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TW200710568A - Photosensitive resin composition for forming light shielding pattern of plasma display - Google Patents

Photosensitive resin composition for forming light shielding pattern of plasma display

Info

Publication number
TW200710568A
TW200710568A TW095129984A TW95129984A TW200710568A TW 200710568 A TW200710568 A TW 200710568A TW 095129984 A TW095129984 A TW 095129984A TW 95129984 A TW95129984 A TW 95129984A TW 200710568 A TW200710568 A TW 200710568A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
light
plasma display
light shielding
Prior art date
Application number
TW095129984A
Other languages
Chinese (zh)
Other versions
TWI319118B (en
Inventor
Yukihiko Tanaka
Hitoshi Setsuda
Taisuke Shiroyama
Hiroyuki Obiya
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200710568A publication Critical patent/TW200710568A/en
Application granted granted Critical
Publication of TWI319118B publication Critical patent/TWI319118B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

To provide a photosensitive resin composition for light-blocking pattern formation of a plasma display in which an excellent black electrode that has a high linearity but has no pealing-off or residues, and the light-blocking pattern represented by black stripes can be formed easily. This photosensitive resin composition contains a photo-polymerization initiator, a light shielding material, a binder resin and a photo-polymerizing compound shown in a formula (1). By containing these compounds, the light-sensitivity of the photosensitive resin composition becomes higher, and a development margin of the pattern becomes larger. Consequently, even when the photosensitive resin composition contains larger amount of light-blocking materials, patterns that have excellent linearity but have no pealing-off or residues can be formed easily, and a PDP having a high contrast and beautiful color development can be provided easily.
TW095129984A 2005-09-08 2006-08-15 Photosensitive resin composition for forming light shielding pattern of plasma display TW200710568A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005261220A JP4640971B2 (en) 2005-09-08 2005-09-08 Photosensitive resin composition for light shielding pattern formation of plasma display

Publications (2)

Publication Number Publication Date
TW200710568A true TW200710568A (en) 2007-03-16
TWI319118B TWI319118B (en) 2010-01-01

Family

ID=37858723

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095129984A TW200710568A (en) 2005-09-08 2006-08-15 Photosensitive resin composition for forming light shielding pattern of plasma display

Country Status (4)

Country Link
JP (1) JP4640971B2 (en)
KR (1) KR100899410B1 (en)
CN (1) CN1928718B (en)
TW (1) TW200710568A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI675872B (en) * 2016-04-11 2019-11-01 日商東洋油墨Ｓｃ控股股份有限公司 Resin composition for forming shielding layer and production method thereof,shielding layer, and shielding member and production method thereof

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4795086B2 (en) * 2006-04-13 2011-10-19 富士フイルム株式会社 Photosensitive composition and photosensitive transfer material using the same, light shielding film for display device and method for producing the same, black matrix, substrate with light shielding film, and display device
KR101142631B1 (en) * 2007-12-14 2012-05-10 코오롱인더스트리 주식회사 Photosensitive Resin Composition for Sandblast Resist and dry-film photoresist
JP5266958B2 (en) * 2008-08-22 2013-08-21 凸版印刷株式会社 Color filter for liquid crystal display
KR101261619B1 (en) * 2010-03-16 2013-05-07 주식회사 엘지화학 Ink composition for manufacturing color filter
JP5732222B2 (en) * 2010-09-30 2015-06-10 太陽ホールディングス株式会社 Photosensitive resin composition
WO2017078271A1 (en) * 2015-11-04 2017-05-11 Rohm And Haas Electronic Materials Korea Ltd. Colored photosensitive resin composition and light shielding spacer prepared therefrom
KR102674086B1 (en) * 2022-04-01 2024-06-14 (주)호전에이블 Copper sintering paste composition and its manufacturing method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6010824A (en) 1992-11-10 2000-01-04 Tokyo Ohka Kogyo Co., Ltd. Photosensitive resin composition containing a triazine compound and a pre-sensitized plate using the same, and photosensitive resin composition containing acridine and triazine compounds and a color filter and a pre-sensitized plate using the same
JPH1184125A (en) * 1997-09-12 1999-03-26 Tokyo Ohka Kogyo Co Ltd Photopolymerizable composition for color filter and production of color filter
MY121423A (en) * 1998-06-26 2006-01-28 Ciba Sc Holding Ag Photopolymerizable thermosetting resin compositions
JP2001261761A (en) * 2000-03-22 2001-09-26 Jsr Corp Radiation-sensitive resin composition and spacer for display panel
JP4130102B2 (en) * 2001-09-18 2008-08-06 富士フイルム株式会社 Radiation sensitive coloring composition
TW200714651A (en) * 2002-10-28 2007-04-16 Mitsubishi Chem Corp Photopolymerization composition and color filter using the same
KR100581971B1 (en) * 2003-02-11 2006-05-22 주식회사 동진쎄미켐 High viscosity ag paste composition for forming a fine electrode and a fine electrode prepared using the same
JP4437651B2 (en) * 2003-08-28 2010-03-24 新日鐵化学株式会社 Photosensitive resin composition and color filter using the same
JP2005091853A (en) * 2003-09-18 2005-04-07 Toppan Printing Co Ltd Photosensitive composition and color filter having photospacer formed by using the same
JP2005129319A (en) * 2003-10-23 2005-05-19 Matsushita Electric Ind Co Ltd Photocuring composition, plasma display panel using the same, and manufacturing method thereof
JP2005202252A (en) * 2004-01-16 2005-07-28 Dainippon Printing Co Ltd Photosensitive coloring composition for solid-state imaging device color filter, solid-state imaging device color filter, solid-state imaging device and manufacturing method of solid-state imaging device color filter
TWI285297B (en) * 2004-02-09 2007-08-11 Chi Mei Corp Light-sensitive resin composition for black matrix

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI675872B (en) * 2016-04-11 2019-11-01 日商東洋油墨Ｓｃ控股股份有限公司 Resin composition for forming shielding layer and production method thereof,shielding layer, and shielding member and production method thereof

Also Published As

Publication number Publication date
CN1928718A (en) 2007-03-14
KR100899410B1 (en) 2009-05-26
TWI319118B (en) 2010-01-01
JP4640971B2 (en) 2011-03-02
KR20070029064A (en) 2007-03-13
CN1928718B (en) 2010-05-26
JP2007073434A (en) 2007-03-22

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees