[go: up one dir, main page]

TW200733327A - Oscillating heat sink sheet in plate structure - Google Patents

Oscillating heat sink sheet in plate structure

Info

Publication number
TW200733327A
TW200733327A TW095106440A TW95106440A TW200733327A TW 200733327 A TW200733327 A TW 200733327A TW 095106440 A TW095106440 A TW 095106440A TW 95106440 A TW95106440 A TW 95106440A TW 200733327 A TW200733327 A TW 200733327A
Authority
TW
Taiwan
Prior art keywords
heat sink
area
oscillating heat
oscillating
heat pipe
Prior art date
Application number
TW095106440A
Other languages
Chinese (zh)
Other versions
TWI279899B (en
Inventor
Shang-Wen Kang
Yu-Xing Lin
Original Assignee
Univ Tamkang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Tamkang filed Critical Univ Tamkang
Priority to TW095106440A priority Critical patent/TWI279899B/en
Application granted granted Critical
Publication of TWI279899B publication Critical patent/TWI279899B/en
Publication of TW200733327A publication Critical patent/TW200733327A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention provides an oscillating heat sink sheet in plate structure, in which the heat sink sheet comprises a substrate and an oscillating heat pipe formed on the substrate; and, the oscillating heat pipe is a closed and bent heat pipe structure, and comprises an evaporation area, a condensing area, and a conduction section fluidic communicating the evaporation area and the condensing area; wherein, a central processing unit is contacted with the evaporation area, and heat sink fins are contacted with the condensing area. The oscillating heat pipe is provided with a working fluid therein, and when the evaporation area is heated, the working fluid would generate a plurality of saturated vapor bubbles, and the saturated vapor bubbles would be transported to the condensing area through the conduction section, and the heat conducted by the saturated vapor bubbles would be dissipated through the heat sink fin.
TW095106440A 2006-02-24 2006-02-24 Oscillating heat sink sheet in plate structure TWI279899B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095106440A TWI279899B (en) 2006-02-24 2006-02-24 Oscillating heat sink sheet in plate structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095106440A TWI279899B (en) 2006-02-24 2006-02-24 Oscillating heat sink sheet in plate structure

Publications (2)

Publication Number Publication Date
TWI279899B TWI279899B (en) 2007-04-21
TW200733327A true TW200733327A (en) 2007-09-01

Family

ID=38645533

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106440A TWI279899B (en) 2006-02-24 2006-02-24 Oscillating heat sink sheet in plate structure

Country Status (1)

Country Link
TW (1) TWI279899B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI499899B (en) * 2012-12-12 2015-09-11 Inventec Corp Electronic device

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103796478B (en) * 2012-10-31 2016-12-21 英业达科技有限公司 Electronic installation
US20150060023A1 (en) * 2013-08-28 2015-03-05 Hamilton Sundstrand Corporation Fin-diffuser heat sink with high conductivity heat spreader
GB2520108A (en) * 2013-08-28 2015-05-13 Hamilton Sundstrand Corp Fin-diffuser heat sink with high conductivity heat spreader
CN103438741B (en) * 2013-08-29 2016-05-25 特能传热科技（中山）有限公司 Heat radiator
FR3039510B1 (en) * 2015-07-28 2017-09-01 Thales Sa HEATING FOR AERONAUTICAL EQUIPMENT FOR AIRCRAFT
TWI757553B (en) 2017-10-13 2022-03-11 訊凱國際股份有限公司 Impulse uniform temperature plate
TWI685638B (en) 2018-09-14 2020-02-21 財團法人工業技術研究院 Three dimensional pulsating heat pipe, three dimensional pulsating heat pipe assembly and heat dissipation module
US11051428B2 (en) * 2019-10-31 2021-06-29 Hamilton Sunstrand Corporation Oscillating heat pipe integrated thermal management system for power electronics

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI499899B (en) * 2012-12-12 2015-09-11 Inventec Corp Electronic device

Also Published As

Publication number Publication date
TWI279899B (en) 2007-04-21

Similar Documents

Publication Publication Date Title
TW200733327A (en) Oscillating heat sink sheet in plate structure
TW200801434A (en) Loop type heat dissipating apparatus with spray cooling device
TWI388792B (en)
US10077945B2 (en) Heat dissipation device
TWI411383B (en)
CN207395544U (en) Phase change type evaporator with radiating fins and phase change type radiating device
WO2010143896A3 (en) Heat-dissipating device and electronic apparatus having the same
SG159444A1 (en) Heat spreader, electronic apparatus, and heat spreader manufacturing method
EP3614089B1 (en) Flat loop heat pipe-based vapor chamber
EP2757584A3 (en) Integrated thin film evaporation thermal spreader and planar heat pipe heat sink
TW200608179A (en) Heat dissipation apparatus
DE602005021314D1 (en) PLATE MASS AND HEAT EXCHANGE WITH EDGE EXTENSION
CN104519718A (en) Radiating module
CN202003980U (en) Radiator structure with temperature equalizing plate
CN205161020U (en) Combination structure of cooling modules
TW200734594A (en) Heat pipe
TW201041492A (en) Heat dissipation device
CN201167446Y (en) Heat radiation module
CN202127010U (en) Heat pipe
TW200732894A (en) Heat sink
TW201414976A (en) Thin radiator
TW200639365A (en) A vibrating heat-pipe equalizer
TW200701492A (en) Semiconductor package structure
TW200742829A (en) Supporting column having porous structure
TWM456523U (en) Multifunctional type heat absorber and sink