JPS62297471A - Electroless nickel plating method for inorganic fine powder - Google Patents
Electroless nickel plating method for inorganic fine powderInfo
- Publication number
- JPS62297471A JPS62297471A JP61139609A JP13960986A JPS62297471A JP S62297471 A JPS62297471 A JP S62297471A JP 61139609 A JP61139609 A JP 61139609A JP 13960986 A JP13960986 A JP 13960986A JP S62297471 A JPS62297471 A JP S62297471A
- Authority
- JP
- Japan
- Prior art keywords
- fine powder
- nickel plating
- inorganic fine
- powder
- electroless nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
〔産業上の利用分野〕
本発明は各種産業に利用される無機微粉、さらに詳しく
はｌ、ａｍ〜数ｍｍの直径を存する無機微粉の無電解ニ
ッケルメッキ方法に関する。Detailed Description of the Invention 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to inorganic fine powder used in various industries, more specifically, inorganic fine powder having a diameter of 1,000 am to several mm. This invention relates to an electrolytic nickel plating method.
従来、無機微粉を無電解ニッケルメッキする場合、無機
微粉を充分洗浄した後センシタイジング・アクチベイテ
ィングを行ってもニッケルを析出させるために触媒とし
て働くパラジウムが強固に無機微粉の表面に付着しない
ため、その上にニッケルメッキを行ってもメッキが剥離
してしまったり、さらにはパラジウム自体が付着しなか
ったりした。そのため、たとえば処理液温度を高温にす
るなど、きびしい処理条件のもとに無電解ニッケルメッ
キが行なわれていた。Conventionally, when electroless nickel plating is applied to inorganic fine powder, palladium, which acts as a catalyst to deposit nickel, does not firmly adhere to the surface of the inorganic fine powder even if sensitizing/activation is performed after thoroughly washing the inorganic fine powder. Therefore, even if nickel plating was applied on top of it, the plating would peel off, and palladium itself would not adhere. Therefore, electroless nickel plating has been performed under severe processing conditions, such as increasing the temperature of the processing solution.
前述のように従来の方法では、かなりきびしい条件管理
を必要とし、さらには安定的に生産することが困難であ
った。As mentioned above, conventional methods require fairly strict control of conditions and are difficult to produce stably.
そこで本発明は上記欠点を除去するためになされたもの
であり、その目的とするところは無機微粉を容易に無電
解ニッケルメッキすることにある。Therefore, the present invention has been made to eliminate the above-mentioned drawbacks, and its purpose is to facilitate electroless nickel plating of inorganic fine powder.
本発明の無機微粉の無電解ニッケルメッキ方法は、上記
目的を解決するために無機微粉をセンシタイジング・ア
クチベイティングする前に、無機微粉の表面にシランカ
ップリング剤を付加することを特徴とする。In order to solve the above object, the electroless nickel plating method for inorganic fine powder of the present invention is characterized by adding a silane coupling agent to the surface of the inorganic fine powder before sensitizing and activating the inorganic fine powder. do.
〔実施例１〕
直径７μｍ、長さ約５０μｍのグラスファイバー１０ｇ
を５０ｍ１のエチルアルコール中に投入し５分間超音波
をかけた後、さらに水酸化カリウム水溶液を加え充分に
ゲラスフアイス−を洗浄した。そして吸引濾過によりグ
ラスファイバーを分取し純水で洗浄してからこれを０．
５ｗｔ％アミノシラン水溶液に５分間超音波をかけて分
散させた後吸引濾過により再びグラスファイバーを分取
浄した後１００℃の恒温槽で３０分間焼成した後センシ
タイジング・アクチベイティングを行い、ニッケルメッ
キを行った。この際、センシタイジング・アクチベイテ
ィング・ニッケルメッキの各処理液はいずれも４５℃〜
５０℃と比較的低温で行ったが、グラスファイバーの表
面には均一なニッケルメッキが施されており、しかも剥
離している箇所も見当たらなかった。[Example 1] 10 g of glass fiber with a diameter of 7 μm and a length of approximately 50 μm
After putting it into 50 ml of ethyl alcohol and applying ultrasonic waves for 5 minutes, an aqueous potassium hydroxide solution was further added to thoroughly wash the gel sphere. Then, the glass fibers are separated by suction filtration, washed with pure water, and then washed at 0.00%.
After dispersing the 5 wt% aminosilane aqueous solution by applying ultrasonic waves for 5 minutes, the glass fibers were separated and purified again by suction filtration, and then baked in a constant temperature bath at 100°C for 30 minutes, followed by sensitizing and activating. Plating was done. At this time, each processing solution for sensitizing, activating, and nickel plating should be kept at 45°C or higher.
Although the test was carried out at a relatively low temperature of 50°C, the surface of the glass fiber was uniformly plated with nickel, and no peeling spots were found.
〔実施例２〕
実施例１においてグラスファイバーのかわりに酸化アル
ミニウム微粉を用いることにより同様な効果が得られた
。[Example 2] The same effect as in Example 1 was obtained by using aluminum oxide fine powder instead of glass fiber.
なお、実施例１では７ミノシランを用いたが、本発明は
７ミノシランに限らず、水溶性のシランカップリング剤
一般により同様な効果が得られる。Although 7-minosilane was used in Example 1, the present invention is not limited to 7-minosilane, and similar effects can be obtained with water-soluble silane coupling agents in general.
以上述べたように本発明によれば、無ｊａ微粉の表面に
容易に無電解ニッケルメッキをすることができ、安定的
に製造することができる。As described above, according to the present invention, electroless nickel plating can be easily applied to the surface of a non-Japanese fine powder, and stable production can be achieved.
以 上 出願人 セイコーエプソン株式会社 ｌ １１．−−１that's all Applicant: Seiko Epson Corporation l 11. --1
Claims (1)
て、該無機微粉をセンシタイジング・アクチベイティン
グする前に、該無機微粉の表面にシランカップリング剤
を付加することを特徴とする無機微粉の無電解ニッケル
メッキ方法。(1) A method for electroless nickel plating of inorganic fine powder, characterized in that a silane coupling agent is added to the surface of the inorganic fine powder before sensitizing and activating the inorganic fine powder. Electroless nickel plating method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61139609A JPS62297471A (en) | 1986-06-16 | 1986-06-16 | Electroless nickel plating method for inorganic fine powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61139609A JPS62297471A (en) | 1986-06-16 | 1986-06-16 | Electroless nickel plating method for inorganic fine powder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62297471A true JPS62297471A (en) | 1987-12-24 |
Family
ID=15249269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61139609A Pending JPS62297471A (en) | 1986-06-16 | 1986-06-16 | Electroless nickel plating method for inorganic fine powder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62297471A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0725983A4 (en) * | 1993-10-08 | 1999-11-10 | Electro Energy Inc | Bipolar electrochemical battery of stacked wafer cells |
| JP2001026880A (en) * | 1999-07-14 | 2001-01-30 | Fujitsu Ltd | Conductor pattern forming method |
| US6503658B1 (en) | 2001-07-11 | 2003-01-07 | Electro Energy, Inc. | Bipolar electrochemical battery of stacked wafer cells |
| WO2007119417A1 (en) * | 2006-03-28 | 2007-10-25 | Nippon Chemical Industrial Co., Ltd | Conductive powder plated by electroless plating and process for producing the same |
| WO2015107996A1 (en) | 2014-01-14 | 2015-07-23 | 東洋アルミニウム株式会社 | Composite conductive particles, conductive resin composition containing same and conductive coated article |
| CN114307883A (en) * | 2021-12-29 | 2022-04-12 | 苏州纳微科技股份有限公司 | Preparation method of nickel-plated microspheres suitable for anisotropic conduction |
-
1986
- 1986-06-16 JP JP61139609A patent/JPS62297471A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0725983A4 (en) * | 1993-10-08 | 1999-11-10 | Electro Energy Inc | Bipolar electrochemical battery of stacked wafer cells |
| JP2001026880A (en) * | 1999-07-14 | 2001-01-30 | Fujitsu Ltd | Conductor pattern forming method |
| US6503658B1 (en) | 2001-07-11 | 2003-01-07 | Electro Energy, Inc. | Bipolar electrochemical battery of stacked wafer cells |
| US6887620B2 (en) | 2001-07-11 | 2005-05-03 | Electro Energy, Inc. | Bipolar electrochemical battery of stacked wafer cells |
| WO2007119417A1 (en) * | 2006-03-28 | 2007-10-25 | Nippon Chemical Industrial Co., Ltd | Conductive powder plated by electroless plating and process for producing the same |
| WO2015107996A1 (en) | 2014-01-14 | 2015-07-23 | 東洋アルミニウム株式会社 | Composite conductive particles, conductive resin composition containing same and conductive coated article |
| KR20160102547A (en) | 2014-01-14 | 2016-08-30 | 도요 알루미늄 가부시키가이샤 | Composite conductive particles, conductive resin composition containing same and conductive coated article |
| US10227496B2 (en) | 2014-01-14 | 2019-03-12 | Toyo Aluminium Kabushiki Kaisha | Composite conductive particle, conductive resin composition containing same and conductive coated article |
| CN114307883A (en) * | 2021-12-29 | 2022-04-12 | 苏州纳微科技股份有限公司 | Preparation method of nickel-plated microspheres suitable for anisotropic conduction |
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