conducting material and anisotropic conducting film
CN106903305A (en) * 2017-04-12 2017-06-30 合肥学院 Preparation method of metal particle/inorganic nano particle/polymer composite powder for 3D printing

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60228678A (en) * 1984-04-26 1985-11-13 Agency Of Ind Science & Technol Formation of metallic film on surface of high molecular material
JPS62297471A (en) * 1986-06-16 1987-12-24 Seiko Epson Corp Electroless nickel plating method for inorganic fine powder
JP2507381B2 (en) * 1987-01-30 1996-06-12 積水フアインケミカル株式会社 Conductive microsphere
JP2635331B2 (en) * 1987-09-01 1997-07-30 株式会社資生堂 Composite material, method for producing the same, and method for depositing metal
JP3071286B2 (en) * 1991-11-29 2000-07-31 日本化学工業株式会社 Pretreatment agent for electroless plating of aluminum base material and electroless plating method thereof
JP3417699B2 (en) * 1994-12-26 2003-06-16 日本化学工業株式会社 Conductive electroless plating powder
JP3436327B2 (en) * 1995-05-16 2003-08-11 日本化学工業株式会社 Conductive electroless plating powder
JP3832938B2 (en) * 1997-08-12 2006-10-11 日本化学工業株式会社 Electroless silver plating powder and method for producing the same
CN1667157B (en) * 2004-03-10 2010-05-05 日本化学工业株式会社 Chemically plated conductive powder and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI586833B (en) * 2015-10-15 2017-06-11 Electroless platinum plating solution

Also Published As

Publication number Publication date
JP2007262495A (en) 2007-10-11
KR20080111022A (en) 2008-12-22
KR101305574B1 (en) 2013-09-09
CN101415863B (en) 2011-04-20
CN101415863A (en) 2009-04-22
JP4849930B2 (en) 2012-01-11
TWI419996B (en) 2013-12-21
WO2007119417A1 (en) 2007-10-25

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